WO2023279810A1 - 焊接装置及使用该焊接装置的焊接方法 - Google Patents

焊接装置及使用该焊接装置的焊接方法 Download PDF

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WO2023279810A1
WO2023279810A1 PCT/CN2022/089136 CN2022089136W WO2023279810A1 WO 2023279810 A1 WO2023279810 A1 WO 2023279810A1 CN 2022089136 W CN2022089136 W CN 2022089136W WO 2023279810 A1 WO2023279810 A1 WO 2023279810A1
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light
sub
welding
transmitting
devices
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PCT/CN2022/089136
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English (en)
French (fr)
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庄文荣
孙明
卢敬权
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东莞市中麒光电技术有限公司
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Priority to EP22836569.8A priority Critical patent/EP4360798A1/en
Publication of WO2023279810A1 publication Critical patent/WO2023279810A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Definitions

  • the present application relates to the field of welding technology, for example, to a welding device and a welding method using the welding device.
  • each display screen is assembled by a plurality of display cabinets, and each display cabinet is assembled by a plurality of display modules.
  • a plurality of pixels for displaying images are welded on the display module (each pixel includes three chips of R/G/B).
  • the chips After the chips are transferred to the substrate in large quantities, the chips need to be soldered and bonded (the electrical connection between the chip electrodes and the pad electrodes).
  • soldering needs to be carried out one by one chip during soldering, and then transfer to the next process after all soldering is completed, and the working efficiency of soldering is low.
  • the power required for welding red-light chips is slightly lower than that of blue-light and green-light chips (the structure of red-light flip-chips is different from that of blue-green flip-chips), it is difficult to continuously and quickly adjust the laser output during massive welding power, it is easy to cause damage to the red light chip.
  • the present application provides a welding device and a welding method using the welding device, which can solve the technical problems of low welding efficiency and easy damage to red light chips during welding.
  • An embodiment of the present application provides a welding device, including: a light source, configured to provide light radiation required for welding; a mask plate, set on the light path of the light source, the mask plate includes a light shielding portion and a plurality of light-transmitting part, the plurality of light-transmitting parts are separated by the light-shielding part; the plurality of light-transmitting parts are arranged to allow the light radiation to pass through.
  • An embodiment of the present application provides a welding method, using the above-mentioned welding device, including: respectively aligning the devices to be welded with the plurality of light-transmitting parts of the mask; and causing the light source to emit The light radiation passes through the plurality of light-transmitting parts, and the devices are soldered in batches.
  • Fig. 1 is a schematic structural view of a welding device provided by an embodiment of the present application
  • FIG. 2 is a top view of the mask plate in FIG. 1;
  • Fig. 3 is a top view of the substrate in Fig. 1;
  • Fig. 4 is a flowchart of a welding method provided by an embodiment of the present application.
  • present embodiment provides a kind of soldering device, can realize batch soldering device, is especially suitable for carrying out batch soldering to the LED chip 41 (Fig. efficiency.
  • the welding device includes a light source 10 and a mask plate 30, the light source 10 is used to provide light radiation required for welding, the mask plate 30 is arranged on the light path of the light source 10, the mask plate 30 includes a light shielding portion 31 and a plurality of The light-transmitting part 32, as shown in FIG. 2, emits laser light.
  • the light-shielding portion 31 is not light-transmitting, and the plurality of light-transmitting portions 32 are spaced apart by the light-shielding portion 31 , and the plurality of light-transmitting portions 32 allow laser light to pass through, so as to realize batch welding of devices.
  • the device is an LED chip 41 , as shown in FIG. 3 .
  • the laser light emitted by the light source 10 is reflected to the mask plate 30 by the mirror 20 .
  • a plurality of spaced light-transmitting portions 32 are provided, and the LED chips 41 on the substrate 40 are respectively aligned with the plurality of light-transmitting portions 32 , which can facilitate batch welding by laser and improve welding efficiency.
  • the light source 10 can be a point light source, by setting a plurality of light sources 10 to emit laser light through a plurality of light-transmitting parts 32; through a plurality of light-transmitting parts 32 . It should be understood that, through an optical system, a point light source can also be converted into a surface light source or a line light source.
  • the LED chip 41 When the devices to be soldered require different optical powers, for example, the LED chip 41 generally includes a red chip 42 , a green chip 43 and a blue chip 44 , and the optical power required by each chip of different colors is different.
  • the light power irradiated by the light source 10 on different light-transmitting parts 32 is consistent, and because the light power required by the red light chip 42 is lower, it is easy to cause damage to the red light chip 42 during batch welding.
  • this embodiment is based on the first embodiment, and the plurality of light-transmitting parts 32 include various sub-light-transmitting parts with different light transmittances. Therefore, by setting different light transmittances, the power irradiated on the chip can be controlled to prevent the chip from being damaged by excessive power.
  • the multi-seed light-transmitting part includes a first sub-light-transmitting part 33 , a second sub-light-transmitting part 34 and a third sub-light-transmitting part 35 .
  • the specific numbers of the first sub-light-transmitting parts 33 , the second sub-light-transmitting parts 34 and the third sub-light-transmitting parts 35 can be respectively determined according to actual needs.
  • the transmittance of the first sub-transmitting portion 33 is 50-80%, the transmittance of the second sub-transmitting portion 34 is 85-95%, and the transmittance of the third sub-transmitting portion 35 is 95-100%. , respectively corresponding to the red light chip 42, the green light chip 43 and the blue light chip 44.
  • the soldering device provided in this embodiment can control the optical power irradiated on the substrate 40 by setting masks 30 with different light transmittances, which can not only realize batch soldering of devices, but also avoid the failure of devices caused by inconsistency in required optical power. Damage problem.
  • a concave-convex structure for reflecting light is provided on the surface of the light-shielding portion 31 , which can diffuse the laser light irradiated on the concave-convex structure.
  • the welding device further includes a movable platform 50 on which a base plate 40 is placed, and a device to be welded is arranged on the base plate 40 .
  • the position of the movable platform 50 can be adjusted so that the devices on the substrate 40 are respectively aligned with the plurality of light-transmitting parts 32 to prepare for soldering.
  • This embodiment provides a welding method, using the welding device provided in the fourth embodiment above, as shown in FIG. 4 , including the following steps: respectively aligning the devices to be welded with the multiple light-transmitting parts 32 of the mask plate 30; and The laser light emitted by the light source 10 is made to pass through the plurality of light-transmitting parts 32, and the devices are soldered in batches.
  • the plurality of light-transmitting portions 32 include various sub-light-transmitting portions with different light transmittances.
  • the plurality of sub-transmitting sections includes a first sub-transmitting section 33 , a second sub-transmitting section 34 and a third sub-transmitting section 35 .
  • the specific numbers of the first sub-light-transmitting parts 33 , the second sub-light-transmitting parts 34 and the third sub-light-transmitting parts 35 can be respectively determined according to actual requirements.
  • the transmittance of the first sub-transparent part is 50-80%, the transmittance of the second sub-transparent part is 85-95%, and the transmittance of the third sub-transparent part is 95-100%, corresponding to In red light chip 42 , green light chip 43 and blue light chip 44 .
  • respectively aligning the devices to be soldered on the multiple light-transmitting portions 32 of the mask 30 includes the following steps:
  • the position of the movable platform 50 is adjusted so that the devices to be soldered on the substrate 40 are respectively aligned with the plurality of light-transmitting portions 32 .
  • the position of the movable platform 50 is optically detected, and the position of the movable platform 50 is initialized, so as to facilitate subsequent alignment of the device with the light-transmitting portion 32 .
  • the laser can pass through multiple light-transmitting parts 32 to achieve batch welding of devices, avoiding the problem of device damage caused by inconsistent demanded optical power, and greatly improving welding efficiency, especially suitable for mass production LED chip bonding can be combined with mass transfer in the previous process.
  • the LED chips 41 After the LED chips 41 are transferred to the substrate 42 through the mass transfer technology, the LED chips 41 can be fixed in batches by this welding method, which can improve production efficiency.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Led Device Packages (AREA)

Abstract

一种焊接装置及使用该焊接装置的焊接方法，焊接装置包括：光源（10），设置为提供焊接所需的光辐射；掩模板（30），设置在所述光源（10）的光路上，所述掩模板（30）包括遮光部（31）和多个透光部（32），所述多个透光部（32）被所述遮光部（31）间隔开；所述多个透光部（32）设置为供所述光辐射通过。通过设置具有不同透光度的掩模板（30），可以控制照射在基板（40）上的光功率大小，不仅能够实现批量焊接器件，而且能避免因需求光功率不一致导致的器件损坏问题。

Description

焊接装置及使用该焊接装置的焊接方法
本申请要求申请日为2021年7月9日、申请号为202110779880.7的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请涉及焊接技术领域，例如涉及一种焊接装置及使用该焊接装置的焊接方法。
背景技术
社会的不断发展以及国家的大力倡导，LED行业成为当今最为活跃的行业之一，LED显示屏产品逐渐走进社会生活的多个领域。与此同时，随着LED显示屏技术创新与发展，单位面积分辨率高的小间距无缝拼接的LED显示屏已经成为LED显示屏的主流产品，它可以显示更高清晰度的图形图像和视频，也可以显示更多的视频和图像画面，尤其是在图像拼接方面的运用，可以做到无缝和任意大面积拼接。相关技术的每一个显示屏由多个显示箱体拼装而成，而每一显示箱体则由多个显示模块拼接而成。显示模块上焊接有多个用于显示图像的像素(每一像素包括有R/G/B三个芯片)。
当芯片被巨量转移至基板上以后，需要对芯片进行焊接固晶(芯片电极与焊盘电极的电连接)。相关技术中，焊接时需要逐个芯片进行焊接，待全部焊接完成再转至下一工序，焊接的工作效率较低。同时，由于焊接红光芯片时所需功率相比于蓝光和绿光芯片略低一些(红光倒装芯片与蓝绿倒装芯片结构不同)，而在巨量焊接时难以不断快速调整激光输出功率，容易导致红光芯片的损坏。
发明内容
本申请提供了一种焊接装置及使用该焊接装置的焊接方法，能够解决焊接的工作效率较低及焊接时，容易导致红光芯片的损坏的技术问题。
本申请一实施例提供了一种焊接装置，包括：光源，设置为提供焊接所需的光辐射；掩模板，设置在所述光源的光路上，所述掩模板包括遮光部和多个透光部，所述多个透光部被所述遮光部间隔开；所述多个透光部设置为供所述光辐射通过。
本申请一实施例提供了一种焊接方法，使用如上所述的焊接装置，包括：将待焊接的器件分别对准所述掩模板的所述多个透光部；及使所述光源发出的光辐射透过所述多个透光部，对器件进行批量焊接。
附图说明
图1为本申请一实施例提供的焊接装置的结构示意图；
图2为图1中掩模板的俯视图；
图3为图1中基板的俯视图；
图4为本申请一实施例提供的焊接方法流程图。
图示说明：
10、光源；20、反射镜；30、掩模板；31、遮光部；32、透光部；33、第一子透光部；34、第二子透光部；35、第三子透光部；40、基板；41、LED芯片；42、红光芯片；43、绿光芯片；44、蓝光芯片；50、可移动平台。
具体实施方式
实施例一
请参阅图1所示，本实施例提供了一种焊接装置，可以实现批量焊接器件，尤其适用于对通过巨量转移至基板40上的LED芯片41(图3)进行批量焊接，以提高焊接效率。
在一实施例中，该焊接装置包括光源10和掩模板30，光源10用于提供焊接所需的光辐射，掩模板30设置在光源10的光路上，掩模板30包括遮光部31和多个透光部32，如图2所示，光辐射为激光。
其中，遮光部31不可透光，多个透光部32被遮光部31间隔开，多个透光部32供激光通过，以实现批量焊接器件。在一实施例中，器件为LED芯片41，如图3所示。
在一实施例中，光源10发出的激光经过反射镜20反射至掩模板30。
本实施例通过设置多个间隔开的透光部32，基板40上的LED芯片41分别对准多个透光部32，可以方便激光实现批量焊接，提高焊接效率。
在一实施例中，光源10可以为点光源，通过设置多个光源10发出激光穿过多个透光部32；光源10也可以为面光源或线光源，由面光源或线光源发出的激光穿过多个透光部32。应当理解，通过光学系统，点光源也可以转换成面光源 或线光源。
实施例二
当待焊接的器件需求不同大小的光功率时，例如LED芯片41一般包括红光芯片42、绿光芯片43和蓝光芯片44，每个不同颜色光的芯片所需要的光功率大小不同。而光源10照射在不同透光部32的光功率是一致的，又由于红光芯片42需求的光功率更低，在批量焊接时容易造成红光芯片42损坏。
为此，本实施例在实施例一的基础上，多个透光部32包括多种具有不同透光度的子透光部。因此，通过设置不同的透光度，控制照射在芯片上的功率大小，防止功率过大损坏芯片。
在一实施例中，多种子透光部包括第一子透光部33、第二子透光部34和第三子透光部35。第一子透光部33、第二子透光部34和第三子透光部35的具体数量可以分别根据实际需求而定。
第一子透光部33的透光度为50～80％，第二子透光部34的透光度为85～95％，第三子透光部35的透光度为95～100％，分别对应于红光芯片42、绿光芯片43和蓝光芯片44。
本实施例提供的焊接装置，通过设置具有不同透光度的掩模板30，可以控制照射在基板40上的光功率大小，不仅能够实现批量焊接器件，而且能避免因需求光功率不一致导致的器件损坏问题。
实施例三
在上述任一实施例的基础上，在遮光部31的表面设有用于反射光的凹凸结构，可以使得照射在凹凸结构上的激光形成漫射。
实施例四
在上述任一实施例的基础上，焊接装置还包括可移动平台50，可移动平台50上放置有基板40，基板40上设有待焊接的器件。
因此，可以通过调整可移动平台50的位置，使得基板40上的器件分别与多个透光部32对准，为焊接作准备。
实施例五
本实施例提供了一种焊接方法，使用如上实施例四提供的焊接装置，如图4所示，包括以下步骤：将待焊接的器件分别对准掩模板30的多个透光部32；及使光源10发出的激光透过多个透光部32，对器件进行批量焊接。
在一实施例中，多个透光部32包括多种具有不同透光度的子透光部。多种 子透光部包括第一子透光部33、第二子透光部34和第三子透光部35。第一子透光部33、第二子透光部34和第三子透光部35的具体数量可以分别根据实际需求而定。第一子透光部的透光度为50～80％，第二子透光部的透光度为85～95％，第三子透光部的透光度为95～100％，分别对应于红光芯片42、绿光芯片43和蓝光芯片44。
在一实施例中，将待焊接的器件分别对准掩模板30的多个透光部32，包括以下步骤：
调整可移动平台50的位置，使得基板40上的待焊接的器件分别与多个透光部32对准。
在一实施例中，将待焊接的器件分别对准掩模板30的多个透光部32之前，还包括以下步骤：
光学检测可移动平台50的位置，并初始化可移动平台50的位置，方便后续将器件与透光部32对准。
实施例五提供的焊接方法，激光可以透过多个透光部32，以实现批量焊接器件，避免因需求光功率不一致导致的器件损坏问题，极大地提高了焊接效率，尤其适用于大批量的LED芯片固晶，其可以与在先工序巨量转移结合，通过巨量转移技术将LED芯片41转移至基板42上后，再利用该焊接方法批量固定LED芯片41，可以提高生产效率。

Claims (10)

  1. 一种焊接装置，包括：
    光源，设置为提供焊接所需的光辐射；
    掩模板，设置在所述光源的光路上，所述掩模板包括遮光部和多个透光部，所述多个透光部被所述遮光部间隔开；所述多个透光部设置为供所述光辐射通过。
  2. 根据权利要求1所述的焊接装置，其中，所述多个透光部包括多种具有不同透光度的子透光部。
  3. 根据权利要求2所述的焊接装置，其中，多种所述子透光部包括第一子透光部、第二子透光部和第三子透光部；
    所述第一子透光部的透光度为50～80％，所述第二子透光部的透光度为85～95％，所述第三子透光部的透光度为95～100％。
  4. 根据权利要求1所述的焊接装置，其中，所述光源为线光源或面光源。
  5. 根据权利要求1所述的焊接装置，还包括：反射镜，所述光源发出的光辐射经过所述反射镜反射至所述掩模板。
  6. 根据权利要求1所述的焊接装置，其中，所述遮光部不可透光，且所述遮光部表面设有反射光的凹凸结构。
  7. 根据权利要求1所述的焊接装置，还包括：可移动平台，所述可移动平台上放置有基板，所述基板设置为放置待焊接的器件。
  8. 一种焊接方法，使用如权利要求1-7中任一所述的焊接装置，包括：
    将待焊接的器件分别对准所述掩模板的所述多个透光部；及
    使所述光源发出的光辐射透过所述多个透光部，对器件进行批量焊接。
  9. 根据权利要求8所述的焊接方法，其中，所述将待焊接的器件分别对所述准掩模板的所述多个透光部，包括：调整可移动平台的位置，使得基板上的待焊接的器件分别与所述多个透光部对准。
  10. 根据权利要求9所述的焊接方法，所述将待焊接的器件分别对所述准掩模板的所述多个透光部之前，还包括：光学检测所述可移动平台的位置，并初始化所述可移动平台的位置。
PCT/CN2022/089136 2021-07-09 2022-04-26 焊接装置及使用该焊接装置的焊接方法 WO2023279810A1 (zh)

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