WO2023227019A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2023227019A1
WO2023227019A1 PCT/CN2023/095999 CN2023095999W WO2023227019A1 WO 2023227019 A1 WO2023227019 A1 WO 2023227019A1 CN 2023095999 W CN2023095999 W CN 2023095999W WO 2023227019 A1 WO2023227019 A1 WO 2023227019A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
enclosure
bracket
sub
sealing ring
Prior art date
Application number
PCT/CN2023/095999
Other languages
English (en)
French (fr)
Inventor
丁建
牛志皓
张乐
邓鼎文
何叶青
张博添
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2023227019A1 publication Critical patent/WO2023227019A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein

Definitions

  • This application belongs to the field of equipment technology, and specifically relates to an electronic equipment.
  • the speaker unit of electronic equipment such as the sound cavity of the upper speaker unit
  • a circuit board such as a printed circuit board (PCB) and two circuit board covers provided on both sides of the circuit board.
  • the area of the circuit board facing the speaker unit is provided with a through hole for the speaker unit to pass through, and the two circuit board covers are pressed and sealed with the circuit board through sealing foam, so that the circuit board and the circuit board are placed on The two circuit board covers on both sides of the circuit board form the sound cavity of the speaker unit.
  • the purpose of the embodiments of the present application is to provide an electronic device that can solve the problem of poor electroacoustic performance of the speaker unit in the electronic device due to the long sound path of the speaker unit.
  • An embodiment of the present application provides an electronic device, including: a first bracket and a second bracket arranged oppositely, a circuit board, a speaker unit and an enclosure component located between the first bracket and the second bracket; the circuit board has a first Gap, the speaker unit is arranged in the first gap; the enclosure component is arranged around the first gap, and the enclosure component is sealingly connected to the first bracket, the second bracket and the circuit board; the first bracket, the second bracket, the circuit board and The enclosure components enclose the sound cavity of the speaker unit.
  • a first notch is provided on the circuit board, and the speaker unit is disposed in the first notch, so that the speaker can be brought close to the edge of the circuit board, thereby shortening the sound output channel of the speaker unit. This can improve the electroacoustic performance of the speaker unit in electronic equipment.
  • Figure 1 is one of the structural schematic diagrams of an electronic device provided by an embodiment of the present application.
  • Figure 2 is a schematic structural diagram of a sound hole in an electronic device provided by an embodiment of the present application.
  • Figure 3 is a schematic diagram comparing the circuit board in the electronic device provided by the embodiment of the present application and the circuit board in related technologies;
  • Figure 4 is a second structural schematic diagram of an electronic device provided by an embodiment of the present application.
  • Figure 5 is a third schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • Figure 6 is a fourth schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • Figure 7 is a fifth structural schematic diagram of an electronic device provided by an embodiment of the present application.
  • Figure 8 is a sixth structural schematic diagram of an electronic device provided by an embodiment of the present application.
  • Figure 9 is a seventh structural schematic diagram of an electronic device provided by an embodiment of the present application.
  • Figure 10 is an eighth structural schematic diagram of an electronic device provided by an embodiment of the present application.
  • Figure 11 is a ninth structural schematic diagram of an electronic device provided by an embodiment of the present application.
  • Figure 12 is a tenth structural schematic diagram of an electronic device provided by an embodiment of the present application.
  • Figure 13 is a schematic diagram of the first sealing structure in the electronic device provided by the embodiment of the present application.
  • Figures 1 to 13 are as follows: 10-Electronic equipment; 11-First bracket; 12-Second bracket; 13-First enclosure; 14-Second enclosure; 141-Side opening of the second enclosure; 15-Transition feet; 151-Extension part ; 152-vertical plate; 16-circuit board; 161-first gap; 17-speaker unit; 18-first sealing structure; 19-first gap; 20-second sealing structure; 201-sealing rib; 22 -The third sealing structure; 23-target sealing ring; 24-sound outlet; 25-enclosed component; 26-side wall of the frame.
  • first, second, etc. in the description and claims of this application are used to distinguish similar objects and are not used to describe a specific order or sequence. It should be understood that such use of data is appropriate where appropriate are interchangeable, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first”, “second”, etc. are generally of the same type and do not limit the objects.
  • the number of , for example, the first object can be one or multiple.
  • “and/or” in the description and claims indicates at least one of the connected objects, and the character “/" generally indicates that the related objects are in an "or” relationship.
  • FIG. 1 shows a possible structural diagram of the electronic device provided by the embodiment of the present application.
  • the electronic device 100 provided by the embodiment of the present application includes: The first bracket 11 and the second bracket 12 are provided, the circuit board 16, the speaker unit 17 and the enclosure assembly 25 located between the first bracket 11 and the second bracket 12.
  • the circuit board 16 has a first notch 161, and the speaker unit 17 is arranged in the first notch 161; the enclosure component 25 is arranged around the first notch 161, and the enclosure component 25 is connected with the first bracket 11, the second bracket 12 and the circuit board 16 is sealed and connected; the first bracket 11 , the second bracket 12 , the circuit board 16 and the surrounding components form a sound cavity of the speaker unit 17 .
  • the circuit board 16 may be a main circuit board in an electronic device, and the circuit board may be a printed circuit board, or other possible circuit boards, which are not limited here.
  • the enclosing component forms the side wall of the sound cavity, and the first bracket and the second bracket form the top wall and the bottom wall of the sound cavity.
  • the first bracket, the enclosure component and the circuit board are enclosed to form a first accommodation cavity, and the second bracket, enclosure assembly and circuit board are enclosed to form a second accommodation cavity; the first notch on the circuit board makes the first accommodation cavity Communicated with the second accommodation chamber.
  • the axis of the sound hole of the speaker unit is parallel to the circuit board.
  • the solution of providing the first notch on the circuit board in the embodiment of the present application eliminates the pressing narrow edge on the circuit board, thereby making the speaker
  • the monomers can be placed close to the edge of the circuit board. This can shorten the length of the sound hole of the speaker unit, which can also be called the length of the sound channel.
  • the speaker unit may be disposed on the first bracket, or the speaker unit may be disposed on the second bracket.
  • the speaker unit if the speaker unit does not change, the speaker unit
  • the main influencing factors of the speaker's external amplification effect are the cavity volume of the speaker's single sound cavity and the length of the sound channel. The larger the volume of the sound cavity and the shorter the sound channel, the better the electroacoustic performance will be.
  • the enclosure assembly 25 may include: a first enclosure 13 , a second enclosure 14 and a transition leg 15 .
  • the first enclosure 13 is disposed between the first bracket 11 and the circuit board 16 , and both ends of the first enclosure 13 are sealingly connected to the first bracket 11 and the circuit board 16 .
  • the second enclosure 14 is disposed between the second bracket 12 and the circuit board 16 , and both ends of the second enclosure 14 are sealingly connected to the second bracket 12 and the circuit board 16 .
  • Both the first enclosure 13 and the second enclosure 14 have side openings facing the same direction as the first notch 161 .
  • the side portion of the transition leg 15 is sealingly connected to the side opening of the first enclosure 13 , the side opening of the second enclosure 14 and the circuit board 16 , and the two ends of the transition leg 15 are sealingly connected to the first bracket 11 and the second bracket 12 .
  • the first notch 161 is located inside the projection area of the first enclosure 13 and the second enclosure 14 on the circuit board 16 .
  • the shape of the projection area of the first enclosure and the second enclosure on the circuit board in the embodiment of the present application can be: a "concave” shape, or a superior arc (that is, the arc is greater than 180°) shape, or any other possible shape. shape.
  • the shapes of the projection areas of the first and second enclosures on the circuit board may be the same as the shape of the first notch.
  • the first notch is located inside the projection area of the first enclosure and the second enclosure on the circuit board", thereby ensuring that the first opening can connect the first accommodation cavity and the second accommodation cavity. cavity.
  • the transition leg is sealingly connected to the side opening of the first enclosure panel and the side opening of the second enclosure panel
  • the side portion of the transition leg is connected to the outer wall of the side opening of the first enclosure panel, The outer wall at the side opening of the first enclosure is sealed and connected.
  • the transition leg 15 is integrally formed with the outer wall of the side opening 141 of the second enclosure 14 .
  • the second enclosure 14 , the transition feet 15 and the second bracket 12 can be integrally formed.
  • the transition leg exceeds the second hoarding, that is, the height of the transition leg is greater than the height of the second hoarding.
  • first enclosure panel and the first bracket may be integrally formed.
  • the height of the transition leg may be equal to the sum of the height of the first enclosure and the height of the second enclosure.
  • the height of a component in an electronic device refers to the maximum dimension of the component along the direction of the connection line (for example, a vertical line) between the first bracket and the circuit board.
  • the height of the speaker unit is greater than the height of the first enclosure and the height of the second enclosure.
  • both the first enclosure panel and the second enclosure panel have side openings facing the same direction as the first notch, thereby ensuring that the side portions of the transition legs can be sealingly connected to the circuit board (specifically, the side wall of the circuit board).
  • both the first enclosure panel and the second enclosure panel have side openings, and the orientations of the side openings of the first enclosure panel and the side openings of the second enclosure panel are the same as the orientation of the first notch, both facing the transition legs, so that the circuit board There is no need to reserve a narrow edge for pressing in the area close to the transition leg, which provides a guarantee for setting the first notch on the circuit board.
  • FIG 3 is a schematic diagram of the layout of a speaker unit and a circuit board in the related art.
  • the circuit board 16' is provided with a pressed narrow edge, so that the distance between the speaker unit and the edge of the circuit board is at least greater than the width of the pressed narrow edge;
  • (b) in Figure 3 shows the speaker unit and circuit in the embodiment of the present application. From the schematic layout diagram of the board, it can be seen that: 1. The speaker unit in the electronic device provided by the embodiment of the present application can be placed closer to the edge of the circuit board 16, thereby shortening the length of the sound channel of the speaker unit. 2.
  • the space for cloth parts near the narrow edge of the circuit board is small due to its small size, so its utilization rate is very low. This makes the demand in the related technology increase while the demand for cloth parts remains unchanged.
  • the effective cloth area of the circuit board is conducive to the thinning of the entire electronic device; and in the embodiment of the present application, since the circuit board does not need to reserve a narrow edge for pressing, the part of the circuit board away from the first notch can be made to have a thinner More layout space can optimize the layout of electronic components on the circuit board, which is conducive to making the entire electronic device thinner and lighter.
  • FIG. 4 is a possible structural schematic diagram of the transition leg 15 .
  • the transition leg 15 includes two extending portions 151 arranged opposite each other, and a vertical plate 152 arranged between the two extending portions 151 and perpendicular to the two extending portions 151 .
  • the side portion of the transition leg 15 is composed of these two extension portions 151 . Since the transition leg includes the vertical plate 152, it can be ensured that the first bracket, the second bracket, the circuit board and the enclosure assembly can enclose a sealed cavity (ie, a sound cavity).
  • the side portions of the transition legs extend into the first notch 161 and are sealingly connected with the circuit board 16 .
  • the side portions of the transition legs are specifically connected in a sealing manner with the side wall of the circuit board corresponding to the first notch.
  • a first notch is provided on the circuit board, and the speaker unit is arranged in the first notch, so that the speaker can be brought close to the edge of the circuit board, thereby shortening the sound output of the speaker unit. aisle. This can improve the electroacoustic performance of the speaker unit in electronic equipment.
  • the electronic device may also include: a frame.
  • the first bracket, the second bracket, the circuit board, the speaker unit and the enclosure assembly are arranged in the frame.
  • the transition legs 15 are provided on the side walls 26 of the frame, and the sound cavity consists of the first bracket 11, the second bracket 12, the circuit board 13, the enclosure assembly 25 and the side walls of the frame. It is surrounded by walls 26.
  • the transition leg when the transition leg is provided on the side wall of the frame, the transition leg may only include two extension parts arranged oppositely, and these two extension parts are directly provided on the side wall of the frame.
  • the first bracket, the second bracket, the circuit board, the enclosure component and the side wall of the frame form a sound cavity of the speaker unit.
  • the speaker unit since there is no need to install a vertical board, it is ensured that the speaker unit can be placed as close to the frame as possible, thereby further shortening the size of the sound output channel of the speaker unit.
  • the side wall of the frame close to the surface of the enclosure assembly can be subjected to settling treatment, so that the settled portion can be sealingly connected to the first bracket.
  • transition legs and the frame can be integrally formed.
  • the transition legs, second enclosure and frame may be formed in one piece.
  • the sound cavity is enclosed by the first bracket, the second bracket, the circuit board, the enclosure component and the side wall of the frame, which can ensure that the speaker unit and the side wall of the frame can be in direct contact, thereby
  • the size of the sound channel of the speaker unit can be shortened to the greatest extent.
  • the sound hole 24 of the speaker unit is provided on the side wall 26 of the frame, and the sound hole 24 is parallel to the circuit board 16 .
  • the electronic device 10 may further include: a first sealing structure 18 , and the first sealing structure 18 is stepped.
  • the first sealing structure 18 may include a first sub-sealing ring, a second sub-sealing ring and two first climbing arms; the first sub-sealing ring and the second sub-sealing ring have opposite openings, and two of each first climbing arm The ends are respectively connected to the first sub-sealing ring and the second sub-sealing ring.
  • the first sub-sealing ring is arranged between one end of the transition leg 15 and the first bracket 11; two first crawlers
  • the lifting arm is arranged between the side of the transition leg 15 and the first enclosure 13
  • the second sub-sealing ring is arranged between the first enclosure 13 and the circuit board 16 .
  • the two first climbing arms do not intersect, so that the first sub-sealing ring, the second sub-sealing ring and the two first climbing arms form a stepped sealing ring.
  • the two first climbing arms are arranged between the sides of the transition legs and the first hoarding
  • the two first climbing arms are arranged between the sides of the transition legs and the first hoarding. between the outer walls of the side opening.
  • the first climbing arm is perpendicular to the first sub-sealing ring and the second sub-sealing ring.
  • the size of the second sub-sealing ring matches the size of the projection area of the first enclosure on the circuit board.
  • the first sealing structure may be made of sealing foam or silicone.
  • sealing ribs 201 are provided on the surface of the first sealing structure 18 facing away from the first bracket 11 . In this way, eccentric errors generated during assembly of the first sealing structure and the second sealing structure can be avoided, thereby further improving the sealing performance of the sound cavity in the electronic device.
  • the first sealing structure is in the shape of a step, that is, one sealing structure can be used to simultaneously realize the sealing of the first enclosure plate and the transition leg, and the transition leg and the first bracket member. Therefore, the sealing error can be reduced, and thus the sealing error can be reduced. Improve sealing performance.
  • the electronic device 10 may also include: a target sealing ring 23 that matches the projected area of the second enclosure 14 on the circuit board 16 , and is configured to Between the top surface of the second enclosure 14 and the bottom surface of the circuit board 16, sealing between the second enclosure 14 and the circuit board 16 can be achieved.
  • a target sealing ring 23 that matches the projected area of the second enclosure 14 on the circuit board 16 , and is configured to Between the top surface of the second enclosure 14 and the bottom surface of the circuit board 16, sealing between the second enclosure 14 and the circuit board 16 can be achieved.
  • the target sealing ring has an opening that matches the side opening of the second enclosure plate. Specifically, the opening of the target sealing ring and the side opening of the second enclosure plate have the same orientation and size.
  • the material of the target sealing ring can be sealing foam or silicone.
  • a first gap 19 may exist between the circuit board 16 and the transition leg 15 .
  • Embodiments of the present application may adopt two possible implementation methods (namely, one possible implementation method and another possible implementation method described below) to achieve sealing of the first gap.
  • the electronic device may further include: a second sealing structure.
  • the second sealing structure seals the first gap between the circuit board and the transition leg.
  • the second sealing structure will be described in detail below.
  • the second sealing structure 20 may include: an intersecting first arm and a second arm; the first arm disposes the circuit board 16 toward the second enclosure 14 On the surface, the second arm is disposed between the circuit board 16 and the side of the transition leg 15 , and the first climbing arm and the side of the transition leg 15 to seal the first gap 19 .
  • the second sealing structure can not only seal the first gap between the circuit board and the transition leg, but also improve sealing reliability because the first arm is attached to the surface of the circuit board facing the second enclosure.
  • first arm and the second arm are connected, and there is an included angle between the first arm and the second arm, such as 90°.
  • first arm and the second arm are L-shaped. It can be understood that the second sealing structure having the first arm and the second arm can also be called an L-shaped sealing bracket.
  • a part of the second arm is located between the circuit board and the side of the transition leg, and the other part of the second arm is located between the first climbing arm and the transition leg.
  • the first arm may be disposed between the target sealing ring and the circuit board.
  • the first arm can fit with the bottom surface of the circuit board, and the first arm fills the first gap between the circuit board and the side of the transition leg, not only the connection between the circuit board and the transition leg can be realized
  • the sealing between the side parts can also increase the connection strength of the second sealing structure and improve the sealing reliability.
  • the second sealing structure 2020 may include a third arm and a fourth arm disposed oppositely, and a third arm disposed between the third arm and the fourth arm. connecting arm.
  • the third arm and the fourth arm are respectively disposed on opposite surfaces of the circuit board 16 , and the connecting arm is disposed between the circuit board 16 and the transition leg 15 .
  • the third arm is provided on the surface of the circuit board facing the first enclosure
  • the second arm is provided on the surface of the circuit board facing the second enclosure
  • the connecting arm is arranged in the first gap (i.e., connecting arm fills the first gap).
  • the third arm may be disposed between the second sub-sealing ring and the circuit board, And it has an interference fit with the second sub-sealing ring; the fourth arm can be disposed between the circuit board and the second enclosure plate, and has an interference fit with the target sealing ring.
  • the connecting arm of the second sealing structure is filled in the gap between the circuit board and the transition leg. In the first gap, the sealing reliability between the circuit board and the transition leg can be improved.
  • the number of the second sealing structures is two, and the two first sealing structures are arranged corresponding to both sides of the first gap.
  • the two second sealing structures are both It is arranged in the area of the circuit board adjacent to the first notch.
  • the corner between the first sealing structure 18 and the second sealing structure 20 is the corner between the second arm and the second arm.
  • the corner between the first sealing structure 18 and the second sealing structure 20 is the third arm.
  • the electronic device provided by the embodiment of the present application may further include: a first adhesive member.
  • the first adhesive member is filled in the gap between the first sealing structure and the second sealing structure.
  • glue can be dispensed between the first sealing structure 18 and the second sealing structure 20 corresponding to the area indicated by the arrow in FIG. 10 .
  • the first adhesive member may be glue. That is, glue can be dispensed at the gap between the first sealing structure and the second sealing structure to achieve sealing of the gap between the first sealing structure and the second sealing structure.
  • the sealing performance of the sound cavity of the speaker can be further improved.
  • the second sealing structure 20 may include: a second adhesive member; the second adhesive member is filled in the first gap 19 between the circuit board 16 and the transition leg 15 shown in FIG. 5 .
  • the first adhesive member may be glue. That is, you can click directly on the gap between the circuit board and the transition leg. Glue to create a seal between the circuit board and the transition legs.
  • the sealing performance of the sound cavity in the electronic device can not only be improved, but also the difficulty of assembling the electronic device can be reduced.
  • the electronic device 10 may further include: a third sealing structure 22 , and the third sealing structure 22 is in the shape of a step.
  • the third sealing structure 22 may include a third sub-sealing ring, a fourth sub-sealing ring and two second climbing arms disposed between the third sub-sealing ring and the fourth sub-sealing ring;
  • the third sub-sealing ring and the fourth sub-sealing ring have opposite openings, and both ends of each second climbing arm are connected to the third sub-sealing ring and the fourth sub-sealing ring respectively.
  • the third sub-sealing ring is arranged between one end of the transition leg 15 and the first sub-sealing ring, and the third sub-sealing ring has an interference fit with the first sub-sealing ring, and the fourth sub-sealing ring is arranged on the second enclosure plate.
  • two second climbing arms are provided between the side of the transition foot 15 and the circuit board 16, and between the side of the transition foot 15 and the first climbing arm, and the second climbing arm and The first climbing arm has an interference fit.
  • the fourth sub-sealing ring is equivalent to the target sealing ring in the above-mentioned embodiment. That is, in another possible implementation, two second climbing arms are respectively provided at the openings of the fourth sub-sealing ring, and are connected to the third sub-sealing ring through the two second climbing arms to form a third sealing structure. .
  • sealing ribs may be provided on the surface of the third sealing structure facing the first bracket. In this way, eccentric errors generated during assembly of the first sealing structure and the second sealing structure can be avoided, thereby further improving the sealing performance of the sound cavity in the electronic device.
  • sealing ribs on the third sealing structure and the sealing ribs on the first sealing structure can be staggered, so that the first sealing structure and the third sealing structure can bite together through their respective sealing ribs.
  • the third sealing structure can not only seal the second enclosure plate and the circuit board, but also seal the first gap between the circuit board and the side of the transition leg, another possible implementation method is
  • the number of sealing structures can be reduced, thereby avoiding the introduction of new installation errors (such as the gap between the first sealing structure and the second structure).
  • the speaker unit 17 is moved up to a position close to the frame.
  • the side i.e. side wall
  • the side wall remove the pressed narrow edge at the corresponding position of the PCB board (i.e. circuit board 16), and use the side wall 26 of the frame as transition legs 15 to extend into the gap of the PCB board
  • the first sealing structure 18 is made of silicone material , and the first sub-sealing ring in the first sealing structure 18 is pressed on the transition leg 15, and the second sub-sealing ring is pressed on the PCB board; paste L-type silicone ( That is, the second sealing structure 20), one side of the L-shaped silicone is pasted on the back of the PCB board, and the other side is climbed and pasted along the side (i.e., the side) of the transition leg 15 (actually it can be climbed and pasted along the first climbing arm), filling the transition The gap between the leg 15 and the PCB board; and then the corner between the first sealing structure 18 and the second
  • the speaker unit 17 is moved up to the side close to the frame (i.e., the side wall), and the pressure at the corresponding position of the PCB board (i.e., the circuit board 16) is removed.
  • the first sealing structure 18 is made of silicone material, and the first sub-sealing ring in the first sealing structure 18 is pressed on the transition leg 15 , the second sub-sealing ring is pressed on the PCB board; a U-shaped silicone clip (i.e., the second sealing structure 20) is pasted on the gap between the first sealing structure 18 and the PCB board (i.e., the first gap 19).
  • the two long sides of the silicone clip i.e., the third arm and the fourth arm
  • the sides of the U-shaped silicone clip i.e., the connecting arms
  • the speaker unit 17 is moved up to the side close to the frame (i.e., the side wall), and the pressed narrow edge of the corresponding position of the PCB board (i.e., the circuit board 16) is removed.
  • the side wall 26 of the frame is used as a transition leg 15 to extend into the gap of the PCB board;
  • the first sealing structure 18 is made of silicone material, and the first sub-sealing ring in the first sealing structure 18 is pressed on the transition leg 15, and the second The sub-sealing ring is pressed onto the PCB board, and the gap between the transition leg 15 and the PCB board (i.e., the first gap 19) is sealed with glue.
  • the speaker unit 17 can be moved toward the frame, shortening the sound channel, and optimizing the PCB cloth; at the same time, due to the adaptability of the silicone gasket (i.e., the first sealing structure 18) for dispensing sealing
  • the gap that is originally difficult to seal through interference fit at the gap can be filled with glue to ensure the sealing of the entire rising cavity.
  • the interference fit of the silicone gasket can also play a good role. Sealing effect.
  • the loudspeaker unit 17 is moved up close to the frame.
  • the side of the body i.e., side wall
  • remove the pressed narrow edge of the corresponding position of the PCB board i.e., circuit board 16
  • the first sealing structure 18 adopts It is made of silicone material, and the first sub-sealing ring in the first sealing structure 18 is pressed between the transition leg 15 and the first bracket 11, and the second sub-sealing ring is pressed between the PCB board and the first enclosure 13;
  • the form of the sealing foam (i.e., the target sealing ring 23) between the second bracket and the second enclosure 14 is changed to a stepped third sealing structure 22, and the lower half of the third sealing structure 22 (i.e., the fourth sub-seal) ring) is laid between the second enclosure 14 and the PCB board, and the upper half of the third sealing structure 22 (i.e., the third sub-sealing ring) is laid at the gap of the transition leg 15.
  • the third sub-seal The ring is arranged between one end of the transition leg 15 and the first sub-seal ring, and the third sub-seal ring has an interference fit with the first sub-seal ring.
  • a sealing rib 201 is provided on the surface of the first sealing structure 18 facing away from the first bracket 11 .
  • the sealing of the step difference between the transition leg 15 and the PCB board is completed by the interference fit of the first sealing structure 18 made of silicone and the third sealing structure 22 made of sealing foam.
  • Both are soft structures, which can ensure that the The fit and seal between the gap and the corner of the transition leg 15, and the convex ribs on the first sealing structure 18 can avoid the eccentric error caused by the first sealing structure 18 and the third sealing structure 22 during assembly, resulting in poor sealing. .
  • the electronic device in the embodiment of the present application may be a mobile electronic device or a non-mobile electronic device.
  • the mobile electronic device may be a mobile phone, a tablet computer, a notebook computer, a handheld computer, a vehicle-mounted electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a personal digital assistant (personal digital assistant). assistant, PDA), etc.
  • the non-mobile electronic device can be a personal computer (PC), a television (TV), a smart speaker, a teller machine or a self-service machine, etc., which are not specifically limited in the embodiments of this application.
  • the methods of the above embodiments can be implemented by means of software plus the necessary general hardware platform. Of course, it can also be implemented by hardware, but in many cases the former is better. implementation.
  • the technical solution of the present application can be embodied in the form of a computer software product that is essentially or contributes to the existing technology.
  • the computer software product is stored in a storage medium (such as ROM/RAM, disk , optical disk), including several instructions to cause a terminal (which can be a mobile phone, computer, server, or network device, etc.) to execute the methods described in various embodiments of this application.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

本申请公开了一种电子设备，属于设备技术领域。该电子设备包括：相对设置的第一支架和第二支架，位于第一支架和第二支架之间的电路板、扬声器单体及围合组件；电路板具有第一缺口，扬声器单体设置在第一缺口内；围合组件围绕第一缺口设置，且围合组件与第一支架、第二支架及电路板密封连接；第一支架、第二支架、电路板及围合组件围合成扬声器单体的音腔。

Description

电子设备
相关申请的交叉引用
本申请主张在2022年05月26日在中国提交的中国专利申请号202210589390.5的优先权，其全部内容通过引用包含于此。
技术领域
本申请属于设备技术领域，具体涉及一种电子设备。
背景技术
目前，电子设备的扬声器单体，例如上扬声器单体的音腔可以由电路板，例如印刷电路PCB Printed Circuit Board，PCB)板以及设置在电路板两侧的2个电路板盖板围合而成。
具体的，电路板正对扬声器单体的区域设置有供扬声器单体穿过的通孔，且2个电路板盖板分别通过密封泡棉与电路板压合密封，从而使得电路板以及设置在电路板两侧的2个电路板盖板围合成扬声器单体的音腔。
如此，由于2个电路板盖板分别通过密封泡棉与PCB板压合密封，因此使得扬声器单体的出音通道较长，从而导致电子设备中的扬声器单体的电声性能较差。
发明内容
本申请实施例的目的是提供一种电子设备，能够解决因扬声器单体的出音通道较长，导致电子设备中的扬声器单体的电声性能较差的问题。
本申请实施例提供一种电子设备，包括：相对设置的第一支架和第二支架，位于第一支架和第二支架之间的电路板、扬声器单体及围合组件；电路板具有第一缺口，扬声器单体设置在第一缺口内；围合组件围绕第一缺口设置，且围合组件与第一支架、第二支架及电路板密封连接；第一支架、第二支架、电路板及围合组件围合成扬声器单体的音腔。
在本申请实施例中，电路板上设置有第一缺口，且扬声器单体设置在第一缺口内，从而可以使得扬声器靠近电路板的边缘，进而可以缩短扬声器单体的出音通道。如此可以提高电子设备中扬声器单体的电声性能。
附图说明
图1是本申请实施例提供的电子设备的结构示意图之一；
图2是本申请实施例提供的电子设备中的出音孔的结构示意图；
图3是本申请实施例提供的电子设备中的电路板与相关技术中电路板的对比示意图；
图4是本申请实施例提供的电子设备的结构示意图之二；
图5是本申请实施例提供的电子设备的结构示意图之三；
图6是本申请实施例提供的电子设备的结构示意图之四；
图7是本申请实施例提供的电子设备的结构示意图之五；
图8是本申请实施例提供的电子设备的结构示意图之六；
图9是本申请实施例提供的电子设备的结构示意图之七；
图10是本申请实施例提供的电子设备的结构示意图之八；
图11是本申请实施例提供的电子设备的结构示意图之九；
图12是本申请实施例提供的电子设备的结构示意图之十；
图13是本申请实施例提供的电子设备中的第一密封结构的示意图；
其中，图1至图13中的附图标记如下：
10-电子设备；11-第一支架；12-第二支架；13-第一围板；14-第二围板；141-第二
围板的侧开口；15-过渡支脚；151-延伸部；152-立板；16-电路板；161-第一缺口；17-扬声器单体；18-第一密封结构；19-第一间隙；20-第二密封结构；201-密封凸筋；22-第三密封结构；23-目标密封圈；24-出音孔；25-围合组件；26-框体的侧壁。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下 可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施，且“第一”、“第二”等所区分的对象通常为一类，并不限定对象的个数，例如第一对象可以是一个，也可以是多个。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
下面结合附图，通过具体的实施例及其应用场景对本申请实施例提供的电子设备进行详细地说明。
本申请实施例提供了一种电子设备，图1示出了本申请实施例提供的电子设备的一种可能的结构示意图，如图1所示，本申请实施例提供的电子设备100包括：相对设置的第一支架11和第二支架12，位于第一支架11和第二支架12之间的电路板16、扬声器单体17及围合组件25。电路板16具有第一缺口161，扬声器单体17设置在第一缺口161内；围合组件25围绕第一缺口161设置，且围合组件25与第一支架11、第二支架12及电路板16密封连接；第一支架11、第二支架12、电路板16及围合组件围合成扬声器单体17的音腔。
可选地，如图1所示，电路板16可以为电子设备中的主电路板，电路板可以为印刷电路板，或者其他可能的电路板，在此不做限定。
本申请实施例中，围合组件构成音腔的侧壁，第一支架和第二支架构成音腔的顶壁和底壁。
第一支架、围合组件和电路板围合成第一容置腔，以及第二支架、围合组件和电路板围合成第二容置腔；电路板上的第一缺口使得第一容置腔和第二容置腔连通。
需要说明的是，扬声器单体的出音孔的轴线与电路板平行。
本申请实施例中，相比于相关技术中在电路板上设置通孔的方案，本申请实施例在电路板设置第一缺口的方案由于去除了电路板上的压合窄边，从而使得扬声器单体能够靠近电路板的边缘设置。如此可以缩短扬声器单体的出音孔的长度，也可以称为出音通道的长度。
可选地，扬声器单体可以设置在第一支架上，或者扬声器单体可以设置在第二支架上。
需要说明的是，对于扬声器单体来说，在扬声器单体不改变的情况下，扬声器单 体的外放效果的主要影响因素在于扬声器单体音腔的腔体体积和出音通道的长短，音腔体积越大，出音通道越短，电声性能就越好。
可选地，如图1所示，围合组件25可以包括：第一围板13、第二围板14和过渡支脚15。
第一围板13设置在第一支架11与电路板16之间，第一围板13的两端与第一支架11和电路板16密封连接。第二围板14设置在第二支架12与电路板16之间，第二围板14的两端与第二支架12和电路板16密封连接。第一围板13和第二围板14均具有与第一缺口161朝向相同的侧开口。过渡支脚15的侧部与第一围板13的侧开口、第二围板14的侧开口及电路板16密封连接，且过渡支脚15的两端与第一支架11和第二支架12密封连接。
其中，第一缺口161位于第一围板13和第二围板14在电路板16上的投影区域的内侧。
可以理解，本申请实施例中的第一围板和第二围板在电路板上的投影区域的形状可以为：“凹”字型，或优弧(即弧度大于180°)形等任意可能的形状。
实际实现中，第一围板和第二围板在电路板上的投影区域的形状可以与第一缺口的形状相同。
本申请实施例中，“第一缺口位于第一围板和第二围板在电路板上的投影区域的内侧”，从而：可以确保第一缺口能够连通第一容置腔和第二容置腔。
本申请实施例中，“过渡支脚与第一围板的侧开口、第二围板的侧开口密封连接”，可以理解为：过渡支脚的侧部与第一围板的侧开口处的外壁、第一围板的侧开口处的外壁密封连接。
例如，如图2所示，过渡支脚15与第二围板14的侧开口处141的外壁一体成型。
可选地，如图2所示，第二围板14、过渡支脚15与第二支架12可以一体成型。
本申请实施例中，过渡支脚超出第二围板，即过渡支脚的高度大于第二围板的高度。
可选地，第一围板和第一支架可以一体成型。
可选地，过渡支脚的高度可以等于第一围板的高度和第二围板的高度之和。
需要说明的是，本申请实施例中，电子设备中的部件(例如过渡支脚)的高度是指部件沿第一支架与电路板的连线(例如垂线)方向的最大尺寸。
本申请实施例中，扬声器单体的高度大于第一围板的高度和第二围板的高度。
本申请实施例中，第一围板和第二围板均具有与第一缺口朝向相同的侧开口，从而确保过渡支脚的侧部能够与电路板(具体为电路板的侧壁)密封连接。
此外，第一围板和第二围板均具有侧开口，且第一围板的侧开口和第二围板的侧开口的朝向与第一缺口的朝向相同，均朝向过渡支脚，从而电路板靠近过渡支脚的区域，无需再预留压合窄边，这为在电路板上设置第一缺口提供了保障。
可以理解，本申请实施例中，如图3所示，图3中的(a)为相关技术中扬声器单体与电路板布局示意图，如图3中的(a)所示，相关技术中的电路板16’上设置有压合窄边，从而扬声器单体与电路板边缘间的距离至少大于压合窄边的宽度；图3中的(b)为本申请实施例中扬声器单体与电路板的布局示意图，可以看出：1，本申请实施例提供的电子设备中扬声器单体可以更加电路板16的边缘设置，从而可以缩短扬声器单体的出音通道的长度。2，在相关技术中，电路板的压合窄边附近的布件空间因尺寸较小，而导致其利用率很低，如此使得在布件需求不变的情况下，相关技术中需求增大电路板的有效布件面积，从而利于电子设备的整机轻薄化；而在本申请实施例中，由于电路板无需预留压合窄边，因此可以使得电路板远离第一缺口的部分具有更多的布局空间，从而可以优化电路板上的电子元件的布局，有利于电子设备的整机轻薄化。
可选地，图4为过渡支脚15的一种可能的结构示意图。如图4所示，过渡支脚15包括相对设置的2个延伸部151，设置在2个延伸部151之间且与2个延伸部151垂直的立板152。过渡支脚15的侧部由这2个延伸部151组成。由于过渡支脚包括立板152从而可以确保第一支架、第二支架、电路板和围合组件能够围合成密封腔(即音腔)。
可选地，上述过渡支脚的侧部伸入第一缺口161中，并与电路板16密封连接。
可以理解，本申请实施例中，过渡支脚的侧部具体与电路板对应于第一缺口处的侧壁密封连接。
本申请实施例中，由于过渡支脚的侧部伸入第一缺口中并与电路板密封连接，因 此可以增大过渡支脚与电路板的接触面积，从而提高密封可靠性。
在本申请实施例提供的电子设备中，电路板上设置有第一缺口，且扬声器单体设置在第一缺口内，从而可以使得扬声器靠近电路板的边缘，进而可以缩短扬声器单体的出音通道。如此可以提高电子设备中扬声器单体的电声性能。
可选地，电子设备还可以包括：框体。第一支架、第二支架、电路板、扬声器单体和围合组件设置在框体中。其中，如图1所示，过渡支脚15设置在框体的侧壁26上，且音腔由第一支架11、第二支架12、电路板13、围合组件25和所述框体的侧壁26围合而成。
具体的，当过渡支脚设置在框体的侧壁上时，过渡支脚可以仅包括相对设置的2个延伸部，这2个延伸部直接设置在框体的侧壁上。如此，第一支架、第二支架、电路板、围合组件和框体的侧壁围合成扬声器单体的音腔。如此，由于无需再设置立板，因此可以确保扬声器单体可以尽可能地靠近框体设置，从而可以进一步缩短扬声器单体的出音通道的尺寸。
进一步可选地，可以将框体的侧壁靠近围合组件的表面作沉降处理，以便于作沉降处理的部分可以与第一支架密封连接。
可选地，过渡支脚与框体可以一体成型。或者，过渡支脚、第二围板和框体可以一体成型。
本申请实施例中，音腔由第一支架、第二支架、电路板、围合组件和框体的侧壁围合而成，可以确保扬声器单体与框体的侧壁可以直接接触，从而可以最大程度地缩短扬声器单体的出音通道的尺寸。
可选地，如图2所示，扬声器单体的出音孔24设置在框体的侧壁26上，且该出音孔24与电路板16平行。
可选地，如图1、图5、图6至图9、图11及图12所示，电子设备10还可以包括：第一密封结构18，第一密封结构18呈台阶状。第一密封结构18可以包括第一子密封圈、第二子密封圈和2个第一爬升臂；第一子密封圈和第二子密封圈具有相向的开口，每个第一爬升臂的两端分别与第一子密封圈和第二子密封圈连接。
其中，第一子密封圈设置在过渡支脚15的一端与第一支架11之间；2个第一爬 升臂设置在过渡支脚15的侧部与第一围板13之间，第二子密封圈设置在第一围板13和电路板16之间。
可以理解，本申请实施例中，2个第一爬升臂不交叉，从而使得第一子密封圈、第二子密封圈和2个第一爬升臂构成一个呈台阶状的密封圈。
本申请实施例中，“2个第一爬升臂设置在过渡支脚的侧部与第一围板之间”可以理解为，2个第一爬升臂设置在过渡支脚的侧部与第一围板的侧开口处的外壁间。
本申请实施例中，第一爬升臂垂直于第一子密封圈和第二子密封圈。
可以理解，本申请实施例中，第二子密封圈的尺寸与第一围板在电路板上的投影区域的尺寸相匹配。
可选地，第一密封结构的材质可以为密封泡棉或硅胶。
可选地，如图13所示，第一密封结构18背向第一支架11的表面上设置有密封凸筋201。如此可以避免第一密封结构和第二密封结构在装配时产生的偏心误差，进而可以进一步提高电子设备中的音腔的密封性能。
本申请实施例中，由于第一密封结构呈台阶状，即可以采用一个密封结构同时实现第一围板与过渡支脚、过渡支脚与第一支架件的密封，因此可以减小密封误差，从而可以提高密封性能。
可选地，如图1、图5至图9所示，电子设备10还可以包括：与第二围板14在电路板16上的投影区域匹配的目标密封圈23，该目标密封圈23设置在第二围板14的顶面与电路板16的底面之间，可以实现第二围板14与电路板16间的密封。
可以看出，目标密封圈具有开口，该开口与第二围板的侧开口相匹配。具体的，目标密封圈的开口与第二围板的侧开口的朝向、尺寸均相同。
可选地，目标密封圈的材质可以为密封泡棉或硅胶。
可选地，如图5所示，当采用第一密封结构18时，电路板16与过渡支脚15之可能存在第一间隙19。本申请实施例可以采用2种可能的实现方式(即下述的一种可能的实现方式和另一种可能的实现方式)，实现第一间隙的密封。
一种可能的实现方式中，电子设备还可以包括：第二密封结构。第二密封结构密封电路板和过渡支脚间的第一间隙。
下面对第二密封结构进行详细说明。
可选地，方式1，如图6和图7所示，第二密封结构20可以包括：相交的第一支臂和第二支臂；第一支臂设置电路板16朝向第二围板14的表面上，第二支臂设置在电路板16与过渡支脚15的侧部，以及第一爬升臂与过渡支脚15的侧部之间，以密封第一间隙19。如此第二密封结构不但可以实现电路板与过渡支脚之间的第一间隙的密封，而且由于第一支臂贴合在电路板朝向第二围板的表面上，因此可以提高密封可靠性。
具体而言，第一支臂和第二支臂相连接，且第一支臂与第二支臂之间存在夹角，例如90°。
可以看出，第一支臂和第二支臂呈L型，可以理解，具有第一支臂和第二支臂的第二密封结构也可以称为L型密封支架。
可以理解，本申请实施例中，第二支臂的一部分位于电路板与过渡支脚的侧部之间，第二支臂的另一部分位于第一爬升臂与过渡支脚之间。
可选地，第一支臂具体可以设置在目标密封圈与电路板之间。
可选地，第二支臂与第一爬升臂之间过盈配合，如此可以避免第一密封结构与第二密封结构间存在缝隙，从而可以增加音腔的密封性能。
本申请实施例中，由于第一支臂可以与电路板的底面贴合，第一支臂填充电路板与过渡支脚的侧部之间的第一间隙，因此不但可以实现电路板与过渡支脚的侧部之间的密封，而且可以增加第二密封结构的连接强度，提高密封可靠性。
可选地，方式2，图8和图9所示，第二密封结构2020可以包括相对设置的第三支臂和第四支臂，以及设置在第三支臂和第四支臂之间的连接臂。
其中，第三支臂和第四支臂分别设置在电路板16相反的表面上，连接臂设置在电路板16与过渡支脚15之间。
可选地，假设第三支臂设置在电路板朝向第一围板的表面上，第二支臂设置在电路板朝向第二围板的表面上，连接臂设置在第一间隙中(即连接臂填充第一间隙)。
可以看出，第二密封结构是卡设在电路板上的。
可以理解，本申请实施例中，第三支臂可以设置在第二子密封圈与电路板之间， 且与第二子密封圈过盈配合；第四支臂可以设置在电路板与第二围板之间，且与目标密封圈过盈配合。
本申请实施例中，由于第二密封结构的第三支臂和第四支臂分别与电路板的两个相反表面贴合，且第二密封结构的连接臂填充在电路板与过渡支脚间的第一间隙中，因此可以提高电路板与过渡支脚间的密封可靠度。
本申请实施例中，在上述方式1和方式2中，第二密封结构的数量均为2个，2个第一密封结构对应第一缺口的两侧设置，例如，2个第二密封结构均设置在电路板与第一缺口相邻的区域。
在上述方式1和方式2中，第一密封结构和第二密封结构之间可能存在缝隙。
例如，如图7所示，当第二密封结构20包括相交的第一支臂和第二支臂时，第一密封结构18与第二密封结构20间的拐角处，即第二支臂与第一爬升臂之间，具体地，图7中的虚线框A所示的区域内可能存在缝隙。
又例如，如图9所示，当第二密封结构20包括第三支臂、第四支臂和连接臂时，第一密封结构18与第二密封结构20间的拐角处，即第三支臂与第一爬升臂之间，具体为图9中的虚线框B所示区域内可能存在缝隙。
为了密封第一密封结构和第二密封结构之间的缝隙，本申请实施例提供的电子设备还可以包括：第一粘接件。第一粘接件填充在第一密封结构与第二密封结构间的缝隙中。
例如，如图10所示，可以第一密封结构18和第二密封结构20间对应图10中箭头所示的区域进行点胶。
可选地，第一粘接件可以为胶水。即可以在第一密封结构和第二密封结构间的缝隙处进行点胶，以实现第一密封结构和第二密封结构之间的缝隙的密封。
本申请实施例中，由于可以通过第一密封件密封第一密封结构和第二密封结构之间的缝隙，因此可以进一步提高扬声器的音腔的密封性能。
可选地，方式3，第二密封结构20可以包括：第二粘接件；第二粘接件填充在图5所示的电路板16和过渡支脚15间的第一间隙19中。
可选地，第一粘接件可以为胶水。即可以直接在电路板与过渡支脚间的间隙处点 胶，以实现电路板与过渡支脚之间的密封。
本申请实施例中，由于可以通过第一粘接件粘接电路板与过渡支脚间的间隙，因此不但可以提高电子设备中的音腔的密封性能，而且可以降低电子设备的组装难度。
另一种可能的实现方式中，如图12所示，电子设备10还可以包括：第三密封结构22，第三密封结构22呈台阶状。第三密封结构22可以包括第三子密封圈、第四子密封圈及设置在第三子密封圈和第四子密封圈之间的2个第二爬升臂；
第三子密封圈和第四子密封圈具有相向的开口，每个第二爬升臂的两端分别与第三子密封圈和第四子密封圈连接。
其中，第三子密封圈设置在过渡支脚15的一端与第一子密封圈之间，且第三子密封圈与第一子密封圈过盈配合，第四子密封圈设置在第二围板14与电路板16之间；2个第二爬升臂设置在过渡支脚15的侧部与电路板16，以及过渡支脚15的侧部与第一爬升臂之间，且所述第二爬升臂与所述第一爬升臂过盈配合。
可以理解，本申请实施例中，第四子密封圈相当于上述实施例中的目标密封圈。即在另一种可能的实现方式中是在第四子密封圈的开口处分别设置2个第二爬升臂，通过2个第二爬升臂与第三子密封圈连接，以构成第三密封结构。
进一步可选地，第三密封结构朝向第一支架的表面上可以设置密封凸筋。如此可以避免第一密封结构和第二密封结构在装配时产生的偏心误差，进而可以进一步提高电子设备中的音腔的密封性能。
可以理解，第三密封结构上的密封凸筋与第一密封结构上的密封凸筋可以交错设置，以便于第一密封结构和第三密封结构可以通过各自的密封凸筋咬合在一起。
对于第三密封结构的其他描述，具体可以参见上述实施例中的相关描述。
本申请实施例中，由于第三密封结构在密封第二围板与电路板的同时，还可以对电路板与过渡支脚的侧部间的第一间隙进行密封，因此另一种可能的实现方式能够减少密封结构的数量，从而可以避免引入新的安装误差(例如第一密封结构与第二结构间的间隙)。
下面对本申请实施例提供的电子设备进行示例性地说明。
在一种可能的实现方式中，如图6和图7所示，扬声器单体17上移至靠近框体的 侧边(即侧壁)，去除PCB板(即电路板16)相应位置的压合窄边，框体的侧壁26做过渡支脚15伸入PCB板的缺口；第一密封结构18采用硅胶材质，且第一密封结构18中的第一子密封圈压合在过渡支脚15上，第二子密封圈压合在PCB板上；在过渡支脚15和PCB板间的段差部位粘贴L型硅胶(即第二密封结构20)，L型硅胶的一边粘贴在PCB板的背面，另一边沿过渡支脚15的侧面(即侧部)爬升粘贴(实际上可以沿第一爬升臂爬升粘贴)，填充过渡支脚15和PCB板间的断差部位的缝隙；然后通过点胶密封第一密封结构18、第二密封结构20间的拐角处，以保证良好的密封效果。
在一种可能的实现方式中，如图8和图9所示，扬声器单体17上移至靠近框体的侧边(即侧壁)，去除PCB板(即电路板16)相应位置的压合窄边，框体的侧壁26做过渡支脚15伸入PCB板的缺口；第一密封结构18采用硅胶材质，且第一密封结构18中的第一子密封圈压合在过渡支脚15上，第二子密封圈压合在PCB板上；在第一密封结构18和PCB板间的断差部位(即第一间隙19)粘贴U型硅胶夹(即第二密封结构20)，U型硅胶夹的两长边(即第三支臂和第四支臂)分别粘贴在PCB板的两面，U型硅胶夹的侧边(即连接臂)用以填充过渡支脚15和PCB板间的断差部位的缝隙；然后通过点胶密封第一密封结构18和U型硅胶夹间的拐角处，以保证音腔具有良好的密封效果。
在一中可能的实现方式中，如图5所示，扬声器单体17上移至靠近框体的侧边(即侧壁)，去除PCB板(即电路板16)相应位置的压合窄边，框体的侧壁26做过渡支脚15伸入PCB板的缺口；第一密封结构18采用硅胶材质，且第一密封结构18中的第一子密封圈压合在过渡支脚15上，第二子密封圈压合在PCB板上，且过渡支脚15和PCB板间的断差部位(即第一间隙19)采用点胶密封。由于取消了PCB上的压合窄边，可使扬声器单体17向框体移动，缩短出音通道，优化PCB布件；同时由于硅胶垫圈(即第一密封结构18)对于点胶密封的适应性，可以将原本断差处通过过盈配合难以密封的缝隙通过点胶填充来保证整个上扬腔体的密封性，而在非断差处，对硅胶垫圈的过盈配合同样可以起到良好的密封效果。
在另一种可能的实现方式中，如图11和图12所示，扬声器单体17上移至靠近框 体的侧边(即侧壁)，去除PCB板(即电路板16)相应位置的压合窄边，框体的侧壁26做过渡支脚15伸入PCB板的缺口；第一密封结构18采用硅胶材质，且第一密封结构18中的第一子密封圈压合在过渡支脚15与第一支架11之间，第二子密封圈压合在PCB板与第一围板13之间；
将第二支架和第二围板14间的密封泡棉(即目标密封圈23)形式改为呈台阶状的第三密封结构22，第三密封结构22的下半部分(即第四子密封圈)铺在第二围板14与PCB板之间，第三密封结构22的上半部分(即第三子密封圈)铺在过渡支脚15的断差处，具体而言，第三子密封圈设置在过渡支脚15的一端与第一子密封圈之间，且第三子密封圈与第一子密封圈过盈配合。
进一步地，第一密封结构18背向第一支架11的表面设置密封凸筋201。此时过渡支脚15和PCB板间的段差部位的密封是由硅胶材质的第一密封结构18与密封泡棉材质的第三密封结构22过盈配合完成，二者都是软结构，可以保证该断差处与过渡支脚15的拐角处的贴合密封，同时第一密封结构18上的凸筋可以避免第一密封结构18和第三密封结构22在装配时产生的偏心误差导致密封不良的情况。
可选地，本申请实施例中的电子设备可以是移动电子设备，也可以为非移动电子设备。示例性的，移动电子设备可以为手机、平板电脑、笔记本电脑、掌上电脑、车载电子设备、可穿戴设备、超级移动个人计算机(ultra-mobile personal computer，UMPC)、上网本或者个人数字助理(personal digital assistant，PDA)等，非移动电子设备可以为个人计算机(personal computer，PC)、电视机(television，TV)、智能音箱、柜员机或者自助机等，本申请实施例不作具体限定。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。此外，需要指出的是，本申请实施方式中的方法和装置的范围不限按示出或讨论的顺序来执行功能，还可包括根据所涉及的功能按基本同时的方式或按相反的顺序 来执行功能，例如，可以按不同于所描述的次序来执行所描述的方法，并且还可以添加、省去、或组合各种步骤。另外，参照某些示例所描述的特征可在其他示例中被组合。
通过以上的实施方式的描述，本领域的技术人员可以清楚地了解到上述实施例方法可借助软件加必需的通用硬件平台的方式来实现，当然也可以通过硬件，但很多情况下前者是更佳的实施方式。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分可以以计算机软件产品的形式体现出来，该计算机软件产品存储在一个存储介质(如ROM/RAM、磁碟、光盘)中，包括若干指令用以使得一台终端(可以是手机，计算机，服务器，或者网络设备等)执行本申请各个实施例所述的方法。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (13)

  1. 一种电子设备，包括：相对设置的第一支架和第二支架，位于所述第一支架和所述第二支架之间的电路板、扬声器单体及围合组件；
    所述电路板具有第一缺口，所述扬声器单体设置在所述第一缺口内；
    所述围合组件围绕所述第一缺口设置，且所述围合组件与所述第一支架、所述第二支架及所述电路板密封连接；
    所述第一支架、所述第二支架、所述电路板及所述围合组件围合成所述扬声器单体的音腔。
  2. 根据权利要求1所述的电子设备，其中，所述围合组件包括：第一围板、第二围板、过渡支脚和第一侧壁；
    所述第一围板设置在所述第一支架与所述电路板之间，所述第一围板的两端与所述第一支架和所述电路板密封连接；
    所述第二围板设置在所述第二支架与所述电路板之间，所述第二围板的两端与所述第二支架和所述电路板密封连接；
    所述第一围板和所述第二围板均具有与所述第一缺口朝向相同的侧开口；
    所述过渡支脚的侧部与所述第一围板的侧开口、所述第二围板的侧开口及所述电路板密封连接，所述过渡支脚的两端与所述第一支架和所述第二支架密封连接；
    其中，所述第一缺口位于所述第一围板和所述第二围板在所述电路板上的投影区域的内侧。
  3. 根据权利要求2所述的电子设备，其中，所述过渡支脚的侧部伸入所述第一缺口中，并与所述电路板密封连接。
  4. 根据权利要求2或3所述的电子设备，其中，还包括：框体；
    所述第一支架、所述第二支架、所述电路板、所述扬声器单体和所述围合组件设置在所述框体中；
    其中，所述过渡支脚设置在所述框体的侧壁上，且所述音腔由所述第一支架、所述第二支架、所述电路板、所述围合组件和所述框体的侧壁围合而成。
  5. 根据权利要求2所述的电子设备，其中，还包括：第一密封结构，且所述第一密封结构呈台阶状；
    所述第一密封结构包括第一子密封圈、第二子密封圈和设置在所述第一子密封圈和所述第二子密封圈之间的2个第一爬升臂；
    所述第一子密封圈和所述第二子密封圈具有相向的开口，每个所述第一爬升臂的两端分别与所述第一子密封圈和所述第二子密封圈连接；
    其中，所述第一子密封圈设置在所述过渡支脚的一端与所述第一支架之间，2个所述第一爬升臂设置在所述过渡支脚的侧部与所述第一围板之间，所述第二子密封圈设置在所述第一围板和所述电路板之间。
  6. 根据权利要求5所述的电子设备，其中，所述第一密封结构背向所述第一支架的表面上设置有密封凸筋。
  7. 根据权利要求5所述的电子设备，其中，还包括：
    第二密封结构，密封所述过渡支脚的侧部和所述电路板间的第一间隙。
  8. 根据权利要求7所述的电子设备，其中，所述第二密封结构包括：相交的第一支臂和第二支臂；
    第一支臂设置在所述电路板朝向第二围板的表面上，所述第二支臂设置在所述过渡支脚的侧部与所述电路板，以及所述过渡支脚的侧部与所述第一爬升臂之间，以密封所述第一间隙。
  9. 根据权利要求7所述的电子设备，其中，所述第二密封结构包括：相对设置的第三支臂和第四支臂，以及设置在所述第三支臂和所述第四支臂之间的连接臂；
    所述第三支臂和所述第四支臂分别设置在所述电路板相反的表面上，所述连接臂设置在所述第一间隙中。
  10. 根据权利要求7至8中任一项所述的电子设备，其中，还包括：
    第一粘接件，填充在所述第一密封结构与所述第二密封结构间的缝隙中。
  11. 根据权利要求6所述的电子设备，其中，所述第二密封结构包括：填充在所述第一间隙中的第二粘接件。
  12. 根据权利要求5所述的电子设备，其中，还包括：第三密封结构，所述第三密封结构呈台阶状；
    所述第三密封结构包括第三子密封圈、第四子密封圈及设置在所述第三子密封圈和所述第四子密封圈之间的2个第二爬升臂；
    所述第三子密封圈和所述第四子密封圈具有相向的开口，每个所述第二爬升臂的两端分别与所述第三子密封圈和所述第四子密封圈连接；
    其中，所述第三子密封圈设置在所述过渡支脚的一端与所述第一子密封圈之间，且所述第三子密封圈与所述第一子密封圈过盈配合，所述第四子密封圈设置在所述第二围板与所述电路板之间；2个所述第二爬升臂设置在所述过渡支脚的侧部与所述电路板，以及所述过渡支脚的侧部与所述第一爬升臂之间，且所述第二爬升臂与所述第一爬升臂过盈配合。
  13. 根据权利要求1所述的电子设备，其中，所述扬声器单体设置在所述第二支架上。
PCT/CN2023/095999 2022-05-26 2023-05-24 电子设备 WO2023227019A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180227668A1 (en) * 2017-02-08 2018-08-09 Samsung Electronics Co., Ltd. Electronic device including speaker
CN112003970A (zh) * 2020-08-10 2020-11-27 北京小米移动软件有限公司 终端设备
CN113114824A (zh) * 2021-05-13 2021-07-13 维沃移动通信有限公司 电子设备
CN113382592A (zh) * 2021-06-18 2021-09-10 维沃移动通信有限公司 电子设备
CN114786079A (zh) * 2022-05-26 2022-07-22 维沃移动通信有限公司 电子设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180227668A1 (en) * 2017-02-08 2018-08-09 Samsung Electronics Co., Ltd. Electronic device including speaker
CN112003970A (zh) * 2020-08-10 2020-11-27 北京小米移动软件有限公司 终端设备
CN113114824A (zh) * 2021-05-13 2021-07-13 维沃移动通信有限公司 电子设备
CN113382592A (zh) * 2021-06-18 2021-09-10 维沃移动通信有限公司 电子设备
CN114786079A (zh) * 2022-05-26 2022-07-22 维沃移动通信有限公司 电子设备

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