WO2022262666A1 - 电子设备 - Google Patents
电子设备 Download PDFInfo
- Publication number
- WO2022262666A1 WO2022262666A1 PCT/CN2022/098328 CN2022098328W WO2022262666A1 WO 2022262666 A1 WO2022262666 A1 WO 2022262666A1 CN 2022098328 W CN2022098328 W CN 2022098328W WO 2022262666 A1 WO2022262666 A1 WO 2022262666A1
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- WO
- WIPO (PCT)
- Prior art keywords
- bracket
- circuit board
- sealing
- sealing layer
- electronic device
- Prior art date
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- 238000007789 sealing Methods 0.000 claims abstract description 236
- 238000009434 installation Methods 0.000 claims description 57
- 230000000670 limiting effect Effects 0.000 claims description 44
- 239000006260 foam Substances 0.000 claims description 23
- 230000007704 transition Effects 0.000 claims description 7
- 238000004891 communication Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 103
- 238000002955 isolation Methods 0.000 description 25
- 230000000694 effects Effects 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- 230000008569 process Effects 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000000428 dust Substances 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
Definitions
- the present application belongs to the technical field of communication equipment, and in particular relates to an electronic equipment.
- the purpose of the embodiments of the present application is to provide an electronic device to solve the problem that the current electronic device has an isolated wired interface, resulting in a large overall thickness of the electronic device, which is not conducive to the development of thinner and lighter electronic devices.
- the embodiment of the present application discloses an electronic device, which includes: a circuit board, a seal, a bracket, a middle frame component, and a support component, wherein,
- the circuit board is provided with an installation gap extending inwardly from its edge, and the bracket and the support assembly are fixedly connected to the circuit board;
- the seal includes a first seal layer on a first side of the circuit board and a second seal layer, the second seal layer on a second side of the circuit board;
- the first sealing layer is clamped between the circuit board and the bracket, and the second sealing layer is clamped between the circuit board and the support assembly ;
- An embodiment of the present application discloses an electronic device, which includes a circuit board, a seal, a bracket, a middle frame component, and a support component, wherein the circuit board is provided with a mounting notch extending inward from its edge, and the mounting notch can accommodate an interface device , the sealing member includes a first sealing layer and a second sealing layer, in the case that both the bracket and the support assembly are fixedly connected to the circuit board, the first sealing layer can be clamped between the circuit board and the bracket, and the second sealing layer can be Clamped between the circuit board and the support assembly, and along the extension direction of the installation notch, the seal can be sandwiched between the bracket and the middle frame assembly, so that the bracket, the first sealing layer, the circuit board, and the second seal
- the layer, the support assembly and the middle frame assembly can form an isolation cavity, which has an opening corresponding to the opening of the installation notch, and in addition to the aforementioned opening, the inner wall of the isolation cavity is a complete inner wall, thereby preventing The water vapor
- the first sealing layer and the second sealing layer in the sealing member are respectively arranged on opposite sides of the circuit board, by making one end of the interface device protrude from the through hole of the first sealing layer, and the interface device The other end of the other end protrudes from the through hole of the second sealing layer, so that the sealing member is not stacked on the interface device accommodated in the installation notch, so that the size of the interface device in the thickness direction of the circuit board will not be further increased, and then in the In the case of adopting the above-mentioned sealing method, the overall thickness of the electronic device will not be further increased, which is conducive to the development of thinner and lighter electronic devices.
- FIG. 1 is an exploded schematic diagram of an electronic device disclosed in an embodiment of the present application
- FIG. 2 is a schematic diagram of a part of the structure of the electronic device disclosed in the embodiment of the present application.
- Fig. 3 is a sectional view of the structure shown in Fig. 2 along the B-B direction;
- Fig. 4 is the sectional view of the structure shown in Fig. 2 along C-C direction;
- FIG. 5 is a schematic diagram of a partial structure including a bracket in an electronic device disclosed in an embodiment of the present application
- Fig. 6 is an assembly diagram between the limiting protrusion and the bracket in the electronic device disclosed in the embodiment of the present application;
- FIG. 7 is a schematic structural diagram of a seal in an electronic device disclosed in an embodiment of the present application.
- FIG. 8 is a schematic cross-sectional view of a seal in an electronic device disclosed in an embodiment of the present application.
- 200-sealing element 210-first sealing layer, 220-second sealing layer, 230-sealing part, 231-connecting section, 232-limiting section, 232a-first plane, 232b-second plane, 232c-arc Shape transition surface, 240-arc chamfer,
- the embodiment of the present application discloses an electronic device
- the electronic device includes a circuit board 100, a bracket 300, a middle frame assembly 400, a support assembly 500 and a seal 200
- the electronic device also includes Structural components such as the rear case 720 and the display screen 730 may also be provided with devices such as the camera 740 , and the details will not be described here in consideration of the brevity of the text.
- the circuit board 100 is a device for laying out the circuit structure in the electronic equipment, and the electronic devices in the electronic equipment can be connected to the circuit board 100.
- the display screen 730 and the camera 740 can be electrically connected by welding. connected to the circuit board 100.
- the circuit board 100 is provided with an installation notch 110 extending inwardly from its edge. During the assembly process of the electronic device, the installation notch 110 can accommodate the interface device 710, so that the interface device 710 and The maximum thickness of the combined structure of the circuit board 100 is relatively small, thereby enabling the development of electronic equipment to be thinner and lighter.
- the interface device 710 is specifically a device with an interface such as a jack.
- the interface device 710 can be provided with a solder pin to solder the interface device 710 to the circuit board 100 through the solder pin. On the one hand, the interface device 710 is fixed, and on the other hand, it can be ensured.
- the interface device 710 forms an electrical connection with the circuit board 100 , so that the electronic device can be wired with peripheral products or data cables and other devices through the interface device 710 for information exchange or charging and discharging.
- the sealing member 200 can be made of rubber and other flexible materials with a certain water-repelling ability, and the sealing member 200 includes a first sealing layer 210 and a second sealing layer 220 .
- the first sealing layer 210 is located on the first side of the circuit board 100
- the second sealing layer 220 is located on the second side of the circuit board 100
- the first sealing layer 210 and the second sealing layer 220 can be parts on opposite sides of the circuit board 100
- the gap with the circuit board 100 provides filling and sealing effect.
- the installation notch 110 is provided on the circuit board 100 , and the projections of the first sealing layer 210 and the second sealing layer 220 in the thickness direction of the circuit board 100 both cover the inner wall of the installation notch 110 . That is to say, the first sealing layer 210 and the second sealing layer 220 respectively cover opposite sides of the inner wall of the installation gap 110 .
- the first sealing layer 210 and the second sealing layer 220 are provided with perforations, and the perforations on the first sealing layer 210 penetrate the first sealing layer 210 along the thickness direction of the circuit board 100.
- the holes on the second sealing layer 220 The perforation runs through the second sealing layer 220 along the thickness direction of the circuit board 100, so that one end of the interface device 710 installed in the installation gap 110 protrudes from the perforation of the first sealing layer 210, and the other end of the interface device 710 protrudes from the second sealing layer 220.
- the perforations of the sealing layer 220 protrude to reduce the overall thickness of the combined structure of the interface device 710 , the circuit board 100 and the sealing member 200 .
- the shapes of the first sealing layer 210 and the second sealing layer 220 may be the same as or similar to the shape of the inner wall of the installation notch 110 .
- the installation gap 110 is an arc-shaped U-shaped structure
- the first sealing layer 210 and the second sealing layer 220 may also be an arc-shaped U-shaped structure
- the installation gap 110 is a zigzag U-shaped structure
- the first sealing layer 210 and the second sealing layer 220 can also be a folded U-shaped structure, to ensure that both the first sealing layer 210 and the second sealing layer 220 can provide a reliable sealing effect for the connection between the installation gap 110 and the opposite side parts 410 .
- both the first sealing layer 210 and the second sealing layer 220 can be sheet-like structural members, and the specific shapes of the two can correspond to the specific shape of the installation notch 110 , and the first sealing layer 210 and the second sealing layer 220
- the thickness can be selected according to actual needs, and is not limited here.
- the structures of the first sealing layer 210 and the second sealing layer 220 may be different.
- the structures of the first sealing layer 210 and the second sealing layer 220 are the same.
- the sealing effect is further reduced.
- the structure of the components corresponding to the first sealing layer 210 and the second sealing layer 220 in the sealing member 200 can be basically the same, thereby improving the overall sealing performance of the sealing member 200 to a certain extent.
- the support assembly 500 may specifically be a front case of an electronic device, and the display screen 730 may specifically be installed on a side of the support assembly 500 away from the circuit board 100 .
- Both the bracket 300 and the support assembly 500 are fixedly connected to the circuit board 100 , thereby providing necessary conditions for forming a stable isolation cavity for the electronic equipment at the area where the installation notch 110 is located.
- a fixed connection relationship can be formed by connecting parts such as screws, or, the bracket 300 can be connected to the circuit board by bonding or the like.
- 100 are fixed to each other, and fix the bracket 300 and the support assembly 500 to each other.
- the specific shapes of the bracket 300, the support assembly 500 and the circuit board 100 are not limited here, and it is only necessary to ensure that the respective areas of the bracket 300 and the support assembly 500 that are opposite to the mounting notch 110 in the circuit board 100 can have a non-porous surface, Therefore, it is ensured that the formed cavity has a complete cavity wall, thereby preventing water vapor or dust from entering the opening of the installation notch 110 from entering the interior of the electronic device through the aforementioned cavity wall.
- the area of the bracket 300 and the support component 500 opposite to the installation gap 110 may have a complete seamless and non-porous surface, or the bracket 300 and the support component 500 may be integrated with the bracket 300 and the support component 500 by coating an adhesive layer or covering an insulating layer. The area opposite to the mounting notch 110 forms a complete surface.
- the first sealing layer 210 can be clamped between the circuit board 100 and the bracket 300, and the second sealing layer 220 can be Clamped between the circuit board 100 and the support assembly 500, so that the bracket 300, the first sealing layer 210, the circuit board 100, the second sealing layer 220 and the support assembly 500 can form an isolation cavity, and the cavity of the isolation cavity is separated from the
- the installation notch 110 is located at the same position as the opening on the edge of the circuit board 100 .
- the seal 200 is sandwiched between the bracket 300 and the middle frame between the components 400, so that the seal 200 and the middle frame component 400 form a press-fit relationship, and block the gap that may exist between the middle frame component 400 and the opening of the formed isolation cavity, so that the formed isolation cavity
- the inner wall of the isolation cavity is a complete inner wall, ensuring that water vapor or dust entering the aforementioned isolation cavity from the opening of the installation notch 110 can only be discharged from the cavity of the isolation cavity , without passing through the wall of the isolation cavity and entering the other side of the isolation cavity.
- the thickness direction of the circuit board 100 is specifically the direction M in FIG. 4
- the extending direction of the installation notch 110 is specifically the direction N in FIG. 4 .
- the cross section of the bracket 300 can be a bent structure, which can include interconnected beams and longitudinal beams, the beams can cooperate with the first sealing layer 210, and the longitudinal beams can Cooperate with the entire sealing member 200, so as to ensure that the bracket 300 can not only provide a limiting effect for the first sealing layer 210 in the thickness direction of the circuit board 100, but also provide a limiting effect for the sealing member 200 in the extending direction of the installation notch 110 .
- the protruding part of the sealing member 200 can cooperate with the middle frame assembly 400 , and under the limit action of the bracket 300 , The part of the sealing member 200 protruding relative to the bracket 300 is squeezed to form a stable and reliable sealing connection with the middle frame assembly 400 .
- bracket 300 and the middle frame assembly 400 can provide the sealing member 200 with a limiting effect along the aforementioned axial direction
- the bracket 300 , the circuit board 100 and the support assembly 500 can provide the sealing member 200 along the thickness of the circuit board 100 direction, so that even if the support assembly 500 and the middle frame do not provide the sealing member 200 with a limiting effect along the extension direction of the installation notch 110, it can basically ensure that the sealing member 200 can form a relatively reliable sealing connection relationship with the middle frame , to ensure that the formed isolation cavity has a complete cavity wall.
- the embodiment of the present application discloses an electronic device, which includes a circuit board 100, a sealing member 200, a bracket 300, a middle frame assembly 400 and a support assembly 500, wherein the circuit board 100 is provided with an installation notch 110 extending inward from its edge,
- the installation notch 110 can accommodate the interface device 710
- the sealing member 200 includes a first sealing layer 210 and a second sealing layer 220, and when the bracket 300 and the support assembly 500 are fixedly connected to the circuit board 100, the first sealing layer 210 can Clamped between the circuit board 100 and the bracket 300, the second sealing layer 220 can be clamped between the circuit board 100 and the support assembly 500, and along the extension direction of the mounting notch 110, the sealing member 200 can be clamped on the Between the bracket 300 and the middle frame assembly 400, so that the bracket 300, the first sealing layer 210, the circuit board 100, the second sealing layer 220, the support assembly 500 and the middle frame assembly 400 can form an isolated cavity, which has a cavity
- the opening of the opening corresponds to
- the first sealing layer 210 and the second sealing layer 220 in the sealing member 200 are arranged on opposite sides of the circuit board 100 respectively, and one end of the interface device 710 extends from the through hole of the first sealing layer 210 and make the other end of the interface device 710 protrude from the through hole of the second sealing layer 220, so that the sealing member 200 is not stacked on the interface device 710 accommodated at the installation notch 110, so that the interface device 710 will not be further enlarged.
- the size in the thickness direction of the circuit board 100 and in the case of adopting the above sealing method, will not cause the overall thickness of the electronic device to further increase, which is conducive to the development of thinner and lighter electronic devices.
- the first sealing layer 210 is sandwiched between the bracket 300 and the circuit board 100.
- at least one side surface of the first sealing layer 210 is provided with a strip-shaped sealing protrusion, and the extension of the strip-shaped sealing protrusion The direction is the same as the extension direction of the entire first sealing layer 210 , for example, both the strip-shaped sealing protrusion and the first sealing layer 210 may be curved U-shaped structural members. More specifically, strip-shaped sealing protrusions can be provided on opposite sides of the first sealing layer 210 , and the number of strip-shaped sealing protrusions on each side can be one or more.
- the bracket 300 and the circuit board 100 are fixed to each other, so that the bracket 300 and the circuit board 100 can exert a pressing effect on the first sealing layer 210, so that the strip-shaped sealing protrusions have a certain degree of compression.
- the elastic deformation further enhances the sealing tightness between the first sealing layer 210 and the bracket 300 , and between the first sealing layer 210 and the circuit board 100 .
- at least one side surface of the opposite sides of the second sealing layer 220 may also be provided with strip-shaped sealing protrusions, so as to improve the tightness of the sealing relationship between the circuit board 100 and the support assembly 500 .
- the sealing member 200 further includes a sealing part 230, and the sealing part 230 includes a connecting section 231, and the respective first ends of the first sealing layer 210 and the second sealing layer 220 are connected through the connecting section 231 of the sealing part 230, so that the second The first sealing layer 210 and the second sealing layer 220 can be connected as a whole to facilitate the installation and transportation of the sealing member 200 .
- the connecting section 231 can be a block structure, and in order to improve the processing efficiency of the sealing member 200, the first sealing layer 210, the second sealing layer 220 and the sealing part 230 can be formed by integral injection molding, which can also improve The connection reliability between the various parts can further improve the sealing performance of the entire sealing member 200 .
- the sealing portion 230 may also include a limiting section 232, which is connected to the connecting section 231, and the limiting section 232 protrudes toward the side of the first sealing layer 210 away from the second sealing layer 220, that is, The limiting section 232 protrudes relative to the first sealing layer 210.
- the limiting section 232 can be sandwiched between the bracket 300 and the middle frame assembly 400, so that the entire sealing member 200 can be installed along the installation gap 110 The extension direction clamping is clamped by the bracket 300 and the middle frame assembly 400 .
- the limiting section 232 can be a block-shaped structural member.
- the limiting section 232 When no other structure except the limiting section 232 is provided between the bracket 300 and the middle frame assembly 400, by making the limiting section 232 in the installation gap 110
- the size of the extending direction of the frame is slightly larger than the distance between the bracket 300 and the middle frame assembly 400, so that after the bracket 300 and the circuit board 100 are fixed to each other, the limiting section 232 is squeezed between the bracket 300 and the middle frame assembly 400 , so that the sealing member 200 and the middle frame assembly 400 form a better sealing connection relationship.
- the first sealing layer 210 and/or The second sealing layer 220 is warped due to the extrusion of the installation notch 110 , which further improves the sealing effect between the bracket 300 and the circuit board 100 , and/or between the support assembly 500 and the circuit board 100 .
- the corner is provided with an arc-shaped chamfer 240
- the end of the bracket 300 is provided with an arc-shaped matching portion 321
- the arc-shaped matching portion 321 and the arc-shaped chamfer 240 are extruded and bonded.
- dimensions such as radians of the arc-shaped matching portion 321 and the arc-shaped chamfering portion 240 may be determined according to actual conditions, and are not limited here.
- the bracket 300 and the circuit board 100 when the bracket 300 and the circuit board 100 are fixed to each other, the bracket 300 and the circuit board 100 press the first sealing layer 210 , and the bracket 300 and the middle frame assembly 400 press the limiting section 232 At this time, it can be basically ensured that no sealing dead angle will be formed between the joint between the limiting section 232 and the first sealing layer 210 and the bracket 300, which can improve the bonding reliability between the bracket 300 and the sealing member 200, and further ensure the above-mentioned multiple The airtight condition of the cavity wall of the isolation cavity formed by the two components is better.
- the second ends of the first sealing layer 210 and the second sealing layer 220 can also be connected through the connecting section 231 of the sealing part 230, And the structures of the two sealing parts 230 are the same.
- both ends of the first sealing layer 210 can seal fit with the middle frame assembly 400 through the limiting section 232 of the sealing part 230 , so that the sealing reliability between the sealing member 200 and the middle frame assembly 400 can be improved. , to further ensure the higher sealing performance of the wall of the isolated cavity formed.
- the support assembly 500 includes a support plate 510 and a main upper plate 520, which are connected to each other.
- the main upper plate 520 is sandwiched between the middle frame assembly 400 and the support plate 510, and the sealing member 200 is sandwiched between them. It is arranged between the bracket 300 and the upper main body 520 , and the seal 200 is also interposed between the supporting plate 510 and the upper main body 520 .
- the two opposite sides of the sealing member 200 can be clamped along the extension direction of the installation notch 110, so that the gap between the sealing member 200 and the middle frame assembly 400 can be further improved. The sealing reliability between the component 200 and the upper body 520.
- the respective shapes and sizes of the support plate 510 and the main upper plate 520 can be determined according to actual needs. Structures such as limiting grooves are provided to ensure that the support plate 510 can provide the sealing member 200 with a limiting effect along the extension direction of the installation notch 110.
- the upper main body 520 can also include interconnected transverse extensions and longitudinal extensions, so that Ensure that the upper part 520 can not only provide the sealing member 200 with a limiting effect along the thickness direction of the circuit board 100 through the lateral extension, but also provide the sealing member 200 with a limiting effect along the extending direction of the installation notch 110 through the longitudinal extension.
- the lateral extension of the upper part 520 can be connected to the support plate 510 and provide support for components such as the display screen 730 in the electronic device, and the longitudinal extension of the upper main part 520 can be clamped between the sealing member 200 and the middle frame assembly 400 .
- the middle frame assembly 400 may include a side part 410 and a main part 420, the side part 410 is connected to the outer periphery of the main part 420, the side part 410 has a side surface of the electronic device, the main part 420 is arranged inside the electronic device, correspondingly , along the extension direction of the installation notch 110, the upper main part 520 is clamped between the side part 410 and the support plate 510; correspondingly, along the thickness direction of the circuit board 100, the bracket 300 is clamped between the main part 420 and the circuit board 100 .
- the actual structure and size of the side part 410 and the main part 420 can be correspondingly set according to the specific situation, which is not limited here.
- the main part 420 and the side part 410 can be made of hard materials such as plastic or metal.
- the space can be fixed as a whole by welding, thermal fusion or bonding, and the main body 420 and the bracket 300 can be fixed to each other by bonding or connecting pieces.
- sealing foam 430 is squeezed between the bracket 300 and the main body 420, and the projection of the sealing foam 430 along the thickness direction of the circuit board 100 covers the installation gap 110.
- the sealing foam 430 can ensure that the area of the circuit board 100 corresponding to the installation notch 110 has a complete surface, so that the integrity of the cavity wall of the formed isolation cavity better.
- the bracket 300 and the sealing foam 430, and between the sealing foam 430 and the main body 420 can be fixed to each other by glue bonding, which can further improve the circuit The surface integrity and sealing performance of the combined structure formed by the board 100 , the sealing foam 430 and the main body 420 .
- the first surface of the limiting section 232 facing the sealing foam 430 includes a first plane 232 a, The second plane 232b and the arc-shaped transition surface 232c, the first plane 232a is flush with the side surface of the bracket 300 facing the sealing foam 430, the second plane 232b is flush with the side surface of the main upper 520 facing the sealing foam 430, The first plane 232 a and the second plane 232 b are connected by an arc-shaped transition surface 232 c , and the sealing foam 430 is attached to the bracket 300 , the first surface and the upper main surface 520 .
- the surface of the bracket 300, the first surface of the sealing member 200 and the surface of the main upper surface 520 can be connected to each other by means of the transition effect of the arc-shaped transition surface 232c to form a relatively gentle and almost There is no dead corner of the foam fitting surface, so that the sealing foam 430 of flexible material can form a relatively close fitting relationship with the aforementioned foam fitting surface, preventing any There is a gap between them and the sealing foam 430, which will adversely affect the isolation reliability of the formed isolation cavity.
- the bracket 300 may include a bracket body 310 and a sunken platform portion 320, and the sunken platform portion 320 is recessed toward one side of the bracket body 310 relative to the bracket body 310 Setting, that is, both the counterpoise portion 320 and the bracket body 310 are not in the same plane.
- the platform portion 320 and the bracket body 310 can be formed through sheet metal through a flat structural member.
- the first sealing layer 210 is clamped between the circuit board 100 and the sunken platform part 320
- the sunken platform part 320 is clamped between the circuit board 100 and the main body part 420.
- the pressing effect of the main body part 420 acting on the sunken platform part 320 is better, thereby further improving the effect of the sunken platform part 320 on the first sealing layer.
- the pressing effect on the layer 210 ensures a better sealing effect between the sunken platform portion 320 and the circuit board 100 .
- the area of the main body 420 corresponding to the sunken platform 320 can also be provided with a structure similar to the sunken platform 320, so as to further reduce the contact area between the main body 420 and the sunken platform 320, and improve the contact area between the main body 420 and the sunken platform.
- the pressing effect between the lands 320 can also be provided with a structure similar to the sunken platform 320, so as to further reduce the contact area between the main body 420 and the sunken platform 320, and improve the contact area between the main body 420 and the sunken platform.
- the sealing member 200 can be squeezed between the bracket 300 and the middle frame assembly 400, and the positioning relationship between the bracket 300 and the middle frame assembly 400 can be specifically determined by making the bracket 300, The circuit board 100 and the middle frame assembly 400 are fixed to each other.
- the side of the support assembly 500 facing the circuit board 100 is provided with a limiting protrusion 530 , and in the extending direction of the installation notch 110 , the bracket 300 is pressed against the sealing member 200 and the limiting protrusion. Between 530.
- the movement of the bracket 300 along the extension direction of the installation notch 110 to the direction away from the middle frame assembly 400 is further restricted, so as to ensure that the sealing member 200 can be clamped stably. It is held between the bracket 300 and the middle frame assembly 400, so that the sealing relationship between the sealing member 200 and the middle frame assembly 400 is relatively stable and reliable.
- the size of the limiting protrusion 530 in the extending direction of the installation notch 110 can be determined according to the dimensions of the components such as the bracket 300 and the sealing member 200 in the corresponding direction, so that when the bracket 300 is installed on the limiting protrusion 530, it can A pressing effect is provided for the sealing member 200 , so that the sealing member 200 and the middle frame assembly 400 are press fit.
- the number of the limiting protrusion 530 can be one, and one limiting protrusion 530 can be set corresponding to the position of the sealing member 200, so as to make the limiting action point provided by the limiting protrusion 530 and the receiving point of the sealing member 200 as far as possible.
- the connecting line between the force acting points is parallel to the extension direction of the installation notch 110 .
- the reliability of the bracket 300 against the seal 200 can be further improved, and on the other hand, it can also prevent
- the bracket 300 rotates obliquely with a limiting protrusion 530 as a fulcrum the stability of the bracket 300 extruding the seal 200 is improved; a plurality of limiting protrusions 530 can be arranged on the support assembly 500 at intervals, and can be used as much as possible.
- a plurality of position-limiting protrusions 530 are arranged in a scattered manner.
- the two position-limiting protrusions 530 may be respectively arranged on the sides of the sealing member 200 in a direction perpendicular to the extending direction of the installation notch 110 and the thickness direction of the circuit board 100 .
- the opposite sides provide a relatively uniform and stable limiting effect for the bracket 300 to squeeze the sealing member 200 .
- the electronic device disclosed in the embodiment of the present application may be a mobile phone, a computer, an e-book reader, a wearable device, etc., and the embodiment of the present application does not limit the specific type of the electronic device.
- the term “comprising”, “comprising” or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article or apparatus comprising a set of elements includes not only those elements, It also includes other elements not expressly listed, or elements inherent in the process, method, article, or device. Without further limitations, an element defined by the phrase “comprising a " does not preclude the presence of additional identical elements in the process, method, article, or apparatus comprising that element.
- the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved. Functions are performed, for example, the described methods may be performed in an order different from that described, and various steps may also be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.
Abstract
本申请公开一种电子设备，属于通信设备领域，电子设备包括电路板、密封件、支架、中框组件和支撑组件，所述电路板设有自其边缘向内延伸形成的安装缺口，所述支架和所述支撑组件均与所述电路板固定连接；所述密封件包括第一密封层和第二密封层，所述第一密封层位于所述电路板的第一侧，所述第二密封层位于所述电路板的第二侧；沿所述电路板的厚度方向：所述第一密封层夹持于所述电路板和所述支架之间，且所述第二密封层夹持于所述电路板和所述支撑组件之间；沿所述安装缺口的延伸方向，所述密封件夹设于所述支架和所述中框组件之间。
Description
交叉引用
本发明要求在2021年06月18日提交中国专利局、申请号为202110681007.4、发明名称为“电子设备”的中国专利申请的优先权，该申请的全部内容通过引用结合在本发明中。
本申请属于通信设备技术领域，具体涉及一种电子设备。
鉴于有线连接的优越性，目前的电子设备在进一步发展无线连接技术的同时，仍保留有一些有线接口。以手机等电子设备为例，手机上设置有充电接口，部分手机还仍保留有耳机接口等。目前，通过在接口处的电子器件之外套设硅胶套，且使硅胶套与电子设备内部的其他部件密封连接，可以保证有线接口的内腔与电子设备的内部空间相互隔开，从而防止外界的水汽通过有线接口的内腔进入至电子设备的内部空间，对电子设备的安全性和使用寿命产生不利影响。但是，在上述方案中，由于接口器件的外周均覆盖有硅胶套的一部分，尤其是接口器件沿电路板的厚度方向的相背两侧覆盖有硅胶套，会对电子设备的整体厚度产生较大的不利影响，不利于电子设备向轻薄化发展。
发明内容
本申请实施例的目的是提供一种电子设备，以解决因目前电子设备为隔绝有线接口，导致电子设备的整体厚度较大，不利于电子设备向轻薄化发展的问题。
为了解决上述技术问题，本申请是这样实现的：
本申请实施例公开一种电子设备，其包括：电路板、密封件、支架、中框组件和支撑组件，其中，
所述电路板设有自其边缘向内延伸形成的安装缺口，所述支架和所述支撑组件均与所述电路板固定连接；
所述密封件包括第一密封层和第二密封层，所述第一密封层位于所述电路板的第一侧，所述第二密封层位于所述电路板的第二侧；
沿所述电路板的厚度方向：所述第一密封层夹持于所述电路板和所述支架之间，且所述第二密封层夹持于所述电路板和所述支撑组件之间；
沿所述安装缺口的延伸方向，所述密封件夹设于所述支架和所述中框组件之间。
本申请实施例公开一种电子设备，其包括电路板、密封件、支架、中框组件和支撑组件，其中，电路板设有自其边缘向内延伸的安装缺口，该安装缺口能够容纳接口器件，密封件包括第一密封层和第二密封层，在支架和支撑组件均与电路板固定连接的情况下，第一密封层能够被夹持在电路板和支架之间，第二密封层能够被夹持在电路板与支撑组件之间，且沿安装缺口的延伸方向，密封件能够被夹设在支架和中框组件之间，从而使得支架、第一密封层、电路板、第二密封层、支撑组件和中框组件能够形成一隔绝腔，该隔绝腔具有腔口，腔口与安装缺口的开口对应，且除了前述腔口之外，隔绝腔的内壁为完整的内壁，进而可以防止自隔绝腔的腔口进入的水汽和灰尘能够通过隔绝腔的内壁流动至隔绝腔的另一侧，保证电子设备中设有接口器件的区域与电子设备的内部隔开，保证电子设备即便设有有线接口，亦具有较高的防水性能。
同时，如上所述，密封件中的第一密封层和第二密封层分别设置在电路板的相背两侧，通过使接口器件的一端自第一密封层的穿孔伸出，且使接口器件的另一端自第二密封层的穿孔伸出，使得密封件没有层叠设置在容纳于安装缺口处的接口器件上，从而不会进一步增大接口器件处在电路板厚度方 向上的尺寸，进而在采用上述密封方式的情况下，不会造成电子设备的整体厚度进一步增大，这有利于电子设备向轻薄化发展。
此处所说明的附图用来提供对本申请的进一步理解，构成本申请的一部分，本申请的示意性实施例及其说明用于解释本申请，并不构成对本申请的不当限定。在附图中：
图1为本申请实施例公开的电子设备的分解示意图；
图2为本申请实施例公开的电子设备中部分结构的示意图；
图3为图2示出的结构沿B-B向的剖面图；
图4为图2示出的结构沿C-C向的剖面图；
图5为本申请实施例公开的电子设备中包括支架的部分结构的示意图；
图6为本申请实施例公开的电子设备中限位凸起与支架之间的装配图；
图7为本申请实施例公开的电子设备中密封件的结构示意图；
图8为本申请实施例公开的电子设备中密封件的剖面示意图。
附图标记说明：
100-电路板、110-安装缺口、
200-密封件、210-第一密封层、220-第二密封层、230-封口部、231-连接段、232-限位段、232a-第一平面、232b-第二平面、232c-弧形过渡面、240-弧形倒角部、
300-支架、310-支架本体、320-沉台部、321-弧形配合部、
400-中框组件、410-侧部、420-主体部、430-密封泡棉、
500-支撑组件、510-支撑板、520-主上、530-限位凸起、
710-接口器件、720-后壳、730-显示屏、740-摄像头。
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整的描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施，且“第一”、“第二”等所区分的对象通常为一类，并不限定对象的个数，例如第一对象可以是一个，也可以是多个。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
下面结合附图，通过具体的实施例及其应用场景对本申请实施例提供的折叠机构及电子设备进行详细地说明。
如图1至图8所示，本申请实施例公开一种电子设备，该电子设备包括电路板100、支架300、中框组件400、支撑组件500和密封件200，当然，电子设备中还包括如后壳720和显示屏730等结构件，也可以设置有摄像头740等器件，考虑文本简洁，此处不再详细介绍。
其中，电路板100为电子设备中用以布局电路结构的器件，电路板100上可以连接有电子设备中的电子器件，如上文所述的显示屏730和摄像头740均可通过焊接的方式电性连接在电路板100上。为了降低整个电子设备的厚度，电路板100上设置有自其边缘向内延伸形成的安装缺口110，在电子设备的组装过程中，该安装缺口110能够容纳接口器件710，从而使接口器件710和电路板100这一组合结构的最大厚度相对较小，进而使电子设备能够向轻薄化发展。接口器件710具体为具有插孔等接口的器件，接口器件710可以设有焊脚，以通过焊脚将接口器件710焊接连接在电路板100上，一方面固定接口器件710，另一方面可以保证接口器件710与电路板100形成电 性连接，从而使电子设备能够通过接口器件710与外设产品或数据线等器件进行有线连接，以进行信息交互或充放电等工作。
密封件200可以采用橡胶等柔性且具有一定隔水能力的材料制成，密封件200包括第一密封层210和第二密封层220。第一密封层210位于电路板100的第一侧，第二密封层220位于电路板100的第二侧，第一密封层210和第二密封层220可以与电路板100相背两侧的部件与电路板100之间的缝隙提供填充封堵作用。
并且，如上所述，电路板100上设置有安装缺口110，第一密封层210和第二密封层220在电路板100的厚度方向上的投影均遮盖安装缺口110的内壁。也就是说，第一密封层210和第二密封层220分别覆盖在安装缺口110的内壁的相背两侧。另外，第一密封层210和第二密封层220均设有穿孔，第一密封层210上的穿孔沿电路板100的厚度方向贯穿第一密封层210，对应地，第二密封层220上的穿孔沿电路板100的厚度方向贯穿第二密封层220，从而使安装于安装缺口110的接口器件710的一端自第一密封层210的穿孔伸出，且使接口器件710的另一端自第二密封层220的穿孔伸出，以减小接口器件710、电路板100和密封件200这一组合结构的整体厚度。
具体来说，可以使第一密封层210和第二密封层220二者的形状与安装缺口110的内壁的形状相同或相似。例如，安装缺口110为弧线状U形结构，则第一密封层210和第二密封层220亦可以为弧线状U形结构，安装缺口110为折线状U形结构，则第一密封层210和第二密封层220亦可以为折线状U形结构，以保证第一密封层210和第二密封层220均能够为安装缺口110与其相背两侧部410件的连接提供可靠的密封效果。
更具体地，第一密封层210和第二密封层220均可以为薄片状结构件，二者的具体形状可以与安装缺口110的具体形状对应，第一密封层210和第二密封层220的厚度可以根据实际需求选定，此处不作限定。可选地，第一密封层210和第二密封层220的结构可以不同，在本申请的另一实施例中， 第一密封层210和第二密封层220的结构相同，一方面进一步降低密封件200的加工难度，另一方面可以使密封件200中分别与第一密封层210和第二密封层220对应的部件的结构基本相同，进而在一定程度上提升密封件200的整体密封性能。
支撑组件500具体可以为电子设备中的前壳，显示屏730具体可以安装在支撑组件500背离电路板100的一侧。支架300和支撑组件500均与电路板100固定连接，从而为电子设备在安装缺口110所在的区域处形成稳定的隔绝腔提供必要条件。具体地，支架300和电路板100之间，以及支撑组件500与电路板100之间均可以通过螺钉等连接件形成固定连接关系，或者，还可以通过粘接等方式，使支架300与电路板100相互固定，且使支架300和支撑组件500相互固定。另外，对于支架300、支撑组件500和电路板100的具体形状，此处不作限定，仅需保证支架300和支撑组件500各自与电路板100中安装缺口110相对的区域能够具有无孔的表面，从而保证所形成的腔室具有完整的腔壁，进而防止自安装缺口110的开口进入水汽或灰尘等通过前述腔壁进入电子设备的内部。其中，支架300和支撑组件500中与安装缺口110相对的区域可以自身即具有完整无缝无孔的表面，亦可以通过涂覆胶层或覆盖隔绝层等方式使支架300和支撑组件500中与安装缺口110相对的区域形成完整的表面。
在支架300和支撑组件500与电路板100相互固定的情况下，沿电路板100的厚度方向，第一密封层210能够被夹持在电路板100和支架300之间，第二密封层220能够被夹持在电路板100和支撑组件500之间，从而使支架300、第一密封层210、电路板100、第二密封层220和支撑组件500能够形成隔绝腔，且隔绝腔的腔口与安装缺口110位于电路板100的边缘的开口的位置相当。
但是，上述部件一并形成的隔绝腔的腔口仍可能与中框组件400之间存在缝隙，基于这种情况，沿安装缺口110的延伸方向，使密封件200夹设于 支架300和中框组件400之间，从而使密封件200与中框组件400之间形成挤压配合关系，封堵中框组件400与形成的隔绝腔的腔口之间可能存在的缝隙，使所形成的隔绝腔除了具有与安装缺口110的开口对应的腔口之外，隔绝腔的内壁为完整的内壁，保证自安装缺口110的开口进入前述隔绝腔的水汽或灰尘等仅能自隔绝腔的腔口被排出，而不会穿过隔绝腔的腔壁进入隔绝腔的另一侧。需要说明的是，电路板100的厚度方向具体为图4中的方向M，安装缺口110的延伸方向具体为图4中的方向N。
具体地，通过对支架300的具体结构进行设计，例如，支架300的截面可以为弯折状结构，其可以包括相互连接的横梁和纵梁，横梁可以与第一密封层210配合，纵梁可以与整个密封件200配合，从而保证支架300既可以在电路板100的厚度方向上为第一密封层210提供限位作用，又可以在安装缺口110的延伸方向上为密封件200提供限位作用。并且，通过使密封件200相对前述横梁向靠近中框组件400所在的方向伸出设置，即可借助密封件200伸出的部分与中框组件400相互配合，在支架300的限位作用下，使密封件200中相对支架300伸出的部分被挤压，与中框组件400形成稳定可靠的密封连接关系。
需要说明的是，由于支架300与中框组件400能够为密封件200提供沿前述轴向的限位作用，且支架300、电路板100和支撑组件500能够为密封件200提供沿电路板100厚度方向的压持作用，从而即便支撑组件500与中框没有为密封件200提供沿安装缺口110的延伸方向的限位作用，也基本可以保证密封件200能够与中框形成较为可靠的密封连接关系，保证所形成的隔绝腔具有完整的腔壁。
本申请实施例公开一种电子设备，其包括电路板100、密封件200、支架300、中框组件400和支撑组件500，其中，电路板100设有自其边缘向内延伸的安装缺口110，该安装缺口110能够容纳接口器件710，密封件200包括第一密封层210和第二密封层220，在支架300和支撑组件500均与电路板 100固定连接的情况下，第一密封层210能够被夹持在电路板100和支架300之间，第二密封层220能够被夹持在电路板100与支撑组件500之间，且沿安装缺口110的延伸方向，密封件200能够被夹设在支架300和中框组件400之间，从而使得支架300、第一密封层210、电路板100、第二密封层220、支撑组件500和中框组件400能够形成一隔绝腔，该隔绝腔具有腔口，腔口与安装缺口110的开口对应，且除了前述腔口之外，隔绝腔的内壁为完整的内壁，进而可以防止自隔绝腔的腔口进入的水汽和灰尘能够通过隔绝腔的内壁流动至隔绝腔的另一侧，保证电子设备中设有接口器件710的区域与电子设备的内部隔开，保证电子设备即便设有有线接口，亦具有较高的防水性能。
同时，如上所述，密封件200中的第一密封层210和第二密封层220分别设置在电路板100的相背两侧，通过使接口器件710的一端自第一密封层210的穿孔伸出，且使接口器件710的另一端自第二密封层220的穿孔伸出，使得密封件200没有层叠设置在容纳于安装缺口110处的接口器件710上，从而不会进一步增大接口器件710处在电路板100厚度方向上的尺寸，进而在采用上述密封方式的情况下，不会造成电子设备的整体厚度进一步增大，这有利于电子设备向轻薄化发展。
如上所述，第一密封层210夹持于支架300和电路板100之间，可选地，第一密封层210的至少一侧表面设有条形密封凸起，条形密封凸起的延伸方向与整个第一密封层210的延伸方向相同，如条形密封凸起和第一密封层210均可以为弧线状U形结构件。更具体地，第一密封层210的相背两侧均可以设置有条形密封凸起，且每侧的条形密封凸起的数量可以为一个或多个。在组装第一密封层210的过程中，支架300与电路板100相互固定，从而使支架300和电路板100可以向第一密封层210施加挤压作用，从而使条形密封凸起产生一定的弹性变形，进一步增强第一密封层210与支架300，以及第一密封层210与电路板100之间的密封配合紧密性。相对应地，第二密封层220相背两侧的至少一侧表面亦可以设置有条形密封凸起，从而提升电路板 100与支撑组件500之间的密封配合关系的紧密程度。
可选地，密封件200还包括封口部230，封口部230包括连接段231，第一密封层210和第二密封层220各自的第一端通过封口部230的连接段231连接，从而使第一密封层210和第二密封层220可以连接为一体，便于密封件200的安装和转运。具体地，连接段231可以为块状结构件，且为了提升密封件200的加工效率，第一密封层210、第二密封层220和封口部230可以采用一体注塑的方式形成，这还可以提升各部分之间的连接可靠性，进而可以提升整个密封件200的密封性能。
进一步地，封口部230还可以包括限位段232，限位段232与连接段231连接，且限位段232向第一密封层210背离第二密封层220的一侧凸出，也即，限位段232相对第一密封层210凸出设置，在这种情况下，可以使限位段232夹设于支架300和中框组件400之间，从而使整个密封件200能够沿安装缺口110的延伸方向夹持被支架300和中框组件400所夹持。具体地，限位段232可以为块状结构件，在支架300与中框组件400之间未设置除限位段232之外的其他结构的情况下，通过使限位段232在安装缺口110的延伸方向的尺寸稍大于支架300与中框组件400之间的间距，即可在支架300与电路板100相互固定之后，使限位段232被挤压在支架300和中框组件400之间，进而使密封件200与中框组件400形成较好的密封连接关系。
相比于整个密封件200均被挤压设置在支架300和中框组件400之间的技术方案，采用上述技术方案时，由于密封件200中被支架300和中框组件400所夹持的部分的尺寸相对较小，从而可以提升支架300和中框组件400所能够提供的夹持作用的可靠性；并且，在采用上述技术方案的情况下，还可以尽量降低第一密封层210和/或第二密封层220受安装缺口110的延伸方向的挤压作用而出现卷翘的情况，进一步提升支架300与电路板100之间，和/或支撑组件500和电路板100之间的密封效果。
为了防止限位段232与第一密封层210的连接处在与支架300配合的过 程中形成密封死角，进一步地，限位段232与第一密封层210的连接处中，朝向支架300的连接角部设有弧形倒角部240，对应地，支架300的端部设有弧形配合部321，弧形配合部321与弧形倒角部240挤压贴合。具体地，弧形配合部321和弧形倒角部240的弧度等尺寸可以根据实际情况确定，此处不作限定。
在采用上述技术方案的情况下，当支架300与电路板100相互固定，以使支架300与电路板100挤压第一密封层210，且使支架300与中框组件400挤压限位段232时，基本可以保证限位段232与第一密封层210的连接处与支架300之间不会形成密封死角，这可以提升支架300与密封件200之间的贴合可靠性，进一步保证上述多个部件一并形成的隔绝腔的腔壁的密闭情况较好。
为了进一步提升密封件200与中框组件400之间的密封可靠性，可选地，第一密封层210和第二密封层220各自的第二端亦可以通过封口部230的连接段231连接，且使两个封口部230的结构相同。在这种情况下，第一密封层210的两端均可以通过封口部230的限位段232与中框组件400密封配合，从而可以提升密封件200与中框组件400之间的密封可靠性，进一步保证形成的隔绝腔的腔壁的封闭性更高。
可选地，支撑组件500包括支撑板510和主上520，二者相互连接，沿安装缺口110的延伸方向，主上520夹设在中框组件400和支撑板510之间，密封件200夹设在支架300和主上520之间，且密封件200还夹设在支撑板510和主上520之间。在本实施例中，密封件200的相背两侧均可以受到沿安装缺口110的延伸方向的夹持作用，从而可以进一步提升密封件200与中框组件400之间，确切地说是提升密封件200与主上520之间的密封可靠性。
具体地，支撑板510和主上520各自的形状和尺寸可以根据实际需求确定，支撑板510和主上520之间可以通过连接件连接或粘接等方式相互固定，且可以在支撑板510上设置限位槽等结构，保证支撑板510可以为密封件200 提供沿安装缺口110的延伸方向的限位作用，对应地，主上520亦可以包括相互连接的横向延伸部和纵向延伸部，从而保证主上520既可以通过横向延伸部为密封件200提供沿电路板100厚度方向的限位作用，亦可以通过纵向延伸部为密封件200提供沿安装缺口110的延伸方向的限位作用，主上520的横向延伸部可以与支撑板510相互连接，且为电子设备中的显示屏730等部件提供支撑作用，主上520的纵向延伸部可以夹持在密封件200和中框组件400之间。
进一步地，中框组件400可以包括侧部410和主体部420，侧部410连接在主体部420的外周，侧部410具有电子设备的侧表面，主体部420设置在电子设备的内部，对应地，沿安装缺口110的延伸方向，主上520夹设于侧部410和支撑板510之间；对应地，沿电路板100的厚度方向，支架300夹持于主体部420和电路板100之间。具体地，侧部410和主体部420的实际结构和尺寸可以根据具体情况对应设定，此处不作限定，主体部420和侧部410可以采用塑料或金属等硬质材料制成，二者之间可以通过焊接、热熔结或粘接等方式固定为一体，主体部420与支架300之间可以通过粘接或连接件连接等方式相互固定。
考虑到支架300和主体部420上可能会设置孔或凹槽等结构，以为电子设备中的其他电子器件提供安装基础作用或避让空间作用等，为了降低在支架300中与安装缺口110相对的区域形成完整的表面的难度，可选地，支架300和主体部420之间挤压设置有密封泡棉430，密封泡棉430沿电路板100的厚度方向的投影覆盖安装缺口110，在这种情况下，无论支架300和主体部420的具体结构如何，均可以通过密封泡棉430保证电路板100中对应于安装缺口110的区域具有完整的表面，从而使形成的隔绝腔的腔壁的完整程度更好。另外，在设置有密封泡棉430的情况下，支架300和密封泡棉430之间，以及密封泡棉430与主体部420之间均可以通过胶水粘接的方式相互固定，这可以进一步提升电路板100、密封泡棉430和主体部420形成的组 合结构的表面的完整程度和密封性能。
为了提升支架300、密封件200和主上520三者与密封泡棉430之间的贴合可靠性，可选地，限位段232朝向密封泡棉430的第一表面包括第一平面232a、第二平面232b和弧形过渡面232c，第一平面232a与支架300朝向密封泡棉430的一侧表面平齐，第二平面232b与主上520朝向密封泡棉430的一侧表面平齐，第一平面232a和第二平面232b通过弧形过渡面232c连接，密封泡棉430贴合设置于支架300、第一表面和主上520。
在采用上述技术方案的情况下，借助弧形过渡面232c的过渡作用，可以使支架300的表面、密封件200的第一表面和主上520的表面相互连接，以形成一较为平缓，且几乎没有死角的泡棉贴合面，从而使柔性材质的密封泡棉430能够与前述泡棉贴合面形成较为紧密的贴合关系，防止因支架300、密封件200和主上520中的任一者与密封泡棉430之间存在缝隙，而对形成的隔绝腔的隔绝可靠性产生不利影响。
在中框组件400包括侧部410和主体部420的情况下，进一步地，支架300可以包括支架本体310和沉台部320，沉台部320相对于支架本体310向支架本体310的一侧凹陷设置，也即，沉台部320和支架本体310二者不在同一平面内。具体地，可以通过平板状结构件，经钣金形成沉台部320和支架本体310。沿电路板100的厚度方向，第一密封层210夹持于电路板100和沉台部320之间，沉台部320夹持在电路板100和主体部420之间，在这种情况下，通过减小支架300中与第一密封层210对应的部分的受力面积，使得主体部420作用于沉台部320上的压持效果更好，从而进一步提升沉台部320作用至第一密封层210上的压持效果，保证沉台部320和电路板100之间的密封效果更好。当然，主体部420中对应于沉台部320的区域亦可以设置类似于沉台部320的结构，以进一步减小主体部420与沉台部320之间的接触面积，提升主体部420与沉台部320之间的压持效果。
如上所述，沿安装缺口110的延伸方向，可以使密封件200被挤压在支 架300和中框组件400之间，支架300和中框组件400之间的定位关系具体可以通过使支架300、电路板100和中框组件400之间相互固定形成。在本申请的另一实施例中，支撑组件500朝向电路板100的一侧设有限位凸起530，在安装缺口110的延伸方向上，支架300挤压设置在密封件200和限位凸起530之间。也就是说，在本实施例中，通过设置限位凸起530，进一步限制支架300向沿安装缺口110的延伸方向向背离中框组件400的方向运动，从而保证密封件200可以被稳定地夹持在支架300和中框组件400之间，从而使密封件200与中框组件400之间的密封关系较为稳定和可靠。
具体地，限位凸起530在安装缺口110的延伸方向上的尺寸可以根据支架300和密封件200等部件在对应方向上的尺寸确定，以使支架300安装至限位凸起530时，可以为密封件200提供挤压作用，使密封件200与中框组件400挤压配合。
更具体地，限位凸起530的数量可以为一个，一个限位凸起530可以对应密封件200的位置设置，从而尽量使限位凸起530提供的限位作用点与密封件200的受力作用点之间的连线平行于安装缺口110的延伸方向。可选地，限位凸起530的数量可以为多个，在多个限位凸起530的作用下，一方面可以进一步提升支架300挤压密封件200的可靠性，另一方面还可以防止支架300以一个限位凸起530为支点出现偏斜旋转的情况，提升支架300挤压密封件200的稳定性；多个限位凸起530可以间隔设置在支撑组件500上，且可以尽量使多个限位凸起530较为分散地设置。更具体地，限位凸起530可以为两个，在垂直于安装缺口110的延伸方向和电路板100的厚度方向的方向上，可以使两个限位凸起530分别设置在密封件200的相背两侧，从而为支架300挤压密封件200提供较为均匀和稳定地限位作用。
本申请实施例公开的电子设备可以是手机、电脑、电子书阅读器、可穿戴设备等，本申请实施例不限制电子设备的具体种类。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变 体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。此外，需要指出的是，本申请实施方式中的方法和装置的范围不限按示出或讨论的顺序来执行功能，还可包括根据所涉及的功能按基本同时的方式或按相反的顺序来执行功能，例如，可以按不同于所描述的次序来执行所描述的方法，并且还可以添加、省去、或组合各种步骤。另外，参照某些示例所描述的特征可在其他示例中被组合。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。
Claims (10)
- 一种电子设备，包括：电路板、密封件、支架、中框组件和支撑组件，其中，所述电路板设有自其边缘向内延伸形成的安装缺口，所述支架和所述支撑组件均与所述电路板固定连接；所述密封件包括第一密封层和第二密封层，所述第一密封层位于所述电路板的第一侧，所述第二密封层位于所述电路板的第二侧；沿所述电路板的厚度方向：所述第一密封层夹持于所述电路板和所述支架之间，且所述第二密封层夹持于所述电路板和所述支撑组件之间；沿所述安装缺口的延伸方向，所述密封件夹设于所述支架和所述中框组件之间。
- 根据权利要求1所述的电子设备，其中，所述密封件还包括封口部，所述第一密封层的一端和所述第二密封层的一端通过所述封口部的连接段连接。
- 根据权利要求2所述的电子设备，其中，所述封口部还包括限位段，所述限位段与所述连接段连接，且所述限位段向所述第一密封层背离所述第二密封层的一侧凸出，沿所述安装缺口的延伸方向，所述限位段夹设于所述支架和所述中框组件之间。
- 根据权利要求3所述的电子设备，其中，所述限位段与所述第一密封层之间的连接角部朝向所述支架的一侧设有弧形倒角部，所述支架的端部设置有弧形配合部，所述弧形配合部与所述弧形倒角部挤压贴合。
- 根据权利要求3所述的电子设备，其中，所述第一密封层的另一端和所述第二密封层的另一端通过另一所述封口部的连接段连接，且两个所述封口部结构相同。
- 根据权利要求3所述的电子设备，其中，所述支撑组件包括相互连接的支撑板和主上，沿所述安装缺口的延伸方向，所述主上夹设于所述中框组 件和所述支撑板之间，所述第一密封层夹设于所述支架和所述主上之间，且所述第二密封层夹设于所述支撑板和所述主上之间。
- 根据权利要求6所述的电子设备，其中，所述中框组件包括侧部和主体部，所述侧部连接于所述主体部的外周，沿所述安装缺口的延伸方向，所述主上夹设于所述侧部和所述支撑板之间；沿所述电路板的厚度方向，所述支架夹持于所述主体部和所述电路板之间，所述支架和所述主体部之间挤压设置有密封泡棉，所述密封泡棉沿所述电路板的厚度方向的投影覆盖所述安装缺口。
- 根据权利要求7所述的电子设备，其中，所述限位段朝向所述密封泡棉的第一表面包括第一平面、第二平面和弧形过渡面，所述第一平面与所述支架朝向所述密封泡棉的一侧表面平齐，所述第二平面与所述主上朝向所述密封泡棉的一侧表面平齐，所述第一平面和所述第二平面通过所述弧形过渡面连接，所述密封泡棉贴合设置于所述支架、所述第一表面和所述主上。
- 根据权利要求7所述的电子设备，其中，所述支架包括支架本体和沉台部，所述沉台部相对于所述支架本体向所述支架本体的一侧凹陷设置，沿所述电路板的厚度方向，所述第一密封层夹持于所述电路板和所述沉台部之间，所述沉台部夹持于所述电路板和所述主体部之间。
- 根据权利要求1所述的电子设备，其中，所述支撑组件朝向所述电路板的一侧设有限位凸起，在所述安装缺口的延伸方向上，所述支架挤压设置于所述密封件和所述限位凸起之间。
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| CN114786079A (zh) * | 2022-05-26 | 2022-07-22 | 维沃移动通信有限公司 | 电子设备 |
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| CN112739095B (zh) * | 2020-12-23 | 2022-05-20 | Oppo广东移动通信有限公司 | 电子装置 |
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| CN113382592A (zh) | 2021-09-10 |
| CN113382592B (zh) | 2023-06-23 |
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