WO2023226930A1 - 显示基板和显示装置 - Google Patents

显示基板和显示装置 Download PDF

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Publication number
WO2023226930A1
WO2023226930A1 PCT/CN2023/095513 CN2023095513W WO2023226930A1 WO 2023226930 A1 WO2023226930 A1 WO 2023226930A1 CN 2023095513 W CN2023095513 W CN 2023095513W WO 2023226930 A1 WO2023226930 A1 WO 2023226930A1
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WO
WIPO (PCT)
Prior art keywords
layer
area
display
substrate
display area
Prior art date
Application number
PCT/CN2023/095513
Other languages
English (en)
French (fr)
Inventor
龙再勇
王格
张锴
蒋志亮
宋二龙
胡文博
孙华平
袁晓敏
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Publication of WO2023226930A1 publication Critical patent/WO2023226930A1/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present application relates to the field of display technology, and in particular, to a display substrate and a display device.
  • the flexible OLED display substrate is composed of a flexible substrate, a driving circuit, a light-emitting device layer and an encapsulation layer.
  • the flexible encapsulation layer has a sandwich structure: two inorganic layers and an organic layer between the two inorganic layers.
  • the organic layer is produced by printing.
  • the organic layer is in liquid form at the initial stage. When it flows to the edge of the display substrate, it will form a slope. If the slope enters the display area of the display substrate, it will affect the path of the light, causing the display substrate to When the edge area of the display area is defective, wavy patterns appear.
  • This application provides a display substrate and a display device.
  • a display substrate includes a display area and a non-display area, and the non-display area includes a bending area; the outer edge area of the non-display area is a cutting reserved area, and at least part of the cutting reserved area is located between the display area and the Between the bending areas; the display substrate includes:
  • a light-emitting device layer located on the substrate and located in the display area;
  • An encapsulation layer located on the side of the light-emitting device layer away from the substrate;
  • a touch layer located on the side of the encapsulation layer away from the substrate;
  • the first organic layer is located on the side of the touch layer away from the substrate, and is located in the display area and the non-display area;
  • a blocking portion is located on at least one side of the display area, the blocking portion is located between the display area and the bending area, and is partially located in the cutting reserved area to prevent the first organic layer from entering.
  • the bending area is located on at least one side of the display area, the blocking portion is located between the display area and the bending area, and is partially located in the cutting reserved area to prevent the first organic layer from entering.
  • the blocking portion is located on a side of the first organic layer away from the display area.
  • the height of the blocking portion is greater than the height of the edge of the first organic layer away from the display area; or,
  • the height of the blocking portion is less than the height of an edge of the first organic layer away from the display area.
  • the cutting reserved area in a direction perpendicular to the direction in which the display area points to the bending area, includes opposite first edges and second edges, the first edge and the third edge Two edges are located on opposite sides of the non-display area, and the blocking portion extends from the first edge to the second edge.
  • a distance from a surface of the blocking portion located in the cutting reserved area facing away from the substrate to the substrate is a first distance
  • a portion of the blocking portion located outside the cutting reserved area facing away from the substrate is a first distance
  • a distance from the surface of the substrate to the substrate is a second distance, and the first distance is smaller than the second distance.
  • the display substrate includes a plurality of organic layers, and the portion of the blocking portion located in the cutting reserved area includes at least two organic layers.
  • the display substrate further includes a third layer located between the touch layer and the first organic layer.
  • a third layer located between the touch layer and the first organic layer.
  • the portion of the blocking portion located in the cutting reserved area at least includes a portion of at least two of the second organic layer, the planarization layer and the pixel defining layer.
  • the first organic layer is formed using an inkjet printing process
  • the material of the second organic layer is organic resin
  • the display substrate further includes a blocking block located in the cutting reserved area, and the blocking block is located on a side of the blocking portion away from the bending area.
  • the width of the blocking block is the same as the width of the cutting reserved area.
  • the blocking block and the blocking part are arranged in the same layer.
  • the encapsulation layer includes an organic encapsulation layer, which is at least partially located in the display area; the blocking portion is located on a side of the organic encapsulation layer away from the display area; the organic encapsulation layer
  • the encapsulation layer includes a slope portion, the thickness of the slope portion is uneven.
  • the first organic layer includes an optical compensation portion, a projection of the slope portion on the substrate is located within a projection of the optical compensation portion on the substrate, and the optical compensation portion It is configured to reduce or eliminate the appearance of wavy patterns on the display screen caused by the slope portion.
  • the thickness of the optical compensation part is substantially the same as the sum of the thicknesses of the slope part, and the refractive index of the slope part is the same as the refractive index of the optical compensation part.
  • the ratio is the same, and the surface of the optical compensation part away from the substrate is parallel to the surface of the substrate facing the light-emitting device layer.
  • the organic encapsulation layer is made of the same material as the optical compensation part.
  • the organic encapsulation layer further includes a first flat portion, the first flat portion is located in the display area, and the first flat portion is adjacent to the slope portion; the first flat portion The thickness of the part is uniform;
  • the first organic layer further includes a second flat portion, the second flat portion is located in the display area and adjacent to the optical compensation portion, and the second flat portion is located away from the first flat portion.
  • the surface of the second flat portion away from the substrate is parallel to the surface of the substrate facing the light-emitting device layer; at different positions in the display area, the first organic
  • the thickness of the layer is substantially the same as the sum of the thicknesses of the organic encapsulation layers.
  • the touch layer includes a first metal layer, an insulating material layer located on a side of the first metal layer away from the substrate, and an insulating material layer located on a side of the insulating material layer away from the substrate.
  • a second metal layer covers the first metal layer
  • the display substrate also includes a second organic layer located between the touch layer and the first organic layer, the second The organic layer is located in the display area and the non-display area and is located outside the bending area, and the second organic layer covers the second metal layer;
  • the portion of the blocking portion located outside the cutting reserved area includes a portion of at least one of the first metal layer, the insulating material layer, the second metal layer, and the second organic layer.
  • the distance between the blocking part and the bending area is smaller than the distance between the blocking part and the display area.
  • the encapsulation layer includes an organic encapsulation layer located at least partially in the display area, and the display substrate further includes a bank located in the non-display area and located near the blocking portion.
  • the dam is used to prevent the organic material for preparing the organic encapsulation layer from overflowing to the non-display area; the dam and the blocking portion do not overlap in a direction perpendicular to the substrate;
  • the distance between the blocking part and the bank is smaller than the distance between the blocking part and the bending area.
  • a display device including the above-mentioned display substrate.
  • the first organic layer located on the side of the touch layer away from the substrate is located in the display area and the non-display area, so that the first organic layer and the encapsulation layer are located in the entire edge area of the display area.
  • the difference between the thickness and the total thickness of other areas of the display area is small, thereby improving the display effect of the edge area of the display area and improving the display quality of the display substrate;
  • the blocking portion located on at least one side of the display area is located between the display area and the bending area space, and is partially located in the cutting reserved area.
  • the part of the blocking portion located in the cutting reserved area can prevent the material of the organic layer in the encapsulation layer and the material of the first organic layer from overflowing the display area through the cutting reserved area, and the blocking portion can effectively block The material of the organic layer in the encapsulation layer and the material of the first organic layer overflow the display area, effectively reducing the difference between the total thickness of the first organic layer and the encapsulation layer at the edge of the display area and the total thickness of other areas of the display area, thereby helping In order to improve the display quality; and the setting of the blocking part can improve the thickness of the film layer in the bending area due to the flow of the material of the first organic layer into the bending area, thereby causing cracks in the film layer in the bending area during the bending process. Or the circuit in the bending area may break, which improves the yield of the display substrate.
  • Figure 1 is a schematic structural diagram of a display substrate provided by an exemplary embodiment of the present application.
  • Figure 2 is a cross-sectional view of the display substrate shown in Figure 1 taken along section line DD;
  • Figure 3 is a cross-sectional view of the display substrate shown in Figure 1 taken along section line EE;
  • Figure 4 is another cross-sectional view of the display substrate shown in Figure 1 taken along section line EE;
  • Figure 5 is yet another cross-sectional view of the display substrate shown in Figure 1 taken along section line EE;
  • Figure 6 is a schematic structural diagram of a display substrate provided by another exemplary embodiment of the present application.
  • Figure 7 is a partial structural schematic diagram of a display substrate provided by yet another exemplary embodiment of the present application.
  • Figure 8 is a schematic structural diagram of a display substrate provided by yet another exemplary embodiment of the present application.
  • Figure 9 is a schematic structural diagram of a display substrate provided by yet another exemplary embodiment of the present application.
  • FIG. 10 is a partial structural diagram of a display substrate provided by yet another exemplary embodiment of the present application.
  • first, second, third, etc. may be used in this application to describe various information, the information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other.
  • first information may also be called second information, and similarly, the second information may also be called first information.
  • word “if” as used herein may be interpreted as "when” or “when” or “in response to determining.”
  • Embodiments of the present application provide a display substrate and a display device.
  • the display substrate and display device in the embodiments of the present application will be described in detail below with reference to the accompanying drawings.
  • Features in the embodiments described below may complement each other or be combined with each other unless they conflict.
  • the display substrate 100 includes a display area AA and a non-display area NA, and the non-display area NA is adjacent to the display area AA.
  • the non-display area NA includes a bending area BB.
  • the outer edge area of the non-display area NA is a cutting reserved area 101, and at least part of the cutting reserved area 101 is located between the display area AA and the bending area BB.
  • the display substrate 100 includes a substrate 21 , a light emitting device layer 23 , an encapsulation layer 24 , a touch layer 27 , a first organic layer 210 and a blocking portion 29 .
  • the light emitting device layer 23 is located on the substrate 21 and located in the display area AA.
  • the encapsulation layer 24 is located on the side of the light emitting device layer 23 away from the substrate 21 .
  • the touch layer 27 is located on the side of the encapsulation layer 24 away from the substrate 21 .
  • the first organic layer 210 is located on the side of the touch layer 27 away from the substrate 21 and is located in the display area AA and the non-display area NA.
  • the blocking portion 29 is located on at least one side of the display area AA, the blocking portion 29 is located between the display area AA and the bending area BB, and is partially located in the cutting reserved area 101 for preventing The first organic layer 210 enters the bending area BB.
  • the first organic layer 210 is located on the side of the touch layer 27 away from the substrate 21 , and the first organic layer 210 is located in the display area AA and the non-display area NA, so that the first organic layer 210
  • the difference between the total thickness of the encapsulation layer 24 located at the edge of the display area AA and the total thickness of other areas of the display area is small, thereby improving the display effect of the edge area of the display area AA and improving the display quality of the display substrate; since it is located in the display area
  • the blocking portion 29 on at least one side of AA is located between the display area AA and the bending area BB, and is partially located in the cutting reserved area 101.
  • the portion of the blocking portion 29 located in the cutting reserved area 101 can prevent the material of the organic layer in the encapsulation layer 24 and the third The material of an organic layer 210 overflows the display area AA by cutting the reserved area 101.
  • the blocking portion 29 can more effectively block the material of the organic layer in the encapsulation layer 24 and the material of the first organic layer 210 from overflowing the display area AA, effectively reducing the third
  • the difference between the total thickness of the organic layer 210 and the encapsulation layer 24 at the edge of the display area and the total thickness of the central area of the display area helps to improve the display quality; and the setting of the blocking portion 29 can improve the
  • the material flows into the bending area BB, causing the thickness of the film in the bending area BB to increase, which in turn causes the film to crack in the bending area BB or the circuits in the bending area BB to break, which improves the display substrate yield.
  • the multiple display substrates are first prepared at the same time, and the multiple display substrates share a relatively large base substrate; and then cut to obtain multiple independent display substrates.
  • Each display substrate corresponds to an annular cutting area, and the cutting area indicates the cutting path. Considering the existence of cutting errors, the width of the cutting area is generally large.
  • the cutting reserved area 101 is the outermost edge area of the non-display area NA of the display substrate 100 , and the cutting reserved area 101 is annular.
  • the non-display area NA includes a first non-display area NA1, a second non-display area NA2, a third non-display area NA3 and a fourth non-display area NA4.
  • the first non-display area NA1 and the second non-display area NA2 are located on both sides of the display area AA and are opposite in the first direction Y;
  • the third non-display area NA3 and the fourth non-display area NA4 are located on the opposite sides of the display area AA.
  • the other two sides are opposite to each other in the second direction X.
  • Part of the cutting reserved area 101 is located in the first non-display area NA1, part is located in the second non-display area NA2, part is located in the third non-display area NA3, and part is located in the fourth non-display area NA4.
  • the second non-display area NA2 includes a fan-out area CC and a bending area BB.
  • the fan-out area CC is located between the display area AA and the bending area BB.
  • Multiple signal lines are provided in the fan-out area CC, such as data signal lines, touch signal lines, and power signal lines.
  • the second non-display area NA2 is also provided with a driver chip 11.
  • the driver chip 11 is located in the bending area BB away from the display. On one side of the display area AA, the bending area BB can be bent to dispose the driver chip 11 on the side of the display substrate facing away from the light-emitting surface.
  • the blocking portion 29 is partially located in the fan-out area CC of the second non-display area NA2 and partially located in the area of the cutting reserved area 101 between the display area AA and the bending area BB.
  • the area of the cutting reserved area 101 between the display area AA and the bending area BB refers to the area of the cutting reserved area 101 located in the second non-display area NA2 and located on the side of the bending area BB facing the display area AA. Area.
  • the substrate 21 includes a substrate body 211 and a buffer layer 212 located on the side of the substrate body 211 facing the light emitting device layer 23 .
  • the substrate body 211 may be a flexible substrate or a rigid substrate.
  • the material of the flexible substrate may include one or more of polyimide, polyethylene terephthalate, and polycarbonate.
  • the material of the rigid substrate can be glass, silicon, etc.
  • the material of the buffer layer 212 may include at least one of silicon nitride and silicon oxide.
  • the display substrate further includes a driving circuit layer 22 located between the substrate 21 and the light emitting device layer 23 .
  • the driving circuit layer 22 includes a plurality of pixel circuits for driving sub-pixels.
  • the pixel circuit may include a thin film transistor and a capacitor.
  • the pixel circuit may be a 2T1C pixel circuit, a 3T1C pixel circuit, a 4T1C pixel circuit, a 5T1C pixel circuit, a 6T1C pixel circuit or a 7T1C pixel circuit.
  • the driving circuit layer 22 may include at least one insulating layer.
  • the at least one insulating layer may include, for example, an interlayer dielectric layer and a passivation layer.
  • the interlayer dielectric layer and the passivation layer are used to realize the connection between adjacent conductive layers in the driving circuit layer. insulation between.
  • the interlayer dielectric layer is located on the side of the passivation layer facing away from the substrate 21 .
  • the material of the interlayer dielectric layer and the passivation layer may be an inorganic insulating material, such as at least one of silicon nitride and silicon oxide.
  • the display substrate further includes a planarization layer 25 , and the planarization layer 25 is located on a side of the driving circuit layer 22 facing away from the substrate 21 .
  • the planarization layer 25 is at least partially located in the non-display area NA, and the portion of the planarization layer 25 located in the non-display area NA is located between the drive circuit layer 22 and the touch layer 27 for isolating the drive circuit layer 22 and the touch layer 27 . open.
  • the material of the planarization layer 25 is an organic insulating material.
  • the light-emitting device layer 23 includes at least three sub-pixels of different emitting colors.
  • the light emitting device layer 23 may include red sub-pixels R, green sub-pixels G and blue sub-pixels B, but is not limited thereto.
  • the red sub-pixel R emits red light
  • the green sub-pixel G emits green light
  • the blue sub-pixel B emits blue light.
  • the light-emitting material layer of the sub-pixels of the light-emitting device layer 23 may be an organic light-emitting layer, and the red sub-pixel R, the green sub-pixel G and the blue sub-pixel B are all OLED (organic light-emitting diode) sub-pixels.
  • the light-emitting device layer 23 also includes a pixel defining layer 231.
  • the pixel defining layer is provided with a plurality of pixel openings.
  • the pixel openings correspond to the sub-pixels in a one-to-one correspondence.
  • the luminescent material of each sub-pixel The layer is located at least partially within the corresponding pixel opening.
  • the encapsulation layer 24 is located on the side of the light-emitting device layer 23 away from the substrate 21 to prevent water and oxygen from eroding the light-emitting device layer 23 .
  • the encapsulation layer 24 may include alternately arranged inorganic encapsulation layers and organic encapsulation layers, and the film layer farthest from the substrate 21 in the encapsulation layer 24 is the inorganic encapsulation layer.
  • the encapsulation layer 24 includes a first inorganic encapsulation layer 241, an organic encapsulation layer 242 and a second inorganic encapsulation layer 243.
  • the first inorganic encapsulation layer 241 is located on the side of the light emitting device layer 23 away from the substrate 21.
  • the organic encapsulation The layer 242 is located on the side of the first inorganic encapsulation layer 241 away from the substrate 21
  • the second inorganic encapsulation layer 243 is located on the side of the organic encapsulation layer 242 away from the substrate 21 .
  • the organic encapsulation layer 242 may be formed using an inkjet printing (IJP) process.
  • a part of the first inorganic encapsulation layer 241 and a part of the second inorganic encapsulation layer 243 are located in the display area AA, and another part of the first inorganic encapsulation layer 241 and the second inorganic encapsulation layer The other part of 243 is located in the non-display area NA.
  • the organic encapsulation layer 242 is at least partially located in the display area AA.
  • the organic encapsulation layer 242 includes a first flat part P1 and a slope part P2.
  • the first flat part P1 and the slope part P2 are both located in the display area AA.
  • the first flat part P1 and the slope part Part P2 is adjacent, diagonally
  • the slope part P2 surrounds the first flat part P1, that is, the first flat part P1 is located inside the slope part P2.
  • the thickness of the first flat part P1 is uniform everywhere, and the thickness of the slope part P2 is uneven.
  • the thickness of the slope part P2 gradually decreases in the direction from the first flat part P1 to the slope part P2. This structure of the slope portion P2 will cause an interference phenomenon, and the organic encapsulation layer 242 having the slope portion P2 around it will cause the image displayed in the edge area of the display area to appear wavy.
  • the blocking portion 29 is located on a side of the organic encapsulation layer 242 away from the display area AA. In this way, the blocking portion 29 can prevent the organic encapsulation layer 242 from overflowing the display area and flowing to the bending area BB, which further helps to reduce the total thickness of the first organic layer and the encapsulation layer at the edge of the display area and the thickness at the center of the display area. The difference in the total thickness can also improve the problem of cracks in the film layer in the bending area BB or breakage of the circuits in the bending area BB during the bending process.
  • the touch layer 27 is located in the display area AA and the non-display area NA.
  • the touch layer 27 includes touch electrodes and touch signal lines.
  • the touch electrodes are located in the display area AA.
  • a part of the touch signal lines is located in the display area AA, and the other part is located in the non-display area NA.
  • the touch layer 27 includes a first metal layer 271 , an insulating material layer 273 and a second metal layer 272 .
  • the first metal layer 271 is located on the packaging layer 24 away from the substrate 21
  • the insulating material layer is located on the side of the first metal layer 271 away from the substrate 21 and covers the first metal layer 271
  • the second metal layer 272 is located on the side of the insulating material layer away from the substrate 21 .
  • one of the first metal layer 271 and the second metal layer 272 can be used for wiring.
  • the fan-out area CC is in The wiring is carried out through the first metal layer 271 on the side close to the display area AA, and the wiring is carried out through the second metal layer 272 on the side close to the bending area BB, which is located in the second part of the fan-out area CC.
  • the metal layer 272 and the first metal layer 271 may be connected by overlapping.
  • the second metal layer 272 includes a hollow portion 2721 , an overlapping portion 2722 and a wiring portion 2723 .
  • the overlapping portion 2722 is located on the side of the hollow portion 2721 away from the display area AA.
  • the overlapping portion 2723 is located on the side of the overlapping portion 2722 away from the display area AA.
  • the overlapping portion 2722 is overlappingly connected to the first metal layer 271.
  • the wiring portion 2723 is connected to the overlapping portion 2722, that is, the second metal layer 272 passes through the overlapping portion. 2722 realizes electrical connection with the first metal layer 271.
  • the display substrate further includes a second organic layer 28 located between the touch layer 27 and the first organic layer 210 .
  • the second organic layer 28 is located in the display area AA and the non-display area NA. , and located outside the bending area BB.
  • the second organic layer 28 covers the second metal layer 272 to protect the second metal layer 272.
  • the second organic layer 28 also plays a planarizing role.
  • the second organic layer 28 is located outside the bending area BB, so the second organic layer 28 is located outside the bending area BB.
  • Layer 28 does not increase the thickness of the film layer in the bend zone BB.
  • the second organic layer 28 may be made of organic resin.
  • the first organic layer 210 may be formed using an inkjet printing (IJP) process.
  • the first organic layer 210 includes a second flat part P3, an optical compensation part P4 and an edge part P5.
  • the second flat part P3 and the optical compensation part P4 are located in the display area AA, the second flat part P3 is adjacent to the optical compensation part P4, and the optical compensation part P4 surrounds the second flat part P3, and the edge part P5 is located in the non-display area NA.
  • the portion P5 is adjacent to the optical compensation portion P4, and the edge portion P5 surrounds the optical compensation portion P4.
  • the second flat portion P3 is located on a side of the first flat portion P1 away from the substrate 21 , and the second flat portion P3 is away from the surface of the substrate 21 and the substrate 21 faces the light emitting device layer.
  • the surfaces of 23 are parallel.
  • the sum of the thicknesses of the first flat part P1 and the second flat part P3 is substantially the same means that the sum of the thicknesses of the first flat part P1 and the second flat part P3 is the same at different positions in the display area, and in the display area The difference in the sum of the thicknesses of the first flat part P1 and the second flat part P3 at different positions is very small.
  • the projection of ramp portion P2 on substrate 21 is located within the projection of optical compensation portion P4 on substrate 21 , and optical compensation portion P4 is configured to attenuate or eliminate the effect caused by ramp portion P2 This causes wavy patterns to appear on the display screen.
  • the thickness of the optical compensation part P4 is substantially the same as the sum of the thicknesses of the slope part P2 , and the refractive index of the slope part P2 is the same as that of the optical compensation part P4 The refractive index is the same.
  • the surface of the optical compensation part P4 away from the substrate 21 is parallel to the surface of the substrate 21 facing the light emitting device layer 23 .
  • the surface of the optical compensation part P4 away from the substrate 21 is flush with the surface of the second flat part P3 away from the substrate 21 .
  • the sum of the thicknesses of the first organic layer 210 and the organic encapsulation layer 242 is substantially the same at different positions within the display area AA.
  • the material of the organic encapsulation layer 242 is the same as the material of the optical compensation part P4.
  • the edge portion P5 is located in the non-display area NA.
  • the edge portion P5 can be located in the first non-display area NA1 , the second non-display area NA2 , the third non-display area NA3 and the third non-display area NA3 .
  • the thickness of the edge part P5 may be uneven everywhere.
  • the first organic layer 210 may only include the optical compensation part P4 and the edge part P5, but not the second flat part P3.
  • the edge portion P5 when the edge portion P5 is located in the second non-display area NA2, the edge portion P5 is located outside the bending area BB.
  • Such arrangement can prevent the first organic layer 210 from affecting the bending performance of the display substrate in the bending area BB, and avoid undesirable phenomena such as cracks or difficulty in bending of the film layer in the bending area BB.
  • the first organic layer 210 covers at least part of the edge of the encapsulation layer 24 . This arrangement is more conducive to making the difference between the total thickness of the first organic layer and the encapsulation layer located at the edge of the display area and the total thickness located at other areas of the display area smaller, effectively improving the display effect of the display area.
  • the blocking portion 29 is located on a side of the first organic layer 210 away from the display area AA. With this arrangement, the blocking portion 29 can more effectively block the organic material of the first organic layer 210 from overflowing in a direction away from the display area AA and entering the bending area BB.
  • the height of the blocking portion 29 is greater than the height of the edge of the first organic layer 210 away from the display area AA. That is, the blocking portion 29 can effectively block the organic material of the first organic layer 210 from overflowing in a direction away from the display area AA.
  • the height of the blocking portion 29 may be smaller than the height of the edge of the first organic layer 210 away from the display area AA. That is, part of the material of the first organic layer 210 overflows the blocking part 29. At this time, the blocking part 29 can block part of the material of the first organic layer 210 on the side of the blocking part 29 away from the bending area.
  • the cutting reserved area 101 in a direction perpendicular to the direction in which the display area AA points to the bending area BB, the cutting reserved area 101 includes opposite first edges 1011 and second edges 1012.
  • the first edge 1011 and second edge 1012 are located on opposite sides of the non-display area NA, and the blocking portion 29 extends from the first edge 1011 to the second edge 1012 . That is to say, in the second direction
  • the path of the organic material overflowing in the direction away from the display area AA to the bending area BB is blocked by the blocking part 29.
  • the blocking part 29 can more effectively prevent the organic material of the first organic layer 210 from flowing to the bending area BB.
  • the blocking portion 29 is entirely located in the second non-display area NA2.
  • the blocking portion 29 may be partially located in the second non-display area NA2 and partially located in other areas of the non-display area.
  • the blocking portion 29 may be annular or semi-annular.
  • the distance from the surface of the blocking portion 29 located in the cutting reserved area 101 away from the substrate 21 to the substrate 21 is a first distance d1, so The distance from the surface of the blocking portion 29 located outside the cutting reserved area 101 away from the substrate 21 to the substrate 21 is a second distance d2, and the first distance d1 is smaller than the second distance d2.
  • the film thickness of the cutting reserved area 101 is smaller than the film thickness of other areas of the non-display area NA, which can reduce the difficulty of cutting when cutting the cutting area.
  • the display substrate includes a plurality of organic layers, and the portion of the blocking portion 29 located in the cutting reserved area 101 includes at least two organic layers.
  • the blocking part 29 includes an organic layer, it means that the blocking part 29 includes a part of the organic layer.
  • the film layer located in the cutting reserved area 101 is an organic layer, which can reduce the difficulty of cutting the cutting area and prevent the film layer in the cutting area from generating cracks during the cutting process and extending to the display area, thereby affecting the service life of the display substrate.
  • the portion of the blocking portion 29 located in the cutting reserved area 101 is made of organic material. This setting is more helpful to avoid cracks in the film layer in the cutting area during the cutting process.
  • the portion of the blocking portion 29 located in the cutting reserved area 101 includes at least a portion of at least two of the second organic layer 28 , the planarization layer 25 and the pixel defining layer 231 .
  • the barrier portion 29 is formed simultaneously with the organic layer of the display substrate, and the formation of the barrier portion does not increase the complexity of preparation of the display substrate.
  • the portion of the blocking portion 29 located in the cutting reserved area 101 includes a portion of the planarization layer 25 and the second organic layer 28 .
  • the portion of the blocking portion 29 located in the cutting reserved area 101 includes the pixel defining layer 231 and a portion of the second organic layer 28 .
  • the portion of the blocking portion 29 located in the cutting reserved area 101 includes the planarization layer 25 , the pixel defining layer 231 and the second organic layer. part of 28.
  • the portion of the blocking portion 29 located outside the cutting reserved area 101 includes the first metal layer 271 of the touch layer 27 , the insulating material layer 273 , the second metal layer 272 and the a portion of at least one of the second organic layers 28 .
  • the portion of the blocking portion 29 located outside the cutting reserved area 101 includes a part of the second organic layer 28 , and the portion of the blocking portion 29 located outside the cutting reserved area 101 is in contact with the substrate. 21 are provided with an interlayer dielectric layer 221 of the driving circuit layer 22, a passivation layer 222 and an insulating material layer 273 of the touch layer 27.
  • Such an arrangement can make the distance from the surface of the blocking portion 29 located outside the cutting reserved area 101 away from the substrate to the substrate larger, which is more helpful in blocking the organic material of the first organic layer 210 from overflowing to the bending area BB; Moreover, the portion of the barrier portion 29 located outside the cutting reserved area 101 is formed simultaneously with the second organic layer 28 , and the formation of the barrier portion 29 does not increase the complexity of the preparation process.
  • the number of blocking portions 29 is two or more, and the two or more blocking portions 29 are sequentially arranged in the direction from the display area AA to the bending area BB.
  • the number of blocking parts 29 is two. In other embodiments, the number of blocking parts 29 may be greater than two.
  • the amount of material that continues to flow to the bending area BB is reduced, which further helps to prevent the material used to prepare the first organic layer 210 from entering the bending area BB, and improves the barrier The reliability of the material barrier of portion 29 to the first organic layer.
  • the heights of each blocking portion 29 located in the cutting reserved area 101 can be the same, and each blocking portion 29 is located in the portion outside the cutting reserved area 101 The heights can all be the same. This helps to simplify the complexity of the preparation process of the barrier portion 29 and reduce the preparation cost of the display substrate. In other embodiments, the heights of the portions of each blocking portion 29 located in the cutting reserved area 101 may not be all the same, and the heights of the portions of each blocking portion 29 located outside the cutting reserved area 101 may be different.
  • the height of the part of the blocking part 29 close to the display area AA located in the cutting reserved area 101 is smaller than the height of the part of the blocking part 29 close to the bending area BB located in the cutting reserved area 101; close to the display area
  • the height of the portion of the blocking portion of area AA located outside the cutting reserved area 101 is smaller than the height of the portion of the blocking portion 29 adjacent to the bending area BB located outside the cutting reserved area 101 .
  • the portion of at least one blocking portion 29 of the display substrate located outside the cutting reserved area 101 bifurcates to form two sub-blocking portions 293 , and both sides of the blocking portion 29 can be substantially symmetry. This arrangement is more helpful in preventing the material for preparing the first organic layer 210 from entering the bending area BB.
  • the display substrate includes two or more blocking portions 29, the portion of the blocking portion 29 near the display area AA that is outside the cutting reserved area 101 can bifurcate to form two sub-blocking portions.
  • the display substrate includes a first blocking portion 291 and a second blocking portion 292 located on the side of the first blocking portion 291 away from the display area AA.
  • the first blocking portion 291 is located between the cutting reserved area 101
  • the outer part bifurcates to form two sub-blocking parts 293 .
  • the blocking portion 29 is continuous. In other embodiments, the blocking portion 29 is discontinuous, that is, the blocking portion 29 is provided with gaps in some positions.
  • the blocking portion 29 includes a first blocking section 294 and a second blocking section 295 .
  • the first blocking section 294 and the second blocking section 295 are spaced apart. A gap is formed between them.
  • the display substrate also includes a buffer portion 296 located on the side of the first blocking section 294 away from the display area AA.
  • the gap between the first blocking section 294 and the second blocking section 295 is opposite to the buffering section 296 .
  • the organic material flows out quickly through the gap between the first blocking section 294 and the second blocking section 295.
  • FIG. 7 only illustrates a partial structure of the blocking portion 29.
  • the blocking portion 29 can be formed with gaps in multiple places, and each gap can be provided with a buffer portion on the side away from the display area AA.
  • both ends of the buffer portion 296 are bent toward the display area AA to further slow down the overflow speed of the organic material.
  • the length of the buffer portion 296 may be larger than the size of the gap between the first blocking section 294 and the second blocking section 295 to more effectively slow down the organic material from overflowing outward.
  • the buffer portion 296 can be in a wavy shape, a linear shape, a zigzag shape, an arc shape, etc.
  • the distance D2 between the blocking part 29 and the bending area BB is smaller than the distance D1 between the blocking part 29 and the display area AA. That is to say, the blocking portion 29 is closer to the bending area BB. With this arrangement, the amount of the organic material of the first organic layer flowing to the blocking portion 29 is smaller, and the organic material of the first organic layer is less likely to flow through the blocking portion 29 .
  • the distance D1 between the blocking portion 29 and the display area AA is 500 microns to 1500 microns.
  • the distance D1 between the blocking portion 29 and the display area AA is 500 microns or 900 microns. Micron, 1000 micron or 1500 micron etc.
  • the distance D2 between the blocking portion 29 and the bending area BB is 400 microns to 1000 microns.
  • the distance D2 between the blocking portion 29 and the bending area BB is 400 microns. , 700 microns, 800 microns or 1000 microns, etc.
  • the display substrate further includes a The blocking block 30 of area 101 is located on the side of the blocking portion 29 away from the bending area BB. Since the height of the cutting reserved area 101 is smaller than the height of other areas, the organic material of the first organic layer easily flows into the cutting reserved area 101 and is collected in the cutting reserved area 101 , resulting in a larger flow rate of the organic material located in the cutting reserved area 101 and blocking. If the distance from the surface of the portion of the blocking portion 29 located outside the cutting reserved area 101 away from the substrate 21 to the substrate is smaller than the distance from the surface of the portion of the blocking portion 29 located outside the cutting reserved area 101 away from the substrate 21 to the substrate, then it is located in the cutting reserved area.
  • the organic material easily crosses the portion of the blocking portion 29 located in the cutting reserved area 101 and enters the bending area BB.
  • the blocking block 30 can reduce the flow rate of the organic material located in the cutting reserved area 101, and prevent the organic material in the cutting reserved area 101 from crossing the blocking portion 29 and entering the bending area BB due to excessive flow velocity, thereby increasing the flow rate. Displays substrate yield.
  • the width of the blocking block 30 is the same as the width of the cutting reserved area 101 . In this way, the blocking block 30 can more effectively reduce the flow rate of the organic material located in the cutting retention area 101 .
  • the barrier 30 includes at least one organic layer.
  • all materials of the blocking block 30 are organic materials. This arrangement is more helpful to avoid cracks in the film layer of the blocking block 30 during the cutting process, and reduces the difficulty of cutting in the cutting area.
  • the blocking block 30 includes a portion of at least one of the second organic layer 28 , the planarization layer 25 and the pixel defining layer.
  • the barrier blocks 30 are formed simultaneously with some film layers of the display substrate, and the formation of the barrier blocks 30 does not increase the complexity of the preparation of the display substrate.
  • the barrier 30 includes a portion of the second organic layer 28 .
  • the barrier block 30 includes the planarization layer 25 and a portion of the second organic layer 28 .
  • the blocking block 30 includes the pixel defining layer and a portion of the second organic layer 28 .
  • the blocking block 30 and the portion of the blocking portion 29 located in the cutting reserved area 101 are arranged in the same layer. With this arrangement, the blocking block 30 and the portion of the blocking portion 29 located in the cutting reserved area 101 can be formed at the same time, which helps to simplify the complexity of the preparation process.
  • the blocking block 30 and the blocking portion 29 may each include a part of the second organic layer 28 and the planarization layer 25 .
  • two or more spaced-apart blocking blocks 30 may be provided in the area where the cutting reserved area 101 is located on the same side of the display area AA. In this way, the blocking block 30 can more effectively reduce the flow rate of the organic material located in the cutting retention area 101 .
  • two blocking blocks 30 are provided in the area where the cutting reserved area 101 is located on the same side of the display area AA.
  • the heights of the two blocking blocks 30 may be the same or different.
  • the height of the blocking block 30 close to the blocking part 29 may be greater than the height of the blocking block 30 far away from the blocking part 29 .
  • the blocking block 30 close to the blocking part 29 includes the planarization layer 25 And a part of the second organic layer 28 , the barrier block 30 away from the barrier part 29 includes a part of the second organic layer 28 .
  • the blocking block 30 may be provided on only one side of the area where the cutting reserved area 101 is located on opposite sides of the display area AA.
  • blocking blocks 30 are provided in areas on opposite sides of the display area AA of the cutting reserved area 101 .
  • the display substrate further includes a bank 26 .
  • the bank 26 is located on the side of the driving circuit layer 22 away from the substrate 21 .
  • the bank 26 is located in the non-display area NA.
  • the bank 26 is used in the preparation process.
  • the organic encapsulation layer 242 prevents the organic material used to prepare the organic encapsulation layer 242 from overflowing into the non-display area NA.
  • dam 26 may be annular.
  • the number of banks 26 may be two.
  • the display substrate may include a first bank 261 and a second bank 262.
  • the first bank 261 is located inside the second bank 262.
  • the bank 26 is located on a side of the blocking portion 29 close to the display area AA, and the bank 26 and the blocking portion 29 do not overlap in a direction perpendicular to the substrate 21; so The distance D3 between the blocking portion 29 and the bank 26 is smaller than the distance between the blocking portion 29 and the bending area BB.
  • the bank 26 may be in the same layer as the planarization layer 25 , and the material of the bank 26 may be the same as the material of the planarization layer 25 . In this way, the bank 26 and the planarization layer 25 can be formed at the same time, which helps to simplify the preparation process of the display substrate.
  • the display substrate may include two banks 26: a first bank 261 and a second bank 262.
  • the first bank 261 is located inside the second bank 262; the display substrate may include two blocking parts. 29: First blocking part 291 and second blocking part 292.
  • the first blocking part 291 is located inside the second blocking part 292.
  • the width of the first blocking part 291 and the width of the second blocking part 292 may be substantially the same.
  • the distance between the first blocking part 291 and the second bank 262 is smaller than the distance between the second blocking part 292 and the bent part BB.
  • the distance between the first bank 261 and the display area AA is smaller than the distance between the second blocking part 292 and the bending part BB.
  • the distance between the second bank 262 and the first blocking part 291 is smaller than the distance between the first bank 261 and the display area AA.
  • the distance D3 between the barrier 29 and the dam 26 is greater than 50 microns.
  • the distance D3 between the blocking portion 29 and the banks 26 is the distance D3 between the blocking portion 29 and the outer bank 26 .
  • An embodiment of the present invention also provides a display device, which includes the display substrate described in any of the above embodiments.
  • the display device further includes a cover plate located on a side of the display substrate facing away from the substrate.
  • the display device further includes a housing, and the display substrate is disposed in the housing.
  • the display device provided by the embodiment of the present application can be, for example, a mobile phone, a tablet computer, a television, a notebook computer, a vehicle-mounted device, or any other device with a display function.

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Abstract

一种显示基板和显示装置。所述显示基板包括显示区和非显示区，所述非显示区包括弯折区；所述非显示区的外侧边缘区域为切割保留区，至少部分所述切割保留区位于所述显示区和所述弯折区之间；所述显示基板包括衬底、发光器件层、封装层、触控层、第一有机层及阻挡部。所述发光器件层位于所述衬底上，且位于所述显示区。所述封装层位于所述发光器件层远离所述衬底的一侧。所述触控层位于所述封装层远离所述衬底的一侧。所述第一有机层位于所述触控层远离所述衬底的一侧，且位于显示区和非显示区。所述阻挡部位于所述显示区的至少一侧，所述阻挡部位于显示区与弯折区之间，且部分位于切割保留区，用于阻止所述第一有机层进入所述弯折区。

Description

显示基板和显示装置 技术领域
本申请涉及显示技术领域，尤其涉及一种显示基板和显示装置。
背景技术
相关技术中，柔性OLED(Organic Light-Emitting Diode，有机发光二极管)显示基板具有很多优点，例如可折叠、弯曲以及窄边框等。柔性OLED显示基板由柔性基板、驱动电路、发光器件层以及封装层构成。柔性封装层为三明治结构：两层无机层以及位于两层无机层中间的有机层。有机层通过打印方式制作，有机层的初期为液体形态，流动至显示基板的边缘时会形成一个斜坡，若该斜坡进入显示基板的显示区内，则会影响光的路径，导致显示基板在显示时显示区的边缘区域出现波浪纹不良。
发明内容
本申请提供一种显示基板和显示装置。
根据本申请实施例的第一方面，提供了一种显示基板。所述显示基板包括显示区和非显示区，所述非显示区包括弯折区；所述非显示区的外侧边缘区域为切割保留区，至少部分所述切割保留区位于所述显示区和所述弯折区之间；所述显示基板包括：
衬底；
发光器件层，位于所述衬底上，且位于所述显示区；
封装层，位于所述发光器件层远离所述衬底的一侧；
触控层，位于所述封装层远离所述衬底的一侧；
第一有机层，位于所述触控层远离所述衬底的一侧，且位于显示区和非显示区；
阻挡部，位于所述显示区的至少一侧，所述阻挡部位于所述显示区与所述弯折区之间，且部分位于所述切割保留区，用于阻止所述第一有机层进入所述弯折区。
在一个实施例中，所述阻挡部位于所述第一有机层远离所述显示区的一侧。
在一个实施例中，所述阻挡部的高度大于所述第一有机层远离所述显示区的边缘的高度；或者，
所述阻挡部的高度小于所述第一有机层远离所述显示区的边缘的高度。
在一个实施例中，在与所述显示区指向所述弯折区的方向垂直的方向上，所述切割保留区包括相对的第一边缘和第二边缘，所述第一边缘与所述第二边缘位于所述非显示区的相对两侧，所述阻挡部由所述第一边缘延伸至所述第二边缘。
在一个实施例中，所述阻挡部位于所述切割保留区的部分背离衬底的表面到所述衬底的距离为第一距离，所述阻挡部位于所述切割保留区之外的部分背离衬底的表面到所述衬底的距离为第二距离，所述第一距离小于所述第二距离。
在一个实施例中，所述显示基板包括多个有机层，所述阻挡部位于所述切割保留区的部分包括至少两个有机层。
在一个实施例中，所述显示基板还包括位于所述触控层与所述第一有机层之间的第 二有机层、位于所述触控层朝向所述衬底一侧的平坦化层、以及所述发光器件层包括的像素限定层；
所述阻挡部位于所述切割保留区的部分至少包括所述第二有机层、所述平坦化层及所述像素限定层中的至少两层的一部分。
在一个实施例中，所述第一有机层采用喷墨打印工艺形成，所述第二有机层的材料为有机树脂。
在一个实施例中，所述显示基板还包括位于所述切割保留区的阻挡块，所述阻挡块位于所述阻挡部背离所述弯折区的一侧。
在一个实施例中，所述阻挡块的宽度与所述切割保留区的宽度相同。
在一个实施例中，所述阻挡块与所述阻挡部同层设置。
在一个实施例中，所述封装层包括有机封装层，所述有机封装层至少部分位于所述显示区；所述阻挡部位于所述有机封装层远离所述显示区的一侧；所述有机封装层包括斜坡部，所述斜坡部的厚度不均匀。
在一个实施例中，所述第一有机层包括光学补偿部，所述斜坡部在所述衬底上的投影位于所述光学补偿部在所述衬底上的投影内，所述光学补偿部被配置为减弱或消除由所述斜坡部引起的显示画面上出现波浪纹的现象。
在一个实施例中，在所述显示区内的不同位置，所述光学补偿部的厚度与所述斜坡部的厚度之和基本相同，所述斜坡部的折射率与所述光学补偿部的折射率相同，所述光学补偿部远离所述衬底的表面与所述衬底面向所述发光器件层的表面平行。
在一个实施例中，所述有机封装层的材料与所述光学补偿部的材料相同。
在一个实施例中，所述有机封装层还包括第一平坦部，所述第一平坦部位于所述显示区，且所述第一平坦部与所述斜坡部相邻；所述第一平坦部的厚度均匀；
所述第一有机层还包括第二平坦部，所述第二平坦部位于所述显示区，且与所述光学补偿部相邻，所述第二平坦部位于所述第一平坦部远离所述衬底的一侧，所述第二平坦部远离所述衬底的表面与所述衬底面向所述发光器件层的表面平行；在所述显示区内的不同位置，所述第一有机层的厚度与所述有机封装层的厚度之和基本相同。
在一个实施例中，所述触控层包括第一金属层、位于所述第一金属层远离所述衬底一侧的绝缘材料层、及位于所述绝缘材料层远离所述衬底一侧的第二金属层；所述绝缘材料层覆盖所述第一金属层；所述显示基板还包括位于所述触控层与所述第一有机层之间的第二有机层，所述第二有机层位于所述显示区与所述非显示区，且位于所述弯折区外，所述第二有机层覆盖所述第二金属层；
所述阻挡部位于所述切割保留区之外的部分包括所述第一金属层、所述绝缘材料层、所述第二金属层与所述第二有机层中的至少一层的一部分。
在一个实施例中，所述阻挡部与所述弯折区之间的距离小于所述阻挡部与所述显示区之间的距离。
在一个实施例中，所述封装层包括至少部分位于所述显示区的有机封装层，所述显示基板还包括堤坝，所述堤坝位于所述非显示区，且位于所述阻挡部靠近所述显示区的一侧，所述堤坝用于阻止制备所述有机封装层的有机材料溢流到所述非显示区；所述堤坝与所述阻挡部在垂直所述衬底的方向上不重叠；
所述阻挡部与所述堤坝之间的距离小于所述阻挡部与所述弯折区之间的距离。
根据本申请实施例的第二方面，提供了一种显示装置，包括上述的显示基板。
本发明实施例提供的显示基板和显示装置，位于触控层远离衬底一侧的第一有机层位于显示区和非显示区，可使得第一有机层与封装层位于显示区边缘区域的总厚度与显示区其他区域的总厚度的差较小，从而可改善显示区的边缘区域的显示效果，提升显示基板的显示质量；位于显示区至少一侧的阻挡部位于显示区与弯折区之间，且部分位于切割保留区，阻挡部位于切割保留区的部分可防止挡封装层中有机层的材料及第一有机层的材料通过切割保留区而溢出显示区，则阻挡部可有效地阻挡封装层中有机层的材料及第一有机层的材料溢出显示区，有效减小第一有机层与封装层位于显示区边缘区域的总厚度与显示区其他区域的总厚度的差，进而有助于提升显示质量；并且阻挡部的设置可改善由于第一有机层的材料流入弯折区而导致弯折区内的膜层厚度增大，进而导致弯折区在弯折过程中膜层产生裂纹或者弯折区内的线路发生断裂的问题，提升显示基板的良率。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性和解释性的，并不能限制本发明。
附图说明
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本发明的实施例，并与说明书一起用于解释本发明的原理。
图1是本申请一示例性实施例提供的显示基板的结构示意图；
图2是图1所示的显示基板沿剖面线DD剖开的剖视图；
图3是图1所示的显示基板沿剖面线EE剖开的一种剖视图；
图4是图1所示的显示基板沿剖面线EE剖开的另一种剖视图；
图5是图1所示的显示基板沿剖面线EE剖开的再一种剖视图；
图6是本申请另一示例性实施例提供的显示基板的结构示意图；
图7是本申请再一示例性实施例提供的显示基板的局部结构示意图；
图8是本申请又一示例性实施例提供的显示基板的结构示意图；
图9是本申请又一示例性实施例提供的显示基板的结构示意图；
图10是本申请又一示例性实施例提供的显示基板的局部结构示意图。
具体实施方式
这里将详细地对示例性实施例进行说明，其示例表示在附图中。下面的描述涉及附图时，除非另有表示，不同附图中的相同数字表示相同或相似的要素。以下示例性实施例中所描述的实施例并不代表与本申请相一致的所有实施例。相反，它们仅是与如所附权利要求书中所详述的、本申请的一些方面相一致的装置和方法的例子。
在本申请使用的术语是仅仅出于描述特定实施例的目的，而非旨在限制本申请。在本申请和所附权利要求书中所使用的单数形式的“一种”、“所述”和“该”也旨在包括多数形式，除非上下文清楚地表示其他含义。还应当理解，本文中使用的术语“和/或”是指并包含一个或多个相关联的列出项目的任何或所有可能组合。
应当理解，尽管在本申请可能采用术语第一、第二、第三等来描述各种信息，但这些信息不应限于这些术语。这些术语仅用来将同一类型的信息彼此区分开。例如，在不 脱离本申请范围的情况下，第一信息也可以被称为第二信息，类似地，第二信息也可以被称为第一信息。取决于语境，如在此所使用的词语“如果”可以被解释成为“在……时”或“当……时”或“响应于确定”。
本申请实施例提供了一种显示基板及显示装置。下面结合附图，对本申请实施例中的显示基板及显示装置进行详细说明。在不冲突的情况下，下述的实施例中的特征可以相互补充或相互组合。
本申请实施例提供了一种显示基板。如图1及图2所示，所述显示基板100包括显示区AA和非显示区NA，所述非显示区NA与所述显示区AA邻接。所述非显示区NA区包括弯折区BB。所述非显示区NA的外侧边缘区域为切割保留区101，至少部分所述切割保留区101位于所述显示区AA和所述弯折区BB之间。
所述显示基板100包括衬底21、发光器件层23、封装层24、触控层27、第一有机层210及阻挡部29。所述发光器件层23位于所述衬底21上，且位于所述显示区AA。所述封装层24位于所述发光器件层23远离所述衬底21的一侧。所述触控层27位于所述封装层24远离所述衬底21的一侧。所述第一有机层210位于所述触控层27远离所述衬底21的一侧，且位于显示区AA和非显示区NA。所述阻挡部29位于所述显示区AA的至少一侧，所述阻挡部29位于所述显示区AA与所述弯折区BB之间，且部分位于所述切割保留区101，用于阻止所述第一有机层210进入所述弯折区BB。
本申请实施例提供的显示基板，第一有机层210位于触控层27远离衬底21的一侧，且第一有机层210位于显示区AA和非显示区NA，可使得第一有机层210与封装层24位于显示区AA边缘区域的总厚度与显示区其他区域的总厚度的差较小，从而可改善显示区AA的边缘区域的显示效果，提升显示基板的显示质量；由于位于显示区AA至少一侧的阻挡部29位于显示区AA与弯折区BB之间，且部分位于切割保留区101，阻挡部29位于切割保留区101的部分可防止封装层24中有机层的材料及第一有机层210的材料通过切割保留区101而溢出显示区AA，阻挡部29可更有效地阻挡封装层24中有机层的材料及第一有机层210的材料溢出显示区AA，有效减小第一有机层210与封装层24位于显示区边缘区域的总厚度与显示区中心区域的总厚度的差，进而有助于提升显示质量；并且阻挡部29的设置可改善由于第一有机层210的材料流入弯折区BB而导致弯折区BB内的膜层厚度增大，进而导致弯折区BB在弯折过程中膜层产生裂纹或者弯折区BB内的线路发生断裂的问题，提升显示基板的良率。
在显示基板在制备过程中，首先同时制备多个显示基板，且多个显示基板共用一个比较大的衬底基板；之后再进行切割，以得到多个独立的显示基板。每个显示基板对应一个环形的切割区域，切割区域指示切割路径。考虑到切割误差的存在，切割区域的宽度一般较大，在切割完成后得到的显示基板的边缘区域会有部分切割区域保留，也即是显示基板的切割保留区。如图1所示，切割保留区101为显示基板100的非显示区NA的最外侧边缘区域，切割保留区101为环形。
在一个实施例中，如图1所示，所示非显示区NA包括第一非显示区NA1、第二非显示区NA2、第三非显示区NA3和第四非显示区NA4。其中第一非显示区NA1与第二非显示区NA2位于显示区AA的两侧，且在第一方向Y上位置相对；第三非显示区NA3和第四非显示区NA4位于显示区AA的另外两侧，并在第二方向X上位置相对。切割保留区101部分位于第一非显示区NA1，部分位于第二非显示区NA2，部分位于第三非显示区NA3，部分位于第四非显示区NA4。
第二非显示区NA2包括扇出区CC与弯折区BB。扇出区CC位于显示区AA与弯折区BB之间。扇出区CC中设置有多条信号线，例如数据信号线、触控信号线与电源信号线等。第二非显示区NA2还设有驱动芯片11，驱动芯片11位于弯折区BB远离显 示区AA的一侧，弯折区BB能够实现弯折，以将驱动芯片11设置于显示基板的背向发光面的一侧。阻挡部29部分位于第二非显示区NA2的扇出区CC，部分位于切割保留区101在显示区AA与所述弯折区BB之间的区域。其中，切割保留区101在显示区AA与所述弯折区BB之间的区域，指的是切割保留区101的位于第二非显示区NA2，且位于弯折区BB朝向显示区AA一侧的区域。
在一个实施例中，如图3至图5所示，所述衬底21包括衬底本体211及位于衬底本体211面向发光器件层23一侧的缓冲层212。所述衬底本体211可以是柔性衬底，也可以是刚性衬底。柔性衬底的材料可以包括聚酰亚胺、聚对苯二甲酸乙二醇酯及聚碳酸酯中的一种或多种。刚性衬底的材料可以是玻璃、硅等。所述缓冲层212的材料可以包括氮化硅及氧化硅中的至少一种。
在一个实施例中，如图2所示，所述显示基板还包括位于所述衬底21与发光器件层23之间的驱动电路层22。所述驱动电路层22包括多个用于驱动子像素的像素电路。像素电路可包括薄膜晶体管和电容，例如像素电路可以是2T1C像素电路、3T1C像素电路、4T1C像素电路、5T1C像素电路、6T1C像素电路或7T1C像素电路。
驱动电路层22可包括至少一层绝缘层，所述至少一层绝缘层例如包括层间介质层及钝化层，层间介质层及钝化层用以实现驱动电路层中相邻导电层之间的绝缘。层间介质层位于钝化层背离衬底21的一侧。层间介质层及钝化层的材料可为无机绝缘材料，例如包括氮化硅及氧化硅中的至少一种。
在一个实施例中，所述显示基板还包括平坦化层25，平坦化层25位于驱动电路层22背离衬底21的一侧。平坦化层25至少部分位于非显示区NA，且平坦化层25位于非显示区NA的部分位于驱动电路层22与触控层27之间，用于将驱动电路层22与触控层27隔开。平坦化层25的材料为有机绝缘材料。
在一个实施例中，如图2所示，所述发光器件层23包括至少三种不同发光颜色的子像素。发光器件层23可包括红色子像素R、绿色子像素G与蓝色子像素B，但不限于此。红色子像素R发红光，绿色子像素G发绿光，蓝色子像素B发蓝光。发光器件层23的子像素的发光材料层可以是有机发光层，红色子像素R、绿色子像素G与蓝色子像素B均为OLED(有机发光二极管)子像素。
在一些实施例中，如图4所示，所述发光器件层23还包括像素限定层231，像素限定层设有多个像素开口，像素开口与子像素一一对应，各子像素的发光材料层至少部分位于对应的像素开口内。
在一些实施例中，如图2所示，封装层24位于发光器件层23远离衬底21的一侧，用于阻止水氧侵蚀发光器件层23。封装层24可包括交替排布的无机封装层和有机封装层，且封装层24中与衬底21距离最远的膜层为无机封装层。
在一些实施例中，封装层24包括第一无机封装层241、有机封装层242与第二无机封装层243，第一无机封装层241位于发光器件层23远离衬底21的一侧，有机封装层242位于第一无机封装层241远离衬底21的一侧，第二无机封装层243位于有机封装层242远离衬底21的一侧。有机封装层242可采用喷墨打印(IJP)工艺形成。
在一些实施例中，如图2所示，第一无机封装层241的一部分与第二无机封装层243的一部分位于显示区AA中，第一无机封装层241的另一部分与第二无机封装层243的另一部分位于非显示区NA中。有机封装层242至少部分位于显示区AA中。
在一些实施例中，如图2所示，有机封装层242包括第一平坦部P1与斜坡部P2，第一平坦部P1与斜坡部P2均位于显示区AA中，第一平坦部P1与斜坡部P2相邻，斜 坡部P2环绕第一平坦部P1，即第一平坦部P1位于斜坡部P2内侧。第一平坦部P1各处的厚度均匀，斜坡部P2各处的厚度不均匀，例如，在由第一平坦部P1指向斜坡部P2的方向上斜坡部P2的厚度逐渐减小。斜坡部P2的这种结构会引起干涉现象，有机封装层242因四周具有斜坡部P2会引起显示区的边缘区域显示的画面出现波浪纹的现象。
在一个实施例中，所述阻挡部29位于所述有机封装层242远离所述显示区AA的一侧。如此设置，阻挡部29可阻挡有机封装层242溢出显示区而流向弯折区BB，更有助于减小第一有机层与封装层位于显示区边缘部分的总厚度与位于显示区中心部分的总厚度的差，以及改善弯折区BB在弯折过程中膜层产生裂纹或者弯折区BB内的线路发生断裂的问题。
在一些实施例中，如图2所示，触控层27位于显示区AA与非显示区NA。触控层27包括触控电极与触控信号线，触控电极位于显示区AA，触控信号线的一部分位于显示区AA，另一部分位于非显示区NA。
在一个实施例中，如图2和3所示，触控层27包括第一金属层271、绝缘材料层273与第二金属层272，第一金属层271位于封装层24远离衬底21的一侧，绝缘材料层位于第一金属层271远离衬底21的一侧，且覆盖第一金属层271，第二金属层272位于绝缘材料层远离衬底21的一侧。
在一些实施例中，如图2所示，在扇出区CC中的部分区域，可采用第一金属层271与第二金属层272中的一层进行走线，例如，扇出区CC在靠近显示区AA的一侧，通过第一金属层271进行走线，扇出区CC在靠近弯折区BB的一侧，通过第二金属层272进行走线，位于扇出区CC的第二金属层272与第一金属层271可通过搭接方式连接。
在一些实施例中，如图2所示，第二金属层272包括镂空部2721、搭接部2722与走线部2723，搭接部2722位于镂空部2721远离显示区AA的一侧，走线部2723位于搭接部2722远离显示区AA的一侧，搭接部2722与第一金属层271搭接连接，走线部2723与搭接部2722连接，即第二金属层272通过搭接部2722实现与第一金属层271的电连接。
在一些实施例中，所述显示基板还包括位于所述触控层27与所述第一有机层210之间的第二有机层28，第二有机层28位于显示区AA与非显示区NA，并位于弯折区BB之外。第二有机层28覆盖第二金属层272，用于保护第二金属层272，第二有机层28还起平坦化的作用；第二有机层28位于弯折区BB之外，则第二有机层28不会增加弯折区BB内的膜层的厚度。所述第二有机层28的材料可为有机树脂。
在一个实施例中，第一有机层210可采用喷墨打印(IJP)工艺形成。第一有机层210包括第二平坦部P3、光学补偿部P4与边缘部P5。第二平坦部P3与光学补偿部P4位于显示区AA，第二平坦部P3与光学补偿部P4相邻，且光学补偿部P4环绕第二平坦部P3，边缘部P5位于非显示区NA，边缘部P5与光学补偿部P4相邻，且边缘部P5环绕光学补偿部P4。
在一些实施例中，如图2所示，第二平坦部P3位于第一平坦部P1远离衬底21的一侧，第二平坦部P3远离衬底21的表面与衬底21面向发光器件层23的表面平行。如此设置，在显示区的不同位置处，第一平坦部P1与第二平坦部P3的厚度之和基本相同，可避免厚度差别较大而导致光线出射的光程差较大，而导致显示质量不佳的问题。其中第一平坦部P1与第二平坦部P3的厚度之和基本相同指的是，在显示区的不同位置处第一平坦部P1与第二平坦部P3的厚度之和相同，以及在显示区的不同位置处第一平坦部P1与第二平坦部P3的厚度之和相差很小的情况。
在一些实施例中，如图2所示，斜坡部P2在衬底21上的投影位于光学补偿部P4在衬底21上的投影内，光学补偿部P4被配置为减弱或消除由斜坡部P2引起的显示画面上出现波浪纹的现象。
在一些实施例中，如图2所示，在显示区AA内的不同位置，光学补偿部P4的厚度与斜坡部P2的厚度之和基本相同，斜坡部P2的折射率与光学补偿部P4的折射率相同。如此设置，当发光器件层23发光时，在显示区内的不同位置，从光学补偿部P4出射的出射光的光程基本相同，可以减弱或消除显示画面出现波浪纹的现象，提高显示质量。
在一些实施例中，如图2所示，光学补偿部P4远离衬底21的表面与衬底21面向发光器件层23的表面平行。光学补偿部P4远离衬底21的表面与第二平坦部P3远离衬底21的表面齐平。
在一些实施例中，在显示区AA内的不同位置，第一有机层210的厚度与有机封装层242的厚度之和基本相同。有机封装层242的材料与光学补偿部P4的材料相同。如此设置，当发光器件层23发光时，在显示区内的不同位置，从第一有机层210出射的出射光的光程基本相同，可以减弱或消除显示画面出现波浪纹的现象，提高显示质量。
在一些实施例中，如图2所示，边缘部P5位于非显示区NA，例如，边缘部P5可位于第一非显示区NA1、第二非显示区NA2、第三非显示区NA3与第四非显示区NA4。边缘部P5各处的厚度可不均匀。
需要说明的是，在一些实施例中，第一有机层210可仅包括光学补偿部P4与边缘部P5，而不包括第二平坦部P3。
在一些实施例中，如图2所示，当边缘部P5位于第二非显示区NA2时，边缘部P5位于弯折区BB之外。如此设置，可以避免第一有机层210影响显示基板在弯折区BB的弯折性能，避免弯折区BB的膜层产生裂纹或不易于弯折等不良现象。
在一个实施例中，所述第一有机层210覆盖所述封装层24的至少部分边缘。如此设置，更有助于使得第一有机层与封装层位于显示区边缘区域的总厚度与位于显示区其他区域的总厚度的差较小，有效改善显示区的显示效果。
在一个实施例中，如图2所示，所述阻挡部29位于所述第一有机层210远离所述显示区AA的一侧。如此设置，阻挡部29可更有效地阻挡第一有机层210的有机材料向远离显示区AA的方向外溢而进入到弯折区BB。
在一个实施例中，所述阻挡部29的高度大于所述第一有机层210远离所述显示区AA的边缘的高度。也即是，阻挡部29可有效阻挡第一有机层210的有机材料向远离显示区AA的方向外溢。
在另一实施例中，所述阻挡部29的高度可小于所述第一有机层210远离所述显示区AA的边缘的高度。也即是，第一有机层210的部分材料漫过阻挡部29，此时阻挡部29可将第一有机层210的材料的部分阻挡在阻挡部29远离弯折区的一侧。
在一个实施例中，在与所述显示区AA指向所述弯折区BB的方向垂直的方向上，所述切割保留区101包括相对的第一边缘1011和第二边缘1012，第一边缘1011和第二边缘1012位于所述非显示区NA的相对两侧，所述阻挡部29由所述第一边缘1011延伸至所述第二边缘1012。也即是，在第二方向X上，切割保留区101包括相对的第一边缘1011和第二边缘1012，阻挡部29由第一边缘1011延伸至第二边缘1012，则第一有机层210的有机材料向远离显示区AA的方向外溢至弯折区BB的路径均被阻挡部29阻隔，阻挡部29可更有效地防止第一有机层210的有机材料流至弯折区BB。
图2所示的实施例中，所述阻挡部29全部位于第二非显示区NA2。在其他实施例 中，所述阻挡部29可部分位于第二非显示区NA2，部分位于非显示区的其他区域，例如阻挡部29可为环形或者半环形。
在一个实施例中，如图3至图5所示，所述阻挡部29位于所述切割保留区101的部分背离衬底21的表面到所述衬底21的距离为第一距离d1，所述阻挡部29位于所述切割保留区101之外的部分背离衬底21的表面到所述衬底21的距离为第二距离d2，所述第一距离d1小于所述第二距离d2。如此设置，切割保留区101的膜层厚度小于非显示区NA的其他区域的膜层厚度，在对切割区域进行切割时可减小切割难度。
在一个实施例中，所述显示基板包括多个有机层，所述阻挡部29位于所述切割保留区101的部分包括至少两个有机层。其中阻挡部29包括有机层指的是，阻挡部29包括有机层的一部分。通过设置阻挡部29位于切割保留区101的部分包括至少两个有机层，可使得阻挡部29位于切割保留区101的部分到衬底21的距离较大，有助于提升阻挡部29对第一有机层210的有机材料的阻挡效果。并且，位于切割保留区101的膜层为有机层，可减小切割区域的切割难度，防止切割区域的膜层在切割过程中产生裂纹而延伸至显示区，进而影响显示基板的使用寿命。
在一些实施例中，所述阻挡部29位于所述切割保留区101的部分均为有机材料。如此设置，更有助于避免切割区域的膜层在切割过程中产生裂纹。
在一些实施例中，所述阻挡部29位于所述切割保留区101的部分至少包括所述第二有机层28、所述平坦化层25及所述像素限定层231中的至少两层的一部分。如此设置，阻挡部29与显示基板的有机层同时形成，阻挡部的形成不会增加显示基板的制备复杂度。
在一个示例性实施例中，如图3所示，所述阻挡部29位于所述切割保留区101的部分包括所述平坦化层25及所述第二有机层28的一部分。在另一示例性实施例中，如图4所示，所述阻挡部29位于所述切割保留区101的部分包括所述像素限定层231及所述第二有机层28的一部分。在再一示例性实施例中，如图5所示，所述阻挡部29位于所述切割保留区101的部分包括所述平坦化层25、所述像素限定层231及所述第二有机层28的一部分。
在一些实施例中，所述阻挡部29位于所述切割保留区101之外的部分包括所述触控层27的第一金属层271、绝缘材料层273、所述第二金属层272与所述第二有机层28中的至少一层的一部分。如图3至图5所示，所述阻挡部29位于所述切割保留区101之外的部分包括第二有机层28的一部分，且阻挡部29位于切割保留区101之外的部分与衬底21之间设有驱动电路层22的层间介质层221、钝化层222及触控层27的绝缘材料层273。如此设置，可使得阻挡部29位于切割保留区101之外的部分背离衬底的表面到衬底的距离较大，更有助于阻挡第一有机层210的有机材料溢出至弯折区BB；并且阻挡部29位于切割保留区101之外的部分与第二有机层28同时形成，阻挡部29的形成不会增大制备工艺的复杂度。
在一个实施例中，阻挡部29的数量为两个或两个以上，两个或两个以上阻挡部29在由显示区AA指向弯折区BB的方向上依次排布。如此设置，当用于制备第一有机层210的材料从靠近显示区AA的阻挡部29溢出时，靠近弯折区BB的其他阻挡部29还可以阻止用于制备第一有机层210的材料进入弯折区BB，提高阻挡部29对第一有机层210的材料阻挡的可靠性。图2所示的实施例中，阻挡部29的数量为两个，在其他实施例中，阻挡部29的数量可大于两个。
在一些实施例中，如图2所示，相邻两个阻挡部29之间存在间隙。如此设置，当用于制备第一有机层210的材料从靠近显示区AA的阻挡部29溢出时，部分材料会停留 在相邻两个阻挡部29之间的间隙中，从而继续流向弯折区BB的材料的量减少，更有助于阻止用于制备第一有机层210的材料进入弯折区BB，提高阻挡部29对第一有机层的材料阻挡的可靠性。
在一些实施例中，所述阻挡部29的数量为两个或两个以上时，各阻挡部29位于切割保留区101的高度可均相同，各阻挡部29位于切割保留区101之外的部分的高度可均相同。如此有助于简化阻挡部29的制备工艺的复杂度，降低显示基板的制备成本。在其他实施例中，各阻挡部29位于切割保留区101的部分的高度可不全相同，各阻挡部29位于切割保留区101之外的部分的高度可不全相同。例如，阻挡部29的数量为两个时，靠近显示区AA的阻挡部位于切割保留区101的部分的高度小于靠近弯折区BB的阻挡部29位于切割保留区101的部分的高度；靠近显示区AA的阻挡部位于切割保留区101之外的部分的高度小于靠近弯折区BB的阻挡部29位于切割保留区101之外的部分的高度。
在一些实施例中，如图6所示，所述显示基板的至少一个阻挡部29位于切割保留区101之外的部分分叉形成两个子阻挡部293，且该阻挡部29的两侧可基本对称。如此设置，更有助于阻止制备第一有机层210的材料进入所述弯折区BB。所述显示基板包括两个或两个以上阻挡部29时，靠近显示区AA的阻挡部29位于切割保留区101之外的部分可分叉形成两个子阻挡部。图6所示的实施例中，所述显示基板包括第一阻挡部291和位于第一阻挡部291远离显示区AA一侧的第二阻挡部292，第一阻挡部291位于切割保留区101之外的部分分叉形成两个子阻挡部293。
在一些实施例中，如图1所示，所述阻挡部29连续。在其他实施例中，所述阻挡部29不连续，也即是阻挡部29在一些位置设有缺口。如图7所示，所述阻挡部29包括第一阻挡段294和第二阻挡段295，第一阻挡段294和第二阻挡段295间隔设置，第一阻挡段294与第二阻挡段295之间形成缺口。所述显示基板还包括位于第一阻挡段294远离显示区AA一侧的缓冲部296，第一阻挡段294和第二阻挡段295之间的缺口与缓冲部296相对。有机材料在经过第一阻挡段294和第二阻挡段295之间的缺口流出时速度较快，有机材料从缺口处流出后绕过缓冲部296，从缓冲部296两侧流出，缓冲部296可减慢有机材料向外溢出的速度。图7仅示意出了阻挡部29的部分结构，阻挡部29可在多个地方形成缺口，每一缺口远离显示区AA的一侧可分别设有缓冲部。
进一步地，如图7所示，缓冲部296的两端部向朝向显示区AA的方向弯折，以进一步减慢有机材料向外溢出的速度。缓冲部296的长度可大于第一阻挡段294和第二阻挡段295之间的缺口的尺寸，以更有效地减慢有机材料向外溢出。缓冲部296可呈波浪形、直线型、折线形、弧形等。
在一个实施例中，如图2所示，阻挡部29与弯折区BB之间的距离D2小于阻挡部29与显示区AA之间的距离D1。也即是阻挡部29更接近弯折区BB。如此设置，第一有机层的有机材料在流至阻挡部29的量较少，第一有机层的有机材料更不容易流过阻挡部29。
在一些实施例中，如图2所示，阻挡部29与显示区AA之间的距离D1为500微米～1500微米，例如，阻挡部29与显示区AA之间的距离D1为500微米、900微米、1000微米或1500微米等。
在一些实施例中，如图2所示，阻挡部29与弯折区BB之间的距离D2为400微米～1000微米，例如，阻挡部29与弯折区BB之间的距离D2为400微米、700微米、800微米或1000微米等。
在一个实施例中，如图8及图9所示，所述显示基板还包括位于所述切割保留 区101的阻挡块30，所述阻挡块30位于所述阻挡部29背离所述弯折区BB的一侧。由于切割保留区101的高度小于其他区域的高度，第一有机层的有机材料易于流入切割保留区101并在切割保留区101汇集，导致位于切割保留区101的有机材料的流速较大，而阻挡部29位于切割保留区101的部分背离衬底21的表面到衬底的距离小于阻挡部29位于切割保留区101之外的部分背离衬底21的表面到衬底的距离，则位于切割保留区的有机材料容易越过阻挡部29位于切割保留区101的部分而进入到弯折区BB。通过设置阻挡块30，阻挡块30可使得位于切割保留区101的有机材料的流速减小，避免因切割保留区101的有机材料的流速过大而越过阻挡部29进入到弯折区BB，提升显示基板的良率。
在一个实施例中，所述阻挡块30的宽度与所述切割保留区101的宽度相同。如此设置，阻挡块30可更有效地减小位于切割保留区101的有机材料的流速。
在一个实施例中，所述阻挡块30包括至少一个有机层。
在一些实施例中，所述阻挡块30的材料全部为有机材料。如此设置，更有助于避免阻挡块30的膜层在切割过程中产生裂纹，降低切割区域的切割难度。
在一些实施例中，所述阻挡块30包括所述第二有机层28、所述平坦化层25及所述像素限定层中的至少一层的一部分。如此设置，阻挡块30与显示基板的一些膜层同时形成，阻挡块30的形成不会增加显示基板的制备复杂度。
在一个示例性实施例中，所述阻挡块30包括所述第二有机层28的一部分。在另一示例性实施例中，所述阻挡块30包括所述平坦化层25及所述第二有机层28的一部分。在再一实施例中，所述阻挡块30包括所述像素限定层及所述第二有机层28的一部分。
在一个实施例中，所述阻挡块30与所述阻挡部29位于所述切割保留区101的部分同层设置。如此设置，阻挡块30与阻挡部29位于所述切割保留区101的部分可同时形成，有助于简化制备工艺的复杂度。例如所述阻挡块30与所述阻挡部29可均包括所述第二有机层28与所述平坦化层25的一部分。
在一个实施例中，所述切割保留区101位于所述显示区AA同一侧的区域中可设有两个或两个以上间隔排布的阻挡块30。如此设置，阻挡块30可更有效地减小位于切割保留区101的有机材料的流速。如图8所示，切割保留区101位于所述显示区AA同一侧的区域中设有两个阻挡块30。该两个阻挡块30的高度可相同，也可不同。该两个阻挡块30的高度不同时，靠近阻挡部29的阻挡块30的高度可大于远离阻挡部29的阻挡块30的高度，例如靠近阻挡部29的阻挡块30包括所述平坦化层25及所述第二有机层28的一部分，远离阻挡部29的阻挡块30包括所述第二有机层28的一部分。
在一个实施例中，如图8所示，所述切割保留区101位于所述显示区AA相对两侧的区域中可仅有一侧设有阻挡块30。或者，如图9所示，所述切割保留区101位于所述显示区AA相对两侧的区域中均设有阻挡块30。
在一个实施例中，如图2所示，所述显示基板还包括堤坝26，堤坝26位于驱动电路层22远离衬底21的一侧，堤坝26位于非显示区NA，堤坝26用于在制备有机封装层242时阻止用于制备有机封装层242的有机材料溢流到非显示区NA。
在一些实施例中，如图2所示，堤坝26可呈环形。堤坝26的数目可以两个，例如，显示基板可包括第一堤坝261与第二堤坝262，第一堤坝261位于第二堤坝262的内侧。如此设置，堤坝26可以在制备有机封装层242时更有效地阻止有机材料溢流到非显示区NA，提高可靠性。
在一些实施例中，所述堤坝26位于所述阻挡部29靠近所述显示区AA的一侧，所述堤坝26和所述阻挡部29在垂直所述衬底21的方向上不重叠；所述阻挡部29与所述堤坝26之间的距离D3小于所述阻挡部29与所述弯折区BB之间的距离。
在一些实施例中，堤坝26可与平坦化层25同层，且堤坝26的材料可与平坦化层25的材料相同。如此，堤坝26与平坦化层25可同时形成，有助于简化显示基板的制备工艺。
在一些实施例中，如图10所示，显示基板可包括两个堤坝26：第一堤坝261与第二堤坝262，第一堤坝261位于第二堤坝262的内侧；显示基板包括两个阻挡部29：第一阻挡部291和第二阻挡部292，第一阻挡部291位于第二阻挡部292的内侧。第一阻挡部291的宽度与第二阻挡部292的宽度可大致相同。第一阻挡部291与第二堤坝262之间的距离小于第二阻挡部292与弯折部BB之间的距离。第一堤坝261与显示区AA之间的距离小于第二阻挡部292与弯折部BB之间的距离。第二堤坝262与第一阻挡部291之间的距离小于第一堤坝261与显示区AA之间的距离。
在一些实施例中，如图2所示，阻挡部29与堤坝26之间的距离D3大于50微米。其中，当堤坝26的数目为两个或两个以上时，阻挡部29与堤坝26之间的距离D3为阻挡部29与外侧的堤坝26之间的距离D3。
本发明的实施例还提供了一种显示装置，所述显示装置包括上述任一实施例所述的显示基板。
在一个实施例中，所述显示装置还包括位于所述显示基板背离所述衬底一侧的盖板。
在一个实施例中，所述显示装置还包括壳体，所述显示基板设置在所述壳体内。
本申请实施例提供的显示装置例如可以为手机、平板电脑、电视机、笔记本电脑、车载设备等任何具有显示功能的设备。
需要指出的是，在附图中，为了图示的清晰可能夸大了层和区域的尺寸。而且可以理解，当元件或层被称为在另一元件或层“上”时，它可以直接在其他元件上，或者可以存在中间的层。另外，可以理解，当元件或层被称为在另一元件或层“下”时，它可以直接在其他元件下，或者可以存在一个以上的中间的层或元件。另外，还可以理解，当层或元件被称为在两层或两个元件“之间”时，它可以为两层或两个元件之间唯一的层，或还可以存在一个以上的中间层或元件。通篇相似的参考标记指示相似的元件。
本领域技术人员在考虑说明书及实践这里公开的内容后，将容易想到本申请的其它实施方案。本申请旨在涵盖本申请的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本申请的一般性原理并包括本申请未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本申请的真正范围和精神由下面的权利要求指出。

Claims (20)

  1. 一种显示基板，其中，所述显示基板包括显示区和非显示区，所述非显示区包括弯折区；所述非显示区的外侧边缘区域为切割保留区，至少部分所述切割保留区位于所述显示区和所述弯折区之间；所述显示基板包括：
    衬底；
    发光器件层，位于所述衬底上，且位于所述显示区；
    封装层，位于所述发光器件层远离所述衬底的一侧；
    触控层，位于所述封装层远离所述衬底的一侧；
    第一有机层，位于所述触控层远离所述衬底的一侧，且位于显示区和非显示区；
    阻挡部，位于所述显示区的至少一侧，所述阻挡部位于所述显示区与所述弯折区之间，且部分位于所述切割保留区，用于阻止所述第一有机层进入所述弯折区。
  2. 根据权利要求1所述的显示基板，其中，所述阻挡部位于所述第一有机层远离所述显示区的一侧。
  3. 根据权利要求2所述的显示基板，其中，所述阻挡部的高度大于所述第一有机层远离所述显示区的边缘的高度；或者，
    所述阻挡部的高度小于所述第一有机层远离所述显示区的边缘的高度。
  4. 根据权利要求1所述的显示基板，其中，在与所述显示区指向所述弯折区的方向垂直的方向上，所述切割保留区包括相对的第一边缘和第二边缘，所述第一边缘与所述第二边缘位于所述非显示区的相对两侧，所述阻挡部由所述第一边缘延伸至所述第二边缘。
  5. 根据权利要求1至4中任一项所述的显示基板，其中，所述阻挡部位于所述切割保留区的部分背离衬底的表面到所述衬底的距离为第一距离，所述阻挡部位于所述切割保留区之外的部分背离衬底的表面到所述衬底的距离为第二距离，所述第一距离小于所述第二距离。
  6. 根据权利要求1所述的显示基板，其中，所述显示基板包括多个有机层，所述阻挡部位于所述切割保留区的部分包括至少两个有机层。
  7. 根据权利要求6所述的显示基板，其中，所述显示基板还包括位于所述触控层与所述第一有机层之间的第二有机层、位于所述触控层朝向所述衬底一侧的平坦化层、以及所述发光器件层包括的像素限定层；
    所述阻挡部位于所述切割保留区的部分至少包括所述第二有机层、所述平坦化层及所述像素限定层中的至少两层的一部分。
  8. 根据权利要求7所述的显示基板，其中，所述第一有机层采用喷墨打印工艺形成，所述第二有机层的材料为有机树脂。
  9. 根据权利要求1到8中任一项所述的显示基板，其中，所述显示基板还包括位于所述切割保留区的阻挡块，所述阻挡块位于所述阻挡部背离所述弯折区的一侧。
  10. 根据权利要求9所述的显示基板，其中，所述阻挡块的宽度与所述切割保留区的宽度相同。
  11. 根据权利要求9或10所述的显示基板，其中，所述阻挡块与所述阻挡部同层设置。
  12. 根据权利要求1至11中任一项所述的显示基板，其中，所述封装层包括有机封装层，所述有机封装层至少部分位于所述显示区；所述阻挡部位于所述有机封装层远离所述显示区的一侧；所述有机封装层包括斜坡部，所述斜坡部的厚度不均匀。
  13. 根据权利要求12所述的显示基板，其中，所述第一有机层包括光学补偿部，所述斜坡部在所述衬底上的投影位于所述光学补偿部在所述衬底上的投影内，所述光学补偿部被配置为减弱或消除由所述斜坡部引起的显示画面上出现波浪纹的现象。
  14. 根据权利要求13所述的显示基板，其中，在所述显示区内的不同位置，所述 光学补偿部的厚度与所述斜坡部的厚度之和基本相同，所述斜坡部的折射率与所述光学补偿部的折射率相同，所述光学补偿部远离所述衬底的表面与所述衬底面向所述发光器件层的表面平行。
  15. 根据权利要求13或14所述的显示基板，其中，所述有机封装层的材料与所述光学补偿部的材料相同。
  16. 根据权利要求13至15中任一项所述的显示基板，其中，所述有机封装层还包括第一平坦部，所述第一平坦部位于所述显示区，且所述第一平坦部与所述斜坡部相邻；所述第一平坦部的厚度均匀；
    所述第一有机层还包括第二平坦部，所述第二平坦部位于所述显示区，且与所述光学补偿部相邻，所述第二平坦部位于所述第一平坦部远离所述衬底的一侧，所述第二平坦部远离所述衬底的表面与所述衬底面向所述发光器件层的表面平行；在所述显示区内的不同位置，所述第一有机层的厚度与所述有机封装层的厚度之和基本相同。
  17. 根据权利要求1至16任一项所述的显示基板，其中，所述触控层包括第一金属层、位于所述第一金属层远离所述衬底一侧的绝缘材料层、及位于所述绝缘材料层远离所述衬底一侧的第二金属层；所述绝缘材料层覆盖所述第一金属层；所述显示基板还包括位于所述触控层与所述第一有机层之间的第二有机层，所述第二有机层位于所述显示区与所述非显示区，且位于所述弯折区外，所述第二有机层覆盖所述第二金属层；
    所述阻挡部位于所述切割保留区之外的部分包括所述第一金属层、所述绝缘材料层、所述第二金属层与所述第二有机层中的至少一层的一部分。
  18. 根据权利要求1至17任一项所述的显示基板，其中，所述阻挡部与所述弯折区之间的距离小于所述阻挡部与所述显示区之间的距离。
  19. 根据权利要求1至18中任一项所述的显示基板，其中，所述封装层包括至少部分位于所述显示区的有机封装层，所述显示基板还包括堤坝，所述堤坝位于所述非显示区，且位于所述阻挡部靠近所述显示区的一侧，所述堤坝用于阻止制备所述有机封装层的有机材料溢流到所述非显示区；所述堤坝与所述阻挡部在垂直所述衬底的方向上不重叠；
    所述阻挡部与所述堤坝之间的距离小于所述阻挡部与所述弯折区之间的距离。
  20. 一种显示装置，其中，包括权利要求1至19任一项所述的显示基板。
PCT/CN2023/095513 2022-05-24 2023-05-22 显示基板和显示装置 WO2023226930A1 (zh)

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