WO2023216045A1 - 具电路保护作用的扁平连接线和其制造方法 - Google Patents

具电路保护作用的扁平连接线和其制造方法 Download PDF

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Publication number
WO2023216045A1
WO2023216045A1 PCT/CN2022/091619 CN2022091619W WO2023216045A1 WO 2023216045 A1 WO2023216045 A1 WO 2023216045A1 CN 2022091619 W CN2022091619 W CN 2022091619W WO 2023216045 A1 WO2023216045 A1 WO 2023216045A1
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WO
WIPO (PCT)
Prior art keywords
circuit protection
flat
circuit
line width
manufacturing
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Application number
PCT/CN2022/091619
Other languages
English (en)
French (fr)
Inventor
吴爱清
张明超
王凯
Original Assignee
亳州联滔电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 亳州联滔电子有限公司 filed Critical 亳州联滔电子有限公司
Priority to PCT/CN2022/091619 priority Critical patent/WO2023216045A1/zh
Priority to CN202280047278.7A priority patent/CN117616516A/zh
Priority to TW111129026A priority patent/TWI808854B/zh
Publication of WO2023216045A1 publication Critical patent/WO2023216045A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/08—Flat or ribbon cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure

Definitions

  • the present application relates to a structure and a manufacturing method of a flat connecting wire, and in particular to a flat connecting wire with circuit protection and a manufacturing method thereof.
  • Flexible flat cable is a flat wire placed between two layers of insulating films and then pressed into shape. It is used to connect electronic devices to transmit electronic signals by providing electrical connectors at both ends. Flexible flat cables have the advantages of being able to be bent and folded at will, thin in thickness, small in size, simple to connect and easy to solve electromagnetic shielding. However, existing flexible flat cables often allow excessive current to pass through and fail to protect the circuit.
  • Embodiments of the present application provide a flat connecting wire with circuit protection and a manufacturing method thereof.
  • the circuit protection structure is provided with a smaller line width (smaller cross-sectional area).
  • An open circuit is created by fusing the circuit protection structure to protect circuits and electronic components.
  • a flat connecting wire with circuit protection function includes a plurality of flat conductors and an insulating covering member.
  • a plurality of flat conductors are configured to extend parallel to each other and are separated by a predetermined distance.
  • Each flat conductor includes at least one circuit protection structure.
  • the at least one circuit protection structure includes two circuit conductive parts and a circuit protection part disposed between the two circuit conductive parts. and two circuit connection parts connecting the circuit conduction part and the circuit protection part, the circuit conduction part has a first line width, the circuit protection part has a second line width, the first line width is greater than the second line width.
  • a plurality of flat conductors are disposed in an insulating covering member, and the insulating covering member covers the circuit protection structure of the plurality of flat conductors.
  • the position of the circuit protection portion of each flat conductor is offset from the position of the circuit protection portion of the adjacent flat conductor in a direction orthogonal to the extension direction of the flat conductor.
  • the positions of the circuit protection portions of all the flat conductors are staggered from each other in a direction orthogonal to the extension direction of the flat conductors.
  • each circuit connection part gradually increases from one end connected to the circuit protection part to one end connected to the circuit conductive part.
  • Each circuit connection portion has a tapered shape, and the taper range of the taper is 30 to 60 degrees.
  • the second line width is 1/8 to 1/12 of the first line width.
  • the second line width is 1/10 of the first line width, and the second line width is equal to the thickness of each flat conductor.
  • the insulating covering member includes two oppositely arranged first insulating films and a second insulating film.
  • the first insulating films and the second insulating films sandwich and cover a plurality of flat conductors.
  • each of the flat wires and the corresponding circuit protection structure is a stamped one-piece molded part, an etched one-piece molded part, or a laser-engraved one-piece molded part.
  • a method for manufacturing a flat connecting wire with circuit protection includes a step of providing a conductive material, a step of forming a circuit protection structure, and a step of forming an insulating covering.
  • the conductive material providing step the conductive material is provided.
  • the circuit protection structure forming step a plurality of circuit protection structures separated from each other are formed from at least a part of the conductive material.
  • Each of the circuit protection structures includes a circuit protection part and two circuit conductive parts respectively connected to both sides of the circuit protection part. and a circuit connection portion connecting the circuit protection portion and the circuit conduction portion.
  • the insulating cover forming step an insulating cover that completely covers the circuit protection structure is formed.
  • the circuit conductive part has a first line width
  • the circuit protection part has a second line width
  • the first line width is greater than the second line width
  • the position of the circuit protection part of each circuit protection structure is consistent with the position of the circuit protection part of the adjacent circuit protection structure.
  • the positions are staggered from each other in a direction orthogonal to the extending direction of the circuit conduction portion.
  • the conductive material in one embodiment of the present application is a conductive plate.
  • the manufacturing method of this embodiment also includes a step of forming a flat wire: forming a circuit conductive portion on the conductive material other than the plurality of circuit protection structures, so that the circuit conductive portion can be used in the circuit protection. Both sides of the portion extend away from the circuit protection portion to form a plurality of flat conductors.
  • the step of forming the insulating covering includes: laminating a plurality of flat conductors with circuit protection structures to the first insulating film; and laminating the second insulating film to the plurality of flat conductors and the first insulating film.
  • circuit protection structure forming step and the flat conductor forming step in one embodiment of the present application are respectively implemented by two consecutive stamping processes.
  • the circuit protection structure forming step and the flat conductor forming step are implemented by etching or laser engraving process technology, and the circuit protection structure forming step and the flat conductor forming step are completed at the same time.
  • the conductive material in another embodiment of the present application is a plurality of conductive wires.
  • the manufacturing method of this embodiment also includes a wire rolling step: rolling a plurality of conductive wires to form a plurality of flat conductors; wherein each circuit protection structure is formed on each Flat wire.
  • the step of forming the circuit protection structure is realized by stamping, etching or laser engraving process technology.
  • each flat conductor and the corresponding circuit protection structure are formed into a stamped one-piece molded part, an etched one-piece molded part or a laser-engraved one-piece molded part by stamping, etching or laser engraving.
  • the manufacturing method of the present application also includes a flat conductor positioning step: attaching and positioning the plurality of flat conductors to the first insulating film; and the insulating covering forming step further includes: attaching the second insulating film to the plurality of flat conductors and the third insulating film.
  • the manufacturing method of this application also includes a flat conductor positioning step: attaching and positioning multiple flat conductors to the positioning diaphragm; wherein the circuit protection structure forming step also includes forming a circuit protection structure on each flat conductor through stamping technology, so that the flat conductor It becomes a stamped integrated molding with the circuit protection structure; wherein the step of forming the insulation covering further includes: fitting the first insulation film and the second insulation film to a plurality of flat conductors and the circuit protection structure.
  • the manufacturing method of the present application also includes a positioning diaphragm removal step: after forming the circuit protection structure, remove the positioning diaphragm.
  • each circuit connection part gradually increases from one end connected to the circuit protection part to one end connected to the circuit conductive part.
  • the flat connection line with circuit protection function and the manufacturing method of the present application form a circuit protection structure on the flat conductor.
  • the circuit protection structure includes a circuit conduction part with a larger first line width and a circuit protection part with a smaller second line width. , when the current flowing through the flat wire exceeds the maximum current allowed by the circuit protection part, the circuit protection part will melt to form an open circuit, thus protecting the electronic components of the circuit.
  • each flat conductor and the circuit protection part of the adjacent flat conductor are arranged in a staggered position in a direction orthogonal to the extension direction of the flat conductor, so that the weakest parts of each flat conductor structure are dispersedly arranged.
  • the weakest part of each flat conductor structure can be reinforced by adjacent flat conductors, so that the overall structure still maintains a predetermined strength and increases the bending resistance of the product.
  • a circuit connection part with a gradually increasing line width from the second line width to the first line width is provided between the circuit conduction part and the circuit protection part.
  • the structure of the gradually increasing line width of the circuit connection part can prevent the concentration of the conductors and prevent the flat conductors from being in the circuit.
  • the connection between the conductive part and the circuit protection part breaks, increasing the tension that each flat conductor can withstand.
  • Figure 1 is a three-dimensional exploded view of a flat connecting cable with circuit protection function according to an embodiment of the present application
  • Figure 2 is a top view and a partial enlarged view of the flat connecting wire with circuit protection in Figure 1 with the first insulating film removed;
  • Figure 3 is a flow chart of a manufacturing method of a flat connecting wire with circuit protection according to an embodiment of the present application
  • Figures 4 to 8 are schematic diagrams of the manufacturing method of Figure 3 using punching process technology
  • Figures 9 to 12 are schematic diagrams of the manufacturing method of Figure 3 using etching or laser engraving technology
  • Figure 13 is a flow chart of a method for manufacturing a flat connecting wire with circuit protection according to another embodiment of the present application.
  • Figures 14 to 18 are schematic diagrams of the manufacturing method of Figure 13 using punching, etching or laser engraving technology
  • Figure 19 is a flow chart of a method for manufacturing a flat connecting wire with circuit protection according to yet another embodiment of the present application.
  • 20 to 25 are schematic diagrams of the manufacturing method of FIG. 19 using punching technology.
  • Figure 1 is an exploded perspective view of a flat connection line with circuit protection function according to an embodiment of the present application.
  • Figure 2 is a first step of removing the flat connection line with circuit protection function in Figure 1.
  • the flat connecting wire 1 with circuit protection function of this embodiment includes a plurality of flat conductors 10 and an insulating covering 20 .
  • the plurality of flat conductors 10 are disposed in the insulating covering 20 , and the insulating covering 20 completely covers the plurality of flat conductors 10 .
  • the insulating coverings 20 at both ends of the flat conductor 10 can be stripped off for electrical connection with electrical connectors.
  • the plurality of flat conductors 10 are made of metal, such as oxygen-free copper, and the insulating coating 20 is made of insulating plastic, such as PET film coated with a thermoplastic resin with flame retardant properties.
  • the plurality of flat conductors 10 are configured to extend parallel to each other and are separated by a predetermined distance, and each flat conductor 10 includes at least one circuit protection structure 11 .
  • the circuit protection structure 11 of this embodiment includes two circuit conductive parts 111, a circuit protection part 112 disposed between the two circuit conductive parts 111, and two circuit connection parts 113 connecting the circuit conductive part 111 and the circuit protection part 112.
  • the circuit conductive part 111 has a first line width a
  • the circuit protection part 112 has a second line width b
  • the first line width a is greater than the second line width b.
  • the second line width b of the circuit protection part 112 is smaller than the first line width a of the circuit conduction part 111, and the resistance of the conductor is proportional to its length and inversely proportional to the cross-sectional area, the smaller the cross-sectional area, the greater the resistance value.
  • the line width of the conductor is related to the cross-sectional area, so the resistance value of the circuit protection part 112 is greater than the resistance value of the circuit conduction part 111.
  • the second line width b of the circuit protection part 112 can be determined according to the design requirements, and is set to 1/8 to 1/12 of the first line width a of the circuit conduction part 111.
  • the second line width of the circuit protection part 112 in this embodiment b is 1/10 of the first line width a, and the second line width b of the circuit protection part 112 of this embodiment is equal to the thickness of the flat conductor 10 .
  • each circuit connection portion 113 gradually increases from the end connected to the circuit protection portion 112 to the end connected to the circuit conduction portion 111 , and gradually increases in a linear manner. That is, each circuit connection portion 113 has a tapered shape, and the taper of the tapered shape in this embodiment is 45 degrees. In some embodiments, the taper of each circuit connection 113 may range from 30 to 60 degrees.
  • the circuit connection part 113 of this embodiment can prevent stress from being concentrated at the connection part, thereby preventing the flat conductor 10 from breaking at the connection part between the circuit conduction part 111 and the circuit protection part 112 and increasing the tension that each flat conductor 10 can withstand.
  • the flat connection with circuit protection function of the present application The wire 1 is not limited to this.
  • slits or openings may be formed in the flat conductor 10 so that the overall line width of the circuit protection part is smaller than the overall line width of the circuit conduction part to protect the circuit.
  • the position of the circuit protection portion 112 of each flat conductor 10 is offset from the position of the circuit protection portion 112 of the adjacent flat conductor 10 in the direction L2 orthogonal to the extension direction L1 of the flat conductor 10 .
  • the positions of even all the circuit protection portions 112 of the flat conductors 10 are staggered from each other in the direction L2 orthogonal to the extension direction L1 of the flat conductors 10 . That is, the projection of each circuit protection part 112 in the direction L2 will not overlap with the projection of any other circuit protection part 112 in the direction L2.
  • the circuit protection portion 112 of each flat conductor 10 in this embodiment will overlap with the projection of the circuit protection portion 112 of the third flat conductor 10 on both sides of the flat conductor 10 separated by two flat conductors 10 in the direction L2.
  • each flat conductor 10 and the circuit protection part 112 of the adjacent flat conductor 10 are arranged in a staggered manner in the direction L2 orthogonal to the flat conductor extension direction L1, so that each flat conductor 10 has a staggered position.
  • the weakest parts are dispersedly arranged, and the weakest parts of the structure of each flat conductor 10 can be reinforced by adjacent flat conductors 10, so that the overall structure still maintains a predetermined strength and increases the bending resistance of the product.
  • the insulating covering 20 of this embodiment includes two first insulating films 21 and a second insulating film 22 that are oppositely arranged.
  • the first insulating films 21 and the second insulating films 22 are connected to each other using a hot pressing process.
  • the press-fit clamps and covers a plurality of flat conductors 10 and completely covers the circuit protection structure 11 .
  • the first insulating film 21 and the second insulating film 22 may be, for example, PET films coated with a thermoplastic resin having flame retardant properties.
  • step S1 is a step of providing a conductive material.
  • a conductive material M is provided.
  • the conductive material is a conductive plate.
  • the conductive plate in this embodiment is an oxygen-free copper plate. Then proceed to step S2.
  • Step S2 is a circuit protection structure forming step.
  • the conductive material M is placed in a punching machine and a first punch is used to punch a portion of the conductive material M to form a plurality of circuit protection structures 11 separated from each other.
  • Each of the circuit protection structures 11 includes a circuit protection part 112, two circuit conduction parts 111 respectively connected to both sides of the circuit protection part 112, and a circuit connection part 113 connecting the circuit protection part 112 and the circuit conduction part 111. Then proceed to step S3.
  • Step S3 is a flat conductor forming step.
  • the conductive material M from which the circuit protection structures 11 have been punched out is punched with a second die on the conductive material M other than the plurality of circuit protection structures 11 to remove the circuit protection structures from the conductive material M.
  • the circuit conductive part 111 of 11 continues and extends the circuit conductive part 111 so that the circuit conductive part 111 extends on both sides of the circuit protection part 11 in a direction away from the circuit protection part 112 to form a plurality of complete flat conductors 10 .
  • each flat conductor 10 and the corresponding circuit protection structure 11 are stamped integrally formed parts. Then proceed to step S4.
  • Step S4 is an insulating covering forming step.
  • step S4 as shown in FIG. 7 , an insulating covering 20 that completely covers the circuit protection structure 11 is formed.
  • step S4 also includes the following two steps: attaching a plurality of flat conductors 10 with circuit protection structures 11 to the first insulating film 21 ; and then applying a hot pressing process to the second insulating film 22 The plurality of flat conductors 10 and the first insulating film 21 are pressed together to form an insulating covering 20 that completely covers the circuit protection structure 11 .
  • FIGS. 9 to 12 are schematic diagrams of the manufacturing method of FIG. 3 using etching or laser engraving technology.
  • a conductive material M is provided, and the conductive material is a conductive plate.
  • the conductive plate in this embodiment is an oxygen-free copper plate.
  • the circuit protection structure 11 and the overall flat conductor 10 are formed simultaneously using etching or laser engraving process technology, that is, step S2 (circuit protection structure forming step) and step S3 (flat conductor forming step) are performed at the same time. Completed in one process.
  • each flat conductor 10 and the corresponding circuit protection structure 11 are etched one-piece moldings or laser-engraved one-piece moldings.
  • step S4 insulating covering forming step
  • the insulating covering 20 that completely covers the circuit protection structure 11 is formed.
  • a plurality of flat conductors 10 with circuit protection structures 11 are bonded to the first insulating film 21, and then the second insulating film 22 is pressed to the plurality of flat conductors 10 and The first insulating diaphragm 21.
  • step S11 is a step of providing a conductive material.
  • a conductive material N is provided.
  • the conductive material N is a plurality of conductive wires, and each conductive wire has a circular cross-section. Then proceed to step S12.
  • Step S12 is a wire rolling step.
  • step S12 as shown in FIG. 15, a plurality of conductive wires are rolled to form a plurality of flat conductors 10, so that the circular cross-section of the wires becomes a rectangular cross-section. Then proceed to step S13.
  • Step S13 is a flat conductor positioning step.
  • step S13 as shown in FIG. 16 , a plurality of flat conductors 10 are attached and positioned on the first insulating film 21 so that the plurality of flat conductors 10 are positioned relative to each other. Then proceed to step S14.
  • Step S14 is a circuit protection structure forming step.
  • step S14 as shown in FIG. 17 , grooves are formed on both sides of the flat conductor 10 using punching, etching or laser engraving technology to obtain multiple separate circuit protections.
  • each of the circuit protection structures 11 includes a circuit protection part 112, two circuit conductive parts 111 respectively connected to both sides of the circuit protection part 112, and a circuit connection part 113 connecting the circuit protection part 112 and the circuit conductive part 111.
  • each flat conductor 10 and the corresponding circuit protection structure 11 are formed into a stamped one-piece molding, an etching one-piece molding, or a laser-engraved one-piece molding by stamping, etching, or laser engraving. Then proceed to step S15.
  • Step S15 is an insulating coating forming step.
  • the second insulating film 22 is pressed onto the plurality of flat conductors 10 and the first insulating film 21 using, for example, a hot pressing process.
  • a structure is formed in which the insulating covering member 20 completely covers the circuit protection structure 11 .
  • FIG. 19 is a flow chart of a method for manufacturing a flat connecting wire with circuit protection according to yet another embodiment of the present application.
  • FIGS. 20 to 25 are schematic diagrams of the manufacturing method of FIG. 19 using punching technology. Step S21 and step S22 in this embodiment are the same as steps 11 and 12 in the previous embodiment.
  • Step S21 is a step of providing a conductive material.
  • a plurality of conductive materials N are provided.
  • the plurality of conductive materials N are a plurality of conductive wires. Each conductive wire has a circular cross-section.
  • step S22 is entered. .
  • Step S22 is a wire rolling step.
  • step S22 as shown in FIG. 21, a plurality of conductive wires are rolled to form a plurality of flat conductors 10, so that the circular cross-section of the wires becomes a rectangular cross-section. Then proceed to step S23.
  • Step S23 is a flat wire positioning step.
  • a plurality of flat wires 10 are attached to the positioning diaphragm 30 so that the plurality of flat wires 10 are positioned on the positioning diaphragm 30 and form a predetermined position with each other. distance.
  • One positioning film 30 can be used to be attached to one side of the plurality of flat conductors 10 , or two positioning films 30 can be used to be attached to opposite sides of the plurality of flat conductors 10 . Then proceed to step S24.
  • Step S24 is a circuit protection structure forming step.
  • step S24 as shown in Figure 23, grooves are formed on both sides of the flat conductor 10 using a punching process to obtain a plurality of circuit protection structures 11 separated from each other.
  • the flat conductor 10 and the corresponding circuit protection structure 11 are formed as a stamped integrated molding, and the positioning diaphragm 30 is also punched on both sides of the circuit protection structure 11 at the same time. Then proceed to step S25.
  • Step S25 is a positioning film removal step.
  • step S25 as shown in FIG. 24, the positioning film 30 is removed from the flat conductor 10. Then proceed to step S26.
  • Step S26 is an insulating covering forming step.
  • the first insulating film 21 and the second insulating film 22 are pressed onto the plurality of flat conductors 10 and 10 using, for example, a hot pressing process.
  • the circuit protection structure 11 is formed such that the insulation covering member 20 completely covers the circuit protection structure 11 .
  • the positioning diaphragm removal step of step S25 can also be omitted, and step S26 can be directly entered from step S24 to directly cover the positioning diaphragm 30 with the first insulating diaphragm 21 and the second insulating diaphragm 22, and then The first insulating film 21 and the second insulating film 22 together with the positioning film 30 are pressed together with the plurality of flat conductors 10 and the circuit protection structure 11 using a hot pressing process.
  • the positioning film removal step of step S25 may be to first attach the first insulating film 21 to the flat conductor 10 and the circuit protection structure 11 if there is a positioning film 30 without the positioning film.
  • the first insulating film 21 is first attached to the side where the positioning film 30 is removed, and then the other positioning film 30 is removed, and then the second insulating film 22 is attached first.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Fuses (AREA)
  • Communication Cables (AREA)
  • Burglar Alarm Systems (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

一种具电路保护作用的扁平连接线和方法，具电路保护作用的扁平连接线可利用冲切、蚀刻或激光雕刻的工艺技术实现,且包括多个扁平导线和绝缘包覆件。多个扁平导线配置成彼此平行延伸且相隔预定的距离，每个扁平导线包括至少一个电路保护结构,至少一个电路保护结构包括两个电路传导部、设置于两个电路传导部间的电路保护部和连接电路传导部与电路保护部的两个电路连接部，电路传导部具有第一线宽，电路保护部具有第二线宽，第一线宽大于第二线宽。多个扁平导线设置于绝缘包覆件内，且绝缘包覆件覆盖多个扁平导线的电路保护结构。每个扁平导线的电路保护部的位置与相邻的扁平导线的电路保护部的位置在与扁平导线延伸方向正交的方向上是彼此错开。

Description

具电路保护作用的扁平连接线和其制造方法 技术领域
本申请涉及一种扁平连接线的结构和制造方法，尤其涉及一种具电路保护作用的扁平连接线和其制造方法。
背景技术
柔性扁平线缆(flexible flat cable，FFC)是将扁平导线放置于两层绝缘膜片间然后压合成型，通过在两端设置电连接器而用于连接电子装置以传送电子信号。柔性扁平线缆，其具有能随意弯曲折迭、厚度薄、体积小，连接简单而且容易解决电磁屏蔽等的优点。但是现有的柔性扁平线缆往往容许过大的电流通过而无法对电路起到保护的作用。
发明内容
本申请实施例提供一种具电路保护作用的扁平连接线和其制造方法,其设置具有线宽较小(截面积较小)的电路保护结构，当流过扁平连接线的电流过大时，通过电路保护结构熔断而形成断路以保护电路和电子部件。
为了解决上述技术问题，本申请是这样实现的：
本申请一实施例的具电路保护作用的扁平连接线包括多个扁平导线和绝缘包覆件。多个扁平导线配置成彼此平行延伸且相隔预定的距离，每个扁平导线包括至少一个电路保护结构,至少一个电路保护结构包括两个电路传导部、设置于两个电路传导部间的电路保护部和连接电路传导部与电路保护部的两个电路连接部，电路传导部具有第一线宽，电路保护部具有第二线宽，第一线宽大于第二线宽。多个扁平导线设置于绝缘包覆件内，且绝缘包覆件覆盖多个扁平导线的电路保护结构。每个扁平导线的电路保护部的位置与相邻的扁平导线的电路保护部的位置在与扁平导线延伸方向正交的方向上是彼此错开。
优选地，全部的所述扁平导线的所述电路保护部的位置在与所述扁平导线延伸方向正交的方向上是彼此错开。
每个电路连接部的线宽从连接电路保护部的一端到连接电路传导部的一端逐渐增加。
每个电路连接部呈现锥形，且锥形的锥度范围为30至60度。
第二线宽为第一线宽的1/8至1/12。
优选地，第二线宽为第一线宽的1/10，且第二线宽等于每个扁平导线的厚度。
绝缘包覆件包括两个相对设置的第一绝缘膜片和第二绝缘膜片，第一绝缘 膜片和第二绝缘膜片夹持且包覆多个扁平导线。
本申请一实施例的每个所述扁平导线与对应的所述电路保护结构为冲压一体成型件、蚀刻一体成型件或激光雕刻一体成型件
本申请一实施例的具电路保护作用的扁平连接线的制造方法，其包括导电材提供步骤、电路保护结构形成步骤和绝缘包覆件形成步骤。在导电材提供步骤中，提供导电材。在电路保护结构形成步骤中，从导电材的至少一部分形成多个彼此分隔的电路保护结构，每个所述电路保护结构包括电路保护部、分别连接于电路保护部两侧的两个电路传导部和连接电路保护部与电路传导部的电路连接部。在绝缘包覆件形成步骤中，其形成完全包覆所述电路保护结构的绝缘包覆件。其中电路传导部具有第一线宽，电路保护部具有第二线宽，第一线宽大于第二线宽，每个电路保护结构的电路保护部的位置与相邻的电路保护结构的电路保护部的位置在与电路传导部延伸方向正交的方向上是彼此错开。
本申请一实施例的导电材为导电板材，本实施例制造方法还包括扁平导线形成步骤：在导电材上的多个电路保护结构以外的部分延续形成电路传导部，使电路传导部于电路保护部的两侧往远离电路保护部的方向延伸以形成多个扁平导线。
绝缘包覆件形成步骤包括：将多个具有电路保护结构的扁平导线贴合于第一绝缘膜片；将第二绝缘膜片压合于多个扁平导线和第一绝缘膜片。
本申请一实施例的电路保护结构形成步骤和扁平导线形成步骤是分别以连续两次冲压工艺实现。
本申请另一实施例的电路保护结构形成步骤和扁平导线形成步骤是以蚀刻或激光雕刻的工艺技术实现，且电路保护结构形成步骤和扁平导线形成步骤是同时完成。
本申请另一实施例的导电材为多个导电线材，本实施例制造方法还包括线材压延步骤：压延多个导电线材，以形成多个扁平导线；其中每个电路保护结构分别形成于每个扁平导线。
电路保护结构形成步骤是以冲压、蚀刻或激光雕刻的工艺技术实现。
本申请另一实施例中，每个扁平导线与对应的电路保护结构是通过冲压、蚀或激光雕刻形成为冲压一体成型件、蚀刻一体成型件或激光雕刻一体成型件
本申请制造方法还包括扁平导线定位步骤：将多个扁平导线贴附定位于第一绝缘膜片；绝缘包覆件形成步骤还包括：将第二绝缘膜片贴合于多个扁平导线和第一绝缘膜片。
本申请制造方法还包括扁平导线定位步骤：将多个扁平导线贴附定位于定位膜片；其中电路保护结构形成步骤还包括在每个扁平导线通过冲压的工艺技术形成电路保护结构，使扁平导线与电路保护结构成为冲压一体成型件；其中 绝缘包覆件形成步骤还包括：将第一绝缘膜片和第二绝缘膜片贴合于多个扁平导线和电路保护结构。
本申请制造方法还包括定位膜片移除步骤：在形成电路保护结构后，移除定位膜片。
每个电路连接部的线宽从连接电路保护部的一端到连接电路传导部的一端逐渐增加。
本申请的具电路保护作用的扁平连接线和制造方法，在扁平导线上形成电路保护结构，电路保护结构包括具有较大第一线宽的电路传导部和具有较小第二线宽的电路保护部，当流过扁平导线的电流超过电路保护部容许通过的最大电流时，电路保护部会熔断而形成断路，从而保护电路的各电子部件。
每个扁平导线的电路保护部与相邻的扁平导线的电路保护部彼此在与扁平导线延伸方向正交的方向上以错开位置的方式配置，使得每个扁平导线结构最弱的部位分散设置，每个扁平导线结构最弱的部位能够由相邻的扁平导线予以补强，使整体结构仍然保持预定的强度，增加产品的耐弯折程度。
在电路传导部与电路保护部间设置呈线宽从第二线宽往第一线宽逐渐增加的电路连接部，电路连接部的线宽渐增的结构能够防止应立集中，避免扁平导线在电路传导部与电路保护部的连接处断裂，增加每个扁平导线所能承受的张力。
附图说明
此处所说明的附图用来提供对本申请的进一步理解，构成本申请的一部分，本申请的示意性实施例及其说明用于解释本申请，并不构成对本申请的不当限定。在附图中：
图1是本申请一实施例的具电路保护作用的扁平连接线的立体分解图；
图2是图1的具电路保护作用的扁平连接线的移除第一绝缘膜片的俯视图和部分放大图；
图3是本申请一实施例的具电路保护作用的扁平连接线的制造方法的流程图；
图4至图8是以冲切工艺技术实现图3的制造方法的示意图；
图9至图12是以蚀刻或激光雕刻的工艺技术实现图3的制造方法的示意图；
图13是本申请另一实施例的具电路保护作用的扁平连接线的制造方法的流程图；
图14至图18是以冲切、蚀刻或激光雕刻的工艺技术实现图13的制造方法的示意图；
图19是本申请又另一实施例的具电路保护作用的扁平连接线的制造方法的流程图；
图20至图25是以冲切的工艺技术实现图19的制造方法的示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
请参阅图1和图2，其中图1是本申请一实施例的具电路保护作用的扁平连接线的立体分解图，图2是图1的具电路保护作用的扁平连接线的移除第一绝缘膜片的俯视图和部分放大图。如图所示，本实施例的具电路保护作用的扁平连接线1包括多个扁平导线10和绝缘包覆件20。多个扁平导线10设置于绝缘包覆件20内，而且绝缘包覆件20完全地包覆多个扁平导线10。扁平导线10两端的绝缘包覆件20可以剥除以便与电连接器电连接。多个扁平导线10是以金属制成，例如无氧铜，绝缘包覆件20是以绝缘塑料制成，例如PET膜涂布具有阻燃特性的热塑型树脂。
多个扁平导线10配置成彼此平行延伸且相隔预定的距离，每个扁平导线10包括至少一个电路保护结构11。本实施例的电路保护结构11包括两个电路传导部111、设置于两个电路传导部111间的电路保护部112和连接电路传导部111与电路保护部112的两个电路连接部113。电路传导部111具有第一线宽a，电路保护部112具有第二线宽b，第一线宽a大于第二线宽b。
由于电路保护部112的第二线宽b比电路传导部111的第一线宽a小，而导体的电阻是与其长度成正比而与截面积成反比，因此截面积愈小，电阻值愈大，导体的线宽与截面积相关，因此电路保护部112的电阻值是大于电路传导部111的电阻值，当相同电流流过电路传导部111和电路保护部112，电路保护部112的发热较大。因此在正常操作的状态下，电子信号会沿着电路传导部111、电路连接部113和电路保护部112传输，当电流超过到额定的标准时，电路保护部112的发热会使其本身熔断，使回路形成断路，起到保护电路的作用。电路保护部112的第二线宽b可以依照设计的需求决定，设定为电路传导部111的第一线宽a的1/8至1/12，本实施例的电路保护部112的第二线宽b为第一线宽a的1/10，而且本实施例的电路保护部112的第二线宽b与扁平导线10的厚度相等。
每个电路连接部113的线宽从连接电路保护部112的一端到连接电路传导部111的一端逐渐增加，而且是以线性的方式逐渐增加。即每个电路连接部113呈现锥形，本实施例的锥形的锥度为45度。在一些实施例中，每个电路连接部113的锥形的锥度范围可以是30至60度。通过在电路传导部111和电路保护 部112间设置锥形的电路连接部113，当扁平导线10受力拉伸时，力可以从电路传导部111沿着电路连接部113平顺的传递至电路保护部112，再从电路保护部112经过另一个电路连接部113平顺的传递至电路传导部111，与没有设置电路连接部113而直接使电路传导部与电路保护部连接形成直角的结构相比较，本实施例的电路连接部113能够避免应力集中于连接处，从而避免扁平导线10在电路传导部111与电路保护部112的连接处断裂，增加每个扁平导线10所能承受的张力。
虽然本实施例是以在扁平导线10两侧形成凹部来实现具有较小的第二线宽b的电路保护部112，而且电路连接部113呈锥形，但本申请的具电路保护作用的扁平连接线1不限于此，在其他实施例中，也可以是以扁平导线10中形成狭缝或开口而实现电路保护部的整体线宽小于电路传导部的整体线宽而起到保护电路的作用。
另外，每个扁平导线10的电路保护部112的位置与相邻的扁平导线10的电路保护部112的位置在与扁平导线10延伸方向L1正交的方向L2上是彼此错开。优选地，甚至是全部的扁平导线10的电路保护部112的位置在与扁平导线10延伸方向L1正交的方向L2上是彼此错开。即每个电路保护部112在方向L2上的投影不会与其他任何一个电路保护部112在方向L2上的投影重叠。本实施例的每个扁平导线10的电路保护部112会与其两侧相隔两个扁平导线10的第三个扁平导线10的电路保护部112在方向L2上的投影重叠。
每个扁平导线10的电路保护部112与相邻的扁平导线10的电路保护部112彼此在与扁平导线延伸方向L1正交的方向L2上以错开位置的方式配置，使得每个扁平导线10结构最弱的部位分散设置，每个扁平导线10结构最弱的部位能够由相邻的扁平导线10予以补强，使整体结构仍然保持预定的强度，增加产品的耐弯折程度。
本实施例的绝缘包覆件20包括两个相对设置的第一绝缘膜片21和第二绝缘膜片22，第一绝缘膜片21和第二绝缘膜片22是以热压的工艺技术彼此压合夹持且包覆多个扁平导线10，而且完全地包覆电路保护结构11。第一绝缘膜片21和第二绝缘膜片22可以是例如涂布具阻燃特性热塑性树脂的PET膜片。
请参阅图3，是本申请一实施例的具电路保护作用的扁平连接线的制造方法的流程图，请同时参阅图4至图8，其是以冲切工艺技术实现图3的制造方法的示意图。首先步骤S1是导电材提供步骤，在步骤S1中，提供导电材M，如图4所示，导电材为导电板材，本实施例的导电板材为无氧铜板。接着进入步骤S2。
步骤S2为电路保护结构形成步骤，在步骤S2中，如图5所示，将导电材M放置于冲压机中以第一冲模从导电材M的一部分冲压形成多个彼此分隔的 电路保护结构11，每个所述电路保护结构11包括电路保护部112、分别连接于电路保护部112两侧的两个电路传导部111和连接电路保护部112与电路传导部111的电路连接部113。接着进入步骤S3。
步骤S3为扁平导线形成步骤。在步骤S3中，如图6所示，将已冲压出电路保护结构11的导电材M以第二冲模在导电材M上的多个电路保护结构11以外的部分再进行冲压而从电路保护结构11的电路传导部111延续而延长电路传导部111，使电路传导部111在电路保护部11的两侧往远离电路保护部112的方向延伸以形成完整的多个扁平导线10。在一些实施例中，每个扁平导线10与对应的电路保护结构11为冲压一体成型件。接着进入步骤S4。
步骤S4为绝缘包覆件形成步骤，在步骤S4中，如图7所示，其形成完全包覆电路保护结构11的绝缘包覆件20。如图8所示，步骤S4还包括下列两个步骤：将多个具有电路保护结构11的扁平导线10贴合于第一绝缘膜片21；接着将第二绝缘膜片22以热压工艺技术压合于多个扁平导线10和第一绝缘膜片21，以形成完全包覆电路保护结构11的绝缘包覆件20。
请参阅图9至图12，其是以蚀刻或激光雕刻的工艺技术实现图3的制造方法的示意图。如图9所示，在步骤1(导电材提供步骤)中，提供导电材M，导电材为导电板材，本实施例的导电板材为无氧铜板。接着如图10所示，以蚀刻或激光雕刻的工艺技术同时形成电路保护结构11和整体的扁平导线10，即步骤S2(电路保护结构形成步骤)与步骤S3(扁平导线形成步骤)是在同一个工序中完成。在一些实施例中，每个扁平导线10与对应的电路保护结构11为蚀刻一体成型件或激光雕刻一体成型件。接着如图11所示，在步骤S4(绝缘包覆件形成步骤)中，形成完全包覆电路保护结构11的绝缘包覆件20。如图12所示，将多个具有电路保护结构11的扁平导线10贴合于第一绝缘膜片21，然后以热压工艺技术将第二绝缘膜片22压合于多个扁平导线10和第一绝缘膜片21。
请参阅图13，是本申请另一实施例的具电路保护作用的扁平连接线的制造方法的流程图。请同时参阅图14至图18，其是以冲切、蚀刻或激光雕刻的工艺技术实现图13的制造方法的示意图。首先步骤S11是导电材提供步骤，在步骤S11中，提供导电材N，如图14所示，导电材N为多个导电线材，每个导电线材具有圆形截面。接着进入步骤S12。
步骤S12是线材压延步骤，在步骤S12中，如图15所示，压延多个导电线材，以形成多个扁平导线10，使线材的圆形截面变成矩形截面。接着进入步骤S13。
步骤S13是扁平导线定位步骤，在步骤S13中，如图16所示，将多个扁平导线10贴附定位于第一绝缘膜片21，以便使多个扁平导线10彼此间形成定位的状态。接着进入步骤S14。
步骤S14是电路保护结构形成步骤，在步骤S14中，如图17所示，以冲切、蚀刻或激光雕刻的工艺技术在扁平导线10的两侧形成凹槽而得到多个彼此分隔的电路保护结构11，每个所述电路保护结构11包括电路保护部112、分别连接于电路保护部112两侧的两个电路传导部111和连接电路保护部112与电路传导部111的电路连接部113。在一些实施例中，每个扁平导线10与对应的电路保护结构11是通过冲压、蚀刻或激光雕刻形成为冲压一体成型件、蚀刻一体成型件或激光雕刻一体成型件。接着进入步骤S15。
步骤S15是绝缘包覆件形成步骤，在步骤S15中，如图18所示，将第二绝缘膜片22以例如热压工艺技术压合于多个扁平导线10和第一绝缘膜片21，而形成绝缘包覆件20完全包覆电路保护结构11的结构。
请参阅图19，是本申请又另一实施例的具电路保护作用的扁平连接线的制造方法的流程图。请同时参阅图20至图25，其是以冲切的工艺技术实现图19的制造方法的示意图。本实施例的步骤S21与步骤S22与前一实施例的步骤11和步骤12相同。
步骤S21是导电材提供步骤，在步骤S21中，如图20所示，提供多个导电材N，多个导电材N为多个导电线材，每个导电线材具有圆形截面，接着进入步骤S22。
步骤S22是线材压延步骤，在步骤S22中，如图21所示，压延多个导电线材，以形成多个扁平导线10，使线材的圆形截面变成矩形截面。接着进入步骤S23。
步骤S23是扁平导线定位步骤，在步骤S23中，如图22所示，将多个扁平导线10贴合于定位膜片30，使得多个扁平导线10定位于定位膜片30，彼此间形成预定的距离。可以使用一个定位膜片30贴合在多个扁平导线10的一侧，或者是使用两个定位膜片30贴合在多个扁平导线10的相对两侧。接着进入步骤S24。
步骤S24是电路保护结构形成步骤，在步骤S24中，如图23所示，以冲切的工艺技术在扁平导线10的两侧形成凹槽而得到多个彼此分隔的电路保护结构11，扁平导线10与对应的电路保护结构11形成为冲压一体成型件，定位膜片30在电路保护结构11的两侧也同时形成冲孔。接着进入步骤S25。
步骤S25是定位膜片移除步骤，在步骤S25中，如图24所示，将定位膜片30从扁平导线10移除。接着进入步骤S26。
步骤S26是绝缘包覆件形成步骤，在步骤S26中，如图25所示，将第一绝缘膜片21和第二绝缘膜片22以例如热压工艺技术压合于多个扁平导线10和电路保护结构11，而形成绝缘包覆件20完全包覆电路保护结构11的结构。
在另一实施例中,也可以省略步骤S25的定位膜片移除步骤，从步骤S24直 接进入步骤S26，将第一绝缘膜片21和第二绝缘膜片22直接覆盖定位膜片30，然后以热压工艺将第一绝缘膜片21和第二绝缘膜片22连同定位膜片30一起压合于多个扁平导线10和电路保护结构11。在一些实施例中，步骤S25的定位膜片移除步骤，可以是在有一个定位膜片30的情况下，先贴附第一绝缘膜片21于扁平导线10和电路保护结构11没有定位膜片30的一侧，再移除定位膜片30，再先贴附第二绝缘膜片22；也可以是在有两个定位膜片30的情况下，先移除有一个定位膜片30，并于被移除定位膜片30的一侧先贴附第一绝缘膜片21，再移除另一个定位膜片30，再先贴附第二绝缘膜片22。
因此以图3、图13或图19所示的三个制造方法的实施例都可以得到如图1和图2所示的具电路保护作用的扁平连接线1。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (20)

  1. 一种具电路保护作用的扁平连接线,其特征在于,包括：
    多个扁平导线，配置成彼此平行延伸且相隔预定的距离,每个所述扁平导线包括至少一个电路保护结构,至少一个所述电路保护结构包括两个电路传导部、设置于两个所述电路传导部间的电路保护部和分别连接于两个所述电路传导部与两个所述电路保护部之间的两个电路连接部,所述电路传导部具有第一线宽，所述电路保护部具有第二线宽，所述第一线宽大于所述第二线宽；
    绝缘包覆件，多个所述扁平导线设置于所述绝缘包覆件内，且所述绝缘包覆件覆盖多个所述扁平导线的所述电路保护结构；
    其中每个所述扁平导线的所述电路保护部的位置与相邻的所述扁平导线的所述电路保护部的位置在与所述扁平导线延伸方向正交的方向上是彼此错开。
  2. 如权利要求1所述的具电路保护作用的扁平连接线，其特征在于，全部的所述扁平导线的所述电路保护部的位置在与所述扁平导线延伸方向正交的方向上是彼此错开。
  3. 如权利要求1所述的具电路保护作用的扁平连接线，其特征在于，每个所述电路连接部的线宽从连接所述电路保护部的一端到连接所述电路传导部的一端逐渐增加。
  4. 如权利要求3所述的具电路保护作用的扁平连接线，其特征在于，每个所述电路连接部呈现锥形，且所述锥形的锥度范围为30至60度。
  5. 如权利要求3或4所述的具电路保护作用的扁平连接线，其特征在于，所述第二线宽为第一线宽的1/8至1/12。
  6. 如权利要求4所述的具电路保护作用的扁平连接线，其特征在于，所述第二线宽为第一线宽的1/10，且所述第二线宽等于每个所述扁平导线的厚度。
  7. 如权利要求1所述的具电路保护作用的扁平连接线，其特征在于，所述绝缘包覆件包括两个相对设置的第一绝缘膜片和第二绝缘膜片，所述第一绝缘膜片和所述第二绝缘膜片夹持且包覆多个所述扁平导线。
  8. 如权利要求1所述的具电路保护作用的扁平连接线，其特征在于，每个所述扁平导线与对应的所述电路保护结构为冲压一体成型件、蚀刻一体成型件或激光雕刻一体成型件。
  9. 一种具电路保护作用的扁平连接线的制造方法，其特征在于，包括下列步骤：
    导电材提供步骤：提供导电材；
    电路保护结构形成步骤：从所述导电材的至少一部分形成多个彼此分隔的电路保护结构，每个所述电路保护结构包括电路保护部、分别连接于所述电路 保护部两侧的两个电路传导部和连接于所述电路保护部与所述电路传导部之间的电路连接部；
    绝缘包覆件形成步骤：形成完全包覆所述电路保护结构的绝缘包覆件；
    其中所述电路传导部具有第一线宽，所述电路保护部具有第二线宽，所述第一线宽大于所述第二线宽，每个所述电路保护结构的所述电路保护部的位置与相邻的所述电路保护结构的所述电路保护部的位置在与所述电路传导部延伸方向正交的方向上是彼此错开。
  10. 如权利要求9所述的具电路保护作用的扁平连接线的制造方法，其特征在于，所述导电材为导电板材，所述制造方法还包括扁平导线形成步骤：在所述导电材上的多个所述电路保护结构以外的部分延续形成所述电路传导部，使所述电路传导部于所述电路保护部的两侧往远离所述电路保护部的方向延伸以形成多个扁平导线。
  11. 如权利要求10所述的具电路保护作用的扁平连接线的制造方法，其特征在于，所述绝缘包覆件形成步骤包括：
    将多个具有所述电路保护结构的所述扁平导线贴合于第一绝缘膜片；
    将第二绝缘膜片压合于多个所述扁平导线和所述第一绝缘膜片。
  12. 如权利要求10所述的具电路保护作用的扁平连接线的制造方法，其特征在于，所述电路保护结构形成步骤和所述扁平导线形成步骤是分别以连续两次冲压工序实现。
  13. 如权利要求10所述的具电路保护作用的扁平连接线的制造方法，其特征在于，所述电路保护结构形成步骤和所述扁平导线形成步骤是以蚀刻或激光雕刻的工艺技术实现，而且所述电路保护结构形成步骤和所述扁平导线形成步骤是同时完成。
  14. 如权利要求9所述的具电路保护作用的扁平连接线的制造方法，其特征在于，所述导电材为多个导电线材，所述制造方法还包括线材压延步骤：压延多个所述导电线材，以形成多个扁平导线；其中每个所述电路保护结构分别形成于每个所述扁平导线。
  15. 如权利要求14所述的具电路保护作用的扁平连接线的制造方法，其特征在于，所述电路保护结构形成步骤是以冲压、蚀刻或激光雕刻的工艺技术实现。
  16. 如权利要求14所述的具电路保护作用的扁平连接线的制造方法，其特征在于，每个所述扁平导线与对应的所述电路保护结构是通过冲压、蚀刻或激光雕刻形成为冲压一体成型件、蚀刻一体成型件或激光雕刻一体成型件。
  17. 如权利要求14所述的具电路保护作用的扁平连接线的制造方法，其特征在于，还包括扁平导线定位步骤：将多个所述扁平导线贴附定位于第一绝缘 膜片；其中所述绝缘包覆件形成步骤还包括：将第二绝缘膜片贴合于多个所述扁平导线和所述第一绝缘膜片。
  18. 如权利要求14所述的具电路保护作用的扁平连接线的制造方法，其特征在于，还包括：
    扁平导线定位步骤：将多个所述扁平导线贴附定位于定位膜片；
    其中所述电路保护结构形成步骤还包括在每个所述扁平导线通过冲压的工艺技术形成所述电路保护结构，使所述扁平导线与所述电路保护结构成为冲压一体成型件；
    其中所述绝缘包覆件形成步骤还包括：将第一绝缘膜片和第二绝缘膜片贴合于多个所述扁平导线和所述电路保护结构。
  19. 如权利要求18所述的具电路保护作用的扁平连接线的制造方法，其特征在于，还包括：定位膜片移除步骤：在形成所述电路保护结构后，移除所述定位膜片。
  20. 如权利要求9所述的具电路保护作用的扁平连接线的制造方法，其特征在于，每个所述电路连接部的线宽从连接所述电路保护部的一端到连接所述电路传导部的一端逐渐增加。
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