WO2023214029A1 - Dispositif de test et procédé de traitement de composants optoélectroniques - Google Patents

Dispositif de test et procédé de traitement de composants optoélectroniques Download PDF

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Publication number
WO2023214029A1
WO2023214029A1 PCT/EP2023/061969 EP2023061969W WO2023214029A1 WO 2023214029 A1 WO2023214029 A1 WO 2023214029A1 EP 2023061969 W EP2023061969 W EP 2023061969W WO 2023214029 A1 WO2023214029 A1 WO 2023214029A1
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WO
WIPO (PCT)
Prior art keywords
test
carrier
optoelectronic components
elements
components
Prior art date
Application number
PCT/EP2023/061969
Other languages
German (de)
English (en)
Inventor
Thomas Schwarz
Markus Klein
Bernd Barchmann
Klaus Reingruber
Original Assignee
Ams-Osram International Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ams-Osram International Gmbh filed Critical Ams-Osram International Gmbh
Publication of WO2023214029A1 publication Critical patent/WO2023214029A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor
    • G01R31/2632—Circuits therefor for testing diodes
    • G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements

Definitions

  • the present invention relates to a test arrangement and a method for processing an optoelectronic component.
  • white light is often required, which is now produced with so-called white LEDs, primarily for reasons of lower power consumption.
  • the color is formed by mixed light, with two main options available.
  • RGB diodes can be used, and on the other hand, white-luminous LED light sources can be produced in which primarily blue-luminous components are coated with a yellow-emitting converter. Depending on the coating, the thickness of the converter or the light emitted, there are variations. Conscious adjustments to the color temperature are also possible.
  • the LEDs are coated with a converter during production during the so-called packaging, i.e. H . the assembly and electrical contacting of the chip into a further processable housing (package).
  • Individual chips or chip clusters are coated with converter plates or liquid-pasty converter-matrix mixtures, depending on the application and package.
  • the exact color location and thus the color temperature must then be measured by energizing the individual components. These can then be corrected by mechanical measures, such as grinding the converter material.
  • the so-called steering is relatively time-consuming, which also increases production costs. There is therefore a need for a simpler solution with which a large number of components can be tested quickly.
  • the inventors propose some special carrier concepts which enable contacting of the optoelectronic components after the converter layer has been applied, with which active color locus control can be implemented. This can be done for chips with both connections at the top, both connections at the bottom, or one connection at the top/bottom.
  • a test device for testing a large number of optoelectronic components these are attached to a temporary carrier with their respective main radiation direction facing the latter.
  • the optoelectronic components On the side facing away from the temporary carrier, the optoelectronic components comprise at least one contact area.
  • this structure is already similar to conventional techniques in which the optoelectronic components are mounted on a temporary support and are then subjected to further process steps.
  • the test device now comprises a test carrier which has a plurality of electrically conductive test elements which can be deflected perpendicular to the surface of the test carrier and which are assigned to a subset of the multitude of optoelectronic components.
  • the test elements can be moved from a starting position to a test position by the subset of optoelectronic components arranged at a distance from the test carrier.
  • the test carrier is equipped with deflectable test elements, at least one of which is assigned to one of the optoelectronic components. If the components are arranged at a defined distance above or on the test carrier, the test elements are deflected by the optoelectronic components from a starting position into a test position.
  • This process ensures that the test elements are in electrical contact with the optoelectronic components, so that a large number of these components can be tested together. It is particularly useful if the components have a slightly different height due to previous process steps when they are introduced into the tool, for example after a converter material has been doctored on. This ensures that despite different heights, all components have electrical contact with the control circuit.
  • the test device further comprises a control circuit that is designed to control the plurality of electrically conductive test elements.
  • the test carrier is designed so that it can be introduced into a tool for spraying and/or pressing together with the large number of optoelectronic components on the temporary carrier.
  • This process allows the optoelectronic components to be processed as a whole in various ways and, if necessary, also tested during or after processing. In particular, it is possible to contact the LED chips after applying a converter layer or another layer, whereby active color locus control can be achieved.
  • the test device is designed in such a way that it remains connected to the optoelectronic components during further process steps.
  • the optoelectronic components can be tested after each process step or at least several times during further processing, and on the other hand, the test device can be easily removed from the optoelectronic components after the process. In this context, it does not matter whether the optoelectronic components are previously isolated or form part of a wafer.
  • the test elements are formed by spring contacts. In some embodiments, these spring contacts are designed as pogo pins. In another embodiment, the test elements are each formed by spring needles which protrude from the surface of the test carrier at an angle of less than 90°. These spring needles can, for example, be attached, in particular soldered, to corresponding electrically conductive elements on the surface of the test carrier. It is also possible to attach these directly to the test carrier if it is itself conductive. In addition to soldering, spot welding or another type of fastening may also have been implemented.
  • the plurality of test elements are formed by a compressible conductive adhesive. This has the advantage that excess material can get into the spaces between the optoelectronic components and electrical contact is still ensured.
  • a structured support element is provided on the surface of the test carrier. This has openings that are arranged above the test elements, with a thickness of the structured support element corresponding to a height of the test position. When the optoelectronic components are placed on the structured support element, electrical contact is established via the test elements.
  • the structured support element is compressible in some aspects, so that different heights of the optoelectronic components can be compensated for. In some aspects this can be, for example, a plastic, in particular Viton or PDMS.
  • the plurality of electrically conductive test elements are connected to the one control circuit via supply lines within the test carrier.
  • a grid dimension of the test elements corresponds to a grid of the contact areas of the subset of the large number of optoelectronic components. In such a case, each of the optoelectronic components can be tested simultaneously.
  • two test elements are each assigned to an optoelectronic component, so the grid size of the test elements is smaller than the corresponding grid of the components. This is useful when contact areas of the components are opposite the light emission side.
  • the test carrier with the plurality of optoelectronic components can be removed from the tool in order to test the components.
  • the test device comprises at least one further test element, which is designed in the shape of a needle for contacting a contact area at least one optoelectronic component of the subset of optoelectronic components on a side of the at least one optoelectronic component facing away from the test carrier. This means that components can be tested individually or, if several such test needles are used, also in groups.
  • a pitch of these test needles corresponds to a pitch of the test elements on the test carrier.
  • test elements are designed as or have a conductive, compressible film. It is also conceivable to provide a conductive adhesive at some points of the test arrangement or also at some components, so that a subset of the optoelectronic components are electrically connected to the test carrier via the conductive adhesive.
  • Another aspect concerns the possibility of at least partially depositing the filling material between and on the components before it is introduced into the tool.
  • the side of one or more optoelectronic components facing away from the temporary carrier can be covered by filling material, with an area above the contact area being recessed and the recess being filled with a conductive material.
  • this filling material is dispensed, although it may not necessarily be evenly distributed after the dispensing process. By applying the test arrangement, the filling material is distributed more evenly.
  • a conductive material can be applied to the contact area.
  • This can be a conductive adhesive or another viscous conductive material that is dispensed, for example.
  • a stub, solder drop, or other conductive material is mechanically deposited on the contact area. The stub protrudes beyond the filling material in some aspects. But it is also possible that the stub or the material is below the surface of the Filling material is located. The filling material can cover the stub.
  • Some further aspects relate to a method for processing an optoelectronic component.
  • a large number of optoelectronic components are provided on a temporary carrier, with the large number of optoelectronic components having at least one contact area on a side facing away from the temporary carrier.
  • a test carrier is also provided which has a plurality of electrically conductive test elements that can be deflected perpendicular to the surface of the test carrier and can be assigned to a subset of the multitude of optoelectronic components. The test elements can be moved from a starting position to a test position by the subset of optoelectronic components arranged at a distance from the test carrier.
  • the temporary carrier is arranged on the test carrier in such a way that the test elements contact the at least one contact areas of the plurality of optoelectronic components in an electrically conductive manner. Subsequently, according to the proposed principle, the arrangement consisting of the temporary carrier and the test carrier is introduced into a tool for spraying and/or pressing and the spaces between the optoelectronic components are filled with a filling compound.
  • the filling compound can be introduced into the spaces between the optoelectronic components.
  • a more even distribution of the filling material only occurs through the step of arranging the temporary carrier on the test carrier.
  • the filling compound is first added when the arrangement has been inserted into the tool.
  • test arrangement can be designed differently.
  • the test elements are designed as pogo pins, the tip of which is pressed towards the optoelectronic components by means of a spring force.
  • a conductive and compressible film can be used as part of the test arrangement.
  • a conductive adhesive is also available, which is applied to a surface of the test arrangement. In this context, it is also conceivable to design the test arrangement to be conductive either as a whole or at least in some areas. The conductive adhesive can then also be applied to the contact area of the optoelectronic component.
  • the test arrangement comprises a structured, in particular compressible, support element on the surface of the test carrier with openings.
  • the openings are arranged above the test elements, with a thickness of the structured support element corresponding to a height of the test position.
  • the temporary carrier can be removed after the filling compound has been introduced, so that in particular an emission surface of the optoelectronic components is exposed. This can be further processed in a suitable manner. After processing, the subset of the large number of optoelectronic components can be tested for their functionality, in particular by contacting the at least one contact area. In addition, a characterization can be carried out, based on the results of which further measures and process steps can be selected and carried out.
  • the method includes applying a converter material to an emission region of the plurality of optoelectronic components. Then the color locus is given by Contacting the at least one contact area is measured. If the measured color location deviates from a predetermined color location, the applied converter material can be further processed, i.e. H . be sanded down.
  • the filling material introduced is removed again, in particular without leaving any residue.
  • the filling material can be evaporated by heating the arrangement.
  • the filler material is a resin, which may be introduced in a liquid state, or a wax or wax-like substance.
  • Figure 1 shows a first step of a test carrier for a chip level conversion with electrical contacting according to the proposed principle
  • Figure 2 shows the carrier in a suitable tool according to the proposed principle
  • Figure 3 shows the test carrier after a first fixation step and further processing according to some aspects of the proposed principle
  • Figure 4 is the arrangement with test carrier after a further process step
  • Figure 5 shows a test step for determining the color location in an arrangement according to some aspects of the proposed principle
  • Figure 6 shows a further process step according to some aspects of the proposed principle
  • Figure 7 illustrates another embodiment of a temporary support according to some aspects of the proposed principle
  • Figure 8 is a further exemplary embodiment of a test carrier with several pogo pins and optoelectronic components constructed differently than the first exemplary embodiment
  • Figure 9 shows a third exemplary embodiment of a test carrier with some aspects of the proposed principle
  • Figure 10 shows a fourth exemplary embodiment with an alternative design of a conductive film
  • FIG. 11 shows the exemplary embodiment according to FIG. 10 after a further process step according to some aspects of the proposed principle
  • Figure 12 shows a fifth exemplary embodiment of a test carrier with some aspects of the proposed principle
  • Figure 13 represents a top view of a large number of optoelectronic components with applied test structures according to the proposed principle
  • Figures 14 A) to B) show process steps for a sixth exemplary embodiment of a test carrier with some aspects of the proposed principle;
  • Figures 15 and 16 are various further process steps for the sixth exemplary embodiment of the test carrier with some aspects of the proposed principle;
  • Figures 17 A) to C) show various process steps for a seventh exemplary embodiment according to some aspects of the proposed principle
  • Figures 18 A) to C) show various process steps for an eighth exemplary embodiment according to some aspects of the proposed principle
  • Figures 19 A) to C) show exemplary embodiments for testing optoelectronic components.
  • FIG. 1 shows a temporary carrier 10 with a large number of optoelectronic components 2 attached thereto in preparation for processing with a test arrangement according to the proposed principle.
  • the temporary carrier 10 contains on its surface a holding layer on which the individual optoelectronic components are applied. In detail, these are placed and fastened with their emission area 22 on the adhesive layer 11.
  • the emission region 22 also forms the main radiation direction for the individual optoelectronic components of the arrangement.
  • the optoelectronic components include a contact area 21 which is arranged next to the emission area 22. However, as can be seen in FIG. 1, the contact area is not attached to the adhesive layer 11, but is somewhat thinner, so that there is a slight gap between the surface of the contact area 21 and the surface of the adhesive layer 11. In alternative embodiments, the contact area 21 can also rest on the adhesive layer 11.
  • each of the optoelectronic components includes a further contact region 23 on the side opposite the emission region.
  • the structure shown in Figure 1 thus forms a large number of optoelectronic components on a temporary carrier 10 out of .
  • the temporary carrier 10 with the optoelectronic components is used for further processing of the same, for example for structuring the surface 23, but also for so-called rebonding, so that the emission region 22 can be processed in further process steps.
  • the individual optoelectronic components have a slightly different layer thickness d and d '.
  • the right optoelectronic component has the lowest height of all the components shown here. This circumstance results, on the one hand, from the previous process steps, in which, for example, semiconductor layers are grown over the wafer with slightly different thicknesses during the epitaxial manufacturing process. In the case of further processing, it is necessary or It is advisable that the individual optoelectronic components can be further processed with a surface that is as uniform and uniform as possible.
  • FIG. 2 now shows a further step with the test arrangement according to the invention in an injection molding or other tool.
  • the structure with the temporary carrier and the optoelectronic components attached to it is rotated through 180° and the temporary carrier 10 is attached to the top of a tool, for example for injection molding or a further process step.
  • a test arrangement 13 is also provided, which includes a large number of individual test elements 40.
  • the test elements are designed in the form of so-called pogo pins, which are needle tips that can be deflected along the Z direction and are supported by a spring 41.
  • the tips 43 of each pogo pin are adjusted under the spring force so that they contact the contact area 23 of each optoelectronic component. Due to the spring 41, the different heights of the individual optoelectronic devices can also be adjusted in this way Compensate components so that the test elements 40 of the test arrangement 13 contact each of the optoelectronic components.
  • the test arrangement together with the temporary carrier is placed in an injection mold or another suitable tool so that the temporary carrier 10 is connected to the side 12 and the test arrangement 13 is connected to the lower side 14 .
  • An elastic filling compound 50 is now filled into the space between the individual optoelectronic components along the device 52 .
  • This filling compound is designed in such a way that it can be used in a subsequent process step after processing or can also be removed essentially without leaving any residue after testing the individual optoelectronic components. In the exemplary embodiment shown here, this mass also surrounds the area 51, i.e. H . the space between the contact element 21 and the adhesive layer 11.
  • the filling compound fixes the optoelectronic components both in the plane and in the Z direction, so that they do not shift or slip during further processing.
  • the upper region of the pressing tool 12 can then be removed together with the temporary carrier 10 and the adhesive layer 11.
  • a photoresist 30 is applied which is structured in such a way that the emission regions 22 are essentially exposed.
  • a part of the photoresist 30 forms an overlap 31 beyond the edge of the emission areas 22 and in this way can protect the contact area 21 on the one hand and the edge of the respective optoelectronic components on the other hand.
  • the test elements 40 continue to touch the contact area 23 due to their spring tension by the springs 41.
  • the layer with the photoresist 30 is applied using conventional photographic techniques and then structured.
  • a converter dye 60 is applied to the emission areas 22 (for example by rubbing) and is firmly connected to them.
  • the photoresist 30 can then be removed so that the existing overlap is now exposed and forms the edges of the emission areas 61.
  • the contact areas 21 are also exposed.
  • the test arrangement further comprises a control circuit 91, which contacts the individual optoelectronic components at their contact area 21 via a measuring needle 90 and can therefore, as shown in the example in FIG. 5, measure the converted and emitted light.
  • the color locus can now be adjusted again to a small extent by a suitable measure, for example by grinding the converter material. It is not necessary to sort or relocate the individual components, since the test arrangement 13 with its test elements 40 is still in contact with the corresponding components.
  • the measuring needle 90 is shown here as a single measuring structure, but it is understood that a large number of such structures can be provided for this process, so that a large number of optoelectronic components can also be measured at the same time. In addition to the regrinding already mentioned, other measures to correct the color location are also conceivable.
  • a further adhesive film 11a is finally applied to the surface of the corresponding converter 60.
  • the material 50 which previously fixed the optoelectronic components in the respective position, can now be removed together with the test arrangement 13.
  • a material 50 is chosen that can be removed again in the simplest possible way.
  • An example of this is a material that is lightweight Heating allows it to liquefy, remove or dissolve without leaving any residue. In this way, the material 50 is completely removed from the optoelectronic component.
  • FIG. 7 shows a further embodiment of a test arrangement according to the proposed principle.
  • compressible support elements 55 are arranged on the surface of the test carrier 13 around the openings for the test elements 40.
  • the size and position of the support elements 55 is chosen so that they are slightly larger than the optoelectronic components to be placed on them. If the optoelectronic components are now placed with their temporary carrier 10 on the support elements 55, they can be easily compressed due to the different heights of the components. This is shown in FIG. 7, for example by the middle and right optoelectronic components.
  • the middle optoelectronic component presses the compressible support element significantly deeper than the right optoelectronic component.
  • the left optoelectronic component 2 on the other hand, merely rests gently on the surface of the support surface 55.
  • the spring 41 of the test elements 40 press their tips 43 onto the contact area of the optoelectronic components.
  • the design with the support surface 55 has the advantage that it keeps the area open in the middle for the test elements 40 free of a filled material 50. As a result, the test elements 40 remain clean and free of the filled material 50, which may increase the service life and also the robustness of the carrier according to the proposed principle.
  • Figure 8 shows a further embodiment in which the individual test elements are connected to internal supply lines 42.
  • the internal supply lines 42 lead to a control circuit not shown here for reasons of clarity.
  • two test elements 40 are each assigned to an optoelectronic component.
  • the test elements 40 and their distances from one another are selected so that they contact the respective contact areas 23a and 23b on the side of the optoelectronic components facing them.
  • differences in thickness in the optoelectronic components 2 and in particular in their semiconductor body 20 are compensated for by the springs 41 of the test elements.
  • this embodiment can also be combined with the additional support surfaces 55, so that the area around the individual tips of the test elements remains free of filling material.
  • the filling material 50 is introduced along the flow direction 52 of FIG. 8, encloses the test tips 43 in this exemplary embodiment and reaches the areas between the semiconductor body 20 and the emission area 22 adjacent to the adhesive layer 11.
  • the pins shown in the previous exemplary embodiments are suitable as test elements, among other things, because the tips are always pressed onto the contact areas of the optoelectronic components via corresponding springs.
  • Figure 9 shows a related embodiment in which the test elements are designed as spring needles 45. These protrude at an angle from the surface of the carrier 13 and range from a solder pad to the contact areas 23a and 23b of the optoelectronic components.
  • the spring needles are now pressed towards the test carrier at different distances, resulting in a mechanical nic contact with the contact areas.
  • the spring needles are slightly bent in the end area towards the contact areas in order to achieve better contact.
  • the soldering pads 42c serve to fasten the spring needles 45. For example, these are soldered to the support 42c or otherwise attached to them in a mechanical and electrically conductive manner. Any desired interconnection and control of the individual spring needles 42 can be achieved via various openings 42b and further lines 42a within the test arrangement 13.
  • the contact area 23 facing the test carrier at a common potential and to test the functionality of the individual optoelectronic components with a further test element 21 for their respective functionality.
  • the surface of the test carrier 13 is covered with a compressible and at the same time electrically conductive film 70.
  • the electrically conductive film 70 is applied flatly to the surface of the test carrier 13 and has a predetermined thickness.
  • the film 70 is pressed in to different depths due to the different thicknesses of the semiconductor bodies 20.
  • the excess material of the film 70 is thereby pressed into the areas between the individual optoelectronic components and forms bulges 72 there.
  • the electrically conductive film 70 can be contacted from the outside, so that the components are connected to a common electrical potential.
  • the conductive film includes, for example, carbon, conductive silver or other conductive materials.
  • FIG. 11 shows an exemplary embodiment in which a conductive adhesive 73 is applied to the contact 21 and to the filling material 50 adjacent thereto.
  • This conductive adhesive can now be guided outwards along the filling material 50 so that various components can be tested in this way. These components can be declared as sacrificial components, i.e. H . These are removed after processing has ended. This is particularly useful if the conductive adhesive on the contact area 21 can no longer be removed without leaving any residue or if only a small number of components are to be tested.
  • Figure 13 shows a top view of such an embodiment in which the optoelectronic components are arranged in rows and columns.
  • the contact areas 21 adjacent to the emission surface 22 are now contacted via various lines 73. It is not possible to test every single component, but rather only selected ones in a periodic sequence, as shown in Figure 13. As a result, a large number of optoelectronic components can be characterized in their color location with relatively little effort and then, depending on the characterization, further measures can be carried out to adapt the color location.
  • test carrier itself can also be implemented with an electrically conductive material, so that the contact areas 23 can be contacted via a conductive adhesive 75.
  • Figure 12 shows such an embodiment in which a compressible conductive adhesive 75 is arranged at regular intervals on the surface of the carrier 13.
  • the conductive adhesive 75 is compressed to different degrees due to the different heights and thus creates an electrically conductive adhesive Connection between the contact area 23 and the electrically conductive test carrier 13.
  • some of the optoelectronic components are selected randomly distributed over the carrier 10 and prepared as “measuring chips”.
  • the back sides of the selected measuring chips are then provided with a drop of conductive adhesive 75.
  • the test arrangement 13 can be arranged and the filling material is applied using a FAM or VIM process and hardened together with the glue drops 75.
  • all glue points are also leveled. All backs of the components and gaps are filled with material 50, only the top of the glue points is free
  • the resulting composite can now be detached from the carrier 10 and further processed.
  • the contact area in order to enable further processing into the finished package, the contact area must be protected, for example by spraying or other methods, before the converter layer is applied. To do this, it is necessary to expose it again afterwards in order to be able to test the component.
  • FIG. 14 A) to B) show such an embodiment, in which several optoelectronic components, each with their emission area and their contact area 21, are applied to a temporary carrier 10a.
  • some of the components have different heights.
  • the components are now completely surrounded by a material 15, so that the surface of the components is also covered by it.
  • the material 15 can be the same material 50 as in the other versions. This allows the material to be removed without leaving any residue after processing.
  • some optoelectronic components are selected as sacrificial elements and the surface is exposed again by means of a laser or mechanically, so that an opening 15a is created in the material 15. This is done using a laser that dissolves and removes the material at this point.
  • the resulting opening lies above a contact area of the component 2 and thus allows the optoelectronic component to be contacted.
  • An electrically conductive material for example a conductive adhesive 71, is filled into the resulting opening 15a and the contact area is thus contacted.
  • FIG. 15 shows the subsequent step in which the test arrangement 13 and an electrically conductive and compressible film 70a are applied to the surface of the material 15 and the conductive layer in the opening.
  • the material in the opening 15a is contacted with the conductive film 70a and the structure is thus prepared for further process steps.
  • Excess adhesive 71 is pressed into the film so that sufficient electrical contact is ensured.
  • the conductive material is in the form of a conductive adhesive 71, so that after testing the component remains as a sacrificial component.
  • FIG. 16 An alternative embodiment is shown in FIG. 16, in which the arrangement 13 has a conductive and at the same time compressible adhesive film 71b. This is pressed into the opening 15a when the temporary carrier 10a with the optoelectronic components 2 is placed and pressed on and thus contacts the component.
  • the advantage of this arrangement is that no additional application step is necessary. Depending on the film 70b used, it can also be removed without leaving any residue, so that further use of the component remains possible.
  • FIGS 17A to 17C show a further embodiment in which both the conductive adhesive 71 and the filling material 15 are applied using a so-called dispensing process. This process creates droplet-shaped structures in and around the components, in particular the filling material 15 being applied (“dispense”) so that the contact areas on the surface of the component remain free. This process is possible in various ways.
  • a larger amount of filler material 15 is applied to the surface of the components by means of a further dispensing process. This takes place in areas around the adhesive points 71, with the amount of material 15 being adjustable. Alternatively, these steps can also be reversed so that first the filling material 15 is placed around the contact areas and then the adhesive dots 71 are placed.
  • the hard and electrically conductive test arrangement 13 is then positioned and pressed onto the filling material 15 and the not yet hardened points 72 with the electrically conductive material. This flattens the individual materials as shown in FIG. 17C, leaving a substantially uniform surface. This can then be hardened. In further process steps, the temporary carrier 10a is removed in order to further process the component.
  • an opening 15a is made on the surface of one of the components and a stub S is bonded there.
  • the length of the stub is chosen so that when the carrier 13 is subsequently arranged with the conductive film, the material of the stub is bent and pressed into the conductive film, without at the same time the contact itself with the contact area or to damage the semiconductor body.
  • the photoresist layer is detached and completely removed, so that the contact area 21 is exposed again next to the emission area 22 of the optoelectronic component.
  • the measuring process can also be carried out with photoresist applied.
  • FIGs 19A) to 19C) show various embodiments in which testing of the optoelectronic component with applied photoresist is possible.
  • the measuring device 90 pierces the photoresist and in this way directly contacts the contact area 21 of the component.
  • this requires that the thickness of the photoresist layer and the position of the contact area 21 be determined with sufficient precision so that the needle 90 also reliably contacts the contact area at a predetermined penetration depth.
  • partial figure 19B allows improved contacting, since the material of the photoresist layer above the contact area 21 is completely removed by means of a laser or another mechanical measure.
  • the measuring needle 90 or The test element can now contact the optoelectronic component from above and thus precisely determine the color location, for example.
  • a sacrificial component is included a stub S which protrudes vertically upwards to the surface of the photoresist.
  • the stub S projects beyond the surface of the photoresist layer or of the converter material, but can always be reached from the outside through the measuring needle.
  • the top of the stub S can be freed using a laser to ensure secure contact. After testing, the component must be removed as it is no longer suitable for further use.
  • a wax or a liquid resin can be used as a filling material for the above-mentioned embodiments.
  • the former can be deformed depending on the temperature and can be converted into a gaseous state at relatively low temperatures and thus removed without leaving any residue.
  • a resin can easily be removed chemically.
  • material in or around the sacrificial layers does not need to be completely removed.
  • the test carrier 13 can consist of a hard and non-compressible material.
  • compressible elements should be provided between the contact areas of the components and the test carrier. These can be the suggested measuring needles, measuring syringes or compressible films.
  • the test carrier itself is made of plastic and is therefore compressible to a certain extent.
  • the support elements can be part of the test carrier or can also be applied to it subsequently.

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  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

L'invention concerne un dispositif de test pour tester une pluralité de composants optoélectroniques (2), qui sont fixés à un support temporaire (10, 10a), leur direction de rayonnement principale respective (22) faisant face à ce dernier, et les composants ont au moins une région de contact (23, 23a) sur un côté opposé au support temporaire (10, 10a). Le dispositif de test comprend un support de test (13), qui comporte une pluralité d'éléments de test électriquement conducteurs (40, 45, 70) pouvant être déviés perpendiculairement à la surface du support de test, qui sont attribués à un sous-ensemble de la pluralité de composants optoélectroniques (13) ; les éléments de test (40, 45, 70) sont mobiles d'une position initiale à une position de test au moyen du sous-ensemble de composants optoélectroniques (2) agencés à une certaine distance du support de test (13). Un circuit d'excitation (91) est conçu pour exciter la pluralité d'éléments de test électriquement conducteurs (40) ; et le support de test (13) est adapté pour être placé dans un système (12, 14) pour l'injection et/ou la compression conjointement avec la pluralité de composants optoélectroniques (2) sur le support temporaire (10).
PCT/EP2023/061969 2022-05-05 2023-05-05 Dispositif de test et procédé de traitement de composants optoélectroniques WO2023214029A1 (fr)

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DE102022111178.4A DE102022111178A1 (de) 2022-05-05 2022-05-05 Testvorrichtung und verfahren zum prozessieren optoelektronischer bauelemente
DE102022111178.4 2022-05-05

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012106949A1 (de) * 2012-07-30 2014-01-30 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauteils
US20140106480A1 (en) * 2010-12-22 2014-04-17 Samsung Electronics Co., Ltd. Method and apparatus for depositing phosphor on semiconductor-light emitting device
DE102016114459A1 (de) * 2016-08-04 2018-02-08 Osram Opto Semiconductors Gmbh Verfahren und Vorrichtung zur Vermessung einer Vielzahl an Halbleiterchips in einem Waferverbund
EP2462633B1 (fr) * 2009-08-07 2018-09-05 OSRAM Opto Semiconductors GmbH Procédé de fabrication d'un composant semiconducteur optoélectronique et composant semiconducteur optoélectronique

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203054014U (zh) 2013-01-30 2013-07-10 杭州远方光电信息股份有限公司 一种发光二极管的固定装置
DE102019107138A1 (de) 2019-03-20 2020-09-24 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren und vorrichtung zum elektrischen kontaktieren von bauelementen in einem halbleiterwafer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2462633B1 (fr) * 2009-08-07 2018-09-05 OSRAM Opto Semiconductors GmbH Procédé de fabrication d'un composant semiconducteur optoélectronique et composant semiconducteur optoélectronique
US20140106480A1 (en) * 2010-12-22 2014-04-17 Samsung Electronics Co., Ltd. Method and apparatus for depositing phosphor on semiconductor-light emitting device
DE102012106949A1 (de) * 2012-07-30 2014-01-30 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauteils
DE102016114459A1 (de) * 2016-08-04 2018-02-08 Osram Opto Semiconductors Gmbh Verfahren und Vorrichtung zur Vermessung einer Vielzahl an Halbleiterchips in einem Waferverbund

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