WO2023210301A1 - サーマルプリントヘッド、およびサーマルプリントヘッドの製造方法 - Google Patents

サーマルプリントヘッド、およびサーマルプリントヘッドの製造方法 Download PDF

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Publication number
WO2023210301A1
WO2023210301A1 PCT/JP2023/014362 JP2023014362W WO2023210301A1 WO 2023210301 A1 WO2023210301 A1 WO 2023210301A1 JP 2023014362 W JP2023014362 W JP 2023014362W WO 2023210301 A1 WO2023210301 A1 WO 2023210301A1
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WIPO (PCT)
Prior art keywords
main surface
layer
base material
print head
thermal print
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Ceased
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PCT/JP2023/014362
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English (en)
French (fr)
Japanese (ja)
Inventor
吾郎 仲谷
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Rohm Co Ltd
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Rohm Co Ltd
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Priority to JP2024517945A priority Critical patent/JPWO2023210301A1/ja
Publication of WO2023210301A1 publication Critical patent/WO2023210301A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads

Definitions

  • the present disclosure relates to a thermal print head and a method of manufacturing the same.
  • the thermal print head is the main component of a thermal printer that prints on recording media such as thermal paper.
  • Patent Document 1 discloses an example of a thermal print head.
  • the thermal print head includes a substrate, a common electrode and a plurality of individual electrodes disposed on the substrate, and a heating resistor electrically connected to the common electrode and the plurality of individual electrodes. Dots are printed on the recording medium by selectively generating heat in the heating resistor as a result of electricity passing through the common electrode and the plurality of individual electrodes.
  • the thermal print head disclosed in Patent Document 1 further includes a glaze layer.
  • the heating resistor is placed on the glaze layer.
  • the glaze layer protrudes from the substrate.
  • the heat from the heating resistor can be transmitted to the recording medium while suppressing the contact area of the recording medium with the thermal print head, so that the quality of printing on the recording medium can be improved.
  • the material of the substrate of the thermal print head contains alumina, the heat storage performance of the substrate is low. Particularly in cold regions, if the heat storage performance of the substrate is low, the power consumption of the thermal print head increases. Therefore, in order to suppress the increase in power consumption of the thermal print head, it is required to improve the heat storage performance of the substrate.
  • An object of the present disclosure is to provide a thermal print head that is improved over conventional ones.
  • the present disclosure provides a thermal print head that can improve the heat storage performance of a base material while improving printing quality, and provides a method for manufacturing such a thermal print head. Our number one challenge is to do so.
  • a thermal print head provided by a first aspect of the present disclosure includes a base material, a glaze layer covering one side of the base material in a first direction, and a base material with respect to the glaze layer in the first direction.
  • the resistor layer includes a plurality of heat generating parts located on the opposite side of the resistor layer, and a wiring layer electrically connected to the plurality of heat generating parts and disposed in contact with the resistor layer.
  • the plurality of heat generating parts are arranged along a second direction orthogonal to the first direction.
  • the composition of the base material includes silicon dioxide, and the base material has a first main surface facing the one side in the first direction, and a second main surface facing the same side as the first main surface in the first direction. It has a main surface and a third main surface.
  • the glaze layer covers the first main surface.
  • the second main surface and the third main surface are located opposite to each other with respect to the first main surface in a third direction perpendicular to the first direction and the second direction.
  • the position of each of the second main surface and the third main surface in the first direction is different from the position of the first main surface in the first direction.
  • a method for manufacturing a thermal print head includes the steps of: forming a base material; forming a glaze layer covering one side of the base material in a first direction; forming a resistor layer on the glaze layer including a plurality of heat generating parts arranged along a second direction perpendicular to the direction; and forming a wiring layer electrically connected to the plurality of heat generating parts on the resistor layer. forming the layer in contact with the layer.
  • the composition of the substrate includes silicon dioxide.
  • the second main surface and the third main surface are located opposite to each other with respect to the first main surface in a third direction perpendicular to the first direction and the second direction.
  • the position of each of the second main surface and the third main surface in the first direction is different from the position of the first main surface in the first direction.
  • thermo print head that can improve the heat storage performance of the base material while improving the printing quality.
  • FIG. 1 is a plan view of a thermal print head according to a first embodiment of the present disclosure.
  • FIG. 2 is a plan view of essential parts of the thermal print head shown in FIG. 1.
  • FIG. 3 is a partially enlarged view of FIG. 2.
  • FIG. 4 is a cross-sectional view taken along line IV-IV in FIG.
  • FIG. 5 is a sectional view of essential parts of the thermal print head shown in FIG. 1.
  • FIG. 6 is a partially enlarged view of FIG. 5, showing the first groove provided in the base material and its vicinity.
  • FIG. 7 is a partially enlarged view of FIG. 5, showing the second groove provided in the base material and its vicinity.
  • FIG. 8 is a cross-sectional view illustrating the manufacturing process of the main parts of the thermal print head shown in FIG. 1.
  • FIG. 1 is a plan view of essential parts of the thermal print head shown in FIG. 1.
  • FIG. 3 is a partially enlarged view of FIG. 2.
  • FIG. 4 is a cross-sectional view taken along
  • FIG. 9 is a cross-sectional view illustrating the manufacturing process of the main parts of the thermal print head shown in FIG. 1.
  • FIG. 10 is a partially enlarged view of FIG. 8.
  • FIG. 11 is a partially enlarged view of FIG. 9.
  • FIG. 12 is a cross-sectional view illustrating the manufacturing process of the main parts of the thermal print head shown in FIG. 1.
  • FIG. 13 is a cross-sectional view illustrating the manufacturing process of the main parts of the thermal print head shown in FIG. 1.
  • FIG. 14 is a cross-sectional view illustrating the manufacturing process of the main parts of the thermal print head shown in FIG. 1.
  • FIG. 15 is a cross-sectional view illustrating the manufacturing process of the main parts of the thermal print head shown in FIG. 1.
  • FIG. 16 is a cross-sectional view illustrating the manufacturing process of the main parts of the thermal print head shown in FIG. 1.
  • FIG. 17 is a cross-sectional view of main parts of a thermal print head according to a second embodiment of the present disclosure.
  • FIG. 18 is a partially enlarged view of FIG. 17.
  • FIG. 19 is a cross-sectional view illustrating the manufacturing process of the main parts of the thermal print head shown in FIG. 17.
  • FIG. 20 is a cross-sectional view illustrating the manufacturing process of the main parts of the thermal print head shown in FIG. 17.
  • FIG. 21 is a cross-sectional view illustrating the manufacturing process of the main parts of the thermal print head shown in FIG. 17.
  • FIG. 22 is a cross-sectional view of main parts of a thermal print head according to a third embodiment of the present disclosure.
  • FIG. 23 is a cross-sectional view illustrating the manufacturing process of the main parts of the thermal print head shown in FIG. 22.
  • FIG. 24 is a cross-sectional view illustrating the manufacturing process of the main parts of the thermal print head shown in FIG. 22.
  • a thermal print head A10 forms the main part of the thermal printer.
  • the thermal print head A10 is composed of a main part and an auxiliary part.
  • the main parts of the thermal print head A10 include a base material 1, a glaze layer 2, a resistor layer 3, a wiring layer 4, and a protective layer 5.
  • the accompanying portion of the thermal print head A10 includes a wiring board 71, a heat radiation member 72, a plurality of drive elements 73, a plurality of first wires 74, a plurality of second wires 75, a sealing resin 76, and a connector 77.
  • illustration of the protective layer 5 is omitted.
  • illustration of the protective layer 5 is omitted for convenience of understanding.
  • first direction z the normal direction of the first main surface 11 of the base material 1, which will be described later, will be referred to as "first direction z.”
  • the main scanning direction of the thermal print head A10 is referred to as a "second direction x.”
  • the sub-scanning direction of the thermal print head A10 is referred to as a "third direction y.”
  • the first direction z is perpendicular to the second direction x and the third direction y.
  • the base material 1, which forms the main part of the thermal print head A10 is joined to the heat radiating member 72. Furthermore, the wiring board 71 is located next to the base material 1 in the third direction y. The wiring board 71 is joined to the heat dissipating member 72 like the base material 1.
  • a plurality of heat generating parts 31 (details will be described later) are formed which form part of the resistor layer 3 and are arranged along the second direction x.
  • the plurality of heat generating parts 31 selectively generate heat by the plurality of drive elements 73 mounted on the wiring board 71.
  • the plurality of drive elements 73 are driven based on print signals transmitted from the outside via the connector 77.
  • the thermal printer includes a thermal print head A10 and a platen roller 79, as shown in FIG.
  • the platen roller 79 is a roller-like mechanism that feeds out a recording medium such as thermal paper.
  • the platen roller 79 presses the recording medium against the plurality of heat generating parts 31 of the resistor layer 3, the plurality of heat generating parts 31 print on the recording medium.
  • the base material 1 has a rectangular shape extending in the second direction x. Therefore, the second direction x corresponds to the long side direction of the base material 1.
  • the third direction y corresponds to the short side direction of the base material 1.
  • the composition of the base material 1 includes silicon dioxide (SiO 2 ). In the thermal print head A10, the silicon dioxide is distributed throughout the base material 1.
  • the material of the base material 1 is, for example, quartz glass.
  • the material of the base material 1 is preferably a material in which the weight percentage (wt%) of silicon dioxide in the base material 1 is as high as possible, such as quartz glass.
  • the base material 1 has electrical insulation properties.
  • the thermal conductivity of the base material 1 is less than 10 W/(m ⁇ K), which is higher than the thermal conductivity of aluminum oxide (Al 2 O 3 ) (approximately 30 W/(m ⁇ K)) and the thermal conductivity of silicon (Si). (approximately 170 W/(m ⁇ K)).
  • the base material 1 has a first main surface 11, a second main surface 12, a third main surface 13, and a back surface 19.
  • the first main surface 11 faces one side in the first direction z.
  • the second main surface 12 and the third main surface 13 face the same side as the first main surface 11 in the first direction z.
  • the second main surface 12 and the third main surface 13 are located on opposite sides of the first main surface 11 in the third direction y.
  • the back surface 19 faces the opposite side to the first main surface 11 in the first direction z.
  • the base material 1 is provided with a first groove 16 recessed from one side in the first direction z. As shown in FIG. 3, the first groove 16 extends in the second direction x. The second main surface 12 is defined by the first groove 16 . Therefore, the position of the second main surface 12 in the first direction z is different from the position of the first main surface 11 in the first direction z.
  • the second main surface 12 is further away from the plurality of heat generating parts 31 of the resistor layer 3 than the first main surface 11 is.
  • a dimension L2 of the second major surface 12 in the third direction y is smaller than a dimension L1 of the first major surface 11 in the third direction y.
  • the dimension L2 is larger than the distance between the first main surface 11 and the second main surface 12 in the first direction z.
  • the base material 1 has a fourth main surface 14.
  • the fourth main surface 14 faces the same side as the first main surface 11 in the first direction z.
  • the fourth main surface 14 is located on the opposite side of the first main surface 11 with respect to the second main surface 12 in the third direction y. Therefore, the first main surface 11 and the fourth main surface 14 are separated by the first groove 16.
  • the position of the fourth main surface 14 in the first direction z is equal to the position of the first main surface 11 in the first direction z.
  • the base material 1 is provided with a second groove 17 recessed from one side in the first direction z.
  • the second groove 17 extends in the second direction x.
  • the third main surface 13 is defined by the second groove 17 . Therefore, the position of the third main surface 13 in the first direction z is different from the position of the first main surface 11 in the first direction z.
  • the first main surface 11 is defined by a region of the base material 1 located between the first groove 16 and the second groove 17 in the third direction y.
  • the third main surface 13 is further away from the plurality of heat generating parts 31 of the resistor layer 3 than the first main surface 11 is.
  • a dimension L3 of the third main surface 13 in the third direction y is smaller than a dimension L1 of the first main surface 11 in the third direction y.
  • the dimension L3 is larger than the distance between the first main surface 11 and the third main surface 13 in the first direction z.
  • the base material 1 has a fifth main surface 15.
  • the fifth main surface 15 faces the same side as the first main surface 11 in the first direction z.
  • the fifth main surface 15 is located on the opposite side of the first main surface 11 with respect to the third main surface 13 in the third direction y. Therefore, the first main surface 11 and the fifth main surface 15 are separated by the second groove 17.
  • the position of the fifth main surface 15 in the first direction z is equal to the position of the first main surface 11 in the first direction z.
  • Glaze layer 2 covers first main surface 11 of base material 1, as shown in FIG.
  • Glaze layer 2 is made of a material containing amorphous glass.
  • the amorphous glass is, for example, SiO 2 --BaO--Al 2 O 3 --SnO--ZnO glass. Therefore, the glaze layer 2 is transparent or white.
  • the glass transition point of the glaze layer 2 is approximately 680°C. The glass transition point of the glaze layer 2 is lower than that of the base material 1.
  • the glaze layer 2 bulges toward the side toward which the first main surface 11 of the base material 1 faces in the first direction z.
  • the periphery of the portion of the glaze layer 2 on the side where the plurality of heat generating parts 31 of the resistor layer 3 are located than the first main surface 11 in the first direction z forms a convex curve. .
  • the glaze layer 2 is in contact with the first boundary 111.
  • the first boundary 111 corresponds to the boundary between the first main surface 11 and the second main surface 12 of the base material 1 when viewed in the first direction z.
  • the first boundary 111 is included in the first main surface 11 .
  • the glaze layer 2 is in contact with the second boundary 112.
  • the second boundary 112 corresponds to the boundary between the first main surface 11 and the third main surface 13 of the base material 1 when viewed in the first direction z.
  • the second boundary 112 is included in the second main surface 12.
  • the resistor layer 3 includes the second main surface 12, the third main surface 13, the fourth main surface 14, and the fifth main surface 15 of the base material 1, and the glaze layer 2. covered. Therefore, the glaze layer 2 is located between the base material 1 and the resistor layer 3 in the first direction z.
  • the resistor layer 3 is made of tantalum nitride (TaN), for example.
  • An example of the thickness of the resistor layer 3 is 0.02 ⁇ m or more and 0.1 ⁇ m or less.
  • the resistor layer 3 includes a plurality of heat generating parts 31.
  • the plurality of heat generating parts 31 are parts exposed from the wiring layer 4.
  • the plurality of heat generating parts 31 are located on the opposite side of the base material 1 with respect to the glaze layer 2 in the first direction z. Therefore, the plurality of heat generating parts 31 overlap the glaze layer 2 when viewed in the first direction z.
  • the plurality of heat generating parts 31 are in contact with the glaze layer 2.
  • the plurality of heat generating parts 31 are arranged along the second direction x. Among the plurality of heat generating parts 31, two heat generating parts 31 adjacent to each other in the second direction x are located apart from each other. As shown in FIG. 4, the plurality of heat generating parts 31 face the platen roller 79. By selectively energizing the plurality of heat generating parts 31 from the wiring layer 4, the plurality of heat generating parts 31 locally heat the recording medium.
  • the wiring layer 4 is arranged in contact with the resistor layer 3, as shown in FIGS. 5 to 7.
  • the wiring layer 4 is electrically connected to the plurality of heat generating parts 31 of the resistor layer 3.
  • the electrical resistivity of the wiring layer 4 is lower than that of the resistor layer 3.
  • the wiring layer 4 is a metal layer made of copper (Cu), for example.
  • An example of the thickness of the wiring layer 4 is 0.3 ⁇ m or more and 2.0 ⁇ m or less.
  • the wiring layer 4 may be configured to include two metal layers: a titanium (Ti) layer laminated on the resistor layer 3 and a copper layer laminated on the titanium layer.
  • An example of the thickness of the titanium layer in this case is 0.1 ⁇ m or more and 0.2 ⁇ m or less.
  • the wiring layer 4 is located away from the periphery of the base material 1.
  • the wiring layer 4 includes a common wiring 41 and a plurality of individual wirings 42.
  • the common wiring 41 is located on the opposite side of the plurality of drive elements 73 with respect to the plurality of heat generating parts 31 of the resistor layer 3 in the third direction y.
  • the plurality of individual wirings 42 are located on the opposite side of the common wiring 41 with respect to the plurality of heat generating parts 31 in the third direction y.
  • the common wiring 41 is electrically connected to the plurality of heat generating parts 31.
  • the plurality of individual wirings 42 are electrically connected to the plurality of heat generating parts 31 individually.
  • the common wiring 41 has a base 411 and a plurality of extensions 412 connected to the base 411.
  • the base portion 411 is located on the opposite side of the plurality of heat generating portions 31 of the resistor layer 3 with respect to the plurality of extension portions 412 in the third direction y.
  • the base 411 has a band shape extending in the second direction x.
  • the plurality of extension parts 412 are band-shaped and extend from the end of the base part 411 facing the glaze layer 2 toward the plurality of heat generating parts 31 in the third direction y.
  • the plurality of extension parts 412 are arranged along the second direction x. A portion of each of the plurality of extensions 412 is located above the glaze layer 2 .
  • each of the plurality of individual wirings 42 has a base 421 and an extension 422 connected to the base 421.
  • the base portion 421 is located on the opposite side of the plurality of heat generating portions 31 of the resistor layer 3 with respect to the extension portion 422 in the third direction y.
  • the base portions 421 of each of the plurality of individual wirings 42 form two rows separated from each other in the third direction y. Each of the two columns is arranged along the second direction x. In the row located closest to the plurality of heat generating portions 31 among the two rows, the extension portion 422 is located between two adjacent base portions 421 .
  • the extending portion 422 has a band shape extending from the end of the base portion 421 facing the glaze layer 2 toward the plurality of heat generating portions 31 in the third direction y.
  • the extending portions 422 of each of the plurality of individual wirings 42 are arranged along the second direction x. A portion of each extending portion 422 of the plurality of individual wirings 42 is located on the glaze layer 2 . In each of the plurality of individual wirings 42, a current flows from one of the plurality of heat generating parts 31 to the base 421 via the extension part 422.
  • each of the plurality of heat generating parts 31 When viewed in the first direction z, each of the plurality of heat generating parts 31 is sandwiched between one of the extension parts 422 of the plurality of individual wirings 42 and one of the plurality of extension parts 412 of the common wiring 41. .
  • the configurations of the wiring layer 4 and the plurality of heat generating parts 31 shown in FIGS. 2 and 3 are examples. Therefore, the configurations of the wiring layer 4 and the plurality of heat generating parts 31 in the present disclosure are not limited to the configurations shown in FIGS. 2 and 3.
  • the protective layer 5 covers the plurality of heat generating parts 31 of the resistor layer 3 and a part of the wiring layer 4, as shown in FIG.
  • the protective layer 5 has electrical insulation properties.
  • the composition of the protective layer 5 includes silicon.
  • the protective layer 5 is made of, for example, either silicon dioxide or silicon nitride (Si 3 N 4 ). Alternatively, the protective layer 5 may be a laminate made of multiple types of these substances.
  • a recording medium is pressed against a portion of the protective layer 5 that covers the plurality of heat generating parts 31 by a platen roller 79 shown in FIG.
  • the protective layer 5 has a wiring opening 51.
  • the wiring opening 51 penetrates the protective layer 5 in the first direction z. From the wiring opening 51, the base portion 421 of each of the plurality of individual wirings 42 and a part of the extension portion 422 of each of the plurality of individual wirings 42 are exposed.
  • the wiring board 71 is located next to the base material 1 in the third direction y. As shown in FIG. 1, when viewed in the first direction z, the plurality of individual wirings 42 are located between the plurality of heat generating parts 31 of the resistor layer 3 and the wiring board 71 in the third direction y. The area of the wiring board 71 is larger than the area of the base material 1 when viewed in the first direction z. Further, when viewed in the first direction z, the wiring board 71 has a rectangular shape with the second direction x as the longitudinal direction.
  • the wiring board 71 is, for example, a PCB (Printed Circuit Board) board.
  • a plurality of drive elements 73 and a connector 77 are mounted on the wiring board 71.
  • the heat dissipation member 72 faces the back surface 19 of the base material 1, as shown in FIG.
  • the back surface 19 is joined to the heat radiating member 72.
  • the wiring board 71 is joined to the heat dissipation member 72 by a fastening member such as a screw.
  • a fastening member such as a screw.
  • the plurality of drive elements 73 are mounted on the wiring board 71 via an electrically insulating die bonding material (not shown).
  • the plurality of drive elements 73 are semiconductor elements configured with various circuits.
  • One end of the plurality of first wires 74 and one end of the plurality of second wires 75 are electrically connected to the plurality of drive elements 73 .
  • the other ends of the plurality of first wires 74 are individually conductively bonded to the base portions 421 of the plurality of individual wirings 42 .
  • the other ends of the plurality of second wires 75 are conductively bonded to wiring (not shown) provided on the wiring board 71 and electrically connected to the connector 77 .
  • electrical signals related to printing and electrical signals related to control of the plurality of drive elements 73 are inputted to the plurality of drive elements 73 from the outside via the connector 77.
  • the plurality of drive elements 73 selectively apply voltages to the plurality of individual wirings 42 based on these electric signals. Furthermore, a constant voltage is applied to the common wiring 41 from the outside via the connector 77. In this case, when a potential difference is generated between the common wiring 41 and any of the plurality of individual wirings 42, the plurality of heat generating parts 31 of the resistor layer 3 selectively generate heat.
  • the sealing resin 76 covers the plurality of drive elements 73, the plurality of first wires 74, and the plurality of second wires 75. Furthermore, the sealing resin 76 covers a part of the fourth main surface 14 of the base material 1 , a part of the wiring board 71 , and a part of each of the plurality of individual wirings 42 .
  • the connector 77 is attached to the end of the wiring board 71 in the third direction y, as shown in FIGS. 1 and 4.
  • Connector 77 has multiple pins (not shown). Some of the plurality of pins are electrically connected to a wiring (not shown) to which a plurality of second wires 75 are electrically connected on the wiring board 71 . Further, another part of the plurality of pins is electrically connected to a wiring (not shown) that is electrically connected to the base 411 of the common wiring 41 on the wiring board 71.
  • FIGS. 8 to 16 show the cross-sectional positions of FIGS. 8, 9, and 12 to 16 based on FIGS. 8 to 16.
  • the cross-sectional positions of FIGS. 8, 9, and 12 to 16 are the same as the cross-sectional positions of FIG. 5, which shows the main parts of the thermal print head A10.
  • a base material 81 is formed.
  • the step of forming the base material 81 includes the step of forming a first groove 81A and a second groove 81B extending in the second direction x and separated from each other in the third direction y.
  • the composition of base material 81 includes silicon dioxide. The silicon dioxide is distributed throughout the base material 81.
  • the base material 81 corresponds to a plurality of base materials 1 connected in a direction perpendicular to the first direction z. Therefore, the material of the base material 81 is the same quartz glass as the material of the base material 1.
  • the first groove 81A and the second groove 81B are recessed from one side of the base material 81 in the first direction z.
  • a mask layer is formed on one side of the base material 81 in the first direction z by lithography patterning.
  • a first groove 81A and a second groove 81B recessed from one side of the base material 81 in the first direction z are formed by reactive ion etching (RIE).
  • RIE reactive ion etching
  • a first main surface 811, a second main surface 812, and a third main surface 813 are formed.
  • the first main surface 811 faces one side in the first direction z.
  • the second main surface 812 and the third main surface 813 are located on opposite sides of the first main surface 811 in the third direction y.
  • the second main surface 812 is defined by the first groove 81A.
  • the third main surface 813 is defined by the second groove 81B.
  • the first main surface 811 is defined by a portion of the base material 81 located between the first groove 81A and the second groove 81B in the third direction y. Therefore, the position of each of the second main surface 812 and the third main surface 813 in the first direction z is different from the position of the first main surface 811 in the first direction z.
  • the surface of the base material 81 facing away from the first principal surface 811 in the first direction z is covered with a light shielding layer 89.
  • the light shielding layer 89 is made of a material containing metal, for example.
  • the light shielding layer 89 may be made of a material containing resin.
  • the glaze layer 2 is formed to cover the first main surface 811 defined by the base material 81.
  • a fluid glaze material is supplied to the first main surface 811, and then the glaze material is fired.
  • the glaze material before firing is in contact with the first boundary 811A and the second boundary 811B.
  • the first boundary 811A corresponds to the boundary between the first main surface 811 and the second main surface 812 defined by the first groove 81A.
  • the second boundary 811B corresponds to the boundary between the first main surface 811 and the third main surface 813 defined by the second groove 81B.
  • the first boundary 811A and the second boundary 811B are included in the first main surface 811.
  • Surface tension T acts on the glaze material before firing at the first boundary 811A and the second boundary 811B.
  • the resistor layer 3 includes a plurality of heat generating parts 31 arranged along the second direction x.
  • the wiring layer 4 is electrically connected to the plurality of heat generating parts 31 .
  • the process of forming the wiring layer 4 includes the process of forming a common wiring 41 and a plurality of individual wirings 42.
  • the common wiring 41 is located on one side in the third direction y with respect to the plurality of heat generating parts 31 of the resistor layer 3 shown in FIG.
  • the plurality of individual wirings 42 are located on the opposite side of the common wiring 41 with respect to the plurality of heat generating parts 31 shown in FIG. 2 in the third direction y.
  • a resistor film 82 is formed to cover one side of the base material 81 in the first direction z and the glaze layer 2.
  • the resistor film 82 is formed by laminating a thin film of tantalum nitride on the base material 81 and the glaze layer 2 using a sputtering method.
  • a conductive layer 83 is formed to cover the entire surface of the resistor film 82.
  • the conductive layer 83 is formed by laminating a thin copper film on the resistor film 82 multiple times using a sputtering method.
  • a method is adopted in which a titanium thin film is laminated on the resistor film 82 by sputtering, and then a copper thin film is laminated multiple times on the titanium thin film by sputtering. It's okay.
  • a portion of the conductive layer 83 is removed.
  • the removal is performed by wet etching using a mixed solution of sulfuric acid (H 2 SO 4 ) and hydrogen peroxide (H 2 O 2 ).
  • H 2 SO 4 sulfuric acid
  • H 2 O 2 hydrogen peroxide
  • the common wiring 41 and the plurality of individual wirings 42 are formed in contact with the resistor film 82.
  • a region of the resistor film 82 formed on the glaze layer 2 is exposed from the wiring layer 4.
  • lithography patterning is performed on the resistor film 82 and the wiring layer 4, and then a part of the resistor film 82 is removed.
  • the removal is performed by reactive ion etching.
  • the resistor layer 3 is formed on the base material 81 and the glaze layer 2.
  • a plurality of heat generating parts 31 appear on the glaze layer 2.
  • a protective layer 5 is formed to cover the plurality of heat generating parts 31 of the resistor layer 3 and a part of the wiring layer 4.
  • the protective layer 5 is formed by laminating a plurality of silicon nitride thin films by plasma CVD.
  • the protective layer 5 can also be formed by laminating a plurality of silicon dioxide thin films using a sputtering method.
  • a wiring opening 51 penetrating the protective layer 5 in the first direction z is formed.
  • the wiring opening 51 is formed by performing lithography patterning on the protective layer 5 and then removing a portion of the protective layer 5. The removal is performed by reactive ion etching. As a result, a portion of each of the plurality of individual wirings 42 is exposed from the wiring opening 51.
  • the part of each of the plurality of individual wirings 42 exposed from the wiring opening 51 refers to the base portion 421 of each of the plurality of individual wirings 42 shown in FIG. 5 and the extension part of each of the plurality of individual wirings 42 shown in FIG. 422.
  • a metal layer such as gold may be laminated on a portion of each of the plurality of individual wirings 42 exposed through the wiring opening 51 by plating.
  • the base material 81 is cut in the first direction z along the second direction x and the third direction y.
  • the pieces thus obtained become the main parts of the thermal print head A10 including the base material 1.
  • a plurality of drive elements 73 are mounted on the wiring board 71.
  • the back surface 19 of the base material 1 and the wiring board 71 are joined to the heat dissipating member 72.
  • the plurality of first wires 74 and the plurality of second wires 75 are conductively bonded to the base portions 421 of each of the wiring board 71, the plurality of drive elements 73, and the plurality of individual wirings 42.
  • a sealing resin 76 covering the plurality of drive elements 73, the plurality of first wires 74, and the plurality of second wires 75 is formed.
  • the connector 77 is attached to the wiring board 71.
  • the thermal print head A10 is obtained through the above steps.
  • the thermal print head A10 includes a base material 1 having a first main surface 11, a second main surface 12, and a third main surface 13, all of which face one side in the first direction z, and a glaze layer covering the first main surface 11. 2.
  • the composition of the base material 1 includes silicon dioxide.
  • the second main surface 12 and the third main surface 13 are located on opposite sides of each other with respect to the first main surface 11 in the third direction y.
  • the position of each of the second main surface 12 and the third main surface 13 in the first direction z is different from the position of the first main surface 11 in the first direction z.
  • the heat from the plurality of heat generating parts 31 of the resistor layer 3 can be transmitted to the recording medium while suppressing the contact area of the recording medium with the thermal print head A10. .
  • the thermal print head A10 it is possible to improve the heat storage performance of the base material 1 while improving the printing quality.
  • the second main surface 12 and the third main surface 13 of the base material 1 are further away from the plurality of heat generating parts 31 of the resistor layer 3 than the first main surface 11 of the base material 1 is. Furthermore, the dimensions of each of the second principal surface 12 and the third principal surface 13 in the third direction y (dimension L2 and dimension L3 shown in FIGS. 6 and 7) are the dimensions of the first principal surface 11 in the third direction y. Smaller than L1.
  • each of the first groove 16 and the second groove 17 provided in the base material 1 in order to define the second principal surface 12 and the third principal surface 13 has a cross section in the second direction x. Can be made smaller.
  • the glass transition point of the glaze layer 2 is lower than that of the base material 1.
  • the dimension L2 of the second main surface 12 of the base material 1 in the third direction y is larger than the distance between the first main surface 11 and the second main surface 12 of the base material 1 in the first direction z.
  • the thermal print head A10 further includes a protective layer 5 that covers the plurality of heat generating parts 31 of the resistor layer 3 and the wiring layer 4. As a result, the plurality of heat generating parts 31 and the wiring layer 4 are protected by the protective layer 5, and the contact of the recording medium with the thermal print head A10 becomes smoother.
  • the thermal print head A10 further includes a heat dissipation member 72.
  • the back surface 19 of the base material 1 is joined to a heat dissipating member 72.
  • FIGS. 17 and 18 A thermal print head A20 according to a second embodiment of the present disclosure will be described based on FIGS. 17 and 18.
  • elements that are the same or similar to those of the thermal print head A10 described above are given the same reference numerals, and redundant explanation will be omitted.
  • the cross-sectional position in FIG. 17 is the same as the cross-sectional position in FIG. 5 showing the main part of the thermal print head A10.
  • the thermal print head A20 differs from the thermal print head A10 in the configuration of the base material 1 and the fact that it further includes an insulating layer 6.
  • the base material 1 includes a first layer 1A and a second layer 1B laminated on the first layer 1A.
  • the second layer 1B extends in the second direction x.
  • the composition of the first layer 1A includes silicon dioxide.
  • the material of the first layer 1A is the same as the material of the base material 1 of the thermal print head A10.
  • the composition of the second layer 1B includes a metal element.
  • the metal element is copper.
  • the metal element may be copper or titanium. Therefore, the thermal conductivity of the second layer 1B is lower than that of the first layer 1A.
  • the dimension of the second layer 1B in the first direction z is smaller than the dimension of the first layer 1A in the first direction z.
  • the second layer 1B may be made of ceramics.
  • An example of the ceramic material is aluminum nitride (AlN) or aluminum oxide.
  • the first layer 1A has a second main surface 12 and a third main surface 13.
  • the second layer 1B has a first main surface 11. Therefore, in the thermal print head A20 as well, the second main surface 12 and the third main surface 13 are further away from the plurality of heat generating parts 31 of the resistor layer 3 than the first main surface 11 is in the first direction z.
  • a first boundary 111 and a second boundary 112 that are in contact with the glaze layer 2 are included in the first main surface 11 .
  • the insulating layer 6 is located between the base material 1 and the resistor layer 3.
  • the insulating layer 6 covers the second main surface 12 and the third main surface 13 of the first layer 1A, and the entire second layer 1B including the first main surface 11.
  • the composition of insulating layer 6 includes silicon dioxide.
  • the composition of the insulating layer 6 may include silicon nitride.
  • the second layer 1B is made of ceramics, the insulating layer 6 is not necessary because the second layer 1B is an insulator.
  • FIGS. 19 to 21 an example of a method for manufacturing the thermal print head A20 will be described based on FIGS. 19 to 21.
  • the cross-sectional positions of FIGS. 19 to 21 are the same as the cross-sectional positions of FIG. 17 showing the main parts of the thermal print head A20.
  • a metal layer 84 is formed on one side of the base material 81 in the first direction z.
  • a base layer is formed to cover one side of the base material 81 in the first direction z.
  • the base layer includes a metal thin film made of titanium and in contact with the base material 81, and a metal thin film laminated on the metal thin film and made of copper.
  • the base layer is formed by a sputtering method.
  • lithography patterning is performed on the base layer.
  • a copper plating layer is formed by electrolytic plating using the base layer as a conductive path.
  • the mask layer for lithographic patterning is removed.
  • the portions of the underlayer exposed to the outside are removed by wet etching using a mixed solution of sulfuric acid and hydrogen peroxide.
  • the process of forming the metal layer 84 on one side of the base material 81 in the first direction z is included in the process of forming the base material 81.
  • the second main surface 812 and the third main surface 813 are defined by the base material 81.
  • the base material 81 becomes the first layer 1A of the base material 1 included in the thermal print head A20.
  • First main surface 811 is defined by metal layer 84 .
  • the metal layer 84 becomes the second layer 1B of the base material 1 included in the thermal print head A20.
  • a glaze layer 2 is formed to cover the first main surface 811 defined by the metal layer 84.
  • a fluid glaze material is supplied to the first main surface 811, and then the glaze material is fired.
  • the surface tension T shown in FIG. 11 acts on the glaze material before firing at the first boundary 811A and the second boundary 811B. Therefore, also by the method of manufacturing the thermal print head A20, it is possible to form the glaze layer 2 that bulges toward the side facing the first main surface 811 in the first direction z.
  • the insulating layer 6 is formed to cover the second main surface 812 and the third main surface 813 defined by the base material 81 and the entire metal layer 84 including the first main surface 811. .
  • the insulating layer 6 is formed by laminating a plurality of silicon dioxide thin films using a sputtering method.
  • the insulating layer 6 can also be formed by laminating a plurality of silicon nitride thin films by plasma CVD.
  • the steps after forming the insulating layer 6 include a step of forming the resistor layer 3 and the wiring layer 4, and a step of forming the protective layer 5.
  • the process of forming these after forming the insulating layer 6 is the same as the manufacturing process of the thermal print head A10. Therefore, a description of the method for manufacturing the thermal print head A20 after forming the insulating layer 6 will be omitted.
  • the thermal print head A20 includes a base material 1 having a first main surface 11, a second main surface 12, and a third main surface 13, all of which face one side in the first direction z, and a glaze layer that covers the first main surface 11. 2.
  • the composition of the base material 1 includes silicon dioxide.
  • the second main surface 12 and the third main surface 13 are located on opposite sides of the first main surface 11 in the third direction y.
  • the position of each of the second main surface 12 and the third main surface 13 in the first direction z is different from the position of the first main surface 11 in the first direction z. Therefore, according to this configuration, also in the thermal print head A20, it is possible to improve the heat storage performance of the base material 1 while improving the printing quality.
  • the thermal print head A20 has the same configuration as the thermal print head A10, so that it can achieve the same effects as the thermal print head A10.
  • the base material 1 includes a first layer 1A having a second main surface 12 and a third main surface 13, and a second layer 1B having a first main surface 11.
  • the thermal conductivity of the second layer 1B is higher than that of the first layer 1A.
  • the thermal print head A20 further includes an insulating layer 6 located between the base material 1 and the resistor layer 3.
  • the insulating layer 6 covers the second main surface 12 and the third main surface 13 of the first layer 1A, and the entire second layer 1B including the first main surface 11.
  • FIG. 22 Based on FIG. 22, a thermal print head A30 according to a third embodiment of the present disclosure will be described.
  • elements that are the same or similar to those of the thermal print head A10 described above are given the same reference numerals, and redundant explanation will be omitted.
  • the cross-sectional position in FIG. 22 is the same as the cross-sectional position in FIG. 5 showing the main part of the thermal print head A10.
  • the configuration of the base material 1 is different from the configuration of the thermal print head A10.
  • the base material 1 is provided with a recessed portion 18 that is recessed from one side in the first direction z.
  • the recess 18 extends in the second direction x.
  • the first main surface 11 of the base material 1 is defined by the recess 18 . Therefore, in the first direction z, the first main surface 11 is farther away from the plurality of heat generating parts 31 of the resistor layer 3 than the second main surface 12 and the third main surface 13 of the base material 1 .
  • Glaze layer 2 includes portions protruding from second main surface 12 and third main surface 13 of base material 1 .
  • the first boundary 111 in contact with the glaze layer 2 is included in the second main surface 12.
  • the second boundary 112 in contact with the glaze layer 2 is included in the third main surface 13.
  • FIGS. 23 and 24 are the same as the cross-sectional positions in FIG. 22 showing the main parts of the thermal print head A30.
  • a recess 81C extending in the second direction x is formed in the base material 81.
  • the recessed portion 81C is recessed from one side of the base material 81 in the first direction z.
  • a mask layer is formed on one side of the base material 81 in the first direction z by lithography patterning.
  • a recessed portion 81C recessed from one side of the base material 81 in the first direction z is formed by reactive ion etching (RIE).
  • RIE reactive ion etching
  • the process of forming the recess 81C in the base material 81 is included in the process of forming the base material 81.
  • the first main surface 811 is defined by the recess 81C.
  • the second main surface 812 is defined by a portion of the base material 81 located on one side of the recessed portion 81C in the third direction y.
  • the third main surface 813 is defined by a part of the base material 81 located on the opposite side of the part of the base material 81 that defines the second main surface 812 with respect to the recess 81C in the third direction y.
  • a glaze layer 2 is formed to cover the first main surface 811 defined by the recess 81C.
  • a fluid glaze material is supplied to the first main surface 811, and then the glaze material is fired.
  • the surface tension T shown in FIG. 11 acts on the glaze material before firing at the first boundary 811A and the second boundary 811B. Therefore, also by the method of manufacturing the thermal print head A30, it is possible to form the glaze layer 2 that bulges toward the side toward which the first main surface 811 faces in the first direction z.
  • the steps after forming the glaze layer 2 include a step of forming a resistor layer 3 and a wiring layer 4, and a step of forming a protective layer 5.
  • the steps for forming these after forming the glaze layer 2 are similar to the steps for manufacturing the thermal print head A10. Therefore, a description of the method for manufacturing the thermal print head A30 after forming the glaze layer 2 will be omitted.
  • the thermal print head A30 includes a base material 1 having a first main surface 11, a second main surface 12, and a third main surface 13, all of which face one side in the first direction z, and a glaze layer that covers the first main surface 11. 2.
  • the composition of the base material 1 includes silicon dioxide.
  • the second main surface 12 and the third main surface 13 are located on opposite sides of the first main surface 11 in the third direction y.
  • the position of each of the second main surface 12 and the third main surface 13 in the first direction z is different from the position of the first main surface 11 in the first direction z. Therefore, according to this configuration, also in the thermal print head A30, it is possible to improve the heat storage performance of the base material 1 while improving the printing quality.
  • the thermal print head A30 has the same configuration as the thermal print head A10, so that it can achieve the same effects as the thermal print head A10.
  • the first main surface 11 of the base material 1 has a larger number of heat generating parts of the resistor layer 3 than the first main surface 11 and second main surface 12 of the base material 1. It is far from 31.
  • the contact area of the glaze layer 2 with the base material 1 can be further expanded. Thereby, it becomes possible to exhibit the heat storage performance of the base material 1 more effectively.
  • the present disclosure includes the embodiments described in the appendix below. Additional note 1. base material and a glaze layer covering one side of the base material in the first direction; a resistor layer including a plurality of heat generating parts located on the opposite side of the base material with respect to the glaze layer in the first direction; a wiring layer electrically connected to the plurality of heat generating parts and disposed in contact with the resistor layer, The plurality of heat generating parts are arranged along a second direction orthogonal to the first direction,
  • the composition of the base material includes silicon dioxide,
  • the base material has a first main surface facing the one side in the first direction, and a second main surface and a third main surface facing the same side as the first main surface in the first direction.
  • the glaze layer covers the first main surface, The second main surface and the third main surface are located opposite to each other with respect to the first main surface in a third direction orthogonal to the first direction and the second direction,
  • the thermal print head wherein a position of each of the second main surface and the third main surface in the first direction is different from a position of the first main surface in the first direction.
  • Appendix 2. When viewed in the first direction, the glaze layer is in contact with a boundary between the first main surface and the second main surface and a boundary between the first main surface and the third main surface.
  • the thermal print head according to appendix 2 wherein in the first direction, the second main surface and the third main surface are further away from the plurality of heat generating parts than the first main surface.
  • Appendix 4. The thermal print head according to appendix 3, wherein a dimension in the third direction of each of the second principal surface and the third principal surface is smaller than a dimension in the third direction of the first principal surface.
  • Appendix 5. The thermal print head according to appendix 4, wherein the silicon dioxide is distributed throughout the substrate.
  • the base material has a fourth main surface facing the same side as the first main surface in the first direction, The fourth main surface is located on the opposite side of the first main surface with respect to the second main surface in the third direction,
  • the thermal print head according to appendix 6 wherein the position of the fourth main surface in the first direction is equal to the position of the first main surface in the first direction.
  • Appendix 8 The thermal print head according to appendix 7, wherein a dimension of the second main surface in the third direction is larger than a distance between the first main surface and the second main surface in the first direction.
  • the base material includes a first layer having the second main surface and the third main surface, and a second layer having the first main surface,
  • the composition of the first layer includes the silicon dioxide,
  • Appendix 11. The thermal print head according to appendix 10, wherein a dimension of the second layer in the first direction is smaller than a dimension of the first layer in the first direction.
  • Appendix 12 The thermal print head according to appendix 2, wherein in the first direction, the first main surface is farther from the plurality of heat generating parts than the second main surface and the third main surface.
  • Appendix 14. The thermal print head according to any one of Supplementary Notes 2 to 13, further comprising a protective layer that covers the plurality of heat generating parts.
  • the wiring layer includes a common wiring and a plurality of individual wirings, The common wiring is electrically connected to the plurality of heat generating parts, The thermal print head according to appendix 14, wherein the plurality of individual wirings are individually electrically connected to the plurality of heat generating parts.
  • Appendix 17 a step of forming a base material; forming a glaze layer covering one side of the base material in the first direction; forming on the glaze layer a resistor layer including a plurality of heat generating parts arranged along a second direction perpendicular to the first direction; forming a wiring layer conductive to the plurality of heat generating parts in contact with the resistor layer,
  • the composition of the base material includes silicon dioxide, In the step of forming the base material, a first main surface facing the one side in the first direction, and a second main surface and a third main surface facing the same side as the first main surface in the first direction.
  • the glaze material which is a fluid, is supplied to the first main surface, and then the glaze material is fired. Appendix 18.
  • the step of forming the base material includes a step of forming a first groove and a second groove extending in the second direction and separated from each other in the third direction in the base material, The first groove and the second groove are recessed from the one side of the base material in the first direction, the second main surface is defined by the first groove, The method for manufacturing a thermal print head according to appendix 17, wherein the third main surface is defined by the second groove.

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Citations (10)

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Publication number Priority date Publication date Assignee Title
US4472723A (en) * 1982-04-23 1984-09-18 Oki Electric Industry Co., Ltd. Thermal head
JPH0781112A (ja) * 1993-09-10 1995-03-28 Alps Electric Co Ltd サーマルヘッドおよびその製造方法
JP2001180025A (ja) * 1999-12-24 2001-07-03 Alps Electric Co Ltd サーマルヘッド、及びこのサーマルヘッドの製造方法
JP2005096274A (ja) * 2003-09-25 2005-04-14 Kyocera Corp サーマルヘッド及びその製造方法、並びにサーマルプリンタ
JP2006205369A (ja) * 2005-01-25 2006-08-10 Kyocera Corp グレーズド基板
JP2007185830A (ja) * 2006-01-12 2007-07-26 Alps Electric Co Ltd サーマルヘッド及びこの製造方法
JP2014231216A (ja) * 2012-08-29 2014-12-11 ローム株式会社 サーマルプリントヘッドおよびサーマルプリンタ
JP2017114056A (ja) * 2015-12-25 2017-06-29 ローム株式会社 サーマルプリントヘッド
JP2018176549A (ja) * 2017-04-13 2018-11-15 ローム株式会社 サーマルプリントヘッド、および、サーマルプリントヘッドの製造方法
JP2021130212A (ja) * 2020-02-18 2021-09-09 ローム株式会社 サーマルプリントヘッドの製造方法、サーマルプリントヘッドおよびサーマルプリンタ

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4472723A (en) * 1982-04-23 1984-09-18 Oki Electric Industry Co., Ltd. Thermal head
JPH0781112A (ja) * 1993-09-10 1995-03-28 Alps Electric Co Ltd サーマルヘッドおよびその製造方法
JP2001180025A (ja) * 1999-12-24 2001-07-03 Alps Electric Co Ltd サーマルヘッド、及びこのサーマルヘッドの製造方法
JP2005096274A (ja) * 2003-09-25 2005-04-14 Kyocera Corp サーマルヘッド及びその製造方法、並びにサーマルプリンタ
JP2006205369A (ja) * 2005-01-25 2006-08-10 Kyocera Corp グレーズド基板
JP2007185830A (ja) * 2006-01-12 2007-07-26 Alps Electric Co Ltd サーマルヘッド及びこの製造方法
JP2014231216A (ja) * 2012-08-29 2014-12-11 ローム株式会社 サーマルプリントヘッドおよびサーマルプリンタ
JP2017114056A (ja) * 2015-12-25 2017-06-29 ローム株式会社 サーマルプリントヘッド
JP2018176549A (ja) * 2017-04-13 2018-11-15 ローム株式会社 サーマルプリントヘッド、および、サーマルプリントヘッドの製造方法
JP2021130212A (ja) * 2020-02-18 2021-09-09 ローム株式会社 サーマルプリントヘッドの製造方法、サーマルプリントヘッドおよびサーマルプリンタ

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