WO2023189250A1 - 導電性フィルム及び表示装置 - Google Patents

導電性フィルム及び表示装置 Download PDF

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Publication number
WO2023189250A1
WO2023189250A1 PCT/JP2023/008405 JP2023008405W WO2023189250A1 WO 2023189250 A1 WO2023189250 A1 WO 2023189250A1 JP 2023008405 W JP2023008405 W JP 2023008405W WO 2023189250 A1 WO2023189250 A1 WO 2023189250A1
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WIPO (PCT)
Prior art keywords
resin layer
resin
inorganic particles
layer
conductive film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/JP2023/008405
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English (en)
French (fr)
Japanese (ja)
Inventor
浩 新開
圭介 西岡
はる菜 小川
晋亮 橋本
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TDK Corp
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TDK Corp
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Priority to JP2024511582A priority Critical patent/JPWO2023189250A1/ja
Publication of WO2023189250A1 publication Critical patent/WO2023189250A1/ja
Priority to US18/897,309 priority patent/US20250022629A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • H01B17/64—Insulating bodies with conductive admixtures, inserts or layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Definitions

  • the present disclosure relates to a conductive film and a display device.
  • a transparent antenna on which a conductive substrate (conductive film) having transparency and conductivity is mounted may be mounted on the surface of a touch panel or display.
  • conductive films are required to have high transparency and conductivity as well as flexibility.
  • Patent Document 1 describes a step of forming a trench in a trench forming layer formed on a base layer formed on a base material so that the base layer is exposed. and a step of growing metal plating from an underlying layer exposed in the trench to form a conductive pattern layer filling the trench.
  • the adhesion between the first resin layer and the second resin layer is high. It is hoped that
  • One aspect of the present disclosure includes a base material, a first resin layer provided on the base material, and a trench provided on the first resin layer and opened on a surface opposite to the first resin layer. and a conductive layer provided in a trench.
  • the first resin layer includes a first resin portion and a plurality of first inorganic particles. At least some of the plurality of first inorganic particles partially protrude from the first resin portion to the second resin layer side.
  • Another aspect of the present disclosure relates to a display device including the above-mentioned conductive film.
  • a conductive film with high adhesion between a first resin layer and a second resin layer, and a display device using this conductive film are provided.
  • FIG. 1 is a schematic plan view showing a conductive film according to one embodiment.
  • 2 is a sectional view taken along line II-II in FIG. 1.
  • FIG. 3 is a partially enlarged view of the conductive film shown in FIG. 2.
  • FIG. 2 is a cross-sectional view schematically showing a method for manufacturing the conductive film shown in FIG. 1.
  • FIG. 2 is a cross-sectional view schematically showing a method for manufacturing the conductive film shown in FIG. 1.
  • FIG. FIG. 1 is a cross-sectional view showing an embodiment of a display device.
  • FIG. 1 is a schematic plan view showing a conductive film according to one embodiment.
  • FIG. 2 is a sectional view taken along line II-II in FIG.
  • the conductive film 100 shown in FIGS. 1 and 2 includes a film-like base material 1, a first resin layer 10 provided on the base material 1, and a first resin layer 10 provided on the first resin layer 10.
  • the second resin layer 20 has a linear trench 25 opening on the surface opposite to the resin layer 10 , and a conductive layer 30 provided in the trench 25 .
  • a mesh pattern is formed by a plurality of linear trenches 25 extending in two directions and intersecting with each other.
  • the conductive layer 30 within the trench 25 also forms a mesh pattern.
  • the conductive layer 30 having a mesh-like pattern can function well as a radiating element of an antenna, for example.
  • the trench 25 and the conductive layer 30 are provided over a part of the surface 10S of the first resin layer 10.
  • FIG. 3 is an enlarged view of region R in the cross-sectional view of the conductive film 100 shown in FIG. 2.
  • the first resin layer 10 includes a first resin part 12 and a plurality of first inorganic particles 11
  • the second resin layer 20 includes a second resin part 22, and a plurality of second inorganic particles 21.
  • the base material 1 may be a transparent base material, particularly a transparent resin film.
  • the resin film may be, for example, a film of polyethylene terephthalate (PET), polycarbonate (PC), polyethylene naphthalate (PEN), cycloolefin polymer (COP), or polyimide (PI).
  • PET polyethylene terephthalate
  • PC polycarbonate
  • PEN polyethylene naphthalate
  • COP cycloolefin polymer
  • PI polyimide
  • the base material 1 may be glass, a Si wafer, or the like.
  • the base material 1 may have a degree of light transmittance required when the conductive film 100 is incorporated into a display device, for example. Specifically, the total light transmittance of the base material may be 90 to 100%.
  • the base material may have a haze of 0 to 5%.
  • the thickness of the base material 1 may be 10 ⁇ m or more, 20 ⁇ m or more, or 35 ⁇ m or more, and may be 500 ⁇ m or less, 200 ⁇ m or less, or 100 ⁇ m or less.
  • the first resin portion 12 constituting the first resin layer 10 may be a cured product of a curable resin composition containing a curable resin.
  • the first resin layer 10 may be transparent.
  • curable resins include amino resin, cyanate resin, isocyanate resin, polyimide resin, epoxy resin, oxetane resin, polyester, allyl resin, phenol resin, benzoxazine resin, xylene resin, ketone resin, furan resin, COPNA resin, Polymerization reaction of silicone resin, dicyclopentadiene resin, benzocyclobutene resin, episulfide resin, ene-thiol resin, polyazomethine resin, polyvinylbenzyl ether compound, acenaphthylene, unsaturated double bond, cyclic ether, vinyl ether, etc. with ultraviolet rays
  • ultraviolet curing resins containing functional groups that cause The curable resin may be used alone or in combination of two or more.
  • the first inorganic particles 11 are dispersed within the first resin part 12.
  • the first inorganic particles 11 include silica, alumina, titania, tantalum oxide, zirconia, silicon nitride, barium titanate, barium carbonate, magnesium carbonate, aluminum hydroxide, magnesium hydroxide, lead titanate, and zircon titanate.
  • the first inorganic particles 11 may be one kind alone or a combination of two or more kinds.
  • the shape of the first inorganic particles 11 is not particularly limited, and may be, for example, spherical, ellipsoidal, polyhedral, plate-like, scale-like, columnar, or the like.
  • At least some of the plurality of first inorganic particles 11 partially protrude from the first resin portion 12 to the second resin layer 20 side.
  • the first inorganic particles 11 partially protrude from the first resin part 12 toward the second resin layer 20 means that a part of the surface of the first inorganic particles 11 is covered with the first resin This means a state in which the portion 12 protrudes toward the second resin layer 20 and is in contact with the second resin layer 20 . That is, the plurality of first inorganic particles 11 that partially protrude toward the second resin layer 20 side are not covered by the first resin portion 12 at the portions that protrude toward the second resin layer 20 side. (The portion protruding toward the second resin layer 20 side is exposed from the first resin portion 12).
  • first inorganic particles are also referred to as “exposed first inorganic particles.”
  • the exposed first inorganic particles 11a can contribute to improving the adhesion between the first resin layer 10 and the second resin layer 20.
  • the presence of the exposed first inorganic particles 11a can be confirmed, for example, by observing a cross section along the thickness direction of the conductive film 100 using a TEM (transmission electron microscope).
  • the first inorganic particles 11 are embedded in the first resin part 12 and do not protrude to the second resin layer 20 side (not exposed from the first resin part 12). May include.
  • the ratio of the number of exposed first inorganic particles 11a is determined from the viewpoint of excellent adhesion between the first resin layer 10 and the second resin layer 20 of the conductive film 100. may be 10% or more of the total number of objects.
  • the ratio of the number of exposed first inorganic particles 11a to the total number of first inorganic particles 11 may be, for example, 40% or less.
  • the ratio of the number of exposed first inorganic particles 11a is determined by TEM observation of a cross section along the thickness direction of the conductive film 100, and the ratio of the number of exposed first inorganic particles 11a is determined by TEM observation of a cross section along the thickness direction of the conductive film 100. Calculated by measuring the number of exposed first inorganic particles 11a in a cross-sectional image of one resin layer 10 and the number of all first inorganic particles 11 in a cross-sectional image of the first resin layer 10 in the range be done.
  • the plurality of first inorganic particles 11 may be unevenly distributed on the second resin layer 20 side in the first resin layer 10.
  • the fact that the plurality of first inorganic particles 11 are unevenly distributed on the second resin layer 20 side in the first resin layer 10 can be seen by observing a cross section along the thickness direction of the conductive film 100 using a TEM. This can be confirmed by
  • the plurality of first inorganic particles 11 are unevenly distributed on the second resin layer 20 side in the first resin layer 10 means, for example, that in the cross section along the thickness direction of the conductive film 100,
  • region A the region from the center of the first resin layer 10 in the thickness direction to the second resin layer 20 side is defined as region A, the first inorganic particles 11 present in region A (the exposed first inorganic particles 11a are (including) exceeds 50% of the total number of first inorganic particles 11 in the entire first resin layer 10. This ratio may be 60% or more, 70% or more, 75% or more, or 80% or more.
  • the average particle diameter of the first inorganic particles 11 may be, for example, 10 nm or more, 15 nm or more, or 20 nm or more, or 400 nm or less, 300 nm or less, or 200 nm or less.
  • the average particle diameter of the first inorganic particles 11 is determined by observing a cross section along the thickness direction of the conductive film 100 with a TEM, and in a TEM image of the cross section, the average particle diameter is 1.5 ⁇ m in any extending direction of the conductive film 100. It is calculated by measuring the maximum length of each of the first inorganic particles 11 existing in the range and averaging them.
  • the thickness of the first resin layer 10 or the first resin part 12 may be, for example, 30 nm or more, 50 nm or more, or 100 nm or more, and may be 500 nm or less, 400 nm or less, or 300 nm or less. .
  • the second resin layer 20 is a resin layer mainly composed of a second resin portion 22.
  • the second resin portion 22 may be transparent.
  • the second resin portion 22 may be a cured product of a photocurable resin or a thermosetting resin.
  • photocurable resins or thermosetting resins include acrylic resins, amino resins, cyanate resins, isocyanate resins, polyimide resins, epoxy resins, oxetane resins, polyesters, allyl resins, phenolic resins, benzoxazine resins, xylene resins, Ketone resin, furan resin, COPNA resin, silicone resin, dicyclopentadiene resin, benzocyclobutene resin, episulfide resin, ene-thiol resin, polyazomethine resin, polyvinylbenzyl ether compound, acenaphthylene, unsaturated double bond, cyclic ether , and ultraviolet curing resins containing functional groups that cause a polymerization reaction
  • the second resin layer 20 may contain second inorganic particles 21.
  • the second inorganic particles 21 may be one or more inorganic particles selected from Pd, Cu, Ni, Co, Au, Ag, Pd, Rh, Pt, In, and Sn, and may include Pd. .
  • the second inorganic particles 21 may be one type alone or a combination of two or more types of inorganic particles.
  • the shape of the second inorganic particles 21 is not particularly limited, and may be, for example, spherical, ellipsoidal, polyhedral, plate-like, scale-like, columnar, or the like.
  • the average particle diameter of the second inorganic particles 21 may be 10 nm or less, 8 nm or less, or 5 nm or less from the viewpoint of excellent transparency of the conductive film 100.
  • the average particle diameter of the second inorganic particles 21 may be, for example, 0.1 nm or more, 0.5 nm or more, or 1 nm or more.
  • the average particle diameter of the second inorganic particles 21 is determined by observing a cross section along the thickness direction of the conductive film 100 with a TEM, and in a TEM image of the cross section, the average particle diameter is 1.5 ⁇ m in any extending direction of the conductive film 100. It is calculated by measuring the maximum length of each of the second inorganic particles 21 existing in the range and averaging them.
  • the average particle diameter of the second inorganic particles 21 may be smaller than the average particle diameter of the first inorganic particles 11.
  • the ratio of the average particle diameter of the second inorganic particles 21 to the average particle diameter of the first inorganic particles 11 is 0. It may be 3 or less, or 0.1 or less, 0.01 or more, 0.02 or more, or 0.05 or more.
  • the plurality of second inorganic particles 21 may be unevenly distributed on the first resin layer 10 side in the second resin layer 20.
  • the plurality of second inorganic particles 21 are unevenly distributed on the first resin layer 10 side in the second resin layer 20 means, for example, in a cross section along the thickness direction of the conductive film 100, When the area from the center of the second resin layer 20 in the thickness direction to the first resin layer 10 side is defined as area B, the ratio of the number of second inorganic particles 21 existing in area B is This means that it exceeds 50% of the total number of second inorganic particles 21 in the entire resin layer 20. This percentage may be 80% or more, 90% or more, or 95% or more.
  • the number of second inorganic particles 21 that is 80% or more of the total number of second inorganic particles 21 is the same as that of the first resin layer 10 and the second resin layer. It may be distributed within a region where the distance from the interface with the layer 20 is 1/3 or less, 1/4 or less, or 1/5 or less of the thickness of the first resin layer 10.
  • the second inorganic particles 21 whose number is 90% or more or 95% or more of the total number of second inorganic particles 21 are located at a distance from the interface between the first resin layer 10 and the second resin layer 20. It may be distributed within a region of 1/3 or less, 1/4 or less, or 1/5 or less of the thickness of the first resin layer 10.
  • the interface between the first resin layer 10 and the second resin layer 20 refers to the interface between the first resin part 12 and the second resin part 22, and the interface between the exposed first inorganic particles 11a and the second resin part 12. means the interface with the resin part 22.
  • the second inorganic particles 21, which account for 80% or more of the total number of second inorganic particles 21, are on the surface of the first resin layer 10 (first or the surface of the exposed first inorganic particles 11a) is 70 nm or less, 65 nm or less, 60 nm or less, 55 nm or less, 50 nm or less, 45 nm or less, 40 nm or less, 35 nm or less, 30 nm or less, It may be distributed within a region of 25 nm or less, 20 nm or less, 15 nm or less, or 10 nm or less.
  • the second inorganic particles 21 in a number of 90% or more or 95% or more of the total number of second inorganic particles 21 are on the surface of the first resin layer 10 (the surface of the first resin part 12 or exposed
  • the distance from the surface of the first inorganic particles 11a) is 70 nm or less, 65 nm or less, 60 nm or less, 55 nm or less, 50 nm or less, 45 nm or less, 40 nm or less, 35 nm or less, 30 nm or less, 25 nm or less, 20 nm or less, 15 nm or less, Alternatively, it may be distributed within a region of 10 nm or less.
  • the trench 25 opens on the surface opposite to the first resin layer 10 and extends onto the second resin layer 20.
  • Trench 25 includes a portion forming a pattern corresponding to the pattern of conductive layer 30 . As shown in FIG. 2, the width of the trench 25 may become narrower from the side of the second resin layer 20 opposite to the first resin layer 10 side toward the first resin layer 10 side, The width of trench 25 may be substantially constant in the depth direction.
  • the width and depth of trench 25 typically substantially match the width and thickness of conductive layer 30, respectively.
  • the width of the trench 25 means the maximum width in the direction perpendicular to the thickness direction of the conductive film 100 (extending direction of the conductive film 100), and the depth of the trench 25 means the width of the conductive film 100. It means the maximum depth in the thickness direction of the film 100.
  • the ratio of the depth of the trench 25 to the width of the trench 25 may be the same as the aspect ratio of the conductive layer 30 described later.
  • the thickness of the second resin layer 20 or the thickness of the second resin part 22 may be, for example, 1 ⁇ m or more, 1.5 ⁇ m or more, or 2 ⁇ m or more, and 5 ⁇ m or less, 4 ⁇ m or less, or 3 ⁇ m or less. It may be.
  • the conductive layer 30 may be a layer made of a single metal plating, or may be made of a plurality of metal platings of different metal types.
  • the metal plating as the conductive layer 30 may contain, for example, at least one metal selected from copper, nickel, cobalt, palladium, silver, gold, platinum, and tin, and may also contain copper.
  • the conductive layer 30 may further contain a nonmetallic element such as phosphorus as long as conductivity is maintained.
  • the metal forming the seed layer and the metal forming the upper metal plating layer may be the same or different.
  • the seed layer may contain nickel and the upper metal plating layer may contain copper.
  • the upper metal plating layer may be composed of a copper plating layer formed on the seed layer and a top layer containing gold or palladium formed on the copper plating layer.
  • the conductive layer 30 may have a pattern including linear parts.
  • the pattern of the conductive layer 30 may include a plurality of linear portions arranged while extending in a certain direction.
  • the conductive layer 30 may have a mesh pattern including linear portions.
  • the width of the linear portion of the conductive layer 30 may be 1 ⁇ m or more, 10 ⁇ m or more, or 20 ⁇ m or more, and may be 90 ⁇ m or less, 70 ⁇ m or less, or 30 ⁇ m or less.
  • the width of the linear portion of the conductive layer 30 refers to the maximum width in the extending direction of the conductive layer 30. From the viewpoint of improving the transparency of the conductive film 100, the width of the linear portion of the conductive layer 30 may be 0.3 ⁇ m or more, 0.5 ⁇ m or more, or 1.0 ⁇ m or more, and 5.0 ⁇ m or less, It may be 4.0 ⁇ m or less, or 3.0 ⁇ m or less.
  • the thickness of the conductive layer 30 may be 0.1 ⁇ m or more, 1.0 ⁇ m or more, or 2.0 ⁇ m or more, and may be 10.0 ⁇ m or less, 5.0 ⁇ m or less, or 3.0 ⁇ m or less.
  • the width and thickness of the linear portion of the conductive layer 30 can be adjusted by changing the design of the mold 50, which will be described later, and by changing the width and thickness of the trench 25.
  • the aspect ratio of the conductive layer 30 may be, for example, 0.1 or more, 0.5 or more, or 1.0 or more, or 10.0 or less, 7.0 or less, or 4.0 or less. good.
  • the aspect ratio of the conductive layer 30 means the ratio of the thickness of the conductive layer 30 to the width of the conductive layer 30 (thickness/width).
  • FIG. 4A a first resin layer 10 containing first inorganic particles 11 is formed on one surface 1S of a film-like base material 1.
  • the first resin layer 10 is formed by, for example, applying a coating liquid containing a resin component forming the first resin part 12, first inorganic particles 11, and a solvent onto the base material 1, and removing the solvent from the coating on the material 1.
  • the step of (a) in FIG. 4 may be a step of preparing a laminate including the base material 1 and the first resin layer 10 formed on the base material 1.
  • a second inorganic particle-containing layer 40 is formed on the surface 10S of the first resin layer 10 on the side opposite to the base material 1.
  • the second inorganic particle-containing layer 40 is a layer containing second inorganic particles 21 and a third resin portion 41.
  • the third resin part 41 may include the same material as the second resin part 22.
  • the step in FIG. 4B may be a step of preparing a laminate including the base material 1, the first resin layer 10, and the second inorganic particle-containing layer 40 in this order.
  • the first inorganic particles 11 are exposed from the surface 10S of the first resin layer 10.
  • a method for exposing the first inorganic particles 11 from the surface 10S for example, the laminate shown in FIG. 41, and a method of removing a part of the first resin part 12 in the first resin layer 10. Due to the ashing process, the first resin layer 10 becomes thinner than at the time of FIG. 4(b). Although a part of the first resin part 12 is removed by the ashing process, the first inorganic particles 11 that were present in the first resin part 12 are not removed and form the base of the first resin layer 10.
  • the third resin portion 41 in the second inorganic particle-containing layer 40 may be completely removed by ashing treatment, and a portion may remain on the surface 10S of the first resin layer 10. Good too.
  • the second inorganic particles 21 in the second inorganic particle-containing layer 40 are removed from the surface 10S of the first resin layer 10. deposit on top.
  • the deposited second inorganic particles 21 may be attached to the first resin portion 12 or the exposed first inorganic particles 11a.
  • the first resin portion 12 in the first resin layer 10 and the third resin portion 41 in the second inorganic particle-containing layer 40 are removed, and the first resin layer It may be a step of exposing a plurality of first inorganic particles 11 on the surface 10S of 10.
  • a second resin layer 20 is formed on the surface 10S of the first resin layer 10. Specifically, by applying a resin composition containing a resin component that forms the second resin portion 22 onto the surface 10S of the first resin layer 10 on which the second inorganic particles 21 are deposited, A second resin layer 20 containing a second resin portion 22 and second inorganic particles 21 is formed.
  • the step of (d) in FIG. 4 may be a step of preparing a laminate including the base material 1, the first resin layer 10, and the second resin layer 20 in this order.
  • a trench 25 is formed in the second resin layer 20 by an imprint method using a mold 50 having a convex portion 50a.
  • a mold 50 having a convex portion 50a of a predetermined shape is moved in the direction shown by arrow A to be pushed into the second resin layer 20 ((a) in FIG. 5).
  • the mold 50 may be pushed in until the tip of the convex portion 50a reaches the first resin layer 10.
  • the second resin portion 22 is cured if necessary.
  • the second resin part 22 before hardening includes a photocurable resin
  • the second resin part 22 is hardened by irradiating light such as ultraviolet rays.
  • a trench 25 having a shape that is an inversion of the shape of the convex portion 50a of the mold 50 is formed ((b) in FIG. 5).
  • the method for forming the trenches 25 is not limited to the imprint method, and the trenches 25 may be formed by, for example, laser, dry etching, or photolithography.
  • the trench 25 extends on the first resin layer 10 so that a pattern corresponding to the conductive layer 30 is formed.
  • the second resin portion remaining on the first resin layer 10 in the trench 25 is etched by dry etching or the like. 22 may be removed.
  • the steps of (a) and (b) in FIG. 5 are performed in a laminate including a base material 1, a first resin layer 10, and a second resin layer 20 in this order. It may be a step of forming trenches 25 that open on the surface opposite to one resin layer 10.
  • the mold 50 may be made of quartz, Ni, ultraviolet curable liquid silicone rubber (PDMS), or the like.
  • the shape of the convex portion 50a of the mold 50 is designed according to the shape of the trench 25 to be formed.
  • a conductive layer 30 filling the trench 25 is formed.
  • the conductive layer 30 may be formed by an electroless plating method in which metal plating is grown from the first resin layer 10. By immersing the laminate in which the trench 25 is formed in an electroless plating solution containing metal ions, metal plating can be grown from the bottom of the trench 25 to form the conductive layer 30. By forming the conductive layer 30 filling the trench 25, the conductive film 100 can be obtained.
  • the electroless plating solution contains metal ions that constitute the conductive layer 30.
  • the electroless plating solution may further contain phosphorus, boron, iron, etc.
  • the temperature of the electroless plating solution when the laminate is immersed in the electroless plating solution may be, for example, 40 to 90°C.
  • the immersion time in the electroless plating solution varies depending on the thickness of the conductive layer 30, and may be, for example, 10 to 30 minutes.
  • the conductive layer having a seed layer and an upper metal plating layer is formed by forming a seed layer (first metal layer) on the first resin layer 10 and forming an upper metal plating layer (second metal layer) on the seed layer.
  • a seed layer first metal layer
  • an upper metal plating layer second metal layer
  • Metal plating is formed as a seed layer on the first resin layer 10 by immersing the laminate in which the trench 25 is formed in an electroless plating solution for forming a seed layer.
  • an upper metal plating layer can be formed on the seed layer by immersing the laminate having the seed layer in an electroless plating solution for forming an upper metal plating layer.
  • a catalyst may be adsorbed to the seed layer, and the upper metal plating layer may be formed using the catalyst adsorbed to the seed layer as a starting point.
  • the thickness of the seed layer may be 10 nm or more, 30 nm or more, or 50 nm or more, and may be 500 nm or less, 300 nm or less, or 100 nm or less.
  • FIG. 6 is a cross-sectional view showing an embodiment of a display device incorporating the conductive film 100.
  • the display device 500 shown in FIG. 6 includes an image display section 60 having an image display area 60S, a conductive film 100, a polarizing plate 70, and a cover glass 80.
  • the conductive film 100, the polarizing plate 70, and the cover glass 80 are laminated in this order from the image display section 60 side on the image display area 60S side of the image display section 60.
  • the configuration of the display device is not limited to the form shown in FIG. 6, and can be modified as necessary.
  • the polarizing plate 70 may be provided between the image display section 60 and the conductive film 100.
  • the image display section 60 may be, for example, a liquid crystal display section.
  • the polarizing plate 70 and the cover glass 80 those commonly used in display devices can be used.
  • the polarizing plate 70 and the cover glass 80 do not necessarily need to be provided.
  • a display device is illustrated as an example of a device to which the conductive film is applied
  • the conductive film may be applied to devices other than the display device.
  • a conductive film may be applied to the glass of buildings, automobiles, etc. as a transparent antenna.
  • the technology according to the present disclosure includes, but is not limited to, the following configuration examples.
  • a conductive film according to one aspect of the present disclosure includes a base material, a first resin layer provided on the base material, and a conductive film provided on the first resin layer and opposite to the first resin layer.
  • a second resin layer having a trench opening on the surface and a conductive layer provided in the trench, the first resin layer including a first resin portion and a plurality of first inorganic particles, At least some of the plurality of first inorganic particles partially protrude from the first resin portion to the second resin layer side.
  • the plurality of first inorganic particles partially protrude from the first resin layer to the second resin layer side, so that the first resin layer
  • the surface area of the resin increases, and the adhesion between the first resin layer and the second resin layer improves.
  • the plurality of first inorganic particles may be unevenly distributed on the second resin layer side in the first resin layer. According to this, since the first inorganic particles are present in large numbers on the second resin layer side of the first resin layer, the adhesion between the first resin layer and the second resin layer is improved. improves.
  • the second resin layer includes a second resin part and a plurality of second inorganic particles, and the plurality of second inorganic particles are attached to the first resin in the second resin layer. It may be unevenly distributed on the layer side. According to this, since the second resin layer contains a plurality of second inorganic particles on the first resin layer side, the adhesion between the first resin layer and the second resin layer is further improved. do.
  • a plurality of second inorganic particles are arranged around the portion of each of the plurality of first inorganic particles partially protruding toward the second resin layer side. Particles may be present. According to this, the adhesion between the first resin layer and the second resin layer is further improved.
  • the average particle diameter of the plurality of second inorganic particles may be smaller than the average particle diameter of the plurality of first inorganic particles. According to this, the first inorganic particles protruding from the first resin layer and the second inorganic particles contained in the second resin layer and smaller than the first inorganic particles cause the first resin layer to The adhesion between the conductive film and the second resin layer is further improved, and the transparency of the conductive film is also improved.
  • the average particle diameter of the plurality of second inorganic particles may be 10 nm or less. According to this, the transparency of the conductive film is improved.
  • the second inorganic particles which account for 80% or more of the total number of the plurality of second inorganic particles, are located at a distance from the surface of the first resin layer. It may be distributed within a region that is 1 ⁇ 3 or less of the thickness. According to this, the transparency of the conductive film is improved while ensuring adhesion between the first resin layer and the second resin layer.
  • a display device includes the above-mentioned conductive film.
  • a display device including a conductive film with high adhesion between the first resin layer and the second resin layer can be obtained.
  • the present disclosure includes, for example, the following [1] to [8].
  • Base material a first resin layer provided on the base material; a second resin layer provided on the first resin layer and having a trench opening on a surface opposite to the first resin layer; A conductive layer provided in the trench,
  • the first resin layer includes a first resin part and a plurality of first inorganic particles, A conductive film in which at least some of the plurality of first inorganic particles partially protrude from the first resin portion to the second resin layer side.
  • the second resin layer includes a second resin part and a plurality of second inorganic particles,
  • a plurality of second inorganic particles are arranged around a portion of each of the plurality of first inorganic particles that partially protrudes toward the second resin layer side.
  • the conductive film according to [3] or [4], wherein the average particle diameter of the plurality of second inorganic particles is smaller than the average particle diameter of the plurality of first inorganic particles.
  • the second inorganic particles whose number is 80% or more of the total number of the plurality of second inorganic particles are such that the distance from the surface of the first resin layer is that of the first resin layer.
  • a display device comprising the conductive film according to any one of [1] to [7].
  • Example 1 A coating liquid for forming a first resin layer containing silica particles (average particle diameter 100 nm), an acrylic resin, and a solvent was prepared. This coating liquid was applied onto a COP film (thickness: 100 ⁇ m), and the solvent was removed from the coating film on the COP film in a hot air drying oven. Next, the coating film is irradiated with ultraviolet rays using a UV treatment device to cure the coating film, and a first resin portion with a thickness of 300 ⁇ m containing a first resin part and silica particles (first inorganic particles) is formed on the COP film. A resin layer was formed.
  • a coating liquid for forming a second inorganic particle-containing layer containing Pd fine particles (average particle diameter 5 nm), an acrylic resin, and a solvent was prepared. This coating liquid was applied onto the first resin layer, and the solvent was removed from the coating film on the first resin layer in a hot air drying oven. Next, the coating film is irradiated with ultraviolet rays using a UV treatment device to cure the coating film, and a second inorganic particle-containing layer with a thickness of 60 ⁇ m containing Pd fine particles (second inorganic particles) is formed on the first resin layer. A laminate was obtained.
  • the laminate After forming the second inorganic particle-containing layer, the laminate is placed in a vacuum device, and the surface of the second inorganic particle-containing layer is subjected to ashing treatment, and the resin part in the second inorganic particle-containing layer and the first The surface resin portion of the resin layer was removed.
  • the thickness of the first resin layer after the ashing treatment was 260 ⁇ m.
  • a UV curable resin was applied to the surface of the first resin layer after the ashing treatment to form a coating film with a thickness of 2 ⁇ m.
  • a mold having a convex portion is pushed into this coating film so that the tip of the convex portion of the mold reaches the surface of the first resin layer, and in this state, the coating film is irradiated with ultraviolet rays to harden the coating film.
  • Ta By removing the mold from the cured coating film, a second resin layer is formed in which linear trenches having a mesh-like pattern are formed, which intersect with each other and are open on the surface opposite to the first resin layer. formed a layer.
  • the laminate was placed in a vacuum apparatus, and an ashing process was performed to remove the resin constituting the second resin layer remaining at the bottom of the trench.
  • the laminate was immersed in an electroless plating solution containing nickel sulfate and sodium hypophosphite to grow Ni plating from the surface of the first resin layer to form a Ni layer in the trench.
  • the laminate on which the Ni layer was formed was immersed in an aqueous solution containing Pd.
  • the laminate after forming the Pd layer is immersed in an electroless plating solution containing copper sulfate and formalin, and Cu plating is grown on the Ni layer starting from the Pd layer to form a Cu layer in the trench. did.
  • a conductive layer including a Ni layer, a Pd layer, and a Cu layer and having a mesh pattern was formed in the trench, and a conductive film was obtained.
  • the mesh part of the conductive film was cut out into a plate shape using an FIB (focused ion beam), and a sample for TEM observation was prepared by performing a thin section process. And so.
  • a sample for TEM observation was prepared by performing a thin section process.
  • the prepared sample was subjected to bright field observation using a TEM (equipment name: JEM-2011F) at an accelerating voltage of 200 kV, it was found that some of the plurality of silica particles were transferred from the first resin part to the second resin part. It was confirmed that the resin layer was partially protruding from the resin layer side.
  • Example 2 A conductive film was produced in the same manner as in Example 1 except that the second inorganic particle-containing layer was not formed.
  • the cross section of the obtained conductive film in the thickness direction was observed using a TEM, it was found that some of the plurality of silica particles moved from the first resin part to the second resin layer side in the TEM image. silica particles are partially protruding, the plurality of silica particles are unevenly distributed on the second resin layer side in the first resin layer, and the majority (95%) of the plurality of Pd fine particles in the second resin layer.
  • a conductive film was produced in the same manner as in Example 1, except that the ashing treatment was not performed before forming the second resin layer.
  • the TEM image showed that the plurality of silica particles were uniformly dispersed in the first resin layer, and the silica particles were dispersed from the first resin part. No silica particles partially protruding to the second resin layer side were observed.
  • Adhesion was evaluated by a cross-cut test specified in JIS K 5600. Specifically, incisions were made on the surface of the second resin layer using a cutter knife to form a right-angled lattice pattern (25 squares). Next, a tape was pasted on the grid pattern, the surface of the second resin layer and the tape were brought into close contact, and then the tape was peeled off. The lattice pattern after the tape was peeled off was observed with an optical microscope, and the evaluation was made as A when no peeling of the second resin layer was observed and B when peeling of the second resin layer was confirmed.
  • SYMBOLS 1 Base material, 10... First resin layer, 11, 11a, 11b... First inorganic particle, 12... First resin part, 20... Second resin layer, 21... Second inorganic particle, 22 ...Second resin part, 25...Trench, 30...Conductive layer, 40...Second inorganic particle-containing layer, 41...Third resin part, 50...Mold, 60...Image display part, 70...Polarizing plate, 80 ... Cover glass, 100 ... Conductive film, 500 ... Display device.

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
PCT/JP2023/008405 2022-03-29 2023-03-06 導電性フィルム及び表示装置 Ceased WO2023189250A1 (ja)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07156326A (ja) * 1993-12-02 1995-06-20 Dainippon Printing Co Ltd 透明機能性フィルム及びその製造方法
JPH11163018A (ja) * 1997-11-28 1999-06-18 Toshiba Corp 半導体装置の製造方法、多層配線基板及びその製造方法
JP2005194327A (ja) * 2003-12-26 2005-07-21 Toshiba Corp 金属微粒子含有樹脂粒子、金属微粒子含有樹脂層および金属微粒子含有樹脂層の形成方法
JP2019029659A (ja) * 2017-07-28 2019-02-21 Tdk株式会社 導電性基板、電子装置及び表示装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07156326A (ja) * 1993-12-02 1995-06-20 Dainippon Printing Co Ltd 透明機能性フィルム及びその製造方法
JPH11163018A (ja) * 1997-11-28 1999-06-18 Toshiba Corp 半導体装置の製造方法、多層配線基板及びその製造方法
JP2005194327A (ja) * 2003-12-26 2005-07-21 Toshiba Corp 金属微粒子含有樹脂粒子、金属微粒子含有樹脂層および金属微粒子含有樹脂層の形成方法
JP2019029659A (ja) * 2017-07-28 2019-02-21 Tdk株式会社 導電性基板、電子装置及び表示装置の製造方法

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