JPWO2023189250A1 - - Google Patents
Info
- Publication number
- JPWO2023189250A1 JPWO2023189250A1 JP2024511582A JP2024511582A JPWO2023189250A1 JP WO2023189250 A1 JPWO2023189250 A1 JP WO2023189250A1 JP 2024511582 A JP2024511582 A JP 2024511582A JP 2024511582 A JP2024511582 A JP 2024511582A JP WO2023189250 A1 JPWO2023189250 A1 JP WO2023189250A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/56—Insulating bodies
- H01B17/64—Insulating bodies with conductive admixtures, inserts or layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022053995 | 2022-03-29 | ||
| PCT/JP2023/008405 WO2023189250A1 (ja) | 2022-03-29 | 2023-03-06 | 導電性フィルム及び表示装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023189250A1 true JPWO2023189250A1 (https=) | 2023-10-05 |
Family
ID=88201307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024511582A Pending JPWO2023189250A1 (https=) | 2022-03-29 | 2023-03-06 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20250022629A1 (https=) |
| JP (1) | JPWO2023189250A1 (https=) |
| WO (1) | WO2023189250A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3332534B2 (ja) * | 1993-12-02 | 2002-10-07 | 大日本印刷株式会社 | 透明機能性フィルムの製造方法 |
| JPH11163018A (ja) * | 1997-11-28 | 1999-06-18 | Toshiba Corp | 半導体装置の製造方法、多層配線基板及びその製造方法 |
| JP4166686B2 (ja) * | 2003-12-26 | 2008-10-15 | 株式会社東芝 | 金属微粒子含有樹脂粒子、金属微粒子含有樹脂層および金属微粒子含有樹脂層の形成方法 |
| JP7375294B2 (ja) * | 2017-07-28 | 2023-11-08 | Tdk株式会社 | 導電性基板、電子装置及び表示装置の製造方法 |
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2023
- 2023-03-06 JP JP2024511582A patent/JPWO2023189250A1/ja active Pending
- 2023-03-06 WO PCT/JP2023/008405 patent/WO2023189250A1/ja not_active Ceased
-
2024
- 2024-09-26 US US18/897,309 patent/US20250022629A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023189250A1 (ja) | 2023-10-05 |
| US20250022629A1 (en) | 2025-01-16 |