WO2023185843A9

WO2023185843A9 - Waveguide antenna assembly, radar, terminal, and preparation method for waveguide antenna assembly

Info

Publication number: WO2023185843A9
Application number: PCT/CN2023/084390
Authority: WO
Inventors: 徐劲拓; 黄明利; 程喆; 刘山当
Original assignee: 华为技术有限公司
Priority date: 2022-03-31
Filing date: 2023-03-28
Publication date: 2023-11-09
Also published as: CN114784489A; CN114784489B; WO2023185843A1

Abstract

The present application relates to the technical field of communication and aims to solve the problem of a poor matching degree between a waveguide antenna and a transition structure. Provided are a waveguide antenna assembly, a radar, a terminal, and a preparation method for the waveguide antenna assembly. The waveguide antenna assembly comprises a first base plate, a second base plate and a transition structure. The first base plate is provided with a first plate surface and a second plate surface facing away from the first plate surface. The transition structure is arranged on the first base plate, a microstrip connecting end of the transition structure is arranged on the first plate surface, and a waveguide connecting end is arranged on the second plate surface. The second base plate is arranged on the second plate surface and is provided with a through hole, the through hole penetrates through the thickness of the second base plate, and a conductive layer is provided on an inner wall of the through hole. The through hole, which has the conductive layer, can form a waveguide antenna, and the projection of the waveguide connecting end on the second base plate is located in the through hole, so that the through hole is coupled to the transition structure. The waveguide antenna assembly provided by the present application can ensure good matching and signal transmission performance between the transition structure and the waveguide antenna.

Description

Waveguide antenna assembly, radar, terminal and method for preparing waveguide antenna assembly

Cross-references to related applications

This application requires the priority of the Chinese patent application submitted to the China Patent Office on March 31, 2022, with the application number 202210346782.9 and the application name "Waveguide antenna assembly, radar, terminal and waveguide antenna assembly preparation method", and its entire content incorporated herein by reference.

Technical field

The present application relates to the field of communication technology, and in particular to a waveguide antenna component, a radar, a terminal, and a method of manufacturing a waveguide antenna component.

Background technique

Waveguide antennas have obvious advantages in low loss and high bandwidth, making it easy to achieve high efficiency, long-distance coverage, and high distance resolution. In addition, the waveguide antenna has a wider horizontal beam bandwidth, which can provide a larger field of view and broaden the detection range. Therefore, waveguide antennas are gradually widely used.

In the practical application of waveguide antennas, it needs to be connected to chips and other devices. However, since the outgoing lines of devices such as chips are generally microstrip lines, and the interface of the waveguide antenna is a standard waveguide structure, energy cannot be transmitted directly. In order to realize signal transmission between devices such as waveguide antennas and chips, a transfer structure is required to realize the connection between the waveguide structure and the microstrip line. Among them, the main function of the transfer structure is to realize the conversion of electromagnetic energy of different modes in microstrip lines and waveguides, and to reduce the energy loss in the process of energy conversion of different modes.

At present, there are still many problems with the matching between the waveguide antenna and the transfer structure, resulting in a large assembly accuracy problem between the waveguide antenna and the transfer structure. In addition, problems such as poor signal transmission effect are also prone to occur. Therefore, there is an urgent need for solve.

Contents of the invention

The present application provides a method for manufacturing a waveguide antenna component, a radar, a terminal and a waveguide antenna component that are easy to manufacture and can ensure good matching and signal transmission performance between the transfer structure and the waveguide antenna.

On the one hand, the present application provides a waveguide antenna assembly, including a transfer structure and a waveguide antenna. Specifically, the waveguide antenna assembly may include a first substrate and a second substrate. The first substrate has a first plate surface and a second plate surface, wherein the second plate surface is away from the first plate surface. The transfer structure is provided on the first substrate and is used to realize conversion between microstrip signals and waveguide signals. The transfer structure has a microstrip connection end and a waveguide connection end. The microstrip connection end is located on the first board surface and can be connected to the microstrip line. The waveguide connection end is located on the second board surface and can be coupled with the waveguide antenna (or waveguide structure) provided on the second board surface. The second substrate is disposed on the second surface of the first substrate, and the waveguide antenna is disposed on the second substrate. Specifically, the second substrate has a through hole, the through hole penetrates the thickness of the second substrate, and the inner wall of the through hole has a conductive layer. The through hole with the conductive layer can emit electromagnetic waves to the outside world or receive electromagnetic waves from the outside world. That is, the through hole with the conductive layer is used to form a waveguide antenna. Alternatively, the waveguide antenna can be understood as a through hole and a conductive antenna located inside the through hole. combination of layers. In order to achieve coupling between the through hole and the transfer structure, the projection of the waveguide connection end of the transfer structure on the second substrate is located within the through hole. In addition, the cross-sectional area of the through hole can be gradually increased in the direction away from the first substrate. .

In the waveguide antenna assembly provided by the present application, the waveguide antenna is disposed on the second substrate, and the second substrate may be a printed circuit board. Circuit boards (printed circuit boards, PCB) or flexible printed circuits, FPC. Therefore, when manufacturing waveguide antennas, mature processes related to the preparation of PCB or FPC can be used, which can effectively reduce the manufacturing cost. Cost and difficulty. In addition, the first substrate can also be a printed circuit board (PCB) or a flexible printed circuit (FPC). When the first substrate and the second substrate are combined, it is beneficial to realize the transfer structure and the antenna. Good matching between them, thereby improving signal transmission efficiency and ensuring antenna performance. In addition, along the direction away from the first substrate, the cross-sectional area of the through hole can be gradually increased, and the shape of the through hole can be reasonably set according to actual needs, so that the radiation range and gain of the antenna can be effectively taken into consideration, which is beneficial to improving the waveguide antenna. Component performance.

In specific applications, the shapes of the through holes can be diverse.

For example, the diameter of the through hole can be proportional to the distance between the through hole and the first substrate, so that the radiation range and gain of the antenna can be effectively taken into consideration, thereby improving the working performance of the waveguide antenna assembly.

Alternatively, the inner wall of the through hole may be stepped in the axial direction of the through hole. In specific applications, the number and gradient of steps can be reasonably adjusted according to actual conditions, and this application does not limit this.

It can be understood that in other embodiments, the opening size of the through hole, the shape of the inner wall, and the increase in the opening size can be reasonably set according to the actual situation. In addition, the cross-sectional shape of the through hole can be circular or oval. , polygon or irregular shape, this application does not specifically limit this.

In addition, the types and setting methods of the transfer structure can also be diverse.

For example, the transfer structure may be a substrate integrated waveguide. One end of the substrate integrated waveguide can be used as a microstrip connection end, and the other end is equipped with an electric wall. The substrate integrated waveguide also has a slit, the slit is located on the second plate surface of the second substrate, and the slit forms the waveguide connection end. That is, the electromagnetic wave propagating in the substrate integrated waveguide can propagate into the through hole through the gap to achieve coupling between the gap (or the waveguide connection end) and the through hole.

The substrate integrated waveguide has the characteristics of simple structure, lightness and thinness. Therefore, when the substrate integrated waveguide is used as the transfer structure, it is beneficial to reduce the size of the waveguide antenna component and facilitate the realization of thin and light design. In addition, the substrate integrated waveguide has a relatively mature preparation process, so it is conducive to lower-cost production and use and can also ensure stable working performance.

When specifically setting up the electric wall, the electric wall can include metallized holes or conductive layers arranged in rows, which can effectively block electromagnetic waves in the substrate integrated waveguide, so that electromagnetic waves can effectively pass through the gaps to the channel. spread within the hole.

In specific settings, the distance between the gap and the electric wall can be 0.25λ, so that electromagnetic waves can efficiently propagate outward through the gap. Among them, λ is the wavelength of electromagnetic waves propagating in the substrate integrated waveguide. It can be understood that a distance close to (or greater than or less than) 0.25λ in engineering implementation is also within the protection scope of this application. The above distance between the gap and the electric wall can be 0.25λ as an example. In practical applications, the distance between the gap and the electric wall can be reasonably selected and adjusted according to the actual situation, and this application does not limit this.

Alternatively, in another example, the transfer structure may also be a probe waveguide structure. Specifically, one end of the probe waveguide structure can be used as a microstrip connection end. The probe waveguide structure may also include a radiation end, and the radiation end may be located on the first plate surface; wherein the waveguide connection end is a projection area of the radiation end on the second plate surface. The radiation end can emit electromagnetic waves, and the electromagnetic waves propagate into the through hole after passing through the second plate surface of the first substrate, thereby realizing coupling between the radiation end and the through hole.

In practical applications, waveguide antenna components can be adapted to many different types of transfer structures, with good design flexibility and wide applicability.

In addition, the above-mentioned first substrate and the second substrate may be independent plate structures, or may be different plate layers in an integrated multi-layer plate body. That is, the first substrate and the second substrate can be divided into different parts from an entire plate body.

In some implementations, the waveguide antenna assembly may also include a radio frequency chip and a microstrip line. The radio frequency chip and the microstrip line can be arranged on the first board surface of the first substrate. One end of the microstrip line can be connected to the radio frequency chip, and the other end can be connected to the microstrip connection end. Arranging the radio frequency chip on the first board surface facilitates the installation of a heat dissipation structure for heat dissipation of the radio frequency chip and other devices. In addition, the radio frequency chip can also be prevented from occupying the space of the second board surface, thereby preventing the chip from interfering with the second substrate. There is positional interference between them.

In some implementations, the waveguide antenna assembly may further include a shielding cover, and the shielding cover may be disposed on a side of the radio frequency chip facing away from the first substrate, thereby shielding electromagnetic waves. In addition, the shielding cover can also be attached to the RF chip so that the heat generated by the RF chip can be transferred to the shielding cover through thermal conduction to improve the heat dissipation performance of the RF chip.

On the other hand, the present application also provides a method for manufacturing a waveguide antenna assembly, which may include: providing a first substrate. The first substrate has a first board surface and a second board surface that is away from the first board surface; the first substrate is provided with a transfer structure, and the transfer structure is used to realize the conversion between microstrip signals and waveguide signals. The transfer structure It has a microstrip connection end and a waveguide connection end, the microstrip connection end is located on the first board surface, and the waveguide connection end is located on the second board surface. A second substrate is provided, a through hole is provided on the second substrate in a thickness direction of the second substrate, and a conductive layer is provided on the inner wall of the through hole.

Subsequently, the second substrate may be disposed on the second surface of the first substrate.

Alternatively, the second substrate may be disposed on the second surface of the first substrate first, and then a through hole penetrating through the thickness direction of the second substrate may be disposed on the second substrate, and a conductive layer may be disposed on the inner wall of the through hole.

In summary, when preparing a waveguide antenna component, structures such as through holes and conductive layers can be first provided on the second substrate, and then the second substrate is provided on the second surface of the first substrate. The second substrate may also be disposed on the second surface of the first substrate first, and then structures such as through holes and conductive layers may be disposed on the second substrate.

In addition, in some preparation methods, a metasurface can also be provided on the side of the through hole away from the first substrate to improve the working performance of the waveguide antenna assembly.

It can be understood that this application does not place specific limitations on the preparation process and sequence of the waveguide antenna assembly.

On the other hand, this application also provides a radar, including a housing and any one of the above-mentioned waveguide antenna components, or a waveguide antenna component prepared by any of the above-mentioned methods. The waveguide antenna component can be disposed in the housing, Thus, the housing can protect the waveguide antenna assembly.

It can be understood that in practical applications, waveguide antenna components can also be applied to many different types of electronic devices. This application does not limit the application scenarios of waveguide antenna components.

In addition, this application also provides a terminal, which may include the above-mentioned radar. The terminal may include a controller, and the controller may be connected to the microstrip connection end. Among them, the terminal can be a vehicle, a drone, etc. This application does not limit the specific application scenarios of radar (or waveguide antenna components).

Description of the drawings

Figure 1 is a schematic diagram of an application scenario of an antenna assembly provided by an embodiment of the present application;

Figure 2 is a schematic side structural diagram of a conventional antenna assembly;

Figure 3 is a schematic side structural view of another conventional antenna assembly;

Figure 4 is a schematic three-dimensional structural diagram of an antenna assembly provided by an embodiment of the present application;

Figure 5 is a perspective structural diagram of Figure 4;

Figure 6 is a schematic diagram of the top structure of Figure 4;

Figure 7 is a schematic structural diagram of the cross-section along AA in Figure 6;

Figure 8 is a schematic cross-sectional structural diagram of another antenna assembly provided by an embodiment of the present application;

Figure 9 is a schematic cross-sectional structural diagram of another antenna assembly provided by an embodiment of the present application;

Figure 10 is a schematic three-dimensional perspective structural diagram of a partial structure of an antenna assembly provided by an embodiment of the present application;

Figure 11 is a schematic perspective structural diagram of another antenna assembly provided by an embodiment of the present application;

Figure 12 is a schematic cross-sectional structural diagram of the back cavity in Figure 11;

Figure 13 is a schematic perspective structural diagram of another antenna assembly provided by an embodiment of the present application;

Figure 14 is a schematic diagram of the top structure of Figure 13;

Figure 15 is a schematic structural diagram of the B-B direction cross-section in Figure 14;

Figure 16 is a structural block diagram of an antenna assembly provided by an embodiment of the present application;

Figure 17 is a data diagram that can characterize the operating bandwidth of the antenna assembly shown in Figure 11 provided by an embodiment of the present application;

Figure 18 is an antenna pattern that can characterize the gain of the antenna assembly shown in Figure 11 provided by an embodiment of the present application;

Figure 19 is a three-dimensional directional diagram that can characterize the antenna assembly shown in Figure 11 provided by an embodiment of the present application;

Figure 20 is a schematic cross-sectional structural diagram of another antenna assembly provided by an embodiment of the present application;

Figure 21 is a schematic cross-sectional structural diagram of another antenna assembly provided by an embodiment of the present application;

Figure 22 is a schematic structural diagram of a terminal provided by an embodiment of the present application;

Figure 23 is a flow chart of a method for manufacturing an antenna assembly provided by an embodiment of the present application;

Figure 24 is a schematic cross-sectional structural diagram of an antenna assembly in a certain preparation state provided by an embodiment of the present application;

Figure 25 is a schematic cross-sectional structural diagram of an antenna assembly provided by an embodiment of the present application in another preparation state;

Figure 26 is a schematic cross-sectional structural diagram of an antenna assembly provided by an embodiment of the present application in another preparation state;

Figure 27 is a schematic cross-sectional structural diagram of an antenna assembly provided by an embodiment of the present application in another preparation state;

Figure 28 is a schematic cross-sectional structural diagram of an antenna assembly in another preparation state according to an embodiment of the present application;

Figure 29 is a flow chart of another preparation method of an antenna assembly provided by an embodiment of the present application;

Figure 30 is a schematic cross-sectional structural diagram of an antenna assembly provided by an embodiment of the present application in another preparation state;

Figure 31 is a schematic cross-sectional structural diagram of an antenna assembly provided by an embodiment of the present application in another preparation state;

Figure 32 is a schematic cross-sectional structural diagram of an antenna assembly provided by an embodiment of the present application in another preparation state;

FIG. 33 is a schematic cross-sectional structural diagram of an antenna assembly in another preparation state according to an embodiment of the present application.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be described in further detail below in conjunction with the accompanying drawings.

In order to facilitate understanding of the waveguide antenna assembly provided by the embodiment of the present application, its application scenarios are first introduced below.

The waveguide antenna assembly provided by the embodiment of the present application can be used in electronic equipment such as radar or detectors. The electronic equipment can realize conversion between microstrip signals and waveguide signals through the waveguide antenna assembly, and transmit electromagnetic waves to the outside world or receive electromagnetic waves from the outside world. .

For example, as shown in Figure 1, take the electronic device as a radar. Radar may include system on chip (SOC), radio frequency integrated circuit (RFIC) and waveguide antenna components. The radio frequency chip is connected to the system-level chip and the waveguide antenna assembly, and the system-level chip can transmit radio frequency signals to the waveguide antenna assembly through the radio frequency chip.

The waveguide antenna component can include a waveguide antenna and a transfer structure. The signal transmission structure of the waveguide antenna is generally a waveguide, while the signal transmission structure of the RF chip is generally a microstrip line. Therefore, the waveguide antenna and the RF chip need to be connected through a corresponding transfer structure. Structures are connected to achieve signal conversion and efficient transmission.

With the continuous development of communication technology, radar has begun to be widely used in vehicles to implement functions such as assisted driving or automatic driving. As a common design method for vehicle-mounted radar, planar phased array antenna requires a large number of antenna arrays to be laid out on the circuit board. The planar phased array antenna refers to an antenna that changes the shape of the pattern by controlling the feed phase of each antenna. Controlling the phase can change the direction of the maximum value of the antenna pattern to achieve the purpose of beam scanning, which can effectively improve Radar scanning speed and accuracy.

As shown in Figure 2, the current waveguide antenna 02 and the radio frequency chip 01 are mainly arranged on the same board surface of the circuit board 03 (the upper board surface in Figure 1). However, due to the limited area of the circuit board 03, the radio frequency chip 01 It will occupy a large space, so it is not conducive to increasing the number of waveguide antennas 02 laid out. In addition, when the waveguide antenna 02 and the radio frequency chip 01 are arranged on the same board of the circuit board 03, it is difficult to balance the heat dissipation performance of the radio frequency chip 01 and the radiation performance of the waveguide antenna 02. For example, the heat dissipation structure may cause positional interference with the waveguide antenna 02. Therefore, the heat dissipation area (or volume) of the heat dissipation structure will be compressed, which will reduce the heat dissipation performance of the radio frequency chip 01. When the heat dissipation area (or volume) of the heat dissipation structure is large, the heat dissipation structure will cause adverse effects such as obstruction to the electromagnetic waves generated by the waveguide antenna 02 , thus reducing the radiation performance of the waveguide antenna 02 .

As shown in Figure 3, in other current implementations, in order to increase the number of waveguide antennas 02 and the heat dissipation performance of the radio frequency chip 01, the waveguide antennas 02 and the radio frequency chip 01 can be arranged on different surfaces of the circuit board 03. That is, layout on different sides. For example, the waveguide antenna 02 can be disposed on the upper surface of the circuit board 03 , and the radio frequency chip 01 can be disposed on the lower surface of the circuit board 03 . That is, the waveguide antenna 02 and the radio frequency chip 01 can be implemented by being arranged in different planes.

The current waveguide antenna 02 is usually made by metal machining or plastic plating, and then the waveguide antenna 02 is assembled on the circuit board 03 . However, the current transfer structure and the waveguide antenna 02 have relatively high requirements for the position, and a gap will inevitably occur between the waveguide antenna 02 and the transfer structure, affecting the working performance of the waveguide antenna 02 .

To this end, embodiments of the present application provide a waveguide antenna assembly that is easy to manufacture and can ensure good matching and signal transmission performance between the transfer structure and the waveguide antenna.

In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

The terminology used in the following examples is for the purpose of describing specific embodiments only and is not intended to limit the application. As used in the specification and appended claims of this application, the singular expressions "a", "an" and "the" are intended to also include expressions such as "one or more" unless Its context clearly indicates the contrary. It should also be understood that in the following embodiments of this application, "at least one" means one, two or more than two.

Reference in this specification to "one embodiment" or the like means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the application. Thus, various appearances in this specification of the phrases "in one embodiment," "in some embodiments," "in additional embodiments," etc., are not necessarily all referring to the same embodiment, but rather means "one or more but not all embodiments" unless otherwise specifically emphasized. The terms "including", "having" and variations thereof all mean "including but not limited to" unless otherwise specifically emphasized.

As shown in Figure 4, in one embodiment provided by the present application, the waveguide antenna assembly 10 may include a transfer structure 13 and a waveguide antenna (not shown in the figure). The transfer structure 13 is provided on the first substrate 11, and the waveguide antenna disposed on the second substrate 12. Specifically, the first substrate 11 has a first board surface 11a (the upper board surface in Figure 4) and a second board surface (the lower board surface in Figure 4), wherein the second board surface and the first board surface 11a is divergent. The switching structure 13 is used to realize conversion between microstrip signals and waveguide signals. Specifically, the electrical signal propagating in the microstrip line is a TEM wave (transverse electromagnetic wave), and the electrical signal propagating in the waveguide structure is a TE wave (transverse electric wave). TEM wave refers to an electromagnetic wave in which the electric field and magnetic field of the electromagnetic wave are on a plane perpendicular to the propagation direction. TE waves refer to electromagnetic waves in which the electric field vector is perpendicular to the propagation direction, and the components of the magnetic field vector include both perpendicular to the propagation direction and parallel to the propagation direction. The switching structure 13 is used to realize conversion between TEM waves and TE waves. In the transfer structure 13 shown in the figure, the transfer structure 13 is roughly T-shaped, and one end is a microstrip connection end 13a, which can be connected to a microstrip line. The other end is the radiation end 1321 , which can be used to radiate electromagnetic waves in the direction of the second substrate 12 . Since the transfer structure 13 is disposed on the first substrate 11, the transfer structure 13 and the first substrate 11 can be regarded as an integral structure, and the vertical projection of the radiation end 1321 on the second surface 11b of the first substrate 11 can be regarded as Waveguide connection end 13b. The waveguide connection end 13b is located on the second board surface and can be coupled with the waveguide antenna (or waveguide structure) provided on the second board surface. In the embodiment provided in this application, the waveguide antenna is provided on the second substrate 12, and the second substrate 12 can be manufactured using a PCB process, that is, the waveguide antenna can be manufactured using a process related to manufacturing a PCB. Since the PCB process is relatively mature and stable, it can effectively reduce the production cost and difficulty, and is conducive to ensuring the production quality to achieve a good match between the transfer structure 13 and the waveguide antenna, thereby improving the signal transmission efficiency and ensuring the waveguide antenna. performance.

For details, please refer to Figure 5, Figure 6 and Figure 7 in combination. The second substrate 12 is disposed on the second plate surface 11b (the lower plate surface in FIG. 4 ) of the first substrate 11. The second substrate 12 has a through hole 121 penetrating its thickness, and the inner wall of the through hole 121 has a conductive layer 122. The through hole 121 with the conductive layer 122 can emit electromagnetic waves to the outside world or receive electromagnetic waves from the outside world. That is, the through hole 121 with the conductive layer 122 is used to form a waveguide antenna. Alternatively, the waveguide antenna can be understood as the through hole 121 and the through hole located in the through hole. The combination of the conductive layer 122 inside the hole 121. In order to achieve coupling between the through hole 121 and the transfer structure 13 , the projection of the waveguide connection end 13 b of the transfer structure 13 on the second substrate 12 is located in the through hole 121 . The electromagnetic waves in the transfer structure 13 can be transmitted into the through hole 121 through the waveguide connection end 13b, and the electromagnetic waves can be emitted to the outside through the through hole 121. It should be noted that coupling represents the effective transmission of electromagnetic waves or energy between two components, and does not limit the mechanical structural connection relationship between the two components. In practical applications, in order to realize the coupling between two components, many different types of methods can be used in the mechanical mechanism.

In the embodiment provided in this application, the conversion between the microstrip structure and the waveguide structure can be realized through the transfer structure 13 to meet the signal transmission requirements between the microstrip line and the waveguide antenna. In addition, the microstrip connection end 13a is located on the first board surface 11a, and the waveguide connection end 13b is located on the second board surface 11b. That is, the microstrip connection end 13a and the waveguide connection end 13b are located on different boards of the first substrate 11. Therefore, it can be realized Differential transmission of signals. In summary, the transfer structure 13 can not only realize signal conversion between microstrips and waveguides, but also realize signal transmission in different planes. Therefore, it is beneficial to increase the number of through holes 121 (or waveguide antennas), thereby increasing Operational performance of waveguide antenna assembly 10. In addition, it is also convenient to arrange devices such as radio frequency chips (not shown in the figure) on the first board surface 11a, thereby facilitating the installation of a heat dissipation structure for dissipating heat from the radio frequency chips and other devices.

In addition, since the through hole 121 with the conductive layer 122 on the inner wall can realize the function of the waveguide antenna, it is beneficial to reduce the manufacturing cost and volume. For example, conventional waveguide antennas are usually manufactured using metal machining or plastic plating processes. Therefore, there are problems such as low manufacturing efficiency, complex processes, and low manufacturing accuracy. In the embodiment provided in this application, the second substrate 12 can use a PCB board as the blank material, therefore, the material cost can be effectively reduced. When the through hole 121 is formed on the second substrate 12 , it is easy to ensure the opening position and size of the through hole 121 , therefore, it is beneficial to achieve higher precision manufacturing. In addition, the conventional waveguide antenna is usually large in size (eg, the thickness is about 10mm-20mm), so in this paper In the embodiment provided by the application, the second substrate 12 can be made of PCB board material. Therefore, the thickness can be effectively controlled (for example, below 3 mm), which is beneficial to reducing the volume of the waveguide antenna assembly 10 . In addition, since the first substrate 11 and the second substrate 12 can both be plate structures, it is helpful to improve the accuracy of the assembly when assembling the first substrate 11 and the second substrate 12, thereby ensuring that the transfer structure 13 and The position accuracy between the through holes 121 can effectively avoid gaps, thereby ensuring the signal transmission quality between the transfer structure 13 and the through holes 121 . In addition, since the microstrip switching structure 13 can be directly coupled with the waveguide antenna through the waveguide connection end 13b, the signal transmission path can be effectively reduced, which is beneficial to reducing the insertion loss of the waveguide antenna assembly 10. For example, compared with the above-mentioned waveguide antenna assembly 10 using a vertical interconnection structure, the waveguide antenna assembly 10 of the embodiment of the present application can reduce the insertion loss by about 0.5 dB.

In specific implementation, the first substrate 11 can be a printed circuit board (PCB) or a flexible printed circuit (FPC), or other types of board structures. In addition, the first substrate 11 may be a single-layer board or a board material in which two, three or more layers are stacked. Alternatively, it can be understood that this application does not limit the specific material and number of layers of the first substrate 11 . In addition, the first plate surface 11a and the second plate surface 11b refer to the two outer surfaces of the first substrate 11 that are away from each other. For example, when the first substrate 11 is a single-layer board, the first board surface 11a and the second board surface 11b are respectively the board surfaces of the first substrate 11 that are away from each other. When the first substrate 11 is a multi-layer board, the first board surface 11 a and the second board surface 11 b are respectively the outer board surfaces of the two outermost boards of the first substrate 11 . When connecting the first substrate 11 and the second substrate 12, the fixed connection between the first substrate 11 and the second substrate 12 can be achieved through a connection layer (not shown in the figure). The material of the connecting layer may be polypropylene (PP) or other materials. Of course, the first substrate 11 and the second substrate 12 can also be fixedly connected by using connectors such as screws. This application does not specifically limit the connection method between the first substrate 11 and the second substrate 12 .

During fabrication, the through hole 121 can be formed on the second substrate 12 first, and the transfer structure 13 can be formed on the first substrate 11 . Then, the second substrate 12 is fixed on the second surface of the first substrate 11, thereby achieving a fixed connection between the first substrate 11 and the second substrate 12. At the same time, the connection between the transfer structure 13 and the through hole 121 can also be achieved. coupling. Alternatively, the second substrate 12 may be fixed on the second surface of the first substrate 11 first, and then structures such as the through holes 121 and the conductive layer 122 may be formed on the second substrate 12, which is not specifically limited in this application.

In specific configuration, the conductive layer 122 may be a metal material with good conductivity such as copper or aluminum. During production, electroplating, vapor deposition and other processes can be used for production. This application does not limit the specific material and production process of the conductive layer 122.

In addition, in specific applications, the shapes of the through holes 121 may be diverse.

For example, as shown in Figure 7, in another embodiment provided by this application, the through hole 121 is divided into two sections, namely a first section 121a and a second section 121b. The first section 121a is disposed close to the first substrate 11, The second section 121b is disposed away from the first substrate 11 . Among them, the first section 121a is a through hole, that is, the hole diameter of the first section 121a is approximately the same. During fabrication, since the first section 121a is a through hole, the hole diameter can be effectively controlled to facilitate higher-precision coupling with the waveguide connection end 13b of the first substrate 11. In addition, along the direction away from the first substrate 11, the cross-sectional area of the second section 121b gradually increases, that is, the diameter of the second section 121b of the through hole 121 is proportional to the distance between the through hole 121 and the first substrate 11, This can effectively take into account the radiation range and gain of the antenna, which is beneficial to improving the working performance of the antenna.

In addition, as shown in FIG. 8 , in one embodiment provided by the present application, the cross-sectional area of the through hole 121 gradually increases in the direction away from the first substrate 11 (the direction from top to bottom in the figure). Among them, the diameter of the through hole 121 is proportional to the distance between the through hole 121 and the first substrate 11 , so that the radiation range and gain of the antenna can be effectively taken into consideration, which is beneficial to improving the working performance of the waveguide antenna assembly 10 .

Of course, along the direction away from the first substrate 11, the cross-sectional area of the through hole 121 gradually increases. Specifically, it may include: to increase according to a fixed and specific proportion, that is, the magnitude of the increase is the same. Alternatively, the magnitude of the increase may vary.

In addition, as shown in FIG. 9 , in another embodiment provided by the present application, in the axial direction of the through hole 121 , the inner wall of the through hole 121 is stepped. Alternatively, along the direction away from the first substrate 11 (from top to bottom in the figure), the cross-sectional area of the through hole 121 increases stepwise. Specifically, the through hole in the axial direction can be divided into multiple sections. In each section, the cross-sectional area of the through hole is approximately the same, and there is a significant difference in the cross-sectional area between two adjacent sections. When opening through holes, drill bits of different diameters can be used to open each section separately, which will help reduce the difficulty of production. In specific applications, the number and gradient of steps can be reasonably adjusted according to actual conditions, and this application does not limit this.

It can be understood that in other embodiments, the opening size of the through hole 121, the shape of the inner wall, and the increase in the opening size can be reasonably set according to the actual situation. In addition, the cross-sectional shape of the through hole 121 can be circular or elliptical. shape, polygon or irregular shape, this application does not specifically limit this.

In addition, in the examples shown in FIGS. 7 , 8 and 9 , the second substrate 12 is a single-layer board. It can be understood that in other embodiments, the second substrate 12 may be a plurality of stacked plates. In practical applications, the second substrate 12 can be a printed circuit board (PCB) or a flexible printed circuit (FPC), or other types of board structures, or can be modified according to actual needs. The specific material and number of layers of the second substrate 12 are subject to reasonable adjustment, and are not specifically limited in this application.

For the transfer structure 13, in specific applications, it can be a variety of different types of structures capable of realizing microstrip and waveguide conversion.

For example, as shown in FIG. 10 , in an example provided by this application, the transfer structure 13 may be a probe waveguide structure. Specifically, the probe waveguide structure may include a floor 131, a transmission line 132 and a waveguide cavity 133. Among them, the floor 131 and the transmission line 132 are both arranged on the first surface of the first substrate 11 (not shown in the figure). The floor 131 is provided with a through slot 1311, and the transmission line 132 is arranged in the through slot 1311. Among them, the through slot 1311 and the transmission line 132 are generally T-shaped. One end of the transmission line 132 has a microstrip connection end 13a. The other end is the radiation end 1321, which is used to generate electromagnetic waves. Among them, the transition part of the T-shaped structure of the transmission line 132 can realize conversion and impedance transformation between microstrip signals and waveguide signals. The waveguide cavity 133 is disposed on the second plate surface of the first substrate 11 (not shown in the figure), and the end of the waveguide cavity 133 away from the first substrate 11 forms the waveguide connection end 13b.

In specific applications, the signal is transmitted from the microstrip connection end 13a to the radiation end 1321, and the microstrip signal and the waveguide signal are converted at the transition part of the T-shaped structure. The waveguide signal is transmitted through the waveguide cavity 133 toward the radiation end 1321. In specific applications, the end of the waveguide cavity 133 away from the first substrate 11 can be coupled with a through hole (or waveguide antenna), that is, the waveguide cavity 133 can play a bridging role for waveguide signals. The waveguide cavity 133 may be a dielectric waveguide or a metal waveguide. This application does not limit the specific structure type of the waveguide cavity 133. In addition, in other embodiments, the waveguide cavity 133 can also be omitted, and one end of the through hole 121 can directly contact the second plate and be coupled with the radiating end 1321, that is, the radiating end 1321 is on the second plate. The projection can form the waveguide connection end 13b.

It can be understood that in other embodiments, the transmission line 132 may also include a microstrip gradient transition structure and other structures capable of realizing impedance transformation to achieve conversion between microstrip signals and waveguide signals. In this application, the transmission line 132 And the specific shape of the through slot 1311 is not limited.

In addition, in specific applications, part of the electromagnetic waves generated by the radiation end 1321 may propagate in a direction away from the second substrate 12 .

Therefore, as shown in Figure 11, in another embodiment provided by this application, the waveguide antenna assembly 10 is also provided with a back cavity 134. The back cavity 134 is disposed on the first surface of the first substrate 11 (not shown in the figure) for reflecting the electromagnetic waves generated by the radiation end 1321 .

For details, please refer to Figure 11 and Figure 12 together. The bottom wall of the back cavity 134 has a metal wall 1341. When the electromagnetic wave generated by the radiation end 1321 propagates in the direction away from the second substrate 12, the metal wall 1341 will reflect the electromagnetic wave so that the electromagnetic wave can be transmitted in the direction of the second substrate 12, thereby effectively improving the transmission efficiency of the electromagnetic wave. , reduce signal loss.

In specific settings, the back cavity 134 can be made of insulating materials such as plastic, and the metal wall 1341 can be made of conductive materials such as copper on the bottom wall of the back cavity 134 through processes such as electroplating or coating. Alternatively, the back cavity 134 can be made of conductive material such as copper or aluminum, and the bottom wall of the back cavity 134 can constitute the metal wall 1341. This application does not limit the material or manufacturing process of the back cavity 134 and the bottom wall.

In specific applications, the distance between the metal wall 1341 and the radiation end 1321 can be one-quarter of the wavelength of the electromagnetic wave generated by the radiation end 1321 propagating in space, so that the metal wall 1341 can effectively reflect the electromagnetic waves. Effect. It can be understood that during specific implementation, the distance between the radiation end 1321 and the metal wall 1341 can be reasonably adjusted according to actual needs, and this application does not specifically limit this.

In addition, as shown in FIG. 10 , in the embodiment provided by this application, since the distance between the transmission line 132 and the floor 131 is relatively close, in order to ensure the stability of the signal when propagating in the transmission line 132 , the floor 131 faces the transmission line 132 Metalized holes 135 may be provided on one side. In specific applications, parameters such as the number, position, and size of the metallized holes 135 can be reasonably set according to actual needs, and this application does not specifically limit this.

In addition, as shown in Figures 13, 14 and 15, in another example provided by this application, the transfer structure 13 may be a substrate integrated waveguide (SIW).

Specifically, the substrate integrated waveguide is a structure in the form of a microwave transmission line, which uses metallized holes 138 to realize the field propagation mode of the waveguide on the dielectric substrate. Structurally, the substrate integrated waveguide mainly includes a dielectric substrate (not shown in the figure), and the upper surface of the dielectric substrate is provided with an upper metal layer 136, and the lower surface is provided with a lower metal layer 137. A plurality of metallized holes 138 are arranged in rows in the dielectric substrate and penetrate to the upper metal layer 136 and the lower metal layer 137 .

In the embodiment provided in this application, the substrate integrated waveguide can be directly fabricated in the first substrate 11 . That is, the first substrate 11 can be used as a dielectric substrate. In addition, in order to enable the electromagnetic waves in the substrate integrated waveguide to propagate into the through hole 121, a gap 1371 is opened in the lower metal layer 137 of the substrate integrated waveguide, and one end of the substrate integrated waveguide (the right end in the figure) is provided with an electrical Wall 139. The electric wall 139 can effectively block electromagnetic waves in the integrated waveguide, thereby allowing the electromagnetic waves to propagate outward through the gap 1371 .

In the embodiment provided in this application, the electric wall 139 includes a plurality of metallized holes arranged in a row. It can be understood that in other embodiments, the electric wall 139 may also be a metal layer or metal sheet that can block electromagnetic waves, and this application is not specifically limited to this.

In addition, the distance between the electric wall 139 and the gap 1371 may be 0.25 times the wavelength of the electromagnetic wave propagating in the substrate integrated waveguide (such as the first substrate 11), so that the electromagnetic wave can efficiently propagate outward through the gap 1371. The size and shape of the gap 1371 and the distance between the gap 1371 and the electric wall 139 can be reasonably adjusted according to the actual situation, and are not specifically limited in this application.

In addition, in other embodiments, the transfer structure 13 may also adopt other types of structures that can realize conversion between microstrip signals and waveguide signals, which is not specifically limited in this application.

In addition, in the above example, the waveguide antenna assembly 10 includes a transfer structure 13 and a through hole 121 as an example for illustration. It can be understood that in specific applications, two or more may be provided in the first substrate 11 or two or more transfer structures 13. Two or more through holes 121 may be provided in the second substrate 12 . When there are multiple transfer structures 13 and through holes 121 , the number of transfer structures 13 and through holes 121 can be the same, and the transfer structures 13 and the through holes 121 can be arranged in one-to-one correspondence.

For example, as shown in Figure 16, the waveguide antenna assembly may include four transfer structures. The four transfer structures are all connected to the same radio frequency chip, and each transfer structure is coupled to a corresponding waveguide antenna. It can be understood that the above is only an exemplary reference. In actual applications, the number and location of the waveguide antennas and transfer structures can be reasonably selected and adjusted according to actual needs, and this application does not limit this.

In order to facilitate the explanation of the technical effect of the waveguide antenna assembly 10 provided by the embodiment of the present application, experimental data diagrams are also provided.

As shown in FIG. 17 , a data plot is provided that can characterize the operating bandwidth of the waveguide antenna assembly 10 shown in FIG. 11 . In the figure, the abscissa represents frequency in GHz, and the ordinate represents amplitude in dB. In the industry, frequencies with amplitudes below -15dB are usually used as the operating bandwidth of waveguide antennas. Curve S1 represents a data plot of amplitude as a function of frequency. It can be clearly seen from Figure 17 that the operating frequency band of the waveguide antenna is approximately between 74.5GHz and 89.5GHz, that is, the bandwidth of the antenna is approximately 15GHz, so it has a good operating bandwidth.

As shown in FIG. 18 , an antenna pattern is provided that can characterize the gain of the waveguide antenna assembly 10 shown in FIG. 11 . In the figure, the abscissa represents the angle in degrees; the abscissa represents the gain in dB. The curve S2 represents the antenna pattern of the H plane measured under the condition of the operating frequency of the waveguide antenna assembly 10 being 79 GHz. Curve S3 represents the antenna pattern of the E-plane measured under the condition that the waveguide antenna assembly 10 operates at a frequency of 79 GHz. Among them, the H surface can also be called a magnetic surface, which refers to a plane parallel to the direction of the magnetic field. The E plane can also be called the electric plane, which refers to the plane parallel to the direction of the electric field. It can be clearly seen from Figure 18 that the waveguide antenna assembly 10 can achieve a radiation gain of more than 7dB.

As shown in FIG. 19 , it is an antenna pattern of the waveguide antenna assembly 10 shown in FIG. 11 . It can be clearly seen from Figure 19 that the antenna has good radiation gain within a specific angle range (such as -120° to 120°), and the pattern shape is relatively regular, so it has good working performance.

In addition, as shown in FIG. 20 , in specific applications, the waveguide antenna assembly 10 may also include a radio frequency chip 14 . The radio frequency chip 14 can be connected to the microstrip connection end 13a of the transfer structure 13 through a microstrip line (not shown in the figure). The radio frequency chip 14 can be disposed on the first surface of the first substrate 11. Since the second substrate 12 (or waveguide antenna) is located on the second surface of the first substrate 11, the radio frequency chip 14 will not occupy the second substrate 12 ( or waveguide antenna), which is conducive to increasing the layout area of the second substrate 12 and the number of through holes 121.

In specific applications, the waveguide antenna assembly 10 may also include a shielding cover 15 . The shielding cover 15 can be disposed on the surface of the radio frequency chip 14 facing away from the first substrate 11, so as to shield electromagnetic waves. Specifically, radio frequency signals may generate electromagnetic waves during operation, and the shielding cover 15 can act as an electromagnetic shield on the electromagnetic waves. Therefore, the radio frequency chip 14 can be prevented from causing electromagnetic interference to other electronic devices. Alternatively, the shielding cover 15 can also play an electromagnetic shielding role against electromagnetic waves generated by other electronic devices to ensure the working stability of the radio frequency chip 14 .

In some embodiments, the shielding case 15 can be placed in close contact with the radio frequency chip 14 , or it can also be understood that the shielding case 15 and the radio frequency chip 14 can be in thermal conductive contact, so that the heat generated by the radio frequency chip 14 can be transferred to the radio frequency chip 14 through thermal conduction. The shielding cover 15 can improve the heat dissipation performance of the radio frequency chip 14.

In specific applications, the shielding cover 15 can be made of conductive materials such as copper or aluminum, thereby effectively ensuring the electromagnetic shielding effect and providing good thermal conductivity. It can be understood that in specific applications, the shape and material of the shielding cover 15 can be reasonably set according to actual needs, and this application does not specifically limit this.

Also, please refer to Figure 11 in conjunction. When the waveguide antenna assembly 10 includes the back cavity 134 in the above embodiment, the screen The shield 15 can also be in thermal contact with the back cavity 134 to improve the heat dissipation effect of the radio frequency chip 14 . Alternatively, the back cavity 134 and the shielding cover 15 may be an integral structure, which is not specifically limited in this application.

In addition, as shown in FIG. 21 , in specific applications, in order to improve the performance of the waveguide antenna assembly 10 , a metasurface 130 may be provided at an end of the through hole 121 away from the second substrate 12 . Metasurface 130 refers to an artificial layered structure whose thickness is smaller than the wavelength. The metasurface 130 can flexibly and effectively control the polarization, amplitude, phase, polarization mode, propagation mode and other characteristics of electromagnetic waves. Therefore, in the embodiment provided in this application, the above-mentioned characteristics of the electromagnetic waves emitted by the through hole 121 can be flexibly and effectively adjusted through the metasurface 130, thereby improving the working performance of the waveguide antenna assembly 10. It should be noted that the wavelength that the thickness of the metasurface 130 is less than refers to the wavelength corresponding to when the electromagnetic wave in the through hole 121 propagates in space.

In the embodiment provided by this application, since the through hole 121 in the second substrate 12 can realize the function of the waveguide antenna, that is, the waveguide antenna can be manufactured using PCB technology, therefore, the metasurface 130 can be efficiently and conveniently disposed on The lower surface of the second substrate 12 can effectively improve the convenience during production.

In addition, in specific applications, the waveguide antenna assembly 10 can be applied to many different types of electronic devices.

For example, the waveguide antenna assembly 10 may be used in radar. The radar may include a housing and any of the above-mentioned waveguide antenna components 10, and the waveguide antenna component 10 may be disposed in the housing. Among them, in terms of electrical performance, the housing has good electromagnetic wave penetration, so that it will not affect the normal transmission and reception of electromagnetic waves between the waveguide antenna assembly 10 and the outside world. In terms of mechanical properties, the housing has good stress resistance and oxidation resistance, so that it can withstand the erosion of the harsh external environment, thereby providing good protection to the waveguide antenna assembly 10 . It can be understood that in specific applications, the specific shape and material of the housing can be reasonably set according to actual conditions, and this application does not limit this.

In addition, radar can be used in terminals such as vehicles or drones, thereby enabling functions such as wireless signal transmission or detection.

As shown in Figure 22, taking the terminal as a vehicle as an example, the vehicle can be equipped with the above-mentioned radar. Specifically, the radar can be a long-range millimeter wave radar, a medium/short-range millimeter wave radar, etc. as shown in the figure. In the figure, different dotted lines represent the approximate detection ranges of different radars or cameras. In practical applications, vehicles can be equipped with a variety of radars, cameras and other devices with different detection types or detection ranges to achieve better detection functions. This application does not limit this.

Alternatively, the waveguide antenna assembly 10 can also be directly applied to radio frequency equipment or other equipment used for communication through electromagnetic waves. This application does not limit the specific application scenarios of radar (or waveguide antenna assembly 10).

In addition, embodiments of the present application also provide a method for manufacturing the waveguide antenna assembly 10 .

As shown in Figure 23, the method may include:

Step S100: Provide a first substrate. The first substrate has a first plate surface and a second plate surface that is away from the first plate surface. The first substrate has a transfer structure. The transfer structure is used to realize conversion between microstrip signals and waveguide signals. The transfer structure has a microstrip connection end and a waveguide connection end. The microstrip connection end is located on the first board surface, and the waveguide connection is The end is located on the second board.

Step S200: Provide a second substrate, provide a through hole penetrating the thickness direction of the second substrate, and provide a conductive layer on the inner wall of the through hole.

Step S300: Place the second substrate on the second surface of the first substrate.

For details, please refer to Figure 24 to Figure 28.

As shown in FIG. 24 , at this time, the first substrate 11 and the second substrate 12 are in a state of being separated from each other. For the first substrate 11, the first substrate 11 may be a printed circuit board (PCB) or a flexible printed circuit (FPC) with a transfer structure, and the first substrate 11 may be a single layer Boards can also be multi-layer boards. Alternatively, it can be understood that when fabricating the waveguide antenna assembly, the first substrate 11 may be made of an adapter that has been prepared. Structural panels. The transfer structure may include a probe waveguide structure, a substrate integrated waveguide structure, or other structures that can realize conversion between microstrip signals and waveguide signals, which is not specifically limited in this application.

In order to facilitate understanding of the preparation method provided by the embodiments of the present application, the following takes the transfer structure including a conventional substrate-integrated waveguide structure as an example for illustrative description. Specifically, the substrate integrated waveguide includes an upper metal layer 136 located on the first plate surface of the first substrate 11 (the upper plate surface in Figure 24) and a second plate surface (the lower plate in Figure 24) of the first substrate 11. The electromagnetic wave can propagate between the upper metal layer 136 and the lower metal layer 137 (such as propagating from left to right).

A gap 1371 is opened in the lower metal layer 137 so that electromagnetic waves can propagate toward the through hole 121 through the gap 1371 . When opening the gap 1371, etching or machining processes can be used to prepare it. Of course, in practical applications, the process of opening the gap 1371 can be reasonably selected according to the actual situation, and this application does not specifically limit this.

For the second substrate 12, the second substrate 12 may be a printed circuit board (PCB) or a flexible printed circuit (FPC), and the second substrate 12 may be a single-layer board or a multi-layer board. laminate.

Please continue to see Figure 24. The upper surface of the second substrate 12 is provided with an upper metal layer 12a, and the lower surface is provided with a lower metal layer 12b. A through hole 121 is opened in the second substrate 12 . The upper end of the through hole 121 penetrates the upper metal layer 12 a and the lower end penetrates the lower metal layer 12 b. Furthermore, the diameter of the through hole 121 gradually increases toward the direction away from the first substrate 11 . When preparing the through hole 121, etching or machining can be used. Of course, in practical applications, the process for opening the through hole 121 can be reasonably selected according to the actual situation, and this application does not specifically limit this. In addition, the through hole 121 may also be a stepped hole or other shaped structure, and the specific shape of the through hole 121 is not limited in this application.

After the through hole 121 is opened, a conductive layer 122 can be provided on the inner wall of the through hole 121 so that the through hole 121 can function as a waveguide antenna. The conductive layer 122 can be made by electroplating or other processes. In addition, the material of the conductive layer 122 may be copper, aluminum, etc., and the preparation process and materials of the conductive layer 122 are not limited in this application.

Please refer to FIG. 25 in conjunction with FIG. 25 . The first substrate 11 and the second substrate 12 can be pressed together using processes such as hot pressing to achieve a fixed connection between the first substrate 11 and the second substrate 12 . In specific applications, a connection layer 100 may be provided between the first substrate 11 and the second substrate 12 . The connection layer 100 may be made of polypropylene (PP) or other materials to achieve a fixed connection between the first substrate 11 and the second substrate 12 .

Please refer to FIG. 26 . After the first substrate 11 and the second substrate 12 are pressed together, a blind hole 111 can be opened in the first substrate 11 , where the bottom of the blind hole 111 penetrates the upper metal layer 12 a of the second substrate 12 . It can be understood that in other embodiments, the bottom of the blind hole 111 may also penetrate to the lower surface of the first substrate 11 . That is, the blind hole 111 may not penetrate to the connection layer 100 or the lower metal layer 137 . In addition, during specific preparation, the first substrate 11 and the second substrate 12 may use larger-area plates. Therefore, separation holes 112 may be provided through the first substrate 11 and the second substrate 12 to separate the required shapes and size waveguide antenna assembly.

As shown in FIG. 27 , a metal layer 1111 can then be disposed in the blind hole 111 to form an electric wall, and a metal layer 1121 can be disposed in the separation hole 112 . The main function of the electric wall is to block electromagnetic waves in the first substrate 11 so that the electromagnetic waves can propagate into the through hole 121 through the gap 1371 .

It can be understood that during specific implementation, the number of blind holes 111 may be multiple and arranged in a row. In addition, in other embodiments, the blind holes 111 can also be replaced by elongated grooves or other structures. Alternatively, the electric wall may also be a metal sheet, etc. This application does not limit the specific structure of the electric wall.

As shown in FIG. 28 , finally, etching or other processes can be performed on the lower surface of the second substrate 12 to create a notch 113 to prepare a waveguide antenna of a desired shape and size.

In addition, in some embodiments, a metasurface (not shown in the figure) may also be provided on the lower side of the through hole 121 (the side away from the first substrate 11 ) to improve the working performance of the waveguide antenna assembly. Among them, the specific type and arrangement method of the metasurface are not limited in this application.

It can be understood that in the above-described embodiment, the gap 1371 can be provided in the first substrate 11 first, the through hole 121 can be opened in the second substrate 12, and then the first substrate 11 and the second substrate 12 can be pressed together.

Of course, in other embodiments, the preparation sequence can also be flexibly adjusted.

For example, as shown in Figure 29, the embodiment of the present application also provides another preparation method.

It includes step S110: providing a first substrate. The first substrate has a first plate surface and a second plate surface that is away from the first plate surface. The first substrate has a transfer structure. The transfer structure is used to realize conversion between microstrip signals and waveguide signals. The transfer structure has a microstrip connection end and a waveguide connection end. The microstrip connection end is located on the first board surface, and the waveguide connection is The end is located on the second board surface.

Step S210: Provide a second substrate, and arrange the second substrate on the second surface of the first substrate.

Step S310: Provide a through hole penetrating the thickness direction of the second substrate on the second substrate, and provide a conductive layer on the inner wall of the through hole.

For details, please refer to Figure 30 to Figure 33 in combination.

As shown in FIG. 30 , the second substrate 12 can be disposed on the lower surface of the first substrate 11 through the connection layer 100 . The specific structures and materials of the first substrate 11 , the second substrate 12 and the connection layer 100 can be similar to those in the above examples, and will not be described again here.

As shown in FIG. 31 , machining and other processes can be used to create blind holes 114 in the first substrate 11 , and through holes 121 in the second substrate 12 . The bottom of the blind holes 114 can penetrate to the connection layer 100 , and the through holes 121 can The upper end may penetrate to the lower metal layer 137 of the first substrate 11 .

As shown in FIG. 32 , a conductive layer 1141 can be provided on the inner wall of the blind hole 114 and a conductive layer 122 can be provided on the inner wall of the through hole 121 .

Among them, the blind hole 114 with the conductive layer 1141 can form an electric wall, and the through hole 121 with the conductive layer 122 can form a waveguide antenna.

As shown in FIG. 33 , etching or other processes can be used to open a slit 1371 on the lower surface of the second substrate at a position corresponding to the through hole 121 , so that electromagnetic waves can propagate to the through hole 121 through the slit 1371 .

Finally, structures such as gaps 113a and 113b can be opened in the upper metal layer 136 on the upper surface of the first substrate 11 and the lower metal layer 12b on the lower surface of the second substrate 12 to prepare a waveguide antenna component with a desired shape and profile.

In summary, when preparing a waveguide antenna component, structures such as the gap 1371 can be first provided in the first substrate 11 and structures such as the through hole 121 (waveguide antenna) can be provided in the second substrate 12 , and then the first substrate 11 and the second substrate 12 are pressed together. Alternatively, the first substrate 11 and the second substrate 12 may be pressed together first, and then a through hole 121 (or waveguide antenna) may be provided in the second substrate 12 and a gap 1371 may be provided in the first substrate 11 to achieve the purpose. Preparation of waveguide antenna components.

It can be understood that during specific preparation, the manufacturing process and sequence can be flexibly adjusted according to actual needs, and this application does not limit this.

The above are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any person familiar with the technical field can easily think of changes or replacements within the technical scope disclosed in the present application, and all of them should be covered. within the protection scope of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims

A waveguide antenna assembly, characterized by including:

A first substrate having a first plate surface and a second plate surface that is away from the first plate surface;

A transfer structure is provided on the first substrate and is used to realize conversion between microstrip signals and waveguide signals; the transfer structure has a microstrip connection end and a waveguide connection end, and the microstrip connection end is located on the The first board surface, the waveguide connection end is located on the second board surface;

A second substrate is provided on the second board surface, the second substrate has a through hole, the through hole penetrates the second substrate in the thickness direction of the second substrate, and the inner wall of the through hole has a conductive layer;

Wherein, the projection of the waveguide connection end on the second substrate is located in the through hole, and the cross-sectional area of the through hole gradually increases in a direction away from the first substrate.
The waveguide antenna assembly according to claim 1, wherein the transfer structure is a substrate integrated waveguide, one end of the substrate integrated waveguide is the microstrip connection end, and the other end is provided with an electric wall;

Wherein, the substrate integrated waveguide has a gap, the gap is located on the second plate surface, and the gap forms the waveguide connection end.
The waveguide antenna assembly of claim 2, wherein the electric wall includes metallized holes or conductive layers arranged in rows.
The waveguide antenna assembly according to claim 2 or 3, characterized in that the distance between the gap and the electric wall is 0.25λ;

Wherein, λ is the wavelength of electromagnetic waves propagating in the substrate integrated waveguide.
The waveguide antenna assembly according to claim 1, wherein the transfer structure is a probe waveguide structure, and one end of the probe waveguide structure is the microstrip connection end;

The probe waveguide structure includes a radiation end, and the radiation end is located on the first plate surface;

Wherein, the waveguide connection end is the projection area of the radiation end on the second plate surface.
The waveguide antenna assembly according to any one of claims 1 to 5, wherein the first substrate and the second substrate are different plate layers in an integrated multi-layer plate body.
The waveguide antenna assembly according to any one of claims 1 to 6, further comprising a radio frequency chip and a microstrip line, the radio frequency chip and the microstrip line being arranged on the first board surface, and One end of the microstrip line is connected to the radio frequency chip, and the other end of the microstrip line is connected to the microstrip connection end.
The waveguide antenna assembly according to claim 7, further comprising a shielding cover, the shielding cover being disposed on a side of the radio frequency chip away from the first substrate and bonded with the radio frequency chip.
The waveguide antenna assembly according to any one of claims 1 to 8, further comprising a metasurface, the metasurface being disposed on a side of the through hole away from the first substrate.
The waveguide antenna assembly according to any one of claims 1 to 9, wherein the through hole is in the axial direction of the through hole, and the inner wall of the through hole is stepped.
A method for preparing a waveguide antenna component, which is characterized by including:

Provide a first substrate, the first substrate having a first plate surface and a second plate surface away from the first plate surface;

The first substrate is provided with a transfer structure. The transfer structure is used to realize conversion between microstrip signals and waveguide signals. The transfer structure has a microstrip connection end and a waveguide connection end. The microstrip connection The end is located on the first board surface, and the waveguide connection end is located on the second board surface;

A second substrate is provided, a through hole is provided on the second substrate in a thickness direction of the second substrate, and a conductive layer is provided on the inner wall of the through hole.
The preparation method according to claim 11, characterized in that, a through hole penetrating the thickness direction of the second substrate is provided on the second substrate, and a conductive layer is provided on the inner wall of the through hole, and the method further includes:

The second substrate is arranged on the second plate surface of the first substrate.
The preparation method according to claim 11, characterized in that, providing a through hole penetrating the thickness direction of the second substrate on the second substrate, and before providing a conductive layer on the inner wall of the through hole, the method further includes:

The second substrate is arranged on the second plate surface of the first substrate.
The preparation method according to any one of claims 11 to 13, further comprising:

A metasurface is provided on a side of the through hole facing away from the first substrate.
A radar, characterized in that it includes a housing and a waveguide antenna assembly according to any one of claims 1 to 10, or a radar prepared by the preparation method according to any one of claims 11 to 14. A waveguide antenna assembly is provided in the housing.
A terminal, characterized in that it includes the radar according to claim 15, the terminal includes a controller, and the controller is connected to the microstrip connection end.