WO2023185843A9 - Ensemble antenne à guide d'ondes, radar, terminal et procédé de préparation d'un ensemble antenne à guide d'ondes - Google Patents

Ensemble antenne à guide d'ondes, radar, terminal et procédé de préparation d'un ensemble antenne à guide d'ondes Download PDF

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Publication number
WO2023185843A9
WO2023185843A9 PCT/CN2023/084390 CN2023084390W WO2023185843A9 WO 2023185843 A9 WO2023185843 A9 WO 2023185843A9 CN 2023084390 W CN2023084390 W CN 2023084390W WO 2023185843 A9 WO2023185843 A9 WO 2023185843A9
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WO
WIPO (PCT)
Prior art keywords
substrate
waveguide
hole
antenna assembly
waveguide antenna
Prior art date
Application number
PCT/CN2023/084390
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English (en)
Chinese (zh)
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WO2023185843A1 (fr
Inventor
徐劲拓
黄明利
程喆
刘山当
Original Assignee
华为技术有限公司
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2023185843A1 publication Critical patent/WO2023185843A1/fr
Publication of WO2023185843A9 publication Critical patent/WO2023185843A9/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
    • H01P5/107—Hollow-waveguide/strip-line transitions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/002—Protection against seismic waves, thermal radiation or other disturbances, e.g. nuclear explosion; Arrangements for improving the power handling capability of an antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/27—Adaptation for use in or on movable bodies
    • H01Q1/28—Adaptation for use in or on aircraft, missiles, satellites, or balloons
    • H01Q1/285—Aircraft wire antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/27—Adaptation for use in or on movable bodies
    • H01Q1/32—Adaptation for use in or on road or rail vehicles
    • H01Q1/3208—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used
    • H01Q1/3233—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors

Definitions

  • the present application relates to the field of communication technology, and in particular to a waveguide antenna component, a radar, a terminal, and a method of manufacturing a waveguide antenna component.
  • Waveguide antennas have obvious advantages in low loss and high bandwidth, making it easy to achieve high efficiency, long-distance coverage, and high distance resolution.
  • the waveguide antenna has a wider horizontal beam bandwidth, which can provide a larger field of view and broaden the detection range. Therefore, waveguide antennas are gradually widely used.
  • waveguide antennas In the practical application of waveguide antennas, it needs to be connected to chips and other devices.
  • the outgoing lines of devices such as chips are generally microstrip lines, and the interface of the waveguide antenna is a standard waveguide structure, energy cannot be transmitted directly.
  • a transfer structure In order to realize signal transmission between devices such as waveguide antennas and chips, a transfer structure is required to realize the connection between the waveguide structure and the microstrip line.
  • the main function of the transfer structure is to realize the conversion of electromagnetic energy of different modes in microstrip lines and waveguides, and to reduce the energy loss in the process of energy conversion of different modes.
  • the present application provides a method for manufacturing a waveguide antenna component, a radar, a terminal and a waveguide antenna component that are easy to manufacture and can ensure good matching and signal transmission performance between the transfer structure and the waveguide antenna.
  • the present application provides a waveguide antenna assembly, including a transfer structure and a waveguide antenna.
  • the waveguide antenna assembly may include a first substrate and a second substrate.
  • the first substrate has a first plate surface and a second plate surface, wherein the second plate surface is away from the first plate surface.
  • the transfer structure is provided on the first substrate and is used to realize conversion between microstrip signals and waveguide signals.
  • the transfer structure has a microstrip connection end and a waveguide connection end.
  • the microstrip connection end is located on the first board surface and can be connected to the microstrip line.
  • the waveguide connection end is located on the second board surface and can be coupled with the waveguide antenna (or waveguide structure) provided on the second board surface.
  • the second substrate is disposed on the second surface of the first substrate, and the waveguide antenna is disposed on the second substrate.
  • the second substrate has a through hole, the through hole penetrates the thickness of the second substrate, and the inner wall of the through hole has a conductive layer.
  • the through hole with the conductive layer can emit electromagnetic waves to the outside world or receive electromagnetic waves from the outside world. That is, the through hole with the conductive layer is used to form a waveguide antenna.
  • the waveguide antenna can be understood as a through hole and a conductive antenna located inside the through hole. combination of layers.
  • the projection of the waveguide connection end of the transfer structure on the second substrate is located within the through hole.
  • the cross-sectional area of the through hole can be gradually increased in the direction away from the first substrate. .
  • the waveguide antenna is disposed on the second substrate, and the second substrate may be a printed circuit board.
  • Circuit boards printed circuit boards, PCB
  • flexible printed circuits FPC. Therefore, when manufacturing waveguide antennas, mature processes related to the preparation of PCB or FPC can be used, which can effectively reduce the manufacturing cost. Cost and difficulty.
  • the first substrate can also be a printed circuit board (PCB) or a flexible printed circuit (FPC). When the first substrate and the second substrate are combined, it is beneficial to realize the transfer structure and the antenna. Good matching between them, thereby improving signal transmission efficiency and ensuring antenna performance.
  • the cross-sectional area of the through hole can be gradually increased, and the shape of the through hole can be reasonably set according to actual needs, so that the radiation range and gain of the antenna can be effectively taken into consideration, which is beneficial to improving the waveguide antenna. Component performance.
  • the shapes of the through holes can be diverse.
  • the diameter of the through hole can be proportional to the distance between the through hole and the first substrate, so that the radiation range and gain of the antenna can be effectively taken into consideration, thereby improving the working performance of the waveguide antenna assembly.
  • the inner wall of the through hole may be stepped in the axial direction of the through hole.
  • the number and gradient of steps can be reasonably adjusted according to actual conditions, and this application does not limit this.
  • the opening size of the through hole, the shape of the inner wall, and the increase in the opening size can be reasonably set according to the actual situation.
  • the cross-sectional shape of the through hole can be circular or oval. , polygon or irregular shape, this application does not specifically limit this.
  • the types and setting methods of the transfer structure can also be diverse.
  • the transfer structure may be a substrate integrated waveguide.
  • One end of the substrate integrated waveguide can be used as a microstrip connection end, and the other end is equipped with an electric wall.
  • the substrate integrated waveguide also has a slit, the slit is located on the second plate surface of the second substrate, and the slit forms the waveguide connection end. That is, the electromagnetic wave propagating in the substrate integrated waveguide can propagate into the through hole through the gap to achieve coupling between the gap (or the waveguide connection end) and the through hole.
  • the substrate integrated waveguide has the characteristics of simple structure, lightness and thinness. Therefore, when the substrate integrated waveguide is used as the transfer structure, it is beneficial to reduce the size of the waveguide antenna component and facilitate the realization of thin and light design. In addition, the substrate integrated waveguide has a relatively mature preparation process, so it is conducive to lower-cost production and use and can also ensure stable working performance.
  • the electric wall can include metallized holes or conductive layers arranged in rows, which can effectively block electromagnetic waves in the substrate integrated waveguide, so that electromagnetic waves can effectively pass through the gaps to the channel. spread within the hole.
  • the distance between the gap and the electric wall can be 0.25 ⁇ , so that electromagnetic waves can efficiently propagate outward through the gap.
  • ⁇ is the wavelength of electromagnetic waves propagating in the substrate integrated waveguide. It can be understood that a distance close to (or greater than or less than) 0.25 ⁇ in engineering implementation is also within the protection scope of this application.
  • the above distance between the gap and the electric wall can be 0.25 ⁇ as an example. In practical applications, the distance between the gap and the electric wall can be reasonably selected and adjusted according to the actual situation, and this application does not limit this.
  • the transfer structure may also be a probe waveguide structure.
  • one end of the probe waveguide structure can be used as a microstrip connection end.
  • the probe waveguide structure may also include a radiation end, and the radiation end may be located on the first plate surface; wherein the waveguide connection end is a projection area of the radiation end on the second plate surface.
  • the radiation end can emit electromagnetic waves, and the electromagnetic waves propagate into the through hole after passing through the second plate surface of the first substrate, thereby realizing coupling between the radiation end and the through hole.
  • waveguide antenna components can be adapted to many different types of transfer structures, with good design flexibility and wide applicability.
  • first substrate and the second substrate may be independent plate structures, or may be different plate layers in an integrated multi-layer plate body. That is, the first substrate and the second substrate can be divided into different parts from an entire plate body.
  • the waveguide antenna assembly may also include a radio frequency chip and a microstrip line.
  • the radio frequency chip and the microstrip line can be arranged on the first board surface of the first substrate. One end of the microstrip line can be connected to the radio frequency chip, and the other end can be connected to the microstrip connection end.
  • Arranging the radio frequency chip on the first board surface facilitates the installation of a heat dissipation structure for heat dissipation of the radio frequency chip and other devices.
  • the radio frequency chip can also be prevented from occupying the space of the second board surface, thereby preventing the chip from interfering with the second substrate. There is positional interference between them.
  • the waveguide antenna assembly may further include a shielding cover, and the shielding cover may be disposed on a side of the radio frequency chip facing away from the first substrate, thereby shielding electromagnetic waves.
  • the shielding cover can also be attached to the RF chip so that the heat generated by the RF chip can be transferred to the shielding cover through thermal conduction to improve the heat dissipation performance of the RF chip.
  • the present application also provides a method for manufacturing a waveguide antenna assembly, which may include: providing a first substrate.
  • the first substrate has a first board surface and a second board surface that is away from the first board surface; the first substrate is provided with a transfer structure, and the transfer structure is used to realize the conversion between microstrip signals and waveguide signals.
  • the transfer structure It has a microstrip connection end and a waveguide connection end, the microstrip connection end is located on the first board surface, and the waveguide connection end is located on the second board surface.
  • a second substrate is provided, a through hole is provided on the second substrate in a thickness direction of the second substrate, and a conductive layer is provided on the inner wall of the through hole.
  • the second substrate may be disposed on the second surface of the first substrate.
  • the second substrate may be disposed on the second surface of the first substrate first, and then a through hole penetrating through the thickness direction of the second substrate may be disposed on the second substrate, and a conductive layer may be disposed on the inner wall of the through hole.
  • structures such as through holes and conductive layers can be first provided on the second substrate, and then the second substrate is provided on the second surface of the first substrate.
  • the second substrate may also be disposed on the second surface of the first substrate first, and then structures such as through holes and conductive layers may be disposed on the second substrate.
  • a metasurface can also be provided on the side of the through hole away from the first substrate to improve the working performance of the waveguide antenna assembly.
  • this application also provides a radar, including a housing and any one of the above-mentioned waveguide antenna components, or a waveguide antenna component prepared by any of the above-mentioned methods.
  • the waveguide antenna component can be disposed in the housing, Thus, the housing can protect the waveguide antenna assembly.
  • waveguide antenna components can also be applied to many different types of electronic devices. This application does not limit the application scenarios of waveguide antenna components.
  • this application also provides a terminal, which may include the above-mentioned radar.
  • the terminal may include a controller, and the controller may be connected to the microstrip connection end.
  • the terminal can be a vehicle, a drone, etc.
  • This application does not limit the specific application scenarios of radar (or waveguide antenna components).
  • Figure 1 is a schematic diagram of an application scenario of an antenna assembly provided by an embodiment of the present application
  • Figure 2 is a schematic side structural diagram of a conventional antenna assembly
  • Figure 3 is a schematic side structural view of another conventional antenna assembly
  • Figure 4 is a schematic three-dimensional structural diagram of an antenna assembly provided by an embodiment of the present application.
  • Figure 5 is a perspective structural diagram of Figure 4.
  • Figure 6 is a schematic diagram of the top structure of Figure 4.
  • Figure 7 is a schematic structural diagram of the cross-section along AA in Figure 6;
  • Figure 8 is a schematic cross-sectional structural diagram of another antenna assembly provided by an embodiment of the present application.
  • FIG. 9 is a schematic cross-sectional structural diagram of another antenna assembly provided by an embodiment of the present application.
  • Figure 10 is a schematic three-dimensional perspective structural diagram of a partial structure of an antenna assembly provided by an embodiment of the present application.
  • FIG 11 is a schematic perspective structural diagram of another antenna assembly provided by an embodiment of the present application.
  • Figure 12 is a schematic cross-sectional structural diagram of the back cavity in Figure 11;
  • FIG. 13 is a schematic perspective structural diagram of another antenna assembly provided by an embodiment of the present application.
  • Figure 14 is a schematic diagram of the top structure of Figure 13;
  • Figure 15 is a schematic structural diagram of the B-B direction cross-section in Figure 14;
  • Figure 16 is a structural block diagram of an antenna assembly provided by an embodiment of the present application.
  • Figure 17 is a data diagram that can characterize the operating bandwidth of the antenna assembly shown in Figure 11 provided by an embodiment of the present application;
  • Figure 18 is an antenna pattern that can characterize the gain of the antenna assembly shown in Figure 11 provided by an embodiment of the present application;
  • Figure 19 is a three-dimensional directional diagram that can characterize the antenna assembly shown in Figure 11 provided by an embodiment of the present application;
  • Figure 20 is a schematic cross-sectional structural diagram of another antenna assembly provided by an embodiment of the present application.
  • Figure 21 is a schematic cross-sectional structural diagram of another antenna assembly provided by an embodiment of the present application.
  • Figure 22 is a schematic structural diagram of a terminal provided by an embodiment of the present application.
  • Figure 23 is a flow chart of a method for manufacturing an antenna assembly provided by an embodiment of the present application.
  • Figure 24 is a schematic cross-sectional structural diagram of an antenna assembly in a certain preparation state provided by an embodiment of the present application.
  • Figure 25 is a schematic cross-sectional structural diagram of an antenna assembly provided by an embodiment of the present application in another preparation state
  • Figure 26 is a schematic cross-sectional structural diagram of an antenna assembly provided by an embodiment of the present application in another preparation state
  • Figure 27 is a schematic cross-sectional structural diagram of an antenna assembly provided by an embodiment of the present application in another preparation state
  • Figure 28 is a schematic cross-sectional structural diagram of an antenna assembly in another preparation state according to an embodiment of the present application.
  • Figure 29 is a flow chart of another preparation method of an antenna assembly provided by an embodiment of the present application.
  • Figure 30 is a schematic cross-sectional structural diagram of an antenna assembly provided by an embodiment of the present application in another preparation state
  • Figure 31 is a schematic cross-sectional structural diagram of an antenna assembly provided by an embodiment of the present application in another preparation state
  • Figure 32 is a schematic cross-sectional structural diagram of an antenna assembly provided by an embodiment of the present application in another preparation state
  • FIG. 33 is a schematic cross-sectional structural diagram of an antenna assembly in another preparation state according to an embodiment of the present application.
  • the waveguide antenna assembly provided by the embodiment of the present application can be used in electronic equipment such as radar or detectors.
  • the electronic equipment can realize conversion between microstrip signals and waveguide signals through the waveguide antenna assembly, and transmit electromagnetic waves to the outside world or receive electromagnetic waves from the outside world. .
  • Radar may include system on chip (SOC), radio frequency integrated circuit (RFIC) and waveguide antenna components.
  • SOC system on chip
  • RFIC radio frequency integrated circuit
  • the radio frequency chip is connected to the system-level chip and the waveguide antenna assembly, and the system-level chip can transmit radio frequency signals to the waveguide antenna assembly through the radio frequency chip.
  • the waveguide antenna component can include a waveguide antenna and a transfer structure.
  • the signal transmission structure of the waveguide antenna is generally a waveguide, while the signal transmission structure of the RF chip is generally a microstrip line. Therefore, the waveguide antenna and the RF chip need to be connected through a corresponding transfer structure. Structures are connected to achieve signal conversion and efficient transmission.
  • planar phased array antenna requires a large number of antenna arrays to be laid out on the circuit board.
  • the planar phased array antenna refers to an antenna that changes the shape of the pattern by controlling the feed phase of each antenna. Controlling the phase can change the direction of the maximum value of the antenna pattern to achieve the purpose of beam scanning, which can effectively improve Radar scanning speed and accuracy.
  • the current waveguide antenna 02 and the radio frequency chip 01 are mainly arranged on the same board surface of the circuit board 03 (the upper board surface in Figure 1).
  • the radio frequency chip 01 It will occupy a large space, so it is not conducive to increasing the number of waveguide antennas 02 laid out.
  • the waveguide antenna 02 and the radio frequency chip 01 are arranged on the same board of the circuit board 03, it is difficult to balance the heat dissipation performance of the radio frequency chip 01 and the radiation performance of the waveguide antenna 02.
  • the heat dissipation structure may cause positional interference with the waveguide antenna 02.
  • the heat dissipation area (or volume) of the heat dissipation structure will be compressed, which will reduce the heat dissipation performance of the radio frequency chip 01.
  • the heat dissipation area (or volume) of the heat dissipation structure will cause adverse effects such as obstruction to the electromagnetic waves generated by the waveguide antenna 02 , thus reducing the radiation performance of the waveguide antenna 02 .
  • the waveguide antennas 02 and the radio frequency chip 01 can be arranged on different surfaces of the circuit board 03. That is, layout on different sides.
  • the waveguide antenna 02 can be disposed on the upper surface of the circuit board 03
  • the radio frequency chip 01 can be disposed on the lower surface of the circuit board 03 . That is, the waveguide antenna 02 and the radio frequency chip 01 can be implemented by being arranged in different planes.
  • the current waveguide antenna 02 is usually made by metal machining or plastic plating, and then the waveguide antenna 02 is assembled on the circuit board 03 .
  • the current transfer structure and the waveguide antenna 02 have relatively high requirements for the position, and a gap will inevitably occur between the waveguide antenna 02 and the transfer structure, affecting the working performance of the waveguide antenna 02 .
  • embodiments of the present application provide a waveguide antenna assembly that is easy to manufacture and can ensure good matching and signal transmission performance between the transfer structure and the waveguide antenna.
  • the waveguide antenna assembly 10 may include a transfer structure 13 and a waveguide antenna (not shown in the figure).
  • the transfer structure 13 is provided on the first substrate 11, and the waveguide antenna disposed on the second substrate 12.
  • the first substrate 11 has a first board surface 11a (the upper board surface in Figure 4) and a second board surface (the lower board surface in Figure 4), wherein the second board surface and the first board surface 11a is divergent.
  • the switching structure 13 is used to realize conversion between microstrip signals and waveguide signals.
  • the electrical signal propagating in the microstrip line is a TEM wave (transverse electromagnetic wave)
  • the electrical signal propagating in the waveguide structure is a TE wave (transverse electric wave).
  • TEM wave refers to an electromagnetic wave in which the electric field and magnetic field of the electromagnetic wave are on a plane perpendicular to the propagation direction.
  • TE waves refer to electromagnetic waves in which the electric field vector is perpendicular to the propagation direction, and the components of the magnetic field vector include both perpendicular to the propagation direction and parallel to the propagation direction.
  • the switching structure 13 is used to realize conversion between TEM waves and TE waves.
  • the transfer structure 13 shown in the figure the transfer structure 13 is roughly T-shaped, and one end is a microstrip connection end 13a, which can be connected to a microstrip line. The other end is the radiation end 1321 , which can be used to radiate electromagnetic waves in the direction of the second substrate 12 .
  • the transfer structure 13 is disposed on the first substrate 11, the transfer structure 13 and the first substrate 11 can be regarded as an integral structure, and the vertical projection of the radiation end 1321 on the second surface 11b of the first substrate 11 can be regarded as Waveguide connection end 13b.
  • the waveguide connection end 13b is located on the second board surface and can be coupled with the waveguide antenna (or waveguide structure) provided on the second board surface.
  • the waveguide antenna is provided on the second substrate 12, and the second substrate 12 can be manufactured using a PCB process, that is, the waveguide antenna can be manufactured using a process related to manufacturing a PCB.
  • the PCB process Since the PCB process is relatively mature and stable, it can effectively reduce the production cost and difficulty, and is conducive to ensuring the production quality to achieve a good match between the transfer structure 13 and the waveguide antenna, thereby improving the signal transmission efficiency and ensuring the waveguide antenna. performance.
  • the second substrate 12 is disposed on the second plate surface 11b (the lower plate surface in FIG. 4 ) of the first substrate 11.
  • the second substrate 12 has a through hole 121 penetrating its thickness, and the inner wall of the through hole 121 has a conductive layer 122.
  • the through hole 121 with the conductive layer 122 can emit electromagnetic waves to the outside world or receive electromagnetic waves from the outside world. That is, the through hole 121 with the conductive layer 122 is used to form a waveguide antenna.
  • the waveguide antenna can be understood as the through hole 121 and the through hole located in the through hole.
  • the projection of the waveguide connection end 13 b of the transfer structure 13 on the second substrate 12 is located in the through hole 121 .
  • the electromagnetic waves in the transfer structure 13 can be transmitted into the through hole 121 through the waveguide connection end 13b, and the electromagnetic waves can be emitted to the outside through the through hole 121.
  • coupling represents the effective transmission of electromagnetic waves or energy between two components, and does not limit the mechanical structural connection relationship between the two components. In practical applications, in order to realize the coupling between two components, many different types of methods can be used in the mechanical mechanism.
  • the conversion between the microstrip structure and the waveguide structure can be realized through the transfer structure 13 to meet the signal transmission requirements between the microstrip line and the waveguide antenna.
  • the microstrip connection end 13a is located on the first board surface 11a
  • the waveguide connection end 13b is located on the second board surface 11b. That is, the microstrip connection end 13a and the waveguide connection end 13b are located on different boards of the first substrate 11. Therefore, it can be realized Differential transmission of signals.
  • the transfer structure 13 can not only realize signal conversion between microstrips and waveguides, but also realize signal transmission in different planes.
  • the through hole 121 with the conductive layer 122 on the inner wall can realize the function of the waveguide antenna, it is beneficial to reduce the manufacturing cost and volume.
  • conventional waveguide antennas are usually manufactured using metal machining or plastic plating processes. Therefore, there are problems such as low manufacturing efficiency, complex processes, and low manufacturing accuracy.
  • the second substrate 12 can use a PCB board as the blank material, therefore, the material cost can be effectively reduced.
  • the through hole 121 is formed on the second substrate 12 , it is easy to ensure the opening position and size of the through hole 121 , therefore, it is beneficial to achieve higher precision manufacturing.
  • the conventional waveguide antenna is usually large in size (eg, the thickness is about 10mm-20mm), so in this paper
  • the second substrate 12 can be made of PCB board material. Therefore, the thickness can be effectively controlled (for example, below 3 mm), which is beneficial to reducing the volume of the waveguide antenna assembly 10 .
  • the first substrate 11 and the second substrate 12 can both be plate structures, it is helpful to improve the accuracy of the assembly when assembling the first substrate 11 and the second substrate 12, thereby ensuring that the transfer structure 13 and The position accuracy between the through holes 121 can effectively avoid gaps, thereby ensuring the signal transmission quality between the transfer structure 13 and the through holes 121 .
  • the waveguide antenna assembly 10 of the embodiment of the present application can reduce the insertion loss by about 0.5 dB.
  • the first substrate 11 can be a printed circuit board (PCB) or a flexible printed circuit (FPC), or other types of board structures.
  • the first substrate 11 may be a single-layer board or a board material in which two, three or more layers are stacked. Alternatively, it can be understood that this application does not limit the specific material and number of layers of the first substrate 11 .
  • the first plate surface 11a and the second plate surface 11b refer to the two outer surfaces of the first substrate 11 that are away from each other.
  • the first board surface 11a and the second board surface 11b are respectively the board surfaces of the first substrate 11 that are away from each other.
  • the first board surface 11 a and the second board surface 11 b are respectively the outer board surfaces of the two outermost boards of the first substrate 11 .
  • the fixed connection between the first substrate 11 and the second substrate 12 can be achieved through a connection layer (not shown in the figure).
  • the material of the connecting layer may be polypropylene (PP) or other materials.
  • the first substrate 11 and the second substrate 12 can also be fixedly connected by using connectors such as screws. This application does not specifically limit the connection method between the first substrate 11 and the second substrate 12 .
  • the through hole 121 can be formed on the second substrate 12 first, and the transfer structure 13 can be formed on the first substrate 11 . Then, the second substrate 12 is fixed on the second surface of the first substrate 11, thereby achieving a fixed connection between the first substrate 11 and the second substrate 12. At the same time, the connection between the transfer structure 13 and the through hole 121 can also be achieved. coupling.
  • the second substrate 12 may be fixed on the second surface of the first substrate 11 first, and then structures such as the through holes 121 and the conductive layer 122 may be formed on the second substrate 12, which is not specifically limited in this application.
  • the conductive layer 122 may be a metal material with good conductivity such as copper or aluminum.
  • electroplating, vapor deposition and other processes can be used for production. This application does not limit the specific material and production process of the conductive layer 122.
  • the shapes of the through holes 121 may be diverse.
  • the through hole 121 is divided into two sections, namely a first section 121a and a second section 121b.
  • the first section 121a is disposed close to the first substrate 11,
  • the second section 121b is disposed away from the first substrate 11 .
  • the first section 121a is a through hole, that is, the hole diameter of the first section 121a is approximately the same.
  • the hole diameter can be effectively controlled to facilitate higher-precision coupling with the waveguide connection end 13b of the first substrate 11.
  • the cross-sectional area of the second section 121b gradually increases, that is, the diameter of the second section 121b of the through hole 121 is proportional to the distance between the through hole 121 and the first substrate 11, This can effectively take into account the radiation range and gain of the antenna, which is beneficial to improving the working performance of the antenna.
  • the cross-sectional area of the through hole 121 gradually increases in the direction away from the first substrate 11 (the direction from top to bottom in the figure).
  • the diameter of the through hole 121 is proportional to the distance between the through hole 121 and the first substrate 11 , so that the radiation range and gain of the antenna can be effectively taken into consideration, which is beneficial to improving the working performance of the waveguide antenna assembly 10 .
  • the cross-sectional area of the through hole 121 gradually increases. Specifically, it may include: to increase according to a fixed and specific proportion, that is, the magnitude of the increase is the same. Alternatively, the magnitude of the increase may vary.
  • the inner wall of the through hole 121 is stepped.
  • the cross-sectional area of the through hole 121 increases stepwise.
  • the through hole in the axial direction can be divided into multiple sections. In each section, the cross-sectional area of the through hole is approximately the same, and there is a significant difference in the cross-sectional area between two adjacent sections.
  • the opening size of the through hole 121, the shape of the inner wall, and the increase in the opening size can be reasonably set according to the actual situation.
  • the cross-sectional shape of the through hole 121 can be circular or elliptical. shape, polygon or irregular shape, this application does not specifically limit this.
  • the second substrate 12 is a single-layer board. It can be understood that in other embodiments, the second substrate 12 may be a plurality of stacked plates. In practical applications, the second substrate 12 can be a printed circuit board (PCB) or a flexible printed circuit (FPC), or other types of board structures, or can be modified according to actual needs.
  • PCB printed circuit board
  • FPC flexible printed circuit
  • the specific material and number of layers of the second substrate 12 are subject to reasonable adjustment, and are not specifically limited in this application.
  • the transfer structure 13 in specific applications, it can be a variety of different types of structures capable of realizing microstrip and waveguide conversion.
  • the transfer structure 13 may be a probe waveguide structure.
  • the probe waveguide structure may include a floor 131, a transmission line 132 and a waveguide cavity 133.
  • the floor 131 and the transmission line 132 are both arranged on the first surface of the first substrate 11 (not shown in the figure).
  • the floor 131 is provided with a through slot 1311, and the transmission line 132 is arranged in the through slot 1311.
  • the through slot 1311 and the transmission line 132 are generally T-shaped.
  • One end of the transmission line 132 has a microstrip connection end 13a. The other end is the radiation end 1321, which is used to generate electromagnetic waves.
  • the transition part of the T-shaped structure of the transmission line 132 can realize conversion and impedance transformation between microstrip signals and waveguide signals.
  • the waveguide cavity 133 is disposed on the second plate surface of the first substrate 11 (not shown in the figure), and the end of the waveguide cavity 133 away from the first substrate 11 forms the waveguide connection end 13b.
  • the signal is transmitted from the microstrip connection end 13a to the radiation end 1321, and the microstrip signal and the waveguide signal are converted at the transition part of the T-shaped structure.
  • the waveguide signal is transmitted through the waveguide cavity 133 toward the radiation end 1321.
  • the end of the waveguide cavity 133 away from the first substrate 11 can be coupled with a through hole (or waveguide antenna), that is, the waveguide cavity 133 can play a bridging role for waveguide signals.
  • the waveguide cavity 133 may be a dielectric waveguide or a metal waveguide. This application does not limit the specific structure type of the waveguide cavity 133.
  • the waveguide cavity 133 can also be omitted, and one end of the through hole 121 can directly contact the second plate and be coupled with the radiating end 1321, that is, the radiating end 1321 is on the second plate.
  • the projection can form the waveguide connection end 13b.
  • the transmission line 132 may also include a microstrip gradient transition structure and other structures capable of realizing impedance transformation to achieve conversion between microstrip signals and waveguide signals.
  • the transmission line 132 And the specific shape of the through slot 1311 is not limited.
  • part of the electromagnetic waves generated by the radiation end 1321 may propagate in a direction away from the second substrate 12 .
  • the waveguide antenna assembly 10 is also provided with a back cavity 134.
  • the back cavity 134 is disposed on the first surface of the first substrate 11 (not shown in the figure) for reflecting the electromagnetic waves generated by the radiation end 1321 .
  • the bottom wall of the back cavity 134 has a metal wall 1341.
  • the metal wall 1341 will reflect the electromagnetic wave so that the electromagnetic wave can be transmitted in the direction of the second substrate 12, thereby effectively improving the transmission efficiency of the electromagnetic wave. , reduce signal loss.
  • the back cavity 134 can be made of insulating materials such as plastic, and the metal wall 1341 can be made of conductive materials such as copper on the bottom wall of the back cavity 134 through processes such as electroplating or coating.
  • the back cavity 134 can be made of conductive material such as copper or aluminum, and the bottom wall of the back cavity 134 can constitute the metal wall 1341. This application does not limit the material or manufacturing process of the back cavity 134 and the bottom wall.
  • the distance between the metal wall 1341 and the radiation end 1321 can be one-quarter of the wavelength of the electromagnetic wave generated by the radiation end 1321 propagating in space, so that the metal wall 1341 can effectively reflect the electromagnetic waves. Effect. It can be understood that during specific implementation, the distance between the radiation end 1321 and the metal wall 1341 can be reasonably adjusted according to actual needs, and this application does not specifically limit this.
  • Metalized holes 135 may be provided on one side. In specific applications, parameters such as the number, position, and size of the metallized holes 135 can be reasonably set according to actual needs, and this application does not specifically limit this.
  • the transfer structure 13 may be a substrate integrated waveguide (SIW).
  • SIW substrate integrated waveguide
  • the substrate integrated waveguide is a structure in the form of a microwave transmission line, which uses metallized holes 138 to realize the field propagation mode of the waveguide on the dielectric substrate.
  • the substrate integrated waveguide mainly includes a dielectric substrate (not shown in the figure), and the upper surface of the dielectric substrate is provided with an upper metal layer 136, and the lower surface is provided with a lower metal layer 137.
  • a plurality of metallized holes 138 are arranged in rows in the dielectric substrate and penetrate to the upper metal layer 136 and the lower metal layer 137 .
  • the substrate integrated waveguide can be directly fabricated in the first substrate 11 . That is, the first substrate 11 can be used as a dielectric substrate.
  • a gap 1371 is opened in the lower metal layer 137 of the substrate integrated waveguide, and one end of the substrate integrated waveguide (the right end in the figure) is provided with an electrical Wall 139.
  • the electric wall 139 can effectively block electromagnetic waves in the integrated waveguide, thereby allowing the electromagnetic waves to propagate outward through the gap 1371 .
  • the electric wall 139 includes a plurality of metallized holes arranged in a row. It can be understood that in other embodiments, the electric wall 139 may also be a metal layer or metal sheet that can block electromagnetic waves, and this application is not specifically limited to this.
  • the distance between the electric wall 139 and the gap 1371 may be 0.25 times the wavelength of the electromagnetic wave propagating in the substrate integrated waveguide (such as the first substrate 11), so that the electromagnetic wave can efficiently propagate outward through the gap 1371.
  • the size and shape of the gap 1371 and the distance between the gap 1371 and the electric wall 139 can be reasonably adjusted according to the actual situation, and are not specifically limited in this application.
  • the transfer structure 13 may also adopt other types of structures that can realize conversion between microstrip signals and waveguide signals, which is not specifically limited in this application.
  • the waveguide antenna assembly 10 includes a transfer structure 13 and a through hole 121 as an example for illustration. It can be understood that in specific applications, two or more may be provided in the first substrate 11 or two or more transfer structures 13. Two or more through holes 121 may be provided in the second substrate 12 . When there are multiple transfer structures 13 and through holes 121 , the number of transfer structures 13 and through holes 121 can be the same, and the transfer structures 13 and the through holes 121 can be arranged in one-to-one correspondence.
  • the waveguide antenna assembly may include four transfer structures.
  • the four transfer structures are all connected to the same radio frequency chip, and each transfer structure is coupled to a corresponding waveguide antenna. It can be understood that the above is only an exemplary reference. In actual applications, the number and location of the waveguide antennas and transfer structures can be reasonably selected and adjusted according to actual needs, and this application does not limit this.
  • a data plot is provided that can characterize the operating bandwidth of the waveguide antenna assembly 10 shown in FIG. 11 .
  • the abscissa represents frequency in GHz
  • the ordinate represents amplitude in dB.
  • Curve S1 represents a data plot of amplitude as a function of frequency. It can be clearly seen from Figure 17 that the operating frequency band of the waveguide antenna is approximately between 74.5GHz and 89.5GHz, that is, the bandwidth of the antenna is approximately 15GHz, so it has a good operating bandwidth.
  • an antenna pattern is provided that can characterize the gain of the waveguide antenna assembly 10 shown in FIG. 11 .
  • the abscissa represents the angle in degrees; the abscissa represents the gain in dB.
  • the curve S2 represents the antenna pattern of the H plane measured under the condition of the operating frequency of the waveguide antenna assembly 10 being 79 GHz.
  • Curve S3 represents the antenna pattern of the E-plane measured under the condition that the waveguide antenna assembly 10 operates at a frequency of 79 GHz.
  • the H surface can also be called a magnetic surface, which refers to a plane parallel to the direction of the magnetic field.
  • the E plane can also be called the electric plane, which refers to the plane parallel to the direction of the electric field. It can be clearly seen from Figure 18 that the waveguide antenna assembly 10 can achieve a radiation gain of more than 7dB.
  • FIG. 19 it is an antenna pattern of the waveguide antenna assembly 10 shown in FIG. 11 . It can be clearly seen from Figure 19 that the antenna has good radiation gain within a specific angle range (such as -120° to 120°), and the pattern shape is relatively regular, so it has good working performance.
  • a specific angle range such as -120° to 120°
  • the waveguide antenna assembly 10 may also include a radio frequency chip 14 .
  • the radio frequency chip 14 can be connected to the microstrip connection end 13a of the transfer structure 13 through a microstrip line (not shown in the figure).
  • the radio frequency chip 14 can be disposed on the first surface of the first substrate 11. Since the second substrate 12 (or waveguide antenna) is located on the second surface of the first substrate 11, the radio frequency chip 14 will not occupy the second substrate 12 ( or waveguide antenna), which is conducive to increasing the layout area of the second substrate 12 and the number of through holes 121.
  • the waveguide antenna assembly 10 may also include a shielding cover 15 .
  • the shielding cover 15 can be disposed on the surface of the radio frequency chip 14 facing away from the first substrate 11, so as to shield electromagnetic waves.
  • radio frequency signals may generate electromagnetic waves during operation, and the shielding cover 15 can act as an electromagnetic shield on the electromagnetic waves. Therefore, the radio frequency chip 14 can be prevented from causing electromagnetic interference to other electronic devices.
  • the shielding cover 15 can also play an electromagnetic shielding role against electromagnetic waves generated by other electronic devices to ensure the working stability of the radio frequency chip 14 .
  • the shielding case 15 can be placed in close contact with the radio frequency chip 14 , or it can also be understood that the shielding case 15 and the radio frequency chip 14 can be in thermal conductive contact, so that the heat generated by the radio frequency chip 14 can be transferred to the radio frequency chip 14 through thermal conduction.
  • the shielding cover 15 can improve the heat dissipation performance of the radio frequency chip 14.
  • the shielding cover 15 can be made of conductive materials such as copper or aluminum, thereby effectively ensuring the electromagnetic shielding effect and providing good thermal conductivity. It can be understood that in specific applications, the shape and material of the shielding cover 15 can be reasonably set according to actual needs, and this application does not specifically limit this.
  • the screen The shield 15 can also be in thermal contact with the back cavity 134 to improve the heat dissipation effect of the radio frequency chip 14 .
  • the back cavity 134 and the shielding cover 15 may be an integral structure, which is not specifically limited in this application.
  • a metasurface 130 may be provided at an end of the through hole 121 away from the second substrate 12 .
  • Metasurface 130 refers to an artificial layered structure whose thickness is smaller than the wavelength.
  • the metasurface 130 can flexibly and effectively control the polarization, amplitude, phase, polarization mode, propagation mode and other characteristics of electromagnetic waves. Therefore, in the embodiment provided in this application, the above-mentioned characteristics of the electromagnetic waves emitted by the through hole 121 can be flexibly and effectively adjusted through the metasurface 130, thereby improving the working performance of the waveguide antenna assembly 10.
  • the wavelength that the thickness of the metasurface 130 is less than refers to the wavelength corresponding to when the electromagnetic wave in the through hole 121 propagates in space.
  • the through hole 121 in the second substrate 12 can realize the function of the waveguide antenna, that is, the waveguide antenna can be manufactured using PCB technology, therefore, the metasurface 130 can be efficiently and conveniently disposed on The lower surface of the second substrate 12 can effectively improve the convenience during production.
  • the waveguide antenna assembly 10 can be applied to many different types of electronic devices.
  • the waveguide antenna assembly 10 may be used in radar.
  • the radar may include a housing and any of the above-mentioned waveguide antenna components 10, and the waveguide antenna component 10 may be disposed in the housing.
  • the housing in terms of electrical performance, has good electromagnetic wave penetration, so that it will not affect the normal transmission and reception of electromagnetic waves between the waveguide antenna assembly 10 and the outside world.
  • the housing In terms of mechanical properties, the housing has good stress resistance and oxidation resistance, so that it can withstand the erosion of the harsh external environment, thereby providing good protection to the waveguide antenna assembly 10 . It can be understood that in specific applications, the specific shape and material of the housing can be reasonably set according to actual conditions, and this application does not limit this.
  • radar can be used in terminals such as vehicles or drones, thereby enabling functions such as wireless signal transmission or detection.
  • the vehicle can be equipped with the above-mentioned radar.
  • the radar can be a long-range millimeter wave radar, a medium/short-range millimeter wave radar, etc. as shown in the figure.
  • different dotted lines represent the approximate detection ranges of different radars or cameras.
  • vehicles can be equipped with a variety of radars, cameras and other devices with different detection types or detection ranges to achieve better detection functions. This application does not limit this.
  • the waveguide antenna assembly 10 can also be directly applied to radio frequency equipment or other equipment used for communication through electromagnetic waves. This application does not limit the specific application scenarios of radar (or waveguide antenna assembly 10).
  • embodiments of the present application also provide a method for manufacturing the waveguide antenna assembly 10 .
  • the method may include:
  • Step S100 Provide a first substrate.
  • the first substrate has a first plate surface and a second plate surface that is away from the first plate surface.
  • the first substrate has a transfer structure.
  • the transfer structure is used to realize conversion between microstrip signals and waveguide signals.
  • the transfer structure has a microstrip connection end and a waveguide connection end. The microstrip connection end is located on the first board surface, and the waveguide connection is The end is located on the second board.
  • Step S200 Provide a second substrate, provide a through hole penetrating the thickness direction of the second substrate, and provide a conductive layer on the inner wall of the through hole.
  • Step S300 Place the second substrate on the second surface of the first substrate.
  • the first substrate 11 and the second substrate 12 are in a state of being separated from each other.
  • the first substrate 11 may be a printed circuit board (PCB) or a flexible printed circuit (FPC) with a transfer structure, and the first substrate 11 may be a single layer Boards can also be multi-layer boards.
  • the first substrate 11 may be made of an adapter that has been prepared. Structural panels.
  • the transfer structure may include a probe waveguide structure, a substrate integrated waveguide structure, or other structures that can realize conversion between microstrip signals and waveguide signals, which is not specifically limited in this application.
  • the substrate integrated waveguide includes an upper metal layer 136 located on the first plate surface of the first substrate 11 (the upper plate surface in Figure 24) and a second plate surface (the lower plate in Figure 24) of the first substrate 11.
  • the electromagnetic wave can propagate between the upper metal layer 136 and the lower metal layer 137 (such as propagating from left to right).
  • a gap 1371 is opened in the lower metal layer 137 so that electromagnetic waves can propagate toward the through hole 121 through the gap 1371 .
  • etching or machining processes can be used to prepare it.
  • the process of opening the gap 1371 can be reasonably selected according to the actual situation, and this application does not specifically limit this.
  • the second substrate 12 may be a printed circuit board (PCB) or a flexible printed circuit (FPC), and the second substrate 12 may be a single-layer board or a multi-layer board. laminate.
  • PCB printed circuit board
  • FPC flexible printed circuit
  • the upper surface of the second substrate 12 is provided with an upper metal layer 12a, and the lower surface is provided with a lower metal layer 12b.
  • a through hole 121 is opened in the second substrate 12 .
  • the upper end of the through hole 121 penetrates the upper metal layer 12 a and the lower end penetrates the lower metal layer 12 b.
  • the diameter of the through hole 121 gradually increases toward the direction away from the first substrate 11 .
  • etching or machining can be used.
  • the process for opening the through hole 121 can be reasonably selected according to the actual situation, and this application does not specifically limit this.
  • the through hole 121 may also be a stepped hole or other shaped structure, and the specific shape of the through hole 121 is not limited in this application.
  • a conductive layer 122 can be provided on the inner wall of the through hole 121 so that the through hole 121 can function as a waveguide antenna.
  • the conductive layer 122 can be made by electroplating or other processes.
  • the material of the conductive layer 122 may be copper, aluminum, etc., and the preparation process and materials of the conductive layer 122 are not limited in this application.
  • the first substrate 11 and the second substrate 12 can be pressed together using processes such as hot pressing to achieve a fixed connection between the first substrate 11 and the second substrate 12 .
  • a connection layer 100 may be provided between the first substrate 11 and the second substrate 12 .
  • the connection layer 100 may be made of polypropylene (PP) or other materials to achieve a fixed connection between the first substrate 11 and the second substrate 12 .
  • a blind hole 111 can be opened in the first substrate 11 , where the bottom of the blind hole 111 penetrates the upper metal layer 12 a of the second substrate 12 . It can be understood that in other embodiments, the bottom of the blind hole 111 may also penetrate to the lower surface of the first substrate 11 . That is, the blind hole 111 may not penetrate to the connection layer 100 or the lower metal layer 137 . In addition, during specific preparation, the first substrate 11 and the second substrate 12 may use larger-area plates. Therefore, separation holes 112 may be provided through the first substrate 11 and the second substrate 12 to separate the required shapes and size waveguide antenna assembly.
  • a metal layer 1111 can then be disposed in the blind hole 111 to form an electric wall, and a metal layer 1121 can be disposed in the separation hole 112 .
  • the main function of the electric wall is to block electromagnetic waves in the first substrate 11 so that the electromagnetic waves can propagate into the through hole 121 through the gap 1371 .
  • the number of blind holes 111 may be multiple and arranged in a row.
  • the blind holes 111 can also be replaced by elongated grooves or other structures.
  • the electric wall may also be a metal sheet, etc. This application does not limit the specific structure of the electric wall.
  • etching or other processes can be performed on the lower surface of the second substrate 12 to create a notch 113 to prepare a waveguide antenna of a desired shape and size.
  • a metasurface (not shown in the figure) may also be provided on the lower side of the through hole 121 (the side away from the first substrate 11 ) to improve the working performance of the waveguide antenna assembly.
  • the specific type and arrangement method of the metasurface are not limited in this application.
  • the gap 1371 can be provided in the first substrate 11 first, the through hole 121 can be opened in the second substrate 12, and then the first substrate 11 and the second substrate 12 can be pressed together.
  • the preparation sequence can also be flexibly adjusted.
  • the embodiment of the present application also provides another preparation method.
  • step S110 providing a first substrate.
  • the first substrate has a first plate surface and a second plate surface that is away from the first plate surface.
  • the first substrate has a transfer structure.
  • the transfer structure is used to realize conversion between microstrip signals and waveguide signals.
  • the transfer structure has a microstrip connection end and a waveguide connection end. The microstrip connection end is located on the first board surface, and the waveguide connection is The end is located on the second board surface.
  • Step S210 Provide a second substrate, and arrange the second substrate on the second surface of the first substrate.
  • Step S310 Provide a through hole penetrating the thickness direction of the second substrate on the second substrate, and provide a conductive layer on the inner wall of the through hole.
  • the second substrate 12 can be disposed on the lower surface of the first substrate 11 through the connection layer 100 .
  • the specific structures and materials of the first substrate 11 , the second substrate 12 and the connection layer 100 can be similar to those in the above examples, and will not be described again here.
  • machining and other processes can be used to create blind holes 114 in the first substrate 11 , and through holes 121 in the second substrate 12 .
  • the bottom of the blind holes 114 can penetrate to the connection layer 100
  • the through holes 121 can The upper end may penetrate to the lower metal layer 137 of the first substrate 11 .
  • a conductive layer 1141 can be provided on the inner wall of the blind hole 114 and a conductive layer 122 can be provided on the inner wall of the through hole 121 .
  • the blind hole 114 with the conductive layer 1141 can form an electric wall
  • the through hole 121 with the conductive layer 122 can form a waveguide antenna
  • etching or other processes can be used to open a slit 1371 on the lower surface of the second substrate at a position corresponding to the through hole 121 , so that electromagnetic waves can propagate to the through hole 121 through the slit 1371 .
  • gaps 113a and 113b can be opened in the upper metal layer 136 on the upper surface of the first substrate 11 and the lower metal layer 12b on the lower surface of the second substrate 12 to prepare a waveguide antenna component with a desired shape and profile.
  • structures such as the gap 1371 can be first provided in the first substrate 11 and structures such as the through hole 121 (waveguide antenna) can be provided in the second substrate 12 , and then the first substrate 11 and the second substrate 12 are pressed together.
  • the first substrate 11 and the second substrate 12 may be pressed together first, and then a through hole 121 (or waveguide antenna) may be provided in the second substrate 12 and a gap 1371 may be provided in the first substrate 11 to achieve the purpose.
  • Preparation of waveguide antenna components are first provided in the first substrate 11 and structures such as the through hole 121 (waveguide antenna) can be provided in the second substrate 12 , and then the first substrate 11 and the second substrate 12 are pressed together.
  • the first substrate 11 and the second substrate 12 may be pressed together first, and then a through hole 121 (or waveguide antenna) may be provided in the second substrate 12 and a gap 1371 may be provided in the first substrate 11 to achieve the purpose.
  • Preparation of waveguide antenna components are first provided in the first substrate 11 and structures such as

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  • Engineering & Computer Science (AREA)
  • Remote Sensing (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Computer Security & Cryptography (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Physics & Mathematics (AREA)
  • Astronomy & Astrophysics (AREA)
  • General Physics & Mathematics (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Waveguide Aerials (AREA)

Abstract

La présente demande se rapporte au domaine technique de la communication et vise à résoudre le problème d'un faible degré de correspondance entre une antenne à guide d'ondes et une structure de transition. L'invention concerne un ensemble antenne à guide d'ondes, un radar, un terminal et un procédé de préparation de l'ensemble antenne à guide d'ondes. L'ensemble antenne à guide d'ondes comprend une première plaque de base, une seconde plaque de base et une structure de transition. La première plaque de base est pourvue d'une première surface de plaque et d'une seconde surface de plaque opposée à la première surface de plaque. La structure de transition est agencée sur la première plaque de base, une extrémité de connexion de microruban de la structure de transition est agencée sur la première surface de plaque et une extrémité de connexion de guide d'ondes est agencée sur la seconde surface de plaque. La seconde plaque de base est agencée sur la seconde surface de plaque et est pourvue d'un trou traversant, le trou traversant pénètre à travers l'épaisseur de la seconde plaque de base et une couche conductrice est disposée sur une paroi interne du trou traversant. Le trou traversant, qui présente la couche conductrice, peut former une antenne à guide d'ondes et la projection de l'extrémité de connexion de guide d'ondes sur la seconde plaque de base est située dans le trou traversant de telle sorte que le trou traversant soit couplé à la structure de transition. L'ensemble antenne à guide d'ondes proposé par la présente demande peut assurer une bonne correspondance et une bonne performance de transmission de signal entre la structure de transition et l'antenne à guide d'ondes.
PCT/CN2023/084390 2022-03-31 2023-03-28 Ensemble antenne à guide d'ondes, radar, terminal et procédé de préparation d'un ensemble antenne à guide d'ondes WO2023185843A1 (fr)

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FR3099132B1 (fr) * 2019-07-26 2022-01-28 Mbda France Capot pour vehicule, en particulier pour vehicule supersonique ou hypersonique
CN114784489B (zh) * 2022-03-31 2024-01-16 华为技术有限公司 波导天线组件、雷达、终端和波导天线组件的制备方法
CN117154408A (zh) * 2022-10-26 2023-12-01 深圳Tcl数字技术有限公司 毫米波天线组件以及显示装置
CN115494456B (zh) * 2022-11-21 2023-03-10 南京隼眼电子科技有限公司 雷达收发装置及雷达装置

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TW293957B (en) * 1996-08-05 1996-12-21 Chyng-Guang Juang The structure and the feeding method of the microstrip leaky-wave antenna
JP2006191428A (ja) * 2005-01-07 2006-07-20 Japan Radio Co Ltd マイクロストリップ線路導波管変換器
JP2008193243A (ja) * 2007-02-01 2008-08-21 Hitachi Kokusai Electric Inc 導波管
CN101436702A (zh) * 2008-12-12 2009-05-20 惠州市硕贝德通讯科技有限公司 一种波导—微带线变换及功率分配器
EP2267832A1 (fr) * 2009-06-11 2010-12-29 Imec Système intégré comprenant un guide d'ondes sur un appareil de couplage de microruban
US9577340B2 (en) * 2014-03-18 2017-02-21 Peraso Technologies Inc. Waveguide adapter plate to facilitate accurate alignment of sectioned waveguide channel in microwave antenna assembly
WO2018116416A1 (fr) * 2016-12-21 2018-06-28 三菱電機株式会社 Convertisseur guide d'ondes/ligne microruban et dispositif d'antenne
CN107394395B (zh) * 2017-07-07 2020-10-27 东南大学 基于平面正交模耦合器的双极化喇叭天线
CN112467326B (zh) * 2020-12-07 2021-10-01 之江实验室 一种宽带矩形波导-微带转换器
CN112563708B (zh) * 2021-02-22 2021-06-04 成都天锐星通科技有限公司 一种传输线转换结构与天线驻波测试系统
CN114784489B (zh) * 2022-03-31 2024-01-16 华为技术有限公司 波导天线组件、雷达、终端和波导天线组件的制备方法

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