Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
  • C08G75/02—Polythioethers
  • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
  • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F2/00—Processes of polymerisation
  • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F2/00—Processes of polymerisation
  • C08F2/46—Polymerisation initiated by wave energy or particle radiation
  • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F2/00—Processes of polymerisation
  • C08F2/46—Polymerisation initiated by wave energy or particle radiation
  • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
  • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
  • C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L21/00—Compositions of unspecified rubbers
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
  • C08L81/02—Polythioethers; Polythioether-ethers
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
  • C09J11/02—Non-macromolecular additives
  • C09J11/04—Non-macromolecular additives inorganic
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
  • C09J11/02—Non-macromolecular additives
  • C09J11/06—Non-macromolecular additives organic
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J181/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Adhesives based on polysulfones; Adhesives based on derivatives of such polymers
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J181/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Adhesives based on polysulfones; Adhesives based on derivatives of such polymers
  • C09J181/02—Polythioethers; Polythioether-ethers
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
  • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
  • C08K3/24—Acids; Salts thereof
  • C08K3/26—Carbonates; Bicarbonates
  • C08K2003/265—Calcium, strontium or barium carbonate
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
  • C08K3/013—Fillers, pigments or reinforcing additives
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/34—Silicon-containing compounds
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/04—Oxygen-containing compounds
  • C08K5/10—Esters; Ether-esters
  • C08K5/101—Esters; Ether-esters of monocarboxylic acids
  • C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
  • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Definitions

• the present invention relates to a resinous composition, an adhesive or a sealing material containing the same, a cured product thereof, and a semiconductor device and an electronic component containing the cured product.
• Photo- and thermosetting resin compositions are known that can be temporarily fixed by light irradiation and can be permanently cured by heating. More specifically, adhesives that are temporarily fixed by ultraviolet (UV) irradiation and then permanently cured by heat are used in many fields (for example, Patent Documents 1 and 2). This type of adhesive is particularly popular in image sensor module applications.
• UV ultraviolet
• Patent Document 3 discloses that it has both excellent photocurability and excellent thermosetting properties, and that when light irradiation is performed under conditions that cause unirradiated areas, heating thereafter can cure the unexposed areas.
• a photo- and thermosetting resin composition that can completely cure the entire composition including the irradiated part to produce a cured product with high adhesive strength and also has good storage stability, (1) (meth)acryloyl (2) a polyene compound having two or more vinyl or allyl groups in one molecule, (3) a polythiol compound having two or more thiol groups in one molecule, (4) a photoradical generator,
• a resin composition is disclosed that includes (5) a thermal radical generator and (6) a thermal anionic polymerization initiator.
• Bleed is an issue in the assembly process of semiconductor modules. Bleeding is a phenomenon in which unreacted components ooze out from the adhesive coating or cured product over time when an adhesive containing a curable resin composition is used to fix or bond parts. This is sometimes called "bleed". When the bleed comes into contact with the metal wiring portion on the substrate, it may cause an electrical defect, and there is a problem that the reliability and bonding properties of the semiconductor module are reduced.
• UV irradiation curing involves UV irradiation from the outside of the semiconductor module. Since the inside of the semiconductor module is not exposed to UV light, there may be an uncured portion of the adhesive. Inner bleed generated from the uncured portion of the adhesive develops when left at room temperature after UV irradiation and during subsequent heat curing, and the bleed length tends to become longer. Furthermore, depending on the location where the adhesive is applied, it may be cured only by heat curing because it will shadow the parts and UV irradiation cannot be applied. In this case as well, there is a problem in that the applied adhesive tends to bleed when left at room temperature or during heat curing.
• a semiconductor module including such miniaturized or highly integrated electronic components has a problem in that the risk of contact between the bleed and the wiring portion increases due to the bleed phenomenon.
• an object of the present invention is to provide at least a thermosetting resin composition and an adhesive that can suppress the bleeding phenomenon.
• the first embodiment of the present invention is the following resin composition.
• (1) (A) (meth)acrylate compound, (B) polythiol compound, (C) A curing catalyst, and (D) a resin composition containing a rubber component.
• (2) The resin composition according to (1) above, further comprising (E) an inorganic filler.
• (3) The resin composition according to (1) or (2) above, further comprising (F) a surfactant.
• (4) The resin composition according to any one of (1) to (3) above, further comprising (G) a photoradical initiator.
• a second embodiment of the present invention is the following adhesive or sealant.
• An adhesive or sealant comprising the resin composition according to any one of (1) to (4) above.
• the third embodiment of the present invention is the following cured product.
• a fourth embodiment of the present invention is the following semiconductor device or electronic component.
• thermosetting resin composition that can suppress the bleeding phenomenon.
• thermosetting adhesive or sealing material that can suppress the bleeding phenomenon.
• thermosetting adhesive or sealing material that can suppress the bleeding phenomenon.
• thermosetting adhesive or sealing material that can suppress the bleeding phenomenon.
• thermosetting adhesive or sealing material that can suppress the bleeding phenomenon.
• thermosetting adhesive or sealing material that can suppress the bleeding phenomenon.
• a cured product in which the bleeding phenomenon is suppressed it is possible to obtain a semiconductor device or an electronic component with excellent reliability and bondability.
• the resin composition that is the first embodiment of the present invention is (A) (meth)acrylate compound, (B) polythiol compound, Contains (C) a curing catalyst and (D) a rubber component. According to this embodiment, it is possible to obtain at least a thermosetting resin composition that can suppress the bleeding phenomenon.
• the resin composition of the present embodiment includes (A) (meth)acrylate compound (hereinafter also referred to as "component (A)").
• component (A) The (meth)acrylate compound can impart transparency and appropriate hardness to the cured resin composition.
• the (meth)acrylate compound that is component (A) is not particularly limited as long as it includes a (meth)acrylate compound having two or more (meth)acryloyl groups. In consideration of ensuring heat resistance, compounds with two or more (meth)acryloyl groups are preferred, compounds with 2 to 6 (meth)acryloyl groups are more preferred, and compounds with two (meth)acryloyl groups are more preferred. More preferred are compounds having the following.
• compounds with one (meth)acryloyl group may also be used to adjust the viscosity and physical properties of the cured product (adhesive strength, flexibility, etc.). can.
• (meth)acrylate compounds include diacrylate and/or dimethacrylate of tris(2-hydroxyethyl)isocyanurate; tris(2-hydroxyethyl)isocyanurate triacrylate and/or trimethacrylate; trimethylol Propane triacrylate and/or trimethacrylate, or oligomer thereof; Pentaerythritol triacrylate and/or trimethacrylate, or oligomer thereof; Dipentaerythritol polyacrylate and/or polymethacrylate; Tris(acryloxyethyl) isocyanurate; Caprolactone modification Tris (acryloxyethyl) isocyanurate; caprolactone-modified tris (methacryloxyethyl) isocyanurate; alkyl-modified dipentaerythritol polyacrylate and/or polymethacrylate; caprolactone-modified dipentaerythritol polyacrylate and/or poly
• component (A) is preferably an acrylate compound without substantially containing a methacrylate compound.
• the (meth)acrylate compound (A) any one type of the above-mentioned (meth)acrylate compounds may be used, or two or more types may be used in combination.
• component (A) has a viscosity of 0.01 to 100 Pa ⁇ s from the viewpoint of preparation and dispensability of the resin composition.
• viscosity refers to a value measured at a measurement temperature of 25° C. using an appropriate viscometer depending on the viscosity range.
• component (A) Commercially available products of component (A) include, for example, polyester acrylate (product name: EBECRYL810) manufactured by Daicel Allnex Corporation, ditrimethylolpropane tetraacrylate (product name: EBECRYL140) manufactured by Daicel Allnex Corporation, and polyester acrylate manufactured by Toagosei Co., Ltd. (product name: M7100), dimethylol-tricyclodecane diacrylate (product name: Light Acrylate DCP-A), manufactured by Kyoeisha Chemical Co., Ltd., neopentyl glycol-modified trimethylolpropane diacrylate (product name: Kayarad R-604), manufactured by Nippon Kayaku Co., Ltd. etc., but are not limited to these. As component (A), any one of these may be used, or two or more thereof may be used in combination.
• EBECRYL810 ditrimethylolpropane tetraacrylate
• the content of component (A) is preferably 10 to 70% by mass, more preferably 20 to 60% by mass, based on the total mass of the resin composition.
• the resin composition of the present embodiment includes (B) a polythiol compound (hereinafter also referred to as "component (B)").
• component (B) The polythiol compound imparts high photocurability to the resin composition.
• Component (B) is not particularly limited as long as it has two or more functional groups, that is, it has two or more thiol groups.
• the component (B) preferably contains a trifunctional or higher functional thiol compound, and more preferably contains a trifunctional and/or tetrafunctional thiol compound. Note that the trifunctional and tetrafunctional thiol compounds are thiol compounds having three and four thiol groups, respectively.
• polythiol compounds examples include pentaerythritol tetrakis (3-mercaptopropionate), trimethylolpropane tris (3-mercaptopropionate), dipentaerythritol hexakis (3-mercaptopropionate), and pentaerythritol tetrakis (3-mercaptopropionate).
• 3-mercaptobutyrate tris-[(3-mercaptopropionyloxy)-ethyl]-isocyanurate, pentaerythritol tetrakis (3-mercaptobutyrate), 1,4-bis(3-mercaptobutyryloxy)butane, 1,3,5-tris(3-mercaptobutyryloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, trimethylolpropane tris(3-mercaptobutyrate) ), and trimethylolethane tris(3-mercaptobutyrate), but are not limited to these.
• polythiol compound (B) a glycoluril compound represented by the following general formula (1) can be mentioned.
• R 1 and R 2 are each independently hydrogen, an alkyl group having 1 to 10 carbon atoms, or a phenyl group.
• n is an integer from 0 to 10.
• component (B) may be a compound represented by the following chemical formula (2) or chemical formula (3).
• a compound represented by chemical formula (2) or chemical formula (3) is a more preferable compound as component (B).
• polythiol compound (B) a polythiol compound represented by general formula (4) can be mentioned.
• R 3 , R 4 , R 5 and R 6 are each independently hydrogen or C n H 2n SH (n is 2 to 6). Furthermore, at least one of R 3 , R 4 , R 5 and R 6 is C n H 2n SH (n is 2 to 6). From the viewpoint of curability, n of the polyfunctional thiol compound of component (B) represented by general formula (4) is preferably 2 to 4. Moreover, it is more preferable that this polyfunctional thiol compound is a mercaptopropyl group in which n is 3 from the viewpoint of the balance between the physical properties of the cured product and the curing speed.
• Component (B) represented by the general formula (4) has a sufficiently flexible skeleton and is therefore effective when it is desired to lower the elastic modulus of the cured product.
• component (B) represented by the general formula (4) By adding component (B) represented by the general formula (4), the elastic modulus of the cured product can be controlled, so the adhesive strength (especially peel strength) after curing can be increased.
• thiol glycoluril derivative manufactured by Shikoku Kasei Kogyo product name: TS-G (corresponding to chemical formula (2), thiol equivalent: 100 g/eq)
• product name: C3 TS-G product name: 114 g/eq
• SC Organic Chemical's thiol compound product name: PEPT (corresponds to general formula (4), thiol equivalent: 124 g/eq), but are not limited to these. .
• the above component (B) include 1,3,4,6-tetrakis(mercaptomethyl)glycoluril, 1,3,4,6-tetrakis(mercaptomethyl)-3a-methylglycoluril, 1, 3,4,6-tetrakis(2-mercaptoethyl)-3a-methylglycoluril, 1,3,4,6-tetrakis(3-mercaptopropyl)-3a-methylglycoluril, 1,3,4,6- Tetrakis(mercaptomethyl)-3a,6a-dimethylglycoluril, 1,3,4,6-tetrakis(2-mercaptoethyl)-3a,6a-dimethylglycoluril, 1,3,4,6-tetrakis(3- Mercaptopropyl)-3a,6a-dimethylglycoluril, 1,3,4,6-tetrakis(mercaptomethyl)-3a,6a-diphenylglycoluril, 1,3,4,6-
• any one type may be used, or two or more types may be used in combination.
• functional group equivalents such as thiol equivalent and (meth)acryloyl equivalent represent the molecular weight of a compound per functional group
• functional group equivalents such as the number of thiol group equivalents and the number of (meth)acryloyl group equivalents are used herein.
• the number of equivalents represents the number of functional groups (number of equivalents) per amount of compound substance (amount charged).
• the ratio of the number of (meth)acryloyl group equivalents of component (A) to the number of thiol group equivalents of component (B) is preferably 0.25 to 3.0, more preferably 0.4 to 2.0, and even more preferably 0.5 to 1.5.
• the thiol equivalent of component (B) is the number obtained by dividing the molecular weight of component (B) by the number of thiol groups in one molecule. The actual thiol equivalent can be determined, for example, by determining the thiol value by potentiometric measurement.
• the number of thiol group equivalents of component (B) is the number of thiol groups (number of equivalents) per mass (charged amount) of component (B), and the mass (g) of the polyfunctional thiol compound (B) is the number of thiol groups per mass (charged amount) of component (B). It is the quotient divided by the thiol equivalent of the compound (if more than one thiol compound is included, the sum of such quotients for each thiol compound).
• the (meth)acryloyl equivalent of the (meth)acrylate compound is theoretically equal to the molecular weight of the (meth)acrylate compound divided by the number of acryloyl groups (or methacryloyl groups) in one molecule.
• the actual (meth)acryloyl equivalent can be determined, for example, by NMR.
• the number of equivalents of (meth)acryloyl groups in component (A) is the number of (meth)acryloyl groups (number of equivalents) per mass (charged amount) of component (A), and the number of equivalents of (meth)acryloyl groups in component (A) (g) divided by the (meth)acryloyl equivalent of that (meth)acrylate compound (or, if more than one (meth)acrylate compound is involved, the sum of such quotients for each (meth)acrylate compound).
• [Number of (meth)acryloyl group equivalents of component (A)]/[Number of thiol group equivalents of component (B)] is set in the range of 0.25 to 3.0. Since a certain amount or more reacts with the group, molecular crosslinks are sufficiently formed and it becomes possible to easily develop high adhesive strength.
• the resin composition of the present embodiment includes (C) a curing catalyst (hereinafter also referred to as "component (C)").
• the curing catalyst (C) used in this embodiment is not particularly limited as long as it is a curing catalyst for a (meth)acrylate compound, and any known catalyst can be used, but a latent curing catalyst is preferable.
• the latent curing catalyst of component (C) is a compound that is inactive at room temperature and functions as a curing catalyst by being activated by heating, such as imidazole compounds that are solid at room temperature; amine compounds; Solid-dispersed amine adduct-based latent curing catalysts such as reaction products with epoxy compounds (amine-epoxy adduct systems); reaction products between amine compounds and isocyanate compounds or urea compounds (urea-type adduct systems), etc. .
• Epoxy compounds used as one of the raw materials for producing solid-dispersed amine adduct-based latent curing catalysts include, for example, polyhydric phenols such as bisphenol A, bisphenol F, catechol, and resorcinol, or glycerin.
• the amine compound used as another raw material for producing the solid-dispersed amine adduct-based latent curing catalyst has one or more active hydrogens in its molecule that can undergo an addition reaction with an epoxy group, and has a primary amino group, a secondary Any material having at least one functional group selected from amino groups and tertiary amino groups in its molecule may be used. Examples of such amine compounds are shown below, but the invention is not limited thereto.
• aliphatic amines such as diethylenetriamine, triethylenetetramine, n-propylamine, 2-hydroxyethylaminopropylamine, cyclohexylamine, 4,4'-diamino-dicyclohexylmethane; 4,4'-diaminodiphenylmethane, 2 - Aromatic amine compounds such as methylaniline; heterocyclic compounds containing nitrogen atoms such as 2-ethyl-4-methylimidazole, 2-ethyl-4-methylimidazoline, 2,4-dimethylimidazoline, piperidine, piperazine; etc., but are not limited to these.
• compounds having a tertiary amino group in the molecule are raw materials that provide latent curing catalysts with excellent curing accelerating ability, and examples of such compounds include, for example, dimethylaminopropylamine. , diethylaminopropylamine, di-n-propylaminopropylamine, dibutylaminopropylamine, dimethylaminoethylamine, diethylaminoethylamine, N-methylpiperazine, and 2-methylimidazole, 2-ethylimidazole, 2-ethyl- Primary or secondary amines having a tertiary amino group in the molecule, such as imidazole compounds such as 4-methylimidazole and 2-phenylimidazole; 2-dimethylaminoethanol, 1-methyl-2-dimethylaminoethanol, 1-phenoxymethyl-2-dimethylaminoethanol, 2-diethylaminoethanol, 1-butoxymethyl-2-dimethylaminoethanol
• Isocyanate compounds that can be used as another production raw material in the solid-dispersed amine adduct latent curing catalyst include, for example, monofunctional isocyanate compounds such as n-butyl isocyanate, isopropyl isocyanate, phenyl isocyanate, and benzyl isocyanate; Methylene diisocyanate, toluylene diisocyanate, 1,5-naphthalene diisocyanate, diphenylmethane-4,4'-diisocyanate, isophorone diisocyanate, xylylene diisocyanate, paraphenylene diisocyanate, 1,3,6-hexamethylene triisocyanate, bicycloheptane triisocyanate, etc.
• monofunctional isocyanate compounds such as n-butyl isocyanate, isopropyl isocyanate, phenyl isocyanate, and benzyl isocyanate
• Polyfunctional isocyanate compounds Furthermore, terminal isocyanate group-containing compounds obtained by reacting these polyfunctional isocyanate compounds with active hydrogen compounds, etc. can also be used.
• terminal isocyanate group-containing compounds include addition compounds having a terminal isocyanate group obtained by the reaction of toluylene diisocyanate and trimethylolpropane, and terminal isocyanate groups obtained by the reaction of toluylene diisocyanate and pentaerythritol. Examples include, but are not limited to, addition compounds having the following.
• urea compounds include urea, thiourea, etc., but are not limited thereto.
• the solid dispersed latent curing catalyst that can be used in this embodiment is, for example, the above-mentioned (a) two components of an amine compound and an epoxy compound, (b) three components of these two components and an active hydrogen compound, or (c) ) It is a combination of two or three components of an amine compound, an isocyanate compound and/or a urea compound. These can be prepared by taking each component, mixing them, reacting at a temperature between room temperature and 200°C, cooling to solidify, and then pulverizing, or reacting in a solvent such as methyl ethyl ketone, dioxane, tetrahydrofuran, etc., and removing the solvent. , can be easily produced by pulverizing the solid content.
• a solvent such as methyl ethyl ketone, dioxane, tetrahydrofuran, etc.
• Typical examples of commercially available solid-dispersed latent curing catalysts include "Amicure PN-23" (product name of Ajinomoto Fine-Techno Co., Ltd.) and “Amicure PN-23” (product name of Ajinomoto Fine-Techno Co., Ltd.) for amine-epoxy adduct systems (amine adduct systems).
• PN-40 Aljinomoto Fine-Techno Co., Ltd. product name
• “Amicure PN-50” (Ajinomoto Fine-Techno Co., Ltd. product name)
• “Hardner X-3661S” ACR Co., Ltd. product name
• “Hardner X-3670S” A.C.R.
• urea type adduct system examples include, but are not limited to, "FujiCure FXE-1000" (product name of T&K TOKA Co., Ltd.) and “FujiCure FXR-1030” (product name of T&K TOKA Co., Ltd.).
• Component (C) may be used alone or in combination of two or more.
• the content of the curing catalyst is preferably 0.1 to 40% by mass, and 1 to 20% by mass, based on the total mass of the resin composition, from the viewpoint of curing speed and pot life of the resin composition. % is more preferable.
• the resin composition of the present embodiment further includes (D) a rubber component (hereinafter also referred to as "component (D)"). This allows the resin composition to suppress the bleeding phenomenon. It is thought that the rubber component acts as a steric hindrance and inhibits the resin flow of the resin composition, thereby suppressing bleeding.
• component (D) a rubber component
• the type of rubber component is not particularly limited.
• Preferred monomers constituting the rubber component include ethylene, propylene, butadiene, styrene, acrylonitrile, acrylic ester, methacrylic ester, urethane, epoxypropyl methacrylate, divinylbenzene, and various derivatives.
• the rubber component is a copolymer obtained by polymerizing one or more of these monomers.
• the rubber components include acrylic rubber, urethane rubber, urethane acrylate rubber, isoprene rubber, butadiene rubber, styrene/isoprene copolymer rubber, styrene/butadiene copolymer rubber, acrylonitrile/butadiene copolymer rubber, and these diene rubbers.
• Hydrogenated or partially hydrogenated saturated rubber silicone rubber, chloroprene rubber, natural rubber, ethylene/propylene copolymer rubber, ethylene/propylene/diene monomer terpolymer rubber, butyl rubber, chlorosulfonated polyethylene, chlorinated polyethylene, epi- Examples include chlorohydrin rubber, fluororubber, and acrylic/silicone composite rubber.
• a rubber component consisting of any one of acrylic rubber, urethane rubber, isoprene rubber, butadiene rubber, acrylonitrile/butadiene copolymer rubber, silicone rubber, and silicone/acrylic composite rubber is more preferable. These rubber components may be crosslinked or uncrosslinked.
• the rubber crosslinking method is selected depending on the type of rubber component, and includes, for example, sulfur crosslinking, peroxide crosslinking, resin crosslinking, amine crosslinking, polyol crosslinking, oxime crosslinking, metal crosslinking, and the like.
• the rubber component may be solid at 25°C or liquid at 25°C.
• the form of the rubber component (D) is not particularly limited, and examples thereof include particles, powder, pellets, and the like. From the viewpoint of dispersibility, the rubber component (D) is preferably in the form of particles.
• the particulate rubber component may be a rubber particle having a core-shell structure, and specifically, a rubber having the above-mentioned rubber component as a core and further having a shell made of a polymer of a radically polymerizable compound covering the outside thereof. It may also be particles.
• the average particle size of the rubber component (D) is preferably 0.01 ⁇ m to 20 ⁇ m, more preferably 0.02 ⁇ m to 10 ⁇ m, and preferably 0.03 ⁇ m to 5 ⁇ m. It is even more preferable that there be.
• the average particle size of the rubber particles is an arithmetic (number) average particle size, and can be measured using a dynamic light scattering method. For example, rubber particles can be dispersed in a suitable organic solvent and measured using a particle size distribution meter.
• the glass transition point of the rubber component is preferably 40°C or lower, more preferably 25°C or lower, and 0. It is more preferable that the temperature is below °C. Further, the glass transition point is preferably -100°C or higher. The glass transition point can be determined by DSC measurement based on JIS K6240.
• the rubber component when the rubber component is liquid at 25°C, (D) the rubber component includes liquid isoprene rubber, carboxy-modified liquid isoprene rubber, liquid butadiene rubber, carboxy-modified liquid butadiene rubber, hydroxyl-modified liquid butadiene rubber, and liquid acrylonitrile.
• examples include low molecular weight components such as /butadiene copolymer rubber, liquid styrene/butadiene copolymer rubber, liquid styrene/isoprene copolymer rubber, and liquid silicone rubber.
• the weight average molecular weight of the low molecular weight component is preferably 5,000 to 80,000, more preferably 8,000 to 50,000.
• Those that are liquid at 25°C include carboxy-terminated butadiene nitrile rubber manufactured by Ube Industries, Ltd. (product names: CTBN1300 and CTBN1008-SP), amine-terminated butadiene nitrile rubber manufactured by Ube Industries, Ltd. (product name: ATBN1300-16), and Toray Dow.
• Examples include, but are not limited to, silicone rubber powder manufactured by Corning Corporation (product name: AY42-119) and epoxidized polybutadiene rubber (product name: Epolead PB3600) manufactured by Daicel Chemical Industries, Ltd.
• the rubber component may be used alone or in combination of two or more.
• the content of the rubber component (D) in the resin composition is preferably 0.1 to 10 parts by mass, more preferably 0.2 to 7 parts by mass, and even more preferably 0. .3 to 5% by mass.
• the resin composition of this embodiment may contain (E) an inorganic filler (hereinafter also referred to as "component (E)").
• component (E) By containing the inorganic filler in the resin composition, the coefficient of linear expansion of the cured product obtained by curing the resin composition can be lowered, and the thermal cycle resistance is improved.
• the inorganic filler is not particularly limited as long as it is made of granules made of an inorganic material and has the effect of lowering the coefficient of linear expansion when added.
• Inorganic materials include silica, zeolite, talc, alumina, aluminum nitride, calcium carbonate, aluminum silicate, magnesium silicate, magnesium carbonate, barium sulfate, barium carbonate, lime sulfate, aluminum hydroxide, calcium silicate, potassium titanate. , titanium oxide, zinc oxide, silicon carbide, silicon nitride, boron nitride, etc. can be used. Any one type of inorganic filler may be used, or two or more types may be used in combination.
• silica filler As the inorganic filler, it is preferable to use silica filler because the filling amount can be increased. Silica is preferably amorphous silica. Moreover, from the viewpoint of suppressing the bleeding phenomenon, it is preferable to use zeolite.
• the surface of the inorganic filler is preferably treated with a coupling agent such as a silane coupling agent.
• a coupling agent such as a silane coupling agent.
• the shape of the inorganic filler is not particularly limited, and may be spherical, scaly, acicular, amorphous, or the like.
• the average particle size of the inorganic filler is preferably 5.0 ⁇ m or less, more preferably 4.0 ⁇ m or less, and even more preferably 3.0 ⁇ m or less.
• the average particle size refers to the volume-based median diameter (d 50 ) measured by a laser diffraction method in accordance with ISO-13320 (2009), or a transmission electron microscope (TEM) or a scanning electron microscope. It refers to a value obtained as the number average of 50 measured values arbitrarily selected from observed images acquired by (SEM).
• the average particle size of the inorganic filler By controlling the average particle size of the inorganic filler to be equal to or less than the upper limit, it is possible to suppress sedimentation of the inorganic filler, suppress the formation of coarse particles, and suppress clogging of the nozzle of the dispenser.
• the lower limit of the average particle size of the inorganic filler is not particularly limited, but from the viewpoint of the viscosity of the resin composition, it is preferably 0.005 ⁇ m or more, and more preferably 0.1 ⁇ m or more.
• the average particle size of the inorganic filler (E) is preferably 0.01 ⁇ m to 5.0 ⁇ m, more preferably 0.1 ⁇ m to 3.0 ⁇ m.
• Inorganic fillers having different average particle sizes may be used in combination. For example, a filler with an average particle size of 0.005 ⁇ m or more and less than 0.1 ⁇ m and an inorganic filler with an average particle size of 0.1 ⁇ m to 5.0 ⁇ m may be used in combination
• the content of the inorganic filler (E) in the resin composition of the present embodiment is preferably 0.5 to 80% by mass, more preferably 1 to 70% by mass, based on the total mass of the resin composition. More preferably, it is 3 to 60%. (E) By setting the content of the inorganic filler within the above range, thermal cycle resistance is improved, and the viscosity of the resin composition is set within an appropriate range, thereby improving applicability in dispensers.
• the resin composition of this embodiment preferably contains an inorganic filler containing zeolite particles. Thereby, a resin composition that can further suppress the bleeding phenomenon can be obtained. It is thought that due to the high adsorption properties of zeolite, components in the system that can cause bleed are adsorbed to zeolite, thereby further suppressing the bleed phenomenon.
• Zeolite is a general term for crystalline aluminosilicate, and its general composition is the following formula (I): Mz +[( SiO2 )x( Al2O3 )y]z- (I) (In formula (I), M is an ion-exchangeable cation species and usually represents a monovalent or divalent metal, z is the valence of M, and x and y are arbitrary integers.
• M is a metal atom selected from Groups 1 to 13, more preferably hydrogen ions (H + ), lithium ions (Li + ), sodium ions (Na + ), potassium ions (K + ), calcium ions (Ca 2+ ), magnesium ions (Mg 2+ ), and barium ions (Ba 2+ ), and x/y (SiO 2 /Al 2 O 3 molar ratio) is, for example, 1 to 100, preferably 2 to 6. .
• the zeolite represented by the above formula (I) may be expressed as a general formula further including a hydrate.
• the SiO 2 /Al 2 O 3 molar ratio of zeolite can be measured using X-ray fluorescence analysis (XRF).
• Zeolite has a plurality of crystal structures, such as A type, X type, LSX type, beta type, ZSM-5 type, ferrierite type, mordenite type, L type, and Y type.
• zeolite with any crystal structure can be used, but A-type, X-type, and LSX-type zeolites are preferable, A-type and X-type are more preferable, and A-type is preferable. More preferred.
• zeolites have cations in their crystal structure, and the cations compensate for the negative charges in the crystal structure composed of aluminosilicate, thereby making up for the lack of positive charges. .
• Examples of cations include hydrogen ions, lithium ions, calcium ions, sodium ions, potassium ions, magnesium ions, and barium ions.
• the zeolite has a particle shape, and the average particle diameter of the zeolite particles is preferably 1 ⁇ m or less, more preferably 10 nm to 1 ⁇ m, and even more preferably 10 nm to 1 ⁇ m, from the viewpoint of better bleeding control. It is 500 nm. In certain embodiments, the particle size of the zeolite particles is between 10 nm and 250 nm. In this case, the effect of suppressing bleed becomes particularly remarkable. Also, in some embodiments, the particle size of the zeolite particles is between 250 nm and 1 ⁇ m. In this case, both the bleed suppression effect and workability can be achieved.
• the content of the zeolite particles is preferably 0.01% by mass or more, and preferably 0.05% by mass or more, based on the total mass of the resin composition, from the viewpoint of suppressing bleeding and workability of the resin composition.
• the content is more preferably 0.1% by mass or more, and even more preferably 0.1% by mass or more.
• it is preferably 10% by mass or less, more preferably 8% by mass or less, and even more preferably 5% by mass or less.
• the amount is preferably 0.01 to 10% by weight, more preferably 0.05 to 8% by weight, and particularly preferably 0.1 to 5% by weight.
• the resin composition of the present embodiment can further include (F) a surfactant (hereinafter also referred to as "component (F)"). Thereby, a further bleed suppression effect can be obtained.
• a surfactant hereinafter also referred to as "component (F)”
• known surfactants can be used.
• Preferred surfactants include surfactants that have one or more, preferably two or more, hydrophilic groups selected from the group consisting of hydroxyl groups and carbonyl groups in the molecule, and have two or more hydroxyl groups in the molecule. Surfactants are more preferred. Among such surfactants, surfactants and/or gemini-type surfactants having a hydrophilic portion containing a cyclic structure are more preferred.
• the resin composition contains a surfactant having one or more hydrophilic groups selected from the group consisting of a hydroxyl group and a carbonyl group in its molecule
• the surfactant is coordinated to the interface between the resin and the substrate, and the interface It is thought that the hydrophilic portion of the activator (particularly the hydroxyl group or carbonyl group) interacts with the substrate and exerts a pinning effect, thereby further suppressing bleeding.
• the cyclic structure in a surfactant having a hydrophilic moiety containing a cyclic structure includes an alicyclic hydrocarbon group such as cyclopentane or cyclohexane, or an alicyclic heterocyclic group such as tetrahydrofuran or tetrahydropyran.
• This cyclic structure is preferably substituted with one or more, preferably two or more substituents selected from a hydroxyl group, a carbonyl group, and an ester bond.
• This cyclic structure is bonded to the hydrophobic moiety with or without a spacer group comprising a group selected from hydroxyl groups, carbonyl groups and ester bonds.
• Examples of such compounds include compounds in which a cyclic structure such as tetrahydrofuran and a saturated or unsaturated fatty acid are bonded. This allows the molecule to contain a plurality of hydrophilic groups selected from the group consisting of hydroxyl groups and carbonyl groups in a compact region, which is thought to strengthen the interaction with the substrate and further suppress bleeding.
• a gemini-type surfactant is a surfactant in which a plurality of surfactants, typically two, of one hydrophobic chain and one hydrophilic group, so-called monomeric surfactants, are bonded via a spacer.
• the gemini surfactant can have two or more hydrophilic groups selected from the group consisting of hydroxyl groups and carbonyl groups in its molecule, so it has stronger interaction with the substrate and prevents bleeding. It is thought that it will be more suppressed.
• Examples of the surfactant having one or more hydrophilic groups selected from the group consisting of a hydroxyl group and a carbonyl group in the molecule include compounds represented by the following general formulas (5) to (7).
• X is carbon (C) or oxygen (O)
• the hydrocarbon chain of the fatty acid in R 5 has, for example, 10 to 20 carbon atoms, preferably 11 to 18 carbon atoms, and more preferably 12 to 18 carbon atoms.
• the hydrocarbon chain of the fatty acid may contain carbon-carbon double bonds, and the number of carbon-carbon double bonds is, for example, from 0 to 5, preferably from 0 to 3, more preferably from 0 to 2.
• both the cis and trans forms are included in the compound of formula (5).
• two of R 1 , R 2 , R 3 and R 4 are hydroxyl groups.
• the hydrogen of the (CH 2 ) n group is substituted with at least one hydroxyl group.
• two of R 1 , R 2 , R 3 and R 4 are hydroxyl groups, and the hydrogen of the (CH 2 ) n group is substituted with at least one hydroxyl group.
• compound of general formula (5) include compounds of the following chemical formulas (5a), (5b), or (5c). Particularly preferred are compounds of formula (5b) or (5c).
• n 1 to 20.
• the compounds of formula (5), formula (5a), formula (5b), formula (5c), formula (6), and formula (7) are not limited to the description of the structural formula for convenience, etc. All isomers that may occur due to the structure of the compound (e.g., geometric isomers, optical isomers based on asymmetric carbon, rotamers, stereoisomers, tautomers, etc.) and two or more of these isomers. Includes mixtures.
• surfactants having one or more hydrophilic groups selected from the group consisting of hydroxyl groups and carbonyl groups in the molecule include polyoxyethylene octyl ether, polyoxyethylene decyl ether, polyoxyethylene lauryl ether, and polyoxyethylene.
• the content of the surfactant is preferably 0.1 to 10 parts by mass, more preferably 0.2 to 7 parts by mass, and more preferably 0.1 to 10 parts by mass, based on the total mass of the resin composition. Preferably it is 0.3 to 5% by mass.
• the resin composition of this embodiment may contain (G) a photoradical initiator (hereinafter also referred to as "component (G)") to the extent that the effects of the present invention are not impaired. good.
• component (G) UV curing is promoted by including a photoradical initiator.
• Examples of the photoradical initiator include, but are not limited to, alkylphenone compounds, acylphosphine oxide compounds, and the like.
• alkylphenone compounds include benzyl dimethyl ketal such as 2,2-dimethoxy-1,2-diphenylethan-1-one (commercially available product: IGM Resins B.V. Omnirad 651); 2-methyl- ⁇ -Aminoalkylphenones such as 2-morpholino(4-thiomethylphenyl)propan-1-one (commercially available IGM Resins B.V. Omnirad 907); 1-hydroxy-cyclohexyl-phenyl-ketone (commercially available) ⁇ -hydroxyalkylphenone such as IGM Resins B.V.
• acylphosphine oxide-based compounds include 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide (commercially available product: IGM Resins B.V. Omnirad TPO H), bis(2,4,6- Examples include, but are not limited to, trimethylbenzoyl)-phenylphosphine oxide (commercially available product: Omnirad 819 manufactured by IGM Resins B.V.).
• examples of the photoradical initiator include 2-hydroxy-2-methyl-1-phenylpropan-1-one, diethoxyacetophenone, and 1-(4-isopropylphenyl).
• the content of the photoradical initiator is preferably 0.1 to 10 parts by mass, more preferably 0.2 to 10 parts by mass, based on 100 parts by mass of the (meth)acrylate compound. It is 8 parts by mass.
• the resin composition of this embodiment may contain (H) an organic filler (hereinafter also referred to as "component (H)”) within a range that does not impair the effects of the present invention.
• component (H) an organic filler
• organic fillers examples include polytetrafluoroethylene (PTFE) fillers, silicone fillers, acrylic fillers, styrene fillers, and the like.
• PTFE polytetrafluoroethylene
• silicone fillers silicone fillers
• acrylic fillers acrylic fillers
• styrene fillers and the like.
• the particulate (F) rubber component is excluded from the (H) organic filler.
• the organic filler may be surface-treated.
• the glass transition point of the organic filler is preferably higher than 40°C.
• the shape of the organic filler is not particularly limited, and may be spherical, flaky, acicular, amorphous, or the like.
• the average particle size of the organic filler is preferably 50 ⁇ m or less, more preferably 40 ⁇ m or less, and even more preferably 30 ⁇ m or less.
• the average particle size refers to the volume-based median diameter (d 50 ) measured by a laser diffraction method in accordance with ISO-13320 (2009), or a transmission electron microscope (TEM) or a scanning electron microscope. It refers to a value obtained as the number average of 50 measured values arbitrarily selected from observed images acquired by (SEM).
• the lower limit of the average particle size of the organic filler is not particularly limited, but from the viewpoint of the viscosity of the resin composition, it is preferably 0.005 ⁇ m or more, and more preferably 0.1 ⁇ m or more.
• the average particle size of the organic filler (H) is preferably 0.01 ⁇ m to 50 ⁇ m, more preferably 0.1 ⁇ m to 30 ⁇ m.
• Organic fillers having different average particle sizes may be used in combination. For example, an organic filler having an average particle size of 0.005 ⁇ m or more and less than 0.1 ⁇ m may be used in combination with an organic filler having an average particle size of 0.1 ⁇ m to 50 ⁇ m.
• the content of the organic filler (H) in the resin composition of the present embodiment is preferably 0.5 to 80% by mass, more preferably 1 to 70% by mass, based on the total mass of the resin composition. More preferably, it is 3 to 60%. (H) By setting the content of the organic filler within the above range, the viscosity of the resin composition is adjusted to an appropriate range, and applicability in a dispenser is improved.
• the resin composition of the present embodiment may contain (I) a stabilizer (hereinafter also referred to as "component (I)") to the extent that the effects of the present invention are not impaired.
• component (I) a stabilizer
• the stabilizer is used to improve the stability of the resin composition during storage, and is added to suppress the occurrence of polymerization reactions caused by unintended radicals or basic components.
• the stabilizer (I) includes a radical polymerization inhibitor and an anionic polymerization inhibitor.
• radical polymerization inhibitors can be used, including, but not limited to, N-nitroso-N-phenylhydroxylamine aluminum, triphenylphosphine, p-methoxyphenol, and hydroquinone. Further, known radical polymerization inhibitors disclosed in JP-A No. 2010-117545, JP-A No. 2008-184514, etc. can also be used. Any one type of radical polymerization inhibitor may be used, or two or more types may be used in combination.
• the content of the radical polymerization inhibitor is preferably 0.0001 to 5% by mass, and 0.001% by mass based on the total mass of the resin composition from the viewpoint of pot life. More preferably, it is 3% by mass.
• anionic polymerization inhibitors can be used, such as boric acid ester compounds and strong acids.
• anionic polymerization inhibitors include trimethylborate, triethylborate, tri-n-propylborate, triisopropylborate, trifluoromethanesulfonic acid, maleic acid, methanesulfonic acid, barbituric acid, difluoroacetic acid, and trichloroacetic acid. , phosphoric acid, dichloroacetic acid and the like, but are not limited to these.
• the preferred anionic polymerization inhibitor is at least one selected from tri-n-propyl borate, triisopropyl borate, and barbituric acid.
• anionic polymerization inhibitor known ones disclosed in JP-A No. 2010-117545, JP-A No. 2008-184514, JP-A No. 2017-171804, etc. can also be used. Any one type of anionic polymerization inhibitor may be used, or two or more types may be used in combination.
• the content of the anionic polymerization inhibitor is preferably 0.001 to 5 parts by mass, more preferably 0.01 to 3 parts by mass, based on the total mass of the resin composition. be.
• the resin composition may contain a solvent, a coupling agent, carbon black, titanium black, an ion trapping agent, a leveling agent, an antioxidant, an antifoaming agent, and a thixotropic agent, as necessary, within a range that does not impair the purpose of this embodiment. , a viscosity modifier, a flame retardant, and/or other additives.
• the resin composition includes, for example, components (A) to (D), optionally component (E), component (F), component (G), component (H), component (I), and/or others. It can be obtained by stirring, melting, mixing, and/or dispersing additives and the like simultaneously or separately, while applying heat treatment if necessary.
• Devices for mixing, stirring, dispersing, etc. are not particularly limited. As this device, a Laikai machine, a Henschel mixer, a three-roll mill, a ball mill, a planetary mixer, a bead mill, etc. equipped with a stirring and heating device can be used. Further, these devices may be used in combination as appropriate.
• the resin composition thus obtained has photocurability and thermosetting properties, and is also sufficiently cured by thermosetting alone.
• the thermosetting temperature of the resin composition is preferably 60 to 90° C. when the resin composition is used for an image sensor module.
• the resin composition of this embodiment can be used, for example, as an adhesive for fixing, adhering, or protecting parts, a sealant, a dam agent, and a raw material thereof, and is suitable as a one-liquid type.
• the dam agent is formed in advance on the outer periphery of the substrate, for example, before sealing a plurality of semiconductor chips and the like on the substrate with a low-viscosity fill agent or the like. By forming a dam using the dam agent, it is possible to suppress the subsequent outflow of the low-viscosity fill agent that seals the plurality of semiconductor chips.
• the adhesive containing the resin composition of the present embodiment enables good bonding to engineering plastics, ceramics, and metals.
• the adhesive or sealant according to the second embodiment of the present invention contains the resin composition according to the first embodiment described above. This adhesive or encapsulant allows good bonding to engineering plastics, ceramics, and metals.
• the adhesive or sealing material of this embodiment is preferably used for fixing, adhering, or protecting components constituting an image sensor or camera module.
• the cured product of the third embodiment of the present invention is a cured product of the resin composition of the first embodiment or the adhesive or sealant of the second embodiment.
• a semiconductor device or an electronic component according to a fourth embodiment of the present invention includes the cured product according to the third embodiment described above.
• the term "semiconductor device” refers to all devices that can function by utilizing semiconductor characteristics, and includes electronic components, semiconductor circuits, modules incorporating these, electronic devices, and the like.
• the semiconductor device or electronic component include, but are not limited to, an HDD, a semiconductor element, a sensor module such as an image sensor module, a camera module, a semiconductor module, and an integrated circuit.
• the semiconductor device or electronic component can be an image sensor or camera module.
• Examples 1 to 31, Comparative Examples 1 to 4 A resin composition was prepared by mixing predetermined amounts of each component using a three-roll mill according to the formulation shown in Table 1.
• Table 1 the amount of each component is expressed in parts by mass (unit: g).
• the components used in the examples and comparative examples are as follows.
• A-1 Polyester acrylate manufactured by Toagosei Co., Ltd. (product name: M7100, acryloyl equivalent: 188 g/eq)
• A-2 Dimethylol-tricyclodecane diacrylate manufactured by Kyoeisha Chemical Co., Ltd. (Product name: Light acrylate DCP-A, acryloyl equivalent: 152 g/eq)
• A-3 Neopentyl glycol-modified trimethylolpropane diacrylate manufactured by Nippon Kayaku Co., Ltd.
• E-1 Calcium carbonate manufactured by Ube Materials
• E-2 Zeolite particles manufactured by Nakamura Carbide
• E-3 Zeolite particles manufactured by Nakamura Carbide
• F-3 Zeolite particles manufactured by Nakamura Carbide
• F-3 Surfactant (ingredient (F))
• F-1) Sorbitan laurate ester manufactured by Takemoto Yushi
• F-2 Sorbitan oleate ester manufactured by Takemoto Yushi
• F-3 Polyoxyethylene oleyl ether manufactured by Takemoto Yushi (product name: D-1502)
• G-1 Photoradical initiator (component (G))
• G-1) IGM Resins B. V. ⁇ -aminoalkylphenone; 1-hydroxy
• the resin compositions of Examples 1 to 5 contain (D) a rubber component, so that the resin compositions of Comparative Example 1 and (D) a rubber component do not contain (D) a rubber component. It can be seen that the bleed phenomenon was significantly suppressed compared to the resin composition of Comparative Example 2 containing (E) inorganic filler (calcium carbonate filler) instead of (E).
• the bleed suppression effect was studied under conditions in which the resin composition contained a certain amount of (G) a photoradical initiator. As shown in Table 2, in Examples 16 to 23 and Comparative Example 3 containing (G) a photoradical initiator, (D) rubber component was included (Examples 16 to 23), and (D) rubber Compared to a resin composition containing no component (Comparative Example 3), the bleeding phenomenon is significantly suppressed.
• the bleed suppression effect was studied under conditions in which the resin composition contained a certain amount of (E) inorganic filler. As shown in Table 3, in Examples 24 to 31 and Comparative Example 4 containing (E) inorganic filler, (D) rubber component was included (Examples 24 to 31), and (D) rubber component was Compared to a resin composition that does not contain it (Comparative Example 4), the bleeding phenomenon is significantly suppressed.
• the present invention relates to at least a thermosetting resin composition capable of suppressing a bleed phenomenon, and in particular, an adhesive or sealant used for fixing, adhering, or protecting components of a miniaturized or highly integrated semiconductor module. It is very useful as a drug.

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