Classifications

• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/24—Coupling light guides
  • G02B6/42—Coupling light guides with opto-electronic elements
  • G02B6/4201—Packages, e.g. shape, construction, internal or external details
  • G02B6/4286—Optical modules with optical power monitoring
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/24—Coupling light guides
  • G02B6/42—Coupling light guides with opto-electronic elements
  • G02B6/4201—Packages, e.g. shape, construction, internal or external details
  • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/24—Coupling light guides
  • G02B6/42—Coupling light guides with opto-electronic elements
  • G02B6/4201—Packages, e.g. shape, construction, internal or external details
  • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
  • G02B6/4236—Fixing or mounting methods of the aligned elements
  • G02B6/4245—Mounting of the opto-electronic elements
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/24—Coupling light guides
  • G02B6/42—Coupling light guides with opto-electronic elements
  • G02B6/4201—Packages, e.g. shape, construction, internal or external details
  • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/24—Coupling light guides
  • G02B6/42—Coupling light guides with opto-electronic elements
  • G02B6/4201—Packages, e.g. shape, construction, internal or external details
  • G02B6/4274—Electrical aspects
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/24—Coupling light guides
  • G02B6/42—Coupling light guides with opto-electronic elements
  • G02B6/4201—Packages, e.g. shape, construction, internal or external details
  • G02B6/4274—Electrical aspects
  • G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/24—Coupling light guides
  • G02B6/26—Optical coupling means
  • G02B6/32—Optical coupling means having lens focusing means positioned between opposed fibre ends

Definitions

• the present disclosure relates to an optical waveguide substrate, an optical waveguide package and a light source module.
• Patent Document 1 A conventional optical waveguide substrate is described in Patent Document 1, for example.
• An optical waveguide substrate of the present disclosure includes a substrate, a clad layer provided on the substrate, and a core forming an optical waveguide in the clad layer.
• the cladding layer has an element mounting region on which a light receiving element is mounted, located across the core in plan view, on a second surface opposite to the first surface facing the substrate. The height from the substrate to the element mounting region is higher than the height from the substrate to the upper surface of the region of the cladding layer covering the core.
• An optical waveguide package of the present disclosure includes the optical waveguide substrate, and a light receiving element mounted in the element mounting area and including a light receiving portion at a position overlapping with the core in plan view.
• the light source module of the present disclosure includes the optical waveguide package, a light-emitting element optically coupled to the light-receiving element through the core, and a lid covering the light-receiving element and the light-emitting element.
• FIG. 1 is a schematic perspective view of one embodiment of a light source module of the present disclosure
• FIG. FIG. 2 is a sectional view seen from the section line II-II in FIG. 1
• 3 is a plan view showing an optical waveguide substrate
• FIG. FIG. 4 is a cross-sectional view seen from the cross-sectional line IV-IV in FIG. 3, showing the light-receiving element arrangement structure of the first embodiment
• 2 is a plan view of a light receiving element
• FIG. 4 is a plan view of a clad layer
• FIG. It is a cross-sectional view showing a light receiving element arrangement structure of a second embodiment.
• FIG. 2 is a plan view of a light receiving element;
• FIG. 4 is a plan view of a clad layer;
• FIG. It is a cross-sectional view showing a light receiving element arrangement structure of a third embodiment.
• 2 is a plan view of a light receiving element;
• FIG. 4 is a plan view of a clad layer;
• FIG. It is a cross-sectional view showing a light-receiving element arrangement structure of a fourth embodiment.
• 2 is a plan view of a light receiving element;
• FIG. 4 is a plan view of a clad layer;
• FIG. 11 is a cross-sectional view showing a light-receiving element arrangement structure of a fifth embodiment;
• 2 is a plan view of a light receiving element;
• FIG. 11 is a cross-sectional view showing a light-receiving element arrangement structure of a fifth embodiment;
• 2 is a plan view of a light receiving element;
• FIG. 4 is a plan view of a clad layer
• FIG. FIG. 11 is a plan view of an optical waveguide substrate showing a light receiving element arrangement structure of a sixth embodiment
• FIG. 10 is a sectional view seen from the section line XX in FIG. 9; It is a top view of a light receiving element.
• 4 is a plan view of a clad layer
• FIG. 11 is a cross-sectional view showing a light receiving element arrangement structure of a seventh embodiment; It is a top view of a light receiving element.
• 4 is a plan view of a clad layer; FIG. It is a top view which shows the light source module of other embodiment.
• Patent Document 1 describes an optical waveguide substrate in which a core layer and a clad layer are laminated on a substrate, and a portion of the clad layer is removed to set a mounting region for a light receiving element.
• Patent Document 2 describes an optical waveguide substrate in which a light-receiving element is supported on a clad layer by a protruding portion having the same height as a core so that the light-receiving portion faces upward.
• the light-receiving element senses part of the light propagating through the core, so improving the arrangement structure of the light-receiving element to increase the light-receiving sensitivity is an issue.
• FIG. 1 is a perspective view schematically showing one embodiment of the light source module of the present disclosure.
• FIG. 2 is a cross-sectional view seen from the section line II--II in FIG. First, based on FIG. 1 and FIG. 2, the configuration of the light source module will be schematically described.
• a light source module 1 of this embodiment includes an optical waveguide package 2 , a light emitting element 3 , a light receiving element 4 , and a lid 5 covering the light emitting element 3 and the light receiving element 4 .
• the optical waveguide package 2 includes an optical waveguide substrate 6, and a recess 7 is formed in the upper surface 6a of the optical waveguide substrate 6.
• Three light emitting elements 3 are installed inside the recess 7 .
• a condensing lens 8 into which the light emitted by the light emitting element 3 is incident is provided. Instead of the condensing lens 8, it is also possible to provide a mirror that reflects light.
• the optical waveguide substrate 6 includes a substrate 11 in which a plurality of dielectric layers made of ceramic material or organic material are laminated, and a clad layer 12 made of glass material, resin material, or the like.
• the substrate 11 has an upper surface 11 a and a lower surface 11 b , and the clad layer 12 is arranged on the upper surface 11 a of the substrate 11 .
• the substrate 11 may be an organic wiring board in which each dielectric layer is made of, for example, an organic material.
• organic wiring boards include printed wiring boards, build-up wiring boards, and flexible wiring boards.
• organic materials used for organic wiring boards include epoxy resins, polyimide resins, polyester resins, acrylic resins, phenolic resins, and fluorine resins.
• the clad layer 12 has a first surface (lower surface) 12a facing the upper surface 11a of the substrate 11 and a second surface (upper surface) 12b opposite to the first surface 12a.
• a recess 7 is formed in the second surface 12b of the clad layer 12, and a plurality of external connection terminals 15 are arranged at the other end in the longitudinal direction.
• the light emitting element 3 is joined to the wiring 14 located on the bottom surface of the recess 7 with a conductive joining material 16 such as solder or brazing material.
• the electrode on the lower surface side of the light emitting element 3 is electrically connected to the wiring 14 via the conductive bonding material 16 .
• a plurality of wirings 14 extend to the outside of the recess 7 and are electrically connected to external connection terminals 15 .
• the external connection terminal 15 is electrically connected to an external device such as a power supply circuit via an external wiring (not shown).
• each core 17 is located on the inner wall surface of the recess 7 and faces the exit surface of the light emitting element 3 located within the recess 7 .
• the three cores 17 meet each other to form a multiplexing portion, and a waveguide is formed by integrating the three cores 17 from the multiplexing portion to one end of the optical waveguide substrate 6 .
• Each core 17 is made of a light-guiding material having a higher optical refractive index than the cladding layer 12, such as a quartz-based glass material. , can be guided in the longitudinal direction of the optical waveguide substrate 6 (the X direction in FIG. 1).
• three LDs Laser Diodes
• the core 17 has an incident end optically coupled to each LD and an outgoing end optically coupled to the condenser lens 8 .
• the light emitting element 3 is optically coupled to the light receiving element 4 via the core 17 .
• the light receiving element 4 senses light leaking from the core 17 and outputs a predetermined signal to the outside.
• the light emitting element 3 is not limited to an LD, and may be, for example, a light emitting diode (LED) or a VCSEL (Vertical Cavity Surface Emitting Laser).
• FIG. 3 is a plan view showing the optical waveguide substrate 6.
• the light receiving element 4 is arranged on the second surface 12b of the clad layer 12, and the joint region 18 (indicated by the chain double-dashed line) of the cover 5 is formed on the second surface 12b of the clad layer 12. is set.
• the lid 5 is formed of glass or the like in a thin box shape with an open bottom surface, and is bonded to the clad layer 12 with a bonding material 13 (see FIG. 2) such as solder or paste.
• the bonding area 18 is defined in a rectangular frame shape similar to the lower surface of the lid 5, and inside the bonding area 18, the recess 7 in which the light emitting element 3 is installed and the area 19 in which the light receiving element 4 is arranged (chain line area) is provided.
• FIG. 4A to 4C show the light receiving element arrangement structure of the first embodiment
• FIG. 4A is a cross-sectional view seen from the section line IV-IV in FIG. 3
• FIG. 4B is a plan view of the light receiving element
• FIG. 4C is a plan view of the clad layer.
• a light receiving area 20 covering the core 17 in plan view and an element mounting area on which the light receiving element 4 is mounted are provided in a region 19 where the light receiving element 4 is disposed. 21 are included.
• a concave portion 22 is formed in a portion corresponding to the light receiving region 20 on the second surface 12 b of the clad layer 12 , and the element mounting region 21 is set in a frame shape surrounding the concave portion 22 .
• the height (21h) from the substrate 11 to the element mounting region 21 is greater than the height (21h) from the substrate 11 to the upper surface of the region covering the core 17 of the cladding layer 12 ( 20h) higher. That is, the height 21h from the substrate 11 to the element mounting region 21 is higher than the height 20h from the substrate 11 to the light receiving region 20 by a distance (21h-20h) corresponding to the depth of the recess 22.
• the height difference (21h-20h) between the light receiving region 20 and the device mounting region 21 can also be provided by projecting the device mounting region 21 from the second surface 12b of the clad layer 12.
• the light receiving element 4 has an upward light receiving portion 4a.
• the light-receiving element 4 has a light-receiving portion 4a at a position overlapping the core in a plan view, so that leaked light from the core 17 can be easily sensed.
• the light receiving element 4 may be composed of, for example, a photodiode (PD), a CMOS (Complementary Metal Oxide Semiconductor), or a CCD (Charge Coupled Device).
• a pair of electrodes 23 are provided in the vicinity of the light receiving portion 4a, and each electrode 23 is electrically connected to an electrode 25 on the clad layer 12 side via a bonding wire 24, respectively.
• Each electrode 25 is electrically connected to the wiring 14 in the clad layer 12 through a penetrating conductor 26 also called a via hole.
• the gap of 21h-20h between the cladding layer 12 and the light receiving device 4 is obtained. can be secured, and contact between the light receiving element 4 and the clad layer 12 can be avoided.
• the possibility of the two rubbing against each other or the core 17 deforming is reduced, and the light propagation efficiency of the optical waveguide substrate 6 is increased. can be maintained.
• FIG. 5A to 5C show the light receiving element arrangement structure of the second embodiment, where FIG. 5A is a cross-sectional view, FIG. 5B is a plan view of the light receiving element, and FIG. 5C is a plan view of the clad layer.
• the same reference numerals are given to the same corresponding parts as in the light receiving element arrangement structure of the above-described first embodiment.
• the light receiving element 4 is installed so as to face the optical waveguide substrate 6 with the light receiving portion 4a facing downward, as shown in FIGS. 5A to 5C.
• the light receiving element 4 is mounted so that the light receiving portion 4 a faces the optical waveguide substrate 6 .
• first recesses 28 are formed to extend along the cores 17 outside the element mounting region 21 at positions sandwiching the three cores 17 in a plan view.
• a side surface 28 a of the first recess 28 is inclined upward so that the width of the first recess 28 is wider on the second surface 12 b of the clad layer 12 than on the first surface 12 a side.
• the side surface 28 a of the first recess 28 has a surface roughness greater than that of the second surface 12 b of the clad layer 12 .
• the electrode 25 on the clad layer 12 side extends from the second surface 12 b of the clad layer 12 to the side surface 28 a of the first recess 28 .
• the electrode 25 is connected to the wiring 14 exposed on the bottom surface of the first recess 28 . Since other configurations are the same as those of the first embodiment, overlapping descriptions are omitted.
• the light-receiving element arrangement structure of the second embodiment since the light-receiving portion 4a is provided facing the clad layer 12 of the optical waveguide substrate 6, light is received between the light-receiving portion 4a and the core 17 through which light is transmitted.
• the substrate of element 4 is not located. Therefore, the detection of the light leaked from the core 17 by the light receiving element 4 is enhanced. Further, since the substrate of the light receiving element 4 is positioned between the outside and the light receiving section 4a, the light receiving element 4 is less susceptible to external light. Further, since the clad layer 12 is formed with the first recesses 28 , the cushion effect of the clad layer 12 can suppress deformation of the core 17 accompanying deformation of the optical waveguide substrate 6 .
• the electrode 25 of the clad layer 12 extends to the side surface 28a of the first concave portion 28 and covers the entire side surface 28a. Incident into the inside of the layer 12 can be effectively suppressed. Moreover, since the side surface 28a is inclined, the amount of light returning to the core 17 can be further reduced. Furthermore, since the electrode 25 extends to the bottom surface of the first recess 28 and is connected to the wiring 14, wire bonding is not required for connecting the electrode 25 and the wiring 14, and the optical waveguide substrate 6 can be miniaturized. is possible.
• the side surface 28a has a larger surface roughness than the second surface 12b of the cladding layer 12, the light leaking from the core 17 is diffused by the roughened surface portion and can be suppressed from returning to the core 17. .
• the anchoring effect of the rough surface portion increases the adhesion strength with the electrode 25, thereby preventing the electrode 25 from peeling off from the side surface 28a due to stress.
• the surface roughness here is the arithmetic mean roughness Ra.
• FIGS. 6A to 6C show the light receiving element arrangement structure of the third embodiment, FIG. 6A being a cross-sectional view, FIG. 6B being a plan view of the light receiving element, and FIG. 6C being a plan view of the clad layer.
• the same reference numerals are given to the same corresponding parts as in the light-receiving element arrangement structure of the first embodiment.
• the light-receiving element arrangement structure of the third embodiment as shown in FIGS. 6A to 6C, the light-receiving element 4 is bonded at its both ends to the element mounting region 21 via a bonding material.
• an electrode 25 is positioned in the element mounting region 21 overlapping the light receiving element 4 , and the electrode 23 of the light receiving element 4 is electrically connected to the electrode 25 .
• the electrode 25 covering the second surface 12b of the cladding layer 12 and the side surface 28a of the first recess 28 has a conductor with a relatively low reflectance
• the wiring 14 exposed at the bottom surface of the first recess 28 is thicker than the electrode 25.
• the wiring 14 extends to a position overlapping with the element mounting region 21 in plan view.
• Other configurations are the same as those of the second embodiment. For example, when aluminum (Al) is used for the wiring 14, any one of Ti, Cr, and Ni, for example, can be used for the electrode 25 as a conductor with low reflectance.
• the electrodes are positioned in the element mounting region 21, when the light-receiving part 4a of the light-receiving element 4 is mounted facing the optical waveguide substrate 6, A light-receiving element 4 in which the light-receiving portion 4a and the electrode 23 are arranged in the same plane, which is low in manufacturing cost, can be used. Wire bonding is not required for mounting the light receiving element 4, flip-chip connection is possible, bonding wires are omitted, and the height of the optical waveguide substrate 6 can be reduced. In addition, since the electrodes 25 are connected so as to cover the wirings 14 (see FIGS.
• wire bonding is not required even in this portion, and the optical waveguide substrate 6 can be made smaller.
• the wiring 14 is made of aluminum (Al)
• Al aluminum
• the surface of the wiring 14 is uneven due to deterioration in the manufacturing process, and the adhesion between the conductors can be improved by the anchor effect.
• the wiring 14 extends to a position overlapping with the element mounting region 21, the surface of the element mounting region 21 overlapping with the uneven wiring 14 is likely to be uneven, and the adhesion of the electrode 25 located thereon is reduced. can also be improved.
• the electrode 25 is positioned at about the same height as the core 17, by arranging a low-reflectance conductor on the electrode 25, which is likely to receive the light leaked from the core 17, the leaked light is reflected to the core. Returning to 17 can be suppressed.
• the wiring 14 on the side of the substrate 11 where light leaking from the core 17 is difficult to hit, the wide portion 14a with high reflectance is provided, thereby preventing disturbance light from entering the core 17 through the substrate 11 and the clad layer 12. can be suppressed.
• FIG. 7A is a cross-sectional view showing a light receiving element arrangement structure of the fourth embodiment
• FIG. 7B is a plan view of the light receiving element
• FIG. 7C is a plan view of the clad layer.
• the same reference numerals are given to the same corresponding parts as in the light-receiving element arrangement structure of the first embodiment.
• a plurality of second concave portions 30 are formed at positions sandwiching the three cores 17 individually. It is formed to extend along the core 17 .
• the bottom surface 30 a of the second recess 30 is positioned higher than the core 17 .
• the height 30h from the top surface 11a of the substrate 11 to the bottom surface 30a of the second recess 30 is higher than the height 17h from the substrate 11 to the top surface 17a of the core 17 .
• Other configurations are the same as those of the third embodiment.
• the gap between the optical waveguide substrate 6 and the light-receiving element 4 increases due to the second concave portion 30, and the element mounting structure is improved. Since the deformation of the cladding layer 12 sandwiched between the regions 21 is mitigated by the second recesses 30, it is possible to make it difficult for the influence to be transmitted to the optical waveguide substrate 6 side. As a result, the distortion of the core 17 can be suppressed and the sensitivity of the light receiving element 4 can be enhanced. Further, by making the bottom surface 30a of the second concave portion 30 higher than the core 17, it is possible to achieve both suppression of deformation of the core 17 and suppression of variation in the gap.
• FIG. 8A is a cross-sectional view showing the light receiving element arrangement structure of the fifth embodiment
• FIG. 8B is a plan view of the light receiving element
• FIG. 8C is a plan view of the clad layer.
• the same reference numerals are given to the same corresponding parts as in the light-receiving element arrangement structure of the first embodiment.
• a first recess 28 is provided inside the element mounting region 21, and a plurality of second recesses are provided further inside the first recess 28. 30 are formed.
• light shielding films 31 are provided on both sides of the light receiving element 4 in the X direction so as to extend across both ends of the electrode 25 covering the side surface 28a of the first recess 28 .
• the light shielding film 31 is a strip-shaped non-light-transmitting film that does not transmit light, and is made of a metal film such as aluminum (Al). Other configurations are the same as those of the fourth embodiment.
• the light shielding film 31 may be made of Ti, Cr, or Ni, for example.
• the light-shielding film 31 surrounds the portion of the core 17 sandwiched between the element mounting regions 21 in a plan view, in other words, surrounds the light-receiving region 20 and is located on the second surface 12b of the clad layer 12. good.
• the light shielding film 31 is positioned across the light receiving region 20 in the X direction, and the electrode 25 is positioned across the light receiving region 20 in the Z direction. Since the electrode 25 is also a metal film having a light shielding property, it can be said that the light shielding film 31 is positioned surrounding the light receiving region 20 in the example shown in FIGS. 8A to 8C.
• the stress (thermal stress) generated between the optical waveguide substrate 6 and the light receiving element 4 is reduced.
• the light-shielding film 31 it is also possible for the light-shielding film 31 to efficiently block disturbance light entering from the periphery of the light-receiving element 4 and trying to enter the light-receiving portion 4a. Therefore, the detection accuracy of light leaking from the core 17 is high.
• FIG. 9 is a plan view of an optical waveguide substrate showing the light receiving element arrangement structure of the sixth embodiment.
• 10A is a cross-sectional view seen from the cross-sectional line XX in FIG. 9
• FIG. 10B is a plan view of the light receiving element
• FIG. 10C is a plan view of the clad layer.
• the same reference numerals are given to the same corresponding parts as in the light-receiving element arrangement structure of the first embodiment.
• the light shielding film 31 is configured to surround the element mounting region 21 in cooperation with the electrode 25 .
• Other configurations and effects are the same as those of the fifth embodiment.
• second recesses 30 are formed on the second surface 12 b of the clad layer 12 so as to extend along the cores 17 at positions sandwiching the three cores 17 individually.
• the first recessed portion 28 is located between the second recessed portion 30 located outside in the Z direction of the four second recessed portions 30 and the element mounting region 21 .
• the second concave portion 30 may extend to the outside of the light receiving region 20 .
• FIG. 11A is a cross-sectional view showing a light receiving element arrangement structure of the seventh embodiment
• FIG. 11B is a plan view of the light receiving element
• FIG. 11C is a plan view of the clad layer.
• the same reference numerals are given to the same corresponding parts as in the light-receiving element arrangement structure of the first embodiment.
• the electrode 25 has a narrow portion 25a, and the side surface 28a of the first recess 28 is partially covered by the narrow portion 25a.
• the light shielding film 31 is formed in a square annular shape so as to continuously surround the element mounting region 21 in plan view.
• Such a light shielding film 31 may be made of, for example, Ti, Cr, or Ni.
• the electrode 25 is provided so as to cover the entire side surface 28a of the first recess 28, so the electrode 25 functions as a light shielding film.
• the narrow portion 25a of the electrode 25 partially covers the side surface 28a of the first recess 28, so the electrode 25 does not sufficiently function as a light shielding film.
• FIG. 12 is a plan view showing a light source module of another embodiment.
• the same reference numerals are given to the parts corresponding to the above-described embodiments, and redundant explanations are omitted.
• the above-described embodiment has a configuration in which three cores 17 are integrated at the combining portion where they meet to form one waveguide, which extends to the output end.
• three light emitting elements 3 are aligned with the positions of the light emitting elements 3 so that the center of the incident end of each core 17 and the optical axis of each light emitting element 3 are aligned. They are the same in that the incident ends are positioned apart from each other.
• the core 17 is bent outside the junction region 18 to meet or come close to it. 21.
• the output ends of the three cores 17 are located close to each other but apart from each other.
• the three cores 17 may be concentrated so as to be close to each other between each incident end and each emitting end, and extend in parallel from there to each emitting end.
• the three cores 17 may not be parallel, but may be arranged substantially parallel so that the distance between them decreases toward the output end.
• the cores 17 may be greatly curved and close to each other, and may be arranged so that the distance between them becomes smaller toward the output end.
• the cores 17 may be greatly curved and close to each other, and may extend substantially parallel to each other toward the emission end. At this time, the gap between adjacent cores 17 may be reduced from the adjacent portion to the output end.
• Each light emitted from the emission end of each core 17 may be combined by, for example, a condenser lens 8 .
• the emitted light from each core 17 may be emitted in parallel by a lens 8, for example.
• the images and the like of the light emitted from the three emitting ends may be synthesized by, for example, an external device.
• the cladding layer has, on the second surface, an element mounting area where the light receiving element located across the core in plan view is mounted, and the area covering the core of the cladding layer from the substrate. Since the height from the substrate to the element mounting region is higher than the height to the upper surface of the substrate, the light receiving sensitivity can be enhanced.
• optical waveguide substrate according to the present disclosure can be implemented in the following configurations (1) to (11).
• the cladding layer has an element mounting region on which a light receiving element is mounted, located across the core in plan view, on a second surface opposite to the first surface facing the substrate, An optical waveguide substrate, wherein the height from the substrate to the element mounting region is higher than the height from the substrate to the upper surface of the region covering the core of the cladding layer.
• optical waveguide substrate according to the above configuration (1) or (2), further comprising an electrode located in the element mounting region and electrically connected to the light receiving element to be mounted.
• the core includes a plurality of The optical waveguide substrate according to any one of the above configurations (2) to (6), wherein the cladding layer has second recesses positioned to sandwich the plurality of cores.
• optical waveguide package according to the present disclosure can be implemented in the following configurations (12) and (13).
• the optical waveguide substrate according to any one of the above configurations (1) to (11); and a light receiving element mounted in the element mounting region and including a light receiving portion at a position overlapping with the core in a plan view.
• optical waveguide package according to the present disclosure can be implemented in the following configuration (14).
• the optical waveguide package according to the above configuration (12) or (13); a light-emitting element optically coupled to the light-receiving element via the core; and a lid covering the light receiving element and the light emitting element.

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• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Optical Integrated Circuits (AREA)
• Light Receiving Elements (AREA)
• Optical Couplings Of Light Guides (AREA)
• Semiconductor Lasers (AREA)

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Publications (1)

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Citations (12)

• 2023
  • 2023-02-16 EP EP23759847.9A patent/EP4485024A1/en not_active Withdrawn
  • 2023-02-16 US US18/836,310 patent/US20250167188A1/en active Pending
  • 2023-02-16 WO PCT/JP2023/005421 patent/WO2023162846A1/ja not_active Ceased
  • 2023-02-16 JP JP2024503088A patent/JPWO2023162846A1/ja active Pending
  • 2023-02-16 CN CN202380020462.7A patent/CN118661121A/zh active Pending
  • 2023-02-20 TW TW112106070A patent/TW202346930A/zh unknown

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