WO2023162489A1 - Composition de résine - Google Patents

Composition de résine Download PDF

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Publication number
WO2023162489A1
WO2023162489A1 PCT/JP2023/000323 JP2023000323W WO2023162489A1 WO 2023162489 A1 WO2023162489 A1 WO 2023162489A1 JP 2023000323 W JP2023000323 W JP 2023000323W WO 2023162489 A1 WO2023162489 A1 WO 2023162489A1
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WIPO (PCT)
Prior art keywords
resin composition
structural unit
component
group
unit represented
Prior art date
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PCT/JP2023/000323
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English (en)
Japanese (ja)
Inventor
翔太 今井
勲 安達
拓 加藤
利彦 神山
圭介 首藤
峻 菅原
敏明 武山
崇洋 坂口
Original Assignee
日産化学株式会社
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Priority to CN202380022645.2A priority Critical patent/CN118742607A/zh
Publication of WO2023162489A1 publication Critical patent/WO2023162489A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/02—Polythioethers; Polythioether-ethers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses

Definitions

  • the present invention relates to a resin composition, a resin film obtained from the resin composition, an optical member, and a microlens.
  • optical members such as intralayer lenses, optical waveguides, and film substrates.
  • optical members are required to have not only transparency but also long-term reliability such as excellent heat resistance, light resistance, and moisture resistance, and chemical resistance.
  • the optical member is often required to have a high refractive index in order to improve the light extraction efficiency and the light condensing property.
  • an etch-back method is known as one method of manufacturing microlenses for CCD/CMOS image sensors (Patent Documents 1 and 2). That is, a resist pattern is formed on the microlens resin layer formed on the color filter layer, and the resist pattern is reflowed by heat treatment to form a lens pattern. Using the lens pattern formed by reflowing this resist pattern as an etching mask, the underlying microlens resin layer is etched back, and the lens pattern shape is transferred to the microlens resin layer to fabricate the microlens.
  • the microlens manufacturing by the etch-back method is generally performed on the wafer, materials suitable for the wafer process, such as EBR (edge bead removal or edge bead rinse) performed for the purpose of preventing contamination of the wafer transfer arm, are used.
  • EBR edge bead removal or edge bead rinse
  • the present invention has been made based on the above circumstances, and is capable of EBR, and has a high refractive index, transparency, heat resistance, light resistance, moisture resistance, chemical resistance, and a dry etching rate equivalent to that of resist. It aims at providing the resin composition which can form the resin film which has.
  • the inventors of the present invention have made intensive studies to solve the above problems, and found that a composition containing polyphenylene sulfide having a phenolic hydroxy group and a specific organic solvent can solve the above problems. completed.
  • the present invention provides the following resin composition.
  • (A) a polymer and (B) an organic solvent The component (A) is a polymer containing a structural unit represented by the following formula (1), A resin composition in which the component (B) is an organic solvent having a melting point of 15°C or lower and a boiling point of 85°C or higher.
  • R 1 independently represents a hydroxy group, methyl group, ethyl group, methoxy group or ethoxy group
  • a represents an integer of 0 to 3
  • n represents an integer of 1 to 4;
  • the above a and n satisfy 1 ⁇ a + n ⁇ 4.
  • the component (A) is a structural unit represented by the following formula (3a), a structural unit represented by the following formula (3b), a structural unit represented by the following formula (4a), and a structural unit represented by the following formula (4b).
  • 1 or 2 resin composition which is a polymer containing at least one structural unit selected from the group consisting of structural units. 4.
  • the component (B) is ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, ethylene glycol monomethyl ether acetate, ethylene glycol mono Ethyl ether acetate, propylene glycol monomethyl ether acetate, ethyl lactate, n-butyl lactate, methyl pyruvate, ethyl pyruvate, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, 2-heptanone, cyclopenta Any of 1 to 3 containing at least one organic solvent selected from the group consisting of non, cyclohexanone, ⁇ -butyrolactone, N,N-dimethylacetamide, N-methyl-2-pyrrolidone and N-ethyl-2-pyrroli
  • the present invention by dissolving polyphenylene sulfide having a phenolic hydroxyl group in a specific organic solvent, EBR becomes possible, and the formed resin film exhibits a high refractive index and high transparency, and long-term reliability and It is possible to provide a resin composition suitable for use in optical members, which is also excellent in chemical resistance. Moreover, since the resin film has an appropriate dry etching rate, it is particularly suitable for microlens applications.
  • the resin composition of the present invention will be described in more detail below.
  • the resin composition of the present invention is characterized by containing (A) a polymer and (B) an organic solvent, which will be described later.
  • solid content means components other than the solvent which comprise a resin composition.
  • the polymer is not particularly limited as long as it contains a structural unit represented by the following formula (1).
  • each R 1 independently represents a hydroxy group, a methyl group, an ethyl group, a methoxy group or an ethoxy group, a represents an integer of 0 to 3, and n represents an integer of 1 to 4. .
  • a and n satisfy 1 ⁇ a+n ⁇ 4.
  • R 1 is preferably a hydroxy group.
  • the a is preferably 0 or 1, and the n is preferably 1.
  • a structural unit represented by the following formula (2) is preferable as the structural unit represented by the formula (1).
  • R 1 has the same definition as in formula (1) above.
  • the structural unit represented by the formula (1) include a structural unit represented by the following formula (3a), a structural unit represented by the following formula (3b), and a structural unit represented by the following formula (4a).
  • Structural units and structural units represented by the following formula (4b) are included.
  • component (A) may contain other structural units other than the structural unit represented by the formula (1) as long as the effects of the present invention are not impaired.
  • Other structural units include, for example, structural units represented by the following formula (a) and structural units represented by the following formula (b).
  • n an integer of 1 to 4.
  • the proportion of the structural unit represented by formula (1) in the polymer is preferably 10 mol% or more, more preferably 20 mol% or more, still more preferably 30 mol% or more, and still more preferably 50 mol%. This is the above, and 100 mol % is optimal.
  • the molecular weight of the polymer is preferably 500 to 100,000, more preferably 1,000 to 30,000, and still more preferably 1,500 as a polystyrene equivalent weight average molecular weight calculated by gel permeation chromatography (GPC). ⁇ 10,000.
  • polyarylene sulfide production methods polycondensation with an aromatic halogen compound and sodium sulfide, oxidation polymerization of an aromatic thiol compound or an aromatic disulfide compound, etc.
  • polycondensation with an aromatic halogen compound and sodium sulfide, oxidation polymerization of an aromatic thiol compound or an aromatic disulfide compound, etc. are applied to a phenol derivative.
  • various known polyarylene sulfide production methods polycondensation with an aromatic halogen compound and sodium sulfide, oxidation polymerization of an aromatic thiol compound or an aromatic disulfide compound, etc.
  • it can be synthesized by deprotecting some or all of the protecting groups.
  • the oxidative polymerization method using a quinone-based oxidizing agent and an acid described in Patent Documents 4 and 5 is preferably used.
  • Specific production methods thereof include a method of oxidative polymerization using a quinone-based oxidizing agent and an acid using an aromatic thiol compound containing a hydroxy group or an aromatic disulfide compound containing a hydroxy group as a monomer; An aromatic thiol compound containing a hydroxy group or an aromatic disulfide compound containing a protected hydroxy group is used as a monomer and oxidatively polymerized using a quinone-based oxidizing agent and an acid, and then some or all of the protective groups are deprotected.
  • the protected hydroxy group is not particularly limited as long as the polymerization proceeds, but from the viewpoint of stability that does not interfere with a quinone-based oxidizing agent or acid, an alkoxy group is preferred, a methoxy group or an ethoxy group is more preferred, and a methoxy group is preferred. , is particularly preferred because the deprotection reaction can proceed more easily.
  • the alkoxy group can be converted to a hydroxy group by removing the alkyl group by the action of an acid or the like.
  • the acid examples include Lewis acids such as trisubstituted boron compounds (such as boron tribromide) and aluminum chloride, and Bronsted acids such as thiol compounds (such as dodecanethiol) and hydrogen bromide. It is not particularly limited as long as it is a convertible acid. All protecting groups may be deprotected or some may be left. Optical properties and solubility can be controlled by appropriately adjusting the deprotection rate.
  • Lewis acids such as trisubstituted boron compounds (such as boron tribromide) and aluminum chloride
  • Bronsted acids such as thiol compounds (such as dodecanethiol) and hydrogen bromide. It is not particularly limited as long as it is a convertible acid. All protecting groups may be deprotected or some may be left. Optical properties and solubility can be controlled by appropriately adjusting the deprotection rate.
  • the monomers used to synthesize the component (A) may be used singly or in combination of two or more. From the viewpoint of adjusting optical properties and solubility, if necessary, an aromatic thiol compound or aromatic disulfide compound containing no hydroxy group, or an aromatic thiol compound or aromatic disulfide containing no protected hydroxy group.
  • the compound may be polymerized using the compound as a comonomer. That is, the polymer may contain at least one structural unit represented by the formula (1), and may be a homopolymer or a copolymer.
  • the polymer is a copolymer
  • its repeating structure is not particularly limited, and may be an alternating copolymer, a block copolymer, a gradient copolymer or a random copolymer.
  • the polymer may be branched depending on the polymerization conditions.
  • the organic solvent is an organic solvent having a melting point of 15° C. or lower and a boiling point of 85° C. or higher.
  • the melting point and boiling point refer to those at 1 atmospheric pressure. Since the melting point is 15° C. or lower, the resin composition has excellent handleability at room temperature.
  • the melting point is preferably 10° C. or lower, more preferably 5° C. or lower, from the viewpoint of storability in a cold place.
  • the lower limit of the melting point is not particularly limited, but is preferably -150° C. or higher, for example.
  • the boiling point is 85° C. or higher, the coating film formed by coating the resin composition on a substrate is less likely to whiten.
  • the boiling point is preferably 100° C. or higher, more preferably 115° C. or higher, from the viewpoint of facilitating the formation of a uniform coating film.
  • the upper limit of the boiling point is preferably 300° C. or lower, more preferably 250° C. or lower, and even more preferably 220° C. or lower, from the viewpoint of organic solvent removability.
  • component (B) include methylcyclohexane, ethylcyclohexane, n-heptane, toluene, o-xylene, m-xylene, mesitylene, chlorobenzene, o-dichlorobenzene, m-dichlorobenzene, anisole, phenetol, di- n-propyl ether, di-n-butyl ether, diisobutyl ether, di-n-pentyl ether, diisopentyl ether, di-n-hexyl ether, n-butyl ethyl ether, methyl-n-pentyl ether, cyclopentyl methyl ether, tetrahydropyran, 1,3-dioxane, 1,4-dioxane, 1-propanol, 1-butanol, 2-butanol, 2-methyl-1-propanol, 1-p
  • the component (B) includes ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, and propylene from the viewpoint of improving the leveling properties of the coating film formed by coating the resin composition on a substrate.
  • the component (B) may be used singly or in combination of two or more. In addition, it may be appropriately mixed with a solvent other than the component (B).In that case, the content of the component (B) is preferably 50 to 100% by mass of the total solvent including the component (B) and other solvents. More preferably 60 to 100% by mass, still more preferably 70 to 100% by mass.
  • the other solvents include methanol, ethanol, 2-propanol, dichloromethane, 1,2-dichloroethane, chloroform, acetone, 2-butanone, dimethylsulfoxide (DMSO), tetrahydrofuran, ethyl acetate, and acetonitrile. mentioned.
  • the resin composition of the present invention may further contain (C) a polyfunctional epoxy compound for the purpose of improving chemical resistance.
  • the component (C) is not particularly limited as long as it is a compound having at least two oxirane rings in the molecule.
  • the following products and compounds can be used.
  • TEPIC (registered trademark)-G, -L, -VL, -S, -SP, -SS, -HP (manufactured by Nissan Chemical Co., Ltd.), Marproof (registered trademark) G- 01100, G-0105SA, G-0130SF, G-0130SP, G-0150M, G-0250SF, G-0250SP, G-05100, G-2050M, G-017581 (above, Japan Oil Co., Ltd.), OGSOL (registered trademark) PG-100, CG-500, EG-200, EG-280 (manufactured by Osaka Gas Chemicals Co., Ltd.), GTR-1800 (manufactured by Nippon Kagaku Pharmaceutical Co., Ltd.), EPICLON (registered trademark) 830, 830-S, 835, 840, 840-S, 850, 850-S, 850-LC, HP-820 (above, DIC Corporation), DENACOL (registered trademark
  • the (C) component may be used singly or in combination of two or more.
  • the content of component (C) is preferably 5 to 50 parts by mass, more preferably 10 to 30 parts by mass, per 100 parts by mass of component (A). Department.
  • the resin composition of the present invention may optionally contain a surfactant for the purpose of improving coatability.
  • surfactants include polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene cetyl ether, and polyoxyethylene oleyl ether; polyoxyethylene octylphenyl ether and polyoxyethylene polyoxyethylene alkylaryl ethers such as nonylphenyl ether; polyoxyethylene/polyoxypropylene block copolymers; sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan monooleate, sorbitan trioleate, and sorbitan trioleate; Sorbitan fatty acid esters such as stearates; Nonionic surfactants such as polyoxyethylene sorbitan fatty acid esters; , F-173, R-30, R-40, R-40-LM (manufactured by stearates.
  • the content of the surfactant is preferably 0.001 to 3 parts by mass, more preferably 0.005 to 1 part by mass, relative to 100 parts by mass of the total solid content. parts, more preferably 0.01 to 0.5 parts by weight.
  • the resin composition of the present invention may optionally contain a curing aid, an antioxidant, a light stabilizer (HALS), an ultraviolet absorber, a plasticizer, an adhesion aid, and the like. Agents can be further included.
  • a curing aid an antioxidant, a light stabilizer (HALS), an ultraviolet absorber, a plasticizer, an adhesion aid, and the like.
  • HALS light stabilizer
  • Agents can be further included.
  • the method for preparing the resin composition of the present invention is not particularly limited, but examples thereof include a method of mixing components (A) and (B), and optionally component (C) and other components to form a uniform solution. be done. Moreover, if necessary, the obtained solution may be filtered using a filter with a pore size of 0.1 to 10 ⁇ m.
  • the solid content concentration of the resin composition thus obtained is usually 1 to 50% by mass from the viewpoint of coatability on substrates.
  • a substrate for example, a PET film, a TAC film, a semiconductor substrate, a glass substrate, a quartz substrate, a silicon wafer, and a substrate having various metal films or color filters formed thereon
  • an appropriate spinner or coater After applying the resin composition of the present invention by a coating method, a resin film is produced by baking using a heating means such as a hot plate or an oven. Baking conditions are appropriately selected from a baking temperature of 50 to 300° C. and a baking time of 0.1 to 360 minutes. The baking process for producing the resin film may be performed in two or more steps.
  • the film thickness of the resin film to be formed is 0.001 to 1,000 ⁇ m, preferably 0.01 to 100 ⁇ m, more preferably 0.1 to 10 ⁇ m.
  • a resist is applied onto the resin film produced through the above [Method for producing a resin film], the resist is exposed through a predetermined mask, post-exposure baking (PEB) is performed as necessary, alkali development is performed, A resist pattern is formed on the resin film by rinsing and drying.
  • PEB post-exposure baking
  • the resist pattern is reflowed by heat treatment to form a lens pattern.
  • the resin film under the lens pattern is etched back, and the shape of the lens pattern is transferred to the resin film to form a microlens.
  • the precipitate generated by the dropping is collected, washed with ethanol, methanol, an aqueous potassium hydroxide solution having a concentration of 3% by mass, and pure water in this order, and then dried at 80° C. under reduced pressure to obtain the following formula (6). 4 g of polymer containing the represented structural unit was obtained (yield 72%). The polystyrene-equivalent weight average molecular weight Mw of the obtained polymer was 3,000.
  • the precipitate generated by the dropping is collected, washed with ethanol, methanol, an aqueous potassium hydroxide solution having a concentration of 3% by mass, and pure water in that order, and then dried at 80° C. under reduced pressure to obtain the following formula (8).
  • 3.5 g of a copolymer containing the two types of structural units represented was obtained (yield 74%).
  • the polystyrene-equivalent weight average molecular weight Mw of the obtained copolymer was 2,500.
  • the precipitate generated by the dropping is collected, washed with ethanol, methanol, an aqueous potassium hydroxide solution having a concentration of 3% by mass, and pure water in this order, and then dried at 80° C. under reduced pressure to obtain the following formula (11). 1.8 g of a copolymer containing the two types of structural units represented was obtained (yield 33%).
  • the polystyrene-equivalent weight average molecular weight Mw of the obtained copolymer was 6,300.
  • Example 2 A resin composition (solid concentration: 18% by mass) was obtained in the same manner as in Example 1, except that 9.8 g of ⁇ -butyrolactone and 6.6 g of methyl pyruvate were used as the component (B).
  • Example 3 A resin composition (solid concentration: 18% by mass) was obtained in the same manner as in Example 1, except that 8.2 g of ethyl lactate and 8.2 g of ethyl 3-ethoxypropionate were used as the component (B). Ta.
  • Example 4 A resin composition (solid content concentration 18 mass% ).
  • Example 5 A resin composition (solid concentration: 18% by mass) was obtained in the same manner as in Example 1, except that 16.4 g of cyclopentanone was used as the component (B).
  • Example 6 Example 1 except that 20.5 g of cyclopentanone was used as component (B) and 0.9 g of ethylene glycol diglycidyl ether was used as component (C) (25 parts by mass per 100 parts by mass of component (A)). A resin composition (solid concentration: 18% by mass) was obtained in the same manner.
  • Example 7 Same as Example 1 except that 23.0 g of cyclopentanone was used as component (B) and 1.4 g of resorcinol diglycidyl ether was used as component (C) (40 parts by mass per 100 parts by mass of component (A)). A resin composition (solid content concentration 18% by mass) was obtained by the procedure of.
  • Example 8 Same as Example 1 except that 19.7 g of cyclopentanone was used as component (B) and 0.7 g of triglycidyl isocyanurate was used as component (C) (20 parts by mass per 100 parts by mass of component (A)). A resin composition (solid content concentration 18% by mass) was obtained by the procedure of.
  • Example 9 A resin composition (solid concentration: 18% by mass) was obtained in the same manner as in Example 5, except that the surfactant was not included.
  • Example 10 A resin composition was prepared in the same manner as in Example 1 except that 3.6 g of the copolymer obtained in Synthesis Example 4 was used as the component (A) and 16.4 g of cyclopentanone was used as the component (B). (solid content concentration 18% by mass) was obtained.
  • Example 11 A resin composition was prepared in the same manner as in Example 1 except that 3.0 g of the copolymer obtained in Synthesis Example 6 was used as the component (A) and 17.0 g of cyclopentanone was used as the component (B). (solid content concentration 15% by mass) was obtained.
  • Example 1 The procedure of Example 1 was repeated except that 3.6 g of the polymer obtained in Synthesis Example 1 was used as the polymer not corresponding to component (A), and 16.4 g of cyclopentanone was used as component (B). , to obtain a resin composition (solid concentration: 18% by mass).
  • ⁇ Comparative Example 4> 3.6 g of the polymer obtained in Synthesis Example 2 was used as component (A), and 16.4 g of dimethyl sulfoxide (melting point: 18°C, boiling point: 189°C) was used as an organic solvent that did not correspond to component (B). A resin composition (solid concentration: 18% by mass) was obtained in the same procedure as in Example 1. When the obtained resin composition was stored in a refrigerator with an interior temperature of 5° C., it solidified.
  • a resist solution THMR-iP1800 (manufactured by Tokyo Ohka Kogyo Co., Ltd.) is applied onto a silicon wafer using a spin coater, and placed on a hot plate at 90°C for 1.5 minutes, 110°C for 1.5 minutes, and then at 180°C. C. for 1 minute to form a resist film with a thickness of 1 .mu.m.
  • the resist film was dry etched using a dry etching apparatus RIE-10NR (manufactured by Samco Ltd.) (etching gas: CF 4 ), and the dry etching rate of the resist film was measured.
  • each of the resin compositions prepared in Examples 1 to 11 was applied onto a silicon wafer using a spin coater and baked on a hot plate at 100° C. for 1 minute. Thereafter, Examples 1 to 4 were baked at 260° C. for 5 minutes, and Examples 5 to 11 were baked at 200° C. for 5 minutes to form a resin film having a thickness of 1 ⁇ m, and the dry etching rate was similarly measured. Then, the dry etching rate ratio of the resin films obtained from the resin compositions prepared in Examples 1 to 11 to the resist film was calculated. Table 1 shows the results.
  • the resin composition of the present invention can be subjected to EBR using PGMEA, and nevertheless, the resin film obtained after baking has resistance to PGMEA.
  • component (C) further improved chemical resistance (Examples 6 to 8).
  • the resin film exhibited excellent transparency, heat resistance, light resistance and moisture resistance while having a high refractive index of 1.75 or more. Furthermore, it was confirmed that the resin film has a dry etching rate suitable for the etch-back method and that it is possible to fabricate a microlens.
  • Comparative Examples 1 and 2 in which polyphenylene sulfide having no phenolic hydroxy group was used instead of component (A), EBR was not possible, and the refractive index of the resulting resin film was less than 1.75. Met. In addition, even if the component (C) was added, no chemical resistance improvement effect was observed (Comparative Example 2).
  • the resin composition of the present invention can be used as an optical member such as a protective film, a planarizing film, an insulating film, an antireflection film, a refractive index control film, a microlens, an intralayer lens, an optical waveguide, and a film substrate. It is useful as a resin composition for forming.

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Polyethers (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

La présente invention concerne une composition de résine à partir de laquelle il est possible de constituer un film de résine pouvant subir un traitement EBR, présentant un indice de réfraction, une transparence, une résistance à la chaleur, une résistance à la lumière, une résistance à l'humidité et une résistance chimique élevés, ainsi qu'une vitesse de gravure à sec comparable à celle d'une réserve. La composition de résine contient (A) un polymère et (B) un solvant organique. Le composant (A) est un polymère comprenant un motif structural de formule (1). Le composant (B) est un solvant organique présentant un point de fusion de 15 °C ou moins et un point d'ébullition de 85 °C ou plus. (Dans la formule, chaque R1 représente indépendamment un groupe hydroxy, un groupe méthyle, un groupe éthyle, un groupe méthoxy ou un groupe éthoxy, a représente un nombre entier de 0 à 3 et n représente un nombre entier de 1 à 4. Cependant, a et n satisfont 1 ≤ a + n ≤ 4).
PCT/JP2023/000323 2022-02-22 2023-01-10 Composition de résine WO2023162489A1 (fr)

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CN202380022645.2A CN118742607A (zh) 2022-02-22 2023-01-10 树脂组合物

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52104550A (en) * 1976-02-28 1977-09-02 Bridgestone Corp Compositions for rapid adhesion
JPH08511050A (ja) * 1993-06-14 1996-11-19 アクゾ ノーベル ナムローゼ フェンノートシャップ 加硫ゴム組成物中のスルフィド樹脂
JP2011162602A (ja) * 2010-02-05 2011-08-25 Taoka Chem Co Ltd 新規サルファイド樹脂
JP2014084380A (ja) * 2012-10-22 2014-05-12 Sumitomo Rubber Ind Ltd インナーライナージョイントストリップ用ゴム組成物及び空気入りタイヤ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52104550A (en) * 1976-02-28 1977-09-02 Bridgestone Corp Compositions for rapid adhesion
JPH08511050A (ja) * 1993-06-14 1996-11-19 アクゾ ノーベル ナムローゼ フェンノートシャップ 加硫ゴム組成物中のスルフィド樹脂
JP2011162602A (ja) * 2010-02-05 2011-08-25 Taoka Chem Co Ltd 新規サルファイド樹脂
JP2014084380A (ja) * 2012-10-22 2014-05-12 Sumitomo Rubber Ind Ltd インナーライナージョイントストリップ用ゴム組成物及び空気入りタイヤ

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