WO2023159966A1 - 散热模块和散热器 - Google Patents

散热模块和散热器 Download PDF

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Publication number
WO2023159966A1
WO2023159966A1 PCT/CN2022/123884 CN2022123884W WO2023159966A1 WO 2023159966 A1 WO2023159966 A1 WO 2023159966A1 CN 2022123884 W CN2022123884 W CN 2022123884W WO 2023159966 A1 WO2023159966 A1 WO 2023159966A1
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WIPO (PCT)
Prior art keywords
heat dissipation
heat
partition
substrate
dissipation module
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PCT/CN2022/123884
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English (en)
French (fr)
Inventor
段凯文
聂志东
陈晓雪
刘欣
褚雯霄
谈周妥
李帅
Original Assignee
中兴通讯股份有限公司
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Publication of WO2023159966A1 publication Critical patent/WO2023159966A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the present application relates to the technical field of communications, in particular to a heat dissipation module and a heat sink.
  • heat sinks are mainly divided into two forms: ordinary heat sinks without pipelines and two-phase heat sinks with pipelines.
  • the gas-liquid flow channels inside the two-phase pipeline are mixed, the two-phase circulation efficiency is low, and the driving force of the two-phase circulation is low in the reverse gravity working state, often Self-circulation cannot be formed, and the size of the pipeline along the direction of gravity is large, and the liquid working medium is easily accumulated at the bottom due to gravity, which may easily cause the problem of dry burning of the top pipeline near the heat source due to lack of liquid.
  • Embodiments of the present application provide a heat dissipation module and a heat sink.
  • the embodiment of the present application provides a heat dissipation module, including: a heat dissipation fin body; at least two loop channels, the loop channels are arranged on the heat dissipation fin body, and at least two of the loop channels At least one connecting passage is arranged therebetween, and the connecting passage is used for communicating the refrigerant working fluid in the two circuit passages.
  • an embodiment of the present invention further provides a heat sink, including the heat dissipation module described in the first aspect.
  • Fig. 1 is a schematic diagram of a heat dissipation module provided by an embodiment of the present application
  • Fig. 2 is a schematic diagram of a heat dissipation module provided by another embodiment of the present application.
  • Fig. 3 is a schematic diagram of a heat dissipation module whose loop channel is a honeycomb pipeline provided by an embodiment of the present application;
  • FIG. 4 is a schematic diagram of a heat dissipation module whose loop channel is a quasi-loop heat pipe loop provided by an embodiment of the present application;
  • Fig. 5 is a schematic diagram of a cooling module whose loop channel is a quasi-pulsating heat pipe loop provided by an embodiment of the present application;
  • Fig. 6 is a schematic diagram of a heat dissipation module provided with a continuous and complete first passage provided by an embodiment of the present application;
  • Fig. 7 is a schematic diagram of a heat dissipation module provided with multiple discontinuous first passages in different positions provided by an embodiment of the present application;
  • Fig. 8 is a schematic diagram of a heat dissipation module provided with two connection paths provided by an embodiment of the present application
  • Fig. 9 is a schematic diagram of a heat dissipation module provided with two connection paths according to another embodiment of the present application.
  • Fig. 10 is a schematic diagram of a heat dissipation module provided with zonal gears according to an embodiment of the present application
  • Fig. 11 is a schematic diagram of a heat dissipation module provided with rounded partition gears provided by an embodiment of the present application;
  • Fig. 12 is a schematic diagram of a radiator provided by an embodiment of the present application with its heat dissipation module arranged in an inclined manner;
  • Fig. 13 is a schematic diagram of a radiator provided in another embodiment of the present application with its heat dissipation module arranged in an inclined manner;
  • Fig. 14 is a schematic diagram of a radiator provided by an embodiment of the present application in which the heat dissipation module is arranged in a vertical manner;
  • Fig. 15 is a schematic diagram of a radiator provided in another embodiment of the present application with its heat dissipation module arranged in a vertical manner;
  • Fig. 16 is a schematic diagram of a radiator provided by an embodiment of the present application in which the heat dissipation module is arranged in an inclined and vertical mixed manner;
  • Fig. 17 is a schematic diagram of the sealing area formed by the process of "plane pressure sealing + plane laser welding" in the heat dissipation module provided by an embodiment of the present application;
  • Fig. 18 is a schematic diagram of the sealing area formed by the process of "plane pressing + opening + cutting laser welding" in the heat dissipation module provided by an embodiment of the present application;
  • Fig. 19 is a schematic diagram of the sealing area formed by the "concave-convex sealing” process in the heat dissipation module provided by an embodiment of the present application;
  • Fig. 20 is a schematic diagram of a connection path and a sealing area formed by an inclined pipe shape in a heat dissipation module provided by an embodiment of the present application.
  • Fig. 21a is a schematic diagram of a heat dissipation module provided by an embodiment of the present application that directly distributes working fluid through connecting passages to realize one-time filling and one-time sealing of partitions.
  • Fig. 21b is a schematic diagram of another heat dissipation module provided by an embodiment of the present application in which the pipe diameter is set to directly distribute the working fluid through the connecting passage to realize one-time filling and one-time sealing of partitions.
  • the present application provides a heat dissipation module and a radiator, wherein the heat dissipation module includes a heat dissipation fin body and at least two loop channels arranged on the heat dissipation fin body, and at least one connecting passage is provided between the two loop channels, The connecting passage is used for communicating the refrigerant working fluid in the two circuit passages.
  • the heat dissipation module includes a heat dissipation fin body and at least two loop channels arranged on the heat dissipation fin body, and at least one connecting passage is provided between the two loop channels,
  • the connecting passage is used for communicating the refrigerant working fluid in the two circuit passages.
  • the liquid level of the liquid refrigerant in each circuit channel reaches a uniform height, reducing the problem of uneven distribution of refrigerant working fluid in each circuit channel caused by gas blockage and air pressure difference caused by the disconnection of the gas phase, and the working medium is distributed in each zone Pressing and sealing after uniformity can realize multiple independent partitions and shorten the circulation loop, thereby solving the problem of dry burning caused by insufficient liquid replenishment at the top.
  • FIG. 1 is a schematic diagram of a heat dissipation module provided by an embodiment of the present application.
  • the heat dissipation module 100 may include a heat dissipation fin body 110 and at least two return channels 121 arranged on the heat dissipation fin body 110, and a connecting passage is provided between the at least two return passages 121. 122, the connecting passage 122 is used to communicate with the refrigerant working medium in the two loop passages 121, that is, the structure in the upper half of FIG. .
  • FIG. 2 is a schematic diagram of a heat dissipation module provided by another embodiment of the present application.
  • the heat dissipation module 100 can be provided with two heat dissipation regions 120, and a seal is provided on the connecting passage 122 between the two heat dissipation regions 120.
  • Zone 123 two heat dissipation areas 120 are formed by the sealing area 123, including the first heat dissipation area 120 and the second heat dissipation area 120; the connection path 122 between the two heat dissipation areas 120 is used to communicate with the loop channel 121 in the two heat dissipation areas 120
  • the refrigerant working fluid inside makes the circuit channels 121 in the two heat dissipation areas 120 integrated; and the setting of the sealing area 123 is to make the original integrated circuit channels 121 separate and independent from each other in the subsequent process to form a corresponding heat dissipation area 120 .
  • the heat dissipation module 100 can also be provided with three heat dissipation regions 120, or can also be provided with four heat dissipation regions 120. This embodiment does not specifically limit the number of heat dissipation regions 120 on the heat dissipation module 100. Actual setting.
  • sealing area 123 can be set on the connection path 122 between two heat dissipation areas 120 according to actual design requirements, or can be set on the connection path between two loop channels 121 in the same heat dissipation area 120 122. This embodiment does not specifically limit it.
  • one heat dissipation area 120 may be provided with one or more loop channels 121 , and the number of loop channels 121 is not specifically limited in this embodiment.
  • connection between the two loop channels 121 in the same heat dissipation area 120 can be done through one connecting path 122, or can be connected through multiple connecting paths 122.
  • connection between the two loop channels 121 The number of interconnecting passages 122 is not limited.
  • the pipeline partition of the heat dissipation module 100 (that is, a heat dissipation area is provided).
  • the refrigerant working medium can be dynamically distributed in the integrated pipeline until it is dynamically balanced, and finally the liquid refrigerant liquid level in each circuit channel 121 in the same partition reaches a uniform height, reducing the occurrence of gas locks,
  • the difference in air pressure causes the problem of uneven distribution of the refrigerant working medium in each circuit channel 121, thereby solving the problem of dry burning.
  • the heat dissipation module 100 in this embodiment is a two-phase heat dissipation tooth of a two-phase pipeline, and the heat dissipation module 100 can also be a heat dissipation fin, a heat dissipation flat plate, or a heat dissipation tooth piece, and this implementation does not make specific details about it. limited.
  • the heat dissipation fin body 110 is the basic carrier of the two-phase circuit channel 121, and generally adopts a rectangular flat plate structure, and may also be a trapezoidal flat plate structure, which is not specifically limited in this embodiment.
  • the heat dissipation fin body 110 The materials used are usually metals, such as aluminum, copper, etc., which are not specifically limited in this embodiment.
  • each circuit passage 121 is arranged independently and at intervals, wherein the distance between every two circuit passages 121 is They may be the same or different, which is not specifically limited in this embodiment.
  • the pipeline forms of the loop channel 121 include but are not limited to the following forms: honeycomb pipeline (as shown in Figure 3), steepest line pipeline, inclined line pipeline (as shown in Figure 20), quasi-loop heat pipe circuit ( As shown in Figure 4), pseudo-pulsation heat pipe circuit (as shown in Figure 5).
  • the pipeline can A gas-liquid staggered interval and multi-stage pulse flow with directional circulation is formed to transfer heat from the side near the heat source of the tooth root of the two-phase gear to the side far from the heat source at the top of the tooth for efficient heat dissipation.
  • the connecting passage 122 is a longitudinal pipeline arranged along the tooth length direction, and its form may be a honeycomb pipeline (as shown in Figure 3), or may be a vertical straight pipe (as shown in Figure 6), or may be a vertical
  • this embodiment does not limit the location, quantity and scope of the arrangement of the connecting passages 122: the main purpose of the connecting passages 122 is to communicate with the independent loop passages 121; as shown in Figure 6 A continuous and complete connection path 122 connects the loop passages 121 in all partitions at the same time; it is also possible to connect the loop passages 121 in each partition sequentially by a plurality of different positions and discontinuous connection passages 122 as shown in Figure 7; 7 shows that the number of circuit passages 121 connected by one of the connecting passages 122 can be at least three (belonging to the long connection), and the number of the circuit passages 121 connected by the other connecting passage 122 can be two (belonging to the short connection), That is, the arrangement range of the connecting passage 122 is not limited.
  • the connecting passage 122 can be a passage without the sealing area 123, and it can be arranged in the same heat dissipation area for communicating with the liquid refrigerant 410 in the loop channel 121 in the same heat dissipation area.
  • the connecting passage 122 can also be The channel provided with the sealing area 123 is arranged between two different heat dissipation areas, and is used to communicate with the liquid refrigerant 410 in the loop channel 121 in different heat dissipation areas.
  • the number of connecting passages 122 used for communication between adjacent partitioned return passages 121 may be two, so that the pipeline has the characteristics of a communicator.
  • the connecting passage 122 is a longitudinal pipeline arranged along the tooth length direction, and its form may be a honeycomb pipeline, or may be a vertical straight pipe, or may be a vertical curved pipeline, or may be a vertical
  • the unit array pipeline is not specifically limited in this embodiment. It should be noted that, this embodiment does not limit the location, quantity and range of the connecting passages 122 .
  • Two connecting passages 122 are also provided between the first heat dissipation area and the second heat dissipation area, one of which is used to connect the loop channel 121 of the first heat dissipation area and the second heat dissipation area.
  • the gaseous refrigerant in the circuit passage 121 of the region, and another connecting passage 122 is used to communicate the circuit passage 121 of the first heat dissipation region with the liquid refrigerant in the circuit passage 121 of the second heat dissipation region.
  • Refrigerant working medium Refrigerant working medium.
  • At least one connecting passage 122 may be provided to be higher than the liquid level of the refrigerant when the cooling module 100 is placed horizontally, and at least another connecting passage 122 may be provided to be submerged below the liquid level of the refrigerant when the cooling module 100 is placed horizontally
  • the refrigerant in the circuit channel 121 can be evenly distributed in the circuit channel 121 of each partition, so that the circuit channel 121 of each partition has a better two-phase Heat dissipation circulation, and there will be no dry burning due to too little working medium or insufficient condensation space due to too much working medium.
  • a liquid-filled part 124 for filling all the circuit passages 121 with the liquid refrigerant 410 can be provided on the fin body, and the liquid-filled part 124 can All the connected circuit channels 121 are charged with refrigerant once.
  • the liquid filling port of the liquid filling part 124 can be pressed and sealed by means of pressure sealing or laser welding, so that the circuit passage 121 and the connecting passage 122 are integrated
  • the type pipeline forms a closed two-phase heat dissipation space, and the refrigerant working medium is stored in the closed two-phase heat dissipation space for heat dissipation circulation.
  • connection path 122 is first compressed and sealed at the sealing position, and then welded and sealed by planar laser welding.
  • FIG. 18 after inflation, filling, and flat sealing are completed, cutting is performed, and a rectangular opening is cut at the sealed sealing area 123 , and then laser welding is performed from the cut surface.
  • Figure 19 first carry out flat pressure sealing at the sealing, and then press from both sides in the direction perpendicular to the plate surface to form double-sided bending, so that the boundary section forms a concave-convex seal.
  • the heat dissipation module 100 is provided with a connecting passage 122 and a second passage 810 , and the whole heat dissipation module 100 is placed vertically along the direction of gravity, while the long teeth of the heat dissipation module 100 are placed along the horizontal direction.
  • the static cooling method for the heat dissipation module 100 may include but not limited to the cooling method of spraying or water bath.
  • the heat dissipation plate is placed in a low temperature environment for a period of time, so that most of the two-phase working fluid in the circuit channel 121 is at a low temperature. It exists in liquid phase and accumulates at the bottom of the circuit channel 121 under the influence of gravity; or without cooling means, the heat dissipation module 100 is directly placed at room temperature in the operating environment, and the working medium inside the circuit channel 121 is in the form of gas-liquid mixture, which is affected by gravity and Due to the influence of pipeline connection, the liquid refrigerant 410 is evenly distributed in the circuit channels 121 of each partition.
  • the liquid refrigerant 410 in each circuit passage 121 can communicate with each other; when the upper second passage 810 is set higher than the refrigerant liquid level At this time, due to the connectivity of the second passage 810, the gaseous refrigerant working fluid in each circuit channel 121 can be connected to each other; based on the principle of the connector, the gas-liquid phase working fluid can be connected to each other, and under the influence of gravity, the refrigerant working fluid can be integrated into one In the end, the liquid level of the refrigerant in each circuit channel 121 reaches a uniform level, and there will be no gas block and air pressure difference caused by the disconnection of the gas phase, which will cause the refrigerant working medium in each circuit channel 121 The problem of uneven distribution.
  • the second passage 810 between the circuit passages 121 of adjacent partitions is provided with a sealing area 123.
  • the pipelines at each sealing area 123 of the second passage 810 are sealed by pressure sealing or laser welding. Pressing and sealing, thereby cutting off the communication effect of the second passage 810, so that the circuit passages 121 of each partition form mutually independent closed two-phase heat dissipation spaces.
  • only part of the sealing area 123 is pressed and sealed, so that the adjacent partition circuit channels 121 corresponding to the non-pressed and sealed sealing area 123 remain connected, so that the pipeline design, partition design, and heat consumption can be flexibly implemented. Distribution design.
  • the multi-partition circuit channel 121 is composed of multiple independent circuit channels 121 arranged at intervals.
  • the working state of each circuit channel 121 is similar to the gravity heat pipe structure. The liquid working medium near the heat source boils and vaporizes, and the gaseous working medium on the far heat source side releases heat.
  • Condensation thereby forming an independent high-efficiency cycle, which is conducive to improving the overall two-phase cycle efficiency and temperature uniformity of the gear, especially helping to improve the problem of dry burning due to lack of liquid at the top of the two-phase gear near the heat source side under the straight tooth structure.
  • the one-time filling improves the process efficiency in the batch production process of the two-phase gear, thereby reducing the batch production cost.
  • each loop channel 121 match the heat dissipation distribution of the radiator, so that the radiator has better heat dissipation performance under the partitioned two-phase circulation heat dissipation.
  • the middle and lower parts of the zoning circuit channel 121 are matched with the heat dissipation bottleneck devices, and the middle and upper positions of the zoning circuit channel 121 are matched with the devices with a large heat dissipation margin, so that the two-phase working fluid can be used
  • the heat migration achieves the efficient heat dissipation state where the bottleneck is dissipated and the heat dissipation margin is efficiently utilized.
  • liquid filling port liquid filling part 124
  • hydrophilic treatment after low temperature baking, The liquid chemical agent inside the pipeline is removed, and at the same time, a rough porous inner surface is formed in the inner cavity of the pipeline.
  • the multi-gasification core on the hydrophilic surface can enhance boiling heat transfer, and more efficiently carry heat closer to the heat source side.
  • a liquid-absorbing core 420 can be set in the loop channel 121, such as the loop channel in Figure 4 A liquid-absorbing core 420 is added in the lower channel of 121, which is similar to the scheme design of a loop heat pipe.
  • the liquid-absorbing core 420 has a capillary porous medium structure, and its formation methods include but are not limited to capillary sintering, plug-shaped capillary cores, and the like.
  • the liquid-absorbing core 420 can enhance the resistance of the lower passages in each circuit passage 121 to the gas flow, so that the bubbles generated by boiling will not enter the condensation end from the lower passages, but escape from the upper passages; on the other hand, the capillary The capillary force generated by the wick can simultaneously increase the liquid return rate, so that the condensate can be replenished to the side channel more quickly.
  • a directional circulation of gas-liquid separation is formed in the loop channel 121, the gaseous working medium is transported from the upper side pipeline to the condensing end, and the liquid working medium is returned from the condensing end to the lower side pipeline.
  • the heat dissipation plate is cut from the top of the tooth along the direction of the tooth root with the boundary of the sealing area 123 and the heat dissipation area 120 as the tooth-shaped partition boundary to form multi-section partition tooth pieces.
  • the partitioned gears (two adjacent heat dissipation regions 120 are at least partially separated) and the plane of the substrate form an inclined angle, which can effectively increase the introduction of the airflow at the bottom of the gears, and at the same time destroy the rising
  • the temperature boundary layer of the airflow improves the convective heat transfer efficiency of the surface of the upper partition tooth piece, thereby improving the overall heat dissipation performance of the heat dissipation plate; at the same time, to a certain extent, the arrangement of adjacent partition tooth pieces staggered left and right can In the state of side-by-side arrangement, the radiation angle of the gear set as a whole relative to the external environment is improved, and the radiation heat transfer is improved.
  • this radiator structure can reduce the temperature by 0.5-1.7°C compared with the ordinary radiator structure.
  • rounding treatment is performed on the tip area of the tooth top side of the sub-area gear, as shown in Figure 11.
  • the tip position is far away from the heat source and the heat dissipation performance is limited.
  • the rounding treatment can increase the amount of airflow introduced. Improve the speed of airflow between the fins, so as to achieve the purpose of improving performance.
  • FIG. 12 is a schematic diagram of a heat sink provided by an embodiment of the present application.
  • the heat sink includes a heat dissipation substrate 200 and the heat dissipation module 100 in the above embodiment, and the heat dissipation module 100 is arranged on the heat dissipation substrate 200 in a partitioned manner.
  • the heat dissipation module 100 can be arranged vertically to the heat dissipation substrate 200 or inclined to the heat dissipation substrate 200 , which is not specifically limited in this embodiment.
  • the heat dissipation fin bodies are arranged on the heat dissipation substrate 200 in the same inclination manner and inclination angle, or in different inclination manners and different inclination angles.
  • the inclination angle is set on the heat dissipation substrate 200, which is not specifically limited in this embodiment.
  • the ways in which the heat dissipation module 100 is obliquely arranged on the heat dissipation substrate 200 can be varied, which is not specifically limited in this embodiment.
  • It forms an inclined angle with the imaginary line of the tooth length direction of the heat dissipation substrate 200, and the heat dissipation fin body is arranged perpendicular to the heat dissipation substrate 200 and is adjacent to the two adjacent imaginary lines of the tooth length direction.
  • the inclination direction of the heat dissipation fin body is opposite, that is, the heat dissipation module 100 is perpendicular to the plane of the heat dissipation substrate 200, and forms an angle of inclination with the tooth length direction;
  • the heat dissipation substrate 200 is set, and the inclination directions of the two adjacent heat dissipation fin bodies relative to the vertical surface of the substrate are opposite, and the vertical surface of the substrate is based on the virtual line in the tooth length direction and perpendicular to the heat dissipation substrate.
  • the surface, that is, the heat dissipation module 100 is parallel to the tooth length direction, and forms an inclined angle with the plane of the heat dissipation substrate 200 .
  • the inclination direction of adjacent heat dissipation modules 100 in the same heat dissipation module 100 of the virtual line of the tooth length direction is opposite to form a staggered direction; the inclination of the corresponding partition teeth of the same group of heat dissipation modules 100
  • the directions are the same to form equidistant parallel flow passages to regulate the flow resistance of the radiator; the range of inclination angles can be: 0° ⁇ 90°.
  • the ways in which the heat dissipation module 100 is vertically arranged on the heat dissipation substrate 200 can be varied, and this embodiment does not specifically limit it, for example: the heat dissipation module 100 of at least one partition is perpendicular to the heat dissipation substrate 200, and the heat dissipation module 100 is arranged parallel to the virtual line in the tooth length direction of the heat dissipation substrate 200; The two sides of the virtual line in the tooth length direction are set alternately.
  • the two adjacent partitions are respectively the first partition and the second partition.
  • the flow channel area of the heat dissipation module 100 in the second partition that is, the tooth length of some heat dissipation modules 100 is extended, and extends into the flow channel area of the adjacent heat dissipation module 100 in a staggered manner, thereby forming a local encrypted tooth state, which is conducive to increasing the local heat dissipation area, thereby strengthening the local heat dissipation capability; or, the heat dissipation module 100 in the first partition and the heat dissipation module 100 in the second partition are arranged in a manner without flow channels, that is, the teeth of part of the heat dissipation module 100 The length is shortened, thereby forming a local state of no flow channel, so the heat dissipation area of the heat dissipation substrate 200 is divided.
  • the heat dissipation module 100 vertically arranged on the heat dissipation substrate 200 and the heat dissipation module 100 obliquely arranged on the heat dissipation substrate 200 may be included.
  • the number and arrangement of the heat dissipation modules 100 disposed on the heat dissipation substrate 200 and the heat dissipation modules 100 obliquely disposed on the heat dissipation substrate 200 are not specifically limited, and can be arranged according to actual needs.
  • the arrangement structure of the heat dissipation modules on the radiator may also be a V-tooth structure, which is not specifically limited in this example.
  • the connecting passage 122 can be formed by the shape of the pipeline itself, and in the sealing area 120 of the connecting passage 122 connecting the two heat dissipation areas 120, a branch pipeline is set to avoid the position of the sealing area 123 Required gland headroom while piping design and coverage areas are not affected.
  • the distribution of the working fluid can be realized during filling through the pipeline design, so that one filling and one welding can form partitions.
  • the two heat dissipation areas 120 of the liquid filling port are directly connected through the communication pipeline 122, and the working fluid can be directly distributed into the two heat dissipation areas during filling.
  • the sealing area 123 is set on the top of the cooling plate to block the two connecting passages 122 and achieve partitioning. The sealing process can maintain the normal non-partitioned cooling plate welding method, and there is no new process flow and additional procedures introduced. Partitioning can be realized without increasing costs .
  • the distribution of the working fluid into the two heat dissipation areas can balance the flow resistance by adjusting the pipe diameter of the connecting passage 122, so as to achieve the purpose of freely distributing the working fluid.
  • Fig. 21a and Fig. 21b there are two schemes for adjusting the diameter of the channel and distributing the working fluid to achieve partitioning.
  • the heat dissipation module includes a heat dissipation fin body and at least two loop passages arranged on the heat dissipation fin body, and at least one connecting passage is provided between the two loop passages, The connecting passage is used for communicating the refrigerant working fluid in the two circuit passages.
  • the liquid level of the liquid refrigerant in each circuit channel reaches a uniform height, reducing the problem of uneven distribution of refrigerant working fluid in each circuit channel caused by gas blockage and air pressure difference caused by the disconnection of the gas phase, and the working medium is distributed in each zone Pressing and sealing after uniformity can realize multiple independent partitions and shorten the circulation loop, thereby solving the problem of dry burning caused by insufficient liquid replenishment at the top.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
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  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
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Abstract

本申请公开了一种散热模块和散热器。该散热模块(100)包括散热齿片体(110)和设置在散热齿片体(110)上的至少两个回路通道(121)，在至少两个回路通道(121)之间设置有至少一个连接通路(122)，连接通路(122)用于连通两个回路通道(121)中的冷媒工质。

Description

散热模块和散热器
相关申请的交叉引用
本申请基于申请号为202210180381.0、申请日为2022年02月25日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
技术领域
本申请涉及通信技术领域，尤其是一种散热模块和散热器。
背景技术
随着电力电子技术的高速发展，电子设备向大容量、大功率、高集成、轻量化方向发展，因此会导致电子设备的热耗密度越来越大，此时对于电子设备环境适应性需求越来越高，电子设备的高可靠性散热问题已经逐渐成为遏制各相关行业发展的瓶颈。在工业应用中，散热齿主要分为无管路的普通散热齿和带管路的两相散热齿两种形态。针对两相散热齿，在工业运用过程中主要存在以下问题：两相管路内部气液流动通道混杂，两相循环效率较低，在逆重力工作状态下，两相循环驱动力较低，经常无法形成自循环，而且管路沿重力方向尺寸较大，液态工质受重力易聚积于底部，容易导致近热源侧顶部管路因缺液出现干烧的问题。
发明内容
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
本申请实施例提供了一种散热模块和散热器。
第一方面，本申请实施例提供了一种散热模块，包括：散热齿片体；至少两个回路通道，所述回路通道设置在所述散热齿片体上，在至少两个所述回路通道之间设置有至少一个连接通路，所述连接通路用于连通所述两个回路通道中的冷媒工质。
第二方面，本发明实施例还提供了一种散热器，包括第一方面所述的散热模块。
本申请的其它特征和优点将在随后的说明书中阐述，并且，部分地从说明书中变得显而易见，或者通过实施本申请而了解。本申请的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。
附图说明
附图用来提供对本申请技术方案的理解，并且构成说明书的一部分，与本申请的实施例一起用于解释本申请的技术方案，并不构成对本申请技术方案的限制。
图1是本申请一个实施例提供的散热模块的示意图；
图2是本申请另一个实施例提供的散热模块的示意图；
图3是本申请一个实施例提供的其回路通道为蜂窝管路的散热模块的示意图；
图4是本申请一个实施例提供的其回路通道为拟环路热管回路的散热模块的示意图；
图5是本申请一个实施例提供的其回路通道为拟脉动热管回路的散热模块的示意图；
图6是本申请一个实施例提供的设置有连续完整第一通路的散热模块的示意图；
图7是本申请一个实施例提供的设置有多个不同位置、不连续的第一通路的散热模块的示意图；
图8是本申请一个实施例提供的设置有两个连接通路的散热模块的示意图；
图9是本申请另一个实施例提供的设置有两个连接通路的散热模块的示意图；
图10是本申请一个实施例提供的设置有分区齿片的散热模块的示意图；
图11是本申请一个实施例提供的设置有圆角分区齿片的散热模块的示意图；
图12是本申请一个实施例提供的其散热模块以倾斜方式设置的散热器的示意图；
图13是本申请另一个实施例提供的其散热模块以倾斜方式设置的散热器的示意图；
图14是本申请一个实施例提供的其散热模块以垂直方式设置的散热器的示意图；
图15是本申请另一个实施例提供的其散热模块以垂直方式设置的散热器的示意图；
图16是本申请一个实施例提供的其散热模块以倾斜和垂直混合方式设置的散热器的示意图；
图17是本申请一个实施例提供的散热模块中的通过“平面压封+平面激光焊”工艺形成的封口区的示意图；
图18是本申请一个实施例提供的散热模块中的通过“平面压封+开孔+切面激光焊”工艺形成的封口区的示意图；
图19是本申请一个实施例提供的散热模块中的通过“凹凸压封”工艺形成的封口区的示意图；
图20是本申请一个实施例提供的散热模块中的通过倾斜管道形状形成的连接通路和封口区的示意图。
图21a是本申请一个实施例提供的通过连接通路直接分配工质实现一次充注、一次封口分区的散热模块的示意图。
图21b是本申请一个实施例提供的另一种管径设置通过连接通路直接分配工质实现一次充注、一次封口分区的散热模块的示意图。
具体实施方式
为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本申请进行详细说明。应当理解，此处所描述的实施例仅用以解释本申请，并不用于限定本申请。
需要说明的是，虽然在流程图中示出了逻辑顺序，但是在某些情况下，可以以不同于流程图中的顺序执行所示出或描述的步骤。说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。
本申请提供了一种散热模块和散热器，其中，散热模块包括散热齿片体和设置在散热齿片体上的至少两个回路通道，在两个回路通道之间设置有至少一个连接通路，连接通路用于连通两个回路通道中的冷媒工质。在本实施例技术方案中，通过一体式回路通道设计，由于第一通路的连通性，液态冷媒相互连通，在受到重力的影响下，液态冷媒能够在一体式回路通道内部动态分配直至动态平衡，最终各回路通道内的液态冷媒液位高度达到统一，减少出现由于气相的不连通导致气塞、气压差而造成冷媒工质在各回路通道内的分配不均匀的问题，工质在各分区分配均匀后进行压封可实现多个独立分区，循环回路缩短，从而解决顶部补液不足产生的干烧问题。
下面结合附图，对本申请实施例作阐述。
如图1所示，图1是本申请一个实施例提供的散热模块的示意图。
在一实施例中，散热模块100可以包括散热齿片体110和设置在所述散热齿片体110上的至少两个回路通道121，在至少两个所述回路通道121之间设置有连接通路122，所述连接 通路122用于连通所述两个回路通道121中的冷媒工质，即图1中上半部分的结构，散热模块100的两个散热区域120之间没有通过连接通路122连接。
如图2所示，图2是本申请另一个实施例提供的散热模块的示意图，散热模块100可以设置有两个散热区域120，通过在两个散热区域120之间的连接通路122上设置封口区123，通过封口区123形成两个散热区域120包括第一散热区域120和第二散热区域120；两个散热区域120之间的连接通路122用于连通两个散热区域120中的回路通道121内的冷媒工质，使两个散热区域120中的回路通道121形成一体；而封口区123的设置则是为了在后续工艺中，使原先一体式的回路通道121相互分隔独立，以形成对应的散热区域120。可以理解的是，散热模块100还可以设置三个散热区域120，或者还可以设置四个散热区域120，本实施例对于散热模块100的上的散热区域120的设置的数量不作具体限定，可以根据实际情况设置。
需要说明的是，封口区123可以根据实际设计需要，设置在两个散热区域120之间的连接通路122上，也可以设置在同一个散热区域120中的两个回路通道121之间的连接通路122，本实施例对其不作具体限定。
需要说明的是，一个散热区域120可以设置有一个或者多个回路通道121，本实施例回路通道121的数量不作具体限定。
需要说明的是，对于同一个散热区域120中的两个回路通道121之间可以通过一个连接通路122进行连接，或者可以通过多个连接通路122进行连接，本实施例对两个回路通道121之间连接的连接通路122的数量不作限定。
在本申请实施例的技术方案中，通过一体式分区回路通道121设计，实现散热模块100的管路分区(即设置有散热区域)，由于连接通路122的连通性，冷媒工质相互连通，受重力影响下，冷媒工质可在一体式管路内部动态分配直至动态平衡，最终同一分区中的各回路通道121内的液态冷媒液位高度达到统一，减少出现由于气相的不连通导致气塞、气压差而造成冷媒工质在各回路通道121内的分配不均匀的问题，从而解决干烧的问题。
需要说明的是，本实施例中的散热模块100为两相管路的两相散热齿，散热模块100也可以是散热片，可以是散热平板，可以是散热齿片，本实施对其不作具体限定。
需要说明的是，散热齿片体110是两相回路通道121的基本载体，通常采用矩形平板式结构，也可以是梯形平板式结构，本实施例对其不作具体限定，散热齿片体110所使用的材料通常为金属，例如铝、铜等，本实施例对其也不作具体限定。
需要说明的是，散热齿片体110内部沿齿长方向设置的多个分区的回路通道121，各个回路通道121之间相互独立、间隔布置，其中，每两个回路通道121之间的间隔距离可以是相同，也可以是不同，本实施例对其不作具体限定。
需要说明的是，回路通道121的管路形式包括且不限于如下形式：蜂窝管路(如图3)、最速降线管路、倾斜线管路(如图20)、拟环路热管回路(如图4)、拟脉动热管回路(如图5)。
需要说明的是，当回路通道121采用如图5的拟脉动热管式回路结构时，得益于脉动热管的自身特性，在管路自身毛细力及加热侧热驱动力作用下，管路中可形成气液交错间隔且定向循环的多段脉冲流，将热量自两相齿片的齿根近热源侧带到齿顶远热源侧进行高效散热。
在一实施例中，连接通路122为沿齿长方向布置的纵向管路，其形式可以为蜂窝管路(如 图3)，或者可以为竖向直管(如图6)，或者可以为竖向直管曲线管路，又或者可以为竖向单元阵列管路，本实施例对其不作具体限定。需要说明的是，本实施例对于连接通路122所布置的位置、数量及范围是不做限制的：连接通路122的主要目的是将相互间隔独立的回路通道121进行连通；可以如图6所示由一条连续完整的连接通路122将所有分区中回路通道121同时连通；也可以如图7所示由多个不同位置、不连续的连接通路122将各分区回路通道121依次连通；也可以如图7所示其中一个连接通路122所连通的回路通道121的数目可为至少三个(属于长连通)，另一个连接通路122所连通的回路通道121的数目可为两个(属于短连通)，即连接通路122的布置范围不做限制。
可以理解的是，连接通路122可以为不设置有封口区123的通路，设置在同一个散热区域中，用于连通同一个散热区域中的回路通道121中的液态冷媒410，连接通路122也可以为设置有封口区123的通路，设置在两个不同的散热区域之间，用于连通不同散热区域中的回路通道121中的液态冷媒410。
在一些实施例中，如图8所示相邻的分区的回路通道121之间用于连通的连接通路122的数量可以是两个，以使管路具有连通器特性。需要说明的是，连接通路122为沿齿长方向布置的纵向管路，其形式可以为蜂窝管路，或者可以为竖向直管，或者可以为竖向曲线管路，又或者可以为竖向单元阵列管路，本实施例对其不作具体限定。需要说明的是，本实施例对于连接通路122所布置的位置、数量及范围是不做限制的。所述第一散热区域和所述第二散热区域之间还设置有两个连接通路122，其中一个连接通路122用于连通所述第一散热区域的所述回路通道121和所述第二散热区域的所述回路通道121中的气态冷媒工质，另一个连接通路122用于连通所述第一散热区域的所述回路通道121和所述第二散热区域的所述回路通道121中的液态冷媒工质。
在一实施例中，可以设置至少一个连接通路122，在散热模块100水平放置时高于冷媒液位，且可以设置至少另一个连接通路122，在散热模块100水平放置时浸没于冷媒液位以下时，可使两相散热模块100处于横向静置时，回路通道121中的冷媒工质能够在各分区的回路通道121中均匀分配，以使各分区的回路通道121均有较好的两相散热循环，且不会因为工质过少而发生干烧或工质过多而发生冷凝空间不足。
在一实施例中，在一体式管路结构基础上，可在散热齿片体上设置用于对所有所述回路通道121填充所述液态冷媒410的充液部件124，通过充液部件124对连通的所有回路通道121进行一次性冷媒充注。通过充液部件124对所有回路通道121进行冷媒充注后，可以采取压封或者激光焊等方式对充液部件124的充液口进行压合密封，以使回路通道121与连接通路122形成一体式管路构成封闭两相散热空间，冷媒工质储存于该封闭两相散热空间内进行散热循环。
对连接通路122封口区进行分区隔离时，可采用平面激光焊、切面激光焊、平面压封或弯曲凹凸型压封的方式。如图17所示，在封口处将连接通路122先进行压封，再通过平面激光焊进行焊封。或如图18所示，吹胀、充注、平面压封完成后进行裁切，在已压封的封口区123处切矩形口，再从切口面进行激光焊。或如图19所示，在封口处先进行平面压封，再通过垂直板面方向分别从双面压至超过板厚距离形成双面弯曲，从而使分界段形成凹凸式封口。
如图9所示，散热模块100设置有连接通路122和第二通路810，该散热模块100整体沿重力方向竖直放置，同时散热模块100的齿长边沿水平方向放置。
对散热模块100的静置冷却方式可以包括但不限于喷淋或者水浴的冷却方式，将散热平板处于低温环境静置一段时间，使其回路通道121内的绝大部分两相工质在低温下以液相存在，并受重力影响聚积于回路通道121底部；或不采用降温手段，将散热模块100在操作环境室温下直接静置，回路通道121内部工质呈气液混合形态，受重力及管路连通影响，液态冷媒410在各分区的回路通道121中平均分配。
当下部的连接通路122浸没于冷媒液位以下时，由于连接通路122的连通性，可使各个回路通道121内的液态冷媒410相互连通；当上部的第二通路810高于冷媒液位进行设置时，由于第二通路810的连通性，可使各个回路通道121内的气态冷媒工质相互连通；基于连通器原理，气液相工质相互连通，受重力影响下，冷媒工质可在一体式管路内部动态分配直至动态平衡，最终各个回路通道121内的冷媒液位高度达到统一，不会出现由于气相的不连通导致气塞、气压差而造成冷媒工质在各回路通道121内的分配不均匀的问题。
相邻分区的回路通道121之间的第二通路810处设置有封口区123，在冷媒充注后，通过压封或者激光焊等方式对第二通路810的各封口区123处的管路进行压合密封，从而截断第二通路810的连通效应，使各个分区的回路通道121形成相互独立的封闭两相散热空间。
在一些实施例中仅对部分封口区123进行压合密封，以使未压合密封的封口区123对应的相邻分区回路通道121依然保持连通，从而灵活进行管路设计、分区设计、热耗分布设计。
通过上述针对两相散热齿形态的散热平板的结构特征及工艺方式，可以达到一次性充注、多分区回路的目的。多分区回路通道121由相互独立的多个间隔布置的回路通道121组成，各回路通道121的工作状态类似重力热管结构，近热源一侧液态工质沸腾汽化，远热源一侧气态工质放热冷凝，由此形成独立的高效循环，有利于提升齿片整体的两相循环效率及均温性，尤其有助于改善直齿架构下两相齿片顶部近热源侧缺液干烧的问题，而且一次性充注提升两相齿片批量生产过程中的工艺效率，从而降低批量生产成本。
需要说明的是，各回路通道121布置范围及封口设计在一些实施例中匹配散热器热耗分布，以使散热器在分区两相循环散热下具有更好的散热性能。比如，通过合理的分区及管路设计，将分区回路通道121中下部位置与散热瓶颈器件相匹配，将分区回路通道121中上部位置与散热余量较大器件相匹配，从而利用两相工质的热量迁移达到瓶颈解热、散热余量高效利用的高效散热状态。
而在冷媒充注前，可通过充液口(充液部件124)注入化学药剂对一体式管路(连接在一起的回路通道121)内腔进行腐蚀，即亲水处理；经低温烘烤，除去管路内部的液态化学药剂，并同时在管路内腔形成粗糙多孔内表面，利用该亲水表面的多气化核心可强化沸腾换热，更高效地带走近热源侧热量。
在一些实施例中，基于各回路通道121内的独立循环，为保证沸腾产生的气泡不会由下侧通道进入冷凝端，可在回路通道121设置吸液芯420，例如在图4中回路通道121的下侧通道内增加吸液芯420，类似环路热管的方案设计。吸液芯420为毛细多孔介质结构，形成方式包括且不限于毛细烧结、塞柱状毛细芯体等。吸液芯420一方面能够增强各回路通道121内的下侧通道对于气体流动的阻力，使沸腾产生的气泡不会由下侧通道进入冷凝端，而从上侧通道逃逸；另一方面，毛细芯产生的毛细力可同步提升液体回流速率，使冷凝液更快地向下侧通道补充。通过在回路通道121中设置毛细芯，使回路通道121内形成了气液分离的定向循环，气态工质从上侧管路输运至冷凝端，液态工质从冷凝端向下侧管路回液补充，进而 为热源侧提供循环往复的冷源。由于回路通道121内形成了气液分离的定向循环，管路内部的工质输运效率及两相循环效率显著提升，两相齿片整体的散热效率持续增强。
需要说明的是，压合密封后，以封口区123及散热区域120边界为齿形分区边界，从齿顶沿齿根方向将散热平板剪切以形成多段分区齿片。
需要说明的是，当散热模块100中的散热区域120的数量为多个，相邻的两个所述散热区域120至少部分分离，而且相邻的两个所述散热区域120所分离的部分交错设置。可以理解的是，对于同一散热平板的分区齿片自齿根至齿顶形成水平方向的张开角度，上下相邻的分区齿片间采用左右交错张开的布置方式，即匹配如图10所示的分区齿片与基板平面形成倾斜夹角设置方式。
通过如图10所示的分区齿片(相邻的两个所述散热区域120至少部分分离)与基板平面形成倾斜夹角的设置方式，可有效提升齿片底部气流的引入量，同时破坏上升气流的温度边界层，提升上方分区齿片的表面对流换热效率，进而使散热平板整体的散热性能得到提升；同时，在一定程度上，相邻分区齿片左右交错张开的布置方式，可提升并排排布状态下，齿片组整体相对外环境的辐射角，提升辐射换热量。经过实验分析，此散热器结构相比于普通散热器结构，可降温0.5-1.7℃。
需要说明的是，对分区齿片的齿顶侧尖端区域进行圆角处理，如图11所示，一般尖端位置因其距离热源较远，散热性能有限，通过圆角处理可增加气流引入量，提升气流在翅片间的运动速度，从而达到提升性能目的。
如图12所示，图12是本申请一个实施例提供的散热器的示意图。该散热器包括散热基板200和上述实施例中的散热模块100，所述散热模块100以分区的方式设置在所述散热基板200上。需要说明的是，散热模块100可以以垂直于散热基板200设置，也可以倾斜散热基板200设置，本实施例对其不作具体限定。
需要说明的是，对于同一分区的所有所述散热模块100的所述散热齿片体以相同的倾斜方式和倾斜角度设置在所述散热基板200上，也可以是不相同的倾斜方式和不相同的倾斜角度设置在所述散热基板200上，本实施对其不作具体限定。
在一实施例中，散热模块100倾斜设置在散热基板200的方式可以是多样的，本实施例对其不作具体限定，例如：参照图12，可以是至少两个分区的所述散热齿片体与所述散热基板200的齿长方向虚拟线形成倾斜夹角，所述散热齿片体垂直于所述散热基板200设置而且在同一个所述齿长方向虚拟线上相邻的两个所述散热齿片体的倾斜方向相反，即散热模块100即垂直散热基板200平面，且与齿长方向形成倾斜夹角；又例如：参照图13，至少两个分区的所述散热齿片体倾斜于所述散热基板200设置，相邻的两个所述散热齿片体相对于基板垂直面的倾斜方向相反，所述基板垂直面为基于所述齿长方向虚拟线并垂直于所述散热基板的面，即散热模块100平行齿长方向，且与散热基板200平面形成倾斜夹角。
需要说明的是，同一个所述齿长方向虚拟线的散热模块100中的相邻散热模块100的倾斜方向相反，以形成方向交错；同一组的散热模块100的相对应的分区齿片的倾斜方向相同，以形成等距平行流道调控散热器流阻；倾斜角度范围可以是：0°≤θ≤90°。
在一实施例中，散热模块100垂直设置在散热基板200的方式可以是多样的，本实施例对其不作具体限定，例如：至少一个所述分区的所述散热模块100垂直于所述散热基板200设置，并且所述散热模块100平行于所述散热基板200的齿长方向虚拟线设置；又例如：参 照图14，至少两个相邻分区的所述散热模块100在所述散热基板200的齿长方向虚拟线的两边交错设置。
需要说明的是，如图15所示，相邻两个分区分别为第一分区和第二分区，所述第一分区中的所述散热模块100中至少部分散热齿片体伸入设置在所述第二分区中所述散热模块100的流道区域，即部分散热模块100齿长延长，并通过交错方式伸入相邻散热模块100流道区域，从而形成局部加密齿状态，有利于增加局部散热面积，从而加强局部散热能力；或者，所述第一分区中的所述散热模块100和所述第二分区中所述散热模块100以无流道的方式设置，即部分散热模块100的齿长缩短，从而形成局部无流道状态，因而对散热基板200散热进行了散热区域划分。
需要说明的是，如图16所示，在同一个散热器中，可以包括垂直设置在散热基板200的散热模块100和倾斜设置在散热基板200的散热模块100，在本实施例中，对于垂直设置在散热基板200的散热模块100和倾斜设置在散热基板200的散热模块100的数量、排列方式不作具体限定，可以根据实际需要设置。
需要说明的是，散热器上的散热模块的排列结构除了上述实施例的结构以外，还可以是V齿架构，本实例对其不作具体限定。
在一实施例中，如图20所示，可通过管路本身的形状形成连接通路122，在连接两个散热区域120的连接通路122的封口区120，设置分管路从而避开封口区123位置所需的压封预留空间，同时管路设计及覆盖区域不受影响。
在一实施例中，可通过管路设计在充注时实现工质分配从而一次充注、一次焊接形成分区。如图21a和图21b所示，充液口两个散热区域120均通过连通管路122直接连通，工质可在充注时直接分配进入两散热区域。封口区123设置在散热板顶部同时封堵两条连接通路122并实现分区，封口工艺可保持正常无分区散热板焊接方式，无新工艺流程及额外工序引入，可在不增加成本的同时实现分区。
需要说明的是，工质进入两散热区域的分配可以通过调节连接通路122的管路直径来平衡流阻，从而达到自由分配工质量的目的。如图21a和图21b所示，分别为调整通路管径分配工质实现分区的两种方案。
本申请实施例的一种散热模块和散热器，该散热模块包括散热齿片体和设置在散热齿片体上的至少两个回路通道，在两个回路通道之间设置有至少一个连接通路，连接通路用于连通两个回路通道中的冷媒工质。在本实施例技术方案中，通过一体式回路通道设计，由于第一通路的连通性，液态冷媒相互连通，在受到重力的影响下，液态冷媒能够在一体式回路通道内部动态分配直至动态平衡，最终各回路通道内的液态冷媒液位高度达到统一，减少出现由于气相的不连通导致气塞、气压差而造成冷媒工质在各回路通道内的分配不均匀的问题，工质在各分区分配均匀后进行压封可实现多个独立分区，循环回路缩短，从而解决顶部补液不足产生的干烧问题。
以上是对本申请的一些实施进行了说明，但本申请并不局限于上述实施方式，熟悉本领域的技术人员在不违背本申请精神的前提下还可作出种种的等同变形或替换，这些等同的变形或替换均包含在本申请权利要求所限定的范围内。

Claims (16)

  1. 一种散热模块，包括：
    散热齿片体；
    至少两个回路通道，所述回路通道设置在所述散热齿片体上，在至少两个所述回路通道之间设置有至少一个连接通路，所述连接通路用于连通所述两个回路通道中的冷媒工质。
  2. 根据权利要求1所述的散热模块，其中，相邻的两个所述回路通道之间设置有至少一个连接通路。
  3. 根据权利要求1所述的散热模块，其中，所述散热齿片体上设置有至少两个散热区域，所述散热区域设置有至少一个所述回路通道。
  4. 根据权利要求3所述的散热模块，其中，至少一个所述连接通路设置有封口区，所述封口区用于生成所述散热区域，所述散热区域包括至少一个所述回路通道。
  5. 根据权利要求3所述的散热模块，其中，所述散热区域沿齿长方向设置在所述散热齿片体上。
  6. 根据权利要求3所述的散热模块，其中，相邻的两个所述散热区域至少部分分离，而且相邻的两个所述散热区域所分离的部分交错设置。
  7. 根据权利要求1所述的散热模块，其中，所述回路通道设置有吸液芯。
  8. 根据权利要求1所述的散热模块，其中，充液部件的充液口与不同分区的连接通路直接连通并在充注过程直接将冷媒工质分配至各分区，并在顶部一次封堵实现分区。
  9. 一种散热器，包括所述权利要求1至8任意一项所述的散热模块。
  10. 根据权利要求9所述的散热器，其中，还包括散热基板，所述散热模块以分区的方式设置在所述散热基板上。
  11. 根据权利要求10所述的散热器，其中，所述散热模块中的所述散热齿片体倾斜设置在所述散热基板上。
  12. 根据权利要求11所述的散热器，其中，同一个分区的所有所述散热模块的所述散热齿片体以相同的倾斜方式和倾斜角度设置在所述散热基板上。
  13. 根据权利要求11所述的散热器，其中，至少两个分区的所述散热齿片体与所述散热基板的齿长方向虚拟线形成倾斜夹角，所述散热齿片体垂直于所述散热基板设置而且在同一个所述齿长方向虚拟线上相邻的两个所述散热齿片体的倾斜方向相反。
  14. 根据权利要求11所述的散热器，其中，至少两个分区的所述散热齿片体倾斜于所述散热基板设置，相邻的两个所述散热齿片体相对于基板垂直面的倾斜方向相反，所述基板垂直面为基于所述齿长方向虚拟线并垂直于所述散热基板的面。
  15. 根据权利要求10所述的散热器，其中，至少两个相邻分区的所述散热模块在所述散热基板的齿长方向虚拟线的两边交错设置。
  16. 根据权利要求15所述的散热器，其中，相邻两个分区分别为第一分区和第二分区；
    所述第一分区中的所述散热模块中至少部分散热齿片体伸入设置在所述第二分区中所述散热模块的流道区域；
    或者，所述第一分区中的所述散热模块和所述第二分区中所述散热模块以无流道的方式设置。
PCT/CN2022/123884 2022-02-25 2022-10-08 散热模块和散热器 WO2023159966A1 (zh)

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