WO2023134141A1 - 一种计算设备及其冷板 - Google Patents

一种计算设备及其冷板 Download PDF

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Publication number
WO2023134141A1
WO2023134141A1 PCT/CN2022/106924 CN2022106924W WO2023134141A1 WO 2023134141 A1 WO2023134141 A1 WO 2023134141A1 CN 2022106924 W CN2022106924 W CN 2022106924W WO 2023134141 A1 WO2023134141 A1 WO 2023134141A1
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WO
WIPO (PCT)
Prior art keywords
phase change
cold plate
cavity
heat
heat exchange
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Application number
PCT/CN2022/106924
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English (en)
French (fr)
Inventor
姚希栋
胡建全
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华为云计算技术有限公司
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Publication of WO2023134141A1 publication Critical patent/WO2023134141A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the embodiments of the present application relate to the field of computer hardware, and in particular to a computing device and a phase change enhanced cold plate thereof.
  • the cold plate is a key component for heat exchange between a liquid cooling system and a heat source, such as but not limited to a central processing unit (CPU) that can be used for heat dissipation of a computing device.
  • a heat source such as but not limited to a central processing unit (CPU) that can be used for heat dissipation of a computing device.
  • CPU central processing unit
  • the heat is conducted from the CPU to the heat exchange core substrate during the heat exchange process, and then heat exchange is performed with water through the heat exchange core fins on the heat exchange core substrate, and is cooled by liquid cooling.
  • the circulation takes the heat away.
  • the fins located around the substrate will basically not be able to participate in the above heat exchange process. That is to say, the fins of the heat exchange core cannot achieve their designed heat exchange capacity. Therefore, the size of the heat exchange core substrate of the existing cold plate is almost the same as the chip size, but directly affects the area where the fins of the heat exchange core can be arranged, and thus cannot obtain good heat dissipation capability.
  • Embodiments of the present application provide a computing device and its cold plate, and improve the heat dissipation capacity and heat dissipation efficiency of the cold plate through structural optimization, so as to support the configuration of different application scenarios of high-power heat-generating components.
  • the first aspect of the embodiment of the present application provides a cold plate, including a cover plate and a heat exchange core that enclose a cooling chamber, the cooling cavity has a cover plate with a liquid inlet and a liquid outlet, and the heat exchange core includes a base plate and multiple A cooling fin, the bottom surface of the substrate is used for heat exchange with the heat-generating component, the heat generated by the heating component is first transferred to the heat-exchanging core substrate, each cooling fin is located in the cooling cavity and arranged on the substrate at intervals, through the liquid
  • the cold cycle can take away the heat exchanged to the heat dissipation fins; in this scheme, a phase change cavity for accommodating the phase change working medium is provided on the body of the substrate, and the lower wall of the phase change cavity has a capillary structure, and the capillary structure It is arranged at least in the outer peripheral region of the lower wall surface.
  • phase-change working medium in the phase-change chamber is heated and vaporized, and the vaporization absorbs a large amount of latent heat of vaporization.
  • the high-temperature gas carrying heat fills the entire phase-change chamber, and quickly condenses in contact with the low-temperature upper wall, forming a liquid working medium that falls back to the phase change chamber.
  • the peripheral phase change working medium can be quickly sucked to the lower wall of the phase change chamber to reduce the amount of liquid volatilization area, to ensure the maximum heat transfer in this area.
  • the heat transfer performance of the outer periphery of the substrate body is improved through the configuration of the phase change side, which can make full use of the heat load capacity of the liquid cooling cycle and effectively improve the overall heat transfer capacity of the cold plate.
  • capillary structures can be arranged on the entire surface of the lower wall of the phase change cavity. In this way, the dynamic flow transfer of the liquid working medium in the area where the heating component is located and the entire surface can be formed, and the heat exchange efficiency can be further improved.
  • the phase change chamber is filled with a phase change working fluid and then evacuated to form a vacuum state that is favorable for phase change when heated.
  • the embodiment of the present application also provides a first implementation manner of the first aspect: the capillary structure is irregularly arranged.
  • the liquid working medium is always covered on the lower wall of the phase change chamber, that is, the phase change heating working surface, and the irregularly arranged capillary structure can form a richer surface on the lower wall.
  • the liquid phase-change working fluid can flow to any position in its web under the action of the capillary structure, so as to give full play to the heat exchange capacity of the reduced area of the liquid phase-change working medium and improve the vaporization efficiency of the phase-change working medium.
  • all the walls of the phase change chamber have a capillary structure, and on the basis of effectively improving the vaporization efficiency, the capillary structure on the side close to the cold dynamic chamber can also improve the condensation efficiency.
  • the capillary structure can be formed on the lower wall of the phase change cavity by using a sintering process.
  • different forms of copper components can be used to form disordered capillary structures with different porosity and permeability by controlling the corresponding sintering temperature.
  • the embodiment of the present application also provides a second implementation of the first aspect: the matching surface of the cover plate and the heat exchange core has a concave cavity, and the inner The cover plate body around the concave cavity has an installation notch, and the installation notch extends toward the heat exchange core; correspondingly, the matching surface of the base plate and the cover plate has an installation recess, and the cover plate passes through the installation notch and The mounting recess of the heat exchange core is sealed and fitted so as to be surrounded by the inner concave cavity and the substrate body inside the mounting recess to form the cooling cavity.
  • the sealed assembly structure design between the two can ensure reliable sealing of the cooling chamber.
  • the cover plate and the heat exchange core can also adopt an integrated structure, such as using 3D printing technology, the cooling chamber formed by direct enclosure has better sealing performance, and the process cost is lower in mass production.
  • the embodiment of the present application also provides a third implementation manner of the first aspect: the phase change cavity is set There are a plurality of diversion pillars, and the upper and lower ends of each diversion pillar are respectively connected with the upper and lower walls of the phase change cavity.
  • the gaseous working medium condenses after contacting the low-temperature upper wall surface, and the formed liquid working medium can fall back to the lower wall surface along the corresponding diversion column, which can quickly guide the liquid working medium to the bottom heated wall surface, and increase the actual falling speed; in addition, Based on the fact that the guide column is supported between the upper wall and the lower wall, the body rigidity of the substrate can be improved at the same time, it is convenient to apply force reasonably during the assembly operation, and it is not easy to produce deformation that affects the heat transfer performance, and has good assembly process.
  • the arrangement quantity of the guide pillars and the spacing arrangement density in the phase change cavity can be set according to the actual heat dissipation requirements of different heat-generating components to be dissipated.
  • connection point between the diversion column and the upper wall surface should preferably be close to the low temperature point, and the connection point position between the flow guide column and the lower wall surface should be preferably selected close to the high temperature point, thus, in the liquid state During the fall-back phase of the working medium, a relatively large amount of liquid working medium can be directed to an area with a higher working temperature to improve the vaporization efficiency of the liquid working medium.
  • the deflector column may be arranged vertically, or may be arranged inclined at a certain angle relative to the vertical direction.
  • the embodiment of the present application also provides the first implementation manner of the first aspect Four implementation modes: the top surface of the substrate is also provided with an enhanced phase change body, the enhanced phase change body is located above the phase change cavity, and has an enhanced phase change cavity communicated with the phase change cavity, at least part of the enhanced phase change cavity is located in the cooling chamber. This can increase the condensation working surface and increase the heat transfer area.
  • the reinforced phase change body is configured in multiples arranged at intervals, and the plurality of cooling fins are arranged on the top surface of the substrate and/or the outer surface of the reinforced phase change body.
  • the embodiment of the present application also provides a fifth implementation of the first aspect: the cooling fins located between two adjacent enhanced phase change bodies are configured to: fix On the adjacent two enhanced phase transitions. Based on this, adjacent enhanced phase change bodies are interconnected with multiple heat dissipation fins between them, which can reasonably balance the heat transfer capabilities of each enhanced phase change body in the cooling chamber, making the condensation work of the phase change chamber and the enhanced phase change chamber The surface temperature tends to be the same, and the heat exchange capacity of the liquid cooling side and the phase change side is balanced as a whole.
  • the top surface of the reinforced phase transition body is in contact with the bottom wall of the concave cavity.
  • the abutment between the two can also form a stable support and improve the overall strength of the cold plate.
  • the heat dissipation fins are arranged on the side of the reinforced phase change body, and the body of the heat dissipation fins is arranged along the extending direction of the body of the substrate, which is convenient for processing and forming.
  • the second aspect of the embodiments of the present application provides a computing device, including a heat-generating device and a cold plate for providing heat dissipation, and the cold plate adopts the aforementioned cold plate.
  • the computing device may be a computer or a server
  • the heat generating device may be a CPU, or a GPU of a graphics card.
  • Fig. 1 is a schematic diagram of the assembly relationship of a cold plate provided by the embodiment of the present invention
  • Fig. 2 is the partial view that the A-A sectional position of cold plate shown in Fig. 1 forms;
  • Fig. 3 is a schematic diagram of the use state of the cold plate shown in Fig. 1;
  • Fig. 4 is the top view of cold plate shown in Fig. 1;
  • Fig. 5 is a schematic diagram of the overall structure of the heat exchange core shown in Fig. 1;
  • Fig. 6 is the B-B sectional view of Fig. 5;
  • Fig. 7 is an enlarged view of part C of Fig. 3;
  • FIG. 8 is a schematic diagram of another cold plate provided by an embodiment of the present invention.
  • Fig. 9 is a schematic diagram of another cold plate provided by an embodiment of the present invention.
  • Fig. 10 is a schematic diagram of another cold plate provided by an embodiment of the present invention.
  • Fig. 11 is a schematic diagram of a typical use state of the existing liquid-cooled cold plate.
  • the embodiment of the present application provides a phase change enhanced cold plate, which can effectively improve the heat transfer capability of the substrate, and support the heat dissipation capability requirements of the heat-generating components of different computing devices.
  • the existing liquid-cooled cold plate it is assembled with heat-generating components in specific application scenarios, such as the CPU of a computing device. After the assembly is completed, the bottom surface of the substrate of the heat exchange core is attached to the CPU to realize heat exchange, and then the fins on the substrate exchange heat with the liquid cooling medium, and the heat is taken away through the liquid cooling cycle.
  • a substrate with a certain size is required to adapt to a large number of fins; please refer to Figure 11, which shows a typical example of an existing liquid-cooled cold plate Use state diagrams.
  • the substrate 1a Limited by the heat transfer capability of the substrate, the substrate 1a has relatively poor heat transfer capability along the lateral direction of its main body plate, and the heat transfer from the middle position where the substrate 1a and the CPU 2a are attached, gradually decreases toward the side.
  • the area indicated by mark D represents the variation trend of the heat transfer, and part of the fins 3 a located around the substrate cannot effectively participate in the heat exchange process. For substrates with larger configuration sizes, there are also situations where heat cannot be transferred to the edge of the body.
  • an embodiment of the present application provides a phase change enhanced cold plate, which may include a cover plate and a heat exchange core, and the two are connected to form a cooling cavity on the liquid cooling side: wherein the heat exchange core includes A base plate and a plurality of heat dissipation fins, the bottom surface of the base plate is used for heat exchange with heat-generating components, and a plurality of heat dissipation fins are located in the cooling cavity and arranged on the base plate at intervals, so as to transfer the energy exchanged to the heat dissipation fins through a liquid cooling cycle. Heat away.
  • the body of the substrate is provided with a phase-change cavity for containing phase-change working fluid
  • the lower wall of the phase-change cavity has a capillary structure, and the capillary structure is arranged at least in the peripheral area of the lower wall.
  • the heat of the CPU is transferred to the heat exchange core substrate, the phase change working medium in the phase change chamber is heated and vaporized, and the vaporization absorbs a large amount of latent heat of vaporization, and quickly takes away the heat; the high temperature gas fills the entire phase change chamber, Contact with the low-temperature upper wall condenses quickly, forming a liquid that falls back to the lower wall of the phase change chamber.
  • the entire substrate body on the top of the phase change chamber participates in heat exchange, and the fins around the substrate can fully participate in heat exchange.
  • the peripheral phase change working fluid can be quickly sucked to the area on the lower wall of the phase change chamber opposite to the CPU. Ensure maximum heat transfer in the area opposite the CPU.
  • the heat transfer performance of the outer periphery of the substrate body is improved by configuring the phase change side, which can make full use of the heat load capacity of the liquid cooling cycle and effectively improve the overall heat transfer capacity of the cold plate.
  • the cold plate 100 may include a cover plate 10 and a heat exchange core 20, please refer to Fig. 1, Fig. 2 and Fig. 3, wherein Fig. 1 shows a cold plate assembly provided in the embodiment of the present application A schematic diagram of the relationship, Fig. 2 is a partial view of the A-A section of the cold plate shown in Fig. 1, and Fig. 3 is a schematic diagram of the use state of the cold plate shown in Fig. 1 .
  • a reinforced cold plate 100 having both a liquid cooling side and a phase change side is formed.
  • the cover plate 10 is provided with a liquid inlet 11 and a liquid outlet 12, which are respectively connected with the liquid cooling system pipeline to establish a liquid cooling cycle.
  • the "liquid cooling cycle” can be driven by the pump to establish a forced circulation to take away the heat of the radiator, and supplemented by a cooling fan to improve the heat dissipation effect, that is, active liquid cooling; "liquid cooling cycle” can also be passive liquid cooling , to obtain a better mute effect.
  • the liquid flowing in the liquid cooling cycle can be selected according to needs, such as but not limited to the water cooling cycle with water as the medium. It can be understood that the working mechanism of the liquid cooling cycle is not the core invention of this application, so it will not be described in detail here.
  • the substrate 21 of the heat exchange core 20 is provided with a plurality of cooling fins 22 .
  • the cooling cavity I as the basic structure of the liquid cooling side is formed by connecting the cover plate 10 and the heat exchange core 20 to form an enclosure: the cooling fins 22 are located in the cooling cavity I, and are arranged on the substrate 21 at intervals. The heat exchanged to the cooling fins 22 can be taken away through the liquid cooling cycle.
  • the phase change cavity II as the basic structure of the phase change side is arranged on the base plate 21 of the heat exchange core 20 .
  • the bottom surface of the substrate 21 is used to be fitted to the top surface of the CPU 30 to realize heat exchange between the CPU 30 and the substrate 21 . That is to say, the phase change chamber II is located below the cooling chamber I.
  • the phase change chamber II of the substrate 21 is equipped with a phase change working medium.
  • the liquid phase change working medium is not completely filled with the phase change chamber II, and after the phase change working medium is injected, the vacuum is drawn to form a vacuum state.
  • phase change chamber II The heat generated by the CPU work is transferred to the substrate 21, and the liquid phase change working medium in the phase change chamber II is heated and vaporized, and fills the phase change chamber II; in this scheme, the upper wall of the phase change chamber II is integrated with the lower wall of the cooling chamber I One, and the temperature is lower, the high-temperature gaseous phase-change working fluid condenses rapidly after contacting the low-temperature upper wall of the phase-change chamber II, and under the action of gravity, the formed liquid phase-change working medium falls back (as indicated by arrow E in Figure 3 shown) to the bottom of phase change chamber II.
  • FIG. 4 is a top view of the cold plate shown in FIG. 1 .
  • Mounting holes 13 are provided on the cover plate 10 so that threaded fasteners and the like can be screwed into a fixed structure of the computing device, such as a casing or a machine frame, through the corresponding mounting holes 13 .
  • the opening position of the mounting hole 13 needs to avoid components such as the CPU.
  • the cold plate can be reliably fixed, and at the same time, it can also ensure that the bottom surface of the base plate 21 and the surface of the CPU are in close contact with each other, which has a good heat exchange effect.
  • the liquid inlet 11 and the liquid outlet 12 of the cold plate are positioned at both sides ends on the length direction of the cover plate 10, and are staggered in the width direction, and water flows into the cooling chamber 1 through the liquid inlet 11 Finally, the flow path in the cavity is relatively long, which can further improve the heat exchange efficiency of the liquid cooling side.
  • the orientation words "length direction” and "width direction” are defined based on the proportional relationship between the length and width of the cold plate shown in the figure, that is, the direction of the relatively large size is the "length direction”, and the direction of the relatively small The direction in which the dimension is located is the "width direction". It should be understood that the use of the above orientation words is only used to clearly describe that the relatively long flow path in the chamber is beneficial to the heat exchange efficiency, rather than constituting a substantial limitation to the present solution.
  • FIG. 5 is a schematic diagram of the overall structure of the heat exchange core shown in FIG. 1
  • FIG. 6 is a B-B sectional view of FIG. 5 .
  • the capillary structure 2111 is arranged on the outer peripheral area of the lower wall surface 211 , specifically, a mark T in FIG. 6 indicates an arrangement form of the outer peripheral area.
  • FIG. 3 shows a schematic diagram of the working cycle principle of the phase change working medium in the phase change chamber II.
  • the peripheral area portion T may be extended to the edge of the area where the CPU is located, so as to establish a stable and reliable capillary flow trend.
  • all the wall surfaces of the phase change chamber II have a capillary structure, in other words, the capillary structure is arranged on the entire wall surface of the phase change chamber II. In this way, on the basis of effectively improving the vaporization efficiency, the side close to the cooling chamber I The capillary structure can further improve the condensation efficiency.
  • the capillary structures 2111 are preferably irregularly arranged, and relatively abundant flow paths can be formed on the lower wall surface 211 where the capillary structures 2111 are arranged.
  • the disordered capillary dynamic flow has a high possibility Adaptability, the liquid phase-change working fluid can flow to any position within its width under the action of the capillary structure 2111, so as to give full play to the heat exchange capacity of the reduced area of the liquid phase-change working medium and improve the vaporization efficiency of the phase-change working medium.
  • the capillary structure 2111 can be formed on the lower wall surface 211 of the phase change chamber II by a sintering process.
  • a sintering process For example but not limited to, different forms of copper components can be used to form disordered capillary structures with different porosity and permeability by controlling the corresponding sintering temperature.
  • the cover plate 10 and the heat exchange core 20 can be processed separately, or can adopt an integrated structure (not shown in the figure), and can be specifically formed by an integrated molding process, such as a 3D printing process, directly enclosed and formed
  • the cooling chamber 1 has better sealing performance, and the process cost is lower during mass production.
  • the cover plate 10 and the heat exchange core 20 are processed separately, and then assembled to form the cooling cavity I, and the sealing of the cooling cavity I is ensured through the design of the sealed assembly structure between the two.
  • FIG. 7 is an enlarged view of part C of FIG. 3 .
  • the mating surface of the cover plate 10 and the heat exchange core 20 has a concave cavity 14, which is formed along the surface of the plate, and the cover body around the concave cavity 14 has a mounting notch 15.
  • the installation notch 15 is formed extending toward the heat exchange core 20; corresponding to the installation notch 15 on the cover plate 10, the mating surface of the substrate 21 and the cover plate 10 has an installation recess 212, and the installation stop Both the opening 15 and the mounting recess 212 are ring-shaped around the outer periphery of the inner concave cavity 14 , and the cover plate 10 is fitted tightly with the mounting recess 212 of the heat exchange core 20 through the mounting notch 15 .
  • the cooling chamber I is enclosed by the inner concave cavity 14 and the substrate body inside the installation recess 212. After the assembly is completed, the cooling fins 22 on the substrate are placed in the cooling chamber I.
  • cover plate 10 and the heat exchange core 20 may be assembled by welding, or may be detachably connected by threaded fasteners, so as to perform inspection and maintenance as required.
  • the capillary structure 2111 is disposed on the peripheral region of the lower wall 211 of the phase change chamber II.
  • capillary structures are configured on the entire surface of the lower wall surface 211 of the phase change chamber II.
  • FIG 8 Please refer to the schematic diagram of another cold plate shown in Figure 8, which is formed in the same way as the cold plate of the embodiment shown in Figure 7, in order to clearly show the difference and connection between this embodiment and the cold plate shown in Figure 7 , components and structures with the same functions are shown with the same symbols in the figure.
  • the capillary structure 2111 is disposed on the entire surface of the lower wall 211 of the phase change chamber II.
  • the capillary structure 2111 in addition to sucking the condensate back to the peripheral area and part of the liquid working medium to the area where the CPU is located, it can form a dynamic flow transfer of the liquid working medium in the area where the CPU is located and the entire surface, which can further improve the heat exchange efficiency on the whole.
  • a flow guide column 213 may be provided in the phase change chamber II of the cold plate.
  • FIG. 9 shows a schematic diagram of another cold plate provided by an embodiment of the present invention, which is formed in the same way as the cold plate of the embodiment shown in FIG. 7 .
  • the differences and connections between the cold plates shown in Fig. 7 and Fig. 8, the composition and structure of the same function in the figure are shown with the same mark.
  • the phase change chamber II has a plurality of guide pillars 213 , and the upper and lower ends of each guide pillar 213 are respectively connected with the upper wall 214 and the lower wall 211 of the phase change chamber II.
  • the gaseous working medium condenses after contacting the low-temperature upper wall surface 214, and the formed liquid working medium can fall back to the lower wall surface 211 along the corresponding diversion column 213.
  • the mass is quickly guided to the heated wall at the bottom to increase the actual falling speed; in addition, the guide column 213 is supported between the upper wall 214 and the lower wall 211, which can improve the body rigidity of the substrate and provide basic technical support for meeting the design requirements of light and thin structure , and at the same time, a reasonable force is applied during the assembly operation, so that deformation affecting the heat transfer performance is not easy to occur, and the complexity of the assembly operation is reduced.
  • the arrangement quantity of the guide columns 213 and the spacing arrangement density in the phase change chamber II can be set according to the actual heat dissipation requirements of different heat-generating components to be dissipated.
  • connection point between the guide column 213 and the upper wall 214 should preferably be close to the low temperature point, and the connection point between the flow guide column 213 and the lower wall 211 should be preferably selected close to the high temperature point, thus, During the fall-back stage of the liquid working medium, a relatively large amount of liquid working medium can be guided to the area with a higher working temperature to improve the vaporization efficiency of the liquid working medium.
  • the deflector column 213 may be arranged vertically, or may be arranged inclined at a certain angle relative to the vertical direction. It can be understood that, as long as the above-mentioned beneficial guidance for the liquid working medium can be formed during the falling phase of the liquid working medium, it is not limited to the arrangement of the guide column 213 in the vertical direction as shown in FIG. 9 .
  • the phase change chamber II is flat and formed along the surface of the substrate 21 , and the condensing working surface is mainly the upper wall of the phase change chamber II. Furthermore, in order to enhance the heat exchange capacity, the phase change chamber II can be designed in a three-dimensional shape to further increase the heat exchange area.
  • Figure 10 shows a schematic view of another cold plate provided by the embodiment of the present invention. similarly, in order to clearly show the differences and connections between this embodiment and the previous embodiments, the configuration and function of the same function in the figure Structures are indicated with the same notation.
  • the substrate 21 also includes a plurality of enhanced phase change bodies 215, each enhanced phase change body 215 is located above the phase change cavity II, and has an enhanced phase change cavity IIa communicating with the phase change cavity II, At least part of the enhanced phase change chamber IIa is located in the cooling chamber I.
  • the size of the body of the substrate 21 protruding into the cooling chamber Ia is directly related to the part of the enhanced phase change chamber IIa located in the cooling chamber I, thereby increasing the condensation working surface, which can be determined according to actual needs.
  • the plurality of reinforcing phase transition bodies 215 arranged at intervals may be arranged at equal intervals, or may be arranged at unequal intervals.
  • the cooling fins 22 are disposed on the outer surface of the reinforced phase change body 215 .
  • the heat dissipation fins 22 can also be arranged on the top surface of the substrate 21 and the outer surface of the reinforced phase change body 215;
  • the sheet 22 is arranged on the outer surface of the reinforced phase transition body 215, the structure is easy to manufacture and has better processability.
  • the cooling fins 215 located between adjacent reinforced phase-change bodies 215 are all configured to be fixed on two reinforced phase-change bodies 215 .
  • adjacent enhanced phase change bodies 215 form interconnections with multiple heat dissipation fins 215 between them, which can reasonably balance the heat transfer capabilities of each enhanced phase change body 215 in the cooling chamber I, so that the phase change chamber II and the enhanced phase change
  • the temperature of the condensing working surface of chamber IIa tends to be consistent, and the heat exchange capacity of the liquid cooling side and the phase change side is balanced to the greatest extent.
  • the adjacent reinforced phase change bodies 215 can improve the overall rigidity through the heat dissipation fins 215 between them, and are less likely to be deformed.
  • the shape of the enhanced phase transition body 215 can be designed according to different application scenarios, such as but not limited to a structure with a square or circular cross section.
  • each reinforced phase transition body 215 is in contact with the bottom wall of the inner concave cavity 14.
  • the offset between the two can also form a stable support and improve the cold plate. overall strength.
  • the heat dissipation fins 22 are arranged in parallel in sequence, that is, the bodies of the heat dissipation fins 22 are arranged along the extending direction of the body of the substrate 21 , which is convenient for processing and forming.
  • the embodiment of the present application also provides a computing device, the computing device includes heat-generating components such as a CPU or a graphics processing unit (Graphic Processing Unit, GPU) of a graphics card, and also includes a cold plate as described in the foregoing Figures 1 to 10, In order to provide good heat dissipation performance for the corresponding heat-generating components.
  • the heat-generating component that uses the cold plate described in this embodiment for heat dissipation treatment is not limited to a CPU or a GPU of a graphics card, but may also be other high-power devices of a computing device.
  • the computing device may be a product type such as a computer or a server. It should be understood that other functions of the corresponding computing device are not the core invention of this application, so details will not be described herein.
  • the phase change enhanced cold plate uses the heat exchange capacity of the phase change side to quickly take away the heat generated by the heat-generating components.
  • the lower wall of the phase change cavity of the substrate has a capillary structure.
  • the peripheral phase change working fluid can be quickly sucked to the area opposite to the CPU or graphics card on the lower wall of the phase change chamber, ensuring that the CPU or graphics card The maximum heat exchange rate of the graphics card area.

Abstract

一种计算设备及其冷板。该冷板的盖板与换热芯围合形成液冷侧的冷却腔，其换热芯通过基板的底面与发热部件适配换热，基板本体上设置有用于容纳相变工质的相变腔，辅以构建相变增强冷板，且该相变腔的下壁面具有毛细结构，该毛细结构至少配置在该下壁面的外周区域部分。如此设置，发热部件工作产生的热量首先传递至换热芯基板，相变腔内的相变工质受热并汽化，携带热量高温的气体充满整个相变腔，与低温的上壁接触快速冷凝并回落至相变腔的底部；在相变腔毛细结构的作用下，将外周相变工质快速吸到相变腔下壁面液量挥发减小的区域，确保该区域的最大换热量，并基于冷却腔与液冷系统建立的液冷循环将热量带走，换热效率较高。

Description

一种计算设备及其冷板
本申请要求于2022年01月17日提交中国专利局的申请号为202210051539.4、发明名称为“一种计算设备及其冷板”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及计算机硬件领域，尤其涉及一种计算设备及其相变增强型冷板。
背景技术
冷板是液冷系统与热源进行换热的关键部件，例如但不限于可用于计算设备的中央处理器(central processing unit，CPU)散热。具体地，通过换热芯基板与CPU贴合，换热过程中热量自CPU导至换热芯基板，再通过换热芯基板上的换热芯翅片与水进行热交换，并经由液冷循环将热量带走。
由于铜基板横向传热能力比较差，基板尺寸过大或者说其板面尺寸超出相适配的热源尺寸较多的话，则会导致位于基板周边的翅片基本无法参与到上述换热过程中。也就是说，换热芯翅片不能达成其设计换热能力。因此，现有冷板的换热芯基板尺寸大多与芯片尺寸差不多，但直接影响换热芯翅片的可布置区域，进而无法获得良好的散热能力。
特别是，对于小尺寸大功率的发热部件来说，上述问题尤为显著。
发明内容
本申请实施例提供了一种计算设备及其冷板，通过结构优化改善冷板散热能力及散热效率，以支持不同大功率发热部件应用场景的配置。
本申请实施例第一方面提供了一种冷板，包括围合形成冷却腔的盖板和换热芯，该冷却腔具有进液口和出液口的盖板，换热芯包括基板和多个散热翅片，该基板的底面用于与发热部件适配换热，发热部件工作产生的热量首先传递至换热芯基板，各散热翅片位于冷却腔中且间隔设置在基板上，通过液冷循环可将交换至散热翅片的热量带走；本方案中，在基板的本体上设置有用于容纳相变工质的相变腔，且该相变腔的下壁面具有毛细结构，毛细结构至少配置在该下壁面的外周区域部分。如此设置，相变腔内的相变工质受热并汽化，汽化吸收大量的汽化潜热，携带热量高温的气体充满整个相变腔，与低温的上壁接触快速冷凝，形成液态工质回落到相变腔的下壁；该相变过程中，相变腔顶部的基板本体全幅面参与热交换，基板周边的翅片由此可充分参与热交换。与此同时，随着发热部件对应区域液体不断受热挥发并减小，在相变腔下壁面毛细结构的作用下，能够将外周相变工质快速吸到相变腔下壁面液量挥发减小的区域，确保该区域的最大换热量。整体来看，基板本体外周的传热性能通过相变侧的配置得以改善，可充分利用液冷循环的热负载能力，能够有效提高冷板的整体换热能力。
在实际应用中，可在相变腔下壁面的全表面配置有毛细结构。这样，可以形成发热部件所在区域以及全表面的液态工质动态流动转移，能够进一步提升换热效率，
在实际应用中，该相变腔中充有相变工质后抽真空，以形成利于受热相变的真空状态。
基于第一方面，本申请实施例还提供了第一方面的第一种实施方式：毛细结构呈非规则排布状。基于基板底面与发热部件进行基础换热的特点，液态工质始终覆于相变腔的下壁面，也即相变受热工作面上，非规则排布的毛细结构能够在下壁面上形成较为丰富的流动路径，液态相变工质可在毛细结构的作用下流向其幅面内的任一位置，以充分发挥液态相变工质减少区域的换热能力，提高相变工质的汽化效率。
示例性的，相变腔的全部壁面具有毛细结构，在有效提高汽化效率的基础上，接近冷动腔一侧的毛细结构还能够提高冷凝效率。
在实际应用中，可采用烧结工艺在相变腔的下壁面上形成该毛细结构。示例性的，可利用不同形态的铜份，通过控制相应的烧结温度，以形成不同孔隙和渗透率的无序毛细结构。
基于第一方面，或第一方面的第一种实施方式，本申请实施例还提供了第一方面的第二种实施方式：盖板与换热芯的适配面具有内凹容腔，内凹容腔的周边的盖板本体具有安装止口，该安装止口朝向所述换热芯延伸形成；相应地，基板与盖板的适配面具有安装凹部，且盖板通过安装止口与换热芯的安装凹部密封适配，以由内凹容腔和安装凹部内侧的基板本体围合形成所述冷却腔。两者间密封组装结构设计，能够确保冷却腔具有可靠的密封性。
在其他实际应用中，盖板和换热芯也可采用一体式结构，例如采用3D打印工艺，直接围合形成的冷却腔密封性较好，且批量生产时工艺成本较低。
基于第一方面，或第一方面的第一种实施方式，或第一方面的第二种实施方式，本申请实施例还提供了第一方面的第三种实施方式：该相变腔内设置有多个导流柱，每个导流柱的上、下端分别与相变腔的上、下壁面连接。这样，气态工质接触低温上壁面后冷凝，形成的液态工质可沿相应的导流柱回落至下壁面上，可快速将液态工质快速引导至底部受热壁面，提高实际回落速度；另外，基于导流柱支撑在上壁面和下壁面之间，可同时提高基板的本体刚度，方便组装操作过程中进行合理施力，不易产生影响换热性能的变形，具有较好的装配工艺性。
在实际应用中，导流柱的布置数量以及在相变腔中的间隔排布密度，可根据不同待散热发热部件的实际散热需求设定。
示例性的，该导流柱与上壁面的连接点位应当优选选择趋近于温度低点，导流柱与下壁面的连接点位应当优选选择趋近于温度高点，由此，在液态工质回落阶段，可将相对多的液态工质引导至工作温度较高的区域，提高液态工质的汽化效率。
示例性的，该导流柱可以竖直设置，也可相对于竖直方向倾斜一定角度设置。
基于第一方面，或第一方面的第一种实施方式，或第一方面的第二种实施方式，或第一方面的第三种实施方式，本申请实施例还提供了第一方面的第四种实施方式：基体的顶面上还设有增强相变体，增强相变体位于相变腔的上方，并具有与相变腔连 通的增强相变腔，增强相变腔的至少部分位于冷却腔中。由此可增大冷凝工作面，加大换热面积。
示例性的，该增强相变体配置为间隔设置的多个，多个散热翅片设置在基板的顶面和/或增强相变体的外表面上。
基于第一方面的第四种实施方式，本申请实施例还提供了第一方面的第五种实施方式：位于相邻的两个增强相变体之间的散热翅片，均配置为：固定在相邻的两个增强相变体上。基于此，相邻增强相变体与两者间的多个散热翅片形成互联，能够合理平衡冷却腔内各增强相变体的换热能力，使得相变腔和增强相变腔的冷凝工作面温度趋于一致，整体平衡液冷侧和相变侧的换热能力。
示例性的，增强相变体的顶面与内凹容腔的底壁相抵，在充分利用内凹容腔的深度空间外，两者相抵还可形成稳定支撑，提高冷板的整体强度。散热翅片设置在增强相变体的侧面上，且散热翅片的本体沿基板的本体延伸方向布置，方便加工成型。
本申请实施例第二方面提供了一种计算设备，包括发热器件和用于提供散热能力的冷板，该冷板采用如前所述冷板。
示例性的，该计算设备可以为计算机或服务器，该发热器件可以为CPU，以可以为显卡的GPU。
附图说明
图1为本发明实施例提供的一种冷板装配关系示意；
图2为图1中所示冷板的A-A剖面位置形成的局部视图；
图3为图1中所示冷板的使用状态示意图；
图4为图1中所示冷板的俯视图；
图5为图1中所示换热芯的整体结构示意；
图6为图5的B-B剖面图；
图7为图3的C部放大图；
图8为本发明实施例提供的另一种冷板的示意图；
图9为本发明实施例提供的又一种冷板的示意图；
图10为本发明实施例提供的又一种冷板的示意图；
图11为现有液冷冷板的一种典型使用状态示意图。
具体实施方式
本申请实施例提供了一种相变增强型冷板，能够有效提升基板的换热能力，支持不同计算设备的发热部件散热能力要求。
现有液冷冷板中，与具体应用场景下的发热部件组装在一起，例如计算设备的CPU。组装完成后，其换热芯的基板的底面与CPU贴合，以实现换热，再通过基板上的翅片与液冷介质进行热交换，经由液冷循环将热量带走。基于现有冷板结构，为了获得良好的散热效率，需要一定幅面尺寸的基板来适配较多数量的翅片；请参见图11，该图示出了现有液冷冷板的一种典型使用状态示意图。
受基板传热能力限制，该基板1a沿其本体板面横向的传热能力比较差，其热量传递自该基板1a与CPU2a贴合的中部位置，向旁侧呈逐渐减小的趋势变化。图11中以标记D所示区域表征该热量传递的变化趋势，位于基板周边的部分翅片3a无法有效参与换热过程。对于更大配置尺寸的基板，还存在热量无法传递至其本体边缘的情形。
基于此，本申请实施例提供了一种相变增强型冷板，该冷板可以包括盖板和换热芯，且两者相连围合形成液冷侧的冷却腔：其中，换热芯包括基板和多个散热翅片，该基板的底面用于与发热部件贴合换热，多个散热翅片位于冷却腔中且间隔设置在基板上，以通过液冷循环将交换至散热翅片的热量带走。同时，该基板的本体设置有用于容纳相变工质的相变腔，且相变腔的下壁面具有毛细结构，这里的毛细结构至少配置在下壁面的外周区域部分。
实际工作状态下，CPU的热量传递到换热芯基板，相变腔内的相变工质受热并汽化，汽化吸收大量的汽化潜热，迅速将热量带走；高温的气体充满整个相变腔，与低温的上壁接触快速冷凝，形成液体回落到相变腔的下壁，该过程中相变腔顶部的基板本体全幅面参与热交换，基板周边的翅片由此可充分参与热交换。与此同时，随着与CPU相对的区域内液体不断挥发减少，在相变腔下壁面毛细结构的作用下，能够将外周相变工质快速吸到相变腔下壁面与CPU相对的区域，确保与CPU相对的区域的最大换热量。整体来看，基板本体外周的传热性能通过配置该相变侧得以改善，可充分利用液冷循环的热负载能力，能够有效提高冷板的整体换热能力。
为了更好地理解本申请的技术方案和技术效果，不失一般性，以下将结合附图并以计算设备的CPU作为发热部件，对具体的实施例进行详细的描述。
本申请实施例中，该冷板100可以包括盖板10和换热芯20，请参见图1、图2和图3，其中，图1示出了本申请实施例提供的一种冷板装配关系示意图，图2为图1中所示冷板的A-A剖面位置形成的局部视图，图3为图1中所示冷板的使用状态示意图。
如图1所示，盖板10与换热芯20组装后，构建形成兼具液冷侧和相变侧的增强型冷板100。其中，盖板10上具有进液口11和出液口12，分别与液冷系统管路连通建立液冷循环。这里，“液冷循环”可以在泵的带动下建立强制循环带走散热器的热量，并辅以散热风扇提升散热效果，也即主动式液冷；“液冷循环”也可以为被动式液冷，以获得较好的静音效果。液冷循环中流动的液体可以根据需要进行选择，例如但不限于以水为介质的水冷循环。可以理解的是，该液冷循环的工作机理非本申请的核心发明点所在，故本文不再赘述。
本申请实施例中，换热芯20的基板21设置有多个散热翅片22。如图2所示，作为液冷侧基础结构的冷却腔I，由盖板10与换热芯20相连围合形成：散热翅片22位于冷却腔I中，且彼此间隔设置在基板21上，以通过液冷循环将交换至散热翅片22的热量带走。
相应地，作为相变侧基础结构的相变腔II，设置在换热芯20的基板21上。结合图3所示，该基板21的底面用于与CPU30的顶面贴合适配，以实现CPU30与基板21之间的换热。也就是说，相变腔II位于冷却腔I的下方。
该基板21的相变腔II内配置有相变工质，在具体应用中，液态相变工质不完全充满相变腔II，且注入相变工质后抽真空，以形成利于受热相变的真空状态。CPU工作产生 的热量传递至基板21，相变腔II内的液态相变工质受热汽化，并充满相变腔II；本方案中，相变腔II的上壁面与冷却腔I的下壁面集成一体，且温度较低，高温的气态相变工质与相变腔II的低温上壁面接触后快速冷凝，在重力的作用下，形成的液态相变工质回落(如图3中箭头E所示)至相变腔II的底部。
结合图4所示，图4为图1中所示冷板的俯视图。盖板10上开设有安装孔13，以便螺纹紧固件等穿过相应的安装孔13旋入计算设备的固定结构上，例如机壳或机框等固定结构。这里，安装孔13的开设位置需要避让CPU等部件。螺纹紧固后，一方面冷板得以可靠固定，同时还能够确保基板21底面与CPU表面之间紧密贴合，具有良好的换热效果。
再如图4所示，冷板的进液口11和出液口12位于盖板10长度方向上的两侧端部，且在宽度方向上错开布置，水经由进液口11流入冷却腔I后，其腔内流动路径相对较长，可进一步提高液冷侧换热效率。这里，方位词“长度方向”、“宽度方向”是以图中所示冷板长宽尺寸比例关系为基准定义的，也即相较大的尺寸所在方向为“长度方向”，相较小的尺寸所在方向为“宽度方向”。应当理解，上述方位词的使用仅用于清楚描述腔内流动路径相对较长有益于换热效率，而非构成对本方案的实质性限制。
本申请实施例中，该相变腔II的下壁面211上具有毛细结构2111。请一并参见图5和图6，其中，图5为图1中所示换热芯的整体结构示意，图6为图5的B-B剖面图。
该毛细结构2111配置在下壁面211的外周区域部分，具体在图6中以标记T示意该外周区域部分的一种布置形式。请一并参见图3，该图示出了相变腔II内相变工质的工作循环原理示意。当CPU区域液体不断挥发减少时，在相变腔下壁面毛细结构的作用下，能够将外周相变工质快速吸到(如图3中F箭头所示)相变腔下壁面与CPU相对的区域，受热汽化进入下一个循环。由此，可保证CPU区域的最大换热量。
当然，在具体实现中，外周区域部分T可以延伸布置至CPU所在区域的边缘，以建立稳定可靠的毛细流动趋势。另外，相变腔II的全部壁面具有毛细结构，换言之，在整个相变腔II壁面上均配置有该毛细结构，如此设置，在有效提高汽化效率的基础上，接近冷动腔I一侧的毛细结构能够进一步提高冷凝效率。
在其他具体实现中，该毛细结构2111优选呈非规则排布状，可在配置有毛细结构2111的下壁面211上形成较为丰富的流动路径，换言之，无序的毛细动态流动具有较高的可适应性，液态相变工质可在毛细结构2111的作用下流向其幅面内的任一位置，以充分发挥液态相变工质减少区域的换热能力，提高相变工质的汽化效率。
为了提高加工工艺性，对于采用铜材制成的基板21，可采用烧结工艺在相变腔II的下壁面211上形成该毛细结构2111。例如但不限于，可利用不同形态的铜份，通过控制相应的烧结温度，以形成不同孔隙和渗透率的无序毛细结构。
具体来说，盖板10和换热芯20可分体加工，也可采用一体结构(图中未示出)，具体可以采用一体成型工艺制成，例如采用3D打印工艺，直接围合形成的冷却腔I具有较好的密封性，且批量生产时工艺成本较低。本实施例中，盖板10和换热芯20采用分体加工，再组装围合形成冷却腔I，并通过两者间密封组装结构设计确保冷却腔I的密封性。请一并参见图3、图6和图7，图7为图3的C部放大图。
本实施例中，盖板10与换热芯20的适配面具有内凹容腔14，该内凹容腔14沿板面形成，且内凹容腔14周边的盖板本体具有安装止口15，如图7所示，安装止口15朝向换热芯20延伸形成；与盖板10上的安装止口15对应地，基板21与盖板10的适配面具有安装凹部212，安装止口15与安装凹部212均呈绕内凹容腔14外周形成的环状，盖板10通过安装止口15与换热芯20的安装凹部212密封适配。这里，冷却腔I由内凹容腔14和安装凹部212内侧的基板本体围合形成，完成组装后，基板上的散热翅片22置于该冷却腔I中。
具体实现时，盖板10与换热芯20之间可以采用焊接固定的方式组装，也可以采用螺纹紧固件形成可拆卸连接，以便根据需要进行检修维护。
前述实施例中，在相变腔II的下壁面211的外周区域部分配置有毛细结构2111。在本申请另一实施例中，将相变腔II下壁面211的全表面配置有毛细结构。请参见图8所示的另一种冷板的示意图，该图的形成方式与图7所示实施例的冷板相同，为了清楚示出本实施例与图7所示冷板的区别和联系，图中相同功能的构成和结构以同一标记进行示明。
如图8所示，毛细结构2111配置在相变腔II下壁面211的整体表面。如此设置，除将冷凝回落至外周区域部分液态工质吸到CPU所在区域外，可以形成CPU所在区域以及全表面的液态工质动态流动转移，整体上能够进一步提升换热效率，
其中，毛线结构2111的非规则布置、具体加工工艺及工艺参数选择，与前述实施例相同。故不再赘述。
为了使得冷凝后液态工质能够实现可控回落，可以在冷板的相变腔II设置有导流柱213。请参见图9，该图示出了本发明实施例提供的又一种冷板的示意图，该图的形成方式与图7所示实施例的冷板相同，为了清楚示出本实施例与图7和图8所示冷板的区别和联系，图中相同功能的构成和结构以同一标记进行示明。
如图9所示，该相变腔II内具有多个导流柱213，每个导流柱213的上、下两端分别与相变腔II的上壁面214和下壁面211相连。气态工质接触低温上壁面214后冷凝，形成的液态工质可沿相应的导流柱213回落至下壁面211上，一方面，无需汇集形成可滴落的大液滴，可快速将液态工质快速引导至底部受热壁面，提高实际回落速度；另外，导流柱213支撑在上壁面214和下壁面211之间，可提高基板的本体刚度，为满足结构轻薄化设计要求提供了基础技术保障，与此同时，在组装操作过程中进行合理施力，不易产生影响换热性能的变形，降低组装操作的复杂程度。
在具体应用中，导流柱213的布置数量以及在相变腔II中的间隔排布密度，可根据不同待散热发热部件的实际散热需求设定。
理论上，导流柱213与上壁面214的连接点位应当优选选择趋近于温度低点，导流柱213与下壁面211的连接点位应当优选选择趋近于温度高点，由此，在液态工质回落阶段，可将相对多的液态工质引导至工作温度较高的区域，提高液态工质的汽化效率。
在其他具体应用中，导流柱213可以竖直设置，也可相对于竖直方向倾斜一定角度设置。可以理解的是，只要能够液态工质回落阶段针对液态工质形成上述的有益引导均可，而非局限于图9中所示的沿竖直方向设置导流柱213。
前述实施例中，相变腔II均呈沿基板21的本体板面形成的扁平状，其冷凝工作面主要为相变腔II的上壁面。进一步地，为了增强换热能力可将相变腔II设计为成立体形状，进一步加大换热面积。请参见图10，该图示了本发明实施例提供的又一种冷板的示意图；同样地，为了清楚示出本实施例与前述各实施例的区别和联系，图中相同功能的构成和结构以同一标记进行示明。
如图10所示，基板21上还包括多个增强相变体215，每个增强相变体215均位于相变腔II的上方，并具有与相变腔II连通的增强相变腔IIa，该增强相变腔IIa的至少部分位于冷却腔I中。换言之，在具体实现时，基板21本体伸入冷却腔Ia尺寸与增强相变腔IIa位于冷却腔I的部分直接关联，并由此增大了冷凝工作面，具体可根据实际需要进行确定。
具体地，间隔设置的多个增强相变体215，可等间距布置，亦可非等间距布置。图中所示，散热翅片22设置在增强相变体215的外表面。
当然，在其他具体实现时，也可将散热翅片22设置在基板21的顶面和增强相变体215的外表面上；相较来说，基于增强相变体215的设置，将散热翅片22设置在增强相变体215的外表面上，结构易于制造，具有较好的加工工艺性。
再如图10所示，位于相邻的增强相变体215之间的散热翅片215，均配置为：固定在两个增强相变体215上。这样，相邻增强相变体215与两者间的多个散热翅片215形成互联，能够合理平衡冷却腔I内各增强相变体215的换热能力，使得相变腔II和增强相变腔IIa的冷凝工作面温度趋于一致，最大限度地平衡液冷侧和相变侧的换热能力。在此基础上，相邻增强相变体215通过两者之间的散热翅片215，能够提高整体刚度，不易产生形变。
这里在具体实现时，该增强相变体215的形状可根据不同的应用场景进行设计，例如但不限于横截面为方形或圆形等结构体。
另外，本实施中各增强相变体215的顶面与内凹容腔14的底壁相抵，在充分利用内凹容腔14的深度空间外，两者相抵还可形成稳定支撑，提高冷板的整体强度。
此外，本实施例中各散热翅片22依次平行设置，也即散热翅片22的本体沿基板21的本体延伸方向布置，方便加工成型。
本申请实施例还提供了一种计算设备，该计算设备包括CPU或者显卡的图形处理单元(Graphic Processing Unit，GPU)等发热部件，还包括如前述图1至图10中所描述的冷板，以为相应的发热部件提供良好的散热性能。可以理解的是，应用本实施例所述冷板进行散热处理的发热部件，非局限于CPU或显卡的GPU，还可以为计算设备的其他大功率器件。
该计算设备可以为计算机、服务器等产品类型，应当理解，相应计算设备的其他功能构成非本申请的核心发明点所在，故本文不再赘述。
由以上内容可知，本申请实施例提供的相变增强型冷板，利用相变侧换热能力将发热部件产生的热量迅速带走，同时，该基板的相变腔下壁面具有毛细结构，随着CPU或者显卡区域液体不断挥发减少，在相变腔下壁面上的毛细结构的作用下，能够将外 周相变工质快速吸到相变腔下壁面与CPU或者显卡相对的区域，确保CPU或者显卡区域的最大换热量。
以上仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (14)

  1. 一种冷板，其特征在于，包括：
    盖板；
    换热芯，与所述盖板围合形成冷却腔，所述冷却腔具有进液口和出液口；
    其中，所述换热芯包括基板和多个散热翅片，所述基板的底面用于与发热部件适配换热，所述多个散热翅片位于所述冷却腔中且间隔设置在所述基板上；
    所述基板的基板本体设置有用于容纳相变工质的相变腔，且所述相变腔的下壁面具有毛细结构，所述毛细结构至少配置在所述下壁面的外周区域部分。
  2. 根据权利要求1所述的冷板，其特征在于，所述相变腔的下壁面的全表面上配置有所述毛细结构。
  3. 根据权利要求1或2所述的冷板，其特征在于，所述相变腔的全部壁面具有毛细结构。
  4. 根据权利要求1至3中任一项所述的冷板，其特征在于，所述毛细结构呈非规则排布状。
  5. 根据权利要求4所述的冷板，其特征在于，所述毛细结构采用烧结工艺制成。
  6. 根据权利要求1至4中任一项所述的冷板，其特征在于，所述相变腔内设置有多个导流柱，每个导流柱的上、下端分别与所述相变腔的上、下壁面连接。
  7. 根据权利要求1至6中任一项所述的冷板，其特征在于，所述盖板与所述换热芯的适配面具有内凹容腔，所述内凹容腔的周边的盖板本体具有安装止口，所述安装止口朝向所述换热芯延伸；所述基板与所述盖板的适配面具有安装凹部，且所述盖板通过所述安装止口与所述换热芯的所述安装凹部密封适配，以由所述内凹容腔和所述安装凹部内侧的基板本体围合形成所述冷却腔，所述进液口和所述出液口设置在所述盖板上。
  8. 根据权利要求1至7中任一项所述的冷板，其特征在于，所述基体的顶面上还设有增强相变体，所述增强相变体位于所述相变腔的上方，并具有与所述相变腔连通的增强相变腔，所述增强相变腔的至少部分位于所述冷却腔中。
  9. 根据权利要求8所述的冷板，其特征在于，所述增强相变体配置为间隔设置的多个，所述多个散热翅片设置在所述基板的顶面和/或所述增强相变体的外表面上。
  10. 根据权利要求9所述的冷板，其特征在于，位于相邻的两个所述增强相变体之间的所述散热翅片，均配置为：固定在相邻的两个所述增强相变体上。
  11. 根据权利要求8至10中任一项所述的冷板，其特征在于，所述增强相变体的顶面与所述内凹容腔的底壁相抵，所述散热翅片设置在所述增强相变体的侧面上，且所述散热翅片的本体沿所述基板本体的延伸方向布置。
  12. 根据权利要求1至11中任一项所述的冷板，其特征在于，所述盖板和所述换热芯为一体式结构。
  13. 根据权利要求1至12中任一项所述的冷板，其特征在于，所述相变腔中充有相变工质，且为真空状态。
  14. 一种计算设备，其特征在于，所述计算设备包括发热器件和用于提供散热能力的冷板，所述冷板采用权利要求1至13中任意一项所述冷板。
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