WO2023139861A1 - Composant de connexion thermorétractable - Google Patents

Composant de connexion thermorétractable Download PDF

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Publication number
WO2023139861A1
WO2023139861A1 PCT/JP2022/038994 JP2022038994W WO2023139861A1 WO 2023139861 A1 WO2023139861 A1 WO 2023139861A1 JP 2022038994 W JP2022038994 W JP 2022038994W WO 2023139861 A1 WO2023139861 A1 WO 2023139861A1
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Prior art keywords
heat
shrinkable
fluororesin
sealing
inorganic filler
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PCT/JP2022/038994
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English (en)
Japanese (ja)
Inventor
遼太 福本
清一郎 村田
太郎 藤田
恵二 石橋
Original Assignee
住友電気工業株式会社
住友電工ファインポリマー株式会社
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Publication of WO2023139861A1 publication Critical patent/WO2023139861A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/70—Insulation of connections
    • H01R4/72—Insulation of connections using a heat shrinking insulating sleeve
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G1/00—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
    • H02G1/14—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for joining or terminating cables
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G15/00—Cable fittings
    • H02G15/08—Cable junctions

Definitions

  • Wire bundles are used as wire harnesses for aircraft, electronic components, railroad vehicles, automobiles, and motorcycles.
  • Each insulated wire is generally configured by covering a bundle of conductors made of one or more conductors such as copper alloys with an insulator.
  • the connection portions (joint portions) at the ends and intermediate portions of the wire bundle require electrical insulation, mechanical protection, and waterproofing because the conductors are exposed.
  • Heat-shrink tubing is used for electrical insulation, mechanical protection, and waterproofing.
  • a heat-shrinkable connecting piece comprising a heat-shrinkable tube that is heat-shrinkable in the radial direction is used.
  • the heat-shrinkable tube provided in this heat-shrinkable connection part covers the connection part of the insulated wires and heats it, it shrinks along the shape of the connection part due to the shape memory effect and adheres closely, thereby protecting the connection part such as the electric wire and the pipe.
  • a waterproof structure of the wire end has been proposed in which a cyano-based adhesive is permeated into the gaps between the core wires of the wire ends and solidified to bond the core wires together, and a heat-shrinkable tube having a hot-melt layer (adhesive layer) on the inner surface is covered over the ends, and the hot-melt layer is melted and solidified and filled (see Patent Document 1).
  • a heat-shrinkable connection component of the present disclosure is a heat-shrinkable connection component for connecting insulated wires in which a conductor is covered with an insulating layer, and includes a heat-shrinkable tube mainly composed of a first fluororesin having a melting point of 140°C or higher and 250°C or lower, a pair of cylindrical sealing portions provided on the inner peripheral surfaces of both ends of the heat-shrinkable tube, and a metal member provided between the pair of the sealing portions of the heat-shrinkable tube and joining the conductors, wherein the sealing material constituting the sealing portion is the first.
  • the decomposition temperature of the inorganic filler is 270° C. or higher
  • the shear viscosity at 250° C. of the sealing material is 2000 Pa s or lower at a shear rate of 100/s
  • the shear viscosity at 215° C. is 7000 Pa s or higher at a shear rate of 0.01/s.
  • FIG. 1 is a schematic perspective view showing a heat shrinkable connection component according to one embodiment of the present disclosure
  • FIG. 2 is a schematic perspective view illustrating a state before inserting conductors exposed from two insulated wires into a heat-shrinkable connection component according to an embodiment of the present disclosure
  • FIG. 3 is a schematic diagram illustrating a state in which a connection portion of two insulated wires is covered with a heat-shrinkable connection component according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic perspective view showing a wire bundle connected by a heat shrinkable connection piece according to an embodiment of the present disclosure;
  • connection part of an insulated wire requires not only protection of the connection part of the insulated wire, but also high sealing performance to prevent water from entering the connection part from the outside and to maintain insulation.
  • the present disclosure has been made based on such circumstances, and aims to provide a heat-shrinkable connection part that is excellent in sealing performance as a connection part application for insulated wires.
  • a heat-shrinkable connection component is a heat-shrinkable connection component for connecting insulated wires in which a conductor is covered with an insulating layer, and includes a heat-shrinkable tube mainly composed of a first fluororesin having a melting point of 140°C or more and 250°C or less, a pair of cylindrical sealing portions disposed on the inner peripheral surfaces of both ends of the heat-shrinkable tube, and a metal member disposed between the pair of the sealing portions of the heat-shrinkable tube and joining the conductors, and forming the sealing portion.
  • the material contains a fluoropolymer containing a second fluororesin as a main component and an inorganic filler, the decomposition temperature of the inorganic filler is 270°C or higher, the shear viscosity at 250°C of the sealing material is 2000 Pa s or lower at a shear rate of 100/s, and the shear viscosity at 215°C is 7000 Pa s or higher at a shear rate of 0.01/s.
  • fluoropolymer is a component containing fluororesin and fluororubber.
  • fluoropolymer means that at least one of the hydrogen atoms bonded to the carbon atoms constituting the repeating unit of the polymer chain is substituted with a fluorine atom or an organic group having a fluorine atom (hereinafter also referred to as "fluorine atom-containing group").
  • the fluorine atom-containing group is a linear or branched organic group in which at least one hydrogen atom is substituted with a fluorine atom, and examples thereof include fluoroalkyl groups, fluoroalkoxy groups and fluoropolyether groups.
  • fluorororubber refers to a fluoropolymer having rubber elasticity, no crystals, and a heat of fusion of 0 J/g as measured by a differential scanning calorimeter.
  • both ends of the heat-shrinkable tube refers to a range of 1 ⁇ 3 or less of the length of the heat-shrinkable tube in the longitudinal direction from both ends of the heat-shrinkable tube in the longitudinal direction.
  • the first fluororesin which is the main component of the heat-shrinkable tube, has a melting point of 140°C or higher and 250°C or lower
  • the sealing material that constitutes the sealing part contains a fluoropolymer containing the second fluororesin as a main component, and an inorganic filler
  • the shear viscosity of the sealing material at 250°C is 2000 Pa ⁇ s or less at a shear rate of 100/s.
  • the shear viscosity at 215° C. of the sealing material is 7000 Pa ⁇ s or more at a shear rate of 0.01/s, dripping during aging is suppressed and durability of the sealing performance is excellent.
  • the sealing material contains an inorganic filler, the viscosity of the sealing material can be easily adjusted, and the decomposition temperature of the inorganic filler is 270 ° C. or higher, so that the durability is excellent even under conditions of thermal shrinkage at high temperatures.
  • the “decomposition temperature of the inorganic filler” in the sealing material means the temperature at which the mass reduction rate is 10% or more in thermal gravimetric analysis (TGA).
  • TGA thermal gravimetric analysis
  • the “main component” in the present disclosure means the component with the highest content, and refers to the component contained at 50% by mass or more with respect to the total mass.
  • the second fluororesin may have a melting point of 110°C or higher and 170°C or lower.
  • the sealing material has appropriate fluidity, and the effect of filling the gap is enhanced, so that the sealing performance of the heat-shrinkable connection part can be improved.
  • the content of the inorganic filler in the sealing portion may be 0.5 parts by mass or more and 10.0 parts by mass or less with respect to 100 parts by mass of the fluoropolymer.
  • the shear viscosity of the sealing material at high temperatures of 250 ° C. and 215 ° C. can be adjusted to a good range, so that the sealing performance of the heat-shrinkable connection part can be further improved.
  • the transmittance of infrared rays with a wavelength of 1 ⁇ m at the sealing portion having a thickness of 0.4 mm may be 30% or less.
  • the transmittance of infrared rays having a wavelength of 1 ⁇ m in the sealing portion is within the above range, it is possible to improve the absorption of infrared rays in the infrared heating of the heat-shrinkable connection part, and to obtain good heat shrinkage behavior of the heat-shrinkable connection part.
  • the arithmetic average roughness Sa of the inner peripheral surface and the outer peripheral surface of the sealing portion may be 0.1 ⁇ m or more and 30.0 ⁇ m or less.
  • the arithmetic mean roughness Sa is 0.1 ⁇ m or more and 30.0 ⁇ m or less, it is possible to improve the absorption of infrared rays in infrared (IR) heating when shrinking the heat-shrinkable connecting part.
  • the "arithmetic mean roughness Sa” means the arithmetic mean roughness Sa defined in ISO25178.
  • the second fluororesin may be a tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymer.
  • a tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymer having a relatively low melting point as the second fluororesin, sealing can be performed at a lower temperature.
  • the average particle size of the inorganic filler may be 10 ⁇ m or less, and the inorganic filler may be silica, hydrotalcite, organically treated layered silicate, or a combination thereof.
  • the average particle size of the inorganic filler is 10.0 ⁇ m or less, it is possible to prevent appearance defects of the sealing material.
  • the inorganic filler is silica, hydrotalcite, organically treated layered silicate, or a combination thereof, the inorganic filler has excellent heat resistance.
  • the "average particle size” means the particle size of primary particles, which is represented by the median diameter D50 of the volume particle size distribution.
  • the average particle size can be measured with a particle size distribution analyzer (for example, "MT3300II” manufactured by Microtrack Bell Co., Ltd.).
  • the first fluororesin may be an ethylene-tetrafluoroethylene copolymer.
  • the melting point of the heat-shrinkable tube can be easily controlled.
  • the first fluororesin may be a crosslinked body. Since the first fluororesin is a crosslinked body, the heat-shrinkable tube can be improved in shape retention at high temperatures after shrinkage.
  • the “crosslinked body” in the present disclosure refers to a product obtained by irradiating the first fluororesin with radiation to at least partially form a three-dimensional crosslinked structure and curing the same.
  • the heat-shrinkable connection part is a heat-shrinkable connection part for connecting a plurality of insulated wires each having a conductor covered with an insulating layer.
  • FIG. 1 is a schematic perspective view showing a heat shrinkable connection component according to one embodiment of the present disclosure; FIG. As shown in FIG. 1, the heat-shrinkable connection component 50 includes a heat-shrinkable tube 1, a pair of sealing portions 3 provided on the inner peripheral surface of both ends of the heat-shrinkable tube 1, and a metal member 2 provided on the inner peripheral surface between the pair of the sealing portions 3 of the heat-shrinkable tube 1 and joining the conductors.
  • the heat-shrinkable tube 1 is used as a covering material for protecting an object to be covered.
  • the heat-shrinkable tube 1 is a tube whose diameter is reduced by being heated. More specifically, the heat-shrinkable tube 1 into which the object to be covered is inserted is heated on the object to be covered, and the object to be covered is covered with the shrinkable body of the heat-shrinkable tube 1, thereby protecting the object to be covered.
  • the heat-shrinkable tube 1 of FIG. 1 is composed of a cylindrical single-layer base material layer.
  • the heat-shrinkable tube 1 is used, for example, as a coating for protecting, insulating, waterproofing, and preventing corrosion of connecting parts between objects to be coated, terminals of wiring, metal pipes, and the like.
  • the main component of the heat-shrinkable tube 1 is the first fluororesin.
  • the heat-shrinkable tube 1 has excellent heat resistance and insulating properties and can be extruded by using the first fluororesin described later as a main component.
  • the lower limit of the melting point of the first fluororesin is 140°C, and may be 200°C. If the melting point of the first fluororesin is less than the above lower limit, the heat-shrinkable tube 1 may soften or deform when used at high temperatures.
  • the upper limit of the melting point of the first fluororesin is 250°C, and may be 240°C. If the melting point of the first fluororesin exceeds the above upper limit, the shrinkage temperature of the manufactured heat-shrinkable tube 1 becomes high, which may cause thermal damage to the object to be covered. In the heat-shrinkable connection component 50, the melting point of the first fluororesin is within the above range, so that heat resistance can be ensured and damage to the covered object due to heat can be suppressed.
  • Examples of the first fluororesin having a melting point of 140°C to 250°C include polyvinylidene fluoride (PVDF, melting point 155°C to 172°C), tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymer (THV, melting point 115°C to 225°C), ethylene-tetrafluoroethylene copolymer (ETFE, melting point 215°C to 250°C), and polychlorotrifluoroethylene (PCTFE, melting point 22°C). 0°C).
  • PVDF polyvinylidene fluoride
  • TSV tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymer
  • EFE ethylene-tetrafluoroethylene copolymer
  • PCTFE polychlorotrifluoroethylene
  • the first fluororesin may be a crosslinked product. Since the first fluororesin is a crosslinked body, the heat-shrinkable tube 1 can be improved in shape retention at a high temperature after being shrunk.
  • the average inner diameter and average thickness of the heat-shrinkable tube 1 are appropriately selected according to the application.
  • the average inner diameter of the heat-shrinkable tube 1 before heat shrinkage can be, for example, 1 mm or more and 60 mm or less.
  • the average inner diameter of the heat-shrinkable tube 1 after heat shrinkage can be, for example, 25% or more and 65% or less of the average inner diameter before heatshrinkage.
  • the average thickness of the heat-shrinkable tube 1 can be, for example, 0.1 mm or more and 5 mm or less.
  • the heat-shrinkable tube 1 may contain other additives as necessary.
  • additives include strength retention agents, antioxidants, flame retardants, copper damage inhibitors, cross-linking aids, colorants, heat stabilizers, infrared absorbers, and ultraviolet absorbers.
  • the content of the additive in the heat-shrinkable tube 1 may be less than 5% by mass or less than 3% by mass. If the content of the additive is more than the above upper limit, the performance of the heat-shrinkable tube 1 may easily vary.
  • the sealing portion 3 is made of a sealing material.
  • the sealing material forming the sealing portion 3 contains a fluoropolymer containing the second fluororesin as a main component and an inorganic filler. Since the sealing material contains a fluoropolymer to be described later, it is excellent in heat resistance and insulation. In addition, since the sealing material contains an inorganic filler, the viscosity of the sealing material can be easily adjusted, and the thickness of the sealing portion 3 can be made uniform.
  • the fluoropolymer contains a second fluororesin as a main component.
  • the lower limit of the melting point of the second fluororesin which is the main component of the fluoropolymer, may be 110°C or 115°C. If the melting point of the second fluororesin is less than the above lower limit, the softening is accelerated and the encapsulating material may be eluted.
  • the upper limit of the melting point of the second fluororesin may be 170°C or 165°C. If the melting point of the second fluororesin exceeds the above upper limit, the softening is delayed, and the end of the heat-shrinkable tube 1 cannot be sealed.
  • the melting point of the second fluororesin is within the above range, so that the sealing material has appropriate fluidity and the effect of filling the gap is enhanced, so that the heat-shrinkable connection component 50 can be sealed.
  • tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymer TSV, melting point 115°C to 225°C
  • PVDF polyvinylidene fluoride
  • a tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymer which has a relatively low melting point and thus can be sealed at a lower temperature and has good adhesive strength, is preferable.
  • the fluoropolymer may contain, as components other than the second fluororesin, fluororubbers such as vinylidene fluoride rubber (FKM), tetrafluoroethylene-propylene rubber (FEPM), and tetrafluoroethylene-perfluoromethyl vinyl ether rubber (FFKM).
  • fluororubbers such as vinylidene fluoride rubber (FKM), tetrafluoroethylene-propylene rubber (FEPM), and tetrafluoroethylene-perfluoromethyl vinyl ether rubber (FFKM).
  • the decomposition temperature of the inorganic filler is 270°C or higher.
  • the decomposition temperature of the inorganic filler is 270° C. or higher, the durability is excellent even under conditions of heat shrinkage at high temperatures.
  • examples of inorganic fillers having a decomposition temperature of 270°C or higher include silica (decomposition temperature 1900°C), hydrotalcite (decomposition temperature 400°C), organically treated layered silicate (decomposition temperature 350°C), titanium oxide (decomposition temperature 1860°C), and clay (decomposition temperature 350°C).
  • the inorganic filler is preferably silica, hydrotalcite, organically treated layered silicate, or a combination thereof.
  • the upper limit of the average particle size of the inorganic filler may be 10.0 ⁇ m or 8.0 ⁇ m.
  • the average particle size of the inorganic filler is 10.0 ⁇ m or less, it is possible to prevent appearance defects of the sealing material.
  • the lower limit of the content of the inorganic filler in the sealing material may be 0.5 parts by mass, 1.0 parts by mass, or 1.5 parts by mass with respect to 100 parts by mass of the fluoropolymer. If the content of the inorganic filler is less than 0.5 parts by mass, there is a possibility that a sufficient effect of improving the shear viscosity of the encapsulant cannot be obtained.
  • the upper limit of the content of the inorganic filler in the sealing material may be 10.0 parts by mass, 8.0 parts by mass, or 7.0 parts by mass with respect to 100 parts by mass of the fluoropolymer. If the content of the inorganic filler is more than 10.0 parts by mass, the shear viscosity of the sealing material may become too high and the sealing performance of the heat-shrinkable connection component 50 may deteriorate.
  • Organically treated layered silicates are organically treated layered silicates (clay minerals, clay) such as montmorillonite, bentonite, and smectite. Interlayer cations such as magnesium ions, sodium ions and calcium ions are present between the layered silicate planes to maintain the layered crystal structure.
  • the intermediate layer cations are ion-exchanged with organic cations. In this way, the organic compound is chemically bonded to the surfaces of the silicate planes and introduced (intercalated) between the layers, thereby increasing the interlayer distance between the silicate planes and improving the dispersibility in the thermoplastic resin. Both natural products and synthetic products can be used as layered silicates.
  • the sealing material can contain other components such as a colorant, an antioxidant, an infrared absorber, and a lubricant.
  • titanium oxide may be used as a coloring agent that reduces infrared transmittance.
  • the content of titanium oxide may be 0.1 parts by mass or more and 0.5 parts by mass or less with respect to 100 parts by mass of the fluoropolymer.
  • the lower limit of the shear viscosity of the sealing material at 250°C and a shear rate of 100/s may be 500 Pa ⁇ s or 1000 Pa ⁇ s. If the shear viscosity of the sealing material at 250° C. and a shear rate of 100/s is lower than 500 Pa s, the heat-shrinkable tube 1 softens and changes its shape easily when it shrinks.
  • the upper limit of the shear viscosity of the sealing material at 250° C. and a shear rate of 100/s is 2000 Pa ⁇ s, and may be 1500 Pa ⁇ s. If the shear viscosity of the sealing material at 250° C.
  • the shear viscosity of the sealing material at 250° C. is 2000 Pa s or less at a shear rate of 100/s, so that gaps are less likely to occur when the heat-shrinkable tube 1 is shrunk, and the heat-shrinkable connection component 50 has excellent sealing accuracy.
  • the sealing material may have a shear viscosity of 4000 Pa ⁇ s or more and 50000 Pa ⁇ s or less at a shear rate of 0.01/s at 250°C. If the shear viscosity at 250° C. and a shear rate of 0.01/s is lower than 4000 Pa ⁇ s, the sealing material tends to flow when kept at a high temperature for a long period of time, making it difficult to maintain sealing properties. If the shear viscosity at 250° C. and a shear rate of 0.01/s is higher than 50000 Pa ⁇ s, the fluidity of the sealing material is low, so the effect of filling gaps is reduced, and the sealing performance may be reduced.
  • the lower limit of the shear viscosity of the sealing material at 215°C and a shear rate of 0.01/s is 7000 Pa ⁇ s, and may be 30000 Pa ⁇ s. If the shear viscosity of the sealing material at 215° C. and a shear rate of 0.01/s is lower than 7000 Pa s, the sealing material tends to flow when kept at a high temperature for a long period of time, and the sealing property may not be maintained.
  • the upper limit of the shear viscosity of the sealing material at 215° C. and a shear rate of 0.01/s may be 80000 Pa ⁇ s or 50000 Pa ⁇ s.
  • the heat-shrinkable connection part 50 has a shear viscosity of 7000 Pa ⁇ s or more at a shear rate of 0.01/s in the sealing material at 215° C., thereby suppressing dripping during aging and excellent in sealing performance durability.
  • the sealing material may have a shear viscosity of 1000 Pa ⁇ s or more and 3000 Pa ⁇ s or less at a shear rate of 100/s at 215°C. If the shear viscosity of the sealing material at 215° C. and a shear rate of 100/s is lower than 1000 Pa s, the heat-shrinkable tube 1 softens and changes its shape easily when contracted, and gaps are likely to occur. If the shear viscosity of the sealing material at 215° C. and a shear rate of 100/s is higher than 3000 Pa s, the fluidity of the heat-shrinkable tube 1 will be low when it is shrunk.
  • the transmittance of infrared rays with a wavelength of 1 ⁇ m at the sealing portion 3 having a thickness of 0.4 mm may be 30% or less. If the infrared transmittance of the sealing portion 3 exceeds 30%, the heating of the sealing portion 3 is slowed during infrared heating, making it difficult for softening to proceed, so the sealing performance of the heat-shrinkable connection component 50 may be reduced.
  • the transmittance of infrared rays having a wavelength of 1 ⁇ m in the sealing portion 3 is 30% or less, the absorption of infrared rays in the infrared heating of the heat-shrinkable connection component 50 can be improved, and the sealing property of the heat-shrinkable connection component 50 can be improved.
  • the lower limit of the arithmetic mean roughness Sa of the inner and outer peripheral surfaces of the sealing portion 3 may be 0.1 ⁇ m. If the arithmetic mean roughness Sa of the inner peripheral surface and the outer peripheral surface of the sealing portion 3 is less than 0.1 ⁇ m, the sealing materials tend to adhere to each other during the manufacturing process, which may lead to manufacturing defects.
  • the upper limit of the arithmetic mean roughness Sa may be 30.0 ⁇ m or 29.0 ⁇ m. If the arithmetic average roughness Sa exceeds 30.0 ⁇ m, it may be difficult to dispose the sealing material in the heat-shrinkable tube 1 during manufacturing or to insert electric wires into the heat-shrinkable connecting part 50 during use.
  • the metal member 2 is arranged between a pair of sealing portions 3 in the heat-shrinkable tube 1 and joins the conductors of the insulated wires.
  • Examples of the metal member 2 include solder, braided solder, and crimp sleeve.
  • any of Sn, Sb, Pb, Bi, Ag, Cu, Ni, In, Ge, P, and Zn can be used as a metal material forming the metal member 2 in combination.
  • Sn--Ag, Sn--Cu, Sn--Sb, Sn--Pb, and Pb--In may be included in terms of melting point adjustment.
  • the metal material can contain flux.
  • the metal material constituting the metal member 2 may be, for example, Cu, Fe, Sn, Sb, Ag, Ni, Al, Zn, or a combination thereof. Braided solder can be further combined with the above solder.
  • any one of Cu, Fe, Sn, Sb, Ag, Ni, Al, and Zn can be used singly or in combination of two or more as the metal material constituting the metal member 2.
  • a coating layer can be formed on the surface to suppress wear and scratches and improve chemical durability. Any of Cu, Fe, Sn, Sb, Ag, Ni, Al, and Zn can be used singly or in combination of two or more for the coating layer.
  • the melting point of the metal member 2 may be 210°C or higher and 240°C or lower, or may be 220°C or higher and 230°C or lower. Since the melting point of the metal member 2 is 210° C. or higher and 240° C. or lower, the heat shrinkable tube 1, the metal member 2, and the sealing portion 3 are combined to improve the heat resistance, sealing performance, and insulated wire connectivity of the heat shrinkable connection component 50.
  • the heat-shrinkable connection part it is possible to provide a heat-shrinkable connection part with excellent sealing performance as a connection part for insulated wires.
  • a method for manufacturing a heat-shrinkable connecting component comprises a step of extruding a resin composition containing a first fluororesin as a main component into a tubular shape (extrusion molding step), a step of expanding the diameter of the tubular extrusion-molded product (diameter-enlarging step), a step of producing a sealing portion (sealing portion-producing step), a step of arranging a pair of sealing portions on the inner peripheral surfaces of both ends of the heat-shrinkable tube formed after the diameter-expanding step (sealing portion-arranging step), and an inner peripheral surface between the pair of sealing portions of the heat-shrinkable tube.
  • the method for producing the heat-shrinkable joint component includes a step of arranging a pair of sealing portions composed of a sealing material having a shear viscosity of 2000 Pa s or less at a shear rate of 100/s at 250°C and a shear viscosity of 7000 Pa ⁇ s or more at a shear rate of 0.01/s at 215°C on the inner peripheral surfaces of both ends of the heat-shrinkable tube. .
  • a resin composition for forming a heat-shrinkable tube is prepared by mixing the first fluororesin, which is the resin component of the heat-shrinkable tube, with other additives, if necessary, using a melt mixer or the like.
  • the melting point can be controlled by selecting the first fluororesin and adjusting the crosslinking.
  • the melt mixer is not particularly limited, and for example, an open roll mixer, a Banbury mixer, a pressure kneader, a single screw mixer, or a multi-screw mixer can be used.
  • the resin composition containing the first fluororesin as a main component is extruded into a tubular shape.
  • the above resin composition is extruded using a melt extruder. Specifically, the resin composition is melted by heating to a temperature above the melting point, eluted from an extrusion die having a cylindrical space, cooled to below the melting point with cooling water or the like and solidified, thereby extruding the resin composition into a tubular shape.
  • the tubular extruded product formed by the above extrusion molding process may be crosslinked by irradiation.
  • irradiation By cross-linking the tube formed by the extrusion molding process, the shrinkability (shape memory effect) when heat-shrinking at high temperature after the expansion process and the shape retention at high temperature after shrinkage are imparted.
  • Radiation used for irradiation crosslinking includes electron beams ( ⁇ -rays), ⁇ -rays, and the like.
  • the extruded product is diameter-expanded.
  • a known diameter-expanding method that is commonly used for producing conventional heat-shrinkable tubes can be used. For example, a method of introducing compressed air into the inside of an extruded article heated to a temperature above the melting point, a method of depressurizing from the outside, a method of inserting a metal rod into the inside, etc. After expanding the diameter to a predetermined inner diameter, a method of cooling and fixing the shape is used.
  • a heat-shrinkable tube is obtained by fixing the shape of the expanded extruded product.
  • this fixing method include a method of cooling to a temperature below the melting point of the base resin component.
  • the roughness of the metal rod can be reduced, or coating or lubricant can be applied.
  • the influence on the surface roughness of the inner surface of the heat-shrinkable tube can be reduced.
  • a heat-shrinkable tube is obtained by expanding the diameter of the extruded product and fixing the shape in this manner.
  • a sealing material for forming a sealing portion is prepared by mixing a fluoropolymer containing a second fluororesin as a main component, an inorganic filler, and, if necessary, other additives using a melt mixer or the like.
  • the melt mixer is not particularly limited, and for example, an open roll mixer, a Banbury mixer, a pressure kneader, a single screw mixer, or a multi-screw mixer can be used.
  • the sealing material is extruded using a melt extruder. Specifically, the sealing material is heated to a temperature equal to or higher than the melting point of the fluoropolymer, melted, and eluted from an extrusion die having a cylindrical space. Then, the encapsulating material is extruded into a tubular shape by cooling with cooling water or the like to a temperature below the melting point and solidifying. A ring-shaped sealing portion is produced by cutting it to a predetermined length.
  • the heat-shrinkable tube formed after the diameter-expanding step is cut to a desired length, and a pair of sealing portions are provided on the inner peripheral surfaces of both ends of the cut heat-shrinkable tube (sealing portion providing step). Then, a metal member for joining the conductor is arranged on the inner peripheral surface between the pair of sealing portions of the heat-shrinkable tube (metal member arrangement step).
  • the heat-shrink connecting part 50 is used, for example, as a part for connecting a plurality of insulated wires, and as a part for attaching a ground wire for grounding insulated wires.
  • a mode of connecting a plurality of insulated wires using the heat-shrinkable connection part 50 a method of connecting conductors exposed from two insulated wires will be described with reference to FIGS. 2 to 4. Note that the number and configuration of the insulated wires are not limited to those shown in FIGS.
  • the process of connecting a plurality of insulated wires using the heat-shrinkable connection part 50 mainly includes a heat-shrinkable connection part covering process and a heat-shrinkable connection part heating process.
  • a heat-shrinkable connection part covering process and a heat-shrinkable connection part heating process.
  • Thermal contraction connecting part covering process When connecting two insulated wires 8 and 18 using the heat-shrinkable connection part 50, first, as shown in FIG. In the heat-shrink connecting part covering step, as shown in FIG. 3, the heat-shrink connecting part 50 is covered so as to cover the boundary between the exposed portion of the conductor 6 and the insulating layer 7 and the boundary between the exposed portion of the conductor 16 and the insulating layer 17.
  • the conductor connection portion 5 around the boundary between the exposed conductor 6 of the insulated wire 8 and the exposed conductor 16 of the insulated wire 18 is preferably arranged so as to be covered with the metal member 2.
  • the heat-shrinkable connection component 50 is heated and thermally shrunk.
  • the heating method include a method of heating the heat-shrinkable connection component 50 with a heat gun or the like.
  • the heating temperature is determined by the heat shrinkage temperature of the heat shrinkable connection component 50, and is, for example, 200° C. or higher and 600° C. or lower.
  • the heating time may be any time that the heat-shrinkable connection component 50 is sufficiently shrunk, and can be, for example, 1 second or more and 300 seconds or less.
  • FIG. 4 is a schematic perspective view showing the wire bundle 100 connected by the heat-shrinkable connection part 50.
  • FIG. 4 shows the heat-shrinkable tube 11 after shrinkage, the metal member 12 made of solder after melting, and the sealing portion 13 after melting in the wire bundle 100 .
  • the melted sealing material of the sealing portion 3 closes the opening of the heat-shrinkable tube 1 . Therefore, the metal material forming the metal member 2 is prevented from flowing out from the opening of the heat-shrinkable tube 1 .
  • a heat-shrinkable tube was produced by extrusion using a resin composition obtained by mixing ethylene-tetrafluoroethylene copolymer (ETFE, melting point 225°C) or polyvinylidene fluoride (PVDF, melting point 165°C) with triallyl isocyanurate as a cross-linking aid.
  • An extrusion die was used for extrusion. Extrusion was performed at a die temperature of 240° C. and a line speed of 10 m/min. Next, the molded body extruded by this molding die was irradiated with radiation at a dose of 90 kGy.
  • the extruded product obtained in this way was expanded by a diameter expanding device and the shape was fixed to obtain a No. 4 with an outer diameter of 4.4 mm and an inner diameter of 2.6 mm.
  • a heat-shrinkable tube of No. 1 was obtained.
  • a heat-shrinkable tube, a solder material (Sn 96.0% by mass, Ag 3.0% by mass, and Cu 1.0% by mass) having a melting point of 223°C, and a sealing material were used to form a ring-shaped solder at the center in the longitudinal direction of the metal rod and a ring-shaped sealing portion at each end.
  • Table 1 shows the composition and content of the fluoropolymer and the inorganic filler in the sealing material. "-" indicates that the corresponding component was not used.
  • a lead wire was placed so that the tip of the lead wire came to the soldered portion, and a heat-shrinkable tube was placed around the periphery. Then, hot air of 500° C.
  • a heat-shrinkable connection part of No. 1 was made.
  • the tube length was 20 mm.
  • the sealing portion had a width of 2 mm and a thickness of 0.4 mm.
  • the solder had a width of 2.5 mm and a thickness of 0.4 mm.
  • shear viscosity The shear viscosities of the sealants at 215° C. and 250° C. were measured using a rotary rheometer (“MCR302” manufactured by Anton Paar) using a jig PP-12.
  • the sealed portion was formed into a sheet with a thickness of 0.40 mm, and absorbance at a wavelength of 1 ⁇ m was measured using a UV-3600 spectrophotometer manufactured by Shimadzu Corporation using an integrating sphere.
  • the arithmetic mean roughness Sa defined by ISO25178 on the inner and outer peripheral surfaces of the sealing portion was measured with a LEXT OLS4100 laser microscope manufactured by Olympus.
  • the leakage current after shrinkage at 250° C. was evaluated by placing a crimping sleeve and a heat-shrinkable connection part on the part where the insulating layer of the ETFE insulated wire was removed, and placing the tip of the lead wire in the removed part by crimping and fixing the crimping sleeve part with a crimping tool.
  • the crimping sleeve used was a copper substrate plated with nickel having a thickness of 8 ⁇ m and a length of 15 mm.
  • the solution to be immersed was a solution of 5% by mass NaCl and 0.5% by mass surfactant, and a voltage of 1 kV was applied for 60 seconds to evaluate leakage current.
  • Table 1 shows the evaluation results of the performance of the heat-shrinkable connection part.
  • the evaluation criteria for the performance of heat-shrinkable joints are as follows. If the evaluation is A or B, it is good. A: Pass rate of leakage current test is 90% or more. B: Pass rate of leakage current test is 80% or more. C: The passing rate of the leakage current test is less than 80%.
  • the performance of the heat-shrinkable connecting part was evaluated by placing the crimping sleeve and the heat-shrinkable connecting part on the part where the insulation layer of the ETFE insulated wire was removed, placing the tip of the lead wire in the removed part, fixing the crimping sleeve part by crimping with a crimping tool, then heat shrinking, applying a voltage in the solution, and determining whether the leakage current was below the threshold.
  • the crimping sleeve used was a copper substrate plated with nickel having a thickness of 8 ⁇ m and a length of 15 mm. In order to evaluate the durability under high temperature, the electric wire after contraction was heated at 215° C.
  • the solution to be immersed was a solution of 5% by mass NaCl and 0.5% by mass surfactant, and a voltage of 1 kV was applied for 60 seconds to evaluate leakage current.
  • Table 1 shows the evaluation results of the performance of the heat-shrinkable connection part. The evaluation criteria for the performance of heat-shrinkable joints are as follows. If the evaluation is A or B, it is good. A: Pass rate of leakage current test is 90% or more. B: Pass rate of leakage current test is 80% or more. C: The passing rate of the leakage current test is less than 80%.
  • Table 1 shows the evaluation results of the shear viscosity of the sealing material at 215 ° C. and 250 ° C., the infrared transmittance at a sealing portion thickness of 0.4 mm, the arithmetic average roughness Sa on the inner and outer peripheral surfaces of the sealing portion, the leakage current test after shrinkage at 250 ° C., and the leakage current test after holding at 215 ° C.
  • the sealing material As shown in Table 1, using a sealing material containing an inorganic filler having a THV and a decomposition temperature of 270° C. or higher, the sealing material has a shear viscosity at 250° C. of 2000 Pa s or less at a shear rate of 100/s and a shear viscosity at 215° C. of 7000 Pa s or more at a shear rate of 0.01/s. 1 to No. 14, No. 17 and No. No. 18 gave good results in the leakage current test at 250°C, which is the shrinking temperature of the heat-shrinkable tube, and in the leakage current test after being kept at 215°C for a long period of time. On the other hand, the No.
  • the 2 sealing material has a shear viscosity at 215° C. of less than 7000 Pa ⁇ s at a shear rate of 0.01/s.
  • No. 15 has a low leakage current evaluation after being held at 215° C., dripping occurs during aging, and the durability of the sealing performance decreases.
  • the No. 1 sealing material has a shear viscosity at 250° C. of 2000 Pa ⁇ s or more at a shear rate of 100/s.
  • the evaluation of leakage current after shrinking at 250 ° C. and leakage current after holding at 215 ° C. is low, and the durability of sealing performance due to deterioration of sealing performance during shrinkage of the heat shrinkable tube and dripping during aging.

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  • Insulating Bodies (AREA)

Abstract

Un composant de connexion thermorétractable (50) selon un mode de réalisation de la présente divulgation est destiné à connecter une ligne électrique isolée (8, 18) dans laquelle un conducteur (6, 16) est recouvert par une couche isolante (7, 17), le composant comprenant : un tube thermorétractable (1) qui possède une première résine fluorée ayant un point de fusion de 140 à 250 °C en tant que constituant principal ; une paire de parties d'étanchéité cylindriques (3) disposées sur la surface périphérique interne de deux sections d'extrémité du tube thermorétractable ; et un élément métallique (2) qui est disposé entre la paire de parties d'étanchéité dans le tube thermorétractable et qui relie les conducteurs. Le matériau d'étanchéité qui forme les parties d'étanchéité contient un polymère de fluor avec une seconde résine fluorée en tant que constituant principal et une charge inorganique ; la température de décomposition de la charge inorganique est de 270 °C ou plus ; la viscosité de cisaillement du matériau d'étanchéité à 250 °C à une vitesse de cisaillement de 100/s est de 2000 Pa∙s ou moins ; et la viscosité de cisaillement du matériau d'étanchéité à 215 °C à une vitesse de cisaillement de 0,01/s est d'au moins 7000 Pa∙s.
PCT/JP2022/038994 2022-01-21 2022-10-19 Composant de connexion thermorétractable WO2023139861A1 (fr)

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JP2022008306 2022-01-21

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014073637A (ja) * 2012-10-04 2014-04-24 Sumitomo Electric Fine Polymer Inc 熱収縮チューブ
WO2016174962A1 (fr) * 2015-04-28 2016-11-03 住友電気工業株式会社 Article de récupération de chaleur, procédé de fabrication d'un article de récupération de chaleur, épissure de fils et faisceau de conducteurs
WO2017122601A1 (fr) * 2016-01-14 2017-07-20 住友電気工業株式会社 Composant de récupération thermique, faisceau de fils et procédé de recouvrement de fil isolé
JP2017213794A (ja) * 2016-06-01 2017-12-07 住友電工ファインポリマー株式会社 熱収縮チューブ、その製造方法及びソルダースリーブ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014073637A (ja) * 2012-10-04 2014-04-24 Sumitomo Electric Fine Polymer Inc 熱収縮チューブ
WO2016174962A1 (fr) * 2015-04-28 2016-11-03 住友電気工業株式会社 Article de récupération de chaleur, procédé de fabrication d'un article de récupération de chaleur, épissure de fils et faisceau de conducteurs
WO2017122601A1 (fr) * 2016-01-14 2017-07-20 住友電気工業株式会社 Composant de récupération thermique, faisceau de fils et procédé de recouvrement de fil isolé
JP2017213794A (ja) * 2016-06-01 2017-12-07 住友電工ファインポリマー株式会社 熱収縮チューブ、その製造方法及びソルダースリーブ

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