WO2023123912A1 - 电镀装置 - Google Patents

电镀装置 Download PDF

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Publication number
WO2023123912A1
WO2023123912A1 PCT/CN2022/100156 CN2022100156W WO2023123912A1 WO 2023123912 A1 WO2023123912 A1 WO 2023123912A1 CN 2022100156 W CN2022100156 W CN 2022100156W WO 2023123912 A1 WO2023123912 A1 WO 2023123912A1
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WIPO (PCT)
Prior art keywords
suction
plated
hole
suction pipe
electroplating device
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PCT/CN2022/100156
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English (en)
French (fr)
Inventor
袁继旺
余锦玉
刘梦茹
杨海云
纪成光
Original Assignee
生益电子股份有限公司
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Application filed by 生益电子股份有限公司 filed Critical 生益电子股份有限公司
Publication of WO2023123912A1 publication Critical patent/WO2023123912A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/026—Electroplating of selected surface areas using locally applied jets of electrolyte

Definitions

  • the present application relates to the technical field of electroplating, for example, to an electroplating device.
  • the holes to be plated on the circuit board need to be electroplated.
  • the requirements for the precision of circuit board manufacturing are getting higher and higher, so the requirements for the deep plating effect of the plated holes are also higher and higher, that is, the electroplating device needs to have better deep plating ability.
  • the PCB electroplating device in the related art is provided with a suction pipe and a nozzle at one side of the PCB, so that there is a pressure difference at the orifice of the hole to be plated, so as to realize the diffusion of the plating solution in the hole to be plated, so that the electroplating device has the ability to treat Plated holes are capable of deep plating. But the above-mentioned electroplating device only has better deep plating ability when the aspect ratio of the hole to be plated is small.
  • the aspect ratio of the hole to be plated on the circuit board is high, the pressure difference at the hole to be plated cannot make the hole to be plated The plating solution inside is effectively diffused, resulting in the difficulty of coating the holes to be plated with high aspect ratios, that is, the electroplating device in the related art does not have good deep plating ability for the holes to be plated with high aspect ratios.
  • the present application provides an electroplating device, which can solve the problem of poor deep plating ability of the electroplating device in the related art when electroplating circuit boards with high aspect ratio holes to be plated.
  • An electroplating device which is configured to electroplate a PCB, the PCB is provided with a hole to be plated along a first direction, and the hole to be plated is divided into a first hole to be plated and a second hole to be plated, and the first hole to be plated Arranged alternately with the second holes to be plated along the second direction, including:
  • the electroplating tank is set to accommodate the plating solution; the PCB and two anode plates are arranged in the electroplating tank, the PCB is arranged between the two anode plates, and the two anode plates are connected to the two anode plates PCB electrical connection;
  • the spray suction assembly includes a suction pipe and a nozzle, the nozzle and the suction pipe are arranged between the anode plate and the PCB, and the nozzle and the suction pipe are arranged opposite to the openings of the holes to be plated
  • the spray pipe is set to spray the plating solution into the first hole to be plated; the suction pipe is set to suck back the plating solution in the second hole to be plated;
  • the straws include:
  • the straw body is tubular and extends along the third direction
  • the wedge-shaped suction opening is arranged on the suction pipe body along the third direction and communicates with the suction pipe body.
  • the end of the wedge-shaped suction suction opening away from the suction pipe body is larger than the wedge-shaped suction suction opening near the suction pipe body one end of the wedge-shaped back-suction port;
  • the end of the wedge-shaped back-suction port away from the suction pipe body is provided with a plurality of return ports at intervals along the second direction, and the return ports extend along the third direction;
  • Two pairs of the first direction, the second direction and the third direction are arranged perpendicular to each other.
  • openings are provided on the suction pipe body along the third direction, deflectors are provided on both sides of the opening width direction on the suction pipe body, and the two deflectors are in the shape of The included angle is set, and the end cover of the two deflectors away from the opening is provided with a sealing plate, and a plurality of the return ports are spaced apart along the second direction on the sealing plate, and the sealing plate A plurality of the recirculation ports, two of the deflectors, and the openings form the wedge-shaped recirculation ports.
  • the width of the opening is 10mm-30mm.
  • the width of each reflow port is 3mm-8mm.
  • the angle range between the two deflectors is 100°-110°.
  • the electroplating device includes multiple sets of the suction suction assembly, and the multiple sets of suction suction assemblies are divided into a first suction suction assembly and a second suction suction assembly, and the first suction suction assembly
  • the nozzle and the suction pipe in the PCB are arranged opposite to the opening of the hole to be plated on one side of the PCB;
  • the orifices of the holes to be plated on one side are oppositely arranged.
  • the first pump is connected to a plurality of the nozzles through a PVC hose; the second pump is connected to a plurality of the suction pipes through a PVC hose.
  • the multiple nozzles and the multiple suction tubes located on the same side are arranged alternately along the second direction.
  • the above electroplating device also includes a swing mechanism, the swing mechanism is arranged on the side wall of the electroplating tank, the spray suction assembly is arranged at the output end of the swing mechanism, and the swing mechanism is set To drive the suction assembly to reciprocate along the second direction.
  • the swing mechanism includes:
  • a slide rail is arranged on the side wall of the electroplating tank along the second direction, and the suction assembly is arranged on the slide rail;
  • a driving part the output end of the driving part is connected with the suction assembly, and the driving part is configured to drive the suction assembly to slide on the slide rail.
  • the electroplating device provided by the present application includes a spray suction assembly, and the spray suction assembly includes a suction pipe and a nozzle.
  • the nozzle and the suction pipe are arranged between one of the anode plates and the PCB.
  • the tube is arranged to spray plating solution into the first hole to be plated, so that a positive pressure is generated in the area between the spray tube and the first hole to be plated.
  • the suction pipe is set to suck back the plating solution in the second hole to be plated, so that the area between the suction pipe and the second hole to be plated generates a negative pressure, thereby generating a pressure difference, and realizes the exchange of the plating solution in the first hole to be plated.
  • Negative pressure is also generated inside the second hole to be plated, so that a pressure difference is also formed inside and outside the second hole to be plated, so that the plating solution diffuses in the second hole to be plated.
  • the suction pipe includes a suction pipe body and a wedge-shaped suction port arranged on the suction pipe body along the third direction. The end of the wedge-shaped suction port away from the suction pipe body is provided with multiple return ports at intervals along the second direction. The setting of multiple return ports increases the connection between the suction pipe and the second The negative pressure in the area between the two to-be-plated holes enables the plating solution to flow more quickly, so that the electroplating device also has better deep-plating ability when targeting high-aspect-ratio to-be-plated holes.
  • Fig. 1 is the schematic structural view of the jet suction assembly in the embodiment of the present application
  • Fig. 2 is an enlarged view of point A in Fig. 1 .
  • a first feature being "on” or “under” a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them.
  • “above”, “above” and “above” the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.
  • “Below”, “beneath” and “under” the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.
  • present embodiment provides a kind of electroplating device, and this electroplating device is set to electroplating PCB3, and PCB3 is provided with to-be-plated holes along the first direction (that is, the X direction in the accompanying drawing), and to be plated
  • the holes are divided into first holes to be plated and second holes to be plated, and the first holes to be plated and the second holes to be plated are alternately arranged along the second direction (ie, the Y direction in the drawing).
  • the electroplating device comprises an electroplating tank which is arranged to accommodate the plating solution, a PCB3 and two anode plates 4 are arranged in the electroplating tank, the PCB3 is arranged between the two anode plates 4, and the two anode plates 4 are electrically connected to the PCB3, so Realize the electroplating of PCB3.
  • the distance between the PCB 3 and the anode plate 4 is adjustable, so as to be adaptively adjusted according to actual working conditions, so that the electroplating device maintains a good deep plating capability.
  • the distance between the PCB 3 and the anode plate 4 is in the range of 200mm-300mm.
  • the electroplating device also includes a spray suction assembly, which includes a suction pipe 2 and a nozzle 1, the nozzle 1 and the suction pipe 2 are arranged between the anode plate 4 and the PCB3, and the nozzle 1 and the suction pipe 2 are arranged opposite to the openings of the holes to be plated.
  • the spray pipe 1 is set to spray the plating solution into the first hole to be plated, so that a positive pressure is generated in the area between the spray pipe 1 and the first hole to be plated.
  • the suction pipe 2 is set to recover the plating solution between the suction pipe 2 and the second hole to be plated, so that a negative pressure is generated in the area between the suction pipe 2 and the second hole to be plated.
  • the region between nozzle 1 and the first hole to be plated and the area between the suction pipe 2 and the second hole to be plated form a pressure difference, realizing the exchange of plating solution in the first hole to be plated. Negative pressure is also generated inside the second hole to be plated, so that a pressure difference is also formed inside and outside the second hole to be plated, so that the plating solution diffuses in the second hole to be plated.
  • the suction pipe 2 includes a suction pipe body 22 and a wedge-shaped suction port 21.
  • the suction pipe body 22 is tubular and extends along the third direction (ie, the Z direction in the drawings).
  • the wedge-shaped suction port 21 is arranged on the suction pipe body 22 along the third direction, and is connected with The straw body 22 communicates with each other.
  • the end of the wedge-shaped back-suction port 21 away from the suction pipe body 22 is larger than the end of the wedge-shaped back-suction port 21 close to the suction pipe body 22; the end of the wedge-shaped back-suction port 21 away from the suction pipe body 22 is provided with a plurality of return ports 2121 at intervals along the second direction, and the return ports 2121 are arranged along the second direction. Extend in three directions.
  • the arrangement of multiple return ports 2121 increases the negative pressure in the area between the suction pipe and the second hole to be plated, so that the plating solution can flow more quickly, so that the electroplating device also has a relatively high efficiency when targeting the hole to be plated with a high aspect ratio. Good deep plating ability.
  • the first direction, the second direction and the third direction are arranged perpendicular to each other.
  • the hole to be plated in this embodiment is a blind hole, and the above flow process of the plating solution is only for the blind hole.
  • the hole to be plated can also be a through hole, the two ends of the through hole are all provided with a spray suction assembly, one end of the through hole is provided with the nozzle pipe 1 of the spray suction assembly, and the other end is provided with a suction pipe 2, and the nozzle pipe 1 can make the area of the through hole close to the nozzle 1 generate positive pressure, and the suction pipe 2 can make the area of the through hole close to the suction pipe 2 generate negative pressure, so that the plating solution can flow from the area of the through hole close to the nozzle 1 to the area of the through hole close to the suction pipe 2 area.
  • the setting of the wedge-shaped back-suction port 21 increases the negative pressure in the area near the suction pipe 2 of the through hole, that is, increases the pressure difference between the areas on both sides of the through hole, so that the electroplating device also has better performance when targeting through holes with high aspect ratios. Deep plating ability.
  • the suction pipe body 22 is provided with an opening along the third direction, and the two sides of the suction pipe body 22 in the width direction of the opening are provided with deflectors 211, and the two deflectors 211 are arranged at an angle, and the two deflectors
  • the end cover of 211 away from the opening is provided with a sealing plate 212, and a plurality of return ports 2121 are spaced apart along the second direction on the sealing plate 212, and the plurality of return ports 2121 on the sealing plate 212 are connected with two deflectors 211 and openings to form Wedge-shaped back suction port 21.
  • the setting of the deflector 211 can confluence the plating solution, and the setting of the opening can make the plating solution enter the suction pipe body 22 through the guide of the deflector 211 , so as to realize the circulating flow of the plating solution between the nozzle 1 and the suction pipe 2 .
  • three recirculation ports 2121 are provided on the sealing plate 212 to form a three-stage recirculation so that a negative pressure is formed in the second hole to be plated.
  • the dynamic pressure of the plating solution at the opening reaches the maximum value, and the static pressure reaches the minimum value, and the flow velocity of the plating solution increases due to the decrease of the flow cross-sectional area.
  • the entire plating solution will experience the process of reducing the flow cross-sectional area at the same time, so the pressure will also decrease at the same time, thereby generating a pressure difference. Therefore, the flow velocity of the plating solution and the pressure difference inside and outside the suction pipe 2 are closely related to the structure of the wedge-shaped back-suction port 21 .
  • each return opening 2121 is in the range of 3mm-8mm.
  • each return port 2121 is 5 mm.
  • the width of the opening ranges from 10mm to 30mm. Since the opening is arranged on the suction pipe 2, the pipe diameter of the suction pipe 2 is larger than the width of the opening. In this embodiment, the pipe diameter of the suction pipe 2 ranges from 25 mm to 35 mm. In order to maintain the stability of the spray-suction cycle, the diameter of the nozzle pipe 1 is equal to that of the suction pipe 2, and the diameter range of the nozzle pipe 1 is also 25mm-35mm.
  • the width of the opening is 20 mm
  • the pipe diameter of the suction pipe 2 is 35 mm
  • the pipe diameter of the spray pipe 1 is also 35 mm.
  • the angle range between the two deflectors 211 is 100°-110°.
  • the angle between the two deflectors 211 is 105°.
  • the distance from the sealing plate 212 to the opening is in the range of 60mm-70mm.
  • the distance from the sealing plate 212 to the opening is 65mm.
  • the size range of the sealing plate 212 in the second direction is 95mm-105mm, so as to expand the contact area between the plating solution and the suction pipe 2, and reduce the waste of the plating solution.
  • the size of the sealing plate 212 in the third direction is consistent with the size of the suction pipe 2 and the nozzle 1 in the third direction.
  • the size range of the sealing plate 212 in the third direction is 750mm-1150mm.
  • the dimension of the sealing plate 212 in the second direction is 100 mm
  • the dimension of the sealing plate 212 in the third direction is 900 mm.
  • the wedge-shaped suction inlet 21 and the suction pipe 2 and the nozzle 1 are all in contact with the plating solution, in order to prevent the plating solution from corroding the wedge-shaped suction inlet 21 and the suction pipe 2 and the nozzle 1, the wedge-shaped suction inlet 21 and the suction pipe 2 and the nozzle 1 all adopt 316 Made of stainless steel. 316 stainless steel contains Mo element, which greatly improves its corrosion resistance and high temperature strength.
  • a plurality of nozzles 11 are evenly arranged on the spray pipe 1 along the third direction, and the nozzles 11 are arranged to realize the spraying of the plating solution, and the arrangement of the plurality of nozzles 11 is to increase the spraying amount of the plating solution.
  • the nozzle 11 is arranged opposite to the first hole to be plated.
  • a nozzle with an inner diameter of 1.5 mm, an outer diameter of 10 mm, and a length of 30 mm is selected as the nozzle 11 provided on the nozzle pipe 1 .
  • the distance between two adjacent nozzles 11 on each nozzle 1 is 15mm.
  • 42 nozzles 11 can be arranged on each nozzle pipe 1 .
  • the spray angle of the above-mentioned nozzle 11 is 15°.
  • the plating solution ejected from the nozzle 11 can cover a maximum range of 100 mm.
  • the electroplating device includes multiple groups of spray and suction components to improve deep plating efficiency of the electroplating device.
  • the nozzle pipes 1 in each group of ejection and suction assemblies are connected to the first pump 5 , and the first pump 5 is configured to deliver the plating solution in the electroplating tank to the nozzle pipes 1 .
  • the suction pipes 2 in each group of spray suction assemblies are connected to the second pump 6, and the second pump 6 is configured to transport the plating solution in the suction pipes 2 to the electroplating tank.
  • the first pump 5 is connected to a plurality of spray pipes 1 through PVC hoses.
  • the second pump 6 is connected to a plurality of suction pipes 2 through PVC hoses.
  • the setting of the PVC hose makes the distance between the nozzle 1 and the suction pipe 2 adjustable, so that the relative position of the nozzle 1 and the suction pipe 2 can be changed according to the actual working conditions, so as to ensure the deep plating ability of the electroplating device.
  • the plurality of spray pipes 1 and the plurality of suction pipes 2 on the same side are arranged alternately along the second direction.
  • the distance between adjacent spray pipes 1 and suction pipes 2 on the same side is 100 mm.
  • holes to be plated are provided on both sides of the PCB3.
  • the spray and suction components are divided into the first spray and suction components and the second spray and suction components.
  • Suction assembly, nozzle pipe 1 in the first spray suction assembly, suction pipe 2 and the orifice of the hole to be plated on one side of PCB3 are arranged oppositely, to realize that the first spray suction assembly sprays plating solution and return to the hole to be plated on PCB3 side Suction plating solution.
  • Spray pipe 1 in the second spray suction assembly, suction pipe 2 and the orifice of the hole to be plated on the other side of PCB3 are relatively arranged, to realize that the second spray suction assembly sprays plating solution and returns to the hole to be plated on the other side of PCB3 Suction plating solution. Further, the distance between the liquid outlet end of the nozzle 11 in the first suction assembly and the sealing plate 212 in the second suction assembly is 20mm-60mm.
  • the electroplating device further includes a swing mechanism, the swing mechanism is arranged on the side wall of the electroplating tank, the spray suction assembly is arranged at the output end of the swing mechanism, and the swing mechanism is configured to drive the spray suction assembly to reciprocate along the second direction.
  • the above setting can fully stir the plating solution, discharge the air bubbles on the surface of the PCB3, and improve the diffusion speed of the plating solution in the hole to be plated; on the other hand, it ensures the uniformity of the plating on the surface of the PCB3 and improves the plating quality.
  • the swing mechanism includes a driving member and a slide rail
  • the slide rail is arranged on the side wall of the electroplating tank along the second direction
  • the spray suction assembly is arranged on the slide rail, and is connected with the output end of the driving member
  • the driving member is set In order to drive the suction assembly to slide on the slide rail to realize the reciprocating movement of the suction assembly in the second direction.
  • the driving member is an electric cylinder.
  • the swing frequency of the swing mechanism is 0.1-1 (times/s), and the above swing frequency can be adaptively changed according to actual working conditions.
  • the amplitude of the swing mechanism is 100mm-250mm.

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Abstract

本申请公开了一种电镀装置，该电镀装置中的喷管被设置为向第一待镀孔内喷射镀液，使得喷管与第一待镀孔之间的区域生成正压。吸管被设置为回吸第二镀孔内的镀液，使得吸管与第二待镀孔之间的区域生成负压，从而产生压差，实现了第一待镀孔内镀液的交换。第二镀孔内部也生成负压，使得第二待镀孔的内外也形成压差，从而使得镀液在第二待镀孔内扩散。吸管包括吸管本体和沿第三方向设于吸管本体上的楔形回吸口，楔形回吸口远离吸管本体的一端沿第二方向间隔设有多个回流口。

Description

电镀装置
本申请要求在2021年12月31日提交中国专利局、申请号为202111668203.4的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请涉及电镀技术领域，例如涉及一种电镀装置。
背景技术
在电路板的制作过程中，需要对电路板上的待镀孔进行电镀。随着技术的不断发展，对电路板制作精度的要求越来越高，因此对待镀孔深镀效果的要求也越来越高，即需要电镀装置具有较好的深镀能力。
相关技术中的PCB的电镀装置在PCB的一侧同时设有吸管和喷管，使得待镀孔的孔口处存在压差，以实现待镀孔内镀液的扩散，从而使得电镀装置具备对待镀孔进行深镀的能力。但上述电镀装置只针对于纵横比较小的待镀孔时具有较好的深镀能力，在电路板上待镀孔的纵横比较高时，待镀孔孔口处的压差无法使得待镀孔内的镀液进行有效地扩散，导致高纵横比的待镀孔镀层困难，即相关技术中的电镀装置在针对于高纵横比的待镀孔时不具备较好的深镀能力。
发明内容
本申请提供一种电镀装置，能够解决相关技术中的电镀装置在针对于高纵横比待镀孔的电路板进行电镀时的深镀能力较差的问题。
本申请提供以下技术方案：
一种电镀装置，被设置为电镀PCB，所述PCB上沿第一方向设有待镀孔，所述待镀孔分为第一待镀孔和第二待镀孔，所述第一待镀孔和所述第二待镀孔沿第二方向交错设置，包括：
电镀槽，被设置为容纳镀液；所述电镀槽内设有所述PCB和两个阳极板，所述PCB设于两个所述阳极板之间，两个所述阳极板均与所述PCB电连接；
喷吸组件，包括吸管和喷管，所述喷管和所述吸管设于所述阳极板与所述PCB之间，所述喷管、所述吸管与所述待镀孔的孔口相对设置；所述喷管被设置为向所述第一待镀孔内喷射所述镀液；所述吸管被设置为回吸所述第二待镀孔内的所述镀液；
所述吸管包括：
吸管本体，呈管状，且沿第三方向延伸；
楔形回吸口，沿所述第三方向设于所述吸管本体上，且与所述吸管本体相连通，所述楔形回吸口远离所述吸管本体的一端大于所述楔形回吸口靠近所述吸管本体的一端；所述楔形回吸口远离所述吸管本体的一端沿所述第二方向间隔设有多个回流口，所述回流口沿所述第三方向延伸；
所述第一方向、所述第二方向和所述第三方向两两相互垂直设置。
作为上述电镀装置的可选方案，所述吸管本体上沿所述第三方向开设开口，所述吸管本体上所述开口宽度方向的两侧设有导流板，两个所述导流板呈夹角设置，两个所述导流板远离所述开口的一端盖设有封板，所述封板上沿所述第二方向间隔开设有多个所述回流口，所述封板上的多个所述回流口与两个所述导流板、所述开口以形成所述楔形回吸口。
作为上述电镀装置的可选方案，所述开口的宽度为10mm-30mm。
作为上述电镀装置的可选方案，每个所述回流口的宽度为3mm-8mm。
作为上述电镀装置的可选方案，两个所述导流板之间所述夹角的角度范围为100°-110°。
作为上述电镀装置的可选方案，所述电镀装置包括多组所述喷吸组件，多组所述喷吸组件分为第一喷吸组件和第二喷吸组件，所述第一喷吸组件中的所述喷管、所述吸管与所述PCB一侧的所述待镀孔的孔口相对设置；所述第二喷吸组件中的所述喷管、所述吸管与所述PCB另一侧的所述待镀孔的孔口相对设置。
作为上述电镀装置的可选方案，第一泵浦通过PVC软管与多个所述喷管相连；第二泵浦通过PVC软管与多个所述吸管相连。
作为上述电镀装置的可选方案，位于同一侧的多个所述喷管与多个所述吸管沿所述第二方向交错设置。
作为上述电镀装置的可选方案，还包括摆动机构，所述摆动机构设于所述电镀槽的侧壁上，所述喷吸组件设于所述摆动机构的输出端，所述摆动机构被设置为驱动所述喷吸组件沿所述第二方向往复移动。
作为上述电镀装置的可选方案，所述摆动机构包括：
滑轨，沿所述第二方向设于所述电镀槽的侧壁上，所述喷吸组件设于所述滑轨上；
驱动件，所述驱动件的输出端与所述喷吸组件相连，所述驱动件被设置为 驱动所述喷吸组件在所述滑轨上滑动。
本申请所提供的电镀装置包括喷吸组件，喷吸组件包括吸管和喷管，喷管和吸管设于其中一个阳极板与PCB之间，喷管、吸管与镀孔的孔口相对设置，喷管被设置为向第一待镀孔内喷射镀液，使得喷管与第一待镀孔之间的区域生成正压。吸管被设置为回吸第二待镀孔内的镀液，使得吸管与第二待镀孔之间的区域生成负压，从而产生压差，实现了第一待镀孔内镀液的交换。第二镀孔内部也生成负压，使得第二待镀孔的内外也形成压差，从而使得镀液在第二待镀孔内扩散。吸管包括吸管本体和沿第三方向设于吸管本体上的楔形回吸口，楔形回吸口远离吸管本体的一端沿第二方向间隔设有多个回流口，多个回流口的设置增加了吸管与第二待镀孔之间区域的负压，从而使得镀液能够更加快速地流动，从而使得电镀装置在针对于高纵横比的待镀孔时也具备较好的深镀能力。
附图说明
图1为本申请实施例中喷吸组件的结构示意图；
图2为图1中A处的放大图。
附图标记：
1、喷管；2、吸管；3、PCB；4、阳极板；5、第一泵浦；6、第二泵浦；
11、喷嘴；
21、楔形回吸口；211、导流板；212、封板；2121、回流口；22、吸管本体。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行描述，所描述的实施例是本申请一部分实施例，而不是全部的实施例。通常在此处附图中描述和示出的本申请实施例的组件可以以各种不同的配置来布置和设计。
因此，以下对在附图中提供的本申请的实施例的详细描述并非限制要求保护的本申请的范围，而是仅仅表示本申请的选定实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行定义和解释。
在本申请的描述中，需要说明的是，术语“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，或者是该申请产品使用时惯常摆放的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的工具台或元件必须具有特定的方位、以特定的方位构造和操作。此外，术语“第一”、“第二”、“第三”等仅用于区分描述，而不能理解为指示或暗示相对重要性。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在本申请的描述中，还需要说明的是，除非另有明确的规定和限定，术语“设置”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接。对于本领域的普通技术人员而言，可以根据情况理解上述术语在本申请中的含义。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
下面详细描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本申请。
如图1-图2所示，本实施例提供了一种电镀装置，该电镀装置被设置为电镀PCB3，PCB3上沿第一方向(即附图中的X方向)设有待镀孔，待镀孔分为第一待镀孔和第二待镀孔，第一待镀孔和第二待镀孔沿第二方向(即附图中的Y方向)交错设置。电镀装置包括被设置为容纳镀液的电镀槽，电镀槽内设有PCB3和两个阳极板4，PCB3设于两个阳极板4之间，两个阳极板4均与PCB3电连接，以便于实现对PCB3的电镀。可选地，PCB3与阳极板4之间的距离可调，以便于根据实际工况进行适应性地调节，使得电镀装置保持较好的深镀能力。可选地，PCB3与阳极板4之间的距离范围为200mm-300mm。
电镀装置还包括喷吸组件，喷吸组件包括吸管2和喷管1，喷管1和吸管2设于阳极板4与PCB3之间，喷管1、吸管2与待镀孔的孔口相对设置，喷管1被设置为向第一待镀孔内喷射镀液，使得喷管1与第一待镀孔之间的区域生成正压。吸管2被设置为回收吸管2与第二待镀孔之间的镀液，使得吸管2与第二待镀孔之间的区域生成负压。喷管1与第一待镀孔之间的区域与吸管2与第 二待镀孔之间的区域形成压差，实现了第一待镀孔内镀液的交换。第二镀孔内部也生成负压，使得第二待镀孔的内外也形成压差，从而使得镀液在第二待镀孔内扩散。吸管2包括吸管本体22和楔形回吸口21，吸管本体22呈管状，沿第三方向(即附图中的Z方向)延伸，楔形回吸口21沿第三方向设于吸管本体22上，且与吸管本体22相连通。楔形回吸口21远离吸管本体22的一端大于楔形回吸口21靠近吸管本体22的一端；楔形回吸口21远离吸管本体22的一端沿第二方向间隔设有多个回流口2121，回流口2121沿第三方向延伸。多个回流口2121的设置增加了吸管与第二待镀孔之间区域的负压，从而使得镀液能够更加快速地流动，使得电镀装置在针对于高纵横比的待镀孔时也具备较好的深镀能力。例如，第一方向、第二方向和第三方向两两相互垂直设置。
本实施例中的待镀孔为盲孔，上述镀液的流动过程仅针对于盲孔而言。在其他实施例中，待镀孔也可以为通孔，通孔的两端均设有喷吸组件，通孔的一端设有喷吸组件的喷管1，另一端设有吸管2，喷管1能够使得通孔靠近喷管1的区域生成正压，吸管2能够使得通孔靠近吸管2的区域生成负压，使得镀液能够从通孔靠近喷管1的区域流向通孔靠近吸管2的区域。而楔形回吸口21的设置增加了通孔靠近吸管2区域的负压，即增大了通孔两侧区域间的压差，使得电镀装置在针对于高纵横比的通孔时也具备较好的深镀能力。
在本实施例中，吸管本体22上沿第三方向开设开口，吸管本体22上开口宽度方向的两侧设有导流板211，两个导流板211呈夹角设置，两个导流板211远离开口的一端盖设有封板212，封板212上沿第二方向间隔开设有多个回流口2121，封板212上的多个回流口2121与两个导流板211、开口以形成楔形回吸口21。导流板211的设置能够对镀液进行汇流，开口的设置能够使得镀液通过导流板211的引导进入吸管本体22中，从而实现镀液在喷管1和吸管2之间循环流动。在本实施例中，封板212上设有三个回流口2121，以形成三级回吸，使得第二待镀孔内形成负压。
由文丘里管的原理可知，镀液在开口处的动态压力达到最大值，静态压力达到最小值，镀液的流动速度因为通流横截面面积减小而上升。整个镀液都要在同一时间内经历通流横截面面积缩小过程，因而压力也在同一时间减小，进而产生压力差。因此，镀液的流动速度和吸管2内外的压力差与楔形回吸口21的结构息息相关。
可选地，每个回流口2121的宽度范围为3mm-8mm。
在一实施例中，每个回流口2121的宽度为5mm。
可选地，开口的宽度范围为10mm-30mm。由于开口设于吸管2上，因此吸管2的管径大于开口的宽度。在本实施例中，吸管2的管径范围为25mm-35mm。 为了维持喷吸循环的稳定性，因此喷管1的管径与吸管2的管径相等，喷管1的管径范围也为25mm-35mm。
在一实施例中，开口的宽度为20mm，吸管2的管径为35mm，喷管1的管径也为35mm。
可选地，两个导流板211之间夹角的角度范围为100°-110°。
在一实施例中，两个导流板211之间夹角的角度为105°。
可选地，封板212到开口处的距离范围为60mm-70mm。
在一实施例中，封板212到开口处的距离为65mm。
可选地，封板212在第二方向上的尺寸范围为95mm-105mm，以扩大镀液与吸管2的接触面积，减少了镀液的浪费。而封板212在第三方向上的尺寸与吸管2、喷管1在第三方向上的尺寸一致。在本实施例中，封板212在第三方向上的尺寸范围为750mm-1150mm。
在一实施例中，封板212在第二方向上的尺寸为100mm，封板212在第三方向上的尺寸为900mm。
由于楔形回吸口21和吸管2、喷管1均与镀液有接触，为了避免镀液腐蚀楔形回吸口21和吸管2、喷管1，楔形回吸口21和吸管2、喷管1均采用316不锈钢制成。316不锈钢中含有Mo元素，使其耐蚀性、和高温强度有较大的提高。
在一实施例中，喷管1上沿第三方向均匀设有多个喷嘴11，喷嘴11被设置为实现镀液的喷射，而多个喷嘴11的设置以提高镀液的喷射量。为了便于喷射的镀液进入第一待镀孔内，喷嘴11于第一待镀孔相对设置。在本实施例中，选取内径为1.5mm，外径为10mm，长度为30mm的喷嘴作为喷管1上设置的喷嘴11。由于上述喷管1和喷嘴11的规格，可以得知，每根喷管1上相邻的两个喷嘴11之间的距离为15mm。每根喷管1上可以设置有42个喷嘴11。上述喷嘴11的喷射角度为15°。喷嘴11喷射出的镀液的最大可覆盖范围为100mm。
可选地，电镀装置包括多组喷吸组件，以提高电镀装置的深镀效率。每组喷吸组件中的喷管1均与第一泵浦5相连，第一泵浦5被设置为将电镀槽内的镀液输送至喷管1。每组喷吸组件中的吸管2均与第二泵浦6相连，第二泵浦6被设置为将吸管2内的镀液输送至电镀槽。上述设置实现了镀液的循环，一方面避免了镀液的浪费；另一方面使得镀液流动起来，加快了镀液在待镀孔内的扩散。
可选地，第一泵浦5通过PVC软管与多个喷管1相连。同样地，第二泵浦 6通过PVC软管与多个吸管2相连。PVC软管的设置使得喷管1与吸管2之间的距离可调，以便于根据实际工况改变喷管1与吸管2的相对位置，从而确保电镀装置的深镀能力。
由于第一待镀孔和第二待镀孔沿第二方向交错设置，所以可选地，位于同一侧的多个喷管1与多个吸管2沿第二方向交错设置。可选地，位于同一侧的相邻的喷管1与吸管2之间的距离为100mm。
一般情况下，PCB3的两侧均设有待镀孔，为了同时对PCB3两侧的待镀孔进行深镀，提高电镀装置的深镀效率，喷吸组件分为第一喷吸组件和第二喷吸组件，第一喷吸组件中的喷管1、吸管2与PCB3一侧的待镀孔的孔口相对设置，以实现第一喷吸组件对PCB3一侧的待镀孔喷射镀液和回吸镀液。第二喷吸组件中的喷管1、吸管2与PCB3另一侧的待镀孔孔的孔口相对设置，以实现第二喷吸组件对PCB3另一侧的待镀孔喷射镀液和回吸镀液。进一步地，第一喷吸组件中的喷嘴11的出液端与第二喷吸组件中的封板212之间的距离为20mm-60mm。
可选地，电镀装置还包括摆动机构，摆动机构设于电镀槽的侧壁上，喷吸组件设于摆动机构的输出端，摆动机构被设置为驱动喷吸组件沿第二方向往复移动。上述设置一方面能够对镀液进行充分搅拌，可以将PCB3表面的气泡排出，提高了镀液在待镀孔内的扩散速度；另一方面保证了PCB3表面电镀的均匀性，提高了电镀质量。
可选地，摆动机构包括驱动件和滑轨，滑轨沿第二方向设于电镀槽的侧壁上，喷吸组件设于滑轨上，且与驱动件的输出端相连，驱动件被设置为驱动喷吸组件在滑轨上滑动，以实现喷吸组件在第二方向上的往复移动。在本实施例中，驱动件为电动气缸。
在本实施例中，摆动机构的摆动频率为0.1-1(次/s)，且上述摆动频率可以根据实际工况进行适应性地改变。摆动机构的振幅为100mm-250mm。

Claims (13)

  1. 一种电镀装置，被设置为电镀PCB(3)，所述PCB(3)上沿第一方向设有待镀孔，所述待镀孔分为第一待镀孔和第二待镀孔，所述第一待镀孔和所述第二待镀孔沿第二方向交错设置，其特征在于，包括：
    电镀槽，被设置为容纳镀液；所述电镀槽内设有所述PCB(3)和两个阳极板(4)，所述PCB(3)设于两个所述阳极板(4)之间，两个所述阳极板(4)均与所述PCB(3)电连接；
    喷吸组件，包括吸管(2)和喷管(1)，所述喷管(1)和所述吸管(2)设于所述阳极板(4)与所述PCB(3)之间，所述喷管(1)、所述吸管(2)与所述待镀孔的孔口相对设置；所述喷管(1)被设置为向所述第一待镀孔内喷射所述镀液；所述吸管(2)被设置为回吸所述第二待镀孔内的所述镀液；
    所述吸管(2)包括：
    吸管本体(22)，呈管状，且沿第三方向延伸；
    楔形回吸口(21)，沿所述第三方向设于所述吸管本体(22)上，且与所述吸管本体(22)相连通，所述楔形回吸口(21)远离所述吸管本体(22)的一端大于所述楔形回吸口(21)靠近所述吸管本体(22)的一端；所述楔形回吸口(21)远离所述吸管本体(22)的一端沿所述第二方向间隔设有多个回流口(2121)，所述回流口(2121)沿所述第三方向延伸；
    所述第一方向、所述第二方向和所述第三方向两两相互垂直设置。
  2. 根据权利要求1所述的电镀装置，其中，所述吸管本体(22)上沿所述第三方向开设开口，所述吸管本体(22)上所述开口宽度方向的两侧设有导流板(211)，两个所述导流板(211)呈夹角设置，两个所述导流板(211)远离所述开口的一端盖设有封板(212)，所述封板(212)上沿所述第二方向间隔开设有多个所述回流口(2121)，所述封板(212)上的多个所述回流口(2121)与两个所述导流板(211)、所述开口以形成所述楔形回吸口(21)。
  3. 根据权利要求2所述的电镀装置，其中，所述开口的宽度范围为10mm-30mm。
  4. 根据权利要求3所述的电镀装置，其中，所述开口的宽度为20mm。
  5. 根据权利要求1所述的电镀装置，其中，每个所述回流口(2121)的宽度范围为3mm-8mm。
  6. 根据权利要求5所述的电镀装置，其中，每个所述回流口(2121)的宽度为5mm。
  7. 根据权利要求2所述的电镀装置，其中，两个所述导流板(211)之间所述 夹角的角度范围为100°-110°。
  8. 根据权利要求7所述的电镀装置，其中，两个所述导流板(211)之间所述夹角的角度为105°。
  9. 根据权利要求1所述的电镀装置，其中，所述电镀装置包括多组所述喷吸组件，多组所述喷吸组件分为第一喷吸组件和第二喷吸组件，所述第一喷吸组件中的所述喷管(1)、所述吸管(2)与所述PCB(3)一侧的所述待镀孔的孔口相对设置；所述第二喷吸组件中的所述喷管(1)、所述吸管(2)与所述PCB(3)另一侧的所述待镀孔的孔口相对设置。
  10. 根据权利要求9所述的电镀装置，其中，第一泵浦(5)通过PVC软管与多个所述喷管(1)相连；第二泵浦(6)通过PVC软管与多个所述吸管(2)相连。
  11. 根据权利要求9所述的电镀装置，其特征在于，位于同一侧的多个所述喷管(1)与多个所述吸管(2)沿所述第二方向交错设置。
  12. 根据权利要求9所述的电镀装置，还包括摆动机构，所述摆动机构设于所述电镀槽的侧壁上，所述喷吸组件设于所述摆动机构的输出端，所述摆动机构被设置为驱动所述喷吸组件沿所述第二方向往复移动。
  13. 根据权利要求12所述的电镀装置，其中，所述摆动机构包括：
    滑轨，沿所述第二方向设于所述电镀槽的侧壁上，所述喷吸组件设于所述滑轨上；
    驱动件，所述驱动件的输出端与所述喷吸组件相连，所述驱动件被设置为驱动所述喷吸组件在所述滑轨上滑动。
PCT/CN2022/100156 2021-12-31 2022-06-21 电镀装置 WO2023123912A1 (zh)

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CN114214712B (zh) * 2021-12-31 2023-10-03 生益电子股份有限公司 一种电镀装置
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1533400A1 (en) * 2003-11-20 2005-05-25 Process Automation International Limited A liquid delivery system for an electroplating apparatus, an electroplating apparatus with such a liquid delivery system, and a method of operating an electroplating apparatus
TWM468525U (zh) * 2013-07-30 2013-12-21 You-Ren Liu 電鍍裝置
CN111910242A (zh) * 2020-07-24 2020-11-10 广州兴森快捷电路科技有限公司 印制电路板的电镀方法及装置
CN112501664A (zh) * 2020-11-24 2021-03-16 深圳明阳芯蕊半导体有限公司 Pcb板电镀方法和pcb板电镀设备
CN213538147U (zh) * 2020-07-24 2021-06-25 广州兴森快捷电路科技有限公司 印制电路板的电镀装置
CN114214712A (zh) * 2021-12-31 2022-03-22 生益电子股份有限公司 一种电镀装置
CN114250499A (zh) * 2021-12-31 2022-03-29 生益电子股份有限公司 一种电镀装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1533400A1 (en) * 2003-11-20 2005-05-25 Process Automation International Limited A liquid delivery system for an electroplating apparatus, an electroplating apparatus with such a liquid delivery system, and a method of operating an electroplating apparatus
TWM468525U (zh) * 2013-07-30 2013-12-21 You-Ren Liu 電鍍裝置
CN111910242A (zh) * 2020-07-24 2020-11-10 广州兴森快捷电路科技有限公司 印制电路板的电镀方法及装置
CN213538147U (zh) * 2020-07-24 2021-06-25 广州兴森快捷电路科技有限公司 印制电路板的电镀装置
CN112501664A (zh) * 2020-11-24 2021-03-16 深圳明阳芯蕊半导体有限公司 Pcb板电镀方法和pcb板电镀设备
CN114214712A (zh) * 2021-12-31 2022-03-22 生益电子股份有限公司 一种电镀装置
CN114250499A (zh) * 2021-12-31 2022-03-29 生益电子股份有限公司 一种电镀装置

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