WO2023122965A1 - 驱动面板和显示装置 - Google Patents

驱动面板和显示装置 Download PDF

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Publication number
WO2023122965A1
WO2023122965A1 PCT/CN2021/142106 CN2021142106W WO2023122965A1 WO 2023122965 A1 WO2023122965 A1 WO 2023122965A1 CN 2021142106 W CN2021142106 W CN 2021142106W WO 2023122965 A1 WO2023122965 A1 WO 2023122965A1
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WO
WIPO (PCT)
Prior art keywords
lines
base substrate
display area
electrically connected
insulating layer
Prior art date
Application number
PCT/CN2021/142106
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English (en)
French (fr)
Inventor
谢相伟
Original Assignee
厦门市芯颖显示科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 厦门市芯颖显示科技有限公司 filed Critical 厦门市芯颖显示科技有限公司
Priority to PCT/CN2021/142106 priority Critical patent/WO2023122965A1/zh
Publication of WO2023122965A1 publication Critical patent/WO2023122965A1/zh
Priority to US18/389,904 priority patent/US20240170499A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0421—Structural details of the set of electrodes
    • G09G2300/0426—Layout of electrodes and connections
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/06—Passive matrix structure, i.e. with direct application of both column and row voltages to the light emitting or modulating elements, other than LCD or OLED
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2310/00—Command of the display device
    • G09G2310/02—Addressing, scanning or driving the display screen or processing steps related thereto
    • G09G2310/0264—Details of driving circuits
    • G09G2310/0267—Details of drivers for scan electrodes, other than drivers for liquid crystal, plasma or OLED displays

Definitions

  • the present application relates to the field of display technology, in particular to a driving panel and a display device.
  • the current passive drive panel utilizes the left and right frames in the non-display area of the drive panel to route wires to the lower frame and connect to the drive circuit, so that the frame of the drive panel is wider.
  • the line width of the signal connection line should be considered for synchronization, and it should be matched with left and right wiring to occupy a larger frame. Therefore, realizing the borderless display drive is a technical problem to be solved at present.
  • the embodiment of the present application provides a driving panel and a display device, which solve the problem of the wide frame of the driving panel in the prior art and realize narrow Bezel or even a bezel-less panel expands the market application of the drive panel.
  • a driving panel provided by an embodiment of the present application includes, for example: a base substrate including a display area and a non-display area; column scanning lines arranged in the display area on the base substrate; row scanning lines, Interlaced with the column scanning lines and arranged in the display area; signal connection lines are arranged in the display area on the base substrate, and the signal connection lines are electrically connected to the row scanning lines; a driving circuit , arranged in the non-display area of the base substrate, respectively forming electrical connections with the column scan lines and the signal connection lines; the first electrode pad, arranged on the base substrate in the display area and electrically connected to the column scan lines; and a second electrode pad disposed in the display area on the base substrate and electrically connected to the row scan lines and the signal connection lines.
  • the driving panel further includes a first insulating layer, the first insulating layer covers the row scanning line and is located between the row scanning line and the signal connection line In between, a first via hole is provided on the first insulating layer, and the row scanning line is electrically connected to the signal connection line through the first via hole.
  • the driving panel further includes a second insulating layer, the second insulating layer covers the signal connecting wire and the first insulating layer and is located on the second electrode pad. Between the pad and the signal connection line, the second insulating layer is also located between the first insulating layer and the column scanning line; the second insulating layer is provided with a second via hole, and the first insulating layer The two electrode pads are electrically connected to the signal connection line through the second via hole.
  • the driving panel further includes a planar layer covering the second insulating layer and the column scan line, and the first electrode pad runs through the The flat layer is electrically connected to the column scan lines.
  • the first electrode pad has a first binding surface
  • the second electrode pad has a second binding surface
  • the first binding surface and the The second binding surfaces are respectively located on the side of the planar layer away from the base substrate, and the minimum distance from the first binding surface to the base substrate is equal to the distance from the second binding surface to the substrate. Minimum distance from substrate.
  • the column scan lines are arranged parallel to the signal connection lines, and the column scan lines are arranged perpendicular to the signal connection lines and the row scan lines.
  • a display device provided by an embodiment of the present application, for example, includes: the aforementioned drive panel; and a light emitting device disposed on the drive panel, wherein the light emitting device includes a first electrode and a second electrode. Two electrodes, the first electrode is electrically connected to the first electrode pad of the driving panel, and the second electrode is electrically connected to the second electrode pad of the driving panel.
  • the row scanning lines and the column scanning lines are interlaced to form a pixel unit; a plurality of the light-emitting devices are arranged in the pixel unit, and a plurality of the light-emitting devices form a plurality of light-emitting devices. sub-pixels; the projected area of the first via hole on the substrate is the projected area of at least one sub-pixel on the substrate.
  • the light emitting device is a micron light emitting diode or a submillimeter light emitting diode.
  • the display device further includes an encapsulation layer covering the light emitting device and the driving panel.
  • the signal connecting line is connected to the row scanning line through a via hole with an area equal to or larger than at least one pixel, which improves the current carrying capacity of the signal connecting line and improves the reliability of the product.
  • the signal connection line can be electrically connected to the light emitting device through the top layer metal pads on the driving panel, that is, the first electrode pad and the second electrode pad.
  • the arrangement of the flat layer is beneficial to the bonding of the metal pads on the top layer, ie, the first electrode pad and the second electrode pad, to the light emitting device, thereby improving the quality and reliability of the product.
  • FIG. 1 is a schematic cross-sectional view of a display device provided by an embodiment of the present application.
  • FIG. 2 is a schematic plan view of a display device provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of the driving panel shown in FIG. 2 .
  • FIG. 4 is a partially enlarged schematic diagram of area A in FIG. 2 .
  • FIG. 5 is a schematic cross-sectional view of the driving panel shown in FIG. 3 .
  • FIG. 6 is a schematic diagram of the positional relationship between the electrode pads and the display panel shown in FIG. 5 .
  • FIG. 7 is a schematic structural diagram of a first via hole and a pixel unit.
  • the embodiment of the present application provides a display device 50 .
  • the display device 50 provided in the embodiment of the present application may be, for example, a micro-LED display device, a submillimeter LED display device, or a micro-LED display device.
  • the display device 50 includes, for example: a driving panel 10, a light emitting device 30, and the like.
  • the light emitting device 30 is disposed on the driving panel 10 and electrically connected to the driving panel 10 .
  • the light emitting device 30 is, for example, a micro light emitting diode (Micro-LED).
  • Micro-LEDs generally refer to semiconductor light-emitting diode chips whose length, width, and thickness are all less than 100 microns ( ⁇ m), for example, including micron light-emitting diodes or submillimeter light-emitting diodes ( Mini LED), and even other similar light-emitting devices.
  • the display device 50 also includes, for example, an encapsulation layer 40 .
  • the encapsulation layer 40 covers, for example, the light emitting device 30 and the driving panel 10 .
  • the encapsulation layer 40 can fix the positions of light emitting devices such as Micro LED and/or light emitting device circuits such as Micro IC to each other, and play a protective role.
  • the material of the encapsulation layer 40 may include, for example, epoxy resin and silicone resin material, or other materials.
  • the display device 50 is, for example, a passive matrix (PM) type display device
  • the driving panel 10 is, for example, a passive driving panel.
  • the driving panel 10 is used to control the light-emitting device 30 to be turned on and off, so that the display device 50 can display a corresponding picture.
  • the driving panel 10 includes, for example, a base substrate 110 and row scanning lines 120, column scanning lines 130, signal connection lines 140, driving circuits 150, first electrode pads 190 and second electrode pads 110 disposed on the base substrate 110. Pad 200.
  • the base substrate 110 is, for example, a glass substrate or the like.
  • the base substrate 110 includes a display area 111 and a non-display area 112 .
  • Row scanning lines 120 , column scanning lines 130 and signal connection lines 140 are respectively arranged in the display area 111 .
  • the column scanning lines 130 are arranged in the display area 111 along the vertical direction (or column direction).
  • the row scan lines 120 are arranged in the display area 111 along the horizontal direction (or row direction). That is, the row scan lines 120 and the column scan lines 130 are arranged in the display area 111 in an alternate manner.
  • the row scan lines 120 and the column scan lines 130 are vertically arranged in the display area 111 .
  • the signal connection line 140 is disposed in the display area 111 , and the signal connection line 140 is electrically connected to the row scan line 120 .
  • the signal connection line 140 can be arranged parallel to the column scan line 130 , for example.
  • the signal connecting lines 140 and the column scanning lines 130 are vertically arranged in the display area 111 .
  • the projection of the signal connection line 140 on the base substrate 110 may be parallel to, overlapped with, or even coincide with, for example, the projection of the column scan line 130 on the base substrate 110 , and the present application is not limited thereto.
  • the projections of the signal connection lines 140 on the base substrate 110 may be parallel to and alternately distributed with the projections of the column scanning lines 130 on the base substrate 110, that is, in the horizontal direction in FIG.
  • a column scan line 130 is provided between two signal connection lines 140
  • a signal connection line 140 is provided between two adjacent column scan lines 130 .
  • the projection of the signal connection line 140 on the base substrate 110 may coincide with the projection of the column scanning line 130 on the base substrate 110, that is, because the signal connection line 140 and the column scanning line 130 are located on the drive panel 10 different layers, therefore, the projections of the two on the base substrate 110 coincide.
  • the signal connecting line 140 is electrically connected to the driving circuit 150
  • the row scanning line 120 is electrically connected to the driving circuit 150 through the signal connecting line 140 .
  • the first electrode pad 190 is electrically connected to the row scan line 120
  • the second electrode pad 200 is electrically connected to the column scan line 130 and the signal connection line 140 .
  • the first electrode pads 190 and the second electrode pads 200 are provided in pairs for connecting the light emitting device 30 .
  • the light emitting device 30 is bonded to the first electrode pad 190 and the second electrode pad 200 .
  • the light emitting device 30 also includes, for example, a first electrode 31 and a second electrode 32 arranged in pairs.
  • the light emitting device 30 is a Micro-LED
  • the first electrode 31 is a cathode (or becomes an N pole)
  • the second electrode 32 is an anode (or becomes a P pole).
  • the first electrode 31 is electrically connected to the first electrode pad 190 of the driving panel 10, and the second electrode 32 is electrically connected to the second electrode pad 200 of the driving panel 10.
  • the light emitting device 30 also includes, for example, a first semiconductor layer such as an active layer such as a multi-quantum well layer and a second semiconductor layer that are sequentially stacked.
  • the first electrodes 31 and the second electrodes 32 can be, for example, point-shaped metal electrodes or strip-shaped metal electrodes, and of course metal electrodes of other shapes can also be used, and the present application is not limited thereto.
  • the light emitting device 30 may also be a plurality of light emitting elements stacked vertically and connected in series to form a stacked light emitting structure.
  • the first electrode of one light-emitting element in every two adjacent light-emitting elements is bonded to the second electrode of the other light-emitting element to form an electrical connection.
  • the bonding here is, for example, a metal bonding process.
  • the first electrode and the second electrode are made of pure tin (Sn) layer, gold tin (Sn/Au) layer, titanium copper (Ti /Cu) layer, aluminum-nickel-gold (Al/Ni/Au) layer or titanium-nickel-tin (Ti/Ni/Sn) form a bonding connection under heat and pressure.
  • the plurality of light-emitting elements can be, for example, the same color light-emitting elements, such as all red light-emitting elements, all blue light-emitting elements, all green light-emitting elements, or other light-emitting elements of the same color, so as to form a single-color light-emitting element as a whole.
  • High voltage light emitting devices connected in series can be used to form a single-color light-emitting elements connected in series.
  • each light-emitting element can also be a light-emitting element of different colors, for example, it can be a mixture of three kinds of red light-emitting elements, green light-emitting elements and blue light-emitting elements, so that it can produce three colors including red, green, and blue.
  • Multi-spectral light output of different colors that is, a multi-color series high-voltage light-emitting device is formed as a whole.
  • the single pixel of this embodiment uses a monochrome series high voltage light-emitting device such as a monochrome series series high voltage Micro-LED chip, compared with the situation in the prior art where a single PN structure Micro-LED chip is used as a pixel, it can be used in The drive current is reduced while maintaining a certain brightness, thereby reducing the power consumption of the display device.
  • the stacked series structure is pre-formed so as not to increase the difficulty of mass transfer.
  • the light emitting elements in the stacked series structure are stacked one after another in the vertical direction, it will not increase the occupied space on the driving substrate 81 , that is, it will not reduce the resolution PPI.
  • the row scan line 120, the column scan line 130, the signal connection line 140, the first electrode pad 190 and the second electrode pad 200 are arranged on the on the base substrate 110 .
  • the row scan lines 120 , the column scan lines 130 , the signal connection lines 140 , the first electrode pads 190 and the second electrode pads 200 are located on different layers on the base substrate 110 .
  • the row scanning lines 120 , the column scanning lines 130 , the signal connecting lines 140 , the first electrode pads 190 and the second electrode pads 200 are respectively, for example, transparent conductive lines made of copper or other transparent conductive materials.
  • the row scanning lines are electrically connected with the driving circuit through the signal connection lines, so that the size of the driving panel can be reduced.
  • the width of the bezel so that a small bezel or even a bezel-less panel can be realized to meet the needs of more users in the market.
  • the driving panel 10 may further include a first insulating layer 160 .
  • the row scan lines 120 are disposed on one side of the base substrate 110 .
  • the first insulating layer 160 covers the row scan lines 120 and the base substrate 110 .
  • the signal connection line 140 is formed on the first insulating layer 160 .
  • a first via hole 161 is disposed on the first insulating layer 160 adjacent to the row scanning line 120 , and the first via hole 161 is, for example, a via hole.
  • the signal connecting line 140 is electrically connected to the row scanning line 120 through the first via hole 161 .
  • the material of the first insulating layer 160 can be, for example, silicon oxide, silicon nitride, zirconium oxide, silicon oxynitride, or silicon nitride.
  • the driving panel 10 further includes, for example, a second insulating layer 170 .
  • the second insulating layer 170 covers the signal connection lines 140 and the first insulating layer 160 .
  • the second insulating layer 170 is located between the second electrode pad 190 and the signal connection line 140; the second insulating layer 170 is provided with a second via hole 171, and the second electrode pad 190
  • the signal connection line 140 is electrically connected through the second via hole 171 .
  • the column scan lines 130 are disposed on the second insulating layer 170 .
  • the first electrode pad 200 is electrically connected to the column scan line 130 .
  • the material of the second insulating layer 170 can be, for example, silicon oxide, silicon nitride, zirconium oxide, silicon oxynitride, or silicon nitride.
  • the driving panel 10 also includes a flat layer 180 .
  • the planar layer 180 covers the second insulating layer 170 and the column scan line 130, the first electrode pad 200 penetrates the planar layer and is electrically connected to the column scan line 130;
  • An electrode pad 190 penetrates through the planar layer 180 and the second insulating layer 170 and is electrically connected to the signal connection line 140 .
  • the flat layer 180 can be any suitable organic material, specifically, it can be suitable materials such as acrylic resin, epoxy resin, silicone resin, polyvinyl alcohol, etc. More specifically, it can be sprayed, scraped, spin-coated, or glued Wait for a suitable process to form.
  • the planarization layer 180 is used to planarize the second insulating layer 170 and the column scan lines 130 so that the first electrode pads 200 and the second electrode pads 190 are of the same height, so as to facilitate the bonding of the light emitting device 30 . More specifically, as shown in FIG. 6, the first electrode pad 200 has a first binding surface 201, the second electrode pad 190 has a second binding surface 191, and the first binding surface 201 and the second bonding surface 191 are respectively located on the side of the planar layer 180 away from the base substrate 100 .
  • the minimum distance D1 from the first binding surface 201 to the base substrate 100 is equal to the minimum distance D2 from the second binding surface 191 to the base substrate 100 .
  • the base substrate 100 may further include a non-display area 112 adjacent to the display area 111 ; the driving panel 10 may further include a driving circuit 150 .
  • the driving circuit 150 is disposed in the non-display area 112 of the base substrate 100 .
  • the column scanning lines 130 and the signal connection lines 140 are respectively connected to the driving circuit 150 .
  • the driving panel 10 further includes a fan-out line 210 .
  • the fan-out lines are provided in the non-display area 112 .
  • the column scan line 130 and the signal connection line 140 are respectively connected to the drive circuit 150 through the fan-out line 210, and the row scan line 120 is connected to the drive circuit 150 through the signal connection line 140 and the fan-out line 210.
  • the arrangement of the fan-out lines 210 can reduce the area occupied by the driving circuit 150 on the driving panel 10.
  • the driving circuit 150 is used for controlling the display of the light emitting device 30 through the row scan line 120 and the column scan line 130 .
  • the driving circuit 150 may adopt a driving circuit in the prior art.
  • the driving circuit 150 may also include a row driving circuit and a column driving circuit respectively connected to the row scanning line 120 and the column scanning line 130 , and the specific structure thereof will not be repeated here.
  • each pixel unit 300 includes, for example, a plurality of pixels arranged in sequence. This time, the plurality of pixels includes, for example, a red pixel (R), a green pixel (G), and a blue pixel (G). Of course, in other embodiments, each pixel unit 300 includes, for example, red pixels (R), green pixels (G), blue pixels (G) and white pixels (G) arranged in sequence, and may even include yellow pixels. Pixel (Y), the present application is not limited thereto.
  • the projected area of the first via hole 161 on the base substrate 100 is greater than or equal to the projected area of one sub-pixel on the base substrate 100 . As shown in FIG. 7 , the projected area of the first via hole 161 on the base substrate is larger than the projected area of the two sub-pixels R and G on the display panel.
  • the driving panel of the display device can realize the frameless design of the driving panel based on the passive driving mode by arranging the signal connection lines connecting the row scanning lines in the display area of the driving panel. Meet the needs of users in the market for narrow borders.
  • the signal connection line passes through the via hole with an area larger than at least one pixel, which improves the current carrying capacity of the signal connection line and improves the reliability of the product.
  • the signal connection line can pass through the top metal pad on the driving panel, namely the first electrode pad and the second electrode pad, and light-emitting devices such as Micro-LED.
  • the top metal pad on the driving panel namely the first electrode pad and the second electrode pad, and light-emitting devices such as Micro-LED.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本申请实施例公开一种驱动面板和应用所述驱动面板的显示装置。驱动面板例如包括：衬底基板，包括显示区域和非显示区域；列扫描线，设置在衬底基板上的显示区域内；行扫描线，与列扫描线相互交错设置在显示区域内；信号连接线，设置在衬底基板上的显示区域内，信号连接线电连接行扫描线；驱动电路，设置在衬底基板的非显示区域内、与列扫描线和信号连接线分别形成电连接；第一电极焊盘，设置在衬底基板上的显示区域内、且电连接列扫描线；以及第二电极焊盘，设置在衬底基板上的显示区域内、且电连接行扫描线和信号连接线。本申请实施例的驱动面板相对于现有驱动面板而言，实现了窄边框甚至是无边框面板，扩大了驱动面板的市场应用。

Description

驱动面板和显示装置 技术领域
本申请涉及显示技术领域，尤其涉及一种驱动面板和一种显示装置。
背景技术
随着微型发光二极管(Micro-LED)显示的发展，无边框显示驱动成为未来市场设计亮点乃至趋势。而目前无源驱动的驱动面板是通过利用驱动面板的非显示区域内的左右边框进行走线至下边框到驱动电路进行绑定连接，从而使得驱动面板的边框较宽。考虑到common driver信号电流相对较大，同步要考虑信号连接线的线宽，搭配左右走线，占用更大的边框。因此，实现无边框显示驱动是目前有待解决的技术问题。
发明内容
因此，为克服现有技术存在的至少部分缺陷与不足，本申请实施例提供了一种驱动面板和一种显示装置，解决了现有技术中的驱动面板的边框较宽的问题，实现了窄边框甚至是无边框面板，扩大了驱动面板的市场应用。
具体地，本申请实施例提供的一种驱动面板，例如包括：衬底基板，包括显示区域和非显示区域；列扫描线，设置在所述衬底基板上的显示区域内；行扫描线，与所述列扫描线相互交错设置在所述显示区域内；信号连接线，设置在所述衬底基板上的所述显示区域内，所述信号连接线电连接所述行扫描线；驱动电路，设置在所述衬底基板的所述非显示区域内、与所述列扫描线和所述信号连接线分别形成电连接；第一电极焊盘，设置在所述衬底基板上的所述显示区域内、 且电连接所述列扫描线；以及第二电极焊盘，设置在所述衬底基板上的所述显示区域内、且电连接所述行扫描线和所述信号连接线。
在本申请的一个具体实施例中，所述驱动面板还包括第一绝缘层，所述第一绝缘层覆盖在所述行扫描线上、且位于所述行扫描线和所述信号连接线之间，所述第一绝缘层上设置有第一过孔，所述行扫描线通过所述第一过孔电连接所述信号连接线。
在本申请的一个具体实施例中，所述驱动面板还包括第二绝缘层，所述第二绝缘层覆盖在所述信号连接线和所述第一绝缘层上且位于所述第二电极焊盘和所述信号连接线之间，所述第二绝缘层还位于所述第一绝缘层和所述列扫描线之间；所述第二绝缘层上设置有第二过孔，所述第二电极焊盘通过所述第二过孔电连接所述信号连接线。
在本申请的一个具体实施例中，所述驱动面板还包括平坦层，所述平坦层覆盖在所述第二绝缘层上和所述列扫描线上，所述第一电极焊盘贯穿所述平坦层并电连接所述列扫描线。
在本申请的一个具体实施例中，所述第一电极焊盘上具有第一绑定面，所述第二电极焊盘上具有第二绑定面，所述第一绑定面和所述第二绑定面分别位于所述平坦层远离所述衬底基板的一侧，所述第一绑定面到所述衬底基板的最小距离等于所述第二绑定面到所述衬底基板的最小距离。
在本申请的一个具体实施例中，所述列扫描线与所述信号连接线平行设置，所述列扫描线与所述信号连接线和所述行扫描线垂直设置。
另一方面，本申请一实施例提供的一种显示装置，例如包括：如前所述的驱动面板；以及发光器件，设在所述驱动面板上，其中所述发光器件包括第一电极 和第二电极，所述第一电极电连接所述驱动面板的所述第一电极焊盘，所述第二电极电连接所述驱动面板的所述第二电极焊盘。
在本申请的一个具体实施例中，所述行扫描线和所述列扫描线相互交错形成有像素单元；所述像素单元内设置有多个所述发光器件，多个所述发光器件形成多个子像素；所述第一过孔在所述衬底基板上的投影的面积为至少一个所述子像素在所述衬底基板上的投影的面积。
在本申请的一个具体实施例中，所述发光器件为微米发光二极管或次毫米发光二极管。
在本申请的一个具体实施例中，所述显示装置还包括封装层，所述封装层覆盖在所述发光器件和所述驱动面板上。
由上可知，本申请实施例通过在驱动面板的显示区域内设置连接行扫描线的信号连接线，可以实现基于无源驱动方式的驱动面板的窄边框甚至无边框设计，满足市场上的用户对窄边框的需求。此外，信号连接线通过面积等于或大于至少一个像素的面积的过孔连接行扫描线，提升了信号连接线的载流能力，提升了产品的可靠性。信号连接线在驱动面板上的有机膜层保护下，可通过驱动面板上的顶层金属焊盘即第一电极焊盘和第二电极焊盘与发光器件电连接。再者，通过设置平坦层，有利于顶层金属焊盘即第一电极焊盘和第二电极焊盘与发光器件的绑定(bonding)，提升产品的质量和可靠性。
附图说明
为了更清楚地说明本申请实施例的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下， 还可以根据这些附图获得其他的附图。
图1为本申请一实施例提供的一种显示装置的截面示意图。
图2为本申请一实施例提供的一种显示装置的平面示意图。
图3为图2所示的驱动面板的结构示意图。
图4为图2中A区域的局部放大示意图。
图5为图3所示的驱动面板的截面示意图。
图6为图5所示的电极焊盘与显示面板之间的位置关系的示意图。
图7为第一过孔与像素单元的结构示意图。
具体实施方式
为了使本申请实施例的目的、技术方案和优点更加清楚，下面将结合附图对本申请实施例中的技术方案进行清楚、完整的描述，显然，所描述的实施例仅仅是本申请的部分实施例，而不是全部实施例。基于本申请描述的实施例，本领域普通技术人员在没有付出创造性劳动的前提下所获得的所有其他实施例，都属于本申请的保护范围。
需要说明，本申请实施例中所有方向性指示(诸如上、下、左、右、前、后、顶、底)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。此外，在发明实施例及权利要求书中所涉及的术语“垂直”是指两个元件之间的夹角为90°或者存在-5°～+5°的偏差，所涉及的术语“平行”是指两个元件之间的夹角为0°或者存在-5°～+5°的偏差。
在本申请实施例中如涉及“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定 有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。
参见图1和图2，本申请实施例提供了一种显示装置50。本申请实施例提供的显示装置50，可例如为微米发光二极管显示装置、次毫米发光二极管显示装置等微型发光二极管显示装置。显示装置50例如包括：驱动面板10和发光器件30等。发光器件30设置在所述驱动面板10上且电连接所述驱动面板10。发光器件30例如为微型发光二极管(Micro-LED)。微型发光二极管(Micro-LED)通常是指其长度(length)、宽度(width)、厚度(thickness)均小于100微米(μm)的半导体发光二极管芯片，例如包括微米发光二极管或次毫米发光二极管(Mini LED)，甚至其它类似发光器件。
此外，所述显示装置50还例如包括封装层40。封装层40例如覆盖在所述发光器件30和所述驱动面板10上。封装层40可以将发光器件例如Micro LED和/或发光器件电路例如Micro IC的位置相互固定，并起到保护作用。封装层40的材料例如可以包括环氧树脂和有机硅树脂材料，或其它材料。
此外，显示装置50例如为被动矩阵(passive matrix,PM)式显示装置，因此，驱动面板10例如为无源驱动面板。驱动面板10用于控制发光器件30的点亮和关闭，以使得显示装置50可以显示相应画面。
具体地，驱动面板10例如包括衬底基板110和设置在衬底基板110上的行扫描线120、列扫描线130、信号连接线140、驱动电路150、第一电极焊盘190和第二电极焊盘200。
如图3所示，衬底基板110例如为玻璃基板等。衬底基板110上包括显示区域111和非显示区域112。行扫描线120、列扫描线130和信号连接线140分别设置在显示区域111内。具体地，如图3所示，列扫描线130沿竖直方向(或列方 向)设置在显示区域111内。行扫描线120沿水平方向(或行方向)设置在显示区域111内。也即，行扫描线120和列扫描线130相互交错地设置在显示区域111内。优选地，行扫描线120和列扫描线130相互垂直地设置在显示区域111内。信号连接线140设置在显示区域111内，所述信号连接线140电连接所述行扫描线120。优选地，信号连接线140可例如与列扫描线130相互平行设置。优选地，信号连接线140与列扫描线130相互垂直设置在显示区域111内。信号连接线140在衬底基板110上的投影可例如与列扫描线130在衬底基板110上的投影相互平行、重叠、甚至重合，本申请不以此为限。举例来说，信号连接线140在衬底基板110上的投影可例如与列扫描线130在衬底基板110上的投影相互平行且交替分布，也即在图3中的水平方向上，相邻两根信号连接线140之间设置有一根列扫描线130，相邻两根列扫描线130之间设置有一根信号连接线140。另外，也可以是，相邻两根信号连接线140之间设置有三根列扫描线130并依次交替。此外还可以是，信号连接线140在衬底基板110上的投影可例如与列扫描线130在衬底基板110上的投影重合，也即由于信号连接线140和列扫描线130位于驱动面板10的不同层，因此，两者在衬底基板110上的投影重合。信号连接线140与驱动电路150电连接，行扫描线120通过信号连接线140与驱动电路150电连接。
第一电极焊盘190电连接行扫描线120，第二电极焊盘200电连接列扫描线130和信号连接线140。第一电极焊盘190和第二电极焊盘200成对设置，用于连接发光器件30。发光器件30与第一电极焊盘190和第二电极焊盘200键合。具体地，如图4所示，发光器件30也例如包括成对设置的第一电极31和第二电极32。举例来说，发光器件30为Micro-LED，第一电极31为阴极(或成为N极)，第二电极32为阳极(或成为P极)。第一电极31电连接驱动面板10的第一电极焊 盘190，所述第二电极32电连接所述驱动面板10的所述第二电极焊盘200。此外，发光器件30还例如包括依次层叠设置的第一半导体层例如、有源层例如多量子阱层和第二半导体层。第一电极31和第二电极32可例如为点状金属电极或条状金属电极，当然也可以为其它形状的金属电极，本申请不以此为限。进一步地，发光器件30还可以是由多个发光元件沿竖直方向依次堆叠且串联连接以形成堆叠发光结构。在所述堆叠发光结构中，每相邻两个发光元件中的一个发光元件的第一电极与另一个发光元件的第二电极键合以形成电连接。此处的键合例如是采用金属键合工艺，例如来说，所述第一电极与所述第二电极是通过纯锡(Sn)层、金锡(Sn/Au)层、钛铜(Ti/Cu)层、铝镍金(Al/Ni/Au)层或钛镍锡(Ti/Ni/Sn)在加热受压条件下形成键合连接。当然，每相邻两个发光元件的电极之间也可以采用其它键合连接方式，只要保证发光单元中间有透光区域、不会完全阻挡发光元件的出光均可。具体地，多个发光元件可例如是相同颜色发光元件，例如均为红光发光元件、均为蓝光发光元件、均为绿光发光元件、或其他相同颜色发光元件，从而整体形成一种单色串联高压发光器件。当然，在本申请其他实施方式中，各个发光元件也可以是不同颜色发光元件，例如可以是红色发光元件、绿色发光元件和蓝色发光元件三种混合，从而可以产生包含红、绿、蓝三种颜色的多光谱出光，也即整体形成一种多色串联高压发光器件。此次，本实施例由于其单个像素采用单色串联高压发光器件比如单色串联高压Micro-LED芯片，相对于现有技术中采用单PN结构之Micro-LED芯片作为像素之情形，其可以在保持一定亮度的前提下降低驱动电流，进而可以降低显示装置的功耗。此外，所述堆叠串联结构预先形成，从而不会增加巨量转移难度。再者，由于所述堆叠串联结构中的各个发光元件为在竖直方向上依次堆叠设置，其不会增加在所述驱动基板81上的占用空间，也即不会降低分辨率PPI。
此处值得一提的是，行扫描线120、列扫描线130、信号连接线140、第一电极焊盘190和第二电极焊盘200分别通过图形化蚀刻、沉积或溅镀制程工艺布设在所述衬底基板110上。行扫描线120、列扫描线130、信号连接线140、第一电极焊盘190和第二电极焊盘200位于衬底基板110上不同的层上。行扫描线120、列扫描线130、信号连接线140、第一电极焊盘190和第二电极焊盘200分别例如为透明导电线，其材料例如为铜或其它透明导电材料。此外，行扫描线120、列扫描线130、信号连接线140、第一电极焊盘190和第二电极焊盘200的数量分别为多个，如图1和图2所示。
如前所述，通过在衬底基板上的显示区域内设置信号连接线并与行扫描线电连接，行扫描线通过信号连接线与驱动电路电连接，如此一来，可以缩小了驱动面板上的边框的宽度，从而可以实现小边框甚至是无边框面板，满足市场上更多用户的需求。
进一步地，如图5所示，驱动面板10还可以包括第一绝缘层160。行扫描线120设置在衬底基板110的一侧上。第一绝缘层160覆盖在行扫描线120和衬底基板110上。信号连接线140形成在第一绝缘层160上。第一绝缘层160上邻近行扫描线120处设置有第一过孔161，第一过孔161例如为通孔。信号连接线140通过第一过孔161电连接行扫描线120。另外，第一绝缘层160的材料可例如为氧化硅、氮化硅、氧化锆、氮氧化硅或氮化硅等。
此外，驱动面板10还例如包括第二绝缘层170。所述第二绝缘层170覆盖在所述信号连接线140和第一绝缘层160上。所述第二绝缘层170位于所述第二电极焊盘190和所述信号连接线140之间；所述第二绝缘层170上设置有第二过孔171，所述第二电极焊盘190通过所述第二过孔171电连接所述信号连接线140。 列扫描线130设置在第二绝缘层170上。第一电极焊盘200电连接列扫描线130。另外，第二绝缘层170的材料可例如为氧化硅、氮化硅、氧化锆、氮氧化硅或氮化硅等。
进一步地，所述驱动面板10还包括平坦层180。所述平坦层180覆盖在所述第二绝缘层170上和所述列扫描线130上，所述第一电极焊盘200贯穿所述平坦层并电连接所述列扫描线130；所述第一电极焊盘190贯穿所述平坦层180和所述第二绝缘层170并电连接信号连接线140。平坦层180可以为任何合适的有机材料，具体的，可以为丙烯酸树脂、环氧树脂、硅树脂、聚乙烯醇等合适的材料，更具体的，可以通过喷涂、刮涂、旋涂、点胶等合适的工艺形成。平坦层180用于平坦化第二绝缘层170及列扫描线130，使得第一电极焊盘200和第二电极焊盘190等高，以利于发光器件30的绑定。更具体地，如图6所示，第一电极焊盘200上具有第一绑定面201，所述第二电极焊盘190上具有第二绑定面191，所述第一绑定面201和所述第二绑定面191分别位于所述平坦层180远离所述衬底基板100的一侧。所述第一绑定面201到所述衬底基板100的最小距离D1等于所述第二绑定面191到所述衬底基板100的最小距离D2。
此外，如图3所示，衬底基板100还可以包括与所述显示区域111相邻的非显示区域112；所述驱动面板10还包括驱动电路150。所述驱动电路150设置在所述衬底基板100的所述非显示区域112中。所述列扫描线130和所述信号连接线140分别连接所述驱动电路150。具体地，所述驱动面板10还包括扇出线路210。扇出线路设置在非显示区域112中。所述列扫描线130和所述信号连接线140分别通过扇出线路210连接所述驱动电路150，行扫描线120通过所述信号连接线140及所述扇出线路210连接所述驱动电路150。扇出线路210的设置，可以缩小 驱动电路150在所述驱动面板10上所占的面积。
驱动电路150用于通过行扫描线120和列扫描线130控制发光器件30的显示。驱动电路150可采用现有技术中的驱动电路。典型地，驱动电路150还可以包括分别连接行扫描线120和列扫描线130的行驱动电路和列驱动电路，其具体结构此次不再赘述。
此外，在本申请其它的实施例中，如图3和图7所示，所述行扫描线120和所述列扫描线130的数量分别为多个，所述多个行扫描线120和所述多个列扫描线130相互交错形成有多个像素单元300。每个像素单元300例如包括依次排布的多个像素。此次，多个像素例如包括红色像素(R)、绿色像素(G)以及蓝色像素(G)。当然，在其它实施例中，每个像素单元300例如包括依次排布的红色像素(R)、绿色像素(G)、蓝色像素(G)以及白色像素(G)等，甚至还可以包括黄色像素(Y)，本申请不以此为限。所述第一过孔161在所述衬底基板100上的投影的面积大于等于一个所述子像素在所述衬底基板100上的投影的面积。如图7所示，第一过孔161在衬底基板上的投影的面积大于两个子像素R和G在显示面板上的投影的面积。
综上所述，本申请实施例提供的显示装置的驱动面板，通过在驱动面板的显示区域内设置连接行扫描线的信号连接线，可以实现基于无源驱动方式的驱动面板的无边框设计，满足市场上的用户对窄边框的需求。此外，信号连接线通过面积大于至少一个像素的面积的过孔，提升了信号连接线的载流能力，提升了产品的可靠性。信号连接线在驱动面板上的有机膜层保护下，可通过驱动面板上的顶层金属pad即第一电极焊盘和第二电极焊盘与发光器件例如Micro-LED。再者，通过设置平坦层，有利于顶层金属pad即第一电极焊盘和第二电极焊盘与发光器件例如 Micro-LED的绑定(bonding)，提升产品的质量和可靠性。
可以理解的是，前述各个实施方式仅为本申请的示例性说明，在技术特征不冲突、结构不矛盾、不违背本申请的发明目的前提下，各个实施方式的技术方案可以任意组合、搭配使用。
最后应说明的是：以上实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围。

Claims (10)

  1. 一种驱动面板，包括：
    衬底基板，包括显示区域和非显示区域；
    列扫描线，设置在所述衬底基板上的显示区域内；
    行扫描线，与所述列扫描线相互交错设置在所述显示区域内；
    信号连接线，设置在所述衬底基板上的所述显示区域内，所述信号连接线电连接所述行扫描线；
    驱动电路，设置在所述衬底基板的所述非显示区域内、与所述列扫描线和所述信号连接线分别形成电连接；
    第一电极焊盘，设置在所述衬底基板上的所述显示区域内、且电连接所述列扫描线；
    第二电极焊盘，设置在所述衬底基板上的所述显示区域内、且电连接所述行扫描线和所述信号连接线。
  2. 如权利要求1所述的驱动面板，其中，所述驱动面板还包括第一绝缘层，所述第一绝缘层覆盖在所述行扫描线上、且位于所述行扫描线和所述信号连接线之间，所述第一绝缘层上设置有第一过孔，所述行扫描线通过所述第一过孔电连接所述信号连接线。
  3. 如权利要求2所述的驱动面板，其中，所述驱动面板还包括第二绝缘层，所述第二绝缘层覆盖在所述信号连接线和所述第一绝缘层上且位于所述第二电极焊盘和所述信号连接线之间，所述第二绝缘层还位于所述第一绝缘层和所述列扫描线之间；所述第二绝缘层上设置有第二过孔，所述第二电极焊盘通过所述第二过 孔电连接所述信号连接线。
  4. 如权利要求3所述的驱动面板，其中，所述驱动面板还包括平坦层，所述平坦层覆盖在所述第二绝缘层上和所述列扫描线上，所述第一电极焊盘贯穿所述平坦层并电连接所述列扫描线。
  5. 如权利要求4所述的驱动面板，其中，所述第一电极焊盘上具有第一绑定面，所述第二电极焊盘上具有第二绑定面，所述第一绑定面和所述第二绑定面分别位于所述平坦层远离所述衬底基板的一侧，所述第一绑定面到所述衬底基板的最小距离等于所述第二绑定面到所述衬底基板的最小距离。
  6. 如权利要求1所述的驱动面板，其中，所述列扫描线与所述信号连接线平行设置，所述列扫描线与所述信号连接线和所述行扫描线垂直设置。
  7. 一种显示装置，包括：
    如权利要求1-6所述的驱动面板；以及
    发光器件，设在所述驱动面板上，其中所述发光器件包括第一电极和第二电极，所述第一电极电连接所述驱动面板的所述第一电极焊盘，所述第二电极电连接所述驱动面板的所述第二电极焊盘。
  8. 如权利要求7所述的显示装置，其中，所述行扫描线和所述列扫描线相互交错形成有像素单元；所述像素单元内设置有多个所述发光器件，多个所述发光器件形成多个子像素；所述第一过孔在所述衬底基板上的投影的面积为至少一个所述子像素在所述衬底基板上的投影的面积。
  9. 如权利要求7所述的显示装置，其中，所述发光器件为微米发光二极管或次毫米发光二极管。
  10. 如权利要求7所述的显示装置，其中，所述显示装置还包括封装层，所述 封装层覆盖在所述发光器件和所述驱动面板上。
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