WO2023119881A1 - Dispositif d'inspection de tranche - Google Patents

Dispositif d'inspection de tranche Download PDF

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Publication number
WO2023119881A1
WO2023119881A1 PCT/JP2022/040597 JP2022040597W WO2023119881A1 WO 2023119881 A1 WO2023119881 A1 WO 2023119881A1 JP 2022040597 W JP2022040597 W JP 2022040597W WO 2023119881 A1 WO2023119881 A1 WO 2023119881A1
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WO
WIPO (PCT)
Prior art keywords
wafer
adhesive film
unit
inspection
ring
Prior art date
Application number
PCT/JP2022/040597
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English (en)
Japanese (ja)
Inventor
達也 越智
恭史 小山
和勝 神田
Original Assignee
東レエンジニアリング株式会社
東レエンジニアリング先端半導体Ｍｉテクノロジー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東レエンジニアリング株式会社, 東レエンジニアリング先端半導体Ｍｉテクノロジー株式会社 filed Critical 東レエンジニアリング株式会社
Priority to CN202280081104.2A priority Critical patent/CN118369752A/zh
Publication of WO2023119881A1 publication Critical patent/WO2023119881A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Definitions

  • the present invention relates to an apparatus for inspecting wafers supported by an adhesive film attached to a ring-shaped frame.
  • Chip parts such as semiconductor devices are manufactured through a process of laminating circuit patterns on a silicon wafer at a predetermined repetition pitch, dicing them into predetermined dimensions, and packaging them.
  • Various inspections are performed during the manufacturing process to check whether the circuit patterns to be laminated are formed in a desired state (for example, Patent Document 1).
  • semiconductor devices are sometimes inspected by a transmitted illumination method using the property that silicon wafers transmit infrared rays (for example, Patent Document 2).
  • a wafer to be diced is supported by an adhesive film attached to a ring-shaped frame on the lower surface side with the circuit forming surface facing up. Then, while holding the ring-shaped frame in a predetermined posture, the wafer is singulated by lifting (that is, expanding) the wafer from below with a push-up member (for example, Patent Document 3).
  • the wafer supported by the adhesive film as described above is placed in a predetermined position.
  • the adhesive film is made by stretching the diced wafer into chips, it is flexible and easily deformed. That is, if holes or grooves are provided on the surface of the support member and negative pressure is sucked with a strong force, the adhesive film may be locally deformed (elongated, etc.) and may not return to its original state. On the other hand, if the negative pressure suction force is weakened, there is a possibility that the wafer may be misaligned or may be unsucked when it is moved while being held.
  • the present invention provides a wafer inspection apparatus that can reliably hold a easily deformable film material without causing local deformation (such as elongation) when inspecting the wafer attached to the film material. intended to
  • one aspect of the present invention includes: A wafer inspection device for inspecting a wafer supported by an adhesive film attached to a ring-shaped frame, a holding part that contacts the adhesive film and holds the wafer in a predetermined posture; an illumination unit that irradiates illumination light toward the wafer; an imaging unit for imaging the exterior and/or interior of the wafer; an inspection unit that performs an inspection based on an inspection image that captures the exterior and/or interior of the wafer captured by the imaging unit;
  • the holding part is The part that contacts the adhesive film is a porous member, A porous member is arranged to surround the wafer in a region set outside the outer edge of the wafer.
  • the lower surface of the adhesive film can be sucked and held in a relatively wide area outside the outer edge of the wafer with a negative pressure slightly lower than the atmosphere.
  • the three axes of the orthogonal coordinate system are X, Y, and Z
  • the horizontal directions are expressed as the X direction and the Y direction
  • the direction perpendicular to the XY plane that is, the direction of gravity
  • the Z direction is expressed as the Z direction. do.
  • the direction against gravity is expressed as up
  • the direction in which gravity acts is expressed as down.
  • the direction of rotation with the Z direction as the center axis is defined as the ⁇ direction.
  • the wafer inspection device 1 inspects a wafer W supported by an adhesive film M attached to a ring-shaped frame F.
  • FIG. 1 is a schematic diagram showing an example of a wafer inspection apparatus in a mode embodying the present invention.
  • FIG. 1(a) shows a perspective view and a block diagram of the positional relationship between each component of the wafer inspection apparatus 1 and the wafer W to be held.
  • FIG. 1(b) shows a cross-sectional view of the positional relationship between each component of the wafer inspection apparatus 1 and the wafer W to be held.
  • the wafer inspection apparatus 1 receives a ring-shaped frame F transported by a handler or the like (not shown) in a horizontal state, and inspects the wafer W while holding it in a predetermined posture.
  • the wafer W to be inspected may be a semiconductor device chip part (for example, a circuit pattern is formed on the upper surface) or a MEMS part (a structure or the like is formed inside). ) can be exemplified.
  • the wafer inspection apparatus 1 includes a holding section 2 , an illumination section 3 , an imaging section 4 and an inspection section 5 . Further, the wafer inspection apparatus 1 includes a moving section M, a computer CP, a controller CN, and the like.
  • the holding part 2 is in contact with the adhesive film M to hold the wafer W in a predetermined posture.
  • the holding unit 2 supports and holds the adhesive film M from the lower surface side so that the wafer W is maintained in a horizontal posture and is not displaced in the horizontal and vertical directions.
  • the holding portion 2 has a ring shape with a predetermined width, which looks like a disc hollowed out, and includes a body portion 20, a frame support portion 21, a film contact portion 22, a communication portion 23, and the like. I have.
  • the frame support portion 21 supports the lower portion of the ring-shaped frame F from the lower surface side. Specifically, the frame supporting portion 21 supports the ring-shaped frame F from the lower surface side so that the ring-shaped frame F is not displaced in the vertical direction while maintaining a horizontal posture. More specifically, the frame supporting portion 21 is made of a ring-shaped metal or resin rigid member having a flat upper surface, and is attached to the lower surface of the ring-shaped frame F and/or the lower surface of the ring-shaped frame F. It is configured to support the ring-shaped frame F by coming into contact with the lower surface of the adhesive film M applied.
  • the film contact part 22 contacts the adhesive film M. As shown in FIG. Specifically, the film contact portion 22 contacts the lower surface of the adhesive film M to support and hold the wafer W supported by the adhesive film M in a predetermined posture. The inner edge 22n is arranged so as to surround the wafer W in an area E set radially outside the outer edge We of the wafer W. As shown in FIG. More specifically, the film contact portion 22 is made of a porous member. The porous member is made by collecting and hardening metal or resin having a small particle size, and has an internal structure in which the upper surface, the lower surface, and the side surfaces are mutually air permeable. Specifically, the film contact portion 22 has an uneven surface, but is formed or processed to have a flat upper end when viewed as a whole.
  • the communication portion 23 connects the lower surface or the inside of the film contact portion 22 and the negative pressure generating means V arranged inside or outside the apparatus.
  • the communicating portion 23 is configured by grooves, holes, or the like provided in the main body portion 20 of the holding portion 2, and is connected to the negative pressure generating means V via the switching valve 24 or the like.
  • the negative pressure generating means V makes the inside of the film contact portion 22 have a negative pressure lower than the atmospheric pressure.
  • the negative pressure generating means V can be exemplified by a vacuum pump, an ejector, and the like.
  • the following arrangement can be exemplified. From the inside, the outer edge We of the wafer W, the inner edge 22n of the film contact portion 22, the inner edge Rn of the ring-shaped frame R, the outer edge 22e of the film contact portion 22, the outer edge Me of the adhesive film M, and the outer edge Rn of the ring-shaped frame R. and the outer edge of the frame support portion 21 .
  • the holding portion 2 Since the holding portion 2 has such a structure, the film contact portion 22 is brought into contact with the adhesive film M to which the wafer W is attached, and the film contact portion 22 is set to a negative pressure. , a suction force can be generated in the space formed by the adhesive film M and the porous member. Therefore, the adhesive film M is sucked and held by the film contact portion 22, and the wafer W is held in a predetermined posture.
  • the illumination unit 3 irradiates the wafer W with illumination light L1.
  • the imaging field F is irradiated with a predetermined amount of illumination light L1 so that the observation light L2 required for imaging by the imaging unit 4 can be obtained.
  • the illumination unit 3 can be an LED illumination, a metal halide lamp, a xenon lamp, a laser diode, or the like, which is arranged inside and below the film contact portion 22 of the holding portion 2 .
  • the lighting unit 3 switches between light emission and light extinction, or emits strobe light at a predetermined place and timing based on signal control from the outside (the controller CN in this embodiment).
  • the imaging unit 4 is for imaging the appearance and/or the inside of the wafer W. As shown in FIG. Specifically, the imaging unit 4 outputs to the outside (computer CP in this embodiment) a video signal and video data of an inspection image G obtained by imaging the exterior and/or interior of the wafer W.
  • the illumination unit 3 and the imaging unit 4 are arranged opposite to each other so that the illumination light L1 transmitted through the wafer W is incident on the imaging unit 4 . More specifically, the imaging unit 4 uses an imaging camera having an imaging device (a so-called image area sensor) with a predetermined area, or an imaging device that emits illumination light L2 that has passed through the wafer W to capture an image of the upper surface or the interior of the wafer W. is provided with a lens or the like for forming an image of the image on the imaging device.
  • an imaging device a so-called image area sensor
  • the inspection unit 5 performs inspection based on an inspection image G obtained by imaging the exterior and/or the interior of the wafer W captured by the imaging unit 4 . Specifically, the inspection unit 5 performs image processing and the like on the inspection image G, performs difference processing on a comparison image serving as an inspection reference, detects defects and foreign matter, and detects luminance information of pixels. Defects, foreign matter, etc. are detected based on this. Then, information about the position and size of the detected defect or foreign matter is output to a display device, a host computer, or the like. More specifically, the inspection unit 5 is composed of a processing unit, an image processing unit, etc. of the computer CP, an execution program, and the like.
  • the moving part M relatively moves the holding part 2 and the imaging part 4 .
  • the moving part M includes a holding part 2 holding the wafer W and an imaging part 4 so that the inspection area set on the surface and/or inside of the wafer W can be imaged by the imaging part 4 all over. , and the image pickup area F of is relatively moved.
  • the moving part M includes an XY stage mechanism that moves the main body part 20 of the holding part 2 in the XY directions at a predetermined speed or stops it at a predetermined position, and an XY stage mechanism that rotates the holding part 2 in the ⁇ direction. It is provided with a combination of a rotating mechanism for moving the stage and keeping it stationary at a predetermined angle (so-called XY ⁇ stage mechanism), and is attached to the apparatus frame 1f.
  • the computer CP inputs signals and data from the outside, performs predetermined arithmetic processing and image processing, and outputs signals and data to the outside. Specifically, the computer CP performs the following functions. ⁇ Setting and registration of the size of the imaging visual field F, imaging position, order, etc. ⁇ Setting and registration of inspection conditions, etc. ⁇ Input and image processing of the inspection image G, and more specifically, the inspection processing based on the inspection conditions, the computer CP , input unit and output unit, storage unit (called register or memory), control unit and arithmetic unit (called CPU or MPU), image processing unit (called GPU), auxiliary storage device (HDD, SSD, etc.), etc. ( hardware) and its execution program (that is, software).
  • storage unit called register or memory
  • control unit and arithmetic unit called CPU or MPU
  • image processing unit called GPU
  • auxiliary storage device HDD, SSD, etc.
  • execution program that is, software
  • the controller CN inputs/outputs signals and data to/from external devices (in this embodiment, each device such as the holding unit 2, the illumination unit 3, the imaging unit 4, the computer CP, etc.) and performs predetermined control processing. be. Specifically, the controller CN performs the following functions. ⁇ Output a drive signal to the switching valve 24 of the holding unit 2 to hold/release the wafer W. ⁇ Output a signal for ON/OFF of the illumination light L1 to the lighting unit 3. ⁇ To the imaging camera of the imaging unit 4.
  • an imaging trigger is output and the drive control of the moving part M: While monitoring the current position and angle of the XY ⁇ stage mechanism, a drive signal is output to control the position and angle More specifically, the controller
  • the CN is composed of a part of the computer CP, a dedicated programmable logic controller, etc. (that is, hardware), and its execution program, etc. (that is, software).
  • the wafer inspection apparatus 1 Since the wafer inspection apparatus 1 according to the present invention has such a configuration, the lower surface of the adhesive film M can be sucked by applying a negative pressure to a relatively wide area outside the outer edge We of the wafer W. At this time, the lower surface of the adhesive film M can be sucked and held securely even with a negative pressure slightly lower than the atmospheric pressure. Therefore, when inspecting a wafer attached to a film material, even a film material that is easily deformed can be reliably held without causing local deformation (such as elongation).
  • the positional relationship between the wafer W supported by the adhesive film M attached to the ring-shaped frame R and each part of the holding unit 2 is the outer edge Rn of the ring-shaped frame R and the adhesive film M.
  • An example is shown in which the outer edge 22e of the film contact portion 22 (that is, the boundary with the frame support portion 21) is arranged inside the outer edge Me.
  • the outer edge 22e of the film contact portion 22 is arranged inside the inner edge Rn of the ring-shaped frame R. Also good. By doing so, the ring-shaped frame R does not exist above the film contact portion 22, and only the adhesive film M can be supported from the lower surface side. Even if it is, the adhesiveness with the adhesive film M is increased, so it is preferable.
  • FIG. 2 is a schematic diagram showing another example of a wafer inspection apparatus in a mode embodying the present invention.
  • FIG. 2(a) shows a perspective view and a block diagram of the positional relationship between each component of the wafer inspection apparatus 1 and the wafer W to be held.
  • FIG. 2(b) shows a cross-sectional view of the positional relationship between each component of the wafer inspection apparatus 1 and the wafer W to be held.
  • the holding portion 2 has the same height (that is, there is no step) between the upper end surface of the frame support portion 21 and the contact surface (ie, upper end surface) of the film contact portion 22 .
  • the holding portion 2 is not limited to such a configuration, and the contact surface (that is, the upper end surface) of the film contact portion 22 is closer to the upper end surface of the frame support portion 21 than the upper end surface of the frame support portion 21 . It may be arranged upward (the film contact portion 22 protrudes).
  • the film contact portion 22 protrudes from the upper end surface of the frame support portion 21, the gap between the lower surface of the adhesive film M and the film contact portion 22 is reduced, and the adhesion when negative pressure is sucked increases, which is preferable. .
  • the amount of protrusion of the film contact portion 22 may be set larger than the amount of deformation due to warpage, undulation, etc. of the ring-shaped frame R. By doing so, when the ring-shaped frame R is placed on the holding portion 2, the lower surface of the adhesive film M is in contact with the film contact portion 22 without gaps over the entire circumference. is higher and preferable.
  • the inner edge 22n of the film contact portion 22 of the holding portion 2 is arranged outside the outer edge We of the wafer W supported by the adhesive film M attached to the ring-shaped frame R (that is, , which is hollow immediately below the wafer W) configuration.
  • the holding portion 2 is not limited to such a configuration, and may be configured to include the auxiliary support portion 6 .
  • the auxiliary support portion 6 supports a predetermined portion radially inward of the outer edge We of the wafer W. As shown in FIG. Specifically, the auxiliary support section 6 supports the adhesive film M from the lower surface side of the wafer W so that the wafer W, which tends to bend, can be held in a predetermined posture. More specifically, the auxiliary support portion 6 is made of a member through which the illumination light L1 is transmitted, and is made of a material through which the illumination light L1 is transmitted to obtain a sufficient amount of the observation light L2 (that is, a substantially transparent material). material) is acceptable.
  • the auxiliary support portion 6 is made of a material that transmits visible light, such as a glass plate, acrylic resin, or polycarbonate resin. Also, if the wafer W is a silicon crystal and the illumination light L1 is near-infrared light, the auxiliary support 6 may be made of silicon crystal.
  • the holding portion 2 may be configured such that the upper end surface of the auxiliary support portion 6 and the upper end surface of the film contact portion 22 are at the same height (that is, there is no step), but they are arranged at different heights. But it's okay.
  • the holding part 2 may be provided with a height adjusting part 7 .
  • the height adjustment portion 7 adjusts the height of the contact surface (that is, upper end surface) of the auxiliary support portion 6 that contacts the adhesive film M to the height of the contact surface (that is, upper end surface) of the film contact portion 22.
  • the height adjuster 7 can be exemplified by an electric actuator, a hand screw, a spacer, and the like.
  • the height adjustment unit 7 may set a difference in height (that is, a difference in level) according to the degree of deformation of the wafer W and the ring-shaped frame R to be handled, the thickness and flexibility of the adhesive film M, and the like.
  • the height adjusting portion 7 changes the height of the contact surface (that is, the upper end surface) of the auxiliary support portion 6 .
  • the height adjusting portion 7 may be configured to change the height of the contact surface (that is, the upper end surface) of the film contact portion 22 with respect to the upper end surface of the frame support portion 21 .
  • the configuration in which the illumination unit 3 and the imaging unit 4 are vertically opposed to each other with the wafer W therebetween is exemplified.
  • the illumination unit 3 and the imaging unit 4 are not limited to such a configuration, and may be arranged above the wafer W (so-called reflection illumination method).
  • the upper surface of the frame support portion 21 is formed of a flat ring-shaped hard member such as metal or resin. With such a configuration, it is easy to prevent vertical positional displacement while maintaining the ring-shaped frame F in a horizontal position, which is preferable.
  • the upper surface of the frame supporting portion 21 is not limited to such a structure, and may be made of an elastic material such as sponge, rubber, or flexible resin.
  • the film contact portion 22 has shown an example in which the porous members are arranged in a ring shape (that is, continuously) with a predetermined width. Such a configuration is preferable because the film contact portion 22 has a relatively large area and holds the adhesive film M by suction with a low negative pressure, so that the adhesive film M is not deformed.
  • the film contact portion 22 is not limited to such a configuration, and may be arranged in an elliptical or polygonal shape. target).
  • the holding portion 2 has a configuration in which the outer edge of the frame support portion 21 is set at the same position as the outer edge Rn of the ring-shaped frame R. As shown in FIG.
  • the holding portion 2 is not limited to such a configuration, and the outer edge of the frame support portion 21 may be arranged outside or inside the outer edge Rn of the ring-shaped frame R. .

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention concerne un dispositif d'inspection de tranche qui permet, lors de l'inspection d'une tranche qui est fixée à un matériau de film, de retenir de manière fiable la tranche sans provoquer de déformation localisée (allongement et autres) dans le matériau de film, qui est facilement déformé.　Plus particulièrement, l'invention concerne un dispositif d'inspection de tranche permettant d'inspecter une tranche qui est supportée par un film adhésif qui est fixé à une structure de type annulaire, ledit dispositif d'inspection de tranche comprenant : une unité de retenue qui entre en contact avec le film adhésif et qui retient la tranche selon une orientation prédéfinie; une unité d'éclairage qui émet une lumière d'éclairage vers la tranche; une unité d'imagerie qui permet d'obtenir des images de l'extérieur et/ou de l'intérieur de la tranche; et une unité d'inspection qui effectue une inspection sur la base d'une image d'inspection de l'extérieur et/ou de l'intérieur de la tranche telle qu'imagée par l'unité d'imagerie, la partie de l'unité de retenue qui entre en contact avec le film adhésif étant un élément poreux et l'élément poreux étant disposé de sorte à entourer la tranche dans une région qui est définie plus loin vers l'extérieur que le bord de la tranche.
PCT/JP2022/040597 2021-12-23 2022-10-31 Dispositif d'inspection de tranche WO2023119881A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202280081104.2A CN118369752A (zh) 2021-12-23 2022-10-31 晶片检查装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-209398 2021-12-23
JP2021209398A JP2023094118A (ja) 2021-12-23 2021-12-23 ウエーハ検査装置

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WO2023119881A1 true WO2023119881A1 (fr) 2023-06-29

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JP (1) JP2023094118A (fr)
CN (1) CN118369752A (fr)
TW (1) TW202345251A (fr)
WO (1) WO2023119881A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08220008A (ja) * 1995-02-15 1996-08-30 Mitsubishi Electric Corp 赤外検査装置
JP2008211097A (ja) * 2007-02-27 2008-09-11 Taiheiyo Cement Corp 真空吸着装置およびその製造方法
JP2009140947A (ja) * 2007-12-03 2009-06-25 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2015528643A (ja) * 2012-08-31 2015-09-28 セミコンダクター テクノロジーズ アンド インストゥルメンツ ピーティーイー リミテッド ウェハー及びフィルムフレームの両方のための単一超平坦ウェハーテーブル構造

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08220008A (ja) * 1995-02-15 1996-08-30 Mitsubishi Electric Corp 赤外検査装置
JP2008211097A (ja) * 2007-02-27 2008-09-11 Taiheiyo Cement Corp 真空吸着装置およびその製造方法
JP2009140947A (ja) * 2007-12-03 2009-06-25 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2015528643A (ja) * 2012-08-31 2015-09-28 セミコンダクター テクノロジーズ アンド インストゥルメンツ ピーティーイー リミテッド ウェハー及びフィルムフレームの両方のための単一超平坦ウェハーテーブル構造

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CN118369752A (zh) 2024-07-19
JP2023094118A (ja) 2023-07-05

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