WO2023119881A1 - Wafer inspection device - Google Patents

Wafer inspection device Download PDF

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Publication number
WO2023119881A1
WO2023119881A1 PCT/JP2022/040597 JP2022040597W WO2023119881A1 WO 2023119881 A1 WO2023119881 A1 WO 2023119881A1 JP 2022040597 W JP2022040597 W JP 2022040597W WO 2023119881 A1 WO2023119881 A1 WO 2023119881A1
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WIPO (PCT)
Prior art keywords
wafer
adhesive film
unit
inspection
ring
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PCT/JP2022/040597
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French (fr)
Japanese (ja)
Inventor
達也 越智
恭史 小山
和勝 神田
Original Assignee
東レエンジニアリング株式会社
東レエンジニアリング先端半導体Ｍｉテクノロジー株式会社
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Application filed by 東レエンジニアリング株式会社, 東レエンジニアリング先端半導体Ｍｉテクノロジー株式会社 filed Critical 東レエンジニアリング株式会社
Priority to CN202280081104.2A priority Critical patent/CN118369752A/en
Publication of WO2023119881A1 publication Critical patent/WO2023119881A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Definitions

  • the present invention relates to an apparatus for inspecting wafers supported by an adhesive film attached to a ring-shaped frame.
  • Chip parts such as semiconductor devices are manufactured through a process of laminating circuit patterns on a silicon wafer at a predetermined repetition pitch, dicing them into predetermined dimensions, and packaging them.
  • Various inspections are performed during the manufacturing process to check whether the circuit patterns to be laminated are formed in a desired state (for example, Patent Document 1).
  • semiconductor devices are sometimes inspected by a transmitted illumination method using the property that silicon wafers transmit infrared rays (for example, Patent Document 2).
  • a wafer to be diced is supported by an adhesive film attached to a ring-shaped frame on the lower surface side with the circuit forming surface facing up. Then, while holding the ring-shaped frame in a predetermined posture, the wafer is singulated by lifting (that is, expanding) the wafer from below with a push-up member (for example, Patent Document 3).
  • the wafer supported by the adhesive film as described above is placed in a predetermined position.
  • the adhesive film is made by stretching the diced wafer into chips, it is flexible and easily deformed. That is, if holes or grooves are provided on the surface of the support member and negative pressure is sucked with a strong force, the adhesive film may be locally deformed (elongated, etc.) and may not return to its original state. On the other hand, if the negative pressure suction force is weakened, there is a possibility that the wafer may be misaligned or may be unsucked when it is moved while being held.
  • the present invention provides a wafer inspection apparatus that can reliably hold a easily deformable film material without causing local deformation (such as elongation) when inspecting the wafer attached to the film material. intended to
  • one aspect of the present invention includes: A wafer inspection device for inspecting a wafer supported by an adhesive film attached to a ring-shaped frame, a holding part that contacts the adhesive film and holds the wafer in a predetermined posture; an illumination unit that irradiates illumination light toward the wafer; an imaging unit for imaging the exterior and/or interior of the wafer; an inspection unit that performs an inspection based on an inspection image that captures the exterior and/or interior of the wafer captured by the imaging unit;
  • the holding part is The part that contacts the adhesive film is a porous member, A porous member is arranged to surround the wafer in a region set outside the outer edge of the wafer.
  • the lower surface of the adhesive film can be sucked and held in a relatively wide area outside the outer edge of the wafer with a negative pressure slightly lower than the atmosphere.
  • the three axes of the orthogonal coordinate system are X, Y, and Z
  • the horizontal directions are expressed as the X direction and the Y direction
  • the direction perpendicular to the XY plane that is, the direction of gravity
  • the Z direction is expressed as the Z direction. do.
  • the direction against gravity is expressed as up
  • the direction in which gravity acts is expressed as down.
  • the direction of rotation with the Z direction as the center axis is defined as the ⁇ direction.
  • the wafer inspection device 1 inspects a wafer W supported by an adhesive film M attached to a ring-shaped frame F.
  • FIG. 1 is a schematic diagram showing an example of a wafer inspection apparatus in a mode embodying the present invention.
  • FIG. 1(a) shows a perspective view and a block diagram of the positional relationship between each component of the wafer inspection apparatus 1 and the wafer W to be held.
  • FIG. 1(b) shows a cross-sectional view of the positional relationship between each component of the wafer inspection apparatus 1 and the wafer W to be held.
  • the wafer inspection apparatus 1 receives a ring-shaped frame F transported by a handler or the like (not shown) in a horizontal state, and inspects the wafer W while holding it in a predetermined posture.
  • the wafer W to be inspected may be a semiconductor device chip part (for example, a circuit pattern is formed on the upper surface) or a MEMS part (a structure or the like is formed inside). ) can be exemplified.
  • the wafer inspection apparatus 1 includes a holding section 2 , an illumination section 3 , an imaging section 4 and an inspection section 5 . Further, the wafer inspection apparatus 1 includes a moving section M, a computer CP, a controller CN, and the like.
  • the holding part 2 is in contact with the adhesive film M to hold the wafer W in a predetermined posture.
  • the holding unit 2 supports and holds the adhesive film M from the lower surface side so that the wafer W is maintained in a horizontal posture and is not displaced in the horizontal and vertical directions.
  • the holding portion 2 has a ring shape with a predetermined width, which looks like a disc hollowed out, and includes a body portion 20, a frame support portion 21, a film contact portion 22, a communication portion 23, and the like. I have.
  • the frame support portion 21 supports the lower portion of the ring-shaped frame F from the lower surface side. Specifically, the frame supporting portion 21 supports the ring-shaped frame F from the lower surface side so that the ring-shaped frame F is not displaced in the vertical direction while maintaining a horizontal posture. More specifically, the frame supporting portion 21 is made of a ring-shaped metal or resin rigid member having a flat upper surface, and is attached to the lower surface of the ring-shaped frame F and/or the lower surface of the ring-shaped frame F. It is configured to support the ring-shaped frame F by coming into contact with the lower surface of the adhesive film M applied.
  • the film contact part 22 contacts the adhesive film M. As shown in FIG. Specifically, the film contact portion 22 contacts the lower surface of the adhesive film M to support and hold the wafer W supported by the adhesive film M in a predetermined posture. The inner edge 22n is arranged so as to surround the wafer W in an area E set radially outside the outer edge We of the wafer W. As shown in FIG. More specifically, the film contact portion 22 is made of a porous member. The porous member is made by collecting and hardening metal or resin having a small particle size, and has an internal structure in which the upper surface, the lower surface, and the side surfaces are mutually air permeable. Specifically, the film contact portion 22 has an uneven surface, but is formed or processed to have a flat upper end when viewed as a whole.
  • the communication portion 23 connects the lower surface or the inside of the film contact portion 22 and the negative pressure generating means V arranged inside or outside the apparatus.
  • the communicating portion 23 is configured by grooves, holes, or the like provided in the main body portion 20 of the holding portion 2, and is connected to the negative pressure generating means V via the switching valve 24 or the like.
  • the negative pressure generating means V makes the inside of the film contact portion 22 have a negative pressure lower than the atmospheric pressure.
  • the negative pressure generating means V can be exemplified by a vacuum pump, an ejector, and the like.
  • the following arrangement can be exemplified. From the inside, the outer edge We of the wafer W, the inner edge 22n of the film contact portion 22, the inner edge Rn of the ring-shaped frame R, the outer edge 22e of the film contact portion 22, the outer edge Me of the adhesive film M, and the outer edge Rn of the ring-shaped frame R. and the outer edge of the frame support portion 21 .
  • the holding portion 2 Since the holding portion 2 has such a structure, the film contact portion 22 is brought into contact with the adhesive film M to which the wafer W is attached, and the film contact portion 22 is set to a negative pressure. , a suction force can be generated in the space formed by the adhesive film M and the porous member. Therefore, the adhesive film M is sucked and held by the film contact portion 22, and the wafer W is held in a predetermined posture.
  • the illumination unit 3 irradiates the wafer W with illumination light L1.
  • the imaging field F is irradiated with a predetermined amount of illumination light L1 so that the observation light L2 required for imaging by the imaging unit 4 can be obtained.
  • the illumination unit 3 can be an LED illumination, a metal halide lamp, a xenon lamp, a laser diode, or the like, which is arranged inside and below the film contact portion 22 of the holding portion 2 .
  • the lighting unit 3 switches between light emission and light extinction, or emits strobe light at a predetermined place and timing based on signal control from the outside (the controller CN in this embodiment).
  • the imaging unit 4 is for imaging the appearance and/or the inside of the wafer W. As shown in FIG. Specifically, the imaging unit 4 outputs to the outside (computer CP in this embodiment) a video signal and video data of an inspection image G obtained by imaging the exterior and/or interior of the wafer W.
  • the illumination unit 3 and the imaging unit 4 are arranged opposite to each other so that the illumination light L1 transmitted through the wafer W is incident on the imaging unit 4 . More specifically, the imaging unit 4 uses an imaging camera having an imaging device (a so-called image area sensor) with a predetermined area, or an imaging device that emits illumination light L2 that has passed through the wafer W to capture an image of the upper surface or the interior of the wafer W. is provided with a lens or the like for forming an image of the image on the imaging device.
  • an imaging device a so-called image area sensor
  • the inspection unit 5 performs inspection based on an inspection image G obtained by imaging the exterior and/or the interior of the wafer W captured by the imaging unit 4 . Specifically, the inspection unit 5 performs image processing and the like on the inspection image G, performs difference processing on a comparison image serving as an inspection reference, detects defects and foreign matter, and detects luminance information of pixels. Defects, foreign matter, etc. are detected based on this. Then, information about the position and size of the detected defect or foreign matter is output to a display device, a host computer, or the like. More specifically, the inspection unit 5 is composed of a processing unit, an image processing unit, etc. of the computer CP, an execution program, and the like.
  • the moving part M relatively moves the holding part 2 and the imaging part 4 .
  • the moving part M includes a holding part 2 holding the wafer W and an imaging part 4 so that the inspection area set on the surface and/or inside of the wafer W can be imaged by the imaging part 4 all over. , and the image pickup area F of is relatively moved.
  • the moving part M includes an XY stage mechanism that moves the main body part 20 of the holding part 2 in the XY directions at a predetermined speed or stops it at a predetermined position, and an XY stage mechanism that rotates the holding part 2 in the ⁇ direction. It is provided with a combination of a rotating mechanism for moving the stage and keeping it stationary at a predetermined angle (so-called XY ⁇ stage mechanism), and is attached to the apparatus frame 1f.
  • the computer CP inputs signals and data from the outside, performs predetermined arithmetic processing and image processing, and outputs signals and data to the outside. Specifically, the computer CP performs the following functions. ⁇ Setting and registration of the size of the imaging visual field F, imaging position, order, etc. ⁇ Setting and registration of inspection conditions, etc. ⁇ Input and image processing of the inspection image G, and more specifically, the inspection processing based on the inspection conditions, the computer CP , input unit and output unit, storage unit (called register or memory), control unit and arithmetic unit (called CPU or MPU), image processing unit (called GPU), auxiliary storage device (HDD, SSD, etc.), etc. ( hardware) and its execution program (that is, software).
  • storage unit called register or memory
  • control unit and arithmetic unit called CPU or MPU
  • image processing unit called GPU
  • auxiliary storage device HDD, SSD, etc.
  • execution program that is, software
  • the controller CN inputs/outputs signals and data to/from external devices (in this embodiment, each device such as the holding unit 2, the illumination unit 3, the imaging unit 4, the computer CP, etc.) and performs predetermined control processing. be. Specifically, the controller CN performs the following functions. ⁇ Output a drive signal to the switching valve 24 of the holding unit 2 to hold/release the wafer W. ⁇ Output a signal for ON/OFF of the illumination light L1 to the lighting unit 3. ⁇ To the imaging camera of the imaging unit 4.
  • an imaging trigger is output and the drive control of the moving part M: While monitoring the current position and angle of the XY ⁇ stage mechanism, a drive signal is output to control the position and angle More specifically, the controller
  • the CN is composed of a part of the computer CP, a dedicated programmable logic controller, etc. (that is, hardware), and its execution program, etc. (that is, software).
  • the wafer inspection apparatus 1 Since the wafer inspection apparatus 1 according to the present invention has such a configuration, the lower surface of the adhesive film M can be sucked by applying a negative pressure to a relatively wide area outside the outer edge We of the wafer W. At this time, the lower surface of the adhesive film M can be sucked and held securely even with a negative pressure slightly lower than the atmospheric pressure. Therefore, when inspecting a wafer attached to a film material, even a film material that is easily deformed can be reliably held without causing local deformation (such as elongation).
  • the positional relationship between the wafer W supported by the adhesive film M attached to the ring-shaped frame R and each part of the holding unit 2 is the outer edge Rn of the ring-shaped frame R and the adhesive film M.
  • An example is shown in which the outer edge 22e of the film contact portion 22 (that is, the boundary with the frame support portion 21) is arranged inside the outer edge Me.
  • the outer edge 22e of the film contact portion 22 is arranged inside the inner edge Rn of the ring-shaped frame R. Also good. By doing so, the ring-shaped frame R does not exist above the film contact portion 22, and only the adhesive film M can be supported from the lower surface side. Even if it is, the adhesiveness with the adhesive film M is increased, so it is preferable.
  • FIG. 2 is a schematic diagram showing another example of a wafer inspection apparatus in a mode embodying the present invention.
  • FIG. 2(a) shows a perspective view and a block diagram of the positional relationship between each component of the wafer inspection apparatus 1 and the wafer W to be held.
  • FIG. 2(b) shows a cross-sectional view of the positional relationship between each component of the wafer inspection apparatus 1 and the wafer W to be held.
  • the holding portion 2 has the same height (that is, there is no step) between the upper end surface of the frame support portion 21 and the contact surface (ie, upper end surface) of the film contact portion 22 .
  • the holding portion 2 is not limited to such a configuration, and the contact surface (that is, the upper end surface) of the film contact portion 22 is closer to the upper end surface of the frame support portion 21 than the upper end surface of the frame support portion 21 . It may be arranged upward (the film contact portion 22 protrudes).
  • the film contact portion 22 protrudes from the upper end surface of the frame support portion 21, the gap between the lower surface of the adhesive film M and the film contact portion 22 is reduced, and the adhesion when negative pressure is sucked increases, which is preferable. .
  • the amount of protrusion of the film contact portion 22 may be set larger than the amount of deformation due to warpage, undulation, etc. of the ring-shaped frame R. By doing so, when the ring-shaped frame R is placed on the holding portion 2, the lower surface of the adhesive film M is in contact with the film contact portion 22 without gaps over the entire circumference. is higher and preferable.
  • the inner edge 22n of the film contact portion 22 of the holding portion 2 is arranged outside the outer edge We of the wafer W supported by the adhesive film M attached to the ring-shaped frame R (that is, , which is hollow immediately below the wafer W) configuration.
  • the holding portion 2 is not limited to such a configuration, and may be configured to include the auxiliary support portion 6 .
  • the auxiliary support portion 6 supports a predetermined portion radially inward of the outer edge We of the wafer W. As shown in FIG. Specifically, the auxiliary support section 6 supports the adhesive film M from the lower surface side of the wafer W so that the wafer W, which tends to bend, can be held in a predetermined posture. More specifically, the auxiliary support portion 6 is made of a member through which the illumination light L1 is transmitted, and is made of a material through which the illumination light L1 is transmitted to obtain a sufficient amount of the observation light L2 (that is, a substantially transparent material). material) is acceptable.
  • the auxiliary support portion 6 is made of a material that transmits visible light, such as a glass plate, acrylic resin, or polycarbonate resin. Also, if the wafer W is a silicon crystal and the illumination light L1 is near-infrared light, the auxiliary support 6 may be made of silicon crystal.
  • the holding portion 2 may be configured such that the upper end surface of the auxiliary support portion 6 and the upper end surface of the film contact portion 22 are at the same height (that is, there is no step), but they are arranged at different heights. But it's okay.
  • the holding part 2 may be provided with a height adjusting part 7 .
  • the height adjustment portion 7 adjusts the height of the contact surface (that is, upper end surface) of the auxiliary support portion 6 that contacts the adhesive film M to the height of the contact surface (that is, upper end surface) of the film contact portion 22.
  • the height adjuster 7 can be exemplified by an electric actuator, a hand screw, a spacer, and the like.
  • the height adjustment unit 7 may set a difference in height (that is, a difference in level) according to the degree of deformation of the wafer W and the ring-shaped frame R to be handled, the thickness and flexibility of the adhesive film M, and the like.
  • the height adjusting portion 7 changes the height of the contact surface (that is, the upper end surface) of the auxiliary support portion 6 .
  • the height adjusting portion 7 may be configured to change the height of the contact surface (that is, the upper end surface) of the film contact portion 22 with respect to the upper end surface of the frame support portion 21 .
  • the configuration in which the illumination unit 3 and the imaging unit 4 are vertically opposed to each other with the wafer W therebetween is exemplified.
  • the illumination unit 3 and the imaging unit 4 are not limited to such a configuration, and may be arranged above the wafer W (so-called reflection illumination method).
  • the upper surface of the frame support portion 21 is formed of a flat ring-shaped hard member such as metal or resin. With such a configuration, it is easy to prevent vertical positional displacement while maintaining the ring-shaped frame F in a horizontal position, which is preferable.
  • the upper surface of the frame supporting portion 21 is not limited to such a structure, and may be made of an elastic material such as sponge, rubber, or flexible resin.
  • the film contact portion 22 has shown an example in which the porous members are arranged in a ring shape (that is, continuously) with a predetermined width. Such a configuration is preferable because the film contact portion 22 has a relatively large area and holds the adhesive film M by suction with a low negative pressure, so that the adhesive film M is not deformed.
  • the film contact portion 22 is not limited to such a configuration, and may be arranged in an elliptical or polygonal shape. target).
  • the holding portion 2 has a configuration in which the outer edge of the frame support portion 21 is set at the same position as the outer edge Rn of the ring-shaped frame R. As shown in FIG.
  • the holding portion 2 is not limited to such a configuration, and the outer edge of the frame support portion 21 may be arranged outside or inside the outer edge Rn of the ring-shaped frame R. .

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Abstract

The present invention provides a wafer inspection device that makes it possible, when inspecting a wafer which is affixed to a film material, to reliably hold the wafer without causing localized deformation (elongation etc.) in the film material, which is easily deformed.　Specifically, provided is a wafer inspection device for inspecting a wafer which is supported by an adhesive film that is affixed to a ring-like frame, said wafer inspection device comprising: a holding unit that contacts the adhesive film and that holds the wafer at a prescribed orientation; an illumination unit that emits illumination light toward the wafer; an imaging unit that images the exterior and/or interior of the wafer; and an inspection unit that performs an inspection on the basis of an inspection image of the exterior and/or interior of the wafer as imaged by the imaging unit, wherein the part of the holding unit that contacts the adhesive film is a porous member, and the porous member is disposed so as to surround the wafer in a region which is set further outward that the edge of the wafer.

Description

ウエーハ検査装置Wafer inspection equipment
　本発明は、リング状フレームに貼り付けられた粘着フィルムにより支持されているウエーハを検査する装置に関する。 The present invention relates to an apparatus for inspecting wafers supported by an adhesive film attached to a ring-shaped frame.
　半導体デバイス等のチップ部品は、所定の繰り返しピッチで回路パターンをシリコンウエーハ上に積層形成した後、所定の寸法にダイシングしてパッケージングする行程を経て製造されている。そして、積層形成される回路パターンが所望の状態で形成されているか、製造工程の途中で種々の検査が行われている（例えば、特許文献１）。 Chip parts such as semiconductor devices are manufactured through a process of laminating circuit patterns on a silicon wafer at a predetermined repetition pitch, dicing them into predetermined dimensions, and packaging them. Various inspections are performed during the manufacturing process to check whether the circuit patterns to be laminated are formed in a desired state (for example, Patent Document 1).
　また、半導体デバイスは、シリコンウエーハが赤外線を透過する性質を利用して、透過照明方式により検査が行われこともある（例えば、特許文献２）。 In addition, semiconductor devices are sometimes inspected by a transmitted illumination method using the property that silicon wafers transmit infrared rays (for example, Patent Document 2).
　通常、ダイシングされるウエーハは、回路形成面を上にして、下面側がリング状フレームに貼り付けられた粘着フィルムにより支持されている。そして、リング状フレームを所定の姿勢で保持しつつ、ウエーハを突き上げ部材により下方から上方に持ち上げる（つまり、エキスパンドする）ことで個片化されている（例えば、特許文献３）。 Usually, a wafer to be diced is supported by an adhesive film attached to a ring-shaped frame on the lower surface side with the circuit forming surface facing up. Then, while holding the ring-shaped frame in a predetermined posture, the wafer is singulated by lifting (that is, expanding) the wafer from below with a push-up member (for example, Patent Document 3).
特開２００３－２５８０６７号公報JP 2003-258067 A 特開平８－２２０００８号公報JP-A-8-220008 特開２００４－２７３８９５号公報JP 2004-273895 A
　例えば、透過照明方式によりウエーハの外周部を含めた検査を行う場合や、粘着フィルム面側から精密な位置制御を伴う加工を行う場合など、上述のような粘着フィルムにより支持されているウエーハを所定の姿勢で保持するには、ウエーハ外縁の半径方向のすぐ外側（つまり、粘着フィルム）を保持する必要がある。そうすることで、リンク状フレームや粘着フィルムの変形の影響が少なくなるからである。 For example, when performing inspection including the outer periphery of the wafer by the transmitted illumination method, or when performing processing involving precise position control from the side of the adhesive film, the wafer supported by the adhesive film as described above is placed in a predetermined position. In order to hold the wafer in this posture, it is necessary to hold the wafer just outside the outer edge in the radial direction (that is, the adhesive film). By doing so, the influence of deformation of the link-shaped frame and the adhesive film is reduced.
　しかし、粘着フィルムは、ダイシングされたウエーハを引き伸ばしてチップ化するため、柔軟性があり変形しやすい。つまり、支持部材の表面に穴や溝を設けて強い力で負圧吸引させると、粘着フィルムに局所的な変形（伸び等）が生じて元に戻らないおそれがある。一方、負圧吸引力を弱めると、ウエーハを保持しながら移動させたときに位置ずれしたり吸着が外れたりする恐れがある。 However, since the adhesive film is made by stretching the diced wafer into chips, it is flexible and easily deformed. That is, if holes or grooves are provided on the surface of the support member and negative pressure is sucked with a strong force, the adhesive film may be locally deformed (elongated, etc.) and may not return to its original state. On the other hand, if the negative pressure suction force is weakened, there is a possibility that the wafer may be misaligned or may be unsucked when it is moved while being held.
　そこで、本発明は、フィルム材料に貼り付けられたウエーハを検査する際、変形しやすいフィルム材料に局所的な変形（伸び等）を生じさせずに確実に保持することができるウエーハ検査装置を提供することを目的とする。 Accordingly, the present invention provides a wafer inspection apparatus that can reliably hold a easily deformable film material without causing local deformation (such as elongation) when inspecting the wafer attached to the film material. intended to
　以上の課題を解決するために、本発明に係る一態様は、
　リング状フレームに貼り付けられた粘着フィルムにより支持されているウエーハを検査するウエーハ検査装置であって、
　粘着フィルムに当接してウエーハを所定の姿勢で保持する保持部と、
　ウエーハに向けて照明光を照射する照明部と、
　ウエーハの外観および／または内部を撮像する撮像部と、
　撮像部で撮像したウエーハの外観および／または内部を撮像した検査画像に基づいて検査を行う検査部とを備え、
　　保持部は、
　粘着フィルムに当接する部位が多孔質部材であり、
　多孔質部材が、ウエーハの外縁部よりも外側に設定された領域で当該ウエーハを取り囲むように配置されている。 In order to solve the above problems, one aspect of the present invention includes:
A wafer inspection device for inspecting a wafer supported by an adhesive film attached to a ring-shaped frame,
a holding part that contacts the adhesive film and holds the wafer in a predetermined posture;
an illumination unit that irradiates illumination light toward the wafer;
an imaging unit for imaging the exterior and/or interior of the wafer;
an inspection unit that performs an inspection based on an inspection image that captures the exterior and/or interior of the wafer captured by the imaging unit;
The holding part is
The part that contacts the adhesive film is a porous member,
A porous member is arranged to surround the wafer in a region set outside the outer edge of the wafer.
　上記態様によれば、ウエーハの外縁より外側の比較的広い領域を、大気より少し低い程度の負圧で粘着フィルムの下面を吸引保持できる。 According to the above aspect, the lower surface of the adhesive film can be sucked and held in a relatively wide area outside the outer edge of the wafer with a negative pressure slightly lower than the atmosphere.
　フィルム材料に貼り付けられたウエーハを検査する際、変形しやすいフィルム材料でも、局所的な変形（伸び等）を生じさせずに確実に保持できる。 When inspecting a wafer attached to a film material, even easily deformable film materials can be reliably held without causing local deformation (elongation, etc.).
本発明を具現化する形態におけるウエーハ検査装置の一例を示す概略図である。It is a schematic diagram showing an example of a wafer inspection device in a form which embodies the present invention. 本発明を具現化する形態におけるウエーハ検査装置の別の一例を示す概略図である。It is a schematic diagram showing another example of a wafer inspection apparatus in a form embodying the present invention.
　以下に、本発明を実施するための形態について、図を用いながら説明する。なお、以下の説明では、直交座標系の３軸をＸ、Ｙ、Ｚとし、水平方向をＸ方向、Ｙ方向と表現し、ＸＹ平面に垂直な方向（つまり、重力方向）をＺ方向と表現する。また、Ｚ方向は、重力に逆らう方向を上、重力がはたらく方向を下と表現する。また、Ｚ方向を中心軸として回転する方向をθ方向とする。 A mode for carrying out the present invention will be described below with reference to the drawings. In the following description, the three axes of the orthogonal coordinate system are X, Y, and Z, the horizontal directions are expressed as the X direction and the Y direction, and the direction perpendicular to the XY plane (that is, the direction of gravity) is expressed as the Z direction. do. In the Z direction, the direction against gravity is expressed as up, and the direction in which gravity acts is expressed as down. Also, the direction of rotation with the Z direction as the center axis is defined as the θ direction.
　ウエーハ検査装置１は、リング状フレームＦに貼り付けられた粘着フィルムＭにより支持されているウエーハＷを検査するものである。 The wafer inspection device 1 inspects a wafer W supported by an adhesive film M attached to a ring-shaped frame F.
　図１は、本発明を具現化する形態におけるウエーハ検査装置の一例を示す概略図である。図１（ａ）には、ウエーハ検査装置１の各構成要素および保持するウエーハＷの位置関係が斜視図およびブロック図で示されている。図１（ｂ）には、ウエーハ検査装置１の各構成要素および保持するウエーハＷの位置関係が断面図で示されている。 FIG. 1 is a schematic diagram showing an example of a wafer inspection apparatus in a mode embodying the present invention. FIG. 1(a) shows a perspective view and a block diagram of the positional relationship between each component of the wafer inspection apparatus 1 and the wafer W to be held. FIG. 1(b) shows a cross-sectional view of the positional relationship between each component of the wafer inspection apparatus 1 and the wafer W to be held.
　具体的には、ウエーハ検査装置１は、不図示のハンドラー等で運ばれたリング状フレームＦを水平状態で受け取り、ウエーハＷを所定の姿勢で保持しつつ検査するものである。
なお、検査対象となるウエーハＷとしては、半導体デバイスのチップ部品となるもの（例えば、上面に回路パターン等が形成されている）や、ＭＥＭＳ部品となるもの（内部に構造物等が形成されている）が例示できる。
より具体的には、ウエーハ検査装置１は、保持部２、照明部３、撮像部４、検査部５を備えている。さらにウエーハ検査装置１は、移動部Ｍ、コンピュータＣＰ、コントローラＣＮ等を備えている。 Specifically, the wafer inspection apparatus 1 receives a ring-shaped frame F transported by a handler or the like (not shown) in a horizontal state, and inspects the wafer W while holding it in a predetermined posture.
The wafer W to be inspected may be a semiconductor device chip part (for example, a circuit pattern is formed on the upper surface) or a MEMS part (a structure or the like is formed inside). ) can be exemplified.
More specifically, the wafer inspection apparatus 1 includes a holding section 2 , an illumination section 3 , an imaging section 4 and an inspection section 5 . Further, the wafer inspection apparatus 1 includes a moving section M, a computer CP, a controller CN, and the like.
　保持部２は、粘着フィルムＭに当接してウエーハＷを所定の姿勢で保持するものである。具体的には、保持部２は、ウエーハＷが水平な姿勢を維持しつつ水平方向および上下方向に位置ずれしないよう、粘着フィルムＭを下面側から支え保持するものである。
より具体的には、保持部２は、円板をくり抜いたような所定の幅を有するリング形状をしており、本体部２０、フレーム支持部２１、フィルム当接部２２、連通部２３等を備えている。 The holding part 2 is in contact with the adhesive film M to hold the wafer W in a predetermined posture. Specifically, the holding unit 2 supports and holds the adhesive film M from the lower surface side so that the wafer W is maintained in a horizontal posture and is not displaced in the horizontal and vertical directions.
More specifically, the holding portion 2 has a ring shape with a predetermined width, which looks like a disc hollowed out, and includes a body portion 20, a frame support portion 21, a film contact portion 22, a communication portion 23, and the like. I have.
　フレーム支持部２１は、リング状フレームＦの下方を下面側から支持するものである。
具体的には、フレーム支持部２１は、リング状フレームＦが水平な姿勢を維持しつつ、上下方向に位置ずれしないよう、リング状フレームＦを下面側から支えるものである。
より具体的には、フレーム支持部２１は、上面が平坦なリング状の金属や樹脂等の硬質部材で構成されており、リング状フレームＦの下面および／またはリング状フレームＦの下面に貼り付けられた粘着フィルムＭの下面に当接して、リング状フレームＦを支える構成をしている。 The frame support portion 21 supports the lower portion of the ring-shaped frame F from the lower surface side.
Specifically, the frame supporting portion 21 supports the ring-shaped frame F from the lower surface side so that the ring-shaped frame F is not displaced in the vertical direction while maintaining a horizontal posture.
More specifically, the frame supporting portion 21 is made of a ring-shaped metal or resin rigid member having a flat upper surface, and is attached to the lower surface of the ring-shaped frame F and/or the lower surface of the ring-shaped frame F. It is configured to support the ring-shaped frame F by coming into contact with the lower surface of the adhesive film M applied.
　フィルム当接部２２は、粘着フィルムＭに当接するものである。
具体的には、フィルム当接部２２は、粘着フィルムＭの下面に当接して、粘着フィルムＭにより支持されているウエーハＷを所定の姿勢で支え保持するものであり、フィルム当接部２２の内縁２２ｎが、ウエーハＷの外縁Ｗｅよりも半径方向外側に設定された領域ＥでウエーハＷを取り囲むように配置されている。
より具体的には、フィルム当接部２２は、多孔質部材で構成されている。
多孔質部材は、粒径の小さな金属や樹脂を集めて固めたものであり、上面、下面、各側面が互いに通気性を有する内部構造をしている。
具体的には、フィルム当接部２２は、表面が凸凹形状であるが、全体的に見れば上端がフラットに成形または加工されている。 The film contact part 22 contacts the adhesive film M. As shown in FIG.
Specifically, the film contact portion 22 contacts the lower surface of the adhesive film M to support and hold the wafer W supported by the adhesive film M in a predetermined posture. The inner edge 22n is arranged so as to surround the wafer W in an area E set radially outside the outer edge We of the wafer W. As shown in FIG.
More specifically, the film contact portion 22 is made of a porous member.
The porous member is made by collecting and hardening metal or resin having a small particle size, and has an internal structure in which the upper surface, the lower surface, and the side surfaces are mutually air permeable.
Specifically, the film contact portion 22 has an uneven surface, but is formed or processed to have a flat upper end when viewed as a whole.
　連通部２３は、フィルム当接部２２の下面ないし内部と、装置内または装置外に配置された負圧発生手段Ｖとを接続するものである。
具体的には、連通部２３は、保持部２の本体部２０内に設けられた溝や穴等で構成されており、切替バルブ２４等を介して負圧発生手段Ｖに接続されている。 The communication portion 23 connects the lower surface or the inside of the film contact portion 22 and the negative pressure generating means V arranged inside or outside the apparatus.
Specifically, the communicating portion 23 is configured by grooves, holes, or the like provided in the main body portion 20 of the holding portion 2, and is connected to the negative pressure generating means V via the switching valve 24 or the like.
　負圧発生手段Ｖは、フィルム当接部２２の内部を大気圧よりも負圧にするものである。
具体的には、負圧発生手段Ｖは、真空ポンプやエジェクタ等が例示できる。 The negative pressure generating means V makes the inside of the film contact portion 22 have a negative pressure lower than the atmospheric pressure.
Specifically, the negative pressure generating means V can be exemplified by a vacuum pump, an ejector, and the like.
　なお、リング状フレームＲに貼り付けられた粘着フィルムＭにより支持されているウエーハＷと、保持部２の各部との位置関係としては、以下の様な配置を例示できる。
内側から順に、ウエーハＷの外縁Ｗｅ、フィルム当接部２２の内縁２２ｎ、リング状フレームＲの内縁Ｒｎ、フィルム当接部２２の外縁２２ｅ、粘着フィルムＭの外縁Ｍｅ、リング状フレームＲの外縁Ｒｎおよびフレーム支持部２１の外縁である。 As for the positional relationship between the wafer W supported by the adhesive film M attached to the ring-shaped frame R and each part of the holding part 2, the following arrangement can be exemplified.
From the inside, the outer edge We of the wafer W, the inner edge 22n of the film contact portion 22, the inner edge Rn of the ring-shaped frame R, the outer edge 22e of the film contact portion 22, the outer edge Me of the adhesive film M, and the outer edge Rn of the ring-shaped frame R. and the outer edge of the frame support portion 21 .
　保持部２は、この様な構成をしているため、ウエーハＷが貼り付けられている粘着フィルムＭとフィルム当接部２２とを当接させ、フィルム当接部２２を負圧にすることで、粘着フィルムＭと多孔質部材とで形成される空間に吸引力を発生させることができる。そのため、粘着フィルムＭがフィルム当接部２２に吸引されて吸着保持され、ウエーハＷが所定の姿勢で保持される。 Since the holding portion 2 has such a structure, the film contact portion 22 is brought into contact with the adhesive film M to which the wafer W is attached, and the film contact portion 22 is set to a negative pressure. , a suction force can be generated in the space formed by the adhesive film M and the porous member. Therefore, the adhesive film M is sucked and held by the film contact portion 22, and the wafer W is held in a predetermined posture.
　照明部３は、ウエーハＷに向けて照明光Ｌ１を照射するものである。
具体的には、撮像部４による撮像に必要な観察光Ｌ２が得られるよう、撮像視野Ｆに向けて、所定光量の照明光Ｌ１を照射するものである。
より具体的には、照明部３は、保持部２のフィルム当接部２２より内側下方に配置された、ＬＥＤ照明やメタルハライドランプ、キセノンランプ、レーザダイオードなどが例示できる。なお、照明部３は、外部（本実施例では、コントローラＣＮ）からの信号制御に基づいて、発光／消灯を切り替えたり、所定の場所やタイミングでストロボ発光させたりする。 The illumination unit 3 irradiates the wafer W with illumination light L1.
Specifically, the imaging field F is irradiated with a predetermined amount of illumination light L1 so that the observation light L2 required for imaging by the imaging unit 4 can be obtained.
More specifically, the illumination unit 3 can be an LED illumination, a metal halide lamp, a xenon lamp, a laser diode, or the like, which is arranged inside and below the film contact portion 22 of the holding portion 2 . In addition, the lighting unit 3 switches between light emission and light extinction, or emits strobe light at a predetermined place and timing based on signal control from the outside (the controller CN in this embodiment).
　撮像部４は、ウエーハWの外観および／または内部を撮像するものである。
具体的には、撮像部４は、ウエーハＷの外観および／または内部を撮像した検査画像Ｇの映像信号や映像データを、外部（本実施例では、コンピュータＣＰ）に出力するものである。なお、照明部３と撮像部４とは、ウエーハＷを透過した照明光Ｌ１が撮像部４に入射されるように、対向配置されている。
より具体的には、撮像部４は、所定面積の撮像素子（いわゆる、イメージエリアセンサ）を有する撮像カメラや、ウエーハＷを通過した照明光Ｌ２を入射させて当該ウエーハＷの上面または内部の像を撮像素子に結像させるレンズ等を備えている。 The imaging unit 4 is for imaging the appearance and/or the inside of the wafer W. As shown in FIG.
Specifically, the imaging unit 4 outputs to the outside (computer CP in this embodiment) a video signal and video data of an inspection image G obtained by imaging the exterior and/or interior of the wafer W. The illumination unit 3 and the imaging unit 4 are arranged opposite to each other so that the illumination light L1 transmitted through the wafer W is incident on the imaging unit 4 .
More specifically, the imaging unit 4 uses an imaging camera having an imaging device (a so-called image area sensor) with a predetermined area, or an imaging device that emits illumination light L2 that has passed through the wafer W to capture an image of the upper surface or the interior of the wafer W. is provided with a lens or the like for forming an image of the image on the imaging device.
　検査部５は、撮像部４で撮像したウエーハＷの外観および／または内部を撮像した検査画像Ｇに基づいて検査を行うものである。
具体的には、検査部５は、検査画像Ｇに対して画像処理等を行い、検査基準となる比較画像に対して差分処理をして欠陥や異物等を検出したり、画素の輝度情報等に基づいて欠陥や異物等を検出したりする。そして、検出した欠陥や異物等の位置や大きさに関する情報を表示器やホストコンピュータ等に出力する。
より具体的には、検査部５は、コンピュータＣＰの処理部や画像処理部等と実行プログラム等で構成されている。 The inspection unit 5 performs inspection based on an inspection image G obtained by imaging the exterior and/or the interior of the wafer W captured by the imaging unit 4 .
Specifically, the inspection unit 5 performs image processing and the like on the inspection image G, performs difference processing on a comparison image serving as an inspection reference, detects defects and foreign matter, and detects luminance information of pixels. Defects, foreign matter, etc. are detected based on this. Then, information about the position and size of the detected defect or foreign matter is output to a display device, a host computer, or the like.
More specifically, the inspection unit 5 is composed of a processing unit, an image processing unit, etc. of the computer CP, an execution program, and the like.
　移動部Ｍは、保持部２と撮像部４とを相対的に移動させるものである。
具体的には、移動部Ｍは、ウエーハＷの表面および／または内部に設定された検査領域を撮像部４でくまなく撮像できる様に、ウエーハＷを保持している保持部２と撮像部４の撮像領域Ｆとを相対的に移動させるものである。
より具体的には、移動部Ｍは、保持部２の本体部２０をＸＹ方向に所定の速度で移動させたり所定の位置で静止させるたりするＸＹステージ機構と、保持部２をθ方向に回転させたり所定の角度で静止させたりする回転機構とを組み合わせたもの（いわゆる、ＸＹθステージ機構）を備えており、装置フレーム１ｆに取り付けられている。 The moving part M relatively moves the holding part 2 and the imaging part 4 .
Specifically, the moving part M includes a holding part 2 holding the wafer W and an imaging part 4 so that the inspection area set on the surface and/or inside of the wafer W can be imaged by the imaging part 4 all over. , and the image pickup area F of is relatively moved.
More specifically, the moving part M includes an XY stage mechanism that moves the main body part 20 of the holding part 2 in the XY directions at a predetermined speed or stops it at a predetermined position, and an XY stage mechanism that rotates the holding part 2 in the θ direction. It is provided with a combination of a rotating mechanism for moving the stage and keeping it stationary at a predetermined angle (so-called XYθ stage mechanism), and is attached to the apparatus frame 1f.
　コンピュータＣＰは、外部から信号やデータを入力し、所定の演算処理や画像処理を行い、外部に信号やデータを出力するものである。
具体的には、コンピュータＣＰは、以下の機能を実行する。
・撮像視野Ｆのサイズや撮像位置・順序等の設定・登録
・検査条件等の設定・登録
・検査画像Ｇを入力・画像処理し、検査条件に基づく検査処理
より具体的には、コンピュータＣＰは、入力部と出力部、記憶部（レジスタやメモリーと呼ばれる）、制御部と演算部（ＣＰＵやＭＰＵと呼ばれる）、画像処理装置（ＧＰＵと呼ばれる）、補助記憶装置（ＨＤＤやＳＳＤなど）等（つまり、ハードウェア）と、その実行プログラム等（つまり、ソフトウェア）で構成されている。 The computer CP inputs signals and data from the outside, performs predetermined arithmetic processing and image processing, and outputs signals and data to the outside.
Specifically, the computer CP performs the following functions.
・Setting and registration of the size of the imaging visual field F, imaging position, order, etc. ・Setting and registration of inspection conditions, etc. ・Input and image processing of the inspection image G, and more specifically, the inspection processing based on the inspection conditions, the computer CP , input unit and output unit, storage unit (called register or memory), control unit and arithmetic unit (called CPU or MPU), image processing unit (called GPU), auxiliary storage device (HDD, SSD, etc.), etc. ( hardware) and its execution program (that is, software).
　コントローラＣＮは、外部機器（本実施例では、保持部２、照明部３、撮像部４等の各機器や、コンピュータＣＰ等）と信号やデータを入出力し、所定の制御処理を行うものである。具体的には、コントローラＣＮは、以下の機能を実行する。
・保持部２の切替バルブ２４に駆動信号を出力し、ウエーハＷを保持／解除
・照明部３に対して、照明光Ｌ１の発光ＯＮ／ＯＦＦ等の信号を出力
・撮像部４の撮像カメラに対して、撮像トリガを出力
・移動部Ｍの駆動制御：ＸＹθステージ機構の現在の位置・角度をモニタリングしつつ、駆動用信号を出力し、位置・角度を制御する機能
より具体的には、コントローラＣＮは、コンピュータＣＰの一部や専用のプログラマブルロジックコントローラ等（つまり、ハードウェア）と、その実行プログラム等（つまり、ソフトウェア）で構成されている。 The controller CN inputs/outputs signals and data to/from external devices (in this embodiment, each device such as the holding unit 2, the illumination unit 3, the imaging unit 4, the computer CP, etc.) and performs predetermined control processing. be. Specifically, the controller CN performs the following functions.
・Output a drive signal to the switching valve 24 of the holding unit 2 to hold/release the wafer W. ・Output a signal for ON/OFF of the illumination light L1 to the lighting unit 3. ・To the imaging camera of the imaging unit 4. On the other hand, an imaging trigger is output and the drive control of the moving part M: While monitoring the current position and angle of the XYθ stage mechanism, a drive signal is output to control the position and angle More specifically, the controller The CN is composed of a part of the computer CP, a dedicated programmable logic controller, etc. (that is, hardware), and its execution program, etc. (that is, software).
　本発明に係るウエーハ検査装置１は、この様な構成をしているため、ウエーハＷの外縁Ｗｅのより外側の比較的広い領域を負圧にして粘着フィルムＭの下面を吸引できる。このとき、大気より少し低い程度の負圧でも粘着フィルムＭの下面を吸引し、確実に保持できる。そのため、フィルム材料に貼り付けられたウエーハを検査する際、変形しやすいフィルム材料でも、局所的な変形（伸び等）を生じさせずに確実に保持できる。 Since the wafer inspection apparatus 1 according to the present invention has such a configuration, the lower surface of the adhesive film M can be sucked by applying a negative pressure to a relatively wide area outside the outer edge We of the wafer W. At this time, the lower surface of the adhesive film M can be sucked and held securely even with a negative pressure slightly lower than the atmospheric pressure. Therefore, when inspecting a wafer attached to a film material, even a film material that is easily deformed can be reliably held without causing local deformation (such as elongation).
　（変形例）　　
　なお上述では、リング状フレームＲに貼り付けられた粘着フィルムＭにより支持されているウエーハＷと、保持部２の各部との位置関係として、リング状フレームＲの内縁Ｒｎの外側かつ粘着フィルムＭの外縁Ｍｅの内側に、フィルム当接部２２の外縁２２ｅ（つまり、フレーム支持部２１との境界）が配置されている例を示した。この様な構成であれば、粘着フィルムＭの下面の比較的広い範囲をフィルム当接部２２により支持・吸引保持できるため、好ましい。
しかし、本発明を具現化する上で、保持部２の各部はこの様な配置に限定されず、フィルム当接部２２の外縁２２ｅがリング状フレームＲの内縁Ｒｎよりも内側に配置されていても良い。そうすることで、フィルム当接部２２の上方にはリング状フレームＲが存在せず、粘着フィルムＭのみを下面側から支えることができるため、リング状フレームＲに反りやたわみなどの変形が生じていたとしても、粘着フィルムＭとの密着性が高まるため、好ましい。 (Modification)
In the above description, the positional relationship between the wafer W supported by the adhesive film M attached to the ring-shaped frame R and each part of the holding unit 2 is the outer edge Rn of the ring-shaped frame R and the adhesive film M. An example is shown in which the outer edge 22e of the film contact portion 22 (that is, the boundary with the frame support portion 21) is arranged inside the outer edge Me. Such a configuration is preferable because a relatively wide area of the lower surface of the adhesive film M can be supported, sucked and held by the film contact portion 22 .
However, in embodying the present invention, each part of the holding part 2 is not limited to such arrangement, and the outer edge 22e of the film contact part 22 is arranged inside the inner edge Rn of the ring-shaped frame R. Also good. By doing so, the ring-shaped frame R does not exist above the film contact portion 22, and only the adhesive film M can be supported from the lower surface side. Even if it is, the adhesiveness with the adhesive film M is increased, so it is preferable.
　図２は、本発明を具現化する形態におけるウエーハ検査装置の別の一例を示す概略図である。図２（ａ）には、ウエーハ検査装置１の各構成要素および保持するウエーハＷの位置関係が斜視図およびブロック図で示されている。図２（ｂ）には、ウエーハ検査装置１の各構成要素および保持するウエーハＷの位置関係が断面図で示されている。 FIG. 2 is a schematic diagram showing another example of a wafer inspection apparatus in a mode embodying the present invention. FIG. 2(a) shows a perspective view and a block diagram of the positional relationship between each component of the wafer inspection apparatus 1 and the wafer W to be held. FIG. 2(b) shows a cross-sectional view of the positional relationship between each component of the wafer inspection apparatus 1 and the wafer W to be held.
　さらに上述では、保持部２が、フレーム支持部２１の上端面とフィルム当接部２２の当接面（つまり、上端面）の高さが同じ（つまり、段差が無い）構成を例示した。
しかし、本発明を具現化する上で、保持部２は、この様な構成に限定されず、フィルム当接部２２の当接面（つまり、上端面）がフレーム支持部２１の上端面よりも上方に配置（フィルム当接部２２が突出）していても良い。つまり、レーム支持部２１の上端面からフィルム当接部２２が突出していれば、粘着フィルムＭの下面とフィルム当接部２２と隙間が減り、負圧吸引した際の密着性が高まるため、好ましい。 Furthermore, in the above description, the holding portion 2 has the same height (that is, there is no step) between the upper end surface of the frame support portion 21 and the contact surface (ie, upper end surface) of the film contact portion 22 .
However, in embodying the present invention, the holding portion 2 is not limited to such a configuration, and the contact surface (that is, the upper end surface) of the film contact portion 22 is closer to the upper end surface of the frame support portion 21 than the upper end surface of the frame support portion 21 . It may be arranged upward (the film contact portion 22 protrudes). In other words, if the film contact portion 22 protrudes from the upper end surface of the frame support portion 21, the gap between the lower surface of the adhesive film M and the film contact portion 22 is reduced, and the adhesion when negative pressure is sucked increases, which is preferable. .
　さらに、リング状フレームＲの反りやうねり等による変形量よりも、フィルム当接部２２の突出量が大きく設定しても良い。そうすれば、リング状フレームＲを保持部２に置いたときに、粘着フィルムＭの下面は、全周に亘ってフィルム当接部２２と隙間無く当接するので、負圧吸引した際の密着性がより高まり、好ましい。 Further, the amount of protrusion of the film contact portion 22 may be set larger than the amount of deformation due to warpage, undulation, etc. of the ring-shaped frame R. By doing so, when the ring-shaped frame R is placed on the holding portion 2, the lower surface of the adhesive film M is in contact with the film contact portion 22 without gaps over the entire circumference. is higher and preferable.
　（補助支持部６について）　　　　
　なお上述では、保持部２のフィルム当接部２２の内縁２２ｎが、リング状フレームＲに貼り付けられた粘着フィルムＭにより支持されているウエーハＷの外縁Ｗｅよりも外側に配置されている（つまり、ウエーハＷの直ぐ下側は空洞である）構成を例示した。
しかし、本発明を具現化する上で、保持部２は、この様な構成に限定されず補助支持部６を備えた構成であっても良い。 (Regarding the auxiliary support portion 6)
In the above description, the inner edge 22n of the film contact portion 22 of the holding portion 2 is arranged outside the outer edge We of the wafer W supported by the adhesive film M attached to the ring-shaped frame R (that is, , which is hollow immediately below the wafer W) configuration.
However, in embodying the present invention, the holding portion 2 is not limited to such a configuration, and may be configured to include the auxiliary support portion 6 .
　補助支持部６は、ウエーハＷの外縁Ｗｅよりも半径方向内側の所定部位を支持するものである。
具体的には、補助支持部６は、たわみやすいウエーハＷが所定の姿勢で保持できるよう、ウエーハＷの下面側から粘着フィルムＭを支持するものである。
より具体的には、補助支持部６は、照明光Ｌ１が透過する部材で構成されており、照明光Ｌ１が透過して十分な光量の観察光Ｌ２が得られる材料（つまり、実質的に透明な材料）であれば良い。例えば、照明光Ｌ１が可視光であれば、補助支持部６は、ガラス板、アクリル樹脂やポリカーボネイト樹脂等の可視光を透過させる材料を用いる。また、ウエーハＷがシリコン結晶で、照明光Ｌ１が近赤外光であれば、補助支持部６としてシリコン結晶を用いても良い。 The auxiliary support portion 6 supports a predetermined portion radially inward of the outer edge We of the wafer W. As shown in FIG.
Specifically, the auxiliary support section 6 supports the adhesive film M from the lower surface side of the wafer W so that the wafer W, which tends to bend, can be held in a predetermined posture.
More specifically, the auxiliary support portion 6 is made of a member through which the illumination light L1 is transmitted, and is made of a material through which the illumination light L1 is transmitted to obtain a sufficient amount of the observation light L2 (that is, a substantially transparent material). material) is acceptable. For example, if the illumination light L1 is visible light, the auxiliary support portion 6 is made of a material that transmits visible light, such as a glass plate, acrylic resin, or polycarbonate resin. Also, if the wafer W is a silicon crystal and the illumination light L1 is near-infrared light, the auxiliary support 6 may be made of silicon crystal.
　なお、保持部２は、補助支持部６の上端面がフィルム当接部２２の上端面と高さが同じ（つまり、段差が無い）構成であっても良いが、異なる高さに配置した構成でも良い。 The holding portion 2 may be configured such that the upper end surface of the auxiliary support portion 6 and the upper end surface of the film contact portion 22 are at the same height (that is, there is no step), but they are arranged at different heights. But it's okay.
　（高さ調節部７について）　　　　　
　さらに、保持部２は、高さ調節部７を備えても良い。 (Regarding the height adjustment part 7)
Furthermore, the holding part 2 may be provided with a height adjusting part 7 .
　高さ調節部７は、粘着フィルムＭと当接する補助支持部６の当接面（つまり、上端面）の高さを、フィルム当接部２２の当接面（つまり、上端面）の高さに対して変更するものである。
具体的には、高さ調節部７は、電動アクチュエータ、手回しのねじ、スペーサ等が例示できる。
なお、高さ調節部７は、取り扱うウエーハＷやリング状フレームＲの変形度合い、粘着フィルムＭの厚みや柔軟性等に応じて、高低差（つまり、段差）を設定すれば良い。 The height adjustment portion 7 adjusts the height of the contact surface (that is, upper end surface) of the auxiliary support portion 6 that contacts the adhesive film M to the height of the contact surface (that is, upper end surface) of the film contact portion 22. is to be changed for
Specifically, the height adjuster 7 can be exemplified by an electric actuator, a hand screw, a spacer, and the like.
The height adjustment unit 7 may set a difference in height (that is, a difference in level) according to the degree of deformation of the wafer W and the ring-shaped frame R to be handled, the thickness and flexibility of the adhesive film M, and the like.
　なお上述では、高さ調節部７が、補助支持部６の当接面（つまり、上端面）の高さを変更する構成を示した。
しかし、高さ調節部７は、フレーム支持部２１の上端面に対して、フィルム当接部２２の当接面（つまり、上端面）の高さを変更する構成であっても良い。 In the above description, the height adjusting portion 7 changes the height of the contact surface (that is, the upper end surface) of the auxiliary support portion 6 .
However, the height adjusting portion 7 may be configured to change the height of the contact surface (that is, the upper end surface) of the film contact portion 22 with respect to the upper end surface of the frame support portion 21 .
　（照明部３について）
　なお上述では、照明部３と撮像部４とがウエーハＷを隔てて上下に対向配置されている構成（いわゆる、透過照明方式）を例示した。
しかし、照明部３と撮像部４とは、この様な構成に限らず、双方がウエーハＷの上方に配置されている構成（いわゆる、反射照明方式）であっても良い。 (Regarding lighting unit 3)
In the above description, the configuration in which the illumination unit 3 and the imaging unit 4 are vertically opposed to each other with the wafer W therebetween (so-called transmissive illumination method) is exemplified.
However, the illumination unit 3 and the imaging unit 4 are not limited to such a configuration, and may be arranged above the wafer W (so-called reflection illumination method).
　（保持部２について）
　なお上述では、フレーム支持部２１の上面が、平坦なリング状の金属や樹脂等の硬質部材で構成されている例を示した。このような構成であれば、リング状フレームＦを水平な姿勢に維持しつつ、上下方向に位置ずれしないようにすることが容易であり好ましい。
しかし、フレーム支持部２１の上面は、この様な構成に限らず、スポンジやゴム、柔軟な樹脂等の弾力性を有する材料で構成されていても良い。 (Regarding the holding part 2)
In the above description, an example is shown in which the upper surface of the frame support portion 21 is formed of a flat ring-shaped hard member such as metal or resin. With such a configuration, it is easy to prevent vertical positional displacement while maintaining the ring-shaped frame F in a horizontal position, which is preferable.
However, the upper surface of the frame supporting portion 21 is not limited to such a structure, and may be made of an elastic material such as sponge, rubber, or flexible resin.
　なお上述では、フィルム当接部２２は、多孔質部材が所定幅のリング状に（つまり、連続的）に配置されている例を示した。このような構成であれば、フィルム当接部２２は、比較的大面積で低い負圧により粘着フィルムＭを吸引保持するため、粘着フィルムＭの変形が生じないので好ましい。
しかし、フィルム当接部２２は、この様な構成に限らず、楕円や多角形的配置されていても良いし、粘着フィルムＭの変形が生じなければ、間欠的（例えば、円弧状や点在的）に配置されていても良い。 In the above description, the film contact portion 22 has shown an example in which the porous members are arranged in a ring shape (that is, continuously) with a predetermined width. Such a configuration is preferable because the film contact portion 22 has a relatively large area and holds the adhesive film M by suction with a low negative pressure, so that the adhesive film M is not deformed.
However, the film contact portion 22 is not limited to such a configuration, and may be arranged in an elliptical or polygonal shape. target).
　なお上述では、保持部２は、フレーム支持部２１の外縁がリング状フレームＲの外縁Ｒｎと同じ位置に設定されている構成を図示した。
しかし、保持部２は、この様な構成に限定されず、フレーム支持部２１の外縁がリング状フレームＲの外縁Ｒｎよりも外側に配置されていても良いし、内側に配置されていても良い。 In the above description, the holding portion 2 has a configuration in which the outer edge of the frame support portion 21 is set at the same position as the outer edge Rn of the ring-shaped frame R. As shown in FIG.
However, the holding portion 2 is not limited to such a configuration, and the outer edge of the frame support portion 21 may be arranged outside or inside the outer edge Rn of the ring-shaped frame R. .
　　１　　ウエーハ検査装置
　　２　　保持部
　　３　　照明部
　　４　　撮像部
　　５　　検査部
　　６　　補助支持部
　　７　　高さ調節部
　　２０　本体部
　　２１　フレーム支持部
　　２２　フィルム当接部（多孔質部材）
　　２２ｅ　外縁
　　２２ｎ　内縁
　　２３　連通部
　　２４　切替バルブ
　　Ｗ　　ウエーハ
　　Ｗｅ　外縁
　　Ｍ　　粘着フィルム
　　Ｍｅ　外縁
　　Ｒ　　リング状フレーム
　　Ｒｅ　外縁
　　Ｒｎ　内縁
　　Ｇ　　検査画像
　　Ｌ１　照明光
　　Ｌ２　ウエーハを透過した照明光
　　Ｅ　　領域
　　Ｖ　　負圧発生手段 Reference Signs List 1 wafer inspection device 2 holding section 3 illumination section 4 imaging section 5 inspection section 6 auxiliary support section 7 height adjustment section 20 body section 21 frame support section 22 film contact section (porous member)
22e Outer edge 22n Inner edge 23 Communication part 24 Switching valve W Wafer We Outer edge M Adhesive film Me Outer edge R Ring-shaped frame Re Outer edge Rn Inner edge G Inspection image L1 Illumination light L2 Illumination light transmitted through wafer E Region V Negative pressure generating means

Claims (5)

  1. 　リング状フレームに貼り付けられた粘着フィルムにより支持されているウエーハを検査するウエーハ検査装置であって、
    　前記粘着フィルムに当接して前記ウエーハを所定の姿勢で保持する保持部と、
    　前記ウエーハに向けて照明光を照射する照明部と、
    　前記ウエーハの外観および／または内部を撮像する撮像部と、
    　前記撮像部で撮像した前記ウエーハの外観および／または内部を撮像した検査画像に基づいて検査を行う検査部とを備え、
    　　前記保持部は、
    　前記粘着フィルムに当接する部位が多孔質部材であり、
    　前記多孔質部材が、前記ウエーハの外縁部よりも外側に設定された領域で当該ウエーハを取り囲むように配置されている
    ことを特徴とする、ウエーハ検査装置。     A wafer inspection device for inspecting a wafer supported by an adhesive film attached to a ring-shaped frame,
    a holding part that contacts the adhesive film and holds the wafer in a predetermined posture;
    an illumination unit that irradiates illumination light toward the wafer;
    an imaging unit for imaging the exterior and/or interior of the wafer;
    an inspection unit that performs an inspection based on an inspection image that captures the exterior and/or interior of the wafer captured by the imaging unit;
    The holding part is
    The part that contacts the adhesive film is a porous member,
    A wafer inspection apparatus, wherein the porous member is arranged so as to surround the wafer in a region set outside an outer edge of the wafer.
  2. 　前記保持部は、前記多孔質部材の外縁が、前記リング状フレームの開口部の内縁よりも内側に配置されている
    ことを特徴とする、請求項１に記載のウエーハ検査装置。     2. The wafer inspection apparatus according to claim 1, wherein the holding portion has an outer edge of the porous member arranged inside an inner edge of the opening of the ring-shaped frame.
  3. 　前記保持部は、前記粘着フィルムと当接する部位が、前記リング状フレームと当接する部位よりも突出して配置されている
    ことを特徴とする、請求項２に記載のウエーハ検査装置。     3. The wafer inspection apparatus according to claim 2, wherein a portion of said holding portion that abuts said adhesive film protrudes from a portion that abuts said ring-shaped frame.
  4. 　前記照明部と前記撮像部とは、前記ウエーハを透過した前記照明光が前記撮像部に入射されるように、対向配置されており
    　前記保持部は、
    前記ウエーハの外縁部よりも内側を支持する補助支持部を備え、
    前記補助支持部は、前記照明光が透過する部材で構成されている
    ことを特徴とする、請求項１～３のいずれかに記載のウエーハ検査装置。     The illumination unit and the imaging unit are arranged opposite to each other so that the illumination light transmitted through the wafer is incident on the imaging unit, and the holding unit includes:
    comprising an auxiliary support portion that supports the inner side of the wafer from its outer edge;
    4. The wafer inspection apparatus according to claim 1, wherein said auxiliary support is made of a member through which said illumination light passes.
  5. 　前記保持部は、
    前記補助支持部の当接面の高さと前記多孔質部材の当接面の高さとを相対的に変更する、高さ調節部を備えた
    ことを特徴とする、請求項４に記載のウエーハ検査装置。     The holding part is
    5. The wafer inspection according to claim 4, further comprising a height adjusting section for relatively changing the height of the contact surface of the auxiliary support section and the height of the contact surface of the porous member. Device.
PCT/JP2022/040597 2021-12-23 2022-10-31 Wafer inspection device WO2023119881A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08220008A (en) * 1995-02-15 1996-08-30 Mitsubishi Electric Corp Infrared ray inspecting apparatus
JP2008211097A (en) * 2007-02-27 2008-09-11 Taiheiyo Cement Corp Vacuum suction apparatus and manufacturing method thereof
JP2009140947A (en) * 2007-12-03 2009-06-25 Disco Abrasive Syst Ltd Method of dividing wafer
JP2015528643A (en) * 2012-08-31 2015-09-28 セミコンダクター テクノロジーズ アンド インストゥルメンツ ピーティーイー リミテッド Single ultra-flat wafer table structure for both wafer and film frame

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08220008A (en) * 1995-02-15 1996-08-30 Mitsubishi Electric Corp Infrared ray inspecting apparatus
JP2008211097A (en) * 2007-02-27 2008-09-11 Taiheiyo Cement Corp Vacuum suction apparatus and manufacturing method thereof
JP2009140947A (en) * 2007-12-03 2009-06-25 Disco Abrasive Syst Ltd Method of dividing wafer
JP2015528643A (en) * 2012-08-31 2015-09-28 セミコンダクター テクノロジーズ アンド インストゥルメンツ ピーティーイー リミテッド Single ultra-flat wafer table structure for both wafer and film frame

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