WO2023109464A1 - 半导体处理设备 - Google Patents
半导体处理设备 Download PDFInfo
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- WO2023109464A1 WO2023109464A1 PCT/CN2022/134110 CN2022134110W WO2023109464A1 WO 2023109464 A1 WO2023109464 A1 WO 2023109464A1 CN 2022134110 W CN2022134110 W CN 2022134110W WO 2023109464 A1 WO2023109464 A1 WO 2023109464A1
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- semiconductor processing
- processing equipment
- scraper
- equipment according
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- 238000012545 processing Methods 0.000 title claims abstract description 62
- 239000004065 semiconductor Substances 0.000 title claims abstract description 56
- 230000000007 visual effect Effects 0.000 claims abstract description 26
- 238000004140 cleaning Methods 0.000 claims description 34
- 239000007921 spray Substances 0.000 claims description 22
- 238000009434 installation Methods 0.000 claims description 21
- 238000007790 scraping Methods 0.000 claims description 17
- 239000007788 liquid Substances 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 9
- 230000004308 accommodation Effects 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 4
- 230000007797 corrosion Effects 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 230000004438 eyesight Effects 0.000 claims description 3
- 238000010926 purge Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 20
- 238000012544 monitoring process Methods 0.000 abstract 1
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- 238000004806 packaging method and process Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
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- 229910052751 metal Inorganic materials 0.000 description 4
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- 238000005516 engineering process Methods 0.000 description 3
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- 239000003595 mist Substances 0.000 description 3
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- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
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- 239000010949 copper Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000011160 research Methods 0.000 description 2
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- 239000002033 PVDF binder Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
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- 239000004020 conductor Substances 0.000 description 1
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- 238000000151 deposition Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
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- 239000012266 salt solution Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the invention belongs to the technical field of semiconductor equipment, in particular to semiconductor processing equipment.
- Advanced packaging has become one of the key points in the future development of the semiconductor industry. Advanced packaging is critical to driving innovation in semiconductors.
- advanced packaging technologies on the market mainly include three-dimensional through-silicon via (TSV, Through Silicon Via), fan-out (Fan-out) packaging, flip-chip (Flip-chip) packaging and fan-in (Fan-in WLP) packaging .
- TSV Through Silicon Via
- Fan-out Fan-out
- flip-chip flip-chip
- Fan-in WLP fan-in
- the electroplating process is a method of depositing a layer of metal on a conductor using the principle of electrolysis. Specifically, in a salt solution containing a pre-plated metal, the base metal to be plated is used as the cathode, and the pre-plated metal in the plating solution is electrolyzed. A surface processing method in which metal cations are deposited on the surface of the base metal to form a coating.
- the pre-wetting process real-time observation of the conditions inside the pre-wetting chamber is required.
- the pre-wetting chamber When the pre-wetting chamber is working, there is an area above the pre-wetting chamber for observing the working conditions in the chamber.
- the inside of the cavity is a closed negative pressure space, and the inside of the cavity is filled with water mist.
- the internal water mist quickly condenses into water droplets. Once there are water droplets attached to the area for observation, observe the cavity again.
- the field of vision is very blurred, and in this case it is impossible to observe the status of the process implementation in the cavity. Even if the process is abnormal, it cannot be judged, which will affect the investigation of the cause of the abnormal situation.
- the invention discloses a semiconductor processing equipment.
- An embodiment of the present application provides a semiconductor processing device, including:
- the visual unit is arranged on the casing of the semiconductor processing equipment and is used to observe the internal conditions of the semiconductor processing equipment;
- a cleaning unit arranged inside the semiconductor processing equipment, for cleaning the target on the side of the visible unit located inside the equipment;
- the driving unit is connected with the clearing unit, and is used to drive the clearing unit to clear the target on the inner side of the device of the visible unit.
- the clearing unit includes:
- the scraper body can be detachably installed on the drive unit;
- the receiving groove is arranged on the upper end surface of the scraper body along the length direction of the scraper body;
- the installation part is arranged at the bottom of the containing groove and is used for installing the scraper.
- a scraper disposed within the mounting portion, is configured to remove a target object.
- the scraper body further includes: a discharge port, which is arranged at one end of the scraper body and communicates with the accommodating groove.
- the bottom wall of the accommodating tank is arranged obliquely along the length direction of the scraper body, and the end close to the discharge port is lower than the end far away from the discharge port.
- the slope of the bottom wall of the accommodating tank is in a range of 0-1.5°.
- the scraping strip is made of corrosion-resistant and wear-resistant materials.
- the installation part is a groove structure or a through hole structure.
- the semiconductor processing equipment further includes:
- the nozzle unit is connected with the driving unit, and the driving unit drives the nozzle unit to perform a fan-shaped movement around the connection point between the nozzle unit and the driving unit as the center of the circle;
- the spray head unit includes: a liquid spray head and a moving arm;
- the liquid spray head is arranged at one end of the moving arm;
- the other end of the moving arm is connected to the drive unit;
- the driving unit drives the moving arm to reciprocate directly above the substrate with the liquid spray head.
- the included angle between the liquid spray head and the scraper body is fixedly set.
- the shower head unit further includes a gas shower head for gas purging.
- the scraper is in direct contact with the visual unit to remove the target on the inner side of the device;
- the scraping strip is not in contact with the viewing unit, and the distance between the scraping strip and the viewing unit is smaller than the diameter of the target to remove the target on the side of the viewing unit inside the device.
- the semiconductor processing equipment of the present invention matches the cleaning unit with the visual unit, cooperates with the visual unit to monitor the semiconductor processing process, facilitates precise control of the processing process, and ensures that the semiconductor processing result reaches a yield rate.
- FIG. 1 shows a schematic diagram of the partial structure relationship of semiconductor processing equipment in Embodiment 1 of the present invention
- Fig. 2 shows a stereoscopic structural schematic view of the assembly of the drive shaft and the cleaning unit of the drive unit in Embodiment 1 of the present invention
- Fig. 3 shows a schematic diagram of the three-dimensional structure of the scraper body according to the embodiment of the present invention
- FIG. 4 shows a schematic diagram of a three-dimensional structure of a cleaning unit according to an embodiment of the present invention
- Fig. 5 shows the bottom view of the scraper body of the embodiment of the present invention
- Figure 6 shows a side view of the scraper body of the embodiment of the present invention.
- FIG. 7 shows a bottom view of the partial structure of the cleaning unit of the semiconductor processing equipment according to Embodiment 1 of the present invention when it is in the working initial position;
- FIG. 8 shows a bottom view of a partial structure of the cleaning unit of the semiconductor processing equipment according to Embodiment 1 of the present invention when it is at the end of work position;
- FIG. 9 shows a schematic diagram of the partial structure relationship of the semiconductor processing equipment according to Embodiment 2 of the present invention.
- Fig. 10 shows a three-dimensional structural schematic diagram of the assembly of the drive shaft, the cleaning unit and the nozzle unit of the drive unit according to Embodiment 2 of the present invention
- FIG. 11 shows a bottom view of the partial structure of the cleaning unit of the semiconductor processing equipment according to Embodiment 2 of the present invention when it is at the end of work position;
- FIG. 12 shows a bottom view of the partial structure of the cleaning unit of the semiconductor processing equipment according to Embodiment 2 of the present invention when it is at the end-of-work position.
- the semiconductor processing equipment includes components such as a visual unit 100 , a cleaning unit 200 , and a driving unit 300 .
- the visual unit 100 is arranged on the casing of the processing equipment, and is used for observing the working conditions inside the processing equipment, especially for observing the working conditions of the substrate 500 inside the processing equipment.
- the cleaning unit 200 is disposed inside the processing device. One end of the cleaning unit 200 is fixedly connected to the output end of the driving unit 300, and the driving unit 300 is arranged outside the casing of the processing device and fixed on the casing.
- the drive unit 300 may utilize a drive unit of the semiconductor processing equipment itself, or may be provided with an additional drive unit.
- the drive unit 300 in this embodiment utilizes the own drive unit of the semiconductor processing equipment, which improves the effective utilization rate of the original device.
- the driving unit 300 is connected with the clearing unit 200 to drive the clearing unit 200 to make a fan-shaped track with the joint of the driving unit 300 and the clearing unit 200 as the center of a circle.
- the driving unit 300 drives the clearing unit 200 to rotate, the clearing unit 200 rotates
- the trajectory is a sector covering the entire area of the visual unit 100 .
- the driving unit 300 drives the cleaning unit 200 to rotate and remove the object.
- the viewing unit 100 includes a transparent viewing part 101 fixedly installed on the casing of the semiconductor processing equipment, and is used for observing the inside of the processing device from the transparent viewing part 101 .
- a transparent viewing part 101 fixedly installed on the casing of the semiconductor processing equipment, and is used for observing the inside of the processing device from the transparent viewing part 101 .
- glass is selected as the preparation material of the transparent visible member 101 in this embodiment.
- the cleaning unit 200 includes: a scraper body 201 , a receiving groove 202 , a mounting portion 203 and a scraper strip 204 .
- Fig. 3 shows a schematic diagram of the three-dimensional structure of the scraper body according to the embodiment of the present invention.
- the scraper body 201 is shaped as a strip-shaped plate or an arc-shaped plate, and its preparation material is light and high-strength material.
- aluminum alloy is used as the preparation material of the scraper body 201.
- the aluminum alloy with a density of about 2.7g/ cm3 has the characteristics of low density, light weight, high strength, and easy processing, which is convenient for manufacturing and processing. process it in the process.
- the upper end surface of the scraper body 201 is provided with an accommodation groove 202 along the length direction of the scraper body 201, and the accommodation groove 202 is used to accommodate the cleaning unit 200 to temporarily store the target object in the accommodation groove 202 when clearing the target object on the visual unit 100
- the bottom of the receiving tank 202 is provided with a mounting part 203, and a mounting hole 206 is opened on the side wall of the mounting part 203.
- the mounting part 203 is used to install the scraper 204, and the scraper 204 is fixed to the mounting part 203 through the cooperation of the bolt and the mounting hole 206.
- FIG. 4 for a structural schematic diagram of the completed assembly of the scraper 204 installed in the scraper body 201 .
- the installation part 203 is a groove structure or a through hole structure.
- the scraping strip 204 is made of corrosion-resistant and wear-resistant materials.
- the scraping strip 204 in this embodiment is made of PVDF material.
- the scraping bar 204 on the cleaning unit 200 is specifically used to remove the target object on the transparent visible member 101 .
- an embodiment of the present invention is: the thickness of the scraper body 201 is 2-6cm.
- the thickness of the scraper body 201 in this embodiment is 4.5cm.
- the cleaning unit 200 is installed, When the scraper body 201 moves to directly below the transparent visible part 101 of the visual unit 100, the distance between the upper end surface of the scraper body 201 and the side of the transparent visible part 101 inside the device is 2-6 cm.
- the distance between the upper end surface of the scraper body 201 in this embodiment and the side of the transparent visible part 101 inside the device is 2 cm; the height of the scraper 204 is 2-6 cm.
- the scraper 204 in this embodiment The height is 5cm.
- the installation part 203 is a groove structure, for example, the distance between the bottom wall of the installation groove and the bottom surface of the scraper body 201 in this embodiment is 1.5cm, then the distance between the installation groove and the receiving groove 202 The total depth is 3cm.
- the scraper 204 is installed in the installation groove, the bottom edge of the scraper 204 in the length direction is in contact with the bottom wall of the installation groove, and the bolts fasten the scraper 204 through the installation hole 206 to ensure that the scraper 204 204 is stable; at this time, the distance from the top of the scraper 204 in the length direction to the bottom surface of the scraper body 201 is just 5 cm.
- the driving unit 300 drives the clearing unit 200 to take the joint of the driving unit 300 and the clearing unit 200 as the center of the circle to make a fan-shaped trajectory
- the top of the scraper 204 contacts the surface of the transparent visible part 101, and the transparent visible part
- the target objects on 101 are swept to one side, and simultaneously fall into the storage tank 202 for storage.
- the width of the installation through hole is greater than the thickness of the scraper 204 so that the scraper 204 can be inserted into the installation through hole for installation.
- An exemplary mounting through hole has a width of 1 cm and a thickness of the wiper strip 204 of 0.8 cm.
- the distance between the upper end surface of the squeegee body 201 and the side of the transparent visual part 101 inside the equipment is 2 cm.
- the distance between the scraping strip 204 and the transparent visual member 101 located on the inside of the device is required to be less than or equal to 1 mm.
- the scraping strip 204 is installed, the scraping The distance between the top of the bar 204 and the side of the transparent visible member 101 inside the semiconductor processing equipment is less than or equal to 1 mm.
- the scraper body 201 is provided with a discharge port 205 on one end surface of the receiving groove 202.
- the discharge port 205 is arranged at one end of the scraper body 201.
- the discharge port 205 communicates with the receiving groove 202. When there are enough objects in the tank 202 , the objects move to the discharge port 205 until they are discharged from the holding tank 202 after moving to the discharge port 205 .
- the bottom wall of the accommodation groove 202 provided on the scraper body 201 is inclined, and the end close to the discharge port 205 is the lower end.
- the slope of the bottom wall of the accommodation groove 202 ranges from 0° to 1.5°.
- the slope of the bottom wall of the receiving groove 202 in this embodiment is 1.5°.
- the bottom wall of the receiving tank 202 is provided with a slope to facilitate the movement of the target object in the receiving tank 202 to the discharge port 205 , and then to be discharged from the cleaning unit 200 .
- the clearing unit 200 when the clearing unit 200 is in a non-working state, the clearing unit 200 is positioned on one side of the transparent visible member 101 of the visual unit 100, at this time, the clearing unit 200 cannot be directly seen through the transparent visible member 101,
- the drive unit 300 drives the removal unit 200 to rotate around the drive shaft of the drive unit 300, and the removal unit 200 is made of transparent One side edge of the visible part 101 rotates to the other side edge of the transparent visible part 101, and the moving range of the scraping bar 204 of the clearing unit 200 completely covers the area of the transparent visible part 101, the state when the clearing unit 200 completes the work
- the clearing unit 200 is located on the other side of the transparent visual member 101 .
- the device further includes a shower head unit 400 .
- the spray head unit 400 includes: a liquid spray head 402 and a moving arm 401 .
- the liquid spray head 402 is disposed at one end of the moving arm.
- the other end of the moving arm 401 is connected to the driving unit, and the driving unit drives the moving arm 401 to reciprocate directly above the substrate 500 with the liquid spray head 402 .
- the spray head unit 400 When the fluid sprayed by the spray head unit 400 is nitrogen, the spray head unit 400 further includes a nitrogen gas spray head 403 for nitrogen purging.
- FIG. 10 shows a three-dimensional structural diagram of the drive shaft of the drive unit, the cleaning unit and the spray head unit assembled in this embodiment.
- the drive unit 300 drives the spray head unit 400 to make a fan-shaped movement with the joint between the print head unit 400 and the drive unit 300 as the center of a circle, and the print head unit 400 and the cleaning unit 200 are both connected to the drive shaft of the drive unit 300, and the liquid spray head 402 and the scraper body 201 fixed angle setting.
- the set angle is such that when the liquid spray head 402 of the spray head unit 400 is located directly above the center of the substrate 500 to be processed in the equipment, the scraping bar 204 of the cleaning unit 200 is located at the edge or the periphery of the transparent visible member 101 .
- the nozzle unit 400 when the nozzle unit 400 is in the non-working state, the nozzle unit 400 is located on one side of the substrate 500, and at this time the cleaning unit 200 is located on the side of the transparent visual part 101 of the visual unit 100, through the transparent
- the nozzle unit 400 cannot be seen directly from the visible part 101
- the scraper body 201 of the cleaning unit 200 is located on the outer peripheral edge of the transparent visible part 101 , and the cleaning unit 200 cannot be seen directly through the transparent visible part 101 .
- the drive unit 300 drives the shower head unit 400 and the cleaning unit 200 to rotate around the drive shaft.
- the cleaning unit 200 When the shower head unit 400 moves from one side of the substrate 500 to the center of the substrate 500, the cleaning unit 200 is visible through the transparent One side edge of the component 101 moves to the other side of the transparent visible component 101, when the shower head unit 400 moves from one side of the substrate 500 to the other side of the substrate 500, and after the work on the substrate 500 is completed, the cleaning unit 200 also During the movement from one side of the transparent visible part 101 to the other side of the transparent visible part 101 , the moving range of the scraping bar 204 of the cleaning unit 200 completely covers the area of the transparent visible part 101 . After the process is completed, the shower head unit 400 and the cleaning unit 200 can no longer be seen through the transparent visible member 101 , as shown in FIG. 12 .
- the equipment can be effectively used; on the other hand, the visual unit 100 can be cleaned in real time during the process of the substrate 500 being processed by the shower head unit 400.
- the target object on the surface effectively improves the controllability of the process, improves the work efficiency at the same time, and provides a further guarantee for ensuring that the processing result of the semiconductor reaches the yield rate.
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
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Abstract
本发明提供一种半导体处理设备，涉及半导体设备技术领域。半导体处理设备包括：可视单元，设置于半导体处理设备壳体上，用于观察半导体处理设备内部情况；清除单元，设置于半导体处理设备内部，用于清除所述可视单元位于设备内部一侧上的目标物；驱动单元，与清除单元连接，用于驱动所述清除单元，以清除所述可视单元位于设备内部一侧上的目标物。本发明的半导体处理设备通过设置给可视单元匹配设置清除单元，协同可视单元监控半导体处理过程，便于精准控制处理工艺过程，保证半导体的处理结果达到良率。
Description
本发明属于半导体设备技术领域，特别涉及半导体处理设备。
随着集成电路制造业的高速发展，更低成本、更可靠、更快及更高密度的电路是集成电路封装追求的目标。先进封装已经成为半导体产业未来发展的重点之一。先进封装对于推动半导体创新至关重要。目前市场上先进封装工艺主要有三维硅通孔(TSV,Through Silicon Via)、扇出型(Fan-out)封装、倒装芯片(Flip-chip)封装以及扇入型(Fan-in WLP)封装。其中，由于三维硅通孔技术能提供更短的电连接通路、能拥有更多的信号通道、能代替效率低下的引线等优点，是提高器件性能的可行途径，故其成为三维集成电路核心技术之一，成为集成电路封装工艺中研究的热点。而电镀作为TSV技术中至关重要的工艺也被重点研究。
电镀工艺是利用电解的原理在导电体上沉积一层金属的方法，具体是指在含有预镀金属的盐类溶液中，以被镀基体金属为阴极，通过电解作用，使镀液中预镀金属的阳离子在基体金属表面沉积出来，形成镀层的一种表面加工方法。
尤其是在集成电路制造行业，对于高性能集成电路中必须被填充的具有高深宽比的孔和槽，在高深宽比硅通孔由下而上的填充过程中，，必须完全填充通孔，不能滞留任何气泡，否则内部存在空洞缺陷，甚至有的TSV孔内无法填充的情况，严重影响TSV的可靠性。为了提高铜电镀的稳定性和均匀性，研究人员在进行铜电镀之前采用了对硅片预湿处理。
在预湿处理的过程中，需要对预湿腔内部的情况进行实时观察，预湿腔在工作时，在预湿腔上方有一个用于观察腔内工作情况的区域。在工艺过程中，腔体内部是密闭的负压空间，腔体内部充满水雾，当腔体被打开，内部水雾迅速凝聚成水滴，一旦有水滴附着在供观察的区域上，再观察腔体内部时，视野内非常模糊，在该种情况下无法观察到腔内工艺实施的状况。即使工艺产生异常也无法判断出来，进而会影响异常情况的原因排查。
发明内容
为了能够便于观察预湿腔内部的具体情况，精准监控半导体处理设备内部的工作情况，本发明公开了一种半导体处理设备。
本申请实施例提供了一种半导体处理设备，包括：
可视单元，设置于半导体处理设备壳体上，用于观察半导体处理设备内部情况；
清除单元，设置于半导体处理设备内部，用于清除所述可视单元位于设备内部一侧上的目标物；
驱动单元，与清除单元连接，用于驱动所述清除单元，以清除所述可视单元位于设备内部一侧上的目标物。
根据本申请实施例的一种具体实现方式，所述清除单元包括：
刮板本体，可拆卸安装于驱动单元上；
容纳槽，沿刮板本体长度方向设置于刮板本体上端面；
安装部，设置于所述容纳槽底部，用于安装刮条。
刮条，设置于所述安装部内，被配置为清除目标物体。
根据本申请实施例的一种具体实现方式，所述刮板本体还包括：排出口，设置于所述刮板本体的一端，与所述容纳槽相连通。
根据本申请实施例的一种具体实现方式，所述容纳槽底壁沿刮板本体长度方向倾斜设置，且靠近排出口的一端低于远离排出口的一端。
根据本申请实施例的一种具体实现方式，所述容纳槽底壁倾斜设置的坡度的范围为0-1.5°。
根据本申请实施例的一种具体实现方式，所述刮条的制备材料为耐腐蚀耐磨材料。
根据本申请实施例的一种具体实现方式，所述安装部为槽结构或通孔结构。
根据本申请实施例的一种具体实现方式，半导体处理设备还包括：
喷头单元，与驱动单元连接，所述驱动单元驱动喷头单元围绕以喷头单元与驱动单元连接处为圆心做扇形运动；
所述喷头单元包括：液体喷头和移动臂；
所述液体喷头，设置于所述移动臂的一端；
所述移动臂，另一端与驱动单元连接；
所述驱动单元，驱动移动臂带着液体喷头在基板的正上方做往复运动。
根据本申请实施例的一种具体实现方式，所述液体喷头与所述刮板本体的夹角固定设置。
根据本申请实施例的一种具体实现方式，所述喷头单元还包括气体喷头，用于气体吹扫。
根据本申请实施例的一种具体实现方式，所述刮条与所述可视单元直接接触以清除所述可视单元位于设备内部一侧上的目标物；或，
所述刮条与所述可视单元不接触，所述刮条与所述可视单元之间的距离小于目标物直径以清除所述可视单元位于设备内部一侧上的目标物。
本发明的半导体处理设备通过设置给可视单元匹配设置清除单元，协同可视单元监控半导体处理过程，便于精准控制处理工艺过程，保证半导体的处理结果达到良率。本发明的其它特征和优点将在随后的说明书中阐述，并且，部分地从说明书中变得显而易见，或者通过实施本发明而了解。本发明的目的和其他优点可通过在说明书、权利要求书以及附图中所指出的结构来实现和获得。
附图概述
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍，显而易见地，下面描述中的附图是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1示出了本发明实施例1的半导体处理设备局部结构关系示意图；
图2示出了本发明实施例1的驱动单元的驱动轴与清除单元装配完成的立体结构示意图；
图3示出了本发明实施例的刮板本体立体结构示意图；
图4示出了本发明实施例的清除单元立体结构示意图；
图5示出了本发明实施例的刮板本体仰视图；
图6示出了本发明实施例的刮板本体侧视图；
图7示出了本发明实施例1的半导体处理设备清除单元位于工作初始位置时的局部结构仰视图；
图8示出了本发明实施例1的半导体处理设备清除单元位于工作结束位置时的局部结构仰视图；
图9示出了本发明实施例2的半导体处理设备局部结构关系示意图；
图10示出了本发明实施例2的驱动单元的驱动轴与清除单元与喷头单元装配完成的立体结构示意图；
图11示出了本发明实施例2的半导体处理设备清除单元位于工作结束位置时的局部结构仰视图；以及
图12示出了本发明实施例2的半导体处理设备清除单元位于工作结束位置时的局部结构仰视图。
本发明的较佳实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地说明，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
图1和图2示出了本发明一实施例中的一种半导体处理设备。半导体处理设备包括：可视单元100、清除单元200及驱动单元300等部件。可视单元100设置于处理设备的壳体上，用于观察处理设备内部的工作情况，尤其是用于观察基板500在处理设备内部时的工作情况。清除单元200设置于处理设备的内部。清除单元200一端与驱动单元300的输出端固定连接，驱动单元300设置于处理设备的壳体外侧，且固定于壳体上。驱动单元300可以利用半导体处理设备自有的驱动单元，也可以另外设置驱动单元。示例性的，本实施例中的驱动单元300利用半导体处理设备自有的驱动单元，提高了原有装置的有效利用率。驱动单元300与清除单元200连接，以驱动清除单元200以驱动单元300与清除单元200连接处为圆心做扇形轨迹的运动，在驱动单元300驱动清除单元200转动的过程中，清除单元200转动的轨迹是覆盖可视单元100的全部区域的扇形。当可视单元100位于半导体处理设备的内部一侧上附着有影响观察的目标物时，驱动单元300驱动清除单元200转动清除该目标物。
可视单元100包括固定安装于半导体处理设备的壳体上的透明可视件101，用于从该透明可视件101处观察处理设备内部的情况。示例性的，本实施例中的透明可视件101的制备材料选用玻璃。
请参照图3至图6，清除单元200包括：刮板本体201、容纳槽202、安装部203以及刮条204。图3示出了本发明实施例的刮板本体立体结构示意图，刮板本体201形状为长条形板状物或者弧形板状物，其制备材料采用质轻且强度较高的材料，示例性的，本实施例中采用铝合金作为刮板本体201的制备材料，密度约为 2.7g/cm
3的铝合金，具有密度小，质量轻，强度高，易加工等特点，便于在制造加工的过程中对其进行加工。刮板本体201的上端面沿刮板本体201的长度方向开设容纳槽202，容纳槽202用于容纳清除单元200在清除可视单元100上的目标物时，暂时将目标物收纳于容纳槽202内，容纳槽202的底部设置安装部203，安装部203侧壁上开设有安装孔206，安装部203用于安装刮条204，刮条204通过螺栓与安装孔206的配合固定于安装部203内，刮条204安装在刮板本体201内的装配完成结构示意图请参照图4。其中，安装部203为槽结构或通孔结构。刮条204采用耐腐蚀耐磨材料制备，示例性的，本实施例中的刮条204采用PVDF材料制备。
更具体的，在实际工艺过程中，清除单元200上的刮条204具体被用于清除透明可视件101上的目标物。刮条204与透明可视件101有两种位置关系。一种是刮条204的顶端与透明可视件101位于半导体处理设备内部一侧直接接触；另一种是刮条204的顶端与透明可视件101位于半导体处理设备内部一侧不接触，但是二者之间的距离小于目标物的直径。
示例性的，本发明的一种实施例为：刮板本体201的厚度为2-6cm，示例性的，本实施例中的刮板本体201的厚度为4.5cm，清除单元200安装完成后，当刮板本体201移动至可视单元100的透明可视件101的正下方时，刮板本体201上端面与透明可视件101位于设备内部一侧面的距离为2-6cm，示例性的，本实施例中的刮板本体201上端面与透明可视件101位于设备内部一侧面之间的距离为2cm；刮条204的高度为2-6cm，示例性的，本实施例中刮条204的高度为5cm，当安装部203为槽结构时，示例性的，本实施例中安装槽的底壁到刮板本体201的底面之间的距离为1.5cm，则安装槽与容纳槽202的深度加在一起为3cm，当刮条204安装于安装槽内，刮条204在长度方向上的底边与安装槽底壁接触，螺栓通过安装孔206对刮条204进行紧固，保证刮条204的稳定；此时刮条204在长度方向上的顶端到刮板本体201的底面的距离刚好为5cm。当驱动单元300驱动清除单元200以驱动单元300与清除单元200连接处为圆心做扇形轨迹的运动的过程中，刮条204的顶端与透明可视件101的表面相接触，将透明可视件101上的目标物清扫至一侧，同时落入容纳槽202进行收纳。
在本发明的另一实施例中，当安装部203为通孔结构时，安装通孔的宽度大于刮条204的厚度，以便于刮条204能够插设于安装通孔内进行安装。示例性的安装通孔的宽度为1cm，刮条204的厚度为0.8cm。在安装时，刮条204在长度方向上的底边插入安装通孔内，根据实际工艺条件的需求调整刮条204插入安装通孔的深 度，然后螺栓通过安装孔206对刮条204进行紧固。更具体的，在实际工艺过程中，当刮板本体201移动至可视单元100的正下方时，刮板本体201上端面与透明可视件101位于设备内部一侧面的距离为2cm，当需要被清除的目标物的直径小于或等于1mm物体时，则要求刮条204与透明可视件101位于设备内部一侧之间的距离为小于或等于1mm，此时安装刮条204时，使刮条204的顶端与透明可视件101位于半导体处理设备内部一侧之间的距离小于或等于1mm。当需要清除的目标物的直径大于1mm时，此时调整安装刮条204插入安装通孔内的深度，进而调整刮条204的顶端与透明可视件101位于设备内部一侧之间的距离，但是需要满足二者之间的距离小于目标物的直径的要求。
在一些实施例中，刮板本体201于开设有容纳槽202的一端面上设置有排出口205，排出口205设于刮板本体201的一端，排出口205与容纳槽202相连通，当容纳槽202内的目标物足够多的时候，目标物向排出口205移动，直至移动至排出口205后被排出容纳槽202。
更进一步地，刮板本体201上开设的容纳槽202底壁倾斜设置，且靠近排出口205的一端为较低端，在工艺过程中，容纳槽202底壁的坡度范围为0-1.5°，示例性的，本实施例中的容纳槽202底壁的坡度为1.5°。容纳槽202底壁设置坡度便于目标物在容纳槽202内移动至排出口205，进而排出清除单元200。
请参照图7，当清除单元200处于未工作状态时，清除单元200位于可视单元100的透明可视件101的一侧，此时，通过透明可视件101无法直接看到清除单元200，当透明可视件101上有需要清除的目标物时，以目标物为水雾或水滴为例，驱动单元300驱动清除单元200围绕以驱动单元300的驱动轴为中心转动，清除单元200由透明可视件101的一侧边缘转动至透明可视件101的另一侧边缘，清除单元200的刮条204移动的范围完全覆盖透明可视件101的区域，当清除单元200完成工作时的状态如图8所示，清除单元200位于透明可视件101的另一侧。
实施例2
本实施例提供了一种半导体处理设备，该设备的结构与实施例1中的半导体处理设备的结构基本相同，不同的是，设备还包括喷头单元400。请参照图9、图10，喷头单元400包括：液体喷头402和移动臂401。液体喷头402设置于移动臂的一端。移动臂401的另一端与驱动单元连接，驱动单元驱动移动臂401带着液体喷头402在基板500的正上方做往复运动。
当喷头单元400喷射的流体为氮气时，喷头单元400还包括氮气喷头403，用于氮气吹扫。
请继续参照图10，图10示出了本实施例的驱动单元的驱动轴与清除单元及喷头单元装配完成的立体结构示意图。驱动单元300驱动喷头单元400以喷头单元400与驱动单元300连接处为圆心做扇形运动，且喷头单元400与清除单元200均与驱动单元300的驱动轴相连接，液体喷头402与刮板本体201的夹角固定设置。所设置的夹角为当喷头单元400的液体喷头402位于设备内待处理的基板500中心的正上方时，清除单元200的刮条204位于透明可视件101的边缘或者边缘外周。
请参照图10、图11，当喷头单元400处于未工作状态时，喷头单元400位于基板500的一侧，此时清除单元200位于可视单元100的透明可视件101的一侧，通过透明可视件101无法直接看到喷头单元400，清除单元200的刮板本体201位于透明可视件101的外周边缘，通过透明可视件101同样无法直接看到清除单元200。当准备开始工作时，驱动单元300驱动喷头单元400和清除单元200围绕以驱动轴为中心转动，当喷头单元400从基板500的一侧向基板500的中心移动时，清除单元200由透明可视件101的一侧边缘向透明可视件101的另一侧方向移动，当喷头单元400从基板500的一侧移动至基板500的另一侧，且对基板500完成工作后，清除单元200也将从透明可视件101的一侧移动至透明可视件101的另一侧，在此过程中，清除单元200的刮条204的移动范围完全覆盖透明可视件101的区域。工艺完成后，通过透明可视件101不能再看到喷头单元400及清除单元200，具体如图12所示。
通过利用半导体处理设备自有的驱动单元作为驱动清除单元200的动力源，一方面能够有效利用设备装置；另一方面，能够在喷头单元400对基板500进行工艺的过程中实时清除可视单元100上的目标物，有效提高了工艺过程的可控性，同时提高了工作效率，为保证半导体的处理结果达到良率提供了进一步的保障。
其余结构与实施例1相同。
尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。
Claims (11)
- 一种半导体处理设备，其特征在于，包括：可视单元，设置于半导体处理设备壳体上，用于观察半导体处理设备内部情况；清除单元，设置于半导体处理设备内部，用于清除所述可视单元位于设备内部一侧上的目标物；驱动单元，与清除单元连接，用于驱动所述清除单元，以清除所述可视单元位于设备内部一侧上的目标物。
- 根据权利要求1所述的半导体处理设备，其特征在于，所述清除单元包括：刮板本体，可拆卸安装于驱动单元上；容纳槽，沿刮板本体长度方向设置于刮板本体上端面；安装部，设置于所述容纳槽底部，用于安装刮条。刮条，设置于所述安装部内，被配置为清除目标物体。
- 根据权利要求2所述的半导体处理设备，其特征在于：所述刮板本体还包括：排出口，设置于所述刮板本体的一端，与所述容纳槽相连通。
- 根据权利要求3所述的半导体处理设备，其特征在于：所述容纳槽底壁沿刮板本体长度方向倾斜设置，且靠近排出口的一端低于远离排出口的一端。
- 根据权利要求4所述的半导体处理设备，其特征在于：所述容纳槽底壁倾斜设置的坡度的范围为0-1.5°。
- 根据权利要求2至5任一项所述的半导体处理设备，其特征在于：所述刮条的制备材料为耐腐蚀耐磨材料。
- 根据权利要求6所述的半导体处理设备，其特征在于：所述安装部为槽结构或通孔结构。
- 根据权利要求1所述的半导体处理设备，其特征在于，还包括：喷头单元，与驱动单元连接，所述驱动单元驱动喷头单元围绕以喷头单元与驱动单元连接处为圆心做扇形运动；所述喷头单元包括：液体喷头和移动臂；所述液体喷头，设置于所述移动臂的一端；所述移动臂，另一端与驱动单元连接；所述驱动单元，驱动移动臂带着液体喷头在基板的正上方做往复运动。
- 根据权利要求8所述的半导体处理设备，其特征在于：所述液体喷头与所述刮板本体的夹角固定设置。
- 根据权利要求8所述的半导体处理设备，其特征在于，所述喷头单元还包括气体喷头，用于气体吹扫。
- 根据权利要求2所述的半导体处理设备，其特征在于，所述刮条与所述可视单元直接接触以清除所述可视单元位于设备内部一侧上的目标物；或，所述刮条与所述可视单元不接触，所述刮条与所述可视单元之间的距离小于目标物直径以清除所述可视单元位于设备内部一侧上的目标物。
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| CN1963991A (zh) * | 2006-11-27 | 2007-05-16 | 成都华冠精密电子机械有限公司 | 清除半导体元器件上残胶的方法及其专用设备 |
| JP2007273806A (ja) * | 2006-03-31 | 2007-10-18 | Matsushita Electric Ind Co Ltd | 半導体基板の洗浄方法および洗浄装置 |
| CN207898432U (zh) * | 2017-10-11 | 2018-09-25 | 苏州亿倍智能清洁股份有限公司 | 一种扫地机用刮条安装结构 |
| CN208324508U (zh) * | 2018-06-05 | 2019-01-04 | 温州铭大印业有限公司 | 一种具有角度调节功能的丝网印刷机的油墨刮板 |
| CN110303422A (zh) * | 2019-07-17 | 2019-10-08 | 国网山东省电力公司菏泽供电公司 | 导线氧化层清除装置 |
| CN211760527U (zh) * | 2019-12-30 | 2020-10-27 | 江苏博雄智能制造有限公司 | 一种半导体元器成型后废料清除设备 |
| CN212725251U (zh) * | 2020-09-23 | 2021-03-16 | 江苏威森美微电子有限公司 | 一种可快速清除半导体元器件残胶的装置 |
-
2021
- 2021-12-16 CN CN202111544767.7A patent/CN116266544A/zh active Pending
-
2022
- 2022-11-24 WO PCT/CN2022/134110 patent/WO2023109464A1/zh unknown
- 2022-12-15 TW TW111148187A patent/TW202343618A/zh unknown
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007273806A (ja) * | 2006-03-31 | 2007-10-18 | Matsushita Electric Ind Co Ltd | 半導体基板の洗浄方法および洗浄装置 |
| CN1963991A (zh) * | 2006-11-27 | 2007-05-16 | 成都华冠精密电子机械有限公司 | 清除半导体元器件上残胶的方法及其专用设备 |
| CN207898432U (zh) * | 2017-10-11 | 2018-09-25 | 苏州亿倍智能清洁股份有限公司 | 一种扫地机用刮条安装结构 |
| CN208324508U (zh) * | 2018-06-05 | 2019-01-04 | 温州铭大印业有限公司 | 一种具有角度调节功能的丝网印刷机的油墨刮板 |
| CN110303422A (zh) * | 2019-07-17 | 2019-10-08 | 国网山东省电力公司菏泽供电公司 | 导线氧化层清除装置 |
| CN211760527U (zh) * | 2019-12-30 | 2020-10-27 | 江苏博雄智能制造有限公司 | 一种半导体元器成型后废料清除设备 |
| CN212725251U (zh) * | 2020-09-23 | 2021-03-16 | 江苏威森美微电子有限公司 | 一种可快速清除半导体元器件残胶的装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116266544A (zh) | 2023-06-20 |
| TW202343618A (zh) | 2023-11-01 |
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