WO2023103095A1 - 显示面板及其制备方法、显示终端 - Google Patents

显示面板及其制备方法、显示终端 Download PDF

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Publication number
WO2023103095A1
WO2023103095A1 PCT/CN2021/140417 CN2021140417W WO2023103095A1 WO 2023103095 A1 WO2023103095 A1 WO 2023103095A1 CN 2021140417 W CN2021140417 W CN 2021140417W WO 2023103095 A1 WO2023103095 A1 WO 2023103095A1
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Prior art keywords
layer
display panel
cathode
pixel
anode
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PCT/CN2021/140417
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English (en)
French (fr)
Inventor
赵云
Original Assignee
惠州华星光电显示有限公司
深圳市华星光电半导体显示技术有限公司
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Application filed by 惠州华星光电显示有限公司, 深圳市华星光电半导体显示技术有限公司 filed Critical 惠州华星光电显示有限公司
Priority to US17/623,055 priority Critical patent/US20240049512A1/en
Publication of WO2023103095A1 publication Critical patent/WO2023103095A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H10K50/822—Cathodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • H10K59/80521—Cathodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant

Definitions

  • the present application relates to the field of display technology, and in particular to a display panel, a manufacturing method thereof, and a display terminal.
  • OLED Organic Light Emitting Diode (Organic Light Emitting Diode) display panel
  • OLED display panel is a new type of flat panel display technology with high contrast and fast response speed, but OLED display panel is very sensitive to water vapor and is easily affected to produce defects.
  • a pixel isolation layer is formed between the sub-pixels of the display panel to avoid a short circuit between the cathode and the anode of the display panel.
  • the material of the pixel isolation layer is an organic substance (especially a polymer material). Under high temperature or ultraviolet light or other conditions, the polymer material will release small molecules, and the small molecules will lift up the cathode, which will damage the cathode and the organic light-emitting layer.
  • the released small molecules react with the cathode (usually magnesium, aluminum, silver and other active metals), which will damage the cathode and cause the film layer of the display panel (especially the cathode and organic Poor contact occurs between the light-emitting layer), which leads to poor light emission at the edge of the sub-pixel of the display panel (decreased or no brightness).
  • the cathode usually magnesium, aluminum, silver and other active metals
  • the embodiment of the present application provides a display panel, which is used to solve the technical problem that the pixel isolation layer of the display panel in the prior art releases small molecules, resulting in poor contact between the cathode and the organic light-emitting layer, resulting in poor edge light emission of sub-pixels.
  • An embodiment of the present application provides a display panel, including a substrate layer, an anode layer, a pixel isolation layer, an organic light-emitting layer, and a cathode layer; the anode layer is located on the substrate layer, and the anode layer includes a plurality of anodes; the The pixel isolation layer is located on the substrate layer, the pixel isolation layer includes a plurality of pixel opening areas and a non-opening area between two adjacent pixel opening areas, one pixel opening area and one anode Corresponding; the organic light-emitting layer is located on the anode layer and the pixel isolation layer; the cathode layer is located on the organic light-emitting layer; wherein, the cathode layer corresponds to the non-opening of the pixel isolation layer region is provided with at least one through hole.
  • the display panel further includes a barrier layer, and the barrier layer covers the cathode layer.
  • the barrier layer includes at least one organic layer and at least one inorganic layer, and the organic layer and the inorganic layer are stacked.
  • the material of the inorganic layer is silicon dioxide, silicon nitride, silicon oxynitride or aluminum oxide.
  • the display panel further includes a cover layer, one side surface of the cover layer is provided with an adhesive layer, and the cover layer is connected to the The side of the barrier layer away from the cathode layer is bonded.
  • the display panel further includes a cover layer, the cover layer is located on the side of the barrier layer away from the cathode layer, and the cover layer faces the substrate layer
  • a sealant layer is arranged around one side of the cover plate, and the cover layer is attached to the base layer through the sealant layer.
  • the side of the cover layer facing the substrate layer is further provided with a getter layer and an adhesive layer, and the adhesive layer is located inside the sealant layer, so The air-absorbing layer is located between the adhesive layer and the sealant layer.
  • the getter layer is a desiccant
  • the adhesive layer is a transparent optical adhesive
  • the sealant layer is a light-shielding adhesive
  • the orthographic projection of the through hole on the pixel isolation layer is located in the non-opening area of the pixel isolation layer.
  • An embodiment of the present application provides a method for manufacturing a display panel, including: preparing an anode layer on a substrate layer, the anode layer including a plurality of anodes; preparing a pixel isolation layer on the substrate layer, the pixel isolation layer including multiple a pixel opening area and a non-opening area located between two adjacent pixel opening areas, one pixel opening area corresponds to one anode; an organic luminescence is prepared on the anode layer and the pixel isolation layer layer; preparing a cathode layer on the organic light-emitting layer; preparing at least one through hole corresponding to the non-opening area of the pixel isolation layer on the cathode layer.
  • the manufacturing method further includes: preparing a barrier layer on the cathode layer, and the barrier layer covers the cathode layer.
  • the barrier layer includes at least one organic layer and at least one inorganic layer, and the organic layer and the inorganic layer are stacked.
  • the material of the inorganic layer is silicon dioxide, silicon nitride, silicon oxynitride or aluminum oxide.
  • the preparation method further includes: providing a cover layer, attaching an adhesive layer to one surface of the cover layer, passing the cover layer through The adhesive layer is bonded to a side of the barrier layer away from the cathode layer.
  • the preparation method further includes: providing a cover layer, the cover layer is located on the side of the barrier layer away from the cathode layer, and on the cover A frame glue layer is pasted around the side of the plate layer facing the base layer, and the cover plate layer is bonded to the base layer through the frame glue layer.
  • the side of the cover layer facing the substrate layer is also provided with a getter layer and an adhesive layer, and the adhesive layer is located on the sealant layer.
  • the air-absorbing layer is located between the adhesive layer and the sealant layer.
  • the air-absorbing layer is a desiccant
  • the adhesive layer is a transparent optical adhesive
  • the sealant layer is a light-shielding adhesive
  • An embodiment of the present application also provides a display terminal, including a terminal body and a display panel, the terminal body and the display panel are integrated, and the display panel includes a substrate layer, an anode layer, a pixel isolation layer, an organic light-emitting layer, and The cathode layer; the anode layer is located on the substrate layer, and the anode layer includes a plurality of anodes; the pixel isolation layer is located on the substrate layer, and the pixel isolation layer includes a plurality of pixel opening regions and adjacent In the non-opening area between the two pixel opening areas, one of the pixel opening areas corresponds to one of the anodes; the organic light-emitting layer is located on the anode layer and the pixel isolation layer; the cathode layer is located on the On the organic light-emitting layer; wherein, at least one through hole is provided on the cathode layer corresponding to the non-opening area of the pixel isolation layer.
  • the display panel further includes a barrier layer, and the barrier layer covers the cathode layer.
  • the barrier layer includes at least one organic layer and at least one inorganic layer, and the organic layer and the inorganic layer are stacked.
  • a display panel provided by an embodiment of the present application includes a substrate layer, an anode layer, a pixel isolation layer, an organic light-emitting layer, and a cathode layer; the anode layer is located on the substrate layer, and the anode layer includes a plurality of anodes; the pixel isolation layer is located on the substrate layer , the pixel isolation layer includes a plurality of pixel opening areas and non-opening areas located between two adjacent pixel opening areas, one pixel opening area corresponds to an anode; the organic light emitting layer is located on the anode layer and the pixel isolation layer; the cathode layer is located on the On the organic light-emitting layer; wherein, at least one through hole is provided on the cathode layer corresponding to the non-opening area of the pixel isolation layer; the application provides at least one through hole on the cathode layer corresponding to the non-opening area of the pixel isolation layer, when the pixel isolation layer When small molecules are generated due to high temperature or ultraviolet
  • FIG. 1 is a schematic diagram of a basic structure of a display panel provided by an embodiment of the present application.
  • FIG. 2 is a top view of a display panel provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of another display panel provided by an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of another display panel provided by an embodiment of the present application.
  • FIG. 5 is a schematic diagram of a basic structure of another display panel provided by an embodiment of the present application.
  • FIG. 6 is a flow chart of a method for manufacturing a display panel provided in an embodiment of the present application.
  • FIG. 1 it is a schematic diagram of the basic structure of the display panel provided by the embodiment of the present application.
  • the display panel includes a substrate layer 10, an anode layer 20, a pixel isolation layer 30, an organic light-emitting layer 40, and a cathode layer 50;
  • the anode Layer 20 is located on the substrate layer 10, the anode layer 20 includes a plurality of anodes;
  • the pixel isolation layer 30 is located on the substrate layer 10, the pixel isolation layer 30 includes a plurality of pixel opening regions and adjacent In the non-opening area between the two pixel opening areas, one pixel opening area corresponds to one anode;
  • the organic light-emitting layer 40 is located on the anode layer 20 and the pixel isolation layer 30;
  • the The cathode layer 50 is located on the organic light emitting layer 40 ; wherein, at least one through hole 60 is provided on the cathode layer 50 corresponding to the non-opening area of the pixel isolation layer 30 .
  • a driving circuit layer (not shown) is also provided between the substrate layer 10 and the anode layer 20, the driving circuit layer is electrically connected to the anode layer 20, and is the anode layer 20 provides driving voltage.
  • the organic light-emitting layer 40 specifically includes a hole transport layer, a light-emitting material layer, and an electron transport layer. The hole transport layer and the light-emitting material layer are located in the pixel opening area formed by the pixel isolation layer 30. The light-emitting layer The material layer is located on the hole transport layer, and the electron transport layer is located on the light emitting material layer and the pixel isolation layer 30 .
  • the anode layer 20 forms holes, and the holes enter the luminescent material layer from the hole transport layer, and the cathode layer 50 forms electrons, and the electrons enter the luminescent material layer from the electron transport layer.
  • material layer, the holes and the electrons recombine in the luminescent material layer to generate excitons, and the excitons migrate under the action of the electric field between the anode layer 20 and the cathode layer 50 to generate photons and release energy.
  • the material of the pixel isolation layer 30 is generally an organic substance (especially a polymer material), and when exposed to high temperature or ultraviolet radiation, the polymer material may release small molecules, and the small molecules lift up the cathode layer 50 , will destroy the contact state between the cathode layer 50 and the organic light-emitting layer 40; in addition, the released small molecules (such as water molecules or other molecules) react with the cathode layer 50 (usually active metals such as magnesium, aluminum, silver), and will damage the cathode layer. layer 50, resulting in poor contact between the film layers of the display panel (especially the cathode layer 50 and the organic light-emitting layer 40), resulting in poor light emission at the edge of the sub-pixels of the display panel.
  • the cathode layer 50 usually active metals such as magnesium, aluminum, silver
  • At least one through hole 60 is provided on the cathode layer 50 corresponding to the non-opening area of the pixel isolation layer 30.
  • the pixel isolation layer 30 generates small molecules (such as water molecules) due to high temperature or ultraviolet radiation, the small molecules can pass through the through hole 60.
  • small molecules such as water molecules
  • the display panel avoid releasing between the cathode layer 50 and the anode layer 20 of the display panel, damage the contact interface between the cathode layer 50 and the organic light-emitting layer 40, avoid poor light emission at the edge of the sub-pixel, and improve the reliability of the display panel. sex.
  • FIG. 2 is a top view of the display panel provided by the embodiment of the present application. It can be seen from FIG. 2 that the orthographic projection of the through hole 60 on the cathode layer 50 on the pixel isolation layer 30 is located in the non-open area. It can be understood that the area where the through hole 60 is located is the missing area of the cathode layer 50.
  • the orthographic projection of the through hole 60 on the pixel isolation layer 30 is located in the non-opening area of the pixel isolation layer 30, that is, the cathode layer
  • the missing area of 50 is located in the non-opening area of the pixel isolation layer 30, which will not cause the missing of the cathode layer 50 in the pixel opening area, and will not affect the gap between the cathode layer 50 and the anode layer 20 in the pixel opening area (as shown in Figure 1). the electric field.
  • the shape of the through hole 60 is circular (as shown in FIG. 2 ), oval or polygonal. It can be understood that, in FIG. 2 , the shape of the through hole 60 is only shown as a circle, and in other embodiments, the shape of the through hole 60 can also be a square or special-shaped opening.
  • the pixel opening area formed by the pixel isolation layer 30 includes a red sub-pixel 401 , a green sub-pixel 402 and a blue sub-pixel 403 .
  • FIG. 3 is a schematic structural diagram of another display panel provided by an embodiment of the present application.
  • the display panel includes a substrate layer 10 , an anode layer 20 , a pixel isolation layer 30 , an organic light-emitting layer 40 and a cathode layer 50
  • the anode layer 20 is located on the substrate layer 10, and the anode layer 20 includes a plurality of anodes;
  • the pixel isolation layer 30 is located on the substrate layer 10, and the pixel isolation layer 30 includes a plurality of pixel opening regions and a non-opening area located between two adjacent pixel opening areas, one pixel opening area corresponds to one anode;
  • the organic light-emitting layer 40 is located between the anode layer 20 and the pixel isolation layer 30 above;
  • the cathode layer 50 is located on the organic light emitting layer 40 ; wherein, at least one through hole 60 is provided on the cathode layer 50 corresponding to the non-opening area of the pixel isolation layer 30 .
  • the display panel further includes a barrier layer 70 covering the cathode layer 50 .
  • a barrier layer 70 covering the cathode layer 50 .
  • at least one through hole 60 is provided on the cathode layer 50 corresponding to the non-opening area of the pixel isolation layer 30 to discharge the small molecules (such as water molecules) released by the pixel isolation layer 30, but the external water vapor It may intrude into the organic light emitting layer 40 through the through holes 60, resulting in poor light emission.
  • the barrier layer 70 by disposing the barrier layer 70 on the cathode layer 50 , the problem of external water vapor introduced by the disposing of the through hole 60 can be improved.
  • the small molecules (such as water molecules) released by the internal pixel isolation layer 30 cannot be discharged through the barrier layer 70 for a short time, the internal water molecules will not accumulate between the cathode layer 50 and the organic light-emitting layer 40, and damage the contact state between the cathode layer 50 and the organic light-emitting layer 40; instead, it will move between the barrier layer 70 and the cathode layer 50, because the barrier layer 70 has a certain water permeability (the water vapor transmission rate WVTR is about 10 ⁇ 3 g /m 2 *day), so the water molecules will slowly dissipate as time goes by, therefore, it will not affect the cathode layer 50 and the organic light-emitting layer 40, and can also block the external water vapor.
  • the water vapor transmission rate WVTR is about 10 ⁇ 3 g /m 2 *day
  • the barrier layer 70 includes at least one organic layer and at least one inorganic layer, and the organic layer and the inorganic layer are stacked.
  • the organic layer is formed by an evaporation process
  • the inorganic layer is formed by a chemical vapor deposition process
  • the material of the inorganic layer is, for example, silicon dioxide, silicon nitride, silicon oxynitride, or aluminum oxide.
  • the display panel further includes a cover layer 80, one side surface of the cover layer 80 is provided with an adhesive layer 90, and the cover layer 80 is connected with the adhesive layer 90.
  • the side of the barrier layer 70 away from the cathode layer 50 is bonded.
  • FIG. 4 is a schematic diagram of the basic structure of another display panel provided by the embodiment of the present application.
  • the display panel includes a substrate layer 10 , an anode layer 20 , a pixel isolation layer 30 , an organic light-emitting layer 40 and a cathode layer 50
  • the anode layer 20 is located on the substrate layer 10, and the anode layer 20 includes a plurality of anodes;
  • the pixel isolation layer 30 is located on the substrate layer 10, and the pixel isolation layer 30 includes a plurality of pixel opening regions and a non-opening area located between two adjacent pixel opening areas, one pixel opening area corresponds to one anode;
  • the organic light-emitting layer 40 is located between the anode layer 20 and the pixel isolation layer 30 above;
  • the cathode layer 50 is located on the organic light emitting layer 40 ; wherein, at least one through hole 60 is provided on the cathode layer 50 corresponding to the non-opening area of the pixel isolation layer 30 .
  • the display panel further includes a barrier layer 70 covering the cathode layer 50 .
  • a barrier layer 70 covering the cathode layer 50 .
  • at least one through hole 60 is provided on the cathode layer 50 corresponding to the non-opening area of the pixel isolation layer 30 to discharge the small molecules (such as water molecules) released by the pixel isolation layer 30, but the external water vapor It may intrude into the organic light emitting layer 40 through the through holes 60, resulting in poor light emission.
  • the barrier layer 70 by disposing the barrier layer 70 on the cathode layer 50 , the problem of external water vapor introduced by the disposing of the through hole 60 can be improved.
  • the display panel further includes a cover layer 80, the cover layer 80 is located on the side of the barrier layer 70 away from the cathode layer 50, the cover layer 80 faces the lining
  • a sealant layer 91 is provided around one side of the bottom layer 10 , and the cover layer 80 is attached to the base layer 10 through the sealant layer 91 .
  • FIG. 5 is a schematic diagram of the basic structure of another display panel provided by the embodiment of the present application.
  • the display panel includes a substrate layer 10 , an anode layer 20 , a pixel isolation layer 30 , an organic light-emitting layer 40 and a cathode layer 50
  • the anode layer 20 is located on the substrate layer 10, and the anode layer 20 includes a plurality of anodes;
  • the pixel isolation layer 30 is located on the substrate layer 10, and the pixel isolation layer 30 includes a plurality of pixel opening regions and a non-opening area located between two adjacent pixel opening areas, one pixel opening area corresponds to one anode;
  • the organic light-emitting layer 40 is located between the anode layer 20 and the pixel isolation layer 30 above;
  • the cathode layer 50 is located on the organic light emitting layer 40 ; wherein, at least one through hole 60 is provided on the cathode layer 50 corresponding to the non-opening area of the pixel isolation layer 30 .
  • the display panel further includes a barrier layer 70 covering the cathode layer 50 .
  • a barrier layer 70 covering the cathode layer 50 .
  • at least one through hole 60 is provided on the cathode layer 50 corresponding to the non-opening area of the pixel isolation layer 30 to discharge the small molecules (such as water molecules) released by the pixel isolation layer 30, but the external water vapor It may intrude into the organic light emitting layer 40 through the through holes 60, resulting in poor light emission.
  • the barrier layer 70 by disposing the barrier layer 70 on the cathode layer 50 , the problem of external water vapor introduced by the disposing of the through hole 60 can be improved.
  • the display panel further includes a cover layer 80, the cover layer 80 is located on the side of the barrier layer 70 away from the cathode layer 50, the cover layer 80 faces the lining
  • a sealant layer 91 is provided around one side of the bottom layer 10 , and the cover layer 80 is attached to the base layer 10 through the sealant layer 91 .
  • the side of the cover layer 80 facing the base layer 10 is also provided with an air-absorbing layer 92 and an adhesive layer 90, the adhesive layer 90 is located inside the sealant layer 91, and the air-absorbing The layer 92 is located between the adhesive layer 90 and the sealant layer 91 .
  • the getter layer 92 can effectively absorb certain gas molecules, effectively protecting the cathode layer 50, the organic light-emitting layer 40 and other sensitive components. film layer.
  • the air-absorbing layer 92 is a desiccant
  • the adhesive layer 90 is a transparent optical adhesive
  • the frame adhesive layer 91 is a light-shielding adhesive.
  • the getter layer 92 is specifically a desiccant.
  • small molecules such as water molecules
  • the adhesive layer 90 adopts transparent optical adhesive, which has a high transmittance and will not affect the light extraction rate of the display panel.
  • the sealant layer 91 uses light-shielding glue to prevent light leakage from the edge of the display panel.
  • FIG. 6 is a flow chart of a manufacturing method of a display panel provided in an embodiment of the present application.
  • the manufacturing method includes steps:
  • the pixel isolation layer includes a plurality of pixel opening areas and a non-opening area located between two adjacent pixel opening areas, one pixel opening area and one pixel opening area
  • the anode corresponds to;
  • the through holes on the cathode layer are formed by laser or exposure etching. It can be understood that the present application prepares at least one through hole on the cathode layer corresponding to the non-opening area of the pixel isolation layer. When the pixel isolation layer generates small molecules (such as water molecules) due to high temperature or ultraviolet radiation, the small molecules can pass through the through hole. Released from the display panel, avoiding release between the cathode layer and the anode layer of the display panel, damaging the contact interface between the cathode layer and the organic light-emitting layer, avoiding poor light emission at the edge of the sub-pixel, and improving the reliability of the display panel.
  • small molecules such as water molecules
  • the preparation method further includes: preparing a barrier layer on the cathode layer, and the barrier layer covers the cathode layer.
  • at least one through hole is prepared on the cathode layer corresponding to the non-opening area of the pixel isolation layer to discharge small molecules (such as water molecules) released from the pixel isolation layer, but external water vapor may pass through the pixel isolation layer.
  • the above-mentioned through hole invades into the organic light-emitting layer, resulting in poor light emission.
  • the problem of external water vapor introduced by setting through holes can be improved.
  • the barrier layer includes at least one organic layer and at least one inorganic layer, and the organic layer and the inorganic layer are stacked.
  • the organic layer is formed by an evaporation process
  • the inorganic layer is formed by a chemical vapor deposition process
  • the material of the inorganic layer is, for example, silicon dioxide, silicon nitride, silicon oxynitride, or aluminum oxide.
  • the preparation method further includes: providing a cover layer, attaching an adhesive layer to one surface of the cover layer, passing the cover layer through the adhesive layer and the adhesive layer. The side of the barrier layer away from the cathode layer is bonded.
  • the preparation method further includes: providing a cover layer, the cover layer is located on the side of the barrier layer away from the cathode layer, and the cover layer faces the substrate layer A sealant layer is pasted around one side of the cover plate, and the cover layer is bonded to the base layer through the sealant layer.
  • the side of the cover layer facing the base layer is further provided with an air-absorbing layer and an adhesive layer, the adhesive layer is located inside the sealant layer, and the air-absorbing layer It is located between the adhesive layer and the sealant layer.
  • a getter layer is provided inside the sealant layer, the getter layer can effectively absorb some gas molecules, and effectively protect sensitive film layers such as the cathode layer and the organic light-emitting layer.
  • the air-absorbing layer is a desiccant
  • the adhesive layer is a transparent optical adhesive
  • the frame adhesive layer is a light-shielding adhesive.
  • the getter layer is specifically a desiccant.
  • the small molecules (such as water molecules) released by the pixel isolation layer or other film layers can be released from the through holes and be absorbed
  • the desiccant absorbs to avoid impact on the cathode layer and the organic light-emitting layer, and avoids damage to the display panel when it is powered on.
  • the adhesive layer adopts transparent optical adhesive, which has a high transmittance and will not affect the light extraction rate of the display panel.
  • the frame glue layer adopts light-shielding glue to prevent light leakage at the edge of the display panel.
  • An embodiment of the present application further provides a display terminal, including a terminal body and the above-mentioned display panel, where the terminal body and the display panel are combined into one body.
  • a display terminal including a terminal body and the above-mentioned display panel, where the terminal body and the display panel are combined into one body.
  • the display terminal provided in the embodiment of the present application may be a product or component having a display function such as a mobile phone, a tablet computer, a notebook computer, a television, a digital camera, and a navigator.
  • a display panel provided by the embodiment of the present application includes a substrate layer, an anode layer, a pixel isolation layer, an organic light-emitting layer, and a cathode layer;
  • the anode layer is located on the substrate layer, and the anode layer includes a plurality of anodes;
  • the pixel isolation layer layer is located on the substrate layer, the pixel isolation layer includes a plurality of pixel opening areas and non-opening areas located between two adjacent pixel opening areas, a pixel opening area corresponds to an anode;
  • the organic light emitting layer is located between the anode layer and the pixel isolation layer above;
  • the cathode layer is located on the organic light-emitting layer; wherein, at least one through hole is provided on the cathode layer corresponding to the non-opening area of the pixel isolation layer;
  • the present application provides at least one through hole on the cathode layer corresponding to the non-opening area of the pixel isolation layer , when the pixel
  • a display panel, a manufacturing method thereof, and a display terminal provided in the embodiments of the present application have been introduced in detail above. It should be understood that the exemplary embodiments described herein should only be considered as descriptive, and are used to help understand the method and core idea of the present application, but not to limit the present application.

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Abstract

一种显示面板及其制备方法、显示终端，显示面板包括衬底层（10）、阳极层（20）、像素隔离层（30）、有机发光层（40）以及阴极层（50）；像素隔离层（30）包括多个像素开口区和位于相邻两个像素开口区之间的非开口区；阴极层（50）上对应像素隔离层（30）的非开口区设有至少一个通孔（60）。

Description

显示面板及其制备方法、显示终端 技术领域
本申请涉及显示技术领域，尤其涉及一种显示面板及其制备方法、显示终端。
 背景技术
OLED(Organic Light Emitting Diode，有机发光二极管)显示面板是一种对比度高，响应速度快的新型平板显示技术，但是OLED显示面板对水汽非常敏感，极易受影响产生缺陷。
显示面板的子像素之间制作有像素隔离层，以避免显示面板的阴极与阳极短路。通常像素隔离层的材料为有机物(特别是高分子材料)，在遇到高温或紫外线或其他条件下，高分子材料存在释放小分子的情况，小分子顶起阴极，会破坏阴极与有机发光层的接触状态；另外，释放的小分子(如水分子或其他分子)与阴极(一般为镁、铝、银等活泼金属)发生反应，会损伤阴极，导致显示面板的膜层(特别是阴极与有机发光层)之间出现接触不良的情况，从而导致显示面板的子像素边缘发光不良(亮度降低或不亮)。
 技术问题
本申请实施例提供一种显示面板，用于解决现有技术的显示面板的像素隔离层释放小分子，导致阴极与有机发光层之间接触不良，导致子像素的边缘发光不良的技术问题。
 技术解决方案
本申请实施例提供一种显示面板，包括衬底层、阳极层、像素隔离层、有机发光层以及阴极层；所述阳极层位于所述衬底层上，所述阳极层包括多个阳极；所述像素隔离层位于所述衬底层上，所述像素隔离层包括多个像素开口区和位于相邻两个所述像素开口区之间的非开口区，一所述像素开口区与一所述阳极对应；所述有机发光层位于所述阳极层和所述像素隔离层上；所述阴极层位于所述有机发光层上；其中，所述阴极层上对应所述像素隔离层的所述非开口区设有至少一个通孔。
在本申请实施例提供的显示面板中，所述显示面板还包括阻隔层，所述阻隔层覆盖所述阴极层。
在本申请实施例提供的显示面板中，所述阻隔层包括至少一层有机层和至少一层无机层，所述有机层和所述无机层层叠设置。
在本申请实施例提供的显示面板中，所述无机层的材料为二氧化硅、氮化硅、氮氧化硅或氧化铝。
在本申请实施例提供的显示面板中，所述显示面板还包括盖板层，所述盖板层的一侧表面设置有粘胶层，所述盖板层通过所述粘胶层与所述阻隔层远离所述阴极层的一侧贴合设置。
在本申请实施例提供的显示面板中，所述显示面板还包括盖板层，所述盖板层位于所述阻隔层远离所述阴极层的一侧，所述盖板层面向所述衬底层的一侧四周设置有框胶层，所述盖板层通过所述框胶层与所述衬底层贴合设置。
在本申请实施例提供的显示面板中，所述盖板层面向所述衬底层的一侧还设置有吸气层和粘胶层，所述粘胶层位于所述框胶层的内侧，所述吸气层位于所述粘胶层和所述框胶层之间。
在本申请实施例提供的显示面板中，所述吸气层为干燥剂，所述粘胶层为透明光学胶，所述框胶层为遮光胶。
在本申请实施例提供的显示面板中，所述通孔在所述像素隔离层上的正投影位于所述像素隔离层的所述非开口区内。
本申请实施例提供一种显示面板的制备方法，包括：在衬底层上制备阳极层，所述阳极层包括多个阳极；在所述衬底层上制备像素隔离层，所述像素隔离层包括多个像素开口区和位于相邻两个所述像素开口区之间的非开口区，一所述像素开口区与一所述阳极对应；在所述阳极层和所述像素隔离层上制备有机发光层；在所述有机发光层上制备阴极层；在所述阴极层上对应所述像素隔离层的所述非开口区制备至少一个通孔。
在本申请实施例提供的显示面板的制备方法中，所述制备方法还包括：在所述阴极层上制备阻隔层，所述阻隔层覆盖所述阴极层。
在本申请实施例提供的显示面板的制备方法中，所述阻隔层包括至少一层有机层和至少一层无机层，所述有机层和所述无机层层叠设置。
在本申请实施例提供的显示面板的制备方法中，所述无机层的材料为二氧化硅、氮化硅、氮氧化硅或氧化铝。
在本申请实施例提供的显示面板的制备方法中，所述制备方法还包括：提供一盖板层，在所述盖板层的一侧表面贴附粘胶层，将所述盖板层通过所述粘胶层与所述阻隔层远离所述阴极层的一侧贴合。
在本申请实施例提供的显示面板的制备方法中，所述制备方法还包括：提供一盖板层，所述盖板层位于所述阻隔层远离所述阴极层的一侧，在所述盖板层面向所述衬底层的一侧四周贴附框胶层，将所述盖板层通过所述框胶层与所述衬底层贴合。
在本申请实施例提供的显示面板的制备方法中，所述盖板层面向所述衬底层的一侧还设置有吸气层和粘胶层，所述粘胶层位于所述框胶层的内侧，所述吸气层位于所述粘胶层和所述框胶层之间。
在本申请实施例提供的显示面板的制备方法中，所述吸气层为干燥剂，所述粘胶层为透明光学胶，所述框胶层为遮光胶。
本申请实施例还提供一种显示终端，包括终端主体和显示面板，所述终端主体与所述显示面板组合为一体，所述显示面板包括衬底层、阳极层、像素隔离层、有机发光层以及阴极层；所述阳极层位于所述衬底层上，所述阳极层包括多个阳极；所述像素隔离层位于所述衬底层上，所述像素隔离层包括多个像素开口区和位于相邻两个所述像素开口区之间的非开口区，一所述像素开口区与一所述阳极对应；所述有机发光层位于所述阳极层和所述像素隔离层上；所述阴极层位于所述有机发光层上；其中，所述阴极层上对应所述像素隔离层的所述非开口区设有至少一个通孔。
在本申请实施例提供的显示终端中，所述显示面板还包括阻隔层，所述阻隔层覆盖所述阴极层。
在本申请实施例提供的显示终端中，所述阻隔层包括至少一层有机层和至少一层无机层，所述有机层和所述无机层层叠设置。
 有益效果
本申请实施例提供的一种显示面板，包括衬底层、阳极层、像素隔离层、有机发光层以及阴极层；阳极层位于衬底层上，阳极层包括多个阳极；像素隔离层位于衬底层上，像素隔离层包括多个像素开口区和位于相邻两个像素开口区之间的非开口区，一像素开口区与一阳极对应；有机发光层位于阳极层和像素隔离层上；阴极层位于有机发光层上；其中，阴极层上对应像素隔离层的非开口区设有至少一个通孔；本申请通过在阴极层上对应像素隔离层的非开口区设置至少一个通孔，当像素隔离层因高温或者紫外线照射产生小分子时，小分子可通过此通孔从显示面板中释放出来，避免在显示面板的阴极与阳极之间释放，损害阴极与有机发光层的接触界面，避免子像素的边缘发光不良，提升了显示面板的可靠性。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍。
图1是本申请实施例提供的显示面板的基本结构示意图。
图2是本申请实施例提供的显示面板的俯视图。
图3是本申请实施例提供的另一显示面板的基本结构示意图。
图4是本申请实施例提供的又一显示面板的基本结构示意图。
图5是本申请实施例提供的再一显示面板的基本结构示意图。
图6是本申请实施例提供的显示面板的制备方法流程图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。在附图中，为了清晰及便于理解和描述，附图中绘示的组件的尺寸和厚度并未按照比例。
如图1所示，为本申请实施例提供的显示面板的基本结构示意图，所述显示面板包括衬底层10、阳极层20、像素隔离层30、有机发光层40以及阴极层50；所述阳极层20位于所述衬底层10上，所述阳极层20包括多个阳极；所述像素隔离层30位于所述衬底层10上，所述像素隔离层30包括多个像素开口区和位于相邻两个所述像素开口区之间的非开口区，一所述像素开口区与一所述阳极对应；所述有机发光层40位于所述阳极层20和所述像素隔离层30上；所述阴极层50位于所述有机发光层40上；其中，所述阴极层50上对应所述像素隔离层30的所述非开口区设有至少一个通孔60。
需要说明的是，所述衬底层10与所述阳极层20之间还设置有驱动电路层(图未示)，所述驱动电路层与所述阳极层20电性连接，为所述阳极层20提供驱动电压。所述有机发光层40具体包括空穴传输层、发光材料层以及电子传输层，所述空穴传输层和所述发光材料层位于所述像素隔离层30形成的像素开口区内，所述发光材料层位于所述空穴传输层上，所述电子传输层位于所述发光材料层和所述像素隔离层30上。其中，所述阳极层20形成空穴，所述空穴由所述空穴传输层进入所述发光材料层，所述阴极层50形成电子，所述电子由所述电子传输层进入所述发光材料层，所述空穴与所述电子在所述发光材料层内复合产生激子，激子在阳极层20和阴极层50之间的电场的作用下迁移，产生光子，释放出能量。
可以理解的是，所述像素隔离层30的材料通常为有机物(特别是高分子材料)，在遇到高温或紫外线照射时，高分子材料存在释放小分子的情况，小分子顶起阴极层50，会破坏阴极层50与有机发光层40的接触状态；另外，释放的小分子(如水分子或其他分子)与阴极层50(一般为镁、铝、银等活泼金属)发生反应，会损伤阴极层50，导致显示面板的膜层(特别是阴极层50与有机发光层40)之间出现接触不良的情况，从而导致显示面板的子像素边缘发光不良。本申请通过在阴极层50上对应像素隔离层30的非开口区设置至少一个通孔60，当像素隔离层30因高温或者紫外线照射产生小分子(如水分子)时，小分子可通过通孔60从显示面板中释放出来，避免在显示面板的阴极层50与阳极层20之间释放，损害阴极层50与有机发光层40的接触界面，避免子像素的边缘发光不良，提升了显示面板的可靠性。
接下来，请参阅图2，为本申请实施例提供的显示面板的俯视图，从图2中可以看出，阴极层50上的通孔60在像素隔离层30上的正投影位于像素隔离层30的非开口区内。可以理解的是，通孔60所在区域为阴极层50缺失的区域，本申请实施例通过使通孔60在像素隔离层30上的正投影位于像素隔离层30的非开口区内，即阴极层50缺失的区域位于像素隔离层30的非开口区内，不会造成像素开口区内的阴极层50缺失，不会影响像素开口区内的阴极层50与阳极层20(如图1)之间的电场。
在一种实施例中，在所述显示面板的俯视图方向上，所述通孔60的形状为圆形(如图2)、椭圆形或多边形。可以理解的是，图2中仅以通孔60的形状为圆形为例进行绘示，在其他实施例中，通孔60的形状还可以为方形或异形开孔。
在一种实施例中，所述像素隔离层30形成的像素开口区内包括红色子像素401、绿色子像素402以及蓝色子像素403。
接下来，请参阅图3，为本申请实施例提供的另一显示面板的基本结构示意图，所述显示面板包括衬底层10、阳极层20、像素隔离层30、有机发光层40以及阴极层50；所述阳极层20位于所述衬底层10上，所述阳极层20包括多个阳极；所述像素隔离层30位于所述衬底层10上，所述像素隔离层30包括多个像素开口区和位于相邻两个所述像素开口区之间的非开口区，一所述像素开口区与一所述阳极对应；所述有机发光层40位于所述阳极层20和所述像素隔离层30上；所述阴极层50位于所述有机发光层40上；其中，所述阴极层50上对应所述像素隔离层30的所述非开口区设有至少一个通孔60。
在本实施例中，所述显示面板还包括阻隔层70，所述阻隔层70覆盖所述阴极层50。可以理解的是，本申请实施例通过在阴极层50上对应像素隔离层30的非开口区设置至少一个通孔60，以排出像素隔离层30释放的小分子(如水分子)，但外部的水汽可能会通过所述通孔60侵入有机发光层40内，导致发光不良。本实施例通过在阴极层50上设置阻隔层70，可以改善由于设置通孔60引入的外部水汽问题。
需要说明的是，虽然内部像素隔离层30释放的小分子(如水分子)短时间内不能通过阻隔层70排出，但是内部的水分子不会积聚在阴极层50和有机发光层40之间，而损害阴极层50与有机发光层40的接触状态；而是会运动至阻隔层70和阴极层50之间，由于阻隔层70具有一定的透水率(水蒸气透过率WVTR大概在10 -3g/m 2*day)，因此水分子会随着时间的推移，慢慢消散，因此，不会对阴极层50和有机发光层40造成影响，还可以阻挡外部的水汽。
在一种实施例中，所述阻隔层70包括至少一层有机层和至少一层无机层，所述有机层和所述无机层层叠设置。其中，所述有机层采用蒸镀工艺成膜，所述无机层采用化学气相沉积工艺成膜，所述无机层的材料例如为二氧化硅、氮化硅、氮氧化硅或氧化铝等。
在一种实施例中，所述显示面板还包括盖板层80，所述盖板层80的一侧表面设置有粘胶层90，所述盖板层80通过所述粘胶层90与所述阻隔层70远离所述阴极层50的一侧贴合设置。
接下来，请参阅图4，为本申请实施例提供的又一显示面板的基本结构示意图，所述显示面板包括衬底层10、阳极层20、像素隔离层30、有机发光层40以及阴极层50；所述阳极层20位于所述衬底层10上，所述阳极层20包括多个阳极；所述像素隔离层30位于所述衬底层10上，所述像素隔离层30包括多个像素开口区和位于相邻两个所述像素开口区之间的非开口区，一所述像素开口区与一所述阳极对应；所述有机发光层40位于所述阳极层20和所述像素隔离层30上；所述阴极层50位于所述有机发光层40上；其中，所述阴极层50上对应所述像素隔离层30的所述非开口区设有至少一个通孔60。
在本实施例中，所述显示面板还包括阻隔层70，所述阻隔层70覆盖所述阴极层50。可以理解的是，本申请实施例通过在阴极层50上对应像素隔离层30的非开口区设置至少一个通孔60，以排出像素隔离层30释放的小分子(如水分子)，但外部的水汽可能会通过所述通孔60侵入有机发光层40内，导致发光不良。本实施例通过在阴极层50上设置阻隔层70，可以改善由于设置通孔60引入的外部水汽问题。
在一种实施例中，所述显示面板还包括盖板层80，所述盖板层80位于所述阻隔层70远离所述阴极层50的一侧，所述盖板层80面向所述衬底层10的一侧四周设置有框胶层91，所述盖板层80通过所述框胶层91与所述衬底层10贴合设置。
接下来，请参阅图5，为本申请实施例提供的再一显示面板的基本结构示意图，所述显示面板包括衬底层10、阳极层20、像素隔离层30、有机发光层40以及阴极层50；所述阳极层20位于所述衬底层10上，所述阳极层20包括多个阳极；所述像素隔离层30位于所述衬底层10上，所述像素隔离层30包括多个像素开口区和位于相邻两个所述像素开口区之间的非开口区，一所述像素开口区与一所述阳极对应；所述有机发光层40位于所述阳极层20和所述像素隔离层30上；所述阴极层50位于所述有机发光层40上；其中，所述阴极层50上对应所述像素隔离层30的所述非开口区设有至少一个通孔60。
在本实施例中，所述显示面板还包括阻隔层70，所述阻隔层70覆盖所述阴极层50。可以理解的是，本申请实施例通过在阴极层50上对应像素隔离层30的非开口区设置至少一个通孔60，以排出像素隔离层30释放的小分子(如水分子)，但外部的水汽可能会通过所述通孔60侵入有机发光层40内，导致发光不良。本实施例通过在阴极层50上设置阻隔层70，可以改善由于设置通孔60引入的外部水汽问题。
在一种实施例中，所述显示面板还包括盖板层80，所述盖板层80位于所述阻隔层70远离所述阴极层50的一侧，所述盖板层80面向所述衬底层10的一侧四周设置有框胶层91，所述盖板层80通过所述框胶层91与所述衬底层10贴合设置。其中，所述盖板层80面向所述衬底层10的一侧还设置有吸气层92和粘胶层90，所述粘胶层90位于所述框胶层91的内侧，所述吸气层92位于所述粘胶层90和所述框胶层91之间。可以理解的是，本实施例通过在框胶层91的内侧设置吸气层92，所述吸气层92能有效地吸着某些气体分子，有效地保护阴极层50、有机发光层40等敏感膜层。
在一种实施例中，所述吸气层92为干燥剂，所述粘胶层90为透明光学胶，所述框胶层91为遮光胶。可以理解的是，所述吸气层92具体为干燥剂，本实施例通过在封装腔体内设置干燥剂，像素隔离层30或其它膜层释放的小分子(如水分子)可以从通孔60释放出去且被干燥剂吸收，避免对阴极层50和有机发光层40造成影响，避免显示面板通电时被损伤。另外，所述粘胶层90采用透明光学胶，透过率高，不会对显示面板的出光率造成影响。所述框胶层91采用遮光胶可以防止显示面板的边缘漏光。
接下来，请参阅图6，为本申请实施例提供的显示面板的制备方法流程图，所述制备方法包括步骤：
S1、在衬底层上制备阳极层，所述阳极层包括多个阳极；
S2、在所述衬底层上制备像素隔离层，所述像素隔离层包括多个像素开口区和位于相邻两个所述像素开口区之间的非开口区，一所述像素开口区与一所述阳极对应；
S3、在所述阳极层和所述像素隔离层上制备有机发光层；
S4、在所述有机发光层上制备阴极层；
S5、在所述阴极层上对应所述像素隔离层的所述非开口区制备至少一个通孔。
需要说明的是，所述阴极层上的通孔通过激光或曝光蚀刻的方式形成。可以理解的是，本申请通过在阴极层上对应像素隔离层的非开口区制备至少一个通孔，当像素隔离层因高温或者紫外线照射产生小分子(如水分子)时，小分子可通过通孔从显示面板中释放出来，避免在显示面板的阴极层与阳极层之间释放，损害阴极层与有机发光层的接触界面，避免子像素的边缘发光不良，提升了显示面板的可靠性。
在一种实施例中，所述制备方法还包括：在所述阴极层上制备阻隔层，所述阻隔层覆盖所述阴极层。可以理解的是，本申请实施例通过在阴极层上对应像素隔离层的非开口区制备至少一个通孔，以排出像素隔离层释放的小分子(如水分子)，但外部的水汽可能会通过所述通孔侵入有机发光层内，导致发光不良。本实施例通过在阴极层上制备阻隔层，可以改善由于设置通孔引入的外部水汽问题。
在一种实施例中，所述阻隔层包括至少一层有机层和至少一层无机层，所述有机层和所述无机层层叠设置。其中，所述有机层采用蒸镀工艺成膜，所述无机层采用化学气相沉积工艺成膜，所述无机层的材料例如为二氧化硅、氮化硅、氮氧化硅或氧化铝等。
在一种实施例中，所述制备方法还包括：提供一盖板层，在所述盖板层的一侧表面贴附粘胶层，将所述盖板层通过所述粘胶层与所述阻隔层远离所述阴极层的一侧贴合。
在一种实施例中，所述制备方法还包括：提供一盖板层，所述盖板层位于所述阻隔层远离所述阴极层的一侧，在所述盖板层面向所述衬底层的一侧四周贴附框胶层，将所述盖板层通过所述框胶层与所述衬底层贴合。
在一种实施例中，所述盖板层面向所述衬底层的一侧还设置有吸气层和粘胶层，所述粘胶层位于所述框胶层的内侧，所述吸气层位于所述粘胶层和所述框胶层之间。可以理解的是，本实施例通过在框胶层的内侧设置吸气层，所述吸气层能有效地吸着某些气体分子，有效地保护阴极层、有机发光层等敏感膜层。
在一种实施例中，所述吸气层为干燥剂，所述粘胶层为透明光学胶，所述框胶层为遮光胶。可以理解的是，所述吸气层具体为干燥剂，本实施例通过在封装腔体内设置干燥剂，像素隔离层或其它膜层释放的小分子(如水分子)可以从通孔释放出去且被干燥剂吸收，避免对阴极层和有机发光层造成影响，避免显示面板通电时被损伤。另外，所述粘胶层采用透明光学胶，透过率高，不会对显示面板的出光率造成影响。所述框胶层采用遮光胶可以防止显示面板的边缘漏光。
本申请实施例还提供一种显示终端，包括终端主体和上述的显示面板，所述终端主体与所述显示面板组合为一体。其中，所述显示面板的基本结构及制备方法请参阅图1至图6及相关说明，此处不再赘述。本申请实施例提供的显示终端可以为：手机、平板电脑、笔记本电脑、电视机、数码相机、导航仪等具有显示功能的产品或部件。
综上所述，本申请实施例提供的一种显示面板，包括衬底层、阳极层、像素隔离层、有机发光层以及阴极层；阳极层位于衬底层上，阳极层包括多个阳极；像素隔离层位于衬底层上，像素隔离层包括多个像素开口区和位于相邻两个像素开口区之间的非开口区，一像素开口区与一阳极对应；有机发光层位于阳极层和像素隔离层上；阴极层位于有机发光层上；其中，阴极层上对应像素隔离层的非开口区设有至少一个通孔；本申请通过在阴极层上对应像素隔离层的非开口区设置至少一个通孔，当像素隔离层因高温或者紫外线照射产生小分子时，小分子可通过此通孔从显示面板中释放出来，避免在显示面板的阴极与阳极之间释放，损害阴极与有机发光层的接触界面，避免子像素的边缘发光不良，提升了显示面板的可靠性，解决了现有技术的显示面板的像素隔离层释放小分子，导致阴极与有机发光层之间接触不良，导致子像素的边缘发光不良的技术问题。
以上对本申请实施例所提供的一种显示面板及其制备方法、显示终端进行了详细介绍。应理解，本文所述的示例性实施方式应仅被认为是描述性的，用于帮助理解本申请的方法及其核心思想，而并不用于限制本申请。

Claims (20)

  1. 一种显示面板，其包括：
    衬底层；
    阳极层，位于所述衬底层上，所述阳极层包括多个阳极；
    像素隔离层，位于所述衬底层上，所述像素隔离层包括多个像素开口区和位于相邻两个所述像素开口区之间的非开口区，一所述像素开口区与一所述阳极对应；
    有机发光层，位于所述阳极层和所述像素隔离层上；
    阴极层，位于所述有机发光层上；
    其中，所述阴极层上对应所述像素隔离层的所述非开口区设有至少一个通孔。
  2. 如权利要求1所述的显示面板，其中，所述显示面板还包括阻隔层，所述阻隔层覆盖所述阴极层。
  3. 如权利要求2所述的显示面板，其中，所述阻隔层包括至少一层有机层和至少一层无机层，所述有机层和所述无机层层叠设置。
  4. 如权利要求3所述的显示面板，其中，所述无机层的材料为二氧化硅、氮化硅、氮氧化硅或氧化铝。
  5. 如权利要求2所述的显示面板，其中，所述显示面板还包括盖板层，所述盖板层的一侧表面设置有粘胶层，所述盖板层通过所述粘胶层与所述阻隔层远离所述阴极层的一侧贴合设置。
  6. 如权利要求2所述的显示面板，其中，所述显示面板还包括盖板层，所述盖板层位于所述阻隔层远离所述阴极层的一侧，所述盖板层面向所述衬底层的一侧四周设置有框胶层，所述盖板层通过所述框胶层与所述衬底层贴合设置。
  7. 如权利要求6所述的显示面板，其中，所述盖板层面向所述衬底层的一侧还设置有吸气层和粘胶层，所述粘胶层位于所述框胶层的内侧，所述吸气层位于所述粘胶层和所述框胶层之间。
  8. 如权利要求7所述的显示面板，其中，所述吸气层为干燥剂，所述粘胶层为透明光学胶，所述框胶层为遮光胶。
  9. 如权利要求1所述的显示面板，其中，所述通孔在所述像素隔离层上的正投影位于所述像素隔离层的所述非开口区内。
  10. 一种显示面板的制备方法，其包括：
    在衬底层上制备阳极层，所述阳极层包括多个阳极；
    在所述衬底层上制备像素隔离层，所述像素隔离层包括多个像素开口区和位于相邻两个所述像素开口区之间的非开口区，一所述像素开口区与一所述阳极对应；
    在所述阳极层和所述像素隔离层上制备有机发光层；
    在所述有机发光层上制备阴极层；
    在所述阴极层上对应所述像素隔离层的所述非开口区制备至少一个通孔。
  11. 如权利要求10所述的显示面板的制备方法，其中，所述制备方法还包括：
    在所述阴极层上制备阻隔层，所述阻隔层覆盖所述阴极层。
  12. 如权利要求11所述的显示面板的制备方法，其中，所述阻隔层包括至少一层有机层和至少一层无机层，所述有机层和所述无机层层叠设置。
  13. 如权利要求12所述的显示面板的制备方法，其中，所述无机层的材料为二氧化硅、氮化硅、氮氧化硅或氧化铝。
  14. 如权利要求11所述的显示面板的制备方法，其中，所述制备方法还包括：
    提供一盖板层，在所述盖板层的一侧表面贴附粘胶层，将所述盖板层通过所述粘胶层与所述阻隔层远离所述阴极层的一侧贴合。
  15. 如权利要求11所述的显示面板的制备方法，其中，所述制备方法还包括：
    提供一盖板层，所述盖板层位于所述阻隔层远离所述阴极层的一侧，在所述盖板层面向所述衬底层的一侧四周贴附框胶层，将所述盖板层通过所述框胶层与所述衬底层贴合。
  16. 如权利要求15所述的显示面板的制备方法，其中，所述盖板层面向所述衬底层的一侧还设置有吸气层和粘胶层，所述粘胶层位于所述框胶层的内侧，所述吸气层位于所述粘胶层和所述框胶层之间。
  17. 如权利要求16所述的显示面板的制备方法，其中，所述吸气层为干燥剂，所述粘胶层为透明光学胶，所述框胶层为遮光胶。
  18. 一种显示终端，其包括终端主体和显示面板，所述终端主体与所述显示面板组合为一体，所述显示面板包括：
    衬底层；
    阳极层，位于所述衬底层上，所述阳极层包括多个阳极；
    像素隔离层，位于所述衬底层上，所述像素隔离层包括多个像素开口区和位于相邻两个所述像素开口区之间的非开口区，一所述像素开口区与一所述阳极对应；
    有机发光层，位于所述阳极层和所述像素隔离层上；
    阴极层，位于所述有机发光层上；
    其中，所述阴极层上对应所述像素隔离层的所述非开口区设有至少一个通孔。
  19. 如权利要求18所述的显示终端，其中，所述显示面板还包括阻隔层，所述阻隔层覆盖所述阴极层。
  20. 如权利要求19所述的显示终端，其中，所述阻隔层包括至少一层有机层和至少一层无机层，所述有机层和所述无机层层叠设置。
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203707190U (zh) * 2014-02-18 2014-07-09 京东方科技集团股份有限公司 显示背板和显示装置
KR20190054563A (ko) * 2017-11-14 2019-05-22 엘지디스플레이 주식회사 투명 유기발광표시패널 및 이를 이용한 투명 유기발광표시장치
CN110739340A (zh) * 2019-10-30 2020-01-31 京东方科技集团股份有限公司 显示装置、显示面板及其制造方法
CN111653595A (zh) * 2020-06-15 2020-09-11 京东方科技集团股份有限公司 一种显示基板及其制作方法、显示面板
CN111952341A (zh) * 2020-08-20 2020-11-17 京东方科技集团股份有限公司 一种显示基板及其制作方法、显示面板及显示装置
CN112993181A (zh) * 2021-02-04 2021-06-18 京东方科技集团股份有限公司 显示基板、显示面板及显示装置
CN113594213A (zh) * 2021-07-28 2021-11-02 京东方科技集团股份有限公司 显示面板及显示装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7635947B2 (en) * 2005-08-29 2009-12-22 Chunghwa Picture Tubes, Ltd. Organic electro-luminescence device comprising uniform thickness light-emitting layer
TWI492374B (zh) * 2012-12-03 2015-07-11 Au Optronics Corp 電激發光顯示面板
CN105552107A (zh) * 2016-02-29 2016-05-04 上海天马有机发光显示技术有限公司 一种显示面板、制作方法以及电子设备
CN107369702B (zh) * 2017-08-16 2020-03-17 武汉华星光电半导体显示技术有限公司 一种oled显示面板及其制作方法
CN110071162B (zh) * 2018-06-22 2021-08-06 友达光电股份有限公司 显示面板
CN109755280B (zh) * 2019-01-10 2020-10-16 昆山国显光电有限公司 有机发光显示面板、制备方法、阴极掩膜板及显示装置
CN109742122B (zh) * 2019-01-10 2021-08-06 京东方科技集团股份有限公司 显示基板及其制作方法、显示面板
CN110137384B (zh) * 2019-06-28 2022-02-01 昆山国显光电有限公司 显示面板及显示装置
CN111463356B (zh) * 2020-04-20 2022-08-09 昆山国显光电有限公司 一种显示面板、显示面板的制备方法和显示装置
CN111785742B (zh) * 2020-08-25 2022-07-12 京东方科技集团股份有限公司 一种显示面板及其制作方法、显示装置
CN113270558A (zh) * 2021-05-13 2021-08-17 Tcl华星光电技术有限公司 显示面板及其制作方法、显示装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203707190U (zh) * 2014-02-18 2014-07-09 京东方科技集团股份有限公司 显示背板和显示装置
KR20190054563A (ko) * 2017-11-14 2019-05-22 엘지디스플레이 주식회사 투명 유기발광표시패널 및 이를 이용한 투명 유기발광표시장치
CN110739340A (zh) * 2019-10-30 2020-01-31 京东方科技集团股份有限公司 显示装置、显示面板及其制造方法
CN111653595A (zh) * 2020-06-15 2020-09-11 京东方科技集团股份有限公司 一种显示基板及其制作方法、显示面板
CN111952341A (zh) * 2020-08-20 2020-11-17 京东方科技集团股份有限公司 一种显示基板及其制作方法、显示面板及显示装置
CN112993181A (zh) * 2021-02-04 2021-06-18 京东方科技集团股份有限公司 显示基板、显示面板及显示装置
CN113594213A (zh) * 2021-07-28 2021-11-02 京东方科技集团股份有限公司 显示面板及显示装置

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