WO2023102997A1 - Led显示面板及显示设备 - Google Patents

Led显示面板及显示设备 Download PDF

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Publication number
WO2023102997A1
WO2023102997A1 PCT/CN2021/138694 CN2021138694W WO2023102997A1 WO 2023102997 A1 WO2023102997 A1 WO 2023102997A1 CN 2021138694 W CN2021138694 W CN 2021138694W WO 2023102997 A1 WO2023102997 A1 WO 2023102997A1
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WO
WIPO (PCT)
Prior art keywords
led
display panel
substrate
layer
led chip
Prior art date
Application number
PCT/CN2021/138694
Other languages
English (en)
French (fr)
Inventor
赵军
赵斌
肖军城
徐洪远
雷兴
Original Assignee
惠州华星光电显示有限公司
Tcl华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 惠州华星光电显示有限公司, Tcl华星光电技术有限公司 filed Critical 惠州华星光电显示有限公司
Priority to US17/621,260 priority Critical patent/US20240036382A1/en
Publication of WO2023102997A1 publication Critical patent/WO2023102997A1/zh

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13336—Combining plural substrates to produce large-area displays, e.g. tiled displays
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133512—Light shielding layers, e.g. black matrix
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133314—Back frames
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/44—Arrangements combining different electro-active layers, e.g. electrochromic, liquid crystal or electroluminescent layers

Definitions

  • the present application relates to the field of display technology, in particular to an LED display panel and a display device.
  • LCD Liquid Crystal Display
  • LCD+LED splicing screen can realize a low-cost large-screen solution, but LCD and LED have different light-emitting principles, and the viewing angle performance is very different, resulting in high LED brightness when viewed from the side, which affects the overall look and feel. Therefore, how to control the viewing angle of the LED is an urgent problem to be solved at present.
  • LCD+LED splicing screen can realize a low-cost large-screen solution, but LCD and LED have different light-emitting principles, and the viewing angle performance is very different, resulting in high LED brightness when viewed from the side, which affects the overall look and feel.
  • Embodiments of the present application provide an LED display panel and a display device.
  • the viewing angle range of the LED packaging module and the LED display panel can be adjusted through a baffle of a light-shielding structure, thereby improving the display quality of the display panel and improving user experience.
  • An embodiment of the present application provides an LED display panel.
  • the LED display panel group includes at least one LED packaging module, and the LED packaging module includes:
  • An electrode unit is provided on the substrate, and the electrode unit includes an anode layer and a cathode layer opposite to the anode layer;
  • the LED chip is disposed on the anode layer and the cathode layer;
  • the light-shielding structure is arranged on the substrate, the light-shielding structure includes a plurality of baffles, the plurality of baffles surround and form at least one cavity, the LED chip is arranged in the cavity, and the light-shielding structure formed by ink jetting;
  • the sealant layer is arranged on the substrate, and the substrate and the sealant layer surround to form an accommodating cavity, and the electrode unit, the LED chip and the light-shielding structure are all arranged in the accommodating cavity.
  • the LED chip is placed in the cavity formed by the baffles in the light-shielding structure, and part of the light emitted by the LED chip in the side view direction is blocked by the baffle, thereby adjusting the viewing angle of the LED display panel, so that through different types of The viewing angles of the LED display panels obtained by splicing the displays are the same, which improves the display quality of the display panels and enhances the experience of users. And by setting different ink composition ratios and jetting process parameters, the requirement of high aspect ratio of the baffle can be achieved, and the light emission of the LED chip can be avoided. The higher the Tg value, the better the temperature resistance of the board, ensuring the safety of the LED display panel under high temperature.
  • the anode layer is integrally formed, and the LED chip is connected to the anode layer.
  • the anode layer is integrally formed to reduce the circuit connection between LED chips and make the circuit structure connection more concise.
  • the cathode layer includes at least one cathode connection unit, the LED chips are connected to the cathode connection unit, and the LED chips correspond to the cathode connection units one by one.
  • the cathode layer is split into several cathode connection units, which can be flexibly set based on the positions of the LED chips, thereby reducing the requirement for circuit layout space.
  • the top surface of the baffle is wavy, and the top surface is the end of the baffle away from the base plate.
  • the parameters of the baffle determine the viewing angle of the LED display panel. Setting the top surface of the baffle in a wave shape makes the viewing angle of the LED display panel change and the brightness change within the viewing angle range not change suddenly, which is more in line with the LED display panel. Brightness change curve.
  • the substrate and the sealant layer surround to form an accommodating cavity, and the electrode unit, the LED chip and the light-shielding structure are all disposed in the accommodating cavity.
  • the substrate and the sealant layer are surrounded to form an accommodation cavity, which is the existing structure of the LED display panel, and the light-shielding structure is arranged in the accommodation cavity. Affect the thickness of the LED display panel.
  • An embodiment of the present application provides an LED display panel.
  • the LED display panel group includes at least one LED packaging module, and the LED packaging module includes:
  • An electrode unit is provided on the substrate, and the electrode unit includes an anode layer and a cathode layer opposite to the anode layer;
  • the LED chip is disposed on the anode layer and the cathode layer;
  • the sealant layer is arranged on the substrate.
  • the LED chip is placed in the cavity formed by the baffles in the light-shielding structure, and part of the light emitted by the LED chip in the side view direction is blocked by the baffle, thereby adjusting the viewing angle of the LED display panel, so that through different types of The viewing angles of the LED display panels obtained by splicing the displays are the same, which improves the display quality of the display panels and enhances the experience of users.
  • the anode layer is integrally formed, and the LED chip is connected to the anode layer.
  • the anode layer is integrally formed to reduce the circuit connection between LED chips and make the circuit structure connection more concise.
  • the cathode layer is integrally formed, and the LED chip is connected to the cathode layer.
  • the cathode layer is integrally formed to reduce the circuit connection between the LED chips and make the circuit structure connection more concise.
  • the cathode layer includes at least one cathode connection unit, the LED chips are connected to the cathode connection unit, and the LED chips correspond to the cathode connection units one by one.
  • the cathode layer is split into several cathode connection units, which can be flexibly set based on the positions of the LED chips, thereby reducing the requirement for circuit layout space.
  • the anode layer includes at least one anode connection unit, the LED chips are connected to the anode connection unit, and the LED chips correspond to the anode connection units one by one.
  • the anode layer is split into several anode connection units, which can be flexibly set based on the positions of the LED chips, reducing the requirement for circuit layout space.
  • the light shielding structure is formed by ink jetting.
  • the requirement for a high aspect ratio of the baffle can be achieved, and the light emission of the LED chip can be avoided.
  • the top surface of the baffle is wavy, and the top surface is the end of the baffle away from the base plate.
  • the parameters of the baffle determine the viewing angle of the LED display panel. Setting the top surface of the baffle in a wave shape makes the viewing angle of the LED display panel change and the brightness change within the viewing angle range not change suddenly, which is more in line with the LED display panel. Brightness change curve.
  • the substrate and the sealant layer surround to form an accommodating cavity, and the electrode unit, the LED chip and the light-shielding structure are all disposed in the accommodating cavity.
  • the substrate and the sealant layer are surrounded to form an accommodation cavity, which is the existing structure of the LED display panel, and the light-shielding structure is arranged in the accommodation cavity. Affect the thickness of the LED display panel.
  • the substrate is a PCB board whose glass transition temperature exceeds a preset threshold.
  • the substrate is a PCB board with a glass transition temperature exceeding a preset threshold.
  • Tg value the higher the Tg value, the better the temperature resistance of the board, ensuring the safety of the LED display panel at high temperatures.
  • a plurality of the LED chips are evenly spaced.
  • a plurality of LED chips are evenly spaced, and the smaller the distance between the plurality of LED chips 3 is, the smoother the display changes of the LED display panel are.
  • the LED chip is any one or more of a red LED chip, a green LED chip, a blue LED chip and a white LED chip.
  • the LED chip is the core component of the LED lamp.
  • the color of the emitted light is determined based on the LED chip, and LED chips of different numbers and colors can be freely combined according to display requirements.
  • the LED chips correspond to the cavities one by one.
  • the LED chips correspond to the cavities one by one, and the baffles separate the multiple LED chips. influence each other.
  • An embodiment of the present application provides a display device, the display device includes several first display panels and the LED display panel according to any one of the above, and the first display panel is connected to the LED display panel.
  • a seam is formed between the first display panel and the first display panel, and the LED display panel is arranged at the seam.
  • the first display panel is an LCD display.
  • the LED display panel group includes at least one LED packaging module
  • the LED packaging module includes:
  • An electrode unit is provided on the substrate, and the electrode unit includes an anode layer and a cathode layer opposite to the anode layer;
  • the LED chip is disposed on the anode layer and the cathode layer;
  • the sealant layer is arranged on the substrate.
  • the anode layer is integrally formed, and the LED chip is connected to the anode layer.
  • the cathode layer is integrally formed, and the LED chip is connected to the cathode layer.
  • the cathode layer includes at least one cathode connection unit, the LEDs are connected to the cathode connection unit, and the LEDs correspond to the cathode connection units one by one.
  • the anode layer includes at least one anode connection unit, the LED chips are connected to the anode connection unit, and the LED chips correspond to the anode connection units one by one.
  • the light shielding structure is formed by ink jetting.
  • the top surface of the baffle is wavy, and the top surface is the end of the baffle away from the base plate.
  • the substrate and the sealant layer surround to form an accommodating cavity, and the electrode unit, the LED chip and the light-shielding structure are all disposed in the accommodating cavity.
  • the substrate is a PCB board whose glass transition temperature exceeds a preset threshold.
  • a plurality of the LED chips are evenly spaced.
  • the LED chip is any one or more of a red LED chip, a green LED chip, a blue LED chip and a white LED chip.
  • the LED chips correspond to the cavities one by one.
  • the LED display panel and the display device provided by the embodiments of the present application are provided with a light-shielding structure to surround each LED chip, and the viewing angle range of the LED packaging module and the LED display panel is adjusted by adjusting the parameters of the baffle in the light-shielding structure, so that through different The viewing angles of the display areas obtained by splicing the type displays are the same, which improves the display quality of the display panel and enhances the user experience.
  • FIG. 1 is a schematic structural diagram of an LED packaging module provided by an embodiment of the present application.
  • Fig. 2 is a schematic cross-sectional view of an LED packaging module chip and a baffle provided by an embodiment of the present application.
  • Substrate 2. Electrode unit; 21. Anode layer; 22. Cathode layer; 221. Cathode connection unit; 3. LED chip; 4. Shading structure; 41. Baffle; 42. Cavity; 5. Sealant layer .
  • first and second are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features.
  • a feature defined as “first” or “second” may explicitly or implicitly include one or more of said features.
  • “plurality” means two or more, unless otherwise specifically defined.
  • connection should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected, or electrically connected, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction of two components relation. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.
  • a first feature being "on” or “under” a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them.
  • “above”, “above” and “above” the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.
  • “Below”, “beneath” and “under” the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.
  • the embodiment of the present application provides an LED display panel
  • the LED display panel includes at least one LED package module
  • one LED package module is the smallest unit to realize the display function
  • one LED package module contains at least one
  • different numbers of LED packaging modules can be selected for splicing according to the size requirements of the display area to obtain an LED display panel, which is not specifically limited in this embodiment.
  • the LED packaging module includes a substrate 1 , an electrode unit 2 , an LED chip 3 , a light-shielding structure 4 and a sealant layer 5 .
  • the substrate 1 plays the role of carrying other components, and the other components are all arranged on the substrate 1;
  • the circuit structure provided on the substrate 1 is electrically connected to other LED packaging modules, and multiple LED packaging modules cooperate to form an LED display panel to realize display functions.
  • the electrode unit 2 is arranged on the substrate 1 .
  • the electrode unit 2 includes an anode layer 21 and a cathode layer 22 . Both the anode layer 21 and the cathode layer 22 are made of metal and are arranged on the substrate 1 .
  • the anode layer 21 and the cathode layer 22 are arranged opposite to each other, and the anode layer 21 and the cathode layer 22 are spaced apart from each other, and the anode layer 21 and the cathode layer 22 are not directly connected to each other.
  • the electrode unit 2 is connected to the circuit structure provided on the substrate 1, and at the same time, each LED package module is also connected to each other through the circuit structure provided on the substrate 1, so as to cooperate and connect multiple LED package modules.
  • the LED chip 3 is also called LED light-emitting chip, which is the core component of the LED lamp, that is, the P-N junction. Its main function is to convert electrical energy into light energy, and the main material of the chip is monocrystalline silicon. Based on the color of the light emitted by the LED chip, the LED chip 3 includes a red LED chip, a green LED chip, a blue LED chip and a white LED chip.
  • the LED packaging module contains at least one LED chip 3, which can be any one of the above-mentioned red LED chip, green LED chip, blue LED chip and white LED chip, or a plurality of LED chips 3 connected in sequence. In this embodiment Not specifically limited.
  • the arrangement order of the plurality of LED chips 3 is set based on the realization requirements of the display function, for example, in the order of red LED chips, green LED chips, and blue LED chips. cycle settings.
  • the LED packaging module contains a plurality of LED chips 3, the plurality of LED chips 3 are evenly spaced, and the smaller the distance between the plurality of LED chips 3, the smoother the display changes of the LED display panel. Therefore, according to The requirement for display accuracy sets the distance between the LED chips 3 , which is not specifically limited in this embodiment.
  • the LED chip 3 is arranged on the anode layer 21 and the cathode layer 22, one end of the LED chip 3 is connected to the anode layer 21, the other end of the LED chip 3 is connected to the cathode layer 22, and is electrically connected to realize the display function.
  • the specific connection method is implemented in this embodiment. Examples are not specifically limited. That is to say, the anode layer 21 and the cathode layer 22 are connected through the LED chip 3 , and the anode layer 21 and the cathode layer 22 are not directly connected to each other.
  • the anode layer 21 and the cathode layer 22 of the electrode unit 2 correspond to the same number of connection points as the LED chips 3, and the anode layer 21 and the cathode layer of all electrode units 2 22 are all connected to the circuit structure provided on the substrate 1, wherein the anode layer 21 and the cathode layer 22 of the electrode unit 2 may be respectively connected to the circuit structure provided on the substrate 1, or the anode layer 21 and the cathode layer of the electrode unit 2
  • 22 is connected to itself, it is then connected to the circuit structure provided on the substrate 1 as a whole, which is not specifically limited in this embodiment. That is to say, the structure of the cathode layer 22 and the anode layer 21 can be selected according to the requirements of display or spatial arrangement, and all connection points can be integrally formed or arranged at intervals, which is not specifically limited in this embodiment.
  • the light-shielding structure 4 is arranged on the substrate 1, and the light-shielding structure 4 is used to block part of the light emitted by the LED chip 3, thereby changing the viewing angle range of the LED display panel and the brightness within the viewing angle, so that the viewing angle range of the LED display panel is consistent with the spliced LCD display. Match the screen to avoid different viewing angles in the same display area, which will affect the display effect.
  • the light-shielding structure 4 includes a plurality of baffles 41, and the plurality of baffles 41 surround and form at least one cavity 42, and the LED chips 3 are arranged in the cavity 42, that is to say, the baffles 41 separate the plurality of LED chips 3. , each LED chip 3 is set in a relatively independent space.
  • the shape and structure of the cavity 42 may be a rectangle. Regular shapes such as circles may also be other irregular shapes, which are not specifically limited in this embodiment.
  • the LED chips 3 correspond to the cavities 42 one by one, and the parameters of the baffles 41 arranged around each cavity 42 determine the range that the light emitted by the LED chips in the corresponding cavities 42 can be seen, that is, the baffles
  • the parameters of the board 41 determine the viewing angle of the LED display panel. Therefore, the viewing angle of the LED display panel can be changed according to the parameters of the baffle 41.
  • the actual situation can be set according to the requirements of the viewing angle. For example, according to the measured brightness of the LCD and LED viewing angles, By comparing the differences between the two, reasonable parameters of the baffle 41 can be calculated, or the best parameters of the baffle 41 can be obtained through experimental verification, which is not specifically limited in this embodiment.
  • the parameters of the baffle 41 include the height of the baffle 41 and the distance between the baffle 41 and the LED chip 3 .
  • the distance between the baffle 41 and the LED chip 3 is the upper end of the inner edge of the baffle 41 near the side of the LED chip 3 to the geometric center of the LED chip 3.
  • the vertical distance of the line, the height of the baffle 41 is the vertical distance from the top surface of the baffle 41 (the end away from the substrate 1 ) to the bottom surface of the LED chip 3 (the end close to the substrate 1 ).
  • the baffle plate 41 in the normal direction of the LED chip 3 does not block the light emitted by the LED chip, that is, the front view brightness of the LED display panel is the highest.
  • ⁇ 1 is the angle between the first connecting line and the normal line of the LED chip 3
  • the first connecting line is the connecting line between the inner edge of the baffle 41 near the LED chip 3 and the upper edge of the LED chip 3 near the inner edge.
  • ⁇ 2 is the angle between the second connecting line and the normal line of the LED chip 3
  • the first connecting line is the connecting line between the inner edge of the baffle 41 near the LED chip 3 and the upper edge of the LED chip 3 away from the inner edge.
  • the baffle plate 41 does not block the light emitted by the LED chip, and the brightness of the LED display panel is the highest.
  • the viewing angle is greater than ⁇ 1
  • part of the light emitted by the LED chip 3 is blocked by the baffle 41 , and the brightness decreases.
  • the viewing angle is between ⁇ 1 and ⁇ 2
  • the viewing angle is greater than ⁇ 2
  • all the light emitted by the LED chip 3 is blocked by the baffle 41 , and the brightness within the viewing angle range is 0, which is to realize the adjustment of the viewing angle range of the LED display panel.
  • the above-mentioned parameters of the baffle 41 are the main factors affecting the viewing angle range of the LED display panel, and the selection of the reference point is only an example for easy understanding, and should not be construed as a limitation to this embodiment , can also be evaluated and adjusted according to other equivalent parameters with the same effect, which is not specifically limited in this embodiment.
  • the sealant layer 5 is arranged on the substrate 1, and the sealant layer 5 is formed by pouring glue to ensure the airtightness of the LED package module structure, and at the same time prevent other components from being damaged due to exposure.
  • a light-shielding structure 4 is set to surround each LED chip 3.
  • the viewing angle range of the LED packaging module and the LED display panel is adjusted, so that the LED chips obtained by splicing different types of displays
  • the viewing angles of the display areas are the same, the display quality of the display panel is improved, and the user experience is improved.
  • the anode layer 21 is integrally formed, that is, all the anode layers 21 are integrated and are not separated from each other, and all the LED chips 3 are connected to the same anode layer 21, thereby reducing the wiring layout of the circuit structure ,save space.
  • the anode layer 21 is integrally formed and can be set according to the actual layout of the LED packaging module, which is not specifically limited in this embodiment.
  • the cathode layer 22 can be partially or completely integrally formed.
  • the cathode layer 22 includes at least one cathode connection unit 221, and the LED is connected to the cathode connection unit 221. If the cathode layer 22 includes a plurality of cathode connection units 221, each cathode connection unit 221 is not connected to each other at intervals. The LEDs are in one-to-one correspondence with the cathode connection unit 221, and the structural arrangement is simpler.
  • the anode layer 21 is similar to the cathode layer 22.
  • the anode layer 21 includes at least one anode connection unit, and the LED is connected to the anode connection unit. If the anode layer 21 includes a plurality of anode connection units (not shown), each anode connection unit The LEDs are in one-to-one correspondence with the anode connection units.
  • the light-shielding structure 4 is formed by ink jetting, and the viewing angle of the LED display panel can be changed by adjusting the parameters of the baffle 41, for example, according to the measured brightness of the viewing angle of the LCD and the LED, and comparing the difference between the two, a reasonable
  • the parameters of the baffle 41, or the best parameters of the baffle 41 are obtained through experimental verification. After the parameters of the baffles 41 are determined, the component distribution ratio of the ink and the parameters of the jetting process are analyzed, and several baffles 41 are formed by ink jetting to obtain the light-shielding structure 4 .
  • the baffle 41 that needs to meet the parameter requirements can be formed by direct injection by adjusting the component distribution ratio of the ink and the jetting process parameters, and the corresponding different parameter requirements of the baffle 41 correspond to different ink component distribution ratios and jetting process parameters.
  • the specific analysis process is not specifically limited in this embodiment.
  • the baffle 41 will cover part of the anode layer 21 or the cathode layer 22.
  • the ink The light-shielding structure 4 is obtained by spraying and forming several baffles 41 with high aspect ratios.
  • the substrate 1 and the sealant layer 5 are surrounded to form an accommodating cavity, and the electrode unit 2 , the LED chip 3 and the light-shielding structure 4 are all disposed in the accommodating cavity.
  • the LED packaging module does not include the light-shielding structure 4.
  • the substrate 1 and the sealing layer 5 are also surrounded to form an accommodation cavity.
  • the electrode unit 2 and the LED chip 3 are both arranged in the accommodation cavity. There is a certain space between them.
  • a light-shielding structure 4 is provided between the substrate 1 and the sealing layer 5, and the size of the light-shielding structure 4 is small.
  • the accommodation cavity in this embodiment does not need Expand the size, so it does not affect the thickness of the LED display panel while improving the viewing angle.
  • the substrate 1 is a high Tg PCB board (printed circuit board, printed circuit board), Tg refers to the glass transition temperature, which is the glass transition temperature of the plate under high temperature heating.
  • Tg refers to the glass transition temperature, which is the glass transition temperature of the plate under high temperature heating.
  • the Tg plate is above 130 degrees
  • the high Tg is generally greater than 170 degrees
  • the medium Tg is about 150 degrees. That is to say, the substrate 1 is a PCB board whose glass transition temperature exceeds a preset threshold. The higher the Tg value, the better the temperature resistance of the board.
  • a light-shielding structure 4 is set to surround each LED chip 3.
  • the viewing angle range of the LED packaging module and the LED display panel is adjusted, so that the LED chips obtained by splicing different types of displays
  • the viewing angles of the display areas are the same, the display quality of the display panel is improved, and the user experience is enhanced.
  • the light-shielding structure 4 is formed by ink jetting, the structure size is small, and the thickness of the LED display panel is not affected.
  • An embodiment of the present application provides a display device, including a plurality of first display panels and an LED display panel as described in any one of the above embodiments, the first display panel is connected to the LED display panel, and the plurality of first display panels are connected to the LED display panel Tiling to obtain a display device with a larger display area.
  • the LED display panel includes at least one LED packaging module, and the LED packaging module includes:
  • An electrode unit 2 arranged on the substrate 1, the electrode unit 2 includes an anode layer 21 and a cathode layer 22 opposite to the anode layer 21;
  • At least one LED chip 3, the LED chip 3 is arranged on the anode layer 21 and the cathode layer 22;
  • the light-shielding structure 4 is arranged on the substrate 1, the light-shielding structure 4 includes a plurality of baffles 41, and the plurality of baffles 41 surround and form at least one cavity 42, and the LED chip 3 is arranged in the cavity. inside cavity 42;
  • the sealant layer 5 is disposed on the substrate 1 .
  • the anode layer 21 is integrally formed, and the LED chip 3 is connected to the anode layer 21 .
  • the cathode layer 22 is integrally formed, and the LED chip 3 is connected to the cathode layer 22 .
  • the cathode layer 22 includes at least one cathode connection unit 221 , the LEDs are connected to the cathode connection unit 221 , and the LEDs correspond to the cathode connection units 221 one by one.
  • the anode layer 21 includes at least one anode connection unit (not shown), the LED chip 3 is connected to the anode connection unit, and the LED chip 3 is connected to the anode connection unit One to one correspondence.
  • the light-shielding structure 4 is formed by ink jetting.
  • the top surface of the baffle 41 is corrugated, and the top surface is the end of the baffle 41 away from the base plate.
  • the substrate 1 and the sealant layer 5 are surrounded to form an accommodating cavity, and the electrode unit 2 , the LED chip 3 and the light-shielding structure 4 are all disposed in the accommodating cavity.
  • the substrate 1 is a PCB board whose glass transition temperature exceeds a preset threshold.
  • a plurality of LED chips 3 are evenly spaced.
  • the LED chip 3 is any one or more of a red LED chip, a green LED chip, a blue LED chip and a white LED chip.
  • the LED chips 3 correspond to the cavities 42 one by one.
  • a seam is formed between the first display panel and the first display panel, and the LED display panel is arranged at the seam.
  • the LED display panel can visually eliminate the seam;
  • the viewing angle is improved, and the display quality of the display panel is improved.
  • the first display panel is an LCD display.
  • a light-shielding structure is set to surround each LED chip, and the viewing angle range of the LED package module and the LED display panel is adjusted by adjusting the parameters of the baffle in the light-shielding structure, so that the viewing angle of the display area obtained by splicing different types of displays Similarly, the display quality of the display panel is improved to enhance the user experience.
  • the light-shielding structure is formed by ink jetting, the structure size is small, and the thickness of the LED display panel is not affected.
  • each embodiment has their own emphases, and for parts not described in detail in a certain embodiment, reference may be made to relevant descriptions of other embodiments.
  • the LED packaging module since the LED packaging module has been described in detail in the embodiment of the LED display panel, the LED packaging module is not described in detail in the embodiment book of the display device.
  • the LED packaging module in the display device For the specific implementation manner, refer to the relevant description of the embodiments of the LED display panel.

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Abstract

本申请公开了一种LED显示面板及显示设备。LED显示面板组包括至少一个LED封装模组，LED封装模组包括：基板；电极单元，设于基板上，电极单元包括阳极层及阴极层；至少一个LED芯片，设于阳极层与阴极层上；遮光结构，设于基板上，遮光结构包含多个挡板，多个挡板围设形成至少一个空腔，LED芯片设于空腔内；封胶层，设于基板上。

Description

LED显示面板及显示设备 技术领域
本申请涉及显示技术领域，具体涉及一种LED显示面板及显示设备。
 背景技术
显示屏拼接市场规模成逐年增长趋势，LCD（Liquid Crystal Display，液晶显示器）拼接以价格优势占领为中低端市场，高端市场以小拼缝LED（light emitting diode，发光二极管）为主流产品。LCD+LED拼接屏可实现低成本的大屏方案，但是LCD与LED发光原理不同，视角表现差异大，导致侧视时LED亮度大，影响整体观感。因此，如何控制LED的视角是目前亟待解决的问题。
 技术问题
LCD+LED拼接屏可实现低成本的大屏方案，但是LCD与LED发光原理不同，视角表现差异大，导致侧视时LED亮度大，影响整体观感。
 技术解决方案
本申请实施例提供一种LED显示面板及显示设备，通过遮光结构的挡板调节LED封装模组及LED显示面板的视角范围，提高显示面板的显示品质，提升用户的使用感受。
本申请实施例提供一种LED显示面板，LED显示面板组包括至少一个LED封装模组，所述LED封装模组包括：
基板；
电极单元，设于所述基板上，所述电极单元包括阳极层及与所述阳极层相对设置的阴极层；
至少一个LED芯片，所述LED芯片设于所述阳极层与所述阴极层上；
遮光结构，设于所述基板上，所述遮光结构包含多个挡板，所述多个挡板围设形成至少一个空腔，所述LED芯片设于所述空腔内，所述遮光结构通过油墨喷射形成；
封胶层，设于所述基板上，所述基板与所述封胶层围设形成容纳腔，所述电极单元、所述LED芯片及所述遮光结构均设于所述容纳腔内。
本实施例中，将LED芯片设于遮光结构中各挡板围设形成的空腔中，侧视方向LED芯片发出的部分光线被挡板遮挡，从而调整LED显示面板的视角，使得通过不同类型显示器拼接得到的LED显示面板的视角相同，提高显示面板的显示品质，提升用户的使用感受。且通过设置不同的油墨的组分配比以及喷射工艺参数能够实现挡板的大高宽比的要求，且避免影响LED芯片发光。Tg值越高，板材的耐温度性能越好，确保高温下LED显示面板的安全性。
在本申请一些实施例中，所述阳极层一体成型，所述LED芯片与所述阳极层连接。
本实施例中，阳极层一体成型，减少LED芯片之间的电路连接，使得电路结构连接更加简洁。
在本申请一些实施例中，所述阴极层包括至少一个阴极连接单元，所述LED芯片与所述阴极连接单元连接，且所述LED芯片与所述阴极连接单元一一对应。
本实施例中，将阴极层拆分为若干个阴极连接单元，基于LED芯片的位置灵活设置，降低对电路布置空间的要求。
在本申请一些实施例中，所述挡板的顶面为波浪型，所述顶面为所述挡板远离所述基板的一端。
本实施例中，挡板的参数决定LED显示面板的视角大小，将挡板的顶面设置为波浪型使得LED显示面板的视角变化以及视角范围内亮度变化不会突变，更加符合LED显示面板的亮度变化曲线。
在本申请一些实施例中，所述基板与所述封胶层围设形成容纳腔，所述电极单元、所述LED芯片及所述遮光结构均设于所述容纳腔内。
本实施例中，基板与封胶层围设形成容纳腔，该容纳腔为LED显示面板的现有结构，遮光结构设于容纳腔内，容纳腔不需要扩大尺寸，在改善视角的同时也不影响LED显示面板的厚度。
本申请实施例提供一种LED显示面板，LED显示面板组包括至少一个LED封装模组，所述LED封装模组包括：
基板；
电极单元，设于所述基板上，所述电极单元包括阳极层及与所述阳极层相对设置的阴极层；
至少一个LED芯片，所述LED芯片设于所述阳极层与所述阴极层上；
遮光结构，设于所述基板上，所述遮光结构包含多个挡板，所述多个挡板围设形成至少一个空腔，所述LED芯片设于所述空腔内；
封胶层，设于所述基板上。
本实施例中，将LED芯片设于遮光结构中各挡板围设形成的空腔中，侧视方向LED芯片发出的部分光线被挡板遮挡，从而调整LED显示面板的视角，使得通过不同类型显示器拼接得到的LED显示面板的视角相同，提高显示面板的显示品质，提升用户的使用感受。
在本申请一些实施例中，所述阳极层一体成型，所述LED芯片与所述阳极层连接。
本实施例中，阳极层一体成型，减少LED芯片之间的电路连接，使得电路结构连接更加简洁。
在本申请一些实施例中，所述阴极层一体成型，所述LED芯片与所述阴极层连接。
本实施例中，阴极层一体成型，减少LED芯片之间的电路连接，使得电路结构连接更加简洁。
在本申请一些实施例中，所述阴极层包括至少一个阴极连接单元，所述LED芯片与所述阴极连接单元连接，且所述LED芯片与所述阴极连接单元一一对应。
本实施例中，将阴极层拆分为若干个阴极连接单元，基于LED芯片的位置灵活设置，降低对电路布置空间的要求。
在本申请一些实施例中，所述阳极层包括至少一个阳极连接单元，所述LED芯片与所述阳极连接单元连接，且所述LED芯片与所述阳极连接单元一一对应。
本实施例中，将阳极层拆分为若干个阳极连接单元，基于LED芯片的位置灵活设置，降低对电路布置空间的要求。
在本申请一些实施例中，所述遮光结构通过油墨喷射形成。
本实施例中，通过设置不同的油墨的组分配比以及喷射工艺参数能够实现挡板的大高宽比的要求，且避免影响LED芯片发光。
在本申请一些实施例中，所述挡板的顶面为波浪型，所述顶面为所述挡板远离所述基板的一端。
本实施例中，挡板的参数决定LED显示面板的视角大小，将挡板的顶面设置为波浪型使得LED显示面板的视角变化以及视角范围内亮度变化不会突变，更加符合LED显示面板的亮度变化曲线。
在本申请一些实施例中，所述基板与所述封胶层围设形成容纳腔，所述电极单元、所述LED芯片及所述遮光结构均设于所述容纳腔内。
本实施例中，基板与封胶层围设形成容纳腔，该容纳腔为LED显示面板的现有结构，遮光结构设于容纳腔内，容纳腔不需要扩大尺寸，在改善视角的同时也不影响LED显示面板的厚度。
在本申请一些实施例中，所述基板为玻璃转化温度超过预设阈值的PCB板。
本实施例中，基板为玻璃转化温度超过预设阈值的PCB板，Tg值越高，板材的耐温度性能越好，确保高温下LED显示面板的安全性。
在本申请一些实施例中，多个所述LED芯片均匀间隔设置。
本实施例中，多个LED芯片均匀间隔设置，且多个LED芯片3相互之间的间距越小，LED显示面板的显示变化更加流畅。
在本申请一些实施例中，所述LED芯片为红色LED芯片、绿色LED芯片、蓝色LED芯片以及白色LED芯片中任意一个或多个。
本实施例中，LED芯片是LED灯的核心组件，基于LED芯片决定发出的光线的颜色，根据显示需要进行不同数量颜色的LED芯片自由组合。
在本申请一些实施例中，所述LED芯片与所述空腔一一对应。
本实施例中，LED芯片与空腔一一对应，挡板将多个LED芯片相隔开来，各个LED芯片分别设置在相对独立的空间，各个LED芯片的光线强度以及视角分别进行调节，避免相互之间影响。
本申请实施例提供一种显示设备，所述显示设备包括若干第一显示面板和如上述任意一项所述的LED显示面板，所述第一显示面板与所述LED显示面板连接。
在本申请一些实施例中，所述第一显示面板与所述第一显示面板之间形成拼缝，所述LED显示面板设置在拼缝处。
在本申请一些实施例中，所述第一显示面板为LCD显示屏。
在本申请一些实施例中，所述LED显示面板组包括至少一个LED封装模组，所述LED封装模组包括：
基板；
电极单元，设于所述基板上，所述电极单元包括阳极层及与所述阳极层相对设置的阴极层；
至少一个LED芯片，所述LED芯片设于所述阳极层与所述阴极层上；
遮光结构，设于所述基板上，所述遮光结构包含多个挡板，所述多个挡板围设形成至少一个空腔，所述LED芯片设于所述空腔内；
封胶层，设于所述基板上。
在本申请一些实施例中，所述阳极层一体成型，所述LED芯片与所述阳极层连接。
在本申请一些实施例中，所述阴极层一体成型，所述LED芯片与所述阴极层连接。
在本申请一些实施例中，所述阴极层包括至少一个阴极连接单元，所述LED与所述阴极连接单元连接，且所述LED与所述阴极连接单元一一对应。
在本申请一些实施例中，所述阳极层包括至少一个阳极连接单元，所述LED芯片与所述阳极连接单元连接，且所述LED芯片与所述阳极连接单元一一对应。
在本申请一些实施例中，所述遮光结构通过油墨喷射形成。
在本申请一些实施例中，所述挡板的顶面为波浪型，所述顶面为所述挡板远离所述基板的一端。
在本申请一些实施例中，所述基板与所述封胶层围设形成容纳腔，所述电极单元、所述LED芯片及所述遮光结构均设于所述容纳腔内。
在本申请一些实施例中，所述基板为玻璃转化温度超过预设阈值的PCB板。
在本申请一些实施例中，多个所述LED芯片均匀间隔设置。
在本申请一些实施例中，所述LED芯片为红色LED芯片、绿色LED芯片、蓝色LED芯片以及白色LED芯片中任意一个或多个。
在本申请一些实施例中，所述LED芯片与所述空腔一一对应。
 有益效果
本申请实施例提供的LED显示面板及显示设备，设置遮光结构将各个LED芯片围设起来，通过调节遮光结构中挡板的参数进而调节LED封装模组及LED显示面板的视角范围，使得通过不同类型显示器拼接得到的显示区域的视角相同，提高显示面板的显示品质，提升用户的使用感受。
 附图说明
下面结合附图，通过对本申请的具体实施方式详细描述，将使本申请的技术方案及其它有益效果显而易见。
图1为本申请一实施例提供的LED封装模组的结构示意图。
图2为本申请一实施例提供的LED封装模组芯片和挡板的截面示意图。
附图标号：
1、基板；2、电极单元；21、阳极层；22、阴极层；221、阴极连接单元；3、LED芯片；4、遮光结构；41、挡板；42、空腔；5、封胶层。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
请参阅图1，本申请实施例提供一种LED显示面板，LED显示面板包括至少一个LED封装模组，一个LED封装模组是实现显示功能的最小单元，一个LED封装模组至少包含一个发光的LED芯片3，可以根据显示区域的大小需求选择不同数量的LED封装模组进行拼接得到LED显示面板，本实施例不作具体限定。
LED封装模组包括基板1、电极单元2、LED芯片3、遮光结构4以及封胶层5。其中，基板1一方面起到承载其它部件的作用，其它部件均设在基板1上，另一方面基板1上设置有相关的电路结构，与其它部件配合实现显示功能，同时LED封装模组通过基板1上设置的电路结构与其它的LED封装模组进行电连接，多个LED封装模组配合组成LED显示面板实现显示功能。
电极单元2设置在基板1上，电极单元2包括阳极层21和阴极层22，阳极层21和阴极层22均为金属制成，均设置在基板1上。阳极层21和阴极层22相对设置，且阳极层21和阴极层22之间相互间隔，阳极层21和阴极层22相互之间并不直接连接。电极单元2与基板1上设置的电路结构连接，同时各个LED封装模组相互之间也是通过各自基板1上设置的电路结构连接，以便将多个LED封装模组配合连接。
LED芯片3也称为LED发光芯片，是LED灯的核心组件，也就是指的P-N结。其主要功能是：把电能转化为光能，芯片的主要材料为单晶硅。基于LED芯片发出的光线的颜色，LED芯片3包含红色LED芯片、绿色LED芯片、蓝色LED芯片以及白色LED芯片。LED封装模组中包含至少一个LED芯片3，可以是上述红色LED芯片、绿色LED芯片、蓝色LED芯片以及白色LED芯片中任意一个，也可以是其中多个LED芯片3依次连接，本实施例不作具体限定。
其中，如果LED封装模组中包含多个LED芯片3，则多个LED芯片3的排列顺序基于显示功能的实现要求进行设置，例如按照红色LED芯片、绿色LED芯片、蓝色LED芯片的顺序依次循环设置。此外，如果LED封装模组中包含多个LED芯片3，多个LED芯片3均匀间隔设置，且多个LED芯片3相互之间的间距越小，LED显示面板的显示变化更加流畅，因此可以根据显示精度的需求设置LED芯片3之间的间距，本实施例对此不作具体限定。
LED芯片3设于阳极层21与阴极层22上，LED芯片3的一端与阳极层21连接，LED芯片3的另一端与阴极层22连接，电连接以实现显示功能，其具体连接方式本实施例不作具体限定。也就是说阳极层21与阴极层22通过LED芯片3连接，阳极层21和阴极层22相互之间并不直接连接。此外，如果LED封装模组中包含多个LED芯片3，电极单元2的阳极层21与阴极层22对应有与LED芯片3相同数量的连接点，所有的电极单元2的阳极层21与阴极层22均与基板1上设置的电路结构连接，其中可以是电极单元2的阳极层21与阴极层22分别与基板1上设置的电路结构连接，也可以是电极单元2的阳极层21与阴极层22自身连接之后，再作为整体与基板1上设置的电路结构连接，本实施例不作具体限定。也就是说，阴极层22与阳极层21的结构可以根据显示需要或者空间布置等要求选择所有的连接点一体成型或者间隔设置，本实施例不作具体限定。
遮光结构4设置在基板1上，遮光结构4用于遮挡LED芯片3发出的部分光线，从而改变LED显示面板的视角范围以及视角内的亮度，以使得LED显示面板的视角范围与拼接的LCD显示屏相匹配，避免同一显示区域的视角不同，影响显示效果。遮光结构4包含多个挡板41，多个挡板41围设形成至少一个空腔42，LED芯片3设于空腔42内，也就是说挡板41将多个LED芯片3相隔开来，各个LED芯片3分别设置在相对独立的空间。其中，空腔42的形状结构可以是矩形。圆形等规则形状，也可以是其它不规则的形状，本实施例不作具体限定。
LED芯片发出的光线由于被挡板41遮挡，因此会改变LED显示面板的视角。LED芯片3与空腔42一一对应，每个空腔42四周设置的挡板41的参数决定其对应的空腔42内到的LED芯片发出的光线所能被看到的范围，也就是挡板41的参数决定了LED显示面板的视角，因此可以根据调节挡板41的参数以改变LED显示面板的视角，实际情况可以根据视角的要求进行设置，例如根据量测的LCD与LED视角亮度，对比两者的差异，可以计算出合理的挡板41的参数，又或者通过实验验证得出最佳的挡板41的参数，本实施例不作具体限定。
其中，挡板41的参数包括挡板41的高度以及挡板41距离LED芯片3的距离。如图2所示，由于挡板41以及LED芯片3本身具有一定的厚度，挡板41距离LED芯片3的距离为挡板41靠近LED芯片3一侧的内边缘上端到LED芯片3几何中心法线的垂直距离，挡板41的高度为挡板41顶面（远离基板1的一端）到LED芯片3底面（靠近基板1的一端）的垂直距离。
由图2可知，LED芯片3法线方向挡板41并没有遮挡LED芯片发出的光线，即LED显示面板的正视亮度最高。∠1为第一连线与LED芯片3法线的夹角，第一连线为挡板41靠近LED芯片3一侧的内边缘与LED芯片3上靠近该内边缘的上边缘的连线。∠2为第二连线与LED芯片3法线的夹角，第一连线为挡板41靠近LED芯片3一侧的内边缘与LED芯片3上远离该内边缘的上边缘的连线。在LED芯片3法线到∠1的视角范围之内，挡板41均没有遮挡LED芯片发出的光线，LED显示面板的亮度最高。当视角大于∠1之后，LED芯片3发出的部分光线被挡板41所遮挡，亮度有所下降。而视角在∠1和∠2之间时，虽然LED芯片3发出的部分光线被挡板41所遮挡但还是可以看到部分光线，只是亮度有所下降。而当视角大于∠2之后，LED芯片3发出的所有光线均被挡板41所遮挡，该视角范围内的亮度为0，也就是实现的LED显示面板的视角范围的调节。需要说明的是，上述所说的挡板41的参数为影响LED显示面板的视角范围的主要因素，其参照点的选取只是为了便于理解的一种举例说明，不应理解为对本实施例的限制，也可以根据其它效果相同的等效参数进行评价调节，本实施例不作具体限定。
封胶层5设置在基板1上，封胶层5为通过胶水浇注而成，保证LED封装模组结构的气密性，同时避免其它的元件因暴露在外而被损坏。
本实施例中设置遮光结构4将各个LED芯片3围设起来，通过调节遮光结构4中挡板41的参数进而调节LED封装模组及LED显示面板的视角范围，使得通过不同类型显示器拼接得到的显示区域的视角相同，提高显示面板的显示品质，提升用户的使用感受。
在一个实施例中，阳极层21一体成型，即所有的阳极层21为一个整体，相互之间并不间隔，所有的LED芯片3与同一个阳极层21连接，从而减少电路结构的走线布置，节省空间。但需要说明的是，如果LED封装模组中包含的LED芯片3数量较多，对应的LED芯片3在阳极层21的连接点较多，由于空间布置等因素无法全部都一体成型，则可以其中部分阳极层21一体成型，可以根据LED封装模组的实际布置情形进行设置，本实施例不作具体限制。此外，阴极层22与阳极层21类似，可以选择部分或者全部一体成型。
在一个实施例中，阴极层22包括至少一个阴极连接单元221，LED与阴极连接单元221连接，如果阴极层22包括多个阴极连接单元221，则各个阴极连接单元221之间相互间隔不连接，LED与阴极连接单元221一一对应，结构布置更加简单。此外，阳极层21与阴极层22类似，阳极层21包括至少一个阳极连接单元，LED与阳极连接单元连接，如果阳极层21包括多个阳极连接单元（未示出），则各个阳极连接单元之间相互间隔不连接，LED与阳极连接单元一一对应。
在一个实施例中，遮光结构4通过油墨喷射形成，根据调节挡板41的参数以改变LED显示面板的视角，例如根据量测的LCD与LED视角亮度，对比两者的差异，可以计算出合理的挡板41的参数，又或者通过实验验证得出最佳的挡板41的参数。在确定挡板41的参数之后，分析油墨的组分配比以及喷射工艺参数，通过油墨喷射形成若干挡板41得到遮光结构4。需要说明的是，可以通过调节油墨的组分配比以及喷射工艺参数直接喷射形成需符合参数要求的挡板41，相应的不同参数要求的挡板41对应不同的油墨的组分配比以及喷射工艺参数，对于其具体分析过程本实施例不作具体限定。此外，当阳极层21或阴极层22设置为一体成型时，挡板41会遮盖部分的阳极层21或阴极层22，为了降低挡板41对阳极层21或阴极层22的影响，因此通过油墨喷射形成若干大高宽比的挡板41得到遮光结构4。
在一个实施例中，基板1与封胶层5围设形成容纳腔，电极单元2、LED芯片3及遮光结构4均设于容纳腔内。现有技术中LED封装模组不包括遮光结构4，基板1与封胶层5同样围设形成容纳腔，电极单元2与LED芯片3均设于容纳腔内，基板1与封胶层5之间存在一定的空间。本实施例中在基板1与封胶层5之间设置遮光结构4，遮光结构4的尺寸较小，相对于现有技术中LED封装模组的结构，本实施例中的容纳腔也不需要扩大尺寸，因此在改善视角的同时也不影响LED显示面板的厚度。
在一个实施例中，基板1为高Tg的PCB板（printed circuit board，印制线路板），Tg为指玻璃态转化温度，是板材在高温受热下的玻璃化温度，一般Tg的板材为130度以上，高Tg一般大于170度，中等Tg约大于150度，也就是说基板1为玻璃转化温度超过预设阈值的PCB板。Tg值越高，板材的耐温度性能越好。
本实施例中设置遮光结构4将各个LED芯片3围设起来，通过调节遮光结构4中挡板41的参数进而调节LED封装模组及LED显示面板的视角范围，使得通过不同类型显示器拼接得到的显示区域的视角相同，提高显示面板的显示品质，提升用户的使用感受。同时通过油墨喷射形成遮光结构4，结构尺寸小，不影响LED显示面板的厚度。
本申请实施例提供一种显示设备，包括若干第一显示面板和如上述任意一项实施例所述的LED显示面板，第一显示面板与LED显示面板连接，若干第一显示面板与LED显示面板拼接从而得到具有更大的显示区域的显示设备。参阅图1，LED显示面板包括至少一个LED封装模组，所述LED封装模组包括：
基板1；
电极单元2，设于所述基板1上，所述电极单元2包括阳极层21及与所述阳极层21相对设置的阴极层22；
至少一个LED芯片3，所述LED芯片3设于所述阳极层21与所述阴极层22上；
遮光结构4，设于所述基板1上，所述遮光结构4包含多个挡板41，所述多个挡板41围设形成至少一个空腔42，所述LED芯片3设于所述空腔42内；
封胶层5，设于所述基板1上。
在一个实施例中，所述阳极层21一体成型，所述LED芯片3与所述阳极层21连接。
在本申请一些实施例中，所述阴极层22一体成型，所述LED芯片3与所述阴极层22连接。
在一个实施例中，所述阴极层22包括至少一个阴极连接单元221，所述LED与所述阴极连接单元221连接，且所述LED与所述阴极连接单元221一一对应。
在本申请一些实施例中，所述阳极层21包括至少一个阳极连接单元（未示出），所述LED芯片3与所述阳极连接单元连接，且所述LED芯片3与所述阳极连接单元一一对应。
在一个实施例中，所述遮光结构4通过油墨喷射形成。
在一个实施例中，所述挡板41的顶面为波浪型，所述顶面为所述挡板41远离所述基板的一端。
在一个实施例中，所述基板1与所述封胶层5围设形成容纳腔，所述电极单元2、所述LED芯片3及所述遮光结构4均设于所述容纳腔内。
在一个实施例中，所述基板1为玻璃转化温度超过预设阈值的PCB板。
在本申请一些实施例中，多个所述LED芯片3均匀间隔设置。
在本申请一些实施例中，所述LED芯片3为红色LED芯片、绿色LED芯片、蓝色LED芯片以及白色LED芯片中任意一个或多个。
在本申请一些实施例中，所述LED芯片3与所述空腔42一一对应。
在一个实施例中，所述第一显示面板与所述第一显示面板之间形成拼缝，所述LED显示面板设置在拼缝处，一方面LED显示面板可以从视觉上消除拼缝，另一方面改善视角，提高显示面板的显示品质。
在一个实施例中，所述第一显示面板为LCD显示屏。
本实施例中设置遮光结构将各个LED芯片围设起来，通过调节遮光结构中挡板的参数进而调节LED封装模组及LED显示面板的视角范围，使得通过不同类型显示器拼接得到的显示区域的视角相同，提高显示面板的显示品质，提升用户的使用感受。同时通过油墨喷射形成遮光结构，结构尺寸小，不影响LED显示面板的厚度。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。具体地，由于在LED显示面板的实施例中对于LED封装模组已经进行了详细说明，因此在显示设备的实施例书中对于LED封装模组没有再一一赘述，显示设备中LED封装模组的具体实施方式参见LED显示面板的实施例的相关描述。
以上对本申请实施例所提供的一种LED显示面板及显示设备进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (20)

  1. 一种LED显示面板，所述LED显示面板组包括至少一个LED封装模组，其中，所述LED封装模组包括：
    基板；
    电极单元，设于所述基板上，所述电极单元包括阳极层及与所述阳极层相对设置的阴极层；
    至少一个LED芯片，所述LED芯片设于所述阳极层与所述阴极层上；
    遮光结构，设于所述基板上，所述遮光结构包含多个挡板，所述多个挡板围设形成至少一个空腔，所述LED芯片设于所述空腔内，所述遮光结构通过油墨喷射形成；
    封胶层，设于所述基板上，所述基板与所述封胶层围设形成容纳腔，所述电极单元、所述LED芯片及所述遮光结构均设于所述容纳腔内。
  2. 如权利要求1所述的LED显示面板，其中，所述阳极层一体成型，所述LED芯片与所述阳极层连接。
  3. 如权利要求1所述的LED显示面板，其中，所述阴极层包括至少一个阴极连接单元，所述LED芯片与所述阴极连接单元连接，且所述LED芯片与所述阴极连接单元一一对应。
  4. 如权利要求1所述的LED显示面板，其中，所述挡板的顶面为波浪型，所述顶面为所述挡板远离所述基板的一端。
  5. 如权利要求1所述的LED显示面板，其中，所述基板为玻璃转化温度超过预设阈值的PCB板。
  6. 一种LED显示面板，所述LED显示面板组包括至少一个LED封装模组，其中，所述LED封装模组包括：
    基板；
    电极单元，设于所述基板上，所述电极单元包括阳极层及与所述阳极层相对设置的阴极层；
    至少一个LED芯片，所述LED芯片设于所述阳极层与所述阴极层上；
    遮光结构，设于所述基板上，所述遮光结构包含多个挡板，所述多个挡板围设形成至少一个空腔，所述LED芯片设于所述空腔内；
    封胶层，设于所述基板上。
  7. 如权利要求6所述的LED显示面板，其中，所述阳极层一体成型，所述LED芯片与所述阳极层连接。
  8. 如权利要求6所述的LED显示面板，其中，所述阴极层一体成型，所述LED芯片与所述阴极层连接。
  9. 如权利要求6所述的LED显示面板，其中，所述阴极层包括至少一个阴极连接单元，所述LED芯片与所述阴极连接单元连接，且所述LED芯片与所述阴极连接单元一一对应。
  10. 如权利要求6所述的LED显示面板，其中，所述阳极层包括至少一个阳极连接单元，所述LED芯片与所述阳极连接单元连接，且所述LED芯片与所述阳极连接单元一一对应。
  11. 如权利要求6所述的LED显示面板，其中，所述遮光结构通过油墨喷射形成。
  12. 如权利要求6任意一项所述的LED显示面板，其中，所述挡板的顶面为波浪型，所述顶面为所述挡板远离所述基板的一端。
  13. 如权利要求6所述的LED显示面板，其中，所述基板与所述封胶层围设形成容纳腔，所述电极单元、所述LED芯片及所述遮光结构均设于所述容纳腔内。
  14. 如权利要求6所述的LED显示面板，其中，所述基板为玻璃转化温度超过预设阈值的PCB板。
  15. 如权利要求6所述的LED显示面板，其中，多个所述LED芯片均匀间隔设置。
  16. 如权利要求6所述的LED显示面板，其中，所述LED芯片为红色LED芯片、绿色LED芯片、蓝色LED芯片以及白色LED芯片中任意一个或多个。
  17. 如权利要求6所述的LED显示面板，其中，所述LED芯片与所述空腔一一对应。
  18. 一种显示设备，其中，所述显示设备包括若干第一显示面板和如权利要求6至17任意一项所述的LED显示面板，所述第一显示面板与所述LED显示面板连接。
  19. 如权利要求18所述的显示设备，其中，所述第一显示面板与所述第一显示面板之间形成拼缝，所述LED显示面板设置在拼缝处。
  20. 如权利要求18所述的显示设备，其中，所述第一显示面板为LCD显示屏。
PCT/CN2021/138694 2021-12-09 2021-12-16 Led显示面板及显示设备 WO2023102997A1 (zh)

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