WO2023102746A1 - 雾化芯、雾化器及电子雾化装置 - Google Patents

雾化芯、雾化器及电子雾化装置 Download PDF

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Publication number
WO2023102746A1
WO2023102746A1 PCT/CN2021/136172 CN2021136172W WO2023102746A1 WO 2023102746 A1 WO2023102746 A1 WO 2023102746A1 CN 2021136172 W CN2021136172 W CN 2021136172W WO 2023102746 A1 WO2023102746 A1 WO 2023102746A1
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Prior art keywords
atomizing
atomizing core
conductor lead
hole
conductor
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PCT/CN2021/136172
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English (en)
French (fr)
Inventor
沈奇杰
蒋振龙
肖从文
吕红霞
罗洪梁
Original Assignee
海南摩尔兄弟科技有限公司
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Priority to PCT/CN2021/136172 priority Critical patent/WO2023102746A1/zh
Publication of WO2023102746A1 publication Critical patent/WO2023102746A1/zh

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    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A24F40/46—Shape or structure of electric heating means

Definitions

  • the present application relates to the technical field of atomizers, in particular to an atomization core, an atomizer and an electronic atomization device.
  • the electronic atomization device in the related art is mainly composed of an atomizer and a power supply assembly.
  • the atomizing core in the atomizer is the core component
  • the atomizing core mainly includes a ceramic atomizing core and a liquid-conducting cotton atomizing core.
  • the traditional ceramic atomizing core is silk-screened on the surface of the ceramic substrate, a layer of heating film resistor is sintered, and a set of conductor leads connected to the power supply are sintered.
  • the conductor leads of the ceramic atomizing core have poor contact stability with the substrate and are easily damaged.
  • the present application provides an atomizing core, an atomizer and an electronic atomizing device to solve the problems in the prior art that the lead wires of the ceramic atomizing core and the substrate have poor contact stability and are easily damaged.
  • the first technical solution provided by this application is: provide an atomizing core, including a base, a heating element and a conductor lead, the base has an atomizing surface and a through hole extending to the atomizing surface;
  • the substrate is used to guide the aerosol generating substrate to the atomizing surface;
  • the heating element is arranged on the atomizing surface for heating and atomizing the aerosol generating substrate to generate aerosol;
  • the conductor lead is arranged In the through hole, it is fixed with the base body to form an integral structure; wherein, the first end of the conductor lead is electrically connected to the heating element, and the second end is used to connect to the power supply component.
  • the side wall of the conductor lead has a protrusion
  • the side wall of the through hole has a depression
  • the protrusion is embedded in the depression.
  • the conductor lead is a solid conductor, or the conductor lead has pores inside.
  • the solid portion of the conductor leads accounts for more than 50% of the volume of the through hole.
  • the base body has a first surface and a second surface oppositely arranged, and the first surface is the atomization surface; the through hole extends from the first surface to the second surface.
  • the through hole is a straight through hole perpendicular to the first surface.
  • the atomizing core further includes an electrode and a welding pad, the electrode is arranged on the first surface and is electrically connected to the heating element; the welding pad is arranged on the second surface for connecting the power supply component;
  • the first end of the conductor lead is electrically connected to the electrode, and the second end is electrically connected to the pad.
  • the wire diameter of the conductor lead is 0.1-1mm; and/or, the material of the conductor lead is one or more of Ag, Cu and Au.
  • the matrix is a porous matrix; the porosity of the matrix is 30-80%; and/or, the pore diameter range of the pores of the matrix is 10-200um.
  • the conductor leads are prepared by filling the through holes with conductive paste and then sintering.
  • the base body has a first surface and a second surface oppositely arranged, and a side surface connecting the first surface and the second surface; the first surface is the atomized surface; The first surface extends to the side.
  • the second technical solution provided by the present application is to provide an atomizer, which includes a housing and an atomizing core.
  • the housing has an accommodating cavity; the atomizing core is arranged in the accommodating cavity and cooperates with the housing to form a liquid storage chamber; the atomizing core is used to heat and atomize the
  • the aerosol-generating substrate of the chamber is used to form an aerosol; wherein, the atomizing core is the atomizing core described in any one of the above.
  • the third technical solution provided by this application is to provide an electronic atomization device, including an atomizer and a power supply assembly; wherein, the atomizer is the atomizer described in any one of the above device; the power supply assembly is electrically connected with the conductor lead of the atomizer, and is used to supply power to the atomizer.
  • the atomizing core of the present application includes a substrate, a heating element and a conductor lead, the substrate has an atomizing surface and a through hole extending to the atomizing surface; the substrate is used to dissipate the aerosol
  • the generating substrate is diverted to the atomizing surface; the heating element is arranged on the atomizing surface for heating and atomizing the aerosol generating substrate to generate aerosol; the conductor lead is arranged in the through hole, and
  • the base body is fixed to form an integrated structure; wherein, the first end of the conductor lead is electrically connected to the heating body, and the second end is used to connect to the power supply assembly.
  • Fig. 1 is a schematic structural diagram of an electronic atomization device provided by the present application
  • Fig. 2 is a schematic structural view of the atomizer provided by the present application.
  • Fig. 3 is a schematic structural diagram of an atomizing core in an embodiment provided by the present application.
  • Fig. 4 is a schematic front view structural diagram of the atomizing core provided in Fig. 3;
  • Fig. 5 is a schematic bottom view of the atomizing core provided in Fig. 3;
  • Fig. 6 is a cross-sectional view of the first embodiment of the atomizing core provided in Fig. 5 along the A-A direction;
  • Fig. 7 is a cross-sectional view of the second embodiment of the A-A direction of the atomizing core provided in Fig. 5;
  • Fig. 8 is a cross-sectional view of a third embodiment of the atomizing core provided in Fig. 5 along the direction of A-A;
  • Fig. 9 is a cross-sectional view of the fourth embodiment of the atomizing core provided in Fig. 5 along the A-A direction;
  • Fig. 10 is a schematic structural diagram of an atomizing core in another embodiment provided by the present application.
  • Fig. 11 is a schematic side sectional view of the connection between the conductor lead and the substrate according to an embodiment of the present application.
  • Fig. 12 is a structural sectional view of the first embodiment of the conductor lead provided by the present application.
  • Fig. 13 is a structural sectional view of the second embodiment of the conductor lead provided by the present application.
  • Fig. 14 is a structural cross-sectional view of a third embodiment of a conductor lead provided by the present application.
  • Fig. 15 is a cross-sectional view of the connection structure between the substrate and the conductor leads provided by the present application.
  • first and second in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as “first”, “second”, may explicitly or implicitly include at least one of the features. All directional indications (such as up, down, left, right, front, back%) in the embodiments of the present application are only used to explain the relative positional relationship between the various components in a certain posture (as shown in the drawings) , sports conditions, etc., if the specific posture changes, the directional indication also changes accordingly. Furthermore, the terms “include” and “have”, as well as any variations thereof, are intended to cover a non-exclusive inclusion.
  • a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes unlisted steps or units, or optionally further includes For other steps or units inherent in these processes, methods, products or apparatuses.
  • Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understood explicitly and implicitly by those skilled in the art that the embodiments described herein can be combined with other embodiments.
  • FIG. 1 is a schematic structural diagram of an electronic atomization device provided in this application.
  • the electronic atomization device includes an atomizer 1 and a power supply assembly 2 , and the power supply assembly 2 is connected to the atomizer 1 for supplying power to the atomizer 1 .
  • Electronic atomization devices can be used for atomization of liquid substrates.
  • the atomizer 1 is used to store the liquid aerosol generating substrate and atomize the aerosol generating substrate to form an aerosol that can be inhaled by the user.
  • the liquid aerosol generating substrate can be a liquid substrate such as a liquid medicine, a plant grass leaf aerosol generating substrate, etc. .
  • the atomizer 1 can be used in different fields, such as medical treatment, beauty treatment, recreational smoking and the like.
  • the power supply assembly 2 includes a battery (not shown in the figure), an airflow sensor (not shown in the figure), and a controller (not shown in the figure), etc.; the battery is used to supply power to the atomizer 1 and control the heating power and heating time of the atomizing core 20, etc. , so that the atomizer 1 can atomize the aerosol-generating substrate to form an aerosol.
  • the airflow sensor is used to detect the airflow change in the electronic atomization device, and the controller starts the electronic atomization device according to the airflow change detected by the airflow sensor.
  • the atomizer 1 and the power supply assembly 2 can be integrated or detachably connected, and can be designed according to specific needs.
  • FIG. 2 is a schematic structural diagram of the atomizer provided in this application.
  • the atomizer 1 includes a casing 10 and an atomizing core 20 , and the casing 10 has an accommodating cavity 11 .
  • the atomizing core 20 and the casing 10 may be integrally provided with a non-detachable connection, or may be a detachable connection.
  • the atomizing core 20 and the housing 10 are detachably connected, and the atomizing core 20 is directly connected to the housing 10, so that there is no need to introduce an additional conduit between the atomizing core 20 and the housing 10
  • the detachable connection is realized, the volume of the atomizer 1 is reduced, and the use is more convenient. It can be understood that the atomizer 1 of the present application is a portable atomizer.
  • the atomizing core 20 is disposed in the accommodating chamber 11 and cooperates with the casing 10 to form a liquid storage chamber 12 for storing the aerosol generating substrate.
  • the atomizing core 20 can be used in different fields, such as medicine atomization, oil leaf flower liquid atomization and other fields, for heating and atomizing the aerosol generating substrate from the liquid storage chamber 12 to form an aerosol when energized.
  • the atomizer 1 may also include a mounting base (not shown in the figure) for mounting the atomizing core 20 .
  • a protrusion (not shown) is provided on the outer wall of the atomizing core 20
  • a chute (not shown) is provided on the outer wall of the casing 10
  • a limiting block (not shown) is arranged in the chute. Align the protrusion on the atomizing core 20 with the chute on the housing 10 and insert it, rotate the atomizing core 20 or the housing 10, so that the protrusion is limited by the limit block in the chute, and realize the atomization core 20
  • the fixing with the casing 10 further realizes the detachable connection between the atomizing core 20 and the casing 10 .
  • a protrusion may also be provided on the outer wall of the housing 10
  • a chute may be provided on the outer wall of the atomizing core 20
  • a limit block may be provided in the chute to realize the connection between the atomizing core 20 and the housing 10.
  • the detachable connection of the atomizing core 20 and the housing 10 can also be realized by magnetic attraction; it only needs to realize the detachable connection of the atomizing core 20 and the housing 10, and the specific embodiment is not limited .
  • the atomizing surface of the atomizing core 20 faces upward, which can increase the amount of atomization.
  • the pins (not shown) of the atomizing core 20 can be set at any position of the atomizing core 20, but in this embodiment, the pins are set downwards, which can facilitate the atomization of the atomizer 1.
  • Automated assembly A suction channel 30 is provided on the side of the atomizing core 20 away from the power supply assembly 2 , and the suction channel 30 communicates with the atomizing chamber 201 .
  • the suction port 31 on the side of the suction channel 30 away from the power supply assembly 2 communicates with the atmosphere, so that the aerosol in the atomization chamber 201 can flow out through the suction channel 30 and provide the user with food from the suction port 31 .
  • FIG. 3 is a schematic structural diagram of the atomizing core provided in an embodiment of the present application
  • FIG. 4 is a schematic front view structural diagram of the atomizing core provided in FIG. 3 .
  • the atomizing core 20 includes a base 21 , a heating element 22 and a conductor lead 23 .
  • the substrate 21 may be a porous substrate or a perforated dense substrate, wherein the porous substrate may specifically be a porous ceramic substrate, and the perforated dense substrate may be a perforated glass substrate or a dense ceramic substrate.
  • the substrate 21 in this embodiment is porous ceramics.
  • Porous ceramic materials are generally composed of aggregates, binders, and pore-forming agents and other components that have been sintered at high temperatures.
  • the interior has a large number of pore structures that are connected to each other and to the surface of the material. Due to the high porosity, stable chemical properties, large specific surface area, low bulk density, low thermal conductivity and high temperature and corrosion resistance of porous ceramic materials, they have many applications in metallurgy, biology, energy, environmental protection and other fields.
  • the base body 21 may be in the shape of a flat plate or a ladder, which is not specifically limited in the present application.
  • the base 21 has a first surface 213 and a second surface 214 , the first surface 213 is the surface of the base 21 facing the liquid storage cavity 12 , and the second surface 214 is the surface of the base 21 facing away from the first surface 213 .
  • Both the first surface 213 and the second surface 214 can be flat planes, and the first surface 213 and the second surface 214 can also be irregular surfaces such as curved surfaces, which are not specifically limited in this application. For example, if a groove (not shown) is provided on the side of the first surface 213 of the base 21 , then the surface of the groove also belongs to the first surface 213 .
  • the substrate 21 has an atomizing surface 211 and a through hole 212 extending to the atomizing surface 211 for guiding the aerosol-generating substrate to the atomizing surface 211 .
  • the porosity of the matrix 21 is 30-80%, and/or, the pore diameter range of the pores of the matrix 21 is 10-200um; it can be understood that the higher the porosity of the matrix 21, the faster the liquid-conducting speed ;
  • the aperture of the base body 21 is associated with the protrusion of the conductor lead 23 . This range can make the matching rate of the conductor lead 23 and the base 21 the highest, and at the same time facilitate the conduction of the conductor lead 23 and the conduction of the aerosol-generating substrate by the base 21 .
  • the via hole 212 has a diameter of 0.1-1 mm. In other embodiments, the diameter of the through hole 212 and the porosity of the matrix 21 can be set as required, which is not limited in this application.
  • Figure 5 is a schematic bottom view of the atomizing core provided in Figure 3
  • Figure 6 is a cross-sectional view of the first embodiment of the atomizing core provided in Figure 5 in the direction of A-A
  • Figure 7 is a schematic view of the first embodiment of the atomizing core provided in Figure 5
  • Figure 8 is a cross-sectional view of the third embodiment of the atomizing core provided in Figure 5 in the A-A direction
  • Figure 9 is a sectional view in the A-A direction of the atomizing core provided in Figure 5 Sectional view of the fourth embodiment.
  • the substrate 21 has a first surface 213 , a second surface 214 and a side surface 215 , the second surface 214 is opposite to the first surface 213 , and the side surface 215 connects the first surface 213 and the second surface 214 .
  • the first surface 213 can be used to contact the aerosol-generating substrate communicated with the liquid storage chamber 12, and the second surface 214 can be used to contact with the gas.
  • the gas contact mentioned here can be that the second surface 214 is in contact with the outside air, The air in the atomization chamber 201 contacts or contacts with the air in the suction channel 30 .
  • the aerosol-generating substrate located on the second surface 214 side of the substrate 21 penetrates to the side where the first surface 213 of the substrate 21 is located via a large number of pore structures inside the substrate 21 that communicate with each other and the surface of the material.
  • the heating element 22 is disposed on the first surface 213 to atomize the aerosol-generating substrate penetrating into the first surface 213 .
  • the side surface 215 is also connected with a channel structure, so the side surface 215 can also be used for liquid conduction or ventilation.
  • the substrate 21 has a first surface 213 and a second surface 214 oppositely disposed, and the first surface 213 is an atomizing surface 211 .
  • the through hole 212 extends from the first surface 213 to the second surface 214 , which can facilitate aerosol atomization by absorbing liquid from the side 215 , and can also absorb liquid from the second surface 214 for aerosol atomization.
  • the through hole 212 is a straight through hole perpendicular to the first surface 213, which can facilitate the preparation of the through hole.
  • the through hole 212 is a straight through hole perpendicular to the first surface 213, it is convenient to perforate the raw material at one time, and then cut into a plurality of substrates 21, and it is also convenient for the mold to be prepared, and the efficiency is high.
  • the substrate 21 also has a first surface 213 and a second surface 214 oppositely arranged, and a side surface 215 connecting the first surface 213 and the second surface 214; wherein, the first surface 213 is an atomizing surface 211 , the through hole 212 may extend from the first surface 213 to the side surface 215 . Specifically, as shown in FIG. 7 , the through hole 212 may extend to the side surface 215 in an oblique hole structure, that is, the through hole 212 is a straight hole directed toward the side surface 215 .
  • the through hole 212 may also be a cornered through hole connecting the first surface 213 and the side surface 215 .
  • the through hole 212 extends from the first surface 213 to the side surface 215 for punching, the mold is not easy to be ejected, and the multi-hole punching cannot be performed at the same time, and the punching efficiency is relatively low.
  • the structure in which the through hole 212 extends from the first surface 213 to the side surface 215 can realize liquid absorption from the second surface 214, which is suitable for a downward atomizing atomizer. In actual use, it can be set as required, and this application does not limit it.
  • the through hole 212 may also be a through hole/non-through hole forming a certain oblique angle with the first surface 213 or the side surface 215 .
  • the through hole 212 is a straight through hole/non-straight through hole with a certain oblique angle, similarly, it is not easy to release the mold, and it is not possible to perform multi-hole punching at the same time, and the punching efficiency is low.
  • the liquid can be sucked from the second surface 214, which is applicable to the atomizer that atomizes downwards, and can be set according to needs. It can be understood that there may be one or more through holes 212 , and the extending directions may be parallel or non-parallel, as long as they match the number of conductor leads 23 , which is not limited in the present application.
  • the heating element 22 is arranged on the atomizing surface 211 , and the heating element 22 is used to atomize the aerosol-generating substrate exported through the substrate 21 .
  • the atomizing surface 211 absorbs the heat of the heating element 22, so as to heat and atomize the aerosol-generating substrate when electrified to generate aerosol.
  • the heating element 22 adopts a metal heating film, which has a good heat conduction effect.
  • the heating element 22 may also be at least one of a heating coating, a heating circuit, a heating sheet or a heating net, which is not limited in the present application.
  • a porous ceramic material is used to make the base 21, and the aerosol-generating matrix located on one side of the base 21 penetrates to the other side of the base 21 through a large number of pore structures in the porous ceramic material that communicate with each other and the surface of the material. And it is in contact with the heating element 22 provided on one side of the substrate 21, so as to atomize the aerosol-generating substrate into an aerosol.
  • the heating element 22 is S-shaped, and the heating element 22 can be integrally formed or detachable, and can be specifically configured as required.
  • the heating element 22 uses a metal heating film with a thickness of 50-120um, which has high heating efficiency and high thermal conductivity, and can improve the atomization efficiency of the aerosol-generating substrate.
  • the heating element 22 can also be rectangular, elliptical or circular, and the thickness, size, quantity, etc. of the heating element 22 can be set as required, which is not limited in this application.
  • the atomizing core 20 further includes an electrode 24 and a welding pad 25 , the electrode 24 is disposed on the first surface 213 and is electrically connected to the heating element 22 .
  • the pads 25 are disposed on the second surface 214 for connecting to the power component 2 .
  • the electrode 24 includes a first electrode 241 and a second electrode 242 , the first electrode 241 and the second electrode 242 are arranged at intervals, and both are connected to the heating element 22 .
  • the heating element 22 is used for atomizing the aerosol-generating substrate exported through the substrate 21 .
  • the heating element 22 may be at least one of heating coating, heating circuit, heating sheet or heating net, and the heating element 22 is electrically connected to the power supply assembly 2 through the electrode 24 .
  • the first electrode 241 and the second electrode 242 may be disposed on a part of the atomizing surface 211 , or extend to the edge of the atomizing surface 211 , which is not limited in the present application.
  • one or more pads 25 can be set, and can be set in a cylindrical shape or a rectangular parallelepiped. Specifically, it can be set according to needs, but it needs to match the number of conductor leads 23 .
  • One end of the conductor lead 23 is connected to the electrode 24 , and the other end is connected to the pad 25 .
  • there are two pads 25 including a first pad 251 and a second pad 252 , and the first pad 251 and the second pad 252 are arranged at intervals.
  • the first pad 251 and the second pad 252 are respectively connected to two conductor leads 23 , and the conductor leads 23 pass through the electrode 24 and the pad 25 up and down.
  • the conductor lead 23 includes a first conductor lead 233 and a second conductor lead 234, the first conductor lead 233 penetrates the first electrode 241 and the first pad 251 up and down, and the second conductor lead 234 penetrates the second electrode 242 and the second electrode 242 up and down.
  • Two pads 252, and the two ends of the first conductor lead 233 and the second conductor lead 234 are electrically connected to the first electrode 241/second electrode 242 and the first pad 251/second pad 252 respectively.
  • the pads 25 can also be arranged on the side surface 215 , and this arrangement can prevent the conductor leads 23 from bending and shielding the second surface 214 from absorbing liquid. Therefore, the specific position of the pad 25 can be set according to specific needs, which is not limited in the present application.
  • FIG. 10 is a schematic structural diagram of an atomizing core in another embodiment provided by the present application.
  • the heating element 22 is waist-shaped with wide ends and gradually decreasing in the middle.
  • the two ends of the heating element 22 are respectively connected to the first electrode 241 and the second electrode 242. It is spaced apart from the second electrode 242 and connected to both ends of the waist-shaped heating element 22 .
  • a first bonding pad 251 and a second bonding pad 252 are disposed on the second surface 214 of the substrate 21 , wherein the first bonding pad 251 and the second bonding pad 252 are arranged at intervals.
  • the first conductor leads 233 are respectively connected to the first electrode 241 and the first pad 251, and the second conductor leads 234 are respectively connected to the second electrode 242 and the second pad 252.
  • the waist-shaped heating element 22 adopts a metal heating film with a thickness of 10-50 um, which has high heating efficiency and high thermal conductivity, and can improve the atomization efficiency of the aerosol-generating substrate.
  • the first electrodes 241 and the first pads 251 may be projected stacked electrodes and pads of the same size, or may be electrodes and pads of different sizes.
  • the two regions can be printed by the same printing screen, which is convenient for fabrication.
  • the conductor lead 23 is disposed in the through hole 212 .
  • the conductor lead 23 includes a first end 231 and a second end 232 , the first end 231 is electrically connected to the electrode 24 , and the second end 232 is used for connecting the power supply assembly 2 .
  • the first end 231 of the conductor lead 23 is electrically connected to the electrode 24
  • the second end 232 is electrically connected to the pad 25 .
  • FIG. 11 is a schematic side sectional view of the connection between the conductor lead and the substrate according to an embodiment of the present application
  • Fig. 12 is a structural sectional view of the first embodiment of the conductor lead provided by the present application
  • Fig. 13 is The structural sectional view of the second embodiment of the conductor lead provided by the present application
  • FIG. 14 is the structural sectional view of the third embodiment of the conductor lead provided by the present application
  • FIG. 15 is the structural sectional view of the connection structure of the base body and the conductor lead provided by the present application.
  • the conductor leads 23 , the electrodes 24 and the pads 25 are all arranged in the through holes 212 , and all are sintered by filling the conductive paste in the through holes 212 preparation.
  • the wire diameter of the conductor leads 23 is 0.1-1mm.
  • the material used for the conductor leads 23 is one or more of Ag, Cu, and Au, which can be specifically designed according to requirements, which is not limited in this application.
  • the most conductive metal or alloy material such as one or more combinations of Ag, Cu, Au, etc.
  • the metal or alloy material is used to fill the metal or alloy material with a paste form metal screen printing into the through hole 212 , and matched and co-fired with the porous ceramic substrate 21 to form an integrated structure of the conductor lead 23 , the electrode 24 and the pad 25 and the substrate 21 .
  • the integrated structure may be a non-detachable structure. Specifically, the integrated structure is neither a structure in which a hole is inserted into a lead wire, nor a structure in which the base body 21 and the conductor lead wire 23 are engaged. At the same time, the integrated structure is different from the integrally formed structure, but an indivisible and non-detachable structure formed by co-sintering the base body 21 and the slurry form of the metal or alloy material.
  • the characteristics of the matched co-fired conductor lead 23 are as follows: the conductor lead 23 penetrates up and down to connect the electrode 24 and the pad 25 , the DC resistance is below 0.1 ⁇ ; the conductor lead 23 has a wire diameter of 0.1-1 mm.
  • the solid portion of the conductor lead 23 occupies more than 50% of the volume of the through hole 212 , that is, the conductor lead 23 can be a hollow or solid conductor, but the minimum filling rate is 50%.
  • the inside of the conductor lead 23 may be a dense structure, as shown in FIG. 12 .
  • the inside of the conductor lead 23 may also have a void 235 , the void 235 is a bubble naturally formed during the process of filling the through hole 212 with a metal or alloy material in the form of a metal silk screen to form the conductor lead 23 .
  • Conductor leads 23 are matched and co-fired with porous ceramic substrate 21 to form an integrated structure.
  • the molded conductor leads 23 and through holes 212 of the substrate 21 are co-fired and inlaid.
  • the reliability of the conductor lead 23 is improved. Different from the lead wires in the prior art, which are arranged outside the base body 21, or partially inside the base body 21, and partly outside the base body 21, it solves the problem that the conductor lead wires 23 are easily broken or pulled and damaged during the production and assembly process.
  • the hole 235 may be a through hole or a blind hole. As shown in FIG. 13 , the hole 235 may be an irregular hole shape existing in the conductor lead 23 . As shown in FIG. 14, the pores 235 may exist on the surface of the conductor lead 23, or may exist inside the conductor lead 23. It is a paste form of a metal or alloy material, and the metal silk screen is filled into the through hole 212 to sinter the naturally formed air bubbles. , its shape and size can be any form, which is not limited in this application.
  • the sidewalls of the through holes 212 opened therein are uneven.
  • the side wall of the conductor lead 23 has a protrusion 236, and the side wall of the through hole 212 has a recess 2121, and the protrusion 236 is embedded in the recess 2121, so that the edge where the conductor lead 23 is combined with the base 21 is uneven.
  • the burrs make the combination stronger, prevent the conductor lead 23 from falling off from the base 21, and have high stability.
  • the sidewalls of the conductor leads 23 and the sidewalls of the through hole 212 may also be in a smooth state, which is not limited in the present application.
  • the bottom of the pad 25 is provided with a thimble 26 in direct contact with the pad 25 for conducting the heating element 22 and the power component 2 .
  • its stress direction is longitudinal, that is, the direction from the first surface 213 to the second surface 214 .
  • the inter-embedded structure of the substrate 21 and the conductor lead 23 can play a position-limiting role, enhance the stability of the conductive contact between the two, and at the same time have excellent mechanical properties, preventing the conductor lead 23 from falling off the substrate 21. Conduction is also more stable.
  • the atomizing core disclosed in the present application includes a base body, a heating element and a conductor lead.
  • the base body has an atomization surface and a through hole extending to the atomization surface; the base body is used to guide the aerosol-generating substrate to the atomization surface;
  • the heating element is arranged on the atomizing surface for heating and atomizing the aerosol generating substrate to generate aerosol; the conductor lead is arranged in the through hole and fixed with the substrate to form an integral structure; wherein the conductor The first end of the lead wire is electrically connected with the heating body, and the second end is used for connecting the power supply assembly.

Abstract

一种雾化芯、雾化器及电子雾化装置，雾化芯（20）包括基体（21）、发热体（22）和导体引线（23），基体（21）具有雾化面（211）以及延伸至雾化面（211）的通孔（212）；基体（21）用于将气溶胶产生基质导流至雾化面（211）；发热体（22）设置于雾化面（211）上，用于加热并雾化气溶胶产生基质以产生气溶胶；导体引线（23）设置于通孔（212）内，与基体（21）固定形成一体结构；导体引线（23）的第一端与发热体（22）电连接，第二端用于连接电源组件（2）。该雾化芯通过将导体引线（23）设置在基体（21）内，改变了发热体（22）与电源组件（2）连接的方向，避免导体引线（23）遮挡雾化面（211），解决了雾化芯（20）的导体引线（23）和基体（21）接触稳定性较差，容易损坏的问题，最大程度地提升了雾化转换效率。

Description

雾化芯、雾化器及电子雾化装置 【技术领域】
本申请涉及雾化器技术领域，具体是涉及一种雾化芯、雾化器及电子雾化装置。
【背景技术】
相关技术中电子雾化装置主要由雾化器和电源组件构成。其中，雾化器中的雾化芯是核心部件，雾化芯主要包括陶瓷雾化芯和导液棉雾化芯。传统的陶瓷雾化芯是陶瓷基体表面丝印、烧结一层发热膜电阻以及烧附一组与电源连接的导体引线。然而，该陶瓷雾化芯的导体引线和基体接触稳定性较差，容易损坏。
【发明内容】
有鉴于此，本申请提供一种雾化芯、雾化器及电子雾化装置，以解决现有技术中陶瓷雾化芯的导体引线和基体接触稳定性较差，容易损坏的问题。
为了解决上述技术问题，本申请提供的第一个技术方案为：提供一种雾化芯，包括基体、发热体和导体引线，基体具有雾化面以及延伸至所述雾化面的通孔；所述基体用于将气溶胶产生基质导流至所述雾化面；发热体设置于所述雾化面上，用于加热并雾化所述气溶胶产生基质以产生气溶胶；导体引线设置于所述通孔内，与所述基体固定形成一体结构；其中，所述导体引线的第一端与所述发热体电连接，第二端用于连接电源组件。
其中，所述导体引线的侧壁具有凸起，所述通孔的侧壁具有凹陷，所述凸起嵌设在所述凹陷内。
其中，所述导体引线为实心导体，或所述导体引线内部具有孔隙。
其中，所述导体引线的实体部分占所述通孔的体积的50％以上。
其中，所述基体具有相对设置的第一表面和第二表面，所述第一 表面为所述雾化面；所述通孔从所述第一表面延伸至所述第二表面。
其中，所述通孔为垂直于所述第一表面的直通孔。
其中，雾化芯还包括电极和焊盘，电极设置于所述第一表面且与所述发热体电连接；焊盘设置于所述第二表面，用于连接电源组件；
其中，所述导体引线的第一端与所述电极电连接，第二端与所述焊盘电连接。
其中，所述导体引线的线径为0.1-1mm；和/或，所述导体引线采用的材料为Ag、Cu以及Au中的一种或多种。
其中，所述基体为多孔基体；所述基体的孔隙率为30-80％；和/或，所述基体孔隙的孔径范围为10-200um。
其中，所述导体引线通过在所述通孔内填充导电浆料后烧结的方法制备。
其中，所述基体具有相对设置的第一表面和第二表面，以及连接所述第一表面和所述第二表面的侧面；所述第一表面为所述雾化面；所述通孔从所述第一表面延伸至所述侧面。
为了解决上述技术问题，本申请提供的第二个技术方案为：提供一种雾化器，包括壳体和雾化芯。壳体具有容置腔；雾化芯设置于所述容置腔内，并与所述壳体配合形成储液腔；所述雾化芯用于在通电时加热并雾化来自所述储液腔的气溶胶产生基质以形成气溶胶；其中，所述雾化芯为上述任一项所述的雾化芯。
为了解决上述技术问题，本申请提供的第三个技术方案为：提供一种电子雾化装置，包括雾化器和电源组件；其中，所述雾化器为上述任一项所述的雾化器；电源组件与所述雾化器的导体引线电连接，用于向所述雾化器供电。
本申请的有益效果：区别于现有技术，本申请的雾化芯包括基体、发热体和导体引线，基体具有雾化面以及延伸至所述雾化面的通孔；基体用于将气溶胶产生基质导流至所述雾化面；发热体设置于所述雾化面上，用于加热并雾化所述气溶胶产生基质以产生气溶胶；导体引线设置于所述通孔内，与基体固定形成一体结构；其中，所述导体引线的第一端与所述发热体电连接，第二端用于连接电源组件。本申请 通过将导体引线设置在基体内与基体形成一体结构，改变了发热体与电源连接的方向，避免引线遮挡雾化面，解决了陶瓷雾化芯的导体引线和基体接触稳定性较差，容易损坏的问题，最大程度地提升了雾化转换效率。
【附图说明】
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图。
图1是本申请提供的电子雾化装置的结构示意图；
图2是本申请提供的雾化器的结构示意图；
图3是本申请提供的一实施例中的雾化芯的结构示意图；
图4是图3提供的雾化芯的前视结构示意图；
图5是图3提供的雾化芯的仰视结构示意图；
图6是图5提供的雾化芯的A-A向的第一实施例的剖视图；
图7是图5提供的雾化芯的A-A向的第二实施例的剖视图；
图8是图5提供的雾化芯的A-A向的第三实施例的剖视图；
图9是图5提供的雾化芯的A-A向的第四实施例的剖视图；
图10是本申请提供的另一实施例中的雾化芯的结构示意图；
图11是本申请提供的一实施例的导体引线和基体连接的侧剖示意图；
图12是本申请提供的导体引线的第一实施例的结构剖视图；
图13是本申请提供的导体引线的第二实施例的结构剖视图；
图14是本申请提供的导体引线的第三实施例的结构剖视图；
图15是本申请提供的基体和导体引线的连接结构剖视图。
【具体实施方式】
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本申请的一部 分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请中的术语“第一”、“第二”、仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”、的特征可以明示或者隐含地包括至少一个该特征。本申请实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。此外，术语“包括”和“具有”以及它们任何变形，意图在于覆盖不排他的包含。例如包含了一系列步骤或单元的过程、方法、系统、产品或设备没有限定于已列出的步骤或单元，而是可选地还包括没有列出的步骤或单元，或可选地还包括对于这些过程、方法、产品或设备固有的其它步骤或单元。在本文中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是，本文所描述的实施例可以与其它实施例相结合。
请参阅图1，图1是本申请提供的电子雾化装置的结构示意图。
电子雾化装置包括雾化器1和电源组件2，电源组件2与雾化器1连接，用于向雾化器1供电。电子雾化装置可用于液态基质的雾化。雾化器1用于存储液态气溶胶产生基质并雾化气溶胶产生基质以形成可供用户吸食的气溶胶，液态气溶胶产生基质可以是药液、植物草叶类气溶胶产生基质等液态基质。雾化器1具体可用于不同的领域，比如医疗、美容、休闲吸食等。电源组件2包括电池(图未示)、气流传感器(图未示)以及控制器(图未示)等；电池用于为雾化器1供电并控制雾化芯20加热的功率、加热时长等，以使得雾化器1能够雾化气溶胶产生基质形成气溶胶。气流传感器用于检测电子雾化装置中的气流变化，控制器根据气流传感器检测到的气流变化启动电子 雾化装置。雾化器1与电源组件2可以是一体设置，也可以是可拆卸连接，根据具体需要进行设计。
请参阅图2，图2是本申请提供的雾化器的结构示意图。
雾化器1包括壳体10和雾化芯20，壳体10具有容置腔11。雾化芯20和壳体10可以为一体设置的不可拆卸连接，也可以为可拆卸连接。在本实施例中，雾化芯20和壳体10为可拆卸连接，且雾化芯20与壳体10直接连接，使得雾化芯20与壳体10之间不需要引入额外的导管即可实现可拆卸连接，减小雾化器1的体积，使用更加方便。可以理解，本申请的雾化器1为便携式雾化器。雾化芯20设置于容置腔11内，并与壳体10配合形成储液腔12，用于存储气溶胶产生基质。雾化芯20可用于不同的领域，比如，药品雾化、油叶花草液体雾化等领域，用于在通电时加热并雾化来自储液腔12的气溶胶产生基质以形成气溶胶。雾化器1还可以包括安装座(图未标)，用于安装雾化芯20。
具体地，雾化芯20的外壁面上设置有凸起(图未示)，壳体10的外壁面上设置有滑槽(图未示)，滑槽中设置有限位块(图未示)；将雾化芯20上的凸起对准壳体10上的滑槽插入，旋转雾化芯20或壳体10，使凸起被滑槽中的限位块限位，实现雾化芯20和壳体10的固定，进而实现雾化芯20和壳体10的可拆卸连接。可以理解的是，也可以在壳体10的外壁面上设置有凸起，雾化芯20的外壁面上设置有滑槽，滑槽中设置有限位块，实现雾化芯20和壳体10的可拆卸连接；也可以采用磁吸的方式实现雾化芯20和壳体10的可拆卸连接；只需实现雾化芯20和壳体10的可拆卸连接即可，具体实施方式不做限定。
在一实施例中，雾化芯20的雾化面朝上，可以提高雾化量。当雾化面朝上时，雾化芯20的引脚(图未示)可以设置在雾化芯20的任何位置，而本实施例中将引脚向下设置，可以方便雾化器1的自动化组装。雾化芯20远离电源组件2的一侧设有抽吸通道30，抽吸通道30与雾化腔201连通。抽吸通道30远离电源组件2的一侧的抽吸口31与大气连通，以使雾化腔201中的气溶胶能通过抽吸通道30流 出，并从抽吸口31提供给用户吸食。
请参阅图3和图4，图3是本申请提供的一实施例中的雾化芯的结构示意图，图4是图3提供的雾化芯的前视结构示意图。
在一实施例中，雾化芯20包括基体21、发热体22和导体引线23。
具体的，基体21可以为多孔基体或打孔的致密基体，其中多孔基体具体可以是多孔陶瓷基体，打孔的致密基体可以是打孔的玻璃基体或致密陶瓷基体等。本实施例中的基体21为多孔陶瓷。多孔陶瓷材料一般是由骨料、粘结剂及造孔剂等组分经高温烧结的陶瓷材料，其内部具有大量彼此连通并与材料表面连通的孔道结构。由于多孔陶瓷材料具有孔隙率高、化学性质稳定、比表面积大、体积密度小、导热性低以及耐高温耐腐蚀等优良性能，在冶金、生物、能源、环保等领域有着众多应用。
基体21可以呈平板状或阶梯状等，本申请对此不做具体限制。基体21具有第一表面213和第二表面214，第一表面213为基体21朝向储液腔12一侧的表面，第二表面214为基体21背离第一表面213的一侧的表面。其中第一表面213和第二表面214均可以是平整的平面，第一表面213和第二表面214还可以是曲面等非规则的面，本申请对此不做具体限制。例如，基体21的第一表面213一侧设有凹槽(图未示)，则该凹槽的表面也属于第一表面213。
基体21具有雾化面211以及延伸至雾化面211的通孔212，用于将气溶胶产生基质导流至雾化面211。在本实施例中，基体21的孔隙率为30-80％，和/或，基体21的孔隙的孔径范围为10-200um；可以理解，基体21的孔隙率越高，其导液速度越快；同时，基体21的孔隙的孔径与导体引线23的凸起关联。该范围可以使得导体引线23与基体21的匹配率最高，同时便于导体引线23导电以及基体21对气溶胶产生基质进行导流。在本实施例中，导通孔212的孔径为0.1-1mm。在其他实施例中，通孔212的孔径和基体21的孔隙率可以根据需要设置，本申请对此不做限制。
请参阅图5至图8，图5是图3提供的雾化芯的仰视结构示意图， 图6是图5提供的雾化芯的A-A向的第一实施例的剖视图，图7是图5提供的雾化芯的A-A向的第二实施例的剖视图，图8是图5提供的雾化芯的A-A向的第三实施例的剖视图，图9是图5提供的雾化芯的A-A向的第四实施例的剖视图。
在一实施例中，基体21具有第一表面213、第二表面214和侧面215，第二表面214与第一表面213相背设置，侧面215连接第一表面213和第二表面214。通常而言，第一表面213可用于与储液腔12相通的气溶胶产生基质接触，第二表面214可用于与气体接触，这里说的气体接触可以是第二表面214与外部空气接触、与雾化腔201内空气接触或者与抽吸通道30中空气接触等。
在本实施例中，位于基体21的第二表面214一侧的气溶胶产生基质经由基体21内部的大量彼此连通并与材料表面连通的孔道结构渗透至基体21的第一表面213所在的一侧，发热体22设置于第一表面213上，以雾化渗透至第一表面213的气溶胶产生基质。侧面215上也连通有孔道结构，因而侧面215也可以用于导液或通气。
如图3和图4所示，在第一实施例中，基体21具有相对设置的第一表面213和第二表面214，第一表面213为雾化面211。通孔212从第一表面213延伸至第二表面214，可以方便从侧面215吸液进行气溶胶雾化，同时也可以从第二表面214吸液进行气溶胶雾化。
在第一实施例中，通孔212为垂直于第一表面213的直通孔，可以便于制备通孔。当通孔212为与第一表面213垂直的直通孔时，可以方便对原材料一次性进行多孔打孔，然后切割成多个基体21，同时也方便模具进行制备，效率高。
在第二实施例中，基体21也具有相对设置的第一表面213和第二表面214，以及连接第一表面213和第二表面214的侧面215；其中，第一表面213为雾化面211，通孔212可以从第一表面213延伸至侧面215。具体的，如图7所示，通孔212可以是以斜向孔的结构延伸至侧面215，即，通孔212是方向朝向侧面215的直孔。
如图8所示，在第三实施例中，通孔212也可以是连接第一表面213与侧面215的带拐角的通孔。当通孔212从第一表面213延伸至 侧面215进行打孔时，模具不容易出模，且不能同时进行多孔打孔，打孔效率比较低。但是，通孔212从第一表面213延伸至侧面215的结构，可以实现从第二表面214进行吸液，适用于朝下雾化的雾化器。实际使用中可以根据需要进行设置，本申请对此不做限制。
如图9所示，在第四实施例中，通孔212也可以是与第一表面213或者侧面215呈一定斜角的直通孔/非直通孔。当通孔212为呈一定斜角的直通孔/非直通孔时，同样的，模具不容易出模，且不能同时进行多孔打孔，打孔效率低。但是，可以从第二表面214进行吸液，适用于朝下雾化的雾化器，具体可以根据需要进行设置。可以理解，通孔212可以为一个或多个，延伸方向可以平行或不平行，只要与导体引线23的数量相匹配即可，本申请对此不做限制。
如图3和图4所示，发热体22设置于雾化面211上，发热体22用于雾化经基体21导出的气溶胶产生基质。雾化面211吸收发热体22的热量，从而用于在通电时加热并雾化气溶胶产生基质以产生气溶胶。在本实施例中，发热体22采用金属发热膜，其导热效果好。在其他实施例中，发热体22也可以是发热涂层、发热线路、发热片或发热网中的至少一种，本申请对此不做限制。
在本实施例中，选用多孔陶瓷材料制作基体21，位于基体21一侧的气溶胶产生基质经由多孔陶瓷材料内部的大量彼此连通并与材料表面连通的孔道结构渗透至基体21的另一侧，且与设置于基体21的一侧面上的发热体22相接触，从而将气溶胶产生基质雾化为气溶胶。
如图3所示，在一实施例中，发热体22为S型，发热体22可以为一体成型结构或可拆分结构，具体可以根据需要设置。在本实施例中，发热体22采用的金属发热膜厚度为50-120um，发热效率高，热传导率高，可以提高气溶胶产生基质的雾化效率。在其他实施例中，发热体22也可以为矩形、椭圆形或圆形等，且发热体22的厚度、大小、数量等均可以根据需要进行设置，本申请对此不做限制。
如图3所示，在一实施例中，雾化芯20还包括电极24和焊盘25，电极24设置于第一表面213上，且与发热体22电连接。焊盘 25设置于第二表面214上，用于连接电源组件2。
具体的，电极24包括第一电极241和第二电极242，第一电极241和第二电极242间隔设置，且均连接发热体22。发热体22用于雾化经基体21导出的气溶胶产生基质。具体的，发热体22可以是发热涂层、发热线路、发热片或发热网中的至少一种，发热体22通过电极24与电源组件2电连接。第一电极241和第二电极242可以设置在雾化面211上的一部分区域，也可以延伸至雾化面211的边缘，本申请对此不做限制。
具体的，如图3所示，焊盘25可以设置为一个或多个，可以设置为圆柱形或者长方体，具体可以根据需要进行设置，但是需要与导体引线23的数量相匹配。导体引线23的一端连接电极24，另一端连接焊盘25。在本实施例中，焊盘25为两个，包括第一焊盘251和第二焊盘252，且第一焊盘251和第二焊盘252间隔设置。第一焊盘251和第二焊盘252分别与两个导体引线23进行连接，导体引线23上下贯通电极24和焊盘25。具体的，导体引线23包括第一导体引线233和第二导体引线234，第一导体引线233上下贯通第一电极241和第一焊盘251，第二导体引线234上下贯通第二电极242和第二焊盘252，且第一导体引线233和第二导体引线234的两端分别与第一电极241/第二电极242和第一焊盘251/第二焊盘252电连接。在其他实施例中，焊盘25也可以设置于侧面215上，该设置方式可以避免导体引线23弯折和遮挡第二表面214吸液。因此，可以根据具体需要设置焊盘25的具体位置，本申请对此不做限制。
请参阅图10，图10是本申请提供的另一实施例中的雾化芯的结构示意图。
如图10所示，在另一实施例中，发热体22为两端宽、中间逐渐递减的腰型，发热体22的两端分别连接第一电极241和第二电极242，第一电极241和第二电极242间隔设置，且均连接腰型发热体22的两端。另外，基体21的第二表面214上设置第一焊盘251和第二焊盘252，其中，第一焊盘251和第二焊盘252间隔设置。第一导体引线233分别连接第一电极241和第一焊盘251，第二导体引线234分 别连接第二电极242和第二焊盘252。在本实施例中，腰型的发热体22采用的金属发热膜厚度为10-50um，发热效率高，热传导率高，可以提高气溶胶产生基质的雾化效率。
可选的，第一电极241和第一焊盘251可以是投影层叠的相同大小的电极和焊盘，也可以为不同大小的电极和焊盘。在一些实施例中，为投影层叠的相同的结构设置，该两个区域可以通过同一印刷网进行印刷，制备方便。
如图3、图4和图10所示，在一实施例中，导体引线23设置于通孔212内。其中，导体引线23包括第一端231和第二端232，第一端231与电极24电连接，第二端232用于连接电源组件2。具体的，导体引线23的第一端231与电极24电连接，第二端232与焊盘25电连接。
请参阅图11至图15，图11是本申请提供的一实施例的导体引线和基体连接的侧剖示意图，图12是本申请提供的导体引线的第一实施例的结构剖视图，图13是本申请提供的导体引线的第二实施例的结构剖视图，图14是本申请提供的导体引线的第三实施例的结构剖视图，图15是本申请提供的基体和导体引线的连接结构剖视图。
如图11至图15所示，在一实施例中，导体引线23、电极24和焊盘25均设置在通孔212中，且均是通过在通孔212内填充导电浆料后烧结的方法制备。可选的，导体引线23的线径为0.1-1mm。导体引线23采用的材料为Ag、Cu以及Au中的一种或多种，具体可以根据需要进行设计，本申请对此不做限制。
具体的，在本实施例中，使用导电性最优的金属或者合金材料，如Ag、Cu、Au等其中的一种或多种组合，通过将该金属或者合金材料的浆料形态金属丝印填充到通孔212内，与多孔结构陶瓷基体21进行匹配共烧，形成导体引线23、电极24和焊盘25与基体21的一体结构。该一体结构可以为不可拆卸结构，具体的，该一体结构不是打孔插入引线的结构，也不是基体21与导体引线23进行卡合的结构。同时，该一体结构不同于一体成型结构，而是将基体21与金属或者合金材料的浆料形态共同烧结形成的不可分割、不可拆卸的结构。
匹配共烧后的导体引线23呈现的特点有：导体引线23上下贯通连接电极24与焊盘25，直流电阻为0.1Ω以下；导体引线23的线径为0.1-1mm。导体引线23的实体部分占通孔212的体积的50％以上，即导体引线23可以为空心或者实心导体，但是最低填充率为50％。具体的，导体引线23的内部可以为致密结构，如图12所示。导体引线23的内部也可以具有孔隙235，该孔隙235是由金属或者合金材料的浆料形态金属丝印填充到该通孔212内形成导体引线23的过程中自然形成的气泡。导体引线23与多孔陶瓷结构的基体21匹配共烧后形成一体结构，成型后的导体引线23与基体21的通孔212是共烧镶嵌的形态，共烧定型后不可拆卸或脱落，极大地提升了导体引线23的可靠性。区别于现有技术中的引线设置于基体21外部，或者部分设置于基体21内部、部分设置于基体21外部，解决了导体引线23在生产和装配过程中容易折断或者拉扯损坏的问题。
孔隙235可以为通孔或者盲孔，如图13所示，该孔隙235可以为存在于导体引线23中的不规则的孔隙形状。如图14所示，该孔隙235可以存在于导体引线23的表面，也可以存在于导体引线23的内部，为金属或者合金材料的浆料形态金属丝印填充到通孔212内烧结自然形成的气泡，其形状和大小可以为任意形态，本申请对此不做限制。
如图15所示，由于基体21为多孔结构，使得其内部开设的通孔212的侧壁为凹凸不平的状态。在一实施例中，导体引线23的侧壁具有凸起236，通孔212的侧壁具有凹陷2121，凸起236嵌设在凹陷2121内，使得导体引线23与基体21结合的边缘为凹凸不平的毛边，结合更牢固，防止导体引线23从基体21脱落，稳定性高。在其他实施例中，导体引线23的侧壁和通孔212的侧壁也可以为光滑的状态，本申请对此不做限制。
在本实施例中，如图2、图3和图11所示，焊盘25的底部设置有与焊盘25直接接触的顶针26，用于导通发热体22与电源组件2。顶针26在工作时，其受力方向是纵向的，即从第一表面213到第二表面214的方向。在顶针26施加作用力的时候，基体21与导体引线 23的互嵌结构可以起到限位的作用，增强两者导电接触的稳定性，同时力学性能优异，防止导体引线23从基体21脱落，导电也更加稳定。
本申请公开的雾化芯包括基体、发热体和导体引线，基体具有雾化面以及延伸至所述雾化面的通孔；基体用于将气溶胶产生基质导流至所述雾化面；发热体设置于所述雾化面上，用于加热并雾化所述气溶胶产生基质以产生气溶胶；导体引线设置于所述通孔内，与基体固定形成一体结构；其中，所述导体引线的第一端与所述发热体电连接，第二端用于连接电源组件。本申请通过将导体引线设置在基体内与基体形成一体结构，改变了发热体与电源连接的方向，避免引线遮挡雾化面，解决了陶瓷雾化芯的导体引线和基体接触稳定性较差，容易损坏的问题，最大程度地提升了雾化转换效率。
以上所述仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (13)

  1. 一种雾化芯，其中，包括：
    基体，具有雾化面以及延伸至所述雾化面的通孔；所述基体用于将气溶胶产生基质导流至所述雾化面；
    发热体，设置于所述雾化面上，用于加热并雾化所述气溶胶产生基质以产生气溶胶；
    导体引线，设置于所述通孔内，与所述基体固定形成一体结构；其中，所述导体引线的第一端与所述发热体电连接，第二端用于连接电源组件。
  2. 根据权利要求1所述的雾化芯，其中，所述导体引线的侧壁具有凸起，所述通孔的侧壁具有凹陷，所述凸起嵌设在所述凹陷内。
  3. 根据权利要求1所述的雾化芯，其中，所述导体引线为实心导体；或所述导体引线内部具有孔隙。
  4. 根据权利要求1所述的雾化芯，其中，所述导体引线的实体部分占所述通孔的体积的50％以上。
  5. 根据权利要求1所述的雾化芯，其中，所述基体具有相对设置的第一表面和第二表面，所述第一表面为所述雾化面；所述通孔从所述第一表面延伸至所述第二表面。
  6. 根据权利要求5所述的雾化芯，其中，所述通孔为垂直于所述第一表面的直通孔。
  7. 根据权利要求5所述的雾化芯，其中，还包括：
    电极，设置于所述第一表面且与所述发热体电连接；
    焊盘，设置于所述第二表面，用于连接电源组件；
    其中，所述导体引线的第一端与所述电极电连接，第二端与所述焊盘电连接。
  8. 根据权利要求1所述的雾化芯，其中，所述导体引线的线径为0.1-1mm；和/或，
    所述导体引线采用的材料为Ag、Cu以及Au中的一种或多种。
  9. 根据权利要求1所述的雾化芯，其中，所述基体为多孔基体； 所述基体的孔隙率为30-80％；
    和/或，所述基体孔隙的孔径范围为10-200um。
  10. 根据权利要求1所述的雾化芯，其中，所述导体引线通过在所述通孔内填充导电浆料后烧结的方法制备。
  11. 根据权利要求1所述的雾化芯，其中，所述基体具有相对设置的第一表面和第二表面，以及连接所述第一表面和所述第二表面的侧面；所述第一表面为所述雾化面；所述通孔从所述第一表面延伸至所述侧面。
  12. 一种雾化器，其中，包括：
    壳体，具有容置腔；
    雾化芯，设置于所述容置腔内，并与所述壳体配合形成储液腔；所述雾化芯用于在通电时加热并雾化来自所述储液腔的气溶胶产生基质以形成气溶胶；其中，所述雾化芯为如权利要求1所述的雾化芯。
  13. 一种电子雾化装置，其中，包括：
    雾化器；其中，所述雾化器为如权利要求12所述的雾化器；
    电源组件，与所述雾化器的导体引线电连接，用于向所述雾化器供电。
PCT/CN2021/136172 2021-12-07 2021-12-07 雾化芯、雾化器及电子雾化装置 WO2023102746A1 (zh)

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CN111920104A (zh) * 2020-07-28 2020-11-13 深圳麦克韦尔科技有限公司 雾化芯、雾化器及电子雾化装置
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JP2012222328A (ja) * 2011-04-14 2012-11-12 Kyocera Corp 配線基板およびその製造方法
CN111920104A (zh) * 2020-07-28 2020-11-13 深圳麦克韦尔科技有限公司 雾化芯、雾化器及电子雾化装置
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