WO2023099015A1 - Procédé de préparation de composés organosilicés contenant des groupes organyloxy - Google Patents

Procédé de préparation de composés organosilicés contenant des groupes organyloxy Download PDF

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WO2023099015A1
WO2023099015A1 PCT/EP2021/084241 EP2021084241W WO2023099015A1 WO 2023099015 A1 WO2023099015 A1 WO 2023099015A1 EP 2021084241 W EP2021084241 W EP 2021084241W WO 2023099015 A1 WO2023099015 A1 WO 2023099015A1
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radical
radicals
component
organosilicon compound
different
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PCT/EP2021/084241
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German (de)
English (en)
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Peter Schöley
Zhou Zhou
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Wacker Chemie Ag
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Priority to PCT/EP2021/084241 priority Critical patent/WO2023099015A1/fr
Publication of WO2023099015A1 publication Critical patent/WO2023099015A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C08G77/382—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon
    • C08G77/388—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C08K5/5477—Silicon-containing compounds containing nitrogen containing nitrogen in a heterocyclic ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups

Definitions

  • the present invention relates to a process for the preparation of organosilicon compounds containing organyloxy groups and to their use in compositions which crosslink at room temperature.
  • RTV1 sealing compounds ie one-component sealing compounds which can be stored in the absence of water and harden to form elastomers when exposed to water at room temperature, and processes for their production are already known.
  • diorganopolysiloxanes containing OH end groups are very often mixed with acetoxysilanes and other components of the mixture in one process step.
  • the production of RTV1 sealants, which harden by splitting off alcohols has to be carried out in two steps.
  • a first step the terminal silanol groups of linear diorganopolysiloxanes are reacted with alkoxysilanes (so-called end-capping reaction).
  • further mixture components such as fillers, plasticizers or catalysts are mixed in.
  • the viscosity of the reaction mixture can increase during these end-capping reactions of the first step. That is, the viscosity of the mixture at the end of the reaction is higher than at the beginning. This can be attributed to incipient crosslinking reactions. It is also known to those skilled in the art that the final viscosities achieved in such mixtures remain unchanged on storage.
  • EP 1735 369 B1 teaches the production of RTV1 sealing compounds based on so-called alpha-silanes.
  • the crosslinkable polydimethylsiloxanes are obtained by reacting terminal silanol groups with methylalkoxysilanes substituted in the alpha position.
  • n-Butyl lithium is used as the catalyst.
  • Recommended reaction temperatures are between 20 and 40°C.
  • the incorporation of fillers and other mixture components takes place 60 minutes after the start of the reaction. Catalysts are not always required for endcapping with so-called alpha-silanes because of the higher reactivity of alpha-alkyl-alkoxysilanes.
  • EP 2170 995 B1 describes RTV1 sealing compounds based on crosslinkable alpha-alkyl-alkoxysilanes.
  • the endcapping reaction described in the examples is carried out over a period of 15 to 20 minutes. Immediately afterwards, the fillers or other components of the RTV1 sealant are mixed in.
  • the invention relates to a process for preparing organyloxy-containing organosilicon compounds by reacting at least one silanol group-containing organosilicon compound (A) with at least two organyloxy groups-containing organosilicon compound (B), characterized in that component (A), component (B) and optionally further mixture components (C) are mechanically mixed with one another and the mixture is heated over a period of at least 60 minutes, preferably 75 to 1800 minutes, particularly preferably 90 to 360 minutes, at temperatures above 45° C. preferably 50 to 120°C, more preferably 60 to 90°C.
  • the organosilicon compounds (A) containing silanol groups used according to the invention are preferably those containing units of the formula (I), where R is identical or different SiC-bonded, optionally substituted hydrocarbon radicals, a is 0, 1, 2 or 3, preferably 1 or 2, and b is 0, 1 or 2, preferably 0 or 1, with the proviso that the The sum of a+b ⁇ 4 and at least one unit of the formula (I) where b is different from 0 is present per molecule.
  • the organosilicon compounds (A) used according to the invention are preferably organopolysiloxanes, in particular those consisting of units of the formula (I).
  • organopolysiloxanes is intended to include both polymeric and oligomeric siloxanes.
  • R examples include alkyl radicals, such as methyl, ethyl, n-propyl, isopropyl, 1-n-butyl, 2-n-butyl, isobutyl, tert-butyl, n -pentyl, isopentyl, neopentyl, tert-pentyl; hexyl radicals, such as the n-hexyl radical; heptyl radicals, such as the n-heptyl radical; Octyl radicals, such as the n-octyl radical and iso-octyl radicals, such as the 2,2,4-trimethylpentyl radical; nonyl radicals, such as the n-nonyl radical; decyl radicals, such as the n-decyl radical; dodecyl radicals, such as the n-dodecyl radical; octadecyl radicals, such as the n
  • substituted radicals R are haloalkyl radicals, such as 3,3,3-trifluoro-n-propyl radical, 2,2,2,2',2',2'-hexafluoroisopropyl radical, heptafluoroisopropyl radical and haloaryl radicals, such as the o-, m- and p-chlorophenyl radical; and ⁇ -functionalized propyl radicals, such as the 3-aminopropyl radical, 3-(2-aminoethyl)aminopropyl radical, 3-glycidoxypropyl radical, 3-mercaptopropyl radical and 3-methacryloxypropyl radical or alpha-functionalized methyl radicals, such as the N-cyclohexylaminomethyl radical.
  • haloalkyl radicals such as 3,3,3-trifluoro-n-propyl radical, 2,2,2,2',2',2'-hexafluoroisopropyl radical, hepta
  • the radical R is preferably a hydrocarbon radical having 1 to 18 carbon atoms which is optionally substituted with halogen atoms, amino groups, ether groups, ester groups, epoxy groups, mercapto groups, cyano groups or polyglycol radicals, the latter being composed of oxyethylene and/or oxypropylene units are built.
  • the radical R is particularly preferably a hydrocarbon radical having 1 to 8 carbon atoms, in particular the methyl radical.
  • the organosilicon compound (A) is preferably an organosilicon compound having one or two silanol groups.
  • the organosilicon compound (A) used according to the invention is particularly preferably an essentially linear organopolysiloxane.
  • the organosilicon compounds (A) are linear diorganopolysiloxanes having a silanol group at each chain end.
  • the organosilicon compounds (A) used according to the invention have a viscosity of preferably from 5 to 10 8 mPas, particularly preferably from 1000 to 350,000 mPas, in each case at 25°C.
  • organosilicon compounds (A) used according to the invention are HO(Si(CH 3 ) 2 O) 29-2000 Si(CH 3 ) 2 (CH 2 ) 3 NH 2 , HO(Si(CH 3 ) 2 O) 29- 2000 Si( CH3 ) 2 (OH), HO(Si( CH3 ) 2 O) 5-2000 Si( CH3 ) 3 , HO(Si(CH 3 ) 2 O) 0-100 Si(CH 3 ) 2 (CH 2 ) 3 O(CH 2 CH(CH 3 )O) 10-1000 (CH 2 ) 3 (Si(CH 3 ) 2 O) 0-100 Si(CH 3 ) 2 (OH), HO(Si(CH 3 ) 2 O) 3-500 Si [O(Si(CH 3 ) 2 O) 3-500 H] 3 and HO(Si (CH 3 ) 2 O) 3-500 Si(CH 3 )[O(Si(CH 3 ) 2 O) 3-500 H] 2 where HO(Si(CH 3
  • Organosilicon compounds (A) are commercially available products or can be prepared by processes customary in chemistry.
  • the organosilicon compound (B) used according to the invention and containing at least two organyloxy groups can be any previously known crosslinking agent with methylorganyloxysilanes substituted in the alpha position.
  • Component (B) is preferably one containing units of the formula (II), where A can be the same or different and is an organic radical bonded via nitrogen, oxygen, sulfur, boron or phosphorus, R 11 is identical or different, monovalent, optionally substituted hydrocarbon radicals, R 1 can be the same or different and are hydrogen or monovalent , is optionally substituted hydrocarbon radicals, R 2 can be the same or different and is a hydrocarbon radical which can be interrupted with oxygen atoms, d is 0, 1, 2 or 3, e is 0, 1, 2 or 3 and c is 0, 1 or 2, preferably 1, with the proviso that the sum of c+d+e ⁇ 4 and the organosilicon compound (B) has at least two radicals (OR 2 ).
  • A can be the same or different and is an organic radical bonded via nitrogen, oxygen, sulfur, boron or phosphorus
  • R 11 is identical or different, monovalent, optionally substituted hydrocarbon radicals
  • R 1 can be the same or different and are hydrogen or monovalent
  • radicals R 1 , R 2 and R 11 are, independently of one another, the examples given above for radical R.
  • the radical R 1 is preferably a hydrogen atom or a hydrocarbon radical having 1 to 20 carbon atoms, in particular a hydrogen atom.
  • the radical R 2 is preferably the methyl, ethyl and isopropyl radical, particularly preferably the methyl or ethyl radical, in particular the ethyl radical.
  • the radical R 11 is preferably an optionally substituted, monovalent hydrocarbon radical having 1 to 18 carbon atoms, particularly preferably an alkyl radical, the vinyl radical, the 3,3,3-trifluoroprop-1-yl radical or the phenyl radical. especially the methyl radical.
  • radicals R 3 and R 4 are hydrogen and the examples given for R above.
  • radicals R 5 , R 9 and R 10 are each independently the examples of hydrocarbon radicals given above for R.
  • the radical R 3 is preferably a methyl, ethyl, propyl, butyl, hexyl, phenyl, cyclohexyl or octyl radical.
  • the radical R 4 is preferably a methyl, ethyl, propyl, butyl, hexyl or octyl radical or a hydrogen atom.
  • the R 3 R 4 N- group particularly preferably forms a ring which, in particular, also contains oxygen or further nitrogen.
  • the radicals R 3 or R 4 can also form a ring with R 1 , although this is not preferred.
  • the R 5 radical is preferably the CH 3 (C ⁇ CH 2 )-(C ⁇ O)— radical or the CH 3 —O-(C ⁇ O)— radical.
  • the radical R 9 is preferably a methyl, ethyl, propyl, butyl, hexyl or octyl radical.
  • the radical R 10 is preferably a methyl, ethyl, propyl, butyl, hexyl or octyl radical.
  • radicals A are dimethylamino, diethylamino, dibutylamino, dihexylamino, n-hexylamino, octylamino, methylmercapto, ethylmercapto, ethoxy, N-cyclohexylamino, N- Phenylamino, the methacryloxy, the isocyanato, the N-morpholino, the N-pyrrolidino, the N-piperidino and the O-methylcarbamato radical.
  • radicals A are the radicals R 3 R 4 N- with R 3 and R 4 having one of the abovementioned meanings and very particularly preferably radicals R 3 HN- and those radicals R 3 R 4 N- in which the group R 3 R 4 N- is connected to form a ring, in particular R 3 HN- and those radicals R 3 R 4 N- in which the group R 3 R 4 N- is connected to form a ring which also contains oxygen or further nitrogen.
  • Ring-shaped radicals A equal to R 3 R 4 N- are preferably 3-, 4-, 5-, 6-, 7- or 8-membered heterocycles which, in addition to carbon and nitrogen, are phosphorus and phosphorus as ring-forming atoms /or oxygen and/or sulfur as a hetero atom, it also being possible for further rings to be fused.
  • the heterocycles on which these radicals A are based are particularly preferably 5- and 6-membered heterocycles which, in addition to the nitrogen atom present for bonding to the CR 12 radical of the compounds of the formula (I), have a further ring he - contain teratoma.
  • heterocycles on which the ring-shaped radicals A are based are aziridine, azetidine, pyrrole, pyrrolidine, 1,3-O-xazolidine, 1,3-thiazolidine, 1H-1,2-diazole, ⁇ 2 -1,2- Diazoline, ⁇ 4 - 1,2-diazoline, 1,3-diazole, ⁇ 2 -1,3-diazoline, ⁇ 4 -1,3-diazoline, 1,3- Diazolidine, 1,2,3-triazole, 1,2,4-triazole, tetrazole, ⁇ 4 -1,2-diazolin-3-one, piperidine, tetrahydro-1,4-oxazine, tetrahydro-1,4 - thiazine, hexahydro-1,3-diazine, hexahydro-1,4-diazine, 1-methyl-hexahydro-1,4-diazin
  • Pyrrolidine, piperidine, tetrahydro-1,4-oxazine, tetrahydro-1,4-thiazine, tetrahydro-1,4-diazine and 1-methyltetrahydro-1 are particularly preferred for heterocycles on which the ring-shaped radicals A are based.
  • component (B) examples are cyclohexylaminomethyltriethoxysilane, (N-cyclohexylaminomethyl)triethoxysilane, (N-cyclohexylaminomethyl)methyldiethoxysilane, (N-phenylaminomethyl)triethoxysilane, (N-phenylaminomethyl)methyldimethoxysilane, (methacryloxymethyl)triethoxysilane, (methacryloxymethyl)methyldiethoxysilane, (isocyanatomethyl)triethoxysilane, 1-(triethoxysilylmethyl)pyrrole, 1-(triethoxysilylmethyl)pyrrolidine, 3-(triethoxysilylmethyl)-1,3-oxazolidine, 3-(triethoxysilylmethyl)-1, 3-thiazolidine, 1-(triethoxysilylmethyl)piperidine and 4-(triethoxysilylmethyl)tetrahydro-1,4-
  • Component (B) is preferably dimethylaminomethyltriethoxysilane, diethylaminomethyltriethoxysilane, dipropylaminomethyltriethoxysilane, dibutylaminomethyltriethoxysilane, dihexylaminomethyltriethoxysilane, cyclohexylaminomethyltriethoxysilane, 4-(triethoxysilylmethyl)tetrahydro-1,4-oxazine, 4-(trimethoxysilylmethyl)tetrahydro-1, 4-oxazine or 4-(tripropoxysilylmethyl)tetrahydro-1,4-oxazine, where diethylaminomethyl- triethoxysilane, dibutylaminomethyltriethoxysilane, cyclohexylaminomethyltriethoxysilane or 4-(triethoxysilylmethyl)tetrahydro-1,4-oxazine are particularly
  • component (B) is preferably used in amounts of 0.1 to 200 parts by weight, particularly preferably in amounts of 1 to 50 parts by weight, in particular in amounts of 2 to 10 parts by weight, based in each case on 100 parts by weight Organosilicon compound (A) used.
  • Component (B) is preferably used in a stoichiometric excess, based on the number of silanol groups in (A).
  • the stoichiometric excess of (B), based on the number of silanol groups in (A) is particularly preferably greater than 1 and very particularly preferably greater than 3
  • Processes according to the invention that can be used are products that can influence the reaction rate, such as catalysts, or non-reactive plasticizers.
  • Component (C) is preferably a catalyst.
  • catalysts (C) which may be used are carboxylic acids, mineral acids, metal hydroxides, Lewis acids, amines, metal chelates and metal alkoxylates, such as those of titanium, or combinations thereof. If catalysts (C) are used in the process of the invention, the amounts involved are preferably from 0.0001 to 5 parts by weight, based in each case on 100 parts by weight of organosilicon compound (A).
  • non-reactive plasticizers (C) are polydimethylsiloxanes with trimethylsilyl end groups or linear, branched or cyclic hydrocarbon mixtures. In the process according to the invention, preferably no component (C) is used.
  • the components used in the process according to the invention can each be one type of such a component or a mixture of at least two types of a respective component.
  • the individual components can be mixed with one another in any order and in a previously known manner. Premixes can also be prepared from some components, such as a mixture of components (B) and component (C), which are then mixed with the other components.
  • the components (A), (B) and, if appropriate, (C) are mechanically mixed with one another in a mixing chamber of any desired design. It is irrelevant whether the individual components are heated beforehand, whether the temperature rise occurs during the mixing itself or whether the heating takes place up to 24 hours after the mixing.
  • the process according to the invention can be carried out continuously or batchwise, it is preferably carried out continuously.
  • the process according to the invention is preferably carried out at the pressure of the surrounding atmosphere, ie from 900 to 1100 hPa, or at pressures which result from the use of mixing systems result.
  • it is particularly preferred in the case of continuous operation to work at excess pressure, for example between 1100 and 40,000 hPa absolute pressure. In closed systems, these pressures generally result from the pressure during delivery and from the vapor pressure of the materials used at elevated temperatures.
  • the process according to the invention is preferably carried out with the exclusion of moisture, for example in dried air or in mixing units which are free of dead spaces.
  • the mixing chamber of the mixing unit used is preferably completely filled with mixture, so that there are no dead spaces.
  • the starting materials are heated by rapidly rotating mixing elements of a dynamic mixer, particularly preferably in a mixing space free of dead spaces, in particular in a continuous process.
  • the reaction mixture cools down at ambient temperature before further processing in storage containers of more than 1 m.sup.3.
  • the reaction mixture can be devolatilized, in which case the devolatilization is then preferably carried out at a pressure of from 1 to 200 hPa.
  • organosilicon compounds containing organyloxy groups can be prepared by the process according to the invention.
  • the organosilicon compounds produced according to the invention are preferably those with a viscosity of 1 to 1000 Pas, particularly preferably 10 to 100 Pas, in each case at 25.degree.
  • the organosilicon compounds containing organyloxy groups prepared according to the invention can be used for all purposes for which organosilicon compounds containing organyloxy groups have also previously been used. In particular, they are suitable for the production of compositions which can be crosslinked by a condensation reaction.
  • the constituents (D) customarily used to prepare compositions crosslinkable by condensation reaction are those selected from the group of crosslinkers, which can be the same compounds as component (B) described, condensation catalysts, adhesion promoters, fillers, plasticizers, stabilizers, dyes, fungicides and rheological additives.
  • the constituents (D) have already been described many times in the literature. In this regard, reference is made, for example, to EP-B1-1397 428 and EP-B1-1640 416, which are included in the disclosure of the present invention.
  • components (D) can be added to the components (A), (B) and optionally (C) used according to the invention individually or separately or divided into partial amounts at any time or after the end-cap according to the invention has ended. ping reaction are added, so that the crosslinkable masses with the organosilicon compounds containing organyloxy groups produced according to the invention as the base polymer can advantageously be produced in one reaction vessel. If the components (D) do not adversely affect the reaction of component (A) with component (B) in the context of the process according to the invention, they can be mixed with the components (A) and/or (B) before, during or after the temperature step become. This is often the case with plasticizers and adhesion promoters, for example.
  • the process according to the invention has the advantage that organosilicon compounds containing organyloxy groups can be prepared in a simple manner with short reaction times.
  • the process of the invention has the advantage that low-viscosity premixes are obtained when organopolysiloxanes (A) are endcapped with component (B).
  • the process according to the invention has the advantage that no additional components, such as non-reactive plasticizers, have to be used to reduce the viscosity.
  • the method according to the invention has the advantage that no waste products are produced that have to be disposed of.
  • the method according to the invention has the advantage that stable RTV1 sealing compounds can be produced.
  • the process of the invention has the advantage that the organosilicon compounds containing organyloxy groups produced according to the invention can be used immediately after production without prior isolation or post-processing, such as neutralization, filtration or deactivation of the catalyst by high temperatures, to produce crosslinkable Masses can be used.
  • the method according to the invention has the advantage that the good rubber-elastic properties of the RTV1 sealing compounds produced therefrom are fully retained.
  • the method according to the invention also has the advantage that it can be carried out continuously. In the examples below, all parts are by weight unless otherwise stated. Unless otherwise stated, the following examples are carried out at a pressure of the surrounding atmosphere, i.e.
  • Examples 1-3 In each case 350 g of an ⁇ , ⁇ -dihydroxypolydimethylsiloxane with a viscosity of 80,000 mPa ⁇ s were dissolved in a laboratory dissolver (measured at 25° C.) with 10.5 g of 4-(triethoxysilylmethyl)tetrahydro-1,4-oxazine, which were stored under the conditions given in Table 1, at a pressure of 100 mbar for the given in Table 1 Duration and specified speed in a laboratory mixer from PC Laborsysteme, then stored under the conditions specified in Table 1 and the viscosity measured 4 hours after mixing. More details and results can be found in Table 1.
  • Example 4 The starting materials described in Example 1, the temperature of which was 24° C., were continuously mixed through a DLM/S mixer from INDAG, Germany, at a speed of 900 rpm. min pumped at a pressure of 35 bar. The mass flow of the OH siloxane was 1000 kg/h and that of the silane 30 kg/h. Details and results can be found in Table 1.
  • Example 5 The procedure given in Example 1 is repeated, with the modification that 10.5 g of cyclohexylaminomethyltriethoxysilane are used instead of 10,54-(triethoxysilylmethyl)tetrahydro-1,4-oxazine. More details and results can be found in Table 2.
  • Example 6 The procedure given in Example 1 is repeated, with the modification that instead of 10,54-(triethoxysilylmethyl)tetrahydro-1,4-oxazine, 10.5 g of dibutylaminomethyl-triethoxy - silane are used. More details and results can be found in Table 2.
  • Comparative Example 2 (V2) The procedure described in Example 5 is repeated with the modification that the temperature does not exceed 27.degree. More details and results can be found in Table 2.
  • Comparative Example 3 (V3) The procedure described in Example 6 is repeated with the modification that the temperature does not exceed 31.degree. Details and results can be found in Table 2.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)

Abstract

La présente invention concerne un procédé de préparation de composés organosiliciés contenant des groupes organyloxy par réaction d'un composé organosilicié (A) contenant au moins un groupe silanol avec un composé organosilicié (B) contenant au moins deux groupes organyloxy, caractérisé en ce que le composant (A), le composant (B) et éventuellement d'autres composants du mélange (C) sont mélangés mécaniquement les uns avec les autres et que le mélange est exposé pendant une période d'au moins 60 minutes à des températures de plus de 45 °C. L'invention concerne également son utilisation pour la réticulation de composés à température ambiante.
PCT/EP2021/084241 2021-12-03 2021-12-03 Procédé de préparation de composés organosilicés contenant des groupes organyloxy WO2023099015A1 (fr)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1397428B1 (fr) 2001-05-03 2004-08-11 Wacker-Chemie GmbH Masses pouvant reticuler lors de la dissociation d'alcools composes de groupes terminaux alkoxysilyle en elastomeres
EP1640416B1 (fr) 2004-09-23 2007-06-27 Wacker Chemie AG Masses réticulables a base des composés d'organosilicium
EP1735369B1 (fr) 2004-04-14 2008-12-03 Henkel AG & Co. KGaA Polydiorganosiloxanes a cuisson rapide
CN101688061B (zh) * 2007-07-25 2013-08-14 瓦克化学股份公司 含有有机氧基团的有机硅化合物的制备方法
EP2176351B1 (fr) 2007-08-07 2013-09-18 Wacker Chemie AG Compositions réticulables à base de composés d'organosilicium
EP2064291B1 (fr) * 2006-09-18 2017-02-22 Dow Corning Corporation Charges, pigments et poudres minérales traités par des organopolysiloxanes

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1397428B1 (fr) 2001-05-03 2004-08-11 Wacker-Chemie GmbH Masses pouvant reticuler lors de la dissociation d'alcools composes de groupes terminaux alkoxysilyle en elastomeres
EP1735369B1 (fr) 2004-04-14 2008-12-03 Henkel AG & Co. KGaA Polydiorganosiloxanes a cuisson rapide
EP1640416B1 (fr) 2004-09-23 2007-06-27 Wacker Chemie AG Masses réticulables a base des composés d'organosilicium
EP2064291B1 (fr) * 2006-09-18 2017-02-22 Dow Corning Corporation Charges, pigments et poudres minérales traités par des organopolysiloxanes
CN101688061B (zh) * 2007-07-25 2013-08-14 瓦克化学股份公司 含有有机氧基团的有机硅化合物的制备方法
EP2170995B1 (fr) 2007-07-25 2014-10-29 Wacker Chemie AG Procédé de fabrication de composés organosilicium présentant des groupes organyloxy
EP2176351B1 (fr) 2007-08-07 2013-09-18 Wacker Chemie AG Compositions réticulables à base de composés d'organosilicium

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