WO2023095826A1 - グラフト共重合体及び熱可塑性樹脂組成物 - Google Patents
グラフト共重合体及び熱可塑性樹脂組成物 Download PDFInfo
- Publication number
- WO2023095826A1 WO2023095826A1 PCT/JP2022/043333 JP2022043333W WO2023095826A1 WO 2023095826 A1 WO2023095826 A1 WO 2023095826A1 JP 2022043333 W JP2022043333 W JP 2022043333W WO 2023095826 A1 WO2023095826 A1 WO 2023095826A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- mass
- thermoplastic resin
- graft copolymer
- parts
- ethylene
- Prior art date
Links
- 229920000578 graft copolymer Polymers 0.000 title claims abstract description 72
- 229920005992 thermoplastic resin Polymers 0.000 title claims description 81
- 239000011342 resin composition Substances 0.000 title claims description 32
- 239000000178 monomer Substances 0.000 claims abstract description 43
- 229920000573 polyethylene Polymers 0.000 claims abstract description 40
- 239000000203 mixture Substances 0.000 claims abstract description 26
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 10
- 229920000642 polymer Polymers 0.000 claims description 40
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 24
- 239000005977 Ethylene Substances 0.000 claims description 24
- 230000009477 glass transition Effects 0.000 claims description 14
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 12
- 229920005668 polycarbonate resin Polymers 0.000 claims description 8
- 239000004431 polycarbonate resin Substances 0.000 claims description 8
- 238000010559 graft polymerization reaction Methods 0.000 claims description 7
- 230000000379 polymerizing effect Effects 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 39
- 239000011347 resin Substances 0.000 description 39
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 36
- 239000007789 gas Substances 0.000 description 23
- 229920001577 copolymer Polymers 0.000 description 14
- 238000000465 moulding Methods 0.000 description 11
- -1 polyethylene Polymers 0.000 description 11
- 238000011109 contamination Methods 0.000 description 9
- 239000002245 particle Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 229920000515 polycarbonate Polymers 0.000 description 7
- 239000004417 polycarbonate Substances 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000004711 α-olefin Substances 0.000 description 6
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 230000032798 delamination Effects 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N 1-Heptene Chemical compound CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N 1-nonene Chemical compound CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 230000005526 G1 to G0 transition Effects 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- 239000000088 plastic resin Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- OJOWICOBYCXEKR-APPZFPTMSA-N (1S,4R)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound CC=C1C[C@@H]2C[C@@H]1C=C2 OJOWICOBYCXEKR-APPZFPTMSA-N 0.000 description 1
- HGXJDMCMYLEZMJ-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOOC(=O)C(C)(C)C HGXJDMCMYLEZMJ-UHFFFAOYSA-N 0.000 description 1
- PZWQOGNTADJZGH-SNAWJCMRSA-N (2e)-2-methylpenta-2,4-dienoic acid Chemical compound OC(=O)C(/C)=C/C=C PZWQOGNTADJZGH-SNAWJCMRSA-N 0.000 description 1
- OGQVROWWFUXRST-FNORWQNLSA-N (3e)-hepta-1,3-diene Chemical compound CCC\C=C\C=C OGQVROWWFUXRST-FNORWQNLSA-N 0.000 description 1
- PRBHEGAFLDMLAL-GQCTYLIASA-N (4e)-hexa-1,4-diene Chemical compound C\C=C\CC=C PRBHEGAFLDMLAL-GQCTYLIASA-N 0.000 description 1
- KYPOHTVBFVELTG-OWOJBTEDSA-N (e)-but-2-enedinitrile Chemical compound N#C\C=C\C#N KYPOHTVBFVELTG-OWOJBTEDSA-N 0.000 description 1
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 description 1
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- 229940005561 1,4-benzoquinone Drugs 0.000 description 1
- PRBHEGAFLDMLAL-UHFFFAOYSA-N 1,5-Hexadiene Natural products CC=CCC=C PRBHEGAFLDMLAL-UHFFFAOYSA-N 0.000 description 1
- VYXHVRARDIDEHS-UHFFFAOYSA-N 1,5-cyclooctadiene Chemical compound C1CC=CCCC=C1 VYXHVRARDIDEHS-UHFFFAOYSA-N 0.000 description 1
- 239000004912 1,5-cyclooctadiene Substances 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- YAJYJWXEWKRTPO-UHFFFAOYSA-N 2,3,3,4,4,5-hexamethylhexane-2-thiol Chemical compound CC(C)C(C)(C)C(C)(C)C(C)(C)S YAJYJWXEWKRTPO-UHFFFAOYSA-N 0.000 description 1
- BDOYKFSQFYNPKF-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]ethyl-(carboxymethyl)amino]acetic acid;sodium Chemical compound [Na].[Na].OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O BDOYKFSQFYNPKF-UHFFFAOYSA-N 0.000 description 1
- SLQMKNPIYMOEGB-UHFFFAOYSA-N 2-methylhexa-1,5-diene Chemical compound CC(=C)CCC=C SLQMKNPIYMOEGB-UHFFFAOYSA-N 0.000 description 1
- TVONJMOVBKMLOM-UHFFFAOYSA-N 2-methylidenebutanenitrile Chemical compound CCC(=C)C#N TVONJMOVBKMLOM-UHFFFAOYSA-N 0.000 description 1
- KTMNDTPAJZKQPF-UHFFFAOYSA-N 2-tert-butyl-4-[1-(3-tert-butyl-4-hydroxyphenyl)propyl]phenol Chemical compound C=1C=C(O)C(C(C)(C)C)=CC=1C(CC)C1=CC=C(O)C(C(C)(C)C)=C1 KTMNDTPAJZKQPF-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- CKNCVRMXCLUOJI-UHFFFAOYSA-N 3,3'-dibromobisphenol A Chemical compound C=1C=C(O)C(Br)=CC=1C(C)(C)C1=CC=C(O)C(Br)=C1 CKNCVRMXCLUOJI-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- NZGQHKSLKRFZFL-UHFFFAOYSA-N 4-(4-hydroxyphenoxy)phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=C(O)C=C1 NZGQHKSLKRFZFL-UHFFFAOYSA-N 0.000 description 1
- RQCACQIALULDSK-UHFFFAOYSA-N 4-(4-hydroxyphenyl)sulfinylphenol Chemical compound C1=CC(O)=CC=C1S(=O)C1=CC=C(O)C=C1 RQCACQIALULDSK-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- BRPSWMCDEYMRPE-UHFFFAOYSA-N 4-[1,1-bis(4-hydroxyphenyl)ethyl]phenol Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=C(O)C=C1 BRPSWMCDEYMRPE-UHFFFAOYSA-N 0.000 description 1
- OVVCSFQRAXVPGT-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)cyclopentyl]phenol Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCC1 OVVCSFQRAXVPGT-UHFFFAOYSA-N 0.000 description 1
- BRNNDPBHQNVHTA-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-methyl-2,5-diphenylphenyl)propan-2-yl]-2-methyl-3,6-diphenylphenol Chemical compound CC1=C(O)C(C=2C=CC=CC=2)=CC(C(C)(C)C=2C(=C(C)C(O)=C(C=3C=CC=CC=3)C=2)C=2C=CC=CC=2)=C1C1=CC=CC=C1 BRNNDPBHQNVHTA-UHFFFAOYSA-N 0.000 description 1
- QHJPJZROUNGTRJ-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)octan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(CCCCCC)C1=CC=C(O)C=C1 QHJPJZROUNGTRJ-UHFFFAOYSA-N 0.000 description 1
- RQTDWDATSAVLOR-UHFFFAOYSA-N 4-[3,5-bis(4-hydroxyphenyl)phenyl]phenol Chemical compound C1=CC(O)=CC=C1C1=CC(C=2C=CC(O)=CC=2)=CC(C=2C=CC(O)=CC=2)=C1 RQTDWDATSAVLOR-UHFFFAOYSA-N 0.000 description 1
- CIEGINNQDIULCT-UHFFFAOYSA-N 4-[4,6-bis(4-hydroxyphenyl)-4,6-dimethylheptan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)CC(C)(C=1C=CC(O)=CC=1)CC(C)(C)C1=CC=C(O)C=C1 CIEGINNQDIULCT-UHFFFAOYSA-N 0.000 description 1
- SUWJESCICIOQHO-UHFFFAOYSA-N 4-methylhex-1-ene Chemical compound CCC(C)CC=C SUWJESCICIOQHO-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- HTVITOHKHWFJKO-UHFFFAOYSA-N Bisphenol B Chemical compound C=1C=C(O)C=CC=1C(C)(CC)C1=CC=C(O)C=C1 HTVITOHKHWFJKO-UHFFFAOYSA-N 0.000 description 1
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 1
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- RVGRUAULSDPKGF-UHFFFAOYSA-N Poloxamer Chemical compound C1CO1.CC1CO1 RVGRUAULSDPKGF-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 1
- YMOONIIMQBGTDU-VOTSOKGWSA-N [(e)-2-bromoethenyl]benzene Chemical compound Br\C=C\C1=CC=CC=C1 YMOONIIMQBGTDU-VOTSOKGWSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229920006167 biodegradable resin Polymers 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 150000001924 cycloalkanes Chemical class 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- 229940069096 dodecene Drugs 0.000 description 1
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 1
- 239000011790 ferrous sulphate Substances 0.000 description 1
- 235000003891 ferrous sulphate Nutrition 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000005194 fractionation Methods 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical compound C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- 229920005669 high impact polystyrene Polymers 0.000 description 1
- 239000004797 high-impact polystyrene Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 1
- 229910000359 iron(II) sulfate Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229910000489 osmium tetroxide Inorganic materials 0.000 description 1
- 239000012285 osmium tetroxide Substances 0.000 description 1
- PMJHHCWVYXUKFD-UHFFFAOYSA-N penta-1,3-diene Chemical compound CC=CC=C PMJHHCWVYXUKFD-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001993 poloxamer 188 Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000747 poly(lactic acid) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000004626 polylactic acid Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229940096992 potassium oleate Drugs 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- MLICVSDCCDDWMD-KVVVOXFISA-M potassium;(z)-octadec-9-enoate Chemical compound [K+].CCCCCCCC\C=C/CCCCCCCC([O-])=O MLICVSDCCDDWMD-KVVVOXFISA-M 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- XWGJFPHUCFXLBL-UHFFFAOYSA-M rongalite Chemical compound [Na+].OCS([O-])=O XWGJFPHUCFXLBL-UHFFFAOYSA-M 0.000 description 1
- 238000005185 salting out Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- WYKYCHHWIJXDAO-UHFFFAOYSA-N tert-butyl 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)C WYKYCHHWIJXDAO-UHFFFAOYSA-N 0.000 description 1
- BWSZXUOMATYHHI-UHFFFAOYSA-N tert-butyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(C)(C)C BWSZXUOMATYHHI-UHFFFAOYSA-N 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F255/00—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
- C08F255/02—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having two or three carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/06—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
Definitions
- the present disclosure relates to a graft copolymer and a thermoplastic resin composition containing the graft copolymer.
- Thermoplastic resins typified by styrene resins, are used as materials for vehicle interior parts such as car air conditioners and car stereo switches.
- vehicle interior parts such as car air conditioners and car stereo switches.
- creaking sounds are generated from the parts where the molded product is mated or the parts that are in contact with (rubbing) parts made of different or similar materials.
- rubbing rubbing
- Patent Documents 1 and 2 In order to solve such problems, grease is applied to the mating and contact parts of the resin surface. However, this application of grease takes time and costs, which is not economical and limits the duration of the effect. Therefore, techniques for blending a polyethylene polymer into a thermoplastic resin composition have been proposed (for example, Patent Documents 1 and 2).
- thermoplastic resin composition is molded into a vehicle interior part or the like using a mold.
- the present inventors have found that when a thermoplastic resin composition containing a polyethylene polymer is continuously molded, deposits may occur on the mold. Continuing molding in the presence of deposits on the mold causes a problem of poor appearance of the molded product. If the molding temperature becomes higher (for example, 270° C.), deposits will occur in a short period of time, resulting in a loss of productivity.
- An object of one aspect of the present disclosure is to provide a graft copolymer that hardly contaminates a mold during molding even when blended with a thermoplastic resin, and a thermoplastic resin composition blended with the graft copolymer. do.
- the inventors have found that heat blended with a specific graft copolymer obtained using an ethylene polymer having a specific amount or less of gas generation per unit mass.
- the inventors have found that the plastic resin composition does not easily contaminate the mold even when molding is performed at a high temperature (for example, 270° C.), and have completed the present disclosure based on this finding.
- one aspect of the present disclosure is a monomer composition containing 20 to 70 parts by mass of an aromatic vinyl monomer in the presence of 30 to 80 parts by mass of an ethylene polymer (a) (however, ethylene-based A graft copolymer (A) obtained by graft polymerization of the polymer (a) and the monomer composition (total of 100 parts by mass), wherein the ethylene-based polymer (a) is heated at 270° C. for 6 minutes
- the graft copolymer generates a gas generation amount of 2500 mass ppm or less when heated.
- the monomer composition may further contain a vinyl cyanide monomer.
- the graft copolymer may have a graft ratio of 30% or more. When the graft ratio is 30% or more, contamination of the mold is further suppressed.
- thermoplastic resin composition containing the graft copolymer (A) and a thermoplastic resin (B) other than the graft copolymer (A), wherein the graft copolymer
- the content of the graft copolymer (A) is 1 to 10 parts by mass and the content of the thermoplastic resin (B) is 100 parts by mass in total for the polymer (A) and the thermoplastic resin (B)
- the thermoplastic resin composition is 90 to 99 parts by mass.
- the thermoplastic resin (B) may contain a thermoplastic resin having a glass transition temperature of 130°C or higher.
- a thermoplastic resin having a glass transition temperature of 130° C. or higher the heat resistance of the obtained molded article is improved.
- the thermoplastic resin (B) may contain a polycarbonate resin.
- the thermoplastic resin (B) may contain a polycarbonate-based resin, the resulting molded article has improved heat resistance.
- a graft copolymer that is less likely to contaminate a mold during molding even when blended with a thermoplastic resin, and a thermoplastic resin composition blended with the graft copolymer.
- the graft copolymer according to the present embodiment is a monomer composition containing 20 to 70 parts by mass of an aromatic vinyl monomer (b) in the presence of 30 to 80 parts by mass of an ethylene polymer (a). It is a graft copolymer (A) obtained by graft polymerization of (the total of the ethylene polymer (a) and the monomer composition is 100 parts by mass).
- Examples of the ethylene-based polymer (a) include ethylene homopolymers, ethylene- ⁇ -olefin copolymers, ethylene-vinyl acetate copolymers, ethylene-acrylic acid copolymers, ethylene-acrylic acid ester copolymers, ethylene - ethylene-based monomer units such as methacrylic acid copolymers, ethylene-methacrylic acid ester copolymers, ethylene-cyclic olefin copolymers, etc.
- mol % a polymer having a content of ethylene-based monomer units of 50 mol % or more can be mentioned.
- Ethylene homopolymer includes polyethylene.
- Examples of the ⁇ -olefin of the ethylene- ⁇ -olefin copolymer include propylene, 1-butene, 1-pentene, 1-hexene, 1-heptene, 1-octene, 1-nonene, 1-decene and 1-dodecene. , 4-methyl-1-pentene, 4-methyl-1-hexene, and other ⁇ -olefins having 3 to 20 carbon atoms. These can be used individually by 1 type or in combination of 2 or more types.
- Ethylene- ⁇ -olefin copolymers include ethylene-propylene copolymers, ethylene-1-butene copolymers, ethylene-1-hexene copolymers, ethylene-1-octene copolymers, ethylene-1-butene -1-hexene copolymer and the like.
- the ethylene- ⁇ -olefin copolymer may contain monomer units based on non-conjugated diene monomers.
- non-conjugated diene monomers include dicyclopentadiene, 5-ethylidene-2-norbornene, 1,4-hexadiene, 1,5-hexadiene, 2-methyl-1,5-hexadiene, 1,4-cyclo Examples include heptadiene, 1,5-cyclooctadiene, and the like.
- the size of the ethylene-based polymer (a) is not limited, but the number average converted particle diameter [(long side + short side)/2] ( ⁇ m) is preferably 500 to 4500 ⁇ m, more preferably 700 to 3500 ⁇ m. is more preferable, 1000 to 3000 ⁇ m is even more preferable, and 1000 to 2700 ⁇ m is particularly preferable.
- the number-average equivalent particle size is the average value of [(long side + short side)/2] of a plurality of ethylene-based polymers (a).
- the ethylene polymer (a) can be used in pellet form.
- the larger the surface area of the pellet the easier the graft polymerization of the monomer such as the aromatic vinyl monomer.
- the number-average converted particle size [(long side+short side)/2] of the pellets is preferably within the above range.
- the density of the ethylene polymer (a) is preferably 0.850 g/cm 3 or more and less than 0.965 g/cm 3 , more preferably 0.870 g/cm 3 or more and less than 0.950 g/cm 3 , and 0.900 g/cm 3 or more. cm 3 or more and less than 0.935 g/cm 3 is particularly preferable.
- the density is measured according to JIS K7112.
- the ethylene polymer (a) has a gas generation amount of 2500 mass ppm or less when heated at 270 ° C. for 6 minutes, and since contamination of the mold is further suppressed, it is 2000 mass ppm or less. It is preferably 1500 mass ppm or less, more preferably 1000 mass ppm or less.
- the amount of gas generated is measured by gas chromatography-mass spectrometry under the following conditions.
- Analytical column a column whose stationary phase is 5% diphenyldimethylpolysiloxane (film thickness 0.25 ⁇ m x length 30 m x inner diameter 0.25 mm)
- Gas generation conditions and peak to be measured A sample (ethylene polymer) is introduced into an oven at a temperature of 270°C, and gas is generated from the sample (ethylene polymer) while the temperature is held at 270°C for 6 minutes. gas.
- Inlet temperature 320°C
- Amount of sample to be introduced 3.0-3.5 mg
- Carrier gas Helium column gas flow rate: 1 mL/min Detector and detection temperature: MSD, 320°C
- a method for adjusting the amount of gas generated when the ethylene polymer is heated at 270° C. for 6 minutes to 2500 ppm by mass or less is, for example, a combination of at least two of the following means 1 to 3 for reducing the amount of gas generated.
- Reducing Means 1 Using a catalyst system comprising a cyclopentadienyl-transition metal compound and an alumoxane compound when producing an ethylene-based polymer Reducing Means 2: Lowering the polymerization temperature when producing an ethylene-based polymer Reduction means 3: Washing the ethylene-based polymer (for example, extracting a very low molecular weight polymer component from the ethylene-based polymer using a solvent (n-hexane, etc.))
- aromatic vinyl-based monomer (b) examples include styrene, ⁇ -methylstyrene, paramethylstyrene, bromostyrene and the like. These can be used individually by 1 type or in combination of 2 or more types. Of these, styrene and ⁇ -methylstyrene are preferred.
- the monomer composition may further contain a vinyl cyanide monomer.
- vinyl cyanide monomer (c) examples include acrylonitrile, methacrylonitrile, ethacrylonitrile and fumaronitrile. These can be used individually by 1 type or in combination of 2 or more types.
- the graft copolymer (A) of the present embodiment is a monomer composition containing an aromatic vinyl monomer (b) in the presence of an ethylene polymer (a) of 30 to 80 parts by mass. It can be obtained by graft polymerization of parts by mass (where the total of the ethylene-based polymer (a) and the monomer composition is 100 parts by mass).
- the ethylene polymer (a) When the ethylene polymer (a) is present in an amount of 30 parts by mass or more, the sliding properties tend to improve when the obtained graft copolymer (A) is blended with a thermoplastic resin. When the graft copolymer (A) to be obtained is blended with a thermoplastic resin, delamination is less likely to occur.
- the amount of the ethylene polymer (a) present is preferably 35 to 75 parts by mass, more preferably 40 to 70 parts by mass.
- the aromatic vinyl monomer (b) is graft polymerized at a rate of 65 to 85 parts by mass based on 100 parts by mass of the monomer composition. is preferable, and it is more preferable to graft-polymerize at a ratio of 70 to 80 parts by mass.
- the graft ratio of the graft copolymer (A) is preferably 30% or more, more preferably 35% or more, and 40% or more because contamination of the mold is further suppressed. is more preferable, and 45% or more is particularly preferable.
- the amount of the vinyl cyanide monomer is 15 to 35 parts by mass based on 100 parts by mass of the monomer composition. is preferred, and 20 to 30 parts by mass is more preferred.
- the method for producing the graft copolymer (A) of the present embodiment is not particularly limited, and it can be obtained by emulsion polymerization, suspension polymerization, bulk polymerization, solution polymerization, or a combination thereof. It is preferred to use law.
- a predetermined value for example, 2500 mass ppm or less, 2000 mass ppm or less, 1500 mass ppm or less, or 1000 mass ppm or less
- thermoplastic resin composition A thermoplastic resin composition according to an embodiment of the present disclosure will be described in detail.
- thermoplastic resin composition of this embodiment contains the graft copolymer (A) of the above embodiment and a thermoplastic resin (B) other than the graft copolymer (A).
- thermoplastic resin (B) is not particularly limited, but for example, styrene resins; acrylic resins such as polymethyl methacrylate resins; polycarbonate resins; polyester resins such as polybutylene terephthalate resins and polyethylene terephthalate resins; Biodegradable resins such as polylactic acid resins; Engineering plastics such as (modified) polyphenylene ether-based resins, polyoxymethylene-based resins, polysulfone-based resins, polyarylate-based resins, polyphenylene-based resins, thermoplastic polyurethane-based resins and the like. These can be used individually by 1 type or in combination of 2 or more types.
- the thermoplastic resin (B) preferably contains a polycarbonate-based resin because the heat resistance of the obtained molded article is improved.
- the thermoplastic resin (B) contains a polycarbonate-based resin, molding at a high temperature is required. Less likely to contaminate the mold.
- Styrene-based resins include rubber-reinforced styrene-based resins and non-rubber-reinforced styrene-based resins.
- rubber-reinforced styrene resins include rubber-reinforced polystyrene resin (HIPS resin), acrylonitrile-butadiene rubber-styrene polymer (ABS resin), acrylonitrile-acrylic rubber-styrene polymer (AAS resin), and methacrylic acid.
- HIPS resin rubber-reinforced polystyrene resin
- ABS resin acrylonitrile-butadiene rubber-styrene polymer
- AS resin acrylonitrile-acrylic rubber-styrene polymer
- methacrylic acid examples include methyl-butadiene-based rubber-styrene resin (MBS resin).
- non-rubber reinforced styrene resins include styrene polymer (PS resin), styrene/acrylonitrile copolymer (AS resin), ⁇ -methylstyrene/acrylonitrile copolymer ( ⁇ MS-ACN resin), and methyl methacrylate.
- PS resin styrene polymer
- AS resin styrene/acrylonitrile copolymer
- ⁇ MS-ACN resin ⁇ -methylstyrene/acrylonitrile copolymer
- MAS resin methyl methacrylate/acrylonitrile/styrene copolymer
- S-NPMI resin styrene/N-phenylmaleimide copolymer
- SA-NPMI resin styrene/N-phenylmaleimide/acrylonitrile copolymer A polymer (SA-NPMI resin) and the like are included.
- the polycarbonate-based resin that can be used in the present embodiment is a polymer obtained by a phosgene method in which various dihydroxydiaryl compounds are reacted with phosgene, or a transesterification method in which a dihydroxydiaryl compound is reacted with a carbonate ester such as diphenyl carbonate.
- a typical example is a polycarbonate resin produced from "bisphenol A", which is 2,2-bis(4-hydroxyphenyl)propane.
- dihydroxydiaryl compounds examples include bisphenol A, bis(4-hydroxydiphenyl)methane, 1,1-bis(4-hydroxyphenyl)ethane, 2,2-bis(4-hydroxyphenyl)butane, 2, 2-bis(4-hydroxyphenyl)octane, bisbis(4-hydroxydiphenyl)phenylmethane, 2,2-bis(4-hydroxydiphenyl-3-methylphenyl)propane, 1,1-bis(4-hydroxy-3 -tert-butylphenyl)propane, 2,2-bis(4-hydroxy-3-bromophenyl)propane, 2,2-bis(4-hydroxy-3,5dibromophenyl)propane, 2,2-bis(4 -Bis(hydroxyaryl)alkanes such as hydroxy-3,5-dichlorophenyl)propane, 1,1-bis(4-hydroxyphenyl)cyclopentane, 1,1-bis(4-hydroxyphenyl)cyclo
- piperazine dipiperidyl hydroquinone, resorcin, 4,4'-dihydroxydiphenyls, etc. may be mixed.
- trihydric or higher phenols examples include phloroglucine, 4,6-dimethyl-2,4,6-tri-(4-hydroxyphenyl)-heptene-2,4,6-dimethyl-2,4,6-tri-(4 -hydroxyphenyl)-heptane, 1,3,5-tri-(4-hydroxyphenyl)-benzol, 1,1,1-tri-(4-hydroxyphenyl)-ethane and 2,2-bis-(4, 4'-(4,4'-hydroxydiphenyl)cyclohexyl)-propane and the like.
- the weight average molecular weight is usually 10,000 to 80,000, preferably 15,000 to 60,000.
- Molecular weight modifiers, catalysts and the like may be used as necessary during production.
- the content of the polycarbonate-based resin is preferably 50% by mass or more based on the total amount of the thermoplastic resin because heat resistance is improved, and 70% by mass. It is more preferably at least 90% by mass, even more preferably at least 90% by mass.
- a polycarbonate-based resin having a high glass transition temperature is used, molding at a high temperature is required, and the mold tends to be easily contaminated. Contamination of the mold can be suppressed.
- the thermoplastic resin (B) preferably contains a thermoplastic resin having a glass transition temperature of 130° C. or higher because it has better heat resistance, and may contain a thermoplastic resin having a glass transition temperature of 140° C. or higher. more preferred. Glass transition temperature is measured by differential scanning calorimetry (DSC).
- the thermoplastic resin (B) contains a thermoplastic resin having a glass transition temperature of 130° C. or higher
- the content of the thermoplastic resin having a glass transition temperature of 130° C. or higher improves the heat resistance.
- the total amount of the plastic resin it is preferably 50% by mass or more, more preferably 70% by mass or more, and even more preferably 90% by mass or more.
- the content of the graft copolymer (A) is 1 with respect to a total of 100 parts by mass of the graft copolymer (A) and the thermoplastic resin (B). 10 parts by mass and the content of the thermoplastic resin (B) is preferably 90 to 99 parts by mass.
- the content of the graft copolymer (A) is 1 part by mass or more, delamination is unlikely to occur in the obtained molded article, and wear resistance, sliding properties, and squeak noise are achieved while sufficiently maintaining heat resistance. can be improved.
- the content of the graft copolymer (A) is more preferably 2 to 8 parts by mass, more preferably 3 to 7 parts by mass, with respect to a total of 100 parts by mass of the graft copolymer (A) and the thermoplastic resin (B). Parts by mass are particularly preferred.
- the content of the structure derived from the ethylene-based polymer (a) of the graft copolymer (A) in the thermoplastic resin composition is the total amount of the thermoplastic resin composition, since contamination of the mold is further suppressed. Based on, it is preferably 0.6 to 6.0% by mass, more preferably 1.2 to 4.8% by mass, even more preferably 1.8 to 4.2% by mass .
- thermoplastic resin composition of the present embodiment can be mixed with pigments, dyes, reinforcing agents (talc, mica, clay, glass fiber, etc.) during resin mixing, molding, etc. according to the purpose, as long as it does not impair the purpose of the present disclosure. ), ultraviolet absorbers, antioxidants, lubricants, release agents, plasticizers, flame retardants, antistatic agents, inorganic and organic antibacterial agents, and other known additives can be blended.
- thermoplastic resin composition of this embodiment can be obtained by mixing the above components.
- known kneading devices such as extruders, rolls, Banbury mixers and kneaders can be used. Also, there is no restriction on the order of mixing.
- the graft copolymer according to the above embodiment is obtained by blending a monomer composition containing an aromatic vinyl monomer (b) in a specific ratio in the presence of an ethylene polymer (a), and graft polymerization. and the ethylene polymer (a) has a gas generation amount of 2500 mass ppm or less per unit mass, so that the thermoplastic resin composition containing the graft copolymer is , even if the molding is performed at high temperature (for example, 270° C.), the mold is less likely to be contaminated.
- the molded article obtained from the thermoplastic resin composition is resistant to delamination while maintaining its heat resistance, provides sufficient wear resistance and sliding properties, and can suppress squeak noise. .
- Inlet temperature 320°C GC interface temperature: 320°C Carrier gas: helium (flow rate: 1 mL/min) Split ratio: 1/150 Detector and detection temperature: MSD, 320°C Amount of sample to be introduced: 3.0-3.5 mg Gas generation conditions and peak to be measured: A sample (ethylene polymer) was introduced into the oven when the oven temperature reached 270 ° C., and the gas generated while the oven temperature was maintained at 270 ° C. for 6 minutes was measured. A gas generated from a sample (ethylene-based polymer) was used.
- graft copolymer (A) > [Graft copolymer (A-1)] 500 parts by mass of deionized water, 0.20 parts by mass of polyoxyethylene polyoxypropylene glycol (trade name: "Pluronic F-68"), 1.0 parts by mass of magnesium sulfate, ethylene polymer (a -1) 100 parts by mass were charged, and the inside of the tank was replaced with nitrogen while stirring.
- the temperature was raised to 100°C during one hour of the reaction, and the reaction was carried out at 100°C after the temperature was raised. After completion of the reaction, the temperature inside the vessel was cooled to 40° C., and the graft copolymer (A-1) was obtained by performing recovery, washing and drying. The graft rate was measured by the method described below and found to be 52.3%.
- a graft copolymer (A-2) was prepared in the same manner as the graft copolymer (A-1) except that the ethylene polymer (a-2) was used instead of the ethylene polymer (a-1). got The graft rate was 49.5%.
- a graft copolymer (A-3) was prepared in the same manner as the graft copolymer (A-1) except that the ethylene polymer (a-3) was used instead of the ethylene polymer (a-1). got The graft rate was 47.5%.
- the ethylene polymer content (%) of the graft copolymer and the mass ratio (%) of the dichloromethane-insoluble portion of the graft copolymer were measured to determine the graft ratio.
- the graft copolymer (A-1) will be described as an example. It is assumed that 100% of the charged amount of the ethylene polymer (a-1) is contained in the graft copolymer. Graft copolymer (A-1) was subjected to fractionation using dichloromethane, and the mass ratio of the dichloromethane-insoluble portion was found to be 91.4 mass%. Since the ethylene-based polymer is present in the dichloromethane-insoluble portion, the graft ratio can be obtained from the following formula (1).
- an image analysis processor (device name: IP-1000PC, manufactured by Asahi Kasei Co., Ltd.), the area of 1000 rubber particles was measured, the circle equivalent diameter (diameter) was obtained, and the rubber-like polymer (b-1 ) was calculated. The weight average particle size was 0.10 ⁇ m.
- thermoplastic resin (B-1) 60 parts by mass (solid content) of rubber-like polymer (b-2) (weight average particle diameter: 0.35 ⁇ m), 140 parts by mass of water, and 0.1 part by mass of disodium ethylenediaminetetraacetic acid are placed in a nitrogen-purged reactor.
- thermoplastic resin composition ⁇ Production of thermoplastic resin composition> [Examples 1 to 3]
- the graft copolymer (A) and the thermoplastic resin (B) were melt-kneaded according to the composition shown in Table 1 to obtain a thermoplastic resin composition.
- a thermoplastic resin (B-1) and PC1 and PC2 shown below were used as the thermoplastic resin (B).
- ⁇ PC1 polycarbonate resin, viscosity average molecular weight: 15,000, glass transition temperature: 141 ° C.
- PC2 polycarbonate resin, viscosity average molecular weight: 20,500, glass transition temperature: 155 ° C.
- thermoplastic resin composition A graft copolymer (A), an ethylene polymer and a thermoplastic resin (B) were mixed according to the composition shown in Table 1 to obtain a thermoplastic resin composition.
- Example 1 The graft copolymer (A) and the thermoplastic resin (B) were mixed according to the composition shown in Table 1 to obtain a thermoplastic resin composition. Using the thermoplastic resin composition, a molded article was produced with a mold (2 pieces of 90 mm long ⁇ 55 mm wide ⁇ 3 mm thick). The molding temperature was 270°C and the mold temperature was 70°C. Mold contamination after 600 shots were continuously produced was evaluated according to the following criteria. Table 1 shows the results.
- Example 2 and 3 and Comparative Examples 1 to 4 A molded product was produced in the same manner as in Example 1, and contamination of the mold after 600 shots were continuously produced was visually evaluated according to the above criteria. Table 1 shows the results.
- the gist of the present disclosure lies in the following [1] to [6].
- the ethylene-based polymer (a) is a graft copolymer that generates a gas of 2500 ppm by mass or less when heated at 270°C for 6 minutes.
- thermoplastic resin composition containing the graft copolymer (A) according to any one of [1] to [3] and a thermoplastic resin (B) other than the graft copolymer (A) and The content of the graft copolymer (A) is 1 to 10 parts by mass and the thermoplastic resin (B) is contained with respect to a total of 100 parts by mass of the graft copolymer (A) and the thermoplastic resin (B) A thermoplastic resin composition having an amount of 90 to 99 parts by mass.
- thermoplastic resin composition according to [4] wherein the thermoplastic resin (B) contains a thermoplastic resin having a glass transition temperature of 130°C or higher.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
本開示の一実施形態に係るグラフト共重合体について詳細に説明する。
分析カラム:固定相が5%ジフェニルジメチルポリシロキサンであるカラム(膜厚0.25μm×長さ30m×内径0.25mm)
ガス発生条件及び測定対象のピーク:温度が270℃のオーブンに試料(エチレン系重合体)を導入し、270℃で6分間保持する間に発生するガスを試料(エチレン系重合体)から発生するガスとした。
注入口温度:320℃
導入する試料の量:3.0~3.5mg
キャリアガス:ヘリウム
カラムのガス流量:1mL/分
検出器及び検出温度:MSD、320℃
低減手段1:エチレン系重合体を製造するときに、シクロペンタジエニル-遷移金属化合物とアルモキサン化合物からなる触媒系を用いること
低減手段2:エチレン系重合体を製造するときの重合温度を下げること
低減手段3:エチレン系重合体を洗浄すること(例えば、溶媒(n-ヘキサン等)を用いてエチレン系重合体から極低分子量重合体成分を抽出すること)
本開示の一実施形態に係る熱可塑性樹脂組成物について詳細に説明する。
上記実施形態に係るグラフト共重合体は、エチレン系重合体(a)の存在下に、芳香族ビニル系単量体(b)を含む単量体組成物を特定の割合で配合し、グラフト重合して得られるものであり、かつ、エチレン系重合体(a)が、単位質量あたりのガス発生量が2500質量ppm以下であることで、該グラフト共重合体を配合した熱可塑性樹脂組成物は、成形を高温(例えば、270℃)で行った場合であっても、金型を汚染しにくい。また、該熱可塑性樹脂組成物から得られる成形品は、耐熱性を維持したまま、デラミネーションが発生しにくく、十分な耐摩耗性及び摺動特性が得られ、軋み音を抑制することができる。
以下に示すエチレン系重合体(a-1)~(a-3)を準備した。各エチレン系重合体のガス発生量は、後述する方法で測定した。
(エチレン-1-ヘキセン共重合体)
ガス発生量[質量ppm]:890
密度::0.903g/cm3
(エチレン単独重合体)
ガス発生量[質量ppm]:340
密度:0.919g/cm3
(エチレン-1-ブテン-1-ヘキセン共重合体)
ガス発生量[質量ppm]:4830
密度:0.918g/cm3
ガス発生量は、下記条件のガスクロマトグラフィー質量分析により測定した。
装置:型式「7890A GC System/5975C VL MSD」、Agilent Technologies社製
分析カラム:商品名「Ultra ALLOY-5」、長さ(30m)×内径(0.25mm)×膜厚(0.25μm)、固定相が5%ジフェニルジメチルポリシロキサン
オーブン温度:20℃/分で70℃から270℃まで昇温した後、270℃で6分間保持した。さらに、20℃/分で320℃まで昇温し、320℃で10分間保持した。
注入口温度:320℃
GCインターフェース温度:320℃
キャリアガス:ヘリウム(流量:1mL/分)
スプリット比:1/150
検出器及び検出温度:MSD、320℃
導入する試料の量:3.0~3.5mg
ガス発生条件及び測定対象のピーク:オーブンの温度が270℃に到達した時点でオーブンに試料(エチレン系重合体)を導入し、オーブンの温度を270℃で6分間保持する間に発生するガスを試料(エチレン系重合体)から発生するガスとした。
[グラフト共重合体(A-1)]
100Lの耐圧容器に脱イオン水500質量部、ポリオキシエチレンポリオキシプロピレングリコール(商品名:「プルロニックF-68」)0.20質量部、硫酸マグネシウム1.0質量部、エチレン系重合体(a-1)100質量部仕込み、攪拌しつつ槽内の窒素置換を行った。その後、スチレン45.5質量部、アクリロニトリル21.5質量部、tert-ブチルパーオキシピバレート(B(PV))1.78質量部、tert-ブチルパーオキシ-2-エチルヘキサノエート(商品名:「カヤエステルO」)0.14質量部、1,4-ベンゾキノン0.07質量部から構成される混合モノマーと脱イオン水50質量部を仕込み槽内を0.1kg/cm3に加圧した。槽内温度を85℃まで昇温後、85℃になってから1時間反応を継続させた。反応1時間中に100℃まで昇温し、昇温後は100℃で反応させた。反応終了後、槽内温度を40℃まで冷却し、回収・洗浄・乾燥を行うことでグラフト共重合体(A-1)を得た。グラフト率の測定を下記に記載の方法で行ったところ、グラフト率は52.3%であった。
エチレン系重合体(a-1)に代えてエチレン系重合体(a-2)を用いたこと以外は、グラフト共重合体(A-1)と同様にしてグラフト共重合体(A-2)を得た。グラフト率は、49.5%であった。
エチレン系重合体(a-1)に代えてエチレン系重合体(a-3)を用いたこと以外は、グラフト共重合体(A-1)と同様にしてグラフト共重合体(A-3)を得た。グラフト率は、47.5%であった。
グラフト共重合体のエチレン系重合体含有率(%)と、グラフト共重合体のジクロロメタン不溶部の質量比率(%)とを測定し、グラフト率を求めた。グラフト共重合体(A-1)を例として説明する。エチレン系重合体(a-1)は仕込み量の100%がグラフト共重合体中に含有すると仮定する。グラフト共重合体(A-1)をジクロロメタンを用いて分別作業を行うことでジクロロメタン不溶部の質量比率を求めたところ91.4質量%であった。エチレン系重合体はジクロロメタン不溶部に存在するので、グラフト率を下記式(1)より求めることができる。
=(91.4-60)/60
=52.3(%)
耐圧容器に、1,3-ブタジエン93質量部、スチレン7質量部、n-ドデシルメルカプタン0.5質量部、過硫酸カリウム0.24質量部、ロジン酸ナトリウム1.5質量部、水酸化ナトリウム0.1質量部及び脱イオン水150質量部を仕込み、70℃で15時間反応させた。その後、冷却して反応を終了させることで、ゴム状重合体(b-1)を得た。得られたゴム状重合体(b-1)を、四酸化オスミウムで染色し、乾燥後に透過型電子顕微鏡で写真撮影をした。画像解析処理装置(装置名:IP-1000PC、旭化成(株)製)を用いて1000個のゴム粒子の面積を計測し、その円相当径(直径)を求め、ゴム状重合体(b-1)の重量平均粒子径を算出した。重量平均粒子径は0.10μmであった。
上記で得られたゴム状重合体(b-1)を用いて凝集肥大化処理を行った。撹拌槽にゴム状重合体(b-1)270質量部、10%ドデシルベンゼンスルホン酸ナトリウム水溶液0.055質量部を添加して10分間撹拌した後、5%リン酸水溶液0.8質量部を10分間に亘り添加した。その後、10%水酸化カリウム水溶液1.0質量部を添加することで、ゴム状重合体(b-2)を得た。得られたゴム状重合体(b-2)は上記と同じ方法で重量平均粒子径を求め、重量平均粒子径は0.35μmであった。
窒素置換した反応器にゴム状重合体(b-2)(重量平均粒子径:0.35μm)を60質量部(固形分)、水140質量部、エチレンジアミン四酢酸二ナトリウム塩0.1質量部、硫酸第1鉄0.001質量部、ナトリウムホルムアルデヒドスルホキシレート0.3質量部を入れ、65℃に加熱後、スチレン30質量部、アクリロニトリル10質量部、t-ドデシルメルカプタン0.27質量部及びt-ブチルヒドロペルオキシド0.139質量部からなる混合物とオレイン酸カリウム1.0質量部及び水15質量部からなる混合物を5時間に亘り連続的に添加した。添加終了後さらに70℃に昇温しつつ2時間重合した。その後、塩析、脱水及び乾燥することでアクリロニトリル・ブタジエン系ゴム・スチレン樹脂である熱可塑性樹脂(B-1)を得た。AS樹脂に由来するガラス転移温度は、110℃であった。
[実施例1~3]
表1に示す組成でグラフト共重合体(A)、熱可塑性樹脂(B)を溶融混錬し、熱可塑性樹脂組成物を得た。熱可塑性樹脂(B)として、熱可塑性樹脂(B-1)並びに下記に示すPC1及びPC2を用いた。
・PC1:ポリカーボネート系樹脂、粘度平均分子量:15,000、ガラス転移温度:141℃
・PC2:ポリカーボネート系樹脂、粘度平均分子量:20,500、ガラス転移温度:155℃
表1に示す組成でグラフト共重合体(A)、エチレン系重合体、熱可塑性樹脂(B)を混合し、熱可塑性樹脂組成物を得た。
[実施例1]
表1に示す組成でグラフト共重合体(A)、熱可塑性樹脂(B)を混合し、熱可塑性樹脂組成物を得た。熱可塑性樹脂組成物を用いて金型(縦90mm×横55mm×厚さ3mmの2枚取り)で成形品を製造した。成形温度は270℃、金型温度は70℃とした。600ショット連続で成形品を製造した後の金型の汚染を下記の基準に沿って評価した。結果を表1に示した。
A:金型鏡面において付着物が確認される面積が40%以下である
B:金型鏡面において付着物が確認される面積が40%を超える
実施例1と同様にして成形品を製造し、600ショット連続で成形品を製造した後の金型の汚染を目視により上記の判定基準で評価した。結果を表1に示した。
[1]エチレン系重合体(a)30~80質量部の存在下に、芳香族ビニル系単量体(b)を含む単量体組成物20~70質量部(ただし、エチレン系重合体(a)及び単量体組成物の合計は100質量部)をグラフト重合して得られるグラフト共重合体(A)であって、
エチレン系重合体(a)は、270℃で6分間加熱したときのガス発生量が2500質量ppm以下である、グラフト共重合体。
[2]単量体組成物が、シアン化ビニル系単量体(c)を更に含む、[1]に記載のグラフト共重合体。
[3]グラフト率が30%以上である、[1]又は[2]に記載のグラフト共重合体。
[4][1]~[3]のいずれかに記載のグラフト共重合体(A)と、該グラフト共重合体(A)以外の熱可塑性樹脂(B)と、を含む熱可塑性樹脂組成物であって、
グラフト共重合体(A)及び熱可塑性樹脂(B)の合計100質量部に対して、グラフト共重合体(A)の含有量が1~10質量部であり且つ熱可塑性樹脂(B)の含有量が90~99質量部である、熱可塑性樹脂組成物。
[5]熱可塑性樹脂(B)が、ガラス転移温度が130℃以上である熱可塑性樹脂を含む、[4]に記載の熱可塑性樹脂組成物。
[6]熱可塑性樹脂(B)が、ポリカーボネート系樹脂を含む、[4]又は[5]に記載の熱可塑性樹脂組成物。
Claims (6)
- エチレン系重合体(a)30~80質量部の存在下に、芳香族ビニル系単量体(b)を含む単量体組成物20~70質量部(ただし、前記エチレン系重合体(a)及び前記単量体組成物の合計は100質量部)をグラフト重合して得られるグラフト共重合体(A)であって、
前記エチレン系重合体(a)は、270℃で6分間加熱したときのガス発生量が2500質量ppm以下である、グラフト共重合体。 - 前記単量体組成物が、シアン化ビニル系単量体(c)を更に含む、請求項1に記載のグラフト共重合体。
- グラフト率が30%以上である、請求項1に記載のグラフト共重合体。
- 請求項1~3のいずれか一項に記載のグラフト共重合体(A)と、該グラフト共重合体(A)以外の熱可塑性樹脂(B)と、を含む熱可塑性樹脂組成物であって、
前記グラフト共重合体(A)及び前記熱可塑性樹脂(B)の合計100質量部に対して、前記グラフト共重合体(A)の含有量が1~10質量部であり且つ前記熱可塑性樹脂(B)の含有量が90~99質量部である、熱可塑性樹脂組成物。 - 前記熱可塑性樹脂(B)が、ガラス転移温度が130℃以上である熱可塑性樹脂を含む、請求項4に記載の熱可塑性樹脂組成物。
- 前記熱可塑性樹脂(B)が、ポリカーボネート系樹脂を含む、請求項4に記載の熱可塑性樹脂組成物。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202280074676.8A CN118317985A (zh) | 2021-11-26 | 2022-11-24 | 接枝共聚物及热塑性树脂组合物 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021-192021 | 2021-11-26 | ||
JP2021192021 | 2021-11-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2023095826A1 true WO2023095826A1 (ja) | 2023-06-01 |
Family
ID=86539545
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2022/043333 WO2023095826A1 (ja) | 2021-11-26 | 2022-11-24 | グラフト共重合体及び熱可塑性樹脂組成物 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN118317985A (ja) |
WO (1) | WO2023095826A1 (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0420550A (ja) | 1990-05-14 | 1992-01-24 | Nippon Oil & Fats Co Ltd | 熱可塑性樹脂組成物およびその製造方法 |
JP2000038513A (ja) | 1998-07-24 | 2000-02-08 | Otsuka Chem Co Ltd | 摺動部材用樹脂組成物及び摺動部材 |
JP2015178567A (ja) * | 2014-03-19 | 2015-10-08 | ユーエムジー・エービーエス株式会社 | 熱可塑性樹脂組成物及び樹脂成形品 |
JP2016060745A (ja) * | 2014-09-12 | 2016-04-25 | 日本エイアンドエル株式会社 | 熱可塑性樹脂組成物 |
JP2017075297A (ja) * | 2015-10-16 | 2017-04-20 | 三菱エンジニアリングプラスチックス株式会社 | ポリカーボネート樹脂組成物 |
JP2018159008A (ja) * | 2017-03-23 | 2018-10-11 | 日本エイアンドエル株式会社 | ポリカーボネート改質剤及びその製造方法 |
JP2020084011A (ja) * | 2018-11-22 | 2020-06-04 | テクノUmg株式会社 | 熱可塑性樹脂組成物およびその成形品 |
-
2022
- 2022-11-24 WO PCT/JP2022/043333 patent/WO2023095826A1/ja active Application Filing
- 2022-11-24 CN CN202280074676.8A patent/CN118317985A/zh active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0420550A (ja) | 1990-05-14 | 1992-01-24 | Nippon Oil & Fats Co Ltd | 熱可塑性樹脂組成物およびその製造方法 |
JP2000038513A (ja) | 1998-07-24 | 2000-02-08 | Otsuka Chem Co Ltd | 摺動部材用樹脂組成物及び摺動部材 |
JP2015178567A (ja) * | 2014-03-19 | 2015-10-08 | ユーエムジー・エービーエス株式会社 | 熱可塑性樹脂組成物及び樹脂成形品 |
JP2016060745A (ja) * | 2014-09-12 | 2016-04-25 | 日本エイアンドエル株式会社 | 熱可塑性樹脂組成物 |
JP2017075297A (ja) * | 2015-10-16 | 2017-04-20 | 三菱エンジニアリングプラスチックス株式会社 | ポリカーボネート樹脂組成物 |
JP2018159008A (ja) * | 2017-03-23 | 2018-10-11 | 日本エイアンドエル株式会社 | ポリカーボネート改質剤及びその製造方法 |
JP2020084011A (ja) * | 2018-11-22 | 2020-06-04 | テクノUmg株式会社 | 熱可塑性樹脂組成物およびその成形品 |
Also Published As
Publication number | Publication date |
---|---|
CN118317985A (zh) | 2024-07-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10227486B2 (en) | Contacting part made of thermoplastic resin composition with reduced squeaking noises | |
KR20190082073A (ko) | 열가소성 수지 조성물 및 이를 이용한 성형품 | |
JP5547793B2 (ja) | 熱可塑性樹脂組成物及び成形品 | |
JP7216628B2 (ja) | グラフト共重合体及び熱可塑性樹脂組成物 | |
WO2023095826A1 (ja) | グラフト共重合体及び熱可塑性樹脂組成物 | |
JP6584814B2 (ja) | グラフト共重合体及び熱可塑性樹脂組成物 | |
CN109438624B (zh) | 接枝共聚物以及热塑性树脂组合物 | |
JP6563316B2 (ja) | グラフト共重合体 | |
JP2022187748A (ja) | 熱可塑性樹脂組成物および成形品 | |
JP6087330B2 (ja) | 軋み音を低減した熱可塑性樹脂組成物及び成形品 | |
KR20240107109A (ko) | 그래프트 공중합체 및 열가소성 수지 조성물 | |
KR102437497B1 (ko) | 폴리카보네이트 개질제 및 그 제조 방법 | |
JP5547796B2 (ja) | 熱可塑性樹脂組成物及び成形品 | |
JP2015042752A (ja) | 軋み音を低減した熱可塑性樹脂組成物製接触用部品 | |
JP6602516B1 (ja) | 熱可塑性樹脂組成物 | |
JP2017101255A (ja) | 熱可塑性樹脂組成物製接触用部品 | |
JP2003138122A (ja) | 車両用外装材料および車両用外装部品 | |
JPH11181269A (ja) | メッキ用樹脂組成物およびメッキ成形品 | |
WO2018051870A1 (ja) | 熱可塑性樹脂組成物およびその成形体 | |
JP2020164806A (ja) | グラフト共重合体、二色積層体、及びグラフト共重合体の製造方法 | |
JP2012219226A (ja) | 帯電防止性熱可塑性樹脂組成物及びその成形品 | |
JP2016166377A (ja) | 熱可塑性樹脂組成物成形品の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 22898608 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2023563721 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2022898608 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 2022898608 Country of ref document: EP Effective date: 20240626 |