WO2023089904A1 - Procédé de fabrication d'une solution d'ozone et procédé d'utilisation d'une solution d'ozone - Google Patents

Procédé de fabrication d'une solution d'ozone et procédé d'utilisation d'une solution d'ozone Download PDF

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Publication number
WO2023089904A1
WO2023089904A1 PCT/JP2022/032675 JP2022032675W WO2023089904A1 WO 2023089904 A1 WO2023089904 A1 WO 2023089904A1 JP 2022032675 W JP2022032675 W JP 2022032675W WO 2023089904 A1 WO2023089904 A1 WO 2023089904A1
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Prior art keywords
liquid
ozone
ufb
dissolved
ultra
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PCT/JP2022/032675
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English (en)
Japanese (ja)
Inventor
毅 山久保
雅彦 久保田
輝 山本
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キヤノン株式会社
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Publication of WO2023089904A1 publication Critical patent/WO2023089904A1/fr

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L2/00—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
    • A61L2/16—Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor using chemical substances
    • A61L2/18—Liquid substances or solutions comprising solids or dissolved gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D19/00—Degasification of liquids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F21/00—Dissolving
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/20—Mixing gases with liquids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/20—Mixing gases with liquids
    • B01F23/23—Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/90—Heating or cooling systems
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B13/00—Oxygen; Ozone; Oxides or hydroxides in general
    • C01B13/10—Preparation of ozone
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/50—Treatment of water, waste water, or sewage by addition or application of a germicide or by oligodynamic treatment
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/72—Treatment of water, waste water, or sewage by oxidation
    • C02F1/78—Treatment of water, waste water, or sewage by oxidation with ozone
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L2101/00—Chemical composition of materials used in disinfecting, sterilising or deodorising

Definitions

  • the present invention relates to a method for producing and utilizing an ozone solution.
  • Patent Literature 1 discloses a method for producing ozone-dissolved water in which high-concentration ozone gas is dissolved.
  • the present invention provides a method for producing an ozone solution and a method for utilizing the ozone solution that can produce an ozone solution having a desired concentration with a simple configuration.
  • the method of utilizing the dissolved ozone solution of the present invention includes a first dissolving step of dissolving ozone gas in a liquid, and an ultra-fine bubble generating step of generating ultra-fine bubbles in the dissolved ozone solution in which the ozone gas is dissolved in the first dissolving step.
  • FIG. 4 is a schematic configuration diagram of a pretreatment unit;
  • FIG. FIG. 3 is a diagram for explaining a schematic configuration diagram of a dissolving unit and a dissolving state of a liquid;
  • 2 is a schematic configuration diagram of a T-UFB generation unit;
  • FIG. 3 is a diagram showing the detailed structure of a heating element;
  • FIG. 4 is a diagram showing how film boiling occurs when a predetermined voltage pulse is applied to a heating element;
  • FIG. 4 is a diagram schematically showing how film boiling bubbles are generated and UFB is generated;
  • FIG. 4 is a diagram showing how UFB is generated as a film boiling bubble shrinks.
  • FIG. 4 is a diagram showing how UFB is generated when a film boiling bubble contracts.
  • FIG. 10 is a diagram showing how UFB is generated by impact when film boiling bubbles disappear.
  • 4 is a diagram showing a configuration example of a post-processing unit;
  • FIG. 4 is a schematic diagram showing a defoaming unit for defoaming USB; It is the flowchart which showed the procedure of the ozone solution utilization method.
  • FIG. 10 is a diagram showing the results of comparative evaluation of the sterilization effects of ozone-dissolved liquids.
  • ozone ultra-fine bubbles (hereinafter simply referred to as UFB) having a diameter of less than 1.0 ⁇ m are used to generate an ozone solution with a desired concentration.
  • UFB ozone ultra-fine bubbles
  • FIG. 1 is a diagram showing an example of an ultra-fine bubble generator (also referred to as a UFB generator) applicable to the present invention.
  • the UFB generator 1 of this embodiment includes a pretreatment unit 100, a dissolution unit 200, a T-UFB generation unit 300, a posttreatment unit 400, and a recovery unit 500.
  • the liquid W such as tap water supplied to the pretreatment unit 100 is treated in the order described above and is recovered by the recovery unit 500 as a TUFB-containing liquid.
  • T-UFB Thermal-Ultra Fine Bubble
  • FIG. 2 is a schematic configuration diagram of the pretreatment unit 100.
  • the pretreatment unit 100 of the present embodiment deaerates the supplied liquid W.
  • the pretreatment unit 100 mainly has a deaeration container 101, a shower head 102, a decompression pump 103, a liquid introduction path 104, a liquid circulation path 105, and a liquid extraction path .
  • a liquid W such as tap water is supplied from the liquid introduction passage 104 to the degassing container 101 via the valve 109 .
  • the shower head 102 provided in the deaeration container 101 atomizes the liquid W into the deaeration container 101 .
  • the shower head 102 is for promoting vaporization of the liquid W, but a centrifugal separator or the like can be substituted as a mechanism for producing the effect of promoting vaporization.
  • the decompression pump 103 After a certain amount of the liquid W is stored in the degassing container 101, when the decompression pump 103 is operated with all the valves closed, the already vaporized gas component is discharged and dissolved in the liquid W. Vaporization and evacuation of gaseous components present are also promoted. At this time, the internal pressure of the degassing container 101 may be reduced to about several hundred to several thousand Pa (1.0 Torr to 10.0 Torr) while checking the pressure gauge 108 . Gases deaerated by the pretreatment unit 100 include, for example, nitrogen, oxygen, argon, and carbon dioxide.
  • the degassing process described above can be repeatedly performed on the same liquid W by using the liquid circulation path 105 .
  • the shower head 102 is operated with the valve 109 of the liquid introduction path 104 and the valve 110 of the liquid outlet path 106 closed and the valve 107 of the liquid circulation path 105 opened.
  • the liquid W stored in the degassing container 101 and subjected to the degassing process once is sprayed again into the degassing container 101 via the shower head 102 .
  • the decompression pump 103 by activating the decompression pump 103, the vaporization process by the shower head 102 and the degassing process by the decompression pump 103 are performed on the same liquid W at the same time.
  • the gas component contained in the liquid W can be reduced step by step each time the above-described repeated processing using the liquid circulation path 105 is performed.
  • the valve 110 is opened to send the liquid W to the dissolving unit 200 through the liquid lead-out path 106 .
  • FIG. 2 shows the pretreatment unit 100 that vaporizes the dissolved matter by reducing the pressure of the gas portion
  • the method of degassing the dissolved liquid is not limited to this.
  • a heat boiling method in which the liquid W is boiled to vaporize the dissolved matter may be employed, or a membrane degassing method in which hollow fibers are used to increase the interface between the liquid and the gas may be employed.
  • SEPAREL series manufactured by Dainippon Ink Co., Ltd.
  • SEPAREL series is commercially available as a degassing module using hollow fibers.
  • This uses poly-4-methylpentene-1 (PMP) as the raw material of the hollow fiber membrane, and is mainly used for the purpose of degassing air bubbles from the ink supplied to the piezo head. Furthermore, two or more of the vacuum degassing method, the heat boiling method, and the membrane degassing method may be used in combination.
  • PMP poly-4-methylpentene-1
  • FIGS. 3(a) and 3(b) are schematic diagrams of the dissolving unit 200 and diagrams for explaining the dissolving state of the liquid.
  • the dissolving unit 200 is a unit that dissolves ozone gas (hereinafter referred to as gas G) in the liquid W supplied from the pretreatment unit 100 .
  • the dissolving unit 200 of this embodiment mainly has a dissolving container 201 , a rotating shaft 203 to which a rotating plate 202 is attached, a liquid introduction path 204 , a gas introduction path 205 , a liquid outlet path 206 and a pressure pump 207 .
  • Methods such as ultraviolet irradiation, discharge, and electrolysis are commonly used to generate ozone gas.
  • the method for generating ozone gas is not specified, and any available ozone gas generating device may be connected to the gas introduction path 205 .
  • the liquid W supplied from the pretreatment unit 100 is supplied to the dissolution container 201 through the liquid introduction path 204 and stored therein.
  • the gas G is supplied to the dissolving container 201 through the gas introduction path 205 .
  • the pressure pump 207 is operated to increase the internal pressure of the dissolving container 201 to approximately 0.5 MPa.
  • a safety valve 208 is arranged between the pressure pump 207 and the dissolving container 201 . Further, by rotating the rotating plate 202 in the liquid via the rotating shaft 203, the gas G supplied to the dissolution container 201 is bubbled, the contact area with the liquid W is increased, and the dissolution in the liquid W is facilitated. Facilitate.
  • solubility of the gas G reaches approximately the maximum saturation solubility.
  • means for lowering the temperature of the liquid may be arranged in order to dissolve as much gas as possible. It is also possible to increase the internal pressure of the dissolving container 201 to 0.5 MPa or higher. In that case, it is necessary to optimize the material of the container from a safety point of view.
  • the liquid W in which the components of the gas G are dissolved at the desired concentration is obtained, the liquid W is discharged through the liquid lead-out path 206 and supplied to the T-UFB generation unit 300 .
  • the back pressure valve 209 adjusts the flow pressure of the liquid W so that the pressure during supply does not become higher than necessary.
  • FIG. 3(b) is a diagram schematically showing how the mixed gas G is dissolved in the dissolution container 201.
  • FIG. Bubbles 2 containing the component of gas G mixed in liquid W dissolve from the portion in contact with liquid W. As shown in FIG. Therefore, the bubble 2 gradually shrinks, and the gas-dissolved liquid 3 exists around the bubble 2 . Since buoyancy acts on the bubble 2 , the bubble 2 moves to a position off the center of the gas-dissolved liquid 3 or separates from the gas-dissolved liquid 3 to become a residual bubble 4 . That is, the liquid W supplied to the T-UFB generation unit 300 through the liquid lead-out path 206 includes the gas-dissolved liquid 3 surrounding the bubbles 2, and the gas-dissolved liquid 3 and the bubbles 2 separated from each other. There are mixed states.
  • the gas-dissolved liquid 3 means "a region in which the mixed gas G has a relatively high dissolved concentration in the liquid W".
  • the concentration is highest around the bubble 2 or even in the state separated from the bubble 2, and the concentration of the gas component is continuous as the distance from that position increases. relatively low. That is, in FIG. 3B, the area of the gas-dissolved liquid 3 is surrounded by a dashed line for explanation, but such a clear boundary does not actually exist.
  • the present invention even if a gas that is not completely dissolved exists in the liquid in the form of bubbles, it is allowed.
  • FIG. 4 is a schematic configuration diagram of the T-UFB generation unit 300.
  • the T-UFB generation unit 300 mainly includes a chamber 301, a liquid introduction path 302, and a liquid outlet path 303. Flow from the liquid introduction path 302 to the liquid outlet path 303 through the chamber 301 is controlled by a flow pump (not shown). formed by Various types of pumps such as diaphragm pumps, gear pumps, and screw pumps can be used as fluid pumps.
  • the liquid W introduced from the liquid introduction path 302 is mixed with the gas-dissolved liquid 3 of the gas G mixed by the dissolving unit 200 .
  • An element substrate 12 provided with heat generating elements 10 is arranged on the bottom surface of the chamber 301 .
  • a bubble 13 caused by film boiling (hereinafter also referred to as a film boiling bubble 13 ) is generated in a region in contact with the heating element 10 .
  • ultra-fine bubbles (UFB 11) containing the gas G are generated.
  • UFB 11 ultra-fine bubbles
  • FIGS. 5(a) and 5(b) are diagrams showing the detailed structure of the heating element 10.
  • FIG. 5(a) shows the vicinity of the heating elements 10
  • FIG. 5(b) shows a cross-sectional view of the element substrate 12 in a wider area including the heating elements 10. As shown in FIG.
  • a thermal oxide film 305 as a heat storage layer and an interlayer film 306 also serving as a heat storage layer are laminated on the surface of a silicon substrate 304.
  • a SiO 2 film or a SiN film can be used as the interlayer film 306 .
  • a resistance layer 307 is formed on the surface of the interlayer film 306 , and wiring 308 is partially formed on the surface of the resistance layer 307 .
  • an Al alloy wiring such as Al, Al--Si, or Al--Cu can be used.
  • a protective layer 309 made of an SiO 2 film or a Si 3 N 4 film is formed on the surfaces of these wirings 308 , resistance layer 307 and interlayer film 306 .
  • the protective layer 309 On the surface of the protective layer 309, the portion corresponding to the heat acting portion 311 that eventually becomes the heating element 10 and its surroundings are covered with the protective layer 309 against chemical and physical impacts accompanying the heat generation of the resistance layer 307.
  • An anti-cavitation film 310 is formed to protect the .
  • a region on the surface of the resistance layer 307 where the wiring 308 is not formed is a heat acting portion 311 where the resistance layer 307 generates heat.
  • a heat-generating portion of the resistance layer 307 where the wiring 308 is not formed functions as a heat-generating element (heater) 10 .
  • the layers of the element substrate 12 are sequentially formed on the surface of the silicon substrate 304 by semiconductor manufacturing techniques, whereby the silicon substrate 304 is provided with the heat acting portion 311 .
  • the configuration shown in the figure is an example, and various other configurations are applicable.
  • a configuration in which the resistive layer 307 and the wiring 308 are stacked in reverse order, and a configuration in which an electrode is connected to the lower surface of the resistive layer 307 are applicable.
  • any configuration may be used as long as the liquid can be heated by the heat acting portion 311 to cause film boiling in the liquid.
  • FIG. 5(b) is an example of a cross-sectional view of a region including a circuit connected to the wiring 308 in the element substrate 12.
  • An N-type well region 322 and a P-type well region 323 are partially provided on the surface layer of the silicon substrate 304, which is a P-type conductor.
  • a P-MOS 320 is formed in the N-type well region 322 and an N-MOS 321 is formed in the P-type well region 323 by introducing and diffusing impurities such as ion implantation by a general MOS process.
  • the P-MOS 320 is composed of a source region 325 and a drain region 326 obtained by partially introducing an N-type or P-type impurity into the surface layer of the N-type well region 322, a gate wiring 335, and the like.
  • a gate wiring 335 is deposited on the surface of the portion of the N-type well region 322 excluding the source region 325 and the drain region 326 via a gate insulating film 328 with a thickness of several hundred angstroms.
  • the N-MOS 321 is composed of a source region 325 and a drain region 326 formed by partially introducing an N-type or P-type impurity into the surface layer of a P-type well region 323, a gate wiring 335, and the like.
  • a gate wiring 335 is deposited on the surface of the portion of the P-type well region 323 excluding the source region 325 and the drain region 326 via a gate insulating film 328 with a thickness of several hundred angstroms.
  • the gate wiring 335 is made of polysilicon deposited by CVD to a thickness of 3000 ⁇ to 5000 ⁇ .
  • an N-MOS transistor 330 for driving an electrothermal conversion element is formed in a portion different from the N-MOS 321.
  • the N-MOS transistor 330 is composed of a source region 332 and a drain region 331 partially formed in the surface layer of the P-type well region 323 by steps such as impurity introduction and diffusion, a gate wiring 333, and the like.
  • a gate wiring 333 is deposited on the surface of a portion of the P-type well region 323 excluding the source region 332 and the drain region 331 via a gate insulating film 328 .
  • an N-MOS transistor 330 is used as a driving transistor for the electrothermal conversion element.
  • the drive transistor may be any transistor that has the ability to individually drive a plurality of electrothermal conversion elements and that can obtain the fine structure described above. Not limited.
  • the electrothermal conversion element and its driving transistor are formed on the same substrate, but they may be formed on separate substrates.
  • an oxide film isolation region 324 is formed by field oxidation to a thickness of 5000 ⁇ to 10000 ⁇ . ing. Each device is isolated by this oxide film isolation region 324 .
  • a portion of the oxide film isolation region 324 corresponding to the heat acting portion 311 functions as the first heat storage layer 334 on the silicon substrate 304 .
  • An interlayer insulating film 336 made of a PSG film or BPSG film having a thickness of about 7000 ⁇ is formed on the surface of each element of the P-MOS 320, N-MOS 321 and N-MOS transistor 330 by CVD. After the interlayer insulating film 336 is flattened by heat treatment, an Al electrode 337 serving as a first wiring layer is formed via a contact hole penetrating the interlayer insulating film 336 and the gate insulating film 328 . An interlayer insulating film 338 made of an SiO2 film with a thickness of 10000 ⁇ to 15000 ⁇ is formed on the surfaces of the interlayer insulating film 336 and the Al electrode 337 by plasma CVD.
  • the resistance layer 307 is electrically connected to the Al electrode 337 near the drain region 331 through a through hole formed in the interlayer insulating film 338 .
  • Al wiring 308 is formed on the surface of the resistance layer 307 as a second wiring layer serving as wiring to each electrothermal conversion element.
  • the wiring 308, the resistance layer 307, and the protective layer 309 on the surface of the interlayer insulating film 338 are made of a 3000 ⁇ thick SiN film formed by plasma CVD.
  • the anti-cavitation film 310 deposited on the surface of the protective layer 309 is made of at least one metal selected from Ta, Fe, Ni, Cr, Ge, Ru, Zr, Ir, etc., and is a thin film with a thickness of about 2000 ⁇ .
  • FIGS. 6(a) and 6(b) are diagrams showing how film boiling occurs when a predetermined voltage pulse is applied to the heating element 10.
  • FIG. Here, the case of film boiling under atmospheric pressure is shown.
  • the horizontal axis indicates time.
  • the vertical axis of the lower graph indicates the voltage applied to the heating element 10
  • the vertical axis of the upper graph indicates the volume and internal pressure of the film boiling bubbles 13 generated by film boiling.
  • FIG. 6(b) shows how the film boiling bubbles 13 correspond to timings 1 to 3 shown in FIG. 6(a). Each state will be described below in chronological order.
  • the UFB 11 generated by film boiling is mainly generated in the vicinity of the surface of the film boiling bubbles 13 .
  • the UFB 11 generated in the T-UFB generation unit 300 is supplied again to the dissolution unit 200 through the circulation path, and the liquid is supplied to the T-UFB generation unit. 300 shows a state in which the liquid is re-supplied to the liquid path.
  • the inside of the chamber 301 is kept at substantially atmospheric pressure.
  • film boiling bubbles 13 the generated bubbles (hereinafter referred to as film boiling bubbles 13) expand due to the high pressure acting from the inside (timing 1).
  • the foaming pressure at this time is considered to be about 8 to 10 MPa, which is close to the saturated vapor pressure of water.
  • the film boiling bubble 13 expands due to the inertia of the pressure obtained at timing 1 even after the voltage is no longer applied.
  • the negative pressure generated along with the expansion gradually increases and acts in the direction of shrinking the film boiling bubble 13 .
  • the volume of the film boiling bubble 13 reaches its maximum at timing 2 when the inertial force and the negative pressure are balanced, and then rapidly shrinks due to the negative pressure.
  • FIGS. 7(a) to (d) are diagrams schematically showing how the UFB 11 is generated as the film boiling bubbles 13 are generated and expanded.
  • FIG. 7A shows the state before a voltage pulse is applied to the heating element 10.
  • FIG. 7(b) shows how a voltage is applied to the heating element 10 and the film boiling bubbles 13 are generated uniformly over almost the entire area of the heating element 10 in contact with the liquid W.
  • FIG. 7(b) shows how a voltage is applied to the heating element 10 and the film boiling bubbles 13 are generated uniformly over almost the entire area of the heating element 10 in contact with the liquid W.
  • FIG. 7(b) shows how a voltage is applied to the heating element 10 and the film boiling bubbles 13 are generated uniformly over almost the entire area of the heating element 10 in contact with the liquid W.
  • the surface temperature of the heating element 10 rises to about 600 to 800° C. during pulse application, and the liquid around the film boiling bubble 13 is also rapidly heated.
  • a region of the liquid located around the film boiling bubbles 13 and rapidly heated is shown as an unfoamed high-temperature region 14 .
  • the gas-dissolved liquid 3 contained in the unfoamed high-temperature region 14 exceeds the thermal solubility limit and precipitates to become UFB.
  • the deposited bubbles have a diameter of about 10 nm to 100 nm and have a high gas-liquid interfacial energy. Therefore, it floats in the liquid W while maintaining its independence without disappearing in a short time.
  • the bubbles generated by the thermal action when the film boiling bubbles 13 are generated and expanded are referred to as first UFB 11A.
  • FIG. 7(c) shows the process in which the film boiling bubbles 13 expand. Even after the application of the voltage pulse to the heating element 10 ends, the film boiling bubbles 13 continue to expand due to the inertia of the force obtained when they are generated, and the non-bubbled high-temperature regions 14 also move and diffuse due to inertia. That is, in the process in which the film boiling bubbles 13 expand, the gas-dissolved liquid 3 contained in the unfoamed high-temperature region 14 is newly precipitated as bubbles to form the first UFB 11A.
  • FIG. 7(d) shows a state in which the film boiling bubble 13 has reached its maximum volume.
  • the film boiling bubble 13 expands due to inertia, but the negative pressure inside the film boiling bubble 13 gradually increases with the expansion, and acts as a negative pressure to contract the film boiling bubble 13 . Then, when this negative pressure balances with the inertial force, the volume of the film boiling bubbles 13 reaches its maximum, and thereafter begins to contract.
  • FIGS. 8(a) to 8(c) are diagrams showing how the UFB 11 is generated as the film boiling bubbles 13 contract.
  • FIG. 8(a) shows a state in which the film boiling bubbles 13 have started contracting. Even if the film boiling bubble 13 starts contracting, the surrounding liquid W still has an inertial force in the expanding direction. Therefore, the inertial force acting in the direction away from the heating element 10 and the force directed toward the heating element 10 due to the contraction of the film boiling bubble 13 act on the extreme periphery of the film boiling bubble 13, resulting in a decompressed region. Become. In the drawing, such a region is indicated as an unfoamed negative pressure region 15.
  • FIG. 8(a) shows a state in which the film boiling bubbles 13 have started contracting. Even if the film boiling bubble 13 starts contracting, the surrounding liquid W still has an inertial force in the expanding direction. Therefore, the inertial force acting in the direction away from the heating element 10 and the force directed toward the heating element 10 due to the contraction of the
  • the gas-dissolving liquid 3 contained in the non-foaming negative pressure region 15 exceeds the pressure solubility limit and precipitates as bubbles.
  • the precipitated bubbles have a diameter of about 100 nm, and do not disappear in a short period of time and float in the liquid W while maintaining their independence.
  • the bubbles deposited by the pressure action when the film boiling bubbles 13 contract in this manner are referred to as second UFB 11B.
  • FIG. 8(b) shows the process of contraction of the film boiling bubble 13.
  • the speed at which the film boiling bubbles 13 shrink is accelerated by the negative pressure, and the unfoamed negative pressure region 15 also moves with the contraction of the film boiling bubbles 13 . That is, in the process of contraction of the film boiling bubbles 13, the gas-dissolved liquid 3 at the location through which the unfoamed negative pressure region 15 passes is deposited one after another to form the second UFB 11B.
  • FIG. 8(c) shows the state immediately before the film boiling bubble 13 disappears.
  • the accelerated contraction of the film boiling bubbles 13 also increases the moving speed of the surrounding liquid W, but pressure loss occurs due to the flow path resistance in the chamber 301 .
  • the area occupied by the unfoamed negative pressure area 15 becomes even larger, and a large number of second UFBs 11B are generated.
  • FIGS. 9(a) to (c) are diagrams showing how UFB is generated by reheating the liquid W when the film boiling bubbles 13 are contracted.
  • FIG. 9A shows a state in which the surface of the heating element 10 is covered with shrinking film boiling bubbles 13 .
  • FIG. 9(b) shows a state in which the contraction of the film boiling bubbles 13 progresses and part of the surface of the heating element 10 is in contact with the liquid W.
  • FIG. 9(b) shows a state in which the contraction of the film boiling bubbles 13 progresses and part of the surface of the heating element 10 is in contact with the liquid W.
  • heat remains on the surface of the heating element 10 to such an extent that film boiling does not occur even when the liquid W is brought into contact with the surface.
  • the area of the liquid that is heated by contact with the surface of the heating element 10 is shown as an unfoamed reheating area 16 .
  • the gas-dissolved liquid 3 contained in the unfoamed reheating region 16 is precipitated beyond the thermal solubility limit.
  • bubbles generated by reheating the liquid W when the film boiling bubbles 13 contract in this manner are referred to as third UFB 11C.
  • FIG. 9(c) shows a state in which the shrinkage of the film boiling bubbles 13 has progressed further.
  • the area of the heat generating element 10 in contact with the liquid W becomes larger, so the third UFB 11C is generated until the film boiling bubbles 13 disappear.
  • FIGS. 10(a) and 10(b) are diagrams showing how UFB is generated by impact (so-called cavitation) when the film boiling bubbles 13 generated by film boiling are destroyed.
  • FIG. 10(a) shows a state immediately before the film boiling bubble 13 disappears. The film boiling bubbles 13 are rapidly contracted by the internal negative pressure, and are surrounded by the non-foamed negative pressure region 15 .
  • FIG. 10(b) shows the state immediately after the film boiling bubble 13 disappears at the point P.
  • the acoustic wave spreads concentrically with the point P as a starting point due to the impact.
  • Acoustic waves are a general term for elastic waves that propagate regardless of gas, liquid, or solid. be done.
  • the gas-dissolved liquid 3 contained in the unfoamed negative pressure region 15 is resonated by the shock wave when the film boiling bubbles 13 disappear, and undergoes a phase transition exceeding the pressure solubility limit at the timing when the low pressure surface 17B passes. . That is, at the same time when the film boiling bubbles 13 disappear, a large number of bubbles are precipitated in the non-bubbled negative pressure region 15 .
  • a bubble generated by a shock wave when the film boiling bubble 13 disappears is called a fourth UFB 11D.
  • the diameter is significantly smaller than the first to third UFBs, and the gas-liquid interfacial energy is higher than the first to third UFBs. Therefore, it is considered that the fourth UFB 11D has different properties and produces different effects from those of the first to third UFBs 11A to 11C.
  • the fourth UFB 11D is uniformly generated throughout the concentric spherical region where the shock wave propagates, it is uniformly present in the chamber 301 from the time of generation. At the timing when the fourth UFB 11D is generated, many first to third UFBs already exist, but the existence of these first to third UFBs does not greatly affect the generation of the fourth UFB 11D. do not have. Also, it is considered that the generation of the fourth UFB 11D will not cause the first to third UFBs to disappear.
  • the UFB 11 is generated in a plurality of stages from the generation of the film boiling bubbles 13 by the heat generated by the heating element 10 to the disappearance of the bubbles.
  • the first UFB 11A, the second UFB 11B and the third UFB 11C are generated near the surface of film boiling bubbles generated by film boiling.
  • the neighborhood is a region within about 20 ⁇ m from the surface of the film boiling bubble.
  • the fourth UFB 11D is generated in a region where a shock wave generated when bubbles disappear (disappear) propagates.
  • an example was shown until the film boiling bubbles 13 disappeared, but the present invention is not limited to this in order to generate UFB.
  • UFB can be generated even when the film boiling bubbles 13 are not exhausted.
  • the dissolution characteristics of the gas rise and the generated UFB becomes easier to liquefy.
  • temperatures are well below ambient temperature.
  • the UFB once generated has a high internal pressure and a high gas-liquid interfacial energy, so the possibility of a high pressure acting to break the gas-liquid interface is extremely low. That is, the UFB once produced does not disappear easily as long as the liquid is stored at normal temperature and normal pressure.
  • the higher the liquid pressure, the higher the gas dissolution characteristics, and the lower the pressure the lower the dissolution characteristics. That is, the lower the pressure of the liquid, the more likely the phase transition of the gas-dissolved liquid dissolved in the liquid to the gas is promoted, and the UFB is likely to be generated.
  • the pressure of the liquid is lowered from normal pressure, the dissolution characteristics drop sharply and UFB begins to be generated.
  • the pressure dissolution characteristics decrease, resulting in a situation in which a large amount of UFB is generated.
  • the first to fourth UFBs with different generated factors have been individually explained, but the above-mentioned generating factors occur simultaneously and frequently with the event of film boiling. Therefore, at least two types of UFBs among the first to fourth UFBs may be generated simultaneously, and these generation factors may cooperate with each other to generate UFBs. However, it is common that all generation factors are caused by changes in the volume of film boiling bubbles generated by the film boiling phenomenon.
  • T-UFB Thermal-Ultra Fine Bubble
  • the UFB produced by the T-UFB producing method is called T-UFB
  • the liquid containing T-UFB produced by the T-UFB producing method is called T-UFB-containing liquid.
  • the bubbles generated by the T-UFB generation method are 1.0 ⁇ m or less, and millibubbles and microbubbles are difficult to generate. That is, according to the T-UFB generation method, UFB is predominantly and efficiently generated.
  • the T-UFB produced by the T-UFB production method has a higher gas-liquid interfacial energy than the UFB produced by the conventional method, and does not disappear easily as long as it is stored at normal temperature and normal pressure. Furthermore, even if new T-UFB is generated by new film boiling, the previously generated T-UFB is prevented from disappearing due to the impact.
  • the number and concentration of T-UFB contained in the T-UFB-containing liquid have hysteresis characteristics with respect to the number of occurrences of film boiling in the T-UFB-containing liquid.
  • the concentration of T-UFB contained in the T-UFB-containing liquid can be adjusted by controlling the number of heating elements arranged in the T-UFB generation unit 300 and the number of voltage pulse applications to the heating elements. .
  • the UFB-containing liquid W having the desired UFB concentration is generated in the T-UFB generation unit 300 .
  • the UFB-containing liquid W is supplied to the post-processing unit 400 .
  • FIG. 11(a) to (c) are diagrams showing a configuration example of the post-processing unit 400 of this embodiment.
  • the post-treatment unit 400 of the present embodiment removes impurities contained in the UFB-containing liquid W in stages in the order of inorganic ions, organic substances, and insoluble solids.
  • FIG. 11(a) shows a first post-treatment mechanism 410 for removing inorganic ions.
  • the first post-treatment mechanism 410 includes an exchange container 411 , a cation exchange resin 412 , a liquid introduction path 413 , a water collection pipe 414 and a liquid outlet path 415 .
  • the exchange container 411 contains a cation exchange resin 412 .
  • the UFB-containing liquid W produced by the T-UFB production unit 300 is injected into the exchange container 411 via the liquid introduction path 413 and absorbed by the cation exchange resin 412, where cations as impurities are removed. be.
  • Such impurities include metal materials separated from the element substrate 12 of the T-UFB generation unit 300, such as SiO 2 , SiN, SiC, Ta, Al 2 O 3 , Ta 2 O 5 and Ir. be done.
  • the cation exchange resin 412 is a synthetic resin in which a functional group (ion exchange group) is introduced into a polymer matrix having a three-dimensional network structure. presenting.
  • a styrene-divinylbenzene copolymer is generally used as the polymer base, and methacrylic acid-based and acrylic acid-based functional groups can be used as the functional group.
  • the above materials are only examples. Various changes can be made to the above materials as long as the desired inorganic ions can be effectively removed.
  • the UFB-containing liquid W absorbed by the cation exchange resin 412 and from which the inorganic ions have been removed is collected by the water collecting pipe 414 and sent to the next step through the liquid lead-out path 415 .
  • FIG. 11(b) shows a second post-treatment mechanism 420 for removing organic matter.
  • the second post-treatment mechanism 420 includes a container 421 , a filtration filter 422 , a vacuum pump 423 , a valve 424 , a liquid introduction path 425 , a liquid extraction path 426 and an air suction path 427 .
  • the inside of the storage container 421 is divided into upper and lower regions by a filtration filter 422 .
  • the liquid introduction path 425 connects to the upper area of the upper and lower areas, and the air suction path 427 and the liquid lead-out path 426 connect to the lower area.
  • the vacuum pump 423 When the vacuum pump 423 is driven with the valve 424 closed, the air in the container 421 is discharged through the air suction path 427, the pressure inside the container 421 becomes negative, and the UFB-containing liquid is drawn from the liquid introduction path 425. W is introduced. Then, the UFB-containing liquid W from which impurities have been removed by the filtration filter 422 is stored in the container 421 .
  • Impurities removed by the filtration filter 422 include organic materials that can be mixed in the tubes and each unit, such as organic compounds containing silicon, siloxane, and epoxy.
  • Filter membranes that can be used for the filtration filter 422 include a sub- ⁇ m mesh filter that can remove even bacteria and an nm mesh filter that can remove viruses.
  • the vacuum pump 423 is stopped and the valve 424 is opened. liquid.
  • the vacuum filtration method is used as a method for removing organic impurities, but gravity filtration or pressure filtration can also be used as a filtration method using a filter.
  • FIG. 11(c) shows a third post-treatment mechanism 430 for removing undissolved solids.
  • the third post-treatment mechanism 430 comprises a sedimentation container 431 , a liquid introduction channel 432 , a valve 433 and a liquid outlet channel 434 .
  • a predetermined amount of the UFB-containing liquid W is stored in the precipitation container 431 from the liquid introduction path 432 and left for a while.
  • the solids contained in the UFB-containing liquid W settle to the bottom of the sedimentation container 431 due to gravity.
  • relatively large-sized bubbles such as microbubbles also rise to the surface of the liquid due to buoyancy and are removed from the UFB-containing liquid.
  • the valve 433 is opened after a sufficient amount of time has passed, the UFB-containing liquid W from which solids and large-sized bubbles have been removed is sent to the recovery unit 500 through the liquid lead-out path 434 .
  • the present invention is not limited to this, and any post-processing mechanism may be employed as appropriate.
  • the T-UFB-containing liquid W from which impurities have been removed in the post-treatment unit 400 may be sent to the recovery unit 500 as it is, or may be returned to the dissolution unit 200 again.
  • the dissolved gas concentration of the T-UFB-containing liquid W which has decreased due to the production of T-UFB, can be replenished to the saturation state in the dissolving unit 200 again.
  • the concentration of UFB in the T-UFB-containing liquid can be further increased based on the characteristics described above.
  • the UFB content concentration can be increased by the number of circulations through the dissolving unit 200, the T-UFB generation unit 300, and the post-treatment unit 400, and after the desired UFB content concentration is obtained, the UFB-containing liquid W can be sent to the recovery unit 500 .
  • the recovery unit 500 recovers and stores the UFB-containing liquid W sent from the post-treatment unit 400 .
  • the T-UFB-containing liquid recovered by the recovery unit 500 becomes a high-purity UFB-containing liquid from which various impurities have been removed.
  • the recovery unit 500 may be provided with a cooling means. Note that such a cooling means may be provided in a part of the post-processing unit 400 .
  • a unit for removing impurities as shown in FIGS. 11(a) to (c) may be provided upstream of the T-UFB generation unit 300, or may be provided both upstream and downstream. If the liquid supplied to the UFB generator is tap water, rain water, or contaminated water, the liquid may contain organic or inorganic impurities. If the liquid W containing such impurities is supplied to the T-UFB generation unit 300, there is a risk that the heating elements 10 will be degraded or salting out will occur. By providing a mechanism as shown in FIGS. 11(a) to 11(c) upstream of the T-UFB generation unit 300, the above impurities can be removed in advance.
  • the bubble diameter of the T-UFB containing liquid containing ozone gas generated by this UFB generator 1 is 200 nm or less, the particle size distribution range is small, and the state of containing ozone gas can be maintained even after being left for half a year or more. . Therefore, the storage stability is better than that of UFB-containing liquids produced by other methods, which will be described later.
  • ultra-fine bubbles with a diameter of less than 1.0 ⁇ m are not easily affected by buoyancy, so as long as the liquid is stored at normal temperature and pressure, it will not disappear easily. Therefore, the ozone UFB-containing liquid thus generated can be stored in a container or the like for a long period of time. Moreover, since it is housed in a predetermined container, it can be easily transported and can be transported by a general method.
  • FIG. 12 is a schematic diagram showing a defoaming unit 600 for defoaming USB in an ozone UFB-containing liquid in this embodiment.
  • the defoaming unit 600 a transmitting unit of a commercially available ultrasonic cleaner is used. Note that the defoaming unit 600 is not limited to this. In other words, there is a shear type defoaming method in which bubbles are destroyed by the shearing force acting on the gap between the rotating disc and the orifice plate in the ozone UFB-containing liquid, and a swirling flow of the ozone UFB-containing liquid to concentrate only the bubbles in the center to eliminate and dissolve the bubbles. Defoaming by centrifugal separation may be used.
  • the antifoaming unit 600 is filled with water 601 such as tap water, and is set in a container 610 containing an ozone UFB-containing liquid 611 diluted as necessary. Next, ultrasonic waves are oscillated at 1.6 MHz and 100 W for 15 minutes.
  • the ozone UFB-containing liquid 611 contains, in addition to the UFB, bubbles larger than the UFB, and aggregates of the UFB and large-sized bubbles.
  • UFB and aggregates containing UFB are defoamed by ultrasonic waves, and ozone contained in UFB and aggregates is dissolved in water to obtain an ozone solution. This ozone-dissolved liquid is the same as the ozone-dissolved liquid generated in the pretreatment unit 100 (see FIG.
  • the ozone concentration is halved in about one hour.
  • ultrasonic waves were applied at 1.6 MHz and 100 W for 15 minutes.
  • the conditions may be adjusted such that the frequency is about 1 to 5 MHz, the intensity is about 50 to 250 W, and the time is about 5 to 30 minutes, and the conditions may be appropriately optimized according to the performance of the ultrasonic device.
  • the UFB is defoamed and an ozone-dissolved liquid in which ozone gas is dissolved can be produced.
  • an ozone absorbing solution neutral phosphate buffered potassium iodide solution
  • the prepared ozone-absorbing liquid and ozone-dissolving liquid are mixed and stirred at a ratio of 1:1 (for example, 10 ml each), and the absorbance at a wavelength of 352 nm is measured using a spectrophotometer.
  • the ozone absorbing solution and distilled water are mixed and stirred at a ratio of 1:1, and the absorbance is measured in the same manner as the blank absorbance.
  • the ozone-dissolved liquid immediately after being created by defoaming the UFB of the ozone UFB-containing liquid with ultrasonic waves was confirmed to be in a state of high ozone concentration.
  • the concentration of the ozone-dissolved liquid immediately after defoaming by ultrasonic waves was confirmed, but compared to the ozone-UFB-containing liquid generated by the T-UFB method, The resulting ozone concentrations were low.
  • FIG. 13 is a flow chart showing the procedure of the ozone solution utilization method in this embodiment.
  • S means a step in each process.
  • the dissolved ozone liquid is generated by the dissolving unit 200 in S001, and then the ozone UFB-containing liquid containing ozone gas is generated by the T-UFB generation unit 300 in S002.
  • the generated ozone UFB-containing liquid is stored in a container or the like (not shown).
  • the container containing the ozone UFB-containing liquid is then transported to a location where the ozone UFB-containing liquid is utilized. Since it is in a liquid state in a container, it can be transported by common methods.
  • the UFB containing ozone gas has a size of 200 nm or less in diameter. Unlike millibubbles and microbubbles, UFBs are not easily affected by buoyancy, so they rise to the liquid surface and float in the liquid without disappearing. Therefore, the ozone UFB-containing liquid can contain ozone at an ozone solubility (generally 0.6 g/L in water at room temperature) or more, and can maintain a stable concentration. That is, even after such storage and transportation, the UFB in the ozone UFB-containing liquid does not disappear, and the ozone UFB-containing liquid can have long-term storage stability, storage efficiency, and transportation efficiency.
  • an ozone solubility generally 0.6 g/L in water at room temperature
  • the ozone UFB-containing liquid is diluted as necessary.
  • an ozone-dissolved liquid having a concentration suitable for the purpose of use can be prepared.
  • the ozone UFB in the ozone-containing liquid is defoamed and dissolved by a defoaming unit 600 (see FIG. 12) such as an ultrasonic device, and in S006 an ozone-dissolved liquid having a desired concentration is generated.
  • the generated ozone solution is utilized for desired purposes such as sterilization, deodorization, and cleaning.
  • the time from defoaming of UFB in S005 to application as the ozone-dissolved liquid in S007 is preferably within 30 minutes as a standard.
  • the liquid in which the ultra-fine bubbles containing ozone are generated is generated in advance, the ultra-fine bubbles are defoamed by the defoaming means at a desired timing, and the ozone gas is dissolved in the liquid. Desired processing such as sterilization is performed with an ozone solution. As a result, an ozone solution having a desired concentration that can be applied at a desired time can be produced in a small size and with a simple configuration.
  • Example 1 In this embodiment, a case will be described in which the ozone solution produced by the above production method is utilized for sterilization in S007 of FIG.
  • FIG. 14 compares the sterilization effect of an ozone-dissolved liquid (hereinafter also referred to as a sterilization liquid) generated by irradiating an ozone UFB-containing liquid generated by the T-UFB method with ultrasonic waves to eliminate UFB. It is the figure which showed the result of having evaluated.
  • Bacteria and fungi were prepared as samples for sterilization evaluation. The bacterial samples used were "Gram-negative bacilli" Escherichia coli, Salmonella and Vibrio parahaemolyticus. As mold samples, Aspergillus, Blue mold, Rhizopus and Ketama mold were used.
  • Bacteria are generally classified into two groups according to the structure of the outer wall of the cell. One is “Gram-positive bacteria” which has a relatively thick and hard outer wall, and the other is “Gram-negative bacteria” which has a relatively thin and fragile outer membrane. On the other hand, conventionally, bacteria are also classified according to their external shape, such as long-shaped "bacilli” and round-shaped “cocci.” Bacteria can thus be classified from these combinations as “Gram-positive bacilli,” “Gram-positive cocci,” “Gram-negative bacilli,” and “Gram-negative cocci,” and the like.
  • Escherichia coli, Salmonella, and Vibrio parahaemolyticus used as samples in this embodiment are included in "Gram-negative bacilli" and are typical Gram-negative bacilli.
  • Bacillus natto is known as a representative of "Gram-positive bacilli”.
  • Kabi is a common name for fungi that spans multiple classification items, and is a term that refers to a part of fungi, or a common name for a colony of microorganisms that looks similar to it and can be observed with the naked eye. is. Therefore, there are molds with various lifestyles. Aspergillus, blue mold, cruciferous mold, and vertebrate mold used as samples in this embodiment are so-called weed-like molds that quickly emerge in an artificial environment.
  • each bacterial or fungal cell suspension was brought into contact with each sterilization solution for 72 hours.
  • a 10e(+6)-fold dilution was prepared from the liquid after contact, and 100 ⁇ L of the dilution was smeared onto a plate medium.
  • the smeared plate medium was cultured and the number of bacteria was measured. The results shown in FIG. 13 were obtained from the above tests.
  • ozone-dissolved solution that does not generate UFB and is used for comparison, and in the case of distilled water that does not dissolve ozone, ozone has no sterilizing effect and the reduction rate is 0%. Met. It is believed that the ozone-dissolved solution left for one day lost the dissolved ozone over time and could not obtain the sterilization effect.
  • Example 2 It is known that the ozone solution has a higher cleaning effect than tap water or the like. Therefore, in this embodiment, the ozone-dissolved liquid obtained by defoaming the UFB with ultrasonic waves or the like immediately before use is caused to flow over the surface of the object in a state of high ozone concentration in S006 of FIG. As a result, contaminants stuck to the object can be peeled off from the surface of the object and washed. Its cleaning effect is higher than that of tap water or a detergent in which a surfactant is dissolved.
  • Ozone is known to have a strong oxidizing action and to detoxify harmful organic substances.
  • harmful organic substances include persistent chlorides such as trichlorethylene, tetrachlorethylene, dichloromethane and carbon tetrachloride.
  • Substances that have a detoxifying effect are not limited to this.
  • the ozone-dissolved liquid obtained by defoaming the UFB with ultrasonic waves or the like immediately before use is used as a solution containing harmful substances in a state of high ozone concentration in S006 of FIG. Mix, stir.
  • chemical reactions with hard-to-decompose harmful organic substances can be caused to reduce the molecular weight and change them into harmless organic substances.
  • the ozone solution obtained by defoaming and dissolving the UFB in the ozone UFB-containing liquid has the effects of sterilization, cleaning, and detoxification of harmful chemical substances.
  • individual explanations are omitted, it can be suitably used in places where there is immediate effect by using it as an ozone dissolution liquid rather than using it as an ozone UFB-containing liquid, such as deodorizing effect and surface modification of plastics and metals. can.
  • the generation method is not limited to the T-UFB method as long as UFB containing ozone can be generated.
  • a mechanical pressure reduction structure such as a pressure reduction nozzle is provided in a part of the flow path, and the liquid is caused to flow at a predetermined pressure so as to pass through this pressure reduction structure.
  • a piezoelectric element or the like may be used to generate the ozone UFB-containing liquid.
  • the ultra-fine bubble-containing liquid containing ozone is generated in advance, and the UFB is defoamed to turn ozone into a liquid at the desired timing when the ozone-containing liquid is actually used.
  • should be dissolved in As a result, it is possible to produce an ozone solution having a desired concentration that can be applied at a desired time, with a small size and a simple configuration.
  • heating element 100 pretreatment unit 200 dissolution unit 300 T-UFB generation unit 400 posttreatment unit 500 recovery unit 600 defoaming unit W liquid

Abstract

La présente invention concerne un procédé de fabrication d'une solution d'ozone avec laquelle il est possible de fabriquer, en utilisant une configuration petite et simple, une solution d'ozone qui peut être utilisée à un point prescrit dans le temps, et un procédé d'utilisation d'une solution d'ozone. Afin d'atteindre ce but, un liquide dans lequel des bulles ultrafines sont générées est stocké sur une durée prescrite, les bulles ultrafines sont retirées par un moyen de démoussage à un moment souhaité, de l'ozone gazeux est dissous dans le liquide, et une stérilisation est effectuée en utilisant une solution d'ozone ainsi produite.
PCT/JP2022/032675 2021-11-17 2022-08-30 Procédé de fabrication d'une solution d'ozone et procédé d'utilisation d'une solution d'ozone WO2023089904A1 (fr)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0975695A (ja) * 1995-09-20 1997-03-25 Tokico Ltd オゾン水生成装置
JP2002126480A (ja) * 2000-10-20 2002-05-08 Yaskawa Electric Corp オゾン水処理装置
WO2018073987A1 (fr) * 2016-10-19 2018-04-26 トスレック株式会社 Procédé de fabrication et système de fabrication d'une boisson ou d'un autre liquide contenant des bulles
JP2020142232A (ja) * 2019-02-28 2020-09-10 キヤノン株式会社 ウルトラファインバブル生成方法、ウルトラファインバブル生成装置、およびウルトラファインバブル含有液
WO2021085629A1 (fr) * 2019-10-31 2021-05-06 キヤノン株式会社 Procédé de production d'un liquide contenant des bulles ultra-fines, liquide contenant des bulles ultra-fines, procédé d'utilisation de bulles ultra-fines et dispositif d'utilisation de bulles ultra-fines

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0975695A (ja) * 1995-09-20 1997-03-25 Tokico Ltd オゾン水生成装置
JP2002126480A (ja) * 2000-10-20 2002-05-08 Yaskawa Electric Corp オゾン水処理装置
WO2018073987A1 (fr) * 2016-10-19 2018-04-26 トスレック株式会社 Procédé de fabrication et système de fabrication d'une boisson ou d'un autre liquide contenant des bulles
JP2020142232A (ja) * 2019-02-28 2020-09-10 キヤノン株式会社 ウルトラファインバブル生成方法、ウルトラファインバブル生成装置、およびウルトラファインバブル含有液
WO2021085629A1 (fr) * 2019-10-31 2021-05-06 キヤノン株式会社 Procédé de production d'un liquide contenant des bulles ultra-fines, liquide contenant des bulles ultra-fines, procédé d'utilisation de bulles ultra-fines et dispositif d'utilisation de bulles ultra-fines

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