WO2023078247A1 - 内嵌电路板的充电座结构及充电座 - Google Patents

内嵌电路板的充电座结构及充电座 Download PDF

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Publication number
WO2023078247A1
WO2023078247A1 PCT/CN2022/129021 CN2022129021W WO2023078247A1 WO 2023078247 A1 WO2023078247 A1 WO 2023078247A1 CN 2022129021 W CN2022129021 W CN 2022129021W WO 2023078247 A1 WO2023078247 A1 WO 2023078247A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
terminal
charging stand
built
interface
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PCT/CN2022/129021
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English (en)
French (fr)
Inventor
王超
Original Assignee
长春捷翼汽车科技股份有限公司
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Publication of WO2023078247A1 publication Critical patent/WO2023078247A1/zh

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40Securing contact members in or to a base or case; Insulating of contact members
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/52Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02TCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00Road transport of goods or passengers
    • Y02T10/60Other road transportation technologies with climate change mitigation effect
    • Y02T10/70Energy storage systems for electromobility, e.g. batteries
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02TCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00Road transport of goods or passengers
    • Y02T10/60Other road transportation technologies with climate change mitigation effect
    • Y02T10/7072Electromobility specific charging systems or methods for batteries, ultracapacitors, supercapacitors or double-layer capacitors

Definitions

  • the invention relates to the technical field of charging, in particular to a charging stand structure with a built-in circuit board, or a charging stand including the charging stand structure with a built-in circuit board.
  • the new energy battery of new energy vehicles uses a charging system to supplement electricity.
  • the charging stand in the charging system will include a plurality of charging terminals and cables, the charging terminals and cables are connected inside the charging stand, the charging terminals are fixed on the charging stand body, and the cables pass through the back cover.
  • the charging stand contains a variety of electronic components, some electronic components need to communicate with the vehicle, so corresponding holes need to be opened on the back of the charging stand, and the charging cable will Because of too many connections, the diameter of the charging cable is too large, resulting in waste of resources, and at the same time, it will cause difficulty in sealing, and there is a certain potential safety hazard.
  • the terminals in the charging stand should be as concentric as possible with the cavity where the terminals are installed, so that when plugging in with the charging gun head, the terminals can be inserted in place at one time without any misalignment.
  • the current charging stand terminals Or use a fixed method, but it will cause the problem of "failure infection" of the charging gun terminals of different manufacturers; or use a large gap to install the terminals, but the wear of the terminals is high, and the replacement frequency increases.
  • the invention provides a charging stand structure with a built-in circuit board and the charging stand.
  • the charging stand structure with a built-in circuit board contains a circuit board, and various electronic components are integrated on the circuit board Components, the circuit board is integrated and connected, which greatly reduces the number of outgoing wires in the charging structure and reduces the diameter of the charging cable to meet the design and development work of the vehicle charging stand and reduce costs.
  • a charging stand structure with a built-in circuit board including a front body of the charging stand and terminals, the charging stand structure with a built-in circuit board also includes a circuit board, the circuit board is provided with a terminal installation through hole, and the terminal passes through the terminal installation through hole. Holes, electronic components and communication interfaces are arranged on the circuit board.
  • a charging stand comprising the above-mentioned charging stand structure with a built-in circuit board.
  • the charging base structure with built-in circuit board contains a circuit board, which can meet the requirements of integrating various electronic components on this circuit board, and the circuit board is integrated and connected, which greatly reduces the number of outgoing lines in the charging structure and reduces the diameter of the charging cable , can meet the design and development work of the vehicle charging stand, is easy to install, can realize automatic assembly, and reduce costs.
  • the communication interface is directly connected to the circuit board, avoiding the connection of the cable layout inside the charging stand, and the communication interface only needs one outlet on the back cover, which is conducive to the sealing of the back cover of the charging stand.
  • terminal installation through holes on the circuit board There are terminal installation through holes on the circuit board.
  • the terminals pass through the terminal installation through holes, which can reduce the installation space of the circuit board in the charging stand.
  • the shrapnel on the circuit board can make the terminals automatically center and reduce the terminal insertion. The case of rear eccentricity.
  • thermosensor on the circuit board, and it is directly or indirectly connected to the terminal, which can measure the real-time temperature of the terminal more accurately, and also facilitate the disassembly of the terminal, avoiding the installation and disassembly of the temperature sensor on the terminal, which is difficult to install and disassemble Condition.
  • Fig. 1 is a schematic diagram of the structure of the charging stand with embedded circuit board according to the present invention.
  • Fig. 2 is a schematic diagram of the front body of the charging stand.
  • Figure 3 is a schematic diagram of the circuit board.
  • Fig. 4 is a schematic diagram of an integrated terminal assembly.
  • Fig. 5 is a schematic diagram of the structure of the shrapnel.
  • a charging stand structure with a built-in circuit board including a front body 1 and a terminal 3 of the charging stand, the charging stand structure with a built-in circuit board also includes a circuit board 2, the circuit board 2 is provided with a terminal installation through hole 21, and the terminal 3 Through the terminal installation through hole 21, the circuit board 2 is provided with electronic components and communication interfaces, as shown in FIGS. 1 to 5 .
  • the number of outlets in the charging structure is greatly reduced, and the diameter of the charging cable is reduced, which can meet the design and development work of the vehicle charging stand, facilitate installation, realize automatic assembly, and reduce costs.
  • the electronic components and the communication interface are electrically connected through the circuit wires in the circuit board 2 (such as PCB), and those skilled in the art can choose to install the electronic components as required,
  • the circuit board 2 such as PCB
  • the communication interface is directly connected to the circuit board, avoiding the connection of the cable layout inside the charging stand, and the communication interface only needs one outlet of the back cover, which is conducive to the sealing of the back cover of the charging stand.
  • the circuit board 2 is provided with a terminal installation through hole 21, and the terminal 3 passes through the terminal installation through hole 21, which can reduce the installation space of the circuit board 2 in the charging stand.
  • the shrapnel 23 on the circuit board 2 can make the terminal 3 automatically Centered to reduce the eccentricity of terminal 3 after insertion.
  • the front body 1 of the charging stand includes a backplane 11 and a terminal protection shell 12 arranged front and back, the backplane 11 is provided with a front body interface 15 of the charging stand, and the terminals 3 are connected to the front body interface 15 of the charging stand in one-to-one correspondence.
  • the circuit board 2 is matchedly arranged in the terminal protection shell 12 .
  • the terminal protective shell 12 can protect the terminal 3. After the terminal 3 is connected to the front body interface 15 of the charging stand, the distance between them is relatively fixed, which is convenient for plugging into the rear body of the charging stand.
  • the size and specifications of the front body interface 15 of the charging stand shall comply with the national standard AC interface, the national standard DC interface, the European standard AC interface, the European standard DC interface, the American standard AC interface, the American standard DC interface, and the Japanese standard AC interface. Interface, Japanese standard DC interface or super charging interface and other standards.
  • the main body shape of the front body 1 of the charging stand can be an irregular outline to match different car models.
  • the material of the front body 1 of the charging stand is insulating soft/hard plastic material, and the front body 1 of the charging stand can be processed and formed by injection molding, and the minimum mold release angle is 0°.
  • the terminal protection shell 12 is a cylindrical structure, and the circuit board 2 is matchedly disposed in the terminal protection shell 12 , that is, the shape of the circuit board 2 matches the interior of the terminal protection shell 12 .
  • the electronic component includes a temperature sensor, and the temperature sensor is in direct or indirect contact with the terminal 3 .
  • the temperature sensor can monitor the temperature of terminal 3 and transmit it through the data line. When the temperature of terminal 3 is abnormal, the staff can deal with it in time.
  • the temperature sensor is an NTC temperature sensor or a PTC temperature sensor.
  • the advantage of using these two temperature sensors is that they are small in size and can measure gaps that cannot be measured by other thermometers; they are easy to use, and the resistance value can be freely selected from 0.1k ⁇ to 100k ⁇ ; Good, strong overload capacity, suitable for conversion joints, which require small size and stable performance.
  • thermosensor on the circuit board 2, and it is directly or indirectly connected to the terminal 3, which can measure the real-time temperature of the terminal 3 more accurately, and also facilitates the disassembly of the terminal 3, avoiding the installation of the temperature sensor on the terminal 3. more difficult situation.
  • the communication interface is located on the surface of the circuit board 2 facing away from the backplane 11 , and the communication interface includes one or more of a pin connector 22 , a USB interface, an Ethernet interface and a wireless interface.
  • the communication interface is a pin connector 22
  • the pin connector 22 can be a one-pin or multi-pin connector
  • the male connector or the female connector of the pin connector 22 is arranged on the circuit board 2 .
  • the communication interface is located on the edge of the circuit board 2, which can facilitate the centralized bundling of the cables on the terminal 3.
  • the communication interface is located on the upper side, lower side, left side or right side of the circuit board 2, as shown in FIG. 3 .
  • At least one elastic piece 23 is provided on the circuit board 2 , as shown in FIG. 5 , the outer periphery of the terminal 3 is connected to the elastic piece 23 , and the pressure exerted by the elastic piece 23 on the terminal 3 is 3N-200N.
  • the terminal 3 and the terminal installation through hole 21 can adopt clearance fit, and the elastic piece 23 is arranged outside the installation through hole 21 , the terminal 3 is connected with the elastic piece 23 , and the elastic piece 23 is used for installing and fixing the terminal 3 .
  • Multiple elastic pieces 23 can be provided, and a plurality of elastic pieces 23 are evenly distributed around the terminal 3.
  • the number of elastic pieces 23 is an even number and distributed symmetrically, so that the terminal 3 is evenly stressed in all directions, and it is compatible with the installation through hole. 21 connection is more stable.
  • the shrapnel 23 is a metal shrapnel, and the metal shrapnel is connected to the circuit in the circuit board 2, and the circuit is connected with the required electronic components.
  • the advantage of this design is that the electronic components and the metal shrapnel can be monitored in real time.
  • the status of the terminal 3 (such as information such as current and temperature), and the status information of the terminal 3 is transmitted to the outside through the circuit board 2 and the charging cable.
  • the inventor selected the terminal installation through hole 21 and the terminal 3 of the same size specification, and different shrapnel 23 are applied to the terminal 3. Then select the same terminal 3 for mating, and test the contact resistance between the mated terminal 3 and the shrapnel 23. The test results are shown in Table 1.
  • the test method of contact resistance use a micro-resistance measuring instrument, connect one end of the measuring end of the micro-resistance measuring instrument to terminal 3, and connect the other end to the shrapnel 23, place the same position for each measurement, and then read the reading on the micro-resistance measuring instrument. contact resistance readings.
  • a contact resistance greater than 1 m ⁇ is unqualified.
  • the size and specification of the terminal mounting through hole 21 should conform to the national standard AC interface, the national standard DC interface, the European standard AC interface, the European standard DC interface, the American standard AC interface, and the American standard DC interface. , Japanese standard AC AC interface, Japanese standard DC direct current interface or super charging interface and other standards.
  • the size and specifications of the terminals 3 should also comply with the national standard AC AC interface, the national standard DC DC interface, the European standard AC AC interface, the European standard DC DC interface, and the American standard AC interface.
  • the electronic component further includes a current sensor, and the current sensor is electrically connected to the metal elastic piece.
  • the current sensor can detect the current situation of the terminal 3 and the metal shrapnel 23, so that the staff can know whether the circuit transmission is normal.
  • the terminal protection case 12 includes an upper case 13 and a lower case 14 arranged up and down, and the circuit board 2 can be matchedly arranged in the upper case 13, or the circuit board 2 can be matchedly arranged in the lower case 14 (as shown in FIG. 1 ), or the circuit board 2 can be matchedly arranged in the upper case 13 and the lower case 14, as shown in FIGS. 1 to 3 .
  • the upper case 13 and the lower case 14 can protect different types of terminals 3 respectively, which is convenient for installation and management.
  • the charging base structure and the charging base with the embedded circuit board also include a terminal bracket 4, and the terminal 3 is integrated into an integrated terminal assembly through the terminal bracket 4 (the terminal bracket 4 may not be used), and the circuit board 2 is located between the terminal support 4 and the back plate 11, there is a distance between the inner surface of the terminal protection shell 12 and the terminal support 4, and the communication interface is located within the distance.
  • the electronic components on the circuit board 2 may face the backplane 11 or the terminal support 4, there is a distance between the inner surface of the terminal protection shell 12 and the terminal support 4, and the communication interface is located within the distance,
  • the communication interface is located on the left or right side of the circuit board 2 , and the circuit board 2 and the communication interface are not sealed and protected by the terminal bracket 4 .
  • connection between the circuit board 2 and the backplane 11 is one or more of adhesive connection, magnetic connection, bayonet connection, lock connection, binding connection, screw connection, rivet connection and welding connection. .
  • an adhesive layer is provided on the contact surface of the circuit board 2 and the back plate 11 , and the circuit board 2 and the back plate 11 are bonded together through the adhesive layer.
  • the contact surface of the circuit board 2 and the backplane 11 is provided with a magnetic attraction, and the connection is made through the magnetic force between the magnetic attraction, so that the connection is convenient and quick.
  • one of the contact surfaces between the circuit board 2 and the back plate 11 is provided with a claw, and the other is provided with a slot. Through the assembly of the claw and the slot, the circuit board 2 and the back The boards 11 are stably connected together.
  • one of the contact surfaces between the circuit board 2 and the backboard 11 is provided with a locking hook, and the other is provided with a locking buckle. Through the assembly of the locking hook and the locking buckle, the circuit board 2 and the backplane 11 Stable connection together.
  • grooves are provided on both the circuit board 2 and the back plate 11, and after the contact surfaces of the two are connected, the circuit board 2 and the back plate 11 are bound at the position of the groove by using a binding member.
  • tie downs include cable ties, pipe collars, hook locks, and more.
  • screw threads and screws are respectively provided on the circuit board 2 and the back plate 11 , and the contact surfaces of the circuit board 2 and the back plate 11 are stably connected together through the screw connection of the threads and screws.
  • connecting holes are respectively provided on the circuit board 2 and the back plate 11, the rivets pass through the connecting holes, and the end through which the rivets pass is deformed to tighten the connecting holes, so that the circuit board 2 and the The backplanes 11 are stably connected together.
  • the circuit board 2 and the back plate 11 also have a welding surface, and a welding machine is used to melt and connect the welding surfaces together so that the contact between the circuit board 2 and the back plate 11 The surfaces are connected together stably.
  • Welding machines include hot melt welding machines and ultrasonic welding machines.
  • the structure of the charging stand with embedded circuit board also includes the rear body of the charging stand, the front body 1 of the charging stand is assembled with the rear body of the charging stand, and the front body 1 of the charging stand is connected with the rear body of the charging stand
  • the existing detachable connection method can be used to realize the installation connection.
  • the material of the terminal 3 can be copper or copper alloy with good electrical conductivity and excellent elastic properties.
  • the price of copper increases, the cost of using copper as the material of the terminal 3 will become higher and higher.
  • the content of metal aluminum in the earth's crust is about 7.73%. After the refining technology is optimized, the price is relatively low.
  • aluminum is lighter in weight and its conductivity is second only to copper.
  • Aluminum can replace part of copper in the field of electrical connections. Therefore, it is also possible to choose aluminum or aluminum alloy with better electrical conductivity and general elastic properties of the material, but at a lower price.
  • the copper material of the terminal 3 is a copper alloy
  • the copper material contains a tellurium material, so that the terminal 3 has good electrical conductivity and easy cutting performance, ensures electrical performance and improves workability, and at the same time, the elasticity of the tellurium-copper alloy is also improved. very good.
  • the tellurium content in the tellurium-copper alloy is 0.1%-5%, and more preferably, the tellurium content in the tellurium-copper alloy is 0.2%-1.2%.
  • the inventor selected 10 terminals 3 of the same shape for testing, and each terminal 3 was a tellurium-copper alloy, and the proportions of tellurium were 0.05%, 0.1%, 0.2%, 1%, 1.2%, 1.8%, 3%, 5%, 6%, 7%.
  • the test results are shown in Table 2.
  • Table 2 The effect of tellurium copper alloys with different tellurium contents on electrical conductivity.
  • the terminal 3 is at least partially provided with a plating layer.
  • the plating layer can improve corrosion resistance, improve electrical conductivity, increase the number of plugging times, and can better extend the service life of the terminal.
  • the plating layer can adopt methods such as electroplating, chemical plating, magnetron sputtering or vacuum plating.
  • the electroplating method is the process of plating a thin layer of other metals or alloys on some metal surfaces by using the principle of electrolysis.
  • the electroless plating method is a process of metal deposition through a controllable oxidation-reduction reaction under the catalysis of metals.
  • the magnetron sputtering method uses the interaction between the magnetic field and the electric field to make electrons run in a spiral shape near the target surface, thereby increasing the probability of electrons colliding with argon to generate ions.
  • the generated ions hit the target surface under the action of the electric field to sputter out the target material.
  • the vacuum plating method is to deposit various metal and non-metal films on the surface of parts by distillation or sputtering under vacuum conditions.
  • the coating material is one or more combinations of gold, silver, nickel, tin, tin-lead alloy, zinc, silver-antimony alloy, palladium, palladium-nickel alloy, graphite silver, graphene silver and silver-gold-zirconium alloy.
  • Copper or aluminum, as an active metal will undergo oxidation reaction with oxygen and water during use, so one or several inert metals are required as a coating to prolong the service life of the terminal 3.
  • a better wear-resistant metal is also required as a coating, which can greatly increase the service life of the contacts.
  • the contacts need good electrical conductivity.
  • the conductivity and stability of the above metals are better than copper or copper alloy, aluminum or aluminum alloy, which can make terminal 3 obtain better electrical performance and longer service life. .
  • the number of plugging and unplugging in Table 3 is to fix the terminal 3 and the mating terminal on the test bench respectively, and use a mechanical device to simulate plugging and unplugging of the terminal 3 and the mating terminal, and stop after every 100 times of plugging and unplugging. Go down and observe the damage of the coating on the surface of the terminal 3. If the coating on the surface of the terminal 3 is scratched and the material of the terminal 3 is exposed, the experiment is stopped and the number of times of plugging and unplugging at that time is recorded. In this embodiment, it is unqualified if the number of times of plugging and unplugging is less than 8000 times.
  • the corrosion resistance time test in Table 3 is to put the terminal 3 into the salt spray test box, spray salt spray on each position of the terminal 3, take it out and clean it every 20 hours to observe the surface corrosion, that is, a Cycle until the corrosion area on the surface of terminal 3 is greater than 10% of the total area, stop the test and record the number of cycles at that time. In this embodiment, the number of cycles less than 80 is considered unqualified.
  • the coating material is gold, silver, silver-antimony alloy, palladium, palladium-nickel alloy, graphite silver, graphene silver, and silver-gold-zirconium alloy
  • the experimental results exceed the standard value and the performance is relatively stable.
  • the coating material is gold, silver, silver-antimony alloy, palladium, palladium-nickel alloy, graphite silver, graphene silver, and silver-gold-zirconium alloy
  • the coating material is gold, silver, silver-antimony alloy, palladium, palladium-nickel alloy, graphite silver, graphene silver and silver-gold-zirconium alloy.
  • the invention also discloses a charging stand, which includes the above-mentioned charging stand structure with a built-in circuit board.
  • Both the front body 1 of the charging stand and the rear body of the charging stand are injection molded, and the size requirements are met by controlling the accuracy of the equipment and the error of the mold, and the injection molding is controlled by the clamping force, injection position measurement accuracy, injection speed, injection pressure, and mold temperature. process, so as to meet the dimensional accuracy requirements of pre-assembly and rotation, as well as the operation requirements of rotation force.
  • Injection position accuracy (end point of holding pressure) is less than 0.03mm
  • the injection speed is greater than or equal to 300mm/s;
  • the injection pressure should be greater than 25MPa;
  • the mold temperature change should be controlled within ⁇ 1°C.
  • orientation word "upper” indicates the upper side direction in Fig. 1
  • the orientation word “down” indicates the lower side in Figure 1
  • the orientation word "left” indicates the left direction in Figure 1
  • the orientation word “right” indicates the right direction in Figure 1
  • the orientation word “front” indicates the direction perpendicular to the paper surface of Figure 1 and pointing to the inside of the paper surface
  • the orientation word “rear” indicates the direction perpendicular to the paper surface of Figure 1 and pointing to the outside of the paper surface.

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Abstract

本发明提供了一种内嵌电路板的充电座结构及充电座,所述内嵌电路板的充电座结构包括充电座前本体(1)和端子(3),所述内嵌电路板的充电座结构还包括电路板(2),电路板(2)上设有端子安装通孔(21),端子(3)穿过端子安装通孔(21),电路板(2)上设有电子元件和通信接口。该内嵌电路板的充电座结构含有电路板,电路板上集成有多种电子元件,该电路板通过集成连接,大大减少了充电座结构内出线数量,降低了充电线缆直径,能够满足车辆充电座的设计开发工作,降低了成本。

Description

内嵌电路板的充电座结构及充电座
相关申请
本申请要求专利申请号为202122683238.7、申请日为2021年11月4日、发明名称为“内嵌电路板的充电座结构及充电座”的中国实用新型专利的优先权。
技术领域
本发明涉及充电技术领域,具体的是一种内嵌电路板的充电座结构,还是一种含有该内嵌电路板的充电座结构的充电座。
背景技术
新能源汽车的新能源电池,使用充电系统来补充电力。充电系统中的充电座都会包括多个充电端子和线缆,充电端子和线缆在充电座内部连接,充电端子固定在充电座体上,线缆贯穿后盖。在电动汽车充电座开发及装配的过程中,由于充电座内部含有多种电子元器件,部分电子元器件需要同车辆通信交互,因此在充电座背板上需要对应开孔,且充电线缆会因为接线过多,导致充电线缆线径过大,造成资源浪费,同时会导致密封困难,存在一定的安全隐患。
另外,充电座内的端子要与端子安装的腔体尽可能保证同心,这样在与充电枪头对插时,能使端子一次性对插到位,不产生插偏的情况,目前的充电座端子或者采用固定的方式,但会造成不同厂家的充电枪端子“失效传染”的问题;或者采用较大间隙安装端子,但是对端子的磨损度较高,更换频次增加。
因此,现有技术中亟需一种新的方案来解决上述问题。
申请内容
为了方便充电座内电子元器件的安装,本发明提供了一种内嵌电路板的充电座结构及充电座,该内嵌电路板的充电座结构含有电路板,电路板上集成有多种电子元件,该电路板通过集成连接,大大减少了充电结构内出线,减小了充电线缆直径,以满足车辆充电座的设计开发工作,降低成本。
本发明解决其技术问题所采用的技术方案是:
一种内嵌电路板的充电座结构,包括充电座前本体和端子,所述内嵌电路板的充电座结构还包括电路板,电路板上设有端子安装通孔,端子穿过端子安装通孔,电路板上设有电子元件和通信接口。
一种充电座,所述充电座包括上述的内嵌电路板的充电座结构。
本发明的有益效果是:
1、该内嵌电路板的充电座结构含有电路板,可以满足在此电路板上集成多种电子元件,且该电路板通过集成连接,大大减少了充电结构内出线,降低了充电线缆直径,能够满足车辆充电座的设计开发工作,便于安装,可实现自动化装配,降低成本。
2、通信接口直接与电路板连接,避免充电座内部的线缆布置的连接,而且通信接口只需要一个后盖的出口,有利于充电座后盖的密封。
3、电路板上设有端子安装通孔,端子穿过端子安装通孔,可以降低电路板在充电座内的安装空间,同时电路板上的弹片,可以使端子能够自动对中,减少端子插入后偏心的情况。
4、电路板上设有金属弹片,并直接和端子连接,另一端连接电路板的电流传感器,能够更直接准确的测量端子的电流,同时也方便端子的拆卸,避免电流传感器安装在端子上,安装和拆卸都较困难的情况。
5、电路板上设有温度传感器,并与端子直接或间接连接,可以更准确的测量端子的实时温度,并且也方便端子的拆卸,避免温度传感器安装在端子上,安装和拆卸都较困难的情况。
附图说明
构成本申请的一部分的说明书附图用来提供对本发明的进一步理解,本发明的示意性实施例及其说明用于解释本发明,并不构成对本发明的不当限定。
图1是本发明所述内嵌电路板的充电座结构的示意图。
图2是充电座前本体的示意图。
图3是电路板的示意图。
图4是一体式端子总成的示意图。
图5是弹片的结构示意图。
1、充电座前本体;2、电路板;3、端子;4、端子支架;
11、背板;12、端子保护壳;13、上壳体;14、下壳体;15、充电座前本体接口;
21、安装通孔;22、插针连接器;23、弹片。
具体实施方式
需要说明的是,在不冲突的情况下,本申请中的实施例及实施例中的特征可以相互组合。下面将参考附图并结合实施例来详细说明本发明。
一种内嵌电路板的充电座结构,包括充电座前本体1和端子3,所述内嵌电路板的充电座结构还包括电路板2,电路板2上设有端子安装通孔21,端子3穿过端子安装通孔21,电路板2上设有电子元件和通信接口,如图1至图5所示。通过本设计大大减少了充电结构内出线数量,降低了充电线缆直径,能够满足车辆充电座的设计开发工作,便于安装,可实现自动化装配,降低成本。
其中,所述电子元件和通信接口之间为并列关系,电子元件和通信接口之间通过电路板2(如PCB)内的电路线电气连接,本领域的技术人员可以根据需要选择安装电子元件,以减少充电结构内出线,降低充电线缆线径。通信接口直接与电路板连接,避免充电座内部的线缆布置的连接,而且通信接口只需要一个后盖的出口,有利于充电座后盖的密封。
电路板2上设有端子安装通孔21,端子3穿过端子安装通孔21,可以降低电路板2在充电座内的安装空间,同时电路板2上的弹片23,可以使端子3能够自动对中,减少端子3插入后偏心的情况。
在本实施例中,充电座前本体1含有前后设置的背板11和端子保护壳12,背板11上设有充电座前本体接口15,端子3与充电座前本体接口15一一对应连接,电路板2匹配地设置于端子保护壳12内。端子保护壳12能够对端子3起到保护作用,端子3与充电座前本体接口15连接后,相互之间的距离相对固定,方便与充电座的后本体插接。
充电座前本体接口15的尺寸和规格应符合国标AC交流接口、国标DC直流接口、欧标AC交流接口、欧标DC直流接口、美标AC交流接口、美标DC直流接口、日标AC交流接口、日标DC直流接口或超级充电接口等多种标准。
充电座前本体1的主体形状可以为不规则轮廓,以匹配不同车型。充电座前本体1的材质为绝缘软/硬塑料材质,充电座前本体1可以采用注塑工艺加工成型,其出模角度最小为0°。
在本实施例中,端子保护壳12为筒形结构,电路板2匹配地设置于端子保护壳12内,即电路板2的外形与端子保护壳12的内部相匹配。
在本实施例中,所述电子元件包括温度传感器,所述温度传感器与端子3直接或间接接触。温度传感器能够监测端子3的温度并通过数据线传递出去,当端子3温度出现异常,工作人员能够及时的进行处理。
温度传感器为NTC温度传感器或PTC温度传感器。采用这两种温度传感器的好处是体积小,能够测量其他温度计无法测量的空隙;使用方便,电阻值可在0.1kΩ~100kΩ间任意选择;易加工成复杂的形状,可大批量生产,稳定性好、过载能力强,适用于转换接头这种要求体积小,性能稳定的产品中。
电路板2上设有温度传感器,并与端子3直接或间接连接,可以更准确的测量端子3的实时温度,并且也方便端子3的拆卸,避免温度传感器安装在端子3上,安装和拆卸都较困难的情况。
所述通信接口位于电路板2背向背板11的面上,所述通信接口包括插针连接器22、USB接口、以太网接口和无线接口中的一种或多种。
优选所述通信接口为插针连接器22,插针连接器22可以为一针或多针连接器,插针连接器22的公接头或母接头设置于电路板2上。通信接口位于电路板2的边缘,能够方便端子3上的线缆的集中捆扎,所述通信接口位于电路板2的上侧、下侧、左侧或右侧,如图3所示。
在本实施例中,电路板2上设有至少一个弹片23,如图5所示,端子3的外周与弹片23连接,弹片23施加在端子3上的压力为3N-200N。
端子3与端子安装通孔21可以采用间隙配合,弹片23设置在安装通孔21外部,端子3与所述弹片23连接,所述弹片23用于安装固定端子3。弹片23可以设置多个,多个弹片23均匀的分布在端子3的周围,优选的,弹片23的数量为偶数个且呈对称分布,这样使端子3在各个方向受力均匀,与安装通孔21连接的更稳定。
优选,所述弹片23为金属弹片,该金属弹片与电路板2内的电路连接,所述电路连接有所需的电子元件,这样设计的优点在于,通过电子元件和所述金属弹片可以实时监测端子3的状态(例如电流、温度等信息),并将端子3的状态信息通过电路板2和充电线缆向外传送。
为了验证弹片23施加到端子3上的压力对端子3插接后的接触电阻和插拔情况的影响,发明人选用了相同尺寸规格的端子安装通孔21和端子3,不同的弹片23施加到端子3上的压力,然后选用相同的端子3进行对插,测试对插后的端子3与弹片23间的接触电阻,试验结果如表1所示。
接触电阻的测试方法:使用微电阻测量仪,将微电阻测量仪的测量端一端连接在端子3上,一端连接在弹片23上,每次测量放置的位置相同,然后读取微电阻测量仪上的接触电阻读数。在本实施例中,接触电阻大于1mΩ为不合格。
表1:不同的压力对接触电阻的影响
Figure PCTCN2022129021-appb-000001
由表1可知,当弹片23施加到端子3上的压力小于3N时,端子3与弹片23之间的接触电阻大于1mΩ,接触电阻过大;当弹片23施加到端子3上的压力大于200N后,电阻已经不能进一步降低,并且插拔也更加困难,因此,发明人设定弹片23施加到端子3上的压力为3N-200N。
在本实施例中,端子安装通孔21的尺寸和规格应符合国标AC交流接口、国标DC直流接口、欧标AC交流接口、欧标DC直流接口、美标AC交流接口、美标DC直流接口、日标AC交流接口、日标DC直流接口或超级充电接口等多种标准。
由于端子3与端子安装通孔21一一对应插接,则端子3的尺寸和规格也应符合国标AC交流接口、国标DC直流接口、欧标AC交流接口、欧标DC直流接口、美标AC交流接口、美标DC直流接口、日标AC交流接口、日标DC直流接口或超级充电接口等多种标准。
在本实施里中,所述电子元件还包括电流传感器,所述电流传感器与所述金属弹片电性连接。电流传感器能够检测端子3和金属弹片23的电流情况,使工作人员了解电路传输是否正常。电路板上设有金属弹片,并直接和端子连接,另一端连接电路板的电流传感器,能够更直接准确的测量端子的电流,同时也方便端子的拆卸,避免电流传感器安装在端子上,安装和拆卸都较困难的情况。
在本实施里中,端子保护壳12含有上下设置的上壳体13和下壳体14,电路板2可以匹配地设置于上壳体13内,或电路板2可以匹配地设置于下壳体14内(如图1所示),或电路板2可以匹配地设置于上壳体13和下壳体14内,如图1至图3所示。上壳体13和下壳体14可以分别保护不同种类的端子3,便于安装和管理。
在本实施例中,所述内嵌电路板的充电座结构及充电座还包括端子支架4,端子3 通过端子支架4集成为一体式端子总成(端子支架4也可以不采用),电路板2位于端子支架4和背板11之间,端子保护壳12的内表面与端子支架4之间存在间距,所述通信接口位于所述间距内。如图4所示,电路板2上的电子元件可以朝向背板11或朝向端子支架4,端子保护壳12的内表面与端子支架4之间存在间距,所述通信接口位于所述间距内,所述通信接口位于电路板2的左侧或右侧,电路板2和所述通信接口不被端子支架4密封保护。
在本实施里中,电路板2与背板11的连接方式为粘贴连接、磁吸连接、卡口连接、锁扣连接、捆扎连接、螺纹连接、铆钉连接和焊接连接中的一种或几种。
在第一种可行的技术方案中,电路板2与背板11的接触面上设有粘贴层,通过粘贴层将电路板2与背板11粘接在一起。
在第二种可行的技术方案中,电路板2与背板11的接触面上设有磁吸件,通过磁吸件之间的磁力进行连接,连接方便快捷。
在第三种可行的技术方案中,电路板2与背板11的接触面上一个设有为卡爪,另一个设有卡槽,通过卡爪与卡槽的装配,使电路板2与背板11稳定的连接在一起。
在第四种可行的技术方案中,电路板2与背板11的接触面上一个设置有锁钩,另一个设置锁扣,通过锁钩和锁扣的装配,使电路板2与背板11稳定的连接在一起。
在第五种可行的技术方案中,在电路板2与背板11上均设置凹槽,将两者的接触面连接后,使用捆扎件在凹槽位置将电路板2与背板11捆扎在一起,捆扎件包括扎带、管箍、钩锁等。
在第六种可行的技术方案中,在电路板2与背板11上分别设置螺纹和螺钉,通过螺纹和螺钉的螺接,将电路板2与背板11的接触面稳定的连接在一起。
在第七种可行的技术方案中,在电路板2与背板11上分别设置连接孔,铆钉穿过连接孔,并将铆钉穿过的一端变形,使连接孔拉紧,使电路板2与背板11稳定的连接在一起。
在第八种可行的技术方案中,电路板2与背板11除了接触面以外,还具有焊接面,使用焊接机,将焊接面熔化并连接在一起,使电路板2与背板11的接触面稳定的连接在一起。焊接机包括热熔焊接机和超声波焊接机等。
在本实施例中,所述内嵌电路板的充电座结构还包括充电座后本体,充电座前本体1与所述充电座后本体前后装配,充电座前本体1与所述充电座后本体之间可以采用现有的可拆卸连接方式实现安装连接。
在本实施例中,端子3的材质可以选择导电性能好,材料的弹性性能优良的铜或铜合金,但是,随着铜价日益上涨,使用铜材作为端子3的材料成本会越来越高。金属铝在地壳中的含量约为7.73%,提炼技术优化后,价格相对较低,并且相对于铜,铝的重量较轻,导电率仅次于铜,铝在电气连接领域可以替代部分铜。因此也可以选择导电性能较好,材料的弹性性能一般,但价格更低的铝或铝合金。
当端子3的材料选择铜合金时,优选的,铜材质中含有碲材质,使端子3具有良好的导电性和易切削性能,保证电学性能也能提高加工性,同时,碲铜合金的弹性也很优良。
优选的,碲铜合金中,碲的含量为0.1%-5%,进一步优选的,碲铜合金中,碲的含量为0.2%-1.2%。
发明人选用了10个相同形状的端子3进行测试,每个端子3均为碲铜合金,其中碲的含量占比分别为0.05%、0.1%、0.2%、1%、1.2%、1.8%、3%、5%、6%、7%。测试结果如表2所示。
表2:不同碲含量的碲铜合金对导电率的影响。
碲含量 0.05% 0.1% 0.2% 1% 1.2% 1.8% 3% 5% 6% 7%
导电率 98.8% 99.4% 99.6% 99.7% 99.8% 99.6% 99.3% 99.1% 98.7% 98.5%
由表2可知,当碲的含量占比小于0.1%时或者大于5%时,导电率明显下降,不能满足实际需求。当碲的含量占比大于等于0.2%且小于等于1.2%时,导电性能最好,因此发明人选用碲的含量为0.1%-5%的碲铜合金。在最理想的情况下选用含量为0.2%-1.2%的碲铜合金作为端子3的材质。
在本实施例中的端子3上至少部分设置镀层,镀层可以提高的耐腐蚀性,提高导电性能,增加接插次数,能够更好的延长端子的使用寿命。
镀层可采用电镀、化学镀、磁控溅射或者真空镀等方法。
电镀方法,就是利用电解原理在某些金属表面上镀上一薄层其它金属或合金的过程。
化学镀方法,是在金属的催化作用下,通过可控制的氧化还原反应产生金属的沉积过程。
磁控溅射方法,是利用磁场与电场交互作用,使电子在靶表面附近成螺旋状运行, 从而增大电子撞击氩气产生离子的概率。所产生的离子在电场作用下撞向靶面从而溅射出靶材。
真空镀方法,是采用在真空条件下,通过蒸馏或溅射等方式在零件表面沉积各种金属和非金属薄膜。
镀层材质为金、银、镍、锡、锡铅合金、锌、银锑合金、钯、钯镍合金、石墨银、石墨烯银和银金锆合金中的一种或多种组合。铜或铝作为一种活泼金属,在使用过程中会与氧气和水发生氧化反应,因此需要一种或几种不活泼金属作为镀层,延长端子3的使用寿命。另外,对于需要经常插拔的金属触点,也是需要较好的耐磨金属作为镀层,能够极大的增加触点的使用寿命。还有触点需要很好的导电性能,上述金属的导电性和稳定性,都要优于铜或铜合金、铝或铝合金,能够使端子3获得更好的电学性能和更长的使用寿命。
为了论证不同镀层材质对端子3整体性能的影响,发明人使用相同规格、材质,采用不同镀层材料的端子3样件,利用同种规格的对插端端子做一系列插拔次数和耐腐蚀性时间测试。实验结果如表3所示。
表3中的插拔次数是将端子3和对插端端子分别固定在实验台上,采用机械装置使端子3和对插端端子模拟插拔,并且每经过100次的插拔,就要停下来观察端子3表面镀层破坏的情况,端子3表面镀层出现划伤,并露出端子3本身材质,则实验停止,记录当时的插拔次数。在本实施例中,插拔次数小于8000次为不合格。
表3中的耐腐蚀性时间测试,是将端子3放入到盐雾喷淋试验箱内,对端子3的各个位置喷淋盐雾,每隔20小时取出清洗观察表面腐蚀情况,即为一个周期,直到端子3表面腐蚀面积大于总面积的10%的时候,停止测试,并记录当时的周期数。在本实施例中,周期数小于80次认为不合格。
表3:不同镀层材质对端子插拔次数和耐腐蚀性的影响
Figure PCTCN2022129021-appb-000002
从表3可以看出,当选用镀层材质为金、银、银锑合金、钯、钯镍合金、石墨银、石墨烯银和银金锆合金时,实验结果超过标准值较多,性能比较稳定。当选用镀层材质为镍、锡、锡铅合金、锌时,实验结果也是能够符合要求的,因此,发明人选择镀层材质为金、银、镍、锡、锡铅合金、锌、银锑合金、钯、钯镍合金、石墨银、石墨烯银和银金锆合金中的一种或多种组合。
本发明还公开了一种充电座,所述充电座包括上述的内嵌电路板的充电座结构。
下面介绍充电座前本体1与所述充电座后本体的加工成型情况:
充电座前本体1与所述充电座后本体均为注塑成型,通过控制设备精度和模具误差来满足尺寸要求,通过锁模力、注射位置计量精度、注射速度、注射压力、模具温度等控制注塑过程,从而满足预装配以及旋转的尺寸精度要求,以及旋转力的操作要求。
具体参数如下:
锁模力为零时小于0.03mm;锁模力为最大时小于0.005mm;
注射位置精度(保压终止点)小于0.03mm;
注射速度大于等于300mm/s;
注射压力要大于25MPa;
模具温度变化应控制在±1℃之内。
下面介绍本发明所述内嵌电路板的充电座结构与现有充电座的技术效果对比,见表4。
表4:本发明所述内嵌电路板的充电座结构与现有充电座的技术效果对比
Figure PCTCN2022129021-appb-000003
为了便于理解和描述,本发明中采用了绝对位置关系进行表述,如无特别说明,其 中的方位词“上”表示图1中的上侧方向,方位词“下”表示图1中的下侧方向,方位词“左”表示图1中的左侧方向,方位词“右”表示图1中的右侧方向,方位词“前”表示垂直于图1的纸面并指向纸面内侧的方向,方位词“后”表示垂直于图1的纸面并指向纸面外侧的方向。本发明采用了阅读者的观察视角进行描述,但上述方位词不能理解或解释为是对本发明保护范围的限定。
以上所述,仅为本发明的具体实施例,不能以其限定发明实施的范围,所以其等同组件的置换,或依本发明专利保护范围所作的等同变化与修饰,都应仍属于本专利涵盖的范畴。另外,本发明中的技术特征与技术特征之间、技术特征与技术方案、技术方案与技术方案之间均可以自由组合使用。

Claims (11)

  1. 一种内嵌电路板的充电座结构,包括充电座前本体(1)和端子(3),其中,所述内嵌电路板的充电座结构还包括电路板(2),电路板(2)上设有端子安装通孔(21),端子(3)穿过端子安装通孔(21),电路板(2)上设有电子元件和通信接口。
  2. 根据权利要求1所述的内嵌电路板的充电座结构,其中,充电座前本体(1)含有前后设置的背板(11)和端子保护壳(12),背板(11)上设有充电座前本体接口(15),端子(3)与充电座前本体接口(15)一一对应连接,电路板(2)匹配地设置于端子保护壳(12)内。
  3. 根据权利要求1所述的内嵌电路板的充电座结构,其中,所述电子元件包括温度传感器,所述温度传感器与端子(3)直接或间接接触。
  4. 根据权利要求2所述的内嵌电路板的充电座结构,其中,所述通信接口位于电路板(2)背向背板(11)的面上,所述通信接口包括插针连接器(22)、USB接口、以太网接口和无线接口中的一种或多种。
  5. 根据权利要求1所述的内嵌电路板的充电座结构,其中,电路板(2)上设有至少一个弹片(23),端子(3)的外周与弹片(23)连接,弹片(23)施加在端子(3)上的压力为3N-200N。
  6. 根据权利要求5所述的内嵌电路板的充电座结构,其中,弹片(23)为金属弹片,该金属弹片与电路板(2)内的电路连接。
  7. 根据权利要求6所述的内嵌电路板的充电座结构,其中,所述电子元件包括电流传感器,所述电流传感器与所述金属弹片电性连接。
  8. 根据权利要求2所述的内嵌电路板的充电座结构,其中,端子保护壳(12)含有上下设置的上壳体(13)和下壳体(14),电路板(2)位于上壳体(13)内,或电路板(2)位于下壳体(14)内,或电路板(2)位于上壳体(13)和下壳体(14)内。
  9. 根据权利要求2所述的内嵌电路板的充电座结构,其中,所述内嵌电路板的充电座结构还包括端子支架(4),端子(3)通过端子支架(4)集成为一体式端子总成,电路板(2)位于端子支架(4)和背板(11)之间,端子保护壳(12)的内表面与端子支架(4)之间存在间距,所述通信接口位于所述间距内。
  10. 根据权利要求2所述的内嵌电路板的充电座结构,其中,电路板(2)与背板(11)的连接方式为粘贴连接、磁吸连接、卡口连接、插接连接、锁扣连接、捆扎连接、螺纹连接、铆钉连接和焊接连接中的一种或几种。
  11. 一种充电座,其中,所述充电座包括权利要求1-10任一项所述的内嵌电路板的充电座结构。
PCT/CN2022/129021 2021-11-04 2022-11-01 内嵌电路板的充电座结构及充电座 WO2023078247A1 (zh)

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