WO2023067901A1 - 伸縮性実装基板 - Google Patents

伸縮性実装基板 Download PDF

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Publication number
WO2023067901A1
WO2023067901A1 PCT/JP2022/032624 JP2022032624W WO2023067901A1 WO 2023067901 A1 WO2023067901 A1 WO 2023067901A1 JP 2022032624 W JP2022032624 W JP 2022032624W WO 2023067901 A1 WO2023067901 A1 WO 2023067901A1
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Prior art keywords
elastic
stretchable
wiring
electronic component
base material
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PCT/JP2022/032624
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English (en)
French (fr)
Japanese (ja)
Inventor
圭佑 西田
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株式会社村田製作所
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Priority to JP2023554972A priority Critical patent/JPWO2023067901A1/ja
Publication of WO2023067901A1 publication Critical patent/WO2023067901A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

Definitions

  • the present invention relates to elastic mounting substrates.
  • stretchable mounting boards are widely known, in which electronic components connected to stretchable wiring are mounted on a stretchable base material.
  • the substrate described in Patent Literature 1 includes stretchable wiring formed on a stretchable base material and electronic components mounted on the stretchable base material.
  • the present invention provides a stretchable substrate, a first stretchable wiring provided on the stretchable substrate, a first electronic component mounted on the stretchable substrate and connected to the first stretchable wiring, a stretchable heat dissipation member provided on the stretchable base material, wherein the first stretchable wiring has a component connection portion connected to the first electronic component, and the stretchable heat dissipation member is provided on the stretchable base material.
  • the present invention also provides a stretchable substrate, a first stretchable wiring provided on the stretchable substrate, and a first electronic component mounted on the stretchable substrate and connected to the first stretchable wiring. and a stretchable heat dissipation member provided on the stretchable base material, and a sealing layer for sealing the first electronic component, wherein the first stretchable wiring is a component connection portion connected to the first electronic component and at least a part of the elastic heat-dissipating member overlaps the sealing layer when viewed from the thickness direction of the elastic base material.
  • a stretchable mounting board according to one aspect of the present invention can obtain a sufficient heat dissipation effect for electronic components. Therefore, it is possible to provide a stretchable mounting substrate with high thermal reliability.
  • FIG. 1 is a top view of a stretchable mounting board according to the first embodiment.
  • FIG. 2A is a partial top view of the stretchable mounting substrate according to the first embodiment.
  • FIG. 2B is a partial cross-sectional view (cross-sectional view taken along the line AA in the top view) of the elastic mounting board according to the first embodiment.
  • FIG. 3A is a partial top view of an elastic mounting substrate according to a first modification of the first embodiment;
  • FIG. 3B is a partial cross-sectional view (cross-sectional view taken along the line BB in the top view) of the elastic mounting board according to the first modification of the first embodiment.
  • FIG. 4A is a partial top view of a stretchable mounting board according to a second modification of the first embodiment;
  • FIG. 4B is a partial cross-sectional view (cross-sectional view taken along the line CC in the top view) of the elastic mounting board according to the second modification of the first embodiment.
  • FIG. 5A is a partial top view of an elastic mounting substrate according to a third modification of the first embodiment
  • FIG. 5B is a partial cross-sectional view (cross-sectional view taken along the line DD in the top view) of the stretchable mounting board according to the third modification of the first embodiment.
  • FIG. 6A is a partial top view of an elastic mounting substrate according to a fourth modification of the first embodiment
  • FIG. 6B is a partial cross-sectional view (cross-sectional view taken along the line EE in the top view) of the stretchable mounting board according to the fourth modification of the first embodiment.
  • FIG. 7 is a partial top view of an elastic mounting board according to a fifth modification of the first embodiment.
  • FIG. 8 is a partial top view of an elastic mounting board according to a sixth modification of the first embodiment.
  • FIG. 9 is a partial cross-sectional view of an elastic mounting board according to the second embodiment.
  • FIG. 10A is a partial top view of an elastic mounting board according to the third embodiment.
  • FIG. 10B is a partial cross-sectional view (cross-sectional view taken along the line FF in the top view) of the elastic mounting board according to the third embodiment.
  • FIG. 11 is a partial top view of an elastic mounting substrate according to a first modified example of the third embodiment.
  • FIG. 12A is a partial top view of an elastic mounting board according to the fourth embodiment.
  • FIG. 12B is a partial cross-sectional view (cross-sectional view taken along the line GG in the top view) of the elastic mounting board according to the fourth embodiment.
  • the stretchable mounting substrate 100 has a shape in plan view with a rectangular main portion on the left side and a convex secondary portion on the right side.
  • the elastic mounting substrate 100 is not limited to the shape shown in FIG. 1, and may be, for example, circular or rectangular. Further, in FIG. 1 , a double-headed arrow X indicates an expected direction of expansion and contraction when the elastic mounting substrate 100 is used.
  • the expansion/contraction direction arrow does not mean that the elastic mounting board 100 expands/contracts only in this direction, and the elastic mounting board 100 may expand/contract in other directions.
  • the area where the first electronic component 3 or the component connection portion 5 is arranged is indicated by a mounting area Z indicated by a double arrow.
  • the mounting area Z indicated by a double arrow is merely an example, and may be of any size.
  • the stretchable mounting substrate 100 is used as a thin and stretchable wearable device, for example, attached to a curved surface of a living body such as a human body using its upper or lower main surface as an attachment surface.
  • the stretchable mounting substrate 100 shown in FIGS. 1, 2A and 2B includes a stretchable substrate 1, first stretchable wiring 2 provided on the stretchable substrate 1, and mounted on the stretchable substrate 1. , a first electronic component 3 connected to the first elastic wiring 2, a second elastic wiring 4 provided on the elastic substrate 1, and a first insulating layer provided on the elastic substrate 1 6 and .
  • the first stretchable wiring 2 has a component connection portion 5 connected to the first electronic component 3, and the second stretchable wiring 4 is viewed from above, that is, viewed from the thickness direction of the stretchable base material 1, A part thereof overlaps with the first electronic component 3 or the component connection portion 5 .
  • the first elastic wiring 2, the second elastic wiring 4, the first insulating layer 6, and the joint 10 are hatched for convenience. The same applies to the following top views.
  • the second stretchable wiring 4 corresponds to the stretchable heat dissipation member in the present disclosure.
  • the portion of the second elastic wiring 4 that overlaps the first electronic component 3 and the component connection portion 5 when viewed from the thickness direction of the elastic base material 1 functions as a heat absorbing portion. .
  • the heat absorbed by the heat absorbing portion spreads over the entire second stretchable wiring 4 . That is, the heat generated from the first electronic component 3 can be absorbed by the heat absorbing portion and released through the second stretchable wiring 4 extending away from the first electronic component 3 . Therefore, with the configuration as described above, it is possible to provide an elastic mounting substrate with high thermal reliability.
  • Thermal reliability in this specification refers to the rate of occurrence of malfunctions and defects due to heat generation of electronic components during use. That is, the higher the thermal reliability, the lower the possibility of malfunctions and defects occurring in the elastic mounting board including the electronic components, and the lower the thermal reliability, the higher the possibility of malfunctions and defects occurring.
  • the stretchable base material 1 is a sheet-like or film-like stretchable base material, and is made of, for example, a stretchable resin material.
  • the resin material include thermoplastic polyurethane and the like.
  • the thickness of the elastic base material 1 is not particularly limited, but from the viewpoint of not inhibiting the expansion and contraction of the surface of the living body when attached to the living body, it is preferably 1 mm or less, more preferably 100 ⁇ m or less, and 1 ⁇ m. More preferably: Moreover, the thickness of the stretchable base material 1 is preferably 0.1 ⁇ m or more.
  • the first elastic wiring 2 is directly connected to the first electronic component 3 among the elastic wirings drawn in a predetermined pattern on the main surface of the elastic base material 1 and on the main surface of the first insulating layer 6. It refers to something that is physically connected.
  • the first stretchable wiring 2 contains conductive particles and resin.
  • a mixture of metal powder such as Ag, Cu, and Ni as conductive particles and elastomeric resin such as silicone resin can be used.
  • the average particle size of the conductive particles is not particularly limited, it is preferably 0.01 ⁇ m or more and 10 ⁇ m or less.
  • the shape of the conductive particles is preferably spherical.
  • the thickness of the first elastic wiring 2 is not particularly limited, it is preferably 100 ⁇ m or less, more preferably 50 ⁇ m or less. Moreover, it is preferable that the thickness of the first elastic wiring 2 is 0.01 ⁇ m or more.
  • the line width of the first elastic wiring 2 is not particularly limited, it is preferably 0.1 ⁇ m or more, and more preferably 10 mm or less. Also, the number of elastic wires included in the first elastic wire 2 is not particularly limited.
  • the first electronic component 3 is mounted on the elastic base material 1.
  • Examples of the first electronic component 3 include an acceleration sensor and a temperature sensor.
  • the first electronic component 3 is not particularly limited, and may be an amplifier (operational amplifier, transistor, etc.), chip capacitor, chip resistor, LED, semiconductor IC, chip inductor, or the like.
  • the first electronic component 3 has an external electrode 13 , and the external electrode 13 is electrically connected to the component connection portion 5 of the first elastic wiring 2 via the joint portion 10 .
  • the first electronic component 3 is preferably a heat-generating electronic component such as an active element from the viewpoint that the thermal reliability of the electronic component, and thus the thermal reliability of the elastic mounting substrate 100, can be greatly improved. may
  • the first electronic component 3 is connected to the first stretchable wiring 2 via the joint 10 .
  • solder and a conductive adhesive can be used as materials for forming the joint 10, the materials other than those described above may be used.
  • the joint 10 is a so-called fillet, and is not limited to the shape shown in FIG. 1, and may be semicircular, for example. Moreover, the first electronic component 3 is not limited to the arrangement shown in FIG.
  • the second stretchable wiring 4 is routed in a predetermined pattern on the main surface of the stretchable base material 1 and contains conductive particles and resin.
  • conductive particles and resin for example, a mixture of metal powder such as Ag, Cu, and Ni as conductive particles and elastomeric resin such as silicone resin can be used.
  • the average particle size of the conductive particles is not particularly limited, it is preferably 0.01 ⁇ m or more and 10 ⁇ m or less.
  • the shape of the conductive particles is preferably spherical.
  • the thickness of the second elastic wiring 4 is not particularly limited, it is preferably 100 ⁇ m or less, more preferably 50 ⁇ m or less. Moreover, it is preferable that the thickness of the second elastic wiring 4 is 0.01 ⁇ m or more.
  • the line width of the second elastic wiring 4 is not particularly limited, it is preferably 0.1 ⁇ m or more, and more preferably 10 mm or less. Further, the number of elastic wirings included in the second elastic wiring 4 is not particularly limited. The second stretchable wiring 4 is not electrically connected directly to the first electronic component 3 .
  • the first elastic wiring 2 and the second elastic wiring 4 may each contain conductive particles having the same average particle size, or may contain different conductive particles. Similarly, the width and thickness of the elastic wiring may be the same or different. It is preferable that the line width of the second stretchable wiring 4 is thicker than that of the first stretchable wiring 2, because the heat dissipation can be improved.
  • the elastic heat dissipation member in the present disclosure is not limited to elastic wiring, and may be, for example, a patterned elastic heat dissipation pattern. In other words, it may be a pattern that is not connected to an electronic component or wiring and whose function is specialized for heat dissipation.
  • the shape of the elastic heat dissipation member other than the elastic wiring is not particularly limited, as long as a part of the elastic heat dissipation member overlaps the first electronic component or the component connection portion when viewed from the thickness direction of the elastic base material. good.
  • first elastic wiring 2 and the second elastic wiring 4 are connected in a region that does not overlap the first electronic component 3 and the component connection portion 5 when viewed from the thickness direction of the elastic base material 1.
  • the first elastic wiring 2 and the second elastic wiring 4 are extended in the same direction so as to be parallel and overlap at least in the vicinity of the first electronic component 3 , and extend from the first elastic wiring 2 to the second elastic wiring. Heat can be efficiently transferred to the wiring 4 .
  • the component connection portion 5 is a portion that functions as a land or pad for mounting electronic components, and refers to a portion of the first elastic wiring 2 that overlaps the joint portion 10 when viewed from the thickness direction of the elastic base material 1. .
  • the joint portion 10 may include a region that does not overlap the first elastic wiring 2 when viewed from the thickness direction of the elastic base material 1, or may overlap the first elastic wiring 2 as a whole. good.
  • the first insulating layer 6 is preferably made of a resin material or a mixture of a resin material and an inorganic material. Rubber, vinyl chloride, ester-based, amide-based elastomer resins, epoxy, phenol, acrylic, polyester, imide-based, rosin, cellulose, polyethylene terephthalate-based, polyethylene naphthalate-based, and polycarbonate-based resins can be used.
  • a first insulating layer 6 is arranged between the first electronic component 3 and the second elastic wiring 4 in the thickness direction of the elastic base material 1 .
  • the first insulating layer 6 may be arranged only in the region where the first elastic wiring 2 and the second elastic wiring 4 overlap, or may be arranged so as to overlap the entire substrate. may be
  • the distance between the first electronic component 3 and the second elastic wiring 4 is short in the thickness direction of the elastic base material 1, the possibility of short circuit due to contact between the two increases.
  • the first insulating layer 6 between the first elastic wiring 2 and the second elastic wiring 4 as shown in FIGS. 2A and 2B, the first electronic component 3 and the first electronic component 3 can be The distance to the second stretchable wiring 4 can be made sufficiently close. Therefore, the heat generated from the first electronic component 3 can be efficiently absorbed by the second stretchable wiring 4 .
  • the elastic mounting board 100 has the second elastic wiring 4 provided on the elastic base material 1 and the first insulating layer 6 interposed therebetween.
  • a component connection portion 5 is provided above the second elastic wiring 4 .
  • the vertical direction in this specification is defined as the “lower side” for the elastic base material 1 and the “upper side” for the first electronic component 3 in FIGS. They do not have to match.
  • stretchable wiring increases in resistance and decreases in thermal conductivity when stretched. In other words, the heat dissipation performance of the first stretchable wiring 2 and the second stretchable wiring 4 is lowered when stretched. Therefore, it is preferable that the first elastic wiring 2 and the second elastic wiring 4 do not expand and contract uniformly when the elastic mounting substrate 100 deforms such as stretching and bending. Therefore, it is preferable that the first elastic wiring 2 and the component connection portion 5 and the second elastic wiring 4 are provided in different layers in the vicinity of the electronic component.
  • the first elastic wiring 2 and the second elastic wiring 4 do not expand and contract uniformly, even when the thermal conductivity of one elastic wiring decreases, the other elastic wiring does not expand. Since a decrease in thermal conductivity can be suppressed, a stretchable mounting substrate with higher thermal reliability can be provided.
  • the component connection portion 5 and the second stretchable wiring 4 are provided at different distances from the stretchable base material. As a result, when the elastic mounting substrate 100 is bent or bent, the first elastic wiring 2 and the second elastic wiring 4 do not expand and contract uniformly. Therefore, even when the stretchable mounting board 100 is bent, it is possible to sufficiently dissipate heat from the vicinity of the first electronic component 3 .
  • the first stretchable wiring 2 and the second stretchable wiring 4 are connected to the connector 12 . That is, the stretchable wiring board 11 can be connected to other devices via the connector 12 . Also, the first elastic wiring 2 is connected to an electronic component 11A different from the first electronic component 3, and the second elastic wiring 4 is connected to the electronic component 11B.
  • a stretchable heat dissipation member may be arranged for each of the plurality of electronic components, or as shown in FIG. You may arrange
  • each stretchable heat radiating member may be a different member or the same member. When using the same heat radiating member, each may be integrally formed or may be separated.
  • the first elastic wiring 2 and the second elastic wiring 4 are not limited to the arrangement shown in FIG. Moreover, each number is not specifically limited. Also, the type of the other electronic component 11 is not particularly limited, and may be the same as or different from the first electronic component 3 . Also, the number of electronic components 11 is not particularly limited. The arrangement position and the number of connectors 12 are not particularly limited. The electronic components 11A, 11B and the connector 12 are not essential components of the present disclosure.
  • the stretchable mounting board 100A according to the first modification of the first embodiment differs from the stretchable mounting board 100 according to the first embodiment in the arrangement of the first stretchable wirings 2 and the second stretchable wirings 4. do.
  • the extending direction (Y direction) of the first elastic wiring 2 and the extending direction (X direction) of the second elastic wiring 4 are: cross.
  • the elastic mounting substrate 100A expands and contracts.
  • the elastic mounting substrate 100A expands and contracts in the direction of the double-headed arrow Y shown in FIG. 3A
  • the first elastic wiring 2 expands and contracts, thereby increasing the resistance and decreasing the thermal conductivity. That is, there is a possibility that the heat dissipation performance may deteriorate.
  • the second elastic wiring 4 extends in the Y direction, that is, in the direction perpendicular to the first elastic wiring 2 as viewed from the first electronic component 3, the amount of expansion and contraction in the Y direction is the same as that of the first elastic wiring less than 2. That is, since a decrease in thermal conductivity is also suppressed, a state of high thermal reliability can be maintained even when the elastic mounting board 100A expands and contracts.
  • the elastic mounting substrate 100A expands and contracts in the direction (Y direction) parallel to the extending direction of the second elastic wirings 4, the thermal conductivity of the second elastic wirings 4 decreases, but the first elasticity increases. A decrease in thermal conductivity of the wiring 2 can be suppressed. That is, the extending direction of the first elastic wiring and the extending direction of the second elastic wiring intersect at least in the vicinity of the first electronic component. can maintain high thermal reliability.
  • the vicinity of an electronic component refers to a region whose distance from the electronic component is 1 mm or less in plan view.
  • the second elastic wiring 4 has an intersection with the extending direction of the first elastic wiring 2 when viewed from the thickness direction of the elastic substrate 1, and the intersection is located at the intersection when viewed from the thickness direction of the elastic substrate 1. , the first electronic component 3 or the joint portion 10 .
  • the first elastic wiring 2 and the second elastic wiring 4 do not have to extend in one direction over the entire length of the wiring.
  • the first elastic wiring 2 includes a region extending in a direction orthogonal to the extending direction of the second elastic wiring 4, and regions extending in parallel.
  • the direction of extension of the first elastic wiring 2 near the component connection portion 5 and the direction of extension of the second elastic wiring 4 are different from each other. It should be crossed.
  • the second stretchable wiring 4 may have regions branched and extended in a plurality of directions.
  • the extending direction of the first elastic wiring 2 and the extending direction of the second elastic wiring 4 are not limited to the arrangement shown in FIGS. 3A and 3B. As described above, if the extending direction of each wiring is different, the decrease in thermal conductivity in a specific expansion/contraction direction will be different. For example, when the stretchable mounting substrate expands and contracts in the X direction, the thermal conductivity of the wires extending in the X direction is greatly reduced, and the thermal conductivity of the wires extending in the Y direction is less reduced. In other words, the larger the angle formed by the stretching direction of the elastic mounting substrate and the extending direction of the wiring, the more the decrease in thermal conductivity is suppressed. In this specification, the term "angle" refers to the smaller of the two angles formed at the intersection. That is, the maximum is 90 degrees.
  • the heat conductivity of the first stretchable wiring 2 is greatly reduced.
  • a decrease in thermal conductivity is suppressed.
  • the larger the angle formed by the first elastic wiring 2 and the second elastic wiring 4 the more the decrease in the thermal conductivity of the second elastic wiring 4 is suppressed.
  • the reduction in the thermal conductivity of the first elastic wiring 2 is suppressed against the expansion and contraction that greatly reduces the thermal conductivity of the second elastic wiring 4 . That is, the extending direction of the first elastic wiring 2 and the extending direction of the second elastic wiring 4 are arranged so as to intersect at least in the vicinity of the first electronic component 3.
  • the flexible mounting substrate 100A By arranging the flexible mounting substrate 100A so as to intersect in the region overlapping with the electronic component 3, it is possible to suppress a decrease in thermal conductivity regardless of the direction in which the elastic mounting substrate 100A expands and contracts. Moreover, it is preferable that the angle between the extending direction of the first elastic wiring 2 and the extending direction of the second elastic wiring 4 is large, and it is more preferable that they are perpendicular to each other.
  • the extending directions of the respective second elastic wirings 4 may be different.
  • the extension directions of the plurality of second elastic wirings 4 are different, so that the thermal conductivity of the second elastic wiring 4 is reduced when the second elastic wiring 4 is expanded and contracted in a specific direction. can be suppressed.
  • the expected expansion/contraction direction is fixed in one direction, it is effective to arrange the plurality of second elastic wirings 4 so as to be orthogonal to that direction. Since the deterioration of the thermal conductivity of the second elastic wiring 4 can be greatly suppressed in a specific expansion/contraction direction, it is possible to provide the elastic mounting substrate 100A with higher thermal reliability.
  • the elastic mounting board 100B according to the second modification of the first embodiment differs from the elastic mounting board 100 according to the first embodiment in the arrangement of the first elastic wirings 2 and the second elastic wirings 4. do.
  • the second stretchable wiring 4 is arranged above the electronic component in the thickness direction of the stretchable base material 1 .
  • the component connection portion 5 and the second stretchable wiring 4 are provided at portions with different distances from the stretchable base material 1 .
  • heat can be sufficiently dissipated from the vicinity of the first electronic component 3 even when the flexible mounting board 100B is bent.
  • the heat dissipation from the lower surface side of the first electronic component 3 can be handled by the first elastic wiring 2, and the heat dissipation from the upper surface side can be conducted by the second elastic wiring 4, so that high heat dissipation can be achieved. It is suitable when using necessary electronic parts.
  • the flexible mounting board 100B is not limited to the arrangement shown in FIGS. 4A and 4B. 4A and 4B, the second elastic wiring 4 is arranged so as to overlap the first electronic component 3 when viewed from the thickness direction of the elastic base material 1, but is arranged so as to overlap the joint 10. may be Moreover, the number and extending direction of the second elastic wiring 4 are not limited.
  • FIGS. 5A and 5B A third modification of the first embodiment will be described with reference to FIGS. 5A and 5B.
  • An elastic mounting substrate 100C according to the third modification of the first embodiment differs in the configuration of the first elastic wirings 2 from that of the first embodiment. Specifically, as shown in FIGS. 5A and 5B, the numbers of the first elastic wires 2 and the numbers of the second elastic wires 4 in the vicinity of the first electronic component 3 are different.
  • the first elastic wiring 2 is composed of three elastic wirings connected to the first electronic component 3A
  • the second elastic wiring 4 is composed of two elastic wirings. Consists of That is, the wiring density of the first elastic wiring 2 provided on the upper side of the first insulating layer 6 is higher than the wiring density of the second elastic wiring 4 provided on the lower side of the first insulating layer 6 .
  • the elastic mounting board 100C is bent so that the second elastic wiring 4 is inside and the first elastic wiring 2 is outside.
  • the elastic base material 1 is composed of a member having a uniform thickness
  • the amount of expansion and contraction increases with increasing distance from the center of bending in the thickness direction of the elastic base material 1 at the time of bending. That is, since there is a portion where the amount of expansion and contraction changes, there is a possibility that the portion will become the starting point of breakage.
  • the portion of the elastic mounting substrate 100C farther from the elastic base material 1 is less likely to expand and contract, so that the amount of expansion and contraction approaches uniformity during bending. Therefore, breakage during bending can be suppressed.
  • the magnitude of the wiring density in this specification can be compared with the magnitude of the wiring cross-sectional area in a specific region. That is, the wiring density of the first elastic wiring 2 provided on the upper side of the first insulating layer 6 is higher than the wiring density of the second elastic wiring 4 provided on the lower side of the first insulating layer 6. can be rephrased that the cross-sectional area of the first elastic wiring 2 is larger than the cross-sectional area of the second elastic wiring 4 . As shown in this embodiment, when there are a plurality of first stretchable wires 2 and a plurality of second stretchable wires 4, the total cross-sectional area of each wire is compared.
  • the number of the first elastic wirings 2 and the number of the second elastic wirings 4 may be the same.
  • the cross-sectional area can be changed by changing the width and thickness of each elastic wiring.
  • the above methods may be combined.
  • the cross-sectional area and the number of each elastic wiring included in the first elastic wiring 2 and the second elastic wiring 4 are particularly related in size. Not limited.
  • each elastic wiring included in the first elastic wiring 2 may be the same or different. The same applies to the second stretchable wiring 4 as well. Also, the first elastic wiring 2 and the second elastic wiring 4 when viewed from the thickness direction of the elastic base material 1 are not limited to the arrangement shown in FIGS. , may overlap completely.
  • the cross-sectional area of the elastic wiring refers to an arbitrary cross section perpendicular to the extending direction of the elastic wiring. As shown in FIGS. 2A and 2B, it is preferable to compare the cross-sectional area of the region where the first elastic wiring 2 and the second elastic wiring 4 overlap in the thickness direction of the elastic base material 1. If the stretchable wiring 2 and the second stretchable wiring 4 do not overlap, it is preferable to compare in the vicinity of the electronic component. 5A and 5B, when the specific cross section is a cross section perpendicular to the extending direction of the elastic wiring included in the first elastic wiring 2 and the second elastic wiring 4, the comparison is made at that part. is more preferable.
  • the extension directions of the respective elastic wirings included in the first elastic wiring 2 may be different. In that case, the sum of the cross-sectional areas perpendicular to each stretch direction is compared. The same applies to the second stretchable wiring 4 as well. Moreover, it is preferable that the extending direction of the first elastic wiring 2 and the extending direction of the second elastic wiring 4 are parallel at least in the vicinity of the first electronic component 3 .
  • the elastic substrate 1 is bent so that the second elastic wiring 4 is inside and the first elastic wiring 2 is outside, the first elastic wiring 2 and the second elastic wiring 4 are bent. are parallel to each other, and the wiring density of the first elastic wiring 2 farther from the elastic base material 1 is higher than the wiring density of the second elastic wiring 4 closer to the elastic base material 1. By doing so, it is possible to make the amount of expansion and contraction in the vicinity of the electronic component nearly uniform when bending in such a direction.
  • the first elastic wiring 2 and the second elastic wiring 4 may each have regions with different extending directions.
  • the second elastic wiring 4 is provided on the elastic base material 1, and the component connection part is provided on the upper side of the second elastic wiring 4 via the first insulating layer 6. 5 is provided, it is preferable to select the function of each wire such that the current density of the first elastic wire 2 is greater than the current density of the second elastic wire 4 .
  • the current density of the elastic wiring is a value obtained by dividing the current flowing through the elastic wiring by the cross-sectional area of the elastic wiring. That is, the higher the current density, the more heat is generated in the stretchable wiring.
  • the second elastic wiring 4 is more likely to transfer heat than the first elastic wiring 2, so that the heat dissipation from the first electronic component 3 to the second elastic wiring 4 is reduced. can be done more efficiently.
  • a stretchable mounting board 100D according to the fourth modification of the first embodiment differs in arrangement of the second stretchable wirings 4 from the stretchable mounting board 100 according to the first embodiment. Specifically, the second stretchable wiring 4 does not overlap the first electronic component 3 but overlaps the component connection portion 5 when viewed from the thickness direction of the stretchable base material 1 .
  • the first electronic component 3 is Among them, it is preferable to place the second stretchable wiring 4 so that the portion to be most heat-dissipated and the second stretchable wiring 4 overlap. By arranging them as shown in FIGS. 6A and 6B, it is possible to efficiently dissipate heat from a region of the first electronic component 3 near the component connection portion 5 .
  • the second elastic wiring 4 is not limited to the arrangement as shown in FIGS. 6A and 6B. 6A and 6B, the second elastic wiring 4 is arranged so as to overlap all the component connection portions 5 when viewed from the thickness direction of the elastic base material 1, but at least one component connection portion 5 and It's okay if they overlap. Also, the extending direction of the second elastic wiring 4 does not have to be orthogonal to the extending direction of the first elastic wiring 2 as shown in FIGS. 6A and 6B.
  • the stretchable mounting board 100E according to the fifth modification of the first embodiment differs from the stretchable mounting board 100 according to the first embodiment in the arrangement of the second stretchable wirings 4 . Specifically, when viewed from the thickness direction of the elastic base material 1 , the second elastic wiring 4 does not overlap the component connection portion 5 but overlaps the first electronic component 3 .
  • heat can be efficiently dissipated from the central portion of the first electronic component 3 .
  • an electronic component when an electronic component generates heat, most of the heat is generated from the central portion of the component. Therefore, by arranging them as shown in FIG. 7 , it is possible to more efficiently radiate heat from the first electronic component 3 while suppressing an increase in the area of the second stretchable wiring 4 .
  • the second elastic wiring 4 is not limited to the arrangement shown in FIG.
  • the extending direction of the second elastic wiring 4 and the extending direction of the first elastic wiring 2 may be arranged so as to be perpendicular to each other.
  • the number of elastic wirings included in the second elastic wiring 4 is not particularly limited.
  • the stretchable mounting board 100F according to the sixth modification of the first embodiment differs from the stretchable mounting board 100 according to the first embodiment in the arrangement of the first stretchable wirings 2 and the second stretchable wirings 4. do.
  • the first elastic wiring 2 has a different extending direction across the connection with the first electronic component 3, and the second elastic wiring 4 extends in the same direction as the first elastic wiring 2. is changing.
  • FIG. 8 shows only the electrodes 13 connected to the first elastic wirings 2 of the first electronic component 3B.
  • the extending direction of the first stretchable wiring 2 may change across the first electronic component 3B. That is, it is possible to change the routing direction of the first stretchable wiring 2 to the optimum shape for the arrangement and shape of the first electronic component. Similarly, the extending direction of the second elastic wiring 4 may be changed so as to match the extending direction of the first elastic wiring 2 .
  • the sixth modification of the first embodiment is not limited to the arrangement shown in FIG.
  • the second stretchable wiring 4 may extend in one direction near the component.
  • the first elastic wiring 2 and the second elastic wiring 4 may be arranged so as to overlap when viewed from the thickness direction of the elastic base material 1 .
  • the second stretchable wiring 4 extends from the thickness direction of the stretchable base material 1.
  • the first elastic wiring 2 extends in a direction different from any direction in which the first elastic wiring 2 extends.
  • the stretchable mounting board 101 according to the second embodiment further includes a second insulating layer 7 compared to the stretchable mounting board 100 according to the first embodiment.
  • the second stretchable wiring line 4 and the stretchable base material 1 overlap in the region where the second stretchable wiring line 4 overlaps the first electronic component or the component connecting portion.
  • a second insulating layer 7 is further provided in between.
  • the second insulating layer 7 is preferably made of a resin material or a mixture of a resin material and an inorganic material. Rubber, vinyl chloride, ester-based, amide-based elastomer resins, epoxy, phenol, acrylic, polyester, imide-based, rosin, cellulose, polyethylene terephthalate-based, polyethylene naphthalate-based, and polycarbonate-based resins can be used.
  • the second insulating layer 7 may be the same member as the first insulating layer 6, or may be different. Moreover, when the second insulating layer 7 and the first insulating layer 6 are the same member, both may be integrated.
  • the second elastic wiring 4 and the elastic group are formed.
  • the position of the second elastic wiring 4 in the thickness direction of the elastic base material 1 can be adjusted by being arranged between the material 1 and the elastic base material 1 .
  • the stretchable mounting substrate 101 bends in the vertical direction and vibrates, there are portions where the displacement is large and portions where the displacement is small depending on the position in the thickness direction. Specifically, the portion with the largest amount of displacement corresponds to an antinode in vibration, and the portion with the smallest amount of displacement corresponds to a node in vibration. That is, by arranging the second insulating layer 7, the second stretchable wiring 4 can be brought closer to the portion where the amount of displacement is the smallest in the thickness direction.
  • the second insulating layer 7 may be arranged between the entire second stretchable wiring 4 and the stretchable base material 1 . Also, as shown in FIG. 9 , a portion of the second insulating layer 7 may be arranged between the stretchable base material 1 and the first stretchable wiring 2 . Moreover, the second insulating layer 7 may be arranged on the entire stretchable base material 1 .
  • the stretchable mounting substrate 102 according to the third embodiment further includes a sealing layer 8 compared to the stretchable mounting substrate 100 according to the first embodiment.
  • a sealing layer 8 compared to the stretchable mounting substrate 100 according to the first embodiment.
  • illustration of the first insulating layer 6 inside the sealing layer 8 is omitted, and the sealing layer 8 is indicated by hatching.
  • the first insulating layer 6 may be arranged only inside the sealing layer 8 as shown in FIG. You can cover it.
  • the sealing layer 8 seals the first electronic component 3 and protects the first electronic component 3 from external forces.
  • the constituent material of the sealing layer 8 is not particularly limited, but examples include polyvinyl chloride, polyethylene, polystyrene, polycarbonate, polyvinylidene fluoride, polyimide, liquid crystal polymer, polytetrafluoroethylene, phenol resin, epoxy resin, urethane resin, Examples include acrylic resins, silicone resins, elastomer resins such as styrene/butadiene resins, and the like.
  • the sealing layer 8 By providing the sealing layer 8, it is possible to protect the first electronic component 3 from external forces, while suppressing the diffusion of heat from the vicinity of the component.
  • the second elastic wiring 4 is provided so as to partially overlap the sealing layer 8 in the thickness direction of the elastic base material 1, and the second elastic wiring 4 is provided in the sealing layer. Heat can be dissipated from the first electronic component 3 by routing it to the outside of 8 .
  • the stretchable mounting substrate 102 includes the stretchable substrate 1, the first stretchable wiring 2 provided on the stretchable substrate 1, and the stretchable substrate 1.
  • the first elastic wiring 2 has a component connection portion 5 connected to the first electronic component 3, and the second elastic wiring 4 has a part of It overlaps with the sealing layer 8 .
  • the second stretchable wiring 4 corresponds to the stretchable heat dissipation member in the present disclosure.
  • the heat inside the sealing layer 8 moves to the region of the second elastic wiring 4 that overlaps with the sealing layer 8 when viewed from the thickness direction of the elastic base material 1, Furthermore, the heat trapped in the sealing layer 8 can be released by being diffused to the remaining region of the second elastic wiring 4, that is, the outer region of the sealing layer 8.
  • the size of the sealing layer 8 should be larger than that of the first electronic component 3 .
  • the shape is not particularly limited, and may be rectangular or circular when viewed from the thickness direction of the elastic base material 1 .
  • part of the second elastic wiring 4 is arranged inside the sealing layer 8 .
  • the second stretchable wiring 4 By arranging the second stretchable wiring 4 inside the sealing layer 8, the distance between the first electronic component 3 and the second stretchable wiring 4 when viewed from the thickness direction of the stretchable base material 1 can be shortened. can. That is, it is possible to radiate heat from the sealing layer 8 more efficiently.
  • the second elastic wiring 4 is arranged inside the sealing layer 8, and the first elastic wiring 2 is arranged at the interface between the sealing layer 8 and the elastic base material 1.
  • the second elastic wiring 4 is not limited to the arrangement shown in FIGS. 10A and 10B, and may be arranged below the first elastic wiring 2 as in the first embodiment, for example. Moreover, it is preferable that the second stretchable wiring 4 is arranged in the vicinity of the first electronic component 3 . Also, the arrangement of the first electronic component, the first stretchable wiring, the second stretchable wiring, the first insulating layer, etc. can be the same as in the first embodiment.
  • a first modification of the third embodiment will be described with reference to FIG.
  • An elastic mounting board 102A according to the first modification of the third embodiment differs in arrangement of the second elastic wirings 4 from the elastic mounting board 102 according to the third embodiment.
  • the extending direction of the first elastic wiring 2 and the extending direction of the second elastic wiring 4 may be parallel.
  • the second stretchable wiring 4 is provided so as to overlap the first electronic component 3 when viewed from the thickness direction of the stretchable base material 1 .
  • illustration of the first insulating layer 6 is omitted in FIG. 11, as in the first embodiment, by arranging the first insulating layer between the first elastic wiring and the second elastic wiring, Since short-circuiting between the first elastic wiring and the second elastic wiring can be suppressed by the first insulating layer 6, the distance between the first electronic component 3 and the second elastic wiring 4 in the thickness direction of the elastic base material 1 is can get closer. That is, heat can be efficiently dissipated.
  • the arrangement of the first elastic wiring 2 and the second elastic wiring 4 is not limited to the arrangement shown in FIGS. 10A and 10B. By using the arrangement shown as each modification of the first embodiment, the effects described above can be obtained.
  • a fourth embodiment will be described with reference to FIGS. 12A and 12B.
  • a stretchable mounting board 103 according to the fourth embodiment differs from the stretchable mounting board 100 according to the first embodiment in that it includes a second electronic component 9 .
  • different reference numerals are assigned to the respective parts of the first elastic wiring and the second elastic wiring for clarity, but this does not indicate that they are different elastic wiring. do not have.
  • the same reference numerals are used even before and after being connected to the electronic component, but different reference numerals are used in the description of the fourth embodiment.
  • when there are a plurality of the first stretchable wirings 2 or the second stretchable wirings 4 all of them are given the same reference numerals.
  • the stretchable mounting board 103 further includes a second electronic component 9 .
  • the second electronic component 9 is connected to the second stretchable wiring 4 .
  • the second electronic component 9 is sealed with a sealing layer 8 .
  • Specific examples of the second electronic component 9 include an acceleration sensor and a temperature sensor.
  • the second electronic component 9 is not particularly limited, and may be an amplifier (operational amplifier, transistor, etc.), chip capacitor, chip resistor, LED, semiconductor IC, chip inductor, or the like. In addition, they may be the same components as the first electronic components 3B and 3C, or they may be different. Also, like the first electronic components 3B and 3C, the second electronic component 9 is preferably an active element, but may be a passive element.
  • the first elastic wires 2A and 2B are connected to the first electronic components 3B and 3C
  • the second elastic wires 4A, 4B, 4C and 4D are connected to the second electronic component 9.
  • the second stretchable wirings 4A and 4B function as stretchable heat dissipation members for the first electronic component 3B
  • the second stretchable wirings 4C and 4D function as stretchable heat dissipation members for the first electronic component 3C.
  • Z1 indicates the mounting area for the first electronic component 3B
  • Z2 indicates the mounting area for the first electronic component 3C.
  • each of the plurality of first electronic components may be provided with a stretchable heat-dissipating member having different functions such as a wiring pattern and a heat-dissipating pattern. It goes without saying that a plurality of first electronic components 3 may also be provided in embodiments other than the fourth embodiment.
  • the second electronic component 9 to which the second elastic wiring 4 is connected may also generate heat during use.
  • the second electronic component 9 also needs to dissipate heat
  • the second stretchable wiring 4 corresponds to the first stretchable wiring 2 in the first electronic components 3B and 3C, so there is a risk of insufficient heat dissipation.
  • the first elastic wiring 2B serves as a heat dissipation member of the second electronic component 9.
  • a part of the first elastic wiring 2B is a sealing layer 8 that seals the second electronic component 9 when viewed from the thickness direction of the elastic base material 1.
  • wiring connected to a certain electronic component can function as a heat dissipation member for other electronic components.
  • a plurality of first electronic components 3 and second electronic components 9 may be provided, and elastic wirings other than the first elastic wirings 2 and the second elastic wirings 4 may be provided. Also, as shown in FIGS. 12A and 12B, it is preferable that the first electronic component 3 and the second electronic component 9 are sufficiently close to each other. As described above, each stretchable wiring more reliably functions as a heat dissipation member for the electronic component connected to the other.
  • the second electronic component 9 Even if the first electronic components 3B and 3C and the second electronic component 9 are separated from each other, by making the second electronic component 9 less calorific than the first electronic components 3B and 3C, the second electronic component The current density of the elastic wiring 4 can be adjusted. That is, as described above, it is possible to more efficiently radiate heat from the first electronic components 3B and 3C.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
PCT/JP2022/032624 2021-10-22 2022-08-30 伸縮性実装基板 WO2023067901A1 (ja)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011249574A (ja) * 2010-05-27 2011-12-08 Nippon Mektron Ltd フレキシブル回路基板
JP2016143763A (ja) * 2015-02-02 2016-08-08 株式会社フジクラ 伸縮性回路基板
JP2020013969A (ja) * 2018-07-10 2020-01-23 矢崎総業株式会社 コネクタ付き回路体、及び、バスバモジュール
US20210111167A1 (en) * 2019-10-11 2021-04-15 Lg Display Co., Ltd. Stretchable display device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011249574A (ja) * 2010-05-27 2011-12-08 Nippon Mektron Ltd フレキシブル回路基板
JP2016143763A (ja) * 2015-02-02 2016-08-08 株式会社フジクラ 伸縮性回路基板
JP2020013969A (ja) * 2018-07-10 2020-01-23 矢崎総業株式会社 コネクタ付き回路体、及び、バスバモジュール
US20210111167A1 (en) * 2019-10-11 2021-04-15 Lg Display Co., Ltd. Stretchable display device

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