WO2023066405A1 - 一种多晶圆刷洗装置 - Google Patents

一种多晶圆刷洗装置 Download PDF

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Publication number
WO2023066405A1
WO2023066405A1 PCT/CN2022/130778 CN2022130778W WO2023066405A1 WO 2023066405 A1 WO2023066405 A1 WO 2023066405A1 CN 2022130778 W CN2022130778 W CN 2022130778W WO 2023066405 A1 WO2023066405 A1 WO 2023066405A1
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WIPO (PCT)
Prior art keywords
connecting plate
wafer
roller brush
opening
compartments
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PCT/CN2022/130778
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English (en)
French (fr)
Inventor
殷骐
徐枭宇
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杭州众硅电子科技有限公司
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Publication of WO2023066405A1 publication Critical patent/WO2023066405A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention belongs to the field of semiconductor integrated circuit chip manufacturing, and in particular relates to a multi-wafer scrubbing device.
  • Chemical mechanical planarization is a processing technology in integrated circuit technology. With the development of technology, the requirements for processing technology will increase accordingly. At the same time, chemical mechanical planarization is a wet process in the wafer processing process. A large amount of polishing liquid and different chemical reagents are used in the entire process. Therefore, at the end of the process, the wafer needs to be cleaned and dried to remove the adhesion. The particles on the surface of the wafer can enter the next process.
  • the surface of the wafer is scrubbed with the cooperation of the support wheel system and the roller brush system to ensure that there is no particle residue on the wafer surface.
  • Wafers are placed on several support wheels in the scrubbing machine.
  • the support wheels are all tangent to the circumference of the wafer, and the wafer is driven to rotate under the action of the drive system of the support wheels.
  • the roller brush system is composed of two rotating roller brushes. When clamping in the middle, it is in contact with both sides of the wafer.
  • the cooperation of the supporting wheel system and the rolling brush system can ensure that the surface of the wafer is completely cleaned, but the overall structure of the brush cleaning machine is complicated and takes up a lot of equipment space.
  • the currently used scrubbing devices can only scrub a single wafer in the chassis body, and the process takes a long time, which seriously affects the production efficiency; if multiple sets of scrubbing chassis are used to clean at the same time, it needs to occupy a very large space, which is not conducive to reducing the size of the equipment.
  • the structure of the scrubbing device needs to be improved.
  • the present invention provides a multi-wafer scrubbing device capable of scrubbing multiple wafers simultaneously in the same box, with high cleaning efficiency and small space occupied by equipment.
  • a multi-wafer brushing device including a box body, a plurality of compartments are arranged in the compartment, the bottoms of the compartments are connected, each A support wheel system and a scrubbing system are provided in the separate chamber.
  • the scrubbing system includes a set of rolling brush units.
  • the rolling scrubbing units can approach each other to scrub the wafers, or move away from each other to take out the wafers.
  • Between multiple scrubbing systems They are connected by an opening and closing driving mechanism, and the opening and closing driving mechanism is used to simultaneously drive multiple groups of rolling brush units to approach or move away from each other.
  • the rolling brush unit includes two horizontal bars arranged in parallel, a first connecting plate connected to both ends of the horizontal bar, and a second connecting plate connected to the two ends of the other horizontal bar, the first connecting plate and the second connecting plate
  • the two connecting plates are used to install the roller brushes; driven by the opening and closing drive mechanism, the two first connecting plates and the two second connecting plates of different groups of roller brush units are synchronously opened or closed in a V-shape.
  • the opening and closing drive mechanism includes a power source, a first drive unit connected to the power source, a second drive unit, and a third drive unit; the first drive unit is respectively connected to the second drive unit of the adjacent roller brush unit.
  • the connecting plate and the first connecting plate; the second drive unit is used to drive the first connecting plate and the second connecting plate of the same group of roller brush units to open or close; Between the adjacent roller brush units, it is used to drive the opening or closing between the second connecting plate and the first connecting plate of the adjacent roller brush units.
  • the first drive unit at least includes a turntable that can rotate circumferentially under the drive of the power source, and a connecting rod.
  • the number of the connecting rods is two, one end of which is directly or indirectly connected to the turntable, and the two connecting rods The other ends of the two are respectively directly or indirectly connected to the first connecting plate and the second connecting plate of the adjacent roller brush unit.
  • connecting rod and the turntable are connected through a third transfer post, the first connecting plate and the connecting rod are connected through a first transfer post, and the connection between the second connecting plate and the connecting rod Connected via a second adapter post.
  • the two third transfer columns are arranged along the radial direction of the turntable. In the initial state, they are vertically located between the two connecting plates, and the connecting rod is connected obliquely to the third transfer column. .
  • the second drive unit is a first gear arranged at the bottom of the first connecting plate, and a second gear arranged at the bottom of the second connecting plate, and the first gear and the second gear are meshed for transmission.
  • the number of the third driving units is at least two, they are alternately arranged up and down.
  • the second connecting plate and the first connecting plate of the adjacent roller brush units both form a notch to form an escape space.
  • each partitioned chamber is equipped with a spray system.
  • the invention provides a scrubbing device capable of cleaning multiple wafers, and the implementation structure of the device can simultaneously scrub multiple wafers in a cabinet.
  • the scrubbing box is extended and divided into multiple independent partition chambers, each partition chamber has an independent support wheel system, a rolling brush system and a spray system.
  • the invention can effectively utilize equipment space and improve cleaning efficiency under the condition of ensuring the cleanliness of wafer scrubbing.
  • the beneficial effects of the present invention are: 1) multiple sets of rolling brush units are integrated in the same box, which can greatly shorten the distance between stations and effectively improve the production efficiency per unit volume; 2) independent support wheel system, brushing system and spraying system The shower system can realize independent or simultaneous scrubbing of different wafers, improving efficiency while ensuring flexibility; 3)
  • the cabinet can be double compartments, three compartments or four compartments, etc.
  • the number of compartments is highly customized and the scope of application 4)
  • the bottoms of different partition chambers can be connected to realize a set of drainage pipelines shared by multiple stations, simplify the drainage system, and further simplify the internal space of the equipment;
  • the integrated scrubbing box shares multiple groups Components such as partitions, bottom plates, etc., greatly reduce the number of parts, save material costs, and reduce assembly workload; 6) share one opening and closing drive mechanism to realize simultaneous opening and closing of different roller brush units, saving equipment space and reducing procurement costs ;
  • the multi-wafer scrubbing device can have a symmetrical structure, which is conducive to the arrangement of equipment and the connection of electrical and vapor-liquid lines.
  • Fig. 1 is a perspective view of the present invention without a box.
  • Fig. 2 is a partial structural perspective view of the present invention.
  • Fig. 3 is a schematic diagram of a partial cooperation structure between the opening and closing drive mechanism and the roller brush unit of the present invention.
  • Fig. 4 is a schematic diagram 2 of a partial cooperative structure of the opening and closing drive mechanism and the roller brush unit of the present invention.
  • Fig. 5 is a schematic diagram of a partial cooperative structure of the opening and closing drive mechanism and the roller brush unit of the present invention (at this time, the first connecting plate and the second connecting plate are opened).
  • FIG. 6 is a first perspective view of the first driving unit of the present invention.
  • FIG. 7 is a second perspective view of the first driving unit of the present invention.
  • FIG. 8 is a third perspective view of the first driving unit of the present invention.
  • a multi-wafer scrubbing device includes a box body 1, and a plurality of partitioned chambers 2 are arranged in the box body 1.
  • the bottoms of the plurality of partitioned chambers 2 are connected and share a set of Drainage system, the tops of multiple partition chambers 2 are connected, and share a set of exhaust system 21, each partition chamber 2 is equipped with a support wheel system 3 and a brushing system 4, and the support wheel system 3 is responsible for passing the support
  • the wheel places the wafer 6, fixes the position of the wafer 6, and drives the wafer 6 to rotate during the scrubbing process, and each compartment 2 is provided with a spray system 22, and the spray system 22 is installed on the wafer 6 in the cabinet.
  • the inside of 1 continuously sprays the cleaning liquid, which is used to clean the chemical reagents on the surface of the wafer 6.
  • the process of cleaning the wafer 6 in each compartment 2 is independent of each other, and cleaning liquids of different processes can be used.
  • the brushing system 4 includes a group of rolling brush units 5, the rolling brushing units 5 can approach each other to brush the wafer 6, or the rolling brushing units 5 can move away from each other to release the wafer 6, which can facilitate the removal of the wafer 6.
  • a plurality of brushing systems 4 are connected through an opening and closing drive mechanism 7, and the opening and closing drive mechanism 7 is used to simultaneously drive multiple sets of rolling brush units 5 in different compartments 2 to move closer or farther away from each other.
  • roller brush units 5 are close to or far away from each other, they can be close to or far away from each other in translation, and they can also be separated from each other by opening one end, or close to each other by being folded.
  • the roller brush unit 5 includes two cross bars 53 arranged in parallel, two first connecting plates 51 connected to two ends of one cross bar 53, and two second connecting plates 52 connected to two ends of the other cross bar 53. Between the first connecting plates 51 and between the two second connecting plates 52 are used for installing the rolling brushes 54 .
  • the two first connecting plates 51 on the cross bar 53 are symmetrically arranged to ensure the parallelism of the rolling brush 54 during the opening and closing movement.
  • the installation positions of the two crossbars 53 are different, and one of the crossbars 53 is installed between the bottoms of the two first connecting plates 51, specifically, the bottom is far away from the second connecting plate 52 of the same group of roller brush units 5
  • another cross bar 53 is installed between the middle parts of the two second connecting plates 52, specifically on the side away from the first connecting plates 51 of the same group of roller brush units 5 in the middle.
  • the two first connecting plates 51 and the two second connecting plates 52 of the rolling brush units 5 of different groups are all synchronously formed.
  • the V shape opens or closes.
  • the opening and closing drive mechanism 7 includes a power source 74 , a first drive unit 71 connected to the power source 74 , a second drive unit 72 , and a third drive unit 73 .
  • the first driving unit 71 is respectively connected to the second connecting plate 52 and the first connecting plate 51 of the adjacent roller brush units 5 .
  • the second driving unit 72 is used to drive the first connecting plate 51 and the second connecting plate 52 of the same group of roller brush units 5 to open or close.
  • the third driving unit 73 is arranged between the adjacent rolling brush units 5 not connected with a power source, and is used to drive the opening or closing between the second connecting plate and the first connecting plate of the adjacent rolling brush unit 5 .
  • the first drive unit 71 at least includes a turntable 711 that can rotate circumferentially under the drive of the power source 74, and a connecting rod 712. There are two connecting rods 712. One end of the two connecting rods 712 is directly or indirectly connected to the turntable 711. The other ends of the two connecting rods 712 are respectively directly or indirectly connected to the first connecting plate and the second connecting plate of the adjacent roller brush unit 5 .
  • the two connecting rods 712 and the turntable 711 are connected through a third transfer post 713, and the two third transfer posts 713 are along the radial direction of the turntable 711.
  • the two third transfer columns 713 are vertically located between the two connecting plates, which facilitates the subsequent transmission, and the transmission structure is more labor-saving;
  • the connecting rod 712 and the third transfer column 713 are connected obliquely,
  • the two connecting rods 712 are arranged in parallel; the first connecting plate and the connecting rod 712 are connected through the first adapter column 714, and the second connecting plate of the other roller brush unit 5 and the other connecting rod 712 are connected through the second connecting rod 712.
  • the adapter post 715 is connected.
  • connection between the above-mentioned connecting rod 712 and the third transfer post 713 can be a rotating connection or a fixed connection;
  • connection between the above-mentioned connecting rod 712 and the first transfer post 714 can be a rotating connection or a fixed connection.
  • connected the connection between the above-mentioned connecting rod 712 and the second transfer column 715 can be a rotary connection, or a fixed connection;
  • the connection between the above-mentioned first transfer post 714 and the first connecting plate can be a rotary connection, or It may be a fixed connection;
  • connection between the second transfer post 715 and the second connecting plate may be a rotational connection or a fixed connection.
  • connection between the two connecting rods 712, the third transfer post 713, the first transfer post 714, the second transfer post 715, the first connecting plate and the second connecting plate cannot all be fixed connections, and need At least one of the connection structures on one side is a rotational connection.
  • the second driving unit 72 is a first gear 721 arranged at the bottom of the first connecting plate 51, and a second gear 722 arranged at the bottom of the second connecting plate 52, and the first gear 721 and the second gear 722 are engaged with each other for transmission.
  • the first connecting plate 51 and the second connecting plate 52 mentioned above belong to the same group of roller brush units 5 .
  • the second driving unit 72 is not limited to gear transmission, and may also be in the form of belt transmission, connecting rod transmission and the like.
  • the structure of the third drive unit 73 is the same as that of the first drive unit 71, except that the turntable is not connected to the power source for rotation.
  • the number of the third driving units 73 is at least two, they are alternately arranged up and down.
  • a notch 55 is formed on the second connecting plate and the first connecting plate, especially on the first connecting plate facing the other rolling brush unit.
  • a cut notch is formed on the top of one side of the connecting plate, and a cut notch is also formed on the top of the first connecting plate on the side of the second connecting plate facing the other roller brush unit.
  • the power source 74 drives the turntable 711 of the first driving unit 71 to rotate counterclockwise, and drives the two connecting rods 712 to rotate, so that the top of the second connecting plate 52-1 Open from the top of the first connecting plate 51 - 2 , the second connecting plate 52 - 1 and the first connecting plate 51 - 2 belong to two different roller brush units 5 .
  • first connecting plate 51-2 and the second connecting plate 52-2 of the second group of roller brush units also open in a V shape.
  • the second connecting post of the third driving unit 73 rotates, so that the first connecting plate 51-3 of the third group of roller brush units rotates, and the second connecting column of the other second driving unit rotates.
  • the first connecting plate 51-3 and the second connecting plate 52-3 of the third group of roller brush units also open in a V shape.
  • the third drive unit between the units is arranged at the upper part of the middle, that is to say, when there are at least two third drive units, they are arranged alternately up and down.
  • the brushing system 4 controls the opening and closing and rotation of the rolling brush unit 5.
  • the opening and closing drive mechanism 7 controls the rolling brush unit 5 to open to form a gap large enough for the manipulator to enter the casing 1 without interference.
  • the above is the process of opening the first connecting plate and the second connecting plate. After opening, the wafer 6 is clamped by the manipulator; when the manipulator has been lifted and moved out of the box 1, the two need to be closed to bring the roller brush 54 close to the wafer 6
  • the power source 74 is used to drive the turntable 711 of the first driving unit 71 to rotate clockwise.
  • the roller brush 54 continues to rotate, and at the same time closes and clamps the wafer 6 towards the middle.
  • the left roller brush rotates clockwise, and the right roller brush rotates counterclockwise to ensure that the wafer receives a downward resultant force during the scrubbing process, and cooperate with the support wheel system 3 to fix the wafer position.
  • the support wheel system 3 drives the wafer to rotate in a fixed direction, so as to ensure that the roller brush can scrub every surface of the wafer.
  • the cleaning fluids sprayed from different compartments 2 are collected by the space at the bottom of the box body 1, and are discharged to the outside of the equipment along the same set of drainage pipelines.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Cleaning Or Drying Semiconductors (AREA)
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Abstract

本发明公开了一种多晶圆刷洗装置，包括箱体，箱体内设有多个分隔腔室，多个分隔腔室的底部相连通，每个分隔腔室内设有支撑轮系统和刷洗系统，该刷洗系统包括一组滚刷单元，滚刷单元可相互靠近以刷洗晶圆，或者，相互远离以取出晶圆，多个刷洗系统之间通过开合驱动机构相连，该开合驱动机构用于同时驱动多组滚刷单元的相互靠近或远离。本发明将多组滚刷单元集成在同一个箱体内，可以大大缩短工位间的距离，有效提高单位体积生产效率；箱体可以为双隔间，三隔间或四隔间等，分隔腔室的数量定制化程度高，适用范围广；共用一个开合驱动机构，实现不同滚刷单元的同步开合，节省设备空间，降低采购成本。

Description

一种多晶圆刷洗装置 技术领域
本发明属于半导体集成电路芯片制造领域，尤其是涉及一种多晶圆刷洗装置。
背景技术
化学机械平坦化是集成电路工艺中的一种加工工艺。随着技术的发展，对加工工艺的要求会随之提高。同时化学机械平坦化在晶圆加工过程中属于湿法工艺，在整个工艺过程中会使用大量的研磨液以及不同的化学试剂，所以在工艺末端需要对晶圆进行一个清洗和干燥来去除附着在晶圆表面的颗粒，从而能够进入到下一道工艺的制程中。
在现有的集成电路设备中，通过将晶圆插入到刷洗机箱，在支撑轮系统和滚刷系统的配合下实现晶圆表面刷洗，确保晶圆表面无颗粒物残留。晶圆在刷洗机箱内放置于数个支撑轮上，支撑轮均相切于晶圆圆周，并在支撑轮驱动系统作用下带动晶圆转动，滚刷系统由两根旋转的滚刷组成，工作时向中间夹紧与晶圆两侧接触。
通过支撑轮系统和滚刷系统的配合能够确保晶圆表面全部洗刷干净，但刷洗机箱整体结构复杂，占用设备空间大。目前所采用的刷洗装置均只能实现机箱体单晶圆刷洗，工艺时间长，严重影响生产效率；采用多套刷洗机箱同时清洗，则需要占用非常大的空间，不利于缩小设备体积。为提高晶圆刷洗效率，精简设备空间尺寸，刷洗装置的结构有待改进。
发明内容
为了克服现有技术的不足，本发明提供一种同一箱体内可同时刷洗多片晶圆，清洗效率高，设备占用空间小的多晶圆刷洗装置。
本发明解决其技术问题所采用的技术方案是：一种多晶圆刷洗装置，包括箱体，所述箱体内设有多个分隔腔室，多个分隔腔室的底部相连通，每个分隔腔室内设有支撑轮系统和刷洗系统，该刷洗系统包括一组滚刷单元，所述滚刷单元可相互靠近以刷洗晶圆，或者，相互远离以取出晶圆，多个刷洗系统之间通过开合驱动机构相连，该开合驱动机构用于同时驱动多组滚刷单元的相互靠近或远离。
进一步的，所述滚刷单元包括平行设置的两个横杆，连接在横杆两端的第一连接板，及连接在另一横杆两端的第二连接板，所述第一连接板和第二连接板用于安装滚刷；在所述开合驱动机构的驱动下，不同组滚刷单元的两个第一连接板和两个第二连接板均同步呈V字形张开或闭合。
进一步的，所述开合驱动机构包括动力源，与动力源相连的第一驱动单元，第二驱动单元，及第三驱动单元；所述第一驱动单元分别连接相邻滚刷单元的第二连接板和第一连接板；所述第二驱动单元用于驱动同一组滚刷单元的第一连接板和第二连接板张开或闭合；所述第三驱动单元设于未连接有动力源的相邻滚刷单元之间，用于驱动该相邻滚刷单元的第二连接板和第一连接板之间的张开或闭合。
进一步的，所述第一驱动单元至少包括在动力源驱动下可周向转动的转盘，及连杆，所述连杆的数量为两个，其一端与转盘直接或间 接相连，两个连杆的另一端分别直接或间接连接相邻滚刷单元的第一连接板和第二连接板。
进一步的，所述连杆和转盘之间均通过第三转接柱相连，所述第一连接板和连杆之间通过第一转接柱相连，所述第二连接板和连杆之间通过第二转接柱相连。
进一步的，所述两个第三转接柱沿转盘的径向布设，在初始状态下，两者竖直地位于两个连接板之间，所述连杆则与第三转接柱倾斜相连。
进一步的，所述第二驱动单元为设于第一连接板底部的第一齿轮，和设于第二连接板底部的第二齿轮，所述第一齿轮和第二齿轮啮合传动。
进一步的，当所述第三驱动单元的数量为至少两个时，其上下交替布设。
进一步的，相邻滚刷单元的第二连接板和第一连接板均形成缺口部，以形成避让空间。
进一步的，所述多个分隔腔室的顶部相连通，且共用一套排气系统和一套排液系统；每个分隔腔室内均设有喷淋系统。
本发明提供了可实现多晶圆清洗的刷洗装置，该装置的实施结构能够在一个机箱内同时刷洗多片晶圆。将刷洗箱体延长并分隔为多个独立的分隔腔室，每个分隔腔室都具有独立的支撑轮系统、滚刷系统以及喷淋系统。本发明能够在保证晶圆刷洗洁净度的情况下有效利用设备空间，提高清洗效率。
本发明的有益效果是，1)将多组滚刷单元集成在同一个箱体内，可以大大缩短工位间的距离，有效提高单位体积生产效率；2)独立的支撑轮系统、刷洗系统以及喷淋系统能够实现不同晶圆独立或同时刷洗，提高效率的同时保证灵活性；3)箱体可以为双隔间，三隔间或四隔间等，分隔腔室的数量定制化程度高，适用范围广；4)同一个箱体内，不同分隔腔室底部可以相通，实现多工位共用一套排水管路，简化排液系统，进一步精简设备内部空间；5)集成后的刷洗箱体共用多组零部件如隔板、底板等，大大减少了零件数量，节省物料成本，降低装配工作量；6)共用一个开合驱动机构，实现不同滚刷单元的同步开合，节省设备空间，降低采购成本；7)多晶圆刷洗装置可以为对称结构，有利于设备排布，便于电气及汽液线路连接。
附图说明
图1为本发明除去箱体的部分的立体图。
图2为本发明的部分结构立体图。
图3为本发明的开合驱动机构与滚刷单元的部分配合结构示意图一。
图4为本发明的开合驱动机构与滚刷单元的部分配合结构示意图二。
图5为本发明的开合驱动机构与滚刷单元的部分配合结构示意图(此时第一连接板和第二连接板张开)。
图6为本发明的第一驱动单元的立体图一。
图7为本发明的第一驱动单元的立体图二。
图8为本发明的第一驱动单元的立体图三。
具体实施方式
为了使本技术领域的人员更好的理解本发明方案，下面将结合本发明实施例中的附图，对发明实施例中的技术方案进行清楚、完整的描述，显然，所描述的实施例仅仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都应当属于本发明保护的范围。
如图1、图2所示，一种多晶圆刷洗装置，包括箱体1，箱体1内设置有多个分隔腔室2，多个分隔腔室2的底部相连通，且共用一套排液系统，多个分隔腔室2的顶部相连通，且共用一套排气系统21，每个分隔腔室2内均设有支撑轮系统3和刷洗系统4，支撑轮系统3负责通过支撑轮放置晶圆6、固定晶圆6位置，以及在刷洗过程中驱动晶圆6转动，且每个分隔腔室2内均设有喷淋系统22，喷淋系统22在晶圆6于箱体1内部时持续喷洒清洗液体，用于洗净晶圆6表面的化学试剂，换句话说，每个分隔腔室2内清洗晶圆6的工艺相互独立，可以使用不同工艺过程的清洗液。
刷洗系统4包括一组滚刷单元5，滚刷单元5可以相互靠近以刷洗晶圆6，或者，滚刷单元5可以相互远离以释放晶圆6，可以便于晶圆6的取出。多个刷洗系统4之间通过开合驱动机构7相连，该开合驱动机构7用于同时驱动不同分隔腔室2内的、多组滚刷单元5的相互靠近或远离。
上述的滚刷单元5相互靠近或远离，可以是平移靠近或远离，也可以是一端张开实现相互远离，或收拢实现相互靠近。
滚刷单元5包括平行设置的两个横杆53，连接在一个横杆53两端的两块第一连接板51，及连接在另一个横杆53两端的两块第二连接板52，两块第一连接板51之间、两块第二连接板52之间用于安装滚刷54。横杆53上的两块第一连接板51对称排布，确保滚刷54在开合运动过程的平行度。
为了避免产生干涉，两个横杆53的安装位置不同，其中一个横杆53安装在两块第一连接板51的底部之间，具体还是底部远离同一组滚刷单元5的第二连接板52的一侧，另一个横杆53安装在两块第二连接板52的中部之间，具体还是在中部远离同一组滚刷单元5的第一连接板51的一侧。
在开合驱动机构7的驱动下，不同组的滚刷单元5，也就是不同分隔腔室2内的滚刷单元5的两个第一连接板51和两个第二连接板52均同步呈V字形张开或闭合。
如图3、图4所示，开合驱动机构7包括动力源74，与动力源74相连的第一驱动单元71，第二驱动单元72，及第三驱动单元73。第一驱动单元71分别连接相邻滚刷单元5的第二连接板52和第一连接板51。第二驱动单元72用于驱动同一组滚刷单元5的第一连接板51和第二连接板52张开或闭合。第三驱动单元73设置在未连接有动力源的相邻滚刷单元5之间，用于驱动该相邻滚刷单元5的第二连接板和第一连接板之间的张开或闭合。
第一驱动单元71至少包括在动力源74的驱动下可以周向转动的转盘711，及连杆712，连杆712的数量为两个，两个连杆712的一端均与转盘711直接或间接相连，两个连杆712的另一端分别直接或间接连接相邻滚刷单元5的第一连接板和第二连接板。
如图6-图8所示，在本实施例中，两个连杆712和转盘711之间均通过第三转接柱713相连，两个第三转接柱713沿着转盘711的径向布设，且在初始状态下，两个第三转接柱713竖直地位于两个连接板之间，便于后续的传动，传动结构更加省力；连杆712和第三转接柱713倾斜相连，且两个连杆712平行设置；第一连接板和连杆712之间通过第一转接柱714相连，另一滚刷单元5的第二连接板和另一连杆712之间通过第二转接柱715相连。
上述连杆712和第三转接柱713之间的连接可以是转动连接，也可以是固定相连；上述连杆712和第一转接柱714之间的连接可以是转动连接，也可以是固定相连；上述连杆712和第二转接柱715之间的连接可以是转动连接，也可以是固定相连；上述第一转接柱714和第一连接板之间的连接可以是转动连接，也可以是固定相连；上述第二转接柱715和第二连接板之间的连接可以是转动连接，也可以是固定相连。但是两个连杆712、第三转接柱713、第一转接柱714、第二转接柱715、第一连接板和第二连接板相互之间的连接不能全部为固定连接，而需要至少一侧连接结构的一处为转动连接。
第二驱动单元72为设置在第一连接板51底部的第一齿轮721，和设置在第二连接板52底部的第二齿轮722，该第一齿轮721和第 二齿轮722相互啮合传动。上述的第一连接板51和第二连接板52属于同一组滚刷单元5。当然在其他实施例中，第二驱动单元72不限于齿轮传动，也可以是带传动、连杆传动等形式。
第三驱动单元73的结构与第一驱动单元71的结构相同，只是转盘不与动力源转动相连。当第三驱动单元73的数量为至少两个时，其上下交替布设。
为了形成避让空间，避免相邻滚刷单元5之间产生干涉，在第二连接板和第一连接板上均形成缺口部55，具体是在第二连接板朝向另一滚刷单元的第一连接板一侧的顶部形成切削而成的缺口部，在第一连接板朝向另一滚刷单元的第二连接板一侧的顶部也形成切削而成的缺口部。
本实用新型的工作过程是，以图3为例进行说明，动力源74驱动第一驱动单元71的转盘711逆时针转动，带动两个连杆712转动，使得第二连接板52-1的顶端和第一连接板51-2的顶端张开，上述第二连接板52-1和第一连接板51-2属于两个不同的滚刷单元5。
与此同时，在第一组滚刷单元底部的第二驱动单元72的驱动下，也就是同一组滚刷单元的第一连接板51-1底部的第一齿轮和第二连接板52-1底部的第二齿轮啮合传动，使得第一组滚动单元的第一连接板51-1和第二连接板52-1呈V字形张开，如图5所示。
同样的，第二组滚刷单元的第一连接板51-2和第二连接板52-2也呈V字形张开。
在第二连接板52-2的驱动下，第三驱动单元73的第二转接柱转 动，从而第三组滚刷单元的第一连接板51-3转动，在另一第二驱动单元的驱动下，第三组滚刷单元的第一连接板51-3和第二连接板52-3也呈V字形张开。
在第三组滚刷单元和第四组滚刷单元之间连接有另一第三驱动单元，此时其设置在中部靠下的位置，不同于第二组滚刷单元和第三组滚刷单元之间的第三驱动单元设置在中部靠上的位置，也就是说第三驱动单元的数量为至少两个时，其上下交替布设。
刷洗系统4控制滚刷单元5的开合和转动，刷洗初始阶段，开合驱动机构7控制滚刷单元5张开以形成足够大的间隙供机械手伸入箱体1不发生干涉。
上述为第一连接板和第二连接板张开的过程，张开之后利用机械手夹持晶圆6；当机械手已抬升移出箱体1，需要两者闭合以将滚刷54靠近对晶圆6实现刷洗，则利用动力源74驱动第一驱动单元71的转盘711顺时针转动。
滚刷54持续转动，同时向中间闭合夹紧晶圆6。左侧滚刷为顺时针方向旋转，右侧滚刷为逆时针方向旋转，确保刷洗过程中晶圆受到的是向下的合力，与支撑轮系统3配合固定晶圆位置。支撑轮系统3带动晶圆沿固定方向转动，以保证滚刷能够刷洗到晶圆每一处表面。不同分隔腔室2喷淋出的清洗液由箱体1底部空间汇拢，一起沿同一套排液管路排出至设备外部。
上述具体实施方式用来解释说明本发明，而不是对本发明进行限制，在本发明的精神和权利要求的保护范围内，对本发明作出的任何 修改和改变，都落入本发明的保护范围。

Claims (10)

  1. 一种多晶圆刷洗装置，包括箱体(1)，其特征在于：所述箱体(1)内设有多个分隔腔室(2)，多个分隔腔室(2)的底部相连通，每个分隔腔室(2)内设有支撑轮系统(3)和刷洗系统(4)，该刷洗系统(4)包括一组滚刷单元(5)，所述滚刷单元(5)可相互靠近以刷洗晶圆(6)，或者，相互远离以取出晶圆(6)，多个刷洗系统(4)之间通过开合驱动机构(7)相连，该开合驱动机构(7)用于同时驱动多组滚刷单元(5)的相互靠近或远离。
  2. 根据权利要求1所述的多晶圆刷洗装置，其特征在于：所述滚刷单元(5)包括平行设置的两个横杆(53)，连接在横杆(53)两端的第一连接板(51)，及连接在另一横杆(53)两端的第二连接板(52)，所述第一连接板(51)和第二连接板(52)用于安装滚刷(54)；在所述开合驱动机构(7)的驱动下，不同组滚刷单元(5)的两个第一连接板(51)和两个第二连接板(52)均同步呈V字形张开或闭合。
  3. 根据权利要求2所述的多晶圆刷洗装置，其特征在于：所述开合驱动机构(7)包括动力源(74)，与动力源(74)相连的第一驱动单元(71)，第二驱动单元(72)，及第三驱动单元(73)；所述第一驱动单元(71)分别连接相邻滚刷单元(5)的第二连接板和第一连接板；所述第二驱动单元(72)用于驱动同一组滚刷单元(5)的第一连接板和第二连接板张开或闭合；所述第三驱动单元(73)设于未连接有动力源的相邻滚刷单元(5)之间，用于驱动该相邻滚刷单元(5)的第二连接板和第一连接板之间的张开或闭合。
  4. 根据权利要求3所述的多晶圆刷洗装置，其特征在于：所述第一驱动单 元(71)至少包括在动力源(74)驱动下可周向转动的转盘(711)，及连杆(712)，所述连杆(712)的数量为两个，其一端与转盘(711)直接或间接相连，两个连杆(712)的另一端分别直接或间接连接相邻滚刷单元(5)的第一连接板和第二连接板。
  5. 根据权利要求4所述的多晶圆刷洗装置，其特征在于：所述连杆(712)和转盘(711)之间均通过第三转接柱(713)相连，所述第一连接板和连杆(712)之间通过第一转接柱(714)相连，所述第二连接板和连杆(712)之间通过第二转接柱(715)相连。
  6. 根据权利要求5所述的多晶圆刷洗装置，其特征在于：所述两个第三转接柱(713)沿转盘(711)的径向布设，在初始状态下，两者竖直地位于两个连接板之间，所述连杆(712)则与第三转接柱(713)倾斜相连。
  7. 根据权利要求3所述的多晶圆刷洗装置，其特征在于：所述第二驱动单元(72)为设于第一连接板(51)底部的第一齿轮(721)，和设于第二连接板(52)底部的第二齿轮(722)，所述第一齿轮(721)和第二齿轮(722)啮合传动。
  8. 根据权利要求3所述的多晶圆刷洗装置，其特征在于：当所述第三驱动单元(73)的数量为至少两个时，其上下交替布设。
  9. 根据权利要求2所述的多晶圆刷洗装置，其特征在于：相邻滚刷单元(5)的第二连接板和第一连接板均形成缺口部(55)，以形成避让空间。
  10. 根据权利要求1所述的多晶圆刷洗装置，其特征在于：所述多个分隔腔室(2)的顶部相连通，且共用一套排气系统(21)和一套排液系统；每个分隔腔室(2)内均设有喷淋系统(22)。
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116673268A (zh) * 2023-08-02 2023-09-01 苏州亚信华电子科技有限公司 一种半导体硅片的清洗方法及清洗设备
CN117160984A (zh) * 2023-09-08 2023-12-05 无锡中环应用材料有限公司 一种单晶硅片水洗脱胶系统及其脱胶工艺

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10256207A (ja) * 1997-03-14 1998-09-25 Nec Corp ブラシスクラブ装置
US20050109371A1 (en) * 2003-10-27 2005-05-26 Applied Materials, Inc. Post CMP scrubbing of substrates
KR100905920B1 (ko) * 2008-02-20 2009-07-02 (주)이노맥스 디스크 세정장치
CN103386406A (zh) * 2013-08-08 2013-11-13 常州市科沛达超声工程设备有限公司 晶圆片生产工序间的双面刷洗设备
CN216288328U (zh) * 2021-10-19 2022-04-12 杭州众硅电子科技有限公司 多晶圆刷洗装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6986185B2 (en) * 2001-10-30 2006-01-17 Applied Materials Inc. Methods and apparatus for determining scrubber brush pressure
US20080035181A1 (en) * 2006-08-09 2008-02-14 Tokyo Seimitsu Co., Ltd. Cleaning apparatus
US9610615B2 (en) * 2015-03-31 2017-04-04 Taiwan Semiconductor Manufacturing Co., Ltd Method and system for cleansing wafer in CMP process of semiconductor manufacturing fabrication
CN109148341A (zh) * 2018-10-16 2019-01-04 杭州众硅电子科技有限公司 一种cmp晶圆清洗设备
TWI726617B (zh) * 2020-02-13 2021-05-01 大陸商北京爍科精微電子裝備有限公司 用於清洗晶圓的裝置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10256207A (ja) * 1997-03-14 1998-09-25 Nec Corp ブラシスクラブ装置
US20050109371A1 (en) * 2003-10-27 2005-05-26 Applied Materials, Inc. Post CMP scrubbing of substrates
KR100905920B1 (ko) * 2008-02-20 2009-07-02 (주)이노맥스 디스크 세정장치
CN103386406A (zh) * 2013-08-08 2013-11-13 常州市科沛达超声工程设备有限公司 晶圆片生产工序间的双面刷洗设备
CN216288328U (zh) * 2021-10-19 2022-04-12 杭州众硅电子科技有限公司 多晶圆刷洗装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116673268A (zh) * 2023-08-02 2023-09-01 苏州亚信华电子科技有限公司 一种半导体硅片的清洗方法及清洗设备
CN116673268B (zh) * 2023-08-02 2023-10-13 苏州亚信华电子科技有限公司 一种半导体硅片的清洗方法及清洗设备
CN117160984A (zh) * 2023-09-08 2023-12-05 无锡中环应用材料有限公司 一种单晶硅片水洗脱胶系统及其脱胶工艺
CN117160984B (zh) * 2023-09-08 2024-04-12 无锡中环应用材料有限公司 一种单晶硅片水洗脱胶系统

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