WO2023063510A1 - 하이브리드 유기발광다이오드 디스플레이 패널 및 그 제조 방법 - Google Patents
하이브리드 유기발광다이오드 디스플레이 패널 및 그 제조 방법 Download PDFInfo
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
- G09G3/3225—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
Definitions
- the present invention relates to an organic light emitting diode display panel and a method for manufacturing the same, and more particularly, to a hybrid organic light emitting diode display panel in which a solar cell is embedded in a display panel in a unit of pixel itself and a method for manufacturing the same will be.
- OLED display is a display device implemented using organic light-emitting diodes made of organic compounds that emit light in response to current. (LCD; Liquid Crystal Display), it is wider, has excellent color reproducibility, and is thin, so it has many advantages such as freedom of deformation, so it is in the limelight.
- LCD Liquid Crystal Display
- Conventional OLED displays need to supply power separately from the outside or use a separately built-in battery to drive the display panel, and the power efficiency increase of the OLED display has reached its limit.
- the present invention provides a hybrid organic light emitting diode display panel in which a solar cell is embedded in a display panel in units of pixels to charge power from solar energy while viewing the display panel, and a method for manufacturing the same.
- the present invention is to provide a transparent organic light emitting diode display panel and a manufacturing method thereof capable of implementing a window-type transparent display panel having high transmittance by including a pixel transparent window in a pixel layout.
- the present invention is to provide an organic light emitting diode display panel capable of implementing a mirror display panel by including a pixel mirror window in a pixel layout and a manufacturing method thereof.
- a plurality of pixels are arranged in a predetermined first arrangement structure on a substrate, and for each pixel, an organic light emitting diode, a driving thin film transistor for driving the organic light emitting diode, and the above an organic light emitting diode panel provided with a pixel light emitting unit including a switching thin film transistor for switching a driving thin film transistor; and a plurality of pixel solar cells arranged on the substrate in the first array structure to correspond to the plurality of pixels, wherein each pixel solar cell corresponds to the pixel light emitting unit in a one-to-one correspondence within a pixel area set in a pixel unit.
- a solar cell disposed thereon; includes.
- the plurality of pixel light emitting units provided in the plurality of pixels and the plurality of pixel solar cells may be arranged to have the same arrangement period.
- the pixel light emitting unit may be disposed in a first area within the pixel area, and the pixel solar cell may be disposed in a second area corresponding to a corner area within the pixel area.
- the second area may be an area that does not overlap with the first area on a plane of the hybrid organic light emitting diode display panel.
- the driving thin film transistor includes a first channel layer on the substrate, a first gate layer formed to be insulated on the first channel layer, and a first drain electrode and a first source electrode electrically connected to the first channel layer.
- the pixel solar cell includes a first electrode layer on the substrate, a first semiconductor layer stacked on the first electrode layer, a second semiconductor layer stacked on the first semiconductor layer in a heterojunction structure, and a second semiconductor layer stacked on the second semiconductor layer.
- a stacked second electrode layer may be included.
- the switching thin film transistor includes a second channel layer on the substrate, a second gate layer formed to be insulated on the second channel layer, and a second drain electrode and a second source electrode electrically connected to the second channel layer.
- the first channel layer and the first semiconductor layer may be formed of the same first semiconductor material corresponding to any one of a first type of an N-type and a P-type.
- the second channel layer and the second semiconductor layer may be formed of the same second semiconductor material corresponding to a second type of the other of N-type and P-type.
- a hybrid organic light emitting diode display panel includes a plurality of pixel transparent windows arranged in the first array structure to correspond to the plurality of pixels on the substrate, and the pixel light emitting unit in the pixel area.
- a transparent window in which each pixel transparent window is arranged to correspond one-to-one with; may further include.
- the plurality of pixel light emitting units and the plurality of pixel transparent windows may be arranged to have the same arrangement period, and the pixel transparent windows may be disposed in a third area within the pixel area.
- the third area may be an area that does not overlap the first area and the second area on a plane of the hybrid organic light emitting diode display panel.
- the driving thin film transistor includes a first insulating layer stacked on the first channel layer, a first interlayer insulating layer covering the first gate layer, a second insulating layer stacked on the first interlayer insulating layer, and the first insulating layer.
- a second interlayer insulating layer formed on the two insulating layers may be further included.
- the second channel layer is stacked on the first interlayer insulating layer, the second gate layer is formed on the second insulating layer, and the second interlayer insulating layer is formed to cover the second gate layer.
- the pixel transparent window includes a first transparent insulating layer laminated on the substrate, a first transparent interlayer insulating layer laminated on the first transparent insulating layer, and a second transparent insulating layer laminated on the first transparent interlayer insulating layer. , and a second transparent interlayer insulating layer laminated on the second transparent insulating layer.
- the first insulating layer and the first transparent insulating layer are made of the same first insulating material
- the second insulating layer and the second transparent insulating layer are made of the same second insulating material
- the first interlayer insulating layer is made of the same second insulating material.
- the first transparent interlayer insulating layer may be made of the same third insulating material
- the second interlayer insulating layer and the second transparent interlayer insulating layer may be made of the same fourth insulating material.
- a hybrid organic light emitting diode display panel includes a plurality of pixel mirror windows made of a reflective material and arranged on the substrate in the first array structure to correspond to the plurality of pixels, and the pixel area It may further include a mirror window in which each pixel mirror window is disposed so as to correspond one-to-one with the pixel light emitting unit.
- the plurality of pixel light emitting units and the plurality of pixel mirror windows may be arranged to have the same arrangement period, and the pixel mirror windows may be disposed in a fourth area within the pixel area.
- the fourth area may be an area that does not overlap the first area and the second area on a plane of the hybrid organic light emitting diode display panel.
- a hybrid organic light emitting diode display panel manufacturing method includes forming an organic light emitting diode panel such that a plurality of pixels are arranged in a first array structure on a substrate; and forming a solar cell such that a plurality of pixel solar cells are arranged on the substrate in the first array structure to correspond to the plurality of pixels.
- the forming of the organic light emitting diode panel may include providing a pixel light emitting unit including an organic light emitting diode for each pixel, a driving thin film transistor for driving the organic light emitting diode, and a switching thin film transistor for switching the driving thin film transistor. It may include forming a panel.
- the forming of the solar cell may include forming the solar cell such that each pixel solar cell is disposed in a one-to-one correspondence with the pixel light emitting unit in a pixel area set in a pixel unit.
- Forming the organic light emitting diode panel may include forming the driving thin film transistor on the substrate.
- Forming the driving thin film transistor may include stacking a first channel layer on the substrate; forming a first gate layer to be insulated on the first channel layer; and forming a first drain electrode and a first source electrode to be electrically connected to the first channel layer.
- Forming the solar cell may include stacking a first electrode layer on the substrate; stacking a first semiconductor layer on the first electrode layer; stacking a second semiconductor layer in a heterojunction structure on the first semiconductor layer; and stacking a second electrode layer on the second semiconductor layer.
- the forming of the organic light emitting diode panel may further include forming the switching thin film transistor on the substrate.
- Forming the switching thin film transistor may include stacking a second channel layer on the substrate; forming a second gate layer to be insulated on the second channel layer; and forming a second drain electrode and a second source electrode to be electrically connected to the second channel layer.
- the stacking of the first channel layer and the stacking of the first semiconductor layer may be performed simultaneously, and the stacking of the second channel layer and the stacking of the second semiconductor layer may be performed simultaneously.
- a plurality of pixel transparent windows are formed on the substrate in the first array structure to correspond to the plurality of pixels, and the pixel light emitting unit is formed in the pixel area.
- Forming a transparent window by arranging each pixel transparent window to correspond one-to-one with the pixel; may further include.
- Forming the driving thin film transistor may include stacking a first insulating layer on the first channel layer; depositing a first interlayer insulating layer covering the first gate layer; stacking a second insulating layer on the first interlayer insulating layer; and stacking a second interlayer insulating layer on the second insulating layer.
- Forming the transparent window may include stacking a first transparent insulating layer on the substrate; laminating a first transparent interlayer insulating layer on the first transparent insulating layer; laminating a second transparent insulating layer on the first transparent interlayer insulating layer; and stacking a second transparent interlayer insulating layer on the second transparent insulating layer.
- the step of laminating the first insulating layer and the step of laminating the first transparent insulating layer are performed simultaneously, and the step of laminating the second insulating layer and the step of laminating the second transparent insulating layer are performed simultaneously,
- the step of laminating the first interlayer insulating layer and the step of laminating the first transparent interlayer insulating layer are performed simultaneously, and the step of laminating the second interlayer insulating layer and the step of laminating the second transparent interlayer insulating layer are can be performed simultaneously.
- a plurality of pixel mirror windows are formed on the substrate in the first array structure to correspond to the plurality of pixels, and the pixel light emitting unit is formed in the pixel area.
- the method may further include forming mirror windows made of a reflective material so that each pixel mirror window is disposed in a one-to-one correspondence with the pixel mirror windows.
- a solar cell is built into the display panel in units of pixels, so that power can be charged from sunlight energy while viewing the display panel, maximizing the energy efficiency of the organic light emitting diode display panel. can do.
- a transparent organic light emitting diode display panel capable of implementing a window-type transparent display panel having high transmittance by including a pixel transparent window in a pixel layout and a manufacturing method thereof are provided.
- a mirror type (mirror type) organic light emitting diode display panel capable of implementing a mirror display panel by including a pixel mirror window in a pixel layout and a manufacturing method thereof are provided.
- FIG. 1 is a schematic plan view of a hybrid organic light emitting diode display panel according to an embodiment of the present invention.
- FIG. 2 is a cross-sectional view schematically illustrating a single pixel constituting a hybrid organic light emitting diode display panel according to an exemplary embodiment of the present invention.
- FIG. 3 is a plan view schematically illustrating a single pixel constituting a hybrid organic light emitting diode display panel according to an exemplary embodiment of the present invention.
- 4 and 5 are views for explaining a method of manufacturing a hybrid organic light emitting diode display panel according to an embodiment of the present invention.
- FIG. 6 is a cross-sectional view of a unit pixel of a hybrid organic light emitting diode display panel according to another embodiment of the present invention.
- FIG. 7 and 8 are cross-sectional views of a unit pixel of a hybrid organic light emitting diode display panel according to various embodiments of the present invention.
- FIG. 9 is a cross-sectional view of a unit pixel of a hybrid organic light emitting diode display panel according to another embodiment of the present invention.
- FIG. 10 is a cross-sectional view of a unit pixel of a hybrid organic light emitting diode display panel according to another embodiment of the present invention.
- FIG. 11 is a cross-sectional view of a pixel light emitting unit constituting a hybrid organic light emitting diode display panel according to another embodiment of the present invention.
- FIG. 12 is a cross-sectional view of a pixel light emitting unit constituting a hybrid organic light emitting diode display panel according to another embodiment of the present invention.
- FIG. 13 is a plan view schematically illustrating a single pixel constituting a hybrid organic light emitting diode display panel according to another exemplary embodiment of the present invention.
- FIG. 14 is a cross-sectional view of a single pixel of the hybrid organic light emitting diode display panel according to the embodiment of FIG. 13 .
- 15 to 20 are diagrams for explaining a method of manufacturing a hybrid organic light emitting diode display panel according to the embodiment shown in FIG. 14 .
- 21 is a plan view schematically illustrating a single pixel constituting a hybrid organic light emitting diode display panel according to another exemplary embodiment of the present invention.
- FIG. 22 is a cross-sectional view of a single pixel of the hybrid organic light emitting diode display panel according to the embodiment of FIG. 21 .
- 23 to 28 are diagrams for explaining a method of manufacturing a hybrid organic light emitting diode display panel according to the embodiment shown in FIG. 22 .
- 29 is a plan view schematically illustrating a single pixel constituting a hybrid organic light emitting diode display panel according to another exemplary embodiment of the present invention.
- FIG. 30 is a cross-sectional view of a single pixel of the hybrid organic light emitting diode display panel according to the embodiment of FIG. 29 .
- directional terms such as upper side, lower side, one side, and the other side are used in relation to the orientation of the disclosed drawings. Since components of embodiments of the present invention may be positioned in a variety of orientations, directional terms are used for purposes of illustration and not limitation.
- first and second may be used to describe various components, but the components should not be limited by the terms. The terms may be used for the purpose of distinguishing one component from another. For example, a first element may be termed a second element, and similarly, a second element may be termed a first element, without departing from the scope of the present invention.
- 1 is a schematic plan view of a hybrid organic light emitting diode display panel according to an embodiment of the present invention.
- 2 is a cross-sectional view schematically illustrating a single pixel constituting a hybrid organic light emitting diode display panel according to an exemplary embodiment of the present invention.
- 3 is a plan view schematically illustrating a single pixel constituting a hybrid organic light emitting diode display panel according to an exemplary embodiment of the present invention.
- a hybrid organic light emitting diode display panel 10 has a plurality of pixels 100 arranged on a substrate 110 in a predetermined first arrangement structure.
- Each (100) may include a solar cell in which the pixel solar cell 300 is disposed.
- a pixel light emitting unit 200 may be provided for each pixel 100 .
- the pixel light emitting unit 200 may include a red light emitting pixel 202 , a green light emitting pixel 204 , and a blue light emitting pixel 206 .
- a detailed description of a configuration well known in the art with respect to the pixel light emitting unit 200 may be omitted.
- the pixel light emitting unit 200 includes organic light emitting diodes (OLEDs) 230, a driving thin film transistor 210 that drives the organic light emitting diode 230, and a switching device that switches the driving thin film transistor 210.
- OLEDs organic light emitting diodes
- a thin film transistor 220 may be included.
- the plurality of pixel solar cells 300 may be arranged on the substrate 110 in the same first arrangement structure as the plurality of pixel light emitting units 200 to correspond to the plurality of pixels 10 .
- the first array structure may be a matrix structure arranged in units of a plurality of rows and units of a plurality of columns.
- Each pixel solar cell 300 may be disposed in a one-to-one correspondence with the pixel light emitting unit 200 in a pixel area set in a pixel unit.
- the plurality of pixel light emitting units 200 and the plurality of pixel solar cells 300 provided in the plurality of pixels 100 may be arranged to have the same arrangement period.
- the pixel light emitting unit 200 may be disposed in a first area within a pixel area corresponding to a single pixel.
- the pixel solar cell 300 may be disposed in a second area corresponding to a corner area within a pixel area set in pixel units.
- the second area where the pixel solar cell 300 is disposed is an area that does not overlap with the first area where the pixel light emitting unit 200 is formed on the plane of the hybrid organic light emitting diode display panel, for example, R/G/B pixels. It may be at the bottom of or adjacent to the region.
- the driving thin film transistor 210 is formed on the substrate 110 and the first channel layer 211 formed on the buffer layer 120 on the substrate 110, the first insulating layer 212, and the first channel layer 211.
- a first gate layer 213 formed to be insulated, a first interlayer insulating layer 214 covering the first gate layer 213, an insulating layer 215 formed on the first interlayer insulating layer 214, and 1 may include first drain/source electrodes 216 and 217 electrically connected to the channel layer 211 .
- the substrate 110 may be, for example, a glass substrate or a polyimide substrate, but is not limited thereto.
- the buffer layer 120 may be made of a material such as SiNx, SiOx, or SiONx, but is not limited thereto.
- the buffer layer 120 may be variously implemented as a single buffer layer, a double buffer layer, or three or more buffer layers.
- the switching thin film transistor 220 includes a substrate 110 and a second channel layer 221 formed on the buffer layer 120 on the substrate 110, an insulating layer 225 formed on the second channel layer 221, A second gate layer 222 formed on the insulating layer 225 to be insulated from the second channel layer 221, and second drain/source electrodes 223 and 224 electrically connected to the second channel layer 221 ) may be included.
- the pixel solar cell 300 includes a first electrode layer 310 stacked on a substrate 110, a first semiconductor layer 320 stacked on the first electrode layer 310, and a heterogeneous layer on the first semiconductor layer 320. It may include a second semiconductor layer 330 stacked in a junction structure, and a second electrode layer 340 stacked on the second semiconductor layer 330 .
- a metal electrode that is stable even after annealing at a temperature of about 450° C. after crystallization by Excimer Laser Annealing (ELA), such as Ti or Mo, may be used.
- the first channel layer 211 of the driving thin film transistor 210 constituting the pixel light emitting unit 200 and the first semiconductor layer 320 of the pixel solar cell 300 are either N-type or P-type. It may be made of the same first semiconductor material corresponding to the first type. In the illustrated example, the first channel layer 211 and the first semiconductor layer 320 are made of a P-type polycrystalline silicon semiconductor material doped with B, Al, or Ga.
- the second channel layer 221 of the driving thin film transistor 210 constituting the pixel light emitting unit 200 and the second semiconductor layer 330 of the pixel solar cell 300 are of the other one of N-type and P-type. It may be made of the same second semiconductor material corresponding to the second type. In the illustrated example, the second channel layer 221 and the second semiconductor layer 330 are made of an N-type IGZO oxide semiconductor material.
- the P-type semiconductor layer may be formed of, for example, an a-Si material doped with boron, and a doping material may be implanted after deposition using a chemical vapor deposition (CVD) method, or a- It may be formed by a method such as ELA-treating the Si material and then doping it with boron.
- CVD chemical vapor deposition
- FIG. 4 and 5 are views for explaining a method of manufacturing a hybrid organic light emitting diode display panel according to an embodiment of the present invention.
- the step of stacking the first channel layer 211 of the pixel light emitting unit and the pixel configuration The step of stacking the first semiconductor layer 320 on the first electrode layer 310 of the battery may be performed simultaneously.
- a first channel layer 211, a first insulating layer 212, a first gate layer 213, and a first interlayer insulating layer 214 of a pixel light emitting part are stacked on a substrate 110.
- the step of stacking the second channel layer 221 of the pixel light emitting unit and the step of stacking the second semiconductor layer 330 on the first semiconductor layer 320 of the pixel solar cell may be performed simultaneously.
- the same material used for the two channel layers which are the semiconductor layers of the driving TFT 210 and the switching TFT 220 of the pixel light emitting unit, is changed to the N-type semiconductor material and the P-type semiconductor material of the pixel solar cell 300. It can be applied to form a hybrid P-N junction.
- the second electrode layer 340 corresponding to the upper electrode of the pixel solar cell is patterned simultaneously when forming the drain/source electrodes of the driving TFT 210 and the switching TFT 220, thereby simplifying the process.
- the pixel solar cell structure is patterned at the same time to form the first channel layer 211 of the pixel light emitting part and the first semiconductor layer 320 of the pixel solar cell.
- the second channel layer 221 of the pixel light emitting part and the second semiconductor layer 330 of the pixel solar cell can be formed at the same time, simplifying the process of forming the pixel solar cell and reducing the process cost and time. can do.
- the switching thin film transistor 220 is formed after forming the driving thin film transistor 210
- the driving thin film transistor 210 is formed after forming the switching thin film transistor 220 first, or driving It is also possible to simultaneously form the thin film transistor 210 and the switching thin film transistor 220 .
- FIG. 6 is a cross-sectional view of a unit pixel of a hybrid organic light emitting diode display panel according to another embodiment of the present invention.
- an intrinsic poly-Si layer 350 is formed between the first semiconductor layer 320 and the second semiconductor layer 330 of the pixel solar cell 300. It is different from the above-described embodiment in that it has an N-i-P heterojunction structure.
- both the second channel layer 221 and the second semiconductor layer 330 are made of N-type poly-Si semiconductor material, and the pixel solar cell 300 is It is different from the above-described embodiment in that it has an N-i-P homojunction structure.
- both the first channel layer 211 and the first semiconductor layer 320 are made of a P-type oxide semiconductor material, and the pixel solar cell 300 has an oxide P-i-N homojunction structure. There is a difference from the described embodiment.
- FIG. 9 is a cross-sectional view of a unit pixel of a hybrid organic light emitting diode display panel according to another embodiment of the present invention.
- the embodiment shown in FIG. 9 is the embodiment described above in that the pixel solar cell 300 is composed of a plurality of pixel solar cells including a first pixel solar cell 302 and a second pixel solar cell 304. There is a difference with Since the first pixel solar cell 302 and the second pixel solar cell 304 are the same as the pixel solar cells shown in FIGS. 2 and 6, respectively, overlapping descriptions are omitted.
- the organic light emitting diode 230 constituting the pixel light emitting unit 200 includes a planarization layer 231 formed on the driving thin film transistor 210 and the switching thin film transistor 220, and a first drain of the driving thin film transistor 210. It may include pixel electrodes 232 and 233 connected to the electrode or the first source electrode, and a pixel define layer (PDL) 234 formed on the planarization layer 231 .
- PDL pixel define layer
- the buffer layer 120 includes a first buffer layer 122 and a second buffer layer 124 stacked on each other, and the driving thin film transistor 210 has a first buffer layer 122 on the first buffer layer 122 . It is different from the above-described embodiment in that it further includes a blocking metal layer 126 and the switching thin film transistor 220 further includes a second blocking metal layer 128 on the first buffer layer 122 .
- one of the channel layer of the driving TFT 210 and the channel layer of the switching TFT 220 may be made of a P-type semiconductor material, and the other may be made of an N-type semiconductor material.
- one of a plurality of semiconductor layers stacked on top and bottom may be made of a P-type semiconductor material, and the other may be made of an N-type semiconductor material.
- FIG. 11 is a cross-sectional view of a pixel light emitting unit constituting a hybrid organic light emitting diode display panel according to another embodiment of the present invention.
- the side surface between the substrate 110 corresponding to the lower substrate and the upper substrate 250 is sealed by the sealing unit 240 made of a sealant in each pixel unit. encapsulation) structure.
- the upper substrate 250 may be, for example, a glass or polyimide substrate.
- An organic light emitting diode light emitting layer 235 may be formed on the planarization layer 231 .
- An upper electrode for applying power or ground for example, a cathode electrode or an anode electrode, may be formed on the light emitting layer 235 .
- the planarization layer 231 may be formed of, for example, an OC organic layer or an inorganic layer such as polyimide (PI) or polyamide (PA).
- FIG. 12 is a cross-sectional view of a pixel light emitting unit constituting a hybrid organic light emitting diode display panel according to another embodiment of the present invention.
- the embodiment shown in FIG. 12 has a side thin film encapsulation structure 262 for encapsulating the side surface of the pixel light emitting unit 200 in units of pixels and a thin film encapsulation for the upper surface of the pixel light emitting unit 200 (thin film encapsulation).
- the structure 264 has a structure in which an encapsulation portion 260 that suppresses external moisture permeation is formed, and a protective window layer 270 is formed on the encapsulation portion 260 .
- the encapsulation unit 260 may have, for example, a thin film encapsulation structure of inorganic film/monomer/inorganic film.
- FIG. 13 is a plan view schematically illustrating a single pixel constituting a hybrid organic light emitting diode display panel according to another exemplary embodiment of the present invention.
- FIG. 14 is a cross-sectional view of a single pixel of the hybrid organic light emitting diode display panel according to the embodiment of FIG. 13 .
- the hybrid organic light emitting diode display panel according to another embodiment of the present invention is similar to the previously described embodiment in that it further includes a transparent window including a plurality of pixel transparent windows 400. There is a difference. Since the pixel light emitting unit 200 and the pixel solar cell 300 have been described in the above-described embodiment, overlapping descriptions will be omitted and the pixel transparent window 400 will be mainly described.
- the plurality of pixel transparent windows 400 may be arranged on the substrate 110 in the same first arrangement structure as the pixel light emitting unit 200 to correspond to the plurality of pixels 100 .
- Each pixel transparent window 400 may be disposed in a one-to-one correspondence with the pixel light emitting unit 200 within a pixel area defined on a pixel basis.
- the plurality of pixel light emitting units 200 and the plurality of pixel transparent windows 400 may be arranged to have the same arrangement period.
- the pixel transparent window 400 may be disposed in a third area within a pixel area defined per pixel.
- the third area where the pixel transparent window 400 is disposed does not overlap with the first area where the pixel light emitting unit 200 is disposed and the second area where the pixel solar cell 300 is disposed on the plane of the hybrid organic light emitting diode display panel. It may be an area that does not exist.
- Transmittance of the pixel transparent window 400 may be improved by etching and removing all other metal films except for the inorganic film.
- the driving thin film transistor 210 includes a first interlayer insulating layer 218 covering the first gate layer 213, a second insulating layer 214 stacked on the first interlayer insulating layer 218, and a second insulating layer.
- a second interlayer insulating layer 219 formed on (214) may be further included.
- the second channel layer 221 is stacked on the first interlayer insulating layer 218, the second gate layer 222 is formed on the second insulating layer 214, and the second interlayer insulating layer 219 is It may be formed to cover the second gate layer 222 .
- the pixel transparent window 400 includes a first transparent insulating layer 410 stacked on the substrate 110 and the buffer layer 120, and a first transparent interlayer insulating layer 420 stacked on the first transparent insulating layer 410. , a second transparent insulating layer 430 stacked on the first transparent insulating interlayer 420, and a second transparent insulating layer 440 stacked on the second transparent insulating layer 430. .
- the first transparent insulating layer 410, the first transparent insulating interlayer 420, the second transparent insulating layer 430, and the second transparent insulating layer 440 are each independently made of a single film of SiOx, SiNx, or SiONx. or a double layer (eg, SiOx/SiNx, SiNx/SiOx, SiONx/SiNx, etc.) or a triple layer (eg, SiNx/SiOx/SiNx, SiOx/SiNx, etc.) or a combination of SiOx, SiNx and/or SiONx /SiOx, SiONx/SiOx/SiNx, other combinations), etc. may be formed of laminated films.
- the first insulating layer 212 of the driving thin film transistor 210 and the first transparent insulating layer 410 of the pixel transparent window 400 may be made of the same first insulating material.
- the second insulating layer 214 of the pixel light emitting unit 200 and the second transparent insulating layer 430 may be made of the same second insulating material.
- the first interlayer insulating layer 218 of the pixel light emitting unit 200 and the first transparent interlayer insulating layer 420 of the pixel transparent window 400 may be made of the same third insulating material.
- the second interlayer insulating layer 219 of the pixel light emitting unit 200 and the second transparent interlayer insulating layer 440 of the pixel transparent window 400 may be made of the same fourth insulating material.
- FIG. 15 to 20 are diagrams for explaining a method of manufacturing a hybrid organic light emitting diode display panel according to the embodiment shown in FIG. 14 .
- the step of stacking the first channel layer 211 of the pixel light emitting unit and the pixel configuration The step of stacking the first semiconductor layer 320 on the first electrode layer 310 of the battery may be performed simultaneously.
- stacking the first insulating layer 212 covering the first channel layer 211 on the substrate 110 and the buffer layer 120, and the first transparent insulating layer 410 of the pixel transparent window The step of laminating may be performed simultaneously.
- the step of stacking the first interlayer insulating layer 218 on the first insulating layer 212 of the pixel light emitting unit, and the step of stacking the first transparent insulating layer 410 of the pixel transparent window 400 The step of depositing the first transparent interlayer insulating layer 420 on may be performed simultaneously.
- stacking the second channel layer 221 on the first interlayer insulating layer 218 of the pixel light emitting unit, and the second semiconductor layer on the first semiconductor layer 320 of the pixel solar cell ( 330) may be formed simultaneously.
- the step of depositing the transparent insulating layer 430 may be performed simultaneously.
- the step of stacking the second interlayer insulating layer 219 on the second insulating layer 214 of the pixel light emitting unit and the step of stacking the second insulating layer 219 on the second transparent insulating layer 430 of the pixel transparent window 400 may be performed simultaneously.
- a process for forming the pixel solar cell and the pixel transparent window can be simplified and process cost and time can be reduced.
- 21 is a plan view schematically illustrating a single pixel constituting a hybrid organic light emitting diode display panel according to another exemplary embodiment of the present invention.
- 22 is a cross-sectional view of a single pixel of the hybrid organic light emitting diode display panel according to the embodiment of FIG. 21 .
- the hybrid organic light emitting diode display panel according to another embodiment of the present invention further includes a plurality of pixel mirror windows 500 made of a reflective material such as Ag having excellent reflectivity. It is different from the above-described embodiment in that it is included. Since the pixel light emitting unit 200 and the pixel solar cell 300 have been described in the above-described embodiment, overlapping descriptions will be omitted and the pixel mirror window 500 will be mainly described.
- the plurality of pixel mirror windows 500 may be arranged on the substrate 110 in the same first arrangement structure as the pixel light emitting unit 200 to correspond to the plurality of pixels 100 .
- Each pixel mirror window 500 may be disposed in a one-to-one correspondence with the pixel light emitting unit 200 within a pixel area defined in a pixel unit.
- the plurality of pixel light emitting units 200 and the plurality of pixel mirror windows 500 may be arranged to have the same arrangement period.
- the pixel mirror window 500 may be disposed in a fourth area within a pixel area defined per pixel.
- the fourth area where the pixel mirror window 500 is disposed does not overlap with the first area where the pixel light emitting unit 200 is disposed and the second area where the pixel solar cell 300 is disposed on the plane of the hybrid organic light emitting diode display panel. It may be an area that does not exist.
- the pixel mirror window 500 includes a first transparent insulating layer 510 stacked on the substrate 110 and the buffer layer 120, and a first transparent interlayer insulating layer 520 stacked on the first transparent insulating layer 510.
- the second transparent insulating layer 530 stacked on the first transparent interlayer insulating layer 520
- the second transparent interlayer insulating layer 540 stacked on the second transparent insulating layer 530
- the second transparent interlayer A reflective layer 550 made of a reflective material stacked on the insulating layer 540 may be included.
- the first insulating layer 212 of the driving thin film transistor 210 and the first transparent insulating layer 510 of the pixel mirror window 500 may be made of the same first insulating material.
- the second insulating layer 214 of the pixel light emitting unit 200 and the second transparent insulating layer 530 of the pixel mirror window 500 may be made of the same second insulating material.
- the first interlayer insulating layer 218 of the pixel light emitting unit 200 and the first transparent interlayer insulating layer 520 of the pixel mirror window 500 may be made of the same third insulating material.
- the second interlayer insulating layer 219 of the pixel light emitting unit 200 and the second transparent interlayer insulating layer 540 of the pixel mirror window 500 may be made of the same fourth insulating material.
- the reflective layer 550 may be finally laminated with an Ag-based material having high reflectivity on top of the inorganic film layer to implement a mirror effect.
- FIG. 23 to 28 are diagrams for explaining a method of manufacturing a hybrid organic light emitting diode display panel according to the embodiment shown in FIG. 22 .
- the step of stacking the first channel layer 211 of the pixel light emitting unit and the pixel configuration The step of stacking the first semiconductor layer 320 on the first electrode layer 310 of the battery may be performed simultaneously.
- stacking the first insulating layer 212 covering the first channel layer 211 on the substrate 110 and the buffer layer 120, and the first transparent insulating layer 510 of the pixel mirror window The step of laminating may be performed simultaneously. Further, referring to FIG. 25 , the step of stacking the first interlayer insulating layer 218 on the first insulating layer 212 of the pixel light emitting unit, and the step of stacking the first transparent insulating layer 510 of the pixel mirror window 500 The step of depositing the first transparent interlayer insulating layer 520 on may be performed simultaneously.
- stacking the second channel layer 221 on the first interlayer insulating layer 218 of the pixel light emitting unit, and the second semiconductor layer on the first semiconductor layer 320 of the pixel solar cell ( 330) may be formed simultaneously. Further, referring to FIG. 27 , stacking a second insulating layer 214 on the first interlayer insulating layer 218 of the pixel light emitting unit, and stacking the second insulating layer 214 on the first transparent interlayer insulating layer 520 of the pixel mirror window. The stacking of the transparent insulating layer 530 may be performed simultaneously.
- the step of stacking the second interlayer insulating layer 219 on the second insulating layer 214 of the pixel light emitting unit, and the step of stacking the second transparent insulating layer 530 of the pixel mirror window 500 may be performed simultaneously. In this way, since the pixel light emitting unit, the pixel solar cell, and the pixel mirror window are formed at the same time, the process for forming the pixel solar cell and the pixel mirror window can be simplified and the process cost and time can be reduced.
- FIG. 29 is a plan view schematically illustrating a single pixel constituting a hybrid organic light emitting diode display panel according to another exemplary embodiment of the present invention.
- FIG. 30 is a cross-sectional view of a single pixel of the hybrid organic light emitting diode display panel according to the embodiment of FIG. 29 .
- the hybrid organic light emitting diode display panel according to another embodiment of the present invention includes a pixel light emitting unit 200, a pixel solar cell 300, a pixel transparent window 400 for each pixel, and It is different from the above-described embodiment in that all pixel mirror windows 500 are included. Since the pixel light emitting unit 200, the pixel solar cell 300, the pixel transparent window 400, and the pixel mirror window 500 have been described through the above-described embodiments, duplicate descriptions will be omitted.
- a display can be implemented by a plurality of pixel light emitting units 200 of a hybrid organic light emitting diode display panel, and a digital play panel having both mirror characteristics and transparent window characteristics is provided. It is possible to collect sunlight energy by two pixel solar cells.
- the hybrid organic light emitting diode display panel according to the embodiment of the present invention as described above can be applied to various display panels such as an OLED display, a flexible OLED display, a rollable OLED display, and a TFT-LCD.
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Abstract
Description
Claims (18)
- 기판 상에 소정의 제1 배열 구조로 복수개의 화소가 배열되고, 각 화소마다 유기발광다이오드와 상기 유기발광다이오드를 구동하는 구동 박막트랜지스터 및 상기 구동 박막트랜지스터를 스위칭하는 스위칭 박막 트랜지스터를 포함하는 화소 발광부가 마련되는 유기발광다이오드 패널; 및상기 기판 상에 상기 복수개의 화소와 대응하도록 상기 제1 배열 구조로 배열되는 복수개의 화소 태양전지를 포함하고, 화소 단위로 설정되는 화소 영역 내에 상기 화소 발광부와 대응하도록 각 화소 태양전지가 배치되는 태양 전지;를 포함하는 하이브리드 유기발광다이오드 디스플레이 패널.
- 청구항 1에 있어서,상기 복수개의 화소에 마련되는 복수개의 화소 발광부와 상기 복수개의 화소 태양전지는 서로 동일한 배열 주기를 가지도록 배열되는 하이브리드 유기발광다이오드 디스플레이 패널.
- 청구항 1에 있어서,상기 화소 발광부는 상기 화소 영역 내의 제1 영역에 배치되고,상기 화소 태양전지는 상기 화소 영역 내의 모서리 영역에 해당하는 제2 영역에 배치되고,상기 제2 영역은 상기 하이브리드 유기발광다이오드 디스플레이 패널의 평면 상에서 상기 제1 영역과 중첩되지 않는 영역인 하이브리드 유기발광다이오드 디스플레이 패널.
- 청구항 3에 있어서,상기 구동 박막트랜지스터는 상기 기판 상의 제1 채널층, 상기 제1 채널층 상에 절연되게 형성되는 제1 게이트층, 및 상기 제1 채널층에 전기적으로 연결되는 제1 드레인 전극과 제1 소스 전극을 포함하고,상기 화소 태양전지는 상기 기판 상의 제1 전극층, 상기 제1 전극층 상에 적층되는 제1 반도체층, 상기 제1 반도체층 상에 이종 접합 구조로 적층되는 제2 반도체층 및 상기 제2 반도체층 상에 적층되는 제2 전극층을 포함하고,상기 제1 채널층과 상기 제1 반도체층은 N-형 및 P-형 중 어느 하나의 제1 형에 해당하는 동일한 제1 반도체 물질로 이루어지는 하이브리드 유기발광다이오드 디스플레이 패널.
- 청구항 4에 있어서,상기 스위칭 박막트랜지스터는 상기 기판 상의 제2 채널층, 상기 제2 채널층 상에 절연되게 형성되는 제2 게이트층, 및 상기 제2 채널층에 전기적으로 연결되는 제2 드레인 전극과 제2 소스 전극을 포함하고,상기 제2 채널층과 상기 제2 반도체층은 N-형 및 P-형 중 다른 하나의 제2 형에 해당하는 동일한 제2 반도체 물질로 이루어지는 하이브리드 유기발광다이오드 디스플레이 패널.
- 청구항 5에 있어서,상기 기판 상에 상기 복수개의 화소와 대응하도록 상기 제1 배열 구조로 배열되는 복수개의 화소 투명창을 포함하고, 상기 화소 영역 내에 상기 화소 발광부와 일대일 대응하도록 각 화소 투명창이 배치되는 투명창;을 더 포함하는 하이브리드 유기발광다이오드 디스플레이 패널.
- 청구항 6에 있어서,상기 복수개의 화소 발광부와 상기 복수개의 화소 투명창은 서로 동일한 배열 주기를 가지도록 배열되고,상기 화소 투명창은 상기 화소 영역 내의 제3 영역에 배치되고,상기 제3 영역은 상기 하이브리드 유기발광다이오드 디스플레이 패널의 평면 상에서 상기 제1 영역 및 상기 제2 영역과 중첩되지 않는 영역인 하이브리드 유기발광다이오드 디스플레이 패널.
- 청구항 7에 있어서,상기 구동 박막트랜지스터는 상기 제1 채널층 상에 적층되는 제1 절연층, 상기 제1 게이트층을 덮는 제1 층간 절연층, 상기 제1 층간 절연층 상에 적층되는 제2 절연층, 및 상기 제2 절연층 상에 형성되는 제2 층간 절연층을 더 포함하고,상기 제2 채널층은 상기 제1 층간 절연층 상에 적층되고,상기 제2 게이트층은 상기 제2 절연층 상에 형성되고,상기 제2 층간 절연층은 상기 제2 게이트층을 덮도록 형성되고,상기 화소 투명창은 상기 기판 상에 적층되는 제1 투명 절연층, 상기 제1 투명 절연층 상에 적층되는 제1 투명 층간 절연층, 상기 제1 투명 층간 절연층 상에 적층되는 제2 투명 절연층, 및 상기 제2 투명 절연층 상에 적층되는 제2 투명 층간 절연층을 포함하고,상기 제1 절연층과 상기 제1 투명 절연층은 동일한 제1 절연 물질로 이루어지고,상기 제2 절연층과 상기 제2 투명 절연층은 동일한 제2 절연 물질로 이루어지고,상기 제1 층간 절연층과 상기 제1 투명 층간 절연층은 동일한 제3 절연 물질로 이루어지고,상기 제2 층간 절연층과 상기 제2 투명 층간 절연층은 동일한 제4 절연 물질로 이루어지는 하이브리드 유기발광다이오드 디스플레이 패널.
- 청구항 4에 있어서,반사 물질로 이루어지고 상기 기판 상에 상기 복수개의 화소와 대응하도록 상기 제1 배열 구조로 배열되는 복수개의 화소 거울창을 포함하고, 상기 화소 영역 내에 상기 화소 발광부와 일대일 대응하도록 각 화소 거울창이 배치되는 거울창;을 더 포함하는 하이브리드 유기발광다이오드 디스플레이 패널.
- 청구항 9에 있어서,상기 복수개의 화소 발광부와 상기 복수개의 화소 거울창은 서로 동일한 배열 주기를 가지도록 배열되고,상기 화소 거울창은 상기 화소 영역 내의 제4 영역에 배치되고,상기 제4 영역은 상기 하이브리드 유기발광다이오드 디스플레이 패널의 평면 상에서 상기 제1 영역 및 상기 제2 영역과 중첩되지 않는 영역인 하이브리드 유기발광다이오드 디스플레이 패널.
- 청구항 1의 하이브리드 유기발광다이오드 디스플레이 패널을 제조하는 하이브리드 유기발광다이오드 디스플레이 패널 제조 방법으로서,기판 상에 제1 배열 구조로 복수개의 화소가 배열되도록 유기발광다이오드 패널을 형성하는 단계; 및상기 기판 상에 상기 복수개의 화소와 대응하도록 상기 제1 배열 구조로 복수개의 화소 태양전지가 배열되도록 태양 전지를 형성하는 단계;를 포함하고,상기 유기발광다이오드 패널을 형성하는 단계는 각 화소마다 유기발광다이오드와 상기 유기발광다이오드를 구동하는 구동 박막트랜지스터 및 상기 구동 박막트랜지스터를 스위칭하는 스위칭 박막 트랜지스터를 포함하는 화소 발광부가 마련되도록 상기 유기발광다이오드 패널을 형성하는 단계를 포함하고,상기 태양 전지를 형성하는 단계는 화소 단위로 설정되는 화소 영역 내에 상기 화소 발광부와 대응하도록 각 화소 태양전지가 배치되도록 상기 태양 전지를 형성하는 단계를 포함하는 하이브리드 유기발광다이오드 디스플레이 패널 제조 방법.
- 청구항 11에 있어서,상기 유기발광다이오드 패널을 형성하는 단계는 상기 기판 상에 상기 구동 박막 트랜지스터를 형성하는 단계를 포함하고,상기 구동 박막트랜지스터를 형성하는 단계는:상기 기판 상에 제1 채널층을 적층하는 단계;상기 제1 채널층 상에 절연되도록 제1 게이트층을 형성하는 단계; 및상기 제1 채널층에 전기적으로 연결되도록 제1 드레인 전극과 제1 소스 전극을 형성하는 단계;를 포함하고,상기 태양 전지를 형성하는 단계는:상기 기판 상에 제1 전극층을 적층하는 단계;상기 제1 전극층 상에 제1 반도체층을 적층하는 단계;상기 제1 반도체층 상에 이종 접합 구조로 제2 반도체층을 적층하는 단계; 및상기 제2 반도체층 상에 제2 전극층을 적층하는 단계;를 포함하고,상기 제1 채널층과 상기 제1 반도체층은 N-형 및 P-형 중 어느 하나의 제1 형에 해당하는 동일한 제1 반도체 물질로 이루어지는 하이브리드 유기발광다이오드 디스플레이 패널 제조 방법.
- 청구항 12에 있어서,상기 유기발광다이오드 패널을 형성하는 단계는 상기 기판 상에 상기 스위칭 박막 트랜지스터를 형성하는 단계를 더 포함하고,상기 스위칭 박막 트랜지스터를 형성하는 단계는:상기 기판 상에 제2 채널층을 적층하는 단계;상기 제2 채널층 상에 절연되게 제2 게이트층을 형성하는 단계; 및상기 제2 채널층에 전기적으로 연결되도록 제2 드레인 전극과 제2 소스 전극을 형성하는 단계;를 포함하고,상기 제2 채널층과 상기 제2 반도체층은 N-형 및 P-형 중 다른 하나의 제2 형에 해당하는 동일한 제2 반도체 물질로 이루어지는 하이브리드 유기발광다이오드 디스플레이 패널 제조 방법.
- 청구항 13에 있어서,상기 제1 채널층을 적층하는 단계와 상기 제1 반도체층을 적층하는 단계는 동시에 수행되고,상기 제2 채널층을 적층하는 단계와 상기 제2 반도체층을 적층하는 단계는 동시에 수행되는 하이브리드 유기발광다이오드 디스플레이 패널 제조 방법.
- 청구항 13에 있어서,상기 기판 상에 상기 복수개의 화소와 대응하도록 상기 제1 배열 구조로 복수개의 화소 투명창을 형성하되, 상기 화소 영역 내에 상기 화소 발광부와 일대일 대응하도록 각 화소 투명창을 배치하여 투명창을 형성하는 단계;를 더 포함하는 하이브리드 유기발광다이오드 디스플레이 패널 제조 방법.
- 청구항 15에 있어서,상기 구동 박막트랜지스터를 형성하는 단계는:상기 제1 채널층 상에 제1 절연층을 적층하는 단계;상기 제1 게이트층을 덮는 제1 층간 절연층을 적층하는 단계;상기 제1 층간 절연층 상에 제2 절연층을 적층하는 단계; 및상기 제2 절연층 상에 제2 층간 절연층을 적층하는 단계;를 더 포함하고,상기 제2 채널층은 상기 제1 층간 절연층 상에 적층되고,상기 제2 게이트층은 상기 제2 절연층 상에 형성되고,상기 제2 층간 절연층은 상기 제2 게이트층을 덮도록 형성되고,상기 투명창을 형성하는 단계는:상기 기판 상에 제1 투명 절연층을 적층하는 단계;상기 제1 투명 절연층 상에 제1 투명 층간 절연층을 적층하는 단계;상기 제1 투명 층간 절연층 상에 제2 투명 절연층을 적층하는 단계; 및상기 제2 투명 절연층 상에 제2 투명 층간 절연층을 적층하는 단계;를 포함하고,상기 제1 절연층과 상기 제1 투명 절연층은 동일한 제1 절연 물질로 이루어지고,상기 제2 절연층과 상기 제2 투명 절연층은 동일한 제2 절연 물질로 이루어지고,상기 제1 층간 절연층과 상기 제1 투명 층간 절연층은 동일한 제3 절연 물질로 이루어지고,상기 제2 층간 절연층과 상기 제2 투명 층간 절연층은 동일한 제4 절연 물질로 이루어지는 하이브리드 유기발광다이오드 디스플레이 패널 제조 방법.
- 청구항 16에 있어서,상기 제1 절연층을 적층하는 단계와 상기 제1 투명 절연층을 적층하는 단계는 동시에 수행되고,상기 제2 절연층을 적층하는 단계와 상기 제2 투명 절연층을 적층하는 단계는 동시에 수행되고,상기 제1 층간 절연층을 적층하는 단계와 상기 제1 투명 층간 절연층을 적층하는 단계는 동시에 수행되고,상기 제2 층간 절연층을 적층하는 단계와 상기 제2 투명 층간 절연층을 적층하는 단계는 동시에 수행되는 하이브리드 유기발광다이오드 디스플레이 패널 제조 방법.
- 청구항 11에 있어서,상기 기판 상에 상기 복수개의 화소와 대응하도록 상기 제1 배열 구조로 복수개의 화소 거울창을 형성하되, 상기 화소 영역 내에 상기 화소 발광부와 일대일 대응하도록 각 화소 거울창이 배치되도록 반사 물질로 이루어지는 거울창을 형성하는 단계;를 더 포함하는 하이브리드 유기발광다이오드 디스플레이 패널 제조 방법.
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US20160343780A1 (en) * | 2015-05-18 | 2016-11-24 | Boe Technology Group Co., Ltd. | Array substrate, fabrication method thereof and organic light-emitting diode display device |
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US20160343780A1 (en) * | 2015-05-18 | 2016-11-24 | Boe Technology Group Co., Ltd. | Array substrate, fabrication method thereof and organic light-emitting diode display device |
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