WO2023042260A1 - Dispositif d'extension - Google Patents

Dispositif d'extension Download PDF

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Publication number
WO2023042260A1
WO2023042260A1 PCT/JP2021/033738 JP2021033738W WO2023042260A1 WO 2023042260 A1 WO2023042260 A1 WO 2023042260A1 JP 2021033738 W JP2021033738 W JP 2021033738W WO 2023042260 A1 WO2023042260 A1 WO 2023042260A1
Authority
WO
WIPO (PCT)
Prior art keywords
ring
sheet member
wafer
expansion
expanding
Prior art date
Application number
PCT/JP2021/033738
Other languages
English (en)
Japanese (ja)
Inventor
芳邦 鈴木
Original Assignee
ヤマハ発動機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to CN202180102178.5A priority Critical patent/CN117957637A/zh
Priority to JP2023547967A priority patent/JPWO2023042260A1/ja
Priority to PCT/JP2021/033738 priority patent/WO2023042260A1/fr
Priority to KR1020247001698A priority patent/KR20240021306A/ko
Priority to TW111104883A priority patent/TWI819486B/zh
Publication of WO2023042260A1 publication Critical patent/WO2023042260A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/04—Cleaning by suction, with or without auxiliary action
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

Definitions

  • the heat shrink portion includes an intake ring
  • the intake ring sucks air around the entire circumference of the sheet member heated by the heating ring.
  • the heating is stopped by the heating ring and the sheet member is cooled, the air around the sheet member heated by the heating ring is sucked over the entire circumference.
  • FIG. 1 is a plan view of an expanding device according to one embodiment
  • FIG. 1 is a side view of an expanding device according to one embodiment
  • FIG. FIG. 4 is a plan view of a wafer ring structure of an expanding device according to one embodiment
  • 4 is a cross-sectional view taken along line 101-101 of FIG. 3
  • FIG. FIG. 4 is a bottom view of a debris cleaner of an expanding device according to one embodiment
  • FIG. 4 is a bottom view of the heat shrink portion of the expanding device according to one embodiment
  • 4 is a block diagram showing a control configuration of an expanding device according to one embodiment
  • FIG. 4 is a flow chart showing semiconductor chip manufacturing processing of the expanding device according to one embodiment.
  • the expanding device 100 includes a base plate 1 , a cassette section 2 , a lift-up hand section 3 , a suction hand section 4 , a base 5 , an expanding section 6 , a cool air supply section 7 , a cooling unit 8 , and a fragment cleaner 9 . , a heat shrink portion 10 , and an ultraviolet irradiation portion 11 .
  • the base plate 1 is a base on which the cassette section 2 and the suction hand section 4 are installed.
  • the base plate 1 has a rectangular shape elongated in the Y direction in plan view.
  • the cassette section 2 is configured to accommodate a plurality (five) of wafer ring structures 200 .
  • the wafer ring structure 200 has a wafer 210, a sheet member 220, and a ring-shaped member 230, as shown in FIGS.
  • the cassette section 2 includes a Z-direction moving mechanism 21, a wafer cassette 22, and a pair of mounting sections 23.
  • the Z-direction moving mechanism 21 is configured to move the wafer cassette 22 in the Z-direction using a motor 21a as a drive source.
  • the Z-direction moving mechanism 21 also has a mounting table 21b that supports the wafer cassette 22 from below.
  • the wafer cassette 22 is manually supplied and mounted on the mounting table 21b.
  • the wafer cassette 22 has an accommodation space capable of accommodating a plurality of wafer ring structures 200 .
  • a plurality of (five) pairs of mounting portions 23 are arranged inside the wafer cassette 22 .
  • the suction hand unit 4 is configured to suction the ring-shaped member 230 of the wafer ring structure 200 from the Z1 direction side.
  • the suction hand unit 4 includes an X-direction movement mechanism 41 , a Z-direction movement mechanism 42 and a suction hand 43 .
  • the X-direction moving mechanism 41 is configured to move the suction hand 43 in the X direction using a motor 41a as a drive source.
  • the Z-direction moving mechanism 42 is configured to move the suction hand 43 in the Z-direction using a motor 42a as a drive source.
  • the suction hand 43 is configured to support the ring-shaped member 230 of the wafer ring structure 200 from the Z1 direction side.
  • the expanding section 6 includes a Z-direction moving mechanism 61 , a Y-direction moving mechanism 62 , a clamp section 63 and an expanding ring 64 .
  • the Z-direction moving mechanism 61 is configured to move the clamp portion 63 in the Z-direction using a motor 61a as a drive source.
  • the Y-direction moving mechanism 62 is configured to move the Z-direction moving mechanism 61, the clamp portion 63 and the expand ring 64 in the Y direction using a motor 62a as a drive source.
  • the expand ring 64 is an example of the "support ring" in the claims.
  • the clamp part 63 is configured to grip the ring-shaped member 230 of the wafer ring structure 200 .
  • the clamp portion 63 has a lower grip portion 63a and an upper grip portion 63b.
  • the lower grip portion 63a supports the ring-shaped member 230 from the Z2 direction side.
  • the upper gripping portion 63b presses the ring-shaped member 230 supported by the lower gripping portion 63a from the Z1 direction side.
  • the ring-shaped member 230 is gripped by the lower gripping portion 63a and the upper gripping portion 63b.
  • the cool air supply unit 7 has a plurality of nozzles 71 .
  • the nozzle 71 has a cool air supply port 71a (see FIG. 5) through which cool air supplied from a cool air supply source (not shown) flows out.
  • a nozzle 71 is attached to the debris cleaner 9 .
  • a cold source is a chiller for generating cold.
  • the cool air supply source supplies air cooled by, for example, a cooling device provided with a heat pump or the like. Such cold air supply is mounted on the base 5 .
  • a cool air supply source and each of the plurality of nozzles 71 are connected by a hose (not shown).
  • the cooling unit 8 includes a cooling member 81 having a cooling body 81 a and a Peltier element 81 b, and a cylinder 82 .
  • the cooling body 81a is made of a member having a large heat capacity and a high thermal conductivity.
  • the cooling body 81a is made of metal such as aluminum.
  • the Peltier element 81b is configured to cool the cooling body 81a. Note that the cooling body 81a is not limited to aluminum, and may be another member having a large heat capacity and a high thermal conductivity.
  • the debris cleaner 9 is configured to be movable in the Z direction by means of a cylinder (not shown). As a result, the fragment cleaner 9 can move to a position close to the wafer 210 and to a position where the suction hand 43 moving in the X direction can be avoided.
  • the heat shrink section 10 is configured to shrink the sheet member 220 expanded by the expanding section 6 by heating while maintaining the gaps between the plurality of semiconductor chips.
  • the expansion maintaining ring 113 has a ring shape in plan view.
  • the expansion retaining ring 113 is configured to be movable in the Z direction by a cylinder (not shown). This allows the expansion retaining ring 113 to move to a position holding the seat member 220 and a position away from the seat member 220 .
  • the ultraviolet irradiation unit 11 is configured to irradiate the sheet member 220 with ultraviolet rays in order to reduce the adhesive strength of the adhesive layer of the sheet member 220 .
  • the ultraviolet irradiation section 11 has an ultraviolet light.
  • the expanding device 100 includes a first control unit 12, a second control unit 13, a third control unit 14, a fourth control unit 15, a fifth control unit 16, an expansion control calculation A unit 17 , a handling control calculation unit 18 , and a storage unit 19 are provided.
  • the first control section 12 is configured to control the heat shrink section 10 .
  • the first control unit 12 includes a CPU (Central Processing Unit) and a storage unit having ROM (Read Only Memory) and RAM (Random Access Memory).
  • the first control unit 12 may include, as a storage unit, an HDD (Hard Disk Drive) that retains stored information even after the voltage is cut off. Also, the HDD may be provided in common to the first control section 12 , the second control section 13 , the third control section 14 , the fourth control section 15 and the fifth control section 16 .
  • an HDD Hard Disk Drive
  • the second control section 13 is configured to control the cool air supply section 7 , the cooling unit 8 and the debris cleaner 9 .
  • the second control unit 13 includes a CPU and a storage unit having ROM, RAM, and the like.
  • the third control section 14 is configured to control the expanding section 6 .
  • the third control unit 14 includes a CPU and a storage unit having ROM, RAM, and the like. Note that the second control unit 13 and the third control unit 14 may include, as a storage unit, an HDD or the like that retains stored information even after the voltage is cut off.
  • the fourth control section 15 is configured to control the cassette section 2 and the lift-up hand section 3.
  • the fourth control unit 15 includes a CPU and a storage unit having ROM, RAM, and the like.
  • the fifth control section 16 is configured to control the suction hand section 4 .
  • the fifth control unit 16 includes a CPU and a storage unit having ROM, RAM, and the like. Note that the fourth control unit 15 and the fifth control unit 16 may include, as a storage unit, an HDD or the like that retains stored information even after the voltage is cut off.
  • the expansion control calculation unit 17 is configured to perform calculations related to expansion processing of the sheet member 220 based on the processing results of the first control unit 12, the second control unit 13 and the third control unit 14.
  • the expansion control calculation unit 17 includes a CPU and a storage unit having ROM, RAM, and the like.
  • the handling control calculation unit 18 is configured to perform calculations related to the process of moving the wafer ring structure 200 based on the processing results of the fourth control unit 15 and the fifth control unit 16 .
  • the handling control calculation unit 18 includes a CPU and a storage unit having ROM, RAM, and the like.
  • a program for operating the expanding device 100 is stored in the storage unit 19 .
  • the storage unit 19 includes ROM, RAM, and the like.
  • step S1 the wafer ring structure 200 is taken out from the cassette section 2. That is, after the wafer ring structure 200 housed in the cassette section 2 is supported by the lift-up hand 32, the lift-up hand 32 is moved in the Y2 direction by the Y-direction moving mechanism 31, whereby the wafer ring structure 200 is removed from the cassette section 2. Structure 200 is retrieved.
  • step S ⁇ b>2 the wafer ring structure 200 is transferred to the expanding section 6 by the suction hand 43 . That is, the wafer ring structure 200 taken out from the cassette section 2 is moved in the X2 direction by the X-direction moving mechanism 41 while being sucked by the suction hand 43 . The wafer ring structure 200 that has moved in the X2 direction is transferred from the suction hand 43 to the clamp section 63 and then gripped by the clamp section 63 .
  • step S3 the sheet member 220 is expanded by the expanding section 6.
  • the sheet member 220 of the wafer ring structure 200 gripped by the clamp portion 63 is cooled by the cooling unit 8 .
  • the sheet member 220 is cooled by the cold air supply unit 7 .
  • the wafer ring structure 200 cooled to a predetermined temperature is lowered by the Z-direction moving mechanism 61 while being gripped by the clamp portion 63 .
  • the sheet member 220 is expanded by the expand ring 64 to divide the wafer 210 along the dividing line. At this time, the wafer 210 is divided while suctioning the fragments by the fragment cleaner 9 .
  • step S4 while maintaining the expanded state of the sheet member 220, the expanded portion 6 is moved to the Z2 direction side of the heat shrink portion 10. That is, after the wafer 210 is divided, the wafer ring structure 200 with the sheet member 220 expanded is moved in the Y1 direction by the Y-direction moving mechanism 62 .
  • step S5 the sheet member 220 is heated by the heat shrink section 10 to be shrunk.
  • the wafer ring structure 200 moved in the Y1 direction is heated by the heating ring 111 while being sandwiched between the expansion retaining ring 113 and the expand ring 64 .
  • suction by the suction ring 112 and irradiation of ultraviolet rays by the ultraviolet irradiation unit 11 are performed.
  • step S6 the expanding section 6 is returned to its original position. That is, the wafer ring structure 200 with the contracted sheet member 220 is moved in the Y2 direction by the Y-direction moving mechanism 31 .
  • step S ⁇ b>7 the wafer ring structure 200 is transferred from the expanding section 6 to the lift-up hand section 3 by the suction hand 43 , is moved in the X1 direction by the X-direction moving mechanism 41 , and is transferred to the lift-up hand 32 .
  • step S ⁇ b>8 the wafer ring structure 200 is accommodated in the cassette part 2 .
  • the wafer ring structure 200 supported by the lift-up hand 32 is moved in the Y1 direction by the Y-direction moving mechanism 31 , so that the wafer ring structure 200 is housed in the cassette section 2 .
  • the processing performed on one wafer ring structure 200 is completed.
  • composition related to expansion and heat shrink 1 and 9-14, the configuration for expansion and heat shrink will be described in detail.
  • the expanding section 6 is configured to expand a stretchable heat-shrinkable sheet member 220 at a first position P1.
  • the Y-direction moving mechanism 62 moves from the first position P1 to a second position P2, which is horizontally (Y1 direction) away from the first position P1 in plan view, in a state in which the sheet member 220 is expanded by the expanding section 6.
  • the Z-direction moving mechanism 61 of the expanding section 6, the clamping section 63 and the expanding ring 64 are configured to move in the horizontal direction (Y1 direction).
  • the heat shrink section 10 is configured to heat and shrink (heat shrink) the slack of the portion 220b of the sheet member 220 around the wafer 210 caused by the expansion by the expanding section 6 at the second position P2. It is
  • the expanding section 6 is configured such that when the sheet member 220 is expanded, the clamping section 63 grips the ring-shaped member 230 in the vertical direction (Z direction).
  • the upper gripping portion 63b of the clamping portion 63 is composed of a plurality (four) of slide moving bodies 63ba arranged so as to surround the wafer ring structure 200.
  • the plurality of slide moving bodies 63ba are configured to horizontally slide toward the wafer 210 side when gripping the ring-shaped member 230.
  • the clamp part 63 is moved toward the expand ring 64 by the driving force of the motor 61a of the Z-direction moving mechanism 61 while gripping the ring-shaped member 230 between the upper grip part 63b and the lower grip part 63a. It is configured to descend in the Z2 direction. As a result, the sheet member 220 is pressed against the expand ring 64 and the sheet member 220 is expanded.
  • the expand ring 64 is arranged on the Z2 direction side with respect to the sheet member 220 .
  • the expand ring 64 is arranged horizontally between the wafer 210 and the ring-shaped member 230 .
  • the expand ring 64 is formed in a circular ring so as to surround the wafer 210 .
  • the first position P1 which is the expanded position, on the Z1 direction side with respect to the wafer ring structure 200, there is a fragment cleaner 9 that sucks and removes scattered matter generated from the wafer ring structure 200 due to the expansion of the sheet member 220.
  • Scattered matter is, for example, fragments of wafer 210 or the like.
  • the die attach film may become a scattering object.
  • the fragments of the wafer 210 are small in the vicinity of the outer edge 210a (see FIG. 12) of the wafer 210, the position of the wafer 210 becomes unstable when the sheet member 220 is expanded, and the fragments are likely to be scattered.
  • the fragment cleaner 9 is configured to suck and remove the scattered matter by the negative pressure supplied from the negative pressure generator.
  • the fragment cleaner 9 has a first position P1, which is an expanded position, by the driving force of a cylinder such as an air cylinder. It is configured to be movable in the vertical direction (Z direction) between the positions.
  • the lower position is the position near the wafer 210 .
  • the upper position is a retreat position where the suction hand 43 moving in the X direction can be avoided.
  • the fragment cleaner 9 is configured to descend in the Z2 direction from the upper position to the lower position when expanding the sheet member 220 . Further, the fragment cleaner 9 is configured to start the suction operation before pressing the sheet member 220 against the expand ring 64 and continue the suction operation at least until the pressing of the sheet member 220 against the expand ring 64 is completed. .
  • a cool air supply section 7 and a cooling unit 8 for cooling the sheet member 220 when the sheet member 220 is expanded by the expanding section 6 are arranged at the first position P1, which is the expanding position.
  • the cool air supply unit 7 is provided integrally with the fragment cleaner 9 on the Z1 direction side with respect to the wafer ring structure 200 . Therefore, at the first position P1, the cool air supply unit 7 moves vertically (in the Z direction) integrally with the fragment cleaner 9 between a lower position where cool air is supplied and an upper position where no cool air is supplied. configured as possible.
  • the cool air supply unit 7 is configured to descend in the Z2 direction from the upper position to the lower position when the sheet member 220 is expanded.
  • the cool air supply unit 7 is configured to start the cool air supply operation before pressing the sheet member 220 against the expand ring 64 and continue the cool air supply operation at least until the sheet member 220 is completely pressed against the expand ring 64. ing.
  • the cooling unit 8 is arranged on the Z2 direction side with respect to the wafer ring structure 200 . At the first position P1, the cooling unit 8 is moved vertically ( Z direction). The cooling unit 8 is configured to rise in the Z1 direction from the lower position to the upper position when the sheet member 220 is expanded. The cooling unit 8 is also configured to initiate and complete the cooling operation before pressing the sheet member 220 against the expand ring 64 . Also, the cooling unit 8 is configured to retract to the lower position before pressing the sheet member 220 against the expand ring 64 .
  • the Y-direction moving mechanism 62 maintains the expanded state of the sheet member 220 by the expanding section 6,
  • the expanding portion 6 (the Z-direction moving mechanism 61, the clamp portion 63 and the expanding ring 64) is moved in the Y1 direction from the first position P1 where the sheet member 220 is expanded to the second position P2 where the sheet member 220 is heat-shrinked. configured to move.
  • the Y-direction moving mechanism 62 moves independently of the fragment cleaner 9, the cool air supply unit 7 and the cooling unit 8 without moving the fragment cleaner 9, the cool air supply unit 7 and the cooling unit 8 from the first position P1.
  • the expanding portion 6 is moved in the Y1 direction from the first position P1 to the second position P2.
  • the fragment cleaner 9 and the cool air supply section 7 are retracted to the upper position, and the cooling unit 8 is retracted to the lower position.
  • the Y-direction moving mechanism 62 further has a mounting portion 62b and a rail portion 62c in addition to the motor 62a.
  • the mounting portion 62b is configured such that the Z-direction moving mechanism 61, the clamp portion 63 and the expand ring 64 are mounted on the upper surface thereof. Further, the mounting portion 62b is formed in a substantially rectangular plate shape in plan view.
  • the mounting portion 62b is movably provided on the rail portion 62c.
  • a pair of rail portions 62c are provided spaced apart in the X direction. The pair of rail portions 62c are provided to extend in the Y direction between the first position P1 and the second position P2.
  • the Y-direction moving mechanism 62 moves the mounting portion 62b in the Y direction along the pair of rail portions 62c by the driving force of the motor 62a, thereby moving the Z-direction moving mechanism 61, the clamp portion 63 and the expand ring 64. It is configured to be movable in the Y direction between the first position P1 and the second position P2.
  • the mounting portion 62b is provided with a hole portion 62ba passing through the mounting portion 62b in the vertical direction (Z direction).
  • the hole portion 62ba is formed in a circular shape in plan view.
  • the hole portion 62ba has a size that allows the cooling unit 8 to pass therethrough at the first position P1. Thereby, it is possible to move the cooling unit 8 between the upper position and the lower position via the hole 62ba.
  • the hole 62ba has a size that allows the ultraviolet irradiation section 11 to pass therethrough at the second position P2. Thereby, it is possible to move the ultraviolet irradiation section 11 between the upper position and the lower position via the hole 62ba.
  • the hole portion 62ba is provided inside the expand ring 64 .
  • the cooling unit 8 and the ultraviolet irradiation section 11 are configured to move inside the expand ring 64 through the hole 62ba.
  • the heat shrink portion 10 is arranged on the Z1 direction side of the expanded portion 6 moved by the Y direction moving mechanism 62 at the second position P2, which is the heat shrink position. Further, the heating ring 111 and the suction ring 112 of the heat shrink portion 10 are driven by the driving force of the motor 110a of the Z-direction moving mechanism 110 at the second position P2, where the sheet member 220 is not heated, and the sheet member 220 is heated.
  • the expansion maintaining ring 113 of the heat shrink portion 10 is moved between an upper position not pressing the sheet member 220 and a lower position pressing the sheet member 220 at the second position P2 by the driving force of a cylinder such as an air cylinder.
  • a cylinder such as an air cylinder.
  • the upper position is a retracted position where the expanding portion 6 and the wafer ring structure 200 moving in the Y1 direction can be avoided.
  • the lower position is a position near the sheet member 220 .
  • the heat shrink portion 10 (the heating ring 111, the suction ring 112, and the expansion maintaining ring 113) is configured to descend in the Z2 direction from the upper position to the lower position when heat shrinking the sheet member 220.
  • the up-down mechanism (Z-direction moving mechanism 110) for the heating ring 111 and the suction ring 112 and the up-down mechanism (cylinder) for the extension maintaining ring 113 are separate mechanisms. Therefore, the heating ring 111, the suction ring 112, and the expansion retaining ring 113 can move up and down independently of each other.
  • the expansion maintaining ring 113 is configured to sandwich the sheet member 220 in the vertical direction (Z direction) with the expanding ring 64 .
  • the expansion maintaining ring 113 is configured to maintain the expanded state of the portion of the sheet member 220 corresponding to the wafer 210 .
  • the heating ring 111 heats the portion 220b of the sheet member 220 around the wafer 210 (the outside of the expansion maintaining ring 113) by the sheathed heater, which is a heating mechanism. part).
  • the intake ring 112 is configured to intake gas generated from the sheet member 220 due to the heating while the sheet member 220 is heated by the heating ring 111 .
  • the heating ring 111 is configured to heat the entire circumference of the portion of the sheet member 220 surrounding the wafer 210 .
  • the suction ring 112 is configured to suck air around the seat member 220 heated by the heating ring 111 over the entire circumference.
  • the intake ring 112 sucks the air around the sheet member 220 heated by the heating ring 111 over the entire circumference, and the heating is stopped by the heating ring 111.
  • the air intake ring 112 is configured to continue air intake during the process of shrinking the sheet member 220 by the heat shrink portion 10 .
  • the sheet member 220 When the sheet member 220 is shrunk by the heat shrink unit 10, the sheet member 220 is cooled by stopping the heating of the heating ring 111 after heating the sheet member 220 by the heating ring 111 for a predetermined time. At this time, the clamp part 63 is moved upward. As a result, the ring-shaped member 230 of the wafer ring structure 200 gripped by the clamp portion 63 moves upward, and the sheet member 220 held by the ring-shaped member is stretched (under tension). Member 220 contracts. After that, heating is restarted, and the operation of stopping after a predetermined time is repeated.
  • the intake ring 112 is arranged close to the inner peripheral side of the heating ring 111 .
  • the intake ring 112 also includes a plurality of intake ports 112a circumferentially arranged over the entire circumference.
  • FIG. 19A by arranging a plurality of intake ports 112a around the entire circumference of the intake ring 112, warm air on the seat member 220 can be evenly sucked. That is, as shown in FIG. 19B, when the air intake ports 112a are arranged with a distance therebetween, point suction occurs, and warm air tends to remain between the air intake ports 112a.
  • FIG. 19A by arranging a plurality of air inlets 112a close to each other, it becomes possible to suppress the occurrence of hot air accumulation due to air flow like line suction.
  • an ultraviolet irradiation section 11 for irradiating the sheet member 220 with ultraviolet rays when the sheet member 220 is heat-shrinked by the heat shrink section 10 is arranged at the second position P2, which is the heat shrink position.
  • the ultraviolet irradiation unit 11 is arranged on the Z2 direction side with respect to the wafer ring structure 200 .
  • the ultraviolet irradiation unit 11 is vertically (Z-direction) moved between an upper position where it irradiates ultraviolet rays and a lower position where it does not irradiate ultraviolet rays by the driving force of a cylinder 121 such as an air cylinder. is configured to be movable to
  • the ultraviolet irradiation unit 11 is configured to rise in the Z1 direction from the lower position to the upper position when heat shrinking the sheet member 220 .
  • the Y-direction moving mechanism 62 moves from the second position P2 where heat shrinking is performed to the first position P1 where expansion is performed to expand the expanding portion 6 (Z
  • the direction moving mechanism 61, the clamp portion 63 and the expand ring 64) are configured to move in the Y2 direction.
  • the Y-direction moving mechanism 62 moves from the second position P2 independently of the heat shrink portion 10 and the ultraviolet irradiation portion 11 without moving the heat shrink portion 10 and the ultraviolet irradiation portion 11 from the second position P2. It is configured to move the expanding portion 6 in the Y2 direction to the first position P1.
  • the heat shrink portion 10 is retracted to the upper position
  • the ultraviolet irradiation portion 11 is retracted to the lower position.
  • the expansion maintaining ring 113 is circumferentially abutted around the wafer 210 on the other side (Z1 direction side) of the sheet member 220.
  • the expansion of the sheet member 220 is maintained in the portion where the wafer 210 is placed.
  • the expansion maintaining ring 113 includes a bottom portion 113a, a side portion 113b, and a sticking suppressing portion 113c.
  • the bottom portion 113a is arranged to cover the upper side (Z1 direction side).
  • the side portion 113b is formed in an annular shape so as to surround the wafer 210 of the sheet member 220 .
  • the bottom surface portion 113a is connected to the side surface portion 113b on the side opposite to the sheet member 220 (Z1 direction side).
  • the bottom portion 113a is formed in a circular shape.
  • the expansion maintaining ring 113 is formed so that the inner diameter has a diameter D11 and the outer diameter has a diameter D12. Further, the expansion maintaining ring 113 is formed so that the diameter of the central portion in the thickness of the ring (side surface portion 113b) has a diameter D13.
  • the expand ring 64 is formed to have an inner diameter of D21 (where D21 ⁇ D11) and an outer diameter of D22. Further, the expand ring 64 is formed so that the diameter of the central portion in the thickness of the ring has a diameter D23 (however, D23 ⁇ D13). That is, the expansion maintaining ring 113 is formed such that the radius of the central portion of the ring thickness is larger than the radius of the central portion of the expand ring 64 in the ring thickness.
  • the insertion/extraction direction (Y direction) of the wafer ring structure 200 by the lift-up hand portion 3 and the moving direction (Y direction) of the expanding portion 6 by the Y direction moving mechanism 62 are substantially parallel to each other.
  • the cassette part 2 is arranged side by side with the second position P2, which is the heat shrink position, in the X direction.
  • the take-out position of the wafer ring structure 200 by the lift-up hand section 3 is arranged side by side with the first position P1, which is the expanded position, in the X direction.
  • the extraction process is a process performed in step S1 in the semiconductor chip manufacturing process.
  • step S101 it is determined whether or not the lift-up hand 32 of the lift-up hand unit 3 is free. If the lift-up hand 32 is not free, the takeout process is terminated. If the lift-up hand 32 is free, the process proceeds to step S102.
  • step S102 it is determined whether or not the lift-up hand 32 exists within the wafer cassette 22 of the cassette section 2. If the lift-up hand 32 does not exist within the wafer cassette 22, the process proceeds to step S104. Also, when the lift-up hand 32 exists in the wafer cassette 22, the process proceeds to step S103.
  • step S103 the lift-up hand 32 is moved from inside the wafer cassette 22 to outside the wafer cassette 22 by the Y-direction moving mechanism 31 in the Y2 direction.
  • step S ⁇ b>104 the wafer cassette 22 is moved in the Z direction by the Z-direction moving mechanism 21 so that the lift-up hand 32 can take out the wafer ring structure 200 to be taken out from the wafer cassette 22 .
  • the upper surface of the lift-up hand 32 is positioned slightly above the lower surface of the ring-shaped member 230 of the wafer ring structure 200 to be taken out in the wafer cassette 22 in the Z2 direction.
  • the wafer cassette 22 is moved in the Z direction by the Z direction moving mechanism 21 .
  • step S105 the lift-up hand 32 is moved in the Y1 direction by the Y-direction moving mechanism 31 so as to be positioned right below the ring-shaped member 230 of the wafer ring structure 200 to be taken out in the wafer cassette 22.
  • step S ⁇ b>106 the wafer ring structure 200 to be taken out from the wafer cassette 22 is transferred to the lift-up hand 32 .
  • step S106 the lower surface of the ring-shaped member 230 of the wafer ring structure 200 to be taken out from the wafer cassette 22 is lifted slightly by the lift-up hand 32 from the upper surfaces of the pair of mounting portions 23.
  • the wafer cassette 22 is moved in the Z2 direction by the Z-direction moving mechanism 21 .
  • step S107 the lift-up hand 32 is moved in the Y2 direction by the Y-direction movement mechanism 31 while the lower surface of the ring-shaped member 230 of the wafer ring structure 200 to be taken out is supported by the upper surface of the lift-up hand 32. .
  • the wafer ring structure 200 to be taken out is taken out from the wafer cassette 22 by the lift-up hand 32 .
  • the extraction process is terminated.
  • Transfer processing in the expanding device 100 will be described with reference to FIG. 21 .
  • the transfer process is a process performed in step S2 or S7 in the semiconductor chip manufacturing process.
  • step S201 the suction hand 43 of the suction hand unit 4 is lifted by the Z-direction moving mechanism 42. As shown in FIG. 21, in step S201, the suction hand 43 of the suction hand unit 4 is lifted by the Z-direction moving mechanism 42. As shown in FIG. 21, in step S201, the suction hand 43 of the suction hand unit 4 is lifted by the Z-direction moving mechanism 42. As shown in FIG. 21, in step S201, the suction hand 43 of the suction hand unit 4 is lifted by the Z-direction moving mechanism 42.
  • step S ⁇ b>202 the suction hand 43 is moved above the wafer ring structure 200 by the X-direction moving mechanism 41 .
  • the suction hand 43 is moved above the wafer ring structure 200 supported by the lift-up hand 32 .
  • the suction hand 43 is moved above the wafer ring structure 200 supported by the expanding section 6 .
  • step S ⁇ b>203 the suction hand 43 is lowered toward the wafer ring structure 200 by the Z-direction moving mechanism 42 .
  • step S204 the suction hand 43 sucks the ring-shaped member 230 of the wafer ring structure 200 by the negative pressure supplied from the negative pressure generator.
  • step S205 the suction hand 43 is lifted by the Z-direction moving mechanism 42.
  • step S206 the suction hand 43 is moved above the transfer destination by the X-direction moving mechanism 41. Specifically, in the case of step S2 in the semiconductor chip manufacturing process, the suction hand 43 is moved above the expanding section 6 at the first position P1. Further, in the case of step S ⁇ b>7 in the semiconductor chip manufacturing process, the suction hand 43 is moved above the lift-up hand 32 .
  • step S208 the suction of the ring-shaped member 230 of the wafer ring structure 200 by the suction hand 43 is released. This completes the transfer of the wafer ring structure 200 to the transfer destination. Then, the transfer process is terminated.
  • step S302 the plurality of sliding moving bodies 63ba of the upper gripping portion 63b are horizontally slid toward the wafer 210 side.
  • step S304 the fragment cleaner 9 is lowered toward the wafer ring structure 200 by the cylinder together with the cool air supply unit 7.
  • step S305 it is determined whether cooling by supplying cool air to the sheet member 220 by the cool air supply unit 7 is necessary. If cooling by supply of cool air to the sheet member 220 by the cool air supply unit 7 is required, the process proceeds to step S305a. Then, in step S305a, supply of cool air to the sheet member 220 by the cool air supply unit 7 is started. Then, the process proceeds to step S306. If cooling by supplying cool air to the sheet member 220 by the cool air supply unit 7 is not necessary, the process proceeds to step S306 without performing the process of step S305a.
  • step S308 the suction of the scattered matter by the fragment cleaner 9 is started.
  • step S309 the clamp portion 63 is rapidly lowered by the Z-direction moving mechanism 61 to press the sheet member 220 against the expand ring 64, thereby expanding the sheet member 220.
  • the wafer 210 on the sheet member 220 is divided into a plurality of matrix-shaped semiconductor chips, and the gaps between the plurality of semiconductor chips are widened.
  • the clamp portion 63 is lowered from the expansion start position to the expansion completion position.
  • step S311 the suction of the scattered matter by the fragment cleaner 9 is stopped.
  • the heat shrink process in the expanding device 100 will be described with reference to FIGS. 24 and 25.
  • FIG. The heat shrink process is a process performed in step S5 in the semiconductor chip manufacturing process.
  • step S401 the ultraviolet irradiation section 11 is raised by the cylinder 121. As shown in FIG. 24, in step S401, the ultraviolet irradiation section 11 is raised by the cylinder 121. As shown in FIG. 24, in step S401, the ultraviolet irradiation section 11 is raised by the cylinder 121. As shown in FIG. 24, in step S401, the ultraviolet irradiation section 11 is raised by the cylinder 121. As shown in FIG.
  • step S402 the extension maintaining ring 113 is lowered by the cylinder. Thereby, the sheet member 220 is sandwiched between the expansion maintaining ring 113 and the expanding ring 64 .
  • step S403 the heating ring 111 and the suction ring 112 are lowered by the Z-direction moving mechanism 110.
  • the up-down mechanism (Z-direction moving mechanism 110) for the heating ring 111 and the suction ring 112 and the up-down mechanism (cylinder) for the extension maintaining ring 113 are separate mechanisms.
  • step S405 heating of the sheet member 220 by the heating ring 111 and irradiation of the sheet member 220 by the ultraviolet irradiation unit 11 with ultraviolet rays are started.
  • the slack in the portion 220b of the sheet member 220 surrounding the wafer 210 is contracted and removed.
  • the irradiation of the sheet member 220 with the ultraviolet rays by the ultraviolet irradiation unit 11 reduces the adhesive strength of the adhesive layer of the sheet member 220 .
  • step S406 it is determined whether or not the heating time of the sheet member 220 by the heating ring 111 has reached the set time. If the heating time of the sheet member 220 by the heating ring 111 has not reached the set time, the process of step S406 is repeated. If the heating time of the sheet member 220 by the heating ring 111 reaches the set time, the process proceeds to step S407.
  • step S407 the heating of the sheet member 220 by the heating ring 111 is stopped.
  • step S408 the clamp part 63 is raised at a low speed by the Z-direction moving mechanism 61.
  • step S409 it is determined whether or not the clamp portion 63 has risen to the expansion start position. If the clamp portion 63 has not risen to the expansion start position, the process of step S409 is repeated. If the clamp portion 63 has risen to the expansion start position, the process proceeds to step S410.
  • steps S406 to S409 an example in which heating of the sheet member 220 by the heating ring 111 and lifting of the clamping portion 63 by the Z-direction moving mechanism 61 are performed at once was shown. is not limited to For example, the heating of the sheet member 220 by the heating ring 111 and the lifting of the clamping portion 63 by the Z-direction moving mechanism 61 may be performed in multiple steps. That is, the clamping portion 63 may be raised to the expansion start position while repeating the heating of the sheet member 220 by the heating ring 111 and the raising of the clamping portion 63 by the Z-direction moving mechanism 61 .
  • step S410 the intake by the intake ring 112 and the irradiation of the ultraviolet rays to the sheet member 220 by the ultraviolet irradiation unit 11 are stopped.
  • step S411 the heating ring 111 and the intake ring 112 are lifted by the Z-direction moving mechanism 110.
  • step S412 the expansion retaining ring 113 is lifted by the cylinder.
  • step S413 the ultraviolet irradiation section 11 is lowered by the cylinder 121. Then, the heat shrink process is terminated. Then, the Y-direction moving mechanism 62 moves the expanding portion 6 (the Z-direction moving mechanism 61, the clamp portion 63 and the expanding ring 64) from the second position P2 to the first position P1. Then, the wafer ring structure 200 that has been expanded and heat-shrinked is transferred from the expanding section 6 at the first position P ⁇ b>1 to the lift-up hand 32 by the suction hand 43 .
  • the accommodation process in the expanding device 100 will be described with reference to FIG. 26 .
  • the accommodation process is a process performed in step S8 in the semiconductor chip manufacturing process.
  • step S501 it is determined whether or not the lift-up hand 32 of the lift-up hand unit 3 is free. If the lift-up hand 32 is not free, the accommodation process is terminated. If the lift-up hand 32 is vacant, the process proceeds to step S502.
  • step S502 it is determined whether or not the lift-up hand 32 exists within the wafer cassette 22 of the cassette section 2. If the lift-up hand 32 does not exist within the wafer cassette 22, the process proceeds to step S504. Also, if the lift-up hand 32 exists in the wafer cassette 22, the process proceeds to step S503.
  • step S505 the lower surface of the ring-shaped member 230 of the wafer ring structure 200 to be accommodated on the lift-up hand 32 is positioned at the accommodation position in the wafer cassette 22 (directly above the pair of mounting portions 23). Then, the lift-up hand 32 is moved in the Y1 direction by the Y-direction moving mechanism 31 .
  • the wafer 210 arranged on the sheet member 220 may be peeled off or shifted due to the vibration of the sheet member 220. Displacement can be suppressed.
  • the coating layer of the sticking suppressing portion 113c coats the contact portion with fluorine. Accordingly, sticking of the extension maintaining ring 113 to the sheet member 220 can be effectively suppressed by the sticking suppressing portion 113c coated with fluorine.
  • the expansion maintaining ring 113 is formed so that the cross-section of the contact portion that contacts the sheet member 220 has a round shape. This makes it possible to reduce the area of the contact portion of the expansion maintaining ring 113 against the sheet member 220 compared to the case where the contact portion of the expansion maintaining ring 113 is flattened. sticking to can be effectively suppressed.
  • the cross-section of the contact portion of the extension maintaining ring 113 contacting the sheet member 220 round, the sheet member 220 is prevented from being damaged unlike the case where the contact portion of the sheet member 220 is contact with the sheet member 220 in an angular shape. can be suppressed.
  • the expand ring 64 is formed so that the cross section of the portion that contacts the sheet member 220 has a round shape.
  • the cross section of the portion of the expand ring 64 that abuts on the sheet member 220 is formed into a square shape, the surface of the expand ring 64 can be brought into contact with the sheet member 220 . Therefore, the sheet member 220 can be prevented from being damaged.
  • the expansion maintaining ring 113 is formed such that the radius of the central portion in the thickness of the ring is larger than the radius of the central portion in the thickness of the expand ring 64 .
  • the expansion maintaining ring 113 can be brought into contact with the seat member 220 outside the expand ring 64, so even if slight vibration occurs when the expansion maintaining ring 113 is separated from the seat member 220, Since the expand ring 64 is in contact with the sheet member 220 inside the expansion maintaining ring 113, it is possible to suppress the transmission of vibration to the inner portion of the sheet member 220 where the wafer 210 is arranged. . This can effectively prevent the wafer 210 placed on the sheet member 220 from peeling off or being displaced.
  • the expansion maintaining ring 113 and the expanding ring 64 are configured to sandwich and hold the sheet member 220 with the inner peripheral portion of the expansion maintaining ring 113 and the outer peripheral portion of the expanding ring 64.
  • the sheet member 220 is sandwiched and held by the inner peripheral portion of the expansion maintaining ring 113 having a round cross section and the outer peripheral portion of the expand ring 64 having a round cross section. It can be securely held and the expansion of the sheet member 220 at the portion where the wafer 210 is placed can be reliably maintained.
  • the heat shrink section 10 includes a heating ring 111 that heats the entire circumference of the portion of the sheet member 220 surrounding the wafer 210 .
  • a heating ring 111 that heats the entire circumference of the portion of the sheet member 220 surrounding the wafer 210 .
  • the heat shrink portion 10 includes an intake ring 112 that sucks air around the sheet member 220 heated by the heating ring 111 over the entire circumference.
  • an intake ring 112 that sucks air around the sheet member 220 heated by the heating ring 111 over the entire circumference.
  • the intake ring 112 sucks the air around the sheet member 220 heated by the heating ring 111 over the entire circumference.
  • the heating is stopped and the sheet member 220 is cooled, the air around the sheet member 220 heated by the heating ring 111 is sucked over the entire circumference.
  • the seat member 220 is cooled, the surrounding air can be sucked over the entire circumference by the intake ring 112, so that the seat member 220 can be cooled quickly.
  • the intake ring 112 is arranged close to the inner peripheral side of the heating ring 111 .
  • air can be sucked into a position close to the inside of the heating ring 111, so that air is sucked from the sheet member 220 heated by the heating ring 111 to the suction ring 112 as shown in FIG. 18(A).
  • the sheet member 220 is closed, an air flow can be formed from the outside to the inside of the sheet member 220 .
  • the intake ring 112 includes a plurality of intake ports 112a circumferentially arranged over the entire circumference.
  • warm air can be evenly sucked from the sheet member 220 heated by the heating ring 111 through the plurality of intake ports 112a circumferentially arranged over the entire circumference.
  • the sheet member 220 can be evenly and efficiently cooled.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Surgical Instruments (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Glass Compositions (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne un dispositif d'expansion (100) comprenant un anneau de maintien d'expansion (113) qui, lors du rétrécissement d'un élément en feuille (220) à l'aide d'une partie thermorétractable (10), entre en contact de manière circonférentielle avec la périphérie d'une tranche (210) sur une surface de l'autre côté de l'élément de feuille, et maintient l'élément de feuille d'une manière prise en sandwich conjointement avec un anneau d'expansion (64), ce qui permet de maintenir la dilatation de l'élément en feuille au niveau de la partie où la tranche est disposée. L'anneau de maintien d'expansion comprend également une partie de suppression de collage (113c) qui est disposée sur une partie de contact qui entre en contact avec l'élément de feuille et qui supprime l'adhérence à l'élément de feuille.
PCT/JP2021/033738 2021-09-14 2021-09-14 Dispositif d'extension WO2023042260A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN202180102178.5A CN117957637A (zh) 2021-09-14 2021-09-14 扩展装置
JP2023547967A JPWO2023042260A1 (fr) 2021-09-14 2021-09-14
PCT/JP2021/033738 WO2023042260A1 (fr) 2021-09-14 2021-09-14 Dispositif d'extension
KR1020247001698A KR20240021306A (ko) 2021-09-14 2021-09-14 익스팬드 장치
TW111104883A TWI819486B (zh) 2021-09-14 2022-02-10 擴展裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/033738 WO2023042260A1 (fr) 2021-09-14 2021-09-14 Dispositif d'extension

Publications (1)

Publication Number Publication Date
WO2023042260A1 true WO2023042260A1 (fr) 2023-03-23

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JP (1) JPWO2023042260A1 (fr)
KR (1) KR20240021306A (fr)
CN (1) CN117957637A (fr)
TW (1) TWI819486B (fr)
WO (1) WO2023042260A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009253071A (ja) * 2008-04-08 2009-10-29 Tokyo Seimitsu Co Ltd エキスパンド方法
JP2009272503A (ja) * 2008-05-09 2009-11-19 Disco Abrasive Syst Ltd フィルム状接着剤の破断装置及び破断方法
JP2012186445A (ja) * 2011-02-16 2012-09-27 Tokyo Seimitsu Co Ltd ワーク分割装置及びワーク分割方法
JP2019110268A (ja) * 2017-12-20 2019-07-04 株式会社ディスコ 分割装置
JP2020102516A (ja) * 2018-12-21 2020-07-02 株式会社ディスコ ウエーハの分割方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3611000A (en) 1969-12-17 1971-10-05 Tektronix Inc Selective erasure of a bistable storage tube
JP7362202B2 (ja) * 2019-04-15 2023-10-17 株式会社ディスコ エキスパンド装置、エキスパンド方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009253071A (ja) * 2008-04-08 2009-10-29 Tokyo Seimitsu Co Ltd エキスパンド方法
JP2009272503A (ja) * 2008-05-09 2009-11-19 Disco Abrasive Syst Ltd フィルム状接着剤の破断装置及び破断方法
JP2012186445A (ja) * 2011-02-16 2012-09-27 Tokyo Seimitsu Co Ltd ワーク分割装置及びワーク分割方法
JP2019110268A (ja) * 2017-12-20 2019-07-04 株式会社ディスコ 分割装置
JP2020102516A (ja) * 2018-12-21 2020-07-02 株式会社ディスコ ウエーハの分割方法

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CN117957637A (zh) 2024-04-30
KR20240021306A (ko) 2024-02-16
TWI819486B (zh) 2023-10-21
TW202312253A (zh) 2023-03-16

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