WO2023027080A1 - 表層除去方法および表層除去装置 - Google Patents

表層除去方法および表層除去装置 Download PDF

Info

Publication number
WO2023027080A1
WO2023027080A1 PCT/JP2022/031760 JP2022031760W WO2023027080A1 WO 2023027080 A1 WO2023027080 A1 WO 2023027080A1 JP 2022031760 W JP2022031760 W JP 2022031760W WO 2023027080 A1 WO2023027080 A1 WO 2023027080A1
Authority
WO
WIPO (PCT)
Prior art keywords
surface layer
spots
removal
spot
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/031760
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
諒介 西井
由博 西潟
和行 梅野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP2023542938A priority Critical patent/JP7464802B2/ja
Publication of WO2023027080A1 publication Critical patent/WO2023027080A1/ja
Anticipated expiration legal-status Critical
Priority to JP2024051134A priority patent/JP2024074841A/ja
Ceased legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material

Definitions

  • the present invention relates to a surface layer removing method and a surface layer removing apparatus.
  • Patent Document 1 a method of removing coatings and deposits on the surface of a structure by irradiating it with laser light.
  • the spot diameter is enlarged by shifting the focus of the laser beam from the surface of the object to be processed, thereby shortening the processing time and alleviating the energy density.
  • one of the objects of the present invention is to obtain a novel and improved surface layer removing method and surface layer removing apparatus that can reduce, for example, the variation in the processing state depending on the location and shorten the processing time. , is.
  • the surface layer removal method of the present invention is, for example, a surface layer removal method in which a laser beam containing a plurality of beams is irradiated onto an object to be processed to remove the surface layer of the object to be processed.
  • the surface layer of the object to be processed is removed by scanning the plurality of formed spots arranged in the first direction in a second direction intersecting the first direction.
  • the arrangement interval of the plurality of spots in the first direction is equal to or less than the width in the first direction of the removal area where the surface layer is removed when the spots are scanned singly in the second direction.
  • the plurality of spots may be arranged to form one row extending in the first direction.
  • the plurality of spots may be arranged to form a plurality of rows extending in the first direction and shifted in the second direction.
  • the plurality of rows includes a first row in which the plurality of spots are spaced apart in the first direction, and a first row in which the plurality of spots are spaced in the first direction. and a second row arranged at a different position in the first direction than the plurality of spots arranged in the first row.
  • the ratio of the intensity of the spot having the lowest intensity among the plurality of spots to the intensity of the spot having the highest intensity among the plurality of spots may be 0.8 or more.
  • the laser light from the light source may be split into the plurality of spots by a beam shaper.
  • the beam shaper may be a diffractive optical element.
  • the material to be processed may be a metal having a rusted surface, and the intensity of the spot may be 25 [J/cm 2 ] or more.
  • the intensity of the spot may be less than 3.8 ⁇ 10 4 [J/cm 2 ].
  • the material to be processed may be concrete or mortar, and the strength of the spot may be 1.2 ⁇ 10 4 [J/cm 2 ] or more.
  • the material to be processed may be metal, and the intensity of the spot may be less than 5.7 ⁇ 10 5 [J/cm 2 ].
  • the material to be processed may be a metal surface covered with a coating film, and the intensity of the spot may be greater than 5.3 ⁇ 10 2 [J/cm 2 ].
  • the intensity of the spot may be smaller than 1.3 ⁇ 10 5 [J/cm 2 ].
  • the surface layer removal apparatus of the present invention is, for example, a surface layer removal apparatus for removing a surface layer of an object to be processed by irradiating a laser beam containing a plurality of beams onto the object to be processed, comprising: a light emitting device that outputs laser light; a delivery optical fiber for transmitting a laser beam from an apparatus; an optical head for irradiating the surface of the object to be processed with the laser beam from the delivery optical fiber; and a scanning mechanism that scans the spots on the surface of the processing object, by scanning in a second direction that intersects the first direction with the plurality of spots arranged in the first direction on the surface of the processing object. Remove the surface layer of the object.
  • the arrangement interval of the plurality of spots in the first direction is equal to or less than the width in the first direction of the removal area where the surface layer is removed when the spots are scanned alone in the second direction.
  • the light emitting device may have an optical fiber laser.
  • the M2 beam quality of the laser light output from the delivery optical fiber may be 10 or less.
  • the delivery optical fiber may have a core and a clad surrounding the core, and the core may have an outer diameter of 50 [ ⁇ m] or more.
  • the outer diameter of the core may be 80 [ ⁇ m] or more.
  • the diameter of the core may be 100 [ ⁇ m] or more.
  • the length of the delivery optical fiber may be 5 [m] or longer.
  • the surface removal apparatus may include a beam shaper that splits the laser beam from the light source into the plurality of spots.
  • the beam shaper may be a diffractive optical element.
  • FIG. 1 is an exemplary schematic configuration diagram of a surface layer removing apparatus according to an embodiment.
  • FIG. 2 is an explanatory diagram showing the concept of the principle of the diffractive optical element included in the surface removal device of the embodiment.
  • FIG. 3 is an exemplary schematic configuration diagram of an optical fiber laser included in the surface removal device of the embodiment.
  • FIG. 4 is a schematic diagram showing an example of a pattern of a plurality of spots formed on the surface of the object to be processed by the surface removal device of the embodiment.
  • FIG. 5 is a schematic diagram showing an example of a removal region where the surface layer is removed when the surface of the object to be processed is scanned with one beam by the surface layer removing apparatus of the embodiment.
  • FIG. 1 is an exemplary schematic configuration diagram of a surface layer removing apparatus according to an embodiment.
  • FIG. 2 is an explanatory diagram showing the concept of the principle of the diffractive optical element included in the surface removal device of the embodiment.
  • FIG. 3 is an exemplary schematic configuration diagram of an optical fiber laser included
  • FIG. 6 is a schematic diagram showing another example of a pattern of a plurality of spots formed on the surface of the object to be processed by the surface removal device of the embodiment.
  • FIG. 7 is a plan view (photographic image) of an example of a removed area formed by the surface layer removing apparatus of the embodiment.
  • FIG. 8 is a plan view (photographic image) of a removed region formed by a surface layer removing apparatus of a reference example.
  • FIG. 9 is a plan view (photographic image) showing a state in which no removal area is formed on the surface of the metal member to be processed by the surface layer removing apparatus of the embodiment.
  • FIG. 7 is a plan view (photographic image) of an example of a removed area formed by the surface layer removing apparatus of the embodiment.
  • FIG. 8 is a plan view (photographic image) of a removed region formed by a surface layer removing apparatus of a reference example.
  • FIG. 9 is a plan view (photographic image) showing a state in which no removal area is formed
  • FIG. 10 is a plan view (photographic image) showing a state in which a suitable removal region is formed on the surface of a metal member to be processed by the surface removal device of the embodiment.
  • FIG. 11 is a plan view (photographic image) showing a state in which the surface of a metal member to be processed is melted by the surface layer removing apparatus of the embodiment.
  • FIG. 12 is a plan view (photographic image) showing a state in which a removal area is not formed on the surface of concrete to be processed by the surface removal apparatus of the embodiment.
  • FIG. 13 is a plan view (photographic image) showing a state in which a suitable removal area is formed on the surface of concrete to be processed by the surface removal device of the embodiment.
  • FIG. 14 is a plan view (photographic image) showing a state in which the surface of concrete to be processed is partially vitrified by the surface layer removing device of the embodiment.
  • FIG. 15 is a plan view (photographic image) showing a state in which stains remain after cleaning the surface of the metal member to be processed by the surface layer removing apparatus of the embodiment.
  • FIG. 16 is a plan view (photographic image) showing a state in which the outermost layer of the coating film on the surface of the metal member to be processed is removed by the surface layer removing apparatus of the embodiment.
  • 17 is a plan view (photographic image) showing a state in which the outermost layer and the inner layer of the coating film on the surface of the metal member to be processed are removed by the surface layer removing apparatus of the embodiment, and the base material is exposed.
  • 18 is a plan view (photographic image) showing a state in which the outermost layer and the inner layer of the coating film on the surface of the metal member to be processed have been removed by the surface layer removing apparatus of the embodiment, but the base material has melted. .
  • the X direction is indicated by an arrow X
  • the Y direction is indicated by an arrow Y
  • the Z direction is indicated by an arrow Z.
  • the X-, Y-, and Z-directions intersect and are orthogonal to each other.
  • FIG. 1 is a diagram showing a schematic configuration of a surface removal device 100 according to an embodiment.
  • the surface removal device 100 includes a light emitting device 110, an optical head 120, and a delivery optical fiber .
  • the surface layer removing apparatus 100 irradiates a laser beam L onto the surface Wa of the object W whose surface layer is to be removed.
  • laser ablation is caused by the energy of the laser light L at the location on the surface Wa irradiated with the laser light L and its vicinity, and the surface layer is thinly removed.
  • the material forming the body (base material) including the surface Wa of the object W the dirt, rust, coating film, coating materials, etc. on the surface Wa are removed.
  • the object W is an example of an object to be processed.
  • the optical head 120 and the object W Prior to the surface layer removal processing by irradiating the laser beam L, the optical head 120 and the object W are positioned so that the laser beam L can be applied to the target region of the surface Wa for the surface layer removal processing. , is set.
  • Objects W are diverse, such as buildings, constructions, constructions, building materials, products, parts, and objects. Moreover, although the material which comprises the target object W is a metal, concrete, mortar, etc., for example, it is not limited to these.
  • the light emitting device 110 includes a laser oscillator, and is configured to output laser light with a power of 6000 [W], for example.
  • the light emitting device 110 will be described later in detail.
  • the delivery optical fiber 130 is an optical fiber having a core and a clad (both not shown) surrounding the core, and optically connects the light emitting device 110 and the optical head 120 . In other words, the delivery optical fiber 130 guides the laser light output from the light emitting device 110 to the optical head 120 .
  • the length of the delivery optical fiber 130 is For example, it is set to 5 [m] or more and 100 [m] or less.
  • the diameter of the core of the delivery optical fiber 130 is preferably 50 [ ⁇ m] or more, more preferably 80 [ ⁇ m] or more, and 100 ⁇ m or more. [ ⁇ m] or more is more preferable.
  • the delivery optical fiber 130 is configured so that the M2 beam quality of the laser light output from the delivery optical fiber 130 is 10 or less in the specifications having the above-described length and diameter. .
  • the M2 beam quality may also be referred to as the M2 factor.
  • the optical head 120 is an optical device for appropriately irradiating the target object W with laser light input from the light emitting device 110 .
  • the optical head 120 has a collimator lens 121 , a condenser lens 122 , a mirror 123 , a DOE 125 and a galvanometer scanner 126 .
  • Collimator lens 121, condenser lens 122, mirror 123, DOE 125, and galvanometer scanner 126 may also be referred to as optics.
  • the collimating lens 121 collimates the laser light input via the delivery optical fiber 130 respectively.
  • the collimated laser light becomes parallel light.
  • the mirror 123 reflects the first laser beam collimated by the collimator lens 121 and directs it to the galvanometer scanner 126 . Note that the mirror 123 may be unnecessary depending on the arrangement of other optical systems.
  • the galvanometer scanner 126 has a plurality of mirrors 126a and 126b. By changing the angles of the plurality of mirrors 126a and 126b, it is possible to switch the emission direction of the laser light L from the optical head 120, thereby changing the irradiation position of the laser light L on the surface Wa of the object W. can.
  • the angles of the mirrors 126a, 126b are each changed by a drive mechanism (not shown), such as a motor controlled by a controller (not shown).
  • a drive mechanism such as a motor controlled by a controller (not shown).
  • the condensing lens 122 condenses the laser light as parallel light coming from the galvanometer scanner 126, and irradiates the object W with the laser light L (output light).
  • the DOE 125 shapes the beam of the first laser beam collimated by the collimating lens 121 .
  • DOE 125 is an example of a beam shaper.
  • FIG. 2 is an explanatory diagram showing the concept of the principle of DOE125.
  • the DOE 125 has, for example, a structure in which a plurality of diffraction gratings 125a with different periods are superimposed.
  • the DOE 125 can shape the beam shape by bending or superimposing the parallel beams in the direction affected by each diffraction grating 125a.
  • the laser light is split into a plurality of beams in the optical head 120.
  • a laser beam L having a plurality of beams is output from the optical head 120, and a plurality of spots are formed on the surface Wa by the plurality of beams.
  • the spots may be separated from each other, or may be connected to each other.
  • FIG. 3 is a schematic configuration diagram of an example of the light emitting device 110. As shown in FIG.
  • the light emitting device 110 has a plurality of light source devices 10 , a plurality of output optical fibers 11 and an optical multiplexing coupler 12 .
  • the light source device 10 can also be called a laser oscillator. Moreover, the light source device 10 of FIG. 3 is, as an example, a CW laser capable of continuously outputting laser light.
  • the light source device 10 is an optical fiber laser and includes a plurality of semiconductor excitation light sources 1, a plurality of optical fibers 2, an optical multiplexer 3, a fiber Bragg grating (FBG) 4, an amplification optical fiber 5, a plurality of , an FBG 7 , an optical multiplexer 8 , and a plurality of optical fibers 9 . Each element is appropriately connected by an optical fiber.
  • FBG fiber Bragg grating
  • the pumping light has a wavelength capable of optically pumping the amplification optical fiber 5, for example, a wavelength of 915 [nm].
  • a plurality of optical fibers 2 each propagate the pumping light output from each semiconductor pumping light source 1 and output it to the optical multiplexer 3 .
  • the optical multiplexer 3 is configured as a TFB (tapered fiber bundle) in this embodiment.
  • the optical multiplexer 3 multiplexes the pumping light input from each optical fiber 2 with the optical fiber of the signal light port and outputs it to the amplification optical fiber 5 .
  • the amplifying optical fiber 5 is a YDF (ytterbium doped fiber) in which ytterbium (Yb) ions, which are amplification substances, are added to the core made of silica glass, and the outer periphery of the core is made of silica glass. It is a double-clad optical fiber in which an inner clad layer and an outer clad layer made of resin or the like are sequentially formed.
  • the core portion of the amplification optical fiber 5 has an NA of, for example, 0.08, and is configured to propagate light emitted from Yb ions, for example, light with a wavelength of 1070 [nm], in a single mode.
  • the absorption coefficient of the core portion of the amplification optical fiber 5 is, for example, 200 [dB/m] at a wavelength of 915 [nm]. Also, the power conversion efficiency from pumping light input to the core portion to laser oscillation light is, for example, 70%.
  • the FBG 4 as the rear end side reflection means is connected between the optical fiber of the signal light port of the optical multiplexer 3 and the amplification optical fiber 5 .
  • the FBG 4 has a central wavelength of, for example, 1070 [nm], a reflectance of about 100% in a wavelength band of about 2 [nm] width around the central wavelength and its surroundings, and almost transmits light with a wavelength of 915 [nm]. do.
  • the FBG 7, which is the output-side reflecting means is connected between the optical fiber of the signal light port of the optical multiplexer 8 and the amplification optical fiber 5.
  • FBG7 has a center wavelength substantially the same as that of FBG4, for example 1070 [nm], has a reflectance of about 10% to 30% at the center wavelength, and has a full width at half maximum of the reflection wavelength band of about 1 [nm], Light with a wavelength of 915 [nm] is almost transmitted.
  • the FBGs 4 and 7 are arranged at both ends of the amplification optical fiber 5, respectively, and form optical fiber resonators for light with a wavelength of 1070 [nm].
  • the pumping light has a wavelength capable of optically pumping the amplification optical fiber 5, for example, a wavelength of 915 [nm].
  • a plurality of optical fibers 9 propagate the pumping light output from each semiconductor pumping light source 6 and output it to the optical multiplexer 8 .
  • the optical multiplexer 8 like the optical multiplexer 3, is composed of a TFB in this embodiment.
  • the optical multiplexer 8 multiplexes the pumping light input from each optical fiber 9 to the optical fiber of the signal light port, and outputs the result to the amplification optical fiber 5 .
  • the amplification optical fiber 5 emits light in a band including a wavelength of 1070 [nm] by optically exciting the Yb ions in the core portion with the pumping light.
  • Light with a wavelength of 1070 [nm] causes laser oscillation due to the optical amplification action of the amplification optical fiber 5 and the action of the optical resonator constituted by the FBGs 4 and 7 .
  • the output optical fiber 11 is arranged on the opposite side of the optical multiplexer 8 from the FBG 7 and connected to the optical fiber of the signal light port of the optical multiplexer 8 .
  • the oscillated laser light (laser oscillation light) is output from the output optical fiber 11 .
  • the laser beams output from the plurality of light source devices 10 are input to the optical multiplexing coupler 12 via the output optical fiber 11, multiplexed by the optical multiplexing coupler 12, and transmitted via the delivery optical fiber 130 to the optical head. 120.
  • FIG. 4 is a diagram showing an example of a pattern of spots Ls formed on the surface Wa. As shown in FIG. 4, a plurality of spots Ls of the laser light L are formed on the surface Wa. As mentioned above, laser light L includes multiple beams split by a beam shaper such as DOE 125 . The spots Ls correspond to beams included in the laser light L, respectively.
  • a plurality of spots Ls are arranged to form one row extending in the Y direction.
  • a plurality of spots Ls are arranged at regular intervals Di in the Y direction.
  • the interval Di is an example of the arrangement interval.
  • the optical head 120 removes the surface layer of the object W by scanning in the X direction with a plurality of spots Ls arranged in the Y direction on the surface Wa as shown in FIG. As a result, the surface layer can be removed over a wider width than in the case of repeatedly scanning one small spot Ls, so that the number of times of scanning can be reduced and the processing time can be shortened.
  • the Y direction is an example of a first direction
  • the X direction is an example of a second direction.
  • FIG. 5 shows the removal area Ab formed on the surface Wa when the spot Ls in FIG. 4 is scanned alone in the X direction under the same irradiation conditions as the irradiation in FIG.
  • the removed area Ab is an area where the surface layer is removed by irradiation and scanning of the spot Ls.
  • FIG. 5 when scanning is performed while irradiating the spot Ls alone, a band-shaped removal area Ab extending in the X direction with a substantially constant width in the Y direction is formed on the surface Wa.
  • the width wb of the removal region Ab is larger than the diameter Ds (width) of the spot Ls. Become.
  • the interval Di ( 4) is set equal to or less than the width wb (FIG. 5) of the removal area Ab. If the interval Di is larger than the width wb, there will be a region where the surface layer is not removed between the removal regions Ab corresponding to the spots Ls adjacent to each other in the Y direction. In this regard, if the interval Di is set to be equal to or less than the width wb as in the present embodiment, the removal regions Ab corresponding to the spots Ls adjacent to each other in the Y direction are in contact with each other or overlap each other. does not occur.
  • FIG. 6 is a diagram showing another example (modification) of the pattern of the spots Ls formed on the surface Wa.
  • the plurality of spots Ls are arranged on the surface Wa to form a plurality of rows extending in the Y direction.
  • the multiple columns are offset in the X direction.
  • the spots Ls are alternately arranged in two rows adjacent to each other in the X direction. That is, the two rows are a first row in which the spots Ls are spaced apart in the Y direction, and a position in which the spots Ls are spaced apart in the Y direction and different from the first row in the Y direction. and a second column aligned with .
  • the interval Di between the plurality of spots Ls in the Y direction is equal to or less than the width wb of the removal region Ab, as in the case of the examples of FIGS. set.
  • the density of the spots Ls on the surface Wa can be reduced, and an excessive local temperature rise can be suppressed.
  • the inventors have found through experimental research that when scanning a plurality of spots Ls on the surface Wa, if there is a large variation in intensity among the spots Ls, the degree of removal of the surface layer varies depending on the location in the removal area. As a result, it was found that unevenness in the treatment state, that is, a difference in the removal state of rust and coatings, and unevenness in the body (base material). From this point of view, the ratio of the intensity of the spot Ls having the minimum intensity among the plurality of spots Ls to the intensity of the spot Ls having the maximum intensity is preferably 0.8 or more, and is 0.9 or more. was found to be more preferable.
  • FIG. 7 is a plan view (photographic image) showing an example of a rectangular removal area Ab formed using the surface removal apparatus 100 of the present embodiment.
  • the removal area Ab in FIG. 7 was formed by scanning the spot pattern shown in FIG. 6 multiple times in the X direction while shifting the position in the Y direction.
  • the total length (width) of the spot pattern in the Y direction was 2.6 [mm]
  • the removal area Ab was a rectangular area of 30 [mm] ⁇ 30 [mm].
  • the output of the laser light L was 500 [W]
  • the scanning speed was 0.5 [m/s].
  • the removal area Ab in FIG. 7 could be formed in 0.9 [sec] (required time).
  • FIG. 8 is a plan view (photographic image) of the removal area Abr of the reference example.
  • the removal area Abr in FIG. 8 was formed by scanning a point-like spot enlarged by defocusing a plurality of times in the X direction while shifting the position in the Y direction.
  • the diameter of the dot-like spot was 3 [mm]
  • the size of the removal area Abr was substantially the same as the removal area Ab in the case of FIG.
  • the output of the laser light L was 500 [W]
  • the scanning speed was 0.1 [m/s].
  • the optical head 120 uses a beam shaper such as the DOE 125 to generate a plurality of spots Ls with small variations in intensity and with an appropriately adjusted interval Di from high-quality laser light transmitted by the delivery optical fiber 130. , and scanning the plurality of spots Ls.
  • a beam shaper such as the DOE 125 to generate a plurality of spots Ls with small variations in intensity and with an appropriately adjusted interval Di from high-quality laser light transmitted by the delivery optical fiber 130.
  • the surface layer was not removed.
  • the intensity of the spot Ls was 25 [J/cm 2 ] or more and less than 3.8 ⁇ 10 4 [J/cm 2 ]
  • the surface layer was preferably removed.
  • the intensity of the spot Ls was 3.8 ⁇ 10 4 [J/cm 2 ] or more, a melt trace Am of the melted material appeared on the surface Wa.
  • the body (base material) of the object W is made of steel plate, for example.
  • the thickness of the rust layer is, for example, 400 [ ⁇ m].
  • the material of the base material and the thickness of the rust layer are not limited to these.
  • the strength of the spot Ls is 1.2 ⁇ 10 4 [J/cm 2 ] or more and 5.7 ⁇ 10 5 [J/cm 2 ] or more. /cm 2 ].
  • 12 to 14 are plan views (photographic images) of the surface Wa scanned with one spot Ls.
  • FIG. 12 shows that when the intensity is less than 0.5 ⁇ 10 4 [J/cm 2 ], that is, 1.2 ⁇ 10 4 [J/cm 2 ], FIG . J/cm 2 ], that is, 1.2 ⁇ 10 4 [J/cm 2 ] or more and less than 5.7 ⁇ 10 5 [J/cm 2 ].
  • the intensity of the spot Ls is greater than 5.3 ⁇ 10 2 [J/cm 2 ] and 1.3 ⁇ 10 5 [J/cm 2 ]. /cm 2 ].
  • 15 to 18 are plan views (photographic images) of the same sample of the metal plate having the double coating film, scanned with the laser light spot Ls at different intensities.
  • the first layer 202 (coating film) is applied on the surface of the base material 201 (metal plate), and the second layer 203 (coating film) is applied on the first layer 202. ing.
  • the base material 201 is made of, for example, a steel plate
  • the first layer 202 is made of, for example, epoxy resin paint
  • the second layer 203 is made of, for example, acrylic resin paint.
  • the thickness of the first layer 202 is, for example, 300 [ ⁇ m]
  • the thickness of the second layer 203 is, for example, 100 [ ⁇ m].
  • the material and thickness of the base material 201, the first layer 202, and the second layer 203 are not limited to these.
  • FIG. 15 shows the case where the intensity is 5.3 ⁇ 10 2 [J/cm 2 ]
  • FIG. 16 shows the case where the intensity is 1.5 ⁇ 10 4 [J/cm 2 ]. .
  • FIG. 15 shows the case where the intensity is 5.3 ⁇ 10 2 [J/cm 2 ]
  • FIG. 16 shows the case where the intensity is 1.5 ⁇ 10 4 [J/cm 2 ]. .
  • FIG. 15 shows the case where the intensity is 5.3 ⁇ 10 2 [J/cm 2 ]
  • FIG. 16
  • the second layer 203 is thinly removed in the area A1 irradiated with the spot Ls.
  • the dirt D remains locally in the region A1, which is insufficient (insufficient strength) for cleaning.
  • the second layer 203 is removed in the area A1 irradiated with the spot Ls, and the first layer 202 is exposed.
  • This is unsuitable (too strong) for cleaning. That is, when performing cleaning to remove dirt from the surface, the strength is preferably greater than 5.3 ⁇ 10 2 [J/cm 2 ] and less than 1.5 ⁇ 10 4 [J/cm 2 ].
  • FIG. 17 shows the case where the intensity is 3.1 ⁇ 10 4 [J/cm 2 ], and FIG.
  • FIG. 17 shows a good state in which the second layer 203 is removed and the base material 201 is exposed in the area A1 irradiated with the spot Ls.
  • the novel surface layer removal method and surface layer removal method are further improved, such that, for example, variations in the processing state depending on the location can be reduced, and the processing time can be shortened.
  • a device 100 can be obtained.
  • the present invention can be used for a surface layer removing method and a surface layer removing apparatus.
  • Second layer (coating film) A1 Area Ab Area to be removed Ab1 Contour Abr Area to be removed Abr1 Contour Ag Vitrified area Am Melting mark D Di Interval (arrangement interval) Ds ... diameter (width) L... Laser beam Ls... Spot W... Object (processing object) Wa... surface wb... width X... direction (second direction) Y... direction (first direction) Z direction

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
PCT/JP2022/031760 2021-08-23 2022-08-23 表層除去方法および表層除去装置 Ceased WO2023027080A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023542938A JP7464802B2 (ja) 2021-08-23 2022-08-23 表層除去方法および表層除去装置
JP2024051134A JP2024074841A (ja) 2021-08-23 2024-03-27 表層除去方法および表層除去装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021135601 2021-08-23
JP2021-135601 2021-08-23

Publications (1)

Publication Number Publication Date
WO2023027080A1 true WO2023027080A1 (ja) 2023-03-02

Family

ID=85322861

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/031760 Ceased WO2023027080A1 (ja) 2021-08-23 2022-08-23 表層除去方法および表層除去装置

Country Status (2)

Country Link
JP (2) JP7464802B2 (https=)
WO (1) WO2023027080A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5650583U (https=) * 1979-09-27 1981-05-06
JP2003039188A (ja) * 2001-07-24 2003-02-12 Taiyo Yuden Co Ltd レーザー加工方法及びレーザー加工装置
JP2004268144A (ja) * 2003-02-21 2004-09-30 Seishin Shoji Kk レーザ加工装置
WO2012165389A1 (ja) * 2011-05-31 2012-12-06 古河電気工業株式会社 レーザ装置および加工装置
WO2019189927A1 (ja) * 2018-03-30 2019-10-03 古河電気工業株式会社 溶接方法および溶接装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5650583U (https=) * 1979-09-27 1981-05-06
JP2003039188A (ja) * 2001-07-24 2003-02-12 Taiyo Yuden Co Ltd レーザー加工方法及びレーザー加工装置
JP2004268144A (ja) * 2003-02-21 2004-09-30 Seishin Shoji Kk レーザ加工装置
WO2012165389A1 (ja) * 2011-05-31 2012-12-06 古河電気工業株式会社 レーザ装置および加工装置
WO2019189927A1 (ja) * 2018-03-30 2019-10-03 古河電気工業株式会社 溶接方法および溶接装置

Also Published As

Publication number Publication date
JPWO2023027080A1 (https=) 2023-03-02
JP7464802B2 (ja) 2024-04-09
JP2024074841A (ja) 2024-05-31

Similar Documents

Publication Publication Date Title
KR102662495B1 (ko) 공작물의 레이저 가공 방법, 광학 가공 시스템 및 레이저 가공 장치
KR100825701B1 (ko) 레이저 어닐링 장치
JP4344224B2 (ja) 光学マスクおよびｍｏｐａレーザ装置
JP7793666B2 (ja) 溶接方法および溶接装置
JP6114431B1 (ja) レーザ加工機
EP3308896B1 (en) Laser machining apparatus
WO2003076150A1 (en) Method and system for machining fragile material
JP2024020355A (ja) レーザー送達アドレス指定可能アレイのための用途、方法、及びシステム
JP3751970B2 (ja) レーザ加工装置
JP2017185543A (ja) レーザ加工機
WO2023027080A1 (ja) 表層除去方法および表層除去装置
JP7328456B2 (ja) 金属箔のレーザ切断方法
JP2014013833A (ja) レーザ光整形装置およびレーザ光整形方法ならびにレーザ処理装置およびレーザ処理方法
JP2005109359A (ja) レーザ装置及び液晶表示装置の製造方法
JP2007102058A (ja) レーザ光の導光構造
JP6628777B2 (ja) 反射鏡、ファイバ共振器、およびファイバレーザ
WO2019225174A1 (ja) 加工ヘッド
JP3867108B2 (ja) レーザ加工装置
JP2012003131A (ja) レーザ照射装置
JP2001276985A (ja) マーキング方法、装置及びマーキングされた光学部材
JP6197084B2 (ja) レーザ加工機
JP2011023408A (ja) レーザ装置及びレーザ光の調整方法
JP2017181777A (ja) 透明光学材料の改質方法、光デバイス、光デバイスの製造方法、及び光デバイスの製造装置
US20250093738A1 (en) Guidance system for a laser beam
US20240230983A1 (en) System and method for fabricating multiplexable active optical fiber sensors

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22861368

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2023542938

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 22861368

Country of ref document: EP

Kind code of ref document: A1