JP7464802B2 - 表層除去方法および表層除去装置 - Google Patents

表層除去方法および表層除去装置 Download PDF

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Publication number
JP7464802B2
JP7464802B2 JP2023542938A JP2023542938A JP7464802B2 JP 7464802 B2 JP7464802 B2 JP 7464802B2 JP 2023542938 A JP2023542938 A JP 2023542938A JP 2023542938 A JP2023542938 A JP 2023542938A JP 7464802 B2 JP7464802 B2 JP 7464802B2
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Japan
Prior art keywords
surface layer
spots
layer removal
spot
optical fiber
Prior art date
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Active
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JP2023542938A
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English (en)
Japanese (ja)
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JPWO2023027080A1 (https=
JPWO2023027080A5 (https=
Inventor
諒介 西井
由博 西潟
和行 梅野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of JPWO2023027080A1 publication Critical patent/JPWO2023027080A1/ja
Publication of JPWO2023027080A5 publication Critical patent/JPWO2023027080A5/ja
Priority to JP2024051134A priority Critical patent/JP2024074841A/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2023542938A 2021-08-23 2022-08-23 表層除去方法および表層除去装置 Active JP7464802B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024051134A JP2024074841A (ja) 2021-08-23 2024-03-27 表層除去方法および表層除去装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021135601 2021-08-23
JP2021135601 2021-08-23
PCT/JP2022/031760 WO2023027080A1 (ja) 2021-08-23 2022-08-23 表層除去方法および表層除去装置

Related Child Applications (1)

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JP2024051134A Division JP2024074841A (ja) 2021-08-23 2024-03-27 表層除去方法および表層除去装置

Publications (3)

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JPWO2023027080A1 JPWO2023027080A1 (https=) 2023-03-02
JPWO2023027080A5 JPWO2023027080A5 (https=) 2023-09-14
JP7464802B2 true JP7464802B2 (ja) 2024-04-09

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ID=85322861

Family Applications (2)

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JP2023542938A Active JP7464802B2 (ja) 2021-08-23 2022-08-23 表層除去方法および表層除去装置
JP2024051134A Pending JP2024074841A (ja) 2021-08-23 2024-03-27 表層除去方法および表層除去装置

Family Applications After (1)

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JP2024051134A Pending JP2024074841A (ja) 2021-08-23 2024-03-27 表層除去方法および表層除去装置

Country Status (2)

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JP (2) JP7464802B2 (https=)
WO (1) WO2023027080A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003039188A (ja) 2001-07-24 2003-02-12 Taiyo Yuden Co Ltd レーザー加工方法及びレーザー加工装置
JP2004268144A (ja) 2003-02-21 2004-09-30 Seishin Shoji Kk レーザ加工装置
WO2012165389A1 (ja) 2011-05-31 2012-12-06 古河電気工業株式会社 レーザ装置および加工装置
WO2019189927A1 (ja) 2018-03-30 2019-10-03 古河電気工業株式会社 溶接方法および溶接装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6121193Y2 (https=) * 1979-09-27 1986-06-25

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003039188A (ja) 2001-07-24 2003-02-12 Taiyo Yuden Co Ltd レーザー加工方法及びレーザー加工装置
JP2004268144A (ja) 2003-02-21 2004-09-30 Seishin Shoji Kk レーザ加工装置
WO2012165389A1 (ja) 2011-05-31 2012-12-06 古河電気工業株式会社 レーザ装置および加工装置
WO2019189927A1 (ja) 2018-03-30 2019-10-03 古河電気工業株式会社 溶接方法および溶接装置

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Publication number Publication date
JPWO2023027080A1 (https=) 2023-03-02
JP2024074841A (ja) 2024-05-31
WO2023027080A1 (ja) 2023-03-02

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