WO2023008279A1 - 積層物の製造方法 - Google Patents
積層物の製造方法 Download PDFInfo
- Publication number
- WO2023008279A1 WO2023008279A1 PCT/JP2022/028199 JP2022028199W WO2023008279A1 WO 2023008279 A1 WO2023008279 A1 WO 2023008279A1 JP 2022028199 W JP2022028199 W JP 2022028199W WO 2023008279 A1 WO2023008279 A1 WO 2023008279A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal
- particles
- laminate
- substrate
- assembly layer
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 54
- 229910052751 metal Inorganic materials 0.000 claims abstract description 332
- 239000002184 metal Substances 0.000 claims abstract description 332
- 239000000758 substrate Substances 0.000 claims abstract description 127
- 238000007747 plating Methods 0.000 claims abstract description 66
- 150000001768 cations Chemical class 0.000 claims abstract description 54
- 239000002245 particle Substances 0.000 claims description 435
- 239000010410 layer Substances 0.000 claims description 146
- 239000011241 protective layer Substances 0.000 claims description 75
- 239000000463 material Substances 0.000 claims description 69
- 239000003638 chemical reducing agent Substances 0.000 claims description 58
- 238000000034 method Methods 0.000 claims description 40
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 27
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical group N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 20
- 239000011810 insulating material Substances 0.000 claims description 17
- 239000008139 complexing agent Substances 0.000 claims description 12
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims description 10
- 229910021529 ammonia Inorganic materials 0.000 claims description 10
- 239000008103 glucose Substances 0.000 claims description 10
- 239000000377 silicon dioxide Substances 0.000 claims description 10
- 238000003980 solgel method Methods 0.000 claims description 10
- 230000009467 reduction Effects 0.000 claims description 7
- 230000033116 oxidation-reduction process Effects 0.000 claims description 6
- 150000001412 amines Chemical class 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 230000005484 gravity Effects 0.000 claims description 3
- 229910052681 coesite Inorganic materials 0.000 claims description 2
- 229910052906 cristobalite Inorganic materials 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims description 2
- 125000002791 glucosyl group Chemical group C1([C@H](O)[C@@H](O)[C@H](O)[C@H](O1)CO)* 0.000 claims description 2
- 229910052682 stishovite Inorganic materials 0.000 claims description 2
- 229910052905 tridymite Inorganic materials 0.000 claims description 2
- 239000013528 metallic particle Substances 0.000 abstract description 31
- 239000007788 liquid Substances 0.000 abstract description 27
- 239000000243 solution Substances 0.000 description 126
- 239000000126 substance Substances 0.000 description 60
- 238000005259 measurement Methods 0.000 description 30
- 238000003756 stirring Methods 0.000 description 22
- 238000001878 scanning electron micrograph Methods 0.000 description 20
- 230000000694 effects Effects 0.000 description 19
- 239000007864 aqueous solution Substances 0.000 description 18
- 238000006243 chemical reaction Methods 0.000 description 18
- 239000000523 sample Substances 0.000 description 18
- 229910052709 silver Inorganic materials 0.000 description 17
- 239000004332 silver Substances 0.000 description 17
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 15
- 230000002708 enhancing effect Effects 0.000 description 14
- 238000004020 luminiscence type Methods 0.000 description 14
- 239000000843 powder Substances 0.000 description 14
- 239000002904 solvent Substances 0.000 description 14
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 13
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 13
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 11
- 238000007654 immersion Methods 0.000 description 11
- 239000011521 glass Substances 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 238000001514 detection method Methods 0.000 description 9
- 230000005284 excitation Effects 0.000 description 9
- 239000002923 metal particle Substances 0.000 description 9
- PYWVYCXTNDRMGF-UHFFFAOYSA-N rhodamine B Chemical compound [Cl-].C=12C=CC(=[N+](CC)CC)C=C2OC2=CC(N(CC)CC)=CC=C2C=1C1=CC=CC=C1C(O)=O PYWVYCXTNDRMGF-UHFFFAOYSA-N 0.000 description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 8
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 229940043267 rhodamine b Drugs 0.000 description 8
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 8
- 239000006228 supernatant Substances 0.000 description 8
- 229910004298 SiO 2 Inorganic materials 0.000 description 7
- 238000000862 absorption spectrum Methods 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 6
- 230000009471 action Effects 0.000 description 6
- 239000012295 chemical reaction liquid Substances 0.000 description 6
- 238000001465 metallisation Methods 0.000 description 6
- 239000002777 nucleoside Substances 0.000 description 6
- 125000003729 nucleotide group Chemical group 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 238000007740 vapor deposition Methods 0.000 description 6
- 238000002835 absorbance Methods 0.000 description 5
- 239000002773 nucleotide Substances 0.000 description 5
- 230000035945 sensitivity Effects 0.000 description 5
- 239000012798 spherical particle Substances 0.000 description 5
- 235000000346 sugar Nutrition 0.000 description 5
- 101710134784 Agnoprotein Proteins 0.000 description 4
- 108020004414 DNA Proteins 0.000 description 4
- 241000209094 Oryza Species 0.000 description 4
- 235000007164 Oryza sativa Nutrition 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 239000011324 bead Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 239000007771 core particle Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000000706 filtrate Substances 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- -1 nucleoside phosphate ester Chemical class 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 235000009566 rice Nutrition 0.000 description 4
- 229910001961 silver nitrate Inorganic materials 0.000 description 4
- 229910021642 ultra pure water Inorganic materials 0.000 description 4
- 239000012498 ultrapure water Substances 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 241000700605 Viruses Species 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000027455 binding Effects 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000007850 fluorescent dye Substances 0.000 description 3
- 230000036541 health Effects 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- 108020004707 nucleic acids Proteins 0.000 description 3
- 150000007523 nucleic acids Chemical class 0.000 description 3
- 102000039446 nucleic acids Human genes 0.000 description 3
- 125000003835 nucleoside group Chemical group 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 108090000623 proteins and genes Proteins 0.000 description 3
- 102000004169 proteins and genes Human genes 0.000 description 3
- 238000011002 quantification Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 2
- 102000003886 Glycoproteins Human genes 0.000 description 2
- 108090000288 Glycoproteins Proteins 0.000 description 2
- 102000004856 Lectins Human genes 0.000 description 2
- 108090001090 Lectins Proteins 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 150000004703 alkoxides Chemical class 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 210000004027 cell Anatomy 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000003574 free electron Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000002372 labelling Methods 0.000 description 2
- 239000002523 lectin Substances 0.000 description 2
- 239000003550 marker Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 150000003833 nucleoside derivatives Chemical class 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000009870 specific binding Effects 0.000 description 2
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 2
- 150000008163 sugars Chemical class 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- JLQFVGYYVXALAG-CFEVTAHFSA-N yasmin 28 Chemical compound OC1=CC=C2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1.C([C@]12[C@H]3C[C@H]3[C@H]3[C@H]4[C@@H]([C@]5(CCC(=O)C=C5[C@@H]5C[C@@H]54)C)CC[C@@]31C)CC(=O)O2 JLQFVGYYVXALAG-CFEVTAHFSA-N 0.000 description 2
- KDCGOANMDULRCW-UHFFFAOYSA-N 7H-purine Chemical compound N1=CNC2=NC=NC2=C1 KDCGOANMDULRCW-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 238000004438 BET method Methods 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 238000000018 DNA microarray Methods 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 108091034117 Oligonucleotide Proteins 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- CZPWVGJYEJSRLH-UHFFFAOYSA-N Pyrimidine Chemical compound C1=CN=CN=C1 CZPWVGJYEJSRLH-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004541 SiN Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- JLCPHMBAVCMARE-UHFFFAOYSA-N [3-[[3-[[3-[[3-[[3-[[3-[[3-[[3-[[3-[[3-[[3-[[5-(2-amino-6-oxo-1H-purin-9-yl)-3-[[3-[[3-[[3-[[3-[[3-[[5-(2-amino-6-oxo-1H-purin-9-yl)-3-[[5-(2-amino-6-oxo-1H-purin-9-yl)-3-hydroxyoxolan-2-yl]methoxy-hydroxyphosphoryl]oxyoxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(5-methyl-2,4-dioxopyrimidin-1-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(6-aminopurin-9-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(6-aminopurin-9-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(6-aminopurin-9-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(6-aminopurin-9-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxyoxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(5-methyl-2,4-dioxopyrimidin-1-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(4-amino-2-oxopyrimidin-1-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(5-methyl-2,4-dioxopyrimidin-1-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(5-methyl-2,4-dioxopyrimidin-1-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(6-aminopurin-9-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(6-aminopurin-9-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(4-amino-2-oxopyrimidin-1-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(4-amino-2-oxopyrimidin-1-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(4-amino-2-oxopyrimidin-1-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(6-aminopurin-9-yl)oxolan-2-yl]methoxy-hydroxyphosphoryl]oxy-5-(4-amino-2-oxopyrimidin-1-yl)oxolan-2-yl]methyl [5-(6-aminopurin-9-yl)-2-(hydroxymethyl)oxolan-3-yl] hydrogen phosphate Polymers Cc1cn(C2CC(OP(O)(=O)OCC3OC(CC3OP(O)(=O)OCC3OC(CC3O)n3cnc4c3nc(N)[nH]c4=O)n3cnc4c3nc(N)[nH]c4=O)C(COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3COP(O)(=O)OC3CC(OC3CO)n3cnc4c(N)ncnc34)n3ccc(N)nc3=O)n3cnc4c(N)ncnc34)n3ccc(N)nc3=O)n3ccc(N)nc3=O)n3ccc(N)nc3=O)n3cnc4c(N)ncnc34)n3cnc4c(N)ncnc34)n3cc(C)c(=O)[nH]c3=O)n3cc(C)c(=O)[nH]c3=O)n3ccc(N)nc3=O)n3cc(C)c(=O)[nH]c3=O)n3cnc4c3nc(N)[nH]c4=O)n3cnc4c(N)ncnc34)n3cnc4c(N)ncnc34)n3cnc4c(N)ncnc34)n3cnc4c(N)ncnc34)O2)c(=O)[nH]c1=O JLCPHMBAVCMARE-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 235000010323 ascorbic acid Nutrition 0.000 description 1
- 229960005070 ascorbic acid Drugs 0.000 description 1
- 239000011668 ascorbic acid Substances 0.000 description 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000009849 deactivation Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000009881 electrostatic interaction Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 210000001808 exosome Anatomy 0.000 description 1
- 238000000684 flow cytometry Methods 0.000 description 1
- 238000002073 fluorescence micrograph Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 229930182470 glycoside Natural products 0.000 description 1
- 125000003563 glycoside group Chemical group 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 150000004694 iodide salts Chemical class 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002082 metal nanoparticle Substances 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 238000002493 microarray Methods 0.000 description 1
- 239000002121 nanofiber Substances 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 108091033319 polynucleotide Proteins 0.000 description 1
- 239000002157 polynucleotide Substances 0.000 description 1
- 102000040430 polynucleotide Human genes 0.000 description 1
- 230000006916 protein interaction Effects 0.000 description 1
- 239000002213 purine nucleotide Substances 0.000 description 1
- 150000003212 purines Chemical class 0.000 description 1
- 239000002719 pyrimidine nucleotide Substances 0.000 description 1
- 150000003230 pyrimidines Chemical class 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 1
- 235000019345 sodium thiosulphate Nutrition 0.000 description 1
- 238000002798 spectrophotometry method Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-L succinate(2-) Chemical compound [O-]C(=O)CCC([O-])=O KDYFGRWQOYBRFD-UHFFFAOYSA-L 0.000 description 1
- 229960002317 succinimide Drugs 0.000 description 1
- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 description 1
- 238000009210 therapy by ultrasound Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/16—Metallic particles coated with a non-metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/18—Non-metallic particles coated with metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C20/00—Chemical coating by decomposition of either solid compounds or suspensions of the coating forming compounds, without leaving reaction products of surface material in the coating
- C23C20/06—Coating with inorganic material, other than metallic material
- C23C20/08—Coating with inorganic material, other than metallic material with compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/02—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using non-aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/41—Refractivity; Phase-affecting properties, e.g. optical path length
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/64—Fluorescence; Phosphorescence
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/48—Biological material, e.g. blood, urine; Haemocytometers
- G01N33/50—Chemical analysis of biological material, e.g. blood, urine; Testing involving biospecific ligand binding methods; Immunological testing
- G01N33/53—Immunoassay; Biospecific binding assay; Materials therefor
- G01N33/531—Production of immunochemical test materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/48—Biological material, e.g. blood, urine; Haemocytometers
- G01N33/50—Chemical analysis of biological material, e.g. blood, urine; Testing involving biospecific ligand binding methods; Immunological testing
- G01N33/53—Immunoassay; Biospecific binding assay; Materials therefor
- G01N33/543—Immunoassay; Biospecific binding assay; Materials therefor with an insoluble carrier for immobilising immunochemicals
- G01N33/54313—Immunoassay; Biospecific binding assay; Materials therefor with an insoluble carrier for immobilising immunochemicals the carrier being characterised by its particulate form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
- B22F2301/255—Silver or gold
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2302/00—Metal Compound, non-Metallic compound or non-metal composition of the powder or its coating
- B22F2302/25—Oxide
- B22F2302/256—Silicium oxide (SiO2)
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/64—Fluorescence; Phosphorescence
- G01N21/6428—Measuring fluorescence of fluorescent products of reactions or of fluorochrome labelled reactive substances, e.g. measuring quenching effects, using measuring "optrodes"
Definitions
- the present invention relates to a method for manufacturing laminates.
- Non-Patent Document 1 shows research on localized plasmon resonance by silver nanoparticles.
- An object of the present invention is to provide a new method for manufacturing a structure comprising an aggregate of metallic particles.
- the present invention provides a method for manufacturing a laminate shown below.
- a substrate having a three-dimensional surface A metal-based particle assembly layer, which is a layer arranged on the three-dimensional surface and contains a plurality of metal-based particles arranged with a space from each other;
- a method of manufacturing a laminate comprising
- the metal-based particle assembly layer is formed on the three-dimensional surface by reducing the cations while the substrate is immersed in a plating solution containing metal cations constituting the metal-based particles. including the process,
- the manufacturing method wherein the ratio V S /V L of the volume V S [cm 3 ] of the substrate to the volume V L [cm 3 ] of the plating solution is 0.03 or less.
- the plurality of metal-based particles are arranged so that the average distance between the adjacent metal-based particles is 1 nm or more and 150 nm or less.
- the average height growth rate of the metal-based particles is 6 nm/min or less after 28 minutes from the start of deposition of the metal on the three-dimensional surface.
- X is represented by the following formula when the particles are amorphous. (Wherein, a, V, D and C have the same meanings as above.
- [12] Further comprising a step of forming a protective layer made of an insulating material on the metal-based particle assembly layer after the step of forming the metal-based particle assembly layer, [1] to [11]
- the manufacturing method according to any one of. [13] The manufacturing method according to [12], wherein the protective layer is formed by a sol-gel method.
- the protective layer has a thickness of 300 nm or less.
- FIG. 3 is a cross-sectional view schematically showing another example of a laminate
- FIG. 2 is a cross-sectional view schematically showing an example of a sensor element
- 1 is an SEM image (6000-fold scale) of the laminate obtained in Example 1.
- FIG. 1 is an SEM image (35000-fold scale) of the laminate obtained in Example 1.
- FIG. 4 is an SEM image (20000-fold scale) of the laminate obtained in Example 2.
- FIG. 4 is an image obtained by fluorescence intensity measurement for measurement sample 1.
- FIG. 3 is a cross-sectional view schematically showing another example of a laminate
- FIG. 2 is a cross-sectional view schematically showing an example of a sensor element
- 1 is an SEM image (6000-fold scale) of the laminate obtained in Example 1.
- FIG. 1 is an SEM image (35000-fold scale) of the laminate obtained in Example 1.
- FIG. 4 is an SEM image (20000-fold scale) of the laminate obtained in Example 2.
- FIG. 4 is an image obtained by fluorescence
- FIG. 4 is an image obtained by fluorescence intensity measurement for measurement sample 2.
- FIG. 4 is an SEM image (7000-fold scale) of the laminate containing the protective layer obtained in Example 3.
- FIG. 3 is an SEM image (30,000-fold scale) of a laminate containing a protective layer obtained in Example 3.
- FIG. 4 is a STEM cross-sectional image (100,000-fold scale) of the laminate containing the protective layer obtained in Example 3.
- FIG. 2 is an SEM image (90000-fold scale) of the laminate obtained in Example 5.
- FIG. 2 is an SEM image (20000-fold scale) of the laminate obtained in Example 6.
- FIG. 10 is an SEM image (30,000-fold scale) of the laminate containing the protective layer obtained in Example 7.
- FIG. 10 is an SEM image (35,000-fold scale) of the laminate containing the protective layer obtained in Example 8.
- FIG. 10 is an SEM image (35,000-fold scale) of the laminate containing the protective layer obtained in Example 9.
- FIG. 10 is an SEM image (35,000-fold scale
- the term “laminate” refers to a base material having a three-dimensional surface, a layer arranged on the three-dimensional surface, and a plurality of metal-based particles (made of metal It refers to a laminated structure comprising a metal-based particle assembly layer containing particles).
- the laminated structure may contain layers other than those described above.
- a "three-dimensional surface" of a substrate means a three-dimensional surface, an example of which is a curved surface.
- FIG. 1 is a plan view schematically showing an example of a laminate
- FIG. 2 is a cross-sectional view schematically showing an example of a laminate
- the base material 10 having a three-dimensional surface is a particulate base material (core particles) whose entire base surface is curved.
- the laminate 1 shown in FIGS. 1 and 2 includes a substrate 10 (core particles) having a three-dimensional surface, and a metal-based particle assembly arranged on at least a part (preferably the entire surface) of the three-dimensional surface of the substrate 10. and a body layer.
- the metal-based particle assembly layer is an aggregate of a plurality of metal-based particles 20 supported on the base material 10, and is a layer composed of a plurality of metal-based particles 20 arranged apart from each other.
- the metal-based particle assembly layer is arranged over the entire three-dimensional surface of the base material 10 .
- the plurality of metal-based particles 20 constituting the metal-based particle assembly layer are separated from each other, there is a region in which the metal-based particle assembly layer does not contain the metal-based particles 20. In this region, the base material 10 surfaces are exposed.
- metal cations constituting metal particles (hereinafter also referred to as "metal cations") are immersed in a plating solution containing metal particles, and the cations are reduced to aggregate the metal particles.
- a step of forming a body layer on the three-dimensional surface of the substrate (metal-based particle assembly layer forming step) is included.
- the method for producing a laminate may further include a step of forming a protective layer composed of an insulating material on the metallic particle assembly layer (protective layer forming step) after the metallic particle assembly layer forming step. can.
- the metal cations are reduced while the substrate is immersed in a plating solution containing the metal cations forming the metal particles.
- This step can be performed, for example, by adding the substrate 10 to the plating solution 60 containing metal cations contained in the bath 50 while stirring, as shown in FIG.
- the metal (zero valence) produced by the reduction of the metal cations begins to deposit on the surface of the base material 10, and the deposited metal becomes particulate as the reaction time elapses. and an aggregate of metallic particles (metallic particle aggregate layer) is formed.
- the metal-based particle assembly layer is preferably formed over the entire three-dimensional surface of the base material 10 , more preferably over the entire surface of the base material 10 .
- the base material 10 is not particularly limited as long as it has a three-dimensional surface, and examples thereof include those having curved surfaces as three-dimensional surfaces and those having uneven surfaces.
- Preferred examples of the substrate 10 are particles such as those shown in FIGS.
- the shape of the particles includes, for example, a spherical shape, a spheroidal shape, a polyhedral shape, and the like.
- the particles may have a surface partially curved and the rest flat.
- the particles may be amorphous.
- the particles are preferably spherical or approximately spherical.
- the particle size is, for example, 0.3 ⁇ m or more and 5000 ⁇ m or less.
- the particle size may be, for example, 0.3 ⁇ m or more and 10 ⁇ m or less, preferably 0.5 ⁇ m or more and 8 ⁇ m or less, more preferably 1 ⁇ m or more and 5 ⁇ m or less, still more preferably 1 ⁇ m or more and 4 ⁇ m or less.
- the particle size is measured according to the following method. Using a scanning electron microscope "JSM-5500" manufactured by JEOL Ltd. or an equivalent device, obtain an SEM observation image from directly above the substrate (glass substrate, etc.) to which the particles are attached, including the particles. .
- tangential diameters are randomly drawn in the particle image (however, any straight line that becomes the tangential diameter can pass only inside the particle image, one of which passes only inside the particle, The straight line that can be drawn the longest), and the average value (average value of tangential line diameter) is taken as the particle diameter of the particles.
- the tangential diameter is defined as a perpendicular line connecting the distance between two parallel lines that are in contact with the contour (projected image) of the particle (Nikkan Kogyo Shimbun, "Particle Measurement Technology", 1994, p. 5). .
- the average particle diameter of the particle group composed of the plurality of particles that can be used as the base material 10 is, for example, 0.3 ⁇ m or more and 5000 ⁇ m or less.
- the average particle size may be, for example, 0.3 ⁇ m or more and 10 ⁇ m or less, preferably 0.5 ⁇ m or more and 8 ⁇ m or less, more preferably 1 ⁇ m or more and 5 ⁇ m or less, still more preferably 1 ⁇ m or more and 4 ⁇ m or less.
- the average particle size is measured according to the following method. Using a scanning electron microscope "JSM-5500" manufactured by JEOL Ltd. or an equivalent device, a SEM observation image from directly above the substrate (such as a glass substrate) to which the particle group is attached, including the particle group.
- the tangent line diameter average value is obtained in the same manner as described above. The above is repeated as necessary to obtain an average tangential diameter for 10 particles that do not overlap the edge region. Let the average value of ten obtained tangential diameter average values be an average particle diameter.
- the material of the base material 10 is not particularly limited. However, the metal-based particle assembly layer formed on the substrate 10 is preferably a plasmonic structure, as described later, and for this reason, the substrate 10 is preferably non-conductive. . From this point of view, the substrate 10 preferably contains an insulating material, more preferably made of an insulating material. Insulating materials include inorganic insulating materials such as silica, titania, alumina, and silicon nitride; and organic insulating materials such as resin materials (eg, polystyrene, acrylic resin, cellulose nanofiber, paper, nitrocellulose, epoxy resin, etc.). mentioned. In addition, a semiconductor such as silicon may be used.
- the material of the base material 10 is preferably silica because it facilitates industrial production of spherical or substantially spherical particles.
- the substrate 10 preferably has translucency, and more preferably is optically transparent.
- the base material 10 may be composed of two or more materials. Further, the substrate 10 may have a single-layer structure or a multi-layer structure. For example, substrate 10 may exhibit non-conductivity by having a core of metallic material and a shell of insulating material. For example, silicon having an insulating film and metal having an insulating film (aluminum, copper, chromium, or a composite thereof, etc.) can be used.
- the plating solution 60 can be prepared by mixing a metal cation liquid containing metal cations and a reducing agent liquid containing a reducing agent.
- a metal cation liquid containing metal cations typically contains metal cations and a solvent.
- the metal-based particle assembly layer formed on the substrate 10 is preferably a plasmonic structure, as described later.
- the metal species of the metal cation can deposit metal-based particles on the substrate 10 by reducing the metal cation while the substrate 10 is in contact with the plating solution 60,
- a material that exhibits a plasmon resonance peak (hereinafter also referred to as a "plasmon peak") that appears in the ultraviolet to visible region in absorption spectrum measurement by absorptiometry when made into metal-based particles or aggregates thereof (a material that exhibits plasmon resonance obtained material).
- plasmon peak a material that exhibits a plasmon resonance peak
- noble metals such as gold, silver, copper, platinum, and palladium
- other metals such as aluminum
- alloys containing such noble metals or other metals include gold, silver, copper, platinum, and palladium.
- the plating solution 60 may contain two or more kinds of metal cations.
- the solvent contained in the metal cation liquid is preferably a solvent capable of dissolving the corresponding metal salt to be contained in the metal cation liquid as a metal cation source, such as water.
- the metal cation liquid may contain two or more solvents.
- solvents can include water and water-miscible organic solvents (eg, alcohols).
- the metal cation concentration in the plating solution 60 is preferably 0.0008 mol/L or higher, more preferably 0.002 mol/L or higher, still more preferably 0.0035 mol/L or higher, and still more preferably 0.006 mol/L or higher. Particularly preferably, it is 0.01 mol/L or more.
- concentration of the metal cation is within the above range, the metal-based particles can grow at an appropriate rate, so the metal-based particle aggregate having a preferable shape (average particle size, average height, average inter-particle distance and its standard deviation) It becomes easy to form a layer with good control. A preferred shape of the metal-based particle assembly layer will be described later in detail.
- the concentration of the metal cation is within the above range, when particles (powder) are used as the base material 10 and immersed in the plating solution 60 to form a metal-based particle assembly layer, each particle It becomes easier to form sufficient metal-based particles on the entire surface.
- the concentration of metal cations in the plating solution 60 is preferably 0.4 mol/L or less, more preferably 0.3 mol/L or less, and still more preferably 0.15 mol/L. L or less, still more preferably 0.05 mol/L or less.
- the ratio V S /V L of the volume V S [cm 3 ] of the substrate 10 to the volume V L [cm 3 ] of the plating solution 60 is 0.03 or less.
- a metal-based particle assembly layer containing a plurality of metal-based particles spaced apart from each other can be formed on the surface of the substrate 10 . If the above ratio exceeds 0.03, a continuous metal film is formed on the substrate 10, making it difficult to form the metal-based particle assembly layer.
- the above ratio is preferably 0.020 or less, more preferably 0.020. 010 or less, more preferably 0.005 or less, even more preferably 0.003 or less, and particularly preferably 0.002 or less.
- the above ratio is usually 0.00001 or more, may be 0.0001 or more, is preferably 0.0005 or more, and more preferably exceeds 0.0005. .
- the volume VS of the substrate 10 can be determined as the total particle weight divided by the particle density.
- the plating solution 60 preferably contains metal cations and a reducing agent capable of reducing the metal cations to zero-valent metals. If a reducing agent is included, this reducing agent is preferably contained in the plating solution 60 immediately before the substrate 10 is immersed in the plating solution 60 .
- the plating solution 60 containing metal cations and a reducing agent can be prepared by mixing a metal cation solution containing metal cations and a reducing agent solution containing a reducing agent.
- the reducing agent liquid is a liquid containing a reducing agent and a solvent, preferably a solution in which the reducing agent is dissolved in the solvent.
- the solvent contained in the reducing agent liquid is preferably a solvent capable of dissolving the reducing agent, such as water.
- the reducing agent liquid may contain two or more solvents.
- solvents can include water and water-miscible organic solvents (eg, alcohols).
- the reducing agent it is preferable to use one having a small reducing power, and its standard oxidation-reduction potential is preferably -0.5 V or higher, preferably -0.45 V or higher.
- the standard oxidation-reduction potential referred to here is a value when pH is 7, 25° C., and a standard hydrogen electrode is used as a cathode.
- the metal-based particles can be grown at an appropriate rate, making it easy to form the metal-based particle assembly layer.
- a standard oxidation-reduction potential within the above range is also advantageous for facilitating the formation of a metal-based particle assembly layer having a preferred shape with good controllability.
- reducing agents having a standard redox potential of ⁇ 0.5 V or more include glucose and ascorbic acid.
- the plating solution 60 may contain two or more reducing agents.
- the concentration of the reducing agent in the plating solution 60 is preferably 1 mol/L or less, more preferably 0.8 mol/L or less, still more preferably 0.4 mol/L or less, still more preferably 0.3 mol/L or less, and particularly preferably is 0.25 mol/L or less.
- concentration of the reducing agent is within the above range, the metal-based particles can be grown at an appropriate rate, making it easier to form a metal-based particle assembly layer having a preferred shape with good control.
- the concentration of the reducing agent in the plating solution 60 is preferably 0.000001 mol/L or more, more preferably 0.000005 mol/L or more, and still more preferably 0.000008 mol/L. L or more, more preferably 0.00001 mol/L or more, particularly preferably 0.0008 mol/L or more.
- the percentage ratio of the concentration of the reducing agent in the plating solution 60 to the saturation concentration of the reducing agent in the plating solution 60 is preferably 8% or less, more preferably 4% or less, even more preferably 2% or less, and even more preferably It is 1% or less, particularly preferably 0.8% or less.
- the metal-based particles can be grown at an appropriate rate, making it easier to form a metal-based particle assembly layer having a preferred shape with good control.
- the above ratio is preferably 0.0005% or more, more preferably 0.001% or more, still more preferably 0.003% or more, and even more preferably 0.003% or more.
- the saturation concentration of the reducing agent in the plating solution 60 is the temperature at which the reducing agent is dissolved in the solvent (containing no metal cations) contained in the plating solution 60 at the temperature at which the substrate 10 is immersed in the plating solution 60. saturation concentration.
- the plating solution 60 can contain one or more of a complexing agent that binds to metal cations to form complex ions and stabilizes the metal cations, and other additives.
- Complexing agents include amine-based complexing agents such as ethylenediamine, ethylenediaminetetraacetic acid, tetrasodium ethylenediaminetetraacetate, triethylenetetraamminehexaacetic acid, ammonia, nitrotriacetic acid, sodium thiosulfate, succinate, succinimide, citric acid.
- the complexing agent can be included in the metal cation solution in advance.
- the process of forming a metal-based particle assembly layer containing a plurality of metal-based particles 20 on the base material 10 by immersing the base material 10 in the plating solution 60 is basically electroless plating using a plating bath ( chemical plating).
- the temperature at which the substrate 10 is immersed in the plating solution 60 is not particularly limited, and is, for example, 10° C. or higher and 100° C. or lower, preferably 15° C. or higher and 60° C. or lower, more preferably 20° C. or higher and 40° C. or lower.
- the growth rate of the metal-based particles is moderated. speed.
- the average height growth rate of the metal-based particles after 28 minutes from the start of metal deposition on the three-dimensional surface of the substrate 10 is preferably 6 nm/ minute or less, more preferably 5 nm/minute or less, even more preferably 4 nm/minute or less, and even more preferably 3.5 nm/minute or less.
- the average height growth rate is usually 1 nm/min or more, preferably 2 nm/min or more, in view of the mass productivity of the laminate.
- the average height growth rate of the metal-based particles after 28 minutes from the start of metal deposition on the three-dimensional surface of the base material 10 is the same except that the reaction is finished in 28 minutes (for example, filtered) as a preliminary experiment.
- the metal-based particle assembly layer forming step can be carried out in advance, and the average height obtained in this preliminary experiment can be used for measurement.
- Start of metal deposition on the three-dimensional surface of the base material 10 means that when the metal-based particle assembly layer forming step is started by immersing the base material 10 in the plating solution 60 containing a metal cation and a reducing agent, , means the start of immersion of the substrate 10, and when the substrate 10 is immersed in a metal cation liquid containing metal cations and then a reducing agent (for example, a reducing agent liquid) is added, it means the time of adding the reducing agent. .
- a reducing agent for example, a reducing agent liquid
- the substrate 10 is a particle.
- the metal-based particle assembly layer forming step preferably satisfies the following formula (1). 10 ⁇ 10 ⁇ 7 ⁇ X ⁇ 600 ⁇ 10 ⁇ 7 (1)
- the value of X is more preferably 30 ⁇ 10 ⁇ 7 or more and 450 ⁇ 10 ⁇ 7 or less, more preferably 40 ⁇ 10 ⁇ 7 or more and 300 ⁇ 10 ⁇ 7 or less.
- X is represented by the following formula.
- a is the concentration (mol/L) of the metal cation in the plating solution 60
- V is the volume (L) of the plating solution 60
- D is the atomic weight of the metal (zero valence) generated by reduction of the metal cation
- B is the base material.
- C is the specific gravity (g/cm 3 ) of the metal (zero valence) produced by reduction of the metal cation
- R is the radius (cm) of the particle that is the substrate 10 .
- X is represented by the following formula.
- a, V, D and C have the same meanings as above.
- S represents the total surface area of the particles that are the substrate 10 .
- the number of particles B of the substrate 10 can be obtained from the total weight mp of the particles and the density Vp of the particles according to the following formula.
- R has the same meaning as above.
- the radius R (cm) of the particles is half the average particle diameter of the particles determined according to the above.
- the total surface area S of the particles can be obtained by measuring the specific surface area by the BET method and multiplying it by the total weight mp of the particles.
- the particles that are the base material 10 are spherical, an SEM observation image is obtained in the same manner as described above, and in all the 10 particles that are adopted, the 5 adopted tangential line diameters are all the tangent line diameter average values. ⁇ 30% (that is, the average particle diameter of the particles of the substrate 10 ⁇ 70% or more and 130% or less). Amorphous means non-spherical.
- a metal-based particle assembly layer containing a plurality of metal-based particles 20 can be formed on the three-dimensional surface of the substrate 10 with good control, and a preferable shape can be obtained. It is possible to form the metal-based particle assembly layer having the above properties on the three-dimensional surface of the base material 10 with good control. Moreover, according to the method for manufacturing a laminate according to the present invention, it becomes easy to form a metal-based particle assembly layer over the entire surface of the substrate 10 . Furthermore, according to the method for manufacturing a laminate according to the present invention, it is possible to improve the mass productivity of manufacturing the laminate.
- the time for the metal-based particle assembly layer forming step that is, the time for immersing the base material 10 in the plating solution 60 to grow the metal-based particles 20 is preferably controlled appropriately. If the time is excessively long, a continuous metal film is formed without forming a metal-based particle assembly layer containing a plurality of metal-based particles 20 . The longer the time, the larger the average particle diameter and average height of the metal-based particles, and the smaller the average inter-particle distance.
- An appropriate time for the metal-based particle assembly layer forming step is preferably known in advance by a preliminary experiment before actually performing the metal-based particle assembly layer forming step.
- Metal-based particle assembly layer formed by the metal-based particle assembly layer forming step Metal-based particle assembly containing a plurality of metal-based particles arranged apart from each other by the metal-based particle assembly layer forming step A layer is formed on the three-dimensional surface of substrate 10 .
- the metal-based particle assembly layer formed on the substrate 10 is preferably a plasmonic structure.
- a "plasmonic structure” refers to a structure capable of exhibiting localized plasmon resonance.
- a plasmon is a compressional wave of free electrons caused by collective oscillation of free electrons in a structure.
- a laminate comprising a plasmon structure can, for example, enhance the intensity of luminescence (for example, fluorescence) from a light-emitting body that labels a substance to be detected due to its localized plasmon resonance. Therefore, laminates with plasmonic structures can be suitably used as luminescence enhancing elements for various sensor elements. By applying the laminate to a sensor element, the sensitivity, quantification accuracy and/or reproducibility (stability) of quantification results of the sensor element can be improved.
- a suitable example of a sensor element is a biosensor element.
- a laminate comprising a plasmonic structure can exhibit the following characteristics [a] and [b]. It is considered that these characteristics are expressed by the interaction between localized plasmons exhibited by the plurality of metal-based particles forming the metal-based particle assembly layer.
- the working range of plasmon resonance exhibited by the metal-based particle assembly layer is wide, and within a range of, for example, several hundred nm (eg, 200 nm) from the surface of the metal-based particle assembly layer It can also enhance the emission of certain emitters.
- the metal-based particle assembly layer exhibits strong plasmon resonance, a strong luminescence enhancing effect can be obtained.
- the laminate including the plasmonic structure is separated from the metal-based particle assembly layer by, for example, 10 nm or more, further several tens of nm (for example, 20 nm, 30 nm or 40 nm) or more, furthermore 100 nm or more or 200 nm or more. It can enhance the emission of light emitters placed at different positions.
- the strength of the plasmon resonance exhibited by the laminate including the plasmon structure is not simply the sum of the localized plasmon resonances exhibited by the individual metal-based particles at a specific wavelength, but can be stronger than that. .
- individual metal-based particles can interact to express strong plasmon resonance. Such strong plasmon resonance is considered to occur due to interactions between localized plasmons of metal-based particles.
- plasmon peak plasmon peak
- the strength of the plasmon resonance of the plasmon structure can be evaluated from the magnitude of the absorbance at the maximum wavelength of the plasmon peak. There is a tendency that the greater the absorbance value, the greater the strength of plasmon resonance.
- the absorption spectrum of the plasmonic structure can be measured by spectrophotometry. Specifically, the absorption spectrum is measured on the back side of the glass substrate on which the metal-based particle assembly is laminated (the side opposite to the metal-based particle assembly), from the direction perpendicular to the substrate surface, in the ultraviolet to visible light region. and the intensity I of the transmitted light in all directions transmitted to the metal-based particle assembly side, and the substrate having the same thickness and the same material as the substrate of the measurement sample, on which the metal-based particle assembly is laminated.
- an objective lens and a spectrophotometer may be used to narrow down the measurement field and perform absorption spectrum measurement.
- the plurality of metal-based particles constituting the metal-based particle assembly layer may have an average particle size of 5 nm or more, preferably 30 nm or more. , more preferably 100 nm or more, still more preferably 200 nm or more, and even more preferably 250 nm or more.
- the plurality of metal-based particles constituting the metal-based particle assembly layer has an average particle size of, for example, 1600 nm or less, preferably 800 nm or less, more preferably It is 550 nm or less, more preferably 450 nm or less, even more preferably 400 nm or less, and particularly preferably 350 nm or less. It is preferable that the average particle diameter of the metal-based particles is appropriately selected according to the type of the metal-based material that constitutes the metal-based particles.
- the average particle size of the plurality of metal-based particles is obtained by randomly selecting 6 metal-based particles in an SEM observation image from directly above the substrate (such as a glass substrate) to which the laminate is attached, including the laminate. , Five tangent diameters are randomly drawn in each metallic particle image (however, any straight line that becomes the tangent diameter can pass only inside the metallic particle image, one of which is only inside the metallic particle and the longest straight line that can be drawn), and the average value (hereinafter, this average value is also referred to as the “average tangential diameter value”) as the particle size of each metal-based particle. It is the average value of the particle size for each metal-based particle.
- the definition of tangent diameter is the same as above.
- the method for measuring the average particle size will be described.
- the SEM observation image is measured using a scanning electron microscope “JSM-5500” manufactured by JEOL Ltd. or an equivalent device.
- the obtained observation image is read with 1280 horizontal pixels ⁇ 960 vertical pixels using free image processing software "ImageJ” manufactured by the National Institutes of Health.
- the random number generation function "RANDBETWEEN” of Microsoft's spreadsheet software "Excel” six random numbers (x 1 , x 2 , x 3 , x 4 , x 5 , x 6 ), 6 random numbers (y 1 , y 2 , y 3 , y 4 , y 5 , y 6 ) are obtained from 1 to 960, respectively.
- the tangential diameter average value is obtained for each of a total of six metallic particle images including the coordinate point, and then the average particle size is obtained as the average value of the six tangential diameter average values.
- the average particle size is obtained as the average value of the six tangential diameter average values.
- the random number combination is discarded.
- all of the six coordinate points are included in different metal-based particle images, and there is no metal-based particle that overlaps even a part of the edge region of the particle that is the substrate on which each metal-based particle is arranged.
- Repeat random number generation until The above is repeated as necessary to obtain the tangential diameter average value for six metal-based particles that do not overlap with the edge region of the base particle. Let the average value of the obtained six tangential diameter average values be an average particle diameter.
- the average particle size of metal-based particles is usually smaller than the particle size of the base particles that support them.
- the ratio of the particle size of the substrate particles to the average particle size of the metal-based particles is, for example, 2 or more and 10,000 or less, preferably 4 or more and 5,000 or less, and more preferably 6 or more and 1,000 or less.
- each of the plurality of metal-based particles in the metal-based particle assembly layer has an average distance between its adjacent metal-based particles (hereinafter, “average particle It is also referred to as “interval distance”.) is preferably 1 nm or more and 150 nm or less.
- the average interparticle distance is more preferably 1 nm or more and 120 nm or less, still more preferably 1 nm or more and 100 nm or less, even more preferably 1 nm or more and 80 nm or less, especially It is preferably 1 nm or more and 60 nm or less, and most preferably 1 nm or more and 40 nm or less. If the average particle-to-particle distance is less than 1 nm, electron transfer occurs between particles based on the Dexter mechanism, which is disadvantageous in deactivation of localized plasmons.
- the average inter-particle distance is the SEM observation image from directly above including the laminate of the substrate (such as a glass substrate) to which the laminate is attached. It is the average value of the inter-particle distances of these six metal-based particles when the inter-particle distances between adjacent metal-based particles are obtained for the metal-based particles.
- the inter-particle distance between adjacent metal-based particles is a value obtained by measuring the distances between all adjacent metal-based particles (minimum distance between surfaces of adjacent metal-based particles) and averaging these.
- the method for measuring the average interparticle distance is first measured using a scanning electron microscope “JSM-5500” manufactured by JEOL Ltd. or an equivalent device.
- the obtained observation image is read with 1280 horizontal pixels ⁇ 960 vertical pixels using free image processing software "ImageJ” manufactured by the National Institutes of Health.
- spreadsheet software “Excel” 6 random numbers (x 1 to x 6 ) from 1 to 1280, 6 random numbers from 1 to 960 (y 1 to y 6 ) are obtained respectively.
- Six sets of random number combinations (x 1 , y 1 ) to (x 6 , y 6 ) are obtained from the obtained six random numbers.
- the “edge region” of the particle that is the base material is obtained from the same observation image. Then, among the six metal-based particles, if there is a metal-based particle that partially overlaps the edge region of the particle that is the base material on which each metal-based particle is arranged, the random number combination is discarded.
- all of the six coordinate points are included in different metal-based particle images, and there is no metal-based particle that overlaps even a part of the edge region of the particle that is the substrate on which each metal-based particle is arranged.
- Repeat random number generation until The above is repeated as necessary to obtain the inter-particle distance for six metal-based particles that do not overlap with the edge region of the substrate particle. Let the average value of the distance between six obtained particles be an average distance between particles.
- the plurality of metal-based particles in the metal-based particle assembly layer are arranged so that the standard deviation of the average inter-particle distance is 50 nm or less. is preferred. By arranging the metal-based particles so that the standard deviation falls within this range, strong plasmon resonance can be obtained and the effect of extending the action range of plasmon resonance can be enhanced.
- the standard deviation of the average interparticle distance is more preferably 40 nm or less, more preferably 30 nm or less, even more preferably 25 nm or less, and particularly preferably 20 nm, from the viewpoint of effectively obtaining the effects of [a] and [b] above. It is below.
- the standard deviation of the average interparticle distance is preferably 0.1 nm or more, more preferably 0.2 nm or more, and still more preferably 0, from the viewpoint of effectively obtaining the effects of [a] and [b] above. .3 nm or more.
- the standard deviation of the average interparticle distance is defined as follows. In the SEM observation image from directly above including the laminate of the substrate (such as a glass substrate) to which the laminate is attached, first one metal-based particle is selected at random, and for the metal-based particles, adjacent metal-based particles Find the inter-particle distance between The inter-particle distance between adjacent metal-based particles is a value obtained by measuring the distances between all adjacent metal-based particles (the minimum distance between surfaces) and averaging them. In the SEM observation image, five metal-based particles different from the one are randomly selected, and for these five metal-based particles, the inter-particle distance between adjacent metal-based particles is performed in the same manner as described above. Ask for The standard deviation of the inter-particle distance between adjacent metal-based particles for a total of six metallic particles thus obtained is defined as the standard deviation of the average inter-particle distance.
- the method for measuring the standard deviation of the average interparticle distance is first measured using a scanning electron microscope "JSM-5500” manufactured by JEOL Ltd. or an equivalent device. .
- the obtained observation image is read with 1280 horizontal pixels ⁇ 960 vertical pixels using free image processing software "ImageJ” manufactured by the National Institutes of Health.
- spreadsheet software “Excel” 6 random numbers (x 1 to x 6 ) from 1 to 1280, 6 random numbers from 1 to 960 (y 1 to y 6 ) are obtained respectively.
- Six sets of random number combinations (x 1 , y 1 ) to (x 6 , y 6 ) are obtained from the obtained six random numbers.
- the “edge region” of the particle that is the base material is obtained from the same observation image. Then, among the six metal-based particles, if there is a metal-based particle that partially overlaps the edge region of the particle that is the base material on which each metal-based particle is arranged, the random number combination is discarded.
- all of the six coordinate points are included in different metal-based particle images, and there is no metal-based particle that overlaps even a part of the edge region of the particle that is the substrate on which each metal-based particle is arranged.
- Repeat random number generation until The above is repeated as necessary to obtain the inter-particle distance for six metal-based particles that do not overlap with the edge region of the substrate particle.
- the standard deviation of the average inter-particle distance is obtained as the standard deviation of the inter-particle distance between the six adjacent metallic particles.
- the average particle diameter of the metal-based particle assembly layer, the average distance between particles, and the standard deviation thereof are measured. may be replaced by TEM (transmission electron microscope) observation.
- the average height of the plurality of metal-based particles constituting the metal-based particle assembly layer is preferably 5 nm or more and 500 nm or less, more preferably 10 nm or more, from the viewpoint of effectively obtaining the effects of [a] and [b] above. It is preferably 300 nm or less, more preferably 30 nm or more and 200 nm or less, still more preferably 50 nm or more and 150 nm or less, and particularly preferably 55 nm or more and 150 nm or less.
- the average height of the plurality of metal-based particles is measured according to the following method. That is, a cross-sectional image of the laminate is obtained using a scanning electron microscope “JSM-5500” manufactured by JEOL Ltd. or an equivalent device. In the obtained cross-sectional image, 10 points on the outer contour surface of the laminate (laminate without protective layer) consisting of the substrate and the metal-based particle assembly layer are randomly selected. Next, a straight line is drawn from each of the 10 points to the outer surface of the substrate so as to be the shortest, and the average value of the lengths of the 10 straight lines thus obtained is taken as the average height of the metal-based particles.
- the aspect ratio of the plurality of metal-based particles constituting the metal-based particle assembly layer is preferably 1 or more and 8 or less, more preferably 1 or more and 7, from the viewpoint of effectively obtaining the effects of [a] and [b]. hereinafter, more preferably 1.5 or more and 7 or less, and even more preferably 1.5 or more and 6 or less.
- the aspect ratio is defined as the ratio of the average particle size to the average height (average particle size/average height).
- the metal-based particles may be spherical, but preferably have a flat shape with an aspect ratio exceeding 1 from the viewpoint of effectively obtaining the above effects [a] and [b].
- the metal-based particles preferably have a smooth curved surface, and more preferably have a flat shape with a smooth curved surface. It may contain some minute unevenness (roughness), and in this sense, the metal-based particles may be amorphous.
- a metal-based particle assembly layer having an average particle size, an average height, an aspect ratio, an average inter-particle distance and a standard deviation thereof, etc. within the above preferred ranges is formed on the substrate 10. It is suitable as a method for forming.
- the number of metal-based particles contained in the metal-based particle assembly layer for one laminate is usually 6 or more, preferably 30 or more. By forming a metal-based particle assembly layer containing six or more metal-based particles, strong plasmon resonance and extension of the action range of plasmon resonance are likely to occur due to interactions between localized plasmons of the metal-based particles.
- the number of metal-based particles contained in the metal-based particle assembly layer may be, for example, 50 or more, further 1000 or more, furthermore 10000 or more.
- the number density of the metal-based particles is preferably 7 or more, more preferably 15 or more per 1 ⁇ m 2 of surface area of the substrate, from the viewpoint of facilitating the development of strong plasmon resonance and extension of the action range of plasmon resonance.
- a laminate in which a metal-based particle assembly layer is arranged on the surface of a base material, and a laminate in which a protective layer described later is further arranged on the surface of the laminate may have surface irregularities. Laminates with surface irregularities have a larger surface area. Therefore, when the laminate is applied to a sensor element, a large amount of substance to be detected can be bound to the surface of the laminate. This is advantageous for improving the detection sensitivity and detection accuracy of the sensor element.
- the metal-based particle assembly layer is preferably non-conductive as a layer from the viewpoint of facilitating the development of strong plasmon resonance and extension of the action range of plasmon resonance. From this point of view, it is preferable that the surface of the substrate on which the metal-based particles are arranged is also non-conductive. The metal-based particles themselves may have conductivity.
- the method for producing a laminate can include a step of forming a protective layer made of an insulating material on the metal-based particle assembly layer.
- FIG. 4 is a cross-sectional view schematically showing another example of the laminate.
- the laminate 2 shown in FIG. 4 includes a substrate 10 (core particles) having a three-dimensional surface, and a metal-based particle assembly layer disposed on at least a portion (preferably the entire surface) of the three-dimensional surface of the substrate 10. , and a protective layer 30 covering at least the surfaces of the plurality of metal-based particles 20 .
- the protective layer is preferably formed so as to cover at least the surfaces of the plurality of metal-based particles on the substrate surface.
- Forming a protective layer is advantageous in the following points.
- the luminous body and the metal-based particles can be reliably separated from each other, so that quenching can be suppressed.
- [B] The stability (oxidation resistance, etc.) and environmental stability (eg, light resistance, humidity resistance, heat resistance, etc.) of the laminate (substrate and/or metallic particles) can be enhanced.
- the protective layer may be formed so as to cover at least the surfaces of the plurality of metal-based particles constituting the metal-based particle assembly layer, but as shown in FIG. It may be formed so as to cover the entire surface including the material surface and the surfaces of the plurality of metal-based particles.
- the material of the protective layer is preferably a non-conductive material, that is, an insulating material.
- insulating materials include inorganic insulating materials such as SiO 2 , SiN, TiO 2 , Al 2 O 3 , and Si 3 N 4 ; and organic insulating materials such as resin materials (eg, polystyrene, acrylic resin, epoxy resin, etc.). mentioned.
- the protective layer may be composed of two or more materials.
- the protective layer may have a single layer structure or a multilayer structure.
- the thickness of the protective layer is not particularly limited, it is, for example, 3 nm or more, preferably 10 nm or more.
- the thickness of the protective layer is, for example, 300 nm or less, preferably 200 nm or less, more preferably 150 nm or less, even more preferably 100 nm or less, and even more preferably 80 nm or less.
- the thickness of the protective layer is measured according to the following method.
- a cross-sectional image of the laminate is obtained using a scanning electron microscope “JSM-5500” manufactured by JEOL Ltd. or an equivalent device.
- JSM-5500 manufactured by JEOL Ltd. or an equivalent device.
- 10 points on the outer contour surface of the laminate (laminate without protective layer) consisting of the substrate and the metal-based particle assembly layer are randomly selected.
- the point is the surface of the metal-based particles and the point on the surface forming the interface with the protective layer.
- the protective layer covers the entire surface of the particles (laminate without protective layer) composed of the substrate and the metal-based particle assembly layer.
- the outer surface of the protective layer may or may not have irregularities following the surface irregularities of the laminate without the protective layer (irregularities based on metal-based particles). It may be smooth.
- FIG. 4 shows an example in which the protective layer has surface irregularities.
- the protective layer preferably has surface irregularities from the viewpoint of increasing the amount of the substance to be detected that binds to the surface of the laminate.
- the protective layer may be formed with a relatively uniform thickness over the entire surface, or may be formed thick locally. It may be formed with a non-uniform thickness, such as being formed thin.
- a substance to be detected labeled with a luminescent substance is captured on a protective layer and the laminate is used as a luminescence enhancing element in a sensor element that analyzes the substance to be detected, the substance to be detected labeled with a luminescent substance is captured.
- the protective layer should be formed with a uniform or relatively uniform thickness over the entire surface. is preferred.
- Examples of the method for producing a laminate including the step of forming a protective layer on the metal-based particle assembly layer include the following methods.
- sputtering method may be powder sputtering
- vapor deposition method may be powder vapor deposition
- CVD may be powder CVD
- a suitable example of a method for forming a protective layer composed of an insulating material on the metal-based particle assembly layer is the sol-gel method described above.
- the sol-gel method is a method in which a corresponding metal oxide can be obtained by starting from a solution containing a metal alkoxide or the like as a raw material and accompanying a hydrolysis reaction and a polymerization reaction.
- An example of the sol-gel method is the Stober method (o in Stober means an umlaut of o; hereinafter the same).
- silica (SiO 2 ) can be obtained by using tetraethyl orthosilicate as a raw material and performing a reaction in an ethanol solvent in the presence of water and ammonia as a catalyst.
- Stober method reference can be made to W. Stober and A. Fink, Journal of Colloid and Interface Science 26(1), 62-69 (1968).
- a SiO 2 layer can be formed as a protective layer on the laminate consisting of the substrate and the metal-based particle assembly layer.
- a solution containing a solvent such as alcohol, water, and ammonia as a catalyst the above-mentioned reaction of tetraethyl orthosilicate as a raw material is performed, and the presence of a laminate consisting of a substrate and a metal-based particle assembly layer is performed.
- a SiO 2 layer can be formed on the stack.
- the temperature of the above reaction is appropriately selected, but is, for example, 0°C or higher and 100°C or lower, preferably 10°C or higher and 60°C or lower.
- the coating with the protective layer tends to be uniform.
- the thickness of the protective layer depends on the amount of the raw material (metal alkoxide, etc.) with respect to the laminate consisting of the substrate and the metal-based particle assembly layer in the reaction liquid.
- the ratio V G / VL2 of the volume V G [cm 3 ] of the raw material to the volume V L2 [cm 3 ] of the laminate consisting of the substrate and the metal-based particle assembly layer in the reaction liquid is, for example, 15 or less, and is preferably is 9 or less, more preferably 6 or less.
- the above ratio is usually 0.1 or more. There is a tendency that the greater the ratio, the greater the thickness of the protective layer.
- the raw material that can be used to form a protective layer made of a metal oxide by the sol-gel method is not limited to tetraethyl orthosilicate, and methyltrimethoxysilane, for example, can also be used.
- Laminates according to the invention in particular laminates comprising plasmonic structures, can be suitably used as luminescence enhancing elements for sensor elements.
- the sensor element is, for example, a sensor element used for detecting a substance to be detected, comprising a substrate, a laminate arranged on the substrate, and a substance specific to the substance to be detected, arranged on the laminate. and a capture portion having a capture substance that binds to.
- the laminate may include the protective layer described above.
- FIG. 5 is a cross-sectional view schematically showing an example of a sensor element.
- the sensor element shown in FIG. 5 comprises a substrate 70 having a depression 71 on its surface, a laminate 2 arranged on the substrate 70, more specifically within the depression 71, and arranged on the laminate 2 to be detected. It includes a capture portion 80 having a capture substance that specifically binds to the substance 90 .
- the trapping part 80 is provided on the protective layer of the laminate 2, but using a laminate without a protective layer, the substrate and/or the metal-based particle assembly layer You may provide the capture
- FIG. 5 schematically shows a state in which a labeled substance 90 to be detected is trapped by the trapping section 80 .
- 91 in FIG. 5 indicates a label bound to the substance 90 to be detected.
- Labels include luminophores.
- the sensor element detects the substance 90 to be detected as follows. Detection may be qualitative or quantitative detection, and refers to, for example, identification or quantification of the substance 90 to be detected.
- Detection may be qualitative or quantitative detection, and refers to, for example, identification or quantification of the substance 90 to be detected.
- the label which is a luminous body
- the metal-based particle assembly layer of the laminate 2 resonates with the excited luminous body to develop plasmon emission enhancement.
- the substance to be detected 90 can be detected qualitatively or quantitatively by detecting light emitted from the excited luminous body using a detector.
- the abundance of the substance to be detected 90 can be qualitatively or quantitatively measured by measuring the emission intensity.
- the laminate contains the metal-based particle assembly layer, which can enhance the plasmon emission, so that the detection sensitivity and detection accuracy can be improved.
- the metal particle assembly layer is arranged on the bottom surface of the recess 71 of the substrate 70, and instead of the laminate, beads without the metal particle assembly layer (corresponding to the substrate of the laminate) are arranged in the recess 71.
- the particle diameter of the beads having the capturing portion on the surface is large (for example, in the order of micrometers), the labeled substance 90 to be detected and the metal particle assembly layer are too far apart, There is a possibility that the effect of enhancing plasmon emission cannot be obtained.
- the laminate including the metal-based particle assembly layer as the beads arranged in the depression 71, the distance between the labeled substance to be detected 90 and the metal particle assembly layer is shortened, so that the plasmon A luminescence enhancing effect can be obtained.
- the laminate in which the metal-based particle assembly layer is arranged on the surface of the substrate, and the laminate in which the protective layer is further arranged on the surface of the laminate have surface unevenness or have surface unevenness.
- the laminate in which the protective layer is further arranged on the surface of the laminate have surface unevenness or have surface unevenness.
- can be Laminates with surface irregularities have a larger surface area. Therefore, by using the laminate as the beads, a large amount of the capture substance and, in turn, the substance to be detected 90 can be bound to the surface of the laminate. This also contributes to improving detection sensitivity and detection accuracy.
- the substance to be detected 90 is a substance to be detected qualitatively or quantitatively, and is a substance that specifically binds to the capture substance.
- the substance to be detected 90 is not particularly limited, and examples thereof include nucleosides, nucleotides, nucleic acids, proteins, sugars, glycoproteins, lectins, viruses, cells, antibodies, exosomes, and the like.
- a sensor element in which the substance 90 to be detected is a biologically-derived substance or a biologically-related substance is also called a biosensor element.
- a nucleic acid means a polymer (nucleotide chain) of a nucleoside phosphate ester in which a purine base or a pyrimidine base and a sugar are glycoside-bonded, and includes oligonucleotides including probe DNA, polynucleotides, and DNAs in which purine nucleotides and pyrimidine nucleotides are polymerized ( full-length or fragments thereof), RNA, polyamide nucleotide derivatives (PNA), and the like.
- a nucleoside is a compound in which a base and a sugar are glycoside bonded
- a nucleotide is a compound in which a phosphate is bonded to a nucleoside
- a nucleoside and a nucleotide are compounds containing a base.
- Specific binding means non-covalent bonding between substances, covalent bonding, chemical bonding including hydrogen bonding, for example, interaction between protein molecules, electrostatic interaction between molecules, etc. .
- the captured substance 90 to be detected can be detected by labeling the substance 90 to be detected in advance with a label 91 that is a luminous body and detecting luminescence from this label 91 .
- the label 91 may be a labeling substance that specifically binds to a complex obtained by specific binding between the capturing substance and the substance to be detected 90 .
- a luminous body is a substance that emits light upon injection of excitation energy by excitation light. The principle of light emission in the light emitter is not limited, and examples thereof include fluorescence, phosphorescence, and chemiluminescence. A conventionally well-known thing can be used as a light-emitting body.
- the capturing substance that constitutes the capturing part 80 is a substance that specifically binds to the substance to be detected 90 and functions to capture it. Capture substances are, for example, immobilized on the surface of the laminate.
- the capturing substance is, for example, a substance having a binding activity group that can specifically bind to the substance to be detected 90 .
- the binding activity group includes, for example, a carboxyl group, a hydroxyl group, and the like, which can electrostatically interact with the substance to be detected 90 .
- the capturing substance is not particularly limited, and examples thereof include nucleosides, nucleotides, nucleic acids, proteins, sugars, glycoproteins and the like.
- Examples of materials for the substrate 70 of the sensor element include silicon, quartz, synthetic quartz, glass, and thermoplastic resin.
- the laminate is not necessarily limited to being arranged in the recess 71 of the substrate 70, and may be arranged in a manner that can be fixed or accommodated in the substrate 70.
- FIG. Substrate 70 may have one or more depressions 71 .
- Examples of substrate 70 are flow cells, microarrays.
- the distance from the metal-based particle assembly layer of the laminate to the label 91 is 10 nm. Even greater distances can enhance the emission from the label 91 .
- the size of DNA that can be the substance to be detected 90 can be several nm to several tens of nm, and can be 5 nm to 15 nm.
- the size of a virus can range from several tens of nm to one hundred and several tens of nm, and can range from 30 nm to 120 nm.
- the distance between the label 91 bound thereto and the metal-based particle assembly layer can be, for example, several tens of nm to several hundreds of nm. Even in such a case, the light emission from the marker 91 can be enhanced according to the sensor element.
- the distance from the metal-based particle assembly layer to the marker 91 may be 15 nm or more, further 25 nm or more, or even more. From the viewpoint of the sensitivity of the sensor element, the distance is preferably 200 nm or less, more preferably 170 nm or less, and even more preferably 150 nm or less.
- the maximum wavelength of the plasmon peak of the metal-based particle assembly layer preferably matches or is close to the emission wavelength of the label 91 . Thereby, the luminescence enhancement effect by plasmon resonance can be enhanced more effectively.
- the maximum wavelength of the plasmon peak of the metal-based particle assembly layer is the metal type, average particle size, average height, aspect ratio, average inter-particle distance and / or standard deviation of the average inter-particle distance of the metal-based particles that constitute it can be controlled by adjusting the
- a sensor device including the above sensor element usually includes a light source that emits excitation light for exciting the label 91 and a detector that detects the light emission from the label 91 in addition to the sensor element.
- the light source and the detector may be arranged on different sides of the substrate 70, or may be arranged on the same side.
- the light source is positioned above the substrate 70 (above or to the side of the labeled substance 90 to be detected in FIG. 5), and the detector is positioned below (behind) the substrate 70, i.e., the substrate It is arranged on the opposite side to the light source or on the same side as the light source with reference to 70 .
- the substrate 70 is preferably translucent, more preferably optically transparent.
- the light-transmitting substrate 70 preferably has a light transmittance of 80% or more, more preferably 90% or more, with respect to light that is to be transmitted therethrough.
- the luminescence When detecting luminescence, if there is a risk of contamination with excitation light, it is preferable to let the luminescence enter the detector through a wavelength cut filter that cuts the light of the wavelength of the excitation light.
- sensor devices examples include biosensor devices such as DNA sequencers, DNA microarrays, virus sensors, ion sensors, plate readers (protein chips, sugar chain chips, lectin chips, etc.), microspectroscopic devices, and glucose sensors.
- biosensor devices such as DNA sequencers, DNA microarrays, virus sensors, ion sensors, plate readers (protein chips, sugar chain chips, lectin chips, etc.), microspectroscopic devices, and glucose sensors.
- the laminate when used for sensor applications, the laminate may be used without being fixed to the substrate.
- Examples of such a method of use include use in flow cytometry and a method of dispersing the layered product in a liquid medium and binding a labeled substance 90 to be detected to the dispersed layered product for analysis.
- Example 1 After 0.25 mL of 0.05 mol/L potassium hydroxide (KOH) aqueous solution was added dropwise to 50 mL of 0.047 mol/L aqueous solution of silver nitrate (AgNO 3 ), the mixture was stirred. The addition of the aqueous potassium hydroxide solution changed the color of the solution from clear and colorless to brown. A 3.5 mol/L ethylenediamine (NH 2 CH 2 CH 2 NH 2 ) aqueous solution was added dropwise to this solution by 50 ⁇ L under stirring, and the dropping was stopped when the solution became colorless and transparent. Let the obtained solution be the silver ion liquid A.
- KOH potassium hydroxide
- a reducing agent liquid B was obtained by mixing 16.6 mL of a 0.06 mol/L aqueous glucose solution and 8.4 mL of methanol.
- Silver ion liquid A was put into the tank, and then 200 mg of silica powder (“Fine Sphere SK-30” manufactured by Nippon Electric Glass Co., Ltd., spherical particles with an average particle diameter of 3 ⁇ m) as a base material was put into the tank. bottom.
- silica powder (“Fine Sphere SK-30” manufactured by Nippon Electric Glass Co., Ltd., spherical particles with an average particle diameter of 3 ⁇ m) as a base material was put into the tank. bottom.
- the substrate is immersed in the plating solution composed of the silver ion solution A and the reducing agent solution B by stirring the solution in the bath, and the surface of the substrate is The growth of metal-based particles consisting of silver was initiated on top.
- Preparation of the plating solution and immersion of the base material in the plating solution were performed in an environment of 25°C. Stirring was continued at 25°C. After 28 minutes from the start of immersion, the base material (laminate) having a metal-based particle assembly layer was separated by filtration, and then the filtrate was washed with a 1:1 volume ratio mixture of acetone and ultrapure water, and then centrifuged. After removing the supernatant using a separator, it was dried at 80° C. to obtain a laminate.
- Example 2 Except for changing the glucose concentration of the glucose aqueous solution used for preparing the reducing agent solution B, the concentration of the reducing agent and the ratio (percentage) of the concentration of the reducing agent to the saturation concentration were the values shown in Table 1.
- a metal-based particle assembly layer forming step was performed in the same manner as in Example 1 to obtain a laminate.
- Example 1 The base material (silica powder) used in Example 1 was used as the particles of Comparative Example 1.
- the average particle size (3 ⁇ m) of the silica powder used as the base material was obtained according to the above-described method for measuring the average particle size of the particle group.
- the concentration of silver ions in the plating solution the type of reducing agent, the concentration of the reducing agent, the ratio of the concentration of the reducing agent to the saturation concentration (percentage), the immersion time of the substrate in the plating solution, The ratio V S /V L of the volume V S [cm 3 ] of the substrate to the volume V L [cm 3 ] of the plating solution, and the average height growth rate of the metal-based particles 28 minutes after the start of metal deposition.
- Table 1 shows. In Examples 1 and 2 in which spherical particles of silica powder were used as the base material, the value of X obtained from the above formula was 121 ⁇ 10 ⁇ 7 .
- FIG. 6 and 7 are SEM images of the laminate obtained in Example 1 (FIG. 6: 6000 times scale, FIG. 7: 35000 times scale), and FIG. 8 is the laminate obtained in Example 2 is an SEM image (20000-fold scale).
- a scanning electron microscope "JSM-5500" manufactured by JEOL Ltd. was used to acquire SEM images in this specification including these SEM images.
- the average particle diameter and the average particle-to-particle distance based on the above definitions of the silver particles that make up the metallic particle assembly layer covering the substrate were obtained. Also, based on the STEM cross-sectional image (100,000-fold scale), the average height of the silver particles based on the above definition was obtained. A scanning transmission electron microscope "Helios G4 UX” manufactured by FEI was used to obtain STEM cross-sectional images. The aspect ratio of the silver particles was calculated from the obtained average particle size and average height. Table 1 shows the above results. For the laminate of Example 2, an SEM image was obtained (FIG. 8), but the average particle size and the average inter-particle distance were not obtained. As shown in FIG.
- the metal-based particle assembly layer of the laminate of Example 2 contains a plurality of metal-based particles that are spaced apart from each other, but compared to the laminate of Example 1 , there were many portions where the metal-based particles bonded to each other to form a continuous film.
- Example 2 After spin-coating a spin-on-glass (SOG) solution onto a glass substrate at 3000 rpm, the laminate obtained in Example 1 was placed on top of the SOG coating. The SOG coating was then dried at 200° C. to set the laminate.
- SOG solution "OCD T-7 5500T” manufactured by Tokyo Ohka Kogyo Co., Ltd., which is an organic SOG material, was used.
- Rhodamine B solution was spin-coated at 2000 rpm for 100 seconds on the surface to which the laminate was fixed, so that the surface of the laminate carried Rhodamine B, which is a fluorescent dye. This is referred to as measurement sample 1.
- rhodamine B which is a fluorescent dye, was supported on the surface of the particles of Comparative Example 1 in the same manner as above. This sample is referred to as measurement sample 2.
- measurement sample 1 and measurement sample 2 were observed to be rhodamine B supported on the laminate (measurement sample 1) and rhodamine supported on silica particles when irradiated with laser light.
- the fluorescence intensity emitted from B (measurement sample 2) was measured.
- the measurement conditions for fluorescence intensity were as follows. Laser excitation wavelength: 559 nm Detection conditions: Cy5 Objective lens: 40x
- the background value was obtained as follows. An untreated glass substrate (same as those used in measurement samples 1 and 2) was subjected to fluorescence intensity measurement under the same conditions as above to obtain an image. 10 points were randomly selected from the image, the average value of the "INT" values was calculated, and this average value was used as the background value.
- Fluorescence intensity 1 was 19.7 times that of fluorescence intensity 2.
- 9 is an image obtained by fluorescence intensity measurement for measurement sample 1
- FIG. 10 is an image obtained by fluorescence intensity measurement for measurement sample 2.
- Example 3 A solution was obtained by dissolving 1188 ⁇ L of a 25% by mass ammonia (NH 3 ) aqueous solution in 5000 ⁇ L of ethanol. After heating this solution to 50° C., 24.8 mg of the laminate obtained in Example 1 and 32.4 ⁇ L of tetraethyl orthosilicate were added at the same temperature with stirring to prepare a reaction solution. After stirring the reaction solution at 50° C. for 4 hours while sonicating the reaction solution, the supernatant was removed using a centrifuge, followed by washing with water and drying at 80° C. in order. , a laminate was obtained in which a protective layer made of SiO 2 was formed on the metal-based particle assembly layer.
- NH 3 25% by mass ammonia
- the ratio V G / VL2 of the volume V G [cm 3 ] of tetraethyl orthosilicate to the volume V L2 [cm 3 ] of the laminate consisting of the substrate and the metal-based particle assembly layer in the reaction liquid was 2.87. rice field.
- FIGS. 11 and 12 are SEM images (FIG. 11: 7000-fold scale, FIG. 12: 30000-fold scale) of the obtained laminate including the protective layer. From the SEM image, it was confirmed that a protective layer was formed over the entire surface of the laminate obtained in Example 1. It was confirmed that the protective layer was formed not only on the surfaces of the silver particles in the metal-based particle assembly layer, but also in the gaps between the silver particles (where the core particles are exposed). Moreover, it was confirmed that the surface of the protective layer had unevenness following the unevenness of the metal-based particle assembly layer.
- FIG. 13 is a STEM cross-sectional image (100,000-fold scale) of the obtained laminate including the protective layer.
- a scanning transmission electron microscope "Helios G4 UX” manufactured by FEI was used to obtain STEM cross-sectional images. From the image, it was confirmed that a protective layer having a thickness of about 60 to 70 nm was formed generally uniformly.
- Example 4 After 0.75 mL of 0.05 mol/L potassium hydroxide (KOH) aqueous solution was added dropwise to 150 mL of 0.047 mol/L aqueous solution of silver nitrate (AgNO 3 ), the mixture was stirred. The addition of the aqueous potassium hydroxide solution changed the color of the solution from clear and colorless to brown. A 3.5 mol/L ethylenediamine (NH 2 CH 2 CH 2 NH 2 ) aqueous solution was added dropwise to this solution by 50 ⁇ L under stirring, and the dropping was stopped when the solution became colorless and transparent. Let the obtained solution be the silver ion liquid A.
- KOH potassium hydroxide
- a reducing agent liquid B was obtained by mixing 50 mL of a 0.04 mol/L aqueous glucose solution and 25 mL of methanol. Silver ion liquid A was put into the tank, and then 240 mg of silica powder (a spherical particle group having an average particle size of 1.1 ⁇ m manufactured by Nikki Shokubai Kasei Co., Ltd.) as a base material was put into the tank. Next, immediately after the reducing agent solution B is introduced into the bath, the substrate is immersed in the plating solution composed of the silver ion solution A and the reducing agent solution B by stirring the solution in the bath, and the surface of the substrate is The growth of metal-based particles consisting of silver was initiated on top.
- Preparation of the plating solution and immersion of the base material in the plating solution were performed in an environment of 25°C. Stirring was continued at 25°C. After 28 minutes from the start of immersion, the base material (laminate) having a metal-based particle assembly layer was separated by filtration, and then the filtrate was washed with a 1:1 volume ratio mixture of acetone and ultrapure water, and then centrifuged. After removing the supernatant using a separator, it was dried at 80° C. to obtain a laminate.
- Example 5 5 mL of 0.05 mol/L potassium hydroxide (KOH) aqueous solution was added dropwise to 666.7 mL of 0.0024 mol/L aqueous solution of silver nitrate (AgNO 3 ), followed by stirring. The addition of the aqueous potassium hydroxide solution changed the color of the solution from clear and colorless to brown. A 3.5 mol/L ethylenediamine (NH 2 CH 2 CH 2 NH 2 ) aqueous solution was added dropwise to this solution by 50 ⁇ L under stirring, and the dropping was stopped when the solution became colorless and transparent. Let the obtained solution be the silver ion liquid A.
- KOH potassium hydroxide
- a reducing agent liquid B was obtained by mixing 222.2 mL of a 0.006 mol/L glucose aqueous solution and 111.1 mL of methanol.
- Silver ion liquid A was charged into the tank, and then 46.7 mg of silica powder (a spherical particle group having an average particle size of 0.55 ⁇ m manufactured by Nikki Shokubai Kasei Co., Ltd.) was charged into the tank as a base material.
- the substrate is immersed in the plating solution composed of the silver ion solution A and the reducing agent solution B by stirring the solution in the bath, and the surface of the substrate is The growth of metal-based particles consisting of silver was initiated on top.
- Preparation of the plating solution and immersion of the base material in the plating solution were performed in an environment of 25°C. Stirring was continued at 25°C. After 28 minutes from the start of immersion, the base material (laminate) having a metal-based particle assembly layer was separated by filtration, and then the filtrate was washed with a 1:1 volume ratio mixture of acetone and ultrapure water, and then centrifuged. After removing the supernatant using a separator, it was dried at 80° C. to obtain a laminate.
- Example 6 After 0.25 mL of 0.05 mol/L potassium hydroxide (KOH) aqueous solution was added dropwise to 50 mL of 0.047 mol/L aqueous solution of silver nitrate (AgNO 3 ), the mixture was stirred. The addition of the aqueous potassium hydroxide solution changed the color of the solution from clear and colorless to brown. A 3.5 mol/L ethylenediamine (NH 2 CH 2 CH 2 NH 2 ) aqueous solution was added dropwise to this solution by 50 ⁇ L under stirring, and the dropping was stopped when the solution became colorless and transparent. Let the obtained solution be the silver ion liquid A.
- KOH potassium hydroxide
- a reducing agent liquid B was obtained by mixing 16.6 mL of a 0.06 mol/L aqueous glucose solution and 8.4 mL of methanol.
- Silver ion liquid A was put into the tank, and then 362 mg of alumina powder (“Advance Alumina AA-3” manufactured by Sumitomo Chemical Co., Ltd., amorphous particles with an average particle size of 3 ⁇ m) as a base material was put into the tank. bottom.
- the substrate is immersed in the plating solution composed of the silver ion solution A and the reducing agent solution B by stirring the solution in the bath, and the surface of the substrate is The growth of metal-based particles consisting of silver was initiated on top.
- Preparation of the plating solution and immersion of the base material in the plating solution were performed in an environment of 25°C. Stirring was continued at 25°C. After 28 minutes from the start of immersion, the base material (laminate) having a metal-based particle assembly layer was separated by filtration, and then the filtrate was washed with a 1:1 volume ratio mixture of acetone and ultrapure water, and then centrifuged. After removing the supernatant using a separator, it was dried at 80° C. to obtain a laminate.
- Example 7 A solution was obtained by dissolving 1188 ⁇ L of a 25% by mass ammonia (NH 3 ) aqueous solution in 5000 ⁇ L of ethanol. After heating this solution to 50° C., 24.8 mg of the laminate obtained in Example 1 and 5.0 ⁇ L of tetraethyl orthosilicate were added at the same temperature with stirring to prepare a reaction solution. After stirring the reaction solution at 50° C. for 4 hours while sonicating the reaction solution, the supernatant was removed using a centrifuge, followed by washing with water and drying at 80° C. in order. , a laminate was obtained in which a protective layer made of SiO 2 was formed on the metal-based particle assembly layer.
- NH 3 25% by mass ammonia
- the ratio V G /VL2 of the volume V G [cm 3 ] of tetraethyl orthosilicate to the volume V L2 [cm 3 ] of the laminate consisting of the substrate and the metal-based particle assembly layer in the reaction liquid was 0.443 . rice field.
- a STEM cross-sectional image was obtained in the same manner as in Example 3. From the image, it was confirmed that a protective layer having a thickness of about 20 nm was formed generally uniformly.
- Example 8> A solution was obtained by dissolving 1188 ⁇ L of a 25% by mass ammonia (NH 3 ) aqueous solution in 5000 ⁇ L of ethanol. After heating this solution to 50° C., 24.8 mg of the laminate obtained in Example 1 and 15.0 ⁇ L of tetraethyl orthosilicate were added at the same temperature with stirring to prepare a reaction solution. After stirring the reaction solution at 50° C. for 4 hours while sonicating the reaction solution, the supernatant was removed using a centrifuge, followed by washing with water and drying at 80° C. in order. , a laminate was obtained in which a protective layer made of SiO 2 was formed on the metal-based particle assembly layer.
- NH 3 25% by mass ammonia
- the ratio V G / VL2 of the volume V G [cm 3 ] of tetraethyl orthosilicate to the volume V L2 [cm 3 ] of the laminate consisting of the substrate and the metal-based particle assembly layer in the reaction liquid was 1.33. rice field.
- a STEM cross-sectional image was obtained in the same manner as in Example 3. From the image, it was confirmed that a protective layer having a thickness of about 85 nm was formed generally uniformly.
- Example 9 A solution was obtained by dissolving 1188 ⁇ L of a 25% by mass ammonia (NH 3 ) aqueous solution in 5000 ⁇ L of ethanol. After heating this solution to 50° C., 24.8 mg of the laminate obtained in Example 1 and 32.4 ⁇ L of tetraethyl orthosilicate were added at the same temperature with stirring to prepare a reaction solution. After stirring the reaction solution at 50° C. for 4 hours while sonicating the reaction solution, the supernatant was removed using a centrifuge, followed by washing with water and drying at 80° C. in order. , a laminate was obtained in which a protective layer made of SiO 2 was formed on the metal-based particle assembly layer.
- NH 3 25% by mass ammonia
- the ratio V G / VL2 of the volume V G [cm 3 ] of tetraethyl orthosilicate to the volume V L2 [cm 3 ] of the laminate consisting of the substrate and the metal-based particle assembly layer in the reaction liquid was 2.87. rice field.
- a STEM cross-sectional image was obtained in the same manner as in Example 3. From the image, it was confirmed that a protective layer having a thickness of about 110 nm was formed generally uniformly.
- the concentration of silver ions in the plating solution the type of reducing agent, the concentration of the reducing agent, the ratio of the concentration of the reducing agent to the saturation concentration (percentage), the immersion time of the substrate in the plating solution, the plating solution Table 2 shows the ratio V S /V L of the volume V S [cm 3 ] of the substrate to the volume V L [cm 3 ] of the substrate, and the average height growth rate of the metal-based particles at the time of 28 minutes from the start of metal deposition. shown in The values of X obtained from the above formula for the substrates used in Examples 4 to 6 are 101 ⁇ 10 ⁇ 7 for Example 4, 41 ⁇ 10 ⁇ 7 for Example 5, and 110 ⁇ 10 for Example 6, respectively. -7 .
- SEM images of the laminates obtained in Examples 5 to 9, respectively are SEM images of the laminates obtained in Examples 5 to 9, respectively. From the SEM image, the average particle diameter and the average particle-to-particle distance based on the above definition of the silver particles constituting the metal-based particle assembly layer covering the substrate were obtained. Also, based on the STEM cross-sectional image (100,000-fold scale), the average height of the silver particles based on the above definition was determined. A scanning transmission electron microscope "Helios G4 UX" manufactured by FEI was used to obtain STEM cross-sectional images. The aspect ratio of the silver particles was calculated from the obtained average particle size and average height. Table 2 shows the above results.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Immunology (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Molecular Biology (AREA)
- Biomedical Technology (AREA)
- Urology & Nephrology (AREA)
- Hematology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Pathology (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Inorganic Chemistry (AREA)
- Nanotechnology (AREA)
- Microbiology (AREA)
- Food Science & Technology (AREA)
- Cell Biology (AREA)
- Medicinal Chemistry (AREA)
- Biotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Biophysics (AREA)
- Optics & Photonics (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
- Powder Metallurgy (AREA)
- Chemically Coating (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Laminated Bodies (AREA)
Abstract
Description
[1] 立体表面を有する基材と、
前記立体表面上に配置される層であって、互いに離間して配置される複数の金属系粒子を含む金属系粒子集合体層と、
を備える積層物の製造方法であって、
前記製造方法は、前記金属系粒子を構成する金属のカチオンを含むメッキ液に前記基材を浸漬した状態で前記カチオンを還元することによって前記金属系粒子集合体層を前記立体表面上に形成する工程を含み、
前記メッキ液の体積VL[cm3]に対する前記基材の体積VS[cm3]の比VS/VLが0.03以下である、製造方法。
[2] 前記積層物が備える金属系粒子集合体層において、前記複数の金属系粒子の平均粒径が5nm以上1600nm以下である、[1]に記載の製造方法。
[3] 前記積層物が備える金属系粒子集合体層において、前記複数の金属系粒子は、それぞれ、その隣り合う金属系粒子との平均距離が1nm以上150nm以下となるように配置されている、[1]又は[2]に記載の製造方法。
[4] 前記金属系粒子集合体層を形成する工程において、前記立体表面上への前記金属の堆積開始から28分経過時点での金属系粒子の平均高さ成長速度が6nm/分以下である、[1]~[3]のいずれかに記載の製造方法。
[5] 前記基材が粒子である、[1]~[4]のいずれかに記載の製造方法。
[6] 前記金属系粒子集合体層を形成する工程は、下記式(1)を満たす、[5]に記載の製造方法。
10×10-7≦X≦600×10-7 (1)
[式(1)中、Xは、前記粒子が球状であるとき、下記式で表される。
(式中、aは前記メッキ液の前記カチオンの濃度(mol/L)、Vは前記メッキ液の体積(L)、Dは前記カチオンの還元によって生じる金属(0価)の原子量、Bは前記基材の粒子数(個)、Cは前記カチオンの還元によって生じる金属(0価)の比重(g/cm3)、Rは前記粒子の半径(cm)を表す。)
Xは、前記粒子が不定形であるとき、下記式で表される。
(式中、a、V、D及びCは前記と同じ意味を表す。Sは前記粒子の表面積の総和を表す。)]
[7] 前記メッキ液は、前記カチオンを還元可能な還元剤をさらに含む、[1]~[6]のいずれかに記載の製造方法。
[8] 前記還元剤は、標準酸化還元電位が-0.5V以上である、[7]に記載の製造方法。
[9] 前記還元剤がグルコースである、[7]又は[8]に記載の製造方法。
[10] 前記メッキ液は、錯化剤をさらに含む、[1]~[9]のいずれかに記載の製造方法。
[11] 前記錯化剤がアンモニア又はアミン系錯化剤である、[10]に記載の製造方法。
[12] 前記金属系粒子集合体層を形成する工程の後に、前記金属系粒子集合体層上に絶縁性材料から構成される保護層を形成する工程をさらに含む、[1]~[11]のいずれかに記載の製造方法。
[13] 前記保護層は、ゾルゲル法により形成される、[12]に記載の製造方法。
[14] 前記絶縁性材料がSiO2である、[12]又は[13]に記載の製造方法。
[15] 前記保護層の厚みが300nm以下である、[12]~[14]のいずれかに記載の製造方法。
以下、実施の形態を示して、本発明に係る積層物の製造方法(以下、単に「積層物の製造方法」ともいう。)及び該製造方法によって得られる積層物について説明する。
本明細書において「積層物」とは、立体表面を有する基材と、該立体表面上に配置される層であって、互いに離間して配置される複数の金属系粒子(金属で構成される粒子)を含む金属系粒子集合体層とを備える積層構造体をいう。該積層構造体は、上記以外の他の層を含んでいてもよい。基材の「立体表面」とは、三次元的な表面を意味し、その一例は曲面である。
金属系粒子集合体層形成工程では、金属系粒子を構成する金属カチオンを含むメッキ液に基材を浸漬した状態で金属カチオンの還元を行う。この工程は、例えば図3に示されるように、槽50に収容された金属カチオンを含むメッキ液60に基材10を攪拌下に加えることによって行うことができる。基材10を、金属カチオンを含むメッキ液60に浸漬させると、金属カチオンの還元によって生じる金属(0価)が基材10の表面に堆積し始め、反応時間の経過とともに堆積した金属は粒子状に成長していき、金属系粒子の集合体(金属系粒子集合体層)が形成される。金属系粒子集合体層は、好ましくは、基材10の立体表面の全体に形成され、より好ましくは、基材10の表面全体に形成される。
上記粒径は、次の方法に従って測定される。日本電子株式会社製の走査型電子顕微鏡「JSM-5500」又はこれと同等の装置を用いて、粒子を付着させた基板(ガラス基板等)の該粒子を含む直上からのSEM観察画像を取得する。該SEM観察画像において、粒子像内に無作為に接線径を5本引き(ただし、接線径となる直線はいずれも粒子像内部のみを通ることができ、このうち1本は粒子内部のみ通り、最も長く引ける直線であるものとする。)、その平均値(接線径平均値)を粒子の粒径とする。接線径とは、粒子の輪郭(投影像)をこれに接する2本の平行線で挟んだときの間隔(日刊工業新聞社 「粒子計測技術」,1994,第5頁)を結ぶ垂線と定義する。
上記平均粒径は、次の方法に従って測定される。日本電子株式会社製の走査型電子顕微鏡「JSM-5500」又はこれと同等の装置を用いて、粒子群を付着させた基板(ガラス基板等)の該粒子群を含む直上からのSEM観察画像を取得する。該SEM観察画像において、無作為に粒子を10個選択し、各粒子像内に無作為に接線径を5本引き(ただし、接線径となる直線はいずれも粒子像内部のみを通ることができ、このうち1本は粒子内部のみ通り、最も長く引ける直線であるものとする。)、その平均値(接線径平均値)を求める。選択した10個すべての粒子について接線径平均値を取得する。接線径の定義は上述と同じである。それぞれの粒子の接線径平均値の1/4の長さをそれぞれの粒子の「縁領域長さ」と定義する。また、それぞれの粒子のSEM観察画像上での輪郭線から粒子内側に向かって「縁領域長さ」分の範囲を、それぞれの粒子の「縁領域」と定義する。そして、上記10個の粒子のうち、他の粒子の縁領域に一部でも重なる粒子が存在する場合には、その粒子を破棄し、不足する個数分だけ新たに粒子を無作為に選択して上記と同様にして接線径平均値を取得する。必要に応じて以上を繰り返し、縁領域と重なることがない粒子10個についての接線径平均値を得る。得られた10個の接線径平均値の平均値を平均粒径とする。
基材10は、透光性を有することが好ましく、光学的に透明であることがより好ましい。
金属カチオンを含む金属カチオン液は通常、金属カチオンと溶媒とを含む。基材10上に形成される金属系粒子集合体層は、後述するように、好ましくはプラズモン構造体である。この観点から、金属カチオンの金属種は、メッキ液60に基材10を接触させた状態で金属カチオンを還元する処理によって金属系粒子を基材10上に堆積させることができるものであって、かつ、金属系粒子又はその集合体としたときに、吸光光度法による吸光スペクトル測定において紫外~可視領域に現れるプラズモン共鳴ピーク(以下、「プラズモンピーク」ともいう。)を示す材料(プラズモン共鳴を示し得る材料)であることが好ましい。このような金属としては、例えば、金、銀、銅、白金、パラジウムのような貴金属;アルミニウムのような他の金属;該貴金属又は他の金属を含有する合金を挙げることができる。中でも、金、銀、銅、白金、パラジウム等の貴金属が好ましく、安価で吸収が小さい(可視光波長において誘電関数の虚部が小さい)という観点からは銀であることがより好ましい。メッキ液60は、2種以上の金属カチオンを含んでいてもよい。
例えば基材10が粒子である場合、基材10の体積VSは、粒子総重量を粒子密度で割った値として求めることができる。
標準酸化還元電位が-0.5V以上である還元剤としては、グルコース、アスコルビン酸等が挙げられる。メッキ液60は、2種以上の還元剤を含んでいてもよい。
メッキ液60における還元剤の飽和濃度は、基材10をメッキ液60に浸漬する処理を行う温度においてメッキ液60に含有される溶媒(金属カチオンを含まないもの)に還元剤を溶解させるときの飽和濃度である。
10×10-7≦X≦600×10-7 (1)
上記比VS/VLが上述の範囲であると、Xの値を上記範囲に制御しやすくなる。Xの値は、より好ましくは30×10-7以上450×10-7以下、さらに好ましくは40
×10-7以上300×10-7以下である。
式中、aはメッキ液60の金属カチオンの濃度(mol/L)、Vはメッキ液60の体積(L)、Dは金属カチオンの還元によって生じる金属(0価)の原子量、Bは基材10の粒子数(個)、Cは金属カチオンの還元によって生じる金属(0価)の比重(g/cm3)、Rは基材10である粒子の半径(cm)を表す。
式中、Rは前記と同じ意味を表す。粒子の半径R(cm)は、上記に従って求められる粒子の平均粒径の1/2の値である。
金属系粒子集合体層形成工程によって、互いに離間して配置される複数の金属系粒子を含む金属系粒子集合体層が基材10の立体表面上に形成される。
[a]金属系粒子集合体層が示すプラズモン共鳴の作用範囲(プラズモンによる発光増強効果の及ぶ範囲)が広く、金属系粒子集合体層の表面から例えば数百nm(例えば200nm)の範囲内にある発光体の発光をも増強し得る。
[b]金属系粒子集合体層が強いプラズモン共鳴を示すため、強い発光増強効果を得ることができる。
吸光度=-log10(I/I0)
で表される。
吸光スペクトルは、一般の分光光度計を用いて測定することができる。
金属系粒子の平均粒径は、金属系粒子を構成する金属系材料の種類に応じて適切に選択されることが好ましい。
上記アスペクト比は、上記平均高さに対する上記平均粒径の比(平均粒径/平均高さ)で定義される。金属系粒子は真球状であってもよいが、上記[a]及び[b]の効果を効果的に得る観点から、アスペクト比が1を超える扁平形状を有していることが好ましい。
金属系粒子の数密度は、強いプラズモン共鳴及びプラズモン共鳴の作用範囲の伸長を発現しやすくする観点から、基材の表面積1μm2あたり、好ましくは7個以上、より好ましくは15個以上である。
積層物の製造方法は、金属系粒子集合体層上に絶縁性材料から構成される保護層を形成する工程を含むことができる。図4は、積層物の他の一例を模式的に示す断面図である。図4に示される積層物2は、立体表面を有する基材10(コア粒子)と、基材10の立体表面の少なくとも一部(好ましくは表面全体)に配置される金属系粒子集合体層と、少なくとも複数の金属系粒子20の表面を覆う保護層30とを含む。保護層は、少なくとも基材表面上の複数の金属系粒子の表面を覆うように形成されることが好ましい。
[A]積層物を、被検出物質を標識する発光体からの発光の強度を増強させるための発光増強要素として用いる場合において、発光体が積層物の金属系粒子に直接接触していると、発光体から金属系粒子への電子トンネリングによる消光が起こる可能性があり、増強効果が低下し得る。金属系粒子上に保護層を設けることにより、発光体と金属系粒子とを確実に離間させることができるため、消光を抑制できる。
[B]積層物(基材及び/又は金属系粒子)の安定性(耐酸化性等)及び耐環境安定性(例えば耐光性、耐湿度性、耐熱性等)を高めることができる。
〔a〕上記(1)で述べた金属系粒子集合体層形成工程を行った後、後述するゾル-ゲル法により保護層を形成する方法。
〔b〕上記(1)で述べた金属系粒子集合体層形成工程を行った後、後述するゾル-ゲル法以外の方法(例えば、スパッタリング法(粉体スパッタリングであってもよい。)、蒸着法(粉体蒸着であってもよい)、CVD(粉体CVDであってもよい)等)により保護層を形成する方法。
〔c〕上記(1)で述べた金属系粒子集合体層形成工程以外の方法(例えば、スパッタリング法、蒸着法(真空蒸着等)等)により金属系粒子集合体層を形成した後、後述するゾル-ゲル法により保護層を形成する方法。
〔d〕上記(1)で述べた金属系粒子集合体層形成工程以外の方法(例えば、スパッタリング法、蒸着法(真空蒸着等)等)により金属系粒子集合体層を形成した後、後述するゾル-ゲル法以外の方法(例えば、スパッタリング法(粉体スパッタリングであってもよい。)、蒸着法(粉体蒸着であってもよい)、CVD(粉体CVDであってもよい)等)により保護層を形成する方法。
本発明に係る積層物、とりわけプラズモン構造体を備える積層物は、センサ素子用の発光増強要素として好適に用いることができる。センサ素子は、例えば、被検出物質を検出するために用いられるセンサ素子であって、基板と、該基板上に配置される積層物と、該積層物上に配置され、被検出物質と特異的に結合する捕捉物質を有する捕捉部とを含む。積層物は、上述の保護層を含むものであってもよい。
例えば、被検出物質90となり得るDNAの大きさは数nm~数十nm程度であり得、5nm~15nmであり得る。例えば、ウィルスの大きさは数十nm~百数十nm程度であり得、30nm~120nmであり得る。これらが被検出物質90である場合、これに結合される標識91と金属系粒子集合体層との距離は、例えば数十nm~数百nmになり得る。このような場合においても上記センサ素子によれば、標識91からの発光を増強させることができる。
0.047mol/Lの硝酸銀(AgNO3)水溶液50mLに0.05mol/Lの水酸化カリウム(KOH)水溶液0.25mLを滴下した後、攪拌した。水酸化カリウム水溶液の添加により溶液は無色透明から褐色に変色した。この溶液に、3.5mol/Lのエチレンジアミン(NH2CH2CH2NH2)水溶液を攪拌下に50μLずつ滴下し、溶液が無色透明になったところで滴下を止めた。得られた溶液を銀イオン液Aとする。
還元剤の濃度及び還元剤の濃度の飽和濃度に対する比(百分率)が表1に示される値となるように、還元剤液Bの調製に用いたグルコース水溶液のグルコース濃度を変更したこと以外は実施例1と同様にして金属系粒子集合体層形成工程を行い、積層物を得た。
実施例1で用いた基材(シリカパウダー)を比較例1の粒子とした。なお、基材として用いたシリカパウダーの平均粒径(3μm)は上述の粒子群の平均粒径の測定方法に従って求めた。
球状粒子であるシリカパウダーを基材として用いた実施例1及び実施例2において、上記式から求められるXの値は、いずれも121×10-7であった。
ガラス基板上にスピンオングラス(SOG)溶液を3000rpmでスピンコートした後、SOGの塗膜の上に実施例1で得られた積層物を置いた。次いで、SOGの塗膜を200℃で乾燥させて、積層物を固定した。SOG溶液には、有機系SOG材料である東京応化工業株式会社製「OCD T-7 5500T」を用いた。
レーザー励起波長:559nm
検出条件:Cy5
対物レンズ:40倍
図9は測定サンプル1についての蛍光強度測定で得られた画像であり、図10は測定サンプル2についての蛍光強度測定で得られた画像である。
エタノール5000μLに25質量%のアンモニア(NH3)水溶液1188μLを溶解させて溶液を得た。この溶液を50℃まで昇温した後、同温度で、実施例1で得られた積層物24.8mg及びオルトケイ酸テトラエチル32.4μLを攪拌下に添加して反応液とした。反応液に対して超音波処理を行いながら、50℃での反応液の攪拌を4時間継続した後、遠心分離機を用いて上澄みを取り除き、水による洗浄及び80℃での乾燥を順に行って、金属系粒子集合体層の上にSiO2からなる保護層が形成された積層物を得た。反応液における基材及び金属系粒子集合体層からなる積層物の体積VL2[cm3]に対するオルトケイ酸テトラエチルの体積VG[cm3]の比VG/VL2は、2.87であった。
0.047mol/Lの硝酸銀(AgNO3)水溶液150mLに0.05mol/Lの水酸化カリウム(KOH)水溶液0.75mLを滴下した後、攪拌した。水酸化カリウム水溶液の添加により溶液は無色透明から褐色に変色した。この溶液に、3.5mol/Lのエチレンジアミン(NH2CH2CH2NH2)水溶液を攪拌下に50μLずつ滴下し、溶液が無色透明になったところで滴下を止めた。得られた溶液を銀イオン液Aとする。
0.0024mol/Lの硝酸銀(AgNO3)水溶液666.7mLに0.05mol/Lの水酸化カリウム(KOH)水溶液5mLを滴下した後、攪拌した。水酸化カリウム水溶液の添加により溶液は無色透明から褐色に変色した。この溶液に、3.5mol/Lのエチレンジアミン(NH2CH2CH2NH2)水溶液を攪拌下に50μLずつ滴下し、溶液が無色透明になったところで滴下を止めた。得られた溶液を銀イオン液Aとする。
0.047mol/Lの硝酸銀(AgNO3)水溶液50mLに0.05mol/Lの水酸化カリウム(KOH)水溶液0.25mLを滴下した後、攪拌した。水酸化カリウム水溶液の添加により溶液は無色透明から褐色に変色した。この溶液に、3.5mol/Lのエチレンジアミン(NH2CH2CH2NH2)水溶液を攪拌下に50μLずつ滴下し、溶液が無色透明になったところで滴下を止めた。得られた溶液を銀イオン液Aとする。
エタノール5000μLに25質量%のアンモニア(NH3)水溶液1188μLを溶解させて溶液を得た。この溶液を50℃まで昇温した後、同温度で、実施例1で得られた積層物24.8mg及びオルトケイ酸テトラエチル5.0μLを攪拌下に添加して反応液とした。反応液に対して超音波処理を行いながら、50℃での反応液の攪拌を4時間継続した後、遠心分離機を用いて上澄みを取り除き、水による洗浄及び80℃での乾燥を順に行って、金属系粒子集合体層の上にSiO2からなる保護層が形成された積層物を得た。反応液における基材及び金属系粒子集合体層からなる積層物の体積VL2[cm3]に対するオルトケイ酸テトラエチルの体積VG[cm3]の比VG/VL2は、0.443であった。
エタノール5000μLに25質量%のアンモニア(NH3)水溶液1188μLを溶解させて溶液を得た。この溶液を50℃まで昇温した後、同温度で、実施例1で得られた積層物24.8mg及びオルトケイ酸テトラエチル15.0μLを攪拌下に添加して反応液とした。反応液に対して超音波処理を行いながら、50℃での反応液の攪拌を4時間継続した後、遠心分離機を用いて上澄みを取り除き、水による洗浄及び80℃での乾燥を順に行って、金属系粒子集合体層の上にSiO2からなる保護層が形成された積層物を得た。反応液における基材及び金属系粒子集合体層からなる積層物の体積VL2[cm3]に対するオルトケイ酸テトラエチルの体積VG[cm3]の比VG/VL2は、1.33であった。
エタノール5000μLに25質量%のアンモニア(NH3)水溶液1188μLを溶解させて溶液を得た。この溶液を50℃まで昇温した後、同温度で、実施例1で得られた積層物24.8mg及びオルトケイ酸テトラエチル32.4μLを攪拌下に添加して反応液とした。反応液に対して超音波処理を行いながら、50℃での反応液の攪拌を4時間継続した後、遠心分離機を用いて上澄みを取り除き、水による洗浄及び80℃での乾燥を順に行って、金属系粒子集合体層の上にSiO2からなる保護層が形成された積層物を得た。反応液における基材及び金属系粒子集合体層からなる積層物の体積VL2[cm3]に対するオルトケイ酸テトラエチルの体積VG[cm3]の比VG/VL2は、2.87であった。
実施例4~6で用いた基材の上記式から求められるXの値は、それぞれ、実施例4について101×10-7、実施例5について41×10-7、実施例6について110×10-7であった。
実施例1で得られた積層物と同じ方法で、実施例4、6、7及び9の積層物について、蛍光強度の増強効果を評価した。その結果、実施例4、6、7及び9の積層物の蛍光強度1は、それぞれ、蛍光強度2の4.5倍、1.3倍、18倍、4.6倍であった。蛍光強度2とは、実施例1で得られた積層物についての評価と同じく、各実施例で用いた基材である粒子の表面に蛍光色素であるローダミンBを担持させてなる測定サンプル2から発せされる蛍光強度である。
Claims (15)
- 立体表面を有する基材と、
前記立体表面上に配置される層であって、互いに離間して配置される複数の金属系粒子を含む金属系粒子集合体層と、
を備える積層物の製造方法であって、
前記製造方法は、前記金属系粒子を構成する金属のカチオンを含むメッキ液に前記基材を浸漬した状態で前記カチオンを還元することによって前記金属系粒子集合体層を前記立体表面上に形成する工程を含み、
前記メッキ液の体積VL[cm3]に対する前記基材の体積VS[cm3]の比VS/VLが0.03以下である、製造方法。 - 前記積層物が備える金属系粒子集合体層において、前記複数の金属系粒子の平均粒径が5nm以上1600nm以下である、請求項1に記載の製造方法。
- 前記積層物が備える金属系粒子集合体層において、前記複数の金属系粒子は、それぞれ、その隣り合う金属系粒子との平均距離が1nm以上150nm以下となるように配置されている、請求項1に記載の製造方法。
- 前記金属系粒子集合体層を形成する工程において、前記立体表面上への前記金属の堆積開始から28分経過時点での金属系粒子の平均高さ成長速度が6nm/分以下である、請求項1に記載の製造方法。
- 前記基材が粒子である、請求項1に記載の製造方法。
- 前記金属系粒子集合体層を形成する工程は、下記式(1)を満たす、請求項5に記載の製造方法。
10×10-7≦X≦600×10-7 (1)
[式(1)中、Xは、前記粒子が球状であるとき、下記式で表される。
(式中、aは前記メッキ液の前記カチオンの濃度(mol/L)、Vは前記メッキ液の体積(L)、Dは前記カチオンの還元によって生じる金属(0価)の原子量、Bは前記基材の粒子数(個)、Cは前記カチオンの還元によって生じる金属(0価)の比重(g/cm3)、Rは前記粒子の半径(cm)を表す。)
Xは、前記粒子が不定形であるとき、下記式で表される。
(式中、a、V、D及びCは前記と同じ意味を表す。Sは前記粒子の表面積の総和を表す。)] - 前記メッキ液は、前記カチオンを還元可能な還元剤をさらに含む、請求項1に記載の製造方法。
- 前記還元剤は、標準酸化還元電位が-0.5V以上である、請求項7に記載の製造方法。
- 前記還元剤がグルコースである、請求項7に記載の製造方法。
- 前記メッキ液は、錯化剤をさらに含む、請求項1に記載の製造方法。
- 前記錯化剤がアンモニア又はアミン系錯化剤である、請求項10に記載の製造方法。
- 前記金属系粒子集合体層を形成する工程の後に、前記金属系粒子集合体層上に絶縁性材料から構成される保護層を形成する工程をさらに含む、請求項1~11のいずれか1項に記載の製造方法。
- 前記保護層は、ゾルゲル法により形成される、請求項12に記載の製造方法。
- 前記絶縁性材料がSiO2である、請求項12に記載の製造方法。
- 前記保護層の厚みが300nm以下である、請求項12に記載の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18/279,660 US20240149337A1 (en) | 2021-07-28 | 2022-07-20 | Method for producing layered product |
CN202280045965.5A CN117616270A (zh) | 2021-07-28 | 2022-07-20 | 层叠物的制造方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021123210 | 2021-07-28 | ||
JP2021-123210 | 2021-07-28 | ||
JP2021-209090 | 2021-12-23 | ||
JP2021209090 | 2021-12-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2023008279A1 true WO2023008279A1 (ja) | 2023-02-02 |
Family
ID=85086793
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2022/028199 WO2023008279A1 (ja) | 2021-07-28 | 2022-07-20 | 積層物の製造方法 |
PCT/JP2022/028198 WO2023008278A1 (ja) | 2021-07-28 | 2022-07-20 | 複合粒子及びその製造方法、並びにセンサ素子 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2022/028198 WO2023008278A1 (ja) | 2021-07-28 | 2022-07-20 | 複合粒子及びその製造方法、並びにセンサ素子 |
Country Status (4)
Country | Link |
---|---|
US (2) | US20240149337A1 (ja) |
JP (2) | JP2023020955A (ja) |
TW (2) | TW202307264A (ja) |
WO (2) | WO2023008279A1 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008055570A (ja) * | 2006-09-01 | 2008-03-13 | Ricoh Co Ltd | 複合金属ナノ粒子、複合金属ナノ粒子を含む多光子吸収反応材料と反応生成物、複合金属ナノ粒子を含む多光子吸収反応助剤 |
WO2011096394A1 (ja) * | 2010-02-02 | 2011-08-11 | コニカミノルタホールディングス株式会社 | アナライト検出プローブおよびこれを用いたアナライトの検出方法 |
WO2019155924A1 (ja) * | 2018-02-06 | 2019-08-15 | 三菱マテリアル株式会社 | 銀被覆樹脂粒子 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008168396A (ja) * | 2007-01-12 | 2008-07-24 | Fujifilm Corp | 微細構造体及びその製造方法、ラマン分光用デバイス、ラマン分光装置 |
JP5006459B1 (ja) * | 2011-05-17 | 2012-08-22 | 古河電気工業株式会社 | 標識用複合粒子 |
KR102331499B1 (ko) * | 2015-07-11 | 2021-12-01 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 수지-백금 복합체 및 그 이용 |
-
2022
- 2022-07-14 JP JP2022113205A patent/JP2023020955A/ja active Pending
- 2022-07-14 JP JP2022113204A patent/JP2023020954A/ja active Pending
- 2022-07-20 WO PCT/JP2022/028199 patent/WO2023008279A1/ja active Application Filing
- 2022-07-20 US US18/279,660 patent/US20240149337A1/en active Pending
- 2022-07-20 US US18/281,498 patent/US20240151715A1/en active Pending
- 2022-07-20 WO PCT/JP2022/028198 patent/WO2023008278A1/ja active Application Filing
- 2022-07-25 TW TW111127741A patent/TW202307264A/zh unknown
- 2022-07-25 TW TW111127740A patent/TW202306898A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008055570A (ja) * | 2006-09-01 | 2008-03-13 | Ricoh Co Ltd | 複合金属ナノ粒子、複合金属ナノ粒子を含む多光子吸収反応材料と反応生成物、複合金属ナノ粒子を含む多光子吸収反応助剤 |
WO2011096394A1 (ja) * | 2010-02-02 | 2011-08-11 | コニカミノルタホールディングス株式会社 | アナライト検出プローブおよびこれを用いたアナライトの検出方法 |
WO2019155924A1 (ja) * | 2018-02-06 | 2019-08-15 | 三菱マテリアル株式会社 | 銀被覆樹脂粒子 |
Non-Patent Citations (2)
Title |
---|
T. FUKUURAM. KAWASAKI: "Long Range Enhancement of Molecular Fluorescence by Closely Packed Submicro-scale Ag Islands", E-JOURNAL OF SURFACE SCIENCE AND NANOTECHNOLOGY, vol. 7, 2009, pages 653 |
W. STOBERA. FINK, JOURNAL OF COLLOID AND INTERFACE SCIENCE, vol. 26, no. 1, 1968, pages 62 - 69 |
Also Published As
Publication number | Publication date |
---|---|
US20240149337A1 (en) | 2024-05-09 |
TW202307264A (zh) | 2023-02-16 |
TW202306898A (zh) | 2023-02-16 |
US20240151715A1 (en) | 2024-05-09 |
JP2023020954A (ja) | 2023-02-09 |
WO2023008278A1 (ja) | 2023-02-02 |
JP2023020955A (ja) | 2023-02-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Israelsen et al. | Nanoparticle properties and synthesis effects on surface-enhanced Raman scattering enhancement factor: an introduction | |
Yun et al. | Highly sensitive metal-enhanced fluorescence biosensor prepared on electrospun fibers decorated with silica-coated silver nanoparticles | |
US10837904B2 (en) | Metal-enhanced photoluminescence from carbon nanodots | |
US8886464B2 (en) | Microwave-accelerated metal-enhanced detection method | |
Chiu et al. | Enhanced plasmonic biosensors of hybrid gold nanoparticle-graphene oxide-based label-free immunoassay | |
Jonsson et al. | Nanoplasmonic biosensing with focus on short-range ordered nanoholes in thin metal films | |
EP2504687A2 (en) | Metal enhanced fluorescence from metallic nanoburger structures | |
WO2011143288A2 (en) | Tuning of metal enhanced emissions of long-lived luminescent compounds | |
US20100179075A1 (en) | Particles for use in supported nucleic acid ligation and detection sequencing | |
WO2010089147A1 (en) | Surface plasmon resonance sensor | |
WO2023008279A1 (ja) | 積層物の製造方法 | |
US20110195516A1 (en) | Wire grid substrate structure and method for manufacturing such a substrate | |
CN117616270A (zh) | 层叠物的制造方法 | |
Dovbeshko et al. | The enhancement of optical processes near rough surface of metals | |
JP4074829B2 (ja) | バイオマイクロアレイ用基板およびバイオマイクロアレイ | |
JP6900325B2 (ja) | センサーチップ及びセンシングシステム | |
WO2021192785A1 (ja) | 金属系粒子集合体、積層体及びセンシング装置 | |
Saridag et al. | Layer-by-layer coating of natural diatomite with silver nanoparticles for identification of circulating cancer protein biomarkers using SERS | |
WO2023210336A1 (ja) | 基板、分析方法、装置および製造方法 | |
JP2013053902A (ja) | 表面プラズモン励起増強蛍光分光法を利用して蛍光量を測定する定量分析方法ならびにそれに用いられる定量分析用キットおよびアナライト解離抑制剤 | |
Stich et al. | DNA biochips based on surface-enhanced fluorescence (SEF) for high-throughput interaction studies | |
Yang et al. | The impact of analyte size on SERS enhancement location, enhancement factor, excitation wavelength, and spectrum | |
JP2023163124A (ja) | 基板、分析方法、装置および製造方法 | |
TW202408801A (zh) | 積層體及其製造方法 | |
Anderson et al. | Controlled Colloidal Aggregation |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 22849341 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 18279660 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 202280045965.5 Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2022849341 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 2022849341 Country of ref document: EP Effective date: 20240228 |