WO2023005173A1 - 电路板及led背光板 - Google Patents

电路板及led背光板 Download PDF

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Publication number
WO2023005173A1
WO2023005173A1 PCT/CN2022/073309 CN2022073309W WO2023005173A1 WO 2023005173 A1 WO2023005173 A1 WO 2023005173A1 CN 2022073309 W CN2022073309 W CN 2022073309W WO 2023005173 A1 WO2023005173 A1 WO 2023005173A1
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WIPO (PCT)
Prior art keywords
copper foil
circuit board
wires
substrate
board according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/073309
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English (en)
French (fr)
Inventor
黎芳群
李锦乐
李治国
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen TCL Digital Technology Co Ltd
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Shenzhen TCL Digital Technology Co Ltd
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Filing date
Publication date
Application filed by Shenzhen TCL Digital Technology Co Ltd filed Critical Shenzhen TCL Digital Technology Co Ltd
Publication of WO2023005173A1 publication Critical patent/WO2023005173A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present application relates to the field of electronic technology, in particular to a circuit board and an LED backlight board.
  • the number of copper foil layers there are usually different types such as single-sided boards, double-sided boards, and multi-layer boards.
  • single-sided board only one side of the substrate is provided with a copper foil layer, and a number of copper foil wires are formed in the copper foil layer through etching and other processes as conductive lines in the circuit board.
  • double-sided and multi-layer boards the copper foil wires in different copper foil layers are electrically connected through via holes on the substrate.
  • the LED light-emitting chip and the LED driver chip will be designed on the same side of the circuit board, especially on the Mini LED backlight board, the LED light-emitting chip and the LED
  • the number of driver chips is large, so the design of its copper foil wire is relatively complicated.
  • double-sided or multi-layer boards are used to design, and the cost is obviously higher, and if a thicker multi-layer board is used, it will also affect The overall thickness of the backlight.
  • An embodiment of the present application provides a circuit board, including:
  • a substrate one surface of the substrate is provided with a copper foil layer, the copper foil layer includes a plurality of copper foil wires, and the plurality of copper foil wires are not connected to each other in the copper foil layer;
  • the several connecting wires are located outside the copper foil layer, at least part of the copper foil wires are electrically connected to the several connecting wires.
  • the number of the substrate in the circuit board is one, one surface of the substrate is provided with a copper foil layer, and the other surface opposite to the surface is free of a copper foil layer.
  • connection wire is electrically connected between different copper foil wires.
  • the conductive part in the middle of the connecting wire is not in contact with the copper foil wire.
  • the circuit board further includes several electronic components, and the several electronic components are arranged on the substrate.
  • the plurality of electronic components are disposed on the same surface of the substrate.
  • the plurality of electronic components include at least one of LED light emitting chips and LED driving chips.
  • the plurality of electronic components include LED light emitting chips and LED driving chips, and the LED light emitting chips and LED driving chips are arranged on the same surface of the substrate.
  • the circuit board further includes an insulating layer overlying the copper foil layer.
  • the plurality of electronic components are disposed above the insulating layer.
  • the plurality of electronic components include LED light emitting chips and LED driving chips, and the LED light emitting chips and LED driving chips are arranged above the insulating layer.
  • the connecting wires are disposed above the insulating layer.
  • the connecting wires are closely attached to the insulating layer.
  • the substrate is an FR4 epoxy resin substrate.
  • both ends of the connection wire are flat, and both ends of the connection wire are connected to the copper foil wire.
  • the plurality of electronic components are disposed on the side where the copper foil layer is located.
  • the plurality of electronic components are soldered on the substrate.
  • a hollow area is provided on the insulating layer to expose the pad on the copper foil layer.
  • the embodiment of the present application also provides an LED backlight board, including a circuit board, and the circuit board includes:
  • a substrate one surface of the substrate is provided with a copper foil layer, the copper foil layer includes a plurality of copper foil wires, and the plurality of copper foil wires are not connected to each other in the copper foil layer;
  • the several connecting wires are located outside the copper foil layer, at least part of the copper foil wires are electrically connected to the several connecting wires.
  • the LED backlight board is a Mini LED backlight board.
  • connection wires outside the copper foil layer of the substrate by setting the connection wires outside the copper foil layer of the substrate and electrically connecting the connection wires with the copper foil conductors, it can not only meet the complex circuit design requirements on the circuit board, but also avoid double-sided boards and multi-layer boards.
  • the complex structural design can not only make the circuit design of the circuit board more flexible, but also reduce the cost of the circuit board.
  • the technical solution provided by this application is suitable for LED backlight panels, especially Mini
  • the design requirements of LED backlight panels can take into account the difficulty of circuit design, cost and thickness requirements.
  • FIG. 1 is a schematic diagram of a first plane structure of a circuit board provided by an embodiment of the present application.
  • FIG. 2 is a first cross-sectional view of the circuit board provided by the embodiment of the present application.
  • FIG. 3 is a second cross-sectional view of the circuit board provided by the embodiment of the present application.
  • FIG. 4 is a schematic diagram of a second plane structure of a circuit board provided by an embodiment of the present application.
  • FIG. 5 is a schematic diagram of a third plane structure of a circuit board provided by an embodiment of the present application.
  • FIG. 6 is a schematic diagram of a fourth planar structure of a circuit board provided by an embodiment of the present application.
  • FIG. 7 is a schematic diagram of a fifth plane structure of a circuit board provided by an embodiment of the present application.
  • FIG. 8 is a third cross-sectional view of the circuit board provided by the embodiment of the present application.
  • FIG. 9 is a fourth cross-sectional view of the circuit board provided by the embodiment of the present application.
  • the embodiment of the present application provides a circuit board, which can be, for example, an LED (light-emitting diode, light-emitting diode) backlight circuit board.
  • a circuit board which can be, for example, an LED (light-emitting diode, light-emitting diode) backlight circuit board.
  • FIG. 1 is a first schematic plan view of the circuit board 100 provided by the embodiment of the present application
  • FIG. 2 is a first cross-sectional view of the circuit board 100 provided by the embodiment of the present application.
  • the circuit board 100 includes a substrate 20 and a plurality of connecting wires 40 .
  • the material of the substrate 20 may include an insulating material, for example, the substrate 20 may be an FR4 epoxy resin substrate.
  • a copper foil layer 22 is disposed on one surface of the substrate 20 .
  • the copper foil layer 22 may or may not cover the surface of the substrate 20 .
  • the copper foil layer 22 includes a plurality of copper foil wires 222 .
  • the copper foil wire 222 can be formed by etching on the copper foil layer 22 , for example.
  • the copper foil wire 222 can be used to electrically connect various electronic components.
  • the plurality of copper foil wires 222 are not connected to each other in the copper foil layer 22 .
  • the number of substrates 20 in the circuit board 100 is one, that is, divided according to the number of copper foil layers, the circuit board 100 is a single-layer board. At this time, one surface of the substrate 20 is provided with the copper foil layer 22 , and the other surface opposite to this surface has no copper foil layer.
  • the substrate 20 may be an aluminum substrate.
  • connection wires 40 are used for conducting electricity, for example, they can be used for electrical connection between different electronic components and wires.
  • the connecting wires 40 are located outside the copper foil layer 22 .
  • the connecting wires 40 can be closely attached to the copper foil layer 22 to reduce the overall thickness of the circuit board 100 , as shown in FIG. 2 .
  • the plurality of connecting wires 40 are spaced from the copper foil layer 22 to improve the insulation performance between the connecting wires 40 and the copper foil layer 22, as shown in FIG. 3, wherein FIG. The second cross-sectional view of the circuit board 100.
  • connection wire 40 is electrically connected between different copper foil wires 222 .
  • each connecting wire 40 may be electrically connected between different copper foil wires 222, so as to realize electrical connection between electronic components connected to different copper foil wires 222, as shown in FIG. 1 Show.
  • each connecting wire in some connecting wires 40 is electrically connected between different copper foil wires 222, so as to realize the electrical connection between the electronic components connected with different copper foil wires 222; in addition, another part
  • Each connecting wire in the connecting wire 40 can be electrically connected to a copper foil wire 222, and is electrically connected to devices outside the circuit board 100, so as to realize the electrical connection between the electronic component connected to the copper foil wire 222 and the external device, As shown in FIG. 4 , FIG. 4 is a schematic diagram of a second planar structure of the circuit board 100 provided in the embodiment of the present application.
  • some copper foil wires 222 may not be electrically connected to the connection wire 40, for example, the two ends of the copper foil wire 222 may be connected to different electronic components, so as to realize the connection between different electronic components. It is not necessary to be electrically connected to the connecting wire 40 at this time, as shown in FIG. 4 .
  • the conductive parts in the middle of the connecting wires 40 are not in contact with the copper foil wires 222 .
  • the connection wire 40 and the copper foil wire 222 do not intersect with each other, thereby ensuring that the conductive part in the middle of the connection wire 40 does not contact the copper foil wire 222 .
  • FIG. 1 the connection wire 40 and the copper foil wire 222 do not intersect with each other, thereby ensuring that the conductive part in the middle of the connection wire 40 does not contact the copper foil wire 222 .
  • the connecting wire 40 may span a plurality of copper foil wires 222 , and the conductive part in the middle of the connecting wire 40 There is a distance between the copper foil wire 222 that is crossed, for example, the conductive part in the middle of the connecting wire 40 is arched away from the direction of the copper foil layer 22, so as to ensure that the conductive part in the middle of the connecting wire 40 does not interfere with the copper foil that is crossed. Wire 222 contacts.
  • connection wire 40 may be in the form of a patch connection wire, an enameled wire, or the like.
  • the chip connection wire is a conductor, such as a conductor formed of copper or silver.
  • the enameled wire is formed by covering the outer surface of the metal wire core with insulating material, for example, the outer surface of the copper wire core is covered with an insulating layer.
  • connection wire 40 may be flat, so as to facilitate the electrical connection between the connection wire 40 and the copper foil wire 222 , for example, to facilitate the welding of the two ends of the connection wire 40 .
  • the plurality of copper foil wires 222 can be electrically connected with electronic components, for example, the electronic components can be welded together with the copper foil wires 222 through pads. Due to factors such as the size of the circuit board 100 itself and the space occupied by devices arranged on the circuit board 100, it is impossible to further arrange more copper foil wires on the copper foil layer 22 to realize the electrical connection between different copper foil wires 222, and by setting Several connection wires 40 realize the electrical connection between different copper foil wires 222, which can well solve this problem. In another application scenario, the copper foil wires 222 need to be electrically connected to external devices. To achieve electrical connection with external devices, this problem can also be well solved by arranging several connecting wires 40 that are electrically connected to some copper foil wires 222 and external devices at the same time.
  • the complex circuit design requirements on the circuit board 100 can be met. , realize the electrical connection between different copper foil wires 222, or realize the electrical connection between the copper foil wire 222 and external devices, and can avoid the complicated structural design of double-sided boards and multi-layer boards, so that the circuit design of the circuit board can be made more In order to be flexible, it can reduce the cost of the circuit board.
  • FIG. 6 is a schematic diagram of a fourth planar structure of the circuit board 100 provided by the embodiment of the present application.
  • the circuit board 100 also includes several electronic components 60 disposed on the substrate 20 .
  • the electronic component 60 may be soldered on the substrate 20 .
  • the plurality of electronic components 60 may be disposed on the same side of the substrate 20 , for example, the side where the copper foil layer 22 is located. It can be understood that, in some other embodiments, the plurality of electronic components 60 may also be disposed on the other side of the substrate 20 opposite to the copper foil layer 22 .
  • the plurality of electronic components 60 include at least one of LED light emitting chips and LED driving chips.
  • the LED light-emitting chip can emit light, thereby forming a light source.
  • the LED driving chip is electrically connected with the LED light-emitting chip to drive the LED light-emitting chip to emit light.
  • the corresponding LED driver chips can be provided separately, for example, on other circuit boards.
  • the corresponding LED light-emitting chips can also be provided separately, for example, on other circuit boards.
  • the LED light-emitting chips and LED driver chips can be arranged on the same side of the substrate 20 , for example, on the side where the copper foil layer 22 is located. It can be understood that, in some other embodiments, the LED light emitting chip and the LED driving chip can also be disposed on the other side of the substrate 20 opposite to the copper foil layer 22 .
  • FIG. 7 is a schematic diagram of a fifth plane structure of a circuit board provided in an embodiment of the present application.
  • the plurality of electronic components 60 include LED light emitting chips 62 and LED driving chips 64 .
  • some copper foil wires 222 are electrically connected to the LED light-emitting chip 62
  • some copper foil wires 222 are electrically connected to the LED driving chip 64 .
  • the copper foil wire 222 connected to the LED light-emitting chip 62 is electrically connected to the copper foil wire 222 connected to the LED driver chip 64 through the connecting wire 40 to realize the electrical connection between the LED light-emitting chip 62 and the LED driver chip 64 .
  • FIG. 8 is a third cross-sectional view of the circuit board 100 provided by the embodiment of the present application.
  • the circuit board 100 further includes an insulating layer 24 covering the copper foil layer 22 . It can be understood that the insulating layer 24 may or may not be covered with the copper foil layer 22 .
  • the area of the insulating layer 24 corresponding to the position on the copper foil layer 22 that needs to be provided with a pad needs to be hollowed out so that the position on the copper foil layer 22 that needs to be provided with a pad is exposed to facilitate welding of various electronic components.
  • the connecting wire 40 can be arranged above the insulating layer 24 and keep a certain distance from the insulating layer 24 , as shown in FIG. 8 , so as to improve the insulation performance between the connecting wire 40 and the copper foil layer 22 . It can be understood that, in some embodiments, the connection wire 40 can be arranged above the insulating layer 24 and be close to the insulating layer 24, so as to reduce the overall thickness of the circuit board 100, as shown in FIG. 9 , which is an embodiment of the present application.
  • the fourth cross-sectional view of the circuit board 100 provided as an example.
  • the above-mentioned several electronic components 60 may be disposed above the insulating layer 24 to ensure the insulation performance between the electronic components 60 and the copper foil layer 22 .
  • both the LED light emitting chips 62 and the LED driving chips 64 are disposed above the insulating layer 24 .
  • the embodiment of the present application also provides an LED backlight board, including the circuit board 100 of any one of the above embodiments.
  • the LED backlight panel of the embodiment of the present application can be used as a display screen light source of electronic devices such as smart phones and tablet computers.
  • the LED backlight can be a Mini LED backlight.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)

Abstract

本申请提供一种电路板及LED背光板，通过在基板铜箔层的外部设置连接线，连接线与铜箔导线电连接，既可以满足电路板上的复杂线路设计需求，又能够避免双面板、多层板复杂的结构设计，能够降低电路板的成本。本申请提供的技术方案适合LED背光板，尤其是Mini LED背光板的设计需求，可以兼顾其线路设计难度、成本及厚度要求。

Description

电路板及LED背光板 技术领域
本申请涉及电子技术领域，特别涉及一种电路板及LED背光板。
 背景技术
当前，在电路板的设计中，按铜箔层数量区分，通常存在单面板、双面板、多层板等不同类型。单面板中，只在基板的一面设置有铜箔层，铜箔层内通过蚀刻等工艺形成若干铜箔导线作为电路板内的导电线路。双面板和多层板中，不同铜箔层内的铜箔导线通过基板上的过孔实现电连接。
随着电路设计越来越复杂，电路板上的铜箔导线越来越密集，单面板无法满足电路板内铜箔导线的设计需求，通常就需要采用双面板和多层板。而由于双面板和多层板需要在基板上设置大量的过孔，并且在过孔内镀铜实现电连接，从而导致电路板设计复杂、工艺及材料成本高。
 技术问题
在LED领域，在LED背光板的设计上，为降低灯板厚度，会将LED发光芯片与LED驱动芯片设计在电路板的同一面，尤其是在Mini LED背光板上，其LED发光芯片与LED驱动芯片的数量较多，因此其铜箔导线的设计复杂程度较高，通常会采用双面板或多层板来设计，其成本明显较高，且若采用较厚的多层板，也会影响背光板的整体厚度。
 技术解决方案
本申请实施例提供一种电路板，包括：
基板，基板的一表面设置有铜箔层，所述铜箔层包括若干铜箔导线，所述若干铜箔导线在所述铜箔层内互不相连；
若干用于导电的连接线，所述若干连接线位于所述铜箔层外，至少部分铜箔导线与所述若干连接线电连接。
在一些实施例中，所述电路板内所述基板的数量为一，所述基板的一表面设置有铜箔层，与所述表面相对的另一表面无铜箔层。
在一些实施例中，至少一连接线电连接于不同的所述铜箔导线之间。
在一些实施例中，所述连接线的中部的导电部分不与所述铜箔导线接触。
在一些实施例中，所述电路板还包括若干电子元件，所述若干电子元件设置在所述基板上。
在一些实施例中，所述若干电子元件设置在所述基板的同一面。
在一些实施例中，所述若干电子元件包括LED发光芯片、LED驱动芯片中的至少一种。
在一些实施例中，所述若干电子元件包括LED发光芯片和LED驱动芯片，所述LED发光芯片和LED驱动芯片设置于所述基板的同一面。
在一些实施例中，所述电路板还包括绝缘层，所述绝缘层覆于所述铜箔层上方。
在一些实施例中，所述若干电子元件设置在所述绝缘层上方。
在一些实施例中，所述若干电子元件包括LED发光芯片和LED驱动芯片，所述LED发光芯片和LED驱动芯片设置于所述绝缘层上方。
在一些实施例中，所述若干连接线设置在所述绝缘层上方。
在一些实施例中，所述若干连接线紧贴所述绝缘层。
在一些实施例中，所述基板为FR4环氧树脂基板。
在一些实施例中，所述连接线的两端呈扁平状，所述连接线的两端与所述铜箔导线连接。
在一些实施例中，所述若干电子元件设置于所述铜箔层所在的一面。
在一些实施例中，所述若干电子元件焊接在所述基板上。
在一些实施例中，所述绝缘层上设置有镂空区域，以露出所述铜箔层上的焊盘。
本申请实施例还提供一种LED背光板，包括电路板，所述电路板包括：
基板，基板的一表面设置有铜箔层，所述铜箔层包括若干铜箔导线，所述若干铜箔导线在所述铜箔层内互不相连；
若干用于导电的连接线，所述若干连接线位于所述铜箔层外，至少部分铜箔导线与所述若干连接线电连接。
在一些实施例中，所述LED背光板为Mini LED背光板。
 有益效果
本申请的电路板中，通过在基板铜箔层的外部设置连接线，通过连接线与铜箔导线电连接，既可以满足电路板上的复杂线路设计需求，又能够避免双面板、多层板复杂的结构设计，因此既能够使电路板的线路设计更为灵活，又能够降低电路板的成本。
特别的，本申请提供的技术方案适合LED背光板，尤其是Mini LED背光板的设计需求，可以兼顾其线路设计难度、成本及厚度要求。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍。显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的电路板的第一种平面结构示意图。
图2为本申请实施例提供的电路板的第一种剖视图。
图3为本申请实施例提供的电路板的第二种剖视图。
图4为本申请实施例提供的电路板的第二种平面结构示意图。
图5为本申请实施例提供的电路板的第三种平面结构示意图。
图6为本申请实施例提供的电路板的第四种平面结构示意图。
图7为本申请实施例提供的电路板的第五种平面结构示意图。
图8为本申请实施例提供的电路板的第三种剖视图。
图9为本申请实施例提供的电路板的第四种剖视图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请实施例提供一种电路板，该电路板例如可以为LED（light-emitting diode，发光二极管）背光板的电路板。
参考图1和图2，图1为本申请实施例提供的电路板100的第一种平面结构示意图，图2为本申请实施例提供的电路板100的第一种剖视图。
电路板100包括基板20以及若干连接线40。
其中，基板20的材质可以包括绝缘材质，例如基板20可以为FR4环氧树脂基板。基板20的一表面设置有铜箔层22。铜箔层22可以铺满基板20的表面，也可以不铺满基板20的表面。铜箔层22包括若干铜箔导线222。铜箔导线222例如可以通过在铜箔层22上蚀刻形成。铜箔导线222可以用于电连接各种电子元件。该若干铜箔导线222在铜箔层22内互不相连。
在一些实施例中，电路板100内基板20的数量为一，也即根据铜箔层的数量划分，电路板100为单层板。此时，基板20的一表面设置有铜箔层22，与该表面相对的另一表面无铜箔层。
需要说明的是，在一些实施例中，基板20可以为铝基板。
若干连接线40用于导电，例如可以用于在不同的电子元件、导线之间起到电连接作用。该若干连接线40位于铜箔层22之外。在一些实施例中，该若干连接线40可以紧贴铜箔层22，以减小电路板100的整体厚度，如图2所示。在另外一些实施例中，该若干连接线40与铜箔层22间隔，以提高连接线40与铜箔层22之间的绝缘性能，如图3所示，其中图3为本申请实施例提供的电路板100的第二种剖视图。
其中，至少部分铜箔导线222与该若干连接线40电连接。在一些实施例中，至少一连接线40电连接于不同的铜箔导线222之间。例如，该若干连接线40中，可以每一连接线40均电连接于不同的铜箔导线222之间，以实现与不同铜箔导线222连接的电子元件之间的电连接，如图1所示。再例如，也可以部分连接线40中的每一连接线均电连接于不同的铜箔导线222之间，以实现与不同铜箔导线222连接的电子元件之间的电连接；此外，另一部分连接线40中的每一连接线可以均与一条铜箔导线222电连接，并与电路板100之外的器件电连接，以实现与铜箔导线222连接的电子元件与外部器件的电连接，如图4所示，图4为本申请实施例提供的电路板100的第二种平面结构示意图。可以理解的，在一些实施例中，还可以有部分铜箔导线222不与连接线40电连接，例如铜箔导线222两端可以分别连接不同的电子元件，以实现不同的电子元件之间的电连接，此时无需与连接线40电连接，如图4所示。
在一些实施例中，若干连接线40的中部的导电部分不与该若干铜箔导线222接触。例如，如图1所示，连接线40与铜箔导线222彼此不交叉，从而可以保证连接线40的中部的导电部分不与铜箔导线222接触。再例如，如图5所示，图5为本申请实施例提供的电路板100的第三种平面结构示意图，连接线40可以跨越多条铜箔导线222，并且连接线40的中部的导电部分与所跨越的铜箔导线222之间存在间距，例如连接线40的中部的导电部分向远离铜箔层22的方向拱起，以保证连接线40的中部的导电部分不与所跨越的铜箔导线222接触。
本申请实施例中，连接线40的形式可以为贴片连接线、漆包线等形式。其中，贴片连接线为导体，例如铜或银等材质形成的导体。漆包线为金属线芯外面包覆绝缘材质形成，例如铜线芯外面包覆绝缘层形成。
可以理解的，连接线40的两端可以呈扁平状，以便于连接线40与铜箔导线222的电连接，例如便于连接线40两端的焊接。
在实际应用中，该若干铜箔导线222可以与电子元件电连接，例如电子元件可以通过焊盘与铜箔导线222焊接在一起。由于电路板100自身尺寸、电路板100上设置的器件占据空间等因素影响，铜箔层22上无法进一步设置更多的铜箔导线来实现不同铜箔导线222之间的电连接，而通过设置若干连接线40实现不同铜箔导线222之间的电连接，能够很好地解决这一问题。在另一应用场景中，铜箔导线222需要实现与外部器件的电连接，例如需要实现与电路板100之外的器件的电连接时，在铜箔层22上增加铜箔导线222的数量无法实现与外部器件的电连接，而通过设置若干连接线40，若干连接线40同时与部分铜箔导线222以及外部器件电连接，也能够很好地解决这一问题。
因此，本申请的电路板100中，通过在基板20的铜箔层22的外部设置连接线40，通过连接线40与铜箔导线222电连接，既可以满足电路板100上的复杂线路设计需求，实现不同铜箔导线222之间的电连接，或者实现铜箔导线222与外部器件的电连接，又能够避免双面板、多层板复杂的结构设计，因此既能够使电路板的线路设计更为灵活，又能够降低电路板的成本。
在一些实施例中，参考图6，图6为本申请实施例提供的电路板100的第四种平面结构示意图。
电路板100还包括若干电子元件60，该若干电子元件60设置在基板20上。例如，电子元件60可以焊接在基板20上。实际应用中，该若干电子元件60可以设置在基板20的同一面，例如设置在铜箔层22所在的一面。可以理解的，在其他一些实施例中，该若干电子元件60也可以设置在基板20上与铜箔层22相对的另一面。
在一些实施例中，该若干电子元件60包括LED发光芯片、LED驱动芯片中的至少一种。其中，LED发光芯片可以发光，从而形成光源。LED驱动芯片与LED发光芯片电连接，以驱动LED发光芯片发光。
可以理解的，该若干电子元件60只包括LED发光芯片、LED驱动芯片中的一种时，例如只包括LED发光芯片时，对应的LED驱动芯片可以另外设置，例如设置在其他的电路板上。同样的，该若干电子元件60只包括LED驱动芯片时，对应的LED发光芯片也可以另外设置，例如设置在其他的电路板上。
在实际应用中，该若干电子元件60包括LED发光芯片和LED驱动芯片时，LED发光芯片和LED驱动芯片可以设置在基板20的同一面，例如设置在铜箔层22所在的一面。可以理解的，在其他一些实施例中，LED发光芯片和LED驱动芯片也可以设置在基板20上与铜箔层22相对的另一面。
在一些实施例中，参考图7，图7为本申请实施例提供的电路板的第五种平面结构示意图。该若干电子元件60包括LED发光芯片62和LED驱动芯片64。其中，部分铜箔导线222与LED发光芯片62电连接，部分铜箔导线222与LED驱动芯片64电连接。连接LED发光芯片62的铜箔导线222与连接LED驱动芯片64的铜箔导线222通过连接线40电连接，以实现LED发光芯片62与LED驱动芯片64的电连接。
在一些实施例中，参考图8，图8为本申请实施例提供的电路板100的第三种剖视图。
电路板100还包括绝缘层24，绝缘层24覆于铜箔层22上方。可以理解的，绝缘层24可以铺满铜箔层22，也可以不铺满铜箔层22。绝缘层24与铜箔层22上需要设置焊盘的位置对应的区域需要镂空，以使铜箔层22上需要设置焊盘的位置露出，便于焊接各种电子元件。
其中，连接线40可以设置在绝缘层24上方，并与绝缘层24之间保持一定间距，如图8所示，以提高连接线40与铜箔层22之间的绝缘性能。可以理解的，在一些实施例中，连接线40可以设置在绝缘层24上方，并紧贴绝缘层24，以减小电路板100的整体厚度，如图9所示，图9为本申请实施例提供的电路板100的第四种剖视图。
在一些实施例中，上述若干电子元件60可以设置在绝缘层24上方，以保证电子元件60与铜箔层22之间的绝缘性能。
在一些实施例中，该若干电子元件60包括LED发光芯片62和LED驱动芯片64时，LED发光芯片62和LED驱动芯片64都设置在绝缘层24上方。
本申请实施例还提供一种LED背光板，包括上述任一实施例的电路板100。本申请实施例的LED背光板可以作为诸如智能手机、平板电脑等电子设备的显示屏光源。
在一些实施例中，LED背光板可以为Mini LED背光板。
以上对本申请实施例提供的电路板及LED背光板进行了详细介绍。本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请。同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种电路板，其中，包括：
    基板，基板的一表面设置有铜箔层，所述铜箔层包括若干铜箔导线，所述若干铜箔导线在所述铜箔层内互不相连；
    若干用于导电的连接线，所述若干连接线位于所述铜箔层外，至少部分铜箔导线与所述若干连接线电连接。
  2. 根据权利要求1所述的电路板，其中，所述电路板内所述基板的数量为一，所述基板的一表面设置有铜箔层，与所述表面相对的另一表面无铜箔层。
  3. 根据权利要求1所述的电路板，其中，至少一连接线电连接于不同的所述铜箔导线之间。
  4. 根据权利要求1所述的电路板，其中，所述连接线的中部的导电部分不与所述铜箔导线接触。
  5. 根据权利要求1所述的电路板，其中，还包括若干电子元件，所述若干电子元件设置在所述基板上。
  6. 根据权利要求5所述的电路板，其中，所述若干电子元件设置在所述基板的同一面。
  7. 根据权利要求5所述的电路板，其中，所述若干电子元件包括LED发光芯片、LED驱动芯片中的至少一种。
  8. 根据权利要求5所述的电路板，其中，所述若干电子元件包括LED发光芯片和LED驱动芯片，所述LED发光芯片和LED驱动芯片设置于所述基板的同一面。
  9. 根据权利要求5所述的电路板，其中，还包括绝缘层，所述绝缘层覆于所述铜箔层上方。
  10. 根据权利要求9所述的电路板，其中，所述若干电子元件设置在所述绝缘层上方。
  11. 根据权利要求9所述的电路板，其中，所述若干电子元件包括LED发光芯片和LED驱动芯片，所述LED发光芯片和LED驱动芯片设置于所述绝缘层上方。
  12. 根据权利要求9所述的电路板，其中，所述若干连接线设置在所述绝缘层上方。
  13. 根据权利要求12所述的电路板，其中，所述若干连接线紧贴所述绝缘层。
  14. 根据权利要求1所述的电路板，其中，所述基板为FR4环氧树脂基板。
  15. 根据权利要求4所述的电路板，其中，所述连接线的两端呈扁平状，所述连接线的两端与所述铜箔导线连接。
  16. 根据权利要求6所述的电路板，其中，所述若干电子元件设置于所述铜箔层所在的一面。
  17. 根据权利要求6所述的电路板，其中，所述若干电子元件焊接在所述基板上。
  18. 根据权利要求9所述的电路板，其中，所述绝缘层上设置有镂空区域，以露出所述铜箔层上的焊盘。
  19. 一种LED背光板，包括电路板，其中，所述电路板包括：
    基板，基板的一表面设置有铜箔层，所述铜箔层包括若干铜箔导线，所述若干铜箔导线在所述铜箔层内互不相连；
    若干用于导电的连接线，所述若干连接线位于所述铜箔层外，至少部分铜箔导线与所述若干连接线电连接。
  20. 根据权利要求19所述的LED背光板，其中，所述LED背光板为Mini LED背光板。
PCT/CN2022/073309 2021-07-27 2022-01-21 电路板及led背光板 Ceased WO2023005173A1 (zh)

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