WO2023005173A1

WO2023005173A1 - Circuit board and led backlight panel

Info

Publication number: WO2023005173A1
Application number: PCT/CN2022/073309
Authority: WO
Inventors: 黎芳群; 李锦乐; 李治国
Original assignee: 深圳Tcl数字技术有限公司
Priority date: 2021-07-27
Filing date: 2022-01-21
Publication date: 2023-02-02
Also published as: CN215935154U

Abstract

The present application provides a circuit board and an LED backlight panel. Connecting wires are provided outside a copper foil layer of a substrate, and the connecting wires are electrically connected to copper foil conductive wires, and thus, the design requirements of complex circuits on the circuit board can be satisfied, the complex structural design of a double-sided board and a multi-layer board can be avoided, and the cost of the circuit board can be reduced. The technical solution provided by the present application is suitable for the design requirements of the LED backlight panel, particularly a Mini LED backlight panel, and the circuit design difficulty, cost, and thickness requirement of the LED backlight panel can be considered.

Description

Circuit board and LED backlight board

technical field

The present application relates to the field of electronic technology, in particular to a circuit board and an LED backlight board.

Background technique

At present, in the design of circuit boards, according to the number of copper foil layers, there are usually different types such as single-sided boards, double-sided boards, and multi-layer boards. In the single-sided board, only one side of the substrate is provided with a copper foil layer, and a number of copper foil wires are formed in the copper foil layer through etching and other processes as conductive lines in the circuit board. In double-sided and multi-layer boards, the copper foil wires in different copper foil layers are electrically connected through via holes on the substrate.

As the circuit design becomes more and more complex, the copper foil conductors on the circuit board become denser and denser, and the single-sided board cannot meet the design requirements of the copper foil conductors in the circuit board, so double-sided boards and multi-layer boards are usually required. However, since double-sided boards and multi-layer boards need to arrange a large number of via holes on the substrate, and copper plating is carried out in the via holes to realize electrical connection, the design of the circuit board is complicated, and the process and material costs are high.

technical problem

In the LED field, in order to reduce the thickness of the light board in the design of the LED backlight board, the LED light-emitting chip and the LED driver chip will be designed on the same side of the circuit board, especially on the Mini LED backlight board, the LED light-emitting chip and the LED The number of driver chips is large, so the design of its copper foil wire is relatively complicated. Usually, double-sided or multi-layer boards are used to design, and the cost is obviously higher, and if a thicker multi-layer board is used, it will also affect The overall thickness of the backlight.

technical solution

An embodiment of the present application provides a circuit board, including:

A substrate, one surface of the substrate is provided with a copper foil layer, the copper foil layer includes a plurality of copper foil wires, and the plurality of copper foil wires are not connected to each other in the copper foil layer;

Several connecting wires for conducting electricity, the several connecting wires are located outside the copper foil layer, at least part of the copper foil wires are electrically connected to the several connecting wires.

In some embodiments, the number of the substrate in the circuit board is one, one surface of the substrate is provided with a copper foil layer, and the other surface opposite to the surface is free of a copper foil layer.

In some embodiments, at least one connection wire is electrically connected between different copper foil wires.

In some embodiments, the conductive part in the middle of the connecting wire is not in contact with the copper foil wire.

In some embodiments, the circuit board further includes several electronic components, and the several electronic components are arranged on the substrate.

In some embodiments, the plurality of electronic components are disposed on the same surface of the substrate.

In some embodiments, the plurality of electronic components include at least one of LED light emitting chips and LED driving chips.

In some embodiments, the plurality of electronic components include LED light emitting chips and LED driving chips, and the LED light emitting chips and LED driving chips are arranged on the same surface of the substrate.

In some embodiments, the circuit board further includes an insulating layer overlying the copper foil layer.

In some embodiments, the plurality of electronic components are disposed above the insulating layer.

In some embodiments, the plurality of electronic components include LED light emitting chips and LED driving chips, and the LED light emitting chips and LED driving chips are arranged above the insulating layer.

In some embodiments, the connecting wires are disposed above the insulating layer.

In some embodiments, the connecting wires are closely attached to the insulating layer.

In some embodiments, the substrate is an FR4 epoxy resin substrate.

In some embodiments, both ends of the connection wire are flat, and both ends of the connection wire are connected to the copper foil wire.

In some embodiments, the plurality of electronic components are disposed on the side where the copper foil layer is located.

In some embodiments, the plurality of electronic components are soldered on the substrate.

In some embodiments, a hollow area is provided on the insulating layer to expose the pad on the copper foil layer.

The embodiment of the present application also provides an LED backlight board, including a circuit board, and the circuit board includes:

In some embodiments, the LED backlight board is a Mini LED backlight board.

Beneficial effect

In the circuit board of the present application, by setting the connection wires outside the copper foil layer of the substrate and electrically connecting the connection wires with the copper foil conductors, it can not only meet the complex circuit design requirements on the circuit board, but also avoid double-sided boards and multi-layer boards. The complex structural design can not only make the circuit design of the circuit board more flexible, but also reduce the cost of the circuit board.

In particular, the technical solution provided by this application is suitable for LED backlight panels, especially Mini The design requirements of LED backlight panels can take into account the difficulty of circuit design, cost and thickness requirements.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings that need to be used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative efforts.

FIG. 1 is a schematic diagram of a first plane structure of a circuit board provided by an embodiment of the present application.

FIG. 2 is a first cross-sectional view of the circuit board provided by the embodiment of the present application.

FIG. 3 is a second cross-sectional view of the circuit board provided by the embodiment of the present application.

FIG. 4 is a schematic diagram of a second plane structure of a circuit board provided by an embodiment of the present application.

FIG. 5 is a schematic diagram of a third plane structure of a circuit board provided by an embodiment of the present application.

FIG. 6 is a schematic diagram of a fourth planar structure of a circuit board provided by an embodiment of the present application.

FIG. 7 is a schematic diagram of a fifth plane structure of a circuit board provided by an embodiment of the present application.

FIG. 8 is a third cross-sectional view of the circuit board provided by the embodiment of the present application.

FIG. 9 is a fourth cross-sectional view of the circuit board provided by the embodiment of the present application.

Embodiments of the present invention

The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

The embodiment of the present application provides a circuit board, which can be, for example, an LED (light-emitting diode, light-emitting diode) backlight circuit board.

Referring to FIG. 1 and FIG. 2 , FIG. 1 is a first schematic plan view of the circuit board 100 provided by the embodiment of the present application, and FIG. 2 is a first cross-sectional view of the circuit board 100 provided by the embodiment of the present application.

The circuit board 100 includes a substrate 20 and a plurality of connecting wires 40 .

Wherein, the material of the substrate 20 may include an insulating material, for example, the substrate 20 may be an FR4 epoxy resin substrate. A copper foil layer 22 is disposed on one surface of the substrate 20 . The copper foil layer 22 may or may not cover the surface of the substrate 20 . The copper foil layer 22 includes a plurality of copper foil wires 222 . The copper foil wire 222 can be formed by etching on the copper foil layer 22 , for example. The copper foil wire 222 can be used to electrically connect various electronic components. The plurality of copper foil wires 222 are not connected to each other in the copper foil layer 22 .

In some embodiments, the number of substrates 20 in the circuit board 100 is one, that is, divided according to the number of copper foil layers, the circuit board 100 is a single-layer board. At this time, one surface of the substrate 20 is provided with the copper foil layer 22 , and the other surface opposite to this surface has no copper foil layer.

It should be noted that, in some embodiments, the substrate 20 may be an aluminum substrate.

Several connection wires 40 are used for conducting electricity, for example, they can be used for electrical connection between different electronic components and wires. The connecting wires 40 are located outside the copper foil layer 22 . In some embodiments, the connecting wires 40 can be closely attached to the copper foil layer 22 to reduce the overall thickness of the circuit board 100 , as shown in FIG. 2 . In some other embodiments, the plurality of connecting wires 40 are spaced from the copper foil layer 22 to improve the insulation performance between the connecting wires 40 and the copper foil layer 22, as shown in FIG. 3, wherein FIG. The second cross-sectional view of the circuit board 100.

Wherein, at least part of the copper foil wires 222 are electrically connected to the connecting wires 40 . In some embodiments, at least one connection wire 40 is electrically connected between different copper foil wires 222 . For example, in the plurality of connecting wires 40, each connecting wire 40 may be electrically connected between different copper foil wires 222, so as to realize electrical connection between electronic components connected to different copper foil wires 222, as shown in FIG. 1 Show. For another example, it is also possible that each connecting wire in some connecting wires 40 is electrically connected between different copper foil wires 222, so as to realize the electrical connection between the electronic components connected with different copper foil wires 222; in addition, another part Each connecting wire in the connecting wire 40 can be electrically connected to a copper foil wire 222, and is electrically connected to devices outside the circuit board 100, so as to realize the electrical connection between the electronic component connected to the copper foil wire 222 and the external device, As shown in FIG. 4 , FIG. 4 is a schematic diagram of a second planar structure of the circuit board 100 provided in the embodiment of the present application. It can be understood that, in some embodiments, some copper foil wires 222 may not be electrically connected to the connection wire 40, for example, the two ends of the copper foil wire 222 may be connected to different electronic components, so as to realize the connection between different electronic components. It is not necessary to be electrically connected to the connecting wire 40 at this time, as shown in FIG. 4 .

In some embodiments, the conductive parts in the middle of the connecting wires 40 are not in contact with the copper foil wires 222 . For example, as shown in FIG. 1 , the connection wire 40 and the copper foil wire 222 do not intersect with each other, thereby ensuring that the conductive part in the middle of the connection wire 40 does not contact the copper foil wire 222 . For another example, as shown in FIG. 5 , which is a schematic diagram of the third plane structure of the circuit board 100 provided by the embodiment of the present application, the connecting wire 40 may span a plurality of copper foil wires 222 , and the conductive part in the middle of the connecting wire 40 There is a distance between the copper foil wire 222 that is crossed, for example, the conductive part in the middle of the connecting wire 40 is arched away from the direction of the copper foil layer 22, so as to ensure that the conductive part in the middle of the connecting wire 40 does not interfere with the copper foil that is crossed. Wire 222 contacts.

In the embodiment of the present application, the connection wire 40 may be in the form of a patch connection wire, an enameled wire, or the like. Wherein, the chip connection wire is a conductor, such as a conductor formed of copper or silver. The enameled wire is formed by covering the outer surface of the metal wire core with insulating material, for example, the outer surface of the copper wire core is covered with an insulating layer.

It can be understood that the two ends of the connection wire 40 may be flat, so as to facilitate the electrical connection between the connection wire 40 and the copper foil wire 222 , for example, to facilitate the welding of the two ends of the connection wire 40 .

In practical applications, the plurality of copper foil wires 222 can be electrically connected with electronic components, for example, the electronic components can be welded together with the copper foil wires 222 through pads. Due to factors such as the size of the circuit board 100 itself and the space occupied by devices arranged on the circuit board 100, it is impossible to further arrange more copper foil wires on the copper foil layer 22 to realize the electrical connection between different copper foil wires 222, and by setting Several connection wires 40 realize the electrical connection between different copper foil wires 222, which can well solve this problem. In another application scenario, the copper foil wires 222 need to be electrically connected to external devices. To achieve electrical connection with external devices, this problem can also be well solved by arranging several connecting wires 40 that are electrically connected to some copper foil wires 222 and external devices at the same time.

Therefore, in the circuit board 100 of the present application, by setting the connecting wire 40 outside the copper foil layer 22 of the substrate 20 and electrically connecting the connecting wire 40 to the copper foil wire 222, the complex circuit design requirements on the circuit board 100 can be met. , realize the electrical connection between different copper foil wires 222, or realize the electrical connection between the copper foil wire 222 and external devices, and can avoid the complicated structural design of double-sided boards and multi-layer boards, so that the circuit design of the circuit board can be made more In order to be flexible, it can reduce the cost of the circuit board.

In some embodiments, refer to FIG. 6 , which is a schematic diagram of a fourth planar structure of the circuit board 100 provided by the embodiment of the present application.

The circuit board 100 also includes several electronic components 60 disposed on the substrate 20 . For example, the electronic component 60 may be soldered on the substrate 20 . In practical applications, the plurality of electronic components 60 may be disposed on the same side of the substrate 20 , for example, the side where the copper foil layer 22 is located. It can be understood that, in some other embodiments, the plurality of electronic components 60 may also be disposed on the other side of the substrate 20 opposite to the copper foil layer 22 .

In some embodiments, the plurality of electronic components 60 include at least one of LED light emitting chips and LED driving chips. Wherein, the LED light-emitting chip can emit light, thereby forming a light source. The LED driving chip is electrically connected with the LED light-emitting chip to drive the LED light-emitting chip to emit light.

It can be understood that when the plurality of electronic components 60 only include one of LED light-emitting chips and LED driver chips, for example, when only LED light-emitting chips are included, the corresponding LED driver chips can be provided separately, for example, on other circuit boards. Similarly, when the plurality of electronic components 60 only include LED driving chips, the corresponding LED light-emitting chips can also be provided separately, for example, on other circuit boards.

In practical applications, when the plurality of electronic components 60 include LED light-emitting chips and LED driver chips, the LED light-emitting chips and LED driver chips can be arranged on the same side of the substrate 20 , for example, on the side where the copper foil layer 22 is located. It can be understood that, in some other embodiments, the LED light emitting chip and the LED driving chip can also be disposed on the other side of the substrate 20 opposite to the copper foil layer 22 .

In some embodiments, refer to FIG. 7 , which is a schematic diagram of a fifth plane structure of a circuit board provided in an embodiment of the present application. The plurality of electronic components 60 include LED light emitting chips 62 and LED driving chips 64 . Wherein, some copper foil wires 222 are electrically connected to the LED light-emitting chip 62 , and some copper foil wires 222 are electrically connected to the LED driving chip 64 . The copper foil wire 222 connected to the LED light-emitting chip 62 is electrically connected to the copper foil wire 222 connected to the LED driver chip 64 through the connecting wire 40 to realize the electrical connection between the LED light-emitting chip 62 and the LED driver chip 64 .

In some embodiments, refer to FIG. 8 , which is a third cross-sectional view of the circuit board 100 provided by the embodiment of the present application.

The circuit board 100 further includes an insulating layer 24 covering the copper foil layer 22 . It can be understood that the insulating layer 24 may or may not be covered with the copper foil layer 22 . The area of the insulating layer 24 corresponding to the position on the copper foil layer 22 that needs to be provided with a pad needs to be hollowed out so that the position on the copper foil layer 22 that needs to be provided with a pad is exposed to facilitate welding of various electronic components.

Wherein, the connecting wire 40 can be arranged above the insulating layer 24 and keep a certain distance from the insulating layer 24 , as shown in FIG. 8 , so as to improve the insulation performance between the connecting wire 40 and the copper foil layer 22 . It can be understood that, in some embodiments, the connection wire 40 can be arranged above the insulating layer 24 and be close to the insulating layer 24, so as to reduce the overall thickness of the circuit board 100, as shown in FIG. 9 , which is an embodiment of the present application. The fourth cross-sectional view of the circuit board 100 provided as an example.

In some embodiments, the above-mentioned several electronic components 60 may be disposed above the insulating layer 24 to ensure the insulation performance between the electronic components 60 and the copper foil layer 22 .

In some embodiments, when the plurality of electronic components 60 include LED light emitting chips 62 and LED driving chips 64 , both the LED light emitting chips 62 and the LED driving chips 64 are disposed above the insulating layer 24 .

The embodiment of the present application also provides an LED backlight board, including the circuit board 100 of any one of the above embodiments. The LED backlight panel of the embodiment of the present application can be used as a display screen light source of electronic devices such as smart phones and tablet computers.

In some embodiments, the LED backlight can be a Mini LED backlight.

The circuit board and the LED backlight board provided by the embodiment of the present application have been introduced in detail above. In this paper, specific examples are used to illustrate the principles and implementation methods of the present application, and the descriptions of the above embodiments are only used to help understand the present application. At the same time, for those skilled in the art, based on the idea of this application, there will be changes in the specific implementation and application scope. In summary, the content of this specification should not be construed as limiting the application.

Claims

A circuit board, comprising:

A substrate, one surface of the substrate is provided with a copper foil layer, the copper foil layer includes a plurality of copper foil wires, and the plurality of copper foil wires are not connected to each other in the copper foil layer;

Several connecting wires for conducting electricity, the several connecting wires are located outside the copper foil layer, at least part of the copper foil wires are electrically connected to the several connecting wires.
The circuit board according to claim 1, wherein the number of the substrates in the circuit board is one, one surface of the substrate is provided with a copper foil layer, and the other surface opposite to the surface has no copper foil layer .
The circuit board according to claim 1, wherein at least one connection wire is electrically connected between different copper foil wires.
The circuit board according to claim 1, wherein the conductive part in the middle of the connecting wire is not in contact with the copper foil wire.
The circuit board according to claim 1, further comprising a plurality of electronic components disposed on the substrate.
The circuit board according to claim 5, wherein the plurality of electronic components are arranged on the same surface of the substrate.
The circuit board according to claim 5, wherein the plurality of electronic components comprise at least one of LED light emitting chips and LED driving chips.
The circuit board according to claim 5, wherein the plurality of electronic components include LED light emitting chips and LED driving chips, and the LED light emitting chips and LED driving chips are arranged on the same surface of the substrate.
The circuit board according to claim 5, further comprising an insulating layer, the insulating layer covering the copper foil layer.
The circuit board of claim 9, wherein the plurality of electronic components are disposed over the insulating layer.
The circuit board according to claim 9, wherein the plurality of electronic components include LED light emitting chips and LED driving chips, and the LED light emitting chips and LED driving chips are arranged above the insulating layer.
The circuit board according to claim 9, wherein the plurality of connecting wires are disposed above the insulating layer.
The circuit board according to claim 12, wherein the plurality of connecting wires are closely attached to the insulating layer.
The circuit board according to claim 1, wherein the substrate is an FR4 epoxy resin substrate.
The circuit board according to claim 4, wherein both ends of the connection wire are flat, and the two ends of the connection wire are connected to the copper foil wire.
The circuit board according to claim 6, wherein the plurality of electronic components are disposed on the side where the copper foil layer is located.
The circuit board according to claim 6, wherein the plurality of electronic components are soldered on the substrate.
The circuit board according to claim 9, wherein a hollow area is provided on the insulating layer to expose the pad on the copper foil layer.
A kind of LED backlight board, comprises circuit board, wherein, described circuit board comprises:

A substrate, one surface of the substrate is provided with a copper foil layer, the copper foil layer includes a plurality of copper foil wires, and the plurality of copper foil wires are not connected to each other in the copper foil layer;

Several connecting wires for conducting electricity, the several connecting wires are located outside the copper foil layer, at least part of the copper foil wires are electrically connected to the several connecting wires.
The LED backlight panel according to claim 19, wherein the LED backlight panel is a Mini LED backlight panel.