WO2023005173A1 - Carte de circuit imprimé et panneau de rétroéclairage à del - Google Patents

Carte de circuit imprimé et panneau de rétroéclairage à del Download PDF

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Publication number
WO2023005173A1
WO2023005173A1 PCT/CN2022/073309 CN2022073309W WO2023005173A1 WO 2023005173 A1 WO2023005173 A1 WO 2023005173A1 CN 2022073309 W CN2022073309 W CN 2022073309W WO 2023005173 A1 WO2023005173 A1 WO 2023005173A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper foil
circuit board
wires
substrate
board according
Prior art date
Application number
PCT/CN2022/073309
Other languages
English (en)
Chinese (zh)
Inventor
黎芳群
李锦乐
李治国
Original Assignee
深圳Tcl数字技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳Tcl数字技术有限公司 filed Critical 深圳Tcl数字技术有限公司
Publication of WO2023005173A1 publication Critical patent/WO2023005173A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present application relates to the field of electronic technology, in particular to a circuit board and an LED backlight board.
  • the number of copper foil layers there are usually different types such as single-sided boards, double-sided boards, and multi-layer boards.
  • single-sided board only one side of the substrate is provided with a copper foil layer, and a number of copper foil wires are formed in the copper foil layer through etching and other processes as conductive lines in the circuit board.
  • double-sided and multi-layer boards the copper foil wires in different copper foil layers are electrically connected through via holes on the substrate.
  • the LED light-emitting chip and the LED driver chip will be designed on the same side of the circuit board, especially on the Mini LED backlight board, the LED light-emitting chip and the LED
  • the number of driver chips is large, so the design of its copper foil wire is relatively complicated.
  • double-sided or multi-layer boards are used to design, and the cost is obviously higher, and if a thicker multi-layer board is used, it will also affect The overall thickness of the backlight.
  • An embodiment of the present application provides a circuit board, including:
  • a substrate one surface of the substrate is provided with a copper foil layer, the copper foil layer includes a plurality of copper foil wires, and the plurality of copper foil wires are not connected to each other in the copper foil layer;
  • the several connecting wires are located outside the copper foil layer, at least part of the copper foil wires are electrically connected to the several connecting wires.
  • the number of the substrate in the circuit board is one, one surface of the substrate is provided with a copper foil layer, and the other surface opposite to the surface is free of a copper foil layer.
  • connection wire is electrically connected between different copper foil wires.
  • the conductive part in the middle of the connecting wire is not in contact with the copper foil wire.
  • the circuit board further includes several electronic components, and the several electronic components are arranged on the substrate.
  • the plurality of electronic components are disposed on the same surface of the substrate.
  • the plurality of electronic components include at least one of LED light emitting chips and LED driving chips.
  • the plurality of electronic components include LED light emitting chips and LED driving chips, and the LED light emitting chips and LED driving chips are arranged on the same surface of the substrate.
  • the circuit board further includes an insulating layer overlying the copper foil layer.
  • the plurality of electronic components are disposed above the insulating layer.
  • the plurality of electronic components include LED light emitting chips and LED driving chips, and the LED light emitting chips and LED driving chips are arranged above the insulating layer.
  • the connecting wires are disposed above the insulating layer.
  • the connecting wires are closely attached to the insulating layer.
  • the substrate is an FR4 epoxy resin substrate.
  • both ends of the connection wire are flat, and both ends of the connection wire are connected to the copper foil wire.
  • the plurality of electronic components are disposed on the side where the copper foil layer is located.
  • the plurality of electronic components are soldered on the substrate.
  • a hollow area is provided on the insulating layer to expose the pad on the copper foil layer.
  • the embodiment of the present application also provides an LED backlight board, including a circuit board, and the circuit board includes:
  • a substrate one surface of the substrate is provided with a copper foil layer, the copper foil layer includes a plurality of copper foil wires, and the plurality of copper foil wires are not connected to each other in the copper foil layer;
  • the several connecting wires are located outside the copper foil layer, at least part of the copper foil wires are electrically connected to the several connecting wires.
  • the LED backlight board is a Mini LED backlight board.
  • connection wires outside the copper foil layer of the substrate by setting the connection wires outside the copper foil layer of the substrate and electrically connecting the connection wires with the copper foil conductors, it can not only meet the complex circuit design requirements on the circuit board, but also avoid double-sided boards and multi-layer boards.
  • the complex structural design can not only make the circuit design of the circuit board more flexible, but also reduce the cost of the circuit board.
  • the technical solution provided by this application is suitable for LED backlight panels, especially Mini
  • the design requirements of LED backlight panels can take into account the difficulty of circuit design, cost and thickness requirements.
  • FIG. 1 is a schematic diagram of a first plane structure of a circuit board provided by an embodiment of the present application.
  • FIG. 2 is a first cross-sectional view of the circuit board provided by the embodiment of the present application.
  • FIG. 3 is a second cross-sectional view of the circuit board provided by the embodiment of the present application.
  • FIG. 4 is a schematic diagram of a second plane structure of a circuit board provided by an embodiment of the present application.
  • FIG. 5 is a schematic diagram of a third plane structure of a circuit board provided by an embodiment of the present application.
  • FIG. 6 is a schematic diagram of a fourth planar structure of a circuit board provided by an embodiment of the present application.
  • FIG. 7 is a schematic diagram of a fifth plane structure of a circuit board provided by an embodiment of the present application.
  • FIG. 8 is a third cross-sectional view of the circuit board provided by the embodiment of the present application.
  • FIG. 9 is a fourth cross-sectional view of the circuit board provided by the embodiment of the present application.
  • the embodiment of the present application provides a circuit board, which can be, for example, an LED (light-emitting diode, light-emitting diode) backlight circuit board.
  • a circuit board which can be, for example, an LED (light-emitting diode, light-emitting diode) backlight circuit board.
  • FIG. 1 is a first schematic plan view of the circuit board 100 provided by the embodiment of the present application
  • FIG. 2 is a first cross-sectional view of the circuit board 100 provided by the embodiment of the present application.
  • the circuit board 100 includes a substrate 20 and a plurality of connecting wires 40 .
  • the material of the substrate 20 may include an insulating material, for example, the substrate 20 may be an FR4 epoxy resin substrate.
  • a copper foil layer 22 is disposed on one surface of the substrate 20 .
  • the copper foil layer 22 may or may not cover the surface of the substrate 20 .
  • the copper foil layer 22 includes a plurality of copper foil wires 222 .
  • the copper foil wire 222 can be formed by etching on the copper foil layer 22 , for example.
  • the copper foil wire 222 can be used to electrically connect various electronic components.
  • the plurality of copper foil wires 222 are not connected to each other in the copper foil layer 22 .
  • the number of substrates 20 in the circuit board 100 is one, that is, divided according to the number of copper foil layers, the circuit board 100 is a single-layer board. At this time, one surface of the substrate 20 is provided with the copper foil layer 22 , and the other surface opposite to this surface has no copper foil layer.
  • the substrate 20 may be an aluminum substrate.
  • connection wires 40 are used for conducting electricity, for example, they can be used for electrical connection between different electronic components and wires.
  • the connecting wires 40 are located outside the copper foil layer 22 .
  • the connecting wires 40 can be closely attached to the copper foil layer 22 to reduce the overall thickness of the circuit board 100 , as shown in FIG. 2 .
  • the plurality of connecting wires 40 are spaced from the copper foil layer 22 to improve the insulation performance between the connecting wires 40 and the copper foil layer 22, as shown in FIG. 3, wherein FIG. The second cross-sectional view of the circuit board 100.
  • connection wire 40 is electrically connected between different copper foil wires 222 .
  • each connecting wire 40 may be electrically connected between different copper foil wires 222, so as to realize electrical connection between electronic components connected to different copper foil wires 222, as shown in FIG. 1 Show.
  • each connecting wire in some connecting wires 40 is electrically connected between different copper foil wires 222, so as to realize the electrical connection between the electronic components connected with different copper foil wires 222; in addition, another part
  • Each connecting wire in the connecting wire 40 can be electrically connected to a copper foil wire 222, and is electrically connected to devices outside the circuit board 100, so as to realize the electrical connection between the electronic component connected to the copper foil wire 222 and the external device, As shown in FIG. 4 , FIG. 4 is a schematic diagram of a second planar structure of the circuit board 100 provided in the embodiment of the present application.
  • some copper foil wires 222 may not be electrically connected to the connection wire 40, for example, the two ends of the copper foil wire 222 may be connected to different electronic components, so as to realize the connection between different electronic components. It is not necessary to be electrically connected to the connecting wire 40 at this time, as shown in FIG. 4 .
  • the conductive parts in the middle of the connecting wires 40 are not in contact with the copper foil wires 222 .
  • the connection wire 40 and the copper foil wire 222 do not intersect with each other, thereby ensuring that the conductive part in the middle of the connection wire 40 does not contact the copper foil wire 222 .
  • FIG. 1 the connection wire 40 and the copper foil wire 222 do not intersect with each other, thereby ensuring that the conductive part in the middle of the connection wire 40 does not contact the copper foil wire 222 .
  • the connecting wire 40 may span a plurality of copper foil wires 222 , and the conductive part in the middle of the connecting wire 40 There is a distance between the copper foil wire 222 that is crossed, for example, the conductive part in the middle of the connecting wire 40 is arched away from the direction of the copper foil layer 22, so as to ensure that the conductive part in the middle of the connecting wire 40 does not interfere with the copper foil that is crossed. Wire 222 contacts.
  • connection wire 40 may be in the form of a patch connection wire, an enameled wire, or the like.
  • the chip connection wire is a conductor, such as a conductor formed of copper or silver.
  • the enameled wire is formed by covering the outer surface of the metal wire core with insulating material, for example, the outer surface of the copper wire core is covered with an insulating layer.
  • connection wire 40 may be flat, so as to facilitate the electrical connection between the connection wire 40 and the copper foil wire 222 , for example, to facilitate the welding of the two ends of the connection wire 40 .
  • the plurality of copper foil wires 222 can be electrically connected with electronic components, for example, the electronic components can be welded together with the copper foil wires 222 through pads. Due to factors such as the size of the circuit board 100 itself and the space occupied by devices arranged on the circuit board 100, it is impossible to further arrange more copper foil wires on the copper foil layer 22 to realize the electrical connection between different copper foil wires 222, and by setting Several connection wires 40 realize the electrical connection between different copper foil wires 222, which can well solve this problem. In another application scenario, the copper foil wires 222 need to be electrically connected to external devices. To achieve electrical connection with external devices, this problem can also be well solved by arranging several connecting wires 40 that are electrically connected to some copper foil wires 222 and external devices at the same time.
  • the complex circuit design requirements on the circuit board 100 can be met. , realize the electrical connection between different copper foil wires 222, or realize the electrical connection between the copper foil wire 222 and external devices, and can avoid the complicated structural design of double-sided boards and multi-layer boards, so that the circuit design of the circuit board can be made more In order to be flexible, it can reduce the cost of the circuit board.
  • FIG. 6 is a schematic diagram of a fourth planar structure of the circuit board 100 provided by the embodiment of the present application.
  • the circuit board 100 also includes several electronic components 60 disposed on the substrate 20 .
  • the electronic component 60 may be soldered on the substrate 20 .
  • the plurality of electronic components 60 may be disposed on the same side of the substrate 20 , for example, the side where the copper foil layer 22 is located. It can be understood that, in some other embodiments, the plurality of electronic components 60 may also be disposed on the other side of the substrate 20 opposite to the copper foil layer 22 .
  • the plurality of electronic components 60 include at least one of LED light emitting chips and LED driving chips.
  • the LED light-emitting chip can emit light, thereby forming a light source.
  • the LED driving chip is electrically connected with the LED light-emitting chip to drive the LED light-emitting chip to emit light.
  • the corresponding LED driver chips can be provided separately, for example, on other circuit boards.
  • the corresponding LED light-emitting chips can also be provided separately, for example, on other circuit boards.
  • the LED light-emitting chips and LED driver chips can be arranged on the same side of the substrate 20 , for example, on the side where the copper foil layer 22 is located. It can be understood that, in some other embodiments, the LED light emitting chip and the LED driving chip can also be disposed on the other side of the substrate 20 opposite to the copper foil layer 22 .
  • FIG. 7 is a schematic diagram of a fifth plane structure of a circuit board provided in an embodiment of the present application.
  • the plurality of electronic components 60 include LED light emitting chips 62 and LED driving chips 64 .
  • some copper foil wires 222 are electrically connected to the LED light-emitting chip 62
  • some copper foil wires 222 are electrically connected to the LED driving chip 64 .
  • the copper foil wire 222 connected to the LED light-emitting chip 62 is electrically connected to the copper foil wire 222 connected to the LED driver chip 64 through the connecting wire 40 to realize the electrical connection between the LED light-emitting chip 62 and the LED driver chip 64 .
  • FIG. 8 is a third cross-sectional view of the circuit board 100 provided by the embodiment of the present application.
  • the circuit board 100 further includes an insulating layer 24 covering the copper foil layer 22 . It can be understood that the insulating layer 24 may or may not be covered with the copper foil layer 22 .
  • the area of the insulating layer 24 corresponding to the position on the copper foil layer 22 that needs to be provided with a pad needs to be hollowed out so that the position on the copper foil layer 22 that needs to be provided with a pad is exposed to facilitate welding of various electronic components.
  • the connecting wire 40 can be arranged above the insulating layer 24 and keep a certain distance from the insulating layer 24 , as shown in FIG. 8 , so as to improve the insulation performance between the connecting wire 40 and the copper foil layer 22 . It can be understood that, in some embodiments, the connection wire 40 can be arranged above the insulating layer 24 and be close to the insulating layer 24, so as to reduce the overall thickness of the circuit board 100, as shown in FIG. 9 , which is an embodiment of the present application.
  • the fourth cross-sectional view of the circuit board 100 provided as an example.
  • the above-mentioned several electronic components 60 may be disposed above the insulating layer 24 to ensure the insulation performance between the electronic components 60 and the copper foil layer 22 .
  • both the LED light emitting chips 62 and the LED driving chips 64 are disposed above the insulating layer 24 .
  • the embodiment of the present application also provides an LED backlight board, including the circuit board 100 of any one of the above embodiments.
  • the LED backlight panel of the embodiment of the present application can be used as a display screen light source of electronic devices such as smart phones and tablet computers.
  • the LED backlight can be a Mini LED backlight.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)

Abstract

La présente demande concerne une carte de circuit imprimé et un panneau de rétroéclairage à DEL. Des fils de connexion sont disposés à l'extérieur d'une couche de feuille de cuivre d'un substrat, et les fils de connexion sont électriquement connectés à des fils conducteurs en feuille de cuivre, et ainsi, les exigences de conception des circuits complexes sur la carte de circuit imprimé peuvent être satisfaites, la conception structurale complexe d'une carte à double face et d'une carte multicouche peut être évitée, et le coût de la carte de circuit imprimé peut être réduit. La solution technique fournie par la présente demande est appropriée pour les exigences de conception du panneau de rétroéclairage à DEL, en particulier un mini-panneau de rétroéclairage à DEL, et la difficulté de conception de circuit, le coût et l'exigence d'épaisseur du panneau de rétroéclairage à DEL peuvent être considérés.
PCT/CN2022/073309 2021-07-27 2022-01-21 Carte de circuit imprimé et panneau de rétroéclairage à del WO2023005173A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202121728913.7 2021-07-27
CN202121728913.7U CN215935154U (zh) 2021-07-27 2021-07-27 电路板及led背光板

Publications (1)

Publication Number Publication Date
WO2023005173A1 true WO2023005173A1 (fr) 2023-02-02

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ID=80397544

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/073309 WO2023005173A1 (fr) 2021-07-27 2022-01-21 Carte de circuit imprimé et panneau de rétroéclairage à del

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CN (1) CN215935154U (fr)
WO (1) WO2023005173A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202949638U (zh) * 2012-12-18 2013-05-22 广东欧珀移动通信有限公司 印刷电路板
CN103369865A (zh) * 2012-03-30 2013-10-23 宏启胜精密电子(秦皇岛)有限公司 电路板的制作方法
US20150208518A1 (en) * 2012-08-31 2015-07-23 Panasonic Intellectual Property Management Co. Ltd Removable copper foil attached substrate and method for producing circuit board
CN107068844A (zh) * 2017-04-10 2017-08-18 上海温良昌平电器科技股份有限公司 一种用于汽车前大灯的led模组及其制备工艺

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103369865A (zh) * 2012-03-30 2013-10-23 宏启胜精密电子(秦皇岛)有限公司 电路板的制作方法
US20150208518A1 (en) * 2012-08-31 2015-07-23 Panasonic Intellectual Property Management Co. Ltd Removable copper foil attached substrate and method for producing circuit board
CN202949638U (zh) * 2012-12-18 2013-05-22 广东欧珀移动通信有限公司 印刷电路板
CN107068844A (zh) * 2017-04-10 2017-08-18 上海温良昌平电器科技股份有限公司 一种用于汽车前大灯的led模组及其制备工艺

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