WO2020156475A1 - Carte de circuit imprimé souple, procédé de fabrication, module de dispositif électronique, et dispositif électronique - Google Patents

Carte de circuit imprimé souple, procédé de fabrication, module de dispositif électronique, et dispositif électronique Download PDF

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Publication number
WO2020156475A1
WO2020156475A1 PCT/CN2020/073940 CN2020073940W WO2020156475A1 WO 2020156475 A1 WO2020156475 A1 WO 2020156475A1 CN 2020073940 W CN2020073940 W CN 2020073940W WO 2020156475 A1 WO2020156475 A1 WO 2020156475A1
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WO
WIPO (PCT)
Prior art keywords
bridge
circuit board
wiring
sub
main body
Prior art date
Application number
PCT/CN2020/073940
Other languages
English (en)
Chinese (zh)
Inventor
熊韧
汤强
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202010075431.XA external-priority patent/CN111511109B/zh
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to EP20748627.5A priority Critical patent/EP3920672A4/fr
Priority to US16/958,937 priority patent/US11419212B2/en
Priority to JP2020561738A priority patent/JP2022519960A/ja
Publication of WO2020156475A1 publication Critical patent/WO2020156475A1/fr
Priority to US17/864,731 priority patent/US11589461B2/en
Priority to US18/094,683 priority patent/US11765828B2/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

Definitions

  • the embodiments of the present disclosure relate to a flexible circuit board and a manufacturing method thereof, an electronic device module, and an electronic device.
  • Flexible Printed Circuit is a highly reliable and flexible printed circuit board made of flexible film as a substrate.
  • Flexible circuit boards have the characteristics of high wiring density, light weight, thin thickness, and good flexibility, and are widely used in various electronic devices such as mobile phones, computers, and displays.
  • the flexible circuit board includes a main body sub-circuit board, including a first substrate, and a first bridge end, a second bridge end, and a first bridge provided on the first substrate.
  • a wiring portion and a second wiring portion, the first wiring portion and the second wiring portion are spaced apart from each other and electrically connected to the first bridge terminal and the second bridge terminal, respectively;
  • a bridge sub-circuit The board includes a second substrate, a third bridge end, a fourth bridge end, and a third wiring part for the first functional wiring provided on the second substrate, the third bridge end and the first
  • the four bridge terminals are electrically connected by the third wiring part, wherein the first substrate and the second substrate are not in direct contact, and the bridge sub-circuit board is configured to connect the third bridge terminal and the The fourth bridge end is electrically connected to the first bridge end and the second bridge end respectively, and is mounted on the main body sub-circuit board.
  • the bridge sub-circuit board is mounted on the main body sub-circuit board so that the first wiring portion, the third wiring portion and the second wiring portion The two wiring parts are electrically connected in sequence to obtain the first functional wiring.
  • the flexible circuit board provided by at least one embodiment of the present disclosure further includes a first control circuit coupling structure, the first control circuit coupling structure is disposed on the main body sub-circuit board, and is electrically connected to the first wiring portion , Or the first control circuit coupling structure is arranged on the bridge sub-circuit board and electrically connected to the third wiring part; the first control circuit coupling structure is configured to provide the first functional wiring The first electrical signal or the first electrical signal is received from the first functional wiring.
  • the main body sub-circuit board further includes a second functional wiring, and the second functional wiring is connected to the second functional wiring provided on the main sub-circuit board.
  • a control circuit combined structure is electrically connected, and the first control circuit combined structure is further configured to provide a second electrical signal to the second functional wiring or receive a second electrical signal from the second functional wiring.
  • the main body sub-circuit board further includes a third functional wiring, and the third functional wiring is located between the first wiring part and the second wiring. Between the line parts and cross the bridge sub-circuit board mounted on the main body sub-circuit board.
  • the first wiring portion, the second wiring portion, and the third functional wiring are routed in the same direction.
  • the main body sub-circuit board includes a first main body wiring layer located on the first side of the first substrate and a layer laminated on the first main body wiring layer
  • the first main body insulating layer on the side away from the first substrate, the first main body wiring layer includes the first wiring portion, the second wiring portion, the first bridge end and the The second bridge end, the first bridge end and the second bridge end are exposed by the first main body insulating layer.
  • the main body sub-circuit board further includes a second main body wiring layer located on a second side of the first substrate opposite to the first side and a stack
  • the second main body insulating layer on the side of the second main body wiring layer away from the first substrate, the second main body wiring layer includes the first wiring portion and the second wiring portion .
  • the main body sub-circuit board includes a first main body wiring layer located on the first side of the first substrate and a layer laminated on the first main body wiring layer The first main body insulating layer on the side away from the first substrate, the main body sub-circuit board further includes a second main body wiring layer located on a second side of the first substrate opposite to the first side, and A second main body insulating layer laminated on the side of the second main body wiring layer away from the first substrate, the first main body wiring layer including the first wiring part and the second wiring Part and the first bridging end, the first bridging end is exposed by the first main body insulating layer; the second main body wiring layer includes the first wiring part, the second wiring part and The second bridge end, the second bridge end is exposed by the second main insulation layer.
  • the bridge sub-circuit board includes a first bridge wiring layer on the first side of the second substrate and a layer stacked on the first bridge wiring
  • the first bridge insulating layer on the side of the layer away from the second substrate, the first bridge wiring layer includes the third wiring portion.
  • the bridge sub-circuit board further includes a ground layer on a second side of the second substrate opposite to the first side, and the bridge sub-circuit board When the circuit board is mounted on the main body sub-circuit board, and the second side is closer to the main body sub-circuit board relative to the first side.
  • the bridge sub-circuit board further includes a shielding layer on the second side of the second substrate, and the shielding laminated layer is on the ground layer. The side away from the second electrode plate.
  • the bridge sub-circuit board further includes a second bridge wiring layer on a second side of the second substrate opposite to the first side and a stack Layer on the second bridge insulating layer on the side of the second bridge wiring layer away from the second substrate, the second bridge wiring layer includes the third wiring portion, the third bridge end and The fourth bridge end, the third bridge end and the fourth bridge end are exposed by the second bridge insulation layer; when the bridge sub-circuit board is mounted on the main body sub-circuit board, The second side is closer to the main body sub-circuit board than the first side.
  • the bridge sub-circuit board further includes a second bridge wiring layer on a second side of the second substrate opposite to the first side and a stack Layer on the second bridge insulating layer on the side of the second bridge wiring layer away from the second substrate, the first bridge wiring layer further includes the third bridge end, the third bridge end is The first bridging insulating layer is exposed; the second bridging wiring layer includes the third wiring portion and the fourth bridging end, and the fourth bridging end is exposed by the second bridging insulating layer.
  • the bridge sub-circuit board further includes a bridge sub-circuit board on the second side of the second substrate and laminated on the second bridge insulating layer away from the first Two shielding layer on one side of the substrate.
  • the third bridge end and the fourth bridge end of the bridge sub-circuit board are connected to each other through anisotropic conductive glue, soldering material, or a connector.
  • the first bridge end and the second bridge end of the main body sub-circuit board are connected to each other through anisotropic conductive glue, soldering material, or a connector.
  • the main body sub-circuit board includes a plurality of the first bridge terminals and a plurality of the second bridge terminals; there are a plurality of the bridge sub-circuit boards, The plurality of bridge sub-circuit boards are respectively electrically connected to the plurality of first bridge ends and the plurality of second bridge ends through the plurality of third bridge ends and the plurality of fourth bridge ends, and Installed on the main body sub-circuit board.
  • the flexible circuit board includes a main body sub-circuit board, including a first substrate, and a first bridge end, a second bridge end, and a first bridge provided on the first substrate.
  • a wiring portion and a second wiring portion, the first wiring portion and the second wiring portion are spaced apart from each other and electrically connected to the first bridge terminal and the second bridge terminal, respectively;
  • a bridge sub-circuit The board includes a second substrate, a third bridge end, a fourth bridge end, and a third wiring part for the first functional wiring provided on the second substrate, the third bridge end and the first
  • the four bridge terminals are electrically connected by the third wiring part, wherein the first substrate and the second substrate are not in direct contact, and the bridge sub-circuit board is configured to connect the third bridge terminal and the The fourth bridge terminal is electrically connected to the first bridge terminal and the second bridge terminal, and is mounted on the main body sub-circuit board;
  • the main body sub-circuit board includes a first side of the first substrate A first main body
  • At least one embodiment of the present disclosure provides an electronic device module, the electronic device module includes an electronic device substrate and any of the above-mentioned flexible circuit boards; wherein the electronic device substrate includes a first functional circuit structure, and the flexible circuit The first functional wiring of the board is electrically connected to the first functional circuit structure.
  • the flexible circuit board further includes a second functional wiring
  • the first functional circuit structure includes a first signal transmission part and a second signal transmission part.
  • a functional wiring is electrically connected to the first signal transmission part
  • the second functional wiring is electrically connected to the second signal transmission part.
  • the electronic device substrate further includes a second functional circuit structure
  • the flexible circuit board further includes a third functional wiring, the third functional wiring electrical Connect the second functional circuit structure.
  • the first functional circuit structure is a touch circuit structure
  • the second functional circuit structure is a display circuit structure
  • the first signal transmission part is a touch drive circuit of the touch circuit
  • the second signal transmission part is a touch drive circuit of the touch circuit.
  • the first signal transmission part is a touch sensor circuit of the touch circuit
  • the second signal transmission part is a touch drive circuit of the touch circuit.
  • At least one embodiment of the present disclosure provides an electronic device including the electronic device module of any one of the above claims.
  • At least one embodiment of the present disclosure provides a method for manufacturing a flexible circuit board, including: providing a main body sub-circuit board, the main body sub-circuit board including a first substrate, and a first bridge terminal and a second substrate provided on the first substrate.
  • Two bridging ends, a first wiring portion and a second wiring portion, the first wiring portion and the second wiring portion are spaced apart from each other and are respectively connected to the first bridging end and the second bridging end Electrical connection; providing a bridge sub-circuit board, the bridge sub-circuit board includes a second substrate and a third bridge end, a fourth bridge end and a third route for the first functional wiring provided on the second substrate The third bridge end and the fourth bridge end are electrically connected by the third wiring part, and the third bridge end and the fourth bridge end of the bridge sub-circuit board are electrically connected to each other. Connected to the first bridge terminal and the second bridge terminal of the main body sub-circuit board so that the bridge sub-circuit board is mounted on the main body sub-circuit board, the first substrate and the second The two substrates are not in direct contact.
  • the third bridge end of the bridge sub-circuit board and the fourth bridge terminal are connected to each other by hot pressing, soldering, or a connector.
  • the bridge ends are respectively connected to the first bridge end and the second bridge end of the main body sub-circuit board.
  • FIG. 1A is a schematic plan view of a flexible circuit board provided by at least one embodiment of the present disclosure
  • FIG. 1B is a schematic plan view of a flexible circuit board provided by at least one embodiment of the present disclosure
  • FIG. 1C is a schematic plan view of a flexible circuit board provided by at least one embodiment of the present disclosure.
  • 1D is a schematic plan view of a flexible circuit board provided by at least one embodiment of the present disclosure.
  • FIG. 2 is a schematic plan view of a main body sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • FIG. 3 is a schematic plan view of a bridge sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 4A is a schematic plan view of a main body sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 4B is a schematic plan view of a bridge sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 5A is a schematic plan view of a main body sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 5B is a schematic plan view of the main body sub-circuit board of the flexible circuit board provided by at least one embodiment of the present disclosure
  • 6A is a schematic cross-sectional view of a main body sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 6B is a schematic cross-sectional view of the main body sub-circuit board of the flexible circuit board provided by at least one embodiment of the present disclosure
  • FIG. 7A is another schematic cross-sectional view of the main body sub-circuit board of the flexible circuit board provided by at least one embodiment of the present disclosure
  • FIG. 7B is another schematic cross-sectional view of the main body sub-circuit board of the flexible circuit board provided by at least one embodiment of the present disclosure.
  • FIG. 8A is a schematic cross-sectional view of a bridge sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • FIG. 8B is a schematic cross-sectional view of a bridge sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 8C is a schematic cross-sectional view of a bridge sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 8D is a schematic cross-sectional view of a bridge sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 9A is another schematic cross-sectional view of the bridge sub-circuit board of the flexible circuit board provided by at least one embodiment of the present disclosure.
  • 9B is another schematic cross-sectional view of the bridge sub-circuit board of the flexible circuit board provided by at least one embodiment of the present disclosure.
  • 10A is a schematic diagram of an electronic device module provided by at least one embodiment of the present disclosure.
  • 10B is a schematic diagram of another electronic device module provided by at least one embodiment of the present disclosure.
  • FIG. 11 is a schematic diagram of an electronic device provided by some embodiments of the disclosure.
  • FIG. 12 is a manufacturing flow chart of a flexible circuit board provided by some embodiments of the disclosure.
  • Flexible circuit boards can usually integrate multiple signal traces to transmit different types of signals.
  • the wiring difficulty in the flexible circuit board will also increase. Big.
  • flexible circuit boards are often formed with multiple wiring layers, such as four or six wiring layers, etc., so as to facilitate the layout of multiple wirings, so that multiple wirings can be distributed on different layers , Thereby reducing the mutual interference between different types of wiring.
  • For signal crosstalk between different traces it is also necessary to form (electromagnetic signal) shielding layers between different traces, all of which increase the difficulty of manufacturing the flexible circuit board.
  • the flexible circuit board includes a first substrate, and a main body sub-circuit board and a bridge sub-circuit board disposed on the first substrate;
  • the main body sub-circuit board includes a first bridge end, a second Two bridge terminals, a first wiring part and a second wiring part, the first wiring part and the second wiring part are spaced apart from each other and electrically connected to the first bridge terminal and the second bridge terminal respectively;
  • the bridge sub-circuit board includes The second substrate and the third bridge end, the fourth bridge end, and the third wiring part provided on the second substrate, the third bridge end and the fourth bridge end are electrically connected by the third wiring part, the first substrate and the second
  • the substrate is not in direct contact, and the bridge sub-circuit board is configured to be mounted on the main sub-circuit board by electrically connecting the third bridge terminal and the fourth bridge terminal to the first bridge terminal and the second bridge terminal, respectively.
  • An electronic device module provided by at least one embodiment of the present disclosure includes an electronic device substrate and the above-mentioned flexible circuit board; the electronic device substrate includes a first functional circuit structure, and the first functional wiring of the flexible circuit board is electrically connected to the first function Circuit configuration.
  • At least one embodiment of the present disclosure provides an electronic device including the above-mentioned electronic device module.
  • FIG. 1A is a schematic plan view of the flexible circuit board.
  • the flexible circuit board 10 includes a main body sub-circuit board 100 and a bridge sub-circuit board 200, and the bridge sub-circuit board 200 may be electrically connected to the main body sub-circuit board 100.
  • FIG. 2 is a schematic plan view of the main body sub-circuit board 100.
  • the main body sub-circuit board 100 includes a first substrate and a first bridge terminal 101, a second bridge terminal 102, a first wiring portion 103, and a second wiring portion 104 disposed on the first substrate;
  • a wiring portion 103 and a second wiring portion 104 are separated from each other by a predetermined space (distance), and are electrically connected to the first bridge terminal 101 and the second bridge terminal 102, respectively.
  • the first bridge end 101 includes a plurality of first contact pads
  • the second bridge end 102 includes a plurality of second contact pads.
  • the first wiring portion 103 includes a plurality of wirings, and one end of the plurality of wirings is electrically connected to the plurality of first contact pads included in the first bridge terminal 101 in a one-to-one correspondence;
  • the second wiring portion 104 also includes multiple One wire, and one end of the wire is electrically connected to the plurality of second contact pads included in the first bridge terminal 102 in a one-to-one correspondence.
  • the figure only shows two wires included in the first wire portion 103 and two wires included in the second wire portion 104, the embodiments of the present disclosure are not limited thereto.
  • FIG. 3 is a schematic plan view of the bridge sub-circuit board 200.
  • the bridge sub-circuit board 200 includes a second substrate, a third bridge end 201, a fourth bridge end 202, and a third wiring portion 203 disposed on the second substrate, the third bridge end 201 and the fourth
  • the bridge terminal 202 is electrically connected by the third wiring part 203.
  • the third bridging end 201 includes a plurality of third contact pads
  • the fourth bridging end 202 includes a plurality of fourth contact pads
  • the third trace portion 203 includes a plurality of traces, and these traces are connected to the third bridging end at one end.
  • the plurality of third contact pads included in 201 are electrically connected in one-to-one correspondence, and the other end is electrically connected in one-to-one correspondence with the plurality of fourth contact pads included in the fourth bridge terminal 202. Although only two wires included in the third wire portion 203 are shown in the figure, the embodiment of the present disclosure is not limited thereto.
  • the bridge sub-circuit board 200 is configured to be able to mount the bridge sub-circuit board 200 to the main sub-circuit by electrically connecting the third bridge terminal 201 and the fourth bridge terminal 202 to the first bridge terminal 101 and the second bridge terminal 102, respectively On board 100.
  • the first wiring portion 103, the third wiring portion 203, and the second wiring portion 104 are sequentially electrically connected to obtain the first functional wiring, thereby
  • the signal may be transmitted from the first wiring section 103 to the second wiring section 104 through the third wiring section 203, or may be transmitted from the second wiring section 104 to the first wiring section through the third wiring section 203 103.
  • FIG. 1A shows a situation where the bridge sub-circuit board 200 is mounted on the main sub-circuit board 100 through the third bridge end 201 and the fourth bridge end 202 respectively being joined to the first bridge end 101 and the second bridge end 102
  • the main body sub-circuit board 100 and the bridge sub-circuit board 200 may also be in a state to be connected, that is, the separate main body sub-circuit board 100 and the bridge sub-circuit board 200 are also within the protection scope of the present disclosure.
  • the flexible circuit board 10 may further include a first control circuit combining structure 105, and the first control circuit combining structure 105 is disposed on the main sub-circuit board 100.
  • the first control circuit combining structure 105 includes a plurality of contact pads for mounting the first control circuit, and a part of the plurality of contact pads is electrically connected to the other end of the plurality of wires included in the first wiring portion 103 one by one. connection.
  • the first control circuit combined structure 105 is configured to provide a first electrical signal to the first functional wiring or receive a first electrical signal from the first functional wiring.
  • the first control circuit may be a driver IC chip.
  • packaging methods such as tape carrier package (TCP), chip on film (COF) packaging, and so on.
  • TCP tape carrier package
  • COF chip on film
  • the flexible circuit board includes multiple contact pads, and the multiple pins of the driver IC chip are soldered to the multiple contact pads of the flexible circuit board in a one-to-one correspondence (such as eutectic soldering), or through anisotropic conductive glue ( ACF)
  • ACF anisotropic conductive glue
  • One-to-one electrical connection, and at least the soldering part is protected by, for example, epoxy resin; in order to increase the bendability of the flexible circuit board in the TCP mode, a slit (Slit) can be formed in the package part.
  • the flexible circuit board includes multiple contact pads, and the multiple pins of the driver IC chip are directly crimped on the multiple contact pads of the flexible circuit board through ACF, so that the multiple pins of the driver IC chip and the flexible circuit
  • the multiple contact pads of the board are electrically connected in a one-to-one correspondence.
  • the size and arrangement of the contact pads on the flexible circuit board used to combine the driver IC chip can be adjusted according to different types of packaging or the driver IC chip to be packaged.
  • the contact pads can be arranged long Bars or arranged in rectangles.
  • the embodiment of the present disclosure does not limit the packaging method of the driver IC chip.
  • the main body sub-circuit board 100 of the flexible circuit board 10 may further include a second functional wiring 106.
  • the second functional wiring 106 includes multiple wirings, and the first control circuit Another part of the contact pads in the bonding structure 105 are electrically connected to the multiple wirings included in the second functional wiring 106 in a one-to-one correspondence.
  • the first control circuit mounted on the first control circuit bonding structure 105 is also configured to provide The second functional wiring 106 provides a second electrical signal or receives a second electrical signal from the second functional wiring 106.
  • the main sub-circuit board 100 of the flexible circuit board 10 further includes a third functional wiring 107, and the third functional wiring 107 is located in the first wiring portion 103 and Between the second wiring portions 104, thereby passing through the predetermined space between the first wiring portion 103 and the second wiring portion 104, for example, the third functional wiring 107 is connected to the main body sub-circuit board 100
  • the bridge sub-circuit board 200 crosses in a direction perpendicular to the surface of the main body sub-circuit board 100.
  • the third portion of the wiring 203 on the bridge sub-circuit board 200 crosses the third functional wiring 107 to electrically connect the first portion 103 and the second portion of the wiring 104 on both sides of the main sub-circuit board 100,
  • this design can also simplify the wiring layout of the main body sub-circuit board 100, making the manufacturing process of the main sub-circuit board simple.
  • the first wiring portion 103, the second wiring portion 104, and the third functional wiring 107 are wired in the same direction, such as parallel wiring or substantially parallel wiring (as long as the wiring It does not need to cross), such as parallel wiring in the vertical direction as shown in the figure.
  • the above-mentioned multiple types of wiring on the main body sub-circuit board 100 have no crossover parts, and the wiring layout is simpler.
  • these traces may be arranged in the same trace layer, thereby reducing the number of trace layers and simplifying the layered structure of the flexible circuit board.
  • the flexible circuit board 10 may further include a second control circuit combining structure 108, and the second control circuit combining structure 108 is disposed on the main sub-circuit board 100.
  • the second control circuit combining structure 108 includes a plurality of contact pads for mounting the second control circuit, and at least a part of the plurality of contact pads is electrically connected to one end of the third functional wiring 107 in a one-to-one correspondence.
  • the second control circuit combined structure 108 is configured to provide a third electrical signal to the third functional wiring 107 or receive a third electrical signal from the third functional wiring 107.
  • the third function trace 107 is divided into two parts, the first part of the third function trace 107 is electrically connected to the first end (the lower end shown in the figure) of the second control circuit combination structure 108, and the third function trace The second part of 107 is electrically connected between the second end (shown as the upper end in the figure) of the second control circuit coupling structure 108 and the contact pad (described below) formed on one side edge of the main sub-circuit board 100.
  • the second control circuit may also be a driver IC chip.
  • the first control circuit and the second control circuit are respectively used to implement different driving functions.
  • the method of coupling the driver IC chip to the flexible circuit board is, for example, tape carrier package (TCP), chip on film (COF) package, and the like.
  • the second control circuit bonding structure 108 includes a plurality of contact pads for connecting with the driving IC chip.
  • the size, arrangement, etc. of the contact pads can be adjusted according to different types of packaging methods or driver IC chips to be packaged, which are not specifically limited in the embodiments of the present disclosure.
  • the first control circuit combination structure 105 may also be formed on the bridge sub-circuit board 200.
  • the first wiring The part 103 and the second wiring part 104 are electrically connected to the first bridge terminal 101 and the second bridge terminal 102, respectively.
  • the third wiring part 203 is divided into two parts, and the third wiring part 203 The first part of is electrically connected between the first control circuit coupling structure 105 and the third bridge terminal 201, and the second part of the third wiring part 203 is electrically connected between the first control circuit coupling structure 105 and the fourth bridge terminal 202 .
  • the first wiring portion 103 and the second wiring portion 104 on the main sub-circuit board 100 are electrically connected to the first control circuit combination structure 105 on the bridge sub-circuit board 200, respectively.
  • the main body sub-circuit board 100 includes a plurality of first bridge terminals 101 and a plurality of second bridge terminals 102, and the plurality of bridge sub-circuit boards 200 respectively pass through a plurality of third bridge terminals 201 and a plurality of fourth bridge terminals thereon.
  • 202 is electrically connected to a plurality of first bridge terminals 101 and a plurality of second bridge terminals 102, respectively, so as to be mounted on the main body sub-circuit board 100.
  • bridge sub-circuit boards 200 there are two bridge sub-circuit boards 200, but the embodiment of the present disclosure is not limited to this, and the number of bridge sub-circuit boards 200 can be selected according to actual needs. In the embodiment of the present disclosure, the number of bridge sub-circuit boards 200 is not limited.
  • the embodiment of the present disclosure does not specifically limit the arrangement of the bridge sub-circuit board 200.
  • the bridge sub-circuit board 200 is arranged horizontally, so that the left and right sides of the main sub-circuit board 100 are routed.
  • the wires located in the middle of the main body sub-circuit board 100 pass under the bridge sub-circuit board 200.
  • the arrangement direction of the bridge sub-circuit board 200 can also be bridged vertically, thereby bridging the traces located on the upper and lower sides of the main sub-circuit board 100, and are located on the main sub-circuit board 100.
  • the traces on the left and right sides pass under the bridge sub-circuit board 200.
  • FIG. 5A shows a schematic plan view of another main body sub-circuit board provided by an embodiment of the present disclosure.
  • the main body sub-circuit board adopts a different shape and circuit arrangement from the foregoing embodiment.
  • the main body sub-circuit board is elongated, and the main body sub-circuit board has a first bridge terminal 101, a second bridge terminal 102, a first wiring portion 103, a second wiring portion 104, and Structures such as the second functional wiring 106 have a similar arrangement to the main body sub-circuit board of the above-mentioned embodiment.
  • Structures such as the second functional wiring 106 have a similar arrangement to the main body sub-circuit board of the above-mentioned embodiment.
  • the third wiring portion 107 extends from the middle part of the main sub-circuit board and is on one side of the main sub-circuit board ( The lower side shown in the figure) is turned to the left side of the main body sub-circuit board and electrically connected to the terminal 111 on the left side of the main body sub-circuit board.
  • the terminal 111 has a plurality of contact pads, and the plurality of wires in the third wiring portion 107 correspond to the plurality of contact pads on the terminal 111 and are electrically connected.
  • the terminal 111 may be used for electrical connection with other electronic devices or control chips, which are not limited in the embodiment of the present disclosure.
  • the main sub-circuit board may have a single-layer wiring structure or a multi-layer wiring structure (such as a double-layer wiring structure or a three-layer wiring structure, etc.), which is not done in the embodiments of the present disclosure. limited.
  • FIG. 6A shows a schematic cross-sectional view of a main body sub-circuit board provided by some embodiments of the present disclosure, and the cross-sectional view is, for example, cut along the line A-A in FIG. 2.
  • the main sub-circuit board 100 has a single-layer wiring structure.
  • the main body sub-circuit board 100 includes a first substrate 1001 and a first main body wiring layer 1002 and a first main body insulating layer 1003 stacked on one side of the first substrate 1001.
  • the first main wiring layer 1002 includes a first wiring portion 103, a second wiring portion 104, a first bridge terminal 101 and a second bridge terminal 102.
  • the first bridge terminal 101 and the second bridge terminal 102 are separated by the first The body insulating layer 1003 is exposed.
  • the first main body insulating layer 1003 serves as a protective layer to provide structural and electrical protection to the first main body wiring layer 1002.
  • the first main body insulating layer 1003 may be bonded to the first main body through an adhesive layer (not shown in the figure).
  • an opening 1013 is formed in the first main insulating layer 1003, and in the opening 1013, for example, the exposed portion of the first wiring layer 1002 corresponding to the first bridge terminal 101 or the second bridge terminal 102 may be subjected to surface treatment (for example, The solder layer is plated), thereby forming a plurality of patterned contact pads, and correspondingly forming the first bridge terminal 101 or the second bridge terminal 102.
  • surface treatment for example, The solder layer is plated
  • the main body sub-circuit board further includes the second function wiring 106 and the third function wiring 107
  • the second function wiring 106 and the third function wiring 107 are also arranged in the first wiring layer 1002.
  • the main body sub-circuit board has a single-layer wiring structure with a single-layer wiring layer.
  • FIG. 6B shows a schematic cross-sectional view of another main body sub-circuit board provided by some embodiments of the present disclosure, and the cross-sectional view is cut along the line A-A in FIG. 2, for example.
  • the main sub-circuit board 100 has a multi-layer wiring structure.
  • the main sub-circuit board 100 has a double-layer wiring structure as an example for description with reference to FIG. 6B, but the embodiment of the present disclosure does not limit this.
  • the main body sub-circuit board 100 includes a first substrate 1001, a first main body wiring layer 1002 and a first main wiring layer 1002 and a second substrate located on the first side of the first substrate 1001 (shown as the upper side in the figure).
  • a main insulation layer 1003 further includes a second main wiring layer 1004 and a second main insulation layer 1005 that are located on the second side of the first substrate 1001 (shown as the lower side in the figure) and stacked.
  • the first main body insulating layer 1003 serves as a protective layer to provide structure and electrical protection for the first main body wiring layer 1002.
  • the first main body insulating layer 1003 can be bonded to the first main body wiring through an adhesive layer (not shown in the figure) Layer 1002 and the first substrate 1001; the second insulating layer 1005 is used as a protective layer to provide structure and electrical protection for the second main body wiring layer 1004, for example, the second main body insulating layer 1005 may pass through an adhesive layer (not shown in the figure) Bonded to the second main wiring layer 1004 and the first substrate 1001.
  • the first main body wiring layer 1002 includes a first wiring portion 103 and a second wiring portion 104. At this time, the first wiring portion 103 and the second wiring portion 104 can be routed on the first main body.
  • the wiring layer 1002 and the second main wiring layer 1004 are arranged crosswise. For example, two wirings adjacent to each other of the first wiring portion 103 on the main body sub-circuit board 100 may be located on the first main wiring layer. 1002 and the second main body wiring layer 1004, thereby facilitating wiring arrangement.
  • the second wiring part 104 can also be similarly arranged.
  • the second functional wiring 106 and the third functional wiring 107 can also be on the first main wiring layer 1002 and the second functional wiring layer 1002.
  • the main wiring layer 1004 is arranged crosswise.
  • the first main wiring layer 1002 may include a first wiring portion 103 and a second wiring portion 104
  • the second main wiring layer 1004 may include a second functional wiring 106 and a third functional wiring 107, that is, different
  • the wiring layer can be arranged with different functional wiring.
  • the embodiment of the present disclosure does not specifically limit the wiring layout on the main body sub-circuit board 100.
  • the wiring in the second main wiring layer 1004 has a similar arrangement to the wiring in the first main wiring layer 1002, and each wiring in the second main wiring layer 1004 can pass through Vias (such as the black dots shown in FIG. 5B) are electrically connected to the first body wiring layer 1002, and are exposed by the corresponding insulating layer to form bridge terminals.
  • the first bridge terminal 101 and the second bridge terminal 102 may be exposed by the first body insulating layer 1003.
  • an opening 1013 is formed in the first body insulating layer 1003, and in the opening 1013, for example, a portion of the exposed first body wiring layer 1002 corresponding to the first bridge terminal 101 or the second bridge terminal 102 can be processed.
  • a plurality of patterned contact pads are formed, corresponding to the first bridging end 101 or the second bridging end 102; similarly, for the wiring located in the second main wiring layer 1004, you can pass through
  • the via hole 1011 in the first substrate 1001, the first main body wiring layer 1002 and the opening 1013 of the first main body insulating layer 1003 form a bridge end.
  • the via hole 1011 in the first substrate 1001 and the opening 1013 of the first body insulating layer 1003 are arranged in a staggered manner. Therefore, during the manufacturing process, the position of the opening 1013 is relatively flat, which facilitates the formation of contact pads.
  • the first bridge terminal 101 and the second bridge terminal 102 may be respectively exposed on different sides of the main body sub-circuit board, so that the first bridge terminal 101 and the second bridge terminal 102 are arranged on the main body sub-circuit board. Different sides.
  • FIG. 7A shows a schematic cross-sectional view of a main sub-circuit board provided by some embodiments of the present disclosure, and the cross-sectional view is, for example, cut along the line C-C in FIG. 2.
  • the main body sub-circuit board has a single-layer wiring structure.
  • the first bridge terminal 101 of the main body sub-circuit board is exposed by the first main insulation layer 1003, as shown in FIG. 6A; the second bridge terminal 102 is exposed by the first substrate 1001, thereby connecting the first bridge terminal 101 and the second bridge terminal 102 Set on different sides of the main body sub-circuit board.
  • FIG. 7B shows a schematic cross-sectional view of another main body sub-circuit board provided by some embodiments of the present disclosure, and the cross-sectional view is cut along the line C-C in FIG. 2, for example.
  • the main body sub-circuit board has a double-layer wiring structure.
  • the first bridge end 101 of the main body sub-circuit board is exposed by the first main body insulating layer 1003, as shown in FIG. 6B; the second bridge end 102 is exposed by the second main body insulating layer 1005, thereby connecting the first bridge end 101 and the second bridge
  • the terminals 102 are arranged on different sides of the main body sub-circuit board.
  • the main body sub-circuit board may also have a three-layer wiring structure, a four-layer wiring structure and other multilayer wiring structures.
  • various parts of the wiring on the main sub-circuit board such as the first wiring part, the second wiring part, the second function wiring, and the third function wiring, may be arranged in a multilayer wiring layer.
  • the first wiring portion, the second wiring portion, the second functional wiring, and the third functional wiring are alternately arranged in multiple wiring layers, or are arranged in different wiring layers.
  • the embodiments of the present disclosure do not specifically limit the number of wiring layers and the wiring arrangement of the main body sub-circuit board.
  • the bridge sub-circuit board may also have a single-layer wiring structure or a multi-layer wiring structure.
  • FIG. 8A shows a schematic cross-sectional view of a bridge sub-circuit board provided by some embodiments of the present disclosure. The cross-sectional view is, for example, cut along the line B-B in FIG. 3A.
  • the bridge daughter circuit board 200 has a single-layer wiring structure.
  • the bridge sub-circuit board 200 includes a second substrate 2001, and a first bridge wiring layer 2002 and a first bridge insulation layer on the first side (the upper side shown in the figure) of the second substrate 2001.
  • Layer 2003, the first bridge wiring layer 2002 includes a third wiring portion 203.
  • the first bridge insulating layer 2003 serves as a protective layer to provide structural and electrical protection to the first bridge wiring layer 2002.
  • the first bridge insulating layer 2003 can be bonded to the first bridge via an adhesive layer (not shown in the figure).
  • the wiring layer 2002 and the second substrate 2001 are examples of the first bridge wiring layer 2002 and the second substrate 2001.
  • the second substrate 2001 has an opening 2011, and in the opening 2011, for example, the exposed part of the first bridge wiring layer 2002 corresponding to the third bridge end 201 or the fourth bridge end 202 may be subjected to surface treatment to form The patterned multiple contact pads form the third bridge end 201 or the fourth bridge end 202 correspondingly.
  • the bridge sub-circuit board 200 may further include a shielding layer 2006, and the shielding layer 2006 is disposed on the side of the second substrate 2001 away from the first bridge wiring layer 2002.
  • the shielding layer 2006 can be grounded, so as to achieve an electromagnetic shielding effect and prevent signal crosstalk from the wiring in the main sub-circuit board and the bridge sub-circuit board.
  • the shielding layer 2006 has a hollow structure 2016 that corresponds to the opening 2011 in the second substrate 2001 to expose the third bridge end 201 or the fourth bridge end 202.
  • FIG. 8C shows a schematic cross-sectional view of another bridge sub-circuit board provided by some embodiments of the present disclosure.
  • the cross-sectional view is, for example, cut along the line B-B in FIG. 3A.
  • the bridge sub-circuit board 200 has a multi-layer structure. The following describes with reference to FIG. 8C taking the bridge sub-circuit board 200 having a double-layer structure as an example, but the embodiment of the present disclosure does not limit this.
  • the bridge sub-circuit board 200 includes a second substrate 2001, and a first bridge wiring layer 2002 and a first bridge insulating layer 2003 on the first side (the upper side shown in the figure) of the second substrate 2001.
  • the first bridge wiring layer 2002 includes a third wiring portion 203.
  • the first bridge insulating layer 2003 serves as a protective layer to provide structural and electrical protection to the first bridge wiring layer 2002.
  • the first bridge insulating layer 2003 can be bonded to the first bridge via an adhesive layer (not shown in the figure).
  • the wiring layer 2002 and the second substrate 2001 are examples of the first bridge wiring layer 2002 and the second substrate 2001.
  • the bridge sub-circuit board 200 may further include a second bridge wiring layer 2004 on a second side (shown as the lower side in the figure) opposite to the first side of the second substrate 2001 and The second bridge insulating layer 2005 is laminated on the second bridge wiring layer 2004.
  • the second bridging wiring layer 2004 may also include a third wiring portion 203.
  • the third wiring portions 203 may be alternately arranged in the first bridging wiring layer 2002 and the second bridging wiring layer 2004.
  • two traces of the third trace portion 203 adjacent to each other on the board surface of the bridge sub-circuit board 200 may be located in the first bridging trace layer 2002 and the second bridging trace layer 2004 respectively, thereby facilitating Wiring arrangement.
  • the dotted line in FIG. 8D indicates that the wiring portions located on both sides of the second bridge wiring layer 2004 are not electrically connected.
  • the third wiring portion 203 located on the first side of the bridge sub-circuit board 200 is exposed and led out through the via 2011 in the second substrate 2001 and the opening 2015 in the second bridge insulating layer 2005, for example, a pattern is formed by surface treatment A plurality of contact pads formed to form the third bridge end 201 or the fourth bridge end 202.
  • the opening 2015 in the second bridge insulating layer 2005 is formed at the position indicated by the dashed frame shown in FIG. 8C or at other suitable positions, which is not limited in the embodiment of the present disclosure.
  • the bridge sub-circuit board 200 may further include a shielding layer 2006 on the second side of the second substrate 2001.
  • the shielding layer 2006 is, for example, provided on the second bridging insulating layer 2005. The side away from the second substrate 2001.
  • the shielding layer 2006 is grounded to achieve an electromagnetic shielding effect.
  • the shielding layer 2006 has a hollow structure 2016 at a position corresponding to the opening 2015 of the second bridging insulating layer 2005, thereby forming the exposed third bridging end 201 or the fourth bridging end 202.
  • the shielding layer 2006 is located between the wiring layer in the main sub-circuit board 100 and the wiring layer bridging the sub-circuit board 200.
  • the shielding layer 2006 can prevent the wiring layer in the main sub-circuit board 100 from bridging the sub-circuit Signal crosstalk occurs between the wiring layers of the board 200.
  • the second bridge wiring layer 2004 may be a ground layer including multiple ground wirings.
  • the third wiring portion 203 may be all disposed in the first bridging wiring layer 2002. Therefore, there is also a ground layer between the wiring layer in the main sub-circuit board 100 and the wiring layer of the bridge sub-circuit board 200, which can further prevent the wiring layer in the main sub-circuit board 100 and the bridge sub-circuit Signal crosstalk occurs between the wiring layers of the board 200.
  • the third wiring portion 203 may be partially disposed in the first bridging wiring layer 2002, and another part is disposed in the second bridging wiring layer 2004. At this time, the second bridging wiring layer The ground traces in the layer 2004 and some traces of the third trace portion 203 may be arranged alternately. Therefore, the second bridge wiring layer 2004 can also play a role in preventing signal crosstalk.
  • the grounding layer 2004 and the shielding layer 2006 can achieve a double shielding effect, preventing the wires on the main sub-circuit board 100 from bridging the wires on the sub-circuit board 200 Signal crosstalk occurs.
  • the bridge sub-circuit board 200 may further include an insulating layer (not shown in the figure) outside the shielding layer 2006 (that is, the side away from the second substrate 2001) to provide protection to the shielding layer 2006
  • the insulating layer may be bonded to the shielding layer 2006 through an adhesive layer.
  • the insulating layer may further include an opening corresponding to the opening 2015 and the hollow structure 2016 to expose the bridging end.
  • the via hole 2011 in the second substrate 2001 and the opening 2015 of the second bridging insulating layer 2005 are arranged in a staggered manner. Therefore, during the manufacturing process, the position of the opening 1015 is relatively flat, which facilitates the formation of contact pads.
  • the third bridge terminal 201 or the fourth bridge terminal 202 of the bridge sub-circuit board 200 may be exposed on different sides of the bridge sub-circuit board 200, so that the third bridge terminal 201 and the fourth bridge terminal are exposed.
  • 202 is arranged on different sides of the bridge sub-circuit board 200.
  • FIG. 9A shows a schematic cross-sectional view of another bridge sub-circuit board provided by some embodiments of the present disclosure.
  • the cross-sectional view is, for example, cut along the line D-D in FIG. 3A.
  • the bridge daughter circuit board has a single-layer wiring structure.
  • the third bridge end 201 of the bridge sub-circuit board is exposed by the second substrate 2001, as shown in FIG. 8A; the fourth bridge end 202 is exposed by the opening 2013 in the first bridge insulating layer 2003, as shown in FIG. 9A, thereby
  • the third bridge terminal 201 and the fourth bridge terminal 202 are arranged on different sides of the bridge sub-circuit board.
  • FIG. 9B shows a schematic cross-sectional view of another bridge sub-circuit board provided by some embodiments of the present disclosure, and the cross-sectional view is cut along the line D-D in FIG. 3A, for example.
  • the bridge sub-circuit board has a double-layer wiring structure.
  • the third bridge terminal 201 of the bridge sub-circuit board is exposed by the second bridge insulating layer 2005, as shown in FIG. 8C; the fourth bridge terminal 202 is exposed by the opening 2013 in the first bridge insulating layer 2003, as shown in FIG. 9B Therefore, the third bridge terminal 201 and the fourth bridge terminal 202 are arranged on different sides of the bridge sub-circuit board.
  • the bridge sub-circuit board may also have a multi-layer wiring structure such as a three-layer wiring structure and a four-layer wiring structure.
  • the third part of the wiring on the bridge sub-circuit board can be arranged in a multilayer wiring layer.
  • the third part of the wiring can be alternately arranged in multiple wiring layers.
  • the embodiments of the present disclosure do not specifically limit the number of wiring layers and the wiring arrangement of the bridge sub-circuit board.
  • the third bridge terminal 201 and the fourth bridge terminal 202 of the bridge sub-circuit board can be electrically connected to the first bridge terminal 101 and the first bridge terminal 101 on different sides of the main sub-circuit board.
  • the second bridge terminal 102 or when the first bridge terminal 101 and the second bridge terminal 102 of the main body sub-circuit board are arranged on different sides of the main body sub-circuit board, and bridge the third bridge terminal 201 and the fourth bridge terminal of the sub-circuit board
  • the third bridge end 201 and the fourth bridge end 202 of the bridge sub-circuit board can be electrically connected to the first bridge end 101 and the first bridge end 101 on different sides of the main sub-circuit board by bending.
  • the second bridge terminal 102 so that the bridge sub-circuit board can be bridged on the main sub-circuit board in a form similar to a "issue card".
  • the first substrate 1001 and the second substrate 2001 can be made of flexible materials such as polyimide or polyester, each wiring layer can be made of copper, silver, aluminum and other metal materials or alloy materials, and each insulating layer can be made of polyimide. Insulating materials such as amine or polyester.
  • the grounding layer 2004 is made of metal materials (such as copper layer or copper foil).
  • the shielding layer 2006 includes an insulating base and a conductive material filled in the insulating base.
  • the insulating base is made of epoxy resin and filled with conductive material.
  • the material is copper powder, graphite powder, etc.; or, in some embodiments, the shielding layer 2006 may also be a metal material.
  • the present disclosure does not specifically limit the material of each functional layer; the adhesive layer is made of epoxy resin or polyethylene.
  • the third bridge end 201 and the fourth bridge end 202 of the bridge sub-circuit board 200 are respectively connected to the first bridge end 101 and the second bridge end of the main sub-circuit board 100 by anisotropic conductive glue, soldering material or a connector. 102.
  • the connector includes a Zero Insertion Force (ZIF) connector or a Board to Board (BTB) connector, etc.
  • ZIF Zero Insertion Force
  • BTB Board to Board
  • a board-to-board type connector is used to connect the main body sub-circuit board 100 and the bridge sub-circuit board 200.
  • the connector includes a male connector and a female connector that cooperate with each other.
  • the first bridge end 101 and the second bridge end 102 of the main sub-circuit board 100 are provided with female connectors
  • the third bridge end 201 and the fourth bridge end 202 of the bridge sub-circuit board 200 are provided with male connectors, thereby connecting via male
  • the mating of the connector and the female connector connects the bridge daughter circuit board 200 and the main body daughter circuit board 100.
  • the flexible circuit board provided by the embodiment of the present disclosure has a main body sub-circuit board and a bridge sub-circuit board, and the wiring on both sides of the main sub-circuit board is bridged by the bridge sub-circuit board, which can avoid the crossing of the wiring on the main sub-circuit board. Therefore, it is possible to prevent or reduce signal crosstalk, or to avoid adding additional functional layers to prevent signal crosstalk, thereby avoiding the complexity of the circuit board structure.
  • the main sub-circuit board and the bridge sub-circuit board have a simple single-layer or double-layer structure, so the wiring layout is simpler, which can reduce the difficulty of manufacturing the main sub-circuit board and the bridge sub-circuit board.
  • FIG. 10A shows a schematic diagram of the electronic device module.
  • the electronic device module 1 includes an electronic device substrate 11 and any of the above-mentioned flexible circuit boards 10, and the electronic device substrate 11 includes a first functional circuit structure 20.
  • the first functional wiring (including the first wiring portion 103, the second wiring portion 104 and the third wiring portion 203) of the flexible circuit board 10 is electrically connected to the first functional circuit structure 20.
  • the flexible circuit board 10 further includes a second functional wiring 106
  • the first functional circuit structure 20 includes a first signal transmission portion 21 and a second signal transmission portion 22, and the first functional wiring is electrically connected to the second signal transmission portion.
  • a signal transmission part 21, and the second functional wiring 106 is electrically connected to the second signal transmission part 22.
  • the electronic device substrate 11 further includes a second functional circuit structure 23, and the flexible circuit board further includes a third functional wiring 107, and the third functional wiring 107 is electrically connected to the second functional circuit structure 23.
  • the electronic device substrate 11 is a substrate with a display function and a touch function.
  • the first functional circuit structure 20 is a touch circuit structure
  • the second functional circuit structure 23 is a display circuit structure.
  • the electronic device substrate 11 is a substrate with a display function and a fingerprint recognition function.
  • the first functional circuit structure 20 is a fingerprint recognition circuit structure.
  • the fingerprint recognition circuit structure is a capacitive fingerprint recognition circuit.
  • the second functional circuit structure 23 is a display circuit structure including detecting driving electrodes and detecting sensing electrodes that are arranged crosswise. In the following, description is made by taking the first functional circuit structure 20 as a touch circuit structure as an example.
  • the arrangement of the touch circuit structure on the electronic device substrate 11 may be a built-in type or an externally mounted type.
  • the form of the touch circuit structure may be capacitive, for example, a mutual capacitive touch circuit structure.
  • the mutual-capacitive touch circuit structure includes a plurality of first electrodes extending in a first direction and a plurality of second electrodes extending in a second direction (intersecting the first direction).
  • a detection capacitance will be formed, that is, the two sets of electrodes respectively constitute the two poles of the capacitance.
  • the capacitance change data of the touch circuit structure and the coordinates of each capacitance the coordinates of each touch point can be obtained.
  • the horizontal electrode is used as a touch drive circuit to send out excitation signals in turn
  • the vertical electrode is used as a touch sensing circuit to receive signals at the same time or sequentially, so that the capacitance value of the intersection of all horizontal and vertical electrodes can be obtained, that is, the entire touch
  • the capacitance of the two-dimensional plane of the structure Therefore, even if there are multiple touch points on the touch control structure, the true coordinates of each touch point can be determined.
  • the first signal transmission part 21 may include touch driving traces electrically connected to the touch drive (Tx) circuit of the touch circuit
  • the second signal transmission part 22 may include touch driving traces electrically connected to the touch circuit.
  • the first control circuit 1051 is a touch drive IC, which can provide an excitation signal to the touch drive circuit through the touch drive trace, and can receive the sensing signal of the touch sensing circuit through the touch sensing trace, and can be based on the above The signal determines the touch position and responds.
  • the touch driving circuit is bridged, and the touch sensing circuit is directly electrically connected to the first control circuit coupling structure 105.
  • the distance between the touch sensing circuit and the first control circuit coupling structure 105 is closer.
  • the first control circuit 1051 installed on the touch control circuit 1051 is closer to the touch driver IC, so the sensing signal received by the touch sensing circuit is transmitted to the touch driver IC in a shorter path, so the sensing signal may be interfered by the signal Smaller, which can make the touch operation more accurate.
  • the touch driving wiring and the touch sensing wiring extend to the same side of the electronic device substrate 11 (the lower side in the figure), and are connected to the contact pad 211 and the contact pad 221 formed on the side. Electrically connect separately.
  • the first signal transmission part 21 may also include touch sensing traces electrically connected to the touch sensing (Rx) circuit of the touch circuit, and the second signal transmission part 22 may include electrical connections.
  • the touch sensing circuit is bridged, and the touch drive circuit is directly electrically connected to the first control circuit combination structure 105, so the touch drive circuit and The distance between the first control circuit and the structure 105 is closer, that is, the distance between the first control circuit 1051, that is, the touch drive IC mounted on it, is closer. Therefore, in this embodiment, the touch control circuit in the touch drive circuit The driving signal is less likely to be interfered by the signal.
  • the flexible circuit board 10 has a terminal 110 on one side (for example, the upper side in the figure), a plurality of contact pads are provided on the terminal 110, and the other end of the plurality of wires included in the second wiring portion 104 is connected to the wiring.
  • Some of the contact pads in the terminal 110 are electrically connected in a one-to-one correspondence
  • the other ends of the multiple wirings included in the second functional wiring 106 are electrically connected to another part of the contact pads in the terminal 110 in a one-to-one correspondence
  • the third functional wiring The other ends of the multiple traces included in 107 are electrically connected to another part of the contact pads in the terminal 110 in a one-to-one correspondence.
  • part of the contact pads respectively electrically connected to the second wiring portion 104, the third functional wiring 107, and the second functional wiring 106 are arranged at intervals or continuously at the terminal 110, which is not specifically described in the embodiment of the present disclosure. limited.
  • the contact pads connected to them can be arranged continuously on the terminal 110; when the second wiring portion 104.
  • the contact pads connected to them can be arranged at intervals on the terminal 110.
  • the spaced arrangement shown in FIG. 10A can be formed Multiple sets of contact pads.
  • the terminal 110 is arranged in the wiring area 110A of the main sub-circuit board (that is, the oblique area under the terminal 110 in the figure).
  • the wiring area 110A area only has a wiring layer and a part of an insulating layer, but does not have a shielding layer. Therefore, the wiring area 110A has high transparency.
  • the contact pads of the terminals 110 on the side of the flexible circuit board 10 and the contact pads on the side of the electronic device substrate 11 can be directly crimped together, for example, in
  • the contact pads of the terminals 110 on the side of the flexible circuit board 10 and the contact pads on the side of the electronic device substrate 11 are electrically connected to each other through, for example, ACF, thereby connecting the first functional wiring on the flexible circuit board 10 to
  • the touch driving trace connected to the first signal transmission part 21 is electrically connected through the contact pad 211
  • the touch sensing trace connecting the second function trace on the flexible circuit board to the second signal transmission part 22 is electrically connected through the contact pad 221. Connection, thereby electrically connecting the first functional wiring and the second functional wiring of the flexible circuit board 10 with the touch circuit structure of the electronic device substrate 11.
  • the second functional circuit structure 23, that is, the display circuit structure, includes multiple data lines (and also gate lines, etc.), the multiple data lines are electrically connected to the pixel units, and the multiple data lines extend to the electronic device substrate 11 On one side (the lower side in the figure), and is electrically connected to the contact pad 231 formed on the side.
  • the pixel unit includes a display driving circuit, for example, the display driving circuit includes a plurality of transistors, capacitors, and light emitting devices, for example, formed in various forms such as 2T1C, 3T1C, or 7T1C.
  • the multiple contact pads on the terminals 110 of the flexible circuit board 10 also combine the third functional wiring on the flexible circuit board with the second functional circuit structure
  • the data lines in 23 are electrically connected through the contact pads 231, thereby electrically connecting the third function traces of the flexible circuit board 10 and the display circuit structure of the electronic device substrate 11.
  • the main sub-circuit board 100 may also have a second control circuit combination structure 108 and a second control circuit 1081 provided on the second control circuit combination structure 108.
  • the second control circuit 1081 is a display driver IC, which can provide data signals for the display driver circuit, so that the light-emitting state of the light-emitting device can be controlled by the data line number provided by the display driver IC to achieve different display effects.
  • the pixel unit includes a switching element and a first electrode (pixel electrode) and a second electrode (common electrode) for controlling the deflection of liquid crystal, and the switching element is electrically connected to the first electrode.
  • the second functional circuit structure 23 that is, the display circuit structure, includes a plurality of data lines respectively connected to the pixel unit.
  • the second control circuit is a display driver IC, which can provide different data voltage signals to the pixel unit through the data lines. In this way, the twisting state of the liquid crystal is controlled to achieve different display effects.
  • the flexible circuit board is bonded to the electronic device substrate 11 by binding.
  • the flexible circuit board can be bent to the back of the electronic device substrate 11 and fixed after being bound to the electronic device substrate 11 , That is, installed on the non-display side of the electronic device substrate 11 to facilitate the large-screen design of the display screen.
  • the wiring parts on the main body sub-circuit board that are respectively electrically connected to the touch drive circuit are bridged by the bridge sub-circuit board, so that the main body sub-circuit The touch drive circuit on the board and the display drive circuit do not intersect, and they are shielded from each other at the intersection of the main sub-circuit board and the bridge sub-circuit board, so the signal routing in the main sub-circuit board and the bridge sub-circuit board can be avoided Crosstalk, meanwhile, the structure of the main sub-circuit board and the bridge sub-circuit board are simple, and the wiring layout is simple, which is beneficial to simplify the manufacturing process.
  • FIG. 11 shows a schematic diagram of the electronic device.
  • the electronic device 2 includes any of the above-mentioned electronic device modules, and the electronic device module includes an electronic device substrate 11 and a flexible circuit board 10.
  • the upper side of the electronic device substrate 11 shown in FIG. 11 is the display side, and the lower side is the non-display side; at this time, the flexible circuit board 10 is bent and placed on the non-display side of the electronic device substrate 11 after being bound. In order to realize the large-screen design of the display screen.
  • the electronic device 2 may be, for example, any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, etc.
  • a display function such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, etc.
  • the embodiment of the present disclosure does not specifically limit this.
  • Some embodiments of the present disclosure provide a manufacturing method of a flexible circuit board. As shown in FIG. 12, the manufacturing method includes steps S101-S103.
  • Step S101 Provide the main body sub-circuit board.
  • the main body sub-circuit board 100 includes a first bridge terminal 101, a second bridge terminal 102, a first wiring portion 103 and a second wiring portion 104.
  • the first wiring portion 103 and the second wiring portion 104 are mutually connected. Spaced apart and electrically connected to the first bridge terminal 101 and the second bridge terminal 102 respectively.
  • the main body sub-circuit board 100 is formed by sequentially forming a first wiring layer 1002 and a first insulating layer 1003 on the first substrate 1001.
  • the first substrate 1001 is made of polyimide or polyester
  • the first wiring layer 1002 is made of copper, silver, aluminum and other metal materials or alloy materials
  • the first insulating layer 1003 is also made of polyimide or polyester.
  • other materials for example, firstly, a copper metal layer is formed on the first substrate 1001 by sputtering, and then the copper metal layer is patterned to form the first wiring layer 1002, and then the first wiring layer 1002 is formed by coating.
  • a first insulating layer 1003 is formed thereon, and openings are formed in the first insulating layer 1003 to form structures such as bridge ends.
  • Step S102 Provide a bridge sub-circuit board.
  • the bridge sub-circuit board 200 includes a third bridge end 201, a fourth bridge end 202, and a third wiring portion 203, and the third bridge end 201 and the fourth bridge end 202 are electrically connected by the third wiring portion 203.
  • the bridge sub-circuit board 200 is formed by sequentially forming a first bridge wiring layer 2002 and a first bridge insulating layer 2003 on the first side of the second substrate 2001.
  • the first substrate 2001 is made of polyimide or polyester
  • the first bridge wiring layer 2002 is made of copper, silver, aluminum and other metal materials or alloy materials
  • the first bridge insulating layer 2003 is also made of polyimide or Materials such as polyester.
  • a copper metal layer is formed on the first substrate 2001 by sputtering, and then the copper metal layer is patterned to form the first bridge wiring layer 2002, and then the first bridge wiring layer 2002 is formed by coating.
  • a first bridging insulating layer 2003 is formed on the layer 2002.
  • forming the bridge sub-circuit board 200 further includes sequentially forming a second bridge wiring layer 2004 and a second bridge insulating layer on the second side of the second substrate 2001 opposite to the first side. 2005.
  • the second bridging wiring layer 2004 may be a grounding layer, using materials such as copper, and the second bridging insulating layer 2005 using materials such as polyimide or polyester.
  • openings are formed in the second substrate 2001 and the second bridge insulating layer 2005 by patterning, etc., and the third wiring portion 203 formed on the first side of the bridge sub-circuit board 200 passes through the second substrate 2001
  • the vias 2011 in the second bridge insulation layer 2005 and the opening 2015 in the second bridge insulating layer 2005 are exposed and lead out.
  • a plurality of contact pads are formed by surface treatment to form bridge ends.
  • forming the bridge sub-circuit board 200 further includes forming a shielding layer 2006 on the second side of the second substrate 2001.
  • the shielding layer 2006 may be suspended or configured to be electrically connected to the ground wire.
  • the second bridge wiring layer 2004 when the second bridge wiring layer 2004 is a ground layer, an opening 2025 is also formed in the second bridge insulating layer 2005, and the shield layer 2006 is connected to the second bridge through the opening 2025.
  • the ground traces in the trace layer 2004 are electrically connected.
  • the shielding layer 2006 can play a double shielding role, preventing the wiring on the main sub-circuit board 100 from each wiring on the bridging sub-circuit board 200 Signal crosstalk occurs on the line.
  • the shielding layer 2006 is formed with a hollow structure 2016 at a position corresponding to the opening 2015 of the second bridging insulating layer 2005, thereby exposing the bridging end.
  • the shielding layer 2006 includes an insulating base and a conductive material filled in the insulating base.
  • the insulating base is made of epoxy resin, and the filled conductive material is copper powder, graphite powder, etc.; or in some embodiments, the shielding layer 2006 may also It is a metal material, which is not specifically limited in the embodiments of the present disclosure.
  • the shielding layer may be directly attached to the second side of the bridge sub-circuit board 200 after being formed.
  • Step S103 Mount the bridge sub-circuit board on the main sub-circuit board.
  • the third bridge end 201 and the fourth bridge end 202 of the bridge sub-circuit board 200 are electrically connected to the first bridge end 101 and the second bridge end 102 of the main sub-circuit board 100, so that the bridge sub-circuit board The 200 is mounted on the main body sub-circuit board 100, and the first wiring portion 103, the third wiring portion 203 and the second wiring portion 104 are electrically connected in sequence to obtain the first functional wiring.
  • the second side of the bridge sub-circuit board 200 is closer to the main sub-circuit board 100 than the first side, so that the wiring on the main sub-circuit board 100 and the wiring on the bridge sub-circuit board 200 can pass through the ground layer 2004 and the shielding layer 2006 are shielded to prevent signal crosstalk.
  • the third bridge end 201 and the fourth bridge end 202 of the bridge sub-circuit board 200 can be connected to the first bridge end 101 and the second bridge end 101 and the second bridge end of the main body sub-circuit board 100 respectively by hot pressing, soldering, or by connectors.
  • Two bridging end 102 For example, in a hot pressing method, an anisotropic conductive glue is formed between two bridge terminals, and then the bridge terminals are subjected to a hot pressing operation to connect the two bridge terminals together with the anisotropic conductive glue.
  • the connector includes a Zero Insertion Force (ZIF) connector or a Board to Board (BTB) connector, etc.
  • ZIF Zero Insertion Force
  • BTB Board to Board
  • a board-to-board type connector is used to connect the main body sub-circuit board 100 and the bridge sub-circuit board 200.
  • the connector includes a male connector and a female connector that cooperate with each other.
  • the first bridge end 101 and the second bridge end 102 of the main sub-circuit board 100 are provided with female connectors
  • the third bridge end 201 and the fourth bridge end 202 of the bridge sub-circuit board 200 are provided with male connectors, so that the The mating of the connector and the female connector connects the bridge daughter circuit board 200 to the main body daughter circuit board 100.
  • the manufacturing method of the flexible circuit board of the embodiment of the present disclosure provides a main body sub-circuit board and a bridge sub-circuit board, and bridges the traces located on both sides of the main sub-circuit board through the bridge sub-circuit board.
  • This method can avoid the wiring in the main body.
  • the sub-circuit boards are crossed to prevent or reduce signal crosstalk, or to avoid adding additional functional layers to prevent signal crosstalk, thereby avoiding the complexity of the circuit board structure; in addition, the main sub-circuit board and bridge sub-circuit board provided by the manufacturing method It has a simple single-layer or double-layer structure, so the wiring layout is simpler, which can reduce the difficulty of making the main sub-circuit board and the bridge sub-circuit board.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

La présente invention concerne une carte de circuit imprimé souple, un procédé de fabrication, un module de dispositif électronique et un dispositif électronique. La carte de circuit imprimé souple (10) comprend une carte de sous-circuit principale (100) et une carte de sous-circuit de pontage (200). La carte de sous-circuit principale (100) comprend un premier substrat (1001), et une première extrémité de pontage (101), une seconde extrémité de pontage (102), une première partie de trace (103), et une seconde partie de trace (104) disposées sur le premier substrat (1001). La première partie de trace (103) et la seconde partie de trace (104) sont espacées, et sont électriquement connectées à la première extrémité de pontage (101) et à la seconde extrémité de pontage, respectivement. La carte de sous-circuit de pontage (200) comprend un second substrat (2001), et une troisième extrémité de pontage (201), une quatrième extrémité de pontage (202), et une troisième partie de trace (203) disposées sur le second substrat (2001), la troisième partie de trace est utilisée pour des premières traces fonctionnelles, et la troisième extrémité de pontage (201) et la quatrième extrémité de pontage (202) sont connectées électriquement par l'intermédiaire de la troisième partie de trace (203). Le premier substrat (1001) et le second substrat (2001) ne sont pas en contact direct. La carte de sous-circuit de pontage (200) est configurée pour être connectée électriquement à la première extrémité de pontage (101) et à la seconde extrémité de pontage (102) respectivement par l'intermédiaire de la troisième extrémité de pontage (201) et de la quatrième extrémité de pontage (202), et est ainsi installée sur la carte de sous-circuit principale (100). La carte de circuit imprimé souple (10) a une configuration de trace simple, et est facile à fabriquer.
PCT/CN2020/073940 2019-01-30 2020-01-23 Carte de circuit imprimé souple, procédé de fabrication, module de dispositif électronique, et dispositif électronique WO2020156475A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP20748627.5A EP3920672A4 (fr) 2019-01-30 2020-01-23 Carte de circuit imprimé souple, procédé de fabrication, module de dispositif électronique, et dispositif électronique
US16/958,937 US11419212B2 (en) 2019-01-30 2020-01-23 Flexible printed circuit and manufacturing method thereof, electronic device module and electronic device
JP2020561738A JP2022519960A (ja) 2019-01-30 2020-01-23 フレキシブル回路基板及び製造方法、電子装置モジュール及び電子装置
US17/864,731 US11589461B2 (en) 2019-01-30 2022-07-14 Flexible printed circuit and manufacturing method thereof, electronic device module and electronic device
US18/094,683 US11765828B2 (en) 2019-01-30 2023-01-09 Flexible printed circuit and manufacturing method thereof, electronic device module and electronic device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201910093341 2019-01-30
CN201910093341.0 2019-01-30
CN202010075431.X 2020-01-22
CN202010075431.XA CN111511109B (zh) 2019-01-30 2020-01-22 柔性电路板及制作方法、电子装置模组及电子装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US16/958,937 A-371-Of-International US11419212B2 (en) 2019-01-30 2020-01-23 Flexible printed circuit and manufacturing method thereof, electronic device module and electronic device
US17/864,731 Division US11589461B2 (en) 2019-01-30 2022-07-14 Flexible printed circuit and manufacturing method thereof, electronic device module and electronic device

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CN102026480A (zh) * 2009-09-18 2011-04-20 揖斐电株式会社 刚挠性电路板及其制造方法
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CN114020166B (zh) * 2021-10-27 2023-07-14 云谷（固安）科技有限公司 一种触控显示装置

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