WO2022268140A1 - 一种三维布线的电路板结构 - Google Patents

一种三维布线的电路板结构 Download PDF

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Publication number
WO2022268140A1
WO2022268140A1 PCT/CN2022/100574 CN2022100574W WO2022268140A1 WO 2022268140 A1 WO2022268140 A1 WO 2022268140A1 CN 2022100574 W CN2022100574 W CN 2022100574W WO 2022268140 A1 WO2022268140 A1 WO 2022268140A1
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WIPO (PCT)
Prior art keywords
pin
groove
board
slot
sub
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PCT/CN2022/100574
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English (en)
French (fr)
Inventor
康铁泷
梁芝铭
Original Assignee
广州市康珑电子有限公司
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Priority claimed from CN202121433593.2U external-priority patent/CN216057630U/zh
Priority claimed from CN202110708272.7A external-priority patent/CN113423171A/zh
Application filed by 广州市康珑电子有限公司 filed Critical 广州市康珑电子有限公司
Publication of WO2022268140A1 publication Critical patent/WO2022268140A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits

Definitions

  • the invention relates to the technical field of circuit boards, in particular to a three-dimensional wiring circuit board structure.
  • the one-dimensional circuit board structure is to carry out relevant circuit design on only one circuit board; the two-dimensional circuit board structure is to provide a circuit base plate, and multiple functional module boards are vertically inserted on the circuit base plate.
  • the circuit board structure is limited to one-dimensional or two-dimensional, that is, it is only designed on one circuit board, or one bottom board/multiple function boards, and then the function boards are vertically inserted on the bottom board, and the electronic devices
  • the layout area and circuit routing density of the chip are limited by a certain degree of space.
  • IoT devices tend to be smaller, more complex, and more flexible.
  • the number of connection pins between the functional module board and the bottom board is relatively small, which affects the number of lead-out pins of the functional modules when the functional modules are limited.
  • the purpose of the present invention is to provide a three-dimensional wiring circuit board structure, which is used to solve the two-dimensional circuit board structure existing in the prior art.
  • the technical problem that affects the number of pins of the functional modules In the case of limited functional modules, the technical problem that affects the number of pins of the functional modules.
  • An embodiment of the present invention provides a circuit board structure for three-dimensional wiring.
  • the circuit board structure for three-dimensional wiring includes: a base plate with a first groove and a first pin; a function board on which It has a second pin and a third pin; a bridge board, the bridge board has a second groove and a fourth pin; wherein, the bottom of the function board is inserted into the second groove, and the first The second pin is connected to the fourth pin to form a combined function module; the combined function module is inserted into the first slot, and the third pin is connected to the first pin.
  • the number of the first slots and the number of the second slots are consistent with the number of the functional boards; the at least two functional boards are respectively inserted into The combined function modules are formed on the corresponding second slots; the combined function modules are respectively inserted into the corresponding first slots.
  • the second pin is located above the third pin; when the functional board is inserted into the second slot, the position of the second pin corresponds to the position of the fourth pin , and connected by welding.
  • the function board passes through the second slot, and the third pin is located below the second slot; when the combined function module is plugged into the When the first slot is used, the position of the third pin corresponds to that of the first pin and is connected by welding.
  • the bottom plate has at least one functional area, and each of the functional areas has the first groove and the first pin.
  • the bottom of the functional board has a first protrusion and a second protrusion, and there is a groove between the first protrusion and the second protrusion, and the first groove includes a first sub-groove and a The second sub-slot, there is a first connecting part between the first sub-slot and the second sub-slot; when the combined function module is plugged into the first slot, wherein the first protrusion The second protrusion is inserted into the first sub-groove, the second protrusion is inserted into the second sub-groove, and the first connecting part is located in the groove.
  • first pins include at least two, arranged around the first groove;
  • second pins include at least two, arranged laterally on the front and/or back of the functional board;
  • third pins arranged laterally on the front and/or back of the functional board;
  • fourth pins are arranged around the second groove.
  • the bottom of the functional board is inserted into the second groove, and the functional board and the bridging board are arranged vertically or obliquely.
  • the second groove includes a third sub-groove and a fourth sub-groove, and there is a second connecting portion between the third sub-groove and the fourth sub-groove; the first protrusion is passed through the On the third sub-groove, the second protrusion passes through the fourth sub-groove; the second connecting part is located in the groove.
  • the bottom of the functional board also has a third protrusion, the third protrusion is located between the first protrusion and the second protrusion; the bridging plate has a third groove, the first The third slot is located between the third sub-slot and the fourth sub-slot; in the combined function module, the third protrusion passes through the third slot, so that a plate is formed between the bridging plate and the bottom plate A distance between boards by which the third pin is flush with the first pin.
  • the third groove is configured as a through hole.
  • the third protrusion is used to separate the bridging board and the bottom board.
  • the bridging board is kept parallel to the bottom board.
  • An embodiment of the present invention provides a circuit board structure for three-dimensional wiring.
  • the circuit board structure for three-dimensional wiring includes: a base plate, the base plate has a first groove and a first pin; a function board, the function board It has a second pin and a third pin; a bridge board, the bridge board has a second groove and a fourth pin; wherein, the bottom of the function board is inserted into the second groove, and the first The second pin is connected to the fourth pin to form a combined function module; the combined function module is inserted into the first slot, and the third pin is connected to the first pin.
  • the combined function module is formed by the bridge board and the function board, and then the combined function module is arranged on the base plate, which not only improves the space utilization efficiency and increases the connection pins of the base plate to the function board, but also increases the circuit wiring space of the function board and Electronic device layout area; thereby effectively solving the existing two-dimensional circuit board structure in the prior art, the number of connection pins between the functional module board and the bottom plate is small, resulting in the limited functional modules. The technical problem of the number of pins of the functional module is solved.
  • FIG. 1 is a schematic structural diagram of a three-dimensional wiring circuit board structure provided by this embodiment
  • FIG. 2 is an exploded view of a three-dimensional wiring circuit board structure provided in this embodiment
  • FIG. 3 is a structural schematic diagram of a bottom plate of a three-dimensional wiring circuit board structure provided by this embodiment
  • FIG. 4 is a schematic structural diagram of a bridging board of a three-dimensional wiring circuit board structure provided by this embodiment
  • FIG. 5 is a schematic structural diagram of a functional board of a three-dimensional wiring circuit board structure provided by this embodiment
  • 100 bottom plate; 101, first sub-slot; 102, second sub-slot; 103, third slot; 114, first slot; 104, first pin; 200, function board; 201, second pin; 202 , the third pin; 203, the first protrusion; 204, the second protrusion; 205, the third protrusion; 300, the bridge plate; 301, the third sub-slot; 302, the fourth sub-slot; 303, the third Slot; 304, the fourth pin; 310, the second slot; 400, combined function module.
  • connection should be understood in a broad sense, for example, it can be a fixed connection or a Replaceable connection, or integral connection, can be mechanical connection or electrical connection, direct connection or indirect connection through an intermediary, or internal communication between two components.
  • connection should be understood in a broad sense, for example, it can be a fixed connection or a Replaceable connection, or integral connection, can be mechanical connection or electrical connection, direct connection or indirect connection through an intermediary, or internal communication between two components.
  • an embodiment of the present invention provides a three-dimensional wiring circuit board structure
  • the circuit board structure of the three-dimensional wiring includes:
  • a base plate 100, the base plate 100 has a first slot 114 and a first pin 104;
  • first pins 104 There are multiple first pins 104, and the first pins 104 are arranged around the first groove 114;
  • a functional board 200 the functional board 200 has a second pin 201 and a third pin 202;
  • second pins 201 There are a plurality of second pins 201, and the second pins 201 are arranged on the front and back of the functional board 200 in a horizontal arrangement;
  • second pins 201 There are a plurality of second pins 201, and the second pins 201 are arranged on the front and back of the functional board 200 in a horizontal arrangement;
  • a bridge board 300 the bridge board 300 has a second groove 310 and a fourth pin 304, that is, the fourth pin 304 and the second groove 310 together form the bridge board 300;
  • the bottom of the function board 200 is inserted into the second slot 310, and the second pin 201 is connected with the fourth pin 304 to form a combined function module 400; the second slot 310 is formed by the second slot 310.
  • the combined function module 400 is inserted into the first slot 114 , and the third pin 202 is connected to the first pin 104 .
  • the second pin 201 and the fourth pin 304 are connected together by welding, so that a combined functional module 400 is formed between the functional board 200 and the bridge board 300;
  • the bottom of the functional module is inserted into the first slot 114, and the bridging plate 300 is arranged in parallel with the bottom plate 100, which not only improves Improve space utilization efficiency and increase the connection pins of the base plate 100 to the function board 200, and increase the circuit wiring space and electronic device layout area of the function board 200; thereby effectively solving the two-dimensional circuit board existing in the prior art
  • the number of connecting pins between the functional module board and the base plate 100 is relatively small, which leads to a technical problem that affects the number of pins leading out of the functional modules when the functional modules are limited.
  • the number of the first slots 114 and the number of the second slots 310 are consistent with the number of the functional boards 200;
  • the at least two functional boards 200 are respectively inserted into the corresponding second slots 310 to form the combined functional module 400;
  • the combined function modules 400 are respectively inserted into the corresponding first slots 114 .
  • the combination function module 400 not only increases the number of pins, but also increases the layout and wiring space of the combination function module 400 .
  • the second pin 201 is located above the third pin 202;
  • the second pin 201 corresponds to the fourth pin 304 and is connected by welding.
  • the functional board 200 passes through the second slot 310 , and the third pin 202 is located below the second slot 310 ;
  • the third pin 202 corresponds to the position of the first pin 104 and is connected by welding.
  • each functional area has the first groove 114 and the first pin 104 .
  • the bottom of the functional board 200 has a first protrusion 203 and a second protrusion 204, the first protrusion There is a groove between the 203 and the second protrusion 204, the first groove 114 includes the first sub-groove 101 and the second sub-groove 102, the first sub-groove 101 and the second sub-groove 102 There is a first connecting portion between them. Referring to Fig.
  • this area is the first connecting part, through which the first sub-groove 101 and the second sub-groove 101 and the second sub-groove are connected.
  • Grooves 102 are located on the same functional plate area.
  • the first protrusion 203 is inserted into the first sub-slot 101, and the second protrusion 204 is inserted into the first slot 114.
  • the first connecting portion is located in the groove, that is, when two protrusions are inserted into each sub-groove, the position of the first connecting portion matches the position of the groove.
  • the functional board 200 and the bridging board 300 can be fixed structurally,
  • the positions of the second pin 201 and the fourth pin 304 are correspondingly connected by welding, thereby avoiding the problem of easy desoldering caused by fixing by pure welding.
  • first pin 104 includes at least two arranged around the first groove 114;
  • the second pins 201 include at least two, arranged laterally on the front and/or back of the functional board 200;
  • the third pins 202 include at least two, arranged laterally on the front and/or back of the functional board 200;
  • the fourth pins 304 include at least two arranged around the second groove 310 .
  • the arrangement of the first pin 104, the second pin 201, the third pin 202 and the fourth pin 304 is convenient for welding the first pin 104 and the third pin 202, and the second pin
  • the pin 201 is welded to the fourth pin 304 .
  • the bottom of the functional board 200 is inserted into the second slot 310 , and the functional board 200 and the bridging board 300 are arranged vertically or obliquely.
  • the functional board 200 and the bridging board 300 are relatively vertically welded, their solder legs can be doubled in the vertical direction and multiple times in the horizontal direction. While expanding by N times in the horizontal direction, the layout and wiring space of the combined function module 400 is also expanded by N times.
  • the number of solder pins of the functional board 200 to the bridge board 300/the layout and wiring space of the functional modules is no longer limited by the size of the functional modules, and the vertical space is fully utilized.
  • the second groove 310 includes a third sub-groove 301 and a fourth sub-groove 302, and there is a second connecting portion between the third sub-groove 301 and the fourth sub-groove 302;
  • the first protrusion 203 penetrates the third sub-groove 301
  • the second protrusion 204 penetrates the fourth sub-groove 302 ;
  • the second connecting portion is located in the groove.
  • the bottom of the functional board 200 in the combined function module 400 can be inserted into the bottom plate 100 for physical fixation, so that the second lead The pin 201 and the fourth pin 304 are soldered, thereby avoiding the problem of easy desoldering caused by fixing by pure soldering.
  • the bottom of the function board 200 also has a third protrusion 205, and the third protrusion 205 is located between the first protrusion 203 and the second protrusion 204, that is, between the first protrusion 203 and the second protrusion 204. In the groove between the second protrusions 204;
  • the bridging plate 300 has a third slot 303 located between the third sub-slot 301 and the fourth sub-slot 302 ; the third slot is configured as a through hole.
  • the third protrusion 205 passes through the third groove 303, for example, the third protrusion 205 passes through the through hole;
  • the third protrusion is used to set a certain plate interval, and is used to separate the bridging plate and the bottom plate;
  • the third protrusion passes through the third groove 303, and acts on the base plate to set up the combined function module, so that there is a certain distance between the bridge plate and the base plate; this distance can make the third pin 202 and the first pin 202
  • One pin 104 is flush, which is convenient for soldering.
  • the third groove can be set as a through hole through the bottom plate for positioning, after the third protrusion passes through the through hole, the bottom of the third protrusion acts on the bottom plate, thereby making the combined function
  • the module is positioned on the bottom plate; when the combined function module is positioned on the bottom plate, the bridging board and the bottom plate are parallel to each other and have a fixed distance between the boards, and the distance between the boards makes the third pin flush with the first pin, so that Enables fast and efficient welding.
  • the cross-sectional shape of the through hole may be circular, elliptical, etc.
  • the first protrusion 203, the second protrusion 204, and the third protrusion 205 respectively correspond to the first sub-groove 101, the second sub-groove 102, the third sub-groove 301, the fourth sub-groove 302, and the third groove 303,
  • the functional board 200 can be effectively fixed on the bridging board 300 and the bottom board 100 , and the soldering between pins can be effectively avoided.

Abstract

本发明的实施例提供的一种三维布线的电路板结构，所述三维布线的电路板结构包括：底板，所述底板上具有第一槽和第一引脚；功能板，所述功能板上具有第二引脚和第三引脚；桥接板，所述桥接板上具有第二槽和第四引脚；其中，所述功能板的底部插于所述第二槽上，且所述第二引脚与所述第四引脚连接，以形成组合功能模块；所述组合功能模块插于所述第一槽上，且所述第三引脚与所述第一引脚连接。通过桥接板与功能板形成组合功能模块，再将该组合功能模块设置在底板上，不仅提高了空间利用效率以及增加了底板对功能板的连接脚位，而且增加了功能板的电路布线空间以及电子器件布局面积。

Description

一种三维布线的电路板结构 技术领域
本发明涉及电路板的技术领域，特别是涉及一种三维布线的电路板结构。
背景技术
一维电路板结构为仅仅在一张电路板上进行相关电路设计；二维电路板结构为提供一张电路底板，在该电路底板上又垂直插接了多个功能模块板。
目前，在市场上，电路板结构局限于一维或者二维，即为仅在一张电路板上设计，或者一张底板/多张功能板，然后功能板垂直插接在底板上，电子器件的布局面积和电路走线密度都受到一定程度的空间限制。特别的，在物联网兴起的时代，物联网在各个领域蓬勃发展，万物互联的时代渐行渐近。物联网设备越趋于小型化、复杂化、灵活化。
但本申请发明人在实施现有技术的过程中，发现现有技术中至少存在如下技术问题：
现有技术中存在着二维电路板结构中，其功能模块板对底板之间连接脚位数量较少，导致在功能模块受限的情况下，影响了功能模块引出脚位的数量。
发明内容
为了解决上述问题，本发明的目的是提供一种三维布线的电路板结构，用于解决现有技术中存在着的二维电路板结构中，其功能模块板对底板之间连接脚位数量较少，导致在功能模块受限的情况下，影响了功能模 块引出脚位的数量的技术问题。
为解决上述技术问题，本发明的实施例采用了如下技术方案：
本发明的实施例提供了一种三维布线的电路板结构，所述三维布线的电路板结构包括：底板，所述底板上具有第一槽和第一引脚；功能板，所述功能板上具有第二引脚和第三引脚；桥接板，所述桥接板上具有第二槽和第四引脚；其中，所述功能板的底部插于所述第二槽上，且所述第二引脚与所述第四引脚连接，以形成组合功能模块；所述组合功能模块插于所述第一槽上，且所述第三引脚与所述第一引脚连接。
进一步地，所述功能板为至少两个；所述第一槽的个数、所述第二槽的个数与所述功能板的个数相一致；所述至少两个功能板分别插于对应的所述第二槽上，形成所述组合功能模块；所述组合功能模块分别插于对应的所述第一槽上。
进一步地，所述第二引脚位于所述第三引脚的上方；所述功能板插入于所述第二槽内时，所述第二引脚与所述第四引脚的位置相对应，且通过焊接连接。
进一步地，所述组合功能模块中，所述功能板穿过所述第二槽内，且所述第三引脚位于所述第二槽的下方；当所述组合功能模块插接于所述第一槽时，所述第三引脚与所述第一引脚的位置相对应，且通过焊接连接。进一步地，所述底板上具有至少一个功能区，每个所述功能区均有所述第一槽和所述第一引脚。
进一步地，所述功能板的底部具有第一凸起和第二凸起，所述第一凸起和所述第二凸起之间具有凹槽，所述第一槽包括第一分槽和第二分槽，所述第一分槽和所述第二分槽之间具有第一连接部；当所述组合功能模块插接于所述第一槽时，其中，所述第一凸起插入于所述第一分槽内，所述第二凸起插入于所述第二分槽内，所述第一连接部位于所述凹槽内。
进一步地，所述第一引脚包括至少两个，环绕于所述第一槽排列；所述第二引脚包括至少两个，横向排列于所述功能板上正面和/或背面；所述第三引脚包括至少两个，横向排列于所述功能板的正面和/或背面上；所述第四引脚包括至少两个，环绕于所述第二槽排列。
进一步地，所述功能板的底部插于所述第二槽上，且所述功能板与所述桥接板之间呈垂直或倾斜设置。
进一步地，所述第二槽包括第三分槽和第四分槽，所述第三分槽和所述第四分槽之间具有第二连接部；所述第一凸起穿设于所述第三分槽上，所述第二凸起穿设于所述第四分槽上；所述第二连接部位于所述凹槽内。
进一步地，所述功能板的底部还具有第三凸起，所述第三凸起位于所述第一凸起和第二凸起之间；所述桥接板上具有第三槽，所述第三槽位于所述第三分槽和所述第四分槽之间；所述组合功能模块中，所述第三凸起穿过所述第三槽，以使桥接板与底板之间构成板间距离，通过所述板间距离使第三引脚和第一引脚齐平。
进一步地，所述第三槽被设置为通孔。
进一步地，所述第三凸起用于隔开桥接板和底板。
进一步地，所述组合功能模块插于所述第一槽上后，所述桥接板与所述底板之间保持平行。
相比于现有技术，本发明的实施例的有益效果在于：
本发明的实施例提供的一种三维布线的电路板结构，所述三维布线的电路板结构包括：底板，所述底板上具有第一槽和第一引脚；功能板，所述功能板上具有第二引脚和第三引脚；桥接板，所述桥接板上具有第二槽和第四引脚；其中，所述功能板的底部插于所述第二槽上，且所述第二引 脚与所述第四引脚连接，以形成组合功能模块；所述组合功能模块插于所述第一槽上，且所述第三引脚与所述第一引脚连接。通过桥接板与功能板形成组合功能模块，再将该组合功能模块设置在底板上，不仅提高了空间利用效率以及增加了底板对功能板的连接脚位，而且增加了功能板的电路布线空间以及电子器件布局面积；从而有效的解决了现有技术中存在着的二维电路板结构中，其功能模块板对底板之间连接脚位数量较少，导致在功能模块受限的情况下，影响了功能模块引出脚位的数量的技术问题。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单的介绍，显而易见地，下面描述中的附图仅仅是本申请的实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据提供的附图获得其他的附图。
图1是本实施例提供的一种三维布线的电路板结构的结构示意图；
图2是本实施例提供的一种三维布线的电路板结构的爆炸图；
图3是本实施例提供的一种三维布线的电路板结构的底板的结构示意图；
图4是本实施例提供的一种三维布线的电路板结构的桥接板的结构示意图；
图5是本实施例提供的一种三维布线的电路板结构的功能板的结构示意图；
其中：
100、底板；101、第一分槽；102、第二分槽；103、第三槽；114、第一槽；104、第一引脚；200、功能板；201、第二引脚；202、第三引脚；203、第一凸起；204、第二凸起；205、第三凸起；300、桥接板；301、第三分槽；302、第四分槽；303、第三槽；304、第四引脚；310、第二槽；400、组合功能模块。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请实施例的描述中，需要说明的是，术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请实施例和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请实施例的限制。此外，术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性。
在本申请实施例的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可更换连接，或一体地连接，可以是机械连接，也可以 是电连接，可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请实施例中的具体含义。
下面结合附图和实施例，对本发明的具体实施方式作进一步详细描述。以下实施例用于说明本发明，但不用来限制本发明的范围。
如图1-5所示，本发明的实施例提供了一种三维布线的电路板结构，
所述三维布线的电路板结构包括：
底板100，所述底板100上具有第一槽114和第一引脚104；
所述第一引脚104为多个，所述第一引脚104环绕所述第一槽114设置；
功能板200，所述功能板200上具有第二引脚201和第三引脚202；
所述第二引脚201为多个，所述第二引脚201设置于所述功能板200的正面和背面，为横向排列设置；
所述第二引脚201为多个，所述第二引脚201设置于所述功能板200的正面和背面，为横向排列设置；
桥接板300，所述桥接板300上具有第二槽310和第四引脚304，也即第四引脚304和第二槽310共同组成了桥接板300；
所述第四引脚304为多个，环绕所述第二槽310设置；
其中，所述功能板200的底部插于所述第二槽310上，且所述第二引脚201与所述第四引脚304连接，以形成组合功能模块400；第二槽310由第三分槽301；第四分槽302；第三槽303组成；
所述组合功能模块400插于所述第一槽114上，且所述第三引脚202与所述第一引脚104连接。
所述第二引脚201与所述第四引脚304通过焊接的方式连接在一起，以使得所述功能板200与所述桥接板300之间形成组合功能模块400；
所述组合功能模块400插入所述第一槽114时，为所述功能模块的底部插入到所述第一槽114内，所述桥接板300与所述底板100之间为平行设置，不仅提高了空间利用效率以及增加了底板100对功能板200的连接脚位，而且增加了功能板200的电路布线空间以及电子器件布局面积；从而有效地解决了现有技术中存在着的二维电路板结构中，其功能模块板对底板100之间连接脚位数量较少，导致在功能模块受限的情况下，影响了功能模块引出脚位的数量的技术问题。
进一步地，所述功能板200为至少两个；
所述第一槽114的个数、所述第二槽310的个数与所述功能板200的个数相一致；
所述至少两个功能板200分别插于对应的所述第二槽310上，形成所述组合功能模块400；
所述组合功能模块400分别插于对应的所述第一槽114上。
其中，所述功能板200为至少两个，一个所述功能板200与一个第一槽114相对应，至少两个功能板200插入与所述桥接板300上的第二槽310中，从而使得所述组合功能模块400，增加了脚位数量的同时，也增加了组合功能模块400有的布局布线空间。
具体地，为了便于功能板200和所述桥接板300之间的连接，所述第二引脚201位于所述第三引脚202的上方；
所述功能板200插入于所述第二槽310内时，所述第二引脚201与所述第四引脚304的位置相对应，且通过焊接连接。
进一步地，为了便于功能板200与所述底板100进行焊接，所述组合功能模块400中，
所述功能板200穿过所述第二槽310内，且所述第三引脚202位于所述第二槽310的下方；
当所述组合功能模块400插接于所述第一槽114时，所述第三引脚202与所述第一引脚104的位置相对应，且通过焊接连接。
进一步地，为了提升底板100的扩展功能以及布线的效果，
所述底板100上具有至少一个功能区，每个所述功能区均有所述第一槽114和所述第一引脚104。
进一步地，为了便于所述功能板200插入于所述桥接板300和所述底板100上，所述功能板200的底部具有第一凸起203和第二凸起204，所述 第一凸起203和所述第二凸起204之间具有凹槽，所述第一槽114包括第一分槽101和第二分槽102，所述第一分槽101和所述第二分槽102之间具有第一连接部。参考图3，在第一分槽101和第二分槽102之间，存在未经开口处理的部分底板区域，该区域即第一连接部，通过该区域使第一分槽101和第二分槽102位于同一个功能板块区域上。
当所述组合功能模块400插接于所述第一槽114时，其中，所述第一凸起203插入于所述第一分槽101内，所述第二凸起204插入于所述第二分槽102内，所述第一连接部位于所述凹槽内，也即当两个凸起插入各个分槽内后，第一连接部的位置便与凹槽的位置匹配吻合。
通过第一凸起203和第二凸起204插入到对应的第一分槽101和第二分槽102内，能够通过结构上使得所述功能板200与所述桥接板300之间进行固定，再通过焊接的方式将所述第二引脚201与所述第四引脚304的位置相对应，且通过焊接连接，从而避免了通过纯焊接的方式固定造成的容易脱焊的问题。
进一步地，所述第一引脚104包括至少两个，环绕于所述第一槽114排列；
所述第二引脚201包括至少两个，横向排列于所述功能板200上正面和/或背面；
所述第三引脚202包括至少两个，横向排列于所述功能板200的正面和/或背面上；
所述第四引脚304包括至少两个，环绕于所述第二槽310排列。
所述第一引脚104、第二引脚201、第三引脚202和第四引脚304的设置方式便于第一引脚104与所述第三引脚202进行焊接，所述第二引脚201与所述第四引脚304进行焊接。
进一步地，所述功能板200的底部插于所述第二槽310上，且所述功能板200与所述桥接板300之间呈垂直或倾斜设置。
功能板200对桥接板300相对垂直焊接时，他们的焊脚可以在垂直方向上拓展一倍，在水平方向上可以拓展多倍。在水平方向拓展N倍的同时，组合功能模块400的布局布线空间也同时拓展了N倍。功能板200对桥接板300的焊脚数量/功能模块布局布线空间不再受限于功能模块的尺寸，同时充分利用了垂直空间。
进一步地，所述第二槽310包括第三分槽301和第四分槽302，所述第三分槽301和所述第四分槽302之间具有第二连接部；
所述第一凸起203穿设于所述第三分槽301上，所述第二凸起204穿设于所述第四分槽302上；
所述第二连接部位于所述凹槽内。
通过所述第三分槽301、第四分槽302和第二连接部，能够使得组合功能模块400中的所述功能板200的底部插入所述底板100内进行物理固定，以便在第二引脚201和第四引脚304进行焊接，从而避免了通过纯焊接的方式固定造成的容易脱焊的问题。
进一步地，所述功能板200的底部还具有第三凸起205，所述第三凸起205位于所述第一凸起203和第二凸起204之间,即位于第一凸起203和所述第二凸起204之间的凹槽内；
所述桥接板300上具有第三槽303，所述第三槽303位于所述第三分槽301和所述第四分槽302之间；所述第三槽被设置为通孔。
所述组合功能模块400中，所述第三凸起205穿过所述第三槽303，示例性地，第三凸起205穿过该贯通的通孔；
其中，所述第三凸起用于设置一定的板间隔，用于隔开桥接板与底板；
第三凸起穿过第三槽303，并作用在底板上，用于架起组合功能模块，使得桥接板与底板之间存在一定的板间距离；这个距离可以让第三引脚202与第一引脚104平齐，方便焊接。示例性地，第三槽可以被设置为用于定位的、贯通底板的通孔，第三凸起在穿过该通孔后，第三凸起的底部作用于底板上，进而可使得组合功能模块定位在底板上；当组合功能模块定位在底板上后，桥接板与底板之间相互平行并具有固定的板间距离，该板间距离令第三引脚与第一引脚平齐，从而能够实现快速有效的焊接。
进一步地，当第三槽被设置为通孔后，该通孔的横截面形状可以是圆形、椭圆形等。
通过第一凸起203、第二凸起204、第三凸起205分别对应第一分槽101、第二分槽102、以及第三分槽301、第四分槽302、第三槽303，能够有效地将所述功能板200固定在所述桥接板300和所述底板100上，在进行引 脚间的焊接，能够有效地避免虚焊脱焊的问题。
以上所述，以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。

Claims (13)

  1. 一种三维布线的电路板结构，其特征在于，所述三维布线的电路板结构包括：
    底板，所述底板上具有第一槽和第一引脚；
    功能板，所述功能板上具有第二引脚和第三引脚；
    桥接板，所述桥接板上具有第二槽和第四引脚；
    其中，所述功能板的底部插于所述第二槽上，且所述第二引脚与所述第四引脚连接，以形成组合功能模块；
    所述组合功能模块插于所述第一槽上，且所述第三引脚与所述第一引脚连接。
  2. 根据权利要求1所述的三维布线的电路板结构，其特征在于，所述功能板为至少两个；
    所述第一槽的个数、所述第二槽的个数与所述功能板的个数相一致；
    所述至少两个功能板分别插于对应的所述第二槽上，形成所述组合功能模块；
    所述组合功能模块分别插于对应的所述第一槽上。
  3. 根据权利要求1所述的三维布线的电路板结构，其特征在于，所述第二引脚位于所述第三引脚的上方；
    所述功能板插入于所述第二槽内时，所述第二引脚与所述第四引脚的位置相对应，且通过焊接连接。
  4. 根据权利要求3所述的三维布线的电路板结构，其特征在于，所述组合功能模块中，
    所述功能板穿过所述第二槽内，且所述第三引脚位于所述第二槽的下方；
    当所述组合功能模块插接于所述第一槽时，所述第三引脚与所述第一引脚的位置相对应，且通过焊接连接。
  5. 根据权利要求4所述的三维布线的电路板结构，其特征在于，所述底板上具有至少一个功能区，每个所述功能区均有所述第一槽和所述第一引脚。
  6. 根据权利要求4所述的三维布线的电路板结构，其特征在于，所述功能板的底部具有第一凸起和第二凸起，所述第一凸起和所述第二凸起之间具有凹槽，所述第一槽包括第一分槽和第二分槽，所述第一分槽和所述第二分槽之间具有第一连接部；
    当所述组合功能模块插接于所述第一槽时，其中，所述第一凸起插入于所述第一分槽内，所述第二凸起插入于所述第二分槽内，所述第一连接部位于所述凹槽内。
  7. 根据权利要求1所述的三维布线的电路板结构，其特征在于，所述第一引脚包括至少两个，环绕于所述第一槽排列；
    所述第二引脚包括至少两个，横向排列于所述功能板上正面和/或背面；
    所述第三引脚包括至少两个，横向排列于所述功能板的正面和/或背面上；
    所述第四引脚包括至少两个，环绕于所述第二槽排列。
  8. 根据权利要求7所述的三维布线的电路板结构，其特征在于，所述功能板的底部插于所述第二槽上，且所述功能板与所述桥接板之间呈垂直或倾斜设置。
  9. 根据权利要求6所述的三维布线的电路板结构，其特征在于，所述第二槽包括第三分槽和第四分槽，所述第三分槽和所述第四分槽之间具有第二连接部；
    所述第一凸起穿设于所述第三分槽上，所述第二凸起穿设于所述第四分槽上；
    所述第二连接部位于所述凹槽内。
  10. 根据权利要求9所述的三维布线的电路板结构，其特征在于，
    所述功能板的底部还具有第三凸起，所述第三凸起位于所述第一凸起和第二凸起之间；
    所述桥接板上具有第三槽，所述第三槽位于所述第三分槽和所述第四分槽之间；
    所述组合功能模块中，所述第三凸起穿过所述第三槽，以使桥接板与底板之间构成板间距离，通过所述板间距离使第三引脚和第一引脚齐平。
  11. 根据权利要求10所述的三维布线的电路板结构，其特征在于，
    所述第三槽被设置为通孔。
  12. 根据权利要求10所述的三维布线的电路板结构，其特征在于，所述第三凸起用于隔开桥接板和底板。
  13. 根据权利要求1所述的三维布线的电路板结构，其特征在于，所述组合功能模块插于所述第一槽上后，所述桥接板与所述底板之间保持平行。
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CN102890665A (zh) * 2011-07-22 2013-01-23 鸿富锦精密工业（深圳）有限公司 连接器组合及其附属卡
CN204994085U (zh) * 2015-08-07 2016-01-20 艾默生网络能源系统北美公司 一种pcb板互连结构及pcb板
CN109964543A (zh) * 2016-11-28 2019-07-02 三菱电机株式会社 立体型印刷布线板及其制造方法
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CN208540244U (zh) * 2018-06-28 2019-02-22 合肥恩光电子科技有限公司 一种便于更换元件的电路板
CN210016722U (zh) * 2019-05-28 2020-02-04 上海航嘉电子科技股份有限公司 压接治具
CN113423171A (zh) * 2021-06-24 2021-09-21 广州市康珑电子有限公司 一种三维布线的电路板结构
CN216057630U (zh) * 2021-06-24 2022-03-15 广州市康珑电子有限公司 一种三维布线的电路板结构

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