WO2017198174A1 - 机柜系统 - Google Patents

机柜系统 Download PDF

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Publication number
WO2017198174A1
WO2017198174A1 PCT/CN2017/084729 CN2017084729W WO2017198174A1 WO 2017198174 A1 WO2017198174 A1 WO 2017198174A1 CN 2017084729 W CN2017084729 W CN 2017084729W WO 2017198174 A1 WO2017198174 A1 WO 2017198174A1
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WO
WIPO (PCT)
Prior art keywords
backplane
interconnected
connector
disposed
function board
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Application number
PCT/CN2017/084729
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English (en)
French (fr)
Inventor
龙细军
杨雪
舒新建
余细红
Original Assignee
中兴通讯股份有限公司
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Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Publication of WO2017198174A1 publication Critical patent/WO2017198174A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant

Definitions

  • the present invention relates to the field of communications, and in particular to a cabinet system.
  • the architecture based on the server product is the development trend of large-capacity centralized processing cabinets in the future, and the heat dissipation method of the server architecture is to suck the wind through the tail fan, so that the wind enters from the front panel and the wind is taken out.
  • the heat of the functional module flows out from the tail, that is, the front and rear air ducts dissipate heat.
  • the cabinet is a centralized placement of each functional module, and the expansion of the processing capability only needs to be configured with a corresponding number of functional modules. Therefore, there is a need for system interconnection among the functional modules.
  • the printed circuit board is still used in the industry ( The Printed Circuit Board (referred to as the PCB) backplane implements the system interconnection of each functional module, and few of them are interconnected by cables. The former has high reliability and low cost.
  • FIG. 1 is a schematic diagram of a conventional backplane system interconnection topology in the related art
  • FIG. 2 is a schematic diagram of a conventional interconnection system assembly and an air duct in the related art.
  • FIG. 3 is a schematic diagram of the front and rear air duct cooling schemes based on the backplane interconnection in the related art
  • the opening ratio of the backplane directly affects the heat dissipation capability of the system, but the opening of the backplane is limited by the electrical interconnection between the functional modules, and cannot be unrestrictedly opened at the same time;
  • the heat dissipation of the heat-generating device on the module is also limited by the opening of the backplane, so the layout of the functional module heating device and the opening of the backplane There are also strong correlations in the pores.
  • the embodiment of the invention provides a cabinet system to solve at least the problem that the heat dissipation opening of the cabinet system in the related art is limited by the electrical interconnection between the functional modules, resulting in low heat dissipation efficiency.
  • a cabinet system includes: a backplane device composed of N sub-backplanes, a function board, and a fan; wherein the sub-backplane includes: An interconnecting backplane and a second interconnecting backplane; each of the two interconnected backplanes is disposed with one of the second interconnected backplanes; the functional boards are horizontally disposed on the first interconnected backplane and the second Interconnecting the backplanes and horizontally orthogonally connecting the first interconnected backplane and the second interconnected backplane respectively; the fan is disposed on the first interconnected backplane and the second interconnected backplane Forming a wind tunnel on a plane perpendicular to a plane in which the first interconnected backplane and the second interconnected backplane are located; the N is an integer greater than or equal to 3.
  • one of the second interconnected backplanes is equally spaced between each of the two first interconnected backplanes.
  • the system further includes a connector; wherein the connector includes: a first connector disposed on the same side of the first interconnecting backplane and on the same side of the second interconnected backplane; a second connector on both sides of the second interconnecting backplane; a third connector disposed on the function board and orthogonally connected to the first connector; disposed on the function board and the second a fourth connector that is orthogonally connected to the connector; the third connector is electrically connected to the fourth connector.
  • the connector includes: a first connector disposed on the same side of the first interconnecting backplane and on the same side of the second interconnected backplane; a second connector on both sides of the second interconnecting backplane; a third connector disposed on the function board and orthogonally connected to the first connector; disposed on the function board and the second a fourth connector that is orthogonally connected to the connector; the third connector is electrically connected to the fourth connector.
  • the third connector and the fourth connector are disposed on the same side of the function board.
  • the third connector and the fourth connector are respectively disposed on opposite sides of the function board.
  • the first connector and the second connector are multiple, wherein any one of the plurality of the first connectors respectively and other The first connector is electrically connected, and any one of the plurality of second connectors is respectively connected to the other second connector Turn on the connection.
  • one air duct is formed between each two of the functional boards by the fan.
  • the fan draws air behind the sub-backboard or blows at the front end of the panel of the function board.
  • the length of the function board is one or more preset lengths, wherein the preset length is a separation distance between the first interconnect backplane and the second interconnect backplane.
  • the function board is disposed on either side of the first interconnected backplane and the second interconnected backplane.
  • the function board is disposed on both sides of the first interconnected backplane and the second interconnected backplane.
  • the odd number of sub-backplanes form a full left-right and full-symmetric orthogonal interconnection, wherein a slot support for inserting the function board is The mixed insertion of the function boards.
  • a first interconnected backplane is further disposed between the first interconnect backplane and the second interconnected backplane.
  • the sub-backplane and each functional board are orthogonally connected, so that the system is a front and rear air duct, and the back board and each functional version do not block the air passage, so that the air cooling and heat dissipation efficiency is higher, thereby solving the problem.
  • the heat dissipation opening of the cabinet system is limited by the electrical interconnection between the functional modules, resulting in low heat dissipation efficiency.
  • FIG. 1 is a schematic diagram of an interconnection topology of a conventional backplane system in the related art
  • FIG. 2 is a schematic diagram of a conventional interconnection system assembly and air duct in the related art
  • FIG. 3 is a schematic diagram of a heat dissipation scheme of a front and rear air duct based on a backplane interconnection in the related art
  • FIG. 4a is a front elevational view of a cabinet system in accordance with an embodiment of the present invention.
  • FIG. 4b is a top plan view of a cabinet system in accordance with an embodiment of the present invention.
  • FIG. 5a-5b are schematic structural views of a cabinet system including a connector according to an embodiment of the present invention.
  • FIG. 6 is a schematic structural view 1 of a cabinet system including a backplane device according to an embodiment of the present invention
  • FIG. 7 is a first schematic diagram of a full cross topology of a backplane device according to an embodiment of the present invention.
  • Figure 8 is a schematic illustration of full width and half width of a backplane device in accordance with an embodiment of the present invention.
  • FIG. 9 is a schematic diagram of application of a functional board on both sides of a backplane device according to an embodiment of the present invention.
  • FIG. 10 is a schematic structural view 1 of a cabinet system including a backplane device according to an embodiment of the present invention
  • FIG. 11 is a second schematic diagram of a full cross topology of a backplane device according to an embodiment of the invention.
  • FIG. 4a is a front view of a cabinet system according to an embodiment of the present invention
  • FIG. 4b is a top view of a cabinet system according to an embodiment of the present invention.
  • the rack system 1 includes: N sub-backboards Backplane device 1-1, function board 1-2, and fan 1-3;
  • the sub-backplane includes: a first interconnected backplane 1-1-1 and a second interconnected backplane 1-1-2; and a second interconnected back may be disposed in each of the two first interconnected backplanes 1-1-1 Board 1-1-2;
  • the function board 1-2 is horizontally disposed between the first interconnected backplane 1-1-1 and the second interconnected backplane 1-1-2, and respectively connected to the first interconnected backplane 1-1-1 and the second interconnected back
  • the plates 1-1-2 are horizontally orthogonally connected;
  • the fan 1-3 is disposed between the first interconnecting backplane and the second interconnecting backplane to form a air duct, and is perpendicular to a plane perpendicular to a plane where the first interconnecting backplane and the second interconnecting backplane are located;
  • N is an integer greater than or equal to 3.
  • the number of -1 is 2, and the number of second interconnected backplanes 1-1-2 is 1.
  • a second interconnected backplane 1-1-2 is equally spaced between each of the two interconnected backplanes 1-1-1.
  • the function boards 1-2 involved in this embodiment may also be one or more, as shown in FIG. 4a and FIG. 4b.
  • the fans 1-3 are in each of the two function boards.
  • a duct is formed between 1-2, wherein the fan 1-3 sucks air behind the sub-backboard or blows at the front end of the panel of the function board.
  • the length of the function board 1-2 is one or more preset lengths, wherein the preset length is a separation distance between the first interconnect backplane and the second interconnect backplane.
  • the function board 1-2 is disposed on either side of the first interconnecting backplane 1-1-1 and the second interconnecting backplane 1-1-2, and may also be It is disposed on both sides of the first interconnected backplane 1-1-1 and the second interconnected backplane 1-1-2. As shown in FIG. 4b, the function board 1-2 is disposed on both sides of the first interconnect backplane 1-1-1 and the second interconnect 1-1-2 backplane, but it should be noted that, in this implementation In another embodiment of the example, the functional version may be disposed only on one side of the interconnect backplane, and the other side may be configured for the first interconnected backplane 1-1-1 and the second interconnected 1-1-2 backplane.
  • Interconnected interconnected backplanes and when there are a large number of signals to be interconnected between the three vertical backplanes, functional versions 1-3 horizontal interconnected backplanes can be added on the other side to achieve interconnection between the three backplanes, that is, In the manner shown in Fig. 4b, it can be seen that this mode is not necessary, because in the case where the size of the interconnection signal is controllable, the interconnection between the three vertical backplanes is realized by a function version provided only on one side.
  • the odd-numbered sub-backplanes form a full left-right and full-symmetric orthogonal interconnection, wherein the function board is inserted
  • the slots support the intermixing of the function boards.
  • a first interconnect backplane may be further disposed between the first interconnect backplane and the second interconnect backplane, thereby further expanding the vertical interconnect capability of each functional module of the system.
  • N 1 or 2
  • the sub-backplane in this embodiment has only the first interconnected backplane, and at this time, the adaptation of the full-width module is supported, which is a minimal system interconnection.
  • the sub-backplane and the respective function boards are orthogonally connected, so that the system is a front and rear air duct, and the back board and each function version do not block the air passage, so that the air cooling heat dissipation efficiency is higher. Therefore, the problem that the heat dissipation opening of the cabinet system in the related art is limited by the electrical interconnection between the functional modules leads to low heat dissipation efficiency.
  • the cabinet system 1 involved in the embodiment further includes a connector 1-4, as shown in FIG. 5a and FIG. 5b, and FIGS. 5a-5b are schematic structural views of a cabinet system including a connector according to an embodiment of the present invention
  • the connector 1-4 includes: a first connector 1-4-1 disposed on the first interconnecting backplane and on the same side of the second interconnecting backplane; and a second connector disposed on opposite sides of the second interconnecting backplane 1-4-2; a third connector 1-3-4 disposed on the function board and orthogonally connected to the first connector 1-4-1; disposed on the function board and connected to the second connector 1-4 -2 orthogonally connected fourth connector 1-4-4; the third connector 1-4-3 is electrically connected to the fourth connector 1-4-4.
  • third connector 1-3-4 and the fourth connector 1-1-4 involved in this embodiment may be disposed on the same side of the function board.
  • the third connector 1-4-3 and the fourth connector 1-4-4 are respectively disposed on opposite sides of the function board.
  • the first connector 1-4-1 and the second connector 1-4- There are two, wherein any one of the plurality of first connectors 1-4-1 is electrically connected to the other first connectors, and any one of the plurality of second connectors 1-4-2 The connectors are electrically connected to the other second connectors, respectively.
  • FIG. 6 is a schematic structural diagram 1 of a cabinet system including a backplane device according to an embodiment of the present invention.
  • the cabinet system includes: a backplane device, wherein the backplane device includes three sub-backplanes: an upper and lower interconnected backplane 1 (corresponding to the first interconnected backplane in the above embodiment), and an upper and lower interconnected backplane 2 (corresponding to the above The first interconnected backplane in the embodiment, the horizontal interconnected backplane (corresponding to the second interconnected backplane in the above embodiment), the three sub-backplanes are parallel to each other.
  • the cabinet system also includes functional modules and fans.
  • the connector 1 is connected to the same side of the upper and lower interconnected backplane 1 and the horizontal interconnected backplane
  • the connector 2 is connected to the same side of the upper and lower interconnected backplane 2 and the horizontal interconnected backplane, and the connector 1 and the connection on the horizontal interconnected backplane are connected.
  • the device 2 is located on both sides of the horizontal interconnect backplane.
  • the upper side of the functional module is connected with a connector 3 which can be orthogonally connected to the connector 1
  • the lower side of the functional module is connected with a connector 4 which can be orthogonally connected to the connector 2.
  • each function board is orthogonally connected to the sub-back board.
  • the fan is located at the interval between the sub-backplanes, and the front and rear air outlets are located on the air duct, which does not block the air duct, so that the air cooling efficiency is maximized.
  • the backplane device is a full-pair Mesh structure, which can realize the shortest path connection between the functional boards, and can realize the full cross-connection of all the function boards.
  • FIG. 7 is a schematic diagram of a full cross-topology structure of a backplane device according to an embodiment of the present invention; wherein slot 1 is taken as an example, and connector 1 of the backplane 1 is interconnected by upper and lower interfaces, and slot 1 is The inserted function board can realize the connection with the function board of each slot in the vertical position, and the link distance is the shortest.
  • the function board inserted in the slot 1 can realize the connection with the function boards of the slots in the horizontal position, and the link distance is the shortest.
  • the function boards in any slot can achieve full mesh connection with other slot function boards, and the connection link is the shortest. This reduces link loss and improves signal quality, which is especially important for high speed signals.
  • PCB traces can reduce the number of trace layers and reduce the area of the board. The cost savings.
  • the backplane device can be inserted not only into a half-width function board but also a full-width function board.
  • the full-width function board can be connected to the left slot function board through the connector 1 of the upper and lower interconnection backplane 1, and can be realized by the connector 2 of the upper and lower interconnection backplane 2 and the right slot.
  • the connection of the function board can also realize the full mesh connection with other slot function boards, and the connection link is the shortest. That is, the backplane device can support a half-width function board, or can support a full-width function board, or a mixed use of a half-width function board and a full-width function board, and the application is very flexible.
  • FIG. 9 is a schematic diagram of an application of a function board on both sides of a backplane device according to an embodiment of the present invention. As shown in FIG. 9, the application mode of the function board is provided on both sides of the backplane device.
  • FIG. 10 is a schematic structural view of a cabinet system including a backplane device according to an embodiment of the present invention
  • FIG. 11 is a schematic diagram of the present invention.
  • the schematic diagram of the full cross topology of the backplane device of the embodiment is as shown in FIG. 10 and FIG. 11, similar to the scheme described in FIG. 6 and FIG. 7 described above.
  • each function board can realize the shortest link connection and full mesh connection through the backplane device, so that the PCB traces between the connectors of the backplane are the shortest, and the number of backplane layers can be better controlled. And the area is convenient for the production and processing of the backboard, which greatly saves the cost.
  • the structure of the backboard device does not block the air passages of the front and rear air outlets, so that the heat dissipation efficiency of the system is greatly improved, which is helpful for the use and upgrade of the system.
  • the solution of the embodiment is applicable to the use of the airway heat dissipation system based on the backplane interconnection of the communication and electronic equipment, and compared with the backplane interconnection technology in the related art, and has the following effects:
  • the backplane interconnection device comprises three sub-backplanes, and the sub-backplanes and the respective function boards are connected by orthogonal connectors;
  • the backplane interconnection device is a full Mesh structure, which can realize full cross connection of each function board.
  • the shortest link connection between the function boards can be realized;
  • the backplane interconnection device makes the system a front and rear air duct, and the back panel and each function version do not obstruct the wind.
  • the road makes the air cooling more efficient.
  • the sub-backplane and each functional board are orthogonally connected, so that the system is a front and rear air duct, and the back board and each functional version do not block the air passage, so that the air cooling and heat dissipation efficiency is higher, thereby solving the problem.
  • the heat dissipation opening of the cabinet system is limited by the electrical interconnection between the functional modules, resulting in low heat dissipation efficiency.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

本发明提供了一种机柜系统，该机柜系统包括：由N个子背板组成的背板装置、功能板、以及风扇；其中，子背板包括：第一互联背板和第二互联背板；每两个第一互联背板中设置一个第二互联背板；功能板水平设置在第一互联背板与第二互联背板之间，并分别与第一互联背板和第二互联背板水平正交连接；风扇设置在第一互联背板与第二互联背板之间以形成风道，且与第一互联背板与第二互联背板所在平面垂直的平面上；N为大于或等于3的整数。通过本发明，解决了相关技术中机柜系统散热开孔受限于功能模块之间的电气互联导致散热效率低的问题。

Description

机柜系统 技术领域
本发明涉及通讯领域，具体而言，涉及一种机柜系统。
背景技术
在通讯及电子领域的设备中，基于服务器产品的架构是未来大容量集中式处理机柜的发展趋势，而服务器架构的散热方式是采用通过尾部风扇吸风，从而使得风从前面板进，风带出功能模块的热后从尾部流出，即：前后风道散热。另外机柜是实现各功能模块的集中式放置，其处理能力的扩容只需要配置相应数量的功能模块即可，因此各功能模块间就存在系统互联的需求，目前行业内还是以印制电路板(Printed Circuit Board，简称为PCB)背板来实现各功能模块的系统互联，极少数通过线缆互联，前者可靠性高成本低。
当前行业内用于机框或者机柜系统互联均采用传统背板，即：都是一整块PCB背板，背板平面与功能模块平面垂直，各功能模块间的互联信号都通过背板承载，如图1和图2所示，图1是相关技术中传统背板系统互联拓扑示意图，图2是相关技术中传统互联系统装配及风道的示意图。从图2中可以看出，传统背板互联系统的散热适合于左右风道，并不适用于类似服务器架构的前后风道散热，如果要实现前后风道散热，目前行业内的做法是将背板开孔，风机在背板后进行吸风散热，如图3所示，图3是相关技术中基于背板互联的前后风道散热方案示意图；
从图3中可以看出，当前业内基于背板互联的前后风道散热方案中，风机是在背板后，需要在背板上开很多散热孔，以便使从功能模块面板通风孔进来的风穿过背板通风孔，将热量带出来。这种方式弊端是非常明显的，背板的开孔率直接影响到系统的散热能力，但背板的开孔受限于功能模块之间的电气互联，不能无限制的随意开孔；同时功能模块上的发热器件的散热也受背板开孔的限制，因此功能模块发热器件的布局与背板的开 孔也存在强相关的耦合关系。
针对相关技术中的上述问题，目前尚未存在有效的解决方案。
发明内容
本发明实施例提供了一种机柜系统，以至少解决相关技术中机柜系统散热开孔受限于功能模块之间的电气互联导致散热效率低的问题。
根据本发明实施例的一个方面，提供了一种机柜系统，所述机柜系统包括：由N个子背板组成的背板装置、功能板、以及风扇；其中，所述子背板包括：第一互联背板和第二互联背板；每两个所述第一互联背板中间设置一个所述第二互联背板；所述功能板水平设置在所述第一互联背板与所述第二互联背板之间，并分别与所述第一互联背板和所述第二互联背板水平正交连接；所述风扇设置在所述第一互联背板与所述第二互联背板之间以形成风道，且与所述第一互联背板与所述第二互联背板所在平面垂直的平面上；所述N为大于或等于3的整数。
可选地，每两个所述第一互联背板之间等间隔设置一个所述第二互联背板。
可选地，所述系统还包括连接器；其中，所述连接器包括：设置在所述第一互联背板且与所述第二互联背板同侧的第一连接器；设置在所述第二互联背板两侧的第二连接器；设置在所述功能板上且与所述第一连接器正交连接的第三连接器；设置在所述功能板上且与所述第二连接器正交连接的第四连接器；所述第三连接器与所述第四连接器导通。
可选地，所述第三连接器和所述第四连接器设置所述功能板的同一侧。
可选地，所述第三连接器和所述第四连接器分别设置在所述功能板异侧。
可选地，在所述功能板有多个时，所述第一连接器和所述第二连接器有多个，其中，多个所述第一连接器中的任一连接器分别与其他第一连接器导通连接，多个所述第二连接器中的任一连接器分别与其他第二连接器 导通连接。
可选地，在所述功能板有多个时，在所述功能板有多个时，通过所述风扇在每两个所述功能板之间形成一个风道。
可选地，所述风扇在所述子背板后面进行吸风，或在所述功能板的面板前端进行吹风。
可选地，所述功能板的长度为一个或多个预设长度，其中，所述预设长度为所述第一互联背板与所述第二互联背板之间的间隔距离。
可选地，所述功能板设置在所述第一互联背板与所述第二互联背板的任一一侧。
可选地，所述功能板设置在所述第一互联背板与所述第二互联背板的两侧。
可选地，当互联的所述子背板的数量N为奇数时，该奇数数量的子背板形成全左右全对称的正交互联，其中，用于插入所述功能板的槽位支持所述功能板的混插。
可选地，在所述第一互联背板和所述第二互联背板之间再设置一个第一互联背板。
通过本发明实施例，子背板与各个功能板之间通过正交连接，使得系统为前后风道，背板和各功能版都不遮挡风道，使风冷散热效率更高，从而解决了相关技术中机柜系统散热开孔受限于功能模块之间的电气互联导致散热效率低的问题。
附图说明
此处所说明的附图用来提供对本发明的进一步理解，构成本申请的一部分，本发明的示意性实施例及其说明用于解释本发明，并不构成对本发明的不当限定。在附图中：
图1是相关技术中传统背板系统互联拓扑示意图；
图2是相关技术中传统互联系统装配及风道的示意图；
图3是相关技术中基于背板互联的前后风道散热方案示意图；
图4a是根据本发明实施例的机柜系统的正面示意图；
图4b是根据本发明实施例的机柜系统的俯视图；
图5a～5b是根据本发明实施例的包括连接器的机柜系统的结构示意图；
图6是根据本发明实施例的包括背板装置的机柜系统的结构示意图一；
图7是根据本发明实施例的背板装置的全交叉拓扑结构示意图一；
图8是根据本发明实施例的背板装置的全宽、半宽的示意图；
图9是根据本发明实施例的背板装置的两侧都有功能板的应用示意图；
图10是根据本发明实施例的包括背板装置的机柜系统的结构示意图一；
图11是根据本发明实施例的背板装置的全交叉拓扑结构示意图二。
具体实施方式
下文中将参考附图并结合实施例来详细说明本发明。需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。
需要说明的是，本发明的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。
实施例1
图4a是根据本发明实施例的机柜系统的正面示意图，图4b是根据本发明实施例的机柜系统的俯视图，如图4a和图4b所示，该机柜系统1包括：由N个子背板组成的背板装置1-1、功能板1-2、以及风扇1-3；
其中，子背板包括：第一互联背板1-1-1和第二互联背板1-1-2；每两个第一互联背板1-1-1中可以设置一个第二互联背板1-1-2；
功能板1-2水平设置在第一互联背板1-1-1与第二互联背板1-1-2之间，并分别与第一互联背板1-1-1和第二互联背板1-1-2水平正交连接；
风扇1-3设置在第一互联背板与第二互联背板之间以形成风道，且与第一互联背板与第二互联背板所在平面垂直的平面上；
N为大于或等于3的整数。
需要说明的是，在图4a和图4b中是以N＝3为例进行说明的，也就是说在图4a和图4b中子背板的数量为3，即第一互联背板1-1-1的数量为2，第二互联背板1-1-2的数量为1，当然N的其他取值也是可以的例如N＝4，5….，只要满足第二互联背板间隔设置在两个第一互联背板之间即可；另外在4a和图4b中两个风扇1-3的间隔之间设置功能板1-2，且功能版与子背板正交连接。
其中，在本实施例的可选实施方式中，每两个所述第一互联背板1-1-1之间等间隔设置一个第二互联背板1-1-2。
此外，本实施例中涉及到的功能板1-2也可以是一个或多个，如图4a和图4b所示，在功能板有多个时，通过风扇1-3在每两个功能板1-2之间形成一个风道，其中，风扇1-3在子背板后面进行吸风，或在功能板的面板前端进行吹风。
其中，该功能板1-2的长度为一个或多个预设长度，其中，预设长度为第一互联背板与第二互联背板之间的间隔距离。
并且，在本实施例的可选实施方式中，该功能板1-2设置在第一互联背板1-1-1与第二互联背板1-1-2的任一一侧，也可以设置在第一互联背板1-1-1与第二互联背板1-1-2的两侧。如图4b所示，以功能板1-2设置在第一互联背板1-1-1与第二互联1-1-2背板的两侧为例，但需要说明的是，在本实施例的另一个实施方式中，该功能版可以只设置在互联背板的一侧，另一侧可以设置用于第一互联背板1-1-1与第二互联1-1-2背板间互联的互联背板，而在三块垂直背板间有大量需要互联的信号时，可以在另一侧增加功能版1-3水平互联背板实现三块背板间的互联，也就是图4b所示的方式，可见该方式不是必须的，因为在互联信号规模可控的情况下，三块垂直背板间的互联是通过只设置在一侧的功能版来实现的。
在本实施例的可选实施方式中，当互联的子背板的数量N为奇数时，该奇数数量的子背板形成全左右全对称的正交互联，其中，用于插入所述功能板的槽位支持所述功能板的混插。
另外，在第一互联背板和第二互联背板之间也可以再设置一个第一互联背板，从而进一步扩展系统各功能模块垂直互联能力。
需要说明的是，当N为1或者2时，本实施例中的子背板只有第一互联背板，此时支持全宽模块的适配，属于最小化的系统互联。
可见，通过本实施例的上述方式，子背板与各个功能板之间通过正交连接，使得系统为前后风道，背板和各功能版都不遮挡风道，使风冷散热效率更高，从而解决了相关技术中机柜系统散热开孔受限于功能模块之间的电气互联导致散热效率低的问题。
实施例2
对于本实施例中涉及到的机柜系统1还包括连接器1-4，如图5a和图5b所示，图5a～5b是根据本发明实施例的包括连接器的机柜系统的结构示意图；
其中，连接器1-4包括：设置在第一互联背板且与第二互联背板同侧的第一连接器1-4-1；设置在第二互联背板两侧的第二连接器1-4-2；设置在功能板上且与第一连接器1-4-1正交连接的第三连接器1-4-3；设置在功能板上且与第二连接器1-4-2正交连接的第四连接器1-4-4；该第三连接器1-4-3与第四连接器1-4-4导通。
需要说明的是，本实施例中涉及到的第三连接器1-4-3和第四连接器1-4-4可以设置功能板的同一侧。另外，该第三连接器1-4-3和第四连接器1-4-4分别设置在功能板异侧。
对于本实施例中各个连接器之间的连接关系，在本实施例中涉及到的功能板1-2有多个时，第一连接器1-4-1和第二连接器1-4-2有多个，其中，多个第一连接器1-4-1中的任一连接器分别与其他第一连接器导通连接，多个第二连接器1-4-2中的任一连接器分别与其他第二连接器导通连接。
实施例3
本实施例是上述实施例1和实施例2的在具体应用场景中的实施方式，该实施方式以机柜为例对本发明进行举例说明，本实施例提供了一种基于背板互联前后风道散热的全Mesh正交互联机柜系统，如图6所示，图6是根据本发明实施例的包括背板装置的机柜系统的结构示意图一；
该机柜系统包括：背板装置，其中，该背板装置包括三个子背板：上下互联背板1(对应于上述实施例中的第一互联背板)、上下互联背板2(对应于上述实施例中的第一互联背板)、水平互联背板(对应于上述实施例中的第二互联背板)，三个子背板相互平行。该机柜系统还包括功能模块及风扇等。
其中，上下互联背板1和水平互联背板的同侧接有连接器1，上下互联背板2和水平互联背板的同侧接有连接器2，水平互联背板上连接器1和连接器2位于水平互联背板两侧。同时，功能模块的上侧接有可以和连接器1正交连接的连接器3，功能模块的下侧接有可以和连接器2正交连接的连接器4。从而，各功能板与子背板正交连接。风扇位于子背板的间隔处，前后出风，背板和功能板都位于风道上，并不遮挡风道，使得风冷效率达到最高。
需要说明的是，该背板装置是全对Mesh结构，可以实现各功能板之间的最短路径连接，同时可以实现所有功能板的全交叉连接。如图7所示，图7是根据本发明实施例的背板装置的全交叉拓扑结构示意图一；其中，以槽位1为例，通过上下互联背板1的连接器1，槽位1上所插功能板可以实现和垂直位置的各槽位的功能板的连接，并且链路距离最短。通过水平互联背板的连机器1和连接器2，槽位1上所插功能板可以实现和水平位置的各槽位的功能板的连接，并且链路距离最短。总结起来，即，任何一个槽位上的功能板都可以实现跟其他槽位功能板的全mesh连接，并且连接链路最短。从而减少了链路损耗，提高信号质量，对高速信号来说尤其重要。同时，PCB走线简单可以减少走线层数，减小单板面积，也极大 的节约了成本。
图8是根据本发明实施例的背板装置的全宽、半宽的示意图；如图8所示，该背板装置不仅可以插半宽的功能板，也可以插全宽的功能板。当插全宽功能板时，该全宽功能板可以通过上下互联背板1的连接器1实现与左边槽位功能板的连接，可以通过上下互联背板2的连接器2实现与右边槽位功能板的连接，也可以实现跟其他槽位功能板的全mesh连接，并且连接链路最短。即，该背板装置可以支持半宽功能板，也可以支持全宽功能板，或者半宽功能板和全宽功能板的混插使用，应用十分灵活。
图9是根据本发明实施例的背板装置的两侧都有功能板的应用示意图，如图9所示，为该背板装置两侧都有功能板的应用方式。
本实施例中涉及到的背板装置还可以采用一个纵向的背板平面来走线，图10是根据本发明实施例的包括背板装置的机柜系统的结构示意图一，图11是根据本发明实施例的背板装置的全交叉拓扑结构示意图二，如图10、图11所示，与上述的图6、图7中所述的方案类似。
可见，在本实施例中各功能板能够通过该背板装置实现最短的链路连接及全mesh连接，使背板各连接器之间的PCB走线最短，能更好的控制背板层数及面积，便于背板生产加工，极大的节约了成本。同时，该背板装置的结构不遮挡前后出风的风道，使系统的散热效率大大提高，有助于系统的使用和升级。
即本实施例的方案适用于通讯及电子领域设备的基于背板互联前后风道散热系统的使用，与相关技术中背板互联技术进行比较，具有如下效果：
①该背板互联装置包括三个子背板，子背板与各个功能板之间通过正交连接器连接；
②该背板互联装置是全Mesh结构，可以实现各个功能板的全交叉连接。可以实现各功能板之间的最短链路连接；
③该背板互联装置使得系统为前后风道，背板和各功能版都不遮挡风 道，使风冷散热效率更高。
以上所述仅为本发明的优选实施例而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。
工业实用性
通过本发明实施例，子背板与各个功能板之间通过正交连接，使得系统为前后风道，背板和各功能版都不遮挡风道，使风冷散热效率更高，从而解决了相关技术中机柜系统散热开孔受限于功能模块之间的电气互联导致散热效率低的问题。

Claims (13)

  1. 一种机柜系统，所述机柜系统包括：由N个子背板组成的背板装置、功能板、以及风扇；
    其中，所述子背板包括：第一互联背板和第二互联背板；每两个所述第一互联背板之间设置一个所述第二互联背板；
    所述功能板水平设置在所述第一互联背板与所述第二互联背板之间，并分别与所述第一互联背板和所述第二互联背板水平正交连接；
    所述风扇设置在所述第一互联背板与所述第二互联背板之间以形成风道，且与所述第一互联背板与所述第二互联背板所在平面垂直的平面上；
    所述N为大于或等于3的整数。
  2. 根据权利要求1所述的系统，其中，每两个所述第一互联背板之间等间隔设置一个所述第二互联背板。
  3. 根据权利要求1所述的系统，其中，所述系统还包括连接器；
    其中，所述连接器包括：设置在所述第一互联背板且与所述第二互联背板同侧的第一连接器；设置在所述第二互联背板两侧的第二连接器；设置在所述功能板上且与所述第一连接器正交连接的第三连接器；设置在所述功能板上且与所述第二连接器正交连接的第四连接器；
    所述第三连接器与所述第四连接器导通。
  4. 根据权利要求3所述的系统，其中，所述第三连接器和所述第四连接器设置所述功能板的同一侧。
  5. 根据权利要求3所述的系统，其中，所述第三连接器和所述第四连接器分别设置在所述功能板异侧。
  6. 根据权利要求3所述的系统，其中，在所述功能板有多个时， 所述第一连接器和所述第二连接器有多个，其中，多个所述第一连接器中的任一连接器分别与其他第一连接器导通连接，多个所述第二连接器中的任一连接器分别与其他第二连接器导通连接。
  7. 根据权利要求3所述的系统，其中，在所述功能板有多个时，通过所述风扇在每两个所述功能板之间形成一个所述风道。
  8. 根据权利要求7所述的系统，其中，所述风扇在所述子背板后面进行吸风，或在所述功能板的面板前端进行吹风。
  9. 根据权利要求1所述的系统，其中，所述功能板的长度为一个或多个预设长度，其中，所述预设长度为所述第一互联背板与所述第二互联背板之间的间隔距离。
  10. 根据权利要求1所述的系统，其中，所述功能板设置在所述第一互联背板与所述第二互联背板的任一一侧。
  11. 根据权利要求1所述的系统，其中，所述功能板设置在所述第一互联背板与所述第二互联背板的两侧。
  12. 根据权利要求1所述的系统，其中，当互联的所述子背板的数量N为奇数时，该奇数数量的子背板形成全左右全对称的正交互联，其中，用于插入所述功能板的槽位支持所述功能板的混插。
  13. 根据权利要求1所述的系统，其中，在所述第一互联背板和所述第二互联背板之间再设置一个所述第一互联背板。
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EP4148578A4 (en) * 2020-06-19 2023-11-01 Huawei Technologies Co., Ltd. STORAGE SYSTEM

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