WO2022264329A1 - Structure de connexion optique et son procédé de fabrication - Google Patents

Structure de connexion optique et son procédé de fabrication Download PDF

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Publication number
WO2022264329A1
WO2022264329A1 PCT/JP2021/022912 JP2021022912W WO2022264329A1 WO 2022264329 A1 WO2022264329 A1 WO 2022264329A1 JP 2021022912 W JP2021022912 W JP 2021022912W WO 2022264329 A1 WO2022264329 A1 WO 2022264329A1
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WIPO (PCT)
Prior art keywords
waveguide
optical
connection structure
light
optical connection
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PCT/JP2021/022912
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English (en)
Japanese (ja)
Inventor
昇男 佐藤
光太 鹿間
洋平 齊藤
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日本電信電話株式会社
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Application filed by 日本電信電話株式会社 filed Critical 日本電信電話株式会社
Priority to PCT/JP2021/022912 priority Critical patent/WO2022264329A1/fr
Priority to JP2023528855A priority patent/JPWO2022264329A1/ja
Publication of WO2022264329A1 publication Critical patent/WO2022264329A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/124—Geodesic lenses or integrated gratings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method

Definitions

  • the present invention relates to an optical connection structure using a self-forming waveguide and a manufacturing method thereof.
  • Non-Patent Document 1 Planar Lightwave Circuit (PLC) equipped with optical waveguides, Silicon Photonics (SiPh), Indium Phosphorus (InP) compound semiconductor chips, etc. are used to connect different types of substrates to advance functionality. Efforts have been made (Non-Patent Document 1).
  • Non-Patent Document 2 the light from the optical element chip is emitted into space.
  • concave portions 515 are formed to expose the silicon of the substrate.
  • a laser diode (not shown) is formed on another indium phosphide substrate and diced into chips.
  • the LD chip 52 is mounted and fixed so that the optical waveguide 523 for propagating light from the LD of the LD chip 52 is connected to the glass waveguide 513 of the PLC chip 51 (FIG. 14B).
  • image recognition can be used for alignment, and intermolecular force can be used for fixation, and there is a bonding device dedicated to this process.
  • chips made of different materials can be integrated and mounted on a wafer for collective manufacturing.
  • the width of the optical waveguide is about 10 microns, so if the positions of the optical waveguides to be connected are shifted by 3 microns, the optical connection loss increases.
  • the width of the optical waveguide becomes narrow, so there is a problem that the optical connection cannot be made with an accuracy of ⁇ 3 microns due to the large loss. rice field.
  • an optical connection structure is arranged on a first substrate and includes a first optical element having a first optical waveguide and a second optical element having a second optical waveguide. 2 optical elements, a self-forming waveguide connecting one end of the first optical waveguide and one end of the second optical waveguide, and a first receiver disposed at the other end of the first optical waveguide. and a light guide.
  • a method for manufacturing an optical connection structure includes: a first optical element having a first optical waveguide and a first light receiving light guide portion disposed at the other end of the first optical waveguide; A method for manufacturing an optical connection structure for optically connecting a second optical element having a second optical waveguide and a second light receiving light guide portion arranged at the other end of the second optical waveguide, the method comprising: a step of collectively forming a plurality of said first optical elements on one substrate; collectively forming a plurality of said second optical elements on a second substrate to form said second optical elements as a chip; fixing the first optical element and the second optical element by bringing the end face of the first optical waveguide and the end face of the second optical waveguide close to each other; a step of filling a photocurable resin between the end face of the first optical waveguide and the end face of the second optical waveguide; forming a self-formed waveguide by exposing to light so as to be incident on the portion and the second light-receiving
  • a low-loss optical connection structure using a self-forming waveguide and a manufacturing method thereof can be provided.
  • FIG. 1A is a schematic top view showing the configuration of the optical connection structure according to the first embodiment of the invention.
  • 1B is a schematic side view showing the configuration of the optical connection structure according to the first embodiment of the present invention
  • FIG. 1C is a schematic top view showing the configuration of the second optical element in the optical connection structure according to the first embodiment of the present invention
  • FIG. 2A is a schematic top view for explaining an example of the method for manufacturing the optical connection structure according to the first embodiment of the invention.
  • FIG. 2B is a schematic side view for explaining an example of the method for manufacturing the optical connection structure according to the first embodiment of the present invention;
  • FIG. 2C is a schematic side view for explaining an example of the method for manufacturing the optical connection structure according to the first embodiment of the present invention;
  • FIG. 1A is a schematic top view showing the configuration of the optical connection structure according to the first embodiment of the invention.
  • 1B is a schematic side view showing the configuration of the optical connection structure according to the first embodiment of the present invention
  • FIG. 1C
  • FIG. 2D is a schematic side view for explaining an example of the method for manufacturing the optical connection structure according to the first embodiment of the present invention
  • FIG. 2E is a schematic side view for explaining an example of the method for manufacturing the optical connection structure according to the first embodiment of the present invention
  • FIG. 2F is a schematic side view for explaining an example of the method for manufacturing the optical connection structure according to the first embodiment of the present invention
  • FIG. 2G is a schematic side view for explaining an example of the method for manufacturing the optical connection structure according to the first embodiment of the present invention
  • FIG. 2H is a schematic side view for explaining an example of the method for manufacturing the optical connection structure according to the first embodiment of the present invention
  • FIG. 3 is a schematic side view for explaining an example of the method for manufacturing the optical connection structure according to the first embodiment of the invention.
  • FIG. 4A is a schematic top view for explaining the effects of the optical connection structure and its manufacturing method according to the first embodiment of the present invention.
  • FIG. 4B is a schematic top view for explaining the effects of the optical connection structure and its manufacturing method according to the first embodiment of the present invention.
  • FIG. 5A is a schematic top view showing an example of the configuration of a light-receiving light guide section in the optical connection structure according to the first embodiment of the present invention;
  • FIG. 5B is a schematic side view showing an example of the configuration of the light-receiving light guide section in the optical connection structure according to the first embodiment of the present invention;
  • FIG. 5A is a schematic top view showing an example of the configuration of a light-receiving light guide section in the optical connection structure according to the first embodiment of the present invention
  • FIG. 5B is a schematic side view showing an example of the configuration of the
  • FIG. 6A is a schematic top view showing an example of the configuration of a light-receiving light guide section in the optical connection structure according to the first embodiment of the present invention
  • FIG. 6B is a schematic side view showing an example of the configuration of the light-receiving light guide section in the optical connection structure according to the first embodiment of the present invention
  • FIG. 7A is a schematic top view showing an example of the configuration of a light-receiving light guiding section in the optical connection structure according to the first embodiment of the present invention
  • FIG. 7B is a schematic side view showing an example of the configuration of the light-receiving light guide section in the optical connection structure according to the first embodiment of the present invention
  • FIG. 8A is a schematic top view showing an example of the configuration of a light-receiving light guiding section in the optical connection structure according to the first embodiment of the present invention
  • FIG. 8B is a schematic side view showing an example of the configuration of the light-receiving light guide section in the optical connection structure according to the first embodiment of the present invention
  • FIG. 9A is a schematic top view showing an example of the configuration of a light-receiving light guiding section in the optical connection structure according to the first embodiment of the present invention
  • 9B is a schematic side view showing an example of the configuration of the light receiving light guide section in the optical connection structure according to the first embodiment of the present invention
  • FIG. 10A is a schematic top view for explaining an optical connection structure according to a second embodiment of the invention.
  • FIG. 10B is a schematic side view for explaining the configuration of the optical connection structure according to the second embodiment of the invention.
  • FIG. 10C is a schematic top view for explaining the optical connection structure according to the second embodiment of the invention.
  • FIG. 10D is a schematic side view for explaining the configuration of the optical connection structure according to the second embodiment of the present invention;
  • FIG. 11 is a schematic side view for explaining the configuration of the second element in the optical connection structure according to the second embodiment of the invention.
  • FIG. 13A is a schematic top view for explaining an example of the method for manufacturing the optical connection structure according to the third embodiment of the present invention
  • FIG. 13B is a schematic side view for explaining an example of the method for manufacturing the optical connection structure according to the third embodiment of the present invention
  • FIG. 13C is a schematic side view for explaining an example of the method for manufacturing the optical connection structure according to the third embodiment of the present invention
  • FIG. 13D is a schematic top view for explaining an example of the method for manufacturing the optical connection structure according to the third embodiment of the present invention
  • FIG. 13E is a schematic side view for explaining an example of the method for manufacturing the optical connection structure according to the third embodiment of the present invention
  • FIG. 13A is a schematic top view for explaining an example of the method for manufacturing the optical connection structure according to the third embodiment of the present invention
  • FIG. 13B is a schematic side view for explaining an example of the method for manufacturing the optical connection structure according to the third embodiment of the present invention
  • FIG. 13C is a schematic side view for explaining an example of the
  • FIG. 13F is a schematic top view for explaining an example of the method for manufacturing the optical connection structure according to the third embodiment of the present invention
  • FIG. 13G is a schematic side view for explaining an example of the method for manufacturing the optical connection structure according to the third embodiment of the present invention
  • FIG. 14A is a schematic top view for explaining the configuration of a conventional optical connection structure.
  • FIG. 14B is a schematic top view for explaining the configuration of a conventional optical connection structure.
  • the optical connection structure 10 includes a first substrate 111, a first element 11, a second element 12, and a first element 11 and a second element 11.
  • a self-formed waveguide 131 (Self Written Waveguide: SWW) is provided between the element 12 of .
  • the first element 11 is a PLC chip and has a glass waveguide 113 .
  • the glass waveguide 113 functions as a waveguide core and has a clad 112 around it.
  • glass waveguide end face An end face (hereinafter referred to as “glass waveguide end face”) 117 at one end of the glass waveguide 113 is exposed toward the second element 12, and the other end is the first light receiving light guide part. 114.
  • PLC end face the end face having the glass waveguide end face 117 is referred to as "PLC end face”.
  • a waveguide branched from the glass waveguide 113 is connected to an optical circuit (not shown).
  • the optical circuit has functions such as multiplexing/demultiplexing and wavelength separation by the glass waveguide 113 .
  • the longitudinal direction (X direction in the drawing) of the glass waveguide 113 of the PLC chip 11 is defined as "waveguide direction”
  • the direction perpendicular to the longitudinal direction (Y direction in the drawing) is defined as "
  • the direction (Z direction) perpendicular to the horizontal plane (substrate surface) is defined as the vertical (thickness) direction
  • the side on which the glass waveguide 113 is arranged in the PLC chip 11 is defined as the “upper” direction.
  • the substrate 111 side is the "downward" direction.
  • the first light-receiving light guide section 114 has a function of changing the course of a part of the light incident from the upper surface of the PLC chip 11 and making it exit from the glass waveguide end face 117 via the glass waveguide 113. formed by
  • the first substrate 111 on which the PLC chip 11 is formed has a recess 115, and the glass waveguide end face 117 is arranged above the side wall 115_2 of the recess 115.
  • the second element 12 is an LD chip and is formed on the second substrate 121 .
  • the bottom surface (back surface) of the second substrate 121 of the LD chip 12 and the top surface of the recess 115 are brought into contact with each other and fixed.
  • the LD chip 12 includes an LD active layer 126, an InP waveguide 125, an SiN waveguide 123, and a second light receiving light guide section 124, as shown in FIG. 1C.
  • the surface on the InP waveguide 125 side is the front surface of the LD chip 12
  • the surface on the second substrate 121 side is the back surface of the LD chip 12 .
  • An InP waveguide 125 is connected to the LD active layer 126 , and the InP waveguide 125 is connected to the SiN waveguide 123 .
  • the tip of the InP waveguide 125 has a tapered spot size converter (SSC).
  • the InP waveguide 125 is covered with the SiN waveguide 123 and connected. Not limited to this, the InP waveguide 125 may be arranged close to the SiN waveguide 123, and may be arranged so that the laser light guided through the InP waveguide 125 is optically coupled to the SiN waveguide 123. .
  • SiN waveguide end face An end face (hereinafter referred to as “SiN waveguide end face”) 127 at one end of the SiN waveguide 123 is exposed toward the first element (PLC chip) 11, and the other end faces the second receiving end. It connects to the light guide section 124 .
  • the end face having the SiN waveguide end face 127 is referred to as "LD end face”.
  • the second light-receiving light-guiding portion 124 converts the optical path of the light incident from the upper surface, guides it to the SiN waveguide 123 , emitted from
  • one end face is connected to the glass waveguide end face 117 of the first element 11 and the other end face is connected to the SiN waveguide end face 127 of the second element 12 .
  • the laser light emitted from the LD active layer 126 is guided through the InP waveguide 125 and the SiN waveguide 123 in order, is guided through the self-formed waveguide 131, and is guided through the glass. Incident into waveguide 113 .
  • the reason why the InP waveguide 125 is connected to the SiN waveguide 123 is that the transmittance of visible light and ultraviolet light is low in InP but high in SiN, and is necessary for forming a self-forming waveguide described later. .
  • the light receiving light guide section is arranged at the other end of both the first optical waveguide and the second waveguide, but it may be arranged at either one.
  • a photocurable resin is filled between the PLC end face of the PLC chip 11 and the LD end face of the LD chip 12, and the first light receiving light guide portion 114 and the second light receiving light guide portion are formed. Visible light (resin curing light) is incident on 124 from above.
  • This visible light (resin curing light) is emitted from the glass waveguide end surface 117 and the SiN waveguide end surface 127 on the wafer, and the photocurable resin is locally irradiated and cured to obtain the glass waveguide end surface 117 and the SiN waveguide end surface. 127 are connected in a self-aligning manner. After that, the self-forming waveguide 131 is formed by removing the unreacted photocurable resin. Finally, by dicing the wafer, the PLC chips 11 on which the LD chips 12 are mounted are formed.
  • FIG. 1 Details of the method for manufacturing the optical connection structure 10 will be described below with reference to FIGS. 2A to 3.
  • FIG. 2A Details of the method for manufacturing the optical connection structure 10 will be described below with reference to FIGS. 2A to 3.
  • the PLC chips 11 are formed on the wafer 1_1, and the concave portions 115 are formed in the substrate (FIGS. 2A and 2B).
  • the LD chip 12 made from another wafer is mounted and fixed in the concave portion 115 (FIGS. 2C and 2D).
  • the mounting device can use a die bonder device, a flip chip device, a transfer printing device, etc. that can pick up a chip and mount it in a predetermined place by image recognition.
  • a bonding method bonding using intermolecular force, bonding using epoxy resin, ultrasonic bonding of metal bumps for electrical conduction, fusion bonding using a thin solder film, and the like can be used.
  • a photocurable resin 14 is formed by spin coating, and mask-exposed with an exposure device (FIG. 2E).
  • the upper surface of the exposure mask 161 is exposed from the upper surface of the exposure mask 161 with the resin curing light 15 of g-line (wavelength of 436 nm) in the exposure apparatus, and the resin curing light 15 passing through the opening 162 of the exposure mask 161 is the second The light is incident on the first light receiving light guide portion 114 and the second light receiving light guide portion 124 .
  • the openings 162 are periodically arranged so as to correspond to the positions of the first light receiving light guiding portion 114 and the second light receiving light guiding portion 124 .
  • a fine linear pattern is formed in the opening 162 to form a diffraction grating so that the resin curing light 15 passing through the exposure mask 161 has a directional component other than the vertical direction.
  • the resin curing light 15 enters the first light-receiving light guide portion 114 and the second light-receiving light guide portion 124 .
  • the resin curing light 15 incident on the first light receiving light guide portion 114 is guided by the glass waveguide 113 and emitted from the glass waveguide end surface 117 .
  • the resin curing light 15 incident on the second light receiving light guide portion 124 of the LD chip 12 is guided by the SiN waveguide 123 and emitted from the SiN waveguide end surface 127 .
  • the photocurable resin 14 is irradiated with the resin curing light 15 from both the glass waveguide 113 and the SiN waveguide 123, the self-forming waveguide 131 is formed, and the light is transmitted between the glass waveguide 113 and the SiN waveguide 123.
  • a connection is made (FIG. 2F).
  • a self-formed waveguide clad is formed around the self-formed waveguide 131 .
  • a self-forming waveguide cladding can be formed by using, as the photocurable resin 14, a resin that produces a difference in refractive index between a portion that is cured with ultraviolet rays and a portion that is cured with heat.
  • the refractive index of the heat-cured portion is lower than the refractive index of the ultraviolet-cured portion.
  • the photocurable resin 14 is cured, and the self-formed waveguide 131 is formed.
  • the unreacted portion of the photocurable resin 14 is liquid, the entire resin including the liquid unreacted portion is thermally cured.
  • the surrounding portion has a lower refractive index than the self-forming waveguide 131 and becomes a cladding.
  • a self-formed waveguide clad may be formed around the self-formed waveguide 131 after removing the unreacted portion of the photocurable resin 14 .
  • the unreacted photocurable resin 14 is removed by a developer device using a developer (FIG. 2G).
  • a cladding 132 of the self-formed waveguide 131 can then be formed by spin-coating and curing a material having a refractive index lower than that of the self-formed waveguide 131 (FIG. 2H).
  • electrical connection can be made from above by a rewiring process, wire bonding, or the like.
  • the optical connection structure 10 is formed on the wafer. Finally, the wafer (described later, FIG. 4A) on which the optical connection structure 10 is formed is diced.
  • the resin curing light 15 can be condensed and expanded.
  • FIG. 4A shows the wafer 1_2 on which the optical connection structure 10 is manufactured by the method described above. Also, FIG. 4B shows an enlarged view of a part of the wafer 1_2 (inside the dotted line in FIG. 4A).
  • the self-forming waveguide 131 allows the PLC chip 11 and the SiN waveguide 123 of the LD chip 12 are connected.
  • the self-formed waveguide 131 is formed so as to correct the positional deviation in this way, the mounting error (about ⁇ 3 microns) of the LD chip 12 is absorbed, and the LD chip 12 and the PLC chip 11 are connected with low loss. can be connected.
  • the same process and apparatus as the wafer process of a normal electric circuit can be used as a collective manufacturing method of the self-forming waveguide 131. It is advantageous for integrated mounting of chips made of different materials.
  • the glass waveguide 113 and the SiN waveguide 123 are provided, but other materials may be used in combination as long as they transmit light having a wavelength that cures the photocurable resin 14 .
  • Si and InP have a high transmittance of infrared light used for communication, but a low transmittance of visible light for curing. If a waveguide made of InP is connected, it can be used for communication.
  • the end of the glass waveguide 113 is provided with the first light-receiving light guiding portion 114 .
  • One end of another glass waveguide 116 is connected to the glass waveguide 113, and the other end of the other glass waveguide 116 is connected to an optical circuit (not shown).
  • the refractive index of the other glass waveguide 116 may be the same as or different from the refractive index of the glass waveguide 113. If the refractive index of the other glass waveguide 116 is higher than that of the glass waveguide 113, the tip of the other glass waveguide 116 may have a tapered spot size converter (SSC). Further, the other glass waveguide 116 may be covered with the glass waveguide 113 and connected, or they may be arranged close to each other, and the glass waveguides 113 and 116 are arranged so as to be optically coupled to each other. I wish I could.
  • SSC tapered spot size converter
  • the first light receiving light guide section 114 in the PLC chip 11 is taken as an example, but it may be applied to the second light receiving light guide section 124 in the LD12 chip.
  • the first light-receiving light guide section 114 may use a diffraction grating 21 as shown in FIGS. 5A and 5B.
  • a metal film pattern is formed as the diffraction grating 21 .
  • the resin curing light 15 incident from above the first light receiving light guide portion 114 is interfered (reflected) by the diffraction grating 21 and part of the resin curing light 15 is introduced into the glass waveguide 113 .
  • a mirror 22 may be used for the first light receiving light guiding section 114.
  • the mirror 22 is formed in a part of the first light receiving light guiding section 114 .
  • part of the resin curing light 15 reflected by the mirror 22 is introduced into the glass waveguide 113 .
  • the mirror 22 is configured by tilting the other end face of the PLC chip including the other end face of the glass waveguide 113 toward the substrate 111 .
  • a configuration using a lens structure 231 may be used.
  • a condensing mirror is formed on the substrate 111 as the lens structure 231 .
  • recesses 233 are formed in the substrate 111 by etching.
  • a condensing mirror (lens structure) 231 made of resin is formed.
  • a portion of the resin curing light 15 incident on the concave portion 233 is condensed toward the glass waveguide 113 by the condensing mirror 231 and is incident on the glass waveguide 113 .
  • a metal mirror 232 may be arranged on the upper surface of the glass waveguide 113.
  • a crystal orientation plane (facet) 241 formed by wet etching the silicon substrate 111 may be used as a mirror. Considering that the angle 242 between the crystal orientation plane 241 and the horizontal plane is about 55 degrees, the crystal orientation is adjusted so that the resin curing light 15 reflected by the crystal orientation plane (mirror) 241 is incident on the glass waveguide 113. Design the position of the surface (mirror) 241 .
  • a mirror 243 made of metal may be arranged on the upper surface of the glass waveguide 113 in order to confine the resin curing light 15 in the glass waveguide 113 .
  • a mirror 251 which is an individual component, may be arranged on the substrate 111 as shown in FIGS. 9A and 9B.
  • the resin curing light 15 from above is reflected in a direction of about 90 degrees with respect to the incident direction, so there is no need to consider the light path of the light receiving light guide section.
  • the process conditions are adjusted so that the mirror 251 does not come off during spin coating and can be removed after exposure and development.
  • the self-forming waveguide 131 is formed and connected after mounting the first optical element (PLC chip) and the second optical element (LD chip).
  • the structure of the self-formed waveguide 131 is used to improve the positional accuracy.
  • Other configurations are the same as those of the first embodiment.
  • the optical connection structure 20 includes a PLC chip 11, an LD chip 12, and a self-forming waveguide 131 between the PLC chip 11 and the LD chip 12, as shown in FIGS. 10A-D.
  • the LD end face of the LD chip 12 is provided with a concave groove 31 having openings 311 and 312 on the upper surface of the LD chip 12 and the LD end face, respectively. Also, the groove 31 is fitted with the self-forming waveguide 131 . Also, the LD chip 12 does not require a substrate. Other configurations are the same as those of the first embodiment.
  • a self-forming waveguide 131 connected to the PLC chip 11 is formed with an appropriate length.
  • the LD chip 12 is mounted so that the SiN waveguide end surface 127 is connected to the self-formed waveguide 131. Then, as shown in FIGS.
  • the LD chip 12 has a layered structure including an LD active layer 126 other than the substrate, an InP waveguide 125, an SiN waveguide 123, and a clad by a wafer bonding method or the like. Here, it is not necessary to provide the LD chip 12 with the second light receiving light guide section 124 .
  • the LD chip 12 has a groove 31 as shown in FIG. A SiN waveguide end surface 127 is exposed on the side surface of the groove 31 parallel to the LD end surface.
  • the self-formed waveguide 131 is fitted (inserted) into the groove 31 of the LD chip 12 to connect the exposed portion of the LD chip 12 and the self-formed waveguide 131 . At this time, the chips are mounted and bonded together with image recognition.
  • the LD chip 12 may be mounted with the opening 311 on the upper surface of the groove 31 facing the substrate 111 side.
  • the position of the LD chip 12 in the vertical direction (perpendicular to the substrate surface) can be improved compared to the case where the opening 311 on the upper surface of the groove 31 of the LD chip 12 is directed upward (opposite to the substrate 111 side). Margins in alignment can be improved.
  • the LD chip 12 from which the substrate has been removed is formed into a thin film so as to transmit visible light, so that the LD chip 12 can be mounted close to the self-formed waveguide 131 from above using image recognition. can be done.
  • the self-forming waveguide 131 formed in one optical element (PLC chip) 11 and the concave groove 31 formed in the other optical element (LD chip) 12 optical connection can be made with high accuracy, and one optical element (PLC chip) 11 and the other optical element (LD chip) 12 can be mounted.
  • the self-forming waveguide 131 is formed and connected after mounting the chip.
  • the optical connection structure according to the present embodiment is different in that after the self-formed waveguide 131 is formed in one chip (LD chip), the positional accuracy is enhanced using the structure of the self-formed waveguide 131 .
  • Other configurations are the same as those of the first embodiment.
  • the optical connection structure includes a PLC chip 11, an LD chip 12, and a self-forming waveguide 131 between the PLC chip 11 and the LD chip 12, as shown in FIG. 13G.
  • the PLC end surface of the PLC chip 11 is provided with a concave groove 41 having openings on the upper surface of the PLC chip 11 and the PLC end surface.
  • the groove 41 is fitted with the self-forming waveguide 131 .
  • Other configurations are the same as those of the first embodiment.
  • the substrate 121 is half-cut along the scribe lines to the middle of the substrate 121 to form the LD wafer grooves 42 .
  • the resin curing light 15 is incident from the second light receiving light guide portion 124 and emitted from the SiN waveguide end surface 127 to the LD wafer groove 42.
  • the filled photocurable resin 14 is irradiated. Thereby, the resin is cured to form the self-formed waveguide 131 with an appropriate length.
  • the uncured portion around the self-formed waveguide 131 is removed (FIGS. 13A, B).
  • the LD chip 12 is singulated by cleaving or the like (Fig. 13C).
  • FIGS. 13D and 13E PLC chips 11 are formed on the wafer, and concave grooves 41 are formed on the PLC end faces.
  • the concave groove 41 has openings on the PLC end surface and the upper surface of the PLC chip 11 .
  • the upper surface of the LD chip 12 is directed (flipped) to the substrate 111 side, and the self-formed waveguide 131 is fitted into the concave groove 41 of the PLC end face, and the LD chip 12 is mounted and bonded to the concave portion 115 of the wafer (Fig. 13F, G).
  • the position of the SiN waveguide 123 on the LD chip 12 side cannot be grasped by direct image recognition from the back surface (substrate 121 side) of the LD chip 12, but since the self-formed waveguide 131 protrudes from the LD end face, image recognition , the position of the SiN waveguide 123 can be detected.
  • optical connection structure by fitting the self-forming waveguide 131 formed in one chip and the concave portion formed in the other chip, optical connection can be achieved with high accuracy. , can be loaded with one chip and the other. Further, when recognizing an image from the substrate side of the chip to be mounted, the position of the waveguide of the chip to be mounted can be grasped by the self-formed waveguide 131 projecting from the chip end and the image can be recognized.
  • the present invention relates to an optical connection structure, and can be applied to devices and systems such as optical communication.

Abstract

L'invention concerne une structure de connexion optique (10) comprenant : un premier élément optique (11) disposé sur un premier substrat (111) et ayant un premier guide d'ondes (113) ; un second élément optique (12) ayant un second guide d'ondes (123) ; un guide d'ondes auto-formé (131) connectant une extrémité du premier guide d'ondes (113) et une extrémité du second guide d'ondes (123) ; et une première partie de guidage de lumière reçue (114) disposée à l'autre extrémité du premier guide d'ondes optique (113).　Par conséquent, la présente invention peut fournir une structure de connexion optique à faible perte utilisant un guide d'ondes auto-formé.
PCT/JP2021/022912 2021-06-16 2021-06-16 Structure de connexion optique et son procédé de fabrication WO2022264329A1 (fr)

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PCT/JP2021/022912 WO2022264329A1 (fr) 2021-06-16 2021-06-16 Structure de connexion optique et son procédé de fabrication
JP2023528855A JPWO2022264329A1 (fr) 2021-06-16 2021-06-16

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