WO2022264321A1 - Structure d'emballage de dispositif de circuit optique et son procédé de fabrication - Google Patents

Structure d'emballage de dispositif de circuit optique et son procédé de fabrication Download PDF

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Publication number
WO2022264321A1
WO2022264321A1 PCT/JP2021/022896 JP2021022896W WO2022264321A1 WO 2022264321 A1 WO2022264321 A1 WO 2022264321A1 JP 2021022896 W JP2021022896 W JP 2021022896W WO 2022264321 A1 WO2022264321 A1 WO 2022264321A1
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Prior art keywords
circuit device
resin
optical circuit
optical
core
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PCT/JP2021/022896
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English (en)
Japanese (ja)
Inventor
光太 鹿間
洋平 齊藤
昇男 佐藤
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日本電信電話株式会社
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Application filed by 日本電信電話株式会社 filed Critical 日本電信電話株式会社
Priority to PCT/JP2021/022896 priority Critical patent/WO2022264321A1/fr
Priority to JP2023528847A priority patent/JPWO2022264321A1/ja
Publication of WO2022264321A1 publication Critical patent/WO2022264321A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind

Definitions

  • the present invention relates to a package structure of an optical circuit device that connects an optical circuit device and an optical component, and a manufacturing method thereof.
  • optical transmission such as an optical waveguide or an optical fiber is performed between a light emitting element such as a laser diode (LD) and a light receiving element such as a photodiode (PD) arranged on a printed circuit board.
  • a light emitting element such as a laser diode (LD)
  • a light receiving element such as a photodiode (PD) arranged on a printed circuit board.
  • Signal processing is realized by transmission using a medium.
  • the optical light emitting element is integrated with an optical modulation element or the like, or connected discretely, and further connected to a driver or the like that performs electrical-to-optical conversion.
  • a configuration including these light emitting elements, light modulating elements, drivers, etc. is mounted as an optical transmitter on an electrical mounting board such as a printed circuit board (PCB).
  • PCB printed circuit board
  • the light-receiving element is appropriately integrated with an optical processor or the like, or connected discretely, and further connected with an electric amplifier circuit for performing optical-electrical conversion.
  • a configuration including these light receiving element, optical processor, electric amplifier circuit, etc. is mounted on a printed circuit board as an optical receiver.
  • Optical interconnection is achieved by mounting an optical transceiver, which integrates an optical transmitter and an optical receiver, in a package or on a printed circuit board and optically connecting it to an optical transmission medium such as an optical fiber. It is also, depending on the topology, it is realized through a repeater such as an optical switch.
  • semiconductors such as silicon and germanium, III-V group represented by indium phosphide (InP), gallium arsenide (GaAs), indium gallium arsenide (InGaAs), etc.
  • InP indium phosphide
  • GaAs gallium arsenide
  • InGaAs indium gallium arsenide
  • devices using materials such as semiconductors have been put to practical use.
  • optical waveguide type optical transceivers have been developed in which a silicon optical circuit (silicon photonics) having a light propagation mechanism, an indium phosphorous optical circuit, or the like are integrated.
  • materials such as ferroelectrics such as lithium niobate and polymers may also be used as light modulation elements.
  • optical functional elements such as planar lightwave circuits made of silica glass are sometimes integrated together with the above light emitting elements, light receiving elements, and light modulating elements.
  • Optical functional devices include splitters, wavelength multiplexers/demultiplexers, optical switches, polarization control devices, optical filters, and the like.
  • an optical waveguide device a device in which a light emitting device, a light receiving device, an optical modulation device, an optical functional device, a light amplifying device, etc. having the above light propagation and waveguiding mechanisms are integrated will be referred to as an optical waveguide device.
  • optical waveguide devices optical waveguide devices using silicon photonics excel in integration, mass production, and compatibility with electrical components, and are attracting attention as key devices in realizing next-generation optical interconnection.
  • One of the representative methods for connecting an optical circuit device and an optical waveguide such as an optical fiber is to butt the optical circuit and the optical waveguide against one or more end faces that are responsible for the optical input/output of the optical circuit. It is a structure to connect.
  • an optical fiber array which is one of the optical waveguides, is integrated with glass or the like in which a V-groove is formed, and each core of the optical fiber and each core of the optical circuit device in this array structure are positioned. connected.
  • alignment position
  • the electrical wiring component 65 is, for example, an electrical wiring component made of ceramic and a metal wiring layer. Pads for electrical contact and multi-layer electrical wiring are omitted.
  • An electric element 64 is mounted on the electric wiring component 65 and electrically connected via the electric wiring of the electric wiring component.
  • the optical circuit device 61 is various optical circuit devices, is mounted on an electrical wiring component, and is covered with a mold resin 63 .
  • an optical circuit device package structure is a package structure for an optical circuit device connected to an optical component, wherein a core and a clad are formed on an electrical wiring component.
  • a resin core cured by irradiating a photocurable resin with light and arranged on an end surface of the core; and a mold resin covering the optical circuit device and the resin core, and at least The refractive index of the mold resin surrounding the resin core is lower than the refractive index of the resin core layer.
  • a method of manufacturing a package structure for an optical circuit device includes the steps of placing the optical circuit device on an electrical wiring component, and filling at least the periphery of the input/output end faces of the optical circuit device with a photocurable resin. a step of guiding resin curing light through the core of the optical circuit device, emitting the light from the input/output end surface, and irradiating the photocurable resin to form a resin core; and a step of filling mold resin around at least the resin core and curing the mold resin.
  • the present invention it is possible to provide a package structure for an optical circuit device that has a high degree of freedom in layout and can be manufactured easily.
  • FIG. 1 is a schematic side view showing the configuration of the package structure of an optical circuit device according to the first embodiment of the present invention.
  • FIG. 2 is an enlarged schematic side view showing the configuration near the input/output end faces in the package structure of the optical circuit device according to the first embodiment of the present invention.
  • FIG. 3 is an enlarged schematic top perspective view showing the configuration near the input/output end faces in the package structure of the optical circuit device according to the first embodiment of the present invention.
  • FIG. 4A is a schematic side view showing an example configuration of the mounting structure of the optical circuit device according to the first embodiment of the present invention.
  • 4B is a schematic side view showing an example of the configuration of the mounting structure of the optical circuit device according to the first embodiment of the present invention;
  • FIG. 1 is a schematic side view showing the configuration of the package structure of an optical circuit device according to the first embodiment of the present invention.
  • FIG. 2 is an enlarged schematic side view showing the configuration near the input/output end faces in the package structure of the optical circuit device according to the
  • FIG. 4C is a schematic side view showing an example of the configuration of the mounting structure of the optical circuit device according to the first embodiment of the present invention
  • FIG. FIG. 5A is a schematic side view showing an example configuration of the package structure of the optical circuit device according to the first embodiment of the present invention.
  • 5B is a schematic side view showing an example of the configuration of the package structure of the optical circuit device according to the first embodiment of the present invention;
  • FIG. 6A is an enlarged schematic side view showing an example of the configuration near the input/output end face in the package structure of the optical circuit device according to the first embodiment of the present invention.
  • FIG. 6B is an enlarged schematic side view showing an example of the configuration near the input/output end face in the package structure of the optical circuit device according to the first embodiment of the present invention.
  • FIG. 6C is an enlarged schematic side view showing an example of the configuration near the input/output end face in the package structure of the optical circuit device according to the first embodiment of the present invention
  • FIG. FIG. 7 is a schematic side view showing the configuration of the package structure of the optical circuit device according to the second embodiment of the present invention.
  • FIG. 8A is a schematic side view showing the configuration of the package structure of the optical circuit device according to the third embodiment of the present invention
  • FIG. 8B is a schematic side view showing the configuration of the package structure of the optical circuit device according to the third embodiment of the present invention;
  • FIG. 9A is a schematic side view showing the configuration of the package structure of the optical circuit device according to the fourth embodiment of the present invention;
  • FIG. 9B is a schematic side view showing the configuration of the mounting structure of the optical circuit device according to the fourth embodiment of the present invention
  • FIG. 10A is a schematic side view showing the configuration of the package structure of the optical circuit device according to the fifth embodiment of the present invention
  • FIG. 10B is a schematic side view showing the configuration of the mounting structure of the optical circuit device according to the fifth embodiment of the present invention
  • FIG. 11A is a schematic side view showing an example configuration of a mounting structure for an optical circuit device according to the fifth embodiment of the present invention.
  • FIG. 11B is a schematic side view showing an example configuration of the mounting structure of the optical circuit device according to the fifth embodiment of the present invention.
  • FIG. 10A is a schematic side view showing the configuration of the package structure of the optical circuit device according to the fifth embodiment of the present invention
  • FIG. 10B is a schematic side view showing the configuration of the mounting structure of the optical circuit device according to the fifth embodiment of the present invention
  • FIG. 11A is a schematic side view showing an example configuration of a mounting
  • FIG. 12 is a schematic side view showing an example of the configuration of the package structure of the optical circuit device according to the fifth embodiment of the invention.
  • FIG. 13A is a schematic side view showing the structure of a conventional optical circuit device package structure.
  • FIG. 13B is a schematic side view showing the structure of a conventional optical circuit device mounting structure.
  • the optical circuit device package structure 1 includes an optical circuit device 11 and a photocurable resin core (hereinafter referred to as " and a molding resin 13 covering the optical circuit device 11 and the resin core 12 .
  • the optical circuit device 11 comprises a substrate 111 and a waveguide layer 112 .
  • a BOX layer is also provided between the substrate 111 and the waveguide layer 112 (not shown).
  • the electric element 14 may be provided.
  • the direction in which light is guided in the waveguide core near the input/output end face 113 of the optical circuit device 11 is defined as the "longitudinal direction of the optical circuit core".
  • the direction perpendicular to (Y direction in the figure) is the “width direction”
  • the direction (Z direction) perpendicular to the horizontal plane (substrate surface) is the thickness direction.
  • the “up” direction is the side to be hit, and the "down” direction is the opposite direction.
  • the optical circuit device package structure 1 is formed on an electrical wiring component 15 , and the optical circuit device 11 and the electrical element 14 are mounted face down and electrically connected via electrical contacts 16 .
  • a known flip-chip connection is used for Face Down mounting.
  • the electrical wiring component 15 has an electrical wiring layer (not shown) and electrical connection pads for flip-chip connection on the upper surface, and multi-layer electrical wiring is formed as necessary. Also, although not shown in the drawings, another electric element 14 such as a capacitor or a coil is mounted, or a structure having a similar effect is integrally formed.
  • the electrical wiring component 15 is formed with electrical wiring by through vias or inner layer wiring so as to electrically connect the upper surface and the lower surface in the thickness direction (Z direction).
  • electrical contacts 16 gold bumps, copper pillars, solder balls, etc. are also formed on the lower surface facing the flip chip connection surface, and are electrically connected to the electrical mounting substrate via the electrical contacts 16 on the lower surface. ing.
  • the electric mounting board is, for example, a known PCB or buildup board. Electrical contacts 16 on the bottom side are formed by solder terminals. For example, it consists of known BGA, LGA, or PGA. It should be noted that electrical contacts may be made by metal bumps (gold bumps, copper pillars, etc.) in the same manner as flip-chip connection.
  • any known interposer may be used as the electrical wiring component 15, and for example, silicon, glass, ceramics (LTCC, HTCC), or a glass epoxy substrate may be used. It may also be called an interposer, subcarrier, package, or the like.
  • the electrical wiring component 15 and the electrical mounting substrate may be connected by known wire bonding, if necessary, without using electrical connection via gold bumps, copper pillars, solder balls, etc. as described above.
  • the electrical wiring component 15 may be composed of a thin film electrical wiring layer called a rewiring layer.
  • the thin-film electrical wiring layer is, for example, a multilayer wiring layer in which copper foil layers and insulating resin layers are alternately laminated, and is manufactured by fan-out wafer level package (FOWLP) technology or fan-out panel level package (FOPLP) technology. In some cases, it is generally called a redistribution layer (RDL: Re-Distribution Layer).
  • FOWLP fan-out wafer level package
  • FOPLP fan-out panel level package
  • RDL redistribution layer
  • the electric element 14 may be any electric element such as a driver, transimpedance amplifier circuit, retimer, FPGA, ASIC, DSP, CPU/GPU, clock circuit, and the like.
  • the electric element 14 is arranged on the electric wiring component 15 and mounted by flip-chip mounting.
  • the mounting form of the electrical element it is not the main focus of the present invention, so it does not necessarily have to be face-down mounting, and may be face-up mounting using wire bonding or the like.
  • the electrical element 14 and the optical circuit device 11 are electrically connected to electrical wiring (not shown) of the electrical wiring component 15 via respective electrical contacts 16 .
  • the optical circuit device 11 is a known silicon photonics chip, the optical waveguide layer is formed on the BOX layer on the substrate, and the thickness of the waveguide substrate is, for example, 625 ⁇ m, which is the standard silicon wafer thickness. . In addition to the optical waveguide layer, it has an electric wiring layer (not shown) and has connection pads. Although not shown in the drawing, the light-emitting element, light-receiving element, modulation element, optical functional element, etc. described in the background are integrated.
  • the optical circuit device 11 is integrated in a hybrid manner with an optical transmission element, an optical modulation element, and the like made of a compound semiconductor or the like, if necessary.
  • a plurality of optical circuit cores are arranged in the depth direction (width direction, Y direction) of the paper surface.
  • a silicon photonics chip has an optical input/output unit for inputting/outputting light to/from at least one optical input/output end surface, and a spot size converter (SSC) or the like is integrated in the optical circuit as an edge coupler.
  • SSC spot size converter
  • the mode field diameter of the light propagation mode in the optical circuit of silicon photonics is very small, 1 ⁇ m or less. ) is done.
  • the operation when incident on the silicon photonics chip 11 is also reversible, and the present invention does not depend on the light input/output direction.
  • a resin core 12 made of a photocurable resin is formed in the longitudinal direction (X direction) of the optical circuit core, in contact with the core end surface responsible for optical input/output of the optical circuit device 11 .
  • the photocurable resin is a known resin that reacts to a specific wavelength and undergoes a curing reaction.
  • acrylic resin, epoxy resin, silicone resin, urethane resin, oxetane resin, organic-inorganic hybrid, modified products thereof, or Substituents and the like can be used, and materials known as photoresists may be used.
  • What is the curing wavelength Although it can be arbitrarily designed by adding an initiator, a dye, or the like, for example, wavelengths from ultraviolet light to visible light can be used.
  • the light used for the photocurable resin is referred to as "resin curing light" 10.
  • the periphery of the electrical element 14, the optical circuit device 11, and the resin core 12 is filled with the mold resin 13.
  • a known mold resin 13 can be used for the package structure of a semiconductor device, etc.
  • the area around the resin core 12 has a lower refractive index than the resin core 12 in the signal wavelength band and functions as a clad.
  • Known acrylic resins, epoxy resins, silicone resins, urethane resins, oxetane resins, and the like can be used as the resin clad material, and halogen-substituted compounds such as fluorination may be used as appropriate to adjust the refractive index.
  • the optical circuit device 11 is composed of a Si substrate 111, a BOX layer 114, and a Si waveguide ( 115 , a second waveguide core (hereinafter also referred to as “core”) 116 covering the Si waveguide 115 , and an overcladding 117 .
  • the waveguide layer 112 is a Si waveguide 115 , a second waveguide core 116 and an overcladding 117 .
  • the tip of the Si waveguide 115 is separated from the light input/output facet 113, that is, the Si waveguide 115 is not arranged near the light input/output facet 113, and only the second waveguide core 116 transmits light. Arranged as a waveguide layer. Here, the tip of the Si waveguide 115 may be in contact with the light input/output facet 113 .
  • the resin core 12 is connected to the end surface of the second waveguide core 116 .
  • a mold resin 13 is filled around the optical circuit device 11 and the resin core 12 .
  • the optical circuit device 11 has a second waveguide core 116 that covers the Si waveguide 115, and the branched second waveguide core (hereinafter also referred to as "branch core").
  • the resin curing light 10 is incident from an end face different from the light input/output end face 113 of 116_2 (an opposite end face in this embodiment).
  • the edge coupler at the tip of the Si waveguide 115 serves as a spot size converter (SSC, arrow 118 in FIG. 3) and has a tapered shape in which the width of the thin line (waveguide) becomes narrower in the longitudinal direction (X+ direction) of the optical circuit core.
  • the tapered shape of the Si waveguide 115 may be a non-linear tapered shape, a multi-step tapered shape, or an SSC structure consisting of a discontinuous body of Si core and glass material known as segmented SSC.
  • a second waveguide core 116 is provided around the Si waveguide 115 .
  • the signal light wavelength transits to the second waveguide core 116 after the mode field is expanded by taper or the like in the Si waveguide 115, and the substantial core at the optical input/output end face 113 of the optical circuit device 11 is , the second waveguide core 116 .
  • the second waveguide core 116 is made of a material capable of propagating resin curing light, such as glass, SiON, SiN, or polymer.
  • the photocurable resin core 12 is formed by gradually curing uncured resin by the resin curing light 10 emitted from the end surface of the second waveguide core 116, and is in contact with the second waveguide core 116.
  • the second waveguide core 116 is branched from the Si thin wire as necessary at a location other than the SSC portion, and has a resin-cured light input portion 119 .
  • the resin cured light input portion 119 of the second waveguide core 116 may be provided on the same end surface as the input/output end surface 113 in contact with the resin core 12, or may be provided on a different end surface or in the circuit.
  • Resin curing light may be input by any known method, and any method such as the above-described butt connection, mirror coupling, or grating coupler via an optical fiber or the like can be applied.
  • the cross section of the photocurable resin core 12 has an arbitrary shape, but is formed to have a shape similar to the mode distribution from the optical fiber core for resin curing light.
  • a Gaussian beam has a shape close to a circular cross section.
  • the mode shape may result in an elliptical shape.
  • the photocurable resin may be used as it is as the mold material.
  • the refractive index is kept lower than that of the photocurable resin core 12, and the resin is used as it is as a mold material.
  • the package structure of the optical circuit device is mounted on the electrical mounting component, and the optical waveguide such as the optical fiber 21 is connected.
  • the optical fibers 21 are fixed as a known optical fiber array housed with an adhesive in a fiber fixing part 22 consisting of a glass part with a V-groove and a lid part.
  • the optical fiber 21 and the resin core 12 are positioned and connected. Positioning is performed with high accuracy by a known method such as active alignment or passive alignment, and fixed via an adhesive.
  • optical connection is achieved by spatial coupling via a lens mechanism 23 or the like.
  • the core 116 of the optical circuit device 11 and the resin core 12 are optically coupled after the resin core 12 is formed.
  • the optical circuit device 11 and the optical fiber 21 are optically connected via the resin core 12 .
  • the longitudinal direction By providing an optical waveguide mechanism composed of a resin core 12 extending in the X direction and a clad made of mold resin 13, an optical waveguide with an optical fiber 21 or the like and the optical circuit device 11 can be optically connected.
  • the optical circuit device 11 is mounted on the electrical wiring component 15 .
  • the electric element 14 may also be mounted.
  • a photocurable resin is filled so as to cover the optical circuit device 11 and the electric element 14 .
  • at least the periphery of the input/output end surface 113 of the optical circuit device 11 should be filled with a photocurable resin.
  • the resin curing light is guided through the core 116 of the optical circuit device 11 and emitted from the input/output end surface 113 to irradiate the photocuring resin.
  • the portion irradiated with the resin curing light becomes the resin core 12 .
  • the molding resin 13 is filled and cured so as to cover the optical circuit device 11 and the electric element 14, including the portion where the uncured portion of the photocurable resin is removed.
  • the periphery of the resin core 12 is filled with the mold resin 13 and hardened.
  • the package structure of the optical circuit device according to this embodiment is manufactured.
  • the electrical wiring components should be separated from the edge of the electrical wiring components by a long distance. were required to expand.
  • the package structure of the optical circuit device according to the present embodiment, it is not necessary to expose the input/output end face of the optical circuit device for connection with the optical waveguide. As a result, it is no longer necessary to arrange the optical circuit device at the edge of the electrical wiring component, and the aforementioned restrictions on the package structure and the layout of the optical circuit device can be eliminated.
  • the conventional configuration required precision processing such as dicing and polishing of dissimilar materials in order to expose the light input/output end faces.
  • the package structure of the optical circuit device according to the present embodiment there is no need to process the optical circuit device, and the number of materials is also reduced, so the load in the process can be greatly reduced.
  • the optical circuit device 11 may be face-up mounted and connected to the electrical wiring component 15 by wire bonding 24 .
  • the optical circuit device 11 and the electrical element 14 may be connected by wire bonding 24 with both of them mounted face-up.
  • the optical circuit device 11 and the electrical element 14 may be flip-chip connected to form a two-story flip-chip connection with the electrical wiring board.
  • optical fiber 21 an example of using silicon photonics as an optical circuit device has been shown, but it is also possible to use, for example, an InP integrated circuit, quartz PLC, LN circuit, etc. in the same way. Also, any known optical fiber may be used as the optical fiber 21 . Optical fibers can also be used as other optical waveguide devices, such as polymer waveguides, as well.
  • the shape of the resin core 12 may be tapered.
  • the resin core 12 a beam diameter expansion or beam diameter reduction function, the beam diameter can be converted to a desired beam diameter so as to minimize the connection loss with the optical fiber, and the connection loss can be reduced.
  • the resin core 12 by interposing the resin core 12 in the mold resin 13, a new optical function can be imparted.
  • the resin core 12 portion may be terminated in the middle of the mold resin 13 .
  • the mold resin 13 is preferably transparent to the signal light.
  • the end portion of the resin core 12 may be provided with a structure that exhibits a lens function.
  • the resin core part and the resin propagation part a beam diameter expansion or beam diameter reduction function in the same way, the beam diameter is converted to a desired beam diameter so as to minimize the connection loss with the optical fiber, and the connection loss is reduced. can be reduced.
  • the basic components are the same as in the first embodiment, the optical circuit device 11 is a silicon photonics chip, and the electric wiring substrate is a polyimide thin film. and copper wiring.
  • the difference from the first embodiment is that two types of mold resin are used, as shown in FIG.
  • the first mold resin 13 exists only around the photocurable resin core 12, and is set to an appropriate value lower than the refractive index of the resin core 12 as in the first embodiment, and It functions as a cladding of
  • the second mold resin 13_2 molds the optical circuit device 11 and the electric element 14 other than the first mold resin 13 portion.
  • the same effect as in the first embodiment can be obtained. That is, by extending the resin core from the optical circuit device and using it as an intermediate portion for connection with the optical waveguide, it is not necessary to arrange the optical circuit device at the edge of the electrical wiring component 15, and the package structure and the optical circuit device can be improved. layout constraints can be eliminated.
  • a resin different from the mold resin for general semiconductor packages is used for the mold resin around the resin core.
  • the first mold resin used as the clad is used separately from the second mold resin used as a general package mold. Resin can be easily selected.
  • the basic constituent elements are the same as in the first embodiment, and the electrical wiring component is the same RDL material as in the second embodiment.
  • an optical function block 31 is inserted in the longitudinal direction of the photocurable resin core, as shown in FIGS. 8A and 8B.
  • any block having an optical function can be applied as the optical function block 31 .
  • lens components By passing through the lens, it is possible to develop a function such as reducing again the diameter of the beam that spreads during propagation through the resin core.
  • any known spatial optical system bulk component such as a polarization control element, a wavelength multiplexing/demultiplexing element, and a splitter element can be used.
  • an optical circuit device 11_2 is used as an optical functional block in a broad sense. Thereby, the connection between the optical circuits can also be realized through the resin core in the mold resin.
  • the same effect as in the first embodiment can be obtained. That is, by extending the resin core from the optical circuit device and using it as an intermediate part for connection with the optical waveguide, it is not necessary to arrange the optical circuit device at the edge of the electrical wiring component, and the package structure and the optical circuit device can be improved. Layout constraints can be eliminated.
  • the optical circuit device does not need to be subjected to the dicing and polishing processes after the molding resin is filled, and the load in the process can be greatly reduced.
  • a resin different from general mold resin is used for the mold resin around the resin core.
  • various optical functions and a plurality of optical circuit devices can be integrated in the resin core waveguide on the electrical wiring component, effectively utilizing the space inside the package without degrading the optical characteristics. Functionality can be imparted.
  • the difference from the first to third embodiments is that the longitudinal direction of the resin core differs from the longitudinal direction (X direction) of the optical circuit (optical waveguide) core, as shown in FIGS. 9A and 9B.
  • the resin core 12 is formed upward at a predetermined angle with respect to the longitudinal direction (X direction) of the optical circuit (optical waveguide) core.
  • This configuration can be formed by inclining the input/output end surface 113 of the optical circuit device 11 in advance, as shown in FIG. 9A.
  • the resin curing light enters the optical circuit device 11 at an angle determined by Snell's law. It is emitted from the output end face 113 . Since the photocurable resin core 12 is formed along the resin curing light, it is formed at a predetermined angle with respect to the longitudinal direction (X direction) of the optical circuit (optical waveguide) core.
  • the end face of the mold resin 13 on the side connected to the optical component such as the optical fiber 21 may be inclined with respect to the thickness direction (Z direction) of the wiring component.
  • the optical fiber array can also be connected in accordance with the angle of the end surface of the mold resin 13 . The combination of these angles is appropriately determined by design, and the end surface of the mold resin 13 may remain in the thickness direction (Z direction) of the wiring component without being inclined.
  • the same effect as in the first embodiment can be obtained. That is, by extending the resin core from the optical circuit device and using it as an intermediate part for connection with the optical waveguide, it is not necessary to arrange the optical circuit device at the edge of the electrical wiring component, and the package structure and the optical circuit device can be improved. Layout constraints can be eliminated.
  • the optical axis can be offset with respect to the thickness direction (Z direction) of the electrical wiring component.
  • the position of the end of the resin core 12 at the end of the mold resin on the side connected to the optical component such as the optical fiber can be separated upward (raised) from the electrical wiring component.
  • the fiber fixing parts and the like are large, and when the package is mounted on the electrical mounting board, mechanical interference may occur between the electrical mounting board and the fiber fixing parts.
  • an optical path conversion component 41 that is, a mirror is arranged as an optical function block in the third embodiment, and a photocurable resin
  • the position of the end of the core 12_2 is the upper surface of the package structure (mold resin 13) of the optical circuit device 11.
  • the end of the photocurable resin core is provided on the mold resin end surface perpendicular to the core longitudinal direction (X direction) of the optical circuit.
  • the end of the photocurable resin core 12_2 is provided on the surface (eg, upper surface) of the mold resin 13 parallel to the longitudinal direction (X direction) of the optical circuit core.
  • the resin cores are composed of a first resin core 12_1 whose longitudinal direction is the core longitudinal direction of the optical circuit (light waveguiding direction of the optical circuit device, X direction), and a thickness direction (Z direction) whose longitudinal direction is the first resin core 12_1. and a second resin core 12_2 in the same direction, and an optical path conversion component 41 is mounted between the first resin core 12_1 and the second resin core 12_2.
  • the second resin core end surface 12_2 connected to the optical component (for example, the optical fiber 21) is arranged on the upper surface of the mold resin 13.
  • a micromirror is preferable as the mirror, and it is preferable that it has sufficient reflectance for both the signal wavelength and the resin curing light.
  • the same effect as in the first embodiment can be obtained. That is, by extending the resin core from the optical circuit device and using it as an intermediate part for connection with the optical waveguide, it is not necessary to arrange the optical circuit device at the edge of the electrical wiring component, and the package structure and the optical circuit device can be improved. Layout constraints can be eliminated.
  • the output end surface of the resin core is arranged on the upper surface of the mold resin.
  • the fiber fixing parts are large, and when the package is mounted on the electrical mounting board, mechanical interference may occur between the electrical mounting board and the fiber fixing parts.
  • the fiber fixing component 22 and the electrical mounting board can be mounted without coming into contact with each other.
  • the package structure of the optical circuit device is manufactured at the wafer level, light can be input and output from the upper surface of the wafer, so it has excellent testability and can be easily inspected.
  • the package structure of the optical circuit device has the end of the resin core 12_2 on the upper surface (the surface facing the electrical wiring component 15) of the package structure (mold resin 13), and the optical fiber 21 may be connected to an optical waveguide.
  • the mold resin on the upper surface of the package is removed by polishing or grinding.
  • the thickness of the mold resin 41 can be reduced, the resin core 12_2 can be shortened.
  • another optical path conversion component 41_2 may be provided on the side of the fiber fixing component 22 so that the longitudinal direction of the optical fiber 21 and the longitudinal direction of the optical circuit core (X direction) are substantially parallel. good.
  • FIG. 1 an example in which one molding resin is applied is shown.
  • FIG. 1 A structure can be used in which the periphery is filled with the first mold resin 13 that functions as a clad for the resin core, and the other portion is filled with the second mold resin 13_2.
  • the present invention relates to a package structure of an optical circuit device, and can be applied to equipment and systems such as optical communication.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

L'invention concerne une structure d'emballage (1) d'un dispositif de circuit optique qui est une structure d'emballage d'un dispositif de circuit optique à connecter à un composant optique, et comprend, sur un composant de câblage électrique (15), un dispositif de circuit optique (11) qui a un noyau (116) et une gaine (114, 117), un noyau de résine (12) qui est durci par irradiation d'une résine photodurcissable avec de la lumière et reliée à une surface d'extrémité du noyau (116), et une résine de moule (13) qui recouvre le dispositif de circuit optique (11) et le noyau de résine (12). L'indice de réfraction de la résine de moulage (13) au moins autour du noyau de résine (12) est inférieur à l'indice de réfraction du noyau de résine (12).　Par conséquent, la présente invention peut fournir une structure d'emballage d'un dispositif de circuit optique, qui a un degré élevé de flexibilité dans la disposition et peut être facilement fabriquée.
PCT/JP2021/022896 2021-06-16 2021-06-16 Structure d'emballage de dispositif de circuit optique et son procédé de fabrication WO2022264321A1 (fr)

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PCT/JP2021/022896 WO2022264321A1 (fr) 2021-06-16 2021-06-16 Structure d'emballage de dispositif de circuit optique et son procédé de fabrication
JP2023528847A JPWO2022264321A1 (fr) 2021-06-16 2021-06-16

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Citations (10)

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Publication number Priority date Publication date Assignee Title
JPH0777637A (ja) * 1993-09-08 1995-03-20 Fujitsu Ltd 光学素子結合方法及び屈折率像形成材料
JPH08320422A (ja) * 1994-06-22 1996-12-03 Fujitsu Ltd 光導波路系の作製方法およびそれを用いた光デバイス
JP2000089054A (ja) * 1998-09-12 2000-03-31 Korea Electronics Telecommun Ｓｏｉ光導波路を利用したハイブリッド光集積回路用基板の製造方法
WO2000029885A1 (fr) * 1998-11-12 2000-05-25 The University Of Sydney Points de raccordement de guides d'ondes a alignement passif
JP2002365459A (ja) * 2001-06-12 2002-12-18 Toyota Central Res & Dev Lab Inc 光導波路デバイスの製造方法
JP2004004487A (ja) * 2002-04-26 2004-01-08 Ibiden Co Ltd 光伝送構造体、および、光導波路の形成方法
JP2004177802A (ja) * 2002-11-28 2004-06-24 Ibiden Co Ltd 光導波路形成・検査装置、および、光導波路の形成方法
JP2014074799A (ja) * 2012-10-04 2014-04-24 Tdk Corp 光導波路
WO2015173420A1 (fr) * 2014-05-15 2015-11-19 Imec Vzw Procédé de couplage d'une fibre optique à un composant optique ou optoélectronique
US20190302379A1 (en) * 2016-07-14 2019-10-03 Intel Corporation Semiconductor package with embedded optical die

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0777637A (ja) * 1993-09-08 1995-03-20 Fujitsu Ltd 光学素子結合方法及び屈折率像形成材料
JPH08320422A (ja) * 1994-06-22 1996-12-03 Fujitsu Ltd 光導波路系の作製方法およびそれを用いた光デバイス
JP2000089054A (ja) * 1998-09-12 2000-03-31 Korea Electronics Telecommun Ｓｏｉ光導波路を利用したハイブリッド光集積回路用基板の製造方法
WO2000029885A1 (fr) * 1998-11-12 2000-05-25 The University Of Sydney Points de raccordement de guides d'ondes a alignement passif
JP2002365459A (ja) * 2001-06-12 2002-12-18 Toyota Central Res & Dev Lab Inc 光導波路デバイスの製造方法
JP2004004487A (ja) * 2002-04-26 2004-01-08 Ibiden Co Ltd 光伝送構造体、および、光導波路の形成方法
JP2004177802A (ja) * 2002-11-28 2004-06-24 Ibiden Co Ltd 光導波路形成・検査装置、および、光導波路の形成方法
JP2014074799A (ja) * 2012-10-04 2014-04-24 Tdk Corp 光導波路
WO2015173420A1 (fr) * 2014-05-15 2015-11-19 Imec Vzw Procédé de couplage d'une fibre optique à un composant optique ou optoélectronique
US20190302379A1 (en) * 2016-07-14 2019-10-03 Intel Corporation Semiconductor package with embedded optical die

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