WO2022244040A1 - ウェハ供給装置及び部品移載装置 - Google Patents
ウェハ供給装置及び部品移載装置 Download PDFInfo
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- WO2022244040A1 WO2022244040A1 PCT/JP2021/018556 JP2021018556W WO2022244040A1 WO 2022244040 A1 WO2022244040 A1 WO 2022244040A1 JP 2021018556 W JP2021018556 W JP 2021018556W WO 2022244040 A1 WO2022244040 A1 WO 2022244040A1
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- wafer
- opening
- container
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- movement
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- 238000012546 transfer Methods 0.000 title claims description 18
- 230000007246 mechanism Effects 0.000 claims abstract description 146
- 230000004308 accommodation Effects 0.000 claims abstract description 14
- 238000001514 detection method Methods 0.000 claims description 74
- 238000000605 extraction Methods 0.000 claims description 33
- 238000011144 upstream manufacturing Methods 0.000 claims description 17
- 230000003287 optical effect Effects 0.000 claims description 9
- 238000012423 maintenance Methods 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 284
- 239000000758 substrate Substances 0.000 description 13
- 238000004891 communication Methods 0.000 description 11
- 238000011084 recovery Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000001105 regulatory effect Effects 0.000 description 6
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 230000004044 response Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 230000009191 jumping Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
Definitions
- the present invention relates to a wafer feeder that feeds wafers divided into a plurality of parts, and a component transfer device equipped with this wafer feeder.
- a component mounting device for mounting components on a board there is known a device equipped with a component supply device that supplies components held on a pallet to a predetermined component picking work position.
- a component supply device of this type is disclosed in, for example, Japanese Unexamined Patent Application Publication No. 2002-200012.
- the component supply device disclosed in Patent Document 1 includes a pallet container (magazine) for containing a pallet on which a tray having a plurality of components is mounted, and an elevator mechanism for vertically moving the pallet container.
- the elevator mechanism vertically moves the pallet container between a first position at the same height as the component picking position and a second position for exchanging used pallets. With the pallet container positioned at the first position, the pallet is supplied from the pallet container to the component extraction work position. On the other hand, when the pallet container is located at the second position, the used pallet is removed from the pallet container and replaced with a new pallet.
- a plurality of insertion preventing members are attached to the pallet container with a predetermined space between them to allow passage of the pallet.
- a plurality of insertion prevention members attached to the pallet container can restrict access to the component extraction work position through the pallet container.
- a wafer feeder is a device that feeds a wafer divided into a plurality of parts as it is or while it is held on a pallet.
- a pallet with a large thickness is usually used.
- the insertion preventing member disclosed in the above Patent Document 1 is applied to a wafer feeder, the interval between adjacent insertion preventing members increases as the thickness of the pallet increases. In this case, in a state where the pallet container (wafer container) that contains the wafers held on the pallet is arranged at the second position, access to the component extraction work position through the wafer container is accurately restricted. There is a risk that you will not be able to
- An object of the present invention is to provide a wafer feeder capable of precisely regulating access to a component extraction work position through a wafer container, and a component transfer device equipped with the same.
- a wafer supply device is a device that supplies a wafer divided into a plurality of parts to a predetermined part extraction work position.
- This wafer feeder includes a first frame plate having a first opening facing the component picking work position, and a second opening facing the side opposite to the component picking work position. a second frame plate formed with a second frame plate defining an internal space between the first frame plate and the second frame plate communicating with the first opening and the second opening;
- a wafer container configured to accommodate the wafer and arranged in the internal space, and movement of the wafer through the first opening between the wafer container and the component extraction work position is permitted.
- the first opening is provided in the internal space so as to be movable in conjunction with the movement of the wafer container, and when the wafer container is placed at the first position, the entire first opening is opened. an opening/closing plate that closes the entire first opening when the is arranged at the second position.
- a component transfer apparatus includes the above-described wafer supply apparatus that supplies a wafer divided into a plurality of components to a predetermined component extraction work position, and the wafer supplied to the component extraction work position. a component transfer unit that takes out the component from the wafer and transfers it to a predetermined component transfer unit.
- FIG. 1 is a top plan view showing the overall configuration of a component mounting apparatus according to an embodiment of the present invention
- FIG. FIG. 4 is a schematic perspective view showing a head unit and a push-up unit; It is the perspective view which looked at the wafer storage elevator of the wafer supply apparatus from the +Y side.
- FIG. 4 is a perspective view of a wafer storage elevator of the wafer supply device viewed from the -Y side;
- FIG. 10 is a perspective view of the wafer storage elevator of the wafer supply device as viewed from the +Y side with the frame plate removed;
- FIG. 4 is a perspective view of the wafer storage elevator of the wafer supply device as viewed from the -Y side with the frame plate removed;
- FIG. 4 is a perspective view of the wafer storage elevator of the wafer supply device as viewed from the -Y side with the frame plate removed;
- FIG. 10 is a perspective view of the pallet container, showing a state in which the latch member is in a movement restricting posture;
- FIG. 10 is a perspective view of the pallet container, showing a state in which the latch member is in a movement permitting posture;
- 3 is a block diagram showing a control configuration of the wafer supply device;
- FIG. 10 is a diagram for explaining the pallet supply/recovery process by the wafer supply device, and shows a state in which the pallet container is arranged at the first position;
- FIG. 10 is a diagram for explaining the pallet supply/recovery process by the wafer supply device, and shows a state in which the pallet container is arranged at the second position;
- FIG. 10 is a diagram for explaining the pallet supply/recovery process by the wafer supply device, showing a state in which the door is opened;
- FIG. 10 is a diagram for explaining the pallet supply and recovery process by the wafer supply device, and shows a state in which the pallet container has been moved to the first position;
- 4 is a flowchart of pallet supply and recovery processing by the wafer supply device; It is a figure which shows the 1st modification of a wafer supply apparatus. It is a figure which shows the 2nd modification of a wafer supply apparatus.
- the X direction and the Y direction are orthogonal to each other on the horizontal plane, and the Z direction extends in the vertical direction orthogonal to both the X direction and the Y direction.
- one side in the X direction is called the "+X side”
- the other side opposite to the one side in the X direction is called the "-X side”.
- one side in the Y direction is called the "+Y side”
- the other side opposite to the one side in the Y direction is called the "-Y side”.
- the upper side, which is one side in the Z direction is referred to as the "+Z side”
- the lower side which is the other side opposite to the one side in the Z direction
- a component transfer apparatus equipped with a wafer supply apparatus includes, for example, a taping apparatus that accommodates a die diced from a wafer on a tape, a die bonder that wire-bonds the die to a substrate, or a component that mounts the die on a substrate. It can be applied to various devices such as mounting devices. Here, an example in which the component transfer device of the present invention is applied to a component mounting device will be described.
- a component mounting apparatus 1 is an apparatus for mounting dies 7a (components) diced from a wafer 7 onto a substrate P (predetermined component transfer section).
- the component mounting apparatus 1 includes a base 2, a conveyor 3, a head unit 4 (component transfer unit), a component supply unit 5, a wafer supply unit 6, a camera unit 32U, and a push-up unit. 40 included.
- the base 2 is a mounting base for various devices provided in the component mounting apparatus 1 .
- the conveyor 3 is a transport line for the substrate P installed on the base 2 so as to extend in the X direction.
- the conveyor 3 carries the board P from outside the machine to a predetermined mounting work position, and carries the board P out of the machine from the mounting work position after the mounting work.
- the conveyor 3 has a clamping mechanism (not shown) that holds the substrate P at the mounting position.
- the position where the substrate P is shown in FIG. 1 is the mounting work position.
- the component supply unit 5 supplies a plurality of dies 7a arranged by dicing from the wafer 7 .
- the head unit 4 picks up the die 7a from the wafer 7 in the component supply unit 5, moves to the mounting work position, and mounts the die 7a on the board P.
- the head unit 4 is provided with a plurality of heads 4H for sucking and holding the die 7a during the picking and releasing the held die 7a during the mounting.
- the head 4H can move back and forth (up and down) in the Z direction with respect to the head unit 4 and can rotate about its axis.
- the head unit 4 is equipped with a substrate recognition camera 31 that captures an image of the substrate P. As shown in FIG.
- the feducial mark attached to the substrate P is recognized from the photographed image of the substrate recognition camera 31 .
- the positional deviation of the board P is recognized, and the positional deviation is corrected when the component is mounted.
- the component mounting apparatus 1 can move the head unit 4 in at least the upper space between the component supply section 5 and the substrate P held at the mounting position in the horizontal direction (X direction and Y direction).
- the first drive mechanism D1 includes a pair of Y-axis fixed rails 13, a first Y-axis servomotor 14, and a ball screw shaft 15 on the +X side and the -X side, respectively, as a mechanism for moving the head unit 4 in the Y direction.
- a pair of Y-axis fixed rails 13 are fixed on the base 2 and extend parallel to each other in the Y-direction at a predetermined interval in the X-direction.
- the ball screw shaft 15 is arranged so as to extend in the Y direction at a position close to the Y-axis fixed rail 13 .
- a first Y-axis servomotor 14 rotationally drives a ball screw shaft 15 .
- a support frame 16 that supports the head unit 4 is installed between the pair of Y-axis fixed rails 13 .
- Nuts 17 to be screwed onto the respective ball screw shafts 15 are assembled to the +X side end and -X side end of the support frame 16 .
- the first drive mechanism D1 includes a guide member (not shown) mounted on the support frame 16, a first X-axis servomotor 18, and a ball screw shaft 19 as a mechanism for moving the head unit 4 in the X direction.
- the guide member is a member that guides the movement of the head unit 4 in the X direction, and is fixed to the +Y side surface of the support frame 16 so as to extend in the X direction.
- the ball screw shaft 19 is arranged in the vicinity of the guide member so as to extend in the X direction.
- a first X-axis servomotor 18 rotationally drives a ball screw shaft 19 .
- a nut (not shown) is attached to the head unit 4 , and the nut is screwed onto the ball screw shaft 19 .
- the first Y-axis servomotor 14 operates to rotate the ball screw shaft 15, thereby moving the head unit 4 together with the support frame 16 in the Y direction. do. Also, the head unit 4 moves in the X direction with respect to the support frame 16 by operating the first X-axis servomotor 18 to rotate the ball screw shaft 19 .
- the component supply unit 5 includes a wafer supply device 6 that supplies wafers 7 divided into a plurality of dies 7a to a predetermined component extraction work position (wafer stage 10).
- the wafer supply device 6 supplies the wafer 7 to the wafer stage 10 while being held on the pallet 8 .
- the wafer 7 is a disk-shaped semiconductor wafer on which circuit patterns and the like are already formed.
- a pallet 8 holds a wafer sheet 8a.
- the component supply unit 5 may include a tape feeder for supplying components in the form of a component storage tape containing electronic components.
- the camera unit 32U is a unit that is movable in the X and Y directions, and includes the wafer camera 32. Wafer camera 32 images a portion of wafer 7 positioned on wafer stage 10, that is, die 7a within the camera's field of view. Based on this captured image, the position of the die 7a to be picked up is recognized.
- the component mounting apparatus 1 includes a second drive mechanism D2 that allows the camera unit 32U to move in at least the upper space between the component supply unit 5 and a predetermined standby position in the horizontal direction (X direction and Y direction). .
- the second drive mechanism D2 is a drive system that is separate and independent from the first drive mechanism D1 that drives the head unit 4. As shown in FIG. In this embodiment, the standby position is a position away from the wafer stage 10 on the +Y side.
- the second drive mechanism D2 includes a pair of Y-axis fixed rails 33 on the +X side and the -X side, and a second Y-axis servomotor 34 and a ball screw shaft arranged on the +X side as a mechanism for moving the camera unit 32U in the Y direction. 35.
- a pair of Y-axis fixed rails 33 are fixed on the base 2 and extend parallel to each other in the Y-direction at a predetermined interval in the X-direction.
- the ball screw shaft 35 is arranged so as to extend in the Y direction at a position close to the Y-axis fixed rail 33 on the +X side.
- a second Y-axis servomotor 34 rotationally drives a ball screw shaft 35 .
- a support frame 36 that supports the camera unit 32U is installed between the pair of Y-axis fixed rails 33 .
- a nut 37 that is screwed onto the ball screw shaft 35 is attached to the +X side end of the support frame 36 .
- the second drive mechanism D2 includes a guide member (not shown) mounted on the support frame 36, a second X-axis servomotor 38, and a ball screw shaft 39 as a mechanism for moving the camera unit 32U in the X direction.
- the guide member is a member that guides movement of the camera unit 32U in the X direction, and is fixed to the -Y side surface of the support frame 36 so as to extend in the X direction.
- the ball screw shaft 39 is arranged in the vicinity of the guide member so as to extend in the X direction.
- a second X-axis servomotor 38 rotationally drives a ball screw shaft 39 .
- a nut (not shown) is attached to the camera unit 32U, and the nut is screwed onto the ball screw shaft 39. As shown in FIG.
- the second Y-axis servomotor 34 operates to rotate the ball screw shaft 35, thereby moving the camera unit 32U integrally with the support frame 36 in the Y direction. do. Also, the camera unit 32U moves in the X direction with respect to the support frame 36 by operating the second X-axis servomotor 38 to rotationally drive the ball screw shaft 39 .
- the push-up unit 40 is arranged below the component supply unit 5, and pushes up the die 7a to be picked up by the head 4H from the lower surface side of the wafer sheet 8a.
- the push-up unit 40 is arranged on the base 2 so as to be movable in the XY directions over a range corresponding to the wafer stage 10 .
- the push-up unit 40 is movably supported in the X direction by a support frame 42 movable along a pair of guide rails 41 extending in the Y direction.
- a ball screw shaft 43 screwed into a nut portion (not shown) provided inside the support frame 42 is rotationally driven by a third Y-axis servomotor 44 .
- the push-up unit 40 moves together with the support frame 42 in the Y direction.
- the support frame 42 is provided with a ball screw shaft 45 that is screwed with a nut portion (not shown) provided inside the push-up unit 40 .
- the ball screw shaft 45 is rotationally driven by the third X-axis servomotor 46 to move the push-up unit 40 in the X-axis direction.
- the push-up unit 40 has a push-up pin 47 for pushing up the die 7a. When the die 7a is sucked by the head 4H, the push-up pin 47 rises to push up the die 7a through the wafer sheet 8a.
- the push-up pin 47 is driven up and down by a pin elevating motor.
- a component recognition camera 30 is installed on the base 2 .
- the component recognition camera 30 images the die 7a sucked by the head 4H of the head unit 4 from below before being mounted on the substrate P. As shown in FIG. Based on this captured image, it is determined whether the head 4H has picked up the die 7a abnormally or picked up incorrectly.
- the configuration of the wafer supply device 6 will be described in detail with reference to FIGS. 3 to 8 in addition to FIG.
- the wafer supply device 6 includes a wafer storage elevator 9 , a wafer stage 10 and a wafer conveyor 11 .
- the wafer storage elevator 9 stores the wafer sheets 8a to which the wafers 7 are stuck on the pallet 8 in multiple stages in the Z direction.
- a wafer stage 10 is installed on the base 2 at a position on the -Y side of the wafer storage elevator 9 .
- the wafer stage 10 is arranged at a position aligned on the +Y side with respect to the mounting work position where the substrate P is stopped.
- the wafer stage 10 which is an area on the base 2 where the wafers 7 divided into a plurality of dies 7a are arranged, serves as a component extraction work position to which the pallets 8 are to be supplied by the wafer supply device 6. Become.
- the wafer conveyor 11 pulls out the pallet 8 from the wafer storage elevator 9 onto the wafer stage 10 or returns the pallet 8 on the wafer stage 10 to the wafer storage elevator 9 .
- the wafer storage elevator 9 is configured to supply the pallet 8 holding the wafer sheet 8a to which the wafer 7 is adhered to the wafer stage 10 and to recover the used pallet 8 from the wafer stage 10.
- the wafer storage elevator 9 includes an apparatus body 91 , a pallet container 95 (wafer container), a moving mechanism 96 and an opening/closing plate 97 .
- the apparatus main body 91 has a housing structure that defines an internal space 917 in which the pallet container 95, the moving mechanism 96, the opening/closing plate 97, and the like are arranged.
- the apparatus main body 91 includes a first frame plate 911 and a second frame plate 912 arranged to face each other in the Y direction, a pair of third frame plates 913 arranged to face each other in the X direction, and a pair of third frame plates 913 arranged to face each other in the Z direction. and a fourth frame plate 914 and a fifth frame plate 915 .
- the device main body 91 defines a space surrounded by the frame plates as the internal space 917 .
- the first frame plate 911 constitutes the -Y side wall surface of the apparatus main body 91 .
- the first frame plate 911 is formed with a first opening 911A that opens toward the -Y side, which is the wafer stage 10 side.
- the first opening 911A has a shape that allows passage of one pallet 8 holding a wafer 7 therethrough.
- the length of the first opening 911A along the X direction is set to be slightly larger than the length of one pallet 8 along the X direction, and the length of the first opening 911A along the Z direction
- the length along is set to a value slightly larger than the length along the Z direction of one pallet 8 .
- the first opening 911A is formed at the same height position as the wafer stage 10 in the Z direction.
- the second frame plate 912 constitutes the +Y side wall surface of the device body 91 .
- the second frame plate 912 is formed with a second opening 912A that opens toward the +Y side opposite to the wafer stage 10 side.
- the second opening 912A has a shape that allows exposure of the entire pallet container 95 arranged in the internal space 917, which will be described later.
- the length of the second opening 912A along the X direction is set to a value greater than the length of the pallet container 95 along the X direction
- the length of the second opening 912A along the Z direction is The length is set to a value greater than the length of the pallet container 95 along the Z direction.
- the opening area of the second opening 912A is larger than the opening area of the first opening 911A.
- the first opening 911A and the second opening 912A are formed so as not to overlap each other when viewed from the Y direction orthogonal to the Z direction, which is the movement direction of the pallet container 95 in the internal space 917.
- the first opening 911A is formed on the -Z side in the Z direction with respect to the second opening 912A.
- a pair of third frame plates 913 constitute the +X side and -X side wall surfaces of the device body 91, respectively.
- the fourth frame plate 914 constitutes the +Z side wall surface of the device main body 91 .
- the fifth frame plate 915 constitutes the ⁇ Z side wall surface of the device main body 91 .
- the apparatus main body 91 further includes a door 916 for opening and closing the second opening 912A.
- the door 916 opens and closes the second opening 912A by rotating around a rotation axis extending in the Z direction provided at the end of the second frame plate 912 on the -X side.
- a container support structure 92 is provided in the +X side end region portion of the fifth frame plate 915 of the device main body 91 .
- the container support structure 92 is a structure for supporting the pallet container 95 so that it can move in the Z direction within the internal space 917 .
- the container support structure 92 has a pair of rail members 921 spaced apart from each other in the Y direction and extending in the Z direction. This pair of rail members 921 movably supports the pallet container 95 .
- the pallet container 95 can move in the Z direction by moving along the pair of rail members 921 while being supported by the pair of rail members 921 .
- a door switch 94A is provided in the +Y side area of the fourth frame plate 914.
- a door lock mechanism 93 and a door detection mechanism 94B are provided on the +Y side end face of the +X side third frame plate 913 of the pair of third frame plates 913 .
- the door switch 94A is a switch that accepts operations related to opening and closing the door 916.
- the door switch 94A outputs a door open request signal SA1 (see FIG. 11 to be described later) when an operation for requesting the opening of the door 916 is received, and closes the door when the door 916 is closed. It outputs a signal SA2 (FIG. 13 to be described later).
- the door lock mechanism 93 is a mechanism for maintaining the state in which the door 916 closes the second opening 912A.
- the door detection mechanism 94B is a detection mechanism for detecting that the door 916 has been opened after the door lock mechanism 93 has released the closed state of the door 916 .
- the door detection mechanism 94B detects that the door 916 is opened, it outputs a door open detection signal SC (see FIG. 12 described later).
- the pallet container 95 is a wafer container that accommodates a plurality of wafers 7 held on the pallet 8 while lined up in the Z direction. That is, the pallet container 95 accommodates the pallet 8 holding the wafer 7 .
- the pallet container 95 is supported movably in the Z direction by a pair of rail members 921 of the container support structure 92 within the internal space 917 of the apparatus main body 91 (see FIGS. 5 and 6).
- the pallet container 95 includes a magazine rack 951, a latch member 952, and a latch opening/closing mechanism 953. As shown in FIGS.
- the magazine rack 951 is formed in a box shape with both ends in the Y direction open, and is a structure constituting a housing body for housing the pallet 8 holding the wafer 7 .
- a plurality of supporting portions 9511 are arranged side by side in the Z direction to support the pallet 8 so as to be movable in the Y direction.
- Each wafer 7 held on each pallet 8 supported by each of the plurality of support portions 9511 is of the same type. That is, each of the plurality of pallets 8 housed in the magazine rack 951 holds wafers 7 having the same type of dies 7a.
- the magazine rack 951 is arranged in the internal space 917 of the device main body 91 so that a predetermined gap GP (FIG. 6) is formed between it and the first frame plate 911 .
- the latch member 952 is a rod-shaped member that extends in the Z direction and protrudes toward the first frame plate 911 within the range of the gap GP with respect to the magazine rack 951 .
- Latch member 952 is an example of a wafer movement control member.
- the latch member 952 is provided at each end of the magazine rack 951 on the first frame plate 911 side ( ⁇ Y side) and on the +X side and the ⁇ X side in the X direction.
- the latch member 952 can rotate around a latch rotation shaft 9521 extending in the Z direction.
- the latch rotation shafts 9521 are provided at the ⁇ Y side and +X side ends and the ⁇ Y side and ⁇ X side ends of the magazine rack 951, respectively.
- the latch member 952 rotates around the latch rotation shaft 9521 to restrict the movement of the pallet 8 holding the wafer 7 from the magazine rack 951 toward the first frame plate 911 (-Y side). It is possible to change the attitude between the movement restricting attitude (the attitude in FIG. 7) that allows the movement and the movement-permitting attitude (the attitude in FIG. 8) that allows the movement.
- the latch opening/closing mechanism 953 is provided on the upper surface of the magazine rack 951 on the +Z side.
- the latch opening/closing mechanism 953 is a mechanism that rotates the latch member 952 around the latch rotation shaft 9521 to change the attitude of the latch member 952 between the movement restriction attitude and the movement allowance attitude.
- a pallet detection mechanism 94C is attached to the device main body 91.
- the pallet detection mechanism 94C is an example of a wafer detection mechanism for detecting movement of the pallet 8 holding the wafer 7 from the magazine rack 951 toward the first frame plate 911 side (-Y side).
- the pallet detection mechanism 94C is composed of a light emitting portion 94C2 and a light receiving portion 94C3.
- the light-emitting portion 94C2 and the light-receiving portion 94C3 are arranged on the optical path 94C1 extending in the Z direction (moving direction of the pallet container 95) within the range of the gap GP formed between the magazine rack 951 and the first frame plate 911. , are arranged opposite each other.
- the pallet detection mechanism 94C detects the movement of the pallet 8 from the magazine rack 951 to the first frame plate 911 side based on the state of light received by the light receiving portion 94C3 of the light emitted from the light emitting portion 94C2 and traveling along the optical path 94C1. Detect movement.
- the movement mechanism 96 is a mechanism for moving the pallet container 95 supported by the pair of rail members 921 of the container support structure 92 in the internal space 917 of the apparatus main body 91 in the Z direction.
- the moving mechanism 96 includes a ball screw shaft 961 and a drive motor 962.
- the ball screw shaft 961 is arranged close to the pair of rail members 921 so as to extend in the Z direction.
- the drive motor 962 is a servomotor that generates a driving force for moving the pallet container 95, and drives the ball screw shaft 961 to rotate.
- a nut (not shown) is attached to the pallet container 95 , and the nut is screwed onto the ball screw shaft 961 . According to the moving mechanism 96 having such a configuration, the pallet container 95 moves in the Z direction along the pair of rail members 921 by operating the driving motor 962 to rotate the ball screw shaft 961 .
- the moving mechanism 96 moves the pallet container 95 in the Z direction between a first position facing the first opening 911A and a second position facing the second opening 912A in the internal space 917 of the apparatus main body 91. move to The first position is a position where movement of the pallet 8 between the pallet container 95 and the wafer stage 10 through the first opening 911A is permitted.
- the second position is a position where the pallet 8 accommodated in the pallet container 95 is allowed to be replaced through the second opening 912A.
- the first opening 911A is formed on the -Z side in the Z direction from the second opening 912A. It is positioned on the -Z side of the direction.
- the moving mechanism 96 moves the pallet container 95 in a first moving direction Z1 from the first position to the second position, and stores the pallet in a second moving direction Z2 from the second position to the first position. Move body 95;
- a container detection mechanism 94D is provided inside the internal space 917 of the apparatus main body 91 .
- the container detection mechanism 94D is a mechanism for detecting that the pallet container 95 is arranged at the second position.
- the container detection mechanism 94D includes a light emitting unit 94D1 attached to the end of the pallet container 95 on the first frame plate 911 side, and a light receiving unit attached to a region of the first frame plate 911 facing the second opening 912A. 94D2 (see FIGS. 10 to 13 described later).
- the light emitting part 94D1 may be attached to the first frame plate 911, and the light receiving part 94D2 may be attached to the pallet container 95.
- the container detecting mechanism 94D detects that the pallet container 95 is arranged at the second position based on the state of light emitted from the light emitting unit 94D1 and received by the light receiving unit 94D2.
- the container detection mechanism 94D detects that the pallet container 95 is placed at the second position
- the container detection mechanism 94D outputs a container detection signal SB (see FIG. 11 to be described later).
- the container detection mechanism 94D is not limited to the above structure using light as long as it can detect that the pallet container 95 is placed at the second position.
- the opening/closing plate 97 is a plate-like member provided within the internal space 917 of the device main body 91 so as to be able to move in conjunction with the movement of the pallet container 95 by the moving mechanism 96 .
- the opening/closing plate 97 opens and closes the first opening 911A formed in the first frame plate 911 by moving in conjunction with the movement of the pallet container 95 .
- the opening/closing plate 97 opens the entire first opening 911A when the pallet container 95 is arranged at the first position.
- the pallet 8 can be supplied from the pallet container 95 to the wafer stage 10 through the first opening 911A while the pallet container 95 is arranged at the first position.
- the pallet 8 can be recovered from the wafer stage 10 to the pallet container 95 through the first opening 911A.
- the opening/closing plate 97 closes the entire first opening 911A.
- the opening/closing plate 97 closes the entire first opening 911A.
- the opening/closing plate 97 is provided at the end of the pallet container 95 on the upstream side (-Z side) in the first moving direction Z1 and on the side of the first frame plate 911 (-Y side). installed.
- the opening/closing plate 97 that can be moved in conjunction with the movement of the pallet container 95 by the moving mechanism 96 can be realized.
- the location where the opening/closing plate 97 is attached in the pallet container 95 is the upstream side in the first movement direction Z1 from the first position to the second position, and the first opening 911A is formed. 1 frame plate 911 side end.
- the pallet container 95 in a state in which the pallet container 95 is arranged at the second position downstream of the first position in the first movement direction Z1, the pallet container 95 is located upstream in the first movement direction Z1 and in the first position.
- the first opening 911A formed in the first frame plate 911 can be reliably closed by the open/close plate 97 attached to the end on the first frame plate 911 side. This makes it possible to more accurately restrict access to the wafer stage 10 through the pallet container 95 when the pallet container 95 is arranged at the second position.
- the first opening 911A and the second opening 912A are mutually aligned when viewed from the Y direction orthogonal to the Z direction, which is the movement direction of the pallet container 95 in the internal space 917 of the apparatus main body 91. formed so that they do not overlap.
- the pallet container 95 is arranged at the second position corresponding to the second opening 912A, communication from the pallet container 95 to the wafer stage 10 through the first opening 911A is
- the opening/closing plate 97 can more reliably block the entire opening 911A. Therefore, in the state where the pallet container 95 is arranged at the second position, access to the wafer stage 10 through the pallet container 95 can be restricted more accurately.
- the latch member 952 includes a latch member 952 .
- the latch member 952 assumes the movement permitting posture in response to the rotation of the latch rotation shaft 9521 by the latch opening/closing mechanism 953, the movement of the pallet 8 from the magazine rack 951 toward the first frame plate 911 is permitted. be done. In this case, the pallet 8 can be supplied from the magazine rack 951 to the wafer stage 10 through the first opening 911A.
- the latch member 952 is in the movement restricting posture, movement of the pallet 8 from the magazine rack 951 toward the first frame plate 911 is restricted. In this case, for example, when the pallet container 95 is moved by the moving mechanism 96 or when the pallet container 95 is arranged at the second position, the pallet 8 jumps out from the magazine rack 951 toward the first frame plate 911. can be regulated.
- the gap GP is formed between the magazine rack 951 and the first frame plate 911 as described above. Since this gap GP is formed between the magazine rack 951 and the first frame plate 911, the first opening 911A formed in the first frame plate 911 and the gap GP communicate with each other. Therefore, when the pallet container 95 is arranged at the second position, the magazine rack 951 and the wafer stage 10 are in communication with each other through the gap GP and the first opening 911A. In this case, in order to restrict access to the wafer stage 10 through the magazine rack 951, communication from the magazine rack 951 to the wafer stage 10 through the gap GP and the first opening 911A must be blocked.
- the opening/closing plate 97 includes a projecting portion 971 and an extending portion 972 .
- the projecting portion 971 extends from the end of the magazine rack 951 on the upstream side (-Z side) in the first moving direction Z1 and on the side of the first frame plate 911 (-Y side) within the range of the gap GP. It is a plate-shaped part that protrudes to the side.
- the length of the projecting portion 971 along the X direction is set to substantially the same value as the length of the magazine rack 951 along the X direction.
- the length of protrusion 971 protruding from magazine rack 951 is set to a value slightly smaller than the dimension of gap GP.
- the extending portion 972 is a plate-like portion extending from the protruding portion 971 in the second movement direction Z2 (-Z side) so as to be able to open or close the entire first opening 911A.
- the length of the extending portion 972 along the X direction is the same as the length of the projecting portion 971 along the X direction and is set to a value greater than the length of the first opening 911A along the X direction.
- the length of the extending portion 972 along the Z direction is set to a value greater than the length of the first opening 911A along the Z direction.
- the opening/closing plate 97 is composed of a member having an L-shaped cross section in which the projecting portion 971 and the extending portion 972 are integrated.
- the opening/closing plate 97 can be easily constructed by integrating the projecting portion 971 and the extending portion 972 .
- the protrusion 971 of the opening/closing plate 97 protrudes from the end of the magazine rack 951 on the upstream side in the first moving direction Z1 and on the first frame plate 911 side within the range of the gap GP to the first frame plate 911 side.
- the projection 971 prevents the gap GP from separating from the first opening 911A. Communication can be cut off.
- the extending portion 972 of the opening/closing plate 97 extends from the projecting portion 971 so as to be able to open or close the entire first opening 911A.
- the first opening 911A can be closed by the extending portion 972 when the pallet container 95 is arranged at the second position. That is, when the pallet container 95 is arranged at the second position, the projection 971 blocks the communication between the gap GP between the magazine rack 951 and the first frame plate 911 and the first opening 911A. At the same time, the extension 972 closes the first opening 911A. As a result, access to the wafer stage 10 through the magazine rack 951 can be properly restricted when the pallet container 95 is located at the second position.
- the optical path 94C1 extending in the Z direction within the range of the gap GP is arranged to face each other.
- a pallet detection mechanism 94C is provided which includes a light emitting portion 94C2 and a light receiving portion 94C3. Based on the detection result of the pallet detection mechanism 94C, it is possible to detect the situation where the pallet 8 protrudes from the magazine rack 951 toward the first frame plate 911 side.
- a projecting portion 971 of the opening/closing plate 97 projecting from the magazine rack 951 toward the first frame plate 911 within the range of the gap GP has a light passage hole 9711 .
- the light passage hole 9711 is a hole that allows light to pass from the light emitting portion 94C2 to the light receiving portion 94C3 by opening the optical path 94C1 of the palette detection mechanism 94C. This prevents the opening/closing plate 97 from interfering with the detection of the pallet 8 by the pallet detection mechanism 94C.
- the wafer supply device 6 has a control section 6C that controls the operations of the wafer conveyor 11 and the wafer storage elevator 9 .
- the control unit 6C is composed of a microcomputer containing a storage device such as a ROM (Read Only Memory) for storing control programs and a flash memory for temporarily storing data.
- the control unit 6C controls the operations of the wafer conveyor 11 and the wafer storage elevator 9 by reading the control program.
- the controller 6C is arranged, for example, on a fifth frame plate 915 in the device main body 91 (see FIG. 5).
- the control unit 6C includes a conveyor control unit 11C and an elevator control unit 9C as functional configurations.
- the conveyor control unit 11C controls the wafer conveyor 11.
- the conveyor control unit 11C controls the wafer conveyor 11 so that the pallet 8 is pulled out from the pallet container 95 onto the wafer stage 10 through the first opening 911A.
- the conveyor control unit 11C controls the pallet 8 on the wafer stage 10 to be returned to the pallet container 95 through the first opening 911A. , controls the wafer conveyor 11 .
- the elevator control unit 9C controls the wafer storage elevator 9.
- the output signal of the door switch 94A is input to the elevator control unit 9C, and detection signals of the door detection mechanism 94B, the pallet detection mechanism 94C, and the container detection mechanism 94D are also input.
- the elevator control section 9C includes, as a functional configuration, a lock control section 9C1, a latch control section 9C2, and a movement control section 9C3.
- the lock control unit 9C1 controls the door lock mechanism 93 based on the detection signal from the container detection mechanism 94D.
- the lock control unit 9C1 controls the door lock mechanism when a container detection signal SB (see FIG. 11 to be described later) indicating that the pallet container 95 is arranged at the second position is output from the container detection mechanism 94D.
- the door lock mechanism 93 is controlled so that the maintenance of the closed state of the door 916 by 93 is released. As a result, the maintenance of the closed state of the door 916 is canceled only when the pallet container 95 is arranged at the second position.
- the opening/closing plate 97 closes the entire first opening 911A in response to the pallet container 95 being arranged at the second position, the door 916 is released from being maintained in the closed state. Therefore, the door 916 can be opened only when the pallet container 95 is placed at the second position and the first opening 911A is closed by the opening/closing plate 97. can be done.
- the lock control unit 9C1 controls the door lock mechanism 93 so that the closed state of the door 916 by the door lock mechanism 93 is maintained. to control.
- the latch control section 9C2 controls the latch opening/closing mechanism 953 according to the position of the pallet container 95 within the internal space 917 of the apparatus main body 91.
- the latch control section 9C2 controls the latch opening/closing mechanism 953 so that the latch member 952 takes the movement permitting posture when the pallet container 95 is arranged at the first position.
- the latch member 952 is in the movement permitting posture, movement of the pallet 8 from the magazine rack 951 toward the first frame plate 911 is permitted.
- the pallet 8 can be supplied from the magazine rack 951 to the wafer stage 10 through the first opening 911A.
- the latch control section 9C2 causes the latch member 952 to take the movement restricting posture. , controls the latch opening/closing mechanism 953 .
- the latch member 952 is in the movement restricting posture, movement of the pallet 8 from the magazine rack 951 toward the first frame plate 911 is restricted. This makes it possible to restrict the pallet 8 from jumping out of the magazine rack 951 toward the first frame plate 911 side.
- the movement control section 9C3 controls the movement mechanism 96 based on the output signal of the door switch 94A.
- the door switch 94A outputs a door open request signal SA1 (see FIG. 11 to be described later) when an operation requesting the opening of the door 916 is received
- the movement control unit 9C3 determines whether the door 916 is provided.
- the moving mechanism 96 is controlled so that the pallet container 95 is arranged at the second position corresponding to the second opening 912A. Accordingly, when the door 916 is opened after the door switch 94A is operated, the pallet container 95 is arranged at the second position.
- the pallet 8 contained in the pallet container 95 can be replaced through the second opening 912A by opening the door 916. is. In this case, access to the wafer stage 10 through the pallet container 95 is properly regulated by the opening/closing plate 97 .
- the movement control unit 9C3 controls the first opening facing the wafer stage 10.
- the moving mechanism 96 is controlled so that the pallet container 95 is arranged at the first position corresponding to the portion 911A.
- the pallet container 95 is arranged at the first position.
- the opening/closing plate 97 opens the first opening 911A. Therefore, the pallet 8 can be supplied from the pallet container 95 to the wafer stage 10 through the first opening 911A.
- the movement control section 9C3 controls the movement mechanism 96 based on the detection signal of the door detection mechanism 94B.
- the door detection mechanism 94B outputs a door open detection signal SC (see FIG. 12 to be described later) indicating the detection result that the door 916 is opened
- the movement control unit 9C3 drives the drive motor 962 of the movement mechanism 96. to stop As a result, movement of the pallet container 95 can be restricted while the door 916 is open. Even when the movement control section 9C3 stops driving the drive motor 962, the servo motors 14 and 18 for moving the head unit 4 in the component mounting apparatus 1 and the servo motors for moving the camera unit 32U are operated.
- the driving of the motors 34, 38 and the respective servo motors 44, 46 for moving the push-up unit 40 is not stopped. Therefore, even when the driving motor 962 of the wafer supply device 6 is stopped, the component mounting device 1 continues the mounting operation using the die 7a of the wafer 7 on the pallet 8 placed on the wafer stage 10. is done.
- the first opening 911A is opened by the opening/closing plate 97 when the pallet container 95 is arranged at the first position in the internal space 917 of the apparatus main body 91 (step S1). ).
- the latch control section 9C2 controls the latch opening/closing mechanism 953 so that the latch member 952 takes the movement permitting posture.
- the conveyor controller 11C controls the wafer conveyor 11 so that the used pallet 8E placed on the wafer stage 10 is returned to the pallet container 95 through the first opening 911A (step S2).
- the used pallet 8E placed on the wafer stage 10 is collected into the pallet container 95.
- the conveyor control unit 11C controls the wafer conveyor 11 so that a new pallet 8 is pulled out from the pallet container 95 onto the wafer stage 10 through the first opening 911A (step S3).
- a new pallet 8 is supplied to the wafer stage 10 instead of the used pallet 8E.
- the head unit 4 takes out the die 7a from the wafer 7 held on the new pallet 8 supplied to the wafer stage 10.
- the elevator control unit 9C monitors whether or not the door switch 94A outputs the door open request signal SA1 (step S4). As shown in FIG. 11, when the door open request signal SA1 is output from the door switch 94A (YES in step S4), the latch controller 9C2 opens and closes the latch so that the latch member 952 assumes the movement restriction posture. Control mechanism 953 . When the latch member 952 is in the movement restricting posture, movement of the pallet 8 from the magazine rack 951 toward the first frame plate 911 is restricted. In this state, the movement control section 9C3 controls the movement mechanism 96 so that the pallet container 95 is arranged at the second position corresponding to the second opening 912A provided with the door 916 (step S5). ).
- the elevator control unit 9C monitors whether or not the container detection signal SB is output from the container detection mechanism 94D (step S6). As shown in FIG. 11, when the container detection signal SB is output from the container detection mechanism 94D (YES in step S6), the pallet container 95 is placed at the second position, and the opening/closing operation is performed. The plate 97 is in a state of closing the entire first opening 911A. In this state, the lock control unit 9C1 controls the door lock mechanism 93 so that the maintenance of the door body 916 in the closed state by the door lock mechanism 93 is released (step S7).
- the elevator control unit 9C monitors whether or not the door open detection signal SC is output from the door detection mechanism 94B (step S8). As shown in FIG. 12, when the door open detection signal SC is output from the door detection mechanism 94B (YES in step S8), the movement control section 9C3 stops driving the drive motor 962 of the movement mechanism 96 (step S9). As a result, movement of the pallet container 95 can be restricted while the door 916 is open. When the door 916 is open, the used pallet 8E collected in the pallet container 95 can be replaced with a new pallet 8 through the second opening 912A.
- the elevator control unit 9C monitors whether or not the door closing signal SA2 has been output from the door switch 94A (step S10). As shown in FIG. 13, when the door closing signal SA2 is output from the door switch 94A (YES in step S10), the movement control unit 9C3 moves to the first opening 911A opening toward the wafer stage 10. The moving mechanism 96 is controlled so that the pallet container 95 is arranged at the first position (step S11). As a result, when the door 916 is closed, the pallet container 95 is arranged at the first position. When the pallet container 95 is placed at the first position in this manner, the opening/closing plate 97 opens the first opening 911A. Therefore, the pallet 8 can be supplied from the pallet container 95 to the wafer stage 10 through the first opening 911A.
- the present invention is not limited to this.
- the first opening 911A may be formed on the +Z side in the Z direction with respect to the second opening 912B.
- the first moving direction Z1 from the first position corresponding to the first opening 911A to the second position corresponding to the second opening 912A is the +Z side. to the -Z side.
- the second moving direction Z2 from the second position corresponding to the second opening 912A to the first position corresponding to the first opening 911A is the direction from the -Z side to the +Z side.
- the opening/closing plate 97 is attached to the end of the pallet container 95 on the upstream side (+Z side) in the first movement direction Z1 and on the side of the first frame plate 911 (-Y side).
- the first opening 911A formed in the first frame plate 911 is securely opened by the opening/closing plate 97 attached to the end on the upstream side (+Z side) in the direction Z1 and on the side of the first frame plate 911 ( ⁇ Y side). can be closed. This makes it possible to accurately restrict access to the wafer stage 10 through the pallet container 95 when the pallet container 95 is arranged at the second position.
- the storage body for storing the pallets 8 in the pallet storage body 95 is composed only of the magazine rack 951, but it is not limited to this.
- the storage body of the pallet storage body 95 may be composed of a magazine rack 951 and a housing 951A.
- the housing 951A is a box-shaped housing that is open at both ends in the Y direction.
- the housing 951A is attached to the ball screw shaft 961 of the moving mechanism 96 and accommodates the magazine rack 951 so as to be movable in the +Y direction in the Y direction.
- the magazine rack 951 can be taken in and out of the housing 951A through the second opening 912A. Therefore, the magazine rack 951 containing a plurality of pallets 8 can be replaced in units.
- the opening/closing plate 97 is attached to the end of the housing 951A on the upstream side in the first moving direction Z1 and on the first frame plate 911 side.
- the opening/closing plate 97 attached to the end portion of the housing 951A on the upstream side in the first movement direction Z1 and on the first frame plate 911 side.
- the first opening 911A formed in the first frame plate 911 can be reliably closed. This makes it possible to accurately restrict access to the wafer stage 10 through the pallet container 95 when the pallet container 95 is arranged at the second position.
- a wafer supply device is a device that supplies a wafer divided into a plurality of parts to a predetermined part extraction work position.
- This wafer feeder includes a first frame plate having a first opening facing the component picking work position, and a second opening facing the side opposite to the component picking work position. a second frame plate formed with a second frame plate defining an internal space between the first frame plate and the second frame plate communicating with the first opening and the second opening;
- a wafer container configured to accommodate the wafer and arranged in the internal space, and movement of the wafer through the first opening between the wafer container and the component extraction work position is permitted.
- the first opening is provided in the internal space so as to be movable in conjunction with the movement of the wafer container, and when the wafer container is placed at the first position, the entire first opening is opened. an opening/closing plate that closes the entire first opening when the is arranged at the second position.
- the device main body has the first opening facing the component extraction work position side and the second opening facing the side opposite to the component extraction work position side.
- the moving mechanism moves the wafer accommodated in the wafer container through a first position where movement through the first opening of the wafer between the wafer container and the component extraction work position is permitted, and through the second opening of the wafer contained in the wafer container.
- the wafer container is moved to and from a second position where the exchange is allowed.
- the opening/closing plate can be moved in conjunction with the movement of the wafer container by the moving mechanism.
- the opening/closing plate opens the entire first opening when the wafer container is placed at the first position. Accordingly, in a state where the wafer container is arranged at the first position, it is possible to supply wafers from the wafer container to the component extraction work position through the first opening. On the other hand, when the wafer container is placed at the second position, the opening/closing plate closes the entire first opening. Thus, in the state where the wafer container is placed at the second position, communication from the wafer container to the component extraction work position through the first opening is made by the open/close plate over the entire first opening. can be blocked. Therefore, in the state where the wafer container is arranged at the second position, access to the component extraction work position through the wafer container can be properly restricted.
- the opening/closing plate may be attached to an end portion of the wafer container on the upstream side in the first moving direction and on the side of the first frame plate.
- the opening/closing plate that can be moved in conjunction with the movement of the wafer container by the movement mechanism.
- the location of the wafer container to which the opening/closing plate is attached is the upstream side in the first movement direction from the first position to the second position, and the end of the first frame plate side where the first opening is formed. Department. Therefore, when the wafer container is placed at the second position downstream of the first position in the first moving direction, the edge of the wafer container on the upstream side in the first moving direction and on the first frame plate side
- the first opening formed in the first frame plate can be reliably closed by the opening/closing plate attached to the portion. This makes it possible to more accurately restrict access to the component extraction work position through the wafer container in a state where the wafer container is arranged at the second position.
- the first opening and the second opening are formed so as not to overlap when viewed from a direction perpendicular to the first moving direction and the second moving direction. There may be.
- the communication from the wafer container to the component picking work position through the first opening is controlled by the first opening.
- the opening/closing plate can be more reliably shut off by the opening/closing plate over the entire area. Therefore, in a state in which the wafer container is arranged at the second position, access to the component extraction work position through the wafer container can be restricted more accurately.
- the wafer container is disposed so as to form a predetermined gap between the wafer container and the first frame plate in the internal space, and a container body for containing the wafer; a movement restricting posture provided so as to protrude toward the first frame plate within the range of the gap with respect to the housing main body and restricting movement of the wafer from the housing main body toward the first frame plate; and a wafer movement control member capable of changing the attitude between the movement-permitting attitude and the movement-permitting attitude.
- the opening/closing plate includes a protruding portion that protrudes toward the first frame plate within the range of the gap from an end portion of the accommodation body on the upstream side in the first moving direction and on the side of the first frame plate; and an extension extending from the protrusion to enable the first opening to be fully opened or closed.
- the wafer movement control member is provided using the gap formed between the housing main body of the wafer housing body and the first frame plate.
- the wafer movement control member When the wafer movement control member is in the movement permitting posture, the wafer is permitted to move from the holding body toward the first frame plate. In this case, it is possible to supply wafers through the first opening from the housing main body to the component picking work position.
- the wafer movement control member takes the movement restricting posture, movement of the wafer from the accommodation body toward the first frame plate is restricted. In this case, for example, when the wafer container is moved by the moving mechanism or when the wafer container is placed at the second position, it is possible to prevent the wafers from jumping out of the container body toward the first frame plate.
- the wafer container includes a wafer movement control member
- a gap is formed between the container body and the first frame plate as described above. Since this gap is formed between the accommodation body and the first frame plate, the first opening formed in the first frame plate communicates with the gap. Therefore, when the wafer container is placed at the second position, the container main body and the component extraction work position communicate with each other through the gap and the first opening. In this case, in order to restrict access to the component extraction work position through the accommodation body, it is necessary to block communication from the accommodation body to the component extraction work position through the gap and the first opening.
- the opening/closing plate is configured to include a projecting portion and an extending portion.
- the protruding portion of the opening/closing plate protrudes toward the first frame plate within the range of the gap from the end portion of the accommodation body on the upstream side in the first moving direction and on the side of the first frame plate. Accordingly, in a state where the wafer container is arranged at the second position downstream of the first position in the first movement direction, from the end portion of the container main body on the upstream side in the first movement direction and the first frame plate side, Communication between the gap and the first opening can be interrupted by the protrusion projecting toward the first frame plate within the gap.
- the extending portion of the opening/closing plate extends from the projecting portion so as to be able to open or close the entire first opening.
- the first opening can be closed by the extending portion when the wafer container is arranged at the second position. That is, in a state where the wafer container is arranged at the second position, the projecting portion blocks the communication between the gap between the container body and the first frame plate and the first opening, and the extending portion blocks the first opening. Close the opening. This makes it possible to accurately restrict access to the component extraction work position through the container body in a state where the wafer container is arranged at the second position.
- the opening/closing plate is composed of a member having an L-shaped cross section in which the projecting portion and the extending portion are integrated.
- the above-described wafer supply device is a mechanism for detecting movement of the wafer from the storage main body toward the first frame plate, and the wafer is moved in the first movement direction and the second movement direction within the range of the gap.
- the configuration may further comprise a wafer detection mechanism composed of a light emitting section and a light receiving section arranged opposite to each other on the extending optical path.
- the projecting portion of the opening/closing plate has a light passage hole that allows light to pass from the light emitting portion to the light receiving portion by opening the optical path.
- a light passage hole that opens the optical path of the wafer detection mechanism is formed in the protruding portion of the opening/closing plate that protrudes within the range of the gap between the accommodation body and the first frame plate. As a result, it is possible to prevent the opening/closing plate from interfering with the detection of the wafer by the wafer detection mechanism.
- the device body may include a door for opening and closing the second opening.
- the wafer supply device includes a door switch that outputs a door open request signal when an operation requesting opening of the door body is received, and the moving mechanism based on the signal output from the door switch. and a movement control unit for controlling.
- the movement control unit moves the wafer container toward the second position and arranges the wafer container at the second position. Controls the movement mechanism.
- the movement control section controls the movement mechanism based on the output signal of the door switch regarding the opening and closing of the second opening in the door of the apparatus main body.
- the movement control unit moves to the second position corresponding to the second opening provided with the door.
- the moving mechanism is controlled so that the wafer container is arranged.
- the wafer container is placed at the second position.
- the wafers contained in the wafer container can be exchanged through the second opening by opening the door. In this case, access to the component extraction work position through the wafer container is properly regulated by the opening/closing plate.
- the device body may include a door for opening and closing the second opening.
- the wafer supply device includes a door switch that outputs a door closing signal when the door is closed, and a movement control section that controls the movement mechanism based on the signal output from the door switch. , is further provided.
- the movement control unit controls the movement so that the wafer container moves toward the first position and is arranged at the first position. control the mechanism.
- the movement control unit moves to the first position corresponding to the first opening facing the component picking work position.
- the moving mechanism is controlled so that the wafer container is placed in the position.
- the wafer container is arranged at the first position.
- the first opening is opened by the opening/closing plate. Therefore, it is possible to supply wafers from the wafer container to the component extraction work position through the first opening.
- the above-described wafer supply device includes: a container detection mechanism that outputs a container detection signal when detecting that the wafer container is arranged at the second position; a door lock mechanism for maintaining a closed state; and a door configured to release the closed state of the door by the door lock mechanism when the container detection signal is output from the container detection mechanism.
- a lock control unit that controls the lock mechanism may be further provided.
- the lock control unit when the container detection signal indicating the detection result that the wafer container is placed at the second position is output from the container detection mechanism, the lock control unit causes the lock mechanism to close the door.
- the lock mechanism is controlled so that the locked state that maintains is released.
- the closed state of the door is released only when the wafer container is located at the second position. That is, in a state in which the opening/closing plate closes the entire first opening in response to the wafer container being placed at the second position, the door is released from being maintained in the closed state. Therefore, the door can be opened only when the wafer container is placed at the second position and the first opening is closed by the opening/closing plate.
- the above-described wafer supply device may further include a door detection mechanism that outputs a door open detection signal when it detects that the door has been opened.
- the moving mechanism includes a driving motor that generates a driving force for moving the wafer container, and the movement control unit controls the driving motor when the door open detection signal is output from the door detection mechanism. stop driving.
- the movement control unit stops driving the drive motor of the movement mechanism. Therefore, it is possible to restrict the movement of the wafer container while the door is open.
- a component transfer apparatus includes the above-described wafer supply apparatus that supplies a wafer divided into a plurality of components to a predetermined component extraction work position, and the wafer supplied to the component extraction work position. a component transfer unit that takes out the component from the wafer and transfers it to a predetermined component transfer unit.
- the present invention it is possible to provide a wafer supply device and a component transfer device having the wafer supply device capable of accurately regulating access to the component extraction work position through the wafer container. can be done.
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
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Abstract
Description
図1に示されるように、本実施形態に係る部品実装装置1は、ウェハ7からダイシングされたダイ7a(部品)を基板P(所定の部品移載部)に実装する装置である。図1及び図2に示されるように、部品実装装置1は、基台2、コンベア3、ヘッドユニット4(部品移載ユニット)、部品供給部5、ウェハ供給装置6、カメラユニット32U及び突き上げユニット40を含む。
図1に加えて図3~図8を参照しながら、ウェハ供給装置6の構成を詳細に説明する。ウェハ供給装置6は、ウェハ収納エレベータ9と、ウェハステージ10と、ウェハコンベア11とを備える。ウェハ収納エレベータ9は、ウェハ7が貼着されたウェハシート8aをパレット8に保持した状態で、Z方向に多段に収納している。ウェハステージ10は、ウェハ収納エレベータ9の-Y側の位置において、基台2上に設置されている。基板Pの停止位置となる前記実装作業位置に対して、ウェハステージ10は+Y側に並ぶ位置に配置されている。本実施形態では、複数個のダイ7aに分割されたウェハ7が基台2上で配置されるエリアとなるウェハステージ10が、ウェハ供給装置6によりパレット8を供給する対象の部品取出作業位置となる。ウェハコンベア11は、ウェハ収納エレベータ9からウェハステージ10上にパレット8を引き出す、或いは、ウェハステージ10上のパレット8をウェハ収納エレベータ9に戻す。
次に、図9のブロック図を参照しながら、ウェハ供給装置6の制御構成について説明する。ウェハ供給装置6は、ウェハコンベア11及びウェハ収納エレベータ9の動作を制御する制御部6Cを備えている。制御部6Cは、例えば制御プログラムを記憶するROM(Read Only Memory)や一時的にデータを記憶するフラッシュメモリ等の記憶装置が内蔵されたマイクロコンピュータからなる。制御部6Cは、前記制御プログラムが読み出されることにより、ウェハコンベア11及びウェハ収納エレベータ9の動作を制御する。制御部6Cは、例えば装置本体91における第5フレーム板915上に配置される(図5参照)。制御部6Cは、機能構成として、コンベア制御部11Cとエレベータ制御部9Cとを含む。
次に、図10~図13と、図14のフローチャートを参照しながら、ウェハ供給装置6によるパレット8の供給及び回収の処理を示すパレット供給回収処理について説明する。
以上、本発明の実施形態に係る部品実装装置1に備えられるウェハ供給装置6について説明したが、本発明はこれに限定されるものではなく、例えば次のような変形実施形態を採用することができる。
Claims (11)
- 複数の部品に分割されたウェハを所定の部品取出作業位置に供給するウェハ供給装置であって、
前記部品取出作業位置側を向いて開口する第1開口部が形成された第1フレーム板と、前記部品取出作業位置側とは反対側を向いて開口する第2開口部が形成された第2フレーム板とを含み、前記第1フレーム板と前記第2フレーム板との間に前記第1開口部及び前記第2開口部に連通する内部空間を規定する装置本体と、
前記ウェハを収容可能に構成され、前記内部空間内に配置されるウェハ収容体と、
前記ウェハ収容体と前記部品取出作業位置との間における前記ウェハの前記第1開口部を介した移動が許容される第1位置と、前記ウェハ収容体に収容された前記ウェハの前記第2開口部を介した交換が許容される第2位置との間において、前記第1位置から前記第2位置に向かう第1移動方向へ前記ウェハ収容体を移動させるとともに、前記第2位置から前記第1位置に向かう第2移動方向へ前記ウェハ収容体を移動させる移動機構と、
前記移動機構による前記ウェハ収容体の移動に連動した移動が可能となるように前記内部空間内に設けられ、前記ウェハ収容体が前記第1位置に配置された状態では前記第1開口部の全体を開放する一方、前記ウェハ収容体が前記第2位置に配置された状態では前記第1開口部の全体を閉鎖する開閉板と、を備えるウェハ供給装置。 - 前記開閉板は、前記ウェハ収容体における前記第1移動方向の上流側且つ前記第1フレーム板側の端部に取付けられている、請求項1に記載のウェハ供給装置。
- 前記第1開口部と前記第2開口部とは、前記第1移動方向及び前記第2移動方向と直交する方向から見る視点において重ならないように形成されている、請求項2に記載のウェハ供給装置。
- 前記ウェハ収容体は、
前記内部空間内において前記第1フレーム板との間に所定の間隙が形成されるように配置され、前記ウェハを収容するための収容本体と、
前記収容本体に対して前記間隙の範囲内で前記第1フレーム板側に突出して設けられ、前記収容本体からの前記ウェハの前記第1フレーム板側への移動を規制する移動規制姿勢と当該移動を許容する移動許容姿勢との間の姿勢変更が可能なウェハ移動制御部材と、を含み、
前記開閉板は、
前記収容本体における前記第1移動方向の上流側且つ前記第1フレーム板側の端部から前記間隙の範囲内で前記第1フレーム板側に突出する突出部と、
前記第1開口部の全体を開放又は閉鎖することが可能となるように、前記突出部から延びる延出部と、を含む、請求項1~3のいずれか1項に記載のウェハ供給装置。 - 前記開閉板は、前記突出部と前記延出部とが一体の、断面形状がL型の部材から構成されている、請求項4に記載のウェハ供給装置。
- 前記ウェハ供給装置は、前記収容本体からの前記ウェハの前記第1フレーム板側への移動を検知する機構であって、前記間隙の範囲内で前記第1移動方向及び前記第2移動方向に延びる光路上に互いに対向配置される発光部及び受光部により構成されるウェハ検知機構を、更に備え、
前記開閉板の前記突出部は、前記光路を開放することで前記発光部から前記受光部への光の通過を許容する光通過孔を有している、請求項4又は5に記載のウェハ供給装置。 - 前記装置本体は、前記第2開口部を開閉するための扉体を含み、
前記ウェハ供給装置は、前記扉体の開放を要求する操作を受付けた場合には扉開放要求信号を出力する扉スイッチと、前記扉スイッチから出力される信号に基づいて前記移動機構を制御する移動制御部と、を更に備え、
前記移動制御部は、前記扉スイッチから前記扉開放要求信号が出力された場合、前記ウェハ収容体が前記第2位置に向けて移動して当該第2位置に配置されるように、前記移動機構を制御する、請求項1~6のいずれか1項に記載のウェハ供給装置。 - 前記装置本体は、前記第2開口部を開閉するための扉体を含み、
前記ウェハ供給装置は、前記扉体が閉鎖された場合には扉閉鎖信号を出力する扉スイッチと、前記扉スイッチから出力される信号に基づいて前記移動機構を制御する移動制御部と、を更に備え、
前記移動制御部は、前記扉スイッチから前記扉閉鎖信号が出力された場合、前記ウェハ収容体が前記第1位置に向けて移動して当該第1位置に配置されるように、前記移動機構を制御する、請求項1~7のいずれか1項に記載のウェハ供給装置。 - 前記ウェハ供給装置は、
前記ウェハ収容体が前記第2位置に配置されていることを検知した場合に収容体検知信号を出力する収容体検知機構と、
前記扉体が前記第2開口部を閉鎖した状態を維持する扉ロック機構と、
前記収容体検知機構から前記収容体検知信号が出力された場合、前記扉ロック機構による前記扉体の閉鎖状態の維持が解除されるように、前記扉ロック機構を制御するロック制御部と、を更に備える、請求項7又は8に記載のウェハ供給装置。 - 前記ウェハ供給装置は、前記扉体が開放されたことを検知した場合に扉開放検知信号を出力する扉検知機構を更に備え、
前記移動機構は、前記ウェハ収容体を移動させるための駆動力を発する駆動モータを含み、
前記移動制御部は、前記扉検知機構から前記扉開放検知信号が出力された場合、前記駆動モータの駆動を停止させる、請求項7~9のいずれか1項に記載のウェハ供給装置。 - 複数の部品に分割されたウェハを所定の部品取出作業位置に供給する、請求項1~10のいずれか1項に記載のウェハ供給装置と、
前記部品取出作業位置に供給された前記ウェハから前記部品を取出して所定の部品移載部に移載する部品移載ユニットと、を備える部品移載装置。
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JPH0837396A (ja) * | 1994-07-26 | 1996-02-06 | Matsushita Electric Ind Co Ltd | 部品供給装置 |
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JP2019029499A (ja) * | 2017-07-28 | 2019-02-21 | ヤマハ発動機株式会社 | 部品供給装置及び部品実装装置 |
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WO2021033461A1 (ja) * | 2019-08-20 | 2021-02-25 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法、プログラムおよび記録媒体 |
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JPH0837396A (ja) * | 1994-07-26 | 1996-02-06 | Matsushita Electric Ind Co Ltd | 部品供給装置 |
JP4322863B2 (ja) * | 2005-11-25 | 2009-09-02 | 株式会社日立ハイテクインスツルメンツ | 部品供給装置 |
WO2014049820A1 (ja) * | 2012-09-28 | 2014-04-03 | 富士機械製造株式会社 | 部品供給装置 |
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JP2019029499A (ja) * | 2017-07-28 | 2019-02-21 | ヤマハ発動機株式会社 | 部品供給装置及び部品実装装置 |
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