WO2022233028A1 - 膨胀石墨热界面材料及其制备方法 - Google Patents
膨胀石墨热界面材料及其制备方法 Download PDFInfo
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- WO2022233028A1 WO2022233028A1 PCT/CN2021/092121 CN2021092121W WO2022233028A1 WO 2022233028 A1 WO2022233028 A1 WO 2022233028A1 CN 2021092121 W CN2021092121 W CN 2021092121W WO 2022233028 A1 WO2022233028 A1 WO 2022233028A1
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- expanded graphite
- thermal interface
- interface material
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 145
- 229910002804 graphite Inorganic materials 0.000 title claims abstract description 144
- 239000010439 graphite Substances 0.000 title claims abstract description 144
- 239000000463 material Substances 0.000 title claims abstract description 32
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 18
- 229920000098 polyolefin Polymers 0.000 claims abstract description 18
- 238000001764 infiltration Methods 0.000 claims abstract description 6
- 230000008595 infiltration Effects 0.000 claims abstract description 6
- 230000002687 intercalation Effects 0.000 claims abstract description 3
- 238000009830 intercalation Methods 0.000 claims abstract description 3
- 230000003647 oxidation Effects 0.000 claims abstract description 3
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 3
- 239000002994 raw material Substances 0.000 claims abstract description 3
- 238000004381 surface treatment Methods 0.000 claims abstract description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 24
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 16
- 239000008367 deionised water Substances 0.000 claims description 16
- 229910021641 deionized water Inorganic materials 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 14
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 12
- 239000011259 mixed solution Substances 0.000 claims description 11
- 238000011049 filling Methods 0.000 claims description 8
- 230000007935 neutral effect Effects 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 239000000243 solution Substances 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 4
- 230000007062 hydrolysis Effects 0.000 claims description 4
- 238000006460 hydrolysis reaction Methods 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 3
- 230000003301 hydrolyzing effect Effects 0.000 claims description 2
- 239000007800 oxidant agent Substances 0.000 claims description 2
- 230000035484 reaction time Effects 0.000 claims 1
- 239000002131 composite material Substances 0.000 abstract description 18
- 239000006185 dispersion Substances 0.000 abstract description 2
- 238000002474 experimental method Methods 0.000 abstract description 2
- 230000008569 process Effects 0.000 abstract description 2
- 239000000945 filler Substances 0.000 description 12
- 229920000642 polymer Polymers 0.000 description 7
- 238000011068 loading method Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229920001940 conductive polymer Polymers 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
Definitions
- the invention belongs to the technical field of inorganic non-metallic materials, and in particular relates to an expanded graphite thermal interface material and a preparation method thereof.
- High thermal conductivity polymer composites are key materials for solving heat dissipation problems in electronic applications.
- various fillers are used.
- polymers with high thermal conductivity are prepared by increasing filler loading, but high filler loading will deteriorate the mechanical properties and processability of the polymer matrix, limiting its application.
- the preparation of thermally conductive polymers with low loadings remains a great challenge.
- a great deal of work has been done on tuning the orientation of fillers, constructing continuous thermal conduction pathways to improve thermal conductivity enhancement efficiency, and synthesizing polymer composites with low filler loadings.
- 2D fillers such as graphene
- K ⁇ in-plane thermal conductivity
- K ⁇ through-plane thermal conductivity
- the preparation of polymer composites is more difficult due to the horizontal orientation of 2D filled materials during processing.
- the orientation of the fillers is tuned by building three-dimensional (3D) filler networks, adding external magnetic/electric fields, or complex processing techniques, and building through-plane thermal conduction paths in the polymer matrix.
- 3D three-dimensional
- thermal conductive fillers of common thermal interface materials whether they are metal powders or ceramic particles, have dispersibility problems, and the filling amount is relatively large, most of which are above 60% (mass fraction).
- the problem brought about by poor dispersibility is that the filler particles cannot be effectively contacted, and heat conduction paths cannot be constructed, resulting in poor thermal conductivity.
- the purpose of the present invention is to provide an expanded graphite thermal interface material and a preparation method thereof.
- the present invention provides a preparation method of an expanded graphite thermal interface material, comprising the following steps:
- the raw material for preparing expanded graphite in step 1) is graphite film.
- step 1) is specifically as follows: the graphite film is placed in a mold with a cover plate above, and then any proportion of concentrated sulfuric acid and hydrogen peroxide are added, and the two oxidizing agents oxidize and intercalate the graphite film into expandable graphite.
- the position of the cover plate above the mold is used to control the expansion multiple, thereby obtaining expandable graphite of different densities; after that, the expandable graphite is repeatedly cleaned until the cleaning liquid is neutral, and the cleaned expandable graphite is dried to obtain expanded graphite.
- step 2) is specifically as follows: adding the silane coupling agent to the mixed solution of deionized water and absolute ethanol, and hydrolyzing it for a period of time at a certain temperature to obtain a hydrolyzed solution of the silane coupling agent; soaking the expanded graphite in the silane coupling agent In the joint agent hydrolyzate, the modified expanded graphite is obtained by reacting at a certain temperature for a period of time.
- volume ratio of deionized water and absolute ethanol in the mixed solution of deionized water and absolute ethanol is 0.2-0.33.
- the temperature of the hydrolysis is 70-90° C., and the time of the hydrolysis is 15-20 h.
- the temperature at which the expanded graphite is soaked in the hydrolyzed solution of the silane coupling agent for reaction is 70-90° C., and the time for the reaction is 2-6 h.
- step of cleaning and drying is also included after the reaction is finished.
- step 3) is specifically: placing the modified expanded graphite in a container, then adding a mixed solution of polyolefin and acetone, vacuuming, so that the polyolefin fully infiltrates the expanded graphite, and then solidified at high temperature to obtain the expanded graphite thermal interface material .
- the mass filling amount of the expanded graphite in the expanded graphite thermal interface material is 10%-50%.
- the high temperature curing temperature is 120-150° C.
- the high temperature curing time is 6-8 h.
- the present invention provides an expanded graphite thermal interface material, which is prepared by any one of the above-mentioned preparation methods for an expanded graphite thermal interface material.
- the beneficial effects of the present invention are as follows: 1) The present invention adopts a novel and simple constrained expansion method to prepare highly oriented constrained expanded graphite. Utilizing the boundary confinement of the vessel during expansion, expanded graphite can spontaneously orient in one direction and establish a continuous thermal conduction path inside, which is of great benefit for the preparation of anisotropic composites and low filler loading.
- the use of bulk expanded graphite as a filler can disregard the problem of dispersibility, and the bulk expanded graphite is internally connected, and the preparation process is simple, which is convenient to control the internal communication density.
- expanded graphite is made from graphite film expansion, and its internal network is well connected, which is conducive to heat conduction, and in the process of preparing composite materials, due to the overall infiltration of polyolefin, there is no problem of poor dispersion performance.
- the expansion ratio of expanded graphite can be adjusted during the preparation process, which is convenient for experiments.
- the polyolefin is more uniformly distributed on the surface of the expanded graphite, so that the infiltration amount of the polyolefin can be controlled.
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Carbon And Carbon Compounds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
一种膨胀石墨热界面材料及其制备方法，制备方法包括以下步骤：1)以石墨膜为原料采用氧化插层法制备膨胀石墨；2)使用硅烷偶联剂对膨胀石墨进行表面处理得到改性膨胀石墨；3)将聚烯烃以真空浸润的方式充分浸润改性膨胀石墨得到所述膨胀石墨热界面材料。首先，膨胀石墨是由石墨膜膨胀制得，本身内部网络连通较好，有利于热传导，且在制备复合材料的过程中由于整体浸润聚烯烃，不存在分散性能不好的问题。其次，膨胀石墨在制备过程中膨胀倍数可调节，方便实验进行。再次，通过对块状膨胀石墨整体改性，聚烯烃在膨胀石墨表面分布更均匀，达到聚烯烃浸润量可控的目的。
Description
本发明属于无机非金属材料技术领域，具体涉及一种膨胀石墨热界面材料及其制备方法。
电子器件的快速发展对散热提出了更高的要求。高热导聚合物复合材料是解决电子应用中出现的散热问题的关键材料。为了提高聚合物的热性能，各种各样的填料被使用。通常，高导热的聚合物都是通过增加填料负载来制备的，但高填料负载会恶化聚合物基体的力学性能和加工性能，限制其应用。制备低填充量的导热聚合物仍然是一个巨大的挑战。目前，在调整填料的取向、构建连续导热途径以提高导热增强效率和合成低填料载量的聚合物复合材料方面已经做了大量的工作。二维填充物，如石墨烯，倾向于通过简单的处理水平方向，因此最终的复合材料通常显示出较高的平面内热导率(K
∥)，但通过平面热导率有限(K
⊥)。然而，由于二维填充材料在加工过程中的水平方向倾向，制备高分子复合材料更加困难。通常，通过构建三维(3D)填料网络、增加外磁场/电场或复杂的加工工艺来调整填料的取向，并在聚合物基体中构建贯穿平面的热传导通路。然而，这些方法也存在时间/能量消耗问题，对实际应用具有很高的挑战性。为了合成具有较低填充量的各向异性导热聚合物复合材料，迫切需要一种有效而简便的方法来调整填料的取向和提高热导率。
此外，常见的热界面材料的导热填料不论是金属粉体还是陶瓷颗粒，均存在分散性问题，且填充量较大，大部分在60％(质量分数)以上。分散性不好带来的问题就是，填料颗粒之间不能有效接触，无法构建导热通路，从而造成导热性能不佳的结果。
发明内容
为了解决上述背景技术中所提出的技术问题，本发明的目的在于提供一种膨胀石墨热界面材料及其制备方法。
为了达到上述目的，本发明所采用的技术方案为：一方面，本发明提供了一种膨胀石墨热界面材料的制备方法，包括以下步骤：
1)以氧化插层法制备膨胀石墨；
2)使用硅烷偶联剂对膨胀石墨进行表面处理得到改性膨胀石墨；
3)将聚烯烃以真空浸润的方式充分浸润改性膨胀石墨得到所述膨胀石墨热界面材料。
进一步地，步骤1)中制备膨胀石墨的原料为石墨膜。
进一步地，步骤1)具体为：将石墨膜放置在上方有盖板的模具中，然后加入任意比例的浓硫酸和过氧化氢，两种氧化剂将石墨膜氧化插层为可膨胀石墨，通过调节模具上方盖板的位置来控制膨胀倍数，进而得到不同密度的可膨胀石墨；之后反复清洗可膨胀石墨，直至清洗液为中性，将清洗过后的可膨胀石墨烘干得到膨胀石墨。
进一步地，步骤2)具体为：将硅烷偶联剂加入去离子水和无水乙醇的混合溶液中，在一定温度下水解一段时间，得到硅烷偶联剂水解液；将膨胀石墨浸泡在硅烷偶联剂水解液中，在一定温度下反应一段时间得到改性膨胀石墨。
进一步地，所述去离子水和无水乙醇的混合溶液中去离子水和无水乙醇的体积比为0.2-0.33。
进一步地，所述水解的温度为70-90℃，所述水解的时间为15-20h。
进一步地，所述膨胀石墨浸泡在硅烷偶联剂水解液中反应的温度为70-90℃，所述反应的时间为2-6h。
进一步地，所述反应结束后还包括清洗烘干的步骤。
进一步地，步骤3)具体为：将改性膨胀石墨放置在容器中，然后加入聚烯烃和丙酮的混合溶液，抽真空处理，使得聚烯烃充分浸润膨胀石墨，之后高温固化得到膨胀石墨热界面材料。
进一步地，所述膨胀石墨热界面材料中膨胀石墨质量填充量在10％-50％。
进一步地，所述高温固化的温度为120-150℃，高温固化的时间为6-8h。
另一方面，本发明提供了一种膨胀石墨热界面材料，由上述任一所述的膨胀石墨热界面材料的制备方法制备得到。
本发明的有益效果为：1)本发明采用一种新的、简便的约束膨胀法制备了高定向约束膨胀石墨。在扩张过程中利用容器的边界限制，膨胀石墨可以自发地沿一个方向定向，并在内部建立了一个连续的热传导通路，这对制备各向异性复合材料和低填料负载有很大的好处。
2)本发明采用块状膨胀石墨作为填料可以不考虑分散性问题，且块状膨胀石墨内部联通，且制备过程简单，便于控制内部联通密度。
3)首先，膨胀石墨是由石墨膜膨胀制得，本身内部网络连通较好，有利于热传导，且在制备复合材料的过程中由于整体浸润聚烯烃，不存在分散性能不好的问题。其次，膨胀石墨在制备过程中膨胀倍数可调节，方便实验进行。再次，通过对块状膨胀石墨整体改性，聚烯烃在膨胀石墨表面分布更均匀，达到聚烯烃浸润量可控的目的。
为了更好地理解本发明的内容，下面结合具体实施方法对本发明内容作进一步说明，但本发明的保护内容不局限以下实施例。
实施例1
选取10张单张厚度为25μm，10×10cm的石墨膜，共3.76g；将石墨膜平铺于模具底部，先加入过氧化氢后加入浓硫酸，其中过氧化氢和浓硫酸的体积比为1：5；石墨膜迅速膨胀为可膨胀石墨，通过调节玻璃盖板的位置来调整石墨膜的膨胀倍数为400倍；去离子水清洗可膨胀石墨至中性，将中性可膨胀石墨高温烘干，得膨胀石墨；0.5g硅烷偶联剂水解于去离子水和无水乙醇体积比为0.2的混合溶液中，80℃、20h；将400倍的膨胀石墨切成4×4×4cm的膨胀石墨块浸泡在硅烷偶联剂水解液中，80℃、4h，之后无水乙醇清洗4-7次；将表面处理过的膨胀石墨低温烘干，真空浸润在30g聚烯烃和丙酮混合液中，高温固化得复合材料；将复合材料切割成标准大小，得膨胀石墨质量填充量为11.13％的导热垫片。
实施例2
选取20张单张厚度为25μm，10×10cm的石墨膜，共7.52g；将石墨膜平铺于模具底部，先加入过氧化氢后加入浓硫酸，其中过氧化氢和浓硫酸的体积比为1：4；石墨膜迅速膨胀为可膨胀石墨，通过调节玻璃盖板的位置来调整石墨膜的膨胀倍数为400倍；去离子水清洗可膨胀石墨至中性，将中性可膨胀石墨高温烘干，得膨胀石墨；0.5g硅烷偶联剂水解于去离子水和无水乙醇体积比为0.25的混合溶液中，80℃、20h；将400倍的膨胀石墨切成4×4×4cm的膨胀石墨块浸泡在硅烷偶联剂水解液中，80℃、4h，之后无水乙醇清洗4-7次；将表面处理过的膨胀石墨低温烘干，真空浸润在24g聚烯烃和丙酮混合液中，高温固化得复合材料；将复合材料切割成标准大小，得膨胀石墨质量填充量为23.84％的导热垫片。
实施例3
选取20张单张厚度为40μm，10×10cm的石墨膜，共9.14g；将石墨膜平铺于模具底部，先加入过氧化氢后加入浓硫酸，其中过氧化氢和浓硫酸的体积比为1：4；石墨膜迅速膨胀为可膨胀石墨，通过调节玻璃盖板的位置来调整石墨膜的膨胀倍数为500倍；去离子水清洗可膨胀石墨至中性，将中性可膨胀石墨高温烘干，得膨胀石墨；0.5g硅烷偶联剂水解于去离子水和无水乙醇体积比为0.28的混合溶液中，80℃、20h；将500倍的膨胀石墨切成4×4×4cm的膨胀石墨块浸泡在硅烷偶联剂水解液中，80℃、4h，之后无水乙醇清洗4-7次；将表面处理过的膨胀石墨低温烘干，真空浸润在30g聚烯烃和丙酮混合液中，高温固化得复合材料；将复合材料切割成标准大小，得膨胀石墨质量填充量为23.32％的导热垫片。
实施例4
选取30张单张厚度为60μm，10×10cm的石墨膜，共14.61g；将石墨膜平铺于模具底部，先加入过氧化氢后加入浓硫酸，其中过氧化氢和浓硫酸的体积比为1：5；石墨膜迅速膨胀为可膨胀石墨，通过调节玻璃盖板的位置来调整石墨膜的膨胀倍数为400倍；去离子水清洗可膨胀石墨至中性，将中性可膨胀石墨高温烘干，得膨胀石墨；0.5g硅烷偶联剂水解于去离子水和无水乙醇体积比为0.2的混合溶液中，80℃、20h；将400倍的膨胀石墨切成4×4×4cm的膨胀石墨块浸泡在硅烷偶联剂水解液中，80℃、4h，之后无水乙醇清洗4-7次；将表面处理过的膨胀石墨低温烘干，真空浸润在25g聚烯烃和丙酮混合液中，高温固化得复合材料；将复合材料切割成标准大小，得膨胀石墨质量填充量为49.34％的导热垫片。
实施例5
选取30张单张厚度为60μm，10×10cm的石墨膜，共14.61g；将石墨膜平铺于模具底部，先加入过氧化氢后加入浓硫酸，其中过氧化氢和浓硫酸的体积比为1：4.5；石墨膜迅速膨胀为可膨胀石墨，通过调节玻璃盖板的位置来调整石墨膜的膨胀倍数为500倍；去离子水清洗可膨胀石墨至中性，将中性可膨胀石墨高温烘干，得膨胀石墨；0.5g硅烷偶联剂水解于去离子水和无水乙醇体积比为0.2的混合溶液中，80℃、20h；将500倍的膨胀石墨切成4×4×4cm的膨胀石墨块浸泡在硅烷偶联剂水解液中，80℃、4h，之后无水乙醇清洗4-7次；将表面处理过的膨胀石墨低温烘干，真空浸润在25g聚烯烃和丙酮混合液中，高温固化得复合材料；将复合材料切割成标准大小，得膨胀石墨质量填充量为49.34％的导热垫片。
以上所述仅为本发明的具体实施方式，不是全部的实施方式，本领域普通技术人员通过阅读本发明说明书而对本发明技术方案采取的任何等效的变换，均为本发明的权利要求所涵盖。
Claims (12)
- 一种膨胀石墨热界面材料的制备方法，其特征在于，包括以下步骤：1)以氧化插层法制备膨胀石墨；2)使用硅烷偶联剂对膨胀石墨进行表面处理得到改性膨胀石墨；3)将聚烯烃以真空浸润的方式充分浸润改性膨胀石墨得到所述膨胀石墨热界面材料。
- 根据权利要求1所述的膨胀石墨热界面材料的制备方法，其特征在于，步骤1)中制备膨胀石墨的原料为石墨膜。
- 根据权利要求2所述的膨胀石墨热界面材料的制备方法，其特征在于，步骤1)具体为：将石墨膜放置在上方有盖板的模具中，然后加入任意比例的浓硫酸和过氧化氢，两种氧化剂将石墨膜氧化插层为可膨胀石墨，通过调节模具上方盖板的位置来控制膨胀倍数，进而得到不同密度的可膨胀石墨；之后反复清洗可膨胀石墨，直至清洗液为中性，将清洗过后的可膨胀石墨烘干得到膨胀石墨。
- 根据权利要求1所述的膨胀石墨热界面材料的制备方法，其特征在于，步骤2)具体为：将硅烷偶联剂加入去离子水和无水乙醇的混合溶液中，在一定温度下水解一段时间，得到硅烷偶联剂水解液；将膨胀石墨浸泡在硅烷偶联剂水解液中，在一定温度下反应一段时间得到改性膨胀石墨。
- 根据权利要求4所述的膨胀石墨热界面材料的制备方法，其特征在于，所述去离子水和无水乙醇的混合溶液中去离子水和无水乙醇的体积比为0.2-0.33。
- 根据权利要求4所述的膨胀石墨热界面材料的制备方法，其特征在于，所述水解的反应温度为70-90℃，所述水解的时间为15-20h。
- 根据权利要求4所述的膨胀石墨热界面材料的制备方法，其特征在于，所述膨胀石墨浸泡在硅烷偶联剂水解液中反应的温度为70-90℃，所述反应的时间为2-6h。
- 根据权利要求4所述的膨胀石墨热界面材料的制备方法，其特征在于，所述反应结束后还包括清洗烘干的步骤。
- 根据权利要求1所述的膨胀石墨热界面材料的制备方法，其特征在于，步骤3)具体为：将改性膨胀石墨放置在容器中，然后加入聚烯烃和丙酮的混合溶液，抽真空处理，使得聚烯烃充分浸润膨胀石墨，之后高温固化得到膨胀石墨热界面材料。
- 根据权利要求9所述的膨胀石墨热界面材料的制备方法，其特征在于，所述膨胀石墨热界面材料中膨胀石墨质量填充量在10％-50％。
- 根据权利要求9所述的膨胀石墨热界面材料的制备方法，其特征在于，所述高温固化的温度为120-150℃，高温固化的时间为6-8h。
- 一种膨胀石墨热界面材料，其特征在于，由权利要求1-11任一项所述的膨胀石墨热界面材料的制备方法制备得到。
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