WO2022228239A1 - 中框及电子设备 - Google Patents

中框及电子设备 Download PDF

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Publication number
WO2022228239A1
WO2022228239A1 PCT/CN2022/087950 CN2022087950W WO2022228239A1 WO 2022228239 A1 WO2022228239 A1 WO 2022228239A1 CN 2022087950 W CN2022087950 W CN 2022087950W WO 2022228239 A1 WO2022228239 A1 WO 2022228239A1
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WO
WIPO (PCT)
Prior art keywords
groove
middle frame
side wall
recessed
bottom wall
Prior art date
Application number
PCT/CN2022/087950
Other languages
English (en)
French (fr)
Inventor
杨涛
张少辉
赵勇
霍国亮
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP22794710.8A priority Critical patent/EP4319113A1/en
Publication of WO2022228239A1 publication Critical patent/WO2022228239A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment

Definitions

  • the embodiments of the present application relate to the technical field of electronic devices, and in particular, to a middle frame and an electronic device.
  • the thickness of the whole machine is one of the key factors affecting the product's refinement.
  • the middle frame includes a flat portion and a concave portion recessed relative to the flat portion, and the groove of the concave portion is used to accommodate other components of the electronic device, so as to reduce the overall thickness of the electronic device.
  • the thickness of the flat portion is relatively thick, which affects the overall thickness of the electronic device.
  • Embodiments of the present application provide a middle frame and an electronic device including the middle frame.
  • the middle frame includes an integrally formed flat part and a concave part, the concave part is concave relative to the flat part to form a groove, and the thickness of the flat part is relatively thin.
  • the present application provides a middle frame.
  • the middle frame is prepared by die casting process.
  • the die-casting process is a casting method that fills the mold cavity with molten material at high speed under the action of high pressure, and solidifies the material under pressure to form a die-casting part.
  • the middle frame is prepared by a die-casting process, which not only reduces the cost of the middle frame, but also improves the efficiency of forming the middle frame.
  • the middle frame includes an integrally formed flat part and a first concave part.
  • the first recessed portion is recessed inward relative to the first surface of the flat portion to form a first groove.
  • the opening of the first groove is located on the first surface.
  • the first recess includes a bottom wall, a first side wall and a second side wall.
  • the orientation of the bottom wall is the same as the orientation of the first surface, the first side wall and the second side wall respectively intersect with the bottom wall, and the first side wall and the second side wall respectively connected.
  • the opening formed by the first side wall and the second side wall gradually becomes larger, and in the process of die-casting the middle frame, the first direction is parallel to the flow direction of the die-casting material .
  • the opening formed by the first side wall and the second side wall gradually becomes larger, and the direction of the opening is parallel to the material flowing in the middle frame during the die-casting process, and the material flows along the first side.
  • the side walls of the cavity corresponding to the wall and the second side wall are gradually dispersed, reducing the resistance to the material flow by the side walls of the cavity corresponding to the first side wall and the second side wall, and reducing the risk of cold material being easily generated by the slag discharge side. , to avoid the thickness of the flat part of the middle frame from being thick, which is beneficial to the overall thinning of the middle frame.
  • first side wall or the second side wall is perpendicular to the flow direction of the material, and the first side wall or the second side wall and the flow direction of the material are at an acute angle, the part of the first side wall or the second side wall is The structure deviates from the flow direction of the material, resulting in greater resistance to the flow of the material by the first side wall or the second side wall.
  • the angle formed by the first side wall and the second side wall is an acute angle.
  • the present application does not limit the specific angle formed by the first side wall and the second side wall.
  • the angle formed by the first side wall and the second side wall is less than or equal to 80 degrees.
  • the angle formed by the first side wall and the second side wall is an acute angle, and the angle formed by the first side wall and the second side wall is relatively small.
  • the flow resistance of the second side wall and the second side wall to the material is small, which further reduces the flow resistance of the material by the groove wall of the first groove, and is more conducive to reducing the thickness of the flat part.
  • the area of the bottom wall is larger, which increases the bonding area between the middle frame and the circuit board, thereby ensuring the stability of the bonding layer bonding the circuit board and the middle frame.
  • the angle formed by the first side wall and the second side wall is greater than or equal to 15 degrees, so as to avoid a small angle formed by the first side wall and the second side wall resulting in a small area of the bottom wall. It can be understood that the angle formed by the first side wall and the second side wall should not be too small nor too large.
  • the shape of the bottom wall includes a quadrangle or a triangle, or the like.
  • the shape of the bottom wall includes a prism or an equilateral triangle.
  • the shape of the bottom wall in the first direction, when the opening formed by the first side wall and the second side wall gradually becomes larger, the shape of the bottom wall may be a triangle or a parallelogram. In other embodiments, the bottom wall may also have other shapes, such as a pentagon or a hexagon, which is not limited in this application.
  • the first concave portion is concave relative to the flat portion to further form a second groove.
  • the opening of the second groove is in the same direction as the opening of the first groove.
  • the first groove is located in the second groove, and the groove depth of the first groove is greater than the groove depth of the second groove. The first groove and the second groove are used to accommodate different components in the electronic device.
  • the middle frame is provided with a first groove and a second groove, and the first groove is located in the second groove, and both the first groove and the second groove are used for accommodating components in the electronic device,
  • the overall thickness of the electronic device to which the middle frame is applied is made smaller.
  • the flat portion is provided with a second surface opposite to the first surface.
  • the first groove is recessed from a side of the first surface toward the second surface, and a side of the bottom wall facing away from the first surface is protruded relative to the second surface. It can be understood that when the groove depths of the first grooves are equal, when the side of the bottom wall of the first groove facing away from the first surface protrudes from the second surface, the bottom wall of the first groove is thicker.
  • the side of the bottom wall of the first groove facing away from the first surface protrudes from the second surface, which increases the thickness of the bottom wall of the first groove.
  • the mold cavity corresponding to the groove has a small resistance to flow, which reduces the risk of cold material being easily generated at the slag discharge side bone position, and avoids the thickness of the flat part of the formed middle frame being thicker, thereby helping to reduce the thickness of the flat part of the middle frame. thickness.
  • the middle frame includes a first plate, a second plate and a third plate connected in sequence, and the first plate, the second plate and the third plate are used to carry different components.
  • the second plate includes a first end portion and a second end portion disposed opposite to each other, the first end portion is connected to the second plate, the second end is connected to the third plate, and the second end is connected to the third plate.
  • a groove extends from the first end to the second end. Wherein, the number of the first grooves is multiple, and the plurality of the first grooves are arranged at intervals and are all located in the second grooves.
  • the plurality of first grooves are used to accommodate a plurality of adhesive layers in a one-to-one correspondence, and the plurality of adhesive layers are used for bonding with different parts of the first recessed portion, so as to improve the connection between the middle frame and the corresponding bonding member. stability.
  • the shapes of the plurality of first grooves may be the same or different, which is not limited in the present application.
  • the number of the first grooves is also not limited in this application.
  • the middle frame further includes a second concave portion.
  • the second concave portion and the flat portion are integrally formed, and the second concave portion is concave relative to the flat portion to form a third groove and a fourth groove.
  • Both the third groove and the fourth groove are recessed from the side of the first surface to the second surface, the fourth groove is located in the third groove, and the fourth groove The depth of the recess is greater than the depth of the recess of the third groove.
  • the middle frame is further provided with a second concave portion integrally formed with the flat portion.
  • the second concave portion is used for accommodating other components in the electronic device, such as connecting pieces, and the connecting pieces are accommodated in the middle frame so as to connect
  • the thickness of the parts and the middle frame is reused, which reduces the overall thickness of the electronic device.
  • the third groove and the second groove are staggered, and along the second direction, the fourth groove and the first groove are staggered; Wherein, the second direction is perpendicular to the first direction.
  • the fourth groove and the first groove are staggered in the first direction and the second direction, which reduces the overlapping area of the fourth groove and the first groove and avoids the middle frame during the molding process.
  • the mold cavity forms double or multiple obstructions to the material in the same direction, which reduces the risk of cold material on the slag discharge side bone position of the mold cavity, thereby further reducing the thickness of the flat part.
  • the shape of the fourth groove is the same as the shape of the first groove, and in the first direction, two adjacent side walls of the fourth groove The openings formed become progressively larger.
  • the bottom wall of the fourth groove and the bottom wall of the first groove are both prismatic.
  • the groove depth of the fourth groove is the same as that of the first groove, and the groove depth of the third groove is the same as that of the second groove.
  • the shape of the fourth groove is the same as that of the first groove, and the openings formed by the two adjacent side walls of the fourth groove gradually become larger, and the middle frame not only lowers during the die-casting process It reduces the flow resistance of the material by the cavity structure corresponding to the first recessed part, and also reduces the flow resistance of the material by the cavity structure corresponding to the second recessed part, further reducing the risk of cold material being easily generated in the bone position on the slag discharge side. It is more conducive to the thinning of the flat part.
  • the shape of the fourth groove may also be different from the shape of the first groove, which is not limited in the present application.
  • the bottom wall of the first groove is rhombic, and the bottom wall of the fourth groove is rectangular.
  • the present application also provides a middle frame.
  • the middle frame is prepared by die casting process.
  • the middle frame includes an integrally formed flat part and a first concave part, the first concave part is concave relative to the flat part to form a first groove, and the flat part is provided with a first surface and a concave part opposite to each other.
  • Second side The first surface faces the battery, the first groove is recessed from the side of the first surface toward the second surface, and the bottom wall of the first groove faces away from the side of the first surface Protruding relative to the second surface.
  • the side of the bottom wall of the first groove facing away from the first surface protrudes from the second surface, which increases the thickness of the bottom wall of the first groove.
  • the mold cavity corresponding to the groove has a small resistance to flow, which reduces the risk of cold material being easily generated at the slag discharge side bone position, and avoids the thickness of the flat part of the formed middle frame being thicker, thereby helping to reduce the thickness of the flat part of the middle frame. thickness.
  • the present application provides an electronic device.
  • An electronic device includes a battery and the middle frame according to any one of the first aspect or the second aspect, the battery being mounted on the middle frame.
  • the projection of the battery on the middle frame covers the flat part and the recessed part.
  • Batteries are used to provide power to various components inside electronic equipment. Exemplarily, the battery is carried in the middle area of the middle frame.
  • the electronic device further includes a circuit board and an adhesive layer.
  • the projected coverage of the circuit board on the middle frame at least partially overlaps the first recessed portion.
  • the adhesive layer is connected between the circuit board and the first recess, and the adhesive layer is accommodated in the first recess.
  • the adhesive layer is used to fix the circuit board to the middle frame.
  • the present application does not limit the material used for the adhesive layer, and those skilled in the art can design it according to actual needs.
  • the adhesive layer may be a double-sided tape.
  • both the circuit board and the adhesive layer are accommodated in the accommodation space formed by the first concave portion, and the thicknesses of the circuit board and the adhesive layer are multiplexed with the thickness of the middle frame, thereby reducing the overall thickness of the electronic device.
  • the present application further provides an electronic device.
  • the electronic device includes a battery, a display screen, a middle frame and auxiliary parts, the battery and the display screen are both installed on the middle frame, and the battery and the display screen are respectively located at two opposite sides of the middle frame. side, the auxiliary part is located between the middle frame and the display screen;
  • the middle frame includes an integrally formed flat part and a first concave part.
  • the first concave portion is concave relative to the flat portion to form a first groove
  • the flat portion is provided with a first surface and a second surface opposite to each other, and the first surface faces the battery.
  • the first groove is recessed from the side of the first surface toward the second surface, and the bottom wall of the first groove is protruded from the side of the first surface away from the first surface relative to the second surface .
  • the auxiliary member is installed on the second surface, and the protruding portion of the bottom wall of the first groove relative to the second surface is embedded in the first auxiliary member.
  • the auxiliary member is installed on the second surface, and the protruding portion of the bottom wall of the first groove relative to the second surface is embedded in the first auxiliary member.
  • the protruding structure of the first recessed portion relative to the flat portion is embedded in the auxiliary member, and the auxiliary member absorbs the protruding structure of the first recessed portion relative to the flat portion, so that the display screen can be flat relative to the middle frame Install.
  • the side of the auxiliary member facing away from the second surface is a flat surface, so that the display screen is flatly mounted on the auxiliary member.
  • the side of the auxiliary member away from the second surface is a flat surface, so that the display screen and the auxiliary member are fully contacted, and the heat dissipation effect of the auxiliary member on the display screen is improved.
  • the auxiliary member may be, but not limited to, a heat sink.
  • Heat sinks are used to dissipate heat from the display to improve the reliability of electronic equipment.
  • the first concave portion is concave relative to the flat portion to further form a second groove, and the opening of the second groove is in the same direction as the opening of the first groove; wherein, The first groove is located in the second groove, and the groove depth of the first groove is greater than the groove depth of the second groove.
  • the electronic device further includes a circuit board and an adhesive layer, the adhesive layer is connected between the circuit board and the concave portion, the adhesive layer is accommodated in the first groove, and the circuit Part of the structure of the board is accommodated in the second groove.
  • the groove depth of the first groove is greater than the groove depth of the second groove, so that the adhesive layer is accommodated in the first groove, and part of the circuit board is accommodated in the second groove, and the adhesive layer is accommodated in the second groove.
  • the thickness of the circuit board and the thickness of the middle frame are multiplexed, which reduces the overall thickness of the electronic device.
  • FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • Fig. 2 is the partial exploded structure schematic diagram of the electronic equipment shown in Fig. 1;
  • Fig. 3 is the structural representation of the middle frame shown in Fig. 2;
  • Fig. 4 is the top view of the middle frame shown in Fig. 3;
  • FIG. 5 is a schematic cross-sectional view of the middle frame shown in FIG. 4 along the line A-A in the first embodiment
  • Fig. 6 is the enlarged structural representation of part a shown in Fig. 4;
  • Fig. 7 is the structural representation of the middle frame shown in Fig. 3 at another angle;
  • FIG. 8 is a schematic structural diagram of the middle frame shown in FIG. 1 in the second embodiment
  • FIG. 9 is a schematic cross-sectional view of the middle frame shown in FIG. 8 along the line B-B;
  • FIG. 10 is a schematic structural diagram of the middle frame shown in FIG. 1 in the third embodiment
  • FIG. 11 is a schematic structural diagram of the middle frame shown in FIG. 1 in the fourth embodiment.
  • Figure 12 is a schematic cross-sectional view of the middle frame shown in Figure 11 along line C-C;
  • FIG. 13 is a partial cross-sectional schematic diagram of the electronic device provided by the embodiment of the present application in another embodiment.
  • FIG. 1 is a schematic structural diagram of an electronic device 100 provided by an embodiment of the present application.
  • the electronic device 100 may be a mobile phone, a tablet computer, a notebook computer, a vehicle-mounted device, a wearable device, or other products, which are not limited in this application.
  • the wearable device may be a smart bracelet, a smart watch, augmented reality (AR) glasses, virtual reality (virtual reality, VR) glasses, and the like.
  • AR augmented reality
  • VR virtual reality
  • the electronic device 100 includes a housing 101 , a battery 102 , a main board 103 , a sub board 104 and a circuit board 105 located inside the housing 101 .
  • the battery 102 is used to provide power for various components inside the electronic device 100 .
  • the main board 103 (motherboard, Mobo), also known as a motherboard, a system board, a logic board, a motherboard or a backplane, etc., is the center or main circuit board constituting a complex electronic system such as the electronic device 100 .
  • the main board 103 integrates the operation management of the electronic device 100 .
  • the main board 103 is connected to the sub-board 104 and external accessories, and the external accessories may be, but not limited to, a memory card, a subscriber identity module (SIM) card, a charging interface, and the like.
  • the battery 102 is located between the main board 103 and the sub board 104 .
  • the main board 103 and the sub board 104 are located at two ends of the battery 102 respectively.
  • the circuit board 105 is electrically connected between the main board 103 and the sub-board 104 , and the circuit board 105 extends from one end of the battery 102 to the other end of the battery 102 .
  • the circuit board 105 may be, but is not limited to, a flexible circuit board.
  • the shapes, sizes or positions of the battery 102 , the main board 103 , the sub-board 104 or the circuit board 105 shown in FIG. 1 are only examples, and are not limited in the present application.
  • the electronic device 100 also includes a connector 106 .
  • the connector 106 is spaced apart from the circuit board 105 .
  • the connecting member 106 is electrically connected between the battery 102 and the main board 103 , so that the battery 102 is used to electrically connect components inside the electronic device 100 .
  • the connector 106 may be, but is not limited to, the flexible circuit board 105 .
  • the connector 106 is located on the same side of the middle frame as the circuit board 105 .
  • FIG. 2 is a schematic diagram of a partial exploded structure of the electronic device 100 shown in FIG. 1 .
  • the electronic device 100 also includes a display screen 107 .
  • the display screen 107 is used for displaying pictures.
  • the display screen 107 may be a flat screen or a curved screen, which is not limited in the present application.
  • the casing 101 includes a middle frame 10 and a rear cover 20 mounted on the middle frame 10 .
  • the middle frame 10 provides a carrying function, such as carrying one or more of the main board 103 , the sub board 104 , the circuit board 105 , the display screen 107 or the battery 102 .
  • the display screen 107 and the battery 102 are respectively located on opposite sides of the middle frame 10 .
  • the shapes of the middle frame 10 and the back cover 20 in the figures are only examples, and are not limited in the present application.
  • the electronic device 100 further includes an adhesive layer 108 , and the adhesive layer 108 is used for fixing the circuit board 105 and the connecting member 106 to the middle frame 10 .
  • the circuit board 105 and the connecting member 106 are directly fixed to the middle frame 10 through the adhesive layer 108 to facilitate the assembly of the electronic device 100 .
  • the present application does not limit the material used for the adhesive layer 108, and those skilled in the art can design it according to actual needs.
  • the adhesive layer 108 may be a double-sided tape.
  • the battery 102 , the circuit board 105 , the connector 106 , the main board 103 and the sub-board 104 are located on the same side of the middle frame 10 .
  • the back cover 20 is located on the side of the battery 102 facing away from the display screen 107 .
  • the back cover 20 is fixed on the middle frame 10 to protect the circuit board 105 , the battery 102 and other structures carried on the middle frame 10 .
  • the application does not limit the shape or material of the back cover 20, and those skilled in the art can design it according to actual needs.
  • the circuit boards 105 and the connecting members 106 are arranged in a staggered manner, which avoids stacking the circuit boards 105 and the connecting members 106 , which is beneficial to reduce the thickness of the electronic device 100 .
  • the connector 106 is located at the end of the battery 102 to electrically connect the battery 102 to the components in the electronic device 100 .
  • the circuit board 105 extends from one end of the battery 102 to the other end of the battery 102 to connect the main board 103 and the sub board 104 .
  • the middle frame 10 includes a first plate 11 , a second plate 12 and a third plate 13 which are connected in sequence.
  • the first plate 11, the second plate 12 and the third plate 13 are used to carry different components.
  • the first plate 11 is used to carry the main board 103
  • the second plate 12 is used to carry the battery 102
  • the third plate 11 is used to carry the sub-board 104 .
  • the second plate 12 includes a first end portion and a second end portion disposed opposite to each other, the first end portion is connected to the second plate 12 , and the second end portion is connected to the third plate 13 .
  • the first plate 11 , the second plate 12 and the third plate 13 are integrally formed.
  • FIG. 3 is a schematic structural diagram of the middle frame 10 shown in FIG. 2 .
  • the second plate 12 includes an integrally formed flat portion 121 , a first recessed portion 122 and a second recessed portion 123 .
  • the first recessed portion 122 is recessed toward the flat portion 121 to form the first receiving space 110 .
  • the first recessed portion 122 is recessed toward the flat portion 121 to form the second receiving space 120 .
  • the first accommodating space 110 and the second accommodating space 120 may be grooves or through holes. In the embodiment of the present application, the first accommodating space 110 and the second accommodating space 120 are used as grooves as an example for description.
  • the part of the circuit board 105 located in the second plate 12 is accommodated in the first accommodation space 110 and is located below the battery 102 .
  • Part of the structure of the connecting member 106 located on the second plate 12 is accommodated in the second accommodating space 120 and is located below the battery 102 .
  • the part of the circuit board 105 located on the first board 11 or the third board 13 is staggered from the battery 102 so as to be connected to the main board 103 or the sub board 104 .
  • the part of the connector 106 located on the first plate 11 is staggered from the battery 102 so as to be electrically connected with the corresponding components.
  • the shape of the first accommodating space 110 matches the shape of the circuit board 105
  • the shape of the second accommodating space 120 matches the shape of the connecting member 106 .
  • Those skilled in the art can correspondingly design the shapes of the first accommodating space 110 and the second accommodating space 120 according to the shapes of the internal circuit board 105 and the connector 106 of the electronic device 100 .
  • the second plate 12 is provided with a receiving space for accommodating the circuit board 105 and the connector 106 , and the part of the circuit board 105 or the connector 106 located below the battery 102 is embedded in the second plate 12 , and the second plate 12 is spatially multiplexed with the thickness of the circuit board 105 or the connector 106 , reducing the thickness of the electronic device 100 .
  • the adhesive layer 108 includes a first adhesive layer 81 and a second adhesive layer 82 .
  • the first adhesive layer 81 is adhered between the circuit board 105 and the middle frame 10 , and the first adhesive layer 81 is accommodated in the first accommodating space 110 .
  • the second adhesive layer 82 is adhered between the connecting member 106 and the middle frame 10 , and the second adhesive layer 82 is accommodated in the second accommodating space 120 .
  • FIG. 4 is a top view of the middle frame 10 shown in FIG. 3 ;
  • FIG. 5 is a schematic cross-sectional view of the middle frame 10 shown in FIG.
  • the first receiving space 110 includes a first groove 111 and a second groove 112 .
  • the opening directions of the first groove 111 and the second groove 112 are the same.
  • the first groove 111 is located in the second groove 112 , and the groove depth of the first groove 111 is greater than that of the second groove 112 . It can be understood that a part of the structure of the first groove 111 continues to be recessed toward the first surface relative to the second groove 112 .
  • the first groove 111 is used for accommodating the first adhesive layer 81
  • the second groove 112 is used for accommodating the circuit board 105 .
  • the first groove 111 is located at a part of the second groove 112 .
  • the flat portion 121 includes a first surface 1211 and a second surface 1212 that are opposite to each other.
  • the first side 1211 faces the battery 102 .
  • the openings of the first groove 111 and the second groove 112 are both the first surface 1211 .
  • Both the first groove 111 and the second groove 112 are recessed from the first surface 1211 to one side of the second surface 1212 and do not penetrate through the second surface 1212 .
  • the outer surface of the first adhesive layer 81 is smaller than the outer surface of the circuit board 105 , and the first adhesive layer 81 is adhered to a local area of the circuit board 105 to ensure that the circuit board 105 is bonded to the middle frame 10 .
  • the space occupied by the first adhesive layer 81 is reduced, the miniaturization of the electronic device 100 is facilitated.
  • the second receiving space 120 includes a third groove 113 and a fourth groove 114 .
  • the opening directions of the third groove 113 and the fourth groove 114 are the same.
  • the fourth groove 114 is located in the third groove 113 , and the groove depth of the fourth groove 114 is greater than that of the third groove 113 . It can be understood that a part of the structure of the fourth groove 114 continues to be recessed in the direction of the first surface 1211 relative to the third groove 113 .
  • the fourth groove 114 is used for accommodating the second adhesive layer 82
  • the third groove 113 is used for accommodating the connecting member 106 . As shown in FIG. 4 , the fourth groove 114 is located at a part of the third groove 113 .
  • the second plate 12 is also correspondingly provided with a groove for accommodating the connecting member 106 and the second adhesive layer 82 , thereby reducing the thickness of the electronic device 100 as a whole.
  • the first adhesive layer 81 includes a plurality of sub-adhesive layers 108 arranged at intervals.
  • the number of the first grooves 111 is multiple, the plurality of first grooves 111 are arranged at intervals, and all are located in the second grooves 112 .
  • the plurality of sub-adhesive layers 108 are accommodated in the plurality of first grooves 111 in a one-to-one correspondence to bond different positions of the circuit board 105, thereby improving the bonding stability of the circuit board 105 and the middle frame 10.
  • the shapes of the plurality of first grooves 111 may be the same or different, which is not limited in the present application.
  • the number of the first grooves 111 is not limited in the present application, and the number in the figure is only an example.
  • the flat portion 121 , the first recessed portion 122 and the second recessed portion 123 are prepared by a die-casting process.
  • the die-casting process is a casting method that fills the mold cavity with molten material at high speed under the action of high pressure, and solidifies the material under pressure to form a die-casting part.
  • the flat portion 121 , the first recessed portion 122 and the second recessed portion 123 are prepared by die casting, which not only reduces the cost of the middle frame 10 but also improves the molding efficiency of the middle frame 10 .
  • the first groove 111 is located in the second groove 112, and the groove depth of the first groove 111 is greater than the groove depth of the second groove 112.
  • the material is In the flow direction, the cavity structure corresponding to the groove wall of the second groove 112 forms a block flow to the flow of the material, and the cavity structure corresponding to the groove wall of the first groove 111 forms another block flow to the flow of the material.
  • the thickness of the flat portion 121 integrally formed with the first recessed portion 122 and the second recessed portion 123 is affected, and finally the thickness of the middle frame 10 is affected.
  • the bottom wall of the first groove is rectangular, and the flow direction of the material is perpendicular to the side of the rectangle.
  • the cavity structure corresponding to the groove wall of the first groove hinders the material.
  • the flow effect is strong, and the slag discharge side bone position is prone to produce poor cold material, resulting in thicker thickness of the formed middle frame. thin.
  • the flow resistance of the material by the cavity structure corresponding to the first concave portion 122 is reduced, the risk of cold material being easily generated at the slag discharge side bone position is reduced, and molding is avoided.
  • the thicknesses of the first concave portion 122 , the second concave portion 123 and the flat portion 121 are relatively thick, thereby facilitating the overall thinning of the middle frame 10 .
  • the first recessed portion 122 includes a bottom wall 1220 , a first side wall 1221 and a second side wall 1222 .
  • the orientation of the bottom wall 1220 is the same as the orientation of the first surface 1211 .
  • the first side wall 1221 and the second side wall 1222 respectively intersect with the bottom wall 1220 .
  • the first side wall 1221 and the second side wall 1222 are connected and intersected.
  • the shape of the bottom wall 1220 is a quadrilateral.
  • the groove wall of the first groove 111 further includes a third side wall 1223 and a fourth side wall 1224 that are connected and intersected.
  • the third side wall 1223 is connected between the second side wall 1222 and the fourth side wall 1224
  • the fourth side wall 1224 is between the first side wall 1221 and the third side wall 1223
  • the first side wall 1221 , the second side wall 1222 , the third side wall 1223 , the fourth side wall 1224 and the bottom wall 1220 together surround and form the first groove 111 . It can be understood that the first side wall 1221 , the second side wall 1222 , the third side wall 1223 , the fourth side wall 1224 and the bottom wall 1220 are all groove walls of the first groove 111 .
  • the first direction X is parallel to the flow direction of the die-casting material.
  • the first direction X is the shortest direction in which the filling material flows along the middle frame 10 .
  • the first direction X is taken as an example of the width direction of the middle frame 10 for description. It can be understood that the first direction X is the short side direction of the middle frame 10 . In other embodiments, the first direction X can also be other directions of the middle frame 10 , which is not limited in the present application.
  • the opening formed by the first side wall 1221 and the second side wall 1222 gradually becomes larger, and the direction of the opening is parallel to the material flowing in the middle frame 10 during the die casting process.
  • the mold cavity corresponding to the first side wall 1221 and the second side wall 1222 is gradually dispersed, reducing the obstruction of the material flow by the mold cavity side walls corresponding to the first side wall 1221 and the second side wall 1222, and reducing the bone position on the slag discharge side It is easy to generate the risk of cold material, and the thickness of the first concave portion 122 , the second concave portion 123 and the flat portion 121 in the middle frame 10 is avoided to be thick, thereby facilitating the overall thinning of the middle frame 10 .
  • the thickness of the flat portion 121 is reduced, and accordingly the thickness of the first recessed portion 122 and the second recessed portion 123 is also reduced.
  • the thinned thickness of the flat portion 121 may be different from the thinned thickness of the first concave portion 122 or the second concave portion 123 .
  • the openings formed by the first side wall 1221 and the second side wall 1222 gradually become larger, so that the thickness of the flat portion 121 can be reduced by more than 0.05 mm, and the first concave portion 122 or the second concave portion 122 can be reduced.
  • the thickness of the portion 123 is reduced by 0.03 mm or more.
  • the first The flow resistance of the material by one side wall 1221 or the second side wall 1222 is smaller. It can be understood that when the first side wall 1221 or the second side wall 1222 is perpendicular to the flow direction of the material, and the first side wall 1221 or the second side wall 1222 is at an acute angle with the flow direction of the material, the first side wall 1221 or the second side wall 1222 is at an acute angle. Part of the structure of the two side walls 1222 is away from the flow direction of the material, so that the first side wall 1221 or the second side wall 1222 greatly hinders the flow of the material.
  • the angle formed by the first sidewall 1221 and the second sidewall 1222 is an acute angle.
  • the present application does not limit the specific angle formed by the first side wall 1221 and the second side wall 1222 .
  • the angle formed by the first side wall 1221 and the second side wall 1222 is less than or equal to 80 degrees.
  • the angle formed by the first side wall 1221 and the second side wall 1222 is an acute angle
  • the angle formed by the first side wall 1221 and the second side wall 1222 is relatively small
  • the middle frame 10 is in the process of die casting.
  • the resistance of the first side wall 1221 and the second side wall 1222 to the material flow is small, which further reduces the resistance of the material flow by the groove wall of the first groove 111, and is more conducive to thinning the first depression 122, Thickness of the second recessed portion 123 and the flat portion 121 .
  • the area of the bottom wall 1220 is larger, which increases the bonding area between the middle frame 10 and the circuit board 105 , thereby ensuring the stability of the bonding layer 108 bonding the circuit board 105 and the middle frame 10 .
  • the angle formed by the first side wall 1221 and the second side wall 1222 is greater than or equal to 15 degrees, so as to avoid a small angle formed by the first side wall 1221 and the second side wall 1222, resulting in a small area of the bottom wall 1220. . It can be understood that the angle formed by the first side wall 1221 and the second side wall 1222 should not be too small or too large. The present application does not limit the specific angle of the acute angle formed by the first side wall 1221 and the second side wall 1222, and those skilled in the art can design this according to actual needs.
  • the length of the first side wall 1221 is equal to the length of the second side wall 1222 .
  • the first side wall 1221 and the second side wall 1222 are symmetrically arranged.
  • the first side wall 1221 and the second side wall 1222 are symmetrically arranged, and the first side wall 1221 and the second side wall 1222 have the same resistance to the flow of materials, which is beneficial to the side structure of the first side wall 1221 and the second side wall 1222.
  • the thickness distribution of the side structures of the two side walls 1222 is uniform.
  • the shapes of the first side wall 1221 , the second side wall 1222 , the third side wall 1223 and the fourth side wall 1224 are all the same.
  • the shape of the bottom wall 1220 is described as a prism.
  • the length of the first side wall 1221 and the length of the third side wall 1223 , or the length of the second side wall 1222 and the length of the fourth side wall 1224 may also be different, which is not limited in the present application.
  • the shape of the fourth groove 114 is the same as the shape of the first groove 111, and in the first direction X, two adjacent fourth grooves 114 The sidewalls form openings that gradually become larger.
  • the bottom wall 1220 of the fourth groove 114 and the bottom wall 1220 of the first groove 111 are both prismatic.
  • the groove depth of the fourth groove 114 is the same as that of the first groove 111
  • the groove depth of the third groove 113 is the same as that of the second groove 112 .
  • the shape of the fourth groove 114 is the same as that of the first groove 111 , and the openings formed by the adjacent two side walls of the fourth groove 114 are gradually enlarged.
  • the flow resistance of the material by the cavity structure corresponding to the first concave part 122 is reduced, and the flow resistance of the material by the cavity structure corresponding to the second concave part 123 is also reduced, which further reduces the slagging side bone dislocation.
  • the risk of generating cold material is more conducive to the thinning of the first concave portion 122 , the second concave portion 123 and the flat portion 121 .
  • the shape of the fourth groove 114 may be different from the shape of the first groove 111 , which is not limited in the present application.
  • the bottom wall 1220 of the first groove 111 is rhombic, and the bottom wall 1220 of the fourth groove 114 is rectangular.
  • FIG. 7 is a schematic structural diagram of the middle frame 10 shown in FIG. 3 from another angle.
  • FIG. 7 is a schematic structural diagram of another angle after the middle frame 10 shown in FIG. 4 is turned over by 180 degrees.
  • the side of the bottom wall 1220 of the first groove 111 facing away from the first surface 1211 is flush with the second surface 1212
  • the side of the bottom wall 1220 of the fourth groove 114 facing away from the first surface 1211 is flush with the second surface 1212 . Both sides 1212 are flush.
  • the shape of the first groove 111 and the fourth groove 114 cannot be observed in the top view of the middle frame 10 along the angle of the second surface 1212.
  • the structures of the first groove 111 and the fourth groove 114 are marked with dotted lines, The approximate positions of the first groove 111 and the fourth groove 114 are shown.
  • the two opposite sides of the flat portion 121 are flat.
  • FIG. 8 is a schematic structural diagram of the middle frame 10 shown in FIG. 1 in the second embodiment
  • FIG. 9 is a cross-sectional schematic diagram of the middle frame 10 shown in FIG.
  • the middle frame 10 in this embodiment includes most of the technical features of the first embodiment, and most of the technical solutions of this embodiment that are the same as the first embodiment will not be repeated here.
  • the middle frame 10 includes an integrally formed flat portion 121 and a first concave portion 122 , and the first concave portion 122 is concave inward relative to the first surface 1211 of the flat portion 121 to form the first groove 111 .
  • the openings formed by the first side wall 1221 and the second side wall 1222 adjacent to the first groove 111 gradually become larger.
  • the third groove 113 and the second groove 112 are staggered, and along the second direction Y, the fourth groove 114 and the first groove 111 are staggered, and the second direction Y is perpendicular to the first Direction X.
  • the second direction Y is the length direction of the middle frame 10 . It can be understood that the fourth groove 114 and the first groove 111 are staggered in the first direction X and the second direction Y.
  • the third groove 113 and the second groove 112 are staggered in the first direction X only. As shown in FIG.
  • the fourth groove 114 and the first groove 111 are staggered in the first direction X and the second direction Y, which reduces the overlapping area of the fourth groove 114 and the first groove 111.
  • the mold cavity forms double or multiple obstructions to the material in the same direction, which reduces the risk of cold material from the mold cavity to the slag-discharging side bone position of the material, thereby further reducing the first step.
  • the thickness of the first concave portion 122 , the second concave portion 123 and the flat portion 121 are provided.
  • FIG. 10 is a schematic structural diagram of the middle frame 10 shown in FIG. 1 in the third embodiment.
  • the middle frame 10 in this embodiment includes most of the technical features of the foregoing embodiments, and most of the technical solutions of this embodiment that are the same as the foregoing embodiments will not be described again below.
  • the middle frame 10 includes an integrally formed flat portion 121 and a first concave portion 122 , and the first concave portion 122 is concave inward relative to the first surface 1211 of the flat portion 121 to form the first groove 111 .
  • the openings formed by the first side wall 1221 and the second side wall 1222 adjacent to the first groove 111 gradually become larger.
  • the bottom wall 1220 of the first groove 111 is triangular.
  • the sidewalls of the first groove 111 include a first sidewall 1221 , a second sidewall 1222 and a third sidewall 1223 .
  • the first side wall 1221 , the second side wall 1222 and the third side wall 1223 are connected to each other and to the bottom wall 1220 .
  • the angle formed by the first side wall 1221 and the second side wall 1222 is 60 degrees
  • the bottom wall 1220 is an equilateral triangle.
  • the shape of the bottom wall 1220 can be a triangle or a parallelogram as an example in the present application.
  • the bottom wall 1220 may also have other shapes, such as a pentagon or a hexagon, which is not limited in this application.
  • FIG. 11 is a schematic structural diagram of the middle frame 10 shown in FIG. 1 in the fourth embodiment
  • FIG. 12 is a cross-sectional schematic diagram of the middle frame 10 shown in FIG. 11 taken along line C-C.
  • the middle frame 10 in this embodiment includes most of the technical features of the foregoing embodiments, and most of the technical solutions of this embodiment and the foregoing embodiments are not repeated hereafter.
  • the middle frame 10 includes an integrally formed flat portion 121 and a first concave portion 122 , and the first concave portion 122 is concave inward relative to the first surface 1211 of the flat portion 121 to form the first groove 111 .
  • the openings formed by the first side wall 1221 and the second side wall 1222 adjacent to the first groove 111 gradually become larger.
  • the first groove 111 is concave from the first surface 1211 toward the side of the second surface 1212
  • the bottom wall 1220 of the first groove 111 is convex relative to the second surface 1212 on the side facing away from the first surface 1211 out.
  • the shape of the first groove 111 and the fourth groove 114 can be observed in the top view of the middle frame 10 along the angle of the second surface 1212 . It can be understood that when the groove depths of the first grooves 111 are equal, when the side of the bottom wall 1220 of the first groove 111 facing away from the first surface 1211 protrudes from the second surface 1212, the Bottom wall 1220 is thicker.
  • the middle frame 10 is being formed during the molding process. During the process, the flow resistance of the material along the mold cavity corresponding to the first groove 111 is small, which reduces the risk of cold material being easily generated in the slag discharge side bone position, and avoids the thickness of the flat part 121 of the formed middle frame 10 being thicker, thereby reducing the risk of cold material being generated at the slag-discharging side bone position. It is beneficial to reduce the thickness of the flat portion 121 in the middle frame 10 .
  • the protruding height of the bottom wall 1220 of the first groove 111 relative to the second surface 1212 is less than or equal to 0.2 mm.
  • the protruding height of the bottom wall 1220 of the first groove 111 relative to the second surface 1212 is 0.16 mm, 0.1 mm or 0.05 mm.
  • the protruding height of the bottom wall 1220 of the first groove 111 relative to the second surface 1212 is relatively small, and the thickness of the bottom wall 1220 of the first groove 111 is appropriately increased to avoid the The thickness of 1220 is thicker to increase the overall thickness of the middle frame 10 .
  • FIG. 13 is a partial cross-sectional schematic diagram of the electronic device 100 provided by the embodiment of the present application in another embodiment.
  • the electronic device 100 in this embodiment includes most of the technical features of the foregoing embodiments, and most of the technical solutions of this embodiment that are the same as the foregoing embodiments will not be described again below.
  • the electronic device 100 includes a battery 102 , a display screen 107 , a middle frame 10 , a main board, a sub board, and a circuit board 105 .
  • the battery 102 , the main board and the sub-board are located on the same side of the middle frame 10 and are staggered.
  • the display screen 107 and the battery 102 are respectively installed on opposite sides of the middle frame 10 .
  • the circuit board 105 is electrically connected between the main board and the sub board.
  • the middle frame 10 includes an integrally formed flat portion 121 and a first recessed portion 122 .
  • the first recessed portion 122 is recessed relative to the flat portion 121 to form the first groove 111 .
  • the flat portion 121 is provided with a first surface 1211 and a second surface 1212 which are opposite to each other.
  • the first surface 1211 faces the battery 102
  • the first groove 111 is recessed from the first surface 1211 to one side of the second surface 1212 .
  • the side of the bottom wall 1220 of the first groove 111 facing away from the first surface 1211 protrudes from the second surface 1212 .
  • the side of the bottom wall 1220 of the first groove 111 away from the first surface 1211 protrudes from the second surface 1212 , which increases the thickness of the bottom wall 1220 of the first groove 111 .
  • the middle frame 10 is being formed during the molding process.
  • the flow resistance of the material along the mold cavity corresponding to the first groove 111 is small, which reduces the risk of cold material being easily generated in the slag discharge side bone position, and avoids the thickness of the flat part 121 of the formed middle frame 10 being thicker, thereby reducing the risk of cold material being generated at the slag-discharging side bone position. It is beneficial to reduce the thickness of the flat portion 121 in the middle frame 10 .
  • the electronic device 100 further includes an auxiliary part 109 .
  • the auxiliary part 109 is located between the middle frame 10 and the display screen 107 .
  • the auxiliary member 109 is a heat sink.
  • the heat sink is used to dissipate heat for the display screen 107 to improve the reliability of the electronic device 100 .
  • the present application does not limit the shape of the auxiliary member 109, and the shape of the auxiliary member 109 in the figure is only an example.
  • the heat sink can be, but is not limited to, a graphite sheet.
  • the auxiliary member 109 may also be foam or Mylar, which is not limited in this application.
  • the auxiliary member 109 is mounted on the second surface 1212 , and the protruding portion of the bottom wall 1220 of the first groove 111 relative to the second surface 1212 is embedded in the first auxiliary member 109 .
  • the protruding structure of the first concave portion 122 relative to the flat portion 121 is embedded in the auxiliary member 109, and the auxiliary member 109 absorbs the protruding structure of the first concave portion 122 relative to the flat portion 121, so that the display screen 107 can be installed flat relative to the middle frame 10 .
  • the side of the auxiliary member 109 away from the second surface 1212 is a flat surface, so that the display screen 107 can be flatly mounted on the auxiliary member 109 .
  • the side of the auxiliary member 109 away from the second surface 1212 is a flat surface, so that the display screen 107 can be fully contacted with the auxiliary member 109 and the heat dissipation of the display screen 107 by the auxiliary member 109 is improved. Effect.
  • the first recessed portion 122 is recessed relative to the flat portion 121 to further form a second groove 112 .
  • the opening of the second groove 112 is in the same direction as the opening of the first groove 111 .
  • the first groove 111 is located in the second groove 112 , and the groove depth of the first groove 111 is greater than the groove depth of the second groove 112 .
  • the electronic device 100 further includes an adhesive layer 108 connected between the circuit board 105 and the recessed portion. The adhesive layer 108 is accommodated in the first groove 111, and a part of the structure of the circuit board 105 is accommodated in the second groove 112.
  • the groove depth of the first groove 111 is greater than the groove depth of the second groove 112, so that the adhesive layer 108 is accommodated in the first groove 111, and part of the circuit board 105 is accommodated in the first groove 111.
  • the thicknesses of the two grooves 112 , the adhesive layer 108 and the circuit board 105 are multiplexed with the thickness of the middle frame 10 , thereby reducing the overall thickness of the electronic device 100 .

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Abstract

本申请提供一种中框及包括此中框的电子设备。中框包括一体成型的平整部和第一凹陷部，第一凹陷部相对平整部的第一面朝内凹陷，以形成第一凹槽，所述第一凹槽的开口位于所述第一面；第一凹陷部包括底壁、第一侧壁和第二侧壁，底壁的朝向与第一面的朝向相同，第一侧壁与第二侧壁分别与底壁相交，第一侧壁与第二侧壁相连；在第一方向上，第一侧壁和第二侧壁形成的开口逐渐变大，且在中框压铸成型的过程中，第一方向平行于压铸物料的流动方向。本申请提供中框的平整部的厚度较薄。

Description

中框及电子设备
本申请要求于2021年04月30日提交中国专利局、申请号为202110486538.8、申请名称为“中框及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及电子设备技术领域，尤其涉及一种中框及电子设备。
背景技术
在消费者电子设备领域，特别是手机，整机的厚度是影响产品精致度的关键因素之一。传统技术中，中框包括平整部和相对平整部凹陷的凹陷部，凹陷部的凹槽用于收容电子设备的其他部件，以减小电子设备整体的厚度。但是，中框采用压铸成型后，平整部的厚度较厚，影响了电子设备的整体厚度。
发明内容
本申请实施例提供一种中框及包括此中框的电子设备。中框包括一体成型的平整部和凹陷部，凹陷部相对平整部凹陷形成凹槽，且平整部的厚度较薄。
第一方面，本申请提供一种中框。所述中框采用压铸工艺制备。压铸成型工艺是一种将熔融的物料在高压的作用下高速充填模腔，并使物料在压力下凝固而形成压铸件的铸造方法。在本实施例中，中框采用压铸成型的工艺制备，不仅降低了中框的成本，也提高了中框成型的效率。
所述中框包括一体成型的平整部和第一凹陷部。所述第一凹陷部相对所述平整部的第一面朝内凹陷，以形成第一凹槽。所述第一凹槽的开口位于所述第一面。所述第一凹陷部包括底壁、第一侧壁和第二侧壁。所述底壁的朝向与所述第一面的朝向相同，所述第一侧壁与所述第二侧壁分别与所述底壁相交，所述第一侧壁与所述第二侧壁相连。在第一方向上，所述第一侧壁和所述第二侧壁形成的开口逐渐变大，且在所述中框压铸成型的过程中，所述第一方向平行于压铸物料的流动方向。
本实施例中，在第一方向上，第一侧壁和第二侧壁形成的开口逐渐变大，并且开口的方向与中框在压铸成型的过程中流动的物料平行，物料沿第一侧壁和第二侧壁对应的模腔侧壁逐渐分散，降低第一侧壁和第二侧壁对应的模腔侧壁对物料的阻流，减小排渣侧骨位易产生冷料的风险，避免中框中平整部的厚度较厚，从而有利于中框整体的减薄。
其中，在沿物料的流动方向上，第一侧壁和第二侧壁形成的角度越小，第一侧壁或第二侧壁与物料的流动方向形成的角度越小，第一侧壁或第二侧壁对物料的阻流越小。可以理解的，第一侧壁或第二侧壁与物料的流动方向垂直，及第一侧壁或第二侧壁与物料的流动方向为锐角时，第一侧壁或第二侧壁的部分结构背离物料的流动方向，导致第一侧壁或第二侧壁对物料的阻流较大。
在一种可能的实现方式中，所述第一侧壁和所述第二侧壁形成的角度为锐角。
本申请并不限定第一侧壁和第二侧壁形成的具体角度。示例性的，第一侧壁与第二侧壁形成的角度小于或等于80度。
在本申请实施例中，第一侧壁和第二侧壁形成的角度位锐角，第一侧壁和第二侧壁形成的角度较小，中框在压铸成型的过程中，第一侧壁和第二侧壁对物料的阻流较小，进一步地减小了第一凹槽的槽壁对物料的阻流，更有利于减薄平整部的厚度。
在一种可能的实现方式中，底壁的面积较大，提高中框与电路板的粘接面积，从而保证粘接层粘接电路板和中框的稳固性。示例性的，第一侧壁与第二侧壁形成的角度大于或等于15度，避免第一侧壁和第二侧壁形成的角度较小而造成底壁的面积较小。可以理解的，第一侧壁和第二侧壁形成的角度不宜过小，也不宜过大。
其中，本申请并不限定第一侧壁和第二侧壁形成的锐角的具体角度，本领域技术人员能够根据实际需求对此进行设计。
在一种可能的实现方式中，所述底壁的形状包括四边形或三角形等。示例性的，底壁的形状包括棱形或等边三角形。
在本实施例中，在第一方向上，第一侧壁和第二侧壁形成的开口逐渐变大时，底壁的形状可以呈三角形，也可以呈平行四边形。在其他实施例中，底壁也可以呈其他形状，例如五边形或六边形等，本申请对此并不限定。
在一种可能的实现方式中，所述第一凹陷部相对所述平整部凹陷还形成第二凹槽。所述第二凹槽的开口与所述第一凹槽的开口方向相同。其中，所述第一凹槽位于所述第二凹槽，且所述第一凹槽的槽深大于所述第二凹槽的槽深。第一凹槽和第二凹槽用于收容电子设备中不同的部件。
在此实施例中，中框设有第一凹槽和第二凹槽，且第一凹槽位于第二凹槽，第一凹槽和第二凹槽均用于收容电子设备中的部件，使得应用此中框的电子设备的整体厚度较小。
在一种可能的实现方式中，所述平整部设有与所述第一面相背设置的第二面。所述第一凹槽自所述第一面朝所述第二面的一侧凹陷，所述底壁背离所述第一面的一侧相对所述第二面凸出。可以理解的，在第一凹槽的槽深相等的情况下，第一凹槽的底壁背离第一面的一侧相对第二面凸出时，第一凹槽的底壁更厚。
在此实施例中，第一凹槽的底壁背离第一面的一侧相对第二面凸出，提升了第一凹槽的底壁的厚度，中框在成型过程中，物料沿第一凹槽对应的模腔的阻流较小，减小排渣侧骨位易产生冷料的风险，避免成型的中框的平整部的厚度较厚，从而有利于减小中框中平整部的厚度。
在一种可能的实现方式中，所述中框包括依次连接的第一板块、第二板块和第三板块，所述第一板块、所述第二板块和所述第三板块用于承载不同的部件。所述第二板块包括相背设置的第一端部和第二端部，所述第一端部连接所述第二板块，所述第二端部连接所述第三板块，所述第二凹槽自所述第一端部延伸至所述第二端部。其中，所述第一凹槽的数量为多个，多个所述第一凹槽间隔设置，且均位于所述第二凹槽。
示例性的，多个第一凹槽用于一一对应地收容多个粘接层，多个粘接层用于与第一凹陷部的不同部位粘接，以提高中框与对应粘接件的稳定性。其中，多个第一凹槽的形状可以相同也可以不同，本申请对此并不限定。第一凹槽的数量本申请也并不限定。
在一种可能的实现方式中，所述中框还包括第二凹陷部。所述第二凹陷部与所述平整部一体成型，且所述第二凹陷部相对所述平整部凹陷，以形成第三凹槽和第四凹槽。所述第三凹槽与所述第四凹槽均自所述第一面朝所述第二面的一侧凹陷，所述第四凹槽位于第三凹槽，且所述第四凹槽凹陷的深度大于所述第三凹槽凹陷的深度。
在本实施例中，中框还设有与平整部一体成型的第二凹陷部，第二凹陷部用于收容电子 设备中的其他部件，例如连接件，连接件收容于中框，以使连接件与中框的厚度复用，减小了电子设备整体的厚度。
其中，在沿所述第一方向上，所述第三凹槽与所述第二凹槽错开设置，且沿第二方向上，所述第四凹槽与所述第一凹槽错开设置；其中，所述第二方向垂直于所述第一方向。
在本实施例中，第四凹槽和第一凹槽在第一方向和第二方向上均错开设置，减小了第四凹槽和第一凹槽的重叠区域，避免中框在成型过程中，在同一方向上模腔对物料形成双重或多重的阻流，减小了模腔对物料的排渣侧骨位的冷料风险，从而进一步地减小了平整部的厚度。
在一种可能的实现方式中，所述第四凹槽的形状和所述第一凹槽的形状相同，且在所述第一方向上，所述第四凹槽相邻的两个侧壁形成的开口逐渐变大。示例性的，第四凹槽的底壁和第一凹槽的底壁均呈棱形。第四凹槽的槽深与第一凹槽的槽深相同，第三凹槽的槽深与第二凹槽的槽深相同。
在此实施例中，第四凹槽的形状与第一凹槽的形状相同，且第四凹槽相邻的两个侧壁形成的开口逐渐变大，中框在压铸成型的过程中不仅降低了第一凹陷部对应的模腔结构对物料的阻流，也降低了第二凹陷部对应的模腔结构对物料的阻流，进一步地减小排渣侧骨位易产生冷料的风险，更有利于平整部的减薄。
在其他可能的实现方式中，第四凹槽的形状与第一凹槽的形状也可以不同，本申请对此并不限定。例如，第一凹槽的底壁呈菱形，第四凹槽的底壁呈矩形。
第二方面，本申请还提供一种中框。所述中框采用压铸工艺制备。所述中框包括一体成型的平整部和第一凹陷部，所述第一凹陷部相对所述平整部凹陷，以形成第一凹槽，所述平整部设有相背设置的第一面和第二面。所述第一面面向电池，所述第一凹槽自所述第一面朝所述第二面的一侧凹陷，且所述第一凹槽的底壁背离所述第一面的一侧相对所述第二面凸出。
可以理解的，在第一凹槽的槽深相等的情况下，第一凹槽的底壁背离第一面的一侧相对第二面凸出时，第一凹槽的底壁更厚。
在此实施例中，第一凹槽的底壁背离第一面的一侧相对第二面凸出，提升了第一凹槽的底壁的厚度，中框在成型过程中，物料沿第一凹槽对应的模腔的阻流较小，减小排渣侧骨位易产生冷料的风险，避免成型的中框的平整部的厚度较厚，从而有利于减小中框中平整部的厚度。
第三方面，本申请提供一种电子设备。电子设备包括电池和第一方面或第二方面中任一项所述的中框，所述电池安装于所述中框。电池在中框的投影覆盖平整部和凹陷部。电池用于为电子设备内部的各元器件提供电源。示例性的，电池承载于中框的中间区域。
在一种可能的实现方式中，所述电子设备还包括电路板和粘接层。所述电路板在所述中框上的投影覆盖与所述第一凹陷部至少部分重叠。所述粘接层连接在所述电路板与所述第一凹陷部之间，且所述粘接层收容于所述第一凹槽。
在本实施例中，粘接层用于将电路板固定于中框。本申请并不限定粘接层采用的材质，本领域技术人员能够根据实际需求对此进行设计。例如，粘接层可以是双面胶。
在本实施例中，电路板和粘接层均收容于第一凹陷部形成的收容空间内，电路板和粘接层的厚度与中框的厚度复用，减小了电子设备的整体厚度。
第四方面，本申请还提供一种电子设备。电子设备包括电池、显示屏、中框和辅助件，所述电池与所述显示屏均安装于所述中框，且所述电池与所述显示屏分别位于所述中框相背设置的两侧，所述辅助件位于所述中框与所述显示屏之间；
所述中框包括一体成型的平整部和第一凹陷部。所述第一凹陷部相对所述平整部凹陷，以形成第一凹槽，所述平整部设有相背设置的第一面和第二面，所述第一面面向所述电池。所述第一凹槽自所述第一面朝所述第二面的一侧凹陷，且所述第一凹槽的底壁背离所述第一面的一侧相对所述第二面凸出。其中，所述辅助件安装于所述第二面，且所述第一凹槽的底壁相对所述第二面凸出的部分嵌设于所述第一辅助件。
在此实施例中，辅助件安装于第二面，且第一凹槽的底壁相对第二面凸出的部分嵌设于第一辅助件。在此实施例中，第一凹陷部相对平整部凸出的结构嵌设于辅助件内，辅助件吸收了第一凹陷部相对平整部凸出的结构，以使显示屏可以相对中框平整地安装。
可以理解的，辅助件背离第二面的一侧为平整面，以使显示屏平整地安装于辅助件上。示例性的，当辅助件为散热片时，辅助件背离第二面的一侧为平整面，以使显示屏与辅助件充分接触，提高辅助件对显示屏的散热效果。
示例性的，辅助件可以是但不仅限于散热片。散热片用于为显示屏进行散热，以提高电子设备的可靠性。
在一种可能的实现方式中，所述第一凹陷部相对所述平整部凹陷还形成第二凹槽，所述第二凹槽的开口与所述第一凹槽的开口方向相同；其中，所述第一凹槽位于所述第二凹槽，且所述第一凹槽的槽深大于所述第二凹槽的槽深。所述电子设备还包括电路板和粘接层，所述粘接层连接在所述电路板与所述凹陷部之间，所述粘接层收容于所述第一凹槽，且所述电路板的部分结构收容于所述第二凹槽。
在本实施例中，第一凹槽的槽深大于第二凹槽的槽深，以使粘接层收容于第一凹槽，且电路板的部分结构收容于第二凹槽，粘接层和电路板的厚度与中框的厚度复用，减小了电子设备的整体厚度。
附图说明
为了说明本申请实施例或背景技术中的技术方案，下面将对本申请实施例或背景技术中所需要使用的附图进行说明。
图1是本申请实施例提供的电子设备的结构示意图；
图2是图1所示电子设备的部分爆炸结构示意图；
图3是图2所示中框的结构示意图；
图4是图3所示中框的俯视图；
图5是图4所示中框沿A-A线处在第一实施例中的截面示意图；
图6是图4所示a部分的放大结构示意图；
图7是图3所示中框在另一角度的结构示意图；
图8是图1所示中框在第二实施例中的结构示意图；
图9是图8所示中框沿B-B线处的截面示意图；
图10是图1所示中框在第三实施例中的结构示意图；
图11是图1所示中框在第四实施例中的结构示意图；
图12是图11所示中框沿C-C线处的截面示意图；
图13是本申请实施例提供的电子设备在另一实施例中的部分截面示意图。
具体实施方式
下面结合本申请实施例中的附图对本申请实施例进行描述。
请参阅图1，图1是本申请实施例提供的电子设备100的结构示意图。电子设备100可以是手机、平板电脑、笔记本电脑、车载设备、可穿戴设备等产品，本申请对此并不限定。其中，可穿戴设备可以是智能手环、智能手表、增强现实(augmented reality，AR)眼镜、虚拟现实技术(virtual reality，VR)眼镜等。在本申请实施例中，以电子设备100是手机为例进行描写。
如图1所示，电子设备100包括壳体101及位于壳体101内部的电池102、主板103、副板104和电路板105。电池102用于为电子设备100内部的各元器件提供电源。主板103(motherboard，Mobo)，又称主机板、系统板、逻辑板、母板或底板等，是构成复杂电子系统例如电子设备100的中心或者主电路板。主板103集成电子设备100的操作管理。主板103连接副板104和外接的配件，外接的配件可以是但不仅限于内存卡、客户识别模块(subscriber identity module，SIM)卡或充电接口等。电池102位于主板103与副板104之间。主板103和副板104分别位于电池102的两端。电路板105电性连接在主板103与副板104之间，且电路板105自电池102的一端延伸至电池102的另一端。电路板105可以是但不仅限于柔性电路板。其中，图1中所示电池102、主板103、副板104或电路板105的形状、大小或位置等仅为示例，本申请并不限定。
在一些实施例中，电子设备100还包括连接件106。连接件106与电路板105间隔设置。连接件106电性连接在电池102与主板103之间，以使电池102用于为电子设备100内部的元器件电性连接。连接件106可以是但不仅限于柔性电路板105。示例性的，连接件106与电路板105位于中框的同一侧。
请一并参阅图1及图2，图2是图1所示电子设备100的部分爆炸结构示意图。电子设备100还包括显示屏107。显示屏107用于显示画面。显示屏107可以为平面屏，也可以为曲面屏，本申请对此并不限定。壳体101包括中框10和安装于中框10的后盖20。中框10提供承载功能，例如承载主板103、副板104、电路板105、显示屏107或电池102中的一种或多种。示例性的，显示屏107及电池102分别位于中框10相背设置的两侧。图中中框10和后盖20的形状仅为示例，本申请对此并不限定。
如图2所示，电子设备100还包括粘接层108，粘接层108用于将电路板105和连接件106固定于中框10。在此实施例中，电路板105与连接件106直接通过粘接层108固定于中框10，方便电子设备100的组装。本申请并不限定粘接层108采用的材质，本领域技术人员能够根据实际需求对此进行设计。例如，粘接层108可以是双面胶。
在一些实施例中，电池102、电路板105、连接件106、主板103和副板104位于中框10的同一侧。后盖20位于电池102背离显示屏107的一侧。后盖20固定于中框10，以保护承载于中框10上的电路板105、电池102等结构。本申请并不限定后盖20的形状或材质等，本领域技术人员能够根据实际需求对此进行设计。
在一些实施例中，电路板105与连接件106交错排布，避免了电路板105与连接件106堆叠设置，有利于减小电子设备100的厚度。示例性的，连接件106位于电池102的端部，以将电池102与电子设备100内的元器件电性连接。电路板105自电池102的一端延伸至电池102的另一端，以连接主板103与副板104。
请继续参阅图1和图2，中框10包括依次连接的第一板块11、第二板块12和第三板块13。第一板块11、第二板块12和第三板块13用于承载不同的部件。示例性的，第一板块11用于承载主板103，第二板块12用于承载电池102，第三板快用于承载副板104。第二板块12包括相背设置的第一端部和第二端部，第一端部连接第二板块12，第二端部连接第三板块 13。示例性的，第一板块11、第二板块12和第三板块13一体成型。
请一并参阅图1和图3，图3是图2所示中框10的结构示意图。第二板块12包括一体成型的平整部121、第一凹陷部122和第二凹陷部123。第一凹陷部122相对平整部121朝凹陷，以形成第一收容空间110。第一凹陷部122相对平整部121朝凹陷，以形成第二收容空间120。第一收容空间110和第二收容空间120可以是凹槽，也可以是通孔。在本申请实施例中，以第一收容空间110和第二收容空间120为凹槽为例来进行描写。
其中，电路板105位于第二板块12的部分结构收容于第一收容空间110，并位于电池102的下方。连接件106位于第二板块12的部分结构收容于第二收容空间120，并位于电池102的下方。可以理解的，电路板105位于第一板块11或第三板块13的部分与电池102错开设置，以与主板103或副板104连接。连接件106位于第一板块11的部分与电池102错开设置，以与对应的元器件电性连接。第一收容空间110的形状与电路板105的形状匹配，第二收容空间120的形状与连接件106的形状匹配。本领域技术人员能够根据电子设备100内部电路板105和连接件106的形状，对应设计第一收容空间110和第二收容空间120的形状。
在本实施例中，第二板块12设有用于收容电路板105和连接件106的收容空间，位于电池102下方的电路板105或连接件106的部分嵌设于第二板块12，第二板块12与电路板105或连接件106的厚度空间复用，减小了电子设备100的厚度。
示例性的，粘接层108包括第一粘接层81和第二粘接层82。第一粘接层81粘接在电路板105和中框10之间，且第一粘接层81收容于第一收容空间110。第二粘接层82粘接在连接件106和中框10之间，且第二粘接层82收容于第二收容空间120。
请一并参阅图4和图5，图4是图3所示中框10的俯视图；图5是图4所示中框10沿A-A线处在第一实施例中的截面示意图。第一收容空间110包括第一凹槽111和第二凹槽112。第一凹槽111和第二凹槽112的开口方向相同。第一凹槽111位于第二凹槽112，且第一凹槽111的槽深大于第二凹槽112的槽深。可以理解的，第一凹槽111的部分结构相对第二凹槽112继续朝第一面的方向凹陷。第一凹槽111用于收容第一粘接层81，第二凹槽112用于收容电路板105。如图4所示，第一凹槽111位于第二凹槽112的部分位置。
示例性的，平整部121包括相背设置的第一面1211和第二面1212。第一面1211面向电池102。第一凹槽111和第二凹槽112的开口均为第一面1211。第一凹槽111和第二凹槽112均自第一面1211朝第二面1212的一侧凹陷，且并未贯穿第二面1212。
在本实施例中，第一粘接层81的外表面小于电路板105的外表面，第一粘接层81粘接在电路板105的局部区域，在保证电路板105与中框10粘接的前提下，减小了第一粘接层81占用的空间，有利于电子设备100的小型化。
在一些实施例中，第二收容空间120包括第三凹槽113和第四凹槽114。第三凹槽113和第四凹槽114的开口方向相同。第四凹槽114位于第三凹槽113，且第四凹槽114的槽深大于第三凹槽113的槽深。可以理解的，第四凹槽114的部分结构相对第三凹槽113继续朝第一面1211的方向凹陷。第四凹槽114用于收容第二粘接层82，第三凹槽113用于收容连接件106。如图4所示，第四凹槽114位于第三凹槽113的部分位置。在本实施例中，第二板块12也对应设有用于收容连接件106和第二粘接层82的凹槽，整体上减小电子设备100的厚度。
请一并参阅图2和图4，第一粘接层81包括多个间隔设置的子粘接层108。第一凹槽111的数量为多个，多个第一凹槽111间隔设置，且均位于第二凹槽112。多个子粘接层108一一对应地收容于多个第一凹槽111，以粘接电路板105的不同位置，提高了电路板105与中 框10粘接的稳固性。其中，多个第一凹槽111的形状可以相同也可以不同，本申请对此并不限定。第一凹槽111的数量本申请也并不限定，图中的数量仅为示例。
其中，平整部121、第一凹陷部122和第二凹陷部123采用压铸成型的工艺制备。压铸成型工艺是一种将熔融的物料在高压的作用下高速充填模腔，并使物料在压力下凝固而形成压铸件的铸造方法。在本实施例中，平整部121、第一凹陷部122和第二凹陷部123采用压铸成型的工艺制备，不仅降低了中框10的成本，也提高了中框10成型的效率。
在本实施例中，第一凹槽111位于第二凹槽112，且第一凹槽111的槽深大于第二凹槽112的槽深，中框10在压铸成型的过程中，在物料的流动方向上，第二凹槽112的槽壁对应的模腔结构对物料的流动形成一次阻流，第一凹槽111的槽壁对应的模腔结构对物料的流动形成又一次的阻流，影响了与第一凹陷部122和第二凹陷部123一体成型的平整部121的厚度，最终影响了中框10的厚度。
传统技术中，第一凹槽的底壁为矩形，且物料的流动方向垂直于矩形的侧边，中框在压铸成型过程中，第一凹槽的槽壁对应的模腔结构对物料的阻流效果较强，排渣侧骨位易产生冷料不良，造成成型的中框的厚度较厚，例如第一凹陷部、第二凹陷部和平整部的厚度较厚，不利于中框整体的减薄。
本申请通过改变中框10中第一凹陷部122的形状，来降低第一凹陷部122对应的模腔结构对物料的阻流，减小排渣侧骨位易产生冷料的风险，避免成型的第一凹陷部122、第二凹陷部123和平整部121的厚度较厚，从而有利于中框10整体的减薄。
请参阅图6，图6是图4所示a部分的放大结构示意图。第一凹陷部122包括底壁1220、第一侧壁1221和第二侧壁1222。底壁1220的朝向与第一面1211的朝向相同。第一侧壁1221与第二侧壁1222分别与底壁1220相交。第一侧壁1221与第二侧壁1222相连且相交。示例性的，底壁1220的形状为四边形。第一凹槽111的槽壁还包括相连且相交的第三侧壁1223和第四侧壁1224。第三侧壁1223连接在第二侧壁1222和第四侧壁1224之间，第四侧壁1224第一侧壁1221和第三侧壁1223之间。第一侧壁1221、第二侧壁1222、第三侧壁1223、第四侧壁1224和底壁1220共同围设形成第一凹槽111。可以理解的，第一侧壁1221、第二侧壁1222、第三侧壁1223、第四侧壁1224和底壁1220均为第一凹槽111的槽壁。
如图4所示，在第一方向X上，第一侧壁1221和第二侧壁1222形成的开口逐渐变大。其中，在中框10压铸成型的过程中，第一方向X平行于压铸物料的流动方向。示例性的，第一方向X为填充物料沿中框10流动的最短方向。在本实施例中，以第一方向X为中框10的宽度方向为例来进行描写。可以理解的，第一方向X为中框10的短边方向。在其他实施例中，第一方向X也能够为中框10的其他方向，本申请对此并不限定。
本实施例中，在第一方向X上，第一侧壁1221和第二侧壁1222形成的开口逐渐变大，并且开口的方向与中框10在压铸成型的过程中流动的物料平行，物料沿第一侧壁1221和第二侧壁1222对应的模腔逐渐分散，降低第一侧壁1221和第二侧壁1222对应的模腔侧壁对物料的阻流，减小排渣侧骨位易产生冷料的风险，避免中框10中第一凹陷部122、第二凹陷部123和平整部121的厚度较厚，从而有利于中框10整体的减薄。
其中，平整部121的厚度减薄，相应地第一凹陷部122和第二凹陷部123的厚度也减薄。平整部121减薄的厚度可以与第一凹陷部122或第二凹陷部123减薄的厚度不同。示例性的，在第一方向X上，第一侧壁1221和第二侧壁1222形成的开口逐渐变大，能够使得平整部121的厚度降低0.05毫米以上，第一凹陷部122或第二凹陷部123的厚度降低0.03毫米以上。
其中，在沿物料的流动方向上，第一侧壁1221和第二侧壁1222形成的角度越小，第一 侧壁1221或第二侧壁1222与物料的流动方向形成的角度越小，第一侧壁1221或第二侧壁1222对物料的阻流越小。可以理解的，第一侧壁1221或第二侧壁1222与物料的流动方向垂直，及第一侧壁1221或第二侧壁1222与物料的流动方向为锐角时，第一侧壁1221或第二侧壁1222的部分结构背离物料的流动方向，导致第一侧壁1221或第二侧壁1222对物料的阻流较大。
在一些实施例中，第一侧壁1221和第二侧壁1222形成的角度为锐角。本申请并不限定第一侧壁1221和第二侧壁1222形成的具体角度。示例性的，第一侧壁1221与第二侧壁1222形成的角度小于或等于80度。
在本申请实施例中，第一侧壁1221和第二侧壁1222形成的角度位锐角，第一侧壁1221和第二侧壁1222形成的角度较小，中框10在压铸成型的过程中，第一侧壁1221和第二侧壁1222对物料的阻流较小，进一步地减小了第一凹槽111的槽壁对物料的阻流，更有利于减薄第一凹陷部122、第二凹陷部123和平整部121的厚度。
在一些实施例中，底壁1220的面积较大，提高中框10与电路板105的粘接面积，从而保证粘接层108粘接电路板105和中框10的稳固性。示例性的，第一侧壁1221与第二侧壁1222形成的角度大于或等于15度，避免第一侧壁1221和第二侧壁1222形成的角度较小而造成底壁1220的面积较小。可以理解的，第一侧壁1221和第二侧壁1222形成的角度不宜过小，也不宜过大。本申请并不限定第一侧壁1221和第二侧壁1222形成的锐角的具体角度，本领域技术人员能够根据实际需求对此进行设计。
在一些实施例中，第一侧壁1221的长度与第二侧壁1222的长度相等。第一侧壁1221和第二侧壁1222对称设置。在本实施例中，第一侧壁1221和第二侧壁1222对称设置，第一侧壁1221和第二侧壁1222对物料的阻流相同，有利于第一侧壁1221侧边结构与第二侧壁1222侧边结构的厚度排布均匀。
示例性的，第一侧壁1221、第二侧壁1222、第三侧壁1223和第四侧壁1224的形状均相同。在本实施例中，以底壁1220的形状为棱形为了来进行描写。在其他实施例中，第一侧壁1221的长度与第三侧壁1223的长度，或者第二侧壁1222的长度与第四侧壁1224的长度也可以不同，本申请对此并不限定。
请继续参阅图4和图5,在一些实施例中，第四凹槽114的形状与第一凹槽111的形状相同，且在第一方向X上，第四凹槽114相邻的两个侧壁形成开口逐渐变大。示例性的，第四凹槽114的底壁1220和第一凹槽111的底壁1220均呈棱形。第四凹槽114的槽深与第一凹槽111的槽深相同，第三凹槽113的槽深与第二凹槽112的槽深相同。
在此实施例中，第四凹槽114的形状与第一凹槽111的形状相同，且第四凹槽114相邻的两个侧壁形成的开口逐渐变大，中框10在压铸成型的过程中不仅降低了第一凹陷部122对应的模腔结构对物料的阻流，也降低了第二凹陷部123对应的模腔结构对物料的阻流，进一步地减小排渣侧骨位易产生冷料的风险，更有利于第一凹陷部122、第二凹陷部123和平整部121的减薄。
在其他实施例中，第四凹槽114的形状与第一凹槽111的形状也可以不同，本申请对此并不限定。例如，第一凹槽111的底壁1220呈菱形，第四凹槽114的底壁1220呈矩形。
请一并参阅图5和图7，图7是图3所示中框10在另一角度的结构示意图。图7是图4所示中框10翻转180度后的另一角度的结构示意图。
在此实施例中，第一凹槽111的底壁1220背离第一面1211的一侧与第二面1212齐平，第四凹槽114的底壁1220背离第一面1211的一侧与第二面1212齐平。其中，中框10沿第 二面1212角度的俯视图无法观察到第一凹槽111和第四凹槽114的形状，图7中用虚线标识第一凹槽111和第四凹槽114的结构，以示意出第一凹槽111和第四凹槽114的大致位置。在此实施例中，平整部121相背设置的两面均呈平面状。
请继续参阅图8和图9，图8是图1所示中框10在第二实施例中的结构示意图；图9是图8所示中框10沿B-B线处的截面示意图。在本实施例中的中框10包括第一实施例的大部分技术特征，以下本实施例与第一实施例相同的大部分技术方案内容不再赘述。例如，中框10包括一体成型的平整部121和第一凹陷部122，第一凹陷部122相对平整部121的第一面1211朝内凹陷，以形成第一凹槽111。其中，在第一方向X上，第一凹槽111相邻设置的第一侧壁1221和第二侧壁1222形成的开口逐渐变大。
在此实施例中,第三凹槽113与第二凹槽112错开设置，且沿第二方向Y上，第四凹槽114与第一凹槽111错开设置，第二方向Y垂直于第一方向X。示例性的，第二方向Y为中框10的长度方向。可以理解的，第四凹槽114和第一凹槽111在第一方向X上和第二方向Y上均错开设置。第三凹槽113和第二凹槽112仅在第一方向X上错开设置。如图9所示，中框10在沿与第一方向X平行线处的截面图中，仅体现出第三凹槽113、第二凹槽112和第一凹槽111，并未体现出第四凹槽114。
在本实施例中，第四凹槽114和第一凹槽111在第一方向X和第二方向Y上均错开设置，减小了第四凹槽114和第一凹槽111的重叠区域，避免中框10在成型过程中，在同一方向上模腔对物料形成双重或多重的阻流，减小了模腔对物料的排渣侧骨位的冷料风险，从而进一步地减小了第一凹陷部122、第二凹陷部123和平整部121的厚度。
请参阅图10，图10是图1所示中框10在第三实施例中的结构示意图。在本实施例中的中框10包括前述实施例的大部分技术特征，以下本实施例与前述实施例相同的大部分技术方案内容不再赘述。例如，中框10包括一体成型的平整部121和第一凹陷部122，第一凹陷部122相对平整部121的第一面1211朝内凹陷，以形成第一凹槽111。其中，在第一方向X上，第一凹槽111相邻设置的第一侧壁1221和第二侧壁1222形成的开口逐渐变大。
在此实施例中,第一凹槽111的底壁1220呈三角形。第一凹槽111的侧壁包括第一侧壁1221、第二侧壁1222和第三侧壁1223。第一侧壁1221、第二侧壁1222和第三侧壁1223彼此连接，并与底壁1220连接。示例性的，第一侧壁1221和第二侧壁1222形成的角度为60度，底壁1220呈等边三角形。
可以理解的，在第一方向X上，第一侧壁1221和第二侧壁1222形成的开口逐渐变大时，本申请例举了底壁1220的形状可以呈三角形，也可以呈平行四边形。在其他实施例中，底壁1220也可以呈其他形状，例如五边形或六边形等，本申请对此并不限定。
请参阅图11和图12，图11是图1所示中框10在第四实施例中的结构示意图；图12是图11所示中框10沿C-C线处的截面示意图。本实施例中的中框10包括前述实施例的大部分技术特征，以下本实施例与前述实施例相同的大部分技术方案内容不再赘述。例如，中框10包括一体成型的平整部121和第一凹陷部122，第一凹陷部122相对平整部121的第一面1211朝内凹陷，以形成第一凹槽111。其中，在第一方向X上，第一凹槽111相邻设置的第一侧壁1221和第二侧壁1222形成的开口逐渐变大。
在此实施例中，第一凹槽111自第一面1211朝第二面1212的一侧凹陷，且第一凹槽111的底壁1220背离第一面1211的一侧相对第二面1212凸出。如图11所示，中框10沿第二面1212角度的俯视图可以观察到第一凹槽111和第四凹槽114的形状。可以理解的，在第一凹槽111的槽深相等的情况下，第一凹槽111的底壁1220背离第一面1211的一侧相对第二面 1212凸出时，第一凹槽111的底壁1220更厚。
在此实施例中，第一凹槽111的底壁1220背离第一面1211的一侧相对第二面1212凸出，提升了第一凹槽111的底壁1220的厚度，中框10在成型过程中，物料沿第一凹槽111对应的模腔的阻流较小，减小排渣侧骨位易产生冷料的风险，避免成型的中框10的平整部121的厚度较厚，从而有利于减小中框10中平整部121的厚度。
在一些实施例中，第一凹槽111的底壁1220相对第二面1212凸出的高度小于或等于0.2毫米。示例性的，第一凹槽111的底壁1220相对第二面1212凸出的高度为0.16毫米、0.1毫米或0.05毫米。
在本实施例中，第一凹槽111的底壁1220相对第二面1212凸出的高度较小，适当增加第一凹槽111的底壁1220的厚度，避免第一凹槽111的底壁1220厚度较厚而增加中框10整体的厚度。
请继续参阅图13，图13是本申请实施例提供的电子设备100在另一实施例中的部分截面示意图。本实施例中的电子设备100包括前述实施例的大部分技术特征，以下本实施例与前述实施例相同的大部分技术方案内容不再赘述。例如，电子设备100包括电池102、显示屏107、中框10、主板、副板和电路板105。电池102、主板和副板位于中框10的同一侧，且错开设置。显示屏107和电池102分别安装于中框10相背设置的两侧。电路板105电性连接在主板和副板之间。中框10包括一体成型的平整部121和第一凹陷部122。第一凹陷部122相对平整部121凹陷，以形成第一凹槽111。平整部121设有相背设置的第一面1211和第二面1212。第一面1211面向电池102，第一凹槽111自第一面1211朝第二面1212的一侧凹陷。
在此实施例中，第一凹槽111的底壁1220背离第一面1211的一侧相对第二面1212凸出。在此实施例中，第一凹槽111的底壁1220背离第一面1211的一侧相对第二面1212凸出，提升了第一凹槽111的底壁1220的厚度，中框10在成型过程中，物料沿第一凹槽111对应的模腔的阻流较小，减小排渣侧骨位易产生冷料的风险，避免成型的中框10的平整部121的厚度较厚，从而有利于减小中框10中平整部121的厚度。
其中，电子设备100还包括辅助件109。辅助件109位于中框10与显示屏107之间。示例性的，辅助件109为散热片。散热片用于为显示屏107进行散热，以提高电子设备100的可靠性。本申请并不限定辅助件109的形状，图中辅助件109的形状仅为示例。散热片可以是但不仅限于石墨片。在其他实施例中，辅助件109也可以是泡棉或麦拉片等，本申请对此并不限定。
在此实施例中，辅助件109安装于第二面1212，且第一凹槽111的底壁1220相对第二面1212凸出的部分嵌设于第一辅助件109。在此实施例中，第一凹陷部122相对平整部121凸出的结构嵌设于辅助件109内，辅助件109吸收了第一凹陷部122相对平整部121凸出的结构，以使显示屏107可以相对中框10平整地安装。
可以理解的，辅助件109背离第二面1212的一侧为平整面，以使显示屏107平整地安装于辅助件109上。示例性的，当辅助件109为散热片时，辅助件109背离第二面1212的一侧为平整面，以使显示屏107与辅助件109充分接触，提高辅助件109对显示屏107的散热效果。
在一些实施例中，第一凹陷部122相对平整部121凹陷还形成第二凹槽112。第二凹槽112的开口与第一凹槽111的开口方向相同。其中，第一凹槽111位于第二凹槽112，且第一凹槽111的槽深大于第二凹槽112的槽深。电子设备100还包括粘接层108，粘接层108连接在电路板105与凹陷部之间。粘接层108收容于第一凹槽111，且电路板105的部分结构 收容于第二凹槽112。
在本实施例中，第一凹槽111的槽深大于所述第二凹槽112的槽深，以使粘接层108收容于第一凹槽111，且电路板105的部分结构收容于第二凹槽112，粘接层108和电路板105的厚度与中框10的厚度复用，减小了电子设备100的整体厚度。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内；在不冲突的情况下，本申请的实施例及实施例中的特征可以相互组合。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (13)

  1. 一种中框，所述中框采用压铸工艺制备，其特征在于，所述中框包括一体成型的平整部和第一凹陷部，所述第一凹陷部相对所述平整部的第一面朝内凹陷，以形成第一凹槽，所述第一凹槽的开口位于所述第一面；
    所述第一凹陷部包括底壁、第一侧壁和第二侧壁，所述底壁的朝向与所述第一面的朝向相同，所述第一侧壁与所述第二侧壁分别与所述底壁相交，所述第一侧壁与所述第二侧壁相连；在第一方向上，所述第一侧壁和所述第二侧壁形成的开口逐渐变大，且在所述中框压铸成型的过程中，所述第一方向平行于压铸物料的流动方向。
  2. 根据权利要求1所述的中框，其特征在于，所述第一侧壁和所述第二侧壁形成的角度为锐角。
  3. 根据权利要求1所述的中框，其特征在于，所述底壁的形状包括四边形或三角形等。
  4. 根据权利要求1至3所述的中框，其特征在于，所述第一凹陷部相对所述平整部凹陷还形成第二凹槽，所述第二凹槽的开口与所述第一凹槽的开口方向相同；其中，所述第一凹槽位于所述第二凹槽，且所述第一凹槽的槽深大于所述第二凹槽的槽深。
  5. 根据权利要求1至4中任一项所述的中框，其特征在于，所述平整部设有与所述第一面相背设置的第二面，所述第一凹槽自所述第一面朝所述第二面的一侧凹陷，所述底壁背离所述第一面的一侧相对所述第二面凸出。
  6. 根据权利要求5所述的中框，其特征在于，所述中框包括依次连接的第一板块、第二板块和第三板块，所述第一板块、所述第二板块和所述第三板块用于承载不同的部件；所述第二板块包括相背设置的第一端部和第二端部，所述第一端部连接所述第二板块，所述第二端部连接所述第三板块，所述第二凹槽自所述第一端部延伸至所述第二端部；其中，所述第一凹槽的数量为多个，多个所述第一凹槽间隔设置，且均位于所述第二凹槽。
  7. 根据权利要求6所述的中框，其特征在于，所述中框还包括第二凹陷部，所述第二凹陷部与所述平整部一体成型，且所述第二凹陷部相对所述平整部凹陷，以形成第三凹槽和第四凹槽，所述第三凹槽与所述第四凹槽均自所述第一面朝所述第二面的一侧凹陷，所述第四凹槽位于第三凹槽，且所述第四凹槽凹陷的深度大于所述第三凹槽凹陷的深度；
    在沿所述第一方向上，所述第三凹槽与所述第二凹槽错开设置，且沿第二方向上，所述第四凹槽与所述第一凹槽错开设置；其中，所述第二方向垂直于所述第一方向。
  8. 根据权利要求7所述的中框，其特征在于，所述第四凹槽的形状和所述第一凹槽的形状相同，且在所述第一方向上，所述第四凹槽相邻的两个侧壁形成的开口逐渐变大。
  9. 一种中框，所述中框采用压铸工艺制备，其特征在于，所述中框包括一体成型的平整部和第一凹陷部，所述第一凹陷部相对所述平整部凹陷，以形成第一凹槽，所述平整部设有相背设置的第一面和第二面，所述第一凹槽自所述第一面朝所述第二面的一侧凹陷，且所述第一凹槽的底壁背离所述第一面的一侧相对所述第二面凸出。
  10. 一种电子设备，其特征在于，包括电池和如权利要求1至9中任一项所述的中框，所述电池安装于所述中框。
  11. 根据权利要求10所述的电子设备，其特征在于，所述电子设备还包括电路板和粘接层，所述电路板在所述中框上的投影覆盖与所述第一凹陷部至少部分重叠，所述粘接层连接在所述电路板与所述第一凹陷部之间，且所述粘接层收容于所述第一凹槽。
  12. 一种电子设备，其特征在于，包括电池、显示屏、中框和辅助件，所述电池与所述显示屏均安装于所述中框，且所述电池与所述显示屏分别位于所述中框相背设置的两侧，所述 辅助件位于所述中框与所述显示屏之间；
    所述中框包括一体成型的平整部和第一凹陷部，所述第一凹陷部相对所述平整部凹陷，以形成第一凹槽，所述平整部设有相背设置的第一面和第二面，所述第一面面向所述电池，所述第一凹槽自所述第一面朝所述第二面的一侧凹陷，且所述第一凹槽的底壁背离所述第一面的一侧相对所述第二面凸出；其中，所述辅助件安装于所述第二面，且所述第一凹槽的底壁相对所述第二面凸出的部分嵌设于所述第一辅助件。
  13. 根据权利要求12所述的电子设备，其特征在于，所述第一凹陷部相对所述平整部凹陷还形成第二凹槽，所述第二凹槽的开口与所述第一凹槽的开口方向相同；其中，所述第一凹槽位于所述第二凹槽，且所述第一凹槽的槽深大于所述第二凹槽的槽深；
    所述电子设备还包括电路板和粘接层，所述粘接层连接在所述电路板与所述凹陷部之间，所述粘接层收容于所述第一凹槽，且所述电路板的部分结构收容于所述第二凹槽。
PCT/CN2022/087950 2021-04-30 2022-04-20 中框及电子设备 WO2022228239A1 (zh)

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