WO2022223191A1 - Méthode de fabrication d'un module optique et module optique - Google Patents

Méthode de fabrication d'un module optique et module optique Download PDF

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Publication number
WO2022223191A1
WO2022223191A1 PCT/EP2022/055579 EP2022055579W WO2022223191A1 WO 2022223191 A1 WO2022223191 A1 WO 2022223191A1 EP 2022055579 W EP2022055579 W EP 2022055579W WO 2022223191 A1 WO2022223191 A1 WO 2022223191A1
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WO
WIPO (PCT)
Prior art keywords
mass
functional structure
optical
optical element
optical module
Prior art date
Application number
PCT/EP2022/055579
Other languages
German (de)
English (en)
Inventor
Patrick HEIβLER
Markus Brehm
Original Assignee
Delo Industrie Klebstoffe Gmbh & Co. Kgaa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delo Industrie Klebstoffe Gmbh & Co. Kgaa filed Critical Delo Industrie Klebstoffe Gmbh & Co. Kgaa
Priority to EP22710572.3A priority Critical patent/EP4326543A1/fr
Publication of WO2022223191A1 publication Critical patent/WO2022223191A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00278—Lenticular sheets
    • B29D11/00307—Producing lens wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00365—Production of microlenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00432—Auxiliary operations, e.g. machines for filling the moulds
    • B29D11/00442—Curing the lens material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • B29D11/00807—Producing lenses combined with electronics, e.g. chips

Definitions

  • the invention relates to a method for producing an optical module and an optical module.
  • Laser-based measuring systems such as LiDAR (abbreviation for “Light detection and ranging”) and ToF (abbreviation for “Time of Flight”) for distance and speed measurement, as well as projection systems for 3D object recognition often have a laser-optical module. If an external force acts on this measuring system, a lens of the measuring system can be damaged in the worst case. As a result, a laser beam emitted by the measuring system can freely enter a human eye of a nearby user if there is no shut-off mechanism. This poses a risk to the user, especially in the case of widespread laser-optical measuring systems such as in smartphones or laser pointers.
  • switch-off mechanisms are implemented in the prior art by electrical circuits or by additional measuring systems within the module, as disclosed, for example, in US 2020 0 049 911 A1.
  • the latter use a transmitter and receiver diode to evaluate the scattering behavior of light on an opposite lens and indicate changed currents as soon as a cover is damaged.
  • the disadvantage of this approach is that more space is required for the corresponding diodes within the module. This stands in the way of ongoing miniaturization.
  • US 2019 0278 104 A1 describes an optical module with a protective device, which has conductor tracks integrated in the side walls having. In order to scatter the light of the emitting element, a cover with an appropriately structured optic is applied. Conductor tracks are also integrated in this cover, which are contacted with the conductor tracks of the side walls in order to measure a reference resistance. If the optics are damaged, the measured resistance changes and the light source is switched off.
  • a lithographic process is usually used to produce conductive structures at the wafer or panel level.
  • a conductor layer is applied to a substrate.
  • a positive photoresist is coated, usually by spin coating, and exposed through a mask.
  • the photoresist is dissolved and rinsed off at the exposed areas with a developer solution.
  • the open areas in which the photoresist has been removed are then removed in an etching process so that only the resist layer remains on the underlying conductor tracks.
  • the remaining paint is removed by a solvent washing process. What remains is a substrate with conductor tracks onto which optical structures can be applied using various processes. Such processes are correspondingly complicated and expensive.
  • US Pat. No. 10,155,872 B2 describes an optical device that is produced using the 3D printing process.
  • the conductive structures are inkjet printed with a conductive nanocomposite ink and the optics are printed with a transparent nanocomposite ink.
  • Acrylate formulations are intended specifically for the optical masses, which can be disadvantageous in a laser-based measuring system with continuous exposure to laser light. They tend to yellow or discolour.
  • the object of the invention is to overcome the disadvantages of the prior art and to provide a method that produces a one-piece and cost-effective optical module in a few method steps can provide.
  • the aim of the invention is to simplify the manufacturing process while at the same time achieving high yields and reduced manufacturing costs.
  • the object of the invention is achieved by a method for producing an optical module according to claim 1 and by an optical module according to claim 12.
  • the optical module according to the invention comprises an optical element and at least one functional structure which is connected to the optical element and has electrical conductivity and/or an aperture function.
  • the optical module is produced according to the invention by: a1) dosing a first curable composition (A) onto a substrate to form a pattern corresponding to the functional structure, the first curable composition (A) comprising at least one functional filler (K3) selected from The group consisting of dyes, pigments, conductive fillers, electrochromic materials, and combinations thereof; a2) optionally at least partially curing the first mass (A) to form the functional structure; a3) dosing a second hardenable composition (B) onto the first composition (A); and a4) subsequent curing of the second compound (B) and optionally the first compound (A) by light and/or heat to form the optical element connected to the functional structure.
  • K3 functional filler
  • the optical module is produced by: b1) dosing and curing of the second curable composition (B) to form the optical element; b2) metering the first mass (A) onto the optical element, forming a pattern corresponding to the functional structure; and b3) subsequent curing of the first mass (A) by light and/or heat with formation of the functional structure connected to the optical element.
  • the use of the first composition (A), which includes a functional filler (K3) and can be easily processed as a resin before curing, allows a high degree of flexibility in the formation of the functional structure, so that the manufacturing process is simplified and can be carried out cost-effectively.
  • the second mass (B) can be processed and structured in a simple manner as a resin before curing.
  • the first compound (A) is metered onto the already formed optical element from the second compound (B) and then cured, or the second compound (B) is applied to the already formed functional structure or a pattern corresponding to the functional structure from the first Mass (A) is dosed and then cured, resulting in a simple manufacturing process for the optical module.
  • the mass applied second can be applied to the previously metered and optionally hardened mass in a simple manner complementary to the already formed functional structure or to the already formed optical element without the formation of defects or empty spaces.
  • the function that the functional structure assumes in the manufactured optical module is determined by the selection of the functional filler (K3) in the first compound (A).
  • the functional structure is electrically conductive.
  • the functional structure forms a conductor structure or a conductor track of the optical module.
  • An electrically conductive functional structure is obtained when the functional filler (K3) comprises a conductive filler.
  • An electrically conductive functional structure makes it possible to detect damage to the optical module electrically, for example due to a change in the current flow or the interruption of a circuit in which the functional structure is contained.
  • the functional structure is at least partially impermeable to electromagnetic radiation, in particular to electromagnetic radiation with a wavelength in the visible and infrared range.
  • the functional structure serves as an aperture.
  • the functional filler (K3) comprises a dye and/or a pigment.
  • This variant makes it possible for the electromagnetic radiation to be shaped when it emerges from the optical module, specifically from the optical element, in order to create projections and patterns.
  • the metering of the first mass (A) to form the pattern corresponding to the functional structure can be done by means of stencil printing, screen printing, ink jetting, jetting or needle metering.
  • pattern corresponding to the functional structure means that the pattern essentially corresponds to the desired geometry of the functional structure, which is obtained from the pattern by at least partially curing the first mass (A).
  • a monolithic optical module is obtained after curing by exposure to actinic radiation and/or heating.
  • Monolithic modules are particularly desirable with regard to a desirable miniaturization of optical modules, for example to save installation space.
  • the first mass (A) having the functional filler (K3) suitable for the desired application can be obtained with little effort, since the flexible formation of the functional structure and the optical element
  • An initially not yet cured first mass (A) or second mass (B) allows a structuring of the functional structure or the optical element adapted to the intended application, while at the same time through final curing, the masses can be connected to one another in a simple manner to form a monolithic component.
  • the functional structure is present as an integral functional structure.
  • the functional structure is an integral part of the monolithic optical module and is embedded in the optical element in such a way that when the optical module is handled, a change in the alignment of the functional structure and the optical element to one another can be ruled out:
  • the functional structure can be optical module complete flush with a surface of the optical element, so that no parts of the functional structure protrude over the optical element.
  • the flush arrangement protects the functional structure from the optical element in such a way that detachment is not possible.
  • the use of two hardenable masses to produce the optical module enables a variable process control, depending on whether the optical element is formed first and then the functional structure is produced on the optical element, or whether a pattern corresponding to the functional structure is dosed and optionally hardened first and then the optical element is generated on the pattern or the functional structure.
  • the optical module is produced by a1) dosing the first mass (A) onto a substrate, forming a pattern corresponding to the functional structure; a2) at least partial hardening of the first mass (A) to form the functional structure; a3) dosing the second mass (B) onto the first mass (A); and a4) final curing of the second mass (B) and the at least partially cured first mass (A) by light and/or heat to form the optical element connected to the functional structure.
  • the first mass (A) is preferably metered onto a temporary substrate, the temporary substrate being in particular after a final Curing of the functional structure and the optical element can be detached from the optical module in a non-destructive manner. If a planar temporary substrate is used, a monolithic optical module can be obtained in a simple manner, in which the functional structure and the optical element terminate flush with one another.
  • the temporary substrate serves to simplify the handling of the first mass (A) during the manufacturing process of the optical module, specifically during the formation of the functional structure. Furthermore, the temporary substrate can mechanically stabilize the first mass (A) before curing, so that complicated patterns and geometries can be applied to the temporary substrate, which are reflected in the functional structure after the first mass (A) has cured.
  • final curing refers to the final curing process that the first mass (A) and the second mass (B) go through during the manufacturing process of the optical module. After the final curing, the first and the second mass have reached their respective final strength.
  • step a2) the first mass (A) can be partially cured by light and/or heat to form the functional structure.
  • a partially hardened functional structure can also serve particularly advantageously as a template for applying the second mass (B).
  • This method also includes the use of curable masses (A) which essentially completely cure in step a2) but still post-cure due to the treatment for curing the second mass (B) taking place in step a4).
  • a so-called “wet-on-wet process” is provided, in which step a2) is omitted and the second mass (B) is applied directly to the pattern formed from the first mass (A).
  • the two masses (A) and (B) are then in step a4) cured together. In this way, further process steps and associated costs can be saved.
  • the optical module is produced by: b1) dosing and curing of the second hardenable composition (B) to form the optical element; b2) metering the first mass (A) onto the optical element, forming a pattern corresponding to the functional structure; and b3) subsequent curing of the first mass (A) by light and/or heat with formation of the functional structure connected to the optical element
  • the optical element is first produced from the second mass (B), for example by known stamping processes.
  • the optical element can have an optical structure on one side. Furthermore, at least one cutout, into which the functional structure engages, can optionally be formed on the side on which the optical structure is located and/or on a side of the optical element opposite to the optical structure.
  • the at least one recess is designed to be complementary to the functional structure, so that the functional structure can be accommodated by the recess.
  • first mass (A) is metered into the at least one recess of the optical element that has already been formed and is then cured.
  • a monolithic optical module with a flush arrangement of functional structure and optical element can also be produced in this way.
  • the recess has, for example, a rectangular, curved or V-shaped cross section.
  • the optical structure can have any geometry required for the intended application of the optical module.
  • the optical structure convex or concave curved, planar, lattice, spherical, aspheric, freeform, stepped, Fresnel or metal lens shaped.
  • the optical structure can have a regular or pseudo-random geometry.
  • the optical structure and/or the at least one recess can be produced by stamping and/or dosing the second mass (B) onto a structured carrier substrate.
  • the second mass (B) is applied to the structured carrier substrate, a stamp is then pressed onto the second mass (B) and the second mass (B) is cured. This makes it possible to remove the structured substrate and/or the stamp without deforming the optical element produced in this way.
  • an optical element can be connected to a functional structure, for example a conductor structure, at the level of the carrier substrate.
  • the intermediate product produced in this way can then be further processed in the sense of steps b2) and b3) described above and provided with a further functional structure, for example a screen structure, on the surface opposite the carrier substrate.
  • the functional structure and the optical element can be present after the final curing in a precursor of the optical module, from which the optical module is produced by separating the precursor.
  • the optical module thus forms the smallest structural unit that can be multiplied as desired using the method according to the invention.
  • a large number of in particular identical optical modules can be obtained from the precursor, for example a wafer or a panel. In this way, the production speed or the production quantity of the optical modules can be increased.
  • the functional structure when separating the precursor is severed, an optical module is created in which the functional structure is only surrounded by the optical element on two adjacent sides. In the case of a conductive functional structure, this results in different possibilities for contacting. If the separation is carried out in such a way that only the hardened mass (B) forming the optical element is severed, the functional structure remains enclosed by the hardened mass (B) except for the area adjoining the carrier substrate. As a result, microstructures can also be reliably stabilized.
  • the first mass (A) and the second mass (B) each comprise a resin (K1) and a hardener and/or initiator (K2).
  • the first composition (A) also includes a functional filler (K3).
  • the same resin (K1) can be used in the first mass (A) and the second mass (B), or different resins (K1) can be used.
  • the same hardener and/or initiator (K2) can be used in the first compound (A) and the second compound (B), or different hardeners and/or initiators (K2) can be used.
  • the hardeners and/or initiators (K2) used in the respective compositions (A) and (B) are selected such that they can cure the resin (K1) used in the first composition (A) or the second composition (B). .
  • the first composition (A) and the second composition (B) are liquid at room temperature and are preferably present as one component. They can each be cured by actinic radiation and/or heat.
  • first mass (A) and the second mass (B) are described in detail below.
  • resin (K1) compounds can be used, by cationic polymerization and / or radical polymerization and / or by nucleophilic Addition polymerization and/or anionic polymerization can be cured.
  • the resin (K1) preferably comprises at least one cationically polymerizable compound.
  • the resin (K1) can be selected from the group consisting of epoxides (K1-1), oxetanes (K1-2), vinyl ethers (K1-3), maleimides (K1-4), isocyanates (K1-5), (meth ) acrylates (K1-6), hybrid compounds (K1-7) and combinations thereof.
  • the resin (K1) can be or comprise an epoxide (K1-1). Epoxides (K1-1) are preferably used as cationically curable components in the resin (K1).
  • the resins from the group of epoxides comprise one or more at least difunctional epoxide-containing compounds, which are structurally not further restricted. "At least difunctional" means that the epoxide-containing compound contains at least two epoxide groups.
  • Component (K1-1) particularly preferably comprises an at least difunctional aliphatic and/or cycloaliphatic epoxide.
  • Component (K1-1) particularly preferably comprises an at least difunctional aliphatic and/or cycloaliphatic epoxide.
  • all fully or partially hydrogenated analogues of aromatic epoxy resins can be used as cycloaliphatic epoxy compounds.
  • Aromatic epoxy resins can be used as a further epoxy compound as an alternative or in addition to aliphatic and/or cycloaliphatic epoxides.
  • Isocyanurates and other heterocyclic compounds substituted with epoxide-containing groups can also be used. Examples include triglycidyl isocyanurate and monoallyl diglycidyl isocyanurate.
  • epoxide-containing compounds of which preferably at least one is difunctional or higher.
  • monofunctional epoxides can also be used as reactive diluents.
  • Examples of commercially available epoxide-containing compounds of the substance classes listed are products sold under the trade names CELLOXIDETM 2021 P, CELLOXIDETM 8000 by Daicel Corporation, Japan, as EPIKOTETM RESIN 828 LVEL, EPIKOTETM RESIN 166, EPIKOTETM RESIN 169 by Hexion B.V., Netherlands, as Eponex 1510 from Hexion, as EpiloxTM resins A, T and AF series from Leuna Harze, Germany, or as EPICLONTM 840, 840-S, 850, 850-S, EXA850CRP, 850-LC from DIC K.K.
  • the resin (K1) may be or comprise an oxetane (K1-2). Oxetanes (K1-2) can serve as cationically curable components in the resin (K1).
  • Oxetanes (K1-2) are used in particular in addition to an epoxide (K1-1) in the first composition (A) and/or the second composition (B).
  • oxetanes examples include bis(3-ethyl-3-oxetanylmethyl) ether (DOX), 3-allyloxymethyl-3-ethyloxetane (AQX), 3-ethyl-3-(phenoxy methyl)oxetane (POX), 3 - Ethyl-3-hydroxymethyl-oxetanes (OXA), 1,4-bis[(3-ethyl-3-oxetanylmethoxy)methyl]benzene (XDO), 3-ethyl-3-[((2-ethylhexyl)oxy)methyl ]oxetanes (EHOX).
  • DOX bis(3-ethyl-3-oxetanylmethyl) ether
  • DOX 3-allyloxymethyl-3-ethyloxetane
  • POX 3-ethyl-3-(phenoxy methyl)oxetane
  • OXA 1,4-bis[(3-ethyl-3-ox
  • the resin (K1) can be or comprise a vinyl ether (K1-3).
  • Vinyl ether compounds can also serve as a cationically curable component in the resin (K1).
  • Vinyl ethers (K1-3) are used in particular in addition to an epoxide (K1-1) and optionally an oxetane (K1-2) in the first composition (A) and/or the second composition (B).
  • Suitable vinyl ethers are trimethylolpropane trivinyl ether, ethylene glycol divinyl ether and cyclic vinyl ether and mixtures thereof. Furthermore, vinyl ethers of polyfunctional alcohols can be used.
  • the resin (K-1) may be or comprise a maleimide.
  • Maleimides serve as a component in the resin (K1) which can be cured by free radicals and/or by nucleophilic addition.
  • the resin (K-1) can be or comprise an isocyanate (K1-5).
  • Isocyanates (K1-5) serve as components in the resin (K1) that can be cured by nucleophilic addition.
  • the isocyanate (K1-5) is preferably an aliphatic, cycloaliphatic, heterocyclic or aromatic polyisocyanate.
  • Suitable polyisocyanates which may be mentioned are: hexamethylene diisocyanates (HDI), 1-isocyanato-3,3,5-trimethyl-5-isocyanatomethylcyclohexane (isophorone diisocyanate, IPDI), bis(isocyanatomethyl)cyclohexane (HXDI), diphenylmethane 2,2' -, 2,4'- and/or 4,4'-diisocyanate (MDI), dimeric 2,4-diisocyanatotoluene, dimeric 4,4'-diisocyanatodiphenylmethane,
  • HDI hexamethylene diisocyanates
  • IPDI isophorone diisocyanate
  • HXDI bis(isocyanatomethyl)cyclohexane
  • MDI diphenylmethane 2,2' -, 2,4'- and/or 4,4'-diisocyanate
  • MDI dimeric 2,4
  • Dimeric 2,4-diisocyanatotoluene, dimeric 4,4'-diisocyanatodiphenylmethane, 3,3'-diisocyanato-4,4'-dimethyl-N,N'-diphenylurea and/or the isocyanurate of isophorone diisocyanate are preferred.
  • the isocyanates (K1-5) can be used alone or in a mixture of two or more of the polyisocyanates.
  • the isocyanate (K1-5) can also be present in the compositions in passivated form.
  • the surface of the isocyanate can be covered with an inert particle layer or, as in EP 0 153 579 A2 or EP 0 100508 B1, deactivated by reaction with amines to form urea groups.
  • Such passivated, latently reactive isocyanate formulations are described in DE 102018 102 916 A1.
  • the resin (K-1) can be or comprise a (meth)acrylate (K1-6).
  • (Meth)acrylates (K1-6) serve as components in the resin (K1) which can be cured by free radicals and/or by nucleophilic addition.
  • the (meth)acrylates (K1-6) are not further restricted in their chemical structure.
  • both aliphatic and aromatic (meth)acrylates can be used.
  • the compound (K1-6) is preferably at least difunctional.
  • the following compounds are suitable, for example: isobornyl acrylate, stearyl acrylate, tetrahydrofurfuryl acrylate, cyclohexyl acrylate, 3,3,5-trimethylcyclohexanol acrylate, behenyl acrylate, 2-methoxyethyl acrylate and other mono- or polyalkoxylated alkyl acrylates, isobutyl acrylate, isooctyl acrylate, lauryl acrylate, tridecyl acrylate, isostearyl acrylate, 2-( o-phenylphenoxy)ethyl acrylate, acryloylmorpholine, N,N-dimethylacrylamide, 4-butanediol diacrylate, 1,6-hexanediol diacrylate, 1,10-decanediol diacrylate, tricyclodecanedimethanol diacrylate, dipropylene glycol diacrylate, triprop
  • Urethane acrylates based on polyesters, polyethers, polycarbonate diols, polybutadiene diols and/or hydrogenated polybutadiene diols can be used as higher molecular weight compound (K1-6).
  • K1-6 higher molecular weight compound
  • a combination of several compounds (K1-6) is also suitable for use as the resin component for the two compositions in the process of the invention.
  • Hybrid compounds (K1-71) can be used in the resin (K1). In addition to at least one of the cationically polymerizable groups mentioned, these also contain radically and/or anionically and/or by nucleophilic addition curable groups.
  • epoxy-(meth)acrylate hybrid compounds are within the meaning of the invention.
  • epoxy (meth)acrylates examples include CYCLOMER M100 from Daicel, UVACURE 1561 from UCB, Miramer PE210HA from Miwon Europe GmbH, epoxy acrylate Solmer SE 1605 and Solmer PSE 1924 from Soltech Ltd. Also oxetane-(meth)acrylates like that Eternacoll OXMA from UBE Industries LTD can be used as a hybrid compound.
  • allyl groups such as 1,3,5-triazine-2,4,6(1H,3H,5H)-trione, which is commercially available as TAICROS® .
  • Unhydrogenated polybutadienes with free double bonds such as the Poly BD® types, can also be used as free-radically curable compounds.
  • the resin (K1) can comprise one or more at least dihydric alcohols, which are used as chain transfer agents.
  • High molecular weight polyols in particular can be used to make cationic masses flexible.
  • Suitable polyols are available, for example, based on polyethers, polyesters, polycaprolactones, polycarbonates, polybutadiene diols or hydrogenated polybutadiene diols.
  • Examples of commercially available polyols of higher molecular weight are products sold under the trade names Eternacoll UM-90 (1/1), Eternacoll UHC50-200 from UBE Industries Ltd., as CapaTM 2200, CapaTM 3091 from Perstorp, as Liquiflex H from Petroflex, as Merginol 901 from HOBUM Oleochemicals, as Placcel 305, Placcel CD 205 PL from Daicel Corporation, as Priplast 3172, Priplast 3196 from Croda, as Kuraray Polyol F-3010, Kuraray Polyol P-6010 from Kuraray Co., Ltd., as Krasol LBH-2000, Krasol HLBH-P3000 from Cray Valley or as Hoopol S-1015-35 or Hoopol S-1063-35 from Synthesia Technology SLU.
  • Component (K2) Hardener and/or initiators
  • Amines (K2-1), anhydrides (K2-2), thiols (K2- 3), alcohols (K2-4), peroxides (K2-5), photoinitiators for the free-radical polymerization (K2-6) and/or initiators for cationic polymerization (K2-7) are used.
  • the hardeners and/or initiators (K2) used in each case in the compositions (A) and (B) can be the same or different.
  • the hardeners and/or initiators (K2) are selected in such a way that curing of the resin (K1) used in each case with the hardener and/or initiator (K2) used therein is made possible.
  • the resins (K1) and hardeners and/or initiators (K2) described can be combined with one another in a suitable manner for both compositions.
  • Hybrid formulations which contain differently polymerizable resins (K1) are also within the meaning of the invention.
  • Amines and nitrogen-containing compounds derived therefrom can be used as hardeners for the epoxy-containing or isocyanate-containing resin components.
  • suitable nitrogen-containing compounds include, in particular, aliphatic polyamines, arylaliphatic polyamines, cycloaliphatic polyamines, aromatic polyamines and heterocyclic polyamines, as well as imidazoles, cyanamides, polyureas, Mannich bases, polyetherpolyamines, polyaminoamides, phenalkamines, sulfonamides, aminocarboxylic acids or combinations of the substance classes mentioned. Reaction products of epoxides and/or anhydrides and the nitrogen-containing compounds mentioned above can also be used as curing agents.
  • an amine (K2-1) is used in the hardener and/or initiator (K2), in particular no initiator for the cationic polymerization (K2-7) is contained in the respective composition.
  • anhydrides which can be used in the present compositions as curing agents (K2) for epoxides include the anhydrides of dibasic acids, such as phthalic anhydride (PSA), succinic anhydride, octenyl succinic anhydride (OSA), pentadodecenyl succinic anhydride and others
  • Alkenylsuccinic anhydrides Maleic anhydride (MA), Itaconic anhydride (ISA), Tetrahydrophthalic anhydride (THPA), Hexahydrophthalic anhydride (HHPA), Methyltetrahydrophthalic anhydride (MTHPA), Methylhexahydrophthalic anhydride (MHHPA), Nadic anhydride, 3,6-Endomethylenetetrahydrophthalic anhydride, Methylenedomethylenetetrahydrophthalic anhydride (METH, NMA), tetrabromophthalic anhydride and trimellitic anhydride, and the anhydrides of aromatic tetraprotic acids, such as biphenyltetracarboxylic dianhydrides, naphthalenetetracarboxylic dianhydrides, diphenylethertetracarboxylic dianhydrides, butanetetracarboxylic dianhydrides, cyclopentanetetracarboxylic dianhydr
  • MHHPA methylhexahydrophthalic anhydride
  • MTHPA methyltetrahydrophthalic anhydride
  • METH, NMA methylendomethylenetetrahydrophthalic anhydride
  • K2 hydrogenation product as hardener
  • the preferred anhydrides for use as curing agents are commercially available, for example, under the following trade names: MHHPA, for example, under the trade names HN-5500 (Hitachi Chemical Co., Ltd.) and MHHPA (Dixie Chemical Company, Inc.), METH under the trade names NMA (Dixie Chemical Company, Inc.), METH/ES (Polynt S.p.A.) and MHAC (Hitachi Chemical Co., Ltd.).
  • this includes at least one compound with at least two thiol groups (-SH) in the molecule.
  • thiols are not further restricted in their chemical structure and preferably include aromatic and aliphatic thiols and combinations thereof.
  • the at least difunctional thiol is preferably selected from the group consisting of ester-based thiols, polyethers with reactive thiol groups, polythioethers, polythioetheracetals, polythioetherthioacetals, polysulfides, thiol-terminated urethanes, thiol derivatives of isocyanurates and glycoluril, and combinations thereof.
  • ester-based thiols based on 2-mercaptoacetic acid examples include trimethylolpropane trimercaptoacetate, pentaerythritol tetramercaptoacetate and glycol dimercaptoacetate, available under the brand names ThiocureTM TMPMA, PETMA and GDMA from Bruno Bock.
  • ester-based thiols include trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptobutyrate), glycol di(3-mercaptopropionate), and tris[2-(3-mercaptopropionyloxy)ethyl]isocyanurate, which are listed under are available under the brand names ThiocureTM TMPMP, PETMP, GDMP and TEMPIC from Bruno Bock.
  • thioethers examples include DMDO (1,8-Dimercapto-3,6-dioxaoctanes) available from Arkema S.A., DMDS (Dimercaptodiethylsulfide) and DMPT (2,3-Di((2-mercaptoethyl)thio)-1 -propane-thiol), both available from Bruno Bock.
  • DMDO 1,8-Dimercapto-3,6-dioxaoctanes
  • DMDS Dimercaptodiethylsulfide
  • DMPT 2,3-Di((2-mercaptoethyl)thio)-1 -propane-thiol
  • ester-free thiols are particularly preferred with reference to increased resistance of the cured masses to temperature and moisture. Examples of ester-free thiols can be found in JP 2012 153 794 A.
  • TM PI tris(3-mercaptopropyl)isocyanurate
  • Ester-free thiols based on a glycoluril compound are known from EP 3 075 736A1. These can also be used as hardeners (K2), alone or mixed with other at least difunctional thiols.
  • At least difunctional alcohols can also be used as hardeners for isocyanates. These are not further restricted in their chemical structure.
  • the alcohol preferably comprises a long-chain polyol with an average molecular weight M n of 400 to 20,000 g/mol.
  • suitable long-chain polyols are polyether-based polyols, commercially available as Acclaim® grades, polyesters and polycarbonates, available as Kuraray® or PriplastTM grades, and also polybutadiene- and hydrogenated polybutadiene-based polyols, available as Krasol ® - Polyvest ® - or Nisso-PB ® types.
  • Long-chain polyols with an average molecular weight of 2000 to 20,000 g/mol are particularly suitable for the production of compounds which, after curing, have high flexibility at low temperatures and a low glass transition temperature.
  • a low-molecular polyol with a molecular weight of up to 400 g/mol such as glycol, glycerol, 1,4-butanediol or 2-ethyl-1,3-hexanediol, can serve as chain extender.
  • Peroxy compounds of the perester, diacyl peroxide, peroxy(di)carbonate and/or hydroperoxide type in particular can be used as free-radical initiators for the (meth)acrylates or maleimides described in the compositions according to the invention.
  • Hydroperoxides are preferably used.
  • Cumene hydroperoxide, tert-amyl peroxy-2-ethylhexanoate and di-(4-tert-butyl-cyclohexyl)-peroxydicarbonate are used as particularly preferred peroxides.
  • the first material (A) and/or the second material (B) can also contain a photoinitiator for the free-radical polymerization (K2-6), in particular for the free-radical polymerization of the (meth)acrylate-containing compound (K1-6).
  • Photoinitiators (K2-6) which can be used are the customary, commercially available compounds, such as a-hydroxyketones, Benzophenone, a,a'-diethoxyacetophenone, 4,4-diethylaminobenzophenone, 2,2-dimethoxy-2-phenylacetophenone, 4-isopropylphenyl 2-hydroxy-2-propyl ketone, 1-hydroxycyclohexylphenyl ketone, isoamyl p-dimethylaminobenzoate , methyl 4-dimethylaminobenzoate, methyl o-benzoylbenzoate, benzoin, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 2-isopropylthioxanthone, dibenzosuberone, 2,4 ,6-Trimethylbenzoyl-diphenylphos
  • the OmniradTM types from IGM Resins can be used as UV photoinitiators, such as the types Omnirad 184, Omnirad 500, Omnirad 1173, Omnirad 2959, Omnirad 754, Omnirad 651, Omnirad 369, Omnirad 907, Omnirad 819, Omnirad 819DW , Omnirad 2022, Omnirad 2100, Omnirad 784, Omnirad TPO, Omnirad TPO-L, Omnirad MBF and Omnirad 4265.
  • UV photoinitiators such as the types Omnirad 184, Omnirad 500, Omnirad 1173, Omnirad 2959, Omnirad 754, Omnirad 651, Omnirad 369, Omnirad 907, Omnirad 819, Omnirad 819DW , Omnirad 2022, Omnirad 2100, Omnirad 784, Omnirad TPO, Omnirad TPO-L, Omnirad MBF and Omnirad 4265.
  • the photoinitiator (K2-6) which can be replaced in the masses can preferably be activated by actinic radiation with a wavelength of from 200 to 400 nm, particularly preferably from 250 to 365 nm.
  • the first material (A) and/or the second material (B) can contain an initiator for the cationic polymerization (K2-7).
  • Examples of different anions of the metallocenium salts are HSO 4 , PFe , SbFe , AsF 6 , CI , Br, h, CIO 4 , PO 4 , SO 3 CF 3 , OTs (tosylate), aluminates and borate anions such as BF 4 and B(CeF 5 ) 4 _ .
  • the initiator for the cationic polymerization (K2-7) based on a metallocenium compound is preferably selected from the group of the ferrocenium salts.
  • Such ferrocenium salts are commercially available, for example, as R-gen 262 from Chitec.
  • Preferred onium compounds are selected from the group consisting of arylsulfonium salts, aryliodonium salts and combinations thereof and are described in the prior art.
  • the cationic polymerization initiator (K2-7) may be a photolatent acid.
  • Triarylsulfonium base are available under the brand names Chivacure 1176, Chivacure 1190 from Chitech, Omnicat 432, Omnicat 270 and Omnicat 320 from IGM Resins, Irgacure 290 and Irgacure GSID 26-1 from BASF, Speedcure 976 and Speedcure 992 from Lambson , TTA UV-692, TTA UV-694 from Jiangsu Tetra New Material Technology Co., Ltd. or UVI-6976 and UVI-6974 available from Dow Chemical Co.
  • Diaryliodonium bases are available, inter alia, under the brand names UV1242 or UV2257 from Deuteron and Bluesil 2074 from Bluestar.
  • the photolatent acids used in the compositions can preferably be activated by irradiation with actinic radiation having a wavelength of from 200 to 480 nm.
  • an initiator for the cationic polymerization (K2-7) is used in the hardener and/or initiator (K2), in particular no amine (K2-1) is contained in the respective composition.
  • composition (A) and/or the composition (B) can also contain a thermal initiator for the cationic polymerization.
  • Quaternary N-benzylpyridinium salts and N-benzylammonium salts are suitable as thermal acid generators.
  • heat-latent sulfonium salts as described in WO 2019 043 778 A1, can also be used as acid generators.
  • Commercially available products are available under the designations K-PURE CXC-1614 or K-PURE CXC-1733 from King Industries Inc.; SAN-AID SI-80L and SAN-AID SI-100L are available from SAN-SHIN Chemical Industry Co. Ltd.
  • the first mass (A) also contains a functional filler (K3) from the group of dyes (K3-1), pigments (K3-2), conductive fillers (K3-3), electrochromic materials (K3 -4) and combinations thereof.
  • a functional filler K3 from the group of dyes (K3-1), pigments (K3-2), conductive fillers (K3-3), electrochromic materials (K3 -4) and combinations thereof.
  • Organic or inorganic compounds can be used as dyes (K3-1) or pigments (K3-2).
  • organic dyes which may be mentioned are azo, cyanine, dioxazine, methine, indigoid, nitro and nitroso, anthraquinone dyes.
  • inorganic pigments (K3-2) are carbon black, chromium antimony titanate, cobalt aluminate blue, manganese antimony titanate,
  • cobalt titanate green iron oxides, bismuth vanadates, chromium oxides and titanium dioxide.
  • the functional filler (K3) is preferably carbon black.
  • conductive fillers K3-3
  • the conductive fillers are selected from the group consisting of Group 4 to 14 metals and their oxides, nitrides, carbides, borides and alloys, conductive carbon compounds, and combinations thereof.
  • Metals from groups 4 to 14 include, in particular, titanium, zirconium, iron, ruthenium, osmium, cobalt, rhodium, iridium, nickel, palladium, platinum, copper, silver, gold, zinc, cadmium, mercury, boron, aluminum, gallium, indium, Thallium, germanium, tin and lead into consideration, as well as their oxides, nitrides, carbides, borides, alloys or combinations thereof.
  • Glass or polymer spheres coated with the metals mentioned can also be used.
  • Silver, nickel or gold, particularly preferably silver, is preferably used as the conductive functional filler (K3-3).
  • conductive modifications of the carbon such as CNTs (carbon nanotubes) can also be used as conductive functional filler (K3-3).
  • electrochromic materials K3-4
  • K3-4 electrochromic materials
  • These can be switched by applying an electrical voltage and allow switching states with different transmissions.
  • different aperture geometries can also be implemented dynamically through different switching states.
  • Suitable electrochromic materials based on organic compounds include PEDOT:PSS as disclosed in US Pat. No. 7,342,708 B2, diarylcyclopentenes from US Pat 877 313 A
  • the first mass (A) and the second mass (B) can also contain optional components as additives.
  • the additives are preferably from the group of fillers, antioxidants, fluorescent agents, stabilizers,
  • Polymerization accelerators sensitizers, adhesion promoters, drying agents, crosslinkers, flow improvers, wetting agents, thixotropic agents, diluents, flexibilizers, polymeric thickeners, flame retardants, corrosion inhibitors, plasticizers, optical modifiers, tackifiers, and combinations thereof.
  • the second mass (B) for forming the optical element can contain additives as optical modifiers for adjusting the optical properties of the mass, in particular the refractive index.
  • additives can be dispersed in a corresponding resin matrix. Suitable dispersions based on zirconium dioxide are disclosed, for example, in US 2015 0 203 989 A1. High-index materials based on titanate are described in US 2017 0200 919 A1.
  • metal oxides it is also possible to use corresponding monomers or resins which intrinsically have a high refractive index.
  • US 20180 079 761 A1 discloses phenyl-substituted siloxane monomers with a high refractive index, which can optionally be combined with other nanoparticulate fillers.
  • Fluorinated or partially fluorinated resins are particularly suitable for setting a low refractive index. Suitable resin components can be found in US Pat. No. 7,537,828 B2.
  • the first mass (A) comprises a resin (K1), a hardener (K2), but no initiator for cationic and/or free-radical polymerization, a functional filler (K3) and optionally at least one additive (K4).
  • the resin component (K1) is in the first composition (A), based on the total weight of the first composition (A), in particular in a proportion of 5 to 50% by weight, preferably in a proportion of 10 to 35% by weight.
  • the hardener (K2) is present in the first composition (A), based on the total weight of the first composition (A), in particular in a proportion of 5 to 50% by weight, preferably in a proportion of 10 to 35% by weight.
  • the first mass (A) comprises a resin (K1), an initiator (K2) for cationic and/or free-radical polymerization, but no curing agent, a functional filler (K3) and optionally at least one additive (K4).
  • the resin component (K1) is present in the first composition (A), based on the total weight of the first composition (A), in particular in a proportion of 5 to 95% by weight, preferably in a proportion of 10 to 35% wt%.
  • the initiator for the cationic and/or free-radical polymerization (K2) is present in the first composition (A), based on the total weight of the first composition (A), in particular in a proportion of 0.001 to 5% by weight , preferably in a proportion of 0.01 to 5 wt .-%.
  • the first composition (A) comprises a resin (K1), a hardener and an initiator (K2) for cationic and/or free-radical polymerization, a functional filler (K3) and optionally at least one additive (K4).
  • the resin component (K1) is present in the first composition (A), based on the total weight of the first composition (A), in particular in a proportion of 5 to 50% by weight, preferably in a proportion of 10 to 35% wt%.
  • the hardener (K2) is present in the first composition (A), based on the total weight of the first composition (A), in particular in a proportion of 5 to 50% by weight, preferably in a proportion of 10 to 35% by weight.
  • the initiator (K2) for the cationic and/or free-radical polymerization is in the first composition (A), based on that Total weight of the first mass (A), in particular in a proportion of 0.001 to 5% by weight, preferably in a proportion of 0.01 to 3% by weight.
  • the first composition (A) also includes a functional filler (K3). If an electrically conductive filler (K3-3) is used, it is present in particular in a proportion of at least 50% by weight, preferably in a proportion of at least 70% by weight, based in each case on the total weight of the first composition (A ). When an electrically conductive filler (K3-3) is used, the functional filler (K3) is present in particular in a proportion of at most 90% by weight, based on the total weight of the first composition (A).
  • the proportion of the functional filler can be in a range from 0.1 to 50 Weight percent are preferably 0.5 to 30 weight percent, based in each case on the total weight of the first composition (A).
  • additives (K4) are present in the embodiments of the first composition (A), these are present, based on the total weight of the first composition (A), in particular in a proportion of 0 to 50% by weight, preferably in one Proportion of 1 to 30% by weight.
  • the first mass (A) can consist of the respective components (K1) to (K4).
  • the resin (K1) of the first composition (A) is preferably selected from the group consisting of epoxides (K1-1), oxetanes (K1-2), isocyanates (K1-5) and combinations thereof, particularly preferably from the group consisting of epoxides (K1-1), isocyanates (K1-5) and combinations thereof.
  • the hardener and/or initiator (K2) of the first mass (A) is preferably selected from the group consisting of amines (K2-1), anhydrides (K2-2), thiols (K2-3), initiators for cationic polymerization ( K2-7) and combinations thereof, particularly preferably selected from the group consisting of amines (K2-1) or initiators for cationic polymerization (K2-7).
  • a hardener (K2) based on nitrogen-containing compounds is very particularly preferred.
  • the hardener (K2) based on a nitrogen-containing compound is preferably present in solid form in the first composition (A) and has a melting point of less than 150° C., preferably less than 110° C.
  • the first composition (A) comprises or consists of the following components, based in each case on the total weight of the first composition (A): a) 10 to 40% by weight of an addition-crosslinking component, resin (K1) being preferred comprises at least difunctional epoxides (K1-1) or isocyanates (K1-5) and combinations thereof; b) 10 to 40% by weight of a hardener (K2) based on nitrogen-containing compounds; c) at least 50% by weight of the functional filler (K3) based on a metal selected from the group consisting of aluminum, copper, nickel, silver, gold and combinations thereof; and d) 0 to 30% by weight of additives (K4).
  • resin (K1) being preferred comprises at least difunctional epoxides (K1-1) or isocyanates (K1-5) and combinations thereof
  • the at least difunctional epoxide (K1-1) preferably has at least 10% by weight of an aliphatic and/or cycloaliphatic epoxide, based on the total weight of the first composition (A).
  • the first composition (A) comprises or consists of the following components, based in each case on the total weight of the first composition (A): a) 10 to 99.9% by weight of a cationically polymerizable component, the resin ( K1) preferably comprises at least difunctional epoxides (K1-1) or oxetanes (K1-2) and combinations thereof; b) 0.001 to 5% by weight of an initiator (K2) for the cationic
  • the at least difunctional epoxide (K1-1) preferably has at least 10% by weight of an aliphatic and/or cycloaliphatic epoxide, based on the total weight of the first composition (A).
  • the second composition (B) comprises a resin (K1), an initiator (K2) for the cationic and/or free-radical polymerization, but no hardener and optionally at least one additive (K4).
  • the resin component (K1) is present in the second mass (B), based on the total weight of the second mass (B), in particular in a proportion of 10 to 99.99% by weight, preferably in a proportion of 10 up to 80% by weight.
  • the initiator for the cationic and/or free-radical polymerization (K2) is present in the second composition (B), based on the total weight of the second composition (B), in particular in a proportion of 0.001 to 5% by weight , preferably in a proportion of 0.01 to 5 wt .-%.
  • the second mass (B) has no functional filler (K3) that is electrically conductive or fulfills a diaphragm function.
  • additives (K4) are contained in the embodiments of the second mass (B), these are present in a proportion of 0 to 80% by weight, based on the total weight of the second mass (B), preferably in a proportion of 1 to 45% by weight.
  • the second mass (B) can consist of the components (K1), (K2) and (K4).
  • the resin (K1) of the second mass (B) is preferably selected from the group consisting of epoxides (K1-1), oxetanes (K1-2), (meth)acrylates (K1-6) and combinations thereof, particularly preferably from the Group consisting of epoxides (K1-1), (meth)acrylates (K1-6) and combinations thereof.
  • the second composition (B) comprises or consists of the following components, based in each case on the total weight of the first composition (B): a) 67 to 98.7% by weight of an at least difunctional epoxide (K1-1) containing at least one aliphatic and/or cycloaliphatic epoxide, or a (meth)acrylate (K1-6); b) 0.3 to 3% by weight of an initiator (K2) for cationic polymerization, selected from the group of sulfonium, iodonium or metallocenium salts, or an initiator (K2) for free-radical polymerization; c) 1 to 45% by weight of additives (K4).
  • the at least difunctional epoxide (K1-1) preferably has at least 20% by weight of an aliphatic and/or cycloaliphatic epoxide, based on the total weight of the second composition (B).
  • the second mass (B) has in particular a transmission of greater than 90%, preferably greater than 95%, in the spectral range from 380-2500 nm, measured at a layer thickness of approximately 200 ⁇ m.
  • the transmission is preferably measured at a defined wavelength which corresponds to the wavelength desired for the respective optical application or is in the wavelength range of the desired optical application.
  • compositions (A) and (B) are preferably used in the compositions (A) and (B). It is particularly preferred to use a cationically polymerizable composition both for the first (A) and for the second composition (B).
  • a cationically polymerizable composition both for the first (A) and for the second composition (B).
  • the combinations given in Table 1 under Nos. 2 to 6 are preferred.
  • Table 1 Preferred combinations of components of the first (A) and second composition (B).
  • Combinations nos. 1, 2 and 6 are particularly preferred for the purposes of the invention.
  • optical element is first formed on the basis of a cationically polymerizable epoxy compound (A) and is fully cured, it is also conceivable to use an epoxy-amine-based compound (B) for the functional structure.
  • optical module that can be obtained using the method described above, comprising a functional structure and an optical element connected to the functional structure with an optical structure, the functional structure having electrical conductivity and/or an aperture function.
  • the functional structure in the optical module is preferably arranged flush with a surface of the optical element.
  • the optical module can be used in an optical device, the optical device additionally comprising a light-emitting element assigned to the optical module.
  • the optical module can in particular interrupt the flow of electrical current and thus switch off the light-emitting element.
  • a malfunction can be understood, for example, as damage in the form of a break or a partial or complete loss of contact between the optical module and at least one other component of the optical device.
  • the functional structure can form a beam path of the light-emitting element to create patterns or projections. DESCRIPTION OF THE DRAWINGS
  • FIG. 1a to 1h schematic cross-sectional views of the manufacturing steps of a first embodiment of a method according to the invention for manufacturing an optical module
  • FIG. 2a to 2e schematic cross-sectional views of the manufacturing steps of a second embodiment of a method according to the invention for manufacturing an optical module
  • FIG. 3a to 3c schematic top views of the functional structures of different geometries as they are produced in the method according to the invention according to Fig. 1a to 1h or Fig. 2a to 2e,
  • FIG. 4a to 4c schematic cross-sectional views of different isolated optical modules as they can be produced by the method according to the invention according to Fig. 1a to 1h or Fig. 2a to 2e,
  • FIG. 5a to 5c schematic cross-sectional views of further isolated optical modules as can be produced by the method according to the invention according to Fig. 1a to 1h or Fig. 2a to 2e,
  • FIGS. 6a to 6c are schematic top views of further isolated optical modules with functional structures in different patterns, as can be produced in the method according to the invention according to FIGS. 1a to 1h and FIGS. 2a to 2e;
  • FIGS. 1a to 1h schematic cross-sectional view of further isolated optical modules as can be produced by the method according to the invention according to FIGS. 1a to 1h and FIGS. 2a to 2e;
  • FIGS. 1a to 1h and FIGS. 2a to 2g show schematically an optical device with an optical module as obtainable by the method according to the invention according to FIGS. 1a to 1h and FIGS. 2a to 2g.
  • DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
  • One-component or “one-component mass” means in the context of the invention that the stated components of the mass are present together in one packaging unit.
  • liquid means that at 23° C. the loss modulus G” determined by viscosity measurement is greater than the storage modulus G’ of the mass in question.
  • Moisture is defined as 50% relative humidity at room temperature, or the moisture on substrate surfaces at those conditions, unless otherwise specified.
  • At least difunctional means that two or more units of the functional group mentioned in each case are present per molecule.
  • Optical modules with a diameter of around 1 to 4000 micrometers are mainly manufactured at the wafer/panel level. This means that between 8 and 10,000 optical module units are manufactured per wafer/panel and then separated using a sawing process, for example.
  • FIG. 1a to 1h A sequence of a first embodiment of the method according to the invention is shown schematically in Figs. 1a to 1h, with a schematic Cross-sectional view of a precursor with, for example, two optical module units is shown.
  • a temporary substrate 10 is provided (see FIG. 1a).
  • the temporary substrate is in particular made of metal, glass, silicone and/or a plastic.
  • the temporary substrate is a foil, in particular made of polyethylene terephthalate (PET) or a glass substrate, in particular a glass substrate with a non-stick coating.
  • Backings, in particular flexible or rigid backings, with a temporary adhesive material or a removable mass can also be used as a temporary substrate.
  • the temporary adhesive material or the removable compound is based, for example, on a (meth)acrylate.
  • the first mass (A) is metered onto the temporary substrate 10 to form a pattern 12 (cf. FIG. 1b).
  • the first mass (A) can be applied to the temporary substrate 10 in the form of the predefined pattern 12 by means of stencil printing, screen printing, ink jetting, jetting or needle dosing.
  • a squeegee made of polyurethane (PUR), silicone and/or other plastics is used in particular, preferably a squeegee made of PUR, a squeegee speed in the range from 10 to 350 mm/s, preferably from 80 to 120 mm/s, and a Squeegee pressure in the range from 0.1 to 5 bar, preferably 1.8 to 2.2 bar.
  • Jetting can use a pneumatic valve or a valve driven by a piezo actuator.
  • the nozzle used can have a diameter in the range from 30 to 600 ⁇ m and in particular to a temperature of up to 100°C be heated.
  • the metering pressure at the first mass (A) is in particular in the range of up to 50 bar, preferably up to 6 bar. In particular, a frequency of up to 1000 Hz is used as the dosing frequency.
  • a cylindrical or conical needle is used in particular, preferably a conical needle.
  • the inner needle diameter is in particular in the range from 50 square meters to 1 mm.
  • a needle pressure in the range from 0.1 to 10 bar, preferably from 0.1 to 5 bar, and an application speed in the range from 0.5 to 100 mm/s are used.
  • the first mass (A) After the first mass (A) has been applied, it is cured at least partially, preferably completely, to form a functional structure 13 (cf. FIG. 1c). Curing can take place thermally or by actinic radiation.
  • the temporary substrate with the applied first composition (A) is heated to a temperature in the range from 60° C. to 150° C. in a circulating air oven or by means of a hotplate for a period of 1 to 120 minutes. For example, thermal curing takes place for 30 minutes at a temperature of 80°C.
  • the first composition (A) is irradiated with an Hg radiator or an LED lamp, in particular with a surface lamp of the corresponding type.
  • a suitable commercially available LED lamp is available under the name DELOLUX 20 from DELO.
  • Irradiation can be carried out with a wavelength in the range from 320 to 480 nm, preferably 365 nm, and an intensity in the range from 20 to 2000 mW/cm 2 , preferably from 180 to 220 mW/cm 2 .
  • the irradiation time is in particular in the range from 1 to 300 s, preferably from 55 to 65 s.
  • the second mass (B) is then metered in the form of a cover layer 14 onto the temporary substrate 10 and the functional structure 13 (cf. FIG. 1c).
  • the dosing of the second mass (B) can be done as a direct dosing from a storage cartridge depending on pressure and time, volumetrically via a dosing screw or gravimetrically. The dosage is preferred volumetrically controlled.
  • the amount of second mass (B) to be metered depends on the size of the temporary substrate 10 used and the desired layer thickness of the cover layer 14 and is typically in the range from 0.5 to 100 ml_.
  • the cover layer 14 can be applied in a spin coating process, with speeds in the range from 500 to 10,000 rpm being used in particular, preferably speeds in the range from 500 to 4,000 rpm, with a total duration in the range from 10 to 120 s.
  • a precursor 18 is then produced by pressing a stamp 16 onto the cover layer 14 and curing the second mass (B) (cf. FIG. 1d).
  • the stamp 16 has cavities 20 which produce a multiplicity of optical structures 22 on a first side of the cover layer 14 and thus of the precursor 18 .
  • the stamp 16 can be made of polydimethylsiloxane (PDMS), a (meth)acrylate, a hybrid polymer, glass or metal, preferably made of PDMS or a (meth)acrylate.
  • PDMS polydimethylsiloxane
  • (meth)acrylate a hybrid polymer
  • glass or metal preferably made of PDMS or a (meth)acrylate.
  • the stamp 16 can have a non-stick coating in order to make it easier to detach the stamp 16 later without destroying it.
  • the stamp 16 can be a flat plate apart from the cavities 20 or part of a roller which is brought into contact with the cover layer 14 .
  • the cavities 20 can be at least partially filled with the second compound (B) before the stamp 16 is pressed onto the cover layer 14 . This is done in particular by jetting or dosing with a needle, as described above for applying the first mass (A) to the temporary substrate 10 .
  • the second compound (B) is cured. Curing can take place thermally or by actinic radiation. In principle, the same curing processes and conditions can be used as for curing the first composition (A). If the plunger 16 can be heated, the heating of the second mass (B) can, however, also take place via the plunger 16 .
  • the stamp 16 is separated from the precursor 18 manually or automatically (cf. FIG. 1e) and the temporary substrate 10 is detached (cf. FIG. 1f).
  • the precursor 18 is obtained, from which a plurality of optical modules 26 can be obtained by separating, each of which has an optical element 24 formed from the hardened second mass (B) and a functional structure 13 connected to the optical element 24 is formed from the hardened first mass (A) and has an electrical conductivity and/or an aperture function (cf. FIGS. 1f to 1h).
  • the separation can be done, for example, by sawing. In the embodiment shown in FIG. 1g, the separation takes place along the line shown in dashed lines, so that only the hardened second mass (B) is severed.
  • the functional structure 13 remains enclosed by the hardened compound (B) except for the area originally adjoining the temporary substrate 10 . As a result, micro- or nanostructures can also be reliably stabilized.
  • the functional structure 13 it is also possible for the functional structure 13 to be severed when the precursor 18 is separated. This results in an optical module (not shown) in which the functional structure 13 is surrounded by the optical element 24 only on two adjacent sides. In the case of a conductive functional structure 13, this results in different possibilities for contacting.
  • the process shown as an example can also be used to produce the individual optical module 26 directly.
  • the cover layer 14 would be cured directly to form the optical element 24 .
  • the optical module 26 obtained is monolithic.
  • the functional structure 13 is firmly anchored in the optical module 26 or integrated into the optical module 26, so that the optical module 26 as a whole can be handled.
  • the functional structure 13 is arranged in the optical module in particular flush with the surface of the optical element 24 which was formed during the production of the optical module 26 by applying and curing the second mass (B) on the temporary substrate.
  • FIGS. 2a to 2e A sequence of a second embodiment of the method according to the invention is shown schematically in FIGS. 2a to 2e.
  • the second embodiment essentially corresponds to the first embodiment, so that only the differences are discussed below. Reference is made to the above explanations.
  • a partial precursor 27 is first produced, which corresponds to the precursor 18 without a functional structure, and from which the optical element 24 results after separation.
  • the partial precursor 27 is a wafer, for example, which carries a multiplicity of optical structures 22 .
  • the second mass (B) is applied as a cover layer 14 to a structured carrier substrate 28, the structured substrate having projections 30 which are complementary to recesses 32 to be produced on the first or second side of the partial precursor 27 for the functional structure 13 are.
  • the structured carrier substrate 28 can be made of the same materials as the temporary substrate 10 or the stamp 16 of the first embodiment.
  • optical structures 22 are then formed by means of the stamp 16 on the side of the cover layer 14 opposite the structured carrier substrate 28 and the second mass (B) is cured to form the partial precursor 27 (cf. FIG. 2a).
  • the partial precursor 27 with a multiplicity of optical structures 22 is obtained by detaching the structured carrier substrate 28 and the stamp 16, the recesses 32 on the first and/or second side of the partial precursor 27 becoming accessible (cf. FIG. 2b).
  • recesses 32 are provided only on the first side and optical structures 22 only on the second side.
  • the first mass (A) is then metered into the recesses 32 in the form of a pattern 12 in order to subsequently form the functional structure 13 (cf. FIG. 2c).
  • the first mass (A) is preferably introduced into the recesses 32 by means of inkjetting, jetting or needle dosing.
  • the first mass (A) is then cured to form the functional structure 13, as previously described in the first embodiment.
  • a precursor 18 is obtained, from which a plurality of optical modules 26 can be obtained by separating, each of which has an optical element 24 formed from the hardened second mass (B) and a functional structure 13 connected to the optical element 24 have, wherein the functional structure 13 is formed from the hardened first mass (A) and has an electrical conductivity and/or an aperture function (cf. FIGS. 2d and 2e).
  • the individual optical module 26 can also be produced directly instead of a precursor 18 in the process shown as an example.
  • the topcoat 14 would be cured directly to the optical element 24 rather than the partial precursor 27.
  • a monolithic optical module 26 with a flush arrangement of functional structure 13 and optical element 24 can also be obtained with the second embodiment of the method according to the invention.
  • Exemplary functional structures 13 are shown schematically in a top view in FIGS. 3a to 3c.
  • this has a rectangular outer contour
  • the functional structure 13 in FIG. 2b has a circular outer contour.
  • the functional structure 13 has an opening 34 which has a circular contour in the examples according to FIGS. 3a and 3b and an irregular polygonal contour in the example according to FIG. 3c.
  • the opening 34 is filled by the optical element 24 (cf. FIGS. 1h and 2e).
  • the shape of the opening 34 is matched in particular to the optical structure 22 of the optical element 24 .
  • the opening 34 can have a larger, the same size or a smaller extent than the optical structure 22, as shown schematically in FIGS. 4a to 4c.
  • FIGS. 6a to 6c Further exemplary functional structures 13 of the optical module 26 are shown in FIGS. 6a to 6c in a sectional view through the optical module 26, the direction of illustration corresponding to a plan view.
  • the functional structures 13 form different patterns in the manner of conductor tracks and can have one or more contact points 35 .
  • the optical structure 22 is decisive for the subsequent function of the optical module 26.
  • the optical structure 22 can, for example, be a lens (see FIG. 5a), a grating, a microlens array (see FIG. 5b), a diffractive optical element (DOE , cf. Fig. 5c) or a diffuser.
  • DOE diffractive optical element
  • FIGS. 7a to 7e show further exemplary embodiments of isolated optical modules 26 in a schematic cross-sectional view, as can be obtained using the method according to the invention, with FIG. 7a essentially corresponding to the embodiment according to FIGS. 1h and 2e.
  • the functional structures 13 of the optical modules 26 shown here can be conductor tracks, for example.
  • the functional structure 13 and the optical structure 22 are located on opposite sides of the optical module 26 (see FIG. 7a), or the functional structure 13 is arranged on the same side as the optical structure 22 (see FIG. 7b). It is also possible to form functional structures 13 and/or optical structures 22 on the both opposite sides of the optical module (see Fig. 7c to 7e). In all cases, monolithic optical modules 26 may be present.
  • optical module 26 obtained by the method according to the invention can be provided for a large number of different applications.
  • the optical module 26 is intended to serve as a receiver unit in an optical device, for example in imaging optics such as cameras or in collecting optics such as sensors.
  • the optical module 26 can be intended to be used in transmitter optics, for example as illumination optics for changing the beam angle of an LED or as projection optics.
  • the optical module 26 can also be used for beam shaping, in particular for beam shaping of a light beam generated by a laser or a laser-like light source.
  • the optical module 26 can be used to generate a point or line pattern or to enable uniform illumination of a solid angle.
  • optical module 26 mentioned by way of example are in devices for 3D recognition such as ToF, LiDAR or stripe projection devices, for example for environmental recognition, face recognition and/or biometric recognition, proximity sensors, color sensors, spectrometers, cameras, in particular for the visible and infrared spectral range, headlights, in particular front headlights in vehicles, signal projection devices, in particular for light signal systems, flash modules and decorative projection devices, in particular in so-called "light carpets”.
  • ToF ToF
  • LiDAR or stripe projection devices for example for environmental recognition, face recognition and/or biometric recognition, proximity sensors, color sensors, spectrometers, cameras, in particular for the visible and infrared spectral range, headlights, in particular front headlights in vehicles, signal projection devices, in particular for light signal systems, flash modules and decorative projection devices, in particular in so-called "light carpets”.
  • ToF ToF
  • LiDAR or stripe projection devices for example for environmental recognition, face recognition and/or biometric recognition, proximity sensors, color sensors,
  • FIG 6 shows an optical device 36 with an optical module 26 according to the invention.
  • the optical device 36 comprises a light-emitting element 38 and an optical module 26, as can be obtained by the method described above and a control unit 40 which is electrically connected to the light-emitting element 38 and to the optical module 26 .
  • the functional structure 13 of the optical module 26 is electrically conductive in the embodiment shown.
  • the light-emitting element 38 is in particular a laser.
  • the optical module 26 is arranged in such a way that it lies in the beam path 42 of the light emitted by the light-emitting element 38 .

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  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)

Abstract

L'invention concerne une méthode de fabrication d'un module optique (26) comprenant une structure fonctionnelle (13) et un élément optique (24) connecté à celle-ci, dans laquelle une première masse durcissable (A) et une seconde masse durcissable (B) sont prévues, la première masse (A) comprenant au moins une charge fonctionnelle (K3) choisie dans le groupe constitué par les colorants, les pigments, les matériaux électrochromiques, les charges conductrices et leurs combinaisons. La structure fonctionnelle (13) est formée à partir de la première masse (A) et l'élément optique (24) est formé à partir de la seconde masse (B). L'invention concerne également un module optique (26).
PCT/EP2022/055579 2021-04-22 2022-03-04 Méthode de fabrication d'un module optique et module optique WO2022223191A1 (fr)

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EP22710572.3A EP4326543A1 (fr) 2021-04-22 2022-03-04 Méthode de fabrication d'un module optique et module optique

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DE102021110210.3A DE102021110210A1 (de) 2021-04-22 2021-04-22 Verfahren zum Herstellen eines optischen Moduls und optisches Modul
DE102021110210.3 2021-04-22

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EP0542716B1 (fr) 1982-11-22 1997-06-25 Minnesota Mining And Manufacturing Company Compositions polymérisables par apport d'énergie contenant des initiateurs organométalliques
EP0153579A2 (fr) 1984-02-02 1985-09-04 Bayer Ag Utilisation de masses réactives d'adhésifs de polyuréthane urées thermodurcissables
US4877313A (en) 1986-09-30 1989-10-31 Research Frontiers Incorporated Light-polarizing materials and suspensions thereof
EP0343690A2 (fr) 1988-05-27 1989-11-29 Nippon Paint Co., Ltd. Initiateur à chaleur latente de polymérisation cationique et compositions résineuses renfermant le même
US6034194A (en) 1994-09-02 2000-03-07 Quantum Materials/Dexter Corporation Bismaleimide-divinyl adhesive compositions and uses therefor
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WO2005097883A2 (fr) 2004-03-26 2005-10-20 King Industries, Inc. Procede de production d'un revetement reticule dans la fabrication de circuits integres
US7342708B2 (en) 2004-04-26 2008-03-11 Tropics Enterprise Co. Ltd. Electrochromic device using poly(3,4-ethylenedioxythiophene) and derivatives thereof
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US10155872B2 (en) 2014-06-17 2018-12-18 Vadient Optics, Llc Nanocomposite optical-device with integrated conductive paths
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DE102018102916A1 (de) 2018-02-09 2019-08-14 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Mit aktinischer Strahlung fixierbare Masse und ihre Verwendung
US20190278104A1 (en) 2018-03-06 2019-09-12 Edison Opto Corporation Optical module for protecting human eyes
US20200049911A1 (en) 2018-08-08 2020-02-13 Lite-On Opto Technology (Changzhou) Co., Ltd. Light source device and electronic apparatus
WO2020120144A1 (fr) * 2018-12-10 2020-06-18 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Matière cationiquement durcissable et procédé d'assemblage, de coulée et de revêtement de substrats à l'aide de ladite matière
CN111607386A (zh) 2020-06-18 2020-09-01 Oppo广东移动通信有限公司 电致变色材料、组合物、制备方法、电致变色器件、壳体组件和电子设备

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