WO2022217820A1 - Wet etching fixture - Google Patents

Wet etching fixture Download PDF

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Publication number
WO2022217820A1
WO2022217820A1 PCT/CN2021/117389 CN2021117389W WO2022217820A1 WO 2022217820 A1 WO2022217820 A1 WO 2022217820A1 CN 2021117389 W CN2021117389 W CN 2021117389W WO 2022217820 A1 WO2022217820 A1 WO 2022217820A1
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WO
WIPO (PCT)
Prior art keywords
wafer
top cover
base
wet etching
groove
Prior art date
Application number
PCT/CN2021/117389
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French (fr)
Chinese (zh)
Inventor
廖洪钢
邓俊先
江友红
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厦门大学
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Application filed by 厦门大学 filed Critical 厦门大学
Publication of WO2022217820A1 publication Critical patent/WO2022217820A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Definitions

  • the invention belongs to the technical field of micro-nano processing, and in particular relates to a wet etching fixture.
  • Micro-nano processing is the processing of micro-nano-level units. It is often used in the fields of material science and chip design. Generally, the pattern is transferred to the substrate through lithography technology, LIGA technology, bonding technology, packaging technology, etc.
  • the substrate is typically a silicon wafer.
  • metal film, semiconductor film, etc. are generally coated on the front side of the wafer, and part of the wafer is selectively etched on the back side of the wafer.
  • the etching solution can often react with the film material on the front side of the wafer, thereby destroying the film structure on the front side of the wafer.
  • a common method for protecting the film structure on the front side of the wafer is to spin-coat the protective adhesive on the front side of the wafer, but this method has high cost and poor effect, and the protective adhesive is not easy to remove.
  • Invention patent CN105405802A discloses a wet corrosion protection fixture, which can protect the front side of the wafer from corrosion without applying protective glue, but the function is relatively simple, only the function of comprehensive corrosion on the back side of the wafer, without the ability to corrode the wafer. The function of local corrosion on the back of the circle.
  • the present invention provides a wet etching fixture with more comprehensive functions, which has the function of performing general corrosion and partial corrosion on the backside of the wafer.
  • a wet etching jig comprises a base, a top cover and a sealing mechanism, the base is provided with a bearing part for carrying the wafer to be etched, the top cover is arranged above the base, and the sealing mechanism is used to prevent the corrosive liquid from contacting the bearing part
  • the front side of the wafer, the sealing mechanism, the top cover and the back side of the wafer together form a chamber for accommodating the etchant, the chamber is provided with a nozzle, and the liquid outlet of the nozzle is located above the bearing part, which is used to eject the etchant to corrode the crystal. Round back.
  • a stirrer is further provided on the top cover, and the stirring head of the stirrer is located above the bearing portion.
  • the number of the spray heads is multiple, the stirring head of the agitator is arranged in the center of the top cover, and the multiple spray heads surround the stirring head and are arranged around the stirring head.
  • the sealing mechanism includes a locking mechanism and a sealing ring arranged above the bearing portion, the wafer to be etched is placed between the bearing portion and the sealing ring, and the inner diameter of the sealing ring is smaller than the size of the wafer to be etched, Under the locking of the locking mechanism, the top cover tightly presses the sealing ring.
  • the top surface of the base is provided with a first groove
  • the first groove is a cylindrical structure
  • the sealing ring is a circular structure
  • the outer diameter is smaller than the diameter of the first groove
  • the bearing part is arranged in the first groove.
  • the carrier sheet in the groove is a circular structure.
  • a buffer washer is provided under the carrier sheet, and the buffer washer has the same size as the sealing ring.
  • the top cover comprises a cylinder
  • the top of the cylinder is provided with an extension extending radially outward
  • the bottom surface of the cylinder is provided with a second groove that is concave upward
  • the diameter of the second groove is the same as that of the sealing ring.
  • the inner diameter of the nozzle is the same
  • the spray head is arranged in the second groove
  • the locking mechanism includes a plurality of screws connecting the extension part and the base.
  • the top cover includes an upper cover and a lower cover
  • the upper cover is a disc structure
  • the spray head is fixed on the upper cover.
  • the outer peripheral surface of the extension portion is flush with the outer peripheral surface of the base
  • the base is provided with a plurality of first screw holes around the first groove
  • the extension portion is provided with second screw holes, and the screws are screwed into the first screw holes. The hole and the second screw hole are locked and the top cover is fixed on the base.
  • the carrier sheet is made of alkali corrosion-resistant glass or steel, and the base and the top cover are made of PTFE material.
  • the wet etching fixture provided by the invention has comprehensive functions, and has the function of performing general corrosion and partial corrosion on the backside of the wafer.
  • General corrosion Load the wafer to be etched, and fill a sufficient amount of etching solution into the chamber to perform general corrosion on the back of the wafer;
  • Local corrosion Load the wafer to be etched, and spray and corrode specific areas on the back of the wafer through a nozzle The liquid is used to etch a small amount of the backside of the wafer.
  • Embodiment 1 is a structural diagram of Embodiment 1 of the present invention.
  • Embodiment 1 of the present invention is an exploded structural diagram of Embodiment 1 of the present invention.
  • FIG. 3 is an exploded structural diagram of another perspective of Embodiment 1 of the present invention.
  • FIG. 4 is a sectional view 1 of Embodiment 1 of the present invention.
  • Fig. 5 is the enlarged view of A part in Fig. 4;
  • FIG. 6 is a second cross-sectional view of the first embodiment of the present invention.
  • FIG. 7 is a cross-sectional view of a top cover, a stirring head and a spray head according to an embodiment of the present invention.
  • a wet etching fixture includes a base 1, a top cover and a sealing mechanism.
  • the base 1 is provided with a bearing portion for carrying the wafer 3 to be etched.
  • the The round side faces the carrier, and the back side of the wafer faces the top cover.
  • the top cover is arranged above the base 1, and the sealing mechanism is used to prevent the corrosive liquid from contacting the front side of the wafer facing the bearing portion.
  • the sealing mechanism, the top cover and the back side of the wafer together form a chamber 9 for accommodating the corrosive liquid, and the chamber is provided with a shower head. 4.
  • the liquid outlet of the spray head 4 is located above the bearing portion, and is used for spraying the etching liquid to corrode the back surface of the wafer.
  • a liquid storage cavity can be provided in the upper cover 22, and a liquid injection port communicated with the liquid storage cavity can be arranged on the side of the upper cover 22.
  • the liquid storage chamber is connected.
  • General corrosion Load the wafer 3 to be etched, and fill a sufficient amount of etching solution into the chamber to perform general corrosion on the back of the wafer; The area is sprayed with corrosive liquid to perform micro-etching on the backside of the wafer.
  • a stirrer 5 is also provided on the top cover, and the stirring head of the stirrer 5 is located above the bearing portion.
  • the stirring head of the stirrer 5 can fully agitate the etching solution in the chamber 9, so that the backside of the wafer is uniformly etched.
  • the driving device of the agitator 5 is provided outside the fixture, and the output end of the driving device passes through the top cover and is connected with the stirring head of the agitator 5 to drive the stirring head to rotate.
  • the stirrer used in the present invention is the existing stirrer, which can be purchased in the market.
  • the structure of the stirrer itself is not an improvement point of the present invention, so it is not fully shown in the accompanying drawings (the stirring shaft and the driving device are not shown), but only the installation position of the stirring head is shown.
  • the number of spray heads 4 is plural, the stirring head of the agitator 5 is arranged in the center of the top cover, and the plurality of spray heads 4 surround the stirring head and are arranged around the stirring head.
  • the function of the shower head 4 is to perform local micro-etching on the wafer 3, and it is better to set it in a dispersed manner, and the function of the stirring head is to stir the etching liquid in the fixture evenly, and it is better to be set in the center of the fixture.
  • the sealing mechanism includes a locking mechanism and a sealing ring 61 arranged above the bearing portion, the wafer 3 to be etched is placed between the bearing portion and the sealing ring 61, and the inner diameter of the sealing ring 61 is slightly smaller than the wafer 3 to be etched. size to ensure that the top cover does not directly touch wafer 3. Under the locking of the locking mechanism, the top cover tightly presses the sealing ring 61 .
  • the sealing ring 61 can be made of fluororubber or chlororubber resistant to corrosion by alkali liquid.
  • the outer diameter of the sealing ring 61 is slightly larger than the size of the wafer 3 to be etched to ensure that the sealing ring 61 can completely protect the edge of the wafer 3 and prevent the edge of the wafer 3 from directly contacting the top cover.
  • the sealing ring 61 and the locking mechanism are used to achieve sealing, preventing the corrosive liquid from contacting the side of the wafer 3 facing the bearing portion, the structure is simple, and the operation is convenient. In other embodiments, other existing sealing mechanisms of other structures may also be used to achieve sealing.
  • the top surface of the base 1 is recessed downward to form a first groove 11, the first groove 11 is a cylindrical structure, the sealing ring 61 is a circular structure, and the outer diameter is slightly smaller than the diameter of the first groove 11, so as to facilitate sealing
  • the bearing part is the bearing sheet 12 arranged in the first groove 11
  • the bearing sheet 12 is a circular structure
  • the outer diameter is consistent with the wafer 3 to be etched; if the size of the bearing sheet 12 is too small , the wafer 3 is easily crushed when the wafer 3 is loaded. If the size of the carrier sheet 12 is too large, it is inconvenient to take the carrier sheet 12 out of the first groove 11 .
  • the base 1 is a cylindrical structure, which makes the clamp structure compact.
  • the carrier sheet 12 is made of alkali corrosion-resistant glass or steel, and the base 1 and the top cover are made of PTFE material, which is low in cost and easy to manufacture.
  • a buffer washer 62 is arranged under the carrier sheet 12 , the buffer washer 62 can buffer the pressure of the top cover on the wafer 3 , the carrier sheet 12 can protect the wafer 3 and prevent the wafer 3 from breaking, the size of the buffer washer 62 and the sealing ring 61 In the same way, the positions of the buffer washer 62 and the sealing ring 61 are as consistent as possible, so as to better buffer the pressure of the top cover on the wafer 3 .
  • the top cover includes a cylindrical body, and the top of the cylindrical body is provided with an extension portion extending radially outward.
  • the bottom surface of the cylinder is recessed upward to form a second groove 21 .
  • the diameter of the second groove 21 is consistent with the inner diameter of the sealing ring 61 ; if the diameter of the second groove 21 is too large, it will hinder the corrosion of the wafer 3 .
  • the spray head 4 is arranged in the second groove 21, and the locking mechanism includes a plurality of screws 71 connecting the extension portion and the base.
  • the outer diameter of the cylinder is the same as the outer diameter of the sealing ring 61 to ensure that the cylinder does not directly contact the wafer 3 .
  • the top cover includes an upper cover 22 and a lower cover 23.
  • the upper cover 22 is a disc structure and is located above the lower cover 23.
  • the spray head 4 is fixed on the upper cover 22 to facilitate loading of corrosive liquid and disassembly and adjustment of the spray head 4.
  • the top cover may also adopt an integrated structure.
  • the base 1 is provided with a plurality of first screw holes 13 around the first groove 11, the extension portion is provided with a second screw hole 24, the screw 71 is screwed with the first screw hole 13 and the second screw hole 24 and locked, and Fix the top cover on the base 1 so that the top cover presses the sealing ring 61 tightly.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
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Abstract

The present invention relates to a wet etching fixture, comprising a base, a top cover, and a sealing mechanism. A bearing part is provided on the base and used for bearing a wafer to be etched; the top cover is disposed above the base; the sealing mechanism is used for preventing an etching solution from contacting the front surface of the wafer facing the bearing part; the sealing mechanism, the top cover, and the back surface of the wafer together form a chamber used for accommodating the etching solution; a spray nozzle is provided in the chamber; a solution outlet of the spray nozzle is located above the bearing part and used for spraying the etching solution to etch the back surface of the wafer.

Description

湿法腐蚀夹具Wet Etch Fixtures 技术领域technical field
本发明属于微纳加工技术领域，具体涉及一种湿法腐蚀夹具。The invention belongs to the technical field of micro-nano processing, and in particular relates to a wet etching fixture.
背景技术Background technique
微纳加工即是微米级纳米级单位的加工，常常应用在材料科学和芯片设计等领域，一般是通过光刻技术、LIGA技术、键合技术、封装技术等，把图形转移到衬底上面，衬底一般是硅晶圆。Micro-nano processing is the processing of micro-nano-level units. It is often used in the fields of material science and chip design. Generally, the pattern is transferred to the substrate through lithography technology, LIGA technology, bonding technology, packaging technology, etc. The substrate is typically a silicon wafer.
为了将芯片功能化，一般要在晶圆正面镀金属膜、半导体膜等，在晶圆背面则选择性腐蚀部分晶圆。在湿法腐蚀工艺中，腐蚀液往往能和晶圆正面的膜材料发生反应，从而破坏晶圆正面的膜结构。通常的保护晶圆正面膜结构的方法是将保护胶旋涂在晶圆正面，但这种方法成本高，效果差，且保护胶不易去除。In order to functionalize the chip, metal film, semiconductor film, etc. are generally coated on the front side of the wafer, and part of the wafer is selectively etched on the back side of the wafer. In the wet etching process, the etching solution can often react with the film material on the front side of the wafer, thereby destroying the film structure on the front side of the wafer. A common method for protecting the film structure on the front side of the wafer is to spin-coat the protective adhesive on the front side of the wafer, but this method has high cost and poor effect, and the protective adhesive is not easy to remove.
发明专利CN105405802A公开了一种湿法腐蚀保护夹具，可以在不涂保护胶的情况下保护晶圆正面不受腐蚀，但功能比较单一，只有对晶圆背面进行全面腐蚀的功能，不具有对晶圆背面进行局部腐蚀的功能。Invention patent CN105405802A discloses a wet corrosion protection fixture, which can protect the front side of the wafer from corrosion without applying protective glue, but the function is relatively simple, only the function of comprehensive corrosion on the back side of the wafer, without the ability to corrode the wafer. The function of local corrosion on the back of the circle.
发明内容SUMMARY OF THE INVENTION
为解决上述问题，本发明提供一种功能更全面的湿法腐蚀夹具，具有对晶圆背面进行全面腐蚀和局部腐蚀的功能。In order to solve the above problems, the present invention provides a wet etching fixture with more comprehensive functions, which has the function of performing general corrosion and partial corrosion on the backside of the wafer.
具体地，本发明的技术方案是：Specifically, the technical scheme of the present invention is:
一种湿法腐蚀夹具，包括底座、顶盖和密封机构，底座上设有承载部，用于承载待腐蚀的晶圆，顶盖设在底座上方，密封机构用于防止腐蚀液接触朝承 载部的晶圆正面，密封机构、顶盖和晶圆背面共同形成用于容纳腐蚀液的腔室，腔室内设有喷头，喷头的出液口位于承载部上方，用于喷出腐蚀液以腐蚀晶圆背面。A wet etching jig comprises a base, a top cover and a sealing mechanism, the base is provided with a bearing part for carrying the wafer to be etched, the top cover is arranged above the base, and the sealing mechanism is used to prevent the corrosive liquid from contacting the bearing part The front side of the wafer, the sealing mechanism, the top cover and the back side of the wafer together form a chamber for accommodating the etchant, the chamber is provided with a nozzle, and the liquid outlet of the nozzle is located above the bearing part, which is used to eject the etchant to corrode the crystal. Round back.
优选地，所述顶盖上还设有搅拌器，搅拌器的搅拌头位于承载部上方。Preferably, a stirrer is further provided on the top cover, and the stirring head of the stirrer is located above the bearing portion.
优选地，所述喷头的数量为多个，搅拌器的搅拌头设在顶盖中央，多个喷头围绕搅拌头，设置在搅拌头的周围。Preferably, the number of the spray heads is multiple, the stirring head of the agitator is arranged in the center of the top cover, and the multiple spray heads surround the stirring head and are arranged around the stirring head.
优选地，所述密封机构包括锁紧机构和设在承载部上方的密封圈，待腐蚀的晶圆放置在承载部与密封圈之间，密封圈的内径小于待腐蚀的晶圆的尺寸，在锁紧机构的锁紧下，顶盖紧压密封圈。Preferably, the sealing mechanism includes a locking mechanism and a sealing ring arranged above the bearing portion, the wafer to be etched is placed between the bearing portion and the sealing ring, and the inner diameter of the sealing ring is smaller than the size of the wafer to be etched, Under the locking of the locking mechanism, the top cover tightly presses the sealing ring.
优选地，所述底座顶面设有第一凹槽，第一凹槽为圆柱形结构，密封圈为圆环形结构，外径小于第一凹槽的直径，承载部为设在第一凹槽内的承载片，承载片为圆形结构。Preferably, the top surface of the base is provided with a first groove, the first groove is a cylindrical structure, the sealing ring is a circular structure, the outer diameter is smaller than the diameter of the first groove, and the bearing part is arranged in the first groove. The carrier sheet in the groove is a circular structure.
优选地，所述承载片下方设有缓冲垫圈，缓冲垫圈与密封圈尺寸相同。Preferably, a buffer washer is provided under the carrier sheet, and the buffer washer has the same size as the sealing ring.
优选地，所述顶盖包括圆柱体，圆柱体的顶部设有沿径向向外延伸的延伸部，圆柱体的底面设有向上凹陷的第二凹槽，第二凹槽的直径与密封圈的内径一致，喷头设在第二凹槽内，锁紧机构包括多个连接延伸部与底座的螺钉。Preferably, the top cover comprises a cylinder, the top of the cylinder is provided with an extension extending radially outward, the bottom surface of the cylinder is provided with a second groove that is concave upward, and the diameter of the second groove is the same as that of the sealing ring. The inner diameter of the nozzle is the same, the spray head is arranged in the second groove, and the locking mechanism includes a plurality of screws connecting the extension part and the base.
优选地，所述顶盖包括上盖和下盖，上盖为圆盘结构，设在下盖上方，喷头固定在上盖上。Preferably, the top cover includes an upper cover and a lower cover, the upper cover is a disc structure, is arranged above the lower cover, and the spray head is fixed on the upper cover.
优选地，所述延伸部的外周面与底座的外周面平齐，底座上环绕第一凹槽设有多个第一螺孔，延伸部上设有第二螺孔，螺钉螺接第一螺孔和第二螺孔并锁紧，而将顶盖固定在底座上。Preferably, the outer peripheral surface of the extension portion is flush with the outer peripheral surface of the base, the base is provided with a plurality of first screw holes around the first groove, the extension portion is provided with second screw holes, and the screws are screwed into the first screw holes. The hole and the second screw hole are locked and the top cover is fixed on the base.
优选地，所述承载片采用耐碱腐蚀的玻璃或钢材制成，底座和顶盖采用聚四氟材料制成。Preferably, the carrier sheet is made of alkali corrosion-resistant glass or steel, and the base and the top cover are made of PTFE material.
本发明提供的湿法腐蚀夹具功能全面，具有对晶圆背面进行全面腐蚀和局部腐蚀的功能。全面腐蚀：装载好待腐蚀的晶圆，向腔室内装入足量腐蚀液，对晶圆背面进行全面腐蚀；局部腐蚀：装载好待腐蚀的晶圆，通过喷头对晶圆 背面特定区域喷洒腐蚀液，对晶圆背面局部进行微量腐蚀。The wet etching fixture provided by the invention has comprehensive functions, and has the function of performing general corrosion and partial corrosion on the backside of the wafer. General corrosion: Load the wafer to be etched, and fill a sufficient amount of etching solution into the chamber to perform general corrosion on the back of the wafer; Local corrosion: Load the wafer to be etched, and spray and corrode specific areas on the back of the wafer through a nozzle The liquid is used to etch a small amount of the backside of the wafer.
附图说明Description of drawings
图1为本发明实施例一的结构图；1 is a structural diagram of Embodiment 1 of the present invention;
图2为本发明实施例一的分解结构图；2 is an exploded structural diagram of Embodiment 1 of the present invention;
图3为本发明实施例一另一视角的分解结构图；FIG. 3 is an exploded structural diagram of another perspective of Embodiment 1 of the present invention;
图4为本发明实施例一的剖视图一；FIG. 4 is a sectional view 1 of Embodiment 1 of the present invention;
图5为图4中A部分的放大图；Fig. 5 is the enlarged view of A part in Fig. 4;
图6为本发明实施例一的剖视图二；6 is a second cross-sectional view of the first embodiment of the present invention;
图7为本发明实施例一顶盖、搅拌头和喷头的剖视图。7 is a cross-sectional view of a top cover, a stirring head and a spray head according to an embodiment of the present invention.
具体实施方式Detailed ways
下面结合附图及具体实施例对本发明作进一步详细说明。The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
实施例一：Example 1:
如图1至7所示，一种湿法腐蚀夹具，包括底座1、顶盖和密封机构，底座1上设有承载部，用于承载待腐蚀的晶圆3，装载晶圆3时，晶圆正面朝承载部，晶圆背面朝顶盖。顶盖设在底座1上方，密封机构用于防止腐蚀液接触朝承载部的晶圆正面，密封机构、顶盖和晶圆背面共同形成用于容纳腐蚀液的腔室9，腔室内设有喷头4，喷头4的出液口位于承载部上方，用于喷出腐蚀液以腐蚀晶圆背面。至于如何向喷头4供给腐蚀液，本领域技术人员可以任意选择，例如，可以在上盖22内设置储液腔，并在上盖22侧面设置与储液腔连通的注液口，喷头4与储液腔连接，需局部腐蚀时，用导管将完成一次腐蚀所需的腐蚀液从注液口一次性注入储液腔，之后用氟橡胶密封注液口，储液腔内的腐蚀液将从喷头4的出液口喷出；对于无需使用的喷头4,可以用氟橡胶密封喷头4的出液口。向喷头4供给腐蚀液的方法是本领域技术人员比较容易想到和实现的，故而附图中并未详细示出相关结构，而仅以上述文字进行简单描述。As shown in Figures 1 to 7, a wet etching fixture includes a base 1, a top cover and a sealing mechanism. The base 1 is provided with a bearing portion for carrying the wafer 3 to be etched. When the wafer 3 is loaded, the The round side faces the carrier, and the back side of the wafer faces the top cover. The top cover is arranged above the base 1, and the sealing mechanism is used to prevent the corrosive liquid from contacting the front side of the wafer facing the bearing portion. The sealing mechanism, the top cover and the back side of the wafer together form a chamber 9 for accommodating the corrosive liquid, and the chamber is provided with a shower head. 4. The liquid outlet of the spray head 4 is located above the bearing portion, and is used for spraying the etching liquid to corrode the back surface of the wafer. As for how to supply the corrosive liquid to the spray head 4, those skilled in the art can choose arbitrarily. For example, a liquid storage cavity can be provided in the upper cover 22, and a liquid injection port communicated with the liquid storage cavity can be arranged on the side of the upper cover 22. The liquid storage chamber is connected. When local corrosion is required, use a catheter to inject the corrosive liquid required to complete a corrosion from the liquid injection port into the liquid storage chamber at one time, and then seal the liquid injection port with fluororubber, and the corrosion liquid in the liquid storage chamber will be The liquid outlet of the nozzle 4 is ejected; for the nozzle 4 that is not needed, the liquid outlet of the nozzle 4 can be sealed with fluororubber. The method of supplying the corrosive liquid to the spray head 4 is relatively easy to think and realize by those skilled in the art, so the related structures are not shown in detail in the drawings, but are simply described in the above words.
全面腐蚀：装载好待腐蚀的晶圆3，向腔室内装入足量腐蚀液，对晶圆背面进行全面腐蚀；局部腐蚀：装载好待腐蚀的晶圆3，通过喷头4对晶圆背面特定区域喷洒腐蚀液，对晶圆背面局部进行微量腐蚀。General corrosion: Load the wafer 3 to be etched, and fill a sufficient amount of etching solution into the chamber to perform general corrosion on the back of the wafer; The area is sprayed with corrosive liquid to perform micro-etching on the backside of the wafer.
进一步地，顶盖上还设有搅拌器5，搅拌器5的搅拌头位于承载部上方。在对晶圆背面进行全面腐蚀时，搅拌器5可以对腔室9内的腐蚀液进行充分搅拌，使晶圆背面被均匀地腐蚀。在本实施例中，搅拌器5的驱动装置设在夹具外，驱动装置的输出端穿过顶盖，与搅拌器5的搅拌头连接，以驱动搅拌头转动。本发明采用的搅拌器为现有的搅拌器，在市场上可以购买得到，搅拌器本身的结构并非本发明的改进点，因而在附图中并未完整示出(搅拌轴和驱动装置均未示出)，而是仅对搅拌头的安装位置进行了示意。Further, a stirrer 5 is also provided on the top cover, and the stirring head of the stirrer 5 is located above the bearing portion. When the backside of the wafer is fully etched, the stirrer 5 can fully agitate the etching solution in the chamber 9, so that the backside of the wafer is uniformly etched. In this embodiment, the driving device of the agitator 5 is provided outside the fixture, and the output end of the driving device passes through the top cover and is connected with the stirring head of the agitator 5 to drive the stirring head to rotate. The stirrer used in the present invention is the existing stirrer, which can be purchased in the market. The structure of the stirrer itself is not an improvement point of the present invention, so it is not fully shown in the accompanying drawings (the stirring shaft and the driving device are not shown), but only the installation position of the stirring head is shown.
进一步地，喷头4的数量为多个，搅拌器5的搅拌头设在顶盖中央，多个喷头4围绕搅拌头，设置在搅拌头的周围。喷头4的作用是对晶圆3进行局部微量腐蚀，最好设置得较为分散，而搅拌头的作用是将夹具内的腐蚀液搅拌均匀，最好设置在夹具中央。Further, the number of spray heads 4 is plural, the stirring head of the agitator 5 is arranged in the center of the top cover, and the plurality of spray heads 4 surround the stirring head and are arranged around the stirring head. The function of the shower head 4 is to perform local micro-etching on the wafer 3, and it is better to set it in a dispersed manner, and the function of the stirring head is to stir the etching liquid in the fixture evenly, and it is better to be set in the center of the fixture.
进一步地，密封机构包括锁紧机构和设在承载部上方的密封圈61，待腐蚀的晶圆3放置在承载部与密封圈61之间，密封圈61的内径略小于待腐蚀的晶圆3的尺寸，以确保顶盖不直接接触晶圆3。在锁紧机构的锁紧下，顶盖紧压密封圈61。具体地，密封圈61可以采用耐碱液腐蚀的氟橡胶或氯橡胶制成。在本实施例中，密封圈61的外径略大于待腐蚀的晶圆3的尺寸，以确保密封圈61可以完全保护到晶圆3的边缘，防止晶圆3的边缘直接与顶盖接触。Further, the sealing mechanism includes a locking mechanism and a sealing ring 61 arranged above the bearing portion, the wafer 3 to be etched is placed between the bearing portion and the sealing ring 61, and the inner diameter of the sealing ring 61 is slightly smaller than the wafer 3 to be etched. size to ensure that the top cover does not directly touch wafer 3. Under the locking of the locking mechanism, the top cover tightly presses the sealing ring 61 . Specifically, the sealing ring 61 can be made of fluororubber or chlororubber resistant to corrosion by alkali liquid. In this embodiment, the outer diameter of the sealing ring 61 is slightly larger than the size of the wafer 3 to be etched to ensure that the sealing ring 61 can completely protect the edge of the wafer 3 and prevent the edge of the wafer 3 from directly contacting the top cover.
采用密封圈61和锁紧机构实现密封，防止腐蚀液接触晶圆3朝承载部的一面，结构简单，操作方便。在其它实施例中，还可以采用现有的其它结构的密封机构实现密封。The sealing ring 61 and the locking mechanism are used to achieve sealing, preventing the corrosive liquid from contacting the side of the wafer 3 facing the bearing portion, the structure is simple, and the operation is convenient. In other embodiments, other existing sealing mechanisms of other structures may also be used to achieve sealing.
进一步地，底座1顶面向下凹陷形成第一凹槽11，第一凹槽11为圆柱形结构，密封圈61为圆环形结构，外径略小于第一凹槽11的直径，以便于密封圈61的装载和取出，承载部为设在第一凹槽11内的承载片12，承载片12为 圆形结构，外径与待腐蚀的晶圆3一致；承载片12的尺寸如果过小，装载晶圆3时容易压坏晶圆3，承载片12的尺寸如果过大，不便于将承载片12从第一凹槽11中取出。在本实施例中，底座1为圆柱形结构，使夹具结构紧凑。Further, the top surface of the base 1 is recessed downward to form a first groove 11, the first groove 11 is a cylindrical structure, the sealing ring 61 is a circular structure, and the outer diameter is slightly smaller than the diameter of the first groove 11, so as to facilitate sealing The loading and unloading of the ring 61, the bearing part is the bearing sheet 12 arranged in the first groove 11, the bearing sheet 12 is a circular structure, and the outer diameter is consistent with the wafer 3 to be etched; if the size of the bearing sheet 12 is too small , the wafer 3 is easily crushed when the wafer 3 is loaded. If the size of the carrier sheet 12 is too large, it is inconvenient to take the carrier sheet 12 out of the first groove 11 . In this embodiment, the base 1 is a cylindrical structure, which makes the clamp structure compact.
进一步地，承载片12采用耐碱腐蚀的玻璃或钢材制成，底座1和顶盖采用聚四氟材料制成，成本低，易于制造。Further, the carrier sheet 12 is made of alkali corrosion-resistant glass or steel, and the base 1 and the top cover are made of PTFE material, which is low in cost and easy to manufacture.
进一步地，承载片12下方设有缓冲垫圈62，缓冲垫圈62可以缓冲顶盖对晶圆3的压力，承载片12可以保护晶圆3，防止晶圆3破裂，缓冲垫圈62与密封圈61尺寸相同，以使缓冲垫圈62与密封圈61位置尽可能一致，更好地缓冲顶盖对晶圆3的压力。Further, a buffer washer 62 is arranged under the carrier sheet 12 , the buffer washer 62 can buffer the pressure of the top cover on the wafer 3 , the carrier sheet 12 can protect the wafer 3 and prevent the wafer 3 from breaking, the size of the buffer washer 62 and the sealing ring 61 In the same way, the positions of the buffer washer 62 and the sealing ring 61 are as consistent as possible, so as to better buffer the pressure of the top cover on the wafer 3 .
进一步地，如图7所示，顶盖包括一圆柱体，圆柱体的顶部设有沿径向向外延伸的延伸部。圆柱体的底面向上凹陷形成第二凹槽21，第二凹槽21的直径与密封圈61的内径一致；如果第二凹槽21的直径过大，会妨碍对晶圆3的腐蚀。喷头4设在第二凹槽21内，锁紧机构包括多个连接延伸部与底座的螺钉71。在本实施例中，圆柱体的外径与密封圈61的外径一致，以确保圆柱体不直接接触晶圆3。Further, as shown in FIG. 7 , the top cover includes a cylindrical body, and the top of the cylindrical body is provided with an extension portion extending radially outward. The bottom surface of the cylinder is recessed upward to form a second groove 21 . The diameter of the second groove 21 is consistent with the inner diameter of the sealing ring 61 ; if the diameter of the second groove 21 is too large, it will hinder the corrosion of the wafer 3 . The spray head 4 is arranged in the second groove 21, and the locking mechanism includes a plurality of screws 71 connecting the extension portion and the base. In this embodiment, the outer diameter of the cylinder is the same as the outer diameter of the sealing ring 61 to ensure that the cylinder does not directly contact the wafer 3 .
进一步地，顶盖包括上盖22和下盖23，上盖22为圆盘结构，设在下盖23上方，喷头4固定在上盖22上，方便装入腐蚀液和拆装调整喷头4。在其它实施例中，顶盖也可以采用一体化结构。Further, the top cover includes an upper cover 22 and a lower cover 23. The upper cover 22 is a disc structure and is located above the lower cover 23. The spray head 4 is fixed on the upper cover 22 to facilitate loading of corrosive liquid and disassembly and adjustment of the spray head 4. In other embodiments, the top cover may also adopt an integrated structure.
进一步地，延伸部的外周面与底座1的外周面平齐，使夹具结构紧凑。底座1上环绕第一凹槽11设有多个第一螺孔13，延伸部上设有第二螺孔24，螺钉71螺接第一螺孔13和第二螺孔24并锁紧，而将顶盖固定在底座1上，使顶盖将密封圈61压紧。Further, the outer peripheral surface of the extension portion is flush with the outer peripheral surface of the base 1, so that the structure of the clamp is compact. The base 1 is provided with a plurality of first screw holes 13 around the first groove 11, the extension portion is provided with a second screw hole 24, the screw 71 is screwed with the first screw hole 13 and the second screw hole 24 and locked, and Fix the top cover on the base 1 so that the top cover presses the sealing ring 61 tightly.
使用方法：Instructions:
(1)全面腐蚀(1) General corrosion
将晶圆3待腐蚀的背面朝上放置在承载片12上，盖好下盖23，装入足量腐蚀液，盖好上盖22，锁紧螺钉71，启动搅拌器5，对晶圆背面进行全面、均 匀的腐蚀。Place the backside of the wafer 3 to be etched up on the carrier sheet 12, cover the lower cover 23, fill in a sufficient amount of etchant, cover the upper cover 22, tighten the screw 71, start the stirrer 5, and clean the back of the wafer. Comprehensive and uniform corrosion.
(2)局部腐蚀(2) Local corrosion
将晶圆3待腐蚀的背面朝上放置在承载片12上，盖好下盖23和上盖22，通过喷头4对晶圆背面特定区域喷洒腐蚀液，对晶圆背面局部进行微量腐蚀。Place the backside of the wafer 3 to be etched up on the carrier sheet 12, cover the lower cover 23 and the upper cover 22, spray the etchant on a specific area of the backside of the wafer through the nozzle 4, and perform micro-etching on the backside of the wafer.
以上所述仅为本发明的较佳实施例，并非对本发明的限制。应当指出，本领域的技术人员在阅读完本说明书后，凡在本发明的精神和原则之内所做的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. It should be pointed out that after reading this specification, any modification, equivalent replacement, improvement, etc. made by those skilled in the art within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims (10)

  1. 一种湿法腐蚀夹具，其特征在于，包括底座、顶盖和密封机构，底座上设有承载部，用于承载待腐蚀的晶圆，顶盖设在底座上方，密封机构用于防止腐蚀液接触朝承载部的晶圆正面，密封机构、顶盖和晶圆背面共同形成用于容纳腐蚀液的腔室，腔室内设有喷头，喷头的出液口位于承载部上方，用于喷出腐蚀液以腐蚀晶圆背面。A wet etching fixture is characterized in that it includes a base, a top cover and a sealing mechanism, the base is provided with a bearing portion for carrying the wafer to be etched, the top cover is arranged above the base, and the sealing mechanism is used to prevent corrosion liquid In contact with the front side of the wafer facing the bearing part, the sealing mechanism, the top cover and the back side of the wafer together form a chamber for accommodating the etching liquid. The chamber is provided with a spray head, and the liquid outlet of the spray head is located above the bearing part for spraying corrosion liquid to etch the backside of the wafer.
  2. 如权利要求1所述的湿法腐蚀夹具，其特征在于，所述顶盖上还设有搅拌器，搅拌器的搅拌头位于承载部上方。The wet etching jig according to claim 1, wherein a stirrer is further provided on the top cover, and the stirring head of the stirrer is located above the bearing portion.
  3. 如权利要求2所述的湿法腐蚀夹具，其特征在于，所述喷头的数量为多个，搅拌器的搅拌头设在顶盖中央，多个喷头围绕搅拌头，设置在搅拌头的周围。The wet etching jig according to claim 2, wherein the number of the spray heads is plural, the stirring head of the agitator is arranged in the center of the top cover, and the plurality of spray heads surround the stirring head and are arranged around the stirring head.
  4. 如权利要求1所述的湿法腐蚀夹具，其特征在于，所述密封机构包括锁紧机构和设在承载部上方的密封圈，待腐蚀的晶圆放置在承载部与密封圈之间，密封圈的内径小于待腐蚀的晶圆的尺寸，在锁紧机构的锁紧下，顶盖紧压密封圈。The wet etching jig according to claim 1, wherein the sealing mechanism comprises a locking mechanism and a sealing ring arranged above the bearing part, the wafer to be etched is placed between the bearing part and the sealing ring, and the sealing The inner diameter of the ring is smaller than the size of the wafer to be etched, and under the locking of the locking mechanism, the top cover tightly presses the sealing ring.
  5. 如权利要求4所述的湿法腐蚀夹具，其特征在于，所述底座顶面设有第一凹槽，第一凹槽为圆柱形结构，密封圈为圆环形结构，外径小于第一凹槽的直径，承载部为设在第一凹槽内的承载片，承载片为圆形结构。The wet etching jig according to claim 4, wherein the top surface of the base is provided with a first groove, the first groove is a cylindrical structure, the sealing ring is a circular structure, and the outer diameter is smaller than the first groove. The diameter of the groove, the carrying part is a carrying piece arranged in the first groove, and the carrying piece is a circular structure.
  6. 如权利要求5所述的湿法腐蚀夹具，其特征在于，所述承载片下方设有缓冲垫圈，缓冲垫圈与密封圈尺寸相同。The wet etching jig according to claim 5, wherein a buffer washer is provided under the carrier sheet, and the buffer washer and the sealing ring have the same size.
  7. 如权利要求5所述的湿法腐蚀夹具，其特征在于，所述顶盖包括圆柱体，圆柱体的顶部设有沿径向向外延伸的延伸部，圆柱体的底面设有向上凹陷的第二凹槽，第二凹槽的直径与密封圈的内径一致，喷头设在第二凹槽内，锁紧机构包括多个连接延伸部与底座的螺钉。The wet etching jig according to claim 5, wherein the top cover comprises a cylinder, the top of the cylinder is provided with an extension extending radially outward, and the bottom surface of the cylinder is provided with an upwardly recessed No. Two grooves, the diameter of the second groove is consistent with the inner diameter of the sealing ring, the spray head is arranged in the second groove, and the locking mechanism includes a plurality of screws connecting the extension part and the base.
  8. 如权利要求7所述的湿法腐蚀夹具，其特征在于，所述顶盖包括上盖 和下盖，上盖为圆盘结构，设在下盖上方，喷头固定在上盖上。The wet etching jig according to claim 7, wherein the top cover comprises an upper cover and a lower cover, the upper cover is a disc structure, is arranged above the lower cover, and the spray head is fixed on the upper cover.
  9. 如权利要求7所述的湿法腐蚀夹具，其特征在于，所述延伸部的外周面与底座的外周面平齐，底座上环绕第一凹槽设有多个第一螺孔，延伸部上设有第二螺孔，螺钉螺接第一螺孔和第二螺孔并锁紧，而将顶盖固定在底座上。The wet etching jig according to claim 7, wherein the outer peripheral surface of the extension portion is flush with the outer peripheral surface of the base, the base is provided with a plurality of first screw holes around the first groove, and the extension portion is provided with a plurality of first screw holes. A second screw hole is provided, and the screw is screwed into the first screw hole and the second screw hole and locked to fix the top cover on the base.
  10. 如权利要求5所述的湿法腐蚀夹具，其特征在于，所述承载片采用耐碱腐蚀的玻璃或钢材制成，底座和顶盖采用聚四氟材料制成。The wet etching jig according to claim 5, characterized in that, the carrier sheet is made of alkali corrosion-resistant glass or steel, and the base and the top cover are made of PTFE material.
PCT/CN2021/117389 2021-04-15 2021-09-09 Wet etching fixture WO2022217820A1 (en)

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CN101403118A (en) * 2008-11-13 2009-04-08 中国电子科技集团公司第二十四研究所 Silicon slice corrosion single-face protection clamper
CN105405802A (en) * 2015-11-30 2016-03-16 浙江大学 Wet etching protection clamp free of damage to wafer
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