JPH02192717A - Resist removing device - Google Patents

Abstract

PURPOSE:To cut down the time for removing process for augmenting the yield by a method wherein a resist removing solvent is discharged from two feed openings and then the resist sticked to the edge, back of a substrate and a focus reference pad is removed simultaneously with the resist removing solvent. CONSTITUTION:The peripheral edge part 8 of a wafer substrate 1 is encircled and tightly held by an over nozzle 2 and an under nozzle 3. A solvent 10 is discharged from feed openings 4a, 4b. The solvent 10 from the opening 4a runs out directly or from the substrate 1 to come into contact with a resist 7 for melting down the resist. The solvent 10 reflected on the inner surface of the nozzles 2, 3 comes into contact with the resist 7 on the back while the solvent 10 from the opening 4b comes into contact with the resist 7 on the focus reference pad part on the substrate 1. The waste solution of the solvent 10 containing the melted down resist 7 is drained from a drainage port 6 while vapor 11 is exhausted from an exhaust port 5.

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention is a method for removing resist attached to the edges and back of a wafer substrate after applying a resist onto a wafer substrate in a photolithography process in semiconductor manufacturing. The present invention relates to a resist removing apparatus that can eliminate resist adhesion to a focus reference pad portion of an aligner having a focus reference pad for determining focus on a wafer substrate.

<Conventional technology> Conventionally, in order to remove resist attached to the edges and back of a wafer substrate, a solvent (
For example, resist was removed by discharging thinner) onto the wafer substrate. In addition, for aligner-processed wafer substrates that have a focus reference pad for determining focus on the wafer substrate, a solvent is discharged spot-wise onto the focus base pad λ pad to remove the resist attached to the focus reference pad. has been removed.

<Problems to be Solved by the Invention> However, in the method described above, in which the resist adhered to the edges and back of the wafer substrate is removed by discharging a solvent while rotating the wafer substrate, the solvent tends to be blown away. When the solvent splashes onto the wafer substrate, pinholes occur in the resist.

In addition, the resist in the orientation flat portion is particularly difficult to remove. In addition, for aligner-treated wafer substrates with focus reference pads, the resist attached to the edges and back is removed separately, and the resist attached to the focus reference pad is removed separately, so the resist removal process The quality of the wafer substrate is degraded due to the increased time required for the process and the increased exposure time of the wafer substrate to the solvent.

The present invention was devised in view of the above-mentioned circumstances, and it is possible to simultaneously remove the resist attached to the edge and back of the wafer substrate and the resist attached to the focus reference pad portion, and therefore, it is possible to simultaneously remove the resist attached to the edge and back of the wafer substrate. The purpose of the present invention is to provide a resist removal device that takes a short time.

Means for Solving the Problems> In order to solve the above problems, the resist removing apparatus of the present invention surrounds and accommodates the peripheral portion of a wafer substrate whose surface is coated with resist, and removes any particles that have adhered to the edges and back of the wafer substrate. a first supply hole for discharging a solvent for removing resist; a second supply hole for supplying a solvent for removing resist attached to the focus reference pad portion in the peripheral portion; a discharge hole for the solvent; A nozzle having a steam exhaust hole is provided.

<Operation> A nozzle surrounds and accommodates the periphery of a wafer substrate whose surface is coated with resist, and a solvent is discharged onto the wafer substrate from the first and second supply holes of the nozzle. wafer substrate edge,
The resist on the back and the resist on the focus reference pad portion hit the solvent and dissolve, the waste solvent containing the dissolved resist is discharged from the discharge hole of the nozzle, and the solvent vapor is discharged from the discharge hole of the nozzle.

<Example> Hereinafter, an example of the present invention will be described with reference to the drawings. 1 and 2 show one embodiment of the present invention, FIG. 1 is an explanatory cross-sectional view taken along the line A--A in FIG. 2, and FIG. 2 is a plan view.

The resist removing apparatus 100 of this embodiment has an over nozzle 2 and an under nozzle 3. As shown in FIG. 1, numeral 1 is a wafer substrate whose upper surface is coated with a resist 7, and the resist 7 is coated around the edges and back of the wafer substrate 1. The over nozzle 2 and the under nozzle 3, each having a rectangular cross section, are connected so as to face each other, and as shown in FIGS. 1 and 2, the over nozzle 2 and the under nozzle 3 are connected to The circumferential edge portion 8 of the first one is enclosed and housed in close contact over the entire circumference of the circumferential edge portion 8. Therefore, the space 9 formed by the over nozzle 2 and the under nozzle 3 accommodates the peripheral portion 8 and is shielded from the outside air.

For aligner-processed wafer substrates that have focus reference pads for determining focus on the wafer substrate, as shown in FIG. The projections 2a, 2b, and 2c (in some cases, but not limited to this) are formed so as to cover the focus reference pad section. 1st
As shown in FIG. 2 and FIG. 2, the over nozzle 2 has a supply hole 4a (first supply hole) for discharging an agent 10 (for example, thinner) that dissolves the resist 7 into the space 9.
A supply hole 4b (second supply hole) and an exhaust hole 5 for discharging the vapor 11 of the solvent IO to the outside of the space 9 are provided. The supply holes 4a are for discharging the solvent 1o for removing the resist 7 attached to the edges and back of the wafer substrate 1. Depending on the size of the wafer substrate 1, an appropriate number of supply holes 4a are provided to cover the entire upper surface of the over nozzle 2. It is located all around the circumference. The supply hole 4b discharges a solvent 10 for removing the resist 7 attached to the focus reference pad portion, and is provided on the upper surface of the protruding portions 2a, 2b, and 2c. A predetermined number of exhaust holes 5 are led to an exhaust device (not shown). Is there waste of solvent LO in the under nozzle 3? A predetermined number of discharge holes 6 are provided for discharging & 12 out of the space 9.

Next, the operation of this embodiment will be explained.

The wafer substrate 1 is aligned, placed on the under nozzle 3, and then the over nozzle 2 is lowered. An over nozzle 2 and an under nozzle 3 surround and hold a peripheral portion 8 of a wafer substrate 1 in close contact with each other.

In this state, the solvent 10 sent from a supply device (not shown) is discharged into the space 9 from the supply holes 4a, 4b of the over nozzle 2. Solvent 10 discharged from supply hole 4a
The liquid flows directly or flows out from the top of the wafer substrate 1 and comes into contact with the resist 7 at the edge and melts the resist 7 at this portion. The solvent 10 reflected from the inner surfaces of the over nozzle 2 and the under nozzle 3 comes into contact with the back resist 7 and melts this portion of the resist 7. The solvent lO discharged from the supply hole 4b comes into contact with the resist 7 attached to the focus reference pad portion on the wafer substrate 1, and this resist 7 is dissolved. Waste liquid 12 of solvent 10 containing melted resist 7
is exhausted from the exhaust hole 6, and the vapor 11 of the solvent 10 in the space 9 is exhausted from the exhaust hole 5.

<Effects of the Invention> As explained above, the resist removal apparatus of the present invention includes a first supply hole that surrounds the peripheral portion of the wafer substrate and discharges a solvent for removing resist attached to the edges and back of the wafer substrate. A nozzle is provided which has a second supply hole for supplying a solvent for removing the resist attached to the focus reference pad portion in the peripheral portion, a solvent discharge hole, and a solvent vapor exhaust hole.

Therefore, the resist attached to the edges and back of the wafer substrate and the resist attached to the focus reference pad can be removed at the same time, reducing the time required for the resist removal process on the wafer substrate, and keeping the wafer substrate in a solvent atmosphere. Improved wafer quality due to shorter exposure times results in higher yields of wafer substrates.

[Brief explanation of the drawing]

1 and 2 show one embodiment of the present invention, FIG. 1 is an explanatory cross-sectional view taken along the line A--A in FIG. 2, and FIG. 2 is a plan view. 1...Wafer substrate, 2...Over nozzle,
3...under nozzle, 4a, 4b...supply hole,
5...Exhaust hole, 6...Exhaust hole, 7...Resist, 8...Peripheral portion, 10...Solvent, 11...
・Steam, 100...Resist removal device. Patent applicant Sharp Corporation

Claims (1)

[Claims] (1) A first supply hole that surrounds the peripheral edge of a wafer substrate whose surface is coated with resist and discharges a solvent for removing resist attached to the edge and back of the wafer substrate, and a focus reference for the peripheral edge. a second supply hole for supplying a solvent for removing resist attached to the pad portion;
A resist removing device comprising: a nozzle having an exhaust hole for the solvent and an exhaust hole for the vapor of the solvent.